TW200951197A - Removable processing film - Google Patents

Abstract

A removable processing film comprising a substrate film and an adhesive layer formed on one face of the substrate film. The adhesive layer comprises (A) an acrylic copolymer containing 40 to 80 mass% of butyl acrylate unit, 1 to 15 mass% of styrene unit, 1 to 30 mass% of methyl methacrylate unit, 1 to 30 mass % of methyl acrylate unit, 1 to 10 mass% of vinyl monomer unit having hydroxyl group and 0.1 to 1 mass% of vinyl monomer unit having carboxyl group and having a weight-average molecular weight of 300,000 to 1, 000,000 and a molecular distribution (Mw/Mn) of 3.0 or less and (B) an isocyanate closslinking agent. When adherend is a substrate sheet, the processing film can reduce contamination on the side of substrate sheet and can maintain adhesive strength with a sticky sheet applied to the released face after releasing sufficiently high and is applicable even when an adherend is a glass portion exposed to a temperature as high as about 260 DEG C.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a re-peelable processed film, and more particularly to a substrate sheet for use in a flexible wiring board for a multilayer printed wiring board, or to a metal material. Or an inorganic material other than the inorganic material such as a charge-coupled device or a glass portion of a complementary metal oxide semiconductor device, and a re-peelable processed film having a base film and an acryl-based adhesive layer provided on one surface thereof. © [Prior Art 4] The printed wiring board is a wiring board that forms a conductor circuit pattern required for connection between an electric appliance and an electronic component mounted on the surface of the insulating substrate or the surface thereof by printing or the like. Such a printed wiring board can be roughly classified into a hard printed wiring board and a flexible printed wiring board in terms of shape, and can be divided into a single layer or a plurality of layers or more. Among these printed wiring boards, the flexible printed wiring board is formed of a conductive circuit pattern of an insulating base sheet having flexibility, and is not suitable for a three-dimensional high-density structure in a narrow and complicated structure inside the electronic device. Or missing substrate. Such a flexible printed wiring board is one of the best electronic machine components in response to the demand for small size, light weight, high density, and high precision of electronic devices in recent years, and its demand is rapidly expanding. Because of the flexibility of the flexible printed wiring board, the plastic sheet as the insulating base sheet is made of, for example, a plastic sheet excellent in heat resistance and insulation such as a polyimide sheet or a polyphenylene sulfide sheet. The surface or surface of the substrate sheet and its interior are formed into a circuit pattern with a metal material such as copper. Circuit diagram The method of forming the method of 200951197 is known, except for the necessary portion of the copper foil which leaves only the copper area laminate, and the subtraction method for removing and removing the remaining portion by the etching treatment, there is an addition method or the like. This addition method is a method of forming a circuit pattern by plating only on a necessary portion of the substrate, and has a semi-additive method and a full additive method. The required performance of such a flexible printed wiring board is processed in addition to, for example, dimensional accuracy, low warpage, distortion, heat resistance, peel strength, bending strength, high volume resistivity, chemical resistance, heat bending strength, etc. Fitness is also extremely important.如此 In such a printed wiring board, in order to suppress solvent contamination, foreign matter intrusion, enthalpy generation, etc. in the circuit formation, electrical and electronic components, generally before the processing, prior to The re-peelable processed film is bonded to a base sheet for producing a flexible printed circuit board. The processed film is provided with a re-peelable adhesive layer on one surface of the base film, and is bonded to a base sheet for a flexible printed wiring board, and then subjected to various processes such as punching, solvent immersion, and hot pressing. The produced flexible printed A wiring board was peeled off. Therefore, it is important to have no releasability which does not cause floating or peeling during the processing, and which does not have residual glue after being peeled off (substrate sheet), and which does not cause curling of the object. Therefore, the present applicant has previously performed this treatment on a base sheet for producing a flexible printed wiring board, and found that slippage, lifting, peeling, and the like do not occur during the process of producing a flexible printed wiring board, and the surface of the wiring board can be effectively suppressed. A re-peelable processed film which does not leave a residue after being peeled off, and which does not cause curling of the object after the peeling, has been proposed (see, for example, Patent Document 1) . 200951197 In recent years, with the high performance and high speed of electronic equipment, there is a demand for high-density packaging and high-density wiring in printed wiring boards. In order to meet this demand, multilayer printed wiring boards have attracted much attention. Further, recently, with the miniaturization of electric appliances and electronic equipment, multilayer printed wiring boards have become increasingly thinner and denser, and multilayer printed wiring boards using a subsequent sheet (thermosetting resin sheet) have been increasingly used. In the production of such a multilayer printed wiring board, for example, a flexible printed wiring board having electrical and electronic components and a flexible printed wiring board are laminated with an adhesive sheet such as an epoxy resin sheet. Specifically, it is generally used to form a circuit pattern on a substrate sheet to which a re-peelable processed film is attached, and to further comprise an electric or electronic component, and a cover sheet (polyimide sheet or the like) is provided thereon. In one unit, the re-peelable processed film is peeled off, and the exposed base sheet is opposed to the coated sheet of the other unit, and an adhesive sheet such as an epoxy resin sheet is interposed therebetween, and the unit is superposed. In this method, the cell and the cell must be high enough. In recent years, solid-state imaging devices such as a charge coupled device (CCD) and a complementary metal oxide semiconductor device (CMOS) have been mounted on digital cameras, video cameras, and camera phones. When these CCD and CMOS products are produced, a re-peelable processed film for protection is usually attached to the glass portion for receiving light. The glass portion may be exposed to a high temperature (for example, at about 260 ° C) by reflow processing or the like. Therefore, the re-peelable processed film used for the purpose may have excellent heat resistance against the temperature, for example, for the object to be treated. Residual glue and substrate film have less deformation requirements. [Problem to be Solved by the Invention] The re-peelable processed film described in Patent Document 1 is as described above with a base sheet as a base material. When the body is attached, it does not cause slippage, floating, peeling, etc., and it can effectively suppress solvent contamination, foreign matter intrusion, sputum formation, etc. on the surface of the wiring board, and it is not easy to be left behind by the body after peeling. Glue, which is not easy to cause excellent characteristics such as being curled by the body, but when used in a wiring board unit for a multilayer printed wiring board, when the re-peelable processed film is peeled off, the substrate sheet of the body is subjected to the side of the substrate. The contamination is insufficient for the adhesion of the adhesive sheet such as the epoxy resin sheet or the like to the laminate unit and the substrate, and the improvement is expected. Further, it is excellent in heat resistance for use in a glass portion for CCD or CMOS, and is, for example, a re-peelable film which can withstand reflow processing at 260 ° C for several minutes. The present invention has been made under such circumstances, and an object thereof is to provide a re-peelable reinforced film having a base film and an acryl-based adhesive layer provided on one surface thereof, which is used for a multilayer printed wiring board. In the case of the base sheet for the production of the flexible printed wiring board, when the re-peelable processed film is peeled off, the contamination on the side of the substrate sheet is suppressed, and the adhesive sheet such as an epoxy resin sheet or the like When the re-peelable processed film of the material sheet is high enough, or when it is used for the glass part of CCD or CMOS, it is exposed to a temperature of about 260 ° C, and the deformation of the residual residue and the substrate film is small. A re-peelable processed film excellent in heat resistance. (Means for Solving the Problems) The inventors of the present invention have repeatedly conducted intensive investigations to find out the results, and have used the film of 200951197 for the production of a base sheet for a flexible printed wiring board for a multilayer printed wiring board. At the time of stripping, the contaminant that migrates to the side of the object is the oligomer component in the acryl-based adhesive layer. The present inventors have found that in order to reduce the content of the oligomer component in the acryl-based adhesive layer, it has been found that the acrylic-based adhesive is controlled when the acryl-based adhesive constituting the adhesive layer is produced. The molecular weight distribution of the propylene-based copolymer of the resin component is less than or equal to a certain size, and preferably, the content of the residual monomer is within a certain range, thereby reducing the content of the oligomer component in the adhesive, and the non-fluorenone The release material is used as a protective adhesive layer to the release agent layer before use, and a re-peelable processed film which is more suitable for bonding the base sheet for the production of the flexible printed wiring board can be obtained. In addition, when a glass portion of a CCD or a CMOS is used for bonding, a re-peelable processed film having excellent heat resistance can be obtained by using, as a base film, a storage elastic modulus change rate prescribed by a specific formula. The present invention has been completed based on this finding. That is, the present invention provides a φ [1] re-peelable processed film having a base film and a re-peelable processed film of an adhesive layer provided on one side of the base film, which is characterized by the adhesive. The layer system contains (A) 40 to 80% by mass of butyl acrylate unit, 1 to 15% by mass of styrene unit, 1 to 30% by mass of methyl methacrylate unit, and 1 to 30% by mass of methyl acrylate unit, and 1 to 10% by mass of a vinyl monomer unit of a hydroxyl group, an acrylate-based copolymer having a carboxyl group-containing vinyl monomer unit of 0.1 to 1% by mass, and (B) an isocyanate crosslinking agent, and the acrylate system The weight average molecular weight Mw of the copolymer is 300,000 to 1,000,000, and the molecular weight distribution (weight average molecular weight Mw / number average molecular weight 200951197 Μη) is formed by an adhesive of 3.0 or less; [2] Re-peelable processed film of [1] Wherein the content of the residual monomer in the (Α) acrylate-based copolymer accounts for 5 to 20% by mass of the (Α) acrylate-based copolymer; [3] a re-peelable processed film 'separate layer such as [1] Or [2] re-peelable processed film with non-矽a release material of the release agent layer, such that the adhesive layer of the re-peelable processed film is formed with respect to the surface of the release agent layer of the release material; [4] a re-peelable processed film such as [3], wherein [5] The re-peelable processed film according to any one of [1] to [4] wherein the adhesive further contains a toluene diisocyanate crosslinking agent and a xylene diisocyanate system. [6] The re-peelable processed film of any one of [1] to [5], wherein a plastic sheet for a flexible printed wiring board for a multilayer printed wiring board is used as a Φ [7] The re-peelable processed film of [6], wherein (a) according to JIS Ζ 0237, the retention of force on the plastic sheet used for the flexible printed wiring board, at temperature 40 ° C is more than 70,000 seconds, and at 70,000 seconds, the slip is less than 0.1 mm; (b) According to the JIS Z 023 7 measurement method, the plastic sheet used for the flexible printed wiring board is adhered to the body. Force, 0.01~0.5N/25mm before hot pressing; (c) Bonded to plastic sheet for flexible printed wiring board After being subjected to heat treatment at a temperature of 180 ° C and a pressure of 4.3 N/mm 2 for 60 minutes, the adhesion of 200951197 is based on the measurement method of JIS Z 0237, which is 2.0 N/25 mm or less, and (d) The adhesive layer has a gel fraction of 95% or more; [8] A re-peelable processed film such as [6] or [7], wherein the plastic sheet of the flexible printed wiring board is made of polyimide film or polyphenylene sulfide. [9] The re-peelable processed film according to any one of [6] to [8], wherein the base film is a polyethylene terephthalate film; [1]] [1] [4] The re-peelable processed film according to any one of [4], wherein the metal I material or an inorganic material other than the same is used as the object; [11] The re-peelable processed film according to [10], wherein the system is charge-coupled The re-peelable processed film of any one of [1] to [4], [10] or [11], wherein the adhesive is xylene The isocyanate-based crosslinking agent is used as an isocyanate-based crosslinking agent, and the re-peelable processed film according to any one of [1] to [4], [10] to [12], wherein the substrate film is 23 ° C Storage elastic modulus of φ G'23,260 ° C storage elastic modulus G'26. When the storage modulus of the following formula changes the rate X by 85% or less, X(%) = [(G'23 - G'26〇) / G'23] x100 and [14] such as [1]~[ The re-peelable processed film according to any one of [10] to [13] wherein the base film is a polyimide film. (Effect of the Invention) According to the present invention, there is provided a re-peelable processed film having a base film and an acryl-based adhesive layer provided on one side thereof, which is used in a multilayer printed wiring board for -10 200951197 In the case of the base sheet for the production of a flexible printed wiring board, when the re-peelable processed film is peeled off, contamination on the side of the substrate sheet can be suppressed, and the adhesive sheet such as an epoxy sheet and the substrate sheet can be prevented. Then, the force is reduced to a re-peelable processed film which can be suppressed. And (2) for metal materials or other inorganic materials, such as CCD, CMOS glass, etc., exposed to a temperature of about 260 ° C, for the deformation of the residual glue, the substrate film A re-peelable processed film which is still excellent in heat resistance. [Embodiment] The best reworkable film of the present invention (hereinafter referred to as "processed film") is a re-peelable processed film having a base film 'and an adhesive layer provided on one side thereof. 'It is characterized in that the adhesive layer is an acrylate-based copolymer containing (A) a specific monomer unit shown below at a specific ratio, and (B) an isocyanate-based crosslinking agent' and the weight of the acrylate-based copolymer The average molecular weight Mw is 300,000 to 1,000,000, and the molecular weight distribution (weight average molecular weight Mw / number average molecular weight Μη) is 3.0 or less. The re-peelable processed film of the present invention having the same adhesive layer can be classified into a re-peelable processed film (hereinafter referred to as "processed film A") and a re-peelable processed film b (hereinafter referred to as " Processed film B"). The processed film A is used as a processed film of a flexible printed wiring board in which a flexible printed wiring sheet of a multilayer printed wiring board is formed into a circuit pattern, and the processed film B is made of a metal material or Other inorganic materials, such as CCD, CMOS glass, etc., are used as processed films of the object. -11- 200951197 [Substrate film for processed film A] The base film of the re-peelable processed film A of the present invention is essential for a film having excellent heat resistance, specifically, a polyethylene terephthalate film, Polycarbonate film, amorphous polyolefin film, aromatic polyamide film, polyethylene naphthalate film, polyphenylene sulfide film, and aromatic polyfluorene film, polyether quinone film, polyarylate film , polyetheretherketone film, various liquid crystal polymer films and other super engineering plastic films, etc., which are excellent in balance of mechanical properties, electrical insulation, barrier properties, heat resistance, drug resistance, economy, etc. A film of ethylene phthalate is suitable. The thickness of the base film is not particularly limited 'usually 16 to 200 / zm, and the range of 25 to 100 μm is more preferable. [Substrate film for processing film B] The substrate film for processing film B is a metal material or an inorganic material other than the substrate material, and has a higher heat resistance than the substrate film for processed film A. For example, when the processed film B is used for the glass portion of a CCD or a CMOS, it may be exposed to a high temperature of about 26 TC due to reflow processing or the like. Therefore, it has excellent heat resistance against this temperature (for the residual adhesive of the object) The requirements for the change of the base film are small. The metal materials suitable for processing the film B are, for example, gold, uranium, silver, copper 'iron, aluminum or alloys thereof, semiconductor metals for wafers, etc. The inorganic material other than the metal material is, for example, a glass plate, a ceramic plate, etc. The base film for processing the film B is used, and the storage elastic modulus at 23 ° C is G, and the storage elastic modulus of 23, 260 〇 C is When g, 26, a film having a storage elastic modulus change rate of the following formula of 85% or less is preferable.

X(%)=[(G^S-G,26〇)/G,23]XlOO such a substrate film is, for example, a polyimide film, an aromatic polyamine thin film -12-200951197 film, etc. An imine film is particularly suitable. However, the storage elastic modulus 〇'23 and the storage elastic modulus g'26. , measured by the following method. The base film was attached to a dynamic viscoelasticity measuring apparatus [manufactured by TA Instruments, trade name DMA-Q800] at a measurement length (clamp pitch) of 20 mm, at a frequency of 1 Hz, an amplitude of 20 /zm, and a temperature increase rate of 5 ° C / min. Under the conditions, the storage elastic modulus G' of the temperature range of 15 to 300 ° C was measured, and the storage elastic modulus G'23 at 23 ° C and the storage elastic modulus G' 26 at 260 ° C were obtained. . The thickness of the base film for the processed film B is not particularly limited, and is usually 16 to 200 / / m, preferably 25 to 100 / / m. The film for processing A and the film for B are at least on the side where the adhesive layer is provided, and the adhesion to the adhesive layer is improved. If necessary, surface treatment can be carried out by an oxidation method or a roughening method. It can also be applied as a primer. The oxidation method is, for example, a corona discharge treatment, a plasma treatment, a chromic acid treatment (wet), a flame treatment, a hot air treatment, an ozone/ultraviolet irradiation treatment, etc., and the embossing method is, for example, a sand blast method or a solvent treatment method. These surface treatment φ methods are appropriately selected depending on the type of the base film, and generally, the corona discharge treatment method is preferable in terms of effect and workability. [Adhesive layer for processing film A and B] The re-peelable processed films A and B of the present invention are provided on the adhesive film layer of one side of the base film, containing (A) at least a butyl acrylate unit, and styrene. a unit, a methyl methacrylate unit, a methyl acrylate unit, a hydroxyl group-containing vinyl monomer unit, an acrylate-based copolymer of a carboxyl group-containing vinyl monomer unit, and (B) an isocyanate crosslinking agent-based adhesive form. ((A) Acrylate Copolymer) -13- 200951197 Used in the adhesive of the present invention, in the acrylate copolymer of the component (A), the methyl methacrylate unit and the styrene unit improve the cohesive force and the glass transfer The temperature of the processed film A has an effect of suppressing the slippage and the adhesion of the soft printed wiring board after the hot pressing. Further, the methyl acrylate unit has a function of making the polymerization stable and increasing the molecular weight in the production of the acrylate copolymer. In the acrylate-based copolymer, a hydroxyl group-containing vinyl monomer unit and a carboxyl group-containing vinyl monomer unit are introduced to impart crosslinkability to the subsequent copolymerization reaction of the acrylate copolymer. Functional group © (hydroxyl, carboxyl). The monomer forming the hydroxyl group-containing vinyl monomer unit is, for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, (A) A hydroxyalkyl (meth) acrylate such as 2-hydroxybutyl acrylate, 3-hydroxybutyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate. These may be used alone or in combination of two or more. Among them, 2-hydroxyethyl acrylate and 2-hydroxyethyl methacrylate are suitable ❹, and monomers forming the carboxyl group-containing vinyl monomer unit are, for example, acrylic acid, methacrylic acid, crotonic acid, and cis. An ethylenically unsaturated carboxylic acid such as butenedioic acid, itaconic acid or citraconic acid. These may be used alone or in combination of two or more. Among these, methacrylic acid and acrylic acid are suitable. In the present invention, the acrylate-based copolymer is introduced into the hydroxyl group-containing vinyl monomer unit, and the carboxylic acid-containing vinyl monomer unit is excellent in reactivity with the acrylate copolymer and the crosslinking agent. . In the resin component of the adhesive agent, the content of the 'acrylic acid butyl ester unit is 40.0% by mass or more as described later', and the bonding process is 14-200951197. The film A is used in the production of a flexible printed wiring board. The material sheet, for example, when hot pressed, is unlikely to slip between the substrate sheet and the processed film. The content ratio of each unit in the acrylate-based copolymer is 40 to 80% by mass based on the properties of the adhesive, 1 to 15% by mass of the styrene unit, and 1 to 30% by mass of the methyl methacrylate unit. %, the methyl acrylate unit is 1 to 30% by mass, the hydroxyl group-containing vinyl monomer unit is 1 to 10% by mass, and the carboxyl group-containing vinyl monomer unit is 0.1 to 1% by mass, and the butyl acrylate unit is 50 to 65 % by mass. 2 to 10% by mass of styrene unit, 3 to 20% by mass of methyl methacrylate unit, 5 to 20% by mass of methyl acrylate unit, 2 to 7% by mass of hydroxyl group-containing monomer unit, and carboxyl group-containing The vinyl monomer unit is preferably 0.1 to 0.5% by mass. Further, in the acrylate-based copolymer, if necessary, other monomers copolymerizable with the monomer may be used as a copolymerization component. The other monomer components are, for example, hydroxyethyl (meth)acrylate, propyl (meth)acrylate, butyl methacrylate, amyl (meth)acrylate, hexyl (meth)acrylate, (methyl) Cyclohexyl acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth) oxime, decyl (meth) acrylate, dodecyl (meth) acrylate, myristyl (meth) acrylate a (meth) acrylate having an alkyl group having 2 to 20 carbon atoms, such as butyl acrylate or stearyl methacrylate; and an ester moiety other than methyl (meth) acrylate; Vinyl esters such as vinyl acetate and vinyl propionate; olefins such as ethylene, propylene and isobutylene; halogenated olefins such as vinyl chloride and dichloroethylene; butadiene, isopyrene and chlorinated diene monomers; a nitrile monomer such as a nitrile or a methacrylonitrile; an acrylamide such as acrylamide, N-methyl acrylamide or N,N-dimethyl acrylamide; or α-methyl styrene. These can be used alone or in combination of -15- 200951197 in combination of two or more. In the present invention, the copolymerization form of the acrylate-based copolymer is not particularly limited, and any of random, block, and graft copolymers may be used. Further, the molecular weight is a weight average molecular weight Mw of 300,000 to 1,000,000. The molecular weight distribution (weight average molecular weight Mw / number average molecular weight Mn) is 3. 〇 or less. The weight average molecular weight Mw is in the range of 300,000 to 1,000,000, and the adhesive can be used to exhibit good adhesion. Further, when the molecular weight distribution Mw/Mn is 3.0 or less, the weight average molecular weight is 1, and the low ruthenium content of about 30,000 to 30,000 is low, which is possible for the purpose of the invention. The preferred molecular weight distribution Mw/Mn is 2.8 or less. Further, the weight average molecular weight Mw and the number average molecular weight Μη are converted into polystyrene by a gel permeation chromatography (GPC) method, and the present invention is determined according to the following conditions unless otherwise stated. GPC device: high-speed GPC device [Tosoh Corporation, trade name HLC-8120GPC] Pipe column: high-speed pipe column [Tosoh Corporation, trade name TSK guard column Φ Hxl-H, TSKGelGMHxL, TSKGel GMHxl, TSKGel G2000Hxl] is connected to the device for measurement in this order. Dissolution solvent: tetrahydrofuran polymer concentration: 10 mg / ml temperature: 40 ° c flow rate: 1.0 ml / min detector: UV-visible detector (detector wavelength; 254 nm) and micro-i difference refractometer Tosoh (share) system: : However, the monomer component is excluded. -16- 200951197 In the acryl-based adhesive, the resin component acrylate copolymer is usually produced by using (meth) acrylate, a vinyl monomer having a functional group having active hydrogen, and other orders if necessary. After the first stage radical polymerization is carried out in the presence of a radical polymerization initiator and a suitable solvent to a monomer consumption of about 40%, in order to remove residual unreacted monomers as much as possible, a second-stage radical polymerization is further employed. 2-stage polymerization method. However, it has been found by the inventors of the present invention that when such a two-stage polymerization method is employed, a plurality of pre-formed oligomers are formed in the second-stage polymerization, and the oligomer is in the form of a re-peeling film. When the body base sheet is peeled off, it migrates to the object side, and the adhesive force of the adhesive film such as an epoxy resin film and the adherend is lowered. Therefore, the present inventors have further found that the amount of residual polymerizable to the unreacted monomer in the first stage can be about 5 to 20% by mass of the acrylate-based copolymer in the resulting adhesive, preferably. When the reaction is carried out at a temperature of 5 to 15% by mass, the first-stage polymerization method in which the reaction is stopped can reduce the formation of oligomers. Thereby, the weight average molecular weight Mw of the produced acrylate-based copolymer can be successfully controlled in the range of 300,000 to 1,000,000, and the molecular weight distribution Mw/Μη Φ is 3.0 or less. It is understood that the residual unreacted monomer contained in the adhesive is volatilized during heating and drying treatment at the time of forming the adhesive layer, and does not substantially remain in the adhesive layer. ((Β) Isocyanate-based crosslinking agent) In the present invention, the crosslinking agent of the adhesive is used as an essential component with an isocyanate crosslinking agent. Examples of the isocyanate crosslinking agent include aromatic polyisocyanates such as toluene diisocyanate, diphenylmethane diisocyanate and xylene diisocyanate, and aliphatic polyisocyanates such as hexamethylene diisocyanate. Isocyanate-based, hydrogenated diphenylmethane diisocyanate, etc. -17-200951197 alicyclic polyisocyanate, and the like, and the biuret, isocyanurate, and ethylene glycol, propylene glycol, new a reaction product adduct of a low molecular weight active hydrogen-containing compound such as pentanediol, trimethylolpropane or castor oil. Among these isocyanate-based crosslinking agents, the processed film A is excellent in adhesion, adhesion between the substrate and the adhesive, less residual rubber, and moderate adhesion after hot pressing, and toluene diisocyanate is used. Both a crosslinking agent and a xylene diisocyanate crosslinking agent are preferred. In this case, the amount thereof is usually selected to be 100 parts by mass based on 100 parts by mass of the acrylate copolymer, and the total amount of toluene diisocyanate and xylene diisocyanate is 0.5 to 30 parts by mass, preferably 1.0 to 1. 20 parts by mass, in order to obtain an adhesive layer having a later-described property, and the processed film B is preferably a xylene diisocyanate from the viewpoint of heat resistance. The amount thereof is usually 0.5 to 30 parts by mass, preferably 1.0 to 20 parts by mass, per 100 parts by mass of the acrylate-based copolymer. The adhesive may not be used in the range of the object of the present invention, and may be appropriately added with various additives such as an antioxidant, an ultraviolet absorber, a light stabilizer, a softener, a tanning agent, and a cross-linking to promote the hydrazine in the acryl-based adhesive. Agents, etc. However, although the adhesion-imparting agent can be used, it is not preferable because the adhesion is increased. [Properties of Re-peelable Processed Film A] The re-peelable processed film A of the present invention formed using the adhesive preferably has the properties shown below. First, the holding force of the base sheet for the production of the flexible printed wiring board is usually 70,000 seconds or more, and at the time of 70,000 seconds, substantially no slip occurs. If the holding force is less than 70,000 seconds, the processed film is bonded to the substrate sheet to be pressed, punched, immersed in a solvent, hot pressed, etc. -18-200951197. The process between the processed film and the object is The slippage occurs. However, the retention force is measured by the method shown below. In addition, "substantially not visible" slip occurs when the slip is less than 0.1 mm at 70,000 seconds. (Retention force) According to JIS Z 0237, the processed film sticking portion of the test piece for the holding force measurement tester made of SUS The polyimide film which is used as a base sheet for the production of a flexible printed wiring board was next used as a test board. Next, the processed film was cut into a test piece having a width of 25 mm and a length of 150 mm. At the end of the test plate, the adhesive layer at one end of the test piece was brought into contact with a surface of 25 mm x 25 mm, and pressed back and forth 5 times with a 2 kg roller. After 15 minutes, it was placed in a creep tester at 40 ° C for 15 minutes. Apply a vertical downward 9.8 07N load and measure the amount of slippage and slippage at the time of the drop or 70,000 seconds. Next, the adhesion force for the base sheet (the object to be coated) for the production of a flexible printed wiring board is preferably 0.01 to 0.5 N/25 mm before the hot pressing, and the temperature is 180 ° C and the pressure is 4.3 N/mm 2 . Next, after hot pressing for 60 minutes, it is preferably 2.0 N/25 mm 〇 or less. When the adhesive force before the hot pressing is in the above range, the processed film is bonded to the base sheet for the production of the flexible printed wiring board, and the mechanical operation such as punching and immersion in a solvent before hot pressing has sufficient adhesion. The slippage between the processed film and the object to be treated is less likely to occur, and the processed film is easily peeled off, and the occurrence of residual glue after peeling and curling of the object can be suppressed. The adhesive force before hot pressing is preferably 0.03 to 0.4 N/25 mm. In addition, when the adhesive force after the hot pressing is 2.ON/2 5 mm or less, the processed film is bonded to the base sheet for the production of the printed wiring board, and the processed film is relatively easily peeled off after the hot pressing operation. It inhibits the occurrence of residual glue and curl of the object after peeling. Further, the hot pressing operation of -19-200951197 has a sufficient adhesive force to suppress the occurrence of slippage between the processed film and the object, and the lower limit of the adhesive force after hot pressing is about 0.08 N/25 mm. Preferably, the adhesive force after hot pressing is 0.12 to 1.0 N/25 mm. However, the adhesion force before and after hot pressing is measured by the method shown below. (Adhesive force before hot pressing); TIS Z 0237, a processed film adhering portion of a test piece for a test plate for measuring adhesion of SUS, which is used as a base sheet for the production of a flexible printed wiring board. The imide sheet was formed to have a width of 120 mm and a length of 150 mm. Next, it was a test plate. The processed film was also cut into test pieces having a width of 25 mm and a length of 250 mm. The adhesive layer at one end of the test piece was attached to the test plate so that the bonding area was 25 mm in width and about 90 mm in length, and was pressed back and forth once with a 2 kg roller. 24 hours after the bonding, the adhesion at the peeling angle of 180 degrees and the peeling speed of 300 mm/min when the test piece was peeled off was measured. Except for 15% of each of the measurement start region and the end region, the average enthalpy of 70% at the center of the figure is the adhesion before hot pressing. (Adhesive force after hot pressing) 〇 Prepared to cut into a substrate sheet (polyimide sheet) for the production of flexible printed wiring boards with a width of 120 mm and a length of 150 mm, and cut the processed film into a width of 10 mm. The length of 2 500 mm is the test piece. At the adhesive layer at one end of the test piece, the substrate sheet was bonded so that the bonding area was up to a width of 100 mmx and the length was about 90 mm, and the pressure was applied to the test piece at a temperature of 180 ° C to apply a pressure of 4.3 N/mm 2 . minute. Then, the sheet to which the hot-pressed test piece and the base sheet were bonded was cut into a width of 25 mm and a length of 250 mm, and the base sheet side was placed on a test plate for measuring the adhesion force made of SUS, and measured according to JIS Z 0237. Peeling angle 180 degrees, peeling speed 300mm/min peeling -20- 200951197 Adhesion force from the test piece. The average enthalpy of 70% in the center of the figure was measured by the hot pressing after 15% of each of the start region and the end region. Further, the adhesive layer of the re-peelable processed films A and B of the present invention has a gel fraction of usually 95% or more. When the gel fraction is less than 95%, the adhesive layer of the film A is bonded to the base sheet for the production of the printed wiring board, and after various operations are performed, the residual film is easily peeled off due to the peeling of the processed film. The pollution of the body, in addition, the film is prone to slip during hot pressing and causes a problem of reduced circuit printing accuracy. The preferred gel fraction is 96% © above. However, the gel fraction was measured by the following method. (Method for measuring gel fraction) The adhesive is applied to a release film of a release film having a thickness of 25/m of a polyethylene terephthalate film and an anthrone resin as a release agent, and the present invention is produced. After peeling the film, the adhesive was peeled off from the peeling film (50 mm x 100 mm) after the conditions were crosslinked. Next, on a 200-mesh metal net of 100×130 mm size, two pieces of the cross-linking adhesive (total mass Ag) were wrapped in a metal mesh, and set in a Soxhlet extraction apparatus in acetic acid. The vinegar was refluxed for 16 hours. Next, after the extraction treatment, the agent remaining on the metal mesh was dried at 100 ° C for 24 hours, and after being wetted for 3 hours or more under the atmosphere of 23 ° C and 50% RH, the mass of the adhesive was measured (B g The gel fraction was calculated from the gel fraction (%) = (B/A) xlOO of the following formula. [Removable Material for Processed Films A and B] The adhesive layer of the processed films A and B can be laminated to form a release material. The material for separation is, for example, a paper substrate such as a cellophane, a coated paper, or a coated paper, and the laminated material 9 is coated with a thermoplastic resin such as a binder to remove the adhesive, such as B--21-200951197. Laminated paper, or polyester film such as polyethylene terephthalate, polybutylene terephthalate or polyethylene naphthalate, polyolefin film such as polypropylene or polyethylene, coated with olefin A rubber-based elastomer such as a resin, an isoprene-based resin or a butadiene-based resin, or a release agent such as a long-chain alkyl-based resin, an alkyd-based resin, an anthrone-based resin, or a fluorine-based resin. Further, these release agents are directly formed into a sheet shape or the like. In particular, when the processed film A of the present invention is used in a base sheet for producing a flexible printed wiring board, the use of an anthrone-based release agent slightly migrates from the release agent layer to the adhesive layer, and the anthrone component may adhere to the base. Sheets, causing pollution. Therefore, when the processed film A of the present invention is used for the production of a flexible printed wiring board, it is preferred to use a non-fluorenone-based release agent. Among the above-mentioned release agents, a polypropylene resin having a small amount of olefin-based resin which has a small amount of component migration and a high strength is preferable. The thickness of the release agent layer is about 0.01 to 100 μm. Further, the thickness of the release material is not particularly limited and is usually about 20 to 150 μm. [Preparation of Re-peelable Processed Films A and B] The re-peelable processed films A and B of the present invention can be directly coated on the G-plane of one of the base sheets, and the adhesives according to the present invention are applied at 100 to 13 0 ° C. The adhesive layer is formed by heating and drying for about 1 to 5 minutes on the left and right sides, and a release material is formed on the adhesive layer. Further, an adhesive may be applied to the release surface of the release material, and the adhesive layer may be formed by heating and drying as described above, and then bonded to one surface of the base film. Considering the adhesion of the adhesive layer to the substrate film, the former method is suitable. Further, in the production operation, the drying treatment after the application of the adhesive is preferably carried out sufficiently. When the drying is insufficient, the occurrence of slippage and an increase in residual solvent and residual monomers are caused after bonding to the object. Further, when the drying is insufficient, the adhesive layer of the film -22-200951197 is easily slipped between the adhesive sheet of the film A and the base sheet for producing a printed wiring board, and the adhesive force is greatly increased after the hot pressing, and the printed wiring is easily peeled off. The curling of the substrate sheet for sheet production and the occurrence of residual glue occur. The adhesive layer of the re-peelable processed films A and B of the present invention has a thickness of usually 5 to 60/zm and preferably about 5 to 30/zm. The re-peelable processed film A of the present invention is used as a processed film for producing a flexible printed wiring board for a multilayer printed wiring board. When the base sheet for soft printed wiring board production of the multilayer printed wiring board is used in the re-peelable processed film A of the present invention, when the re-peelable processed film is peeled off, it is placed on the side of the substrate sheet. When the contamination is suppressed, the adhesion between the adhesive sheet such as the epoxy resin sheet and the substrate sheet can be suppressed, and a multilayer printed wiring board having good quality can be produced. The type of the base sheet of the flexible printed wiring board to which the re-peelable processed film A of the present invention is applied is not particularly limited, and the flexible printed wiring board usually uses a heat-resistant plastic sheet such as polyimide or polyphenylene sulfide. Further, the re-peelable processed film B of the present invention is suitably used as a metal material Ο or an inorganic material other than the inorganic material such as a CCD or a CMOS glass portion. At this time, although it is exposed to a high temperature of about 260 ° C, the residual of the glass portion of the object can be suppressed, and the deformation of the base film is small. EXAMPLES Next, the present invention will be described in more detail by way of examples, but the present invention is by no means limited to these examples. The properties of the processed film produced in each case were evaluated by the following methods. (1) Next force -23- 200951197 A base sheet (polyimine sheet) for making a flexible printed wiring board which is cut into a size of 22 cm x 22 cm is used as a test board (received body), and is cut into a size of 20 cm x 20 cm. The adhesive layer of the processed film was bonded without sandwiching the air bubbles, and the film was peeled off after hot pressing at a temperature of 180 ° C and a pressure of 4.3 N/mm 2 for 1 hour. The processed film is peeled between the surface and the new substrate sheet (polyimide sheet) used for the production of printed wiring boards, and then the sheet is attached (Pyralux LF0100 [made by DuPont Co., Ltd., registered trademark Pyralux, propylene]醯 modified epoxy-based sheet], width 20 mm, length 150 mm), heat-pressed for 30 minutes under conditions of a temperature of 180 ° C and a pressure of 4.3 N/mm 2 , and then the substrate sheet of the object was placed in SUS. For the adhesion test, the adhesion of the polyimide film to another polyimide film was measured in accordance with JIS Z 0237 at a peeling angle of 180 degrees and a peeling speed of 300 mm/min. Then the force is qualified to be 30N/20mm or more. (2) Sliding after hot pressing to cut a substrate sheet (polyimine sheet) for making a flexible printed wiring board into a test board (bedding) of 22 cm x 22 cm, which will be cut into a size of 20 cm x 20 cm. The adhesive layer of the processed film is bonded without sandwiching the air bubbles, and a through hole having a diameter of 6 mm is opened at four turns. After hot pressing at a temperature of 180 ° C and a pressure of 4.3 N/mm 2 for 60 minutes, the slip of the processed film and the object at the through hole of the four turns was measured, and the average enthalpy was slipped. (3) The adhesion between the adhesive layer and the substrate film is in accordance with JIS K 5 600-5-6, and the adhesive layer of the processed film is cut into a 1 mm square by the rotary cutter, and the adhesive tape (CELLOTAPE [ Nichiban company, registered trademark]) After pressing, the adhesive-24-200951197 tape is removed at an angle of about 60° for 0.5 seconds to 1 sec., and the number of residual films in the 〇〇 grid is processed. The adhesion test between the substrate film and the adhesive layer. The adhesion is evaluated according to the following criteria. 90/100 or more. :5 80/100~Unsold 90/100; 4 70/100 ~ not up to 80/1 00; 3 60/100~not up to 70/100 : 2 not up to 60/100 : ! β ( 4) Residue Evaluation Test-1 A substrate sheet (polyimine sheet) for making a flexible printed wiring board which is cut into a size of 22 cm x 22 cm is used as a test sheet (bedding), and is cut into a size of 20 cm x 20 cm. The adhesive layer of the film is bonded without being sandwiched with air bubbles at a temperature of 180 ° C and a pressure of 4, 3 N/mm 2 for 60 minutes. The film is peeled off and the surface of the test plate is FT-IR (Fourier transform infrared absorption). Spectral analysis, ATR method) The IR measurement was carried out by the presence or absence of the absorption peak from the adhesive to detect the presence or absence of residual glue, and those without residual glue were evaluated as sputum, and those with residual glue were referred to as X. (5) Residual rubber evaluation test-2 A 7 mm x 15 cm 2 mm float glass plate was used as a test piece (in-situ), and the adhesive layer cut into a 3 cm x 5 cm-sized processed film was attached without sandwiching bubbles. IR reflow with a maximum temperature of 260 °C and a heating time of 3 minutes (reflow oven: phase mold WL-15-20DNX type). Then, after standing at room temperature for 1 hour, the processed film was peeled off, and the surface of the object was observed by a digital microscope to examine the presence or absence of residual glue. Residual gums were evaluated according to the following criteria. Residue ratio in lcm2 -25- 200951197 Less than 5% : 〇 5%~Unreached 30% : △

30% or more: X (6) Residual anthrone is cut into a 22cm x 22cm substrate sheet (polyimine sheet) for making a flexible printed wiring board as a test board (bedding), which will be cut into 20cm x 20cm The adhesive layer of the processed film of the size is bonded without sandwiching the air bubbles, and after hot pressing for 1 hour at a temperature of 180 ° C and a pressure of 4.3 N/mm 2 , the film is peeled off. The surface of the test plate was subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS) under the following conditions. Measuring device: ARTUKAFAI Quantera SXM X Line source: AIK α (1 486.6 eV) Injection angle: 45 degrees Measurement elements: bismuth (Si), carbon (C) and nitrogen (N) and Si amount in Si/(Si + Multiply C + N) by 100, expressed as "atomic %". When the amount of Si is detected, the fluorenone has migrated. © (7) Determination of weight average molecular weight and number average molecular weight (GPC) The adhesive obtained in each example was dissolved in tetrahydrofuran (polymer concentration: 10 mg/ml) and determined by gel permeation chromatography (GPC). The weight average molecular weight and the number average molecular weight in terms of standard polystyrene. The measurement system uses a GPC device [high-speed GPC device HLC-8120GPC, manufactured by Tosoh Co., Ltd.], and sequentially connects the high-speed column TSK guard column HxL-H, TSKGel GMHxl, TSKGel GMHxl, TSKGel G2000Hxl (all of which are Dongcao) )) is measured in the device. The column temperature is 4CTC, the infusion rate is 1.0 ml/min, and the detector uses UV-visible detector (detector wavelength; -26- 200951197 2 54 nm) and differential refractometer (both toss) The β molecular weight distribution is a ratio (Mw/Mn) of a weight average molecular weight (Mw) to a number average molecular weight (Mn) measured by a GPC method. However, the monomer component excludes hydrazine. (8) Storage elastic modulus change rate The storage elastic modulus G, 23 & 26 (TC storage elastic modulus G'26 of TC) was measured by the following method. From the formula X (%) = [(G' 2 3 — G ' 2 6 0 ) / G ' 2 3 ] X 1 0 〇 Determine the storage elastic modulus change rate X. ® &lt; G ' 2 3 and G ' 2 6 D Determination > The measurement length (clamp pitch) was measured by a dynamic viscoelasticity measuring apparatus [manufactured by TA Instruments, trade name DMA-Q800] at a frequency of 1 Hz, an amplitude of 20 am, and a temperature increase rate of 5 ° C /min. The storage elastic modulus G' of the temperature range of 15 to 300 ° C, the storage elastic modulus G'23 of 23 ° C, the storage elastic modulus G'26 of 260 ° C. Also, the retention of the adhesive layer, The adhesion and gel fraction before and after hot pressing are determined by the method described in the specification. © Example 1 A reaction apparatus equipped with a stirrer, a reflux condenser, a dropping funnel, a nitrogen introduction tube, and a thermometer was used. 61.0 parts by mass of butyl acrylate (BA), 18.0 parts by mass of methyl methacrylate (MM A ), 3.5 parts by mass of styrene (St), acrylic acid 12.0 parts by mass of ester (MA), 5.0 parts by mass of 2-hydroxyethyl methacrylate (HEM A ), 0.15 parts by mass of acrylic acid (A Ac ), 0.01 parts by mass of azobisisobutyronitrile (AIBN) as a polymerization initiator And adding toluene as a solvent, and solution polymerization under a nitrogen atmosphere to produce an acrylate-based copolymer having a solid content of 0.0% by mass, a weight average molecular weight of about 450,000, and a molecular weight distribution (Mw/Mn) of 2.60-27-200951197. The monomer content is 10.0% by mass of the acrylate-based copolymer by the following measurement method. <Measurement of Residual Monomer Content> The residual monomer content is quantitatively measured by a gas chromatography method and is calculated. 100 parts by mass of a copolymer and a toluene diisocyanate-based (TDI) crosslinking agent [manufactured by Toyo Ink Co., Ltd., trade name: OLIBINE BHS8515 (solid content: 37.5 mass%)] 8.0 parts by mass and xylene diisocyanate (XDI) A cross-linking agent [manufactured by Takeda Pharmaceutical Co., Ltd., trade name: D-110N (solid content: 75 mass%)] 3.0 parts by mass, toluene 30.0 parts by mass, and ethyl acetate 1.0 parts by mass to prepare an adhesive. Coated with a polyethylene terephthalate (PET) film (manufactured by YUNITIKA Co., Ltd., trade name ENPLETTA-50) with a thickness of 50#m, and the coating amount after drying is up to l〇g/m2 (thickness) After 10 minutes of TC drying, a release material having an anthrone-based release agent layer (manufactured by Oji Paper Co., Ltd., trade name: 40RL-01Z) was laminated thereon to prepare a processed film, and the properties were evaluated. The test plate (on the body) was coated with a polyimide film. Further, the residual gum was evaluated by Residue Evaluation Test-1. The results are shown in Table 1. Example 2 An acrylate-based copolymer having a solid content of 40.0% by mass, a weight average molecular weight of about 460,000, a molecular weight distribution (Mw/Mn) of 2.70, and a residual monomer of 12.0% by mass, as in Example 1, was changed as in Table 1. . The processed film was produced as in Example 1 below, and the properties were evaluated. The results are shown in Table 1. Comparative Example 1 -28- 200951197 In Example 1, the weight average molecular weight of the C-storage vinegar-based copolymer obtained by performing the solution polymerization after 'repolymerization-time other than the production of the acrylate copolymer as in Example 1 470,000, molecular weight distribution (Mw / Mn) 3.29. Further, the residual monomer content was measured in the same manner as in Example 1 and was 3.4% by mass based on the propionic acid ester copolymer. The processed film was produced as in Example 1 below, and the properties were evaluated. The results are shown in Table 1.

-29- 200951197 Table 1 Example 1 Example 2 Comparative Example 3 Monomer (parts by mass) BA 61.0 63.0 61.0 MMA 18.0 15.0 18.0 St 3.5 5.0 3.5 ΜΑ 12.0 12.0 12.0 HEMA 5.0 5.0 5.0 AAc 0.15 0.15 0.15 Crosslinking agent (quality份) BHS8515 8.0 8.0 8.0 D-110N 3.0 3.0 3.0 Acrylate Copolymer Mw 456.46 million Mwan/Mn 2.60 2.70 3.29 Acrylate # monomer content (residue of ruthenium polymer 10.0 12.0 3.4 Adhesion ( N/25mm) 0.06 0.08 before hot pressing 0.22 0.20 after hot pressing 0.31 0.42 Slip after hot pressing Um) 0 0 0 Adhesion to substrate film 5 5 5 Residue evaluation test Μ 〇〇〇 Retention ( Second) 70,000 &lt; 70,000 &lt; 70,000 &lt; slip amount at 70,000 seconds without slip (&lt;0.1 mm) no slip (&lt;0.1 mm) no slip (&lt;0.1 mm) gel fraction ( %) 97.4 97.6 95.7 Next force (N/20 mm) 40.0 38.0 2.0 -30- 200951197 It is understood from Table 1 that the processed films of Examples 1 and 2 have a very high adhesion force in the subsequent tests as compared with Comparative Example 1. Example 3 60.0 parts by mass of butyl acrylate (BA), 18.0 parts by mass of methyl methacrylate (MM A ), and benzene were used in a reaction apparatus equipped with a stirrer, a reflux condenser, a dropping funnel, a nitrogen introduction tube, and a thermometer. 3.5 parts by mass of ethylene (St), 13.0 parts by mass of methyl acrylate (MA), 5.0 parts by mass of 2-hydroxyethyl methacrylate (HEM A ), 0.15 parts by mass of acrylic acid (AAC) using azobisisobutyronitrile ( AIBN) 0.01 parts by mass of a polymerization initiator, adding toluene as a solvent, and solution polymerization under a nitrogen atmosphere to produce a solid content of 40.0% by mass, a weight average molecular weight of about 470,000, and a molecular weight distribution (Mw/Mn) of 2.4 acrylate copolymerization. Things. Further, the residual monomer content was measured in the same manner as in Example 1 and was 11.0% by mass of the acrylate-based copolymer. 100 parts by mass of the acrylate-based copolymer solution (solid content: 40.0% by mass), and a toluene diisocyanate-based (TDI-based) crosslinking agent [manufactured by Toyo Oil® Ink Co., Ltd., trade name: OLIBINE BHS8515C, solid content, 37.5 mass% ] 8.0 parts by mass of a xylene diisocyanate-based (XDI-based) crosslinking agent [manufactured by Takeda Pharmaceutical Co., Ltd., trade name: D-110N (solid content: 75 mass%)] 3.0 parts by mass, and ethyl acetate 40.0 parts by mass , modulation of the adhesive. Secondly, it is directly coated on a polyethylene terephthalate (PET) film with a thickness of 50#m [丫111^11'11^(share) system, the product name is ugly, 1^1' Ding into -5 0] , after drying, the coating amount can reach l〇g/m2 (thickness '10 /zm), after drying at 120 °C for 1 -31-200951197 minutes, the release resin formed by laminating polypropylene resin on it [Oji Paper Co., Ltd. The product name is ALFAN PP40SD-001], and the film is processed and evaluated. However, the residual gum was evaluated by Residue Evaluation Test-1. The results are shown in Table 2. Example 4 As in Example 2, except that the monomer composition was changed, as in Example 3, an acrylate copolymer having a solid content of 40.0% by mass, a weight average molecular weight of about 500,000, a molecular weight distribution (Mw/Mn) of 2.7, and a residual monomer of 8.3% by mass was produced. Things. The processed film was produced as in Example 3, and the properties were evaluated. The results are shown in Table 2. Example 5 The release material was changed to a polyethylene terephthalate film having a thickness of 50 g m which was subjected to release treatment with an alkyd resin on one side, as in Example 3, manufactured by LINTEC Co., Ltd., trade name PET50 AL-5. The processed film was fabricated and evaluated for characteristics. The results are shown in Table 2. Example 6 A processed film was produced as in Example 3 except that a release material (manufactured by LINTEC Co., Ltd., trade name SP-PET 38 1 1) using an anthrone-based release agent layer was used. The results are shown in Table 2: Comparative Example 2 In Example 3, an acrylate-based copolymer was produced as in Example 3, except that polymerization was carried out again after solution polymerization. The obtained acrylate-based copolymer had a weight average molecular weight of about 550,000 and a molecular weight distribution (Mw/Mn) of 3.4. Further, the residual monomer content was measured in the same manner as in Example 1 and was 3.5% by mass of the acrylate* copolymer. -32-.200951197 Hereinafter, a processed film was produced as in Example 3, and various characteristics were evaluated. The results are shown in Table 2.

-33- 200951197

Ζ0 Comparative Example 2 〇g Ο 〇6 ν〇CO ο cn &lt;'&lt; ο ν〇1 &lt; Ο Ο ΟΟ cn cn 55 million 〇CO cn ALFAN PP40 SD-001 (N Ο oo 〇〇〇V ο ο No slip (&lt;0.1mm) CS vo σ\ ο Example 6 〇g ο 〇6 UO CO Ο CO 1 &lt; ο ι〇Ό « Η Ο ο οό Ο CO 47 million 〇 03 〇rH 1-H SP -PET3811 s ο 沄oo 〇〇ι-Η V ο ο 卜 no slip (&lt;0.1mm) ι 1 〇6 o ο CN CO Example 5 ο s ο οό CO ο CO 1 * ο wi νο ι 4 Ο ο οό ο cn 470,000 〇Ο r»H ι-Η PET50AL-5 s ci soo w-1 〇ο ο V ο ο ο No slip (&lt; 0.1mm) 〇6 ON Ο ο Example 4 ο vo ο Νο ο Ο CO 赘_Η ο 1 &lt; Ο ο οό Ο CO 500,000 〇 03 m od ALFAN PP40 SD-001 S ooo ΙΟ 〇ο ο V ο ο No slip (&lt;0.1mm) s; ο Example 3 og ο οό CO ο cn 1 &lt; ο ι 1 Ο ο οό ο CO 47 million 〇 03 Ο »-Η ι-Η ALFAN PP40 SD-001 go c5 o un 〇ο c5 V ο ο No slip (<0.1 Mm) 1 i 00 ON ο &lt; OQ ΜΜΑ &lt; ΗΕΜΑ AAC BHS8515 D-110N 1 Mw/Mn flame • Ν ^ _ _ stripping material hot pressing After hot pressing / - NB N m TlvV» Adhesive evaluation test with substrate film - 1 / - Ν 秒 (seconds) Slip amount at 70,000 seconds Gel fraction (%) Next test (N/20mm) Monomer (parts by mass) Crosslinking agent (parts by mass) Acrylate copolymer *π\ Flavor _ 趦 Listening 1E钿 Adhesion (N/25mm) 111 Μ Garden holding power—inch ε, 200951197 by As shown in Table 2, the processed films of Examples 3 to 6 had higher adhesion in the subsequent tests than Comparative Example 2. Further, Examples 3 to 5 were carried out using a release material having a non-nonanone-based release agent layer. For example, a release material having an anthrone-based release agent layer was used, so that the adhesive strength of the subsequent test was not as good as in Examples 3 to 5. Example 7 An acrylic acid-ester copolymer solution was produced as in Example 3. 1 part by mass of the acrylate-based copolymer solution (solid content: 40.0% by mass), and a xylene diisocyanate-based (XDI-based) crosslinking agent [manufactured by Takeda Pharmaceutical Co., Ltd., trade name D-110N ( Solid content: 75 mass%)] 9.0 parts by mass and ethyl acetate 40.0 parts by mass to prepare an adhesive. Secondly, it is directly coated on a surface of 50 μm thick and stored in a polyimide film with a change rate of elastic modulus of 40% [manufactured by Toray Dupont Co., Ltd., registered trademark ΚΑΡΤΟΝ], and the coating amount can reach l〇g/ after drying. M2, after drying at 120 ° C for 1 minute, a release material made of a polypropylene resin (manufactured by Oji Paper Co., Ltd., trade name ALFAN PP40SD-001) was formed thereon, and a processed film was produced, and the evaluation was carried out using a residual rubber evaluation test-2. Residue. The results are shown in Table 3. Example 8 An acrylate-based copolymer was produced as in Example 1. 1 part by mass of the acrylate-based copolymer solution (solid content: 40.0% by mass), and a xylene diisocyanate-based (XDI-based) crosslinking agent [manufactured by Takeda Pharmaceutical Co., Ltd., trade name D-11 0N (solid) The component was 75 mass%)] 7.0 parts by mass, and 40.0 parts by mass of ethyl acetate, and an adhesive was prepared. Secondly, it is directly coated on a surface of 50 μm thick and stored in a polyimine film (manufactured by Toray Dupont Co., Ltd., registered trademark ΚΑΡΤΟΝ) with an elastic modulus change rate of -35-200951197 40%. After drying at 120 ° C for 1 minute, the laminate was laminated with a polypropylene resin (manufactured by Oji Paper Co., Ltd., trade name ALFAN PP40SD-001) to prepare a processed film, which was evaluated by residual glue. Test-2 evaluated the residual glue. The results are shown in Table 3. Comparative Example 3 A processed film was produced as in Example 7 except that the adhesive solution prepared in Comparative Example 1 was used, and the residual adhesive was evaluated by Residue Evaluation Test-2. The result is shown in the table ©3

-36- 200951197 Table 3 Example 7 Example 8 Comparative Example 3 Part of the valence of the monomer BA 60.0 61.0 61.0 MMA 18.0 18.0 18.0 St 3.5 3.5 3.5 ΜΑ 13.0 12.0 12.0 HEMA 5.0 5.0 5.0 AAC 0.15 0.15 0.15 Crosslinker (quality份) BHS8515 0.0 0.0 8.0 D-110N 9.0 7.0 3.0 Acrylate copolymer Mw 474,45,700,000 Mw/Mn 2.40 2.60 3.29 Residual monomer content of acrylate copolymer (% by mass) 11.0 10.0 3.4 Release material ALFAN PP40 SD-001 ALFAN PP40 SD-001 ALFAN PP40 SD-001 Adhesion to substrate film 5 5 5 Residue test - 2 〇〇X Residual fluorenone (atomic %) 0.0 0.0 0.0 Gel fraction (% 97.8 98.3 95.7 -37- 200951197 (Industrial Applicability) The re-peelable film of the present invention is used for a base sheet for producing a flexible printed wiring board for a multilayer printed wiring board. When the X film is peeled off, the contamination on the side of the substrate sheet is suppressed, and the adhesion between the adhesive sheet such as the epoxy resin sheet and the substrate sheet can be suppressed. Further, when a glass portion such as a CCD or a CMOS is used as a substrate, it is exposed to a temperature of about 260 ° C, and the deformation of the residue and the substrate sheet of the object is small, and the heat resistance is excellent. © [Simple description] drrr 0 [Main component symbol description] Ατι*· None. -38-

Claims (1)

200951197 VII. Patent application scope: 1. A re-peelable processed film, which is a re-peelable processed film having a substrate film and an adhesive layer provided on one side of the substrate film, characterized in that the adhesive layer is The use of (A) has a butyl acrylate unit of 40 to 80% by mass, a styrene unit of 1 to 15% by mass, a methyl methacrylate unit of 1 to 30% by mass, a methyl acrylate unit of 1 to 30% by mass, and a hydroxyl group. 1 to 10% by mass of the vinyl monomer unit, 0.1 to 1% by mass of the acrylate-based copolymer having a carboxyl group-containing vinyl monomer unit, and (B) an iso-Q cyanate-based crosslinking agent, and the acrylate system The weight average molecular weight Mw of the copolymer is 300,000 to 1,000,000, and the molecular weight distribution (weight average molecular weight Mw / number average molecular weight Μη) is an adhesive formation of 3.0 or less. 2. Re-peelable processed film according to claim 1 The content of the residual monomer in the (Α) acrylate-based copolymer accounts for 5 to 20% by mass of the (Α) acrylate-based copolymer. 3. A re-peelable processed film, which is a re-peelable processed film having a non-fluorenone-based release agent layer as disclosed in claim 1 or 2, such that the re-peelable processed film is The adhesive layer is formed to face the surface of the release agent layer of the release material. 4. A re-peelable processed film according to claim 3, wherein the non-ketone-based release agent layer is a polypropylene resin. 5. The re-peelable processed film according to claim 1 or 2, wherein the adhesive further comprises a toluene diisocyanate crosslinking agent and a xylene diisocyanate crosslinking agent as an isocyanate crosslinking agent. 6. The re-peelable processed film according to claim 1 or 2, wherein the plastic sheet-39-200951197 for a flexible printed wiring board for a multilayer printed wiring board is used as an object. 7. The re-peelable processed film according to item 6 of the patent application, wherein (a) according to the measurement method of JIS Z 0237, the holding force of the plastic sheet for the flexible printed wiring board, that is, the temperature at 40 ° The C system is 70,000 seconds or more, and the slip is less than 0.1 mm at 70,000 seconds. (b) According to the measurement method of nS Z 0237, the adhesive force for the plastic sheet used for the flexible printed wiring board is the heat of the body. 0.01 to 0.5 N/25 mm before pressing. (c) After being applied to a plastic sheet (attached body) used for a flexible printed wiring board, hot pressing is performed at a temperature of 180 ° C and a pressure of 4.3 N/mm 2 . The adhesion after minute is 2.0 N/25 mm or less according to the measurement method of JIS Z 0237, and (d) the gel fraction of the adhesive layer is 95% or more. 8. The re-peelable processed film according to item 6 of the patent application, wherein the plastic sheet of the flexible printed wiring board is obtained by using a polyimide film or a polyphenylene sulfide sheet. ©9. Patent Application No. 6 A re-peelable processed film, wherein the substrate film is a polyethylene terephthalate film. 10. The re-peelable processed film of claim 2 or 2, wherein the metal material or an inorganic material other than the same is used as the object. 11. The re-peelable processed film according to claim 10, wherein the glass portion of the system charge-coupled device or the complementary metal oxide film semiconductor device is used. 12. The re-peelable processed film according to claim 1 or 2, wherein the adhesive is obtained by using a xylene diisocyanate crosslinking agent as an isocyanate crosslinking agent. The re-peelable processed film of the invention of claim 1, wherein the adhesive is obtained by using a xylene diisocyanate crosslinking agent as an isocyanate crosslinking agent. 14. The re-peelable processed film according to claim 1 or 2, wherein the storage film has a storage elastic modulus of G'23, 26 at 23 ° C (the storage elastic modulus of TC is G, 26 () When the storage elastic modulus change rate of the following formula is X 55% or less, X ( /6 ) — [(G'23 _ G '2 6 .) / G '2 3 ] X 1 0 0 . 0 15 The re-peelable processed film according to claim 10, wherein the storage film has a storage elastic modulus of 23, 260 at 23 ° C. (: the storage elastic modulus is G'26. The storage elastic modulus change rate of the above formula is 85% or less, X ( /0 ) — [ ( G * 2 3 — G ' 2 6 .) / G ' 2 3 ] X 1 0 〇. The re-peelable processed film of the first or second aspect of the invention, wherein the base film is a polyimide film. 17. The re-peelable processed film according to the scope of the patent application, wherein the base Q film is polyimine. Film -41 - 200951197 IV. Designated representative map: (1) The representative representative of the case is: No. (2) The symbol of the symbol of the representative figure is simple: ΒΕ 。 、 、 、 、 、 、 、 、 、 、 Please disclosed invention features most indicative of the formula: