201000255 六、發明說明 【發明所屬之技術領域】 本發明係關於一種平面基板之硏磨 一種使用於半導體晶圓（以下，簡稱爲t 的精加工硏磨及再生晶圓硏磨的硏磨裝 【先前技術】 近年來，對應電子機器之小型化. 如，內建於薄型1C卡等的半導體元件; 如晶片之厚度爲ΙΟΟμηι以下或50μηι以 形成有半導體元件或電子零件等的晶圓 各個晶片前，’已開始進行一種硏削晶圓 之厚度的背面硏削（backgrind)步驟。 然而會有起因於上述背面硏削而在 工變質層，有時因該加工變質層使晶圓 解決上述不良情況，藉由如下方式來防 束後，加入硏磨步驟以去除加工變質層 此硏磨，已有採用縮小磨輪（grindi 粒直徑的方法、或進而在硏磨顆粒結合 的方法（例如，參照專利文獻1)。又， 案一種在以磨輪進行硏削後，加入餓刻 削來去除損傷的方法（例如，參照專利或 另一方面，在半導體晶圓中，已進 圓予以再生使用的方法。例如，在薄膜 技術。尤其是關於 3曰圓）之背面硏削後 置及硏磨方法。 •輕量化的需求（例 等），而被要求極薄 下。因此在將表面 以切割步驟分割成 之背面以減薄晶圓 晶圓背面形成有加 破損的缺點。爲了 止：在硏削加工結 〇 n g w h e e 1)之硏磨顆 材中使用軟性材料 其他方法中，有提 步驟，利用磨輪硏 :獻 2)。 行一種將使用完晶 形成步驟中，有爲 201000255 了各種之目的而使用，且表面上具有多數層的膜之晶圓、 或在製造步驟中因不良品而被挑出的晶圓基板等。在此再 生晶圓基板上，有被要求與新品同樣的表面性狀或金屬污 染等級等之品質，且提案了各種有關此的再生方法（例 如，參照專利文獻3、4)。當再生時，雖有以硏削磨輪進 行硏削後依鈾刻處理最終去除表面的損傷或雜質之方法， 但是此鈾刻處理，因恐有涉及環境破壞之虞，故有提案一 種使用如類樹脂（res inoid)磨輪之加工損傷少的磨輪進行 硏磨之方法。 然而在使用於上述晶圓的背面加工或晶圓的再生加工 之精加工磨輪加工中，因磨輪之堵塞而發生加工品質降 低，故有必要頻繁地進行磨輪之修整處理。更因硏磨裝置 之機械精度、剛性及構造均爲複雜，且維護性也差，故需 要附帶設備。 因此在晶圓的背面加工或晶圓再生加工中，藉由使用 硏磨帶，並使此硏磨帶一邊行走一邊經常地供給新的硏磨 帶，即可迴避上述堵塞的問題，更可藉由使硏磨帶旋轉來 對應硏磨不均一的問題。並且有提案一種利用硏磨帶來對 液晶顯示器或印刷電路板等之平坦的被硏磨材進行硏磨或 清潔的硏磨裝置（例如，參照專利文獻5)。 作爲具體之例，如第9圖（a)及（b)所示，該硏磨裝置 1〇〇，係具備：裝設有硏磨帶1〇1的硏磨頭1〇2 ;及支撐 硏磨頭1 02的支撐構件1 03 ;以及設置於硏磨頭1 02之下 方且裝設有被硏磨材的硏磨台（未圖示）。 -6- 02 201000255 然後，硏磨裝置1 〇 〇，係構成：使裝設於硏磨台1 的硏磨帶101 —邊接觸設置於硏磨台上的被硏磨材之 面’一邊使硏磨頭102相對於支撐構件103以與硏磨台 硏磨面正交的線爲軸線而旋轉。 更且，硏磨台102，係以複數個行走輥104使硏磨 101 —邊行走一邊硏磨被硏磨材。在硏磨台102之內部 係安裝有：安裝有捲繞著硏磨帶101的輥子之供給捲 106;以及用以捲繞從供給捲筒106拉出的硏磨帶101 捲繞捲筒107，藉由設置於硏磨頭102內的硏磨帶搬運 馬達108，使捲繞捲筒107及行走輥104之一部分旋轉 動，硏磨帶1 〇 1就可從供給捲筒1 06拉出，且一邊以複 個行走輥1CM搬運硏磨帶101，一邊使通過設置於硏磨 102之下端的接觸輥105之後，再由捲繞捲筒107所 繞。 又，設置於硏磨頭102之下端的接觸輥105，係設 成使接觸輥105之軸線與硏磨頭102之旋轉中心正交而 對於硏磨台成爲水平，且使硏磨台101 —邊行走一邊藉 接觸輥105將硏磨帶101按壓於硏磨台上之被硏磨材。 者，藉由設置於支撐構件103的硏磨頭旋轉用馬達109 使硏磨台102以延伸於與硏磨台之被硏磨材設置面正交 方向之軸線爲中心而旋轉。 如以上所述，習知的硏磨裝置1 0 0，係藉由將硏磨 101設置於硏磨頭102的硏磨帶搬運用馬達108 —邊使 磨帶1 〇 1沿著行走輥1 04行走，一邊使硏磨頭1 02相對 表 之 帶 ， 筒 之 用 驅 數 頭 捲 置 相 由 再 y 的 帶 硏 於 201000255 支撐構件103旋轉，並藉由接觸輥105使硏磨帶ιοί接觸 設置於硏磨台上的被硏磨材，藉此來自動地硏磨被硏磨材 之表面。 然而，第9圖（a)及（b)所示的硏磨裝置100中，雖然 是以複數個行走輥1 04使一條硏磨帶1 0 1行走，但是也使 硏磨頭1 02旋轉而硏磨，所以一旦硏磨頭1 02旋轉，設置 於硏磨頭102之下端的接觸輥105就會以接觸輥105之軸 線與硏磨頭1 0 2之旋轉中心所交叉的點爲中心而旋轉。亦 即，會以硏磨帶1 〇 1之寬度方向的中心爲軸心而旋轉。 此時，一旦使硏磨帶1 〇 1接觸及於接觸輥1 05之輥子 全面，當硏磨頭1 02旋轉時因接觸輥1 05使硏磨帶1 Ο 1按 壓於被硏磨材就會使硏磨材彎曲，且在硏磨帶寬度方向中 央部會產生較大的皺紋，而有無法良好地進行硏磨的問 題。 因此，習知的硏磨裝置中，係如第9圖（b)所示，將 接觸輥105形成寬度方向中央部11〇之輥子直徑比兩端的 輥子直徑還小，並在接觸輥105之寬度方向中央部110使 硏磨帶101不接觸於輥子面。 然而’ 一旦在接觸輥105之中央部110形成有與硏磨 帶101之非接觸部分，由於在硏磨帶101之寬度方向中央 部110無法按壓於被硏磨材，所以在硏磨帶101之寬度方 向中央部110的硏磨力較弱而發生不均一硏磨面的不良情 況。 尤其是，被硏磨材需要高精度之表面精加工的半導體 -8- 201000255 晶圓之情況，一旦在接觸輥之接觸壓力有不均一的部分就 會發生無法獲得均一表面的問題。 又，如本發明之晶圓爲圓盤狀、以及在旋轉硏磨的步 驟中，在接觸輥之中央部無法充分消除硏磨帶之彎曲，此 成爲旋轉的晶圓發生破損問題的原因。 另一方面，爲了要抑制不均一硏磨面的發生，有提案 一種以硏磨台之旋轉中心爲基準而將硏磨帶配置於左右的 硏磨裝置（參照專利文獻6)。 (專利文獻1)日本特開HI 1 - 42540號公報 (專利文獻2)日本特開200 1 -22 3 202號公報 (專利文獻3)日本特開2002-57129號公報 (專利文獻4)日本特開2000-269 1 74號公報 (專利文獻5)日本特開平1 1 -273 053號公報 (專利文獻6)日本特開平6- 1 55269號公報 【發明內容】 (發明所欲解決之問題） 上述專利文獻6所記載的硏磨裝置，係具備左右一對 的導出軌條、捲繞捲筒所構成，而一對硏磨帶係在離開硏 磨頭之旋轉中心的位置硏磨左右者。 然而此硏磨裝置，因係使用同一驅動源於硏磨頭之旋 轉與硏磨帶之行走的結構，故有損硏磨頭之旋轉與硏磨帶 之控制的自由度，另一方面，裝置構成變得複雜。又因硏 磨帶係行走於同一方向，故其中一方的硏磨帶會依藉由硏 -9- 201000255 磨頭之旋轉所產生的應力作用，而在捲繞方向產生應力’ 且另一方的硏磨帶會在捲繞方向之相反方向產生應力，故 在捲繞方向之相反方向產生應力之另一方的硏磨帶恐有發 生鬆弛之虞且有造成不均一硏磨面之虞。 因此，本發明係有鑑於如此之上述情事而開發完成 者，其目的在於提供一種不會使旋轉的晶圓等之被硏磨材 破損，而可獲得平滑又均一之表面的硏磨裝置及硏磨方 法。 (解決問題之手段） 爲了解決上述課題本發明所提案者係一種具備：裝設 有行走的硏磨帶之硏磨頭；及將前述硏磨帶按壓於被硏磨 材並使前述硏磨頭旋轉的支撐單元；以及可旋轉地裝設有 前述被硏磨材的工件旋轉單元而成之硏磨裝置，其特徵在 於：前述硏磨頭，係具有各二組之：硏磨帶；及供給該硏 磨帶的供給捲筒；及使被供給的硏磨帶抵接於前述被硏磨 材的接觸輥；以及將經過該接觸輥之硏磨帶予以捲繞的捲 繞捲筒，被按壓於前述被硏磨材的前述硏磨帶，係與前述 硏磨頭之旋轉軸左右對稱且隔開預定距離而配置，並且可 分別朝反方向行走。 由於如此地相對於硏磨頭之旋轉軸隔著預定的距離左 右對稱地配置二組朝反方向行走的硏磨帶，所以可防止位 於旋轉軸之位置的硏磨帶之彎曲發生。又藉由使二組硏磨 帶朝與硏磨頭之旋轉方向相對向的方向行走也可防止硏磨 -10- 201000255 帶之鬆弛，且可提供一種經考慮過硏磨帶之切斷防止的硏 磨裝置。因而可獲得硏磨精加工面也均一的表面。又，依 據行走的硏磨帶，由於可經常供給新的硏磨帶，所以也沒 有硏磨帶之堵塞問題’而可效率佳且穩定地進行硏磨。 較佳爲，前述供給捲筒及前述捲繞捲筒，爲了成爲能 夠同步旋轉，係連接於：將前述供給捲筒及前述捲繞捲筒 驅動的驅動馬達以及傳遞該驅動的驅動傳遞裝置而成。其 爲對應硏磨帶之鬆弛發生或切斷的問題者。 再者，前述驅動馬達，係配置於前述硏磨頭之旋轉軸 的一方側，並且在前述旋轉軸之另一方側配置使前述驅動 馬達與前述傳遞裝置取得重量平衡的重量平衡用構件。藉 此可將被硏磨材之硏磨面，形成更均一的表面。又與進行 硏磨頭之旋轉的驅動裝置不同地，由於設置硏磨帶之行走 用的驅動馬達，所以可個別地控制硏磨帶之旋轉與硏磨帶 之行走，且可進行相應於用途的硏磨。 又本發明進一步所提案者係一種使用上述硏磨裝置而 成的硏磨方法，其特徵在於：朝反方向行走的二條前述硏 磨帶在抵接於前述接觸輥的位置，朝向與前述硏磨頭之旋 轉方向相對向的方向行走而硏磨前述被硏磨構件。在硏磨 帶之行走中可防止鬆弛之發生。 再者，二條前述硏磨帶中之一方硏磨帶的外側與另一 方硏磨帶的外側之間距，係設定在：超過薄板圓形被硏磨 材之半徑的長度，且比前述被硏磨材之直徑的長度還小的 範圍而成。藉此構成即可使被硏磨材之硏磨面均一地硏 -11 - 201000255 磨’且可抑制局部形成有不需要的硏磨花紋者。 另外本發明中，可適當地變更硏磨帶之種類，即硏磨 帶之硏磨顆粒之粒子直徑或硏磨頭等之旋轉速度等，且可 對硏磨面做更進一步的清潔。 又雖將硏磨帶與硏磨頭之旋轉軸對稱地配置二組，但 是若與硏磨頭之旋轉軸做對稱地配置亦可爲二組以上，即 至少配置二組。 (發明效果） 依據本發明，則可提供一種抑制硏磨帶之彎曲或鬆弛 的發生’不使旋轉的晶圓等之被硏磨材破損，而可獲得平 滑又均一之表面的硏磨裝置及硏磨方法。 【實施方式】 以下參照附圖說明本發明之較佳的實施形態。 第1圖係顯示本發明晶圓平面硏磨裝置之主要機構部 構成的裝置正面圖；第2圖係第1圖的硏磨頭之χ·χ截 面圖；第3圖（a)係第2圖之A-A截面圖；第3圖（b)係第 2圖之B-B截面圖；第4圖（a)係第2圖之A-A截面中的 驅動傳遞路徑說明圖；第4圖（b)係第2圖之C-C截面中 的驅動傳遞路徑說明圖；第5圖（a)係第2圖的D-D箭視 圖；第5圖（b)係第2圖的E-E箭視圖。 如第1圖所示，硏磨裝置1，係具備：裝設有硏磨行 走的硏磨帶之硏磨頭4;及支撐硏磨頭4的支撐單元2; -12- 201000255 以及載置成爲硏磨對象的被硏磨材W之工件機台單元3 而成者。硏磨裝置1，係平行地配置有從機體（未圖示）突 出的上部框體5與下部框體6;在上部框體5，係配置有 用以支撐裝設有硏磨帶之硏磨頭4的支撐單元2;在下部 框體6，係具備有工件機台單元3。又在支撐單元2，係 具備有硏磨頭4之水平方向移動部、升降部及旋轉部。 硏磨頭4之水平方向的移動，係以被硏磨材表面之定 位而利用LM導件2 1來進行，在此LM導件21之基板上 配置有硏磨頭4之升降部及旋轉部。更且，硏磨頭4，係 連結於與上部框體5正交的旋轉軸20，且通過可升降及 旋轉的滾珠旋轉栓槽（ball rotary spline)22，連結於上部 的旋轉接頭（rot ary joint )28而旋轉自如地支撐著。 硏磨頭 4之升降，係藉由加壓氣缸（例如，air cylinder)23來控制連結於硏磨頭4之旋轉軸（固定於硏磨 頭4之凸緣，且連至旋轉接頭28的軸）20，用於對設置於 工件機台31的被硏磨材W施加適當的荷重。爲了將硏磨 頭4支撐成可旋轉，而藉由旋轉接頭28來與加壓氣缸23 及旋轉軸20連接。更且對旋轉軸20而言，係支撐成可藉 由滾珠旋轉栓槽22朝上下方向移動及旋轉。藉此，可進 行硏磨頭4的前端與工件表面之定位作業。 然後，在上部框體5之上方載置有硏磨頭4之旋轉驅 動用的馬達2 4。該馬達24側之滑輪2 5與旋轉軸2 0側之 滑輪26係由皮帶27連結，藉由馬達24之旋轉驅動’可 使旋轉軸20旋轉，且使連結於心軸的硏磨頭4旋轉。 -13- 201000255 另一方面，在下部框體6，係配置有工件; 及機台驅動馬達3 2。然後連結於工件機台3 1 之滑輪3 4與馬達3 2側之滑輪3 5可利用皮帶： 藉此可使工件機台3 1旋轉。 又在硏磨頭4之內部裝設有後述的二組硏 建有分別獨立的硏磨帶行走部。 以下，參照附圖說明本發明的硏磨頭4之 2至4圖所示，硏磨頭4，係由旋轉軸20所保 4，係由以第2圖的旋轉軸之軸線Z爲境界來 行走系之二個滑車（左側滑車1 〇a、右側滑_ 成，分別將硏磨帶ΤΙ、T2並列內建於硏磨帶 可藉由複數個行走輥子而行走。 在左側滑車1 〇a、右側滑車1 〇b之內部， 安裝有捲繞著硏磨帶τ 1、T2的輥子之供給 6 2b ;以及用以對從供給捲筒62a、62b各自拉 ΤΙ、T2進行捲繞之捲繞捲筒61a、61b。然後 左側滑車1 0a內之作爲硏磨帶搬運用驅動馬達 走用馬達48使捲繞捲筒部及行走輥子之一 動，使硏磨帶ΤΙ、T2從供給捲筒62a、62b拉 用複數個行走輥搬運硏磨帶T1'T2，一邊通 磨頭之下端的接觸輥41a、41b之後，捲繞 61a、 61b 〇 左側滑車1 0a與右側滑車1 Ob，係以旋轉 對稱，且構成二組的硏磨帶行走部。另外，在 機台3 1、以 的凸緣3 3 3 6來連結， 磨帶，且內 構成。如第 持。硏磨頭 保持硏磨帶 i 10b)所構 寬度方向， 係安裝有： 捲筒 62a 、 出的硏磨帶 藉由設置於 的硏磨帶行 部分旋轉驅 出，一邊利 過設置於硏 於捲繞捲筒 軸線Z成爲 旋轉軸線周 -14- 201000255 圍有中空部19，在此中空部19藉由複數個齒輪及皮 行走馬達48之驅動力傳遞至捲繞捲筒部，可使硏 ΤΙ、T2行走。 捲繞部之一方，係具有捲繞轉矩調整部（例如， (slip ring))13a、13b，而另一方係藉由軸承成爲旋轉 的捲筒承座l4a、14b。又，硏磨帶供給部之一方係 有滑動軸承（slide bear ing)17a、17b，且具有硏磨帶 轉矩調整部16a、16b。如此，硏磨帶可以調整成固 張力而行走。 前述硏磨帶之捲繞部、及供給部，係分別夾介軸 可旋轉地支撐於內部側壁 1 2 a、1 2 b與外部側壁 1 1 lb。又此等硏磨帶供給捲筒62a、62b及硏磨帶捲繞 6 1 a、6 1 b之旋轉軸線，係設置成相對於硏磨頭旋轉軸 正交。 然後’硏磨帶供給捲筒62a、62b及硏磨帶捲繞 61a、61b也與二支接觸輥41a、41b在上下方向分別 心位於同一線上的方式配置於離開硏磨頭4之旋轉軸 的直徑方向外側。 又，如第3、4圖所示，在硏磨帶捲繞捲筒61a、 之內側端部’係設置有硏磨帶捲繞軸確動滑輪50， 介皮帶52來與硏磨帶供給軸確動滑輪50連結。 硏磨帶行走馬達48驅動並夾介齒輪G而傳遞至 (idle gear)A ’該旋轉進而傳遞至齒輪H，並使確動滑 轉，且該旋轉夾介皮帶52而傳遞至捲繞軸之確動 帶將 磨帶 滑環 自如 也具 供給 定的 承而 la、 捲筒 線Z 捲筒 以中 線Z 61b 且夾 惰輪 輪旋 滑輪 -15- 201000255 50，使硏磨帶捲繞捲筒61a、61b旋轉。 又本實施形態中的硏磨頭4，係以一個硏磨帶行走用 馬達48，藉由將行走機構（齒輪及皮帶等的驅動力傳遞構 件）設置在位於中央之中空部1 9，來降低零件數，以謀求 小型化，且使供給捲筒62a、62b與捲繞捲筒61a、61b可 同步旋轉。又爲了取得均一硏磨所需之硏磨頭4進行旋轉 時的重量平衡，且爲了取得與設置於左側滑車1 Ob的硏磨 帶行走用馬達48或其他的傳遞裝置（齒輪、皮帶等）之重 量平衡’而將作爲重量平衡用構件的暫置構件（dummy member)49設置於右側滑車i〇b。 又，設置於硏磨頭4之下端的接觸輥41a、41b，係 設計成使與接觸輥41a、41b之軸線與硏磨頭4之旋轉中 心正交並相對於工件機台31成爲平行，且一邊使硏磨帶 ΤΙ、T2行走一邊藉由接觸輥41a、41b將硏磨帶以固定的 按壓力按壓在工件機台31上之被硏磨材W。 然後’二支接觸輥41a、41b，係藉由硏磨帶行走用 馬達48與複數個齒輪來傳遞俾使硏磨帶τΐ、T2相互地 朝相反方向行走，且使接觸輥4 1 a、4 1 b以軸線Z爲中心 旋轉。 因此，爲了使二支接觸輥4 1 a、4 1 b個別地朝相反方 向旋轉’可藉由複數個齒輪來調整各自的按壓輥41a、 4lb俾藉由硏磨帶行走用馬達48與複數個齒輪使旋轉方 向相互地成爲相反。 以下’參照第4圖說明從硏磨帶行走用馬達48藉由 -16- 201000255 複數個齒輪朝接觸輥之傳遞、與朝捲繞捲筒之傳遞作業。 如第3圖（a)所示，在左側滑車1 〇 a之接觸輥4 1 a，係 從直接連結於硏磨帶行走用馬達48的齒輪G藉由惰輪 B、 D而傳遞至接觸輥部齒輪F1，且使接觸輥41a旋轉。 另一方面，在右側滑車1 Ob之接觸輥4 1 b，係從直接連結 於同一個硏磨帶行走用馬達4 8的齒輪G藉由惰輪A、 C、 E而傳遞至接觸輥部齒輪F2，且使接觸輥4 1 b旋轉。 藉由該等的齒輪組合，接觸輥41a、41b就會朝反方向旋 轉。 同時從硏磨帶行走用馬達48的齒輪G傳遞至惰輪 A ’且傳遞至確動滑輪 50的旋轉力係傳遞至捲繞滑輪 51，藉由與此掛設在捲繞滑輪51的確動皮帶52使捲繞滑 輪5 1旋轉，而捲在供給捲筒上的硏磨帶係通過接觸輥 41a而一邊捲繞一邊行走。在此，捲繞捲筒6ia、61b，係 彼此連結，且藉由捲繞滑輪51而旋轉。另外，供給捲筒 62a及62b，係爲了可逆旋轉而藉由軸承55(參照第2圖） 而連結，且構成旋轉自由。 其次，以第5圖（a)、（b)來說明硏磨帶的行走路徑。 第5圖（a)、（b)係硏磨頭的側視圖；第5圖（a)係以第2圖 之D-D箭視圖顯示左側滑車1 〇a之硏磨帶的行走路徑； 第5圖（b)係第2圖之E-E箭視圖顯示右側滑車l〇b之硏 磨帶的行走路徑。 第5圖（a)中，硏磨帶T1，係從供給捲筒62a送出’ 且通過複數個輥子（71a、72a、73a、75a及76a)，而從捲 -17- 201000255 繞捲筒61a之下側朝箭頭之方向捲繞。另一方面，硏磨帶 T2，係從供給捲筒62b送出，且通過複數個輥子（7 lb、 72b、73b、75b)，而從捲繞捲筒61b之下側朝箭頭之方向 捲繞。 如此硏磨帶T 1、T2就可彼此地朝同一方向即捲繞旋 轉方向爲相同的方向旋轉並捲繞。另外，在接觸輥4la、 4 1 b之側面，爲了使硏磨帶呈緊張狀態而設置有迫緊輥 77a 、 77b ° 如上面所述，本發明中，二個接觸輥41a、41b，係 爲了將使其與設置於工件機台（硏磨台）31的被硏磨材W 之表面接觸的硏磨帶T 1、T2之接觸部位於比硏磨頭4之 旋轉軸線Z更靠近直徑方向之外側，而如第2圖所示，將 構成使其與被硏磨材接觸的硏磨帶T1、T2之接觸部的二 個接觸輥41a、41b，在比硏磨頭4之旋轉軸線Ζ還靠近 直徑方向之外側，且二個接觸輥41a、41b在同一軸線上 支撐成相對於硏磨頭4之旋轉軸線Z對稱地設置。 再者，接觸輥41a、41b，係爲了在硏磨頭4旋轉中 於被硏磨材之預定位置彼此朝反方向以輥子軸線爲中心旋 轉，而安裝於硏磨頭4。此等可藉由複數個惰輪來調整。 根據上述的硏磨裝置所進行的硏磨方法（被硏磨材之 硏磨或清潔）係進行如下。 首先，將平坦的被硏磨材配置於第1圖所示的工件機 台3 1上，且使其吸附而固定。 其次如第1圖及第2圖所示，使水平移動裝置（Lm導 -18- 201000255 件21)驅動，並使硏磨頭4水平移動至被硏磨材之適當位 置，藉由升降裝置之驅動使裝設於硏磨頭4的硏磨帶 ΤΙ、T2利用接觸輥41a、41b以適當的壓力接觸於被硏磨 材之表面。 然後，使硏磨帶行走用馬達48驅動，而使接觸輥 41a、41b與硏磨帶捲繞捲筒61a、61b旋轉。藉此，在新 的硏磨帶ΤΙ' T2依次供給至接觸輥41a、41b之後捲繞於 硏磨帶捲繞捲筒。 再者，使支撐單元2之驅動馬達24驅動，並夾介由 皮帶27而連結的滑輪26使旋轉軸20旋轉，藉此使硏磨 頭4旋轉。如此’可藉由經常被供給之新的硏磨帶來完成 旋轉硏磨或清潔。 關於本發明的作用，係參照附圖並列舉實施例及比較 例，具體地說明本發明之硏磨方法。 第6圖（a)係習知法以一條硏磨帶T爲旋轉中心P而 旋轉時施加於硏磨帶的應力之示意圖；第6圖（b)係本發 明將二條硏磨帶T 1、T2配置於旋轉中心P之兩側使彼此 朝反方向一邊行走一邊旋轉時施加於硏磨帶的應力之示意 圖。 第6圖（a)及（b)中，T係顯示硏磨帶，P係顯示硏磨頭 之旋轉中心。箭頭81係顯示硏磨頭之旋轉方向，箭頭 82、82a、82b係顯示硏磨帶進給方向，83a、83b係顯示 此時所發生的應力方向。 第6圖（a)之習知例中，係相對於硏磨頭之旋轉中心 -19- 201000255 P，以旋轉中心爲境界而將反方向之應力104a、104b施加 於一條硏磨帶。因此會在硏磨帶發生彎曲或皺紋。此應力 有時造成硏磨帶被切斷的原因。 另一方面，依據第6圖（b)所示的本發明之硏磨方 法，則由於相對於旋轉中心P而在外側配置有硏磨帶T 1 及T2，所以不會在硏磨帶產生彎曲應力，故不會在旋轉 中心集中應力，不會在硏磨帶發生扭歪或皺紋。又，由於 硏磨帶T1及T2係將硏磨帶進給方向設爲相反，所以會 在二條硏磨帶產生取得平衡的應力，故硏磨頭也可穩定地 旋轉。結果，可進行平滑性、平坦性之優異的硏磨。 第7圖係由接觸輥41a、41b按壓而行走的硏磨帶 ΤΙ、T2之槪略立體圖。在硏磨帶T1及T2之供給捲筒 62a、62b與捲繞捲筒61a、61b，爲了分別在行走的硏磨 帶ΤΙ、T2施加固定的拉伸力，並爲了在施加異常的拉伸 力時滑移，而可藉由硏磨帶供給轉矩調整部（滑移環，slip ring)16a、16b與硏磨帶捲繞調整部（滑移環）13a、13b來 調整（參照第2圖）。調整係以硏磨帶ΤΙ、T2之捲繞不會 鬆弛的方式，將硏磨帶捲繞調整部（滑移環）1 3a、13b的拉 伸力設爲較大。 因此如第7圖所示，若對在旋轉軸P中旋轉的硏磨頭 4(未圖示）之旋轉方向81，接觸輥41a、41b之旋轉彼此朝 捲繞方向施加拉伸力的話，則可抑制在硏磨帶τ 1、T2發 生鬆弛或皺紋，結果有助於均一硏磨面的形成。 第8圖（a)、（b)係顯示半導體晶圓的較佳硏磨例。第 -20- 201000255 8圖（a)係顯示晶圓W之直徑較大（例如，3 00 φ )時之晶圓 W與硏磨帶寬度（硏磨區域寬度）的位置關係；第8圖（b)係 顯示晶圓W之直徑較小（例如，2 0 0 φ )時之晶圓W與硏磨 帶寬度（硏磨區域寬度）的位置關係。 箭頭8 5係晶圓W之旋轉方向，s係晶圓之旋轉中 心，P係二組硏磨帶T1、T2之旋轉中心，箭頭8 1係硏磨 頭（硏磨帶）之旋轉方向。 第 8圖（a)中，相對於晶圓之半徑，二條硏磨帶 (T1+T2)之旋轉端係配置成比晶圓之半徑還大，其中一端 位於晶圓的旋轉中心S之外側，另一端則從晶圓之外周露 出。 又如第8圖（b)顯示晶圓之半徑較小（例如，2 0 0 φ )時 的一例。具體而言’若使用寬度2.5吋的二條硏磨帶，且 總計爲7吋的話’則不用改變硏磨帶就可使用於大小之晶 圓（3 00 Φ 與 200 φ )。 如此的話則晶圓之前面可硏磨成均一，而不會在局部 上形成不要的硏磨花紋。又’不用改變二條硏磨帶寬度 (接觸輕寬度）就可進丫了 300φ 、200φ之硏磨。 另外，晶圓的旋轉方向與硏磨頭的旋轉方向，雖無特 別的規定’但是彼此爲反方向較可提高硏磨效率。 【圖式簡單說明】 第1圖係顯示本發明晶圓平面硏磨裝置之主要機構部 構成的裝置正面圖。 -21 - 201000255 第2圖係第1圖的硏磨頭之χ_χ截面圖。 第3圖（a)係第2圖之Α_α截面圖；第3圖（b)係第2 圖之B-B截面圖。 第4圖（a)係第2圖之a-A截面中的驅動傳遞路徑說 明圖；第4圖（b)係第2圖之c-C截面中的驅動傳遞路徑 說明圖。 第5圖（a)係第2圖的d_D箭視圖；第5圖（b)係第2 圖的E-E箭視圖。 第6圖（a)係習知法以—條硏磨帶τ爲旋轉中心P而 旋轉時施加於硏磨帶的應力之示意圖；第6圖（b)係本發 明將二條硏磨帶T 1、T2配置於旋轉中心p之兩側使彼此 朝反方向一邊行走一邊旋轉時施加於硏磨帶的應力之示意 圖。 第7圖係由接觸輥按壓而行走的硏磨帶之槪略立體 圖。 第8圖（a)、（b)係半導體晶圓的較佳硏磨例。 第9圖（a)係習知的硏磨裝置正面圖；第9圖（1>)係其 截面圖。 【主要元件符號說明】 1 :硏磨裝置 2 :支撐單元 3 :工件機台單元 4 :硏磨頭 -22- 201000255 5 :上部框體 6 :下部框體 1 〇 a :左側滑車 1 〇 b :右側滑車 4 1 a、4 1 b :接觸輥 61a、61b:捲繞捲筒 62a、62b :供給捲筒 ΤΙ、T2 :硏磨帶 Z :旋轉軸 -23-201000255 VI. Description of the Invention [Technical Fields of the Invention] The present invention relates to a honing of a planar substrate for use in a semiconductor wafer (hereinafter, referred to as t-finishing honing and reclaiming wafer honing) Prior Art In recent years, miniaturization of electronic equipment has been carried out. For example, a semiconductor element built in a thin 1C card or the like; for example, a wafer having a thickness of ΙΟΟμηι or less or 50 μm to form a semiconductor element or an electronic component, etc. , 'The backgrinding step of boring the thickness of the wafer has begun. However, there will be a change in the surface due to the above-mentioned back boring, and sometimes the wafer will solve the above problem due to the processing of the deteriorated layer. After the anti-bundle is added by the following method, the honing step is added to remove the tempered layer, and the method of reducing the grinding wheel (grindi particle diameter, or further honing the particle combination) has been used (for example, refer to the patent literature) 1). Also, a method of adding a hungry cut to remove damage after boring with a grinding wheel (for example, refer to a patent or another In the semiconductor wafer, it has been rounded and recycled. For example, in the thin film technology, especially on the back side of the 3D round, the boring and honing method. • Lightweight requirements (example, etc.) Therefore, it is required to be extremely thin. Therefore, the surface is divided into the back surface by the cutting step to reduce the defects of the wafer wafer on the back surface of the wafer wafer. To stop: in the boring process, the ngwhee 1) Among other methods of using soft materials in materials, there are steps to take advantage of the grinding wheel 硏: 2). In the step of using the crystal forming step, there are a wafer for use in various purposes for 201000255, a film having a plurality of layers on the surface, or a wafer substrate which is picked up by defective products in the manufacturing process. On the wafer substrate, the quality of the surface properties or metal contamination levels required for the new product is required, and various reproduction methods have been proposed (for example, refer to Patent Documents 3 and 4). When regenerating, although there is a method of removing the surface damage or impurities by honing the grinding wheel after boring, the uranium engraving treatment may be caused by environmental damage. Resin-to-oid grinding wheel is a method of honing a grinding wheel with less damage. However, in the finishing grinding process used for the back surface processing of the wafer or the reprocessing of the wafer, the processing quality is lowered due to the clogging of the grinding wheel, so it is necessary to frequently perform the dressing process of the grinding wheel. Further, since the mechanical precision, rigidity, and construction of the honing device are complicated and the maintainability is also poor, an attached device is required. Therefore, in the back surface processing or wafer re-processing of the wafer, by using the honing tape and frequently feeding the honing belt while feeding the new honing belt, the problem of the clogging can be avoided, and the clogging problem can be avoided. The problem of uneven honing is corresponding to the rotation of the honing belt. Further, there has been proposed a honing device for honing or cleaning a flat honed material such as a liquid crystal display or a printed circuit board by honing (for example, see Patent Document 5). As a specific example, as shown in Fig. 9 (a) and (b), the honing device 1A includes: a honing head 1〇2 equipped with a honing belt 1〇1; and a support 硏A support member 103 of the grinding head 102; and a honing table (not shown) provided below the honing head 102 and equipped with a honed material. -6- 02 201000255 Then, the honing device 1 is configured such that the honing belt 101 attached to the honing table 1 is brought into contact with the surface of the honed material provided on the honing table. The grinding head 102 rotates with respect to the support member 103 with a line orthogonal to the honing table honing surface. Further, the honing station 102 hones the honed material by walking the honing 101 with a plurality of running rollers 104. Inside the honing table 102, a supply roll 106 to which a roller around which the honing belt 101 is wound is attached, and a winding reel 107 for winding the honing tape 101 pulled out from the supply reel 106, The honing belt carrying motor 108 provided in the honing head 102 rotates one of the winding reel 107 and the traveling roller 104, and the honing belt 1 〇1 can be pulled out from the supply reel 106, and The honing belt 101 is conveyed by the plurality of traveling rolls 1CM, and is passed through the winding roller 107 after passing through the contact roller 105 provided at the lower end of the honing 102. Further, the contact roller 105 provided at the lower end of the honing head 102 is disposed such that the axis of the contact roller 105 is orthogonal to the center of rotation of the honing head 102 and becomes horizontal to the honing table, and the honing table 101 is edged. The honing tape 101 is pressed against the honed material on the honing table by the contact roller 105 while walking. The honing head 102 is rotated by a honing head rotating motor 109 provided on the support member 103 around an axis extending in a direction orthogonal to the honing material setting surface of the honing table. As described above, the conventional honing device 100 is provided with the honing belt 101 in the honing belt carrying motor 108, and the grinding belt 1 〇1 is along the traveling roller 104. Walking, while the honing head 102 is opposite to the watch belt, the drive head winding phase is rotated by the y belt yoke 201000255, and the honing belt ιοί is contacted by the contact roller 105. The honed material on the honing table is used to automatically honing the surface of the honed material. However, in the honing apparatus 100 shown in Fig. 9 (a) and (b), although one honing belt 101 is driven by a plurality of running rollers 104, the honing head 102 is rotated. The honing, so once the honing head 102 rotates, the contact roller 105 disposed at the lower end of the honing head 102 rotates centering on the point at which the axis of the contact roller 105 intersects the center of rotation of the honing head 102 . That is, the center of the width direction of the honing belt 1 〇 1 is rotated as an axis. At this time, once the honing belt 1 〇 1 is contacted and the roller of the contact roller 105 is fully integrated, when the honing head 102 rotates, the honing belt 1 Ο 1 is pressed against the honed material by the contact roller 105. When the honing material is bent, large wrinkles are generated in the central portion in the width direction of the honing belt, and there is a problem that honing cannot be performed satisfactorily. Therefore, in the conventional honing apparatus, as shown in Fig. 9(b), the diameter of the roller which forms the center portion 11 of the contact roller 105 in the width direction is smaller than the diameter of the roller at both ends, and is at the width of the contact roller 105. The direction center portion 110 causes the honing belt 101 not to contact the roller surface. However, once the non-contact portion with the honing belt 101 is formed at the central portion 110 of the touch roll 105, since the central portion 110 in the width direction of the honing belt 101 cannot be pressed against the honed material, the honing belt 101 is The honing force of the center portion 110 in the width direction is weak and the uneven honing surface is defective. In particular, in the case of wafers that require high-precision surface finishing of the honed material, there is a problem that a uniform surface cannot be obtained once the contact pressure of the contact roller is uneven. Further, in the case where the wafer of the present invention is in the form of a disk and in the step of rotational honing, the bending of the honing tape cannot be sufficiently eliminated at the central portion of the contact roller, which causes a problem of breakage of the rotating wafer. On the other hand, in order to suppress the occurrence of the uneven honing surface, a honing device in which the honing tape is disposed on the right and left sides based on the rotation center of the honing table has been proposed (see Patent Document 6). (Patent Document 1) Japanese Patent Laid-Open Publication No. JP-A No. 2002-57129 (Patent Document 3) Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The honing device described in Patent Document 6 includes a pair of left and right lead-out rails and a winding reel, and a pair of honing belts are honed to the left and right at a position away from the center of rotation of the honing head. However, the honing device uses the same driving source for the rotation of the honing head and the walking structure of the honing belt, so that the rotation of the honing head and the degree of freedom of the control of the honing belt are impaired, and on the other hand, the device The composition becomes complicated. Since the honing belts are traveling in the same direction, one of the honing belts will generate stress in the winding direction by the stress generated by the rotation of the 硏-9- 201000255 grinding head and the other side The grinding belt generates stress in the opposite direction of the winding direction, so that the other honing belt which generates stress in the opposite direction of the winding direction may be slack and may cause unevenness of the honing surface. Therefore, the present invention has been developed in view of the above circumstances, and an object of the present invention is to provide a honing device and a cymbal that can obtain a smooth and uniform surface without damaging a honed material such as a rotating wafer. Grinding method. (Means for Solving the Problem) In order to solve the above problems, the present invention proposes a honing head provided with a walking honing belt, and pressing the honing belt against the honed material and the honing head a rotating support unit; and a honing device which is rotatably mounted with the workpiece rotating unit of the honed material, wherein the honing head has two groups: a honing belt; and a supply a supply reel of the honing belt; and a contact roller that causes the supplied honing belt to abut against the honed material; and a winding reel that winds the honing belt passing through the contact roller and is pressed The honing belt of the honed material is disposed symmetrically with respect to the rotation axis of the honing head and spaced apart by a predetermined distance, and is movable in opposite directions. Since the two sets of the honing belts that travel in the opposite directions are disposed symmetrically with respect to the rotation axis of the honing head by a predetermined distance, the bending of the honing belt at the position of the rotating shaft can be prevented. Further, by causing the two sets of honing belts to travel in a direction opposite to the direction of rotation of the honing head, the relaxation of the honing--10-201000255 belt can be prevented, and the cutting prevention of the honing belt can be provided. Honing device. Thus, it is possible to obtain a surface in which the honed finish surface is also uniform. Further, depending on the walking honing belt, since a new honing belt can be frequently supplied, there is no clogging problem of the honing belt, and the honing can be performed efficiently and stably. Preferably, the supply reel and the winding reel are connected to a drive motor that drives the supply reel and the winding reel and a drive transmission device that transmits the drive in order to be able to rotate synchronously. . It is a problem corresponding to the occurrence or interruption of slack in the honing belt. Further, the drive motor is disposed on one side of the rotation shaft of the honing head, and a weight balance member that balances the drive motor and the transmission device is disposed on the other side of the rotation shaft. By this, the surface of the honed material can be polished to form a more uniform surface. Further, unlike the driving device that performs the rotation of the honing head, since the driving motor for running the honing belt is provided, the rotation of the honing belt and the walking of the honing belt can be individually controlled, and can be performed corresponding to the use. Honing. Further, the present invention proposes a honing method using the above-described honing device, characterized in that two honing belts that travel in opposite directions are in contact with the contact roller, and are oriented toward the aforementioned honing The direction of rotation of the head travels in a direction opposite to the direction in which the honed member is honed. The occurrence of slack can be prevented during walking in the honing belt. Furthermore, the distance between the outer side of one of the two honing belts and the outer side of the other honing belt is set to be longer than the radius of the circular circular honing material of the thin plate, and is honed than the foregoing The length of the material is also small in length. According to this configuration, the honing surface of the honed material can be uniformly ground -11 - 201000255 and the formation of an unnecessary honing pattern can be suppressed. Further, in the present invention, the type of the honing belt, that is, the particle diameter of the honing particles of the honing belt, the rotational speed of the honing head, etc., can be appropriately changed, and the honing surface can be further cleaned. Further, although the honing belt is arranged in two sets symmetrically with respect to the rotational axis of the honing head, two or more sets may be arranged symmetrically with the rotational axis of the honing head, that is, at least two sets are arranged. (Effect of the Invention) According to the present invention, it is possible to provide a honing device which can suppress the occurrence of bending or slack of a honing belt, and which can be used to obtain a smooth and uniform surface without damaging the honing material such as a rotating wafer. Honing method. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. 1 is a front view showing a configuration of a main mechanism portion of a wafer plane honing device according to the present invention; FIG. 2 is a cross-sectional view of a honing head of FIG. 1; FIG. 3(a) is a second view; Figure AA cross-sectional view; Figure 3 (b) is a BB cross-sectional view of Figure 2; Figure 4 (a) is an explanatory diagram of the drive transmission path in the AA cross-section of Figure 2; Figure 4 (b) 2 is a diagram showing the drive transmission path in the CC section; Fig. 5(a) is a DD arrow view of Fig. 2; and Fig. 5(b) is an EE arrow view of Fig. 2. As shown in Fig. 1, the honing device 1 includes a honing head 4 equipped with a honing belt for honing walking, and a supporting unit 2 for supporting the honing head 4; -12- 201000255 and mounting The workpiece machine unit 3 of the honed material W of the object is honed. In the honing device 1, the upper housing 5 and the lower housing 6 projecting from the body (not shown) are arranged in parallel, and the upper housing 5 is provided with a honing head for supporting the honing belt. The support unit 2 of 4; the lower frame 6 is provided with a workpiece stage unit 3. Further, the support unit 2 is provided with a horizontal moving portion, a lifting portion, and a rotating portion of the honing head 4. The movement of the honing head 4 in the horizontal direction is performed by the positioning of the surface of the honing material by the LM guide 21, and the lifting portion and the rotating portion of the honing head 4 are disposed on the substrate of the LM guide 21. . Further, the honing head 4 is coupled to the rotating shaft 20 orthogonal to the upper casing 5, and is coupled to the upper rotary joint by a ball rotary spline 22 that can be raised and lowered and rotated (rotary Joint ) 28 is rotatably supported. The lifting of the honing head 4 is controlled by a pressing cylinder (for example, an air cylinder) 23 to control a rotating shaft coupled to the honing head 4 (an flange fixed to the honing head 4 and connected to the rotary joint 28). 20) for applying an appropriate load to the honed material W provided on the workpiece stage 31. In order to support the honing head 4 to be rotatable, the rotary joint 23 and the rotary shaft 20 are connected by a rotary joint 28. Further, the rotating shaft 20 is supported to be movable and rotated in the vertical direction by the ball rotating pin groove 22. Thereby, the positioning work of the front end of the honing head 4 and the surface of the workpiece can be performed. Then, a motor 24 for rotational driving of the honing head 4 is placed above the upper casing 5. The pulley 25 on the motor 24 side and the pulley 26 on the rotating shaft 20 side are coupled by a belt 27, and the rotary shaft 20 is rotated by the rotation of the motor 24, and the honing head 4 coupled to the spindle is rotated. . -13- 201000255 On the other hand, the lower frame 6 is provided with a workpiece; and the table drive motor 32. Then, the pulley 3 4 coupled to the workpiece table 3 1 and the pulley 35 on the side of the motor 3 2 can utilize the belt: whereby the workpiece table 31 can be rotated. Further, in the inside of the honing head 4, two sets of shovel which are described later are provided with independent honing belt running portions. Hereinafter, the honing head 4 of the honing head 4 of the present invention will be described with reference to the drawings. The honing head 4 is secured by the rotating shaft 20 and is defined by the axis Z of the rotating shaft of FIG. The two blocks of the walking system (the left side of the pulley 1 〇 a, the right side of the _ _ _, the honing belt ΤΙ, T2 side by side built in the honing belt can be walked by a plurality of walking rollers. On the left side of the pulley 1 〇a, Inside the right side block 1 〇b, a supply 6 2b of a roller around which the honing belts τ 1 and T2 are wound, and a winding roll for winding each of the supply reels 62a and 62b and T2 are wound. The cylinders 61a and 61b are then used as the honing belt conveyance drive motor running motor 48 to move one of the winding reel and the traveling roller to honing the belt ΤΙ and T2 from the supply reels 62a and 62b. Pulling the honing belt T1'T2 with a plurality of running rollers, and after winding the contact rollers 41a, 41b at the lower end of the grinding head, the windings 61a, 61b 〇 the left side pulley 10a and the right side pulley 1 Ob are rotationally symmetrical, and The honing belt running portions of the two groups are formed, and the flanges 3 3 3 6 of the machine table 3 1 are connected to each other to grind the belt, and The internal structure is as follows: the honing head maintains the width direction of the honing belt i 10b), and is mounted with: a reel 62a, and the honing belt is driven out by a portion of the honing belt provided on the side The hollow portion 19 is surrounded by the driving force of the plurality of gears and the skin traveling motor 48, and the hollow portion 19 is disposed on the winding reel axis Z to be the rotation axis circumference-14-201000255. The Ministry can make 硏ΤΙ and T2 walk. One of the winding portions has winding torque adjusting portions (e.g., (slip rings) 13a, 13b, and the other is a reel-receiving reel holders 14a, 14b by bearings. Further, one of the honing belt supply portions is provided with slide bearings 17a and 17b, and has honing belt torque adjusting portions 16a and 16b. In this way, the honing belt can be adjusted to maintain the tension and walk. The winding portion and the supply portion of the honing belt are rotatably supported by the inner side wall 1 2 a, 1 2 b and the outer side wall 1 1 lb, respectively. Further, the axes of rotation of the honing belt supply reels 62a, 62b and the honing belt windings 6 1 a, 6 1 b are set to be orthogonal to the honing head rotation axis. Then, the honing belt supply reels 62a and 62b and the honing belt windings 61a and 61b are also disposed on the rotating shaft away from the honing head 4 so that the two contact rollers 41a and 41b are located on the same line in the vertical direction. Diameter outside. Further, as shown in Figs. 3 and 4, the honing belt winding reel 61a and the inner end portion are provided with a honing belt winding shaft confirming pulley 50, and the belt 52 is supplied to the honing belt. The movable pulley 50 is coupled. The honing belt travel motor 48 drives and interposes the gear G and transmits it to the idle gear A '. The rotation is transmitted to the gear H, and the slid is rotated, and the rotation is transmitted to the winding shaft 52. The belt will be freely supplied with the slip ring, the reel, the Z reel with the center line Z 61b and the idler pulley pulley -15- 201000255 50, so that the honing belt reel 61a, 61b rotate. Further, the honing head 4 of the present embodiment is a honing belt running motor 48, and is provided by providing a traveling mechanism (a driving force transmitting member such as a gear and a belt) in the hollow portion 119 located at the center. The number of parts is reduced in size, and the supply reels 62a and 62b and the winding reels 61a and 61b are simultaneously rotatable. In order to obtain the weight balance when the honing head 4 required for uniform honing is rotated, and to obtain the honing belt running motor 48 or other transmission device (gear, belt, etc.) provided on the left side pulley 1 Ob The weight balance ' is set as a dummy member 49 as a weight balance member to the right side slider i 〇 b. Further, the contact rollers 41a, 41b provided at the lower end of the honing head 4 are designed such that the axes of the contact rollers 41a, 41b are orthogonal to the center of rotation of the honing head 4 and are parallel with respect to the workpiece table 31, and The honing material W is pressed against the workpiece table 31 by a fixed pressing force by the contact rollers 41a and 41b while the honing belt is twisted and T2 is moved. Then, the 'two contact rollers 41a, 41b are conveyed by the honing belt running motor 48 and a plurality of gears so that the honing belts τ ΐ and T 2 travel in opposite directions to each other, and the contact rollers 4 1 a, 4 are made. 1 b rotates around the axis Z. Therefore, in order to rotate the two contact rollers 4 1 a, 4 1 b individually in opposite directions, the respective pressing rollers 41a, 4lb can be adjusted by a plurality of gears, and the motor 48 and the plurality of walking motors can be adjusted by the honing belt. The gears make the directions of rotation opposite to each other. Hereinafter, the transmission from the honing belt running motor 48 to the contact roller by the honing belt running motor 48 and the transfer operation to the winding reel will be described with reference to Fig. 4 . As shown in Fig. 3(a), the contact roller 4 1 a of the left side pulley 1 〇a is transmitted from the gear G directly coupled to the honing belt running motor 48 to the contact roller by the idle gears B and D. The gear F1 is rotated, and the contact roller 41a is rotated. On the other hand, the contact roller 4 1 b of the right side pulley 1 Ob is transmitted from the gear G directly coupled to the same honing belt running motor 48 to the contact roller gear by the idle gears A, C, E. F2, and the contact roller 4 1 b is rotated. With these gear combinations, the contact rollers 41a, 41b are rotated in the reverse direction. At the same time, the rotational force transmitted from the gear G of the honing belt travel motor 48 to the idle gear A' and transmitted to the eliminating pulley 50 is transmitted to the winding pulley 51, by which the eliminating belt 52 is hung on the winding pulley 51. The winding pulley 51 is rotated, and the honing belt wound on the supply drum is wound while being wound by the contact roller 41a. Here, the winding reels 6ia, 61b are coupled to each other and rotated by the winding pulley 51. Further, the supply reels 62a and 62b are connected by a bearing 55 (see Fig. 2) for reversible rotation, and are configured to be freely rotatable. Next, the traveling path of the honing belt will be described with reference to Figs. 5(a) and 5(b). Figure 5 (a), (b) is a side view of the honing head; Figure 5 (a) shows the walking path of the honing belt of the left side pulley 1 〇a in the DD arrow view of Fig. 2; (b) The EE arrow view of Fig. 2 shows the walking path of the honing belt of the right side pulley l〇b. In Fig. 5(a), the honing belt T1 is fed from the supply reel 62a and passes through a plurality of rollers (71a, 72a, 73a, 75a and 76a), and from the reel -17-201000255 around the reel 61a. The lower side is wound in the direction of the arrow. On the other hand, the honing belt T2 is fed from the supply reel 62b, and is wound from the lower side of the winding reel 61b in the direction of the arrow by a plurality of rollers (7 lb, 72b, 73b, 75b). Thus, the honing belts T 1 and T2 can be rotated and wound in the same direction, that is, in the same direction as the winding rotation direction. Further, on the side faces of the contact rollers 41a, 4 1 b, pressing rollers 77a, 77b are provided in order to make the honing belt tense. As described above, in the present invention, the two contact rollers 41a, 41b are provided. The contact portion of the honing tapes T 1 and T2 which are brought into contact with the surface of the workpiece honing table 31 which is placed on the surface of the workpiece W (the honing table) 31 is located closer to the diameter than the rotation axis Z of the honing head 4 On the outer side, as shown in Fig. 2, the two contact rollers 41a, 41b constituting the contact portions of the honing belts T1, T2 which are brought into contact with the honed material are traversed by the rotation axis of the honing head 4. Close to the outer side in the diametrical direction, the two contact rollers 41a, 41b are supported symmetrically on the same axis with respect to the rotational axis Z of the honing head 4. Further, the contact rollers 41a, 41b are attached to the honing head 4 in order to rotate the honing head 4 at a predetermined position of the honed material in the opposite direction from the roller axis. These can be adjusted by a plurality of idlers. The honing method (honing or cleaning by the honing material) according to the above honing device is carried out as follows. First, a flat honed material is placed on the workpiece table 31 shown in Fig. 1, and is adsorbed and fixed. Next, as shown in Fig. 1 and Fig. 2, the horizontal moving device (Lm guide -18 - 201000255 piece 21) is driven, and the honing head 4 is horizontally moved to the appropriate position of the honed material by the lifting device. The honing tapes T and T2 attached to the honing head 4 are driven to contact the surface of the honed material with an appropriate pressure by the contact rolls 41a and 41b. Then, the honing belt running motor 48 is driven to rotate the contact rollers 41a and 41b and the honing belt winding reels 61a and 61b. Thereby, the new honing belt ΤΙ 'T2 is sequentially supplied to the contact rolls 41a and 41b, and then wound around the honing belt winding reel. Further, the drive motor 24 of the support unit 2 is driven, and the pulley 26 connected by the belt 27 is interposed to rotate the rotary shaft 20, whereby the honing head 4 is rotated. Such a rotary honing or cleaning can be accomplished by a new honing belt that is often supplied. Regarding the action of the present invention, the honing method of the present invention will be specifically described with reference to the drawings and examples and comparative examples. Fig. 6(a) is a schematic view showing the stress applied to the honing belt when a honing belt T is rotated as a center of rotation P; and Fig. 6(b) shows two honing belts T1, A schematic diagram of the stress applied to the honing belt when T2 is disposed on both sides of the rotation center P so as to rotate while traveling in the opposite direction. In Fig. 6 (a) and (b), the T system shows the honing belt, and the P system shows the center of rotation of the honing head. Arrow 81 indicates the direction of rotation of the honing head, arrows 82, 82a, 82b indicate the direction in which the honing belt is fed, and 83a, 83b indicate the direction of stress occurring at this time. In the conventional example of Fig. 6(a), the stresses 104a and 104b in the opposite direction are applied to a honing belt with respect to the center of rotation of the honing head, -19-201000255 P, with the center of rotation as the boundary. Therefore, bending or wrinkles occur in the honing belt. This stress sometimes causes the honing band to be cut. On the other hand, according to the honing method of the present invention shown in Fig. 6(b), since the honing tapes T1 and T2 are disposed outside with respect to the rotation center P, bending does not occur in the honing belt. Stress, so it will not concentrate stress in the center of rotation, and will not cause twisting or wrinkles in the honing belt. Further, since the honing belts T1 and T2 have opposite feeding directions of the honing belt, balanced stress is generated in the two honing belts, so that the honing head can be stably rotated. As a result, excellent honing of smoothness and flatness can be performed. Fig. 7 is a schematic perspective view of the honing belts ΤΙ and T2 which are pressed by the contact rollers 41a and 41b. In the supply reels 62a and 62b of the honing belts T1 and T2 and the winding reels 61a and 61b, a fixed tensile force is applied to the honing belts T and T2, respectively, and an abnormal tensile force is applied. When the time is slipped, it can be adjusted by the honing belt supply torque adjusting portions (slip rings) 16a and 16b and the honing belt winding adjusting portions (slip rings) 13a and 13b (refer to Fig. 2). ). In the adjustment, the stretching force of the honing belt winding adjusting portion (slip ring) 13a, 13b is made large by the honing belt and the winding of T2 without slackening. Therefore, as shown in Fig. 7, when the rotation of the contact rollers 41a and 41b in the rotation direction 81 of the honing head 4 (not shown) that rotates in the rotation axis P is applied to the winding direction, the tensile force can be applied to the winding direction. It inhibits the relaxation or wrinkles in the honing zone τ 1 and T2, and the result contributes to the formation of a uniform honing surface. Fig. 8 (a) and (b) show a preferred example of honing of a semiconductor wafer. -20- 201000255 8 (a) shows the positional relationship between the wafer W and the width of the honing belt (width of the honing area) when the diameter of the wafer W is large (for example, 300 φ); b) shows the positional relationship between the wafer W and the width of the honing belt (width of the honing area) when the diameter of the wafer W is small (for example, 2 0 0 φ ). Arrow 8 5 is the rotation direction of the wafer W, s is the rotation center of the wafer, P is the rotation center of the two sets of honing belts T1 and T2, and the arrow 8 1 is the rotation direction of the honing head (honing belt). In Fig. 8(a), the rotating end of the two honing belts (T1+T2) is arranged to be larger than the radius of the wafer with respect to the radius of the wafer, one end of which is located outside the center of rotation S of the wafer, The other end is exposed from the outside of the wafer. Further, as shown in Fig. 8(b), an example in which the radius of the wafer is small (e.g., 2 0 0 φ ) is shown. Specifically, if two honing belts with a width of 2.5 , are used, and a total of 7 吋 is used, the crystal circle for size (300 φ and 200 φ) can be used without changing the honing belt. In this case, the front surface of the wafer can be honed to a uniform shape without forming an unnecessary honing pattern locally. Moreover, it is possible to enter the 300φ and 200φ honing without changing the width of the two honing belts (contact light width). Further, although the direction of rotation of the wafer and the direction of rotation of the honing head are not specifically defined, the honing efficiency can be improved in the opposite directions. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing the configuration of a main mechanism of a wafer plane honing device of the present invention. -21 - 201000255 Fig. 2 is a cross-sectional view of the honing head of Fig. 1 . Fig. 3(a) is a cross-sectional view of Fig. 2, and Fig. 3(b) is a cross-sectional view taken along line B-B of Fig. 2. Fig. 4(a) is a diagram showing the drive transmission path in the a-A section of Fig. 2; Fig. 4(b) is an explanatory diagram of the drive transmission path in the c-C section of Fig. 2. Fig. 5(a) is a d_D arrow view of Fig. 2; Fig. 5(b) is an E-E arrow view of Fig. 2. Fig. 6(a) is a schematic view showing the stress applied to the honing belt when the honing belt τ is rotated as the center of rotation P; and Fig. 6(b) shows the two honing belts T 1 in the present invention. And T2 is a schematic diagram in which the stress applied to the honing belt when the two sides of the rotation center p are rotated while traveling in the opposite direction. Fig. 7 is a schematic perspective view of the honing belt which is pressed by the contact roller. Fig. 8 (a) and (b) are preferred examples of honing of semiconductor wafers. Fig. 9(a) is a front view of a conventional honing device; Fig. 9 (1>) is a sectional view thereof. [Main component symbol description] 1 : Honing device 2 : Support unit 3 : Work machine table unit 4 : Honing head -22 - 201000255 5 : Upper frame 6 : Lower frame 1 〇 a : Left side pulley 1 〇 b : Right side pulley 4 1 a, 4 1 b : contact rollers 61a, 61b: winding reels 62a, 62b: supply reel ΤΙ, T2: honing belt Z: rotation shaft -23-