201002458 六、發明說明： c發明所屬之技術領域3 發明領域 本文所討論的實施例是針對一種修復具有藉由焊接安 5 裝於其上的零件的一電路板之修復技術。 發明背景 例如，在諸如一蜂巢式電話的電子設備中，一組用於 處理具有不同頻率的射頻信號的電路單元，諸如一微處理 10 器或一 SWA濾波器被安裝於相同的電路板上。在這種情況 下，可能存在一射頻干擾發生於該等電路單元之間的問題。 爲了解決這種問題，由一種金屬製成的一遮蔽件5(金 屬外殼）被安裝於一蜂巢式電話的一電路板1上以遮蔽一組 電子零件2，如第1圖所示。遮蔽件5被安裝於印刷有一錫膏 15 的電路板1上，同時安裝電子零件2及電子零件3，且藉由回 流焊接被共同結合至電路板1。射頻干擾的問題可藉由具有 由一金屬製成的遮蔽件5的結構被解決。然而，另一方面， 如果一缺陷發生在佈置於遮蔽件5中的電子零件中，那麼可 能發生另一問題。 20 當一缺陷發生在電子零件2其中之一時，該有缺陷的電 子零件2從電路板1被移除，且施以使用一良好電子零件2替 換該有缺陷的電子零件2的修復處理（參考專利文件1)。通 常，遮蔽件5被安裝於電路板1上以一小距離，諸如距電子 部件2大約1mm圍繞佈置於遮蔽件5中的電子零件2。 201002458 因此，如果需要更換電子零件2，許多情況遮蔽件5阻 礙該更換工作的執行。因此，在許多情況中，電子零件2必 須在從電路板1移除該遮蔽件之後用另一電子零件替換。因 為遮蔽件5藉由焊接以其整個周邊結合至電路板1，移除遮 5 蔽件5唯一的一種方法就是熔化將遮蔽件5結合至電路板1 的焊錫。 爲了從電路板1移除遮蔽件5，需要同時加熱遮蔽件5的 整個焊接部份。因此，建議使用一種加熱一大面積的方法， 諸如使用一熱氣。然而，這樣一種方法實際上並未被使用， 10 因為一個問題使得在出貨後難以獲得產品之可靠性，該問 題是：佈置於遮蔽件5内的電子零件2及佈置於遮蔽件外的 電子零件3被同時加熱至接近該焊錫的一熔點（217°C)的溫 度。 因此，單獨加熱遮蔽件5的其他方法被提出，諸如一種 15 繪示於第2A圖中的方法及一種繪示於第2B圖中的方法。在 第2A圖中繪示的方法中，使一加熱頭100與遮蔽件5的一頂 面5 b接觸以藉由從遮蔽件5的一上部傳送的熱量加熱焊錫 7。在第2B圖中繪示的方法中，使加熱頭100與遮蔽件5的一 側面5 b接觸以藉由從一比第2 A圖所繪示方法更接近焊錫7 20 的部份所傳送的熱量加熱焊錫7。 專利文件1 :曰本早期公開專利申請案第08-046351號 案 然而，因為難以依據上述第2A圖及第2B圖繪示的方法 穩定加熱焊錫7，該等方法實際上未曾被使用。 201002458 即，依據第2A圖中繪示的方法，除非加熱頭刚的溫度 上升至大約WC的-溫度否則難以⑹匕焊錫了，因為遮蔽 件5通常由鑛有鎳或錫的一不鏽鋼板製成，其提供一不良的 導熱性，且加熱位置遠_錫7。料，如果使呈有此1 溫妙細_麵件5接觸，由於錢件5的氧化而使^ 色進行，因此引起一個問題，即有灰 形成於遮蔽件5的-表面上，塵產生且—隔熱層被 質降低。 面上—問題使遮蔽件5的遮蔽性 依據第2B圖中繪千沾七、+ A & Y 3不的方法，與電路板丨 10 15 20 關地，有許多愔況带7 J门山没女展相 f A况$子零件3被佈 置一小距離，編.、。因此，_=件5配置之位 件5的側面接觸。 難从使加熱獅與遮蔽 如果焊錫7由具有_與焊錫了接觸的平 熱頭100的一接觸加埶 、。而不疋加 …助焊劑可能黏著該接觸 17......、、面’助焊無絕接觸加熱卫具敎流。因此， 難以確實地熔化焊錫7。另冰+ …、、、机因此， 該接觸加熱有必要在每—次操作後清潔 行清潔操作残的卩切。 狀婦貝執 【韻'明内容^】 發明概要 因此，本發明之 —目的疋提供一修復裝置及一修復方 法，其可簡單地且確杂 ^復方 構件，而Μ卜 被焊接至—電路板的焊接 如曰女襄於該電路板的其他零件。 依據本發明之—思ζ 層面，一修復裝置包括··—加熱頭裝 5 201002458 置被配置以供加熱一焊接構件，該焊接構件被焊接至一電 路板，其中該加熱頭裝置包括：一加熱頭；及一由該加熱 頭加熱之接觸構件，該接觸構件由一具有彈性且導熱性大 於該加熱頭的導熱性材料形成’該接觸構件被配置成供與 5 該焊接構件的一焊接面以一彈力接觸，以熔化將該焊接構 件結合至該電路板的一焊錫。 依據本發明之另一層面，一修復方法包括：藉由以一 接觸構件的一焊接面接觸一焊接構件將一使焊接構件結合 至一電路板的焊錫加熱而熔化構件；將一種惰性氣體供給 10 該焊接構件；以及在該焊錫被熔化後將該焊接構件從該電 路板移除。 圖式簡單說明 第1圖繪示一遮蔽件及一電路板的透視圖； 第2A圖繪示與該遮蔽件的一頂面接觸的一加熱頭的截 15 面圖； 第2 B圖繪示與該遮蔽件的一側面接觸的加熱頭的截面 圖； 第3A圖繪示依據一實施例作為一修復裝置的一再加工 裝置的正面圖； 20 第3B圖繪示第3A圖中繪示的再加工裝置的一側視圖； 第4圖繪示一加熱頭裝置的截面圖； 第5圖繪示在一夾板附近的一加熱頭裝置之一部份的 放大圖； 第6A圖繪示一加熱頭及與該加熱頭分離的一遮蔽件的 201002458 ‘ 截面圖； 第6B圖繪示該加熱頭及附接於該加熱頭的遮蔽件的截 面圖； 第7A圖繪示指示在一習知加熱程序中一電子零件及一 5 遮蔽件的溫度變化的圖式；及 第7 B圖繪示指示在由依據該實施例的再加工裝置執行 的一加熱程序中的一電子零件及該遮蔽件的溫度變化的圖 式。 【實方各方式;3 10 較佳實施例之詳細說明 本發明之較佳實施例將參考該等附圖被說明。 第3A圖及第3B圖繪示一再加工裝置10作為依據一實 施例的修復裝置。第4圖繪示設在再加工裝置10中的一加熱 頭裝置40。當一缺陷發生於安裝在電路板1上且佈置在一遮 15 蔽件5中的電子零件2上時，再加工裝置10在電路板1的修復 二法中被利用。遮蔽件5藉由焊接被安裝在電路板丨上。遮 ' 蔽件5相對應於—焊接構件的-範例，該焊接構件藉由焊接 被女裝在電路板1上。 。亥修復紅序疋指一種用於從電路板丨上移除一有缺陷 2〇的電子零件2 ’且代之以安裝一良好的電子零件2在電路板} 上。在本實施例中，遮蔽件5由具有— l5W/mK的導熱性的 一不鏽鋼板製成。 大體上，再加工裝置1〇包括一外殼u、一舉升裝置12、 一定位裝置13、-平臺裝置14，及—冷卻％供應裝置15。 7 201002458 外殼11支撐舉升裝置12、定位裝置13、平臺裝置14及冷卻 N2供應裝置15。 舉升裝置12包括一舉升座16, 一驅動裝置17、一臂18、 一附接部件19、一隔熱部件20，及加熱頭裝置40。舉升座 5 16被固定在外殼11上，且驅動裝置17被固定於舉升座16。 驅動裝置17能夠相對電路板1以垂直方向（在圖中以箭頭Z1 及Z2指示的方向）移動臂18。驅動裝置17是一線性致動器諸 如一汽缸或一線性馬達。 臂18設有附接部件19用於附接加熱頭裝置40。隔熱部 10 件20被設在附接部件19的底部使得加熱頭裝置40經由隔熱 部件20被附接至附接部件19。 因此，當加熱頭裝置40產生熱量，該熱量的傳送被隔 熱部件20阻擋，且該熱量不被傳送至臂18及舉升裝置12。 爲了說明之便，加熱頭裝置40的細節稍後提到。 15 定位裝置13在其上部支承平臺裝置14。定位裝置13被 配置且安排成可在由圖中箭頭XI與X2及箭頭Y1與Y2所指 示的方向上移動平臺裝置14。因此，定位裝置13設有以XI 與X2方向移動平臺裝置14的一驅動裝置21，及以Y1與Y2 方向移動平臺裝置14的一驅動裝置22。 20 電路板1被置於平臺裝置14的一頂面。多個電子零件2 及3被安裝在電路板1上，且遮蔽件5也藉由焊接被安裝於電 路板1上以覆蓋需要遮蔽的電子零件2。遮蔽件5的一整個周 邊被焊接至電路板1。遮蔽件5由一種導熱金屬製成，且被 形成為一箱狀形狀，具有側面5a，一頂面5b及一敞開的底 201002458 部。銜接孔6形成於側面5ahx與稍後提到的—夹板料銜 接0 平臺裝置Μ中設有-熱氣產生裝置23。一熱氣喷嘴24 設在熱氣產生裝置23的-上部。在熱氣產线⑽中產生 的熱氣從熱氣喷嘴24被注人遮蔽件5上。該熱氣是—加敎氣 體的範例，且熱氣喷嘴24是-加熱氣體噴嘴的範例。 -冷卻氣體供應裝置的_，冷料供應裝置15被置 :平臺1置丨4上。冷卻Ν2供應裝置15具有固定於_助的 10 ρ喷嘴26。包括Ν2噴嘴26的冷卻心應裝置时連接至 1供氣源(未示於圖中），使得作為—冷卻氣體_2氣體 從乂噴嘴26被注入。 Ν 2喷嘴2 6被配置且被安排以向一稍後提到的修復位置 注入作為冷卻氣體的-Ν2氣體，在該純位置，遮蔽件5 ^電路板1附接及分開。從Ν2喷嘴26注人眺氣體的溫度被 设為等於或低於正常溫度(例如，2Gt±15。⑺的—溫度。一 知作裝置3G由-操作員操作以控制再加工裝置⑺的操作。 現在將參考第4圖描述加熱頭裝置4〇的一結構。 加熱頭裝置40包括附接部件19、隔熱部件2〇、一加熱 鬼41、一加熱碩42，及—夾板44。夾板44相對應於被配置 成供作為一焊接構件與遮蔽件5接觸的一接觸構件的範 例。附接部件19被固定於上述臂18。隔熱部件2〇被附接至 附接部件19的底部。附接部件19被提供以防止加熱塊41中 產生的熱量通過該臂被轉移至舉升裝置12。一隔熱玻璃纖 、、、一隔熱礦石棉、一隔熱陶瓷等等可被用作隔熱部件2〇。 201002458 一導板43被設在隔熱部件20底面的周邊位置以在一向 下方向（Z1方向）延伸。導板43具有一爪部43a從導板43的一 底端向内延伸。 加熱塊41及加熱頭42被置於隔熱部件2〇與導板43的爪 5 部43a之間。加熱塊41及加熱頭42彼此結合為加熱塊41在一 上部且加熱頭42在一下部的狀態。 用作加熱裝置的一加熱器（未示於圖中）包含在加熱塊 41中。加熱頭42由一種導熱金屬形成（例如，黃銅）^因此， 當加熱塊41的加熱器產生熱量時’該熱量被轉移至加熱頭 10 42。 加熱塊41及加熱頭42與導板43接合。具體而言，加熱 頭42由導板43錯由與爪部43a銜接的一階部42c支撐。夢· 此’加熱塊41及加熱頭42在導板43中可輕微移動。 一附接孔51在絕熱部件20的一中心位置形成。一樞轴 15 50設在附接孔51中。枢軸50由一螺旋彈簧52以一向下位置 (zi位置）被彈性加壓。因此’與彼此結合的加熱塊41及加 熱頭42可圍繞作為一中心的樞軸50以第4圖中箭頭八丨與人2 指示的方向移動或擺動。結合的加熱塊41與加熱頭42之择 動的範圍被設定，使得夾板44簡單地且確實地附接於安裝 20 在電路板1上的遮蔽件5。 一間隔部件42b形成於加熱頭42的底面上。間隔部件 42b被配置且被安排以加熱頭40被附接於遮蔽件5的一狀辦 (該狀態繪示於第4圖中）面對該遮蔽件的頂面5b。 多個N2注入孔48形成於間隔部件42b面對頂面％的表 201002458 面上。該等N2注入孔48通過-N2供應通道47及叫入口如被 連接至N2供應裝置（未示於圖中）。 當一加熱程序由加熱頭裴置40在遮蔽件5上被執行 時，一A氣體從該等N2注入孔妨向遮蔽件5的頂面％注入。 5藉此，防止遮蔽件5的頂面汕由於氧化而褪色，即使遮蔽件 5由加熱頭裝置40加熱。 該加熱頭具有一延伸部件42a，其圍繞間隔部件42b形 成於加熱頭42的底面上。延伸部件42a以一向下方向（21方 向）延伸。夾板44由固定螺釘45被固定在延伸部件42的一外 10 表面上。 夾板44由具有一彈簧特性的—種金屬材料形成，諸如 舉例而5 —热氧銅，其具有高於加熱頭仏之導熱性（例如， l〇6W/m.K)的一導熱性(例如，4〇3 w/m.K)。由一無氧銅形 成的夾板44的表面是祕的以防止氧化。夾板44的厚度為 15 例如 0.3mm到 〇.4mm。 上述結構的夾板44通過加熱頭42由加熱塊41加熱。因 為夾板的$熱性大於力〇熱頭Μ的，熱量(從力口熱塊Μ轉移 的…里）被间效地轉移至夾板44。因此，夾板44的溫度被升 ν至等於或呵於焊錫7被融化的一溫度（大約217。〇的溫度。 2〇 夾板44疋一板狀構件，其能夠以一彈力接觸遮蔽件5的 側面5a ’側面5a被用作一焊接表面。在本實施例中，爽板 44被提供至加熱頭42的各該對立側，且爽板料之間的—距 離與遮敝件5的一外部形狀相匹配。因此，遮蔽件5被失在 被提供至加熱頭42的該對失板44之間。 11 201002458 另外，如上所述，銜接孔6形成於側面5&上（參考第6八 圖及第6B圖）。各該夾板44在其内側上（對遮蔽件5之一側） 具有一突出部44a。突出部44a被配置成供與相對應的銜接 孔6銜接。 5 當將加熱頭裝置40附接於遮蔽件5時，夾板44向下移動 (、方向Z1)，同時，突出部44a如第6A圖所示在側面5a上滑 動接著，當該突出部移至相對應於銜接孔6的一位置時， 如第6B圖所示突出部44a與銜接孔6銜接。 因此，當藉由夾板44固定遮蔽件5時，除藉由夾板之彈 1〇力的—固定動作之外，遮蔽件5由突出部44a與各自的銜接 孔6%接被固定。因此，遮蔽件5可由加熱頭裝置牝被確實 地固又。應注意，如果突出部形成於遮蔽件5的側面兄上， 且被配置成供與該等突出部銜接的凹部被形成於爽板44 中，那麼遮蔽件5也可由加熱頭裝置4〇被確實地固定。 15 失板44在其下端（Z1方向的末端）設有一傾斜表面 b傾斜表面44b被设在夾板44的一内側上（面對遮蔽件5 的—側）。藉由在夾板44上形成傾斜表面4扑，夾板44可接 近將遮蔽件5結合至電路板1的焊錫7放置。 2〇 #遮蔽件5被焊接至電路板1時，烊錫7變為-焊接圓角 2〇的=式。如果使夾板44與焊錫7接觸，坪錫7及一錫膏可能 黏著於夾板44的表面，這可能會弄髒夾板44 。因此，失板 44必須以-雜件5被夾板44固定的片大態與焊錫了分開。焊 锡7的焊接圓角如第5圖所示沿遮蔽件5的側面5&延伸。因 此’側面5a對應於-被焊接表面，該表面由焊錫7被結合至 12 201002458 電路板1。 日女果失板44的底端是平坦的，夾板料可被移至稍微高 ;0錫的位置，在此位置，夾板44的該平坦底面與焊錫 的上穴端刀開。另一方面，如果傾斜表面4扑被設在夾板 5 44的底士傾斜表面44b可如第5圖及第6B圖接近焊錫7被放 up ’傾斜表面44b㈣—間隙部件，其在夹板44與焊錫 7之間提供-間隙。目此，夹板叫傾斜表面桃)可被移至接 近焊錫7的-位置，這實現了焊錫7的高效加熱。 現在將描述一種用於藉由使用再加工裝置丨〇替換安裝 10於電路板1上的電子零件2的純電路板丨的修復方法。電子 零件2由被焊接至電路板丨的遮蔽件5圍住。 爲了修復電路板1(或電子零件2)’具有要被替換的電子 零件2的電路板1被附接於再加工裝置10。第3A圖、第3B圖 及第4圖繪示一種電路板丨被附接於再加工裝置丨〇的狀態。 15 加熱頭裝置40被附接於再加工裝置10的附接部件19。加熱 頭裝置40具有加熱頭42，加熱頭42可適當且高效地加熱事 先被焊接至電路板1之遮蔽件5。 在電路板1被附接於再加工袈置10之後，熱氣產生裝置 23由操作裝置30被運轉。因此，一熱氣被吹至電路板1的底 20 面以預熱電路板1。 同時’包含在加熱頭裝置40内的加熱塊42中的加熱器 也被致動以加熱加熱塊42。隨著加熱塊41被加熱，加熱頭 42的溫度上升。加熱塊41的加熱溫度被控制，使得加熱頭 42的延伸部件42a被加熱至例如315°C的一溫度。 13 201002458 接著’操作裝置3 0驅動定位裝置13以定位電路板1，使 '寸電路板1上的遮蔽件5位於面對加熱頭裝置40的一位置。 在電路板1對加熱頭裝置40的定位完成後，操作裝置30驅動 舉升裴置12的驅動裝置17以向下移動（以21方向移動）加熱 5 頭裝置40。另外，操作裝置30致動A供應裝置（未示於圖中） 乂從Κ注入孔48經由Ν2入口 46及&供應通道47注入Ν2氣 體。 ” 隨著加熱頭裝置40的向下移動，夹板44與遮蔽件5的各 自的側面5a接觸。彼此整合的加熱塊41及加熱頭42可圍繞 10 作為—中心的枢轴50以第4圖中箭頭八1與八2指示的方向移 動或擺動。因此，如果在每一夾板44與遮蔽件5之間存在一 位置偏移，此一位置偏移由加熱塊41及加熱頭42的擺動移 動吸收，這使夾板44得以確實地與遮蔽件5銜接。 每一夾板44具有一彈簧特性，且藉由固定螺釘45處於 15 一懸臂狀態。另外，突出部44a形成於每一夾板44的内表面 上。因此，每一夾板44向下移動時，在失板44與遮蔽件5接 觸後，如第6A圖所示被彈性地變形。突出部4如在遮蔽件5 之各自的側面5a上滑動。當夾板44與遮蔽件5銜接時，遮蔽 件5藉由夾板44的加熱被啟動。 20 當加熱頭裝置40進—步向下移動時，突出部44a與各自 的銜接孔6銜接。因此，遮蔽件5被夾置在夾板糾之間且由 夾板44固定’這導致遮蔽件5由加熱頭裝置4〇固定的一狀態 (在下文中，該狀態稱為附接狀態）。在該附接狀態中，遮蔽 件5由加熱頭裝置40藉由夾板44壓制遮蔽件5的之彈力及突 201002458 出部44a與銜接孔6的銜接力被固定。 另外’在該附接狀態中，夾板44被穩固地附接於遮蔽 件5的側面5a。因此，失板44中的熱量被轉移至遮蔽件5而 沒有損失。另外，因為傾斜表面44b形成於每一夾板44的底 5 端，夾板44可非常接近焊錫7放置。因此，焊錫7可由夾板 44的一熱輕射直接加熱。另外，因為使加熱頭42的延伸部 件42a與遮蔽件的頂面北接觸，遮蔽件5藉由加熱頭42的延 伸部件42a的底面被加熱。 遮蔽件5藉由加熱頭裝置4〇加熱時，是以呈一圓角形式 10 的焊錫7之—上部（側面5a上的一部份）與一下部（電路板1上 的一部份)之間有較小熱梯度的狀態被加熱。發明者量測由 • 加熱頭裝置40加熱的焊錫7之溫度，且一圓角形式的焊錫7 之上部溫度為268。(3，且下部溫度為230°C。 因為依據本實施例之再加工裝置1 〇能夠以如上所述的 15 小熱梯度南效地加熱整個焊錫7，焊錫7可在很短時期内被 熔化。應注意電路板1的底面藉由熱氣產生裝置23被加熱。 1 因此，花費在融化焊錫7上的時間可被進一步縮短。 另外，因為夾板44被牢固地附接於遮蔽件5且依據本發 明之再加工裝置10接近焊錫7放置，包含在加熱塊41中的加 20 熱器之容量可被設定為小於一夾板與一焊錫分開之習知加 熱器的容量。因此，包含在再加工裝置1〇的加熱塊41中的 加熱器可被小型化且該加熱器的功耗可被減小。 用於本實施例的夾板44由一板狀構件製成，且其厚度 被'設為0.3mm到大約0.5mm。因此，即使電子零件2及電子 15 201002458 零件3以高密度安裝於電路板丨上，等於或大於〇imm的— 距離可如第5圖所示被提供於附接狀態的夾板4 4與各電子 零件3之間。因此，當執行郷復程序時可防止接近遮蔽件 5佈置的電子零件3由於夾板44的干擾被損壞。 5 另外，當加熱頭裝置4 0執行藉由加熱遮蔽件5熔化焊錫 7的程序時，一惰性氣體之範例的n2氣體從形成於加熱頭42 上的注入孔48向遮蔽件5注入。藉此，如果遮蔽件5被加熱， 遮蔽件5被防止氧化及褪色。另外，其可防止一隔熱層形成 於遮蔽件5的一表面上。因此，即使遮蔽件5被加熱，遮蔽 10 件5的遮蔽性能可被防止降級。 應理解從N2注入孔48注入的N2氣體在通過加熱塊41及 加熱頭42後被注入至遮蔽件5上。因此，從A注入孔48注入 的A氣體被加熱，且藉此，加熱效率並未由於乂氣體的注 入而變壞。 15 在焊錫7如上所述被熔化後，加熱頭裝置40被抬高（以 Z2方向移動）。遮蔽件5被加熱頭裝置4〇藉由突出部斗如與銜 接孔6銜接而確實地固定。因此，遮蔽件5藉由被提起的加 熱頭裝置40從電路板丨被移除。藉此，已經被遮蔽件5覆蓋 的電子零件2被暴露在外面。 '° 在遮蔽件5被移除的狀態中，移除一有缺陷的電子零件 2的耘序及女裝一好的電子零件2的程序被執行。該兩個程 序共同稱為一零件修復程序。該零件修復程序在該技藝中 是省知的，且其之描述將被省略。在該部件修復程序被執 行的同時’遮蔽件5藉由加熱頭裝置4〇的加熱程序被連續執 16 201002458 行。 在該部件修復程序完成後’一焊膏在遮蔽件5欲被安裝 的一位置被施加於電路板1。在施加一焊膏的程序完成後， 將遮蔽件5附加於電路板1的一程序開始。在下文中，再附 5 接遮蔽件5的程序稱為一重新附接程序。 當重新附接程序開始時，操作裝置30驅動舉升裝置12 以使加熱頭裝置4〇再度向下移動。因此，遮蔽件5的側面之 底部與電路板上的焊膏接觸，且夾板44的傾斜表面4扑接近 該焊膏被放置。 1〇 如上所述，依據本實施例之再加工裝置，因為遮蔽件5 可被尚效加熱，包含在該焊膏中的一焊錫可在一很短時間 内被確貫地熔化。藉由熔化該焊膏中的焊錫，該焊錫可將 遮蔽件5結合至電路板j。 在遮蔽件5藉由焊錫7又被結合至電路板1後，操作裝置 15 3G啟動N2氣體供應裝置15以向電路板i與遮蔽件5之間的一 接合位置，即被熔化的焊錫7所處位置注入一n2氣體。藉 此，被熔化的焊錫7在一短時間内被固化，且遮蔽件5再次 被附接（固定）於電路板1。 在遮蔽件5被附接於電路板1之後，操作裝置30向上移 2〇動加熱頭裝置40。由夾板44施加以固定遮蔽件5的力（包括 突出部44a與銜接孔6之間的一銜接力）被設定為小於將遮 蔽件5結合至電路板1的一力。因此，突出部44a由於加熱頭 裝置40的向上移動從銜接孔6脫離，且夾板44與遮蔽件5分 開。该修復程序藉由上述一系列程序被完成。 17 201002458 第7A圖繪示指示當一修 用-熱氣力，方法被執行時t藉由一再加工裝置僅使 式。第7B圖綠示蔽件中的溫度上升的圖 加工071"田Ί程序藉由依據本實施例的再 加工衣置10破執行時，遮蔽 7A圖及第7B圖中的各該圖7溫度升高的圖示。在第 起的經過時間，縱減^ 平軸代一表從加熱 的—溫度。、.車代表遮敝件5被焊接至電路板1的部份 10 15 20 遮蔽^法的再加，，該裝置向 f併 …、米 A圖所不，遮蔽件5的溫度上升 溫二：於！裂於電路板的電子零件剛溫度上升，且該 使；佟-很k因此’難以高效地單獨加熱該遮蔽件，這 序的效率變差。另外，因為該電子零件暴露於 ^ &時間’所以該電子零件可能被損壞。 的圖二:：，依據本實施例的再加工裝置10，由第· 工ϋ、曰遮蚊件5的溫度上升速率高於第7A圖的再加 ψ f子零件2的溫度上升速率低於第7Α圖的再加工 裝置 移除。另外’因输零短時_被從電路板1 件2的溫度上升速率很低，電子 件2即便於該修復程序被執行時可防止受到損壞。 【阖式簡單貌曰月j 第1圖緣示-遮蔽件及—電路板的透視 第2Α圖繪示與該遮蔽件的—頂面接 圖 面圖； 觸的 加熱碩的截 18 201002458 第2 B圖繪示與該遮蔽件的一側面接觸的加熱頭的截面 圖， 第3A圖繪示依據一實施例作為一修復裝置的一再加工 裝置的正面圖； 5 第3B圖繪示第3A圖中繪示的再加工裝置的一側視圖； 第4圖繪示一加熱頭裝置的截面圖； 第5圖繪示在一夾板附近的一加熱頭裝置之一部份的 放大圖， 第6A圖繪示一加熱頭及與該加熱頭分離的一遮蔽件的 10 截面圖； 第6B圖繪示該加熱頭及附接於該加熱頭的遮蔽件的截 面圖； 第7A圖繪示指示在一習知加熱程序中一電子零件及一 遮蔽件的溫度變化的圖式；及 15 第7 B圖繪示指示在由依據該實施例的再加工裝置執行 的一加熱程序中的一電子零件及該遮蔽件的溫度變化的圖 式。 【主要元件符號說明】 1…電路板 7…焊錫 2、3···電子零件 10…再加工裝置 5…遮蔽件 11…外殼 5a…側面 12…舉升裝置 5b…頂面 13…定位裝置 6…銜接孔 14…平臺裝置 19 201002458 15…冷卻N2裝置 16…舉升座 17、2卜22…驅動裝置 18…臂 19···附接部件 20···隔熱部件 23…熱氣產生裝置 24…熱氣喷嘴 26…N2喷嘴 27…轴 30…操作裝置 40···加熱頭裝置 41…加熱塊 42…加熱頭 42a·.·延伸部件 42b…間隔部件 42c···階部 43…導板 43a···爪部 44…失板 44a…突出部 44b···傾斜表面 45…固定螺釘 46…N〗入口 47···Ν2供應通道 48···Ν2注入孔 50…柩轴 51···附接孔 52…螺旋彈篑 Α1-Α2 ' Χ1-Χ2 ' Υ1-Υ2 > Ζ1-Ζ2··.方向箭頭 ν2…Si氣 20201002458 VI. INSTRUCTIONS: C TECHNICAL FIELD OF THE INVENTION The present invention is directed to a repair technique for repairing a circuit board having components mounted thereon by soldering. BACKGROUND OF THE INVENTION For example, in an electronic device such as a cellular phone, a group of circuit units for processing radio frequency signals having different frequencies, such as a microprocessor 10 or a SWA filter, are mounted on the same circuit board. In this case, there may be a problem that radio frequency interference occurs between the circuit units. In order to solve this problem, a shield member 5 (metal casing) made of a metal is mounted on a circuit board 1 of a cellular phone to shield a set of electronic components 2 as shown in Fig. 1. The shield member 5 is mounted on the circuit board 1 on which a solder paste 15 is printed, and the electronic component 2 and the electronic component 3 are mounted at the same time, and are collectively bonded to the circuit board 1 by reflow soldering. The problem of radio frequency interference can be solved by a structure having a shield member 5 made of a metal. On the other hand, however, if a defect occurs in the electronic component disposed in the shield 5, another problem may occur. 20 When a defect occurs in one of the electronic components 2, the defective electronic component 2 is removed from the circuit board 1, and a repair process for replacing the defective electronic component 2 with a good electronic component 2 is applied (refer to Patent Document 1). Generally, the shield member 5 is mounted on the circuit board 1 at a small distance, such as about 1 mm from the electronic component 2, around the electronic component 2 disposed in the shield member 5. 201002458 Therefore, if the electronic component 2 needs to be replaced, in many cases the shield 5 hinders the execution of the replacement work. Therefore, in many cases, the electronic component 2 must be replaced with another electronic component after the shield is removed from the circuit board 1. Since the shield member 5 is bonded to the circuit board 1 with its entire periphery by soldering, the only way to remove the shield member 5 is to melt the solder which bonds the shield member 5 to the circuit board 1. In order to remove the shield member 5 from the circuit board 1, it is necessary to simultaneously heat the entire welded portion of the shield member 5. Therefore, it is recommended to use a method of heating a large area, such as using a hot gas. However, such a method is not actually used, 10 because a problem makes it difficult to obtain the reliability of the product after shipment, the problem being: the electronic component 2 disposed in the shield 5 and the electrons disposed outside the shield The part 3 is simultaneously heated to a temperature close to a melting point (217 ° C) of the solder. Therefore, other methods of separately heating the shield member 5 are proposed, such as a method illustrated in Fig. 2A and a method illustrated in Fig. 2B. In the method illustrated in Fig. 2A, a heating head 100 is brought into contact with a top surface 5b of the shield member 5 to heat the solder 7 by heat transferred from an upper portion of the shield member 5. In the method illustrated in FIG. 2B, the heating head 100 is brought into contact with a side surface 5b of the shield member 5 to be transferred from a portion closer to the solder 720 by a method than that illustrated in FIG. 2A. Heat heats the solder 7. Patent Document 1: Japanese Laid-Open Patent Application No. 08-046351 However, since it is difficult to stably heat the solder 7 in accordance with the above-described methods shown in Figs. 2A and 2B, the methods have not actually been used. 201002458 That is, according to the method illustrated in FIG. 2A, it is difficult to (6) 匕 solder unless the temperature of the heating head just rises to about -WC, because the shield 5 is usually made of a stainless steel plate with nickel or tin. It provides a poor thermal conductivity and the heating position is far away - tin 7. If the material is brought into contact with the surface member 5, the color is caused by the oxidation of the money member 5, thereby causing a problem that ash is formed on the surface of the shield member 5, and dust is generated. - The insulation layer is reduced in quality. Surface-problem makes the shielding of the shielding member 5 according to the method of drawing thousands of smear, + A & Y 3 in Figure 2B, and the circuit board 丨 10 15 20, there are many conditions with 7 J Menshan No women's exhibition f A condition $ sub-part 3 is arranged a small distance, edited. Therefore, the side of the position 5 of the _=piece 5 is in contact. It is difficult to heat the lion and shield if the solder 7 is twisted by a contact with the flat head 100 having the contact with the solder. Without adding ... the flux may adhere to the contact 17..., the surface 'welding' is in contact with the heating device turbulence. Therefore, it is difficult to melt the solder 7 surely. Another ice + ...,,, and therefore, the contact heating is necessary to clean the cleaning operation after each operation. SUMMARY OF THE INVENTION Accordingly, the present invention is directed to providing a repairing apparatus and a repairing method which can simply and accurately mix a compound member and which is welded to a circuit board. The soldering is like a niece licking other parts of the board. In accordance with the present invention, a repair apparatus includes a heating head mount 5 201002458 configured to heat a soldering member that is soldered to a circuit board, wherein the heating head apparatus includes: a heating a contact member heated by the heating head, the contact member being formed of a thermally conductive material having elasticity and thermal conductivity greater than the heating head. The contact member is configured to be attached to a welding surface of the welding member. A resilient contact to melt the soldering member to a solder of the circuit board. According to another aspect of the present invention, a repair method includes: melting a member by contacting a soldering member with a soldering member of a contact member to solder a soldering member to a circuit board; supplying an inert gas to the 10; The soldering member; and removing the soldering member from the circuit board after the solder is melted. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a shielding member and a circuit board; FIG. 2A is a cross-sectional view showing a heating head in contact with a top surface of the shielding member; A cross-sectional view of a heating head in contact with a side of the shield; FIG. 3A is a front view of a reworking device as a repairing device according to an embodiment; 20 FIG. 3B is a cross-sectional view of FIG. A side view of the processing device; FIG. 4 is a cross-sectional view of a heating head device; FIG. 5 is an enlarged view of a portion of a heating head device in the vicinity of a splint; FIG. 6A is a view showing a heating head And a cross-sectional view of a shield member separated from the heating head; FIG. 6B is a cross-sectional view of the heating head and a shield attached to the heating head; and FIG. 7A is a view showing a conventional heating procedure a pattern of temperature changes of the first electronic component and a 5 shield; and FIG. 7B illustrates an electronic component and the temperature of the shield in a heating process performed by the reworking device according to the embodiment The pattern of change. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described with reference to the accompanying drawings. 3A and 3B illustrate a reworking device 10 as a repairing device in accordance with an embodiment. Fig. 4 shows a heating head unit 40 provided in the reprocessing apparatus 10. When a defect occurs on the electronic component 2 mounted on the circuit board 1 and disposed in a shield member 5, the rework device 10 is utilized in the repair method of the circuit board 1. The shield 5 is mounted on the board by soldering. The cover member 5 corresponds to an example of a welded member which is worn on the circuit board 1 by soldering. . The hai repair red 疋 refers to an electronic component 2 ′ for removing a defective 2 从 from the board 且 and replacing a good electronic component 2 on the circuit board. In the present embodiment, the shield member 5 is made of a stainless steel plate having a thermal conductivity of -15 W/mK. In general, the reprocessing device 1A includes a housing u, a lifting device 12, a positioning device 13, a platform device 14, and a cooling % supply device 15. 7 201002458 The outer casing 11 supports the lifting device 12, the positioning device 13, the platform device 14, and the cooling N2 supply device 15. The lifting device 12 includes a lift block 16, a drive unit 17, an arm 18, an attachment member 19, a thermal insulation member 20, and a heating head assembly 40. The lift base 5 16 is fixed to the outer casing 11 and the drive unit 17 is fixed to the lift base 16. The drive unit 17 is capable of moving the arm 18 in a vertical direction (direction indicated by arrows Z1 and Z2 in the figure) with respect to the circuit board 1. The drive unit 17 is a linear actuator such as a cylinder or a linear motor. The arm 18 is provided with an attachment member 19 for attaching the heating head device 40. The heat insulating portion 10 is provided at the bottom of the attachment member 19 such that the heating head device 40 is attached to the attachment member 19 via the heat insulating member 20. Therefore, when the heating head unit 40 generates heat, the heat is transferred by the heat insulating member 20, and the heat is not transmitted to the arm 18 and the lifting device 12. For the sake of explanation, the details of the heating head unit 40 will be mentioned later. The positioning device 13 supports the platform device 14 at its upper portion. The positioning device 13 is configured and arranged to move the platform device 14 in the direction indicated by arrows XI and X2 and arrows Y1 and Y2 in the figure. Therefore, the positioning device 13 is provided with a driving device 21 that moves the platform device 14 in the XI and X2 directions, and a driving device 22 that moves the platform device 14 in the Y1 and Y2 directions. 20 The circuit board 1 is placed on a top surface of the platform unit 14. A plurality of electronic components 2 and 3 are mounted on the circuit board 1, and the shield 5 is also mounted on the circuit board 1 by soldering to cover the electronic component 2 to be shielded. An entire circumference of the shield member 5 is welded to the circuit board 1. The shield member 5 is made of a heat conductive metal and is formed in a box shape having a side surface 5a, a top surface 5b and an open bottom portion 201002458. The engagement hole 6 is formed in the side surface 5ahx and is provided later in the - the splint connection 0 platform device (the heat generating means 23). A hot gas nozzle 24 is provided at the upper portion of the hot gas generating device 23. The hot gas generated in the hot gas production line (10) is injected from the hot gas nozzle 24 onto the shield member 5. The hot gas is an example of a twisted gas, and the hot gas nozzle 24 is an example of a heated gas nozzle. - Cooling gas supply device_, cold material supply device 15 is placed: platform 1 is placed on top 4. The cooling crucible 2 supply unit 15 has a 10 ρ nozzle 26 fixed to the auxiliaries. The cooling core including the Ν2 nozzle 26 is connected to a supply air source (not shown) so that the gas as the cooling gas 2 is injected from the 乂 nozzle 26. The nozzle 2 6 is configured and arranged to inject a gas as a cooling gas into a repairing position mentioned later, in which the shield 5 is attached and separated. The temperature of the gas injected from the 喷嘴2 nozzle 26 is set to be equal to or lower than the normal temperature (for example, 2Gt ± 15. (7) - the temperature is known. The device 3G is operated by the operator to control the operation of the rework device (7). A structure of the heating head unit 4 will now be described with reference to Fig. 4. The heating head unit 40 includes an attachment member 19, a heat insulating member 2, a heating ghost 41, a heating master 42, and a splint 44. Corresponding to an example of a contact member configured to be in contact with the shield 5 as a welded member. The attachment member 19 is fixed to the above-described arm 18. The heat insulating member 2 is attached to the bottom of the attachment member 19. The connecting member 19 is provided to prevent heat generated in the heating block 41 from being transferred to the lifting device 12 through the arm. An insulating glass fiber, an insulated mineral asbestos, an insulating ceramic, or the like can be used as the partition. Hot-rolling member 2〇 201002458 A guide plate 43 is provided at a peripheral position of the bottom surface of the heat insulating member 20 to extend in a downward direction (Z1 direction). The guide plate 43 has a claw portion 43a inward from a bottom end of the guide plate 43. The heating block 41 and the heating head 42 are placed in the heat insulating member 2 The heating block 41 and the heating head 42 are coupled to each other such that the heating block 41 and the heating head 42 are combined with each other in a state where the heating block 41 is at an upper portion and the heating head 42 is in a lower portion. A heater serving as a heating device (not shown) The heating head 42 is formed of a heat conductive metal (for example, brass). Therefore, when the heater of the heating block 41 generates heat, the heat is transferred to the heating head 10 42. The heating block 41 The heating head 42 is engaged with the guide plate 43. Specifically, the heating head 42 is supported by the first step portion 42c which is engaged with the claw portion 43a by the guide plate 43. The 'heating block 41 and the heating head 42 are on the guide plate 43. The attachment hole 51 is formed at a central position of the heat insulating member 20. A pivot 15 50 is provided in the attachment hole 51. The pivot 50 is elasticized by a coil spring 52 at a downward position (zi position). Pressurization. Therefore, the heating block 41 and the heating head 42 combined with each other can be moved or oscillated around the pivot 50 as a center in the direction indicated by the arrow gossip and the person 2 in Fig. 4. The combined heating block 41 and heating The range of motion of the head 42 is set such that the splint 44 is simply and surely A shield member 5 is attached to the mounting board 20 on the circuit board 1. A spacer member 42b is formed on the bottom surface of the heating head 42. The spacer member 42b is disposed and arranged to attach the heating head 40 to the shield member 5. (This state is shown in Fig. 4) facing the top surface 5b of the shield. A plurality of N2 injection holes 48 are formed on the surface 201002458 of the spacer member 42b facing the top surface %. The N2 injection holes 48 are passed. The -N2 supply channel 47 and the inlet are connected to the N2 supply (not shown). When a heating sequence is performed by the heating head 40 on the shield 5, an A gas is injected from the N2. The hole may be injected into the top surface of the shield member 5. 5 Thereby, the top surface 汕 of the shield member 5 is prevented from being discolored by oxidation, even if the shield member 5 is heated by the heating head unit 40. The heating head has an extension member 42a formed on the bottom surface of the heating head 42 around the spacer member 42b. The extension member 42a extends in a downward direction (21 direction). The cleat 44 is fixed to an outer surface 10 of the extending member 42 by a fixing screw 45. The splint 44 is formed of a metal material having a spring characteristic, such as, for example, 5 - hot oxygen copper, which has a thermal conductivity higher than that of the heating head (e.g., l 〇 6 W/mK) (for example, 4 〇3 w/mK). The surface of the splint 44 formed of an oxygen-free copper is secret to prevent oxidation. The thickness of the splint 44 is 15, for example, 0.3 mm to 〇.4 mm. The splint 44 of the above structure is heated by the heating block 41 by the heating head 42. Since the heat of the splint is greater than that of the hot head, the heat (transferred from the heat block of the force port) is transferred to the splint 44. Therefore, the temperature of the splint 44 is raised to be equal to or equal to a temperature at which the solder 7 is melted (a temperature of about 217. 〇. 2 〇 splint 44 疋 a plate-like member capable of contacting the side of the shield 5 with an elastic force 5a 'side 5a is used as a soldering surface. In the present embodiment, the plate 44 is provided to each of the opposite sides of the heating head 42, and the distance between the sheets is the distance from the outer shape of the concealing member 5. Accordingly, the shield member 5 is lost between the pair of lost plates 44 provided to the heating head 42. 11 201002458 In addition, as described above, the engaging holes 6 are formed on the side faces 5 & Fig. 6B) Each of the jaws 44 has a projection 44a on its inner side (on one side of the shield member 5). The projection 44a is configured to engage with the corresponding engagement hole 6. 5 When the heating head device is to be used When the cover member 40 is attached to the shield member 5, the clamp plate 44 is moved downward (the direction Z1), and at the same time, the projection portion 44a is slid on the side surface 5a as shown in Fig. 6A, and then the projection portion is moved to correspond to the engagement hole 6 In a position, the protruding portion 44a is engaged with the engaging hole 6 as shown in Fig. 6B. Therefore, when borrowing When the splint 44 fixes the shielding member 5, the shielding member 5 is fixed by the protruding portion 44a and the respective engaging holes 6% except for the fixing action by the elastic force of the splint. Therefore, the shielding member 5 can be heated by the heating head. The device 牝 is securely fixed. It should be noted that if the projection is formed on the side of the shield 5 and is configured such that the recess engaged with the projections is formed in the slab 44, the shield 5 is also It can be surely fixed by the heating head unit 4. 15 The lost plate 44 is provided at its lower end (end in the Z1 direction) with an inclined surface b. The inclined surface 44b is provided on an inner side of the clamping plate 44 (facing the side of the shielding member 5) By forming the inclined surface 4 on the splint 44, the splint 44 can be placed close to the solder 7 that bonds the shield 5 to the circuit board 1. 2〇# When the shield 5 is soldered to the circuit board 1, the tin-tin 7 is changed For the welding of the fillet 2〇. If the splint 44 is brought into contact with the solder 7, the flat tin 7 and a solder paste may adhere to the surface of the cleat 44, which may stain the splint 44. Therefore, the lost plate 44 must - The sheet 5 fixed by the splint 44 is separated from the solder. The solder 7 is soldered. The corner extends along the side 5& of the shield 5 as shown in Fig. 5. Therefore, the 'side 5a corresponds to the -welded surface which is bonded to the 12 201002458 circuit board 1 by the solder 7. The bottom of the female fruit plate 44 The end is flat, the splint can be moved to a slightly higher position; 0 tin position, in which the flat bottom surface of the splint 44 is open to the upper end of the solder. On the other hand, if the inclined surface 4 is set The base inclined surface 44b of the splint 5 44 can be placed close to the solder 7 as shown in Figs. 5 and 6B. The upper inclined surface 44b (four) is a gap member which provides a gap between the splint 44 and the solder 7. For this reason, the splint is called the inclined surface peach) can be moved to the position close to the solder 7, which achieves efficient heating of the solder 7. A repairing method for replacing a pure board 安装 of the electronic component 2 mounted on the circuit board 1 by using a rework device will now be described. The electronic component 2 is surrounded by a shield 5 that is soldered to the circuit board. In order to repair the circuit board 1 (or the electronic component 2)', the circuit board 1 having the electronic component 2 to be replaced is attached to the rework device 10. 3A, 3B, and 4 illustrate a state in which the circuit board 附 is attached to the rework device 。. The heating head device 40 is attached to the attachment member 19 of the rework device 10. The heating head unit 40 has a heating head 42 which can appropriately and efficiently heat the shield member 5 which is previously soldered to the circuit board 1. After the circuit board 1 is attached to the rework device 10, the hot gas generating device 23 is operated by the operating device 30. Therefore, a hot gas is blown to the bottom surface 20 of the circuit board 1 to preheat the circuit board 1. At the same time, the heater contained in the heating block 42 within the heating head unit 40 is also actuated to heat the heating block 42. As the heating block 41 is heated, the temperature of the heating head 42 rises. The heating temperature of the heating block 41 is controlled such that the extending member 42a of the heating head 42 is heated to a temperature of, for example, 315 °C. 13 201002458 Next, the operating device 30 drives the positioning device 13 to position the circuit board 1 such that the shield 5 on the 'inch board 1 is located at a position facing the heating head unit 40. After the positioning of the heating head unit 40 by the circuit board 1 is completed, the operating unit 30 drives the driving unit 17 of the lifting unit 12 to move downward (moving in the 21 direction) to heat the head unit 40. Further, the operating device 30 actuates the A supply device (not shown) and injects the Ν2 gas from the Κ injection hole 48 via the Ν2 inlet 46 and the & supply channel 47. With the downward movement of the heating head device 40, the clamping plates 44 are in contact with the respective side faces 5a of the shielding member 5. The heating blocks 41 and the heating heads 42 integrated with each other can surround 10 as a central pivot 50 in Fig. 4 The directions indicated by the arrows 八1 and 八2 are moved or oscillated. Therefore, if there is a positional offset between each of the clamping plates 44 and the shielding member 5, this positional displacement is absorbed by the oscillating movement of the heating block 41 and the heating head 42. This allows the clamping plate 44 to be surely engaged with the shielding member 5. Each of the clamping plates 44 has a spring characteristic and is in a cantilever state by the fixing screws 45. Further, the protruding portion 44a is formed on the inner surface of each of the clamping plates 44. Therefore, when each of the bridges 44 moves downward, after the loss plate 44 comes into contact with the shield member 5, it is elastically deformed as shown in Fig. 6A. The projections 4 slide on the respective side faces 5a of the shield member 5. When the splint 44 is engaged with the shield 5, the shield 5 is activated by the heating of the splint 44. 20 When the heating head unit 40 moves further downward, the projections 44a are engaged with the respective engaging holes 6. Piece 5 is sandwiched between the cleats and clamped 44 fixed 'this causes a state in which the shield 5 is fixed by the heating head device 4 (hereinafter, this state is referred to as an attached state). In this attached state, the shield 5 is replaced by the heating head device 40 by the splint 44 The elastic force of the pressing shield 5 and the engaging force of the projection 40a of the 201002458 and the engaging hole 6 are fixed. Further 'in this attached state, the clamping plate 44 is firmly attached to the side 5a of the shielding member 5. Therefore, The heat in the plate 44 is transferred to the shield 5 without loss. In addition, since the inclined surface 44b is formed at the bottom 5 end of each of the plates 44, the plate 44 can be placed very close to the solder 7. Therefore, the solder 7 can be made of one of the plates 44. The heat is directly heated by heat. In addition, since the extending member 42a of the heating head 42 is brought into contact with the top surface of the shielding member north, the shielding member 5 is heated by the bottom surface of the extending member 42a of the heating head 42. The shielding member 5 is heated by the heating head. When the device 4 is heated, the solder 7 in a rounded form 10 has a small thermal gradient between the upper portion (a portion on the side surface 5a) and the lower portion (a portion on the circuit board 1). Heated. The inventor measured by • heating The temperature of the solder 7 heated by the device 40, and the upper temperature of the solder 7 in the form of a rounded corner is 268. (3, and the lower temperature is 230 ° C. Since the rework device 1 according to the present embodiment can be as described above 15 The small thermal gradient heats the entire solder 7 in a south effect, and the solder 7 can be melted in a short period of time. It should be noted that the bottom surface of the circuit board 1 is heated by the hot gas generating device 23. 1 Therefore, the time spent on melting the solder 7 Further, since the splint 44 is firmly attached to the shield member 5 and the rework device 10 according to the present invention is placed close to the solder 7, the capacity of the heater 20 included in the heating block 41 can be set to The capacity of a conventional heater that is smaller than a splice plate separated from a solder. Therefore, the heater included in the heating block 41 of the reprocessing apparatus 1 can be miniaturized and the power consumption of the heater can be reduced. The splint 44 used in the present embodiment is made of a plate member, and its thickness is set to be 0.3 mm to about 0.5 mm. Therefore, even if the electronic component 2 and the electronic component 15 201002458 component 3 are mounted on the circuit board raft at a high density, the distance equal to or larger than 〇imm can be provided to the attached state of the splint 44 and each electron as shown in FIG. Between parts 3. Therefore, it is possible to prevent the electronic component 3 disposed close to the shield 5 from being damaged due to the interference of the splint 44 when the repeating process is performed. Further, when the heating head unit 40 performs the process of melting the solder 7 by heating the shield member 5, an example n2 gas of an inert gas is injected from the injection hole 48 formed in the heating head 42 to the shield member 5. Thereby, if the shield 5 is heated, the shield 5 is prevented from being oxidized and discolored. Further, it prevents a heat insulating layer from being formed on a surface of the shield member 5. Therefore, even if the shield member 5 is heated, the shielding performance of the shield member 5 can be prevented from being degraded. It should be understood that the N2 gas injected from the N2 injection hole 48 is injected onto the shield 5 after passing through the heating block 41 and the heating head 42. Therefore, the A gas injected from the A injection hole 48 is heated, and thereby the heating efficiency is not deteriorated by the injection of helium gas. 15 After the solder 7 is melted as described above, the heating head unit 40 is raised (moved in the Z2 direction). The shield member 5 is securely fixed by the heating head unit 4 by engaging the projecting portion with the engaging hole 6 as it is engaged. Therefore, the shield 5 is removed from the board by the lifted heating head unit 40. Thereby, the electronic component 2 that has been covered by the shield 5 is exposed to the outside. '° In the state where the shield 5 is removed, the procedure of removing the defective electronic component 2 and the woman's good electronic component 2 is performed. These two programs are collectively referred to as a part fix. This part repair procedure is not known in the art and its description will be omitted. While the component repair procedure is being performed, the 'shadowing member 5' is continuously executed by the heating program of the heating head unit 4〇. After the component repair process is completed, a solder paste is applied to the circuit board 1 at a position where the shield member 5 is to be mounted. After the process of applying a solder paste is completed, a process of attaching the shield 5 to the circuit board 1 is started. In the following, the procedure of attaching the shutter 5 is referred to as a reattachment procedure. When the reattachment procedure begins, the operating device 30 drives the lifting device 12 to cause the heating head device 4 to move down again. Therefore, the bottom of the side surface of the shield member 5 comes into contact with the solder paste on the circuit board, and the inclined surface 4 of the cleat 44 is placed close to the solder paste. 1) As described above, according to the rework apparatus of this embodiment, since the shield member 5 can be heated, the solder contained in the solder paste can be surely melted in a short time. The solder can bond the shield 5 to the circuit board j by melting the solder in the solder paste. After the shield member 5 is again bonded to the circuit board 1 by the solder 7, the operating device 15 3G activates the N2 gas supply device 15 to a position of engagement between the circuit board i and the shield member 5, that is, the solder 7 to be melted. Inject a n2 gas into the position. Thereby, the melted solder 7 is solidified in a short time, and the shield 5 is attached (fixed) to the circuit board 1 again. After the shield 5 is attached to the circuit board 1, the operating device 30 is moved up 2 to move the heating head unit 40. The force applied by the splint 44 to fix the shield 5 (including an engaging force between the projection 44a and the engaging hole 6) is set to be smaller than a force for bonding the shutter 5 to the circuit board 1. Therefore, the projection 44a is detached from the engaging hole 6 by the upward movement of the heating head unit 40, and the cleat 44 is separated from the shield 5. The fix is completed by the series of programs described above. 17 201002458 Figure 7A shows the indication that when a method-heating force is applied, the method is only used by a reworking device. Fig. 7B is a graph processing of the temperature rise in the green mask. The 071" field procedure is performed by the reworked garment according to the present embodiment, and the temperature rises in each of the masks 7A and 7B. High icon. In the elapsed time of the first time, the vertical axis is replaced by a heating-temperature. The car represents that the concealing member 5 is soldered to the portion of the circuit board 1 10 15 20 to cover the method, and the device is raised to f and ..., the meter A is not heated, and the temperature of the shielding member 5 is raised by two: to! The electronic component cracked on the board just rises in temperature, and it is difficult to efficiently heat the shield member alone, and the efficiency of this order is deteriorated. In addition, the electronic component may be damaged because the electronic component is exposed to ^ & time. Figure 2: According to the reworking device 10 of the present embodiment, the temperature rise rate of the ϋ 曰 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子The rework device of Figure 7 is removed. In addition, since the rate of temperature rise from the board 2 is low due to the zero-transmission time, the electronic component 2 can be prevented from being damaged even when the repair program is executed. [阖 简单 曰 j j j 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第The figure shows a cross-sectional view of the heating head in contact with one side of the shielding member, and FIG. 3A shows a front view of a reworking device as a repairing device according to an embodiment; 5 FIG. 3B shows a drawing in FIG. 3A A side view of the rework device shown in FIG. 4; a cross-sectional view of a heating head device; FIG. 5 is an enlarged view of a portion of a heating head device near a splint, and FIG. 10 is a cross-sectional view of a heating head and a shielding member separated from the heating head; FIG. 6B is a cross-sectional view showing the heating head and a shielding member attached to the heating head; FIG. 7A is a diagram showing the indication a pattern of temperature changes of an electronic component and a shield in the heating process; and 15 FIG. 7B depicts an electronic component and the shield in a heating process performed by the reworking device according to the embodiment The pattern of temperature changes. [Description of main component symbols] 1...PCB 7...solder 2,3···electronic component 10...rework device 5...shadow 11...shell 5a...side 12...lifting device 5b...top surface 13...positioning device 6 ...connection hole 14...platform device 19 201002458 15...cooling N2 device 16...lifting seat 17,2,22...drive device 18...arm 19···attachment member 20···heat insulation member 23...hot gas generation device 24 ...hot air nozzle 26...N2 nozzle 27...shaft 30...operating device 40··heating head device 41...heating block 42...heating head 42a·.·extending member 42b...spacer member 42c···step 43...guide 43a ··· claw part 44... lost plate 44a... protruding part 44b··· inclined surface 45... fixing screw 46...N〗 inlet 47···Ν2 supply passage 48···Ν2 injection hole 50...柩 axis 51··· Attachment hole 52...screw magazine 篑Α1-Α2 ' Χ1-Χ2 ' Υ1-Υ2 > Ζ1-Ζ2··.direction arrow ν2...Si gas 20