200950640 九、發明說明： 【發明所屬之技術領域】 本案為一種金屬件與塑膠件之連接結構及其製造方 法’以及採用该金屬件與塑膠件之連接結構之電子裝置外 殼0 【先前技術】 隨著微電子技術之發展，電子產品日益小型化、便攜 ❹ Ο 化和夕功此化。鎮合金材料重量較輕，延展性好，容易加 工成型，又具一定金屬強度，係一種較理想電子產品外殼 材料。然，鎂合金之金屬電磁遮罩功能使殼體内之天線很 難接收到無線f射頻信號，限制了好產品移動通訊、無 =網等功能。因此，目前—些電子產品（例如行動電話或 筆記型電腦）在鎮合金材料製成之顯示幕後蓋或殼體之局 :地方鑲有塑膠天線蓋，以便使無線電信號能夠穿透該塑 滕天線蓋而被機内之天線所接收。 :二大、易鬆動等缺點而影響產品強度。隨著電； 之勢，電子裝置之 二 例如小〜時，採用之厚度減小到-定程度， 町休用卡勾卡合及鉚接之方 度不夠而導致金屬件蛊塑赚 Λ易因為強 【發明内容】ι塑膠件脫落，影響產品之品質。 鑒於上述狀況，有必要提供一種結合力較強之金屬件 目前’塑膠製造之天線蓋與金屬殼體之結合主要 ▲卡合或鉚接等方式、然，卡勾卡合及鉚接之方式易產生 200950640 .與塑膠件之連接結構及其製備方法，及電子裝置外殼。 一種金屬件與塑膠件之連接結構，包含金屬件及嵌入 成型於該金屬件上之塑膠件。金屬件與塑膠件之間由黏膠 連接層連接。 一種金屬件與塑膠件之連接結構之製備方法，其包括 如下步驟：提供一金屬件；在該金屬件表面塗覆黏膠，並 固化；將該金屬件作為嵌件，在該固化之黏膠層上注塑熔 融塑膠，形成塑膠件。 ❺ 一種電子裝置外殼，包括金屬殼體及嵌入成型於該金 屬殼體上之塑膠蓋。金屬殼體與塑膠蓋之間由黏膠連接層 連接。 由於在金屬件與塑膠件之間增加了一黏膠連接層，增 加了金屬與塑膠之間之結合力，使金屬與塑膠之間不易發 生脫落。 【實施方式】 下面將結合附圖及實施例對本發明之金屬件與塑膠件 ©之連接結構及電子裝置外殼作進一步詳細說明。 請參見圖1，本發明較佳實施例之金屬件與塑膠件之 ，結構具體為一電子裝置外殼10’其包含金屬殼體u 及嵌入成型於該金屬殼體上之塑膠天線蓋12。在 11與塑膠天線蓋12之結合處還存在一黏膠連接 ： 屬/V又體11可採用合金材料製造，優選採用鎂合金、厶 或鈦合金之一或其組合材料製造，其成型工藝 二、 擠出、鍛造等各種金屬生產方法。具體在本實施侧仏 屬威體11之材質為鎂合金。該塑膠天線蓋12之材質要求 200950640 .具有較小之縮水率和與金屬殼體u之材質近似之線膨脹 -係數。因此，塑膠天線蓋12之材質優選為聚笨硫醚（pps/ 聚對苯二曱酸丁二醇酯（PBT)和液晶聚合樹脂（Lcp)等工程 2料中之一種或其組合。具體在本實施例中，塑膠天線蓋 12之材質為聚笨硫醚。黏膠連接層13之厚度可為15 〜如/zm，製備該黏膠連接層13之材料包括&氧樹脂、θ = 硫醇、聚酿胺、炭黑與季胺。可以理解，為了增強黏膠連 接層13與金屬殼體U及塑膠天線蓋12之間之結合力，黏 ©膠連接層13之層數也可為複數層，每層之化學組°成也可有 所不同。舉例來說，緊靠金屬-層要求要與金屬有較強龄 合力，而緊靠塑膠一層則要求要與塑膠有較強結合力，^ 他中間層可為過渡層。 、 上述電子裝置外殼10之製備方法包括以下步驟： (1)提供一金屬殼體11。可利用鑄造、擠出、鍛造等 各種金屬生產方法製備該金屬殼體u，優選採用壓 製備該金屬殼體11 ^ © (2)在金屬殼體11之表面塗覆黏膠。該黏膠可為熱固 化黏膠或光固化黏膠。具體在本實施例中，該黏膠優選為 耐熱度大於18(TC之熱固型黏膠。該熱固型黏膠之特點係 加熱後產生化學變化，逐漸硬化成型，再受熱不會軟化， 其成分包括環氧樹脂、聚硫醇、聚醯胺、炭黑與季胺。 (3)使黏膠固化。固化之方法可為加熱，吹風或光昭 等，優選方法係在I5(rc~20(rc之溫度下，加熱15〜3〇分 鐘使其固化，更為優選之方法係在18(rC2溫度下，加熱 20分鐘使其固化。 200950640 (4)將金屬威體11作為嵌件放入預設模具内而後將 .熔融之塑膠注入預設模具之模穴内，覆蓋在金屬殼體^ 表面固化之黏膠上，冷卻後形成塑膠天線蓋12。 可以理解，在步驟（2)之前，為使金屬殼體u更好地 與黏膠相結合，必要時可清潔金屬殼體u之表面以除去鏽 跡、灰塵和油污等。 可以理解，步驟（2)所塗覆黏膠可為單層或不限於兩層 之複數層，且依實際需要，還可對上述黏膠進行改質或添 ❹加各種添加劑，例如：固化劑、潤滑劑、穩定劑等。其中， 添加固化劑可縮短黏膠固化時間；添加潤滑劑可改善黏膠 之黏度；添加穩定劑可改善該黏膠連接層之耐溫、耐壓、 耐化學品等特性，延長其使用壽命。 塗覆在金屬殼體11表面之黏膠可以保證其與金屬之 間有一定強度之結合力，且當黏膠固化成黏膠連接層13 後’由於黏膠連接層13和塑膠天線蓋12同為有機化合物， 在嵌入成型時，該二者之分子間結合性較好。 ❹ 請參見圖2 ’圖2為圖1所示電子裝置外殼1〇之截面 使用顯微鏡放大50倍後所拍攝之照片。圖中左側較黑色之 區域係金屬设體11 ’右側白色之區域係塑膠天線蓋12，兩 者相結合之區域有一層黏膠連接層13。由圖2可得知，在 嵌入成型之過程中，黏膠連接層13之表面存在少量氣孔 14，塑膠天線蓋12之部分能夠填入該氣孔14中，而使黏 膠連接層13與塑膠天線蓋12之間相互滲透，增強了黏勝 連接層13與塑膠天線蓋12二者之結合力。 本發明所揭露之金屬件與塑膠件之連接結構不僅可用 9 200950640 工藝品等外殼較薄之 於電子裝置外殼，還可應用於文具、 產品。 综上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施方式，本 發明之範圍並不以上述實施方式為限，舉凡熟悉本案技藝 之人士’於爰依本案發明精神所作之等效修飾或變化，皆 應包含於以下之申請專利範圍内。 【圖式簡單說明】 © 圖1係本發明較佳實施例之金屬件與塑膠件之連接結 構之結構示意圖。 圖2係圖1所示之金屬件與塑膠件之連接結構之截面 顯微放大圖。 【主要元件符號說明】 (本發明） 電子裝置外殼 10 金屬殼體 11 _ 塑膠天線蓋 12 黏膠連接層 13 © 氣孔 14200950640 IX. Description of the invention: [Technical field of invention] The present invention is a connection structure of a metal piece and a plastic part and a manufacturing method thereof, and an electronic device casing 0 using a connection structure of the metal piece and the plastic part [Prior Art] With the development of microelectronics technology, electronic products are becoming increasingly miniaturized, portable, and sinister. The town alloy material is light in weight, good in ductility, easy to process and form, and has a certain metal strength. It is an ideal electronic product shell material. However, the metal electromagnetic shielding function of magnesium alloy makes it difficult for the antenna in the housing to receive the wireless RF signal, which limits the functions of mobile communication and non-network. Therefore, at present, some electronic products (such as mobile phones or notebook computers) are placed in the display cover or casing of the alloy material: a plastic antenna cover is placed in the place to enable radio signals to penetrate the plastic antenna. The cover is received by the antenna inside the machine. : Two major, easy to loose and other shortcomings affect the strength of the product. With the power; the second, the second of the electronic device, such as small ~, the thickness of the use is reduced to a certain degree, the square of the hook and the riveting of the town is not enough, resulting in the metal parts [Summary of the Invention] ι plastic parts fall off, affecting the quality of the product. In view of the above situation, it is necessary to provide a metal member with strong bonding strength. At present, the combination of the antenna cover and the metal casing of the plastic manufacturing is mainly ▲ snapping or riveting, and the manner of snapping and riveting is easy to produce 200950640. The connection structure with the plastic part and the preparation method thereof, and the electronic device casing. A connection structure of a metal member and a plastic member, comprising a metal member and a plastic member embedded in the metal member. The metal piece and the plastic part are connected by a glue connecting layer. A method for preparing a joint structure of a metal member and a plastic member, comprising the steps of: providing a metal member; applying a glue on the surface of the metal member, and curing; using the metal member as an insert, the cured adhesive The molten plastic is injection molded on the layer to form a plastic part. ❺ An electronic device housing comprising a metal housing and a plastic cover embedded in the metal housing. The metal casing and the plastic cover are connected by an adhesive connection layer. Since a glue connecting layer is added between the metal member and the plastic member, the bonding force between the metal and the plastic is increased, so that the metal and the plastic are less likely to fall off. [Embodiment] Hereinafter, the connection structure of the metal member and the plastic member © and the electronic device casing of the present invention will be further described in detail with reference to the accompanying drawings and embodiments. Referring to FIG. 1, a metal member and a plastic member according to a preferred embodiment of the present invention are specifically configured as an electronic device housing 10' including a metal housing u and a plastic antenna cover 12 embedded in the metal housing. There is also a glue connection at the junction of 11 and the plastic antenna cover 12: the genus /V and the body 11 can be made of an alloy material, preferably made of one of magnesium alloy, tantalum or titanium alloy or a combination thereof, and the molding process 2 , extrusion, forging and other metal production methods. Specifically, in the present embodiment, the material of the genus body 11 is a magnesium alloy. The material requirement of the plastic antenna cover 12 is 200950640. It has a small shrinkage rate and a linear expansion coefficient similar to that of the metal casing u. Therefore, the material of the plastic antenna cover 12 is preferably one of or a combination of polystyrene (pps/polybutylene terephthalate (PBT) and liquid crystal polymer resin (Lcp), etc. In this embodiment, the material of the plastic antenna cover 12 is polystyrene sulfide. The thickness of the adhesive connecting layer 13 can be 15~such as /zm, and the material for preparing the adhesive connecting layer 13 includes &oxy resin, θ = sulfur Alcohol, polyamine, carbon black and quaternary amine. It can be understood that in order to enhance the bonding force between the adhesive connecting layer 13 and the metal shell U and the plastic antenna cover 12, the number of layers of the adhesive layer 13 can also be For multiple layers, the chemical composition of each layer can also be different. For example, the metal-layer requires a stronger age than the metal, and the plastic layer requires a strong bond with the plastic. The middle layer of the electronic device may be a transition layer. The method for preparing the electronic device casing 10 includes the following steps: (1) providing a metal casing 11. The metal shell can be prepared by various metal production methods such as casting, extrusion, and forging. Body u, preferably using a metal shell 11 ^ © (2) in a metal shell The surface of the coating 11 is coated with a glue. The adhesive may be a heat-curable adhesive or a photo-curable adhesive. Specifically, in the embodiment, the adhesive is preferably a thermosetting adhesive having a heat resistance of more than 18 (TC). The characteristics of solid adhesives are chemical changes after heating, which are gradually hardened and then softened without heating. The components include epoxy resin, polythiol, polyamine, carbon black and quaternary amine. (3) Adhesive Curing. The curing method can be heating, blowing or light, etc. The preferred method is to cure at I5 (rc~20 (rc temperature, heating for 15~3〇 minutes, more preferably at 18 (rC2 temperature) Next, heat it for 20 minutes to cure. 200950640 (4) Put the metal core 11 as an insert into the preset mold and then inject the molten plastic into the cavity of the preset mold to cover the surface of the metal shell. On the adhesive, after cooling, the plastic antenna cover 12 is formed. It can be understood that before the step (2), in order to better combine the metal shell u with the glue, the surface of the metal shell u can be cleaned if necessary to remove the rust. Trace, dust and oil, etc. It can be understood that the glue applied in step (2) can be The layer is not limited to a plurality of layers of two layers, and the above-mentioned adhesive may be modified or added with various additives according to actual needs, for example, a curing agent, a lubricant, a stabilizer, etc., wherein the addition of the curing agent can be shortened. Adhesive curing time; adding lubricant can improve the viscosity of the adhesive; adding stabilizer can improve the temperature resistance, pressure resistance, chemical resistance and other properties of the adhesive connecting layer and prolong its service life. The adhesive on the surface can ensure a certain strength bond with the metal, and when the adhesive is cured into the adhesive connecting layer 13, 'because the adhesive connecting layer 13 and the plastic antenna cover 12 are both organic compounds, in the insert molding At the same time, the intermolecular bonding of the two is better. ❹ Refer to FIG. 2 ' FIG. 2 is a photograph taken after the cross section of the casing 1 of the electronic device shown in FIG. 1 is magnified 50 times using a microscope. The blacker area on the left side of the figure is the metal body 11'. The white area on the right side is the plastic antenna cover 12, and the area where the two are combined has a layer of adhesive connection layer 13. As can be seen from FIG. 2, in the process of insert molding, a small number of air holes 14 are present on the surface of the adhesive connecting layer 13, and a portion of the plastic antenna cover 12 can be filled into the air hole 14, and the adhesive connecting layer 13 and the plastic antenna are provided. The cover 12 penetrates each other to enhance the bonding force between the adhesive connection layer 13 and the plastic antenna cover 12. The connection structure of the metal piece and the plastic part disclosed by the invention can be used not only for the housing of the electronic device, but also for the stationery and the product. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be equivalently modified or changed in accordance with the spirit of the invention. All should be included in the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a structural schematic view showing a connection structure of a metal member and a plastic member according to a preferred embodiment of the present invention. Fig. 2 is a cross-sectional microscopic enlarged view showing the connection structure of the metal member and the plastic member shown in Fig. 1. [Main component symbol description] (Invention) Electronic device housing 10 Metal housing 11 _ Plastic antenna cover 12 Adhesive connection layer 13 © Air hole 14