TW200947466A - Anti-electromagnetic interference material arrangement - Google Patents

Anti-electromagnetic interference material arrangement Download PDF

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TW200947466A
TW200947466A TW97116158A TW97116158A TW200947466A TW 200947466 A TW200947466 A TW 200947466A TW 97116158 A TW97116158 A TW 97116158A TW 97116158 A TW97116158 A TW 97116158A TW 200947466 A TW200947466 A TW 200947466A
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electromagnetic wave
particulate material
substrate
conductive
composite
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TW97116158A
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TWI401701B (en
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ren-hong Zhang
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ren-hong Zhang
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Abstract

Anti-EMI material arrangement, comprising a lurality of electrically conducting elongated particles, which are irregularly distributed within a substrate, forming a web of electrically conducting paths, so that incoming electromagnetic waves are attenuated. Optionally, spherical particles are added. Furthermore, optionally, absorbing particles are added to dissipate energy of electromagnetic waves.

Description

200947466 九、發明說明: (發明所屬之技術領域) 本發明係有關一種複合式電磁波微粒材料,特別是 指一種可以添加於高分子塑膠材料/樹脂塗料,或者是紡 織纖維、水泥粉體等基材中,使得任何以該基材製成之物 體或表面處理材料具有遮蔽及吸收寬頻之電磁波干擾的 複合式電磁波微粗材料。 (先前技術) 近年來電子科技發展迅速,科學技術一日千里,為 追求生活之便利,在現今社會各式各樣的電子產品3C整 合系統設備雖然帶給人類生活無線的方便,卻也造成複雜 的電磁波錯訊環境,就是所謂的電磁波干擾 (Electro-magnetic Interference) (EMI)。 電磁波產生原因,主要來自於所有電子設備在操作 時均會產生一定程度的電磁場,尤其在電子元件密度過高 或有高頻電路時》而電子設備在運作時所產生的電磁波則 會干擾其他電子設備,使其無法正常運作,因而若無防制 EMI的措施則不僅彩響其他電子設備的運作,本身也容易 受到其他電子設備的干擾》電磁波除對於電子設備之運作 有所影響外,對於人體健康亦有重大影響,因此目前世界 各國對於電子產品的電磁波防護標準均有越來越嚴格的 限制。 不同波長範園的電磁波是由不同的方法、不同的輪 射源產生的。波長最長(頻率最低)的是無線電波,由電路 200947466 系统產生*而波長最短的是射線,由陰極射線管產生。 放射性元素會射出r (伽瑪)射線,是波長最短(相對頻率 最高)的電磁波。人類由視網膜所能感覺到的即是人類所 能看到的電磁波,就是可見光,其波長範圍約在〇,4到 0. 76 # m 之間 ^ 一般而言,以可見光最短波長0.4μ«ι的紫外線為分 界,波長短於紫外線的電磁波均屬於短波長的電磁波,越 短波長的電磁波的電磁波能階越高,對於人體細胞的傷害 Ο 越直接,當極短波長的電磁波,如尤射線或r (伽瑪)射線 之能階足以達到破壞細胞DNA的程度,因此會直接對人親 產生傷害。 而較長波長的電磁波如無線電波、行動電話電磁 波,以及變電所、高壓電塔產生磁場均屬於長波長的電磁 波,其對於人體健康的彩響到現在仍未有定論,但基本上 長期暴露於高強度的電磁波中仍會產生病變,其產生病變 主要方式有: 〇 1.電流通過細胞間質,使細胞電位改變》 2. 類似微波爐,使人體組織的水分加熱破壞組織〇 3. 磁場效應使細胞改變。 4·在生理上由於電磁波輻射對人體有抑制心血管、内分 泌、免疫、生殖等系統功能及血小板與白血球降低、神 經衰弱,眼晶球混濁,甚至畸形兒之誕生與癌細胞之加 速擴散有十分嚴重之影響。 由於電磁波種類相當多,因此其防護技術也變得相 當複雜。目前由於一般電子產品多數以工程塑膠做為外般 6 200947466 材料,但因為塑膠外般不具有抗電磁波特性,因此必須藉 由其他技術手段來達到遮蔽及吸收電磁波的目的,目前業 界最常見的電磁波防護方法主要如下: 1. 金屬外殼:係利用具有鋁鎂合金等高導電性材料製造電 子產品外殼,藉由金屬外殼的電磁波反射性來遮蔽電磁 波。然而該方法主要缺點在於金屬外般製造成本為塑膠 外般之數十倍以上,因此造成生產成本昂贵》此外金屬 材料僅有遮蔽電磁波的能力,電磁波碰觸導電材料後, Ο 還會產生反射、繞射、爬行等現象,因此仍然會使電磁 波無法消除而從其他方向洩露出去,並無法達到全面有 效的電磁波防護功效。 2. 金屬片遮蔽:係為利用洋白銅、磷青銅等高導電材質做 成保護片,貼附在塑膠外般的内惻,以達到遮蔽電磁波 的目的。該方法成本雖低於金屬外般的成本,但會增加 塑膠外殼的厚度,且也同樣無法完全地消除電磁波的反 射與繞射、爬行等現象》 〇 3.電鍍:係於塑膠外般表面電鍍上一層或多層之導電金屬 薄骐,使塑膠外殼表面具有導電性,此方法由於環保因 素’在目前歐美先進國家均已立法規定禁止電鍍產品輸 入。 4. 在塑膠外殼塗上導電漆:係為在塑膠外殼上嘖塗導電 漆,該方法主要疑慮在於導電漆之環保疑慮,且其良率 低,且穩定性差。 5. 真空濺鍍法:係為利用真空濺鍍方式於塑膠外般表面形 成一個導電或電磁波吸收微粒材料組合而成的鍍骐,其 200947466 目前雖然為塑膠產品抗電磁波處理的熱門技術,但由於 其必須利用特殊的低溫真空濺鍍設備,且此技術僅掌握 於少數廠商手中,因此在生產電子產品外殼的過程中還 必須要委外加工,造成製程時間延長,且加工成本提高。 6.利用電磁波吸收微粒材料(ESD)吸收電磁波:電磁波吸 收微粒材料係為利用可使電磁波產生共振阻抗、介電、 磁力等形式損失之介質,使電磁波的能量轉換為熱能, 以達到消除電磁波之目的。但由於電磁波吸收微粒材料 〇 不具有遮蔽電磁波穿透之功效,因此其必須要在電磁波 吸收艎的背面贴附另一個金屬反射片,才能夠使得電磁 波被反射回來後再被電磁波吸收體所吸收,因此其並無 法單獨達成全面性的電磁波防護功效*此外由於每一種 電磁波吸收微粒材料所能吸收的電磁波頻寬均有一 定*因此習用的電磁波吸收微粒材料並無法達到防護所 有頻寬之電磁波的功效。 由以上說明可知,習用的電磁波防護技術主要缺點 〇 可以歸納為增加製造成本、增加產品外般厚度,以及僅有 單純遮蔽電磁波功效,無法消除電磁波反射、繞射、爬行 等現象等幾項,因此其顯然有改進之必要。本發明人有鏗 於此,乃苦思細索’積極研究,加以多年從事相關產品研 發之經驗,並經不斷試驗及改良,终於發展出本發明。 (發明内容) 本發明主要目的在提供一種可以添加在高分子塑膠 材料/樹脂塗料,或者是紡織織維、水泥粉體等基材中, 8 200947466 使得任何以該基材製成之物品或表面處理材料具有遮毅 及吸收宽頻之電磁波干擾能力的複合式電磁波微粒材料。 其主要技術特徵,係在於:該抗電磁波微粒材料係 至少由一種導電性微粒材料所構成,該導電性微粒材料係 可為呈現管狀/纖維狀之長形結構的導電微粒(例如:奈 米碳管、奈米碳纖維、奈米級金屬絲等材料)所组成,前 述呈現長形結構之導電微粒摻雜於前述基材之令,係可產 生相互鍊結而形成不規則交織的結構,因此使得前述管狀 ❹ /纖維狀的導電微粒產生跨電性,而增加導電材料遮蔽及 吸收寬頻電磁波干擾之能力。 此外前述導電微粒材料亦可由管狀/纖維狀之導電 微粒混合顆粒狀之導電徽粒所組成,如此亦可以藉由管狀 /織維狀的導電微粒材料與顆粒狀的導電微粒材料與不規 則顆粒形狀的粉體材料構成相互交織的結構,而產生跨電 性,藉以增進該導電微粒材料導電通道的密集度,而使得 本發明的抗電磁波黴粒材料具有吸收、遮蔽及消除寬頻電 ❹ 磁波之特性。 前述導電微粒材料可為石墨、竹碳、碳黑、碳60、 奈米碳球、奈米碳管、碳纖維等碳系材料,另一類則為金、 銀、銅、鋁、鐵、生鐵、鎳、錫等金屬材料。該導電性微 粒材料主要功效為使得添加有本發明之抗電磁波微粒材 料之基礎材質具有導電性,而能夠將入射或内部元件產生 的電磁波導出,再利用一接地裝置,導弓|電磁波接地,以 消減電磁波而達到遮蔽電磁波的目的。 此外,本發明之抗電磁波微粒材料亦可藉由將導電 9 200947466 性微粒材料與電磁波吸收微粒材料相互混合的方式組 ;'n 成。前述電磁波吸收微粒4料可選用的材質主要包括有: 金屬氧化物、光觸媒材料、磁性粉體,以及碳酸鈣、水泥、 天然礦石、遠紅外線礦石材料等材料。其主要作用係為用 以吸收被導電材料所攔阻後所反射、繞射之電磁波,使電 磁波的能量消耗轉換為熱能,以消除電磁波的反射、繞射 等情形。 本發明之抗電磁波微粒材料由於同時混合導電性微 © 粒舆電磁波吸收微粒材料,其除了有遮蔽 +電磁波的功效 外,更可藉由電磁波吸收微粒材料消除電磁波的反射、繞 射及爬行等現象,而達到全面性的電磁波防護功效。 當利用本發明之複合式電磁波微粒材料添加入塑膠 或橡膠材料之中時,可以利用該塑膠材料以射出成形或其 他塑膠成形方式製造電子產品之外般,而不需再外加其他 電磁波防護元件,於原本的加工製程中便可製造出具有良 好的遮蔽與吸收寬頻或特定頻率電磁波的電子產品外 〇 般。或者是應用此複合式功能性微粒材料製造成其他電磁 波防護元件。 此外,亦可利用本發明之技術製造出具有抗EMI特 性之塗料,可塗裝或印刷於電子產品、木材、水泥、玻璃、 塑膠、布料'建材表面、紙張或是管材之内表面或外表面, 而使得任何喷塗有該塗料之物品均具有遮蔽及吸收寬頻 電磁波的特性。或者是將前述塗料嘖塗於紡織織維、織品 的表面’或是直接將其添加到織品織維中,藉以製造出具 有遮蔽及吸收寛頻電磁波的特性的紡織或纖維產品。 10 200947466 本發明為達成上述及其他目的,其所採用技術手段 及其功效兹採較佳實施例詳細說明如下。 (實施方式) 如圖1所示,本發明之複合式電磁波微粒材料係提 供一種可以摻合於塑膠、橡膠、樹脂塗料、水泥粉體及人 造紡織織維等基材之中,且具有吸收及遮蔽寬頻電磁波特 性之檄粗材料,藉以使得添加有本發明之抗電磁波微粒材 © 料的基材具有抗電磁波特性,且能夠利用該基材進一步製 成電子零件外般、紡織品,或者是塗料等β 本發明之複合式電磁波微粒材料係由至少一種導電 性微粒材料組合而成,該導電性微粒材料可為管狀/織維 狀之長形結構,或是不規則顆粒狀的結構,或者是由長形 結構與不規則顆粒狀結構的混合。 前述導電性微粒材料主要功效為用以增進該基材之 導電性,並於基材内部形成密佈交織的導電通道,而使得 © 基材具有遮蔽及吸收寬頻電磁波干擾的特性。此外,為進 一步消除導電性微粒材料攔阻電磁波之後產生的繞射、折 射、爬行等現象,該抗電磁波微粒材料中,可進一步添加 電磁波吸收微粒材料,前述電磁波吸收微粒材料可選用的 材質主要包括有:金屬氧化物、光觸媒材料、磁性粉髏, 以及碳酸鈣、水泥、天然礦石、遠紅外線礦石等材料。其 主要作用係為用以吸收被導電材料所棚阻後所反射、繞射 之電磁波,使電磁波的能量消耗轉換為熱能,以消除電磁 波的反射、繞射等情形。 200947466 如圖丨所示,係為本發明之第一實施例,該實施例 之抗電磁波微粒材料係由至少一種呈管狀/纖維狀之長形 結構的導電性微粒材料10所構成,該長形結構之導電性 微粒材料10由於其特殊之結構,當其添加於基材30之中 時’容易產生彼此頭尾相互連結,而形成交織網狀之組織 結構,所以能夠藉由各該長形結構之導電性微粒材料1〇 相互連結,使得基材30内部的導電通路增加,而提高其 導電性,並且產生網狀的可以攔阻電磁波之導電網路,因 〇 此使得該基材30產生攔阻及遮蔽電磁波之特性。 前述的長形結構之導電擻粒材料主要可選用材料類 型包括有:1、碳系材料,如奈米碳管、碳纖维材料,以 及纖維狀之奈米碳屑等材料;或者是2、導電金屬絲:係 將導電金屬製成極細的絲狀纖維後,再經過細徹化處理, 使其成為可摻雜於基材之中的微粒材料。 本發明第一實施例與習用技術相較下,由於前述呈 現管狀/纖維狀的長形結構之導電性微粒材料10可相互 〇 連結,並且交織出不規則的網狀結搆,因此使得各個導電 性微粒之間彼此產生跨電性,而使其產生之導電性,相較 於習用之單純粉體顆粒狀的導電性添加材料更能達到提 高基材導電性,並且在基材30内形成由錦密之導電通道 所構成之網路,因此可達到有效的遮蔽電磁波干檨能力的 目的0 如圖2所示,係為本發明的第二實施例,該實施例 係藉由將管狀/織維狀之長形結構之導電性微粒材料10 與顆粒結構之導電性微粒材料10B相互混合。其中該顆粒 12 200947466 結構之導電性微粒材料10B係為由不同直徑之不規則形 狀之導電性材料所製成之顆粒所組成,當其舆呈長形結構 之導電性徽粒材料10混合摻雜於基材30内時,可藉由長 條狀結構之導電性微粒材料10與顆粒結構之導電性微粒 材料10B相互連結交織,而達成增加基材30導電性舆遮 蔽電磁波干擾的能力的目的。 本發明上述導電性微粒材料10、10B可選用材質主 要分為:1、破系材料:主要包括石墨、碳六十、竹破、 © 奈米碳管、碳織維或奈米碳球等材料·該顗型材料係為將 含有碳元素材料經由高溫反應之後使其具有導電性,然後 再研磨成為超微細徽粒,成為具有導電性的長條狀或顆粒 狀結構的微粒材料;2、導電金屬材料:係可選用金、銀、 銅、鋁、鐵、生鐵、鎳、錫等導電性金屬製成之微粒材料》 本發明藉由上述之以長條形結構之導電性微粒混合 不規則顆粒狀結構之導電性微粒之技術手段所產生之功 效可由圈8及圈9之電子顯微鏡放大圈比較得知》 © 如圖8所示,係為利用本發明之技術手段,將由奈 米管柱結構、奈米屑、奈米球狀結構及不規則顆粗形狀之 碳系微粒混合摻雜於塑膠基材中所形成之組織結搆的電 子顢微銳放大圈。圈中明顯可見由長條狀結構之碳系材料 微粒與顆粒狀之碳系材料微粒所形成的不規則交織結 構,而在塑膠基材中形成綿密的導電'通道及遮蔽網,因此 產生良好的遮蔽與攔阻電磁波的功效。 而圖9係為單純以顆粒狀結搆之導電微粒掺合於塑 膠基村之組織結構的電子顯微銳放大圖。圖中可見由顆粒 13 200947466 狀結構所構成之導電通道較短(不綿密)且所構成的遮蔽 區域較小’因此並無法產生如本發明第一、二實施例相同 之遮蔽及棚阻電磁波的功效。。 前述導電性微粒材料10,10B係藉由增加基材30之 導電性,來達成攔阻遮蔽電磁波防止電磁波直接穿透的功 效,然而由於電磁波對導體具有反射、繞射、爬行 (creeping)等現象,其被導電性微粒材料1〇、10B遮擋後 並不會消失無蹤,因此如圖3所示之第三實施例,本發明 Ο 之抗電磁波微粒材料t可進一步添加混合有電磁波吸收 擻粒材料20,用以將被導電性材料10所遮擋反射的電磁 波能量轉換為熱能,以達到吸收電磁波的目的β 前述的電磁波吸收微粒材料20係為具有高度之電磁 波反射損失率之介質,其主要係為使得電磁波穿透介質時 產生阻抗'磁性、共振、介電損失等現象,而使得電磁波 能量轉換為熱能。該電磁波吸收微粒材料20可選用的材 料主要分為下列類型:1.金屬氧化物粉體:主要有氧化 © 銘、氧化鋅、氡化銅、二氧化鈦、光觸媒材料等金屬氡化 物粉體或鐵的氡化物,如四氧化三鐵,該類型材料主要因 為具有高阻抗或高介電係數特性,因此可使得電磁波產生 阻抗捐失或是介電損失,而達到使得電磁波能量損失之目 的;2·磁性粉體:主要可分為具磁性之金屬粉艘(例如: 钕、绷系合金等),以極具磁性之金屬氧化物(例如:鐵 氣磁想)’其可使電磁波產生磁性損失與共振損失,而速 到消耗電磁波能董的目的;3、天然礦石:該類型材料包 括有水泥粉體、陶土、黏土、碳酸鈣,或者是内含矽、鐵、 14 200947466 鋁、鎳、碳、鎂、猛'鉻礦物等物質之天然礦石,例如電 氣石、麥飯石、石英、水晶、雲母等,該類之天然礦物材 質製成之粉體係為具有高阻抗及高介電特性之材料,其添 加於本發明之抗電磁波粉體之中亦可達吸收電磁波之功 效。 除此之外,如圖4所示之第四實施例,本發明亦可 以藉由將顆粒狀的導電性微粒材料10B與電磁波吸收微 粒材料20混合的方式加以運用,該實施例中,雖然不具 〇 有前述實施例中所使用的纖維狀或管狀之導電微粒材 料,但其由於同時具有導電性的微粒材料及介電性的電磁 波吸收微粒材料相互混合,亦可達到較習用之單純由導電 性或介電性材料單獨使用之抗電磁波材料更加之功效* 此外,由以往研究文獻可知導電性材料與電磁波吸 收微粒材料之粉體顆粒的直徑對於其所能夠遮蔽及吸收 的電磁波波長範園均不相同,因此本發明可藉由混用不同 直徑的顆粒狀結構之導電性材料10B與電磁波吸收微粒 〇 材料20之粉體的目的,來達到有效阻隔與吸收不同波長 之電磁波的目的。而且為針對極短波長的電磁波防護,前 述導電性材料10B與電磁波吸收微粒材料20係經由微粒 化加工,而使其最少一部份之粉體直徑達到介於1-100奈 米之間,而成為奈米級粉體顆粒之型態β 本發明之複合式電磁波微粒材料係可添加於多種型 態之基材30之中’而使得基材30具有吸收及消除宽頻電 磁波之能力。該基材30之範圍包括有:塑膠/橡膠等高分 子材料、樹脂塗料、紡織織維材料或水泥等》 15 200947466 當前述基材30為塑膠材料時(如:PC、PVC、ABS、 PET、PT、PU、尼龍、壓克力樹脂、橡黟),係可以直接以 射出成形或其他塑膠成形加工方式將其製造成為電子產 品之外般,或者是遮蔽板、穿線管、電線包復材等元件, 因此其具有相當廣泛的應用類型。其具體應用實例如圖5 所示,係可將該基材製作成電子產品之外殼40,使得該 外般具有遮蔽及吸收電磁波之功效,因此可以用於遮蔽及 吸收電路元件41產生之電磁波;或者是如圖6所示將该 © 基材製作成為各種形狀的板片50,然後利用該板片作為 電磁波遮蔽板;或者是如圖7所示將其做成一個防護管 60,該防護管60 t央係可穿設電力/資訊線路70,以保 護該電力/資訊線路70不受外界電磁波千擾,或者是隔絕 該電力/資訊線路70的電磁波外洩。 此外,前述基材亦可以為樹脂塗料。當其為樹脂塗 料之型態時,係可以將其製作成為塗料或顏料,而能夠廣 泛應用於塑膠、布料、金屬、木材、建萘物牆板、玻璃、 〇 塑膠管《等各種材料的塗裝或表面處理,而使得各種材質 均能夠具有遮蔽及吸收電磁波之功效》 當該基材30為塑膠高分子材料時,其將前述抗電磁 波微粒材料摻合添加於該基材的方法主要有下列幾種: 1、在高分子基材聚合過程中,將本發明之抗電磁波微粒 材料加入;2、在高分子基材為粉體狀態時,將本發明之 抗電磁波微粒村料添加入到該高分子基材的粉末中,再將 該混合後之高分子基材的粉體製造成顆粒材料,以利於後 續塑膠射出成形或其他塑膠成形加工;3、若高分子基材 16 200947466 為塑膠粒之狀態時,可將該塑膠粒打碎後再加入本發明之 抗電磁波微粒材料,或者是直接將本發明之抗電磁波微粒 材料直接混入到塑膠母粒中,直接進行射出成形或以其他 塑謬成形加工程序加以成形為最後成品;4、另本發明可 先將超過正常摻合濃度之份量將該抗電磁波微粒材料添 加到高分子基材之令,製造成「高濃度母粒」,然後將铱 高濃度之塑縢母粒混合到一般的塑糝母粒中,再以一般的 射出成形或其他塑膠成形程序製造成為電子產品外般或 Ο 其他成品;及5、若該高分子基材為橡膠材料時,可於橡 膠材料發泡過程中將該抗電磁波微粒材料添加到發泡中 的橡膠材料中。 此外,前述基材30為紡織纖維時,係可以在該紡織 織維母粒材料聚合過程中加入本發明之抗電磁波微粒材 料·以製造出包含有該抗電磁波微粒材料的纖維母粒,或 者是在纖維母粒抽製成絲的階段,將該抗電磁波微粒材料 加入,以製成具有抗電磁波特性之紡織織維。 © 另外前述基材30亦可為水泥,當本發明之抗電磁波 微粒材料混入水泥型態的基材30内時,可使得該水泥型 態的基材具有抗電磁波特性,因此可利用該水泥型態的基 材30製作成牆壁,或構成建築物隔間的材料,以使得建 築物的結構物具有抗電磁波特性。 本發明藉由以上技術手段,利用本發明之抗電磁波 微粒材料可添加於各種型態之基材之中,而使得基材具有 吸收及消除寬頻之電磁波干擾的特性》本發明與習知技術 相較下,由於其採用特殊結構的導電性微粒材料來達到增 17 200947466 加導電性的目的,再加上其能夠同時混合導電微粒材料及 電磁波吸收微粒材料,來達到完全消除電磁波之反射、繞 射、极行等現象’因此可以達到有效且完全吸收寬頻電磁 波干擾的目的。 且利用本發明的技術,可以將基材30直接製造電子 產品外殼’或者是其他電磁波防護元件,其不需要再附加 其他電磁波防護元件,且加工程序與傳統的塑謬材料加工 程序完全相同’因此可以有效降低電子產品外殼生產之成 〇 本。再者可利用本發明技術製造成各種塗料,而使其能夠 廣泛應用於各種產品之電磁波防護,更使本發明之應用層 面拓展至各種日常生活用品的電磁波防護。 (圖式簡單說明) 圈1係為一添加有本發明之第一實施例之抗電磁波 微粒材料之基材之斷面結搆示意圖。 圈2係為一添加有本發明之第二實施例之抗電磁波 〇 微粒材料之基材之斷面結搆示意围。 圈3係為一添加有本發明之第三實施例之抗電磁波 微粒材料之基材之斷面結構示意圈。 圖4係為一添加有本發明之第四實施例之抗電磁波 微粒材料之基材之斷面結構示意圈。 圈5係為一利用本發明技術製成之電子產品外般之 構造示意圈* 圖6係為一利用本發明技術製成之電磁波遮蔽板件 之使用狀態示意圖。 18 200947466 圖7係為一利用本發明技術製成之電磁波防護管體 之使用狀態示意圖。 圖8係為利用本發明之技術,以長形結構之奈米微 粒添加於塑膠材料中所形成之抗電磁波材料之組織結構 電子顯微鏡放大圖。 圖9係為利用單純顆粒狀奈米微粒材料添加於塑膝 材料t所製成之材料組織結構之電子顯微銳放大圖。 〇 (主要元件符號說明) 10長形結搆之導電性微粒材料 10B顆粒狀結構之導電性微粒材料 20 電磁波吸收擻粒材料 30 基材 40外般 41電路元件 50板片 Ο 60防護管 電力/資訊線路 19200947466 IX. Description of the invention: (Technical field to which the invention pertains) The present invention relates to a composite electromagnetic wave particulate material, in particular to a substrate which can be added to a polymer plastic material/resin paint, or a textile fiber, a cement powder or the like. The object or surface treatment material made of the substrate has a composite electromagnetic wave micro-rough material which shields and absorbs electromagnetic interference of a wide frequency. (Previous technology) In recent years, electronic technology has developed rapidly, and science and technology have developed rapidly. In order to pursue the convenience of life, the 3C integrated system equipment of various electronic products in today's society has brought convenience to human life, but it also causes complex electromagnetic waves. The wrong environment is the so-called Electro-magnetic Interference (EMI). The cause of electromagnetic waves is mainly due to the fact that all electronic devices generate a certain degree of electromagnetic field during operation, especially when the density of electronic components is too high or there is a high-frequency circuit. The electromagnetic waves generated by the operation of electronic devices interfere with other electrons. The equipment makes it unable to operate normally. Therefore, if there is no EMI prevention measure, it will not only cause the operation of other electronic equipment, but also be easily interfered by other electronic equipment. The electromagnetic wave has influence on the operation of the electronic equipment, Health also has a major impact, so the world's countries have increasingly strict limits on the electromagnetic wave protection standards for electronic products. Electromagnetic waves of different wavelengths are generated by different methods and different sources. The longest wavelength (lowest frequency) is the radio wave, which is generated by the circuit 200947466 system and the shortest wavelength is the ray, which is generated by the cathode ray tube. The radioactive element emits r (gamma) rays, which are the electromagnetic waves with the shortest wavelength (the highest relative frequency). What humans can feel from the retina is the electromagnetic wave that humans can see, that is, visible light, whose wavelength range is about 〇, 4 to 0. 76 # m between ^ Generally speaking, the shortest wavelength of visible light is 0.4μ«ι The ultraviolet rays are demarcation, and the electromagnetic waves whose wavelength is shorter than ultraviolet rays belong to short-wavelength electromagnetic waves. The higher the electromagnetic wave energy level of the shorter-wavelength electromagnetic waves, the more direct the damage to human cells, when extremely short-wavelength electromagnetic waves, such as ray or The energy level of the r (gamma) ray is sufficient to destroy the DNA of the cell, so it will directly harm the human being. Long-wavelength electromagnetic waves, such as radio waves, mobile phone electromagnetic waves, and magnetic fields generated by substations and high-voltage electric towers are all long-wavelength electromagnetic waves. Their color sounds for human health have not yet been determined, but they are basically long-term. Exposure to high-intensity electromagnetic waves still produces lesions. The main ways of producing lesions are: 〇 1. Current passes through the interstitial cells, causing changes in cell potential. 2. Similar to microwave ovens, heating the body tissue to destroy tissue 〇 3. Magnetic field The effect causes the cells to change. 4. Physiologically, due to electromagnetic wave radiation, the body has cardiovascular system, endocrine, immune, reproductive and other systemic functions and platelet and leukopenia, neurasthenia, ocular lens turbidity, even the birth of deformed children and the accelerated spread of cancer cells Serious impact. Due to the large number of electromagnetic waves, their protection technology has become quite complicated. At present, most of the general electronic products are made of engineering plastics as the external materials. However, because they do not have electromagnetic wave resistance, they must be shielded and absorbed by electromagnetic waves. The most common electromagnetic waves in the industry. The main protective methods are as follows: 1. Metal case: The outer casing of an electronic product is made of a highly conductive material such as an aluminum-magnesium alloy, and electromagnetic waves are shielded by electromagnetic wave reflection of the metal casing. However, the main disadvantage of this method is that the manufacturing cost of metal is more than ten times that of plastic, which results in high production cost. In addition, the metal material only has the ability to shield electromagnetic waves. When electromagnetic waves touch the conductive material, Ο will also produce reflection. Diffraction, creeping, etc., so that electromagnetic waves can not be eliminated and leaked from other directions, and can not achieve comprehensive and effective electromagnetic wave protection. 2. Metal sheet shielding: It is made of a high-conductivity material such as white copper or phosphor bronze, which is used as a protective sheet and attached to the inner lining of plastic to achieve the purpose of shielding electromagnetic waves. Although the cost of the method is lower than that of metal, it increases the thickness of the plastic casing, and it also cannot completely eliminate the reflection and diffraction of electromagnetic waves, crawling, etc. 〇 3. Plating: plating on the surface of plastic The conductive metal thin layer on one or more layers makes the surface of the plastic outer casing electrically conductive. This method has been enacted in the advanced countries of Europe and the United States due to environmental protection factors. 4. Apply conductive paint to the plastic case: the conductive paint is applied to the plastic case. The main concern of this method is the environmental protection of the conductive paint, and its low yield and poor stability. 5. Vacuum sputtering method: It is a combination of a conductive or electromagnetic wave absorbing particulate material formed on the surface of plastic by vacuum sputtering. Its 200947466 is currently a popular technology for anti-electromagnetic treatment of plastic products, but due to It must utilize special low-temperature vacuum sputtering equipment, and this technology is only in the hands of a few manufacturers. Therefore, in the process of producing electronic product casings, it must be processed outside, resulting in prolonged process time and increased processing costs. 6. Absorbing electromagnetic waves by electromagnetic wave absorbing particulate material (ESD): The electromagnetic wave absorbing particulate material is a medium that can cause electromagnetic waves to generate resonance impedance, dielectric, magnetic force, etc., so that the energy of electromagnetic waves is converted into thermal energy, so as to eliminate electromagnetic waves. purpose. However, since the electromagnetic wave absorbing particulate material does not have the effect of shielding electromagnetic wave penetration, it is necessary to attach another metal reflection sheet on the back surface of the electromagnetic wave absorption , to enable the electromagnetic wave to be reflected back and then absorbed by the electromagnetic wave absorber. Therefore, it is not possible to achieve a comprehensive electromagnetic wave protection effect alone. In addition, since each electromagnetic wave absorbing particulate material can absorb electromagnetic wave bandwidths with a certain amount*, the conventional electromagnetic wave absorbing particulate material cannot achieve the effect of protecting electromagnetic waves of all bandwidths. . It can be seen from the above description that the main disadvantages of the conventional electromagnetic wave protection technology can be summarized as increasing the manufacturing cost, increasing the thickness of the product, and simply shielding the electromagnetic wave, and eliminating the phenomenon of electromagnetic wave reflection, diffraction, crawling, etc., It obviously has the need for improvement. The inventors of the present invention have developed the present invention by actively researching and conducting years of experience in research and development of related products, and through continuous experimentation and improvement. SUMMARY OF THE INVENTION The main object of the present invention is to provide a material which can be added to a polymer plastic material/resin paint, or a woven fabric, a cement powder or the like, 8 200947466 to make any article or surface made of the substrate The composite material has a composite electromagnetic wave particle material which has the ability to absorb and absorb electromagnetic interference of a wide frequency. The main technical feature is that the anti-electromagnetic wave material is composed of at least one conductive particulate material, and the conductive particulate material can be a conductive particle that exhibits a tubular/fibrous elongated structure (for example, nano carbon). a material composed of a tube, a nano carbon fiber, a nano-wire, or the like, wherein the conductive particles having an elongated structure are doped on the substrate, and a structure in which an intertwined chain is formed to form an irregular interlace is formed, thereby The aforementioned tubular ❹/fibrous conductive particles generate cross-over properties, and increase the ability of the conductive material to shield and absorb broadband electromagnetic wave interference. In addition, the conductive particulate material may also be composed of tubular/fibrous conductive particles mixed with granular conductive particles, so that the tubular/woven-shaped conductive particulate material and the granular conductive particulate material and the irregular particle shape may also be used. The powder material constitutes a mutually interwoven structure, and generates a cross-over property, thereby increasing the density of the conductive passage of the conductive particulate material, so that the electromagnetic wave-resistant mold material of the present invention has the characteristics of absorbing, shielding and eliminating the broadband electromagnetic wave. . The conductive particulate material may be carbonaceous materials such as graphite, bamboo carbon, carbon black, carbon 60, carbon spheres, carbon nanotubes, carbon fibers, and the like, and gold, silver, copper, aluminum, iron, pig iron, and nickel. , tin and other metal materials. The main function of the conductive particulate material is that the base material to which the electromagnetic wave resistant particulate material of the present invention is added has conductivity, and the electromagnetic wave generated by the incident or internal component can be derived, and then a grounding device is used, and the lead wire is electromagnetically grounded. The electromagnetic wave is reduced to achieve the purpose of shielding electromagnetic waves. In addition, the anti-electromagnetic wave material of the present invention may also be formed by mixing conductive material 9 200947466 particulate material with electromagnetic wave absorbing particulate material. The materials selected for the electromagnetic wave absorbing particles 4 include: metal oxides, photocatalyst materials, magnetic powders, and materials such as calcium carbonate, cement, natural ore, and far-infrared ore materials. Its main function is to absorb the electromagnetic waves reflected and diffracted by the conductive material, and convert the energy consumption of the electromagnetic wave into heat energy to eliminate the reflection and diffraction of electromagnetic waves. The anti-electromagnetic wave material of the present invention can simultaneously absorb the reflection, the diffraction and the crawling of the electromagnetic wave by the electromagnetic wave absorbing particulate material, because of the simultaneous mixing of the conductive micro-particles and electromagnetic wave absorbing particulate material. And achieve comprehensive electromagnetic wave protection. When the composite electromagnetic wave particulate material of the present invention is added to a plastic or rubber material, the plastic material can be used to manufacture an electronic product by injection molding or other plastic molding, without adding other electromagnetic wave protection components. In the original processing process, it is possible to manufacture electronic products that have good shielding and absorption of broadband or electromagnetic waves of a specific frequency. Alternatively, the composite functional particulate material can be used to make other electromagnetic wave protection components. In addition, the technology of the present invention can also be used to manufacture coatings with anti-EMI properties, which can be painted or printed on the inner or outer surface of electronic products, wood, cement, glass, plastic, cloth, building materials, paper or pipes. Therefore, any article coated with the coating has the characteristics of shielding and absorbing broadband electromagnetic waves. Alternatively, the coating may be applied to the surface of the woven fabric or fabric or directly added to the fabric weaving to produce a woven or fibrous product having the characteristics of shielding and absorbing electromagnetic waves. 10 200947466 The present invention has been made in view of the above and other objects, and the preferred embodiments thereof are described in detail below. (Embodiment) As shown in Fig. 1, the composite electromagnetic wave particulate material of the present invention provides a material which can be blended into a substrate such as plastic, rubber, resin paint, cement powder and artificial textile weaving, and has absorption and The base material which shields the characteristics of the broadband electromagnetic wave, so that the substrate to which the electromagnetic wave resistant particulate material of the present invention is added has electromagnetic wave resistance characteristics, and can be further used to make electronic parts, textiles, paints, etc. β The composite electromagnetic wave particulate material of the present invention is composed of at least one conductive particulate material, which may be a tubular/woven-shaped elongated structure, or an irregular granular structure, or A mixture of an elongated structure and an irregular granular structure. The conductive microparticle material has the main function of improving the conductivity of the substrate and forming a densely interwoven conductive channel inside the substrate, so that the © substrate has the property of shielding and absorbing broadband electromagnetic wave interference. In addition, in order to further eliminate the phenomenon of diffraction, refraction, creep, etc. generated after the conductive particulate material blocks the electromagnetic wave, the electromagnetic wave absorbing particulate material may be further added to the anti-electromagnetic wave particulate material, and the materials selected for the electromagnetic wave absorbing particulate material mainly include : Metal oxides, photocatalyst materials, magnetic powder, and materials such as calcium carbonate, cement, natural ore, far-infrared ore. Its main function is to absorb the electromagnetic waves reflected and diffracted by the conductive material, and convert the energy consumption of the electromagnetic waves into heat energy to eliminate the reflection and diffraction of electromagnetic waves. 200947466 is a first embodiment of the present invention, and the electromagnetic wave resistant particulate material of the embodiment is composed of at least one conductive particulate material 10 having a tubular/fibrous elongated structure, the elongated shape The conductive particulate material 10 of the structure, because of its special structure, is easily joined to each other when it is added to the substrate 30, thereby forming an interlaced network structure, so that the elongated structure can be formed by each of the elongated structures. The conductive particulate materials are connected to each other such that the conductive path inside the substrate 30 is increased to improve the conductivity, and a mesh-like conductive network capable of blocking electromagnetic waves is generated, thereby causing the substrate 30 to block and Shading the characteristics of electromagnetic waves. The above-mentioned elongated structure of conductive enamel material mainly selects material types including: 1, carbon-based materials, such as carbon nanotubes, carbon fiber materials, and fibrous nano-carbon chips; or 2, conductive Wire: The conductive metal is made into a very fine filamentous fiber, and then subjected to fine-cutting treatment to make it a particulate material that can be doped into the substrate. According to the first embodiment of the present invention, the conductive fine particle material 10 having the tubular/fibrous elongated structure can be connected to each other and interlaced with an irregular network structure, thereby making each conductivity. The particles are electrically connected to each other, and the conductivity thereof is generated, and the conductivity of the substrate is improved as compared with the conventional powder-like conductive additive material, and the substrate 30 is formed into a substrate. The network formed by the dense conductive path can achieve the purpose of effectively shielding the electromagnetic wave drying capability. As shown in FIG. 2, it is a second embodiment of the present invention, which is a tubular/weaving dimension. The conductive particulate material 10 having an elongated structure and the conductive particulate material 10B having a granular structure are mixed with each other. The conductive particulate material 10B of the granule 12 200947466 structure is composed of particles made of electrically conductive materials having irregular shapes of different diameters, and the conductive granule material 10 having an elongated structure is mixed and doped. In the case of the substrate 30, the conductive particulate material 10 having a long strip structure and the conductive particulate material 10B having a granular structure are connected to each other, thereby achieving the purpose of increasing the conductivity of the substrate 30 and shielding electromagnetic interference. The above-mentioned conductive particulate material 10, 10B of the present invention can be mainly divided into materials: 1. Breaking materials: mainly including graphite, carbon sixty, bamboo broken, © carbon nanotube, carbon woven or nano carbon sphere. The 顗-type material is a particulate material which is made of a carbon material after being subjected to high temperature reaction and then made electroconductive, and then ground into an ultrafine granule to form a conductive elongated or granular structure; Metal material: a particulate material made of a conductive metal such as gold, silver, copper, aluminum, iron, pig iron, nickel, or tin. The present invention is characterized in that the conductive particles are mixed with irregular particles in the above-described elongated structure. The effect of the technical means of the conductive particles of the structure can be compared by the magnification of the electron microscope of the circle 8 and the circle 9" © as shown in Fig. 8, by using the technical means of the present invention, the structure of the column by the nano tube The carbon microparticles of the nanochip, the nanosphere structure and the irregular coarse shape are mixed with an electron 颟 micro-magnification ring which is doped in the structure of the plastic substrate. In the ring, an irregular interlaced structure formed by the carbon-based material particles of the long strip structure and the particulate carbon-based material particles is clearly visible, and a dense conductive channel and a shielding net are formed in the plastic substrate, thereby producing a good The effect of shielding and blocking electromagnetic waves. Fig. 9 is an electron microscopic sharp enlarged view of a structure in which a conductive particle of a granular structure is simply blended into a plastic base. It can be seen that the conductive path formed by the particle 13 200947466-like structure is short (not dense) and the formed shielding area is small 'and thus cannot produce the same shielding and shed electromagnetic waves as in the first and second embodiments of the present invention. efficacy. . The conductive particulate material 10, 10B achieves the effect of blocking electromagnetic waves from direct penetration of electromagnetic waves by increasing the conductivity of the substrate 30. However, since the electromagnetic waves have reflection, diffraction, creeping, etc. on the conductor, The opaque anti-electromagnetic wave material t of the present invention can be further mixed with the electromagnetic wave absorbing granule material as shown in the third embodiment shown in FIG. 3 after being blocked by the conductive particulate material 1 〇, 10B. 20, for converting electromagnetic energy reflected by the conductive material 10 into thermal energy for the purpose of absorbing electromagnetic waves. The electromagnetic wave absorbing particulate material 20 is a medium having a high electromagnetic wave reflection loss rate, which is mainly When the electromagnetic wave penetrates the medium, the phenomenon of impedance 'magnetic, resonance, dielectric loss, etc. occurs, and the electromagnetic wave energy is converted into thermal energy. The materials selectable for the electromagnetic wave absorbing particulate material 20 are mainly classified into the following types: 1. Metal oxide powder: mainly metal oxide powder or iron such as oxidation, metal oxide, zinc oxide, copper oxide, titanium dioxide, photocatalyst material, etc. Telluride, such as ferroferric oxide, this type of material mainly because of its high impedance or high dielectric coefficient, so that electromagnetic waves can cause impedance loss or dielectric loss, and achieve the purpose of making electromagnetic wave energy loss; Powder: It can be mainly divided into magnetic metal powder ships (for example: 钕, stretch alloys, etc.), which are magnetically oxidized (for example, iron gas magnetic), which can cause magnetic loss and resonance of electromagnetic waves. Loss, and the purpose of consumption of electromagnetic wave energy; 3, natural ore: This type of material includes cement powder, clay, clay, calcium carbonate, or contains antimony, iron, 14 200947466 aluminum, nickel, carbon, magnesium Natural minerals such as tourmaline, medical stone, quartz, crystal, mica, etc., which are made of natural mineral materials. Electrical impedance characteristic of a material of high dielectric and high, which may add efficacy of absorbing electromagnetic waves of the present invention to an electromagnetic wave in an anti powder. In addition, as shown in the fourth embodiment shown in FIG. 4, the present invention can also be applied by mixing the particulate conductive particulate material 10B with the electromagnetic wave absorbing particulate material 20, in this embodiment, although not Having the fibrous or tubular conductive particulate material used in the foregoing embodiments, but by the fact that the conductive particulate material and the dielectric electromagnetic wave absorbing particulate material are mixed with each other, it is also possible to achieve a simple electrical conductivity. Or the anti-electromagnetic wave material used alone for dielectric materials is more effective* In addition, it is known from previous research literature that the diameter of the powder particles of the conductive material and the electromagnetic wave absorbing particulate material is not the wavelength of the electromagnetic wave that can be shielded and absorbed by the dielectric material. In the same manner, the present invention can achieve the purpose of effectively blocking and absorbing electromagnetic waves of different wavelengths by mixing the conductive material 10B of the granular structure of different diameters and the powder of the electromagnetic wave absorbing the fine particle material 20. Moreover, for electromagnetic wave protection against extremely short wavelengths, the conductive material 10B and the electromagnetic wave absorbing particulate material 20 are processed by micronization so that at least a part of the powder diameter is between 1 and 100 nm, and The type β of the nano-sized powder particles can be added to the substrate 30 of a plurality of types to make the substrate 30 have the ability to absorb and eliminate broadband electromagnetic waves. The range of the substrate 30 includes: a polymer material such as plastic/rubber, a resin coating, a textile material or a cement, etc. 15 200947466 When the aforementioned substrate 30 is a plastic material (eg, PC, PVC, ABS, PET, PT, PU, nylon, acrylic resin, rubber) can be directly manufactured into electronic products by injection molding or other plastic forming processes, or shield plates, threading pipes, wire wrapping materials, etc. Components, so it has a fairly wide range of applications. A specific application example is shown in FIG. 5, which can be made into the outer casing 40 of the electronic product, so that the outer surface has the function of shielding and absorbing electromagnetic waves, and thus can be used for shielding and absorbing electromagnetic waves generated by the circuit component 41; Alternatively, the substrate may be fabricated into sheets 50 of various shapes as shown in FIG. 6, and then used as an electromagnetic wave shielding plate; or as a protective tube 60 as shown in FIG. 7, the protective tube The 60 t central system may be provided with a power/information line 70 to protect the power/information line 70 from external electromagnetic waves or to isolate electromagnetic waves from the power/information line 70. Further, the aforementioned substrate may also be a resin coating. When it is in the form of a resin coating, it can be made into a coating or a pigment, and can be widely used in the coating of various materials such as plastic, cloth, metal, wood, naphthalene wallboard, glass, and plastic pipe. Packing or surface treatment, so that various materials can have the effect of shielding and absorbing electromagnetic waves. When the substrate 30 is a plastic polymer material, the method of blending the above-mentioned anti-electromagnetic wave particulate material into the substrate mainly includes the following Several kinds: 1. In the polymerization process of the polymer substrate, the anti-electromagnetic wave microparticle material of the invention is added; 2. When the polymer substrate is in a powder state, the anti-electromagnetic wave microparticle material of the invention is added to the In the powder of the polymer substrate, the powder system of the mixed polymer substrate is made into a granular material to facilitate subsequent plastic injection molding or other plastic molding processing; 3. If the polymer substrate 16 200947466 is a plastic pellet In the state of being, the plastic granules may be broken and then the anti-electromagnetic wave material of the present invention may be added, or the electromagnetic wave-resistant particulate material of the present invention may be directly mixed directly. In the plastic masterbatch, the injection molding is directly performed or formed into a final product by other plastic forming processing procedures; 4. In addition, the present invention can first add the anti-electromagnetic wave particulate material to the polymer substrate in excess of the normal blending concentration. It is made into a "high-concentration masterbatch", and then the high-concentration plastic masterbatch is mixed into a general plastic masterbatch, and then manufactured into an electronic product by a general injection molding or other plastic molding process. Ο other finished product; and 5. If the polymer substrate is a rubber material, the electromagnetic wave resistant particulate material may be added to the foamed rubber material during foaming of the rubber material. In addition, when the substrate 30 is a textile fiber, the anti-electromagnetic wave material of the present invention may be added during the polymerization of the woven weimu masterbatch material to produce a fiber masterbatch containing the anti-electromagnetic particle material, or The anti-electromagnetic wave particulate material is added during the stage in which the fiber masterbatch is drawn into a wire to produce a textile weave having electromagnetic wave resistance. Further, the substrate 30 may be cement. When the anti-electromagnetic wave material of the present invention is mixed into the cement-type substrate 30, the cement-type substrate can be made to have electromagnetic wave resistance, so that the cement type can be utilized. The substrate 30 is formed into a wall or a material constituting a building compartment so that the structure of the building has electromagnetic wave resistance. According to the above technical means, the anti-electromagnetic wave microparticle material of the present invention can be added to various types of substrates, so that the substrate has the characteristics of absorbing and eliminating electromagnetic interference of a wide frequency. The present invention and the prior art In the following, due to the use of a special structure of conductive particulate material to achieve the purpose of adding conductivity, coupled with the ability to simultaneously mix conductive particulate material and electromagnetic wave absorbing particulate material, to completely eliminate electromagnetic wave reflection, diffraction , extreme phenomena and so on 'thus can achieve the purpose of effectively and completely absorb broadband electromagnetic interference. And by using the technology of the present invention, the substrate 30 can be directly manufactured into an electronic product casing 'or other electromagnetic wave protection component, which does not need to be attached with other electromagnetic wave protection components, and the processing procedure is exactly the same as that of the conventional plastic material processing program. It can effectively reduce the cost of electronic product casing production. Further, the present invention can be used to manufacture various coating materials, so that it can be widely applied to electromagnetic wave protection of various products, and the application layer of the present invention can be extended to electromagnetic wave protection of various daily necessities. (Simplified description of the drawing) The ring 1 is a schematic sectional view of a substrate to which the electromagnetic wave resistant particulate material of the first embodiment of the present invention is added. Ring 2 is a schematic cross-sectional structure of a substrate to which the anti-electromagnetic 〇 particulate material of the second embodiment of the present invention is added. The ring 3 is a cross-sectional structural circle of a substrate to which the electromagnetic wave resistant particulate material of the third embodiment of the present invention is added. Fig. 4 is a schematic sectional view showing a structure of a substrate to which an electromagnetic wave resistant particulate material according to a fourth embodiment of the present invention is added. The ring 5 is a structural schematic ring which is made of an electronic product made by the technique of the present invention. Fig. 6 is a schematic view showing the state of use of the electromagnetic wave shielding plate member manufactured by the technique of the present invention. 18 200947466 Fig. 7 is a schematic view showing the state of use of an electromagnetic wave protection tube body made by the technique of the present invention. Fig. 8 is an enlarged view showing the structure of an anti-electromagnetic wave material formed by adding a nano-particle of an elongated structure to a plastic material by the technique of the present invention. Fig. 9 is an electron microscopic sharp enlarged view of a material structure of a material obtained by adding a pure granular nanoparticle material to a plastic knee material t. 〇(Main component symbol description) 10 Conductive particulate material with elongated structure 10B Conductive particulate material with granular structure 20 Electromagnetic wave absorbing granule material 30 Substrate 40 External 41 Circuit component 50 Ο 60 Protective tube power / information Line 19

Claims (1)

200947466 十、申請專利範圍: 1. 一種複合式電磁波微粒材料,係包含至少一種導電性微 粒材料,其係可添加於一基材之中,而使得該基材具有 吸收及遮蔽電磁波之特性; 其特徵在於: 該導電性微粒材料中至少一部份係呈管狀/織維狀 之長形結構之導電性微粒材料,因此當其添加於該基材 内部時,各該呈長形結構的導電性微粒材料係可相互鍊 〇 結形成不規則形狀交織的結構,因此產生跨電性,而使 得該基材内部的導電性提高,具有吸收/遮蔽電磁波之 特性《» 2. 如申請專利範圍第1項所述之複合式電磁波微粒材 料’其中該長形結構之導電性微粒材料係可選自奈米碳 管、碳纖維、奈米碳屑、導電金屬絲等呈長形結構之導 電性材料的其中一種或一種以上之混合。 3. 如申請專利範圍第1項所述之複合式電磁波徵粒材 Ο 料’其中該導電性微粒材料係由管狀/織維狀的長形結 構之導電性微粒材料,混合顆粒狀之導電性微粒材料, 藉由該長形結構微粒材料與顆粒狀結構微粒材料相互 鍊結形成以不規則形狀交織的結構,以增加該導電性微 粒材料的跨電性》 4. 如申請專利範園第3項所述之複合式電磁波微粒材料, 其中該顆粒狀結構導電微粒材料係可選用自石墨、碳六 十、竹碳等碳系材料其中至少一種或多種材料之混合, 且製成奈米碳球或不規則形狀之奈米碳屑等不規則形 20 200947466 狀之顆粒.狀微粒。 5.如申請專利範面第3項所述之複合式電磁波微粒材料, 其中該顆粒狀導電性微粒材料可選用選自金、銀、銅、 鐵、生鐵、鋁、鎳、錫,純矽、矽鐵等導電性金屬材料 其中至少一種或是多種材料之多種混合而成所製成之 不規則顆粒狀微粒β 6·如申請專利範固第3項所述之複合式電磁波微粒材料, 其中該導電性微粒材料可由申請專利範圍第4項所述之 〇 碳系材料與申請專利範圍第5項所述之導電性金屬材料 之微粒混合而成。 7. 如申請專利範圍第1項所述之複合式電磁波微粒材料, 其可進一步包含電磁波吸收微粒材料,藉以吸收前述導 電性微粒材料所阻擋之電磁波產生之反射及繞射,並將 電磁波之能董消耗轉換為熱能,以達到消除電磁波之目 的。 8. 如申請專利範圍第7項所述之複合式電磁波微粒材料, 〇 其中該電磁波吸收微粒材料係可選用自氡化鋁、氧化 鋅、二氧化鈦、光觸媒材料、鐵氡化物等金属氧化物的 其中至少一種或多種材料之微粒混合。 9. 如申請專利範面第7項所述之複合式電磁波微粒材料, 其t該電磁波吸收微粒材料係可為磁性粉艎,前述磁性 粉馥可為具磁性之金屬材料,以及具磁性之金屬氧化物 材料· 10. 如申請專利範圍第7項所述之複合式電磁波擻粒材 料’其中該電磁波吸收微粒材料係可選用自選自水泥、 21 200947466 陶土、黏土,碳酸鈣,或其他金屬礦石等天然礦物材料 的其中之一或多種材料的混合。 11. 如申請專利範圍第1項所述之複合式電磁波微粒材 料’其中該基材係為塑膊/橡膊等類型之高分子材料, 且可經由射出成形或其他塑膠成形加工方法將該高分 子基材製成各種形狀或形式之塑/橡骖製品〇 12. 如申請專利範固第π項所述之複合式電磁波微粒材 料’係於前述高分子基材聚合過程中摻雜入到該高分子 〇 基材中。 13. 如申請專利範团第η項所述之複合式電磁波微粒材 料’係將前述高分子基材粉碎為粉體狀,再將前述複合 式電磁波微粒材料摻雜入到該基材中,再將該高分子基 材以塑膠射出或其他塑膠加工方式加工為各種塑膠製 品β 14. 如申請專利範圍第η項所述之複合式電磁波微粒材 料’係將前述複合式電磁波微粒材料於該高分子基材為 © 原料粉狀態下摻雜入到該基材之粉體中,並加以混合 後,再將該高分子基材之粉體製成顆粒,以利於後續之 射出成形或其他塑驂加工製程進行。 15·如申請專利範面第u項所述之複合式電磁波微粒材 料,係將超過正常摻雜濃度之抗電磁波微粒材料舆前述 高分子基材混合製成高濃度母粒,再將前述高濃度母粒 與其他一般之高分子基材之顆粒混合後,再以一般塑膠 射出成形或其他加工方式製成塑膠成品。》 16.如申請專利範圍第1丨項所述之複合式電磁波微粒材 22 200947466 料’其中該基材係可製成電子零件外殼β Π,如申請專利範圓第11項所述之複合式電磁波微粒材 料,其中該基材係可製成管狀或平板狀之電磁波遮蔽元 件。 18. 如申請專利範圍第1項所述之複合式電磁波微粒材 料’其中該基材係為樹脂塗料,且該樹脂塗料可以塗裴 或印刷於電子產品、木材、水泥、玻璃、紙張、塑移、 布料、建材表面’或是管材之内表面或外表面物品表 Ο 面,而使得塗附有該樹脂塗料的物品具有吸收及遮蔽電 磁波之能力。 19. 如申請專利範面第1項所述之複合式電磁波微粒材 料’其中該基材係為人造紡織織維材料,前述抗電磁波 微粒材料係均勻分佈於該人造紡織織維基材之中,並可 利用該紡織織維基材製成具有抗電磁波特性之紡織品。 20. 如申請專利範園第1項所述之複合式電磁波微粒材 料,其中該基材係為水泥粉體,且能夠以該水泥粉體製 〇 成具有抗電磁波能力之結搆物。 21·—種複合式電磁波微粒材料,係由至少一種導電性微 粒材料及至少一種電磁波吸收微粒材料混合而成,且能 夠摻合於一基材之中,而使該基材具有遮蔽電磁波穿 透,並吸收電磁波之特性;其中前述導電性微粒材料係 用以使該基材具有導電性,而能夠遮蔽電磁波穿透;前 述電磁波吸收微粒材料係可吸收前述導電性材料粉體 所阻擋之電磁波產生之反射及繞射,並將電磁波之能量 消耗轉換為熱能,以達到消除電磁波之目的。 23 200947466 22. 如申請專利範圍第21 #所述之複合式電磁波微粒材 料,其中該導電性微粒材料係可選用申請專利範面第4 項所述之碳系材料的其中之一或多種材料之混合。 23. 如申請專利範固第2】項所述之複合式電磁波微粒材 料,其令該導電性微粒材料係可選用夺請專利範团第5 項所述之導電性金屬#料的纟中之一或多種材料之混 合。 24. 如申請專到範圍第21項所述之複合式電磁波微粒材 料,其中該電磁波吸收微粒材料係可選用申請專利範团 第8項所述之金屬氧化物材料的其中之一或多種材料之 混合》 25. 如申請專利範園第21項所述之複合式電磁波微粒材 料,其_該電磁波吸收微粒材料係可選用申請專利範圍 第9項所述之磁性粉體材料的其令之一或多種材料之混 合❶ 26. 如申請專利範囡第21項所述之複合式電磁波微粒材 料,其t該電磁波吸收微粒材料係可選用申請專利範園 第10項所述之天然礦物材料的其中之一或多種材料之 混合》 24200947466 X. Patent Application Range: 1. A composite electromagnetic wave particulate material comprising at least one conductive particulate material which can be added to a substrate such that the substrate has the property of absorbing and shielding electromagnetic waves; The method is characterized in that at least a part of the conductive particulate material is a conductive particulate material having an elongated structure of a tubular/woven shape, so that when it is added inside the substrate, the electrical conductivity of each elongated structure The particulate material can be intertwined to form an irregularly interlaced structure, thereby generating a transmissivity, so that the conductivity inside the substrate is improved, and the characteristic of absorbing/shading electromagnetic waves is "» 2. As claimed in the patent scope 1 The composite electromagnetic wave particulate material according to the invention, wherein the conductive particulate material of the elongated structure may be selected from the group consisting of a carbon nanotube, a carbon fiber, a nano carbon scrap, a conductive metal wire, and the like having an elongated structure. One or more blends. 3. The composite electromagnetic wave granule material as described in claim 1, wherein the conductive particulate material is a conductive particulate material of a tubular/woven-shaped elongated structure, and the granular conductive property is mixed. a particulate material, which is formed by interlacing the elongated structural particulate material and the particulate structural particulate material to form an irregularly interwoven structure to increase the electrical conductivity of the conductive particulate material. The composite electromagnetic wave particulate material according to the invention, wherein the particulate structured conductive particulate material is selected from a mixture of at least one or more of carbon materials such as graphite, carbon sixty, and bamboo carbon, and is made into a nano carbon sphere. Or irregular shape of nano carbon scraps and other irregular shapes 20 200947466 Shaped particles. 5. The composite electromagnetic wave particulate material according to claim 3, wherein the particulate conductive particulate material is selected from the group consisting of gold, silver, copper, iron, pig iron, aluminum, nickel, tin, pure germanium, Irregular particulate-like particles made of at least one or a plurality of materials of a conductive metal material such as ferroniobium, and a composite electromagnetic wave particulate material as described in claim 3, wherein The conductive particulate material may be obtained by mixing the bismuth carbon-based material described in claim 4 of the patent application with the fine particles of the conductive metal material described in claim 5 of the patent application. 7. The composite electromagnetic wave particulate material according to claim 1, further comprising an electromagnetic wave absorbing particulate material for absorbing the reflection and diffraction generated by the electromagnetic wave blocked by the conductive particulate material, and absorbing the electromagnetic wave energy Dong consumption is converted into heat energy to achieve the purpose of eliminating electromagnetic waves. 8. The composite electromagnetic wave particulate material according to claim 7, wherein the electromagnetic wave absorbing particulate material is selected from the group consisting of aluminum oxide, zinc oxide, titanium dioxide, photocatalyst material, iron oxide and the like. Mixing particles of at least one or more materials. 9. The composite electromagnetic wave particulate material according to claim 7, wherein the electromagnetic wave absorbing particulate material may be a magnetic powder, the magnetic powder may be a magnetic metal material, and a magnetic metal Oxide material · 10. The composite electromagnetic wave granule material as described in claim 7 wherein the electromagnetic wave absorbing particulate material may be selected from the group consisting of cement, 21 200947466 clay, clay, calcium carbonate, or other metal ores, etc. A blend of one or more of the natural mineral materials. 11. The composite electromagnetic wave particulate material according to claim 1, wherein the substrate is a polymer material of a type such as a plastic collar/rubber, and can be high by injection molding or other plastic forming processing methods. The molecular substrate is made into a plastic/rubber product of various shapes or forms. 12. The composite electromagnetic wave particulate material described in the patent application § π is doped into the polymer substrate during the polymerization process. In a polymer matrix. 13. The composite electromagnetic wave particulate material according to item η of the patent application group is characterized in that the polymer substrate is pulverized into a powder form, and the composite electromagnetic wave particulate material is doped into the substrate, and then The polymer substrate is processed into various plastic products by plastic injection or other plastic processing method. 14. The composite electromagnetic wave particulate material as described in claim n is the composite electromagnetic wave particulate material in the polymer. The substrate is doped into the powder of the substrate in the state of the raw material powder, and after mixing, the powder of the polymer substrate is granulated to facilitate subsequent injection molding or other plastic processing. The process is carried out. 15. The composite electromagnetic wave particulate material as described in the application of the patent specification, in which the anti-electromagnetic wave material material exceeding the normal doping concentration is mixed with the polymer substrate to form a high-concentration masterbatch, and then the high concentration is The masterbatch is mixed with the particles of other general polymer substrates, and then finished into a plastic product by general plastic injection molding or other processing methods. 16. The composite electromagnetic wave particulate material 22 according to the scope of claim 1 200947466, wherein the substrate can be made into an electronic component casing β Π, as described in the patent specification No. 11 Electromagnetic wave particulate material, wherein the substrate can be made into a tubular or flat electromagnetic wave shielding element. 18. The composite electromagnetic wave particulate material according to claim 1, wherein the substrate is a resin coating, and the resin coating can be applied or printed on electronic products, wood, cement, glass, paper, plastic transfer. The surface of the fabric or building material is either the inner surface of the pipe or the surface of the outer surface of the pipe, so that the article coated with the resin coating has the ability to absorb and shield electromagnetic waves. 19. The composite electromagnetic wave particulate material according to claim 1, wherein the substrate is a synthetic textile material, and the electromagnetic wave resistant material is uniformly distributed in the artificial textile substrate, and The textile woven base material can be used to produce a textile having electromagnetic wave resistance. 20. The composite electromagnetic wave particulate material according to claim 1, wherein the substrate is a cement powder, and the cement powder system can be used to form a structure having an electromagnetic wave resistance. 21—a composite electromagnetic wave particulate material obtained by mixing at least one conductive particulate material and at least one electromagnetic wave absorbing particulate material, and capable of being blended into a substrate to shield the substrate from electromagnetic waves And absorbing electromagnetic wave characteristics; wherein the conductive particulate material is used to make the substrate conductive and can shield electromagnetic wave penetration; the electromagnetic wave absorbing particulate material can absorb electromagnetic waves generated by the conductive material powder The reflection and diffraction, and the energy consumption of the electromagnetic wave is converted into heat energy, so as to eliminate the electromagnetic wave. 23 200947466 22. The composite electromagnetic wave particulate material according to claim 21, wherein the conductive particulate material is selected from one or more of the carbon-based materials described in claim 4 of the patent application. mixing. 23. The composite electromagnetic wave particulate material according to claim 2, wherein the conductive particulate material is selected from the group of conductive metal materials described in claim 5 of the patent specification. A mixture of one or more materials. 24. The composite electromagnetic wave particulate material according to claim 21, wherein the electromagnetic wave absorbing particulate material is selected from one or more of the metal oxide materials described in claim 8 of the patent application group. Mixing 25. The composite electromagnetic wave particulate material according to claim 21 of the patent application, the electromagnetic wave absorbing particulate material may be one of the orders of the magnetic powder material described in claim 9 or Mixing of various materials ❶ 26. For the composite electromagnetic wave particulate material described in claim 21, the electromagnetic wave absorbing particulate material may be selected from the natural mineral materials described in claim 10 of the patent application. Mixture of one or more materials" 24
TW97116158A 2008-05-02 2008-05-02 Anti-electromagnetic interference material arrangement TW200947466A (en)

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US9506194B2 (en) 2012-09-04 2016-11-29 Ocv Intellectual Capital, Llc Dispersion of carbon enhanced reinforcement fibers in aqueous or non-aqueous media
TWI582183B (en) * 2014-11-06 2017-05-11 張仁鴻 Coating having function of eliminating electromagnetic waves and converting the electromagnetic waves into far-infrared rays
CN114846565A (en) * 2019-12-25 2022-08-02 株式会社自动网络技术研究所 Electric wire for communication

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TW517002B (en) * 1999-07-12 2003-01-11 Ind Tech Res Inst Electromagnetic shielding multi-layered structure and method of making the same
JP4665499B2 (en) * 2004-12-10 2011-04-06 三菱マテリアル株式会社 Metal fine particles, production method thereof, composition containing the same, and use thereof
TW200800606A (en) * 2006-06-29 2008-01-01 Shiu Li Technology Co Ltd Multi-layered composite capable of conducting heat and absorbing electromagnetic wave and manufacturing method thereof

Cited By (3)

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Publication number Priority date Publication date Assignee Title
US9506194B2 (en) 2012-09-04 2016-11-29 Ocv Intellectual Capital, Llc Dispersion of carbon enhanced reinforcement fibers in aqueous or non-aqueous media
TWI582183B (en) * 2014-11-06 2017-05-11 張仁鴻 Coating having function of eliminating electromagnetic waves and converting the electromagnetic waves into far-infrared rays
CN114846565A (en) * 2019-12-25 2022-08-02 株式会社自动网络技术研究所 Electric wire for communication

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