CN2444311Y - Crystal plate tester - Google Patents

Crystal plate tester Download PDF

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Publication number
CN2444311Y
CN2444311Y CN 00245839 CN00245839U CN2444311Y CN 2444311 Y CN2444311 Y CN 2444311Y CN 00245839 CN00245839 CN 00245839 CN 00245839 U CN00245839 U CN 00245839U CN 2444311 Y CN2444311 Y CN 2444311Y
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CN
China
Prior art keywords
wafer
elevating bracket
driving element
test
substrate
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Expired - Fee Related
Application number
CN 00245839
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Chinese (zh)
Inventor
陈文杰
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Individual
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Individual
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Priority to CN 00245839 priority Critical patent/CN2444311Y/en
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Publication of CN2444311Y publication Critical patent/CN2444311Y/en
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Abstract

The utility model relates to a wafer tester, which comprises a base, a body, an object placing member, and a detecting member, wherein, the base is provided with a fixing seat, and is erected with a guide member; the body is erected on the guide member, and is moved according to the guide, a lifting seat is sheathed on the body to move up and down, and a driving element is fixed on the body to correct and drive the lifting seat to upwards move for setting distance; the object placing member is fixed to the lifting seat, and a wafer is arranged in a positioning slot of the object placing member; the detecting member is arranged on the upper side of the object placing member, and is provided with a basal plate which is provided with a testing seat. The driving element on the body moves unit distance by starting at one time, a controller starts the driving element at one time, an action is tightly followed at one time, and the driving element is immediately stopped at the accurate distance after receiving stop sign. A probe of the wafer, which is contacted with the testing seat can receive a pressing contact range for providing accurate test.

Description

Wafer test apparatus
The utility model relates to the testing apparatus in a kind of instrument field measurement, the test, particularly relate to a kind of driving element and drive elevating bracket one by one, make the wafer contact substrate, make through storage that its repeated starting driving element moves, the wafer test apparatus of testing wafer.
Whether the existing wafer of commonly using must normal through its wiring of test earlier before encapsulation, it is so-called naked ranging degree, early stage naked survey mostly is the IC crystal grain of generally commonly seeing, after completing, promptly pack in the concave character type fixed die, so that deliver to and do test job on the test base, yet this work all is to do test by manpower with the program of craft traditionally, so very expend time in and manpower, make whole test job quite slow, therefore also influence production efficiency.
A kind of machine testing apparatus is arranged recently, it is to set up motor driven one elevating bracket on the board, this elevating bracket is provided with a groove seat for putting a wafer, one detection means is set up in this board, and being positioned at suitably height of this elevating bracket top, an affixed substrate on this detection means utilizes starter to drive this elevating bracket and is moved upwards up to the location and stops, groove seat on this elevating bracket is put the detection zone of this wafer contact substrate, to test this wafer.
Yet this wafer contacts the position of the detection zone of this substrate, must control quite accurate, stop also must be very accurate so this elevating bracket of motor driven is moved upwards up to the location, but motor Continuous Drive, it will be to stopping that one section buffer field will be arranged from driving condition, so need a sensing element be set in the interval of rising, be moved upwards up to desired location to detect this elevating bracket, this sensing element produces signal, motor is stopped, but because motor will be to stopping that one section buffer field will be arranged from driving condition, and the length of this buffer field is relevant with the translational speed speed, so after configuring buffer field, tend to because of rapid change (regularly), cause this elevating bracket move up position interference or deficiency as voltage instability.
If the detection zone that displacement interference meeting makes this wafer contact this substrate forms extruding, cause the detection zone damage easily and test inaccurate, and for example fruit displacement deficiency can make this wafer not contact the detection zone of this substrate, cause test bad, cause inaccurate, the good product of test to be taken as the defective of defective products easily so have, still have many disappearances in the use, the dealer that remains to be correlated with is apt to add improvement.This shows that above-mentioned existing wafer test apparatus still has many defectives, and the assistant officer waits to be improved.
Because wafer sort, its shift position that above-mentioned existing wafer test apparatus exists can't accurately be located, and the test section of causing contact substrate is incorrect, the defective of test poor effect, the design people is based on the abundant practical experience and the professional knowledge of the manufacturing of being engaged in wafer sort and relevant device for many years and design, actively studied innovation, through constantly research, design, and after studying sample and improvement repeatedly, create the utility model finally.
Main purpose of the present utility model is, overcome the defective that existing wafer test apparatus exists, and provide a kind of wafer test apparatus of new structure, make it utilize controller to start driving element and move, accurately stop the location one by one, make body move on to the location according to guide member, the wafer that driving element drives on the smelting tool on it is stablized the engaged test seat, tests so that wafer to be provided.
Another purpose of the present utility model is, a kind of wafer test apparatus is provided, make the steady lifting moving of guide groove of its body top guide bar elevating bracket, smelting tool bearing wafer aligns the test bench of substrate on this elevating bracket, accuracy of test is improved, and smelting tool, substrate can corresponding different chips specification changed, very convenient in the use.
The purpose of this utility model is realized by following technical scheme.According to a kind of wafer test apparatus that the utility model proposes, it is provided with driving element and controller, it is characterized in that it mainly comprises: a base, which is provided with a holder, and it is put on the shelf and is provided with a guide member; One body, be set up in this guide member, and be according to guiding the structure that direction moves, one elevating bracket, be socketed on this body, form structure moving up and down, a driving element is fixedly arranged on this body, a unit distance is once moved in the every startup of this driving element, and this driving element is proofreaied and correct mobile setpoint distance on this elevating bracket of driving; One glove member is fixedly arranged on this elevating bracket, which is provided with a location notch, puts a wafer in this location notch; One detection means, setting is positioned at the upside of glove member, and is set up on this holder, and this detection means has been set up a substrate, and this substrate is provided with a test bench; The combined formation wafer test apparatus of said structure, its body is put wafer at the glove member, move to the location, test section, driving this elevating bracket one by one rises one by one, the test bench of this wafer contact substrate, this elevating bracket lifting height stores through a controller, to start the foundation of this elevating bracket lifting height as next time.
The purpose of this utility model can also further realize by following technical measures.
Aforesaid wafer test apparatus, the distolateral guide rod that is provided with predetermined number of wherein said body, the guide groove of this guide rod closing elevating bracket, this elevating bracket form according to the guide rod correcting and move up and down and the structure of non-migration.
Aforesaid wafer test apparatus, wherein said body are provided with one can be stopped and move the limit element that stops, avoiding glove member percussion substrate on the elevating bracket.
Aforesaid wafer test apparatus, wherein said holder are provided with the detecing element that a detecting body moves on to correct location, test section, and this elevating bracket rises, the test bench of wafer contact substrate.
The utility model compared with prior art has tangible advantage and good effect.By above technical scheme as can be known, the utility model wafer test apparatus, it utilizes controller to start driving element and moves, accurately stops the location one by one, make body move on to the position location according to guide member, the wafer that driving element on it drives on the smelting tool is stablized the engaged test seat, and can provide wafer to test.The steady lifting moving of guide groove of its body top guide bar elevating bracket, smelting tool bearing wafer on this elevating bracket aligns the test bench of substrate, accuracy of test is significantly improved, and the specification that smelting tool, substrate can corresponding different chips changed, very convenient in the use.
In sum, a unit distance is once moved in the every startup of the driving element of the utility model on body, controller startup driving element once is right after action once, stop the location with accurate distance at once after receiving stop signal, and the probe that makes wafer engaged test seat is tested and can provide accurately for accepting to compress the scope of contact.No matter it structurally or bigger improvement is all arranged on the function, and have large improvement technically, and produced handy and practical effect, and have the effect of enhancement really, thereby be suitable for practicality more, really is a new and innovative, progressive, practical new design.
Concrete structure of the present utility model is provided in detail by following examples and accompanying drawing thereof.
Fig. 1 is the overall structure schematic diagram of the utility model wafer test apparatus.
Fig. 2 is the structural upright schematic diagram of the utility model wafer test apparatus.
Fig. 3 is that the body of the utility model wafer test apparatus shifts out the structural representation of putting wafer.
Fig. 4 is the structural representation that the body of the utility model wafer test apparatus moves into the location.
Fig. 5 moves the schematic diagram that makes the test of wafer contact substrate on the elevating bracket of the utility model wafer test apparatus.
Fig. 6 is the structure enlarged diagram of the wafer contact substrate test of the utility model wafer test apparatus.
Base ... (20) controller ... (21)
The operating surface cricket ... (211) front stall ... (221)
Holder ... (22) lead ... (223)
Detecing element ... (222) detecing element ... (225)
Lead ... (226)
Guide member ... (23) cylinder ... (24)
Side plate ... (25)
Body ... (30) perforation ... (31)
Elevating bracket ... (32) guide groove ... (33)
Guide rod ... (34) driving element ... (35)
Drive link ... (36) detection lug ... (37), (371)
Projection ... (38) limit element ... (39)
The smelting tool ... (40) location notch ... (41)
Wafer ... (42) aperture ... (43)
Screw ... (44)
Detection means ... (50) cover ... (51)
Substrate ... (52) test bench ... (53)
The Plug Division ... (54) line seat ... (55)
Winding displacement ... (56)
Below in conjunction with accompanying drawing and preferred embodiment, to according to its concrete structure of wafer test apparatus, feature and the effect thereof that the utility model proposes, describe in detail as after.
See also Fig. 1 to shown in Figure 6, the utility model wafer test apparatus, it comprise a base 20, a body 30, a smelting tool 40 and a detection means 50 form (as shown in Figure 1), wherein:
This base 20, be equiped with a controller 21 (as shown in Figure 3) in it, it connects an operating surface cricket 211 (as shown in Figure 1) with lead, these base 20 upper sides are established a holder 22, transverse strands is provided with a guide member 23 on this holder 22, its straight-bar is suitable at interval spacing, one cylinder 24 is fixed in the front stall 221 of this holder 22, which is provided with a detecing element 222, it connects this controller 21 with a lead 223, the back seat 224 (as shown in Figure 3) of this holder 22 which is provided with a detecing element 225 in addition, and it connects this controller 21 with a lead 226; Two side plate 25 (as shown in Figure 2) crosswise fixed are in the both sides of this holder 22 in addition.
This body 30, be generally to be cylinder, which is provided with perforation and set up the straight-bar of guide member 23 31 (as shown in Figure 2), the side face of this body 30 also connects the actuating strut of cylinder 24, this body 30 is for being hollow form, and be equiped with the elevating bracket 32 (as shown in Figure 6) of a circle, the side face of this elevating bracket 32 is provided with three guide grooves 33 (as shown in Figure 1), three guide rods 34 are fixed in this body 30, and this guide groove 33 of closing, for another shown in Figure 3, one driving element 35 (the utility model is a stepper motor) is fixedly arranged on the hollow bulb of this body 30, it is provided with a drive link 36 and articulates the bottom side of elevating bracket 32 (as Fig. 3, shown in Figure 6), this driving element 35 can every startup once promptly drives drive link 36 and moves a cell distance, and this element distance can be set suitable length unit; For another Fig. 3, shown in Figure 6, two detection lugs 37,371 are fixed at body 30 respectively, and are 180 degree distributions at interval, and the side face of this elevating bracket 32 is provided with a projection 38 (as shown in Figure 2), one limit element 39 is fixedly arranged on the end face of this body 30, and its side is positioned at the suitable distance of upside of projection 38.
This smelting tool 40 as shown in Figure 6, is the end face that rounded plate is hubbed at elevating bracket 32, and its central authorities are provided with a location notch 41, and this location notch 41 is for putting a wafer 42; Other is provided with two apertures 43 and is positioned on the location notch 41, and collocation is provided with two-screw 44 and covers in it, and this two-screw 44 screws togather elevating bracket 32 and stationary positioned.
This detection means 50, as Fig. 2, Fig. 3, shown in Figure 6, it is set up on the side plate 25 of holder 22, and be positioned at the upside of smelting tool 40, its upside is installed with a cover 51, one substrate 52 is socketed between detection means 50, the cover 51, and this substrate 52 is provided with a test bench 53, and it is connected with most contacts wire and connects corresponding line; One end of this substrate 52 is provided with this Plug Division 54 of 54, one line seats, 55 sockets, a Plug Division, and a winding displacement 56 of this line seat 55 connects controller 21, for transmitting the message (not shown).
Combined by said structure, constitute the utility model wafer test apparatus.See also Fig. 1 to shown in Figure 6, the utility model in use, it is the driving lever (as shown in Figure 1) on this operating surface cricket 211 of operation, the actuating strut pulling body 30 (as shown in Figure 2) of this cylinder 24, make its according to the straight-bar of guide member 23 to guiding, before move to desired location and make detection lug 37 be abutted against detecing element 222, and produce signal and control this cylinder 24 and stop the location, the operator can be placed in wafer 42 location notch 41 of smelting tool 40; Utilize the driving lever on the operating surface cricket 211 to control then, the actuating strut of this cylinder 24 promotes body 30, make its straight-bar guiding according to guide member 23, moving backward to desired location makes detection lug 371 be abutted against detecing element 225, and produce signal and control this cylinder 24 and stop the location, body 30 promptly moves to the rear side of base 20, and the middle position of the substrate 52 of corresponding detection means 50.
The home loop of controller 21 produces signal simultaneously, starting driving element 35 (as shown in Figure 6) driving drive link 36 moves continuously, promptly driving this elevating bracket 32 moves up, the test bench 53 of wafer 42 contact substrates of putting up to the location notch 41 of smelting tool 40 52, this substrate 52 produces the signal pulse wave and is communicated with controller 21 through winding displacement 56, this controller 21 produces signal and is delivered to driving element 35, formation stops the location, this wafer 42 keeps in touch the test bench 53 of substrate 52, and test, controller 21 produces signals and starts this driving element 35 and drive elevating brackets 32 and be moved down into the location after test is finished, make the actuating strut pulling body 30 of cylinder 24 move forward to desired location simultaneously, detection lug 37 is abutted against detecing element 222 and produces signal, control cylinder 24 stops the location, the operator can store these wafer 42 classified placings, to make next test operation according to test result.
The utility model articulates the bottom side of elevating bracket 32 by the drive link 36 (as shown in Figure 6) of driving element 35 (the utility model is a stepper motor), driving element 35 every startups once promptly drive drive link 36 and move a cell distance, and this element distance can be set suitable length unit; Home loop by controller 1 can produce the continuous pulse wave signal simultaneously, make this driving element 35 once be right after one-shot, form simultaneously once to be right after and once drive this drive link 36 and move, when the test bench 53 of wafer 42 contact substrates 52, generation signal pulse wave is communicated with these driving element 35 formation and stops action, because these driving element 35 every startups once only drive this drive link 36 and move a cell distance, so stop to move signal when this driving element 35 receives, (this distance is very short after moving a cell distance for this driving element 35, be about 0.01 centimetre), promptly form and stop the location at once, it is from accepting to stop mobile signal to stopping the location, may be controlled to point-device distance, and for the probe of wafer 43 and test bench 53 for accepting to compress the scope of contact, so the utility model can utilize these wafer 43 engaged test seats 53 are tested.This driving element 35 drives drive link 36, driving elevating bracket 32 simultaneously moves up, the test bench 53 of wafer 42 contact substrates 52, to test, so can exempt the existing driving element driving elevating bracket of commonly using that utilizes uninterruptedly moves up continuously, cause the test bench of wafer contact substrate, driving element receives stop signal can be continued to move, can't stop at once, causes the test bench interference of wafer contact substrate and produces test error or touch the defective of damage.
Smelting tool 40 of the present utility model is the end faces that are screwed together in elevating bracket 32 with screw 44, this smelting tool 40 can corresponding different wafer specification be changed, because substrate 52 can corresponding different wafer specification, and this substrate 52 can be changed and be plugged between detection means 50, the cover 51, so smelting tool 40 of the present utility model, substrate 52 can corresponding different wafer specification be changed, and be very convenient in the use.
Three guide grooves 33 of three guide rods, 34 closing elevating brackets, 32 side faces on the body 30 of the present utility model again, make elevating bracket 32 form restricted location, can not produce yaw displacement, and by guide rod 34 closing guide grooves 33, make steadily lifting moving of elevating bracket 32, and the location notch 41 of smelting tool 40 can keep stablizing bearing wafer 42, elevating bracket 32 rises, and can make this wafer 42 align the test bench 53 of substrate 52, and the test accuracy of wafer 42 is improved.
What deserves to be mentioned is at this; because limit element 39 sides of the present utility model are positioned at the suitable distance of projection 38 upsides; if this is for controller 21, substrate 52 as when breaking down; elevating bracket 32 rises uncontrollable; and because these limit element 39 sides can be close to projection 38; this can form and stop that elevating bracket 32 continues to rise; so the doubt that can avoid this wafer 42 of location notch 41 carryings of smelting tool 40 to clash into the test bench 53 of substrates 52; can increase many one deck protections in the use, and can guarantee that device security uses.
In sum, the utility model wafer test apparatus, be on holder, to set up detection means to reach movably body, driving element on it drives the wafer engaged test seat on the smelting tool, utilizing controller to start driving element moves one by one, and accurately stopping the location, the probe that can provide wafer to stablize the engaged test seat is tested, and has industrial extensive value.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any simple modification, equivalent variations and modification that above embodiment did.

Claims (4)

1, a kind of wafer test apparatus is provided with driving element and controller, it is characterized in that it mainly comprises:
One base which is provided with a holder, and it is put on the shelf and is provided with a guide member;
One body, be set up in this guide member, and be according to guiding the structure that direction moves, one elevating bracket is socketed on this body, form structure moving up and down, one driving element is fixedly arranged on this body, and a unit distance is once moved in the every startup of this driving element, and this driving element is proofreaied and correct mobile setpoint distance on this elevating bracket of driving;
One glove member is fixedly arranged on this elevating bracket, which is provided with a location notch, puts a wafer in this location notch;
One detection means, setting is positioned at the upside of glove member, and is set up on this holder, and this detection means has been set up a substrate, and this substrate is provided with a test bench;
The combined formation wafer test apparatus of said structure, its body is put wafer at the glove member, move to the location, test section, driving this elevating bracket one by one rises one by one, the test bench of this wafer contact substrate, this elevating bracket lifting height stores through a controller, to start the foundation of this elevating bracket lifting height as next time.
2, wafer test apparatus according to claim 1 is characterized in that the distolateral guide rod that is provided with predetermined number of wherein said body, and the guide groove of this guide rod closing elevating bracket, this elevating bracket form according to the guide rod correcting and move up and down and the structure of non-migration.
3, wafer test apparatus according to claim 1 and 2 is characterized in that wherein said body is provided with one and can stops and move the limit element that stops, avoiding glove member percussion substrate on the elevating bracket.
4, wafer test apparatus according to claim 1 is characterized in that wherein said holder is provided with the detecing element that a detecting body moves on to correct location, test section, and this elevating bracket rises, the test bench of wafer contact substrate.
CN 00245839 2000-08-15 2000-08-15 Crystal plate tester Expired - Fee Related CN2444311Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 00245839 CN2444311Y (en) 2000-08-15 2000-08-15 Crystal plate tester

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 00245839 CN2444311Y (en) 2000-08-15 2000-08-15 Crystal plate tester

Publications (1)

Publication Number Publication Date
CN2444311Y true CN2444311Y (en) 2001-08-22

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CN 00245839 Expired - Fee Related CN2444311Y (en) 2000-08-15 2000-08-15 Crystal plate tester

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101095057B (en) * 2005-01-03 2010-06-23 佛姆法克特股份有限公司 Probe head array
CN1950709B (en) * 2004-02-18 2010-10-06 佛姆法克特股份有限公司 Probing a device
CN102124552B (en) * 2008-08-20 2012-12-26 赛米克斯股份有限公司 Apparatus and method of correcting planarity between probe card and chuck plate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1950709B (en) * 2004-02-18 2010-10-06 佛姆法克特股份有限公司 Probing a device
CN101095057B (en) * 2005-01-03 2010-06-23 佛姆法克特股份有限公司 Probe head array
CN102124552B (en) * 2008-08-20 2012-12-26 赛米克斯股份有限公司 Apparatus and method of correcting planarity between probe card and chuck plate

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GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee