201009350 六、發明說明： 【發明所屬之技術領域】 本發月般而言係關於晶圓探針台，且更特定而言 之係關於一種裝置及方法，其用來修正一晶圓探針台之 探針卡及卡盤板間的平行性。 【先前技術】 一晶圓探針台係用來將—晶圓上之晶片與-測試器連 接以測試該晶圓上之晶片的一種裴置。 在此參考第-圖簡短地描述_習知之晶圓探 構及操作。 ，口· 日日圓探針台100包括：一探針卡1〇2、一晶圓轉移裝 置104、一卡盤板1〇6、一卡盤轉移裝置1⑽，及—控制裝置 110。 該曰曰圓轉移裝置104將一晶圓裝載於該卡盤板刚上， 其中複數個晶片於該晶圓上形成。 該卡盤板106經由該卡盤轉移裝置108在X、丫及2；方向 移動’因此在賴針卡1()2上所提供之贿針經排列以 與該晶圓112上所提供該等晶片墊取得接觸。 田》亥等複數個探針分別與該等複數個晶片之墊取得接 觸時’-測試HIM根據—預定程式將—賴訊號經由該探 針卡搬提供至該晶圓112的晶片上。該晶圓ιΐ2的晶片將可 分派給該測試訊號之輸出峨，而經由姉針卡⑽提供予 該測試器114。因此’該測試器114在該晶圓i 12的晶片上執 201009350 行一測試。 然而，當該晶圓探針台1〇〇之探針卡102並非精確地水 ' 平放置時，該探針卡102之探針及該晶圓112之晶片的墊並 • 非彼此一致地取得接觸，因此存在一問題：無法垂直地檢 驗該晶圓112之該等晶片是否故障。 為了解決此種問題，在先前技術中，該探針卡1〇2之探 針係藉由在一z軸方向（其係一垂直方向）抬高該探針卡 鬌 來強制地與該晶圓U2之晶片取得接觸。然而，此操作成為 造成該晶圓112之晶片的墊以及該探針卡1〇2之該等探針受 損的一主要因素。 又 【發明内容】 技術問題 因此，本發明謹記先前技術中所發生之上述問題，且 藝本發日月之—目標係提供—種裝置及方法，其絲修正一晶 圓探針台之探針卡及該卡盤板間的平行性，其允許該探針 卡及該卡盤板可根據該晶圓探針台之探針卡的傾斜，而藉 由傾斜該卡盤板使彼此取得平行接觸。 曰 技術解決方案 為了達成該以上目標，本發明提供修正—晶圓探針台 之一探針卡及一卡盤板間之平行性的一種方法，其包含: 等步驟：測量該探針卡之-傾斜；產生相對於在該基座及 该卡盤板間之複數個第-預設位置之複數個片段的位移資 201009350 訊’其指出用來垂直地支撐該卡盤板之一基座及該卡盤板 間的間隔以對應該探針卡之測得傾斜；以及個別地驅動安 裝在該基座及該卡盤板間之第二預設位置處的複數個致動 器’因此該基座及該卡盤板變得彼此遠離或變得以不同角. 度彼此靠近’直到複數個片段之已感測位移資訊分別追蹤 該=複數個片段之位移資訊，該等複數個片段之已感測位 移=貝訊係自安裝在該基座及該卡盤板間之第一預設位置處 的複數個位移感測器’藉由感測其安裝位置處之該基座及 =卡盤板間的間隔來輸出，其中該卡盤板追蹤該探針卡之❹ § 斜因此該卡盤板及該探針卡係彼此平行地佈置。 有利之影響 圓探明之優點係一探針卡及一卡盤板可藉由傾斜一晶 得接2台之卡盤板以對應該探針卡之傾斜來彼此平行地取 因此改善了在一晶圓上之晶片上之一測試的效率。 【實施方式】 ❹ 最隹棋式 卡盤種拫據本發明用來修正一晶圓探針台一探針卡及一 卡之—間之平行性的方法，其包括該等步驟：測量該探針 預敦位该斜·’產生相對該基座及該卡盤板間之複數個第一 撐置的複數個片段之位移資訊，其指出用來垂直地支 之冽彳θ盤板之一基座及該卡盤板間的間隔以對應該探針卡 /侍饿钭；以及分別驅動複數個致動器，其安裝在該基 201009350 座及該卡盤板間之第二預設位置處，因此該基座及該卡盤 板變得彼此遠離或以不同角度彼此靠近，直到複數個片段 之所感測的位移資訊分別追蹤該等複數個片段的位移資 訊’該等複數個片段所感測的位移資訊係自安裝在該基座 及該卡盤板間之第一預設位置處的複數個位移感測器藉由 感測在其安裝位置處該基座及該卡盤板間的間隔來輸出， 其中該卡盤板追蹤該探針卡之傾斜，因此該卡盤板及該探 針卡係彼此平行地佈置。 發明模式 以下將參考第二圖詳細描述根據本發明之一具體實施 例之一晶圓探針台的示意建構。 一 B曰圓探針台包括：一卡盤板傾斜裝置2〇〇、—主要控 制裝置222、-成像裝置224，及一記憶單m 工201009350 VI. Description of the Invention: [Technical Fields of the Invention] This is a monthly reference to a wafer probe station, and more particularly to a device and method for modifying a wafer probe station The parallelism between the probe card and the chuck plate. [Prior Art] A wafer probe station is used to connect a wafer on a wafer to a tester to test a device on the wafer. The wafer probing and operation of the prior art is briefly described herein with reference to the drawings. The port/day probe probe station 100 includes a probe card 1 2, a wafer transfer device 104, a chuck plate 1〇6, a chuck transfer device 1 (10), and a control device 110. The dome transfer device 104 loads a wafer onto the chuck plate, wherein a plurality of wafers are formed on the wafer. The chuck plate 106 is moved in the X, 丫, and 2 directions via the chuck transfer device 108. Thus, the burrs provided on the PIN card 1() 2 are arranged to be provided with the wafer 112. The wafer pad is brought into contact. When a plurality of probes, such as Tian Hai, are respectively in contact with the pads of the plurality of wafers, the test HIM is supplied to the wafer of the wafer 112 via the probe card according to a predetermined program. The wafer of wafer ι 2 will be dispatched to the output 峨 of the test signal and to the tester 114 via the 卡 card (10). Therefore, the tester 114 performs a test of 201009350 on the wafer of the wafer i12. However, when the probe card 102 of the wafer probe station 1 is not accurately placed in a water level, the probe of the probe card 102 and the pads of the wafer of the wafer 112 are not uniformly obtained from each other. Contact, and therefore there is a problem in that it is not possible to vertically verify whether the wafers of the wafer 112 are malfunctioning. In order to solve such a problem, in the prior art, the probe of the probe card 1〇2 is forcibly connected to the wafer by raising the probe cassette in a z-axis direction (which is a vertical direction). The U2 wafer is in contact. However, this operation becomes a major factor in the pad of the wafer that causes the wafer 112 and the probes of the probe card 1〇2. Further, the present invention is directed to the above-mentioned problems occurring in the prior art, and the present invention provides a device and a method for correcting a wafer probe station. The parallelism between the needle card and the chuck plate allows the probe card and the chuck plate to be parallel to each other by tilting the chuck plate according to the tilt of the probe card of the wafer probe station contact.曰Technical Solution In order to achieve the above object, the present invention provides a method for correcting the parallelism between a probe card and a chuck plate of a wafer probe station, comprising: steps: measuring the probe card - tilting; generating a displacement of a plurality of segments relative to a plurality of first-predetermined positions between the base and the chuck plate, indicating that it is used to vertically support a base of the chuck plate and The spacing between the chuck plates is inclined to correspond to the measurement of the probe card; and the plurality of actuators mounted at a second predetermined position between the base and the chuck plate are individually driven. The seat and the chuck plate become distant from each other or become close to each other at different angles until the sensed displacement information of the plurality of segments respectively tracks the displacement information of the plurality of segments, and the plurality of segments have been sensed Displacement = the number of displacement sensors installed at the first predetermined position between the base and the chuck plate' by sensing the position of the base and the chuck between the mounting positions Interval to output, where the chuck plate tracks the probe The card is ❹ oblique so the chuck plate and the probe card are arranged parallel to each other. The advantage of the advantageous circle is that a probe card and a chuck plate can be taken in parallel with each other by tilting one crystal to connect two chuck plates to the inclination of the probe card, thereby improving The efficiency of one of the tests on the wafer on the wafer. [Embodiment] ❹ The most advanced chess type is a method for correcting the parallelism between a wafer probe station and a probe card according to the present invention, which comprises the steps of: measuring the probe The pre-drilling position of the slant is 'displacement' with respect to a plurality of segments of the plurality of first struts between the pedestal and the chuck plate, indicating a pedestal of the 冽彳 θ disk plate for vertical support And the spacing between the chuck plates to correspond to the probe card/snake; and driving a plurality of actuators respectively, which are installed at the second preset position between the base 201009350 and the chuck plate, The pedestal and the chuck plate are moved away from each other or close to each other at different angles until the displacement information sensed by the plurality of segments respectively tracks the displacement information of the plurality of segments' displacement information sensed by the plurality of segments And a plurality of displacement sensors installed at a first predetermined position between the base and the chuck plate are outputted by sensing an interval between the base and the chuck plate at a mounting position thereof, Where the chuck board tracks the tilt of the probe card, so The chuck plate and the probe card are arranged parallel to each other lines. Mode for Invention Hereinafter, a schematic construction of a wafer probe station according to an embodiment of the present invention will be described in detail with reference to the second drawing. A B-round probe station includes: a chuck plate tilting device 2〇〇, a main control device 222, an imaging device 224, and a memory unit m
該卡盤板傾斜裝置200依照來自該主要控制裝置222 之一傾斜命切—卡餘傾斜崎應-騎卡之傾斜，因 此能使該卡盤板與該探針卡平行地接觸。 該主要控制裝置222接收經由該成像裝置22 形 tr針^之ΓΓ取得的f訊，_該探針卡之傾斜度 :=之該傾斜度，並傳送該傾斜命令至該卡盤二 該傾斜命令包括第— 經指派來對應該探針卡傾 至第二位移資訊的片段，其對應 斜之卡盤板的第一至第三位移感 201009350 測器204至208。第一至第三位移資訊的片段可用此一方式 取得：對應個別傾斜之第一至第三位移感測器2〇4至2〇8之 第一至弟二位移資訊的片段係經由在製造該晶圓探針台時 的實驗來事先取得並儲存在該記憶單元226中，或是用此一 * 方式取得：第一至第三位移資訊的該等片段係經由公式計 算而得，該公式係取自對應該等傾斜之第一至第三位移感 測器204至208之第一至第三位移資訊片段之間的相關性。 该§己億單元226將各種類型之資訊儲存於其中，包括节 主要控制裝置222之控制程式，特別是由對應該探針卡之個❹ 別傾斜之第一至第三位移感測器2〇4至2〇8之第一至第三位 移資訊片段所組成的傾斜命令。 該卡盤板傾斜裝置200包括：一控制裝置2〇2、第—至 第二位移感測器204至208、一類比至數位轉換器 (Analog-to-Digital Converter，ADC) 210、一數位至類比轉 換器（Digital-to-Analog Converter，DAC) 212、第一至第二 致動器214至218 ’及一通訊模組220。 卜 ◎ 第一至第三位移感測器204至208及第一至第三致動 器214至218係安裝在該卡盤板300及一基座302之間， 如第三圖及第四圖所示。該基座3〇2垂直地支撐該卡盤板 300’其中用來垂直地支撐該卡盤板3〇〇的工具共同稱之 一 Z 轴。 .、、' 第一至第三位移感測器204至208係分別安裝在與該 基座3〇2取得接觸之卡盤板3〇〇後表面的三個均等創分位 置處。進一步地，第一至第三致動器214至218係安裝在 201009350 與5亥基座302取得接觸之卡盤板3005後表面的其它三個均 等劃分位置處。 當第一至第三位移感測器204至208及第一至第三致 動态214至218之位置未彼此重疊時，需要根據第一至第 二致動器214至218之驅動用來將第一至第三位移感測器 204至208之第一至第三已感測位移資訊與該卡盤板3〇〇 之傾斜度相配的一初始設定程序。 參 母一個第一至第三位移感測器2〇4至2〇8在其自身之安 裝位置處感測該基座3 02及該卡盤板3 〇 〇間的一垂直間隔， 並將可分派給該感測操作之一已感測訊號提供予(該ADC 210 〇 該ADC 210將自第一至第三位移感測器2〇4至2〇8輸 出之第一至第三已感測訊號轉換成第一至第三已感測位移 資訊的片段，並將第一至第三已感測位移資訊提供.予該控 制裝置202。 _ 該控制裝置202產生用於第一至第三致動器214至218 的第一至第三驅動命令，其允許自第一至第三位移感測器 204至208輸出之第一至第三已感測位移資訊的片段追蹤 用於第一至第三位移感測器204至208之第一至第三位移 資訊的片段，其係包括在自該主要控制裝置222輸出的傾 斜命令中。用於第一至第三致動器214至218的第一至第 三驅動命令係經由該DAC 212轉換成用於第一至第三致動 器214至218的第一至第三驅動訊號，並提供予第一至第 三致動器214至218。 201009350 第一至第三致動器214至218增加或減少在其安裝位 置處在不同角度下該基座302及該卡盤板300間的垂直間 隔’以回應自該控制裴置202輸出的第一至第三驅動訊號， 因此使該基座302及該卡盤板300在一垂直方向上能變得 彼此遠離或變得彼此靠近。因此，傾斜該卡盤板300以對 應該探針卡的傾斜。 該通訊模組220執行該主要控制裝置222及該控制裝 置202間之通訊。 該卡盤板傾斜裝置200之控制裝置202的建構將參考 弟五圖來詳細描述。 該控制裝置202包括：一比較器500及一比例-積分-微分(Proportional-Integral-Derivative，PID)控制器 502。 該比較器500比較第一至第三位移資訊的片段及自第 一至第三位移感測器204至208輸出之第一至第三已感測 之位移資訊的片段，並將比較結果提供予該控制器 502。該PID控制器502產生用於第一至第三致動器214至 218之第一至第三驅動命令，因此所有比較結果變成「〇」， 然後將第一至第三驅動命令分別提供給第一至第三致動器 214 至 218。 在此方式下，該控制裝置202產生控制第一至第三致 動器214至218所需的第一至第三驅動命令，因此自第一 至第三位移感測器204至208輸出之第一至第三已感測位 移資訊的片段分別追蹤第一至第三位移資訊的片段。 以下參考第六圖及第七圖之該等流程圖描述根據本發 201009350 明之:具體實施例之卡盤板傾斜褒置的操作。 222的百^作參考第六圖之流程圖詳細描述該主要控制裝置 在步驟600中，該主要控制襄置22 通知該卡盤板傾斜裝置竭 接下來在步驟602中，魅要㈣裝置 P 7 針卡之成絲__針卡 經由該探 參 度，該探針卡之成# 斜卩.忒探針卡之傾斜 其後在步驟6〇4糸以該成像裝置似來實行。 元220讀取用於讀卞=，該主要控制裝置222自該記憶單 之傾斜度，即：自"第^板之_一傾斜命令，其對應該探針卡 之第一至第三已感挪〜至第三位移感測器2〇4至208輪出 至第三位移資訊之片^ =位移資訊的片段所必須追蹤的第一 一至第三位移資訊之^，該主要控制裝置222配置來自第 傾斜命令傳送至該士卡盤板彳員斜命令，以及將該卡盤板 其後，參考第七^板傾斜裝置細。 在步驟700及^插述該卡盤板傾斜裝置200之操作。 第三致動器214至2]2中，該控制裝置202初始化第一至 -初始命令。 8以回應來自該主要控制裝置222的 其後，當在步綠 卡盤板傾斜命令時，Υ 4中自該主要控制裝置222接收該 器2!4至218，因^控制裝置2〇2驅動第一至第三致動 輸出之第一至第=Ρ第一至第三位移感測器204至208 該卡盤板傾斜測位移資訊的個別片段追縱包括在 <第一至第三位移資訊的片段。即， 201009350 該控制裝置202分別比較用於第一至第三位移感測器204 至20δ之第一至第三位移資訊的片段（由該主要控制裝置 222所提供）以及第一至第三已感測位移值（由第一至第三 位移感測器2〇4至208所實際感測）’產生用於第一至第三 致動器214至21S之驅動命令，其使得第一至第三位移資 訊之片段變得與第一至第三已感測位移值一致，以及將該 等驅動命令提供給第一至第三致動器214至218。 產業上可利用性 © 本發明之優點係-探針卡及一卡盤板可藉由傾斜一晶 = 板㈣應該探針卡之傾斜來彼 付接觸，因此改善了在—日日日紅日日日片之1試效率。 【圖式簡單說明】 示； 第-圖係顯示-代表性晶圓探針台之示意建構的^圖 ❹ 第二圖係根據本發明之—具體實 斜裝置的-方塊圖； _不-卡盤板傾 第二圖及第四圖係根據本發明一 卡盤板傾斜裝置的圖示； 之具體實施例顯示一 第五圖係根據本發明之一具體實施 斜裝置之控制裝置詳細建構的一圖示；及 盤板j 第六圖及第七圖係根據本發明之一具 卡盤板傾斜裝置之處理程序流程圖。A 項不 12 201009350The chuck plate tilting device 200 is tilted in accordance with one of the main control devices 222. The tilt of the card is ramped, so that the chuck plate can be brought into contact with the probe card in parallel. The main control device 222 receives the f signal obtained through the shape of the imaging device 22, the slope of the probe card: = the inclination, and transmits the tilt command to the chuck 2 the tilt command Including the first segment assigned to the second displacement information corresponding to the probe card, which corresponds to the first to third displacement senses 201009350 detectors 204 to 208 of the oblique chuck plate. The segments of the first to third displacement information can be obtained in such a manner that the segments corresponding to the first to third displacement sensors of the first to third displacement sensors 2〇4 to 2〇8 of the individual inclinations are manufactured by The experiment at the wafer probe station is obtained in advance and stored in the memory unit 226, or is obtained by using the method: the segments of the first to third displacement information are calculated by a formula, and the formula is The correlation between the first to third displacement information segments of the first to third displacement sensors 204 to 208 corresponding to the inclination is taken. The § billion unit 226 stores various types of information therein, including the control program of the main control unit 222, in particular, the first to third displacement sensors 2 corresponding to the tilt of the probe card. A tilt command composed of the first to third displacement information segments of 4 to 2〇8. The chuck plate tilting device 200 includes: a control device 2〇2, a first to second displacement sensors 204 to 208, an analog-to-digital converter (ADC) 210, and a digit to A digital-to-analog converter (DAC) 212, first to second actuators 214 to 218' and a communication module 220. The first to third displacement sensors 204 to 208 and the first to third actuators 214 to 218 are mounted between the chuck plate 300 and a base 302, as shown in the third and fourth figures. Shown. The base 3〇2 vertically supports the chuck plate 300'. The tool for vertically supporting the chuck plate 3 is collectively referred to as a Z-axis. The first to third displacement sensors 204 to 208 are respectively mounted at three equal-creation positions on the rear surface of the chuck plate 3 which is in contact with the base 3〇2. Further, the first to third actuators 214 to 218 are mounted at the other three equal division positions of the rear surface of the chuck plate 3005 where the 201009350 is brought into contact with the 5th pedestal 302. When the positions of the first to third displacement sensors 204 to 208 and the first to third actuation dynamics 214 to 218 do not overlap each other, it is necessary to drive according to the driving of the first to second actuators 214 to 218 An initial setting procedure of the first to third sensed displacement information of the first to third displacement sensors 204 to 208 is matched with the inclination of the chuck plate 3〇〇. A first to third displacement sensors 2〇4 to 2〇8 of the ginseng sense a vertical interval between the pedestal 032 and the chuck plate 3 at its own mounting position, and Assigned to one of the sensing operations, the sensed signal is provided (the ADC 210, the ADC 210 will first sense the first to third sensed outputs from the first to third displacement sensors 2〇4 to 2〇8) The signal is converted into segments of the first to third sensed displacement information, and the first to third sensed displacement information is provided to the control device 202. The control device 202 is generated for the first to third directions. First to third drive commands of the actuators 214 to 218, which allow segment tracking of the first to third sensed displacement information output from the first to third displacement sensors 204 to 208 for the first to the Fragments of the first to third displacement information of the three displacement sensors 204 to 208 are included in the tilt command output from the main control device 222. The first to third actuators 214 to 218 The first to third drive commands are converted to the first to third drives for the first to third actuators 214 to 218 via the DAC 212 No. and supplied to the first to third actuators 214 to 218. 201009350 The first to third actuators 214 to 218 increase or decrease the base 302 and the chuck plate at different angles at their mounting positions. 300 vertical intervals 'in response to the first to third driving signals output from the control device 202, thereby enabling the pedestal 302 and the chuck plate 300 to become distant from each other or become mutually in a vertical direction Therefore, the chuck plate 300 is tilted to correspond to the tilt of the probe card. The communication module 220 performs communication between the main control device 222 and the control device 202. The control device 202 of the chuck plate tilting device 200 The construction will be described in detail with reference to the fifth diagram. The control device 202 includes a comparator 500 and a Proportional-Integral-Derivative (PID) controller 502. The comparator 500 compares the first to the first A segment of the three-displacement information and a segment of the first to third sensed displacement information output from the first to third displacement sensors 204 to 208, and the comparison result is supplied to the controller 502. The PID controller 502 is generated for the first to The first to third drive commands of the third actuators 214 to 218, therefore, all the comparison results become "〇", and then the first to third drive commands are supplied to the first to third actuators 214 to 218, respectively. In this manner, the control device 202 generates first to third drive commands required to control the first to third actuators 214 to 218, and thus outputs the first to third displacement sensors 204 to 208. The segments of the first to third sensed displacement information track the segments of the first to third displacement information, respectively. The operation of the chuck plate tilting device of the specific embodiment will be described below with reference to the flow charts of the sixth and seventh figures. Referring to the flowchart of FIG. 6 in detail, the main control device in step 600, the main control device 22 notifies the chuck plate tilting device to proceed in step 602, the charm device (4) device P 7 The needle card is formed by the probe, and the probe card is tilted. The tilt of the probe card is then performed in the step 6〇4糸 as the image forming apparatus. The element 220 is read for reading 卞=, the inclination of the main control device 222 from the memory sheet, that is, from the "the slab of the slanting command, which corresponds to the first to third of the probe card Sensing ~ to the third displacement sensor 2 〇 4 to 208 to the third displacement information piece ^ = the first to third displacement information of the segment of the displacement information must be tracked, the main control device 222 Configure the command from the first tilt command to the slash plate operator, and the chuck plate to the rear, refer to the seventh plate tilting device. The operation of the chuck plate tilting device 200 is interposed at steps 700 and 2. In the third actuators 214 to 2] 2, the control device 202 initializes the first to - initial commands. 8 in response to the main control device 222, when the green card tray tilt command is issued, the device 2 receives the devices 2! 4 to 218 from the main control device 222, because the control device 2〇2 drives the first First to third first to third displacement sensors 204 to 208 of the first to third actuation outputs The individual segment tracking of the chuck plate tilt measurement information is included in the <first to third displacement information Fragment of. That is, 201009350, the control device 202 compares the segments (provided by the primary control device 222) for the first to third displacement information of the first to third displacement sensors 204 to 20δ, respectively, and the first to third The sense displacement value (actually sensed by the first to third displacement sensors 2〇4 to 208) generates a drive command for the first to third actuators 214 to 21S, which makes the first to the first The pieces of the three displacement information become coincident with the first to third sensed displacement values, and the drive commands are supplied to the first to third actuators 214 to 218. INDUSTRIAL APPLICABILITY © The advantage of the present invention is that the probe card and a chuck plate can be contacted by tilting a crystal plate (four) and the probe card should be tilted, thereby improving the day-to-day red day. 1 day test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic diagram of a representative wafer probe station. The second figure is a block diagram of a specific solid tilting device according to the present invention; _ not-card The second and fourth figures of the disk plate are diagrams of a chuck plate tilting device according to the present invention; the specific embodiment shows a fifth figure which is a detailed construction of the control device of the tilting device according to one embodiment of the present invention. Illustrated; and disk plate j The sixth and seventh drawings are flowcharts of the processing procedure of the chuck plate tilting device according to one of the present invention. A item is not 12 201009350
主要元件符號說明】 100 晶圓探針台 102 探針卡 104 晶圓轉移裝置 106 卡盤板 108 卡盤轉移裝置 110 控制裝置 112 晶圓 114 測試器 200 卡盤板傾斜裝置 202 控制裝置 204 第一位移感測器 206 第二位移感測器 208 第三位移感測器 210 類比至數位轉換器 212 數位至類比轉換器 214 第一致動器 216 第二致動器 218 第三致動器 220 通訊模組 222 主要控制裝置 224 成像裝置 226 記憶單元 300 卡盤板 13 201009350 302 500 502 基座 比較器 比例-積分-微分控制器Main component symbol description] 100 wafer probe station 102 probe card 104 wafer transfer device 106 chuck plate 108 chuck transfer device 110 control device 112 wafer 114 tester 200 chuck plate tilt device 202 control device 204 first Displacement sensor 206 second displacement sensor 208 third displacement sensor 210 analog to digital converter 212 digital to analog converter 214 first actuator 216 second actuator 218 third actuator 220 communication Module 222 main control device 224 imaging device 226 memory unit 300 chuck plate 13 201009350 302 500 502 pedestal comparator proportional-integral-derivative controller
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