200950915 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種加工裝置及加工方法，更詳細地說，係關於 一種雷射加工裝置及雷射加工方法。 【先前技術】 傳統加工機，如車床、磨床、鑽孔機等，其工作範圍普遍僅能 達到約250微米之精密度，對於200微米以下的工件加工，必需 另覓他法。此外，機械加工製程中殘留於工件上之機械應力則是 ❹ 機械加工時另一個必須考量的因素。 近幾年來，雷射相關技術逐漸發展成熟，將雷射應用於工件加 工曰益普遍。依不同工件之材質種類，可選用適當雷射進行加工。 經常使用於加工製程中的雷射有三種，分別為二氧化碳雷射、固 態雷射、及準分子雷射（Excimer Laser )，這三種雷射加工所能 達成之精密度與品質分別是準分子雷射優於固態雷射，固態雷射 又優於二氧化碳雷射；另一方面，其三者之加工速度與所需成本 φ 則是顛倒過來，二氧化碳雷射優於固態雷射，固態雷射優於準分 子雷射。因此，可視工件之實際加工需求與特性，選擇適當的雷 射加工種類。 此外，雷射加工所需之雷射輸出功率，一般在50毫瓦特到2瓦 特之間，脈衝能量從幾十微焦耳到幾毫焦耳不等。雷射加工之縱 向深度與橫向之精準度分別與雷射的穩定度和雷射加工設備中光 學聚焦系統之設計有關。相較於傳統機械刀具之加工方式，雷射 加工的優點在於不但可進行精密度高的加工作業外，另一方面， 5 200950915 ^可解決前述機械加卫應力殘留的問題。然而，由於雷射加工乃 2雷射光束脈衝打點的方式進行，因此雷射光之強度往往會過 ::中而於：件上產生熱應力殘留之影響，甚至造成工件本身的 卜尤其是’在需要多維度加工的場合，傳統的雷射加工很難 做到深度的控制，當工件 干乏厚度車乂溥時，更可能因而造成非預期 之穿孔’麵產品品質。因此’傳統的雷射加卫方式往往被限 制在例如工件形狀切割等之二維加工環境。 二 另_田射加工的常見問題是由於雷射加工設備之設計 田而使雷射加工過程所產生大量之卫件移除量，造成粉塵過 ，並對加工設備產生污染，對於精密的加工零組件而言，會造 成運作問題。 、、^所述，針對前述f知雷射加卫過程中常見之熱應力殘留' 粉塵污染以及加卫深度不易控制等問題研發—種新的雷射加工裝 置與應用該裝置之雷射加工方法，便為此技術領域亟需解 標。 【發明内容】 本發明之—目的在於提供—種用以加工—工件之雷射加工裝 ^ ’此雷射加工裝置可於卫件上產生由至少—封閉軌跡所形成之 加工路控，藉以減少因加工而產生的工件移除量，減少因粉塵 對加工設備所造成的汙染。 為達成前述目的，本發明之雷射加工裝置包含：一雷射光源、 鏡片〜'成、—致動裝置、及一工件平台。雷射光源適以提供— 第光線，第一光線入射鏡片總成後射出一第二光線，此第二光 200950915 · 線相對於第一光線具有一角度偏移量。致動裝置適以旋轉鏡片總 成，俾利第二光線於工件上形成一封閉執跡。工件平台適以置放 工件，且工作平台適可移動，俾利第二光線於工件上產生一加工 路徑，其中加工路徑係由為至少一封閉軌跡所組成。 本發明之另一目的在於提供一種雷射加工方法，用以加工一工 件，此雷射加工方法可精準控制加工路徑之寬度或深度，以符合 多維度加工之需求。 為達成前述目的，本發明之雷射加工方法包含：提供一第一光 〇 線，入射一鏡片總成以形成一第二光線自鏡片總成射出，第二光 線相對於第一光線具有一角度偏移量。旋轉鏡片總成，俾利第二 光線於工件上形成一封閉軌跡。此雷射加工方法更包含：提供一 工件平台以置放工件並移動該工作平台，俾利第二光線於工件上 產生一加工路徑，其中加工路徑係由至少一圈狀封閉軌跡所組成。 在參閱圖式及隨後描述之實施方式後，該技術領域具有通常知 識者便可瞭解本發明之其他目的，以及本發明之技術手段及實施 ❹ 態樣。 【實施方式】 以下將透過數個實施例來解釋本發明内容，請參閱第1圖，其 顯示本發明一實施例中一雷射加工裝置1之主要元件，其他與本 發明技術特徵較無關聯之其他元件茲略而未示。 雷射加工裝置1係用以加工一工件10，其包含一雷射光源11、 一鏡片總成12、致動裝置13及一工件平台14。具體而言，此實 施例之雷射光源11可使用波長介於193奈米至1064奈米間之雷 7 200950915 射光’例如一固態紫外光雷射光源，但不僅限於此，例如雷射光 源π亦可使用固態紅外光雷射光源。雷射光源11適以提供一第 一光線15，此第一光線15將入射鏡片總成12。請合併參閱第2A 圖’圖中所示者係為鏡片總成12之内部示意圖。鏡片總成I]包 含至少一鏡片17，在此實施例中該鏡片為一透鏡。該至少一鏡片 17具有一入射面18與一出射面i9,該出射面19為一傾斜面，當 第一光線15由該傾斜面射出時產生第二光線16。特別地，本發明 之特徵之一在於藉由傾斜面的角度變化，可使此第二光線16相對 於第一光線15具有一角度偏移量0，換言之’第一光線15通過 鏡片〜成12後將於原光線的行進方向上產生偏折而調變為第二光 線16。於較佳實施態樣中，可配合實際角度偏移量的需求而調整 出射面19的傾斜角度，以產生適合的角度偏移量0。 請參閱第2B與2C圖，於實際應用時亦可增加鏡片總成12之鏡 片數量，使其包含複數鏡片17依序排列，以漸進的方式產生適當 的角度偏移量。詳言之，各鏡片17皆具有一入射面Μ與一出: 面19’且各出射面19為一傾斜面’俾利第一光線15由各出射面 射出時分別產生—角度偏移分量，該角度偏移量$等於各該角 度偏移分量w、02、...、知".之總和。於—實施财，可適當 鏡片17之出射面19之傾斜角度，可使第二光線16平行 第-光線15。此外，藉由調整鏡片總成12中相鄰鏡片η間 L，亦可調整因該角度偏移量所造成偏移原第—光線Μ 订進方向的—光線偏移距離D。 本發明之另一特徵之一在於致 置3適足以轉動鏡片總成 200950915 . · 12，使射出鏡片總成12之第二雷射光16，於工件10上產生一加 工軌跡。特別地，此加工軌跡係一封閉軌跡20，此封壁執跡20 之中心部分25乃為雷射光線未經過之處，如第3A圖所示。詳言 之，由於鏡片總成12之偏折效應，首先使得射出鏡片總成12之 第二雷射光16將相對第一光線15之原先行進方向產生角度偏移 量0，此際具有一角度偏移量之第二雷射光16將再因致動裝置13 之驅動，而以第一光線15之原先行進方向為軸心而轉動，進而在 工件10上產生封閉軌跡20。於較佳實施例中本發明雷射加工裝置 1於工件10上所產生之封閉執跡20係為一圏狀執跡。 請參閱第4圖所示，此係本發明雷射加工裝置1中致動裝置13 之具體實施例，其包含一馬達21與一傳動裝置22,本實施例中之 傳動裝置22包含一皮帶輪23以及一皮帶24,分別連接至馬達21 與鏡片總成12。具體而言，馬達21係提供轉動鏡片總成12所需 的動力源，透過傳動裝置22中之皮帶24與連接至鏡片總成12之 皮帶輪23，鏡片總成12得以旋轉，俾第二光線16於工件10上形 ❷ 成如第3A圖所示之封閉軌跡20。特別說明的是，在其他實施例 中傳動裝置22可以具有至少一齒輪之一齒輪裝置（未顯示）用以 取代皮帶輪23、皮帶24，但並不以此為限。 於較佳實施例中，本發明之雷射加工裝置1更包含一工件平台 14。請參閱第5圖，其顯示本發明工件平台14之一示意圖。此工 作平台14適以置放等待加工之工件10。特別地是，此工作平台 14亦可配合加工需要而移動，尤其是，於一平面上移動，俾利第 二光線16於工件平台14上之工件10表面上產生一加工路徑26, 9 200950915 , 其中此加工路徑26係由至少一前述封閉執跡20所組成，如第5 圖所示的F型加工路徑26。詳細而言，鏡片總成20之旋轉配合工 件平台14之平面位移，將使工件10表面上產生由前述複數個圈 狀軌跡20所構成的一預定的加工路徑26，請參閱第3B圖。此加 工路徑26之特徵在於可藉由雷射光重複行走於此加工路徑，以精 確地控制工件10上所形成之加工深度。詳細而言，第3A圖中圈 狀執跡20之中心部分25之寬度、面積乃由第二雷射光線16之光 線偏移距離D而定，而此中心部分25之寬度、面積將進一步決定 加工路徑26的寬度。舉例而言，當第二雷射光線16之光線偏移 距離D小的時候，圈狀執跡20之中心部分25即對應地具有較小 的面積，因而加工路徑26所形成的寬度亦對應地較小，藉由工件 平台14於加工路徑26上的重複移動，工件10上所能形成的加工 深度即可精確地加以控制，以符合多維加工的需求。 另一方面，須說明的是，由於本發明雷射加工裝置1於工件10 上所形成的加工路徑26乃由至少一個封閉軌跡20所組成，因此 相較習知技術，此加工路徑26所移除的工件移除廢料乃當然地相 對減少，其所形成的粉塵對加工設備所造成的汙染亦當然地降低。 請合併上述說明以及參考第1圖至第5圖所示，本發明亦揭露 一種用以加工一工件之雷射加工方法，如第6圖所示。須說明的 是，此方法主要乃利用前述之雷射加工裝置1對一工件10進行雷 射加工，因此，前述關於雷射加工裝置1之各裝置之描述皆直接 適用於本雷射加工方法，請合併參考前述内容。此雷射加工方法 包含下列步驟： 10 200950915 ❹ ❹ 首先’於步驟601中’開啟雷射光源u，以提供-第-光線15。 詳細而言’係雷射光源11係-固態紫外光雷射光源或者為-固態 、^光雷射光源。其次，於步驟親中，偏折該第一光線Η以產 生第光線16,其中第二光線16相對第一光線具有一角度 偏移量。具體而言，於本發明之一實施例中，步驟602中形成第 二光線16之步驟係為提供包含至少—鏡片Π之鏡片總成12，使 第Ή入射至少—鏡片17之一入射面μ後，將由該至少一 鏡月η之—出射面19偏折而射出，以產生角度偏移量。於本實 施例中’鏡片17之出射面19係為一傾斜面。 最後’於步驟6〇3中，旋轉第二光線16，俾第二光線16於工件 10上形成-封閉軌跡2〇。於本實施例中，此封閉軌跡2〇係為一 圈狀轨跡。前述步驟603中旋轉第二光線16之步驟主要是由旋轉 鏡片總成12達成’更具體而言乃提供—致動裝置13，卩旋轉鏡片 總成12。 於本發明之較佳實施例中，本發明之雷射加工方法更包含將一 工件10設置於雷射加工裝置i之工件平台14上並移動工作平台 14之步驟’俾利第二光線16於工 卞υ上進而產生一加工路徑26， 其中加工路徑26係由至少一封閉軌跡20所組成。 由上述可知，相對於先前技術，本發明所揭露的雷射加工裝置 與雷射加工方法主要乃藉由旋轉鏡片總成所產生之加工路徑，、以 進行精確地多維度雷射加工，此加卫過程不但沒有㈣能量過度 集中，而產生熱應力破壞工件1G的問題，且其造成移除之工件 移除1較少’可有效降低粉塵污染，以符合業界需长。 200950915 上述實施例僅為例示性說明本發明之原理及其功效，以及閣釋 本發明之技術特徵，而非用於限制本發明之保護範疇。任何熟悉 本技術者之人士均可在不違背本發明之技術原理及精神的情況 下，可輕易完成之改變或均等性之安排均屬於本發明所主張之範 圍因此，本發明之權利保護範圍應如後述之申請專利範圍所列。 【圖式簡單說明】 第1圖係為本發明雷射加工裝置之一實施例之示意圖； 第2A圖係為本發明鏡片總成之一實施例之示意圖； 第2B圖係為本發明鏡片總成之另一實施例之示意圖； 第2C圖係為本發明鏡片總成之另-實施例之示意圖； 第3A圖係為本發明封閉軌跡之一實施例之示意圖； 第3B圖係為本發明加工軌跡之一實施例之示意圖； 第4圖係為本發明致動裝置之-實施例之示意〜圖； 第5圖係為本發明工件平台之一實施例之示意圖；以及 第6圖係為本發明雷射加卫方法流程圖。 【主要元件符號說明】 I :雷射加工裝置 II :雷射光源 13 :致動裝置 15 :第一光線 17 :鏡片 19 :出射面 21 :馬達 23 ’·皮帶輪 25 :中心部分 10 :工件 12 :鏡片總成 14 :工件平台 16 :第二光線 18 :入射面 20 :圈狀軌跡 22 :傳動裝置 24 :皮帶 26 :加工路徑 12200950915 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a processing apparatus and a processing method, and more particularly to a laser processing apparatus and a laser processing method. [Prior Art] Conventional processing machines, such as lathes, grinders, drills, etc., generally have a working range of only about 250 microns. For workpieces up to 200 microns, it is necessary to do the other. In addition, the mechanical stress remaining on the workpiece during the machining process is another factor that must be considered during machining. In recent years, laser-related technologies have gradually matured, and the benefits of applying lasers to workpiece processing are widespread. Depending on the material type of the workpiece, it can be processed with a suitable laser. There are three kinds of lasers that are often used in the processing process, namely carbon dioxide laser, solid-state laser, and excimer laser. The precision and quality that can be achieved by these three kinds of laser processing are excimer mines. The shot is superior to the solid-state laser, and the solid-state laser is superior to the carbon dioxide laser. On the other hand, the processing speed and required cost φ of the three are reversed. The carbon dioxide laser is superior to the solid-state laser, and the solid-state laser is excellent. In the excimer laser. Therefore, depending on the actual processing requirements and characteristics of the workpiece, the appropriate laser processing type can be selected. In addition, the laser output power required for laser processing is typically between 50 milliwatts and 2 watts, with pulse energies ranging from tens of microjoules to a few millijoules. The longitudinal depth and lateral accuracy of laser processing are related to the stability of the laser and the design of the optical focusing system in the laser processing equipment. Compared with the traditional machining methods of mechanical tools, the advantage of laser processing is that it can not only perform high-precision machining operations, but also solve the problem of mechanical reinforcement stress remaining on the other hand. However, since the laser processing is performed by means of 2 laser beam pulse striking, the intensity of the laser light tends to be over:: in the case: the thermal stress residual is generated on the part, and even the workpiece itself is especially In the case of multi-dimensional machining, traditional laser processing is difficult to achieve deep control. When the workpiece is dry and rut, it is more likely to cause unintended perforation. Therefore, the conventional laser reinforcement method is often limited to a two-dimensional processing environment such as workpiece shape cutting. Secondly, the common problem of _field processing is that due to the design field of laser processing equipment, a large number of guards are removed during the laser processing process, causing dust and pollution to the processing equipment. For precision machining zero In terms of components, it can cause operational problems. According to the above, we have developed a new laser processing device and a laser processing method using the same for the above-mentioned problems of thermal stress residuals, dust pollution and difficulty in controlling the depth of the laser. Therefore, there is an urgent need to decipher the technical field. SUMMARY OF THE INVENTION The present invention is directed to providing a laser processing apparatus for processing a workpiece. The laser processing apparatus can generate a processing path formed by at least a closed trajectory on the guard member, thereby reducing The amount of workpiece removal due to processing reduces the contamination caused by dust on processing equipment. To achieve the foregoing objectives, the laser processing apparatus of the present invention comprises: a laser source, a lens, an actuator, and a workpiece platform. The laser source is adapted to provide a first light, the first light entering the lens assembly and emitting a second light, the second light 200950915. The line has an angular offset relative to the first light. The actuating device is adapted to rotate the lens assembly to create a closed trace on the workpiece. The workpiece platform is adapted to place the workpiece, and the working platform is adapted to move, and the second light generates a machining path on the workpiece, wherein the machining path is composed of at least one closed trajectory. Another object of the present invention is to provide a laser processing method for processing a workpiece that precisely controls the width or depth of the processing path to meet the needs of multi-dimensional processing. To achieve the foregoing objective, the laser processing method of the present invention comprises: providing a first pupil line, incident on a lens assembly to form a second light from the lens assembly, the second light having an angle with respect to the first light Offset. Rotating the lens assembly to create a closed trajectory on the workpiece. The laser processing method further comprises: providing a workpiece platform for placing the workpiece and moving the working platform to generate a machining path by the second light, wherein the machining path is composed of at least one circular closed track. Other objects of the present invention, as well as the technical means and implementations of the present invention, will be apparent to those skilled in the art in view of the appended claims. [Embodiment] The present invention will be explained below through several embodiments. Please refer to FIG. 1 , which shows the main components of a laser processing apparatus 1 according to an embodiment of the present invention, and other aspects are not related to the technical features of the present invention. Other components are not shown. The laser processing apparatus 1 is for processing a workpiece 10 comprising a laser source 11, a lens assembly 12, an actuator 13 and a workpiece platform 14. Specifically, the laser light source 11 of this embodiment can use a Ray 7 200950915 light source having a wavelength between 193 nm and 1064 nm, such as a solid ultraviolet light source, but is not limited thereto, such as a laser light source π. Solid-state infrared light sources can also be used. The laser source 11 is adapted to provide a first ray 15 which will incident on the lens assembly 12. Please refer to the internal diagram of the lens assembly 12 as shown in the Figure 2A. The lens assembly I] comprises at least one lens 17, which in this embodiment is a lens. The at least one lens 17 has an entrance surface 18 and an exit surface i9. The exit surface 19 is an inclined surface, and the second light 16 is generated when the first light 15 is emitted from the inclined surface. In particular, one of the features of the present invention is that the second light ray 16 has an angular offset of 0 with respect to the first light ray 15 by the change of the angle of the inclined surface, in other words, the first light ray 15 passes through the lens 〜12. Thereafter, a deflection is generated in the traveling direction of the original light to be converted into the second light ray 16. In a preferred embodiment, the angle of inclination of the exit surface 19 can be adjusted to match the actual angular offset requirement to produce a suitable angular offset of zero. Please refer to Figures 2B and 2C. In practice, the number of mirrors of the lens assembly 12 can also be increased to include the plurality of lenses 17 in sequence to produce an appropriate angular offset in a progressive manner. In detail, each of the lenses 17 has an entrance surface and an output: a surface 19' and each of the exit surfaces 19 is an inclined surface. The first light rays 15 are respectively generated by the respective exit surfaces to generate an angular offset component. The angular offset $ is equal to the sum of the angular offset components w, 02, ..., and known. In the implementation, the second ray 16 may be parallel to the first ray 15 by appropriately tilting the exit surface 19 of the lens 17. In addition, by adjusting the distance L between adjacent lenses η in the lens assembly 12, the ray shift distance D of the original ray ray aligning direction due to the angular offset can also be adjusted. One of the other features of the present invention is that the means 3 is adapted to rotate the lens assembly 200950915.12 to cause the second laser light 16 exiting the lens assembly 12 to create a processing track on the workpiece 10. In particular, the processing track is a closed track 20, and the central portion 25 of the wall stop 20 is where the laser light has not passed, as shown in Figure 3A. In detail, due to the deflection effect of the lens assembly 12, the second laser light 16 exiting the lens assembly 12 is first caused to have an angular offset of 0 relative to the original direction of travel of the first ray 15, which has an angular offset. The shifted second laser light 16 will be rotated by the actuation of the actuating device 13 with the original direction of travel of the first ray 15 as the axis, thereby creating a closed trajectory 20 on the workpiece 10. In the preferred embodiment, the closed trace 20 produced by the laser processing apparatus 1 of the present invention on the workpiece 10 is a braided trace. Referring to FIG. 4, a specific embodiment of the actuating device 13 in the laser processing apparatus 1 of the present invention includes a motor 21 and a transmission 22. The transmission 22 of the present embodiment includes a pulley 23. And a belt 24 is coupled to the motor 21 and the lens assembly 12, respectively. In particular, the motor 21 provides the power source required to rotate the lens assembly 12, through the belt 24 in the transmission 22 and the pulley 23 coupled to the lens assembly 12, the lens assembly 12 is rotated, and the second light 16 is rotated. The workpiece 10 is formed into a closed trajectory 20 as shown in Fig. 3A. Specifically, in other embodiments, the transmission 22 may have at least one gear device (not shown) for replacing the pulley 23 and the belt 24, but is not limited thereto. In a preferred embodiment, the laser processing apparatus 1 of the present invention further includes a workpiece platform 14. Referring to Figure 5, a schematic view of one of the workpiece platforms 14 of the present invention is shown. This work platform 14 is adapted to place the workpiece 10 waiting to be processed. In particular, the work platform 14 can also be moved in accordance with the processing needs, in particular, moving on a plane, and the second light 16 is generated on the surface of the workpiece 10 on the workpiece platform 14 to produce a processing path 26, 9 200950915, The processing path 26 is composed of at least one of the aforementioned closed traces 20, such as the F-shaped processing path 26 shown in FIG. In detail, the rotation of the lens assembly 20 in conjunction with the planar displacement of the workpiece platform 14 will result in a predetermined processing path 26 formed by the plurality of circular tracks 20 on the surface of the workpiece 10, see Figure 3B. This processing path 26 is characterized in that the machining path can be repeatedly traveled by laser light to precisely control the processing depth formed on the workpiece 10. In detail, the width and area of the central portion 25 of the looped trace 20 in FIG. 3A are determined by the light offset distance D of the second laser beam 16, and the width and area of the central portion 25 are further determined. The width of the processing path 26. For example, when the light deflection distance D of the second laser beam 16 is small, the central portion 25 of the coiled trace 20 has a correspondingly small area, and thus the width formed by the processing path 26 is correspondingly Smaller, by the repeated movement of the workpiece platform 14 on the machining path 26, the machining depth that can be formed on the workpiece 10 can be precisely controlled to meet the requirements of multi-dimensional machining. On the other hand, it should be noted that since the processing path 26 formed on the workpiece 10 by the laser processing apparatus 1 of the present invention is composed of at least one closed track 20, the processing path 26 is shifted compared to the prior art. The removal of the workpiece from the scrap is of course relatively reduced, and the resulting dust also naturally reduces the contamination of the processing equipment. In combination with the above description and with reference to FIGS. 1 to 5, the present invention also discloses a laser processing method for processing a workpiece, as shown in FIG. It should be noted that this method mainly performs laser processing on a workpiece 10 by using the laser processing apparatus 1 described above. Therefore, the foregoing descriptions of the respective devices of the laser processing apparatus 1 are directly applicable to the laser processing method. Please refer to the foregoing for a combination. The laser processing method comprises the following steps: 10 200950915 ❹ ❹ First, the laser light source u is turned on in step 601 to provide a -first light ray 15. In detail, the laser source 11 is a solid-state ultraviolet laser source or a solid-state, laser source. Next, in the step, the first ray is deflected to generate a first ray 16, wherein the second ray 16 has an angular offset relative to the first ray. Specifically, in an embodiment of the present invention, the step of forming the second light ray 16 in step 602 is to provide a lens assembly 12 including at least a lens ,, such that the third ray is incident on at least one of the incident surfaces of the lens 17 Thereafter, the exit surface 19 of the at least one mirror month η is deflected and emitted to generate an angular offset. In the present embodiment, the exit surface 19 of the lens 17 is an inclined surface. Finally, in step 6〇3, the second ray 16 is rotated, and the second ray 16 is formed on the workpiece 10 to form a closed trajectory 2〇. In the present embodiment, the closed track 2 is a circular track. The step of rotating the second ray 16 in the aforementioned step 603 is primarily accomplished by the rotating lens assembly 12, more specifically providing the actuating device 13, and rotating the lens assembly 12. In a preferred embodiment of the present invention, the laser processing method of the present invention further includes the step of placing a workpiece 10 on the workpiece platform 14 of the laser processing apparatus i and moving the working platform 14 to facilitate the second light 16 A work path 26 is then produced on the work raft, wherein the work path 26 is comprised of at least one closed trajectory 20. It can be seen from the above that, compared with the prior art, the laser processing apparatus and the laser processing method disclosed by the present invention mainly use a processing path generated by rotating the lens assembly to perform precise multi-dimensional laser processing. The process of the Guardian not only does not have (4) excessive concentration of energy, but the problem of thermal stress destroying the workpiece 1G, and the removal of the workpiece is less than 1 'can effectively reduce the dust pollution to meet the needs of the industry. The above-mentioned embodiments are merely illustrative of the principles and effects of the present invention, and the technical features of the present invention are not intended to limit the scope of protection of the present invention. Any person skilled in the art can arbitrarily change or equalize the arrangement without departing from the technical spirit and spirit of the present invention. The scope of the present invention should be It is listed in the scope of the patent application mentioned later. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing an embodiment of a laser processing apparatus according to the present invention; FIG. 2A is a schematic view showing an embodiment of the lens assembly of the present invention; 2C is a schematic view of another embodiment of the lens assembly of the present invention; FIG. 3A is a schematic view of one embodiment of the closed track of the present invention; FIG. 3B is a view of the present invention BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4 is a schematic view of an embodiment of an actuating device of the present invention; FIG. 5 is a schematic view of an embodiment of a workpiece platform of the present invention; and FIG. The flow chart of the laser lifting method of the present invention. [Description of main component symbols] I: Laser processing device II: Laser light source 13: Actuating device 15: First light 17: Lens 19: Exit surface 21: Motor 23'· Pulley 25: Center portion 10: Workpiece 12: Lens assembly 14: workpiece platform 16: second light 18: incident surface 20: looped track 22: transmission 24: belt 26: processing path 12