201007829 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種檢查方法，特別是指 切痕檢查方法。 非工件 【先前技術】 如圖卜2所示，習知一種檢查晶圓切割道的 配一晶圓切割機使用，該切割機具有一 疋搭 ❿ ❸ 左右移動並可繞一第二軸向2自轉的工作：軸向X 一第三轴向γ前後移動且可沿該第二軸二上下移： 割：凡2,及一可與該切割單元2同步沿該第三轴： 移動的攝影機3。該切割單元2具有—刀轴2G1，及j 於該刀軸201上的刀具2〇2，其一 U。又 宗於一、二目士「4产 寺刀口丨】的晶圓5是固 疋h具框4底面所黏置的—膠帶4〇ι 作台單元1。 乂仅歹' 4工 此種檢查方法為了檢查該晶圓5的切割品質1 晶圓5被切割預定數目的切割道训後，暫停該切割機進； 切割，並驅使該攝影機3移動至該晶圓5的切割道5〇ι上: 拍攝影像，以使該切割機的—中央處理器（圖未示）利用与 像處理技術，來判定該切割道5〇1邊緣的碎裂缺陷程产^ clnpping)或切痕寬度（kerfwidth)是否合格。 又 雖然’此種檢查方法可藉由檢查該切割道Μ 來判定該晶圓5的切割品質，但是，此種檢查方法並益法： 測出該切割道5〇1底部的膠帶術是否有被切割到，因此， 並不能判斷出該切割單元2在«二軸向Z的下刀深度是 201007829 否正確。舉例而言，若下刀過淺，並沒有切到該膝帶401的 話’該晶圓5的晶粒並未被確實分離，使後續的解膠、吸粒 製程難以進行。 【發明内容】 因此’本發明之目#，即在提供一種可檢測固定層上 的切痕狀況而判斷出切割單元的下刀深度是否正確的非工 件切痕檢查方法。 本發月非工件切痕檢查方法，適用於一切割裝置，該 切割裝置具有一工作台單元、一切割單元、一取像單元， 及-中央處理H’該切割單元具有一刀軸，及一裝設於該 刀的刀具，該工作台單元與該切割單元可沿一第一轴向 彼此相對水平移動’該工作台單 平兀興該取像早可沿該第 :軸向彼此相對水平移動，該卫作台單元與該切割單元可 沿一第二軸向彼此相對上下移動， 二… 4中央處理器可操控該 作D早7L、該切割單元與該取像單 „ , L 1豕早π的作動，該工作台 早兀上設置有一面積大於一工件而可供 屉，兮认太一 、这工件疋位的固定 層，邊檢查方法包含：（Α)使該切割 早兀沿該第二軸向從 -位於該工件之外的下刀點靠近該工作台單元，使 台單π與該切割單元沿該第一軸向相 元沿該第二軸向從一位於該工件：動’使該切割單 外 卜的提刀點遠離該工作 ^疋，該下刀點與該提刀點沿該第1向至該工件之門 可为別疋義出一檢測區。⑻使該取像單元拍攝其 測區的-影像。（c)檢測該檢測區的影像。判^ 測區的影像的檢測結果。 V檢 201007829 【實施方式】 特點與功效，在 說明中’將可清 有關本發明之前述及其他技術内容、 以下配合參考圖式之一較佳實施例的詳細 楚的明白。 參閱圖3、4、5,為本發明非工件切痕檢查方法的一較 佳實施例搭配使用的一切割裝置1〇〇，在本實施例中201007829 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to an inspection method, and more particularly to a inspection method for a flaw. Non-Workpiece [Prior Art] As shown in Figure 2, there is a conventional wafer cutting machine for inspecting wafer scribe lines. The cutter has a stack of ❿ 左右 left and right and can rotate around a second axis 2 The work: the axial direction X - the third axial direction γ moves back and forth and can move up and down along the second axis: cutting: 2, and one can be synchronized with the cutting unit 2 along the third axis: the moving camera 3. The cutting unit 2 has a cutter shaft 2G1, and a cutter 2〇2 on the cutter shaft 201, which is a U. The wafer 5, which is also used in the first and second eyes of the "4th generation of the temple", is adhered to the bottom surface of the frame 4. The tape is 4〇ι. The unit 1 is only used. Method for checking the cutting quality of the wafer 5 After the wafer 5 is cut by a predetermined number of cutting passes, the cutting machine is suspended; cutting, and driving the camera 3 to the cutting path 5 of the wafer 5. : Shooting the image so that the central processing unit (not shown) of the cutting machine uses the image processing technique to determine the fragmentation defect (clnpping) or the kerf width of the edge of the cutting lane 5〇1. Compliance is also true. Although the inspection method can determine the cutting quality of the wafer 5 by inspecting the cutting burr, the inspection method is also beneficial: measuring the tape at the bottom of the scribe line 5〇1 Whether it has been cut or not, therefore, it cannot be judged whether the cutting depth of the cutting unit 2 in the "two axial Z" is 201007829. For example, if the lower knife is too shallow and the knee band 401 is not cut, 'The grain of the wafer 5 is not reliably separated, so that the subsequent degumming and absorbing granulation [Embodiment] Therefore, the object of the present invention is to provide a non-workpiece incision inspection method for determining whether or not the undercut depth of the cutting unit is correct by detecting a condition of the cut on the fixed layer. The non-workpiece incision inspection method is applicable to a cutting device having a table unit, a cutting unit, an image taking unit, and a central processing unit. The cutting unit has a cutter shaft, and a cutter shaft is mounted thereon. a cutter tool, the table unit and the cutting unit are horizontally movable relative to each other along a first axial direction. The work platform is flat and the image can be moved horizontally relative to each other along the first: axial direction. The table unit and the cutting unit can move up and down relative to each other along a second axial direction, and the central processing unit can control the operation of the cutting unit D and the image capturing unit „ , L 1 豕 π, The workbench is provided with a fixed layer having an area larger than a workpiece for the drawer, and the workpiece is clamped, and the side inspection method comprises: (Α) making the cutting early along the second axial direction - lie in a lower cutting point outside the workpiece is adjacent to the table unit, so that the table π and the cutting unit are located along the second axial direction along the second axial direction from a workpiece located in the workpiece: The tool point is away from the work, and the lower tool point and the tool point along the first direction to the door of the workpiece may be a detection zone. (8) The image capturing unit is caused to take an image of the measurement area. (c) detecting an image of the detection zone. Determine the detection result of the image in the measurement area. V-test 201007829 [Embodiment] The above and other technical contents of the present invention will be apparent from the following description of the preferred embodiments of the present invention. Referring to Figures 3, 4 and 5, a cutting device 1 is used in conjunction with a preferred embodiment of the non-workpiece incision inspection method of the present invention, in this embodiment
割裝置，是-種晶圓切割機，並具有—可沿_第—轴向、 左右移動並可繞一第二軸向z自轉的工作台單元⑺、一可 沿一第三軸向γ前後移動且可沿該第二軸向z上下移 切割單元20、一可與該切割單元2〇同步沿該第三軸向Y前 後移動的取像單元3〇、一與該取像單元3〇連結的類比/數 位轉換器40、一與該類比/數位轉換器4〇連結的影像記憶 裝置50、一與該影像記憶裝置5〇連結的中央處理器的: 一與該中央處理器60連結的顯示器7〇,及一受該中央處理 器60控制的警報器80。該切割單元2〇具有一刀軸η，及 一固設於該刀軸21上的刀具22，該取像單元3〇是一種攝 影機並具有一鏡頭31，該中央處理器60是可操控該工作台 單元1〇、該切割單元20與該取像單元3〇的作動，該顯示 器70是可顯示該取像單元30拍攝的影像。 如圖8、9所示，該工作台單元10是可供置放一待切 割的工件200，該工件200是先黏附於一治具框9〇底面所 黏置的一固定層110上，再與該治具框9〇 一同定位於該工 作台單元10上’該固定層11 〇被該治具框90所圍繞的面 積疋大於該工件200，在本實施例中，該工件200是一種曰曰 201007829 圓’該固定層no是-種膠帶。另外要說明岐，亦可以 壤（赠）t作該固定層no,而將該工件2〇〇隸點附於 該工作台單元H)上，如此，即不需使用到該治具框9〇，此 種無膠帶（tapeless)固定技術也可適用於本發明。 參閱圖6、7所示，該非工件切痕檢查方法包含： 步驟300:如圖6、8所示，該中央處理器6〇 (見圖5 )使該切割單元20沿該第二軸向z從—位於該工件綱之 外的下刀點X1靠近該工作台單元1〇;接著，該中央處理写 6(K見圖5)使該工作台單元1G帶動該卫件與該固定 層m沿該第-軸向X相對於該切割單元2()移動，在此過 程中’理想情況是該刀具22會沿該第一軸向χ切割該固定 層U〇與該工件2〇〇;接著，該中央處理器6〇(見圖5)使 該切割單元20沿該第二軸向2從_位於該工件2(κ)之外的 提刀點Χ2遠離該工作台單元1〇。該下刀點幻沿該第—軸 二X至該卫件之間可定義出—檢測區⑴，該提刀點 =沿該第—軸向x至該卫件之間可定義出另-檢測區 112。 在本實施例令，該中參虚理哭 土 , 夹處理态60 (見圖5)會依使用 者預先輸入的指令判斷是否要進行下述的步驟mo、 330,以下是以進行該步驟31〇、32〇、㈣作說明。 步驟；310 .如圖6、9、10所示，該中央處理器60 (見 圖5)使絲像單疋3〇的鏡頭3ι移動至該檢測區⑴的上 方’並拍攝該檢測區111的—影像⑴。在本實施例中，該 影像1 1 3顯示於該顯示器7Λ π 顯不益70，且，該影像113在該第一、 201007829 三軸向χ、γ上的尺寸規格為刚Χ彻像素（pixei)。 的 步驟0 .如圖6、10、11所示，檢測該檢測區111 影像113。 在本實施例中，該中央處理器60 (見圖5)會將該影 像113的&樣部分114進行二值化影像處理，該採樣部分 1M在。亥第、二軸向Χ、γ上的尺寸規格為300x56像素 ’因此’該採樣部分114在該第-軸向X上的-長度L1大 小為300個像素。The cutting device is a wafer cutting machine and has a table unit (7) movable along the _th axis, moving left and right and rotating around a second axis z, and a γ front and rear along a third axis Moving and moving up and down the cutting unit 20 along the second axial direction z, an image capturing unit 3 可 that can move back and forth along the third axial direction Y in synchronization with the cutting unit 2〇, and a connection with the image capturing unit 3〇 An analog/digital converter 40, an image memory device 50 coupled to the analog/digital converter 4A, and a central processing unit coupled to the image memory device 5: a display coupled to the central processing unit 60 7〇, and an alarm 80 controlled by the central processor 60. The cutting unit 2 has a cutter shaft η and a cutter 22 fixed to the cutter shaft 21. The image capturing unit 3 is a camera and has a lens 31. The central processing unit 60 is operable to control the worktable. The operation of the unit 1 , the cutting unit 20 and the image capturing unit 3 , the display 70 is capable of displaying an image captured by the image capturing unit 30 . As shown in FIG. 8 and FIG. 9, the table unit 10 is configured to place a workpiece 200 to be cut. The workpiece 200 is first adhered to a fixed layer 110 adhered to the bottom surface of a fixture frame 9. Positioned on the table unit 10 together with the jig frame 9', the area 疋 surrounded by the jig frame 90 is larger than the workpiece 200. In the embodiment, the workpiece 200 is a kind曰曰201007829 Round 'The fixed layer no is a kind of tape. In addition, it is also necessary to describe the crucible, and it is also possible to attach the workpiece to the workbench unit H), so that the jig box 9 is not needed. Such tapeless fastening techniques are also applicable to the present invention. Referring to FIGS. 6 and 7, the non-workpiece incision inspection method includes: Step 300: As shown in FIGS. 6 and 8, the central processing unit 6〇 (see FIG. 5) causes the cutting unit 20 to follow the second axial direction. The slave point X1 located outside the workpiece is adjacent to the table unit 1; then, the central processing write 6 (see FIG. 5) causes the table unit 1G to drive the guard and the fixed layer m along The first axial axis X moves relative to the cutting unit 2 (), in the process 'ideally, the cutter 22 will cut the fixed layer U 〇 and the workpiece 2 沿 along the first axial direction; then, The central processing unit 6 (see FIG. 5) moves the cutting unit 20 away from the table unit 1 in the second axial direction 2 from the tool point 2 located outside the workpiece 2 (κ). The lower knife point can be defined along the first-axis two X to the guard--detection zone (1), the tool-cut point = along the first-axis x to the guard can define another-detection Area 112. In the embodiment, the middle of the symmetry is chopped, and the clip processing state 60 (see FIG. 5) determines whether the following steps mo, 330 are to be performed according to a command input by the user in advance, and the following step is performed. 〇, 32〇, (4) for explanation. Step; 310. As shown in Figs. 6, 9, and 10, the central processing unit 60 (see Fig. 5) moves the lens 3ι of the single-lens 3 至 to the upper side of the detection area (1) and photographs the detection area 111. - Image (1). In this embodiment, the image 1 1 3 is displayed on the display 7 Λ π 显 益 70, and the size of the image 113 on the first, 201007829 triaxial χ, γ is just 像素 pixei (pixei ). Step 0. As shown in Figs. 6, 10 and 11, the detection area 111 image 113 is detected. In the present embodiment, the central processing unit 60 (see Fig. 5) performs binarized image processing on the &sample portion 114 of the image 113, and the sampling portion 1M is present. The dimensions of the hexagram, the two-axis Χ, and the γ are 300x56 pixels. Therefore, the length L1 of the sampling portion 114 in the first-axis X is 300 pixels.
»亥才木樣。卩分114進行二值化影像處理的理論基礎概述如 下由於°玄彳木樣部分114有無切痕的灰階亮度值並不相同’ 其中，該採樣部分114的無切痕部分會較亮，而該採樣部分 中由°玄刀具22 (見圖8 )所劃切形成一切痕115則會較 暗因此，該中央處理器60 (見圖5 )可分析該採樣部分 114每像素座標的灰階亮度值，此時，若某一像素座標（ 乂的火^冗度值大於一預設的閥值m( thresholding value ，或稱二值化臨界值），則將該像素座標（x,y)視為一亮 ’’ 之’若該像素座標（x,y)的灰階亮度值小於該預設 的閥值m，則將該像素座標（x，y)視為一暗點，如此，即 可將該採樣部分114簡化為二元的影像。 如此，如圖11所示，該中央處理器60 (見圖5)即可 統計出該切痕115在該第一軸向χ上的一長度乙2是佔了幾 個像素’在本實施例中’是以該切痕115的最大長度代表該 長度L2。 步驟330 :如圖6、1 〇、11所示，判斷該檢測區111的 201007829 影像113的檢測結果。 在本實施例中，該中央處理器6〇 (見圖5)將該切痕 ⑴的長度L2與該採樣部分114的長度u &比值⑽^ =義為-評價值V，若該評價值V低於—使用者輸入至 該中央處理H6G (見_5)的預設值p(_㈣），則表 示該切割單見圖8)在該第二軸向z的下刀深度並 不正確。舉例來說’ ^該切割單& 2g (見圖8)在該第二 軸向Z的下料度不而完全沒有切定層⑽»Hai Cai wood samples. The theoretical basis of the binary image processing for the segmentation 114 is summarized as follows: since the grayscale luminance values of the sinensis wood sample portion 114 are not the same, the non-cut portion of the sampling portion 114 is brighter. The sampling portion is formed by the slashing tool 22 (see Fig. 8) to form all the marks 115, which is dark. Therefore, the central processing unit 60 (see Fig. 5) can analyze the gray scale brightness of the pixel portion of the sampling portion 114. Value, at this time, if a pixel coordinate (the fire ^ redundancy value is greater than a preset threshold m (thresholding value, or binarization threshold), then the pixel coordinates (x, y) are regarded If the grayscale luminance value of the pixel coordinate (x, y) is smaller than the preset threshold m, the pixel coordinate (x, y) is regarded as a dark point, and thus The sampling portion 114 is simplified into a binary image. Thus, as shown in FIG. 11, the central processing unit 60 (see FIG. 5) can calculate a length B of the incision 115 on the first axial axis. 2 is a few pixels 'in this embodiment' with the maximum length of the cut 115 representing the length L2. Step 330: 6, 1 〇, 11, the detection result of the 201007829 image 113 of the detection area 111 is determined. In this embodiment, the central processing unit 6〇 (see FIG. 5) compares the length L2 of the notch (1) with the sampling. The length u & ratio of the portion 114 is equal to - the evaluation value V, and if the evaluation value V is lower than the preset value p (_ (four)) input by the user to the central processing H6G (see _5), The cutting list is shown in Figure 8). The lower knife depth in the second axial direction is not correct. For example, '^ the cutting sheet & 2g (see Fig. 8) does not have a cutting layer at all in the second axial direction Z (10)
或只劃到該固定層110 —點點，則，該切痕ιΐ5的長度U 將會驅近於0 ’使得該評價值v亦會驅近於Q而低於該預設 值p，則該中央處理器60 (見圖5)會使該警報器8〇 (見 圖5)發出警報’並中斷切割作業；相反地，若該評價值v 局於該預設值預設值P’則表示該切割單元2〇(見圖8)在 该第二軸向Z的下刀深度已達到設定值，該中央處理器6〇 (見圖5)會將檢測結果記錄下來，且，在本實施例中，該Or only to the fixed layer 110 - point, then the length U of the cut ι ΐ 5 will drive closer to 0 ' so that the evaluation value v will also drive closer to Q and lower than the preset value p, then The central processor 60 (see Fig. 5) causes the alarm 8 (see Fig. 5) to issue an alarm 'and interrupts the cutting operation; conversely, if the evaluation value v is at the preset value preset value P' The cutting unit 2〇 (see FIG. 8) has reached the set value in the lower cutting depth of the second axial direction Z, and the central processing unit 6〇 (see FIG. 5) records the detection result, and in the embodiment. Medium, the
中央處理ϋ 60 (見圖5)會依使用者預先輸人的指令判斷 是否要進行下述的㈣34g、35G、36q，町是以進行該步 驟340、350、36〇作說明。 要說明的疋，在該步驟320中，該中央處理器6〇 (見 圖5)亦可改為統計出該切痕115所佔的一面積ai (像素X 像素）’並在該步驟330中，將該切痕115的面積A1與該 採，部分114的-面積A2 (3_56像素）的比值（ai/a2 )定義為該評價值v ,如此，同樣可以判斷出該檢測區ηι 的影像113的檢測結果。 10 201007829 步驟340 ·如圖6、9、12所示，該中央處理器60 (見 圖5)使該取像單元30的鏡頭31移動至該工件200的上方 並拍攝。亥工件200的—切割道21 〇的一影像211。 步驟350 .如圖6、9、12所示，檢測該卫件獅的切 割道210的影像2n。 在本實施例中，該中央處理器60 (見圖5)也會將該 影像2H的-採樣部分212進行二值化影像處理，以檢測 ❹ 該切割道加邊緣的碎裂缺随度（ehipping)或切痕寬度 (kerf width )。 ☆步驟360 ·如圖6 ' 9、12所示’判斷該影像川的一 採樣部分2 12的檢測結果。 ::實施例中，該中央處理_ 6〇(見圖5)會根據該 :樣部"212的二值化影像，判定該切割道2H)邊緣的碎 裂缺陷程度或切痕寬度是否合格。若該採樣㈣212的檢 測結果不合格，則該中央處理器 „ on , a ^ λ 1見圖5)會使該警報 盗8”見圖5)發出警報，並中斷切割作業；相反 f採合樣部分212的檢測結果合格，該中央處理器60(見圖 匕將檢測結果記錄下來’且，該中央處理 :。、一。，一一， 要說明的是，上述步驟350、360、μλ 進行—既給制f 1Φ „老、 0可對該工件200 進订黑占檢測（工件中間處）或三點檢測 中間處、右邊處），在本實施例中， 左邊處、 是Λ進行一點檢測作說 201007829 明。 步驟370 :如圖6、9、l〇所示，使該取像單元3〇拍攝 該檢測區112的一影像。此步驟37〇的實質内容是相同於 έ亥步驟3 10 ’在此不再重覆地說明。 步驟380 :如圖6、10、1丨所示，檢測該檢測區112的 影像。此步驟380的實質内容是相同於該步驟32〇，在此不 再重覆地說明。 步驟39G .如圖6、1〇、u所示，判斷該檢測區112的 影像的檢測結果，若該檢測區112的影像的一評價值V低 於該預設值P，則發出警報，若該評價值v高於該預設值 預設值P，該中央處理器60 (見圖5)會將檢測結果記錄下 來°此步驟390的實質内容是相同於該步驟33()，在此不再 重覆地說明。 經由以上的說明，可再將本發明的優點歸納如下·· 本發明除了可如同習知技術般藉由檢查該切割道21〇 的影像來判定該工件200的切割品質外，本發明更可藉由 檢查該等檢測區⑴、⑴㈣像，來判定該㈣單元20在 該第二軸向Z的下刀深度是否正確，而供使用者適時調整 該切割單it 20在該第二軸向z上的切割高度，以進一步確 保該工件200的切割品質。 提得-提的是，本實施例在該步驟则〜32〇完成該檢 測區⑴的檢測之後，當然也可選擇跳過該步驟34〇、35〇 、360的工件檢測，而直接進行該步驟370、380、390,以 對該檢測區112進行檢測。 12 201007829 歸納上述，本發明之 測工件切割道的切割品質 狀況，而判定切割單元的 到發明之目的。 非工件切痕檢查方法，不僅可檢 ，更可藉由檢測固定層上的切痕 下刀深度是否正確，故確實能達 惟以上所述者’僅為本發明之較佳實施例而已，當不 月b以此限定本發明實施之範圍，即大凡依本發明申請專利 祀圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 13 201007829 【圖式簡單說明】 圖1是習知一種晶圓切割機的一切割單元切割一晶圓 的平面示意圖，說明該切割機的一攝影機移動至該晶圓的 上方； 圖2是一平面示意圖，說明該攝影機拍攝的晶圓影像 圖3是本發明的非工件切痕檢查方法一較佳實施例所 搭配使用的一切割裝置的立體外觀示意圖；The central processing unit 60 (see Fig. 5) determines whether or not to perform the following (4) 34g, 35G, 36q according to the user's pre-input command, and the description is made by performing the steps 340, 350, and 36. To be described, in the step 320, the central processing unit 6 (see FIG. 5) may also calculate an area ai (pixel X pixel) occupied by the incision 115 and in step 330. The ratio (ai/a2) of the area A1 of the cut 115 to the area A2 (3_56 pixels) of the portion 114 is defined as the evaluation value v. Thus, the image 113 of the detection area ηι can also be determined. Test results. 10 201007829 Step 340 · As shown in Figs. 6, 9, and 12, the central processing unit 60 (see Fig. 5) moves the lens 31 of the image capturing unit 30 above the workpiece 200 and photographs it. An image 211 of the cutting path 21 of the workpiece 200. Step 350. As shown in Figures 6, 9, and 12, the image 2n of the cutting lane 210 of the guard lion is detected. In this embodiment, the central processing unit 60 (see FIG. 5) also performs binarized image processing on the image-sampling portion 212 of the image 2H to detect 碎 缺 ❹ ❹ eh eh eh ) or kerf width. ☆Step 360 · As shown in Fig. 6 '9, 12', the detection result of a sampling portion 2 12 of the image is judged. In the embodiment, the central processing _ 6 〇 (see FIG. 5 ) determines whether the degree of chipping defects or the width of the scribe line of the scribe line 2H) is qualified according to the binarized image of the sample "212; . If the detection result of the sampling (four) 212 is unsatisfactory, the central processing unit „on , a ^ λ 1 (see Fig. 5) will cause the alarm burglary 8” as shown in Fig. 5) to issue an alarm and interrupt the cutting operation; The detection result of the portion 212 is qualified, and the central processing unit 60 (see FIG. 记录 records the detection result), and the central processing: ., one, one by one, it is to be noted that the above steps 350, 360, μλ are performed - Both the f 1Φ „老, 0 can be used to determine the black occupancy of the workpiece 200 (in the middle of the workpiece) or the middle of the three-point detection, the right side). In this embodiment, the left side is Λ Step 370: As shown in Figures 6, 9, and 10, the image capturing unit 3 〇 captures an image of the detection area 112. The essence of this step 37 is the same as the step 3 10 ' Step 380: As shown in FIG. 6, 10, and 1 ,, the image of the detection area 112 is detected. The essence of this step 380 is the same as the step 32, and is not heavy here. Step 39G. As shown in FIG. 6, FIG. 1 and u, the detection area 112 is determined. If the evaluation value V of the image of the detection area 112 is lower than the preset value P, an alarm is generated. If the evaluation value v is higher than the preset value preset value P, the central processing unit 60 (See Fig. 5) The detection result will be recorded. The essence of this step 390 is the same as the step 33(), and will not be repeatedly explained here. Through the above description, the advantages of the present invention can be further summarized as follows The present invention can determine the cutting quality of the workpiece 200 by examining the image of the cutting path 21〇 as in the prior art, and the present invention can further determine the image by checking the detection areas (1), (1) and (4). (4) Whether the lower cutting depth of the unit 20 in the second axial direction Z is correct, and the user can timely adjust the cutting height of the cutting sheet it 20 in the second axial direction z to further ensure the cutting quality of the workpiece 200. It is noted that, in this embodiment, after the detection of the detection area (1) is completed at this step, it is of course possible to skip the workpiece detection of the steps 34〇, 35〇, 360, and directly perform the step. 370, 380, 390 to check the detection area 112 12 201007829 In summary, the cutting quality condition of the workpiece cutting track of the present invention is determined, and the cutting unit is determined to the purpose of the invention. The non-workpiece incision inspection method can not only detect but also detect the cut on the fixed layer. Whether the depth of the lower knives is correct or not, it is true that the above-mentioned ones are only the preferred embodiments of the present invention, and the scope of the present invention is limited to the extent that the present invention is applied. BRIEF DESCRIPTION OF THE DRAWINGS The simple equivalent changes and modifications made by the present invention are still within the scope of the present patent. 13 201007829 [Simplified Schematic] FIG. 1 is a cutting unit of a wafer cutting machine for cutting a wafer. FIG. 2 is a plan view showing a wafer image taken by the camera. FIG. 3 is a preferred embodiment of the non-workpiece incision inspection method of the present invention. A schematic perspective view of a cutting device used in conjunction with the example;
圖4是該切割裝置拆除一外殼後的立體外觀示意圖； 圖5是該切割裝置的系統配置示意圖； 圖6是該較佳實施例的流程圖； 疋以牧佳貫施例搭配該切割裝置的控制方塊圖，· 圖8是該切割裝置的局部前視示意圖，說明該切割 的一刀具在一下刀點與一提刀點之間切割一工件； 置的二9:二切割裝置的局部俯視示意®，說明該切割 、取像單元移動至一檢測區上方；4 is a schematic perspective view of the cutting device after removing a casing; FIG. 5 is a schematic diagram of a system configuration of the cutting device; FIG. 6 is a flow chart of the preferred embodiment; Control block diagram, Fig. 8 is a partial front elevational view of the cutting device, illustrating that a cutting tool cuts a workpiece between a lower cutting point and a lifting point; a partial view of the second 9: two cutting device ®, indicating that the cutting and image taking unit moves above a detection area;
圖10是一平面示意圖， 區的影像； ”取料謂拍攝的檢 圖 圖；及 11是該檢測區影像的— 取樣部分的二值化影像分析 10的視圖，說明該取像單元所拍 圖12是一類似於圖 攝的工件影像。 14 201007829Figure 10 is a plan view of the area, the image of the area; "Retrieve the picture taken by the picture taken; and 11 is the view of the binarized image analysis 10 of the sampled portion of the image of the detection area, illustrating the picture taken by the image capturing unit 12 is a workpiece image similar to the picture taken. 14 201007829
【主要元件符號說明】 100··· …切割裝置 212··· …採樣部分 10 ··· …工作台單元 300··· …步驟 20 ···· …切割單元 310··. …步驟 21 ··· …刀軸 320··· …步驟 22 ···· …刀具 330··· …步驟 30 ···· …取像單元 340··· …步驟 31 …鏡頭 350··· …步驟 40 ···· …類比/數位轉換器 360". …步驟 50 ···· …影像記憶裝置 370··· …步驟 60 .... …中央處理器 380··. …步驟 70 ··.· …顯示器 390··. …步驟 80 ···· …警報器 X…… …第 轴向 90 .··· …治具框 Z…… …第·一轴向 110··· …固定層 Y…… …第·—轴向 111… …檢測£ XI ·.·· …下刀點 112… …才欢測£ X2 ···· …提刀點 113… …影像 L1 ···· …長度 114… …採樣部分 L2 ···· …長度 115… …切痕 200… …工件 210… …切割道 211… …影像 15[Description of main component symbols] 100··· ... cutting device 212··· ... sampling section 10 ··· ...table unit 300···Step 20 ····...Cutting unit 310··. ...Step 21 · ···刀刀320··· ...Step 22 ···· ...Tools 330··· ...Step 30 ·····Image capture unit 340···Step 31 ...Lens 350···...Step 40 · ··· ...Analog/Digital Converter 360". ...Step 50 ·····Image Memory Device 370···Step 60 .... ...Central Processing Unit 380··. ...Step 70 ···· ... Display 390··. ...Step 80 ····...Alarm X...... ...the axial direction 90.···...The jig frame Z...the first one axial direction 110···...the fixed layer Y... ...第·—Axis 111... ...Detection £ XI ···· ...Bottom of the knife point 112... The test is only £ X2 ···· ...Tool point 113... Image L1 ····... Length 114... Sampling portion L2 ·····length 115...cutting 200...worker 210...cutting path 211...image 15