CN107818942B - edge finder - Google Patents
edge finder Download PDFInfo
- Publication number
- CN107818942B CN107818942B CN201711270805.8A CN201711270805A CN107818942B CN 107818942 B CN107818942 B CN 107818942B CN 201711270805 A CN201711270805 A CN 201711270805A CN 107818942 B CN107818942 B CN 107818942B
- Authority
- CN
- China
- Prior art keywords
- clamping
- mounting platform
- driving
- wafer
- brackets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides an edge finder, comprising: base, one end are fixed support, clamping part and sensor on the base, and the clamping part contains: the clamping device comprises a mounting platform, two semicircular clamping brackets, a plurality of clamping wheels, a clamping driving unit and a rotation driving unit, wherein the mounting platform is mounted at the other end of the bracket, the two semicircular clamping brackets are slidably mounted on the mounting platform, the clamping wheels are respectively rotatably mounted on the two clamping brackets, the clamping driving unit is mounted on the mounting platform and is in driving connection with the two clamping brackets for driving the two clamping brackets to approach and separate, and the rotation driving unit is mounted on the mounting platform for driving all the clamping wheels to rotate; the edge finder has the advantages of quick original finding and low manufacturing cost.
Description
Technical Field
The invention belongs to the technical field of semiconductor production and processing, and particularly relates to an edge finder.
Background
The wafer needs hundreds of working procedures on the production line, and the wafer needs to be continuously subjected to the original searching, the edge searching and the positioning in order to ensure the excellent rate of each working procedure. The wafer of the existing edge finder is generally placed on a vacuum chuck, the vacuum chuck can move, and the wafer is rotated to be combined with an optical instrument to center and find the edge. The prior art has the following disadvantages: 1. after the wafer is placed on the edge finder, the wafer can be found out after being rotated, and more than two times of positioning adjustment are needed each time, so that time is wasted, and the wafer and the three ejector pins collide with each other due to repeated lifting of the center shaft, so that the wafer is damaged. 2. The manufacturing cost is high.
Disclosure of Invention
The present invention has been made to solve the above problems, and an object of the present invention is to provide an edge finder which is quick in finding the original edge and low in manufacturing cost.
The invention provides an edge finder, which is characterized by comprising the following components:
a base;
one end of the bracket is fixed on the base;
a clamping portion comprising: the clamping device comprises a mounting platform, two semicircular clamping brackets, a plurality of clamping wheels, a clamping driving unit and a rotating driving unit, wherein the mounting platform is mounted at the other end of the bracket, the two semicircular clamping brackets are slidably mounted on the mounting platform, the clamping wheels are respectively rotatably mounted on the two clamping brackets, the clamping driving unit is mounted on the mounting platform and is in driving connection with the two clamping brackets and is used for driving the two clamping brackets to approach and depart, and the rotating driving unit is mounted on the mounting platform and is used for driving all the clamping wheels to rotate; and
the sensor is arranged on the mounting platform and used for searching edges of the wafer;
wherein the two clamping brackets are parallel to the mounting platform and positioned on the same horizontal plane, one sides of the two clamping brackets, which are concave, are opposite to each other to form a circle,
when the clamping driving unit drives the two clamping brackets to approach and separate, the two clamping brackets are driven to move in opposite directions for the same distance,
the clamping driving unit drives the two clamping brackets to be close to each other, the clamping wheel clamps the wafer, the circle center position of the wafer is the circle center position of the circle formed by the two clamping brackets, the rotation driving unit drives the clamping wheel to rotate, the clamping wheel drives the wafer to rotate, and when a notch on the wafer passes through the sensor, the sensor detects the position of the notch.
Further, the edge finder provided by the invention can also have the following characteristics: wherein the clamping driving unit comprises: install mounting platform's first motor, with the threaded rod of first motor drive connection and two are fixed respectively two the movable block on the clamping support, wherein, set up two sections pitch on the threaded rod the same and screw opposite screw thread, two the movable block respectively with two sections screw thread threaded connection on the threaded rod.
Further, the edge finder provided by the invention can also have the following characteristics: the clamping driving unit further comprises two supporting members fixed on the mounting platform, and two ends of the threaded rod are respectively rotatably mounted on the two supporting members.
Further, the edge finder provided by the invention can also have the following characteristics: the clamping driving unit further comprises a positioning member, wherein the positioning member is fixed on the mounting platform and is positioned between two sections of threads of the threaded rod.
Further, the edge finder provided by the invention can also have the following characteristics: the clamping driving unit further comprises a limiting member which is fixed on the mounting platform and used for limiting the minimum distance between the two clamping brackets.
Further, the edge finder provided by the invention can also have the following characteristics: wherein the rotation driving unit includes: the clamping device comprises a clamping wheel, a first driving wheel, at least one tensioning wheel, elastic members, a belt or a chain and a second motor, wherein the first driving wheel is in one-to-one correspondence with the clamping wheel and is respectively fixed on a rotating shaft of the clamping wheel, the tensioning wheel is slidably installed on an installation platform, the elastic members are in one-to-one correspondence with the tensioning wheel and are respectively fixed on the tensioning wheel and the installation platform at two ends of the elastic members, the belt or the chain is used for connecting the tensioning wheel and all the first driving wheels in a driving manner, and the second motor is used for driving the first driving wheels and the tensioning wheel to rotate.
Further, the edge finder provided by the invention can also have the following characteristics: wherein the rotation driving unit further comprises: the plurality of steering wheels are fixed on the mounting platform and are in transmission connection with the tensioning wheel and all the first transmission wheels for changing the transmission direction of the belt or the chain.
Further, the edge finder provided by the invention can also have the following characteristics: wherein, the edge finder still includes: the camera is used for detecting the two-dimensional code of wafer, set up a recess on the base, the camera is installed in the recess, set up a circular through-hole on the mounting platform, first circular through-hole is located two the wafer that the clamping support constitutes is directly under, the recess is located under the circular through-hole of first, the diameter of circular through-hole of first is greater than the diameter of wafer.
Further, the edge finder provided by the invention can also have the following characteristics: wherein, the edge finder still includes: the platform rotates the drive division, is used for driving the clamping part rotates and carries out defect detection to the positive and negative of wafer, contains: the device comprises a bracket, a rotating shaft, a driving wheel unit, a third motor and a driving wheel unit, wherein the rotating shaft is rotatably arranged on the bracket and fixedly connected with the mounting platform, the driving wheel unit is in driving connection with the rotating shaft at the output end, and the third motor is arranged on the base and in driving connection with the input end of the driving wheel unit.
Further, the edge finder provided by the invention can also have the following characteristics: wherein, the clamping part still contains: a shell, a second circular through hole is arranged on the shell, the central axis of the first circular through hole coincides with the central axis of the second circular through hole, the diameter of the second circular through hole is larger than that of the wafer,
the top side of the shell is provided with sliding holes corresponding to the clamping wheels one by one, the direction of the sliding holes is the same as the direction of the moving of the clamping wheels, and the sliding holes are positioned on the moving track of the corresponding clamping wheels.
Further, the edge finder provided by the invention can also have the following characteristics: the sensor is an optical fiber sensor, optical fibers of the optical fiber sensor are located in a circle formed by the two clamping supports, and the distance from the center of the circle is larger than the radius of the wafer. The invention has the following advantages:
according to the edge finder, the clamping wheels are rotatably arranged on the two semicircular clamping brackets, when the two semicircular clamping brackets are driven to be relatively close to and far away from each other to clamp the wafer, the clamping driving unit is adopted to simultaneously drive the two clamping brackets to move the same distance in opposite directions, so that the symmetry axes of the two semicircular clamping brackets are unchanged when the two semicircular clamping brackets are mutually far away from each other, and the circle center of a formed wafer is unchanged, therefore, when the wafer is clamped by the clamping wheels, the circle center of the wafer is determined, the circle center finding is not required to be rotated any more, and the rotation driving unit drives all the clamping wheels to rotate so as to enable the wafer to be rotated, and the sensor is used for finding the edge of the wafer, so that other optical instruments are not required.
Drawings
FIG. 1 is a schematic diagram of an edge finder according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an edge finder with a housing removed in an embodiment of the present invention;
FIG. 3 is a top view of FIG. 2;
FIG. 4 is a schematic view of a spacing member according to an embodiment of the present invention;
fig. 5 is a front view of fig. 4;
fig. 6 is an enlarged view of a mark a in fig. 2;
FIG. 7 is a schematic view of another angle of the edge finder with the housing removed in an embodiment of the present invention; FIG. 8 is a schematic structural view of a mounting platform in an embodiment of the invention;
FIG. 9 is a schematic view of the structure of the clamp housing in an embodiment of the invention;
fig. 10 is a schematic view of another angle of the clamping portion housing in accordance with an embodiment of the present invention.
Detailed Description
In order to make the technical means, creation features, achievement of the purposes and effects of the present invention easy to understand, the following embodiments are specifically described with reference to the accompanying drawings.
As shown in fig. 1 and 2, the edge finder 100 includes: base 10, bracket 20, clamp 30, and sensor 40. One end of the bracket 20 is fixed to the base 10, the clamping part 30 is installed at the other end of the bracket 20, and the sensor 40 is mounted on the clamping part 30.
In this embodiment, a recess 11 is formed in the base 10, and a camera (not shown) is mounted in the recess 11, and is used for reading the wafer ID.
As shown in fig. 2, the holding portion 30 includes: the device comprises a mounting platform 31, two clamping brackets 32, a plurality of clamping wheels 33, a clamping driving unit 34 and a rotation driving unit 35.
The mounting platform 31 is mounted at an end of the stand 20 remote from the base 10, and the mounting platform 31 is mounted at an upper end of the stand 20 as seen in the direction of fig. 2. As shown in fig. 8, in this embodiment, a first circular through hole 311 is provided in the middle of the mounting platform 31, the first circular through hole 311 is located right below a circle formed by two clamping brackets 32, the groove 11 is located right below the first circular through hole 311, the diameter of the first circular through hole 311 is larger than the diameter of a wafer with the maximum diameter that can be detected by the device, when the wafer 200 is clamped by the clamping wheel 33, the camera is mounted on the groove 11 to read the ID of the wafer, so that the problem that the ID of the wafer cannot be read in the downward direction in the detection process in the prior art is solved. In the present embodiment, a rectangular through hole 312 is provided adjacent to the first circular through hole 311, the rectangular through hole 312 being a mounting space for the second motor 355, the rectangular through hole 312 being provided as needed.
As shown in fig. 2 and 3, two clamping brackets 32 are slidably mounted on the mounting platform 31, the two clamping brackets 32 are semicircular, parallel to the mounting platform 31 and located on the same horizontal plane, and concave sides of the two clamping brackets 32 are disposed opposite to each other, so that the two clamping brackets 32 form a circle. As shown in fig. 2, 3 and 4, in the present embodiment, two pairs of slide rails 321 are provided on the mounting platform 31, and each clamping bracket 32 is slidably mounted on one pair of slide rails 321.
In this embodiment, three clamping wheels 33 are mounted on each clamping bracket 32, as shown in fig. 4, a circle of grooves is disposed on each clamping wheel 33, and when a wafer is clamped by the clamping wheels 33, the wafer is clamped on the grooves to avoid the wafer tilting.
The clamping driving unit 34 is used for driving the two clamping brackets 32 to approach and separate from each other, when the clamping driving unit 34 drives the two clamping brackets 32 to move, the two clamping brackets 32 are driven to move in opposite directions at the same time by the same distance, so that when the two clamping brackets 32 approach or separate from each other, the symmetry axes of the two clamping brackets 32 are unchanged, therefore, when the two clamping brackets 32 approach or separate from each other, the circle center position formed by the two clamping brackets 32 is unchanged, and when a wafer is mounted on the edge finder 100, the circle center position of the wafer is determined to be the circle center position formed by the two clamping brackets 32.
As shown in fig. 2 and 3, in the present embodiment, the clamp driving unit 34 includes: the first motor 341, the threaded rod 342, two moving blocks 343, a supporting member 344, a positioning member 345 and a limiting member 346.
The first motor 341 is mounted on the mounting platform 31. The threaded rod 342 is fixed on the motor shaft of the first motor 341, two sections of threads are arranged on the threaded rod 342, the rotation directions of the two sections of threads are opposite, and the thread pitches are the same. The two moving blocks 343 are respectively matched with the two sections of threads on the threaded rod 342, the two moving blocks 343 are in threaded connection with the threaded rod 342 and are respectively connected to the two sections of threads, and when the threaded rod 342 rotates, the two moving blocks 343 respectively move in opposite directions and have the same moving distance. The two moving blocks 343 are respectively fixed at one ends of the two clamping brackets 32, and when the two moving blocks 343 move, the two clamping brackets 32 are driven to move.
In this embodiment, the mounting platform 31 is further provided with a supporting member 344 and a positioning member 345, the supporting member 344 is fixed on the mounting platform 31 and located at two sections of the threaded rod 342, and the two sections of the threaded rod 342 are rotatably mounted on the two supporting members 344 respectively for supporting the threaded rod 342. The positioning member 345 is fixed to the mounting platform 31 and is located intermediate the two threads of the threaded rod 342, with the two clamping brackets 32 being equidistant from the positioning member 345. The positioning member 345 is used to determine the position of the symmetry axis between the two clamping brackets 32 when the whole apparatus is designed, determine the position of the center of a circle when the apparatus detects a wafer, and calibrate the two clamping brackets 32 after the apparatus is used for a period of time, so as to ensure that the position of the center of a circle determined by the whole apparatus is unchanged.
As shown in fig. 4 and 5, the limiting member 346 is fixed on the mounting platform 31, and is used for limiting the minimum distance between the two clamping brackets 32 relatively close to each other, so as to avoid clamping the wafer when clamping the wafer. The stopper member 346 includes: limit switch 361, L-shaped slide block 362, pressing plate 363, adjusting screw 364, two springs 365, two slide rails 366, and two fixing blocks 367.
The two fixed blocks 367 are fixed on the mounting platform 31, the two ends of the two sliding rails 366 are respectively fixed on the two fixed blocks 367, the two ends of the adjusting screw 364 are respectively rotatably mounted on the two fixed blocks 367, a folded edge of the sliding block 362 is slidably mounted on the two sliding rails 361 and is in threaded connection with the adjusting screw 364, the two springs 365 are respectively sleeved on the two sliding rails 366, the position of the sliding block 362 can be adjusted by rotating the adjusting screw 364, and therefore the minimum distance between the two clamping brackets 32 is adjusted, and the purposes of clamping a wafer and avoiding damage caused by overlarge clamping force are achieved. The pressing plate 363 is fixed on the two fixing blocks 367, and presses and fixes the slide block 362 with the adjusted position. The limit switch 361 is mounted on the other fold of the slider 362. The slider 362 mounts the edge of the limit switch 361 on the same straight line with one end of the two clamping brackets 32, as seen in the direction of fig. 3, on the same straight line with the upper ends of the two clamping brackets 32, so that when the two clamping brackets 32 are relatively close to clamp a wafer, as seen in the direction of fig. 3, the upper end of the left clamping bracket 32 can touch the limit switch 361, and when the upper end of the left clamping bracket 32 touches the limit switch 361, the first motor 341 stops driving the two clamping brackets 32 to continuously approach each other, thereby avoiding clamping the wafer.
The rotation driving unit 35 is used to drive all the clamping wheels 33 to rotate, thereby driving the wafer to rotate. As shown in fig. 2, 3, and 6, the rotation driving unit 35 includes: a plurality of first driving wheels 351, at least one tensioning wheel 352, at least one elastic member 353, a belt or chain 354, a second motor 355, a plurality of steering wheels 356.
The plurality of first driving wheels 351 are in one-to-one correspondence with the plurality of clamping wheels 33, and are respectively fixed on the rotating shafts of the corresponding clamping wheels 33.
The tensioning wheels 352 are slidably mounted on the mounting platform 31, in this embodiment, two tensioning wheels 352 are provided in total, a sliding rail 3521 is fixed on the mounting platform 31, and the tensioning wheels 352 are slidably mounted on the sliding rail 3521. A belt or chain 354 drivingly connects all of the first drive wheels 351 and the tensioning wheel 352.
The elastic members 353 are in one-to-one correspondence with the tensioning pulleys 352, and in this embodiment, there are two tensioning pulleys 352 and two elastic members 353. The two ends of each elastic member 353 are respectively mounted on the corresponding tensioning wheel 352 and mounting platform 31, and when the distance between the two clamping brackets 32 is adjusted, the tensioning wheel 352 slides along the sliding rail 3521, so that the belt or chain 354 is always in good driving connection with all the first driving wheels 351 and the tensioning wheel 352. In the present embodiment, the elastic member 353 is a spring.
The second motor 355 is used for driving all the first driving wheels 351 and the tensioning wheels 352 to rotate. In this embodiment, the second motor 355 is fixed to one of the clamping brackets 32, and the motor shaft of the second motor 355 is in driving connection with the rotating shaft of one of the clamping wheels 33 on the clamping bracket 32. The second motor 355 operates to drive the rotation shaft of the clamping wheel 33 connected thereto to rotate, the first driving wheel 351 fixed on the rotation shaft rotates therewith, and the belt or chain 354 drives the remaining first driving wheels 351 and tensioning wheel 352 to rotate.
Of course, the second motor 355 may also be fixed on the mounting platform 31, and a driving wheel is fixed on the motor shaft of the second motor 355, and the driving wheel is in transmission connection with all the first driving wheels 351 and the tensioning wheels 352 through a belt or a chain 354.
In this embodiment, the rotation driving unit 35 further includes a plurality of steering wheels 356, and the steering wheels 356 are used to change the transmission direction of the belt or the chain 354, so that the transmission contact area between the belt or the chain 354 and the first transmission wheel 351 is increased, and the belt or the chain 354 is prevented from slipping during the transmission process. The number of the steering wheels 356 is set according to the requirement, in this embodiment, each first driving wheel 351 corresponds to one steering wheel 356, and the included angle between the belt or the chain 354 when the steering wheel 356 passes the belt or the chain 354 through each first driving wheel 351 and the tensioning wheel 352 is smaller than 90 °.
In this embodiment, the clamping portion 30 further includes a housing 36, and the mounting platform 31, the two clamping brackets 32, the clamping driving unit 34, and the rotation driving unit 35 are all located in the housing 36. As shown in fig. 9 and 10, a second circular through hole 361 is provided in the middle of the housing 36, the diameter of the second circular through hole 361 is larger than that of the wafer that can be detected by the device, and the central axes of the second circular through hole 361 and the first circular through hole 311 are coincident. The top side surface of the housing 36 is provided with sliding holes 362 corresponding to the clamping wheels 33 one by one, the direction of the sliding holes 362 is the same as the moving direction of the clamping wheels 33, and each sliding hole 362 is positioned on the moving track of the corresponding clamping wheel 33, namely, slides in the corresponding sliding hole 362 when the clamping wheel 33 moves.
In this embodiment, the edge finder 100 further includes a stage rotation driving portion 50. The platform rotation driving part 50 is used for driving the clamping part 30 to rotate, so that defect detection is conveniently performed on the front side and the back side of the wafer.
As shown in fig. 2, the stage rotation driving section 50 includes: a rotation shaft 51, a driving wheel unit 52, and a third motor 53. The mounting platform 31 is fixed at one end of a rotating shaft 51, the rotating shaft 51 is rotatably mounted on the bracket 20, and in this embodiment, a bearing is provided between the rotating shaft 51 and the rotational contact of the bracket 20. The output end of the driving wheel unit 52 is in driving connection with the rotating shaft 51, and the input end of the driving wheel unit 52 is in driving connection with the third motor 53. In this embodiment, the drive wheel unit 52 comprises a plurality of drivingly connected drive wheels. The third motor 53 is installed in the base 10, and the third motor 53 operates to transmit a driving force to the rotating shaft 51 through the driving wheel unit 52, and the rotating shaft 51 rotates to drive the mounting platform 31 to rotate.
As shown in fig. 2 and 7, the sensor 40 is mounted on the mounting platform 31 for wafer edge seeking. In this embodiment, the sensor 40 is an optical fiber sensor, and an optical fiber of the optical fiber sensor is located in a circle formed by the two clamping brackets 32, and a distance from a center of the circle formed by the two clamping brackets 32 is greater than a radius of the wafer. When the housing 36 is installed, the optical fibers are positioned in the second circular through hole 361 of the housing 36, close to the side wall of the housing 36, and at a distance from the center of the circle formed by the two clamping brackets 32 that is greater than the radius of the wafer.
The working process of the edge finder comprises the following steps:
when the wafer is placed in the edge finder 10 for detection, the initial positions of the two clamping brackets 32 are far away, so that after the wafer is placed between the clamping wheels 33, the clamping driving unit 34 drives the clamping brackets 32 to mutually approach to clamp the wafer, and the circle center position of the wafer is determined to be the circle center position of the wafer formed by the two clamping brackets 32. The rotation driving unit 35 drives the clamping wheel 33 to rotate, so that the wafer is driven to rotate, and when the notch of the wafer passes through the sensor 40, the sensor 40 senses that the notch is located to realize edge searching. The camera 60 reads the wafer ID through the first circular through hole 311 and the second circular through hole 361, and the reading operation is convenient.
When the defect detection is required to be performed on the wafer, the platen rotation driving part 50 drives the clamping part 30 to rotate, so that the front and back surfaces of the wafer can be detected.
The above embodiments are preferred examples of the present invention, and are not intended to limit the scope of the present invention.
Claims (9)
1. An edge finder, comprising:
a base;
one end of the bracket is fixed on the base;
a clamping portion comprising: the device comprises a mounting platform, two semicircular clamping brackets, a plurality of clamping wheels, a clamping driving unit and a rotating driving unit, wherein the mounting platform is mounted at the other end of the bracket, the two semicircular clamping brackets are slidably mounted on the mounting platform, the clamping wheels are respectively rotatably mounted on the two clamping brackets, the clamping driving unit is mounted on the mounting platform and is in driving connection with the two clamping brackets for driving the two clamping brackets to approach and separate, and the rotating driving unit is mounted on the mounting platform for driving all the clamping wheels to rotate; and
the sensor is arranged on the mounting platform and is used for searching the edge of the wafer,
wherein the two clamping brackets are parallel to the mounting platform and positioned on the same horizontal plane, one sides of the two clamping brackets, which are concave, are opposite to each other to form a circle,
when the clamping driving unit drives the two clamping brackets to approach and separate, the two clamping brackets are driven to move in opposite directions for the same distance,
the clamping driving unit drives the two clamping brackets to be close to each other, the clamping wheel clamps the wafer, the circle center position of the wafer is the circle center position of a circle formed by the two clamping brackets, the rotation driving unit drives the clamping wheel to rotate, the clamping wheel drives the wafer to rotate, and when a notch on the wafer passes through the sensor, the sensor detects the position of the notch;
the rotation driving unit includes: the clamping device comprises a clamping wheel, a first driving wheel, at least one tensioning wheel, elastic members, a belt or a chain, a second motor and a first motor, wherein the clamping wheel is in one-to-one correspondence with the first driving wheel and is respectively fixed on a rotating shaft of the clamping wheel;
the sensor is an optical fiber sensor, optical fibers of the optical fiber sensor are positioned in a circle formed by the two clamping brackets, and the distance from the center of the circle is larger than the radius of the wafer.
2. The edge finder as defined in claim 1, wherein:
the clamping driving unit includes: the first motor is arranged on the mounting platform, the threaded rod is in driving connection with the first motor, and two moving blocks are respectively fixed on the two clamping brackets,
the threaded rod is provided with two sections of threads with the same thread pitch and opposite thread directions, and the two moving blocks are respectively in threaded connection with the two sections of threads on the threaded rod.
3. The edge finder as defined in claim 2, wherein:
the clamping driving unit further comprises two supporting members fixed on the mounting platform, and two ends of the threaded rod are respectively rotatably mounted on the two supporting members.
4. The edge finder as defined in claim 2, wherein:
the clamping drive unit also includes a positioning member fixed to the mounting platform and located between the two threads of the threaded rod.
5. The edge finder as defined in claim 2, wherein:
the clamping driving unit further comprises a limiting member which is fixed on the mounting platform and used for limiting the minimum distance between the two clamping brackets.
6. The edge finder as defined in claim 1, wherein:
the rotation driving unit further includes: the plurality of steering wheels are fixed on the mounting platform and are in transmission connection with the tensioning wheel and all the first transmission wheels for changing the transmission direction of the belt or the chain.
7. The edge finder as recited in claim 1, further comprising:
a camera for detecting the two-dimensional code of the wafer, wherein the base is provided with a groove, the camera is arranged in the groove,
the mounting platform is provided with a first circular through hole, the first circular through hole is positioned under a circle formed by the two clamping brackets, the groove is positioned under the first circular through hole, and the diameter of the first circular through hole is larger than that of the wafer.
8. The edge finder as defined in claim 7, further comprising:
the platform rotates the drive division, is used for driving the clamping part rotates and carries out defect detection to the positive and negative of wafer, contains: the device comprises a bracket, a rotating shaft, a driving wheel unit, a third motor and a driving wheel unit, wherein the rotating shaft is rotatably arranged on the bracket and fixedly connected with the mounting platform, the driving wheel unit is in driving connection with the rotating shaft at the output end, and the third motor is arranged on the base and in driving connection with the input end of the driving wheel unit.
9. The edge finder as defined in claim 7, further comprising:
the clamping portion further comprises: a shell, a second circular through hole is arranged on the shell, the central axis of the first circular through hole coincides with the central axis of the second circular through hole, the diameter of the second circular through hole is larger than that of the wafer,
the top side of the shell is provided with sliding holes corresponding to the clamping wheels one by one, the direction of the sliding holes is the same as the direction of the moving of the clamping wheels, and the sliding holes are positioned on the moving track of the corresponding clamping wheels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711270805.8A CN107818942B (en) | 2017-12-05 | 2017-12-05 | edge finder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711270805.8A CN107818942B (en) | 2017-12-05 | 2017-12-05 | edge finder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107818942A CN107818942A (en) | 2018-03-20 |
| CN107818942B true CN107818942B (en) | 2023-10-17 |
Family
ID=61605788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711270805.8A Active CN107818942B (en) | 2017-12-05 | 2017-12-05 | edge finder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107818942B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109029335A (en) * | 2018-09-12 | 2018-12-18 | 江苏英锐半导体有限公司 | A kind of wafer flow surface smoothness detection device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201009911A (en) * | 2008-08-18 | 2010-03-01 | Zen Voce Corp | Method to locate the perimeter of a wafer |
| CN202434487U (en) * | 2011-12-13 | 2012-09-12 | 昆山中辰矽晶有限公司 | Wafer edge searching and positioning device and etching machine station |
| CN106558526A (en) * | 2016-05-24 | 2017-04-05 | 陈百捷 | It is a kind of to carry the manipulator that wafer seeks side sensor |
| CN206076205U (en) * | 2016-08-19 | 2017-04-05 | 天津三安光电有限公司 | Chip seeking border |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7161669B2 (en) * | 2005-05-06 | 2007-01-09 | Kla- Tencor Technologies Corporation | Wafer edge inspection |
-
2017
- 2017-12-05 CN CN201711270805.8A patent/CN107818942B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201009911A (en) * | 2008-08-18 | 2010-03-01 | Zen Voce Corp | Method to locate the perimeter of a wafer |
| CN202434487U (en) * | 2011-12-13 | 2012-09-12 | 昆山中辰矽晶有限公司 | Wafer edge searching and positioning device and etching machine station |
| CN106558526A (en) * | 2016-05-24 | 2017-04-05 | 陈百捷 | It is a kind of to carry the manipulator that wafer seeks side sensor |
| CN206076205U (en) * | 2016-08-19 | 2017-04-05 | 天津三安光电有限公司 | Chip seeking border |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107818942A (en) | 2018-03-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI692644B (en) | Electronic component probing device | |
| CN102607804A (en) | Clamping assembly and backlight module testing device applying same | |
| CN104122633B (en) | A kind of chip of light waveguide and fiber angle automatic alignment apparatus and method | |
| CN104330417B (en) | Image detection imaging device and image detecting apparatus | |
| CN108152778B (en) | Automatic intermodulation test equipment of filter | |
| CN112563180A (en) | Wafer positioning and calibrating device based on roller clamping driving | |
| WO2020125656A1 (en) | Imaging adjustment device | |
| CN107818942B (en) | edge finder | |
| TWI442157B (en) | Focusing mechanism | |
| CN102997857A (en) | Aperture measurement device and aperture measurement method | |
| CN107393855B (en) | Wafer positioning device and method | |
| CN107990819A (en) | A kind of multi-angle film thickness detecting device | |
| CN213424965U (en) | Wafer positioning and calibrating device based on roller clamping driving | |
| US8073650B2 (en) | Dimension measuring apparatus | |
| CN105278070B (en) | Optical element clamping device | |
| CN216078885U (en) | Rotary clamping device of equipment | |
| CN114200625B (en) | Eccentric adjusting device | |
| CN212227997U (en) | Roller sample chamfer detection device | |
| CN207637771U (en) | Seeking border | |
| CN210625998U (en) | Lens detection device | |
| CN103111495A (en) | Square shaft straightener | |
| CN221404665U (en) | Optical machine detection device | |
| CN213028371U (en) | Zoom lens MTF detection equipment | |
| CN220508011U (en) | Optical element detection device | |
| CN104807421A (en) | Automatic detection device for relative position of component after forming of tow belt forming |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: Room 202, Building 1, 555 Wanfang Road, Minhang District, Shanghai, 201100 Applicant after: Shanghai Han's Fuchuang Technology Co.,Ltd. Address before: Room 202, Building 1, 555 Wanfang Road, Minhang District, Shanghai, 201100 Applicant before: SHANGHAI FORTREND TECHNOLOGY Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |