TW200946956A - Method of making an electrowetting device, apparatus for carrying out the method and electrowetting device - Google Patents

Method of making an electrowetting device, apparatus for carrying out the method and electrowetting device Download PDF

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TW200946956A
TW200946956A TW97145223A TW97145223A TW200946956A TW 200946956 A TW200946956 A TW 200946956A TW 97145223 A TW97145223 A TW 97145223A TW 97145223 A TW97145223 A TW 97145223A TW 200946956 A TW200946956 A TW 200946956A
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Taiwan
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substrate
fluid
sealing member
sealing
electrowetting
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TW97145223A
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Chinese (zh)
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TWI456256B (en
Inventor
Harrie C M Hermens
Charles R M Schmidgall
Robert A Hayes
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Liquavista Bv
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/004Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid

Abstract

A method of making an electrowetting device including a first substrate, a second substrate and a sealing member. The method comprises: a first step of applying a first fluid and a second fluid on the first substrate, the first and second fluid being immiscible; a second, subsequent step of attaching the sealing member to the first substrate; a step of attaching the sealing member to the second substrate; the attaching of the sealing member forming a cavity enclosed by the first substrate, the second substrate and the sealing member, the cavity comprising the first fluid and the second fluid; and a step of curing the sealing member.

Description

200946956 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種製造一電濕潤裝置之方法、一種實行 該方法之設備,及一種根據該方法所製造的電濕潤裝置。 【先前技術】 . 一顯示裝置通常包括兩個密封在一起的基板以形成一孔 • & ’該孔穴包括顯示—顯示效果之構件。在-液晶(LC)顯 φ *裝置巾,該構件為一液晶材料。LC顯示裝置有兩種常用 的製造方法。一第一方法係將一密封材料的圖案配置於一 基板上,將一第二基板附著至該密封材料,藉此在該兩個 基板之間形成一孔穴。該孔穴具有一開口,透過該開口將 該孔穴填充以該LC材料,通常係在真空下進行填充。 一第二方法為美國專利申請案第2〇〇5/〇〇94〇84號中已知 所謂的滴定式注入法(〇ne-dr〇p fiIHng)。其於一基板上配 置一封閉的密封材料圖帛,藉此形成一系列開口容器。將 〇 LC材料點滴施配在各容器中。將一第二基板附著至該密封 材料封閉該谷器並且形成一系列填充有材料之密封孔 八义y頁精確選擇該點滴大小以避免溢出或未填滿該孔 穴。 將2等顯示技術應用於電濕潤裝置,是為產量低且無法 7人滿意的操作裝置之費力方法。尤其當該裝置為— 電濕潤顯示裝晉技 _ 置時’該等孔穴之填充通常導致顯示器之顯 不效果的性無法達到可接受的程度。 因此, 赞明之一目的係提供一種製造一濕潤電極裝置 I36i24.doc 200946956 之經改良的方法、一種用於實行該方法之設備,及一種經 改良的電濕潤裝置。 【發明内容】200946956 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a method of manufacturing an electrowetting device, an apparatus for carrying out the method, and an electrowetting device manufactured according to the method. [Prior Art] A display device typically includes two substrates sealed together to form a hole. & The hole includes a display-display effect member. In the liquid crystal (LC) display φ * device towel, the member is a liquid crystal material. There are two common manufacturing methods for LC display devices. A first method is to arrange a pattern of a sealing material on a substrate, and attach a second substrate to the sealing material, thereby forming a hole between the two substrates. The aperture has an opening through which the aperture is filled with the LC material, typically under vacuum. A second method is known as the so-called titration injection method (〇ne-dr〇p fiIHng) in U.S. Patent Application Serial No. 2/5/94. It is provided with a closed sealing material pattern on a substrate to form a series of open containers. The 〇LC material was dispensed into each container. Attaching a second substrate to the sealing material encloses the granulator and forms a series of sealed holes filled with material. The y-page is precisely selected to avoid spillage or unfilling of the crater. The application of the 2nd display technology to the electrowetting device is a laborious method for operating devices that are low in yield and cannot be satisfied by seven people. In particular, when the device is a device that is filled with such holes, the filling of the holes generally results in an inability to achieve an acceptable level of performance. Accordingly, one of the aims is to provide an improved method of making a wet electrode assembly I36i24.doc 200946956, an apparatus for carrying out the method, and an improved electrowetting apparatus. [Summary of the Invention]

❹ 本發明之目的係以一種製造一包含一第一基板、一第二 基板及一密封構件之電濕潤裝置之方法而予以實現,該方 法包括一第一步驟,將一第一流體及一第二流體施加於該 第一基板上,該第一流體及該第二流體為不互溶;一第二 後續步驟,將該密封構件附著至該第一基板;將該密封構 件附著至該第一基板之一步驟;該密封構件之該附著形成 由該第一基板、該第二基板及該密封構件所圍封之一孔 穴,該孔穴包含該第一流體及該第二流體;固化該密封構 件之一步驟。 在該最終裝置中,該密封構件係附著於該第一基板及該 第二基板兩者。其中,本發明係關於將該密封構件附著至 該等基板之順序且進行產生該裝置之其他步驟。 該方法在將該密封構件附著至該第一基板之前,將該第 一流體及該第二流體施加於該第一基板。該密封構件在製 備好的裝置中將該第一基板及該第二基板連接。含有該等 流體之孔穴係藉由該第一基板、該第二基板及該密封構件 而予以圍封。在將該第一流體及該第二流體施加於該第一 基板期間’該[基板實質上無諸如密封構件之突出之障 礙物。障礙物會影響該基板丨的流體劑量。當該第—基板 表面實質上為平坦時’流體劑量將僅取決於該表面 潤性及該兩種流體之特性,產生—準確且可靠的劑量。因 136124.doc 200946956 :相較於先前技術之方法,根據本發明之方法利用具有 彼封構件之基板而能夠較好地控制流體劑量。 、根據本發明之方法不需要如在先前技術中之滴定式注入 法所需之準確劑量。本方法極適於製造一水中電濕潤裝 置,例如該第二流體為水且該第一流體可為油之一裝置。 將該密封構件附著至該第二基板之步驟可在將該等流體 ' 施加於該第一基板上之前或之後實行。該密封構件之固化 Φ 可在將該兩個基板藉由該密封構件而組合之後實行。或 者,利用固化作用之延遲,能夠在組合該等基板之前實行 諸如輻射之固化的一引發劑,該固化係在該組合之後進 行。 該方法尤其適於製造電濕潤裝置,例如透鏡、光濾波 器、晶片上的實驗室’且特別係電濕潤顯示裝置。圍封一 孔穴之兩個基板可形成一包含一圖像元素或複數個像素元 件之顯示裝置。 ❹ 在該電濕潤裝置之一特殊實施例中,可將該第一流體施 加於兩個基板。在該情形下,較佳在將該密封構件附著於 基板之前將該等流體施加於兩個基板。 該方法亦可用於製造一包括三或三個以上基板之電濕潤 裝置,兩個基板各藉由一密封構件而連接β在使用根據本 發明之方法填充並連接最初的兩個基板之後,可再次使用 該方法將此對基板連接至第三基板。可將該第一流體施加 於每對基板中之一者或兩者。 在組合該第一基板及該第二基板之前可將該密封構件附 136124.doc • 8 · 200946956 著至該第二基板,該應用具有以下優點:可在流體不存在 之情況下將該密封構件附著至該第二基板。亦可在將該等 流體施加於該第一基板之後且在將該兩個基板組合之前, 將該密封構件附著至該第—基板。該兩個基板及該密封構 件亦可以一個動作而組合。The object of the present invention is achieved by a method of manufacturing an electrowetting device comprising a first substrate, a second substrate and a sealing member, the method comprising a first step of applying a first fluid and a first a second fluid is applied to the first substrate, the first fluid and the second fluid are immiscible; a second subsequent step of attaching the sealing member to the first substrate; attaching the sealing member to the first substrate a step of forming the sealing member to form a hole surrounded by the first substrate, the second substrate and the sealing member, the hole containing the first fluid and the second fluid; curing the sealing member One step. In the final device, the sealing member is attached to both the first substrate and the second substrate. Among other things, the present invention relates to the order in which the sealing member is attached to the substrates and the other steps of producing the device. The method applies the first fluid and the second fluid to the first substrate prior to attaching the sealing member to the first substrate. The sealing member connects the first substrate and the second substrate in a prepared device. The holes containing the fluids are enclosed by the first substrate, the second substrate, and the sealing member. During the application of the first fluid and the second fluid to the first substrate, the [substrate is substantially free of obstacles such as protrusion of the sealing member. The obstacle affects the fluid dose of the substrate. When the surface of the first substrate is substantially flat, the fluid dose will only depend on the surface wettability and the characteristics of the two fluids, resulting in an accurate and reliable dose. 136124.doc 200946956: The method according to the invention makes it possible to better control the fluid dose by means of a substrate having a sealing member compared to the method of the prior art. The method according to the invention does not require the exact dose required for the titration injection method as in the prior art. The method is highly suitable for the manufacture of a hydro-wetting device, for example the second fluid is water and the first fluid can be one of the oil devices. The step of attaching the sealing member to the second substrate may be performed before or after applying the fluids to the first substrate. The curing Φ of the sealing member can be carried out after the two substrates are combined by the sealing member. Alternatively, by the delay of the curing action, an initiator such as radiation curing can be carried out prior to combining the substrates, the curing being carried out after the combination. This method is particularly suitable for the manufacture of electrowetting devices, such as lenses, optical filters, labs on wafers, and in particular electrowetting display devices. The two substrates enclosing a hole can form a display device comprising an image element or a plurality of pixel elements. ❹ In one particular embodiment of the electrowetting device, the first fluid can be applied to both substrates. In this case, it is preferred to apply the fluid to the two substrates before attaching the sealing member to the substrate. The method can also be used to manufacture an electrowetting device comprising three or more substrates, each of which is connected by a sealing member. After being filled and connected to the first two substrates by the method according to the present invention, the method can be used again. This pair of substrates is attached to the third substrate using this method. The first fluid can be applied to one or both of each pair of substrates. The sealing member can be attached to the second substrate before combining the first substrate and the second substrate, and the application has the following advantages: the sealing member can be in the absence of fluid Attached to the second substrate. The sealing member may be attached to the first substrate after the fluids are applied to the first substrate and before the two substrates are combined. The two substrates and the sealing member can also be combined in one operation.

可以一特定圖案將該密封構件施加於該基板上。這可藉 由將社封材料自-注射II直接施配於該基板上或藉由使用 網版印刷而^以實現。或者,該密封構件可為-在該附著 之前所製造並具有預定圖案之經圖案化之密封構件,亦稱 為-密封框架。使用此種密封框架,例如藉由使用來自一 輥輪上之一經圖案化之層可簡化該裝置之製造。 該經圖案化之密封構件之一特殊實施例依下列順序包 含:該密封材料之一第一層、-固體材料之-載體’及該 密封材料之-第二層。密封材料之該等層及該載體較佳具 有該預定圖案之形式。該載體對該經圖案化之密封構件提 供尺寸穩疋性有助於在將該密封材料施加於該基板之前 處理該密封材料°由於該載體會《該最終裝置之部件, 所以其亦有助於使該兩個基板保持在—規定距離處。 該等基板之間的密封構件 嫌❹署W 饵件了藉由將-個經圖案化的密封 構件配置於另一個經圖宰 該情形下,該密封構件依下Γ 部而構成。在 g —韶I* 下列順序包括:,密封材料、一 第:載、、密封材料、一第二载體及密封材料。 条·該密封構件包含一制 件之處理。該剝落層亦可則有助於該密封構 具有該預疋圖案。該剝落層較佳 136I24.doc -9- 200946956 係在將該兩個基板組合之前不久移除。在將該經圖案化的 密封構件施加於該基板上與將該兩個基板組合之間的時間 内,該密封材料不會受到污染。該密封構件亦可在兩側上 皆具有一剝落層。在將該密封構件施加於一基板上之前, 移除一剝落層。在將該兩個基板組合之前,移除另一剝落 層。 該方法可包括在該密封構件中形成圖案之步驟。該圖案 可藉由任何適當方式而形成,較佳使用雷射切割或衝模切 割。可將一圖案形成於該密封材料、該載體及/或該剝落 層中。 在該電濕调裝置中,該第二流體較佳為導電性或極性, 且該第一基板具有相對於該第二流體較為不可濕潤之一第 一表面區域及相對於該第二流體較為可濕潤之一第二表面 區域’該方法包含將該密封構件施加於該第二表面區域之 步驟。在將該第-流體及該第二流體施加於該卜基板之The sealing member can be applied to the substrate in a specific pattern. This can be achieved by applying the self-injection material directly to the substrate from the injection II or by using screen printing. Alternatively, the sealing member can be a patterned sealing member, also known as a - sealing frame, fabricated prior to the attachment and having a predetermined pattern. The use of such a sealing frame simplifies the manufacture of the device, for example by using a patterned layer from one of the rollers. A particular embodiment of the patterned sealing member comprises, in the following order, a first layer of the sealing material, a carrier of the solid material, and a second layer of the sealing material. The layers of the sealing material and the carrier preferably have the form of the predetermined pattern. The carrier provides dimensional stability to the patterned sealing member to facilitate processing of the sealing material prior to application of the sealing material to the substrate. Since the carrier will "part of the final device, it will also help The two substrates are held at a prescribed distance. The sealing member between the substrates dissipates the W bait member by arranging the one patterned sealing member to the other, and the sealing member is constructed according to the lower jaw. The following sequence in g - 韶I* includes: a sealing material, a first loading, a sealing material, a second carrier, and a sealing material. The sealing member comprises a part of the process. The peeling layer may also contribute to the sealing structure having the pre-twist pattern. Preferably, the exfoliation layer is removed 136I24.doc -9- 200946956 shortly before combining the two substrates. The sealing material is not contaminated during the time between application of the patterned sealing member to the substrate and combination of the two substrates. The sealing member may also have a peeling layer on both sides. A peeling layer is removed prior to applying the sealing member to a substrate. Another peeling layer is removed before combining the two substrates. The method can include the step of forming a pattern in the sealing member. The pattern can be formed by any suitable means, preferably by laser cutting or die cutting. A pattern may be formed in the sealing material, the carrier, and/or the exfoliation layer. In the electrowetting device, the second fluid is preferably electrically conductive or polar, and the first substrate has a first surface area that is less wettable relative to the second fluid and is relatively permeable to the second fluid. Wetting one of the second surface regions 'The method includes the step of applying the sealing member to the second surface region. Applying the first fluid and the second fluid to the substrate

後’該第-流體將在相對於該第二流體較為不可濕调之區 域上形成薄層’且該第二流體將覆蓋此薄並 基板鄰接於該第二表面區域,哕、第 埤該第一表面區域相對於該第 一流體較為可濕潤。, 當將該密封構件提供於該第二表面區域中時,該密封材 保二Γ體接觸’且可經最優化以使該第二流體 二袅面厂祕八内部。相反地’若將該密封構件施加於該第 :=域:則該密封材料將與該第一流體及該第二流體 接觸。很難形成一可將該第-流體及該第二流體兩者 Z36124.doc 200946956 皆保持在該孔穴内部之密封材料。在該第一流體及該第二 流韹分別為油及水之情形下,該密封材料係提供於該第二 表面區域上,該第二表面區域相較於該第一表面區域較為 親水。 "亥枪封構件較佳係藉由將其經由存在於一 -第二流想層而黏合至該第一基板之該第二:面= 加於該第一基板。After the 'the first fluid will form a thin layer on the area that is less wettable with respect to the second fluid' and the second fluid will cover the thin and the substrate is adjacent to the second surface area, 埤, 埤A surface area is relatively wettable relative to the first fluid. When the sealing member is provided in the second surface region, the sealing material is in contact with the body and can be optimized to internalize the second fluid. Conversely, if the sealing member is applied to the := field: the sealing material will be in contact with the first fluid and the second fluid. It is difficult to form a sealing material that retains both the first fluid and the second fluid Z36124.doc 200946956 inside the cavity. In the case where the first fluid and the second streamer are oil and water, respectively, the sealing material is provided on the second surface region, the second surface region being relatively hydrophilic compared to the first surface region. " The rifle seal member is preferably bonded to the first substrate by bonding it to the first substrate via the first-second flow stratification layer.

❹ 藉由施加壓力於該密封構件±,可將該冑封材料黏合至 該等基板。該壓力施加係-種尤其適用於密封電㈣裝置 之可靠方法。可利用υν轄射、施加一升高的溫度或利用 一沉殿時間作為單獨的固化步驟或組合㈣而使該密封材 料固化。 根據本發明之方法尤其適於製造複數個電濕潤裝置,其 中該第-基板係共驗料裝置,且財法包括在形成該 等孔穴後切割該第一基板之步驟。一破璃基板之切割可利 用劃線及斷裂來實行。該㈣通常係在使該密封材料固化 後實行。 該方法可用於製造複數個具有一共同第一基板及單獨的 板之裝置。該方法包括下列步驟:針對每—裝置提 :-密封構件’及將每一第二基板與該共同第一基板组 S。在密封後切割該第一基板。該製程可使該第二基板之 形狀不同於該第一基板之形狀, 於劃線及斷裂。 之形狀無需通 該方法亦可詩製造複數個具有1同第—基板及一共 136124.doc -11 - 200946956 同第二基板之裝置。該方法包含下列步驟:提供一密封構 件及共用於該等裝置的一第二基板;將該共同第一基板及 該共同第二基板組合;及切割該第一基板及該第二基板。 該等方法的步驟中之至少一者較佳係以一連續製程實 行。舉例而言,該第一基板、第二基板及/或密封構件可 供應自一輥輪。若成品的電濕潤裝置係纏繞於一觀輪上, 則可使該方法進一步自動化,藉此形成一輥對輥製程。胄 The sealing material can be bonded to the substrates by applying pressure to the sealing member ±. This pressure application system is particularly suitable for use in a reliable method of sealing electrical (4) devices. The sealing material can be cured by means of υν, applying an elevated temperature or using a chamber time as a separate curing step or combination (4). The method according to the present invention is particularly suitable for fabricating a plurality of electrowetting devices, wherein the first substrate is a co-inspection device, and the method includes the step of cutting the first substrate after forming the holes. The cutting of a broken glass substrate can be carried out by scribing and breaking. This (4) is usually carried out after curing the sealing material. The method can be used to fabricate a plurality of devices having a common first substrate and a separate plate. The method includes the steps of: - sealing member ' and each of the second substrate and the common first substrate group S for each device. The first substrate is cut after sealing. The process allows the shape of the second substrate to be different from the shape of the first substrate for scribing and breaking. The shape does not need to be passed through this method to create a plurality of devices having the same substrate and a total of 136124.doc -11 - 200946956 and the second substrate. The method comprises the steps of: providing a sealing member and a second substrate common to the devices; combining the common first substrate and the common second substrate; and cutting the first substrate and the second substrate. At least one of the steps of the methods is preferably carried out in a continuous process. For example, the first substrate, the second substrate, and/or the sealing member can be supplied from a roller. If the finished electrowetting device is wound on a wheel, the method can be further automated, thereby forming a roll-to-roll process.

本發明之另一態樣係關於一種利用根據本發明之方法製 造一電濕潤裝置之設備。 本發明亦關於一種包含一第一基板及一第二基板之電濕 潤裝置,該第一基板及該第二基板係藉由一密封構件而妗 合並且形成一孔穴,該孔穴包含一第一流體及一第二導電 性或極性流體,該第一流體及該第二流體為不互溶該第 一基板具有相對於該第二流體較為不可濕潤之一第一表面 區域及相對於該第二流體較為可濕潤之一第二表面區域 其中該密封構件係配置於該第二表面區域上。 本發明進一步關於一種包含一第一基板及一第二基板之 電濕潤裝置,該第一基板及該第二基板係藉由一密封構件 而結合並且形成一孔穴’該孔穴包含一第一流體及—第_ 導電性或極性流體,該第一流體及該第二流體為不互溶^ 該第一基板具有相對於該第二流體較為不可濕润之—第— 表面區域及相對於該第二流體較為可濕潤之一第_ 乐一1表面區 域’其中該密封構件包含一壓敏黏合劑。當該密封材料為 一壓敏黏合劑時’藉由施加壓力使密封材料黏合,可才γ 136124.doc -12- 200946956 簡單地整合於製造該電濕潤裝置之方法中。 該密封構件可包含兩個密封材料層之間的一固體材料之 一載體’形成一具有適當界定的厚度之構件。 3亥第一基板及該第二基板可具有不同形狀。 從以下參考附圖、以純粹實例的方式提出之對本發明之 . 較佳實施例的描述中,將可明白本發明之進一步特徵及優 • 點。 【實施方式】 ® 1顯示利用-種根據本發明《方法組裝兩個基板以形 成一電濕潤裝置。該電濕潤裝置之實施例係一具有四個圖 像7L素之電濕潤顯示裝置。該電濕潤裝置包括一第一流體 及一第一流體。該第一流體及該第二流體為不互溶。該第 一流體為非導電性且例如可為一如十六烷或(聚矽氧)油之 烧烴。該第-流體較佳為不透明,但可為有色或白色。該 第二流體為導電性或極性,且可為水或一鹽溶液,例如在 β 纟與乙醇的混合物中之氣化鉀溶液。該第二流體較佳為透 明,但可為有色、白色、吸收的或反射的。 圖la顯示該第一基板丨之俯視圖。該第一基板包括相對 於該第二流體較為不可濕潤之四個第一表面區域2及相對 力該第=流體較為可濕濁之一個第二表面區域3。該第二 表面區域圍封該等第一表面區域。該四個第一表面區域相 應於顯示裝置之該四個圖像元素且係配置於-顯示區域4 中。當該第一流體為油且該第二流體為水時,第一表面區 域為疏水性,且第二表面區域為親水性。 136124.doc •13· 200946956 該等表面區域之W、Bq Μ 了濕潤性特性可藉由適當選擇基板材 枓、處理該基板表面或將一層施加於該基板表面上而獲 :。:清楚起見’該等圖式中將該等表面區域顯示為一 田該基板材料提供該第二表面區域3之特性時,該第 二表面區域延伸至圖la中之該基板i之邊緣。 舉例而言,第一矣而F成 & 表面區域可藉由一諸如AF1600之非晶 性含氟聚合物層或另—低表面能量聚合物而形成。該疏水 ❹ 特性使得該第一流體優先黏合至該第一表面區域,此乃因 為疏水層相對於該第一流體之可濕潤性高於其相對於該第 流體之可濕潤性。該第二表面區域可藉由一光阻層(例 :U8)而形成。儘管以上說明密封構件係附著至該基板或 該基板之-表面或表面區域’或將一流體施加於該基板或 該基板之一表面或表面區域之處,該基板被認為包含配置 於該基板上之任何固體層,例如控制該可濕潤性之上述 層0 可濕潤性係指一流體對固體表面之相對親和力。可濕潤 性隨著親和力增加而增加,且其可藉由形成於該流體與該 固間的接觸角度而予以量測’且有利地在所關注流體 内°卩罝測。其從處於一大於90。的角度時的相對非可濕潤 性增加到當該接觸角度為〇。時的完全可濕潤性,在該接觸 角度為0。之情形中,該流體趨向於在該固體表面上形成一 膜。 圖1 b顯示該第二基板5之一俯視圖。一密封材料係以— 預疋圖案配置於該基板上,在此實施例中為具有圍封該顯 136124.doc -14· 200946956 不區域4之一形狀的一正方形6。利用一注射器,使其可依 照該預定圖案而施配該密封材料。為避免由於該注射開始 而在圖案中產生材料厚度不均之情形該注射較佳始於該 顯示區域外部,且接著朝向該預定圖案繼續注射。或者, 該密封材料可具有可配置於該基板上之一密封框架之形 式。 ' 圖顯示在組裝該第一基板丨及該第二基板5之前該兩個 φ 基板之一橫截面。該橫截面係沿著圓la中的線Α-Α»圖ie 亦以橫截面顯示密封材料6之條紋。 該第一基板已具有第一流體7,該第一流體7僅與第一表 面區域2鄰接。一種將該第一流體施加於該第一基板上之 方法係將該基板浸沒在該第二流體例如水之浴槽中。該第 一流體,例如油,係藉由一施配器而施配在該基板表面 上,該施配器具有一接近該表面且浸沒於該第二流體中之 長型開口。該施配器在一垂直於該開口之長度方向之方向 〇 上於該表面上移動。該第一流體係施配在該施配器之長度 上作為一第一流體薄膜。由於該表面包括相對於該第一流 . 體之可濕潤性高於其相對於該第二流體之可濕潤性之第一 表面區域及相對於該第二流體之可濕潤較高之第二表面區 域,該第一流體將優先與該等第一表面區域鄰接,而不會 覆蓋該等第二表面區域。 當使用以上用於施加該第一流體之方法時,結合該兩個 基板之步驟較佳係在該第二流體浴槽中實行。將該第二基 板5放入該浴槽中,其中注意避免空氣被捕集在該基板 136124.doc -15· 200946956 下。 將該兩個基板1及5對準且壓合在一起,使得該兩個基板 獲得如圖Id所示之理想的相互距離。㈣封材料在該兩個 基板之間形成一密封構件8。該密封構件在兩個基板之間 . 封閉成一孔穴9。該孔穴包含與該等第一表面區域2鄰接之 該第一流體7及捕集於該孔穴中之該第二流體1〇。該等圖 " 式為示意性’為清楚起見而擴大了一些尺寸。 φ 該密封8係形成於該第二表面區域3上,在此實施例中為 形成於親水區域上。由於無第一流體與此區域鄰接,所以 該密封之孔穴側僅與該第二流體鄰接。可針對一種流體進 行密封材料的最佳化選擇。若該密封係形成於該等第一區 域之一者上,則該第一流體會與該密封之下部鄰接,且該 第二流體會與該密封之上部鄰接。相對困難的係找到可承 受如該第一流體及該第二流體之兩種相異的流體。 該密封材料6較佳係一壓敏黏合劑(PSA),如可購自 ❹ 3M。使該材料在壓力施加下而黏合至該等基板。該密封 構件可藉由施加UV光而予以固化。該密封構件之厚度可 在10微米與1〇〇微米之間。應注意與油的接觸會使大多數 壓敏黏合劑之黏合劣化。 該等基板可由例如玻璃或聚合物製成,且可為剛性或撓 性。如圖Id所示之顯示裝置具有一檢視侧12及一後側13, 該檢視側12上可檢視一由該顯示裝置所形成的影像或顯 示;。該第一基板1面向該後侧,該第二基板5面向該檢視 側12 °在一替代實施例中,該顯示可從該後側13檢視。該 136124.doc • 16 - 200946956 顯示裝置可為反射型、透射型或半透射半反射型。 該第一流體7在該第一表面區域2上的位置可藉由一施加 於β亥等圖中未顯示之電極中之電場而予以控制。該等電極 及s亥裝置之操作之詳情描述於國際專利申請案第 W003/071346號中。Another aspect of the invention pertains to an apparatus for making an electrowetting device using the method of the present invention. The invention also relates to an electrowetting device comprising a first substrate and a second substrate, the first substrate and the second substrate being kneaded by a sealing member and forming a hole, the hole comprising a first fluid And a second conductive or polar fluid, the first fluid and the second fluid are immiscible, the first substrate has a first surface area that is less wettable relative to the second fluid, and is opposite to the second fluid One of the second surface regions may be wetted wherein the sealing member is disposed on the second surface region. The invention further relates to an electrowetting device comprising a first substrate and a second substrate, wherein the first substrate and the second substrate are combined by a sealing member and form a hole, the hole comprising a first fluid and a _ conductive or polar fluid, the first fluid and the second fluid being immiscible, the first substrate having a relatively non-wettable relative to the second fluid - a first surface region and relative to the second fluid One of the more wettable _Le-1 surface areas 'where the sealing member comprises a pressure sensitive adhesive. When the sealing material is a pressure sensitive adhesive, the sealing material is bonded by applying pressure, and γ 136124.doc -12- 200946956 is simply integrated into the method of manufacturing the electrowetting device. The sealing member may comprise a carrier of a solid material between two layers of sealing material forming a member having a suitably defined thickness. The first substrate of the 3H and the second substrate may have different shapes. Further features and advantages of the present invention will become apparent from the following description of the preferred embodiments. [Embodiment] ® 1 shows that two substrates are assembled according to the method of the present invention to form an electrowetting device. An embodiment of the electrowetting device is an electrowetting display device having four images of 7L. The electrowetting device includes a first fluid and a first fluid. The first fluid and the second fluid are immiscible. The first fluid is non-conductive and may, for example, be a hydrocarbon such as hexadecane or (polyoxy) oil. The first fluid is preferably opaque, but may be colored or white. The second fluid is electrically conductive or polar and may be water or a salt solution, such as a potassium hydride solution in a mixture of beta hydrazine and ethanol. The second fluid is preferably transparent, but may be colored, white, absorbing or reflective. Figure la shows a top view of the first substrate. The first substrate includes four first surface regions 2 that are less wettable relative to the second fluid and a second surface region 3 that is relatively wettable with the first fluid. The second surface area encloses the first surface areas. The four first surface areas correspond to the four image elements of the display device and are disposed in the - display area 4. When the first fluid is oil and the second fluid is water, the first surface area is hydrophobic and the second surface area is hydrophilic. 136124.doc •13· 200946956 The W, Bq 湿润 wettability characteristics of these surface areas can be obtained by appropriately selecting the base material, treating the surface of the substrate or applying a layer to the surface of the substrate. : For clarity, the surface areas are shown in the drawings as the substrate material provides the properties of the second surface region 3, the second surface region extending to the edge of the substrate i in FIG. For example, the first surface and the F & surface region can be formed by an amorphous fluoropolymer layer such as AF1600 or another low surface energy polymer. The hydrophobic hydrazine property preferentially bonds the first fluid to the first surface region because the wettability of the hydrophobic layer relative to the first fluid is higher than its wettability relative to the first fluid. The second surface region can be formed by a photoresist layer (Example: U8). Although the sealing member is attached to the substrate or the surface or surface region of the substrate or a fluid is applied to the substrate or a surface or surface region of the substrate, the substrate is considered to be disposed on the substrate. Any of the solid layers, such as the above-described layer 0 wettability which controls the wettability, refers to the relative affinity of a fluid to a solid surface. Wettability increases with increasing affinity, and it can be measured by the angle of contact formed between the fluid and the solid' and is advantageously measured within the fluid of interest. It is at a greater than 90. The relative non-wetability of the angle is increased when the contact angle is 〇. The complete wettability at this point is 0 at this contact angle. In this case, the fluid tends to form a film on the solid surface. Figure 1 b shows a top view of the second substrate 5. A sealing material is disposed on the substrate in a pre-twisted pattern, in this embodiment a square 6 having a shape enclosing one of the regions 136124.doc -14·200946956. A syringe is utilized to dispense the sealing material in accordance with the predetermined pattern. In order to avoid a situation in which the thickness of the material is uneven in the pattern due to the start of the injection, the injection preferably starts outside the display area, and then continues the injection toward the predetermined pattern. Alternatively, the sealing material can have a form that can be disposed on one of the sealing frames on the substrate. The figure shows a cross section of one of the two φ substrates before assembling the first substrate 丨 and the second substrate 5. The cross section shows the strips of the sealing material 6 in cross section along the line Α-Α» Figie in the circle la. The first substrate already has a first fluid 7, which is only adjacent to the first surface region 2. A method of applying the first fluid to the first substrate is to immerse the substrate in a bath of the second fluid, such as water. The first fluid, such as oil, is dispensed onto the surface of the substrate by a dispenser having an elongated opening adjacent the surface and submerged in the second fluid. The dispenser moves over the surface in a direction 垂直 perpendicular to the length of the opening. The first flow system is dispensed as a first fluid film over the length of the dispenser. Since the surface includes a first surface region that is more wettable relative to the wettability of the first fluid relative to the second fluid and a second wettable surface region that is higher in wettable relative to the second fluid The first fluid will preferentially abut the first surface regions without covering the second surface regions. When the above method for applying the first fluid is used, the step of combining the two substrates is preferably carried out in the second fluid bath. The second substrate 5 is placed in the bath, taking care to avoid trapping air under the substrate 136124.doc -15·200946956. The two substrates 1 and 5 are aligned and pressed together such that the two substrates achieve a desired mutual distance as shown in Figure Id. (4) The sealing material forms a sealing member 8 between the two substrates. The sealing member is between the two substrates. It is closed into a hole 9. The aperture includes the first fluid 7 adjacent the first surface regions 2 and the second fluid 1 捕 trapped in the aperture. The figures " are schematic 'expanded' for size. φ The seal 8 is formed on the second surface region 3, in this embodiment on the hydrophilic region. Since no first fluid is adjacent to this region, the sealed cavity side is only adjacent to the second fluid. Optimized selection of sealing materials for a fluid. If the seal is formed on one of the first regions, the first fluid will abut the lower portion of the seal and the second fluid will abut the upper portion of the seal. A relatively difficult system finds that it can withstand two distinct fluids, such as the first fluid and the second fluid. The sealing material 6 is preferably a pressure sensitive adhesive (PSA) such as commercially available from ❹3M. The material is bonded to the substrates under pressure application. The sealing member can be cured by applying UV light. The sealing member may have a thickness between 10 microns and 1 inch. It should be noted that contact with oil can degrade the adhesion of most pressure sensitive adhesives. The substrates may be made of, for example, glass or a polymer and may be rigid or flexible. The display device shown in FIG. 1D has a viewing side 12 and a rear side 13, and the viewing side 12 can view an image or display formed by the display device. The first substrate 1 faces the rear side, and the second substrate 5 faces the viewing side 12°. In an alternative embodiment, the display can be viewed from the rear side 13. The 136124.doc • 16 - 200946956 display unit can be reflective, transmissive or transflective. The position of the first fluid 7 on the first surface region 2 can be controlled by an electric field applied to an electrode not shown in the figure. Details of the operation of the electrodes and the sigma apparatus are described in International Patent Application No. W003/071346.

圖2顯示一密封框架形式的密封構件之兩項不同實施 例。此種密封框架能夠以一種與以上使用一注射器之方法 不同的方法將該密封材料施加於一基板上。圖2&顯示一密 封構件15之一橫截面。該密封框架包含一密封材料之層 16,該冑封材才斗具有密封該裝置之子L穴所S的預定形狀。 該密封框架可於一側上具有一剝落層17,如該圖中所示, 但亦可被提供於兩側上。該剝落層可對該密封框架提供強 度,有助於處理該密封框架並能夠將該密封框架儲存於一 輥輪上。必須在結合該兩個基板之前將該剝落層從該密封 材料移除。在將結合該兩個基板之前不久,可在該密封框 架被浸沒在該第二流體浴槽中時移除該剝落層。該剝落層 可具有該預定形狀,但其亦可為無該預定形狀之一薄片或 帶材。 '3 q股何竹例如諸如 PET之類的聚合物之一載體21之兩側上具有兩層密封材料 19及20。該密封㈣及該㈣具有該敎形狀。該密封框 架可具有-剝落層22,以虛線表示。密封材料之各層之厚 度可為25微米,且該载體之厚度可為25微米。 在製造該電濕潤裝置之程序中,可在該第。二基板5被結 136124.doc -17- 200946956 合至該第一基板1之前,將該密封構件15或該密封框架18 附著至該第二基板。結合前的基板丨及5之橫截面類似於圖 lc所示。或者,可在該等流體被施加於該第一基板後,將 該密封框架附著至該第一基板。結合之前的基板之橫截面 顯示於圖3a中。亦有可能於該兩個基板之間將該密封構件 對準並且將該兩個基板與該密封框架壓合在一起,如圖讣 所示。 該等密封框架可在用於一設備實行根據本發明之方法之Figure 2 shows two different embodiments of a sealing member in the form of a sealing frame. The sealing frame can be applied to a substrate in a different manner than the above method using a syringe. Figure 2 & shows a cross section of a sealing member 15. The sealing frame comprises a layer 16 of sealing material having a predetermined shape that seals the sub-hole S of the device. The sealing frame may have a peeling layer 17 on one side, as shown in the figure, but may also be provided on both sides. The spalling layer provides strength to the sealing frame, aids in processing the sealing frame and enables the sealing frame to be stored on a roller. The peeling layer must be removed from the sealing material prior to bonding the two substrates. The spalling layer can be removed while the sealing frame is submerged in the second fluid bath shortly before the two substrates are to be bonded. The peeling layer may have the predetermined shape, but it may also be a sheet or strip without the predetermined shape. The '3 q-stranded bamboo, for example, one of the polymers 21 such as PET, has two layers of sealing materials 19 and 20 on both sides. The seal (four) and the (four) have the shape of the crucible. The sealing frame can have a peeling layer 22, indicated by a dashed line. The thickness of each layer of the sealing material can be 25 microns and the thickness of the carrier can be 25 microns. In the procedure for manufacturing the electrowetting device, this can be used. The second substrate 5 is bonded to 136124.doc -17- 200946956 before the first substrate 1 is attached, the sealing member 15 or the sealing frame 18 is attached to the second substrate. The cross-section of the substrate 丨 and 5 before bonding is similar to that shown in Figure lc. Alternatively, the sealing frame may be attached to the first substrate after the fluid is applied to the first substrate. The cross section of the substrate before bonding is shown in Figure 3a. It is also possible to align the sealing member between the two substrates and press the two substrates together with the sealing frame, as shown in FIG. The sealing frames can be used in a device for carrying out the method according to the invention

前製造成該預定圖案。該等密封框架可為待由該 儲存區拾取之單獨的密封框架,或其可藉由該剝落層結合 以形成一成捲之帶材。 或者,可切割該等密封框架’作為該製造方法之部分。 為達到此目的,該設備需H台,其巾該密封框_ 如藉由-雷射或一衝模而予以切割。該經圖案化的密封框 架從此工作台被輸送到將該等基板結合之工作台。 根據本發明t製造該電濕潤裝置之方法係極適於在一軍 一基板上製造複數個電濕潤裝置。圖4顯示在—單一基板 上之複數個裝置的—橫戴面及—俯視圖。在該實施例中所 示的裝置數目為十二,組成三列,每列四個裝置。對於該 十二個裝置26中之每一裝置,該第一基板25具有第一表面 區域及第二表面區域之一圖# ’類似於圖u。該等裝置之 間的表面區域2 7具有與該第二表面區域相同的可濕潤性。 該第-基板係共用於各裝置,而各裝置㈣有其各自的第 二基板28。 136124.doc -18· 200946956 在製期間,將該第一流體及該第二流體施加於該第一 基板25上。在對準於該第一基板之適當位置後,接著將該 等第土板8之各個結合至該第一基板。該密封材料29可 藉由以上所述方法中之任一者而予以施加。當施加於該等 . 第一基板時,各第二基板個別具有該密封材料。當施加於 該第-基板時,可針對所有的十二個裝置以一單一圓案逐 • -施加該密封材料。該結合較佳係在H體浴槽中實 Φ 行。在使該密封構件固化後,切割該第-基板以分離該等 裝置。當該第一基板係由玻璃製成時,該切割將包含一劃 線及斷裂程序。 圖5顯示在切割前之一系列裝置之一俯視圖。該等裝置 具有一共同第一基板30及單獨的第二基板31。該等第二基 板具有一特殊形式,其偏離於矩形,可相對簡單地製造: 然而,若該等裝置具有一共同第二基板,則製造此等形狀 為相對較難,特別係當該切割需要劃線及斷裂時。該等第 ❹ 一基板31可為彎曲形,例如使該孔穴形成一圓頂形。 圖6顯示共同地具有兩個基板之複數個裝置之一橫戴面 及一俯視圖。該第一基板35具有類似於圖4中之該第一基 板乃之第一表面區域及第二表面區域之一圖案。在填充該 等流體後,將一第二基板36結合至該第一基板。當該第二 基板36係II由-配置於其表面之一者上之彩色滤光器而予 以圖案化時,該兩個基板在結合之前必須先對準。該密封 材料37可以一單一圖案而施加至例如該第一基板或該第二 基板。在使密封構件固化後,切割該第一基板及該第二基 136124.doc •19· 200946956 板。該圖顯示該第二基板上之線38’沿著該等線38從該基 板切下由陰影所示之該等裝置。 土 製造—電濕潤裝置之程序可完全機械化。在實行根據本 發明之方法之前,該第一基板較佳係經過以下處理將諸 如電極、電子設備及例如用於反射、吸收或透射之任何光 學層等元件施加於該基板表面上,以及賦予該等表面區域 所需的可濕潤性特性。類似地,該第二基板應具有任何所 需層’例如彩Μ光ϋ。當對切斷連接的組件(例如基板 及密封構件)進行作業時,該等組件可根據該方法藉由一 拾放機器而予以拾取及組裝。Pre-made into the predetermined pattern. The sealing frames may be separate sealing frames to be picked up by the storage area, or they may be joined by the peeling layers to form a roll of tape. Alternatively, the sealing frames can be cut as part of the manufacturing process. In order to achieve this, the device requires H, and the sealing frame is cut by a laser or a die. The patterned seal frame is transported from the table to a table where the substrates are joined. The method of making the electrowetting device in accordance with the present invention is highly suitable for fabricating a plurality of electrowetting devices on a military substrate. Figure 4 shows a cross-sectional and top view of a plurality of devices on a single substrate. The number of devices shown in this embodiment is twelve, constituting three columns, four devices per column. For each of the twelve devices 26, the first substrate 25 has a first surface area and a second surface area. Figure #' is similar to Figure u. The surface area 27 between the devices has the same wettability as the second surface area. The first substrate is used in common for each device, and each device (four) has its own second substrate 28. 136124.doc -18· 200946956 During the manufacturing process, the first fluid and the second fluid are applied to the first substrate 25. After aligning to the appropriate position of the first substrate, each of the equal soil plates 8 is then bonded to the first substrate. The sealing material 29 can be applied by any of the methods described above. When applied to the first substrate, each of the second substrates individually has the sealing material. When applied to the first substrate, the sealing material can be applied in a single round for all twelve devices. Preferably, the combination is in the H body bath. After the sealing member is cured, the first substrate is cut to separate the devices. When the first substrate is made of glass, the cutting will include a scribing and breaking procedure. Figure 5 shows a top view of one of a series of devices prior to cutting. The devices have a common first substrate 30 and a separate second substrate 31. The second substrate has a special form that is offset from the rectangle and can be relatively simple to manufacture: However, if the devices have a common second substrate, it is relatively difficult to fabricate such shapes, particularly when the cutting is required When scribing and breaking. The first substrate 31 may be curved, for example, to form the cavity into a dome shape. Figure 6 shows a cross-face and a top view of one of a plurality of devices having two substrates in common. The first substrate 35 has a pattern similar to one of the first surface area and the second surface area of the first substrate in FIG. After filling the fluids, a second substrate 36 is bonded to the first substrate. When the second substrate 36 is patterned by a color filter disposed on one of its surfaces, the two substrates must be aligned prior to bonding. The sealing material 37 can be applied to, for example, the first substrate or the second substrate in a single pattern. After the sealing member is cured, the first substrate and the second substrate 136124.doc • 19·200946956 are cut. The figure shows that the line 38' on the second substrate cuts the devices shown by the hatching from the substrate along the line 38. The process of making the earth-electric humidifier can be completely mechanized. Prior to performing the method according to the present invention, the first substrate is preferably applied to the surface of the substrate by electrodes, electronic devices, and any optical layer such as for reflection, absorption or transmission, and the like. The wettability characteristics required for the surface area. Similarly, the second substrate should have any desired layer 'e. When the components to be disconnected (e.g., the substrate and the sealing member) are operated, the components can be picked up and assembled by a pick-and-place machine according to the method.

圓7示意顯示一種用於利用一親輪對輥輪式(r〇11-to_roll) 製程製造電濕潤裝置之設備。一包括密封框架之捲帶牦自 輥輪46進給。該捲帶可為—㈣層…密封框架包含於兩 侧^具有黏合劑之載體材料…選削生切割台〇從該載體 材料及黏合劑切下—狀圖案且將該載體材料切成單獨的 載趙。於輥輪46上之該等載體可已㈣具有該預定圖案, 在該清形下無需該切割台。一輥輪48提供 基板附著於其之-捲㈣。在-組裝台5〇中,將= 捲帶49下之該等第二基板及配置於該捲㈣上之該等密封 框架結合。隨後該捲帶45藉由—輥輪⑽從該經組裝的第 一基板及密封構件移除,並且收集於一捲取輥Μ上。 報輪53提供包括第一基板之一捲帶5[該等捲帶的及 54將該等組件輸送到包括一第二流體56之-洛槽55中。在 該冷槽中’配置於該捲帶49下之該等第二基板面向配置於 136124.doc •20- 200946956 該捲帶54上之該等第一基板。一填充·組裴台”係部分配 置於該浴槽上方及該浴槽内,且隨後執行填充該第一基板 及結合該兩個基板之兩個步驟。在該填充步驟期間,使該 兩個捲帶49及54之間的距離夠大以便一施配器在第一基板 上經過,以將一第一流體施配於第一基板上。為清楚起 見,該施配器未顯示於該圖中。在該填充步驟之後,將第 二基板及第一基板對準並緊密接觸^在結合步驟中,將該 兩個基板壓合在一起且使該兩個基板之間的密封固化,形 成一經組裝的裝置。Circle 7 schematically shows an apparatus for manufacturing an electrowetting device using a wheel-to-roll (r〇11-to-roll) process. A web of reel including the sealing frame is fed from the roller 46. The tape can be - (four) layer... The sealing frame is contained on both sides. The carrier material with the adhesive is selected. The cutting table is cut from the carrier material and the adhesive, and the carrier material is cut into individual pieces. Zhao. The carriers on the roller 46 may have (4) have the predetermined pattern in which the cutting table is not required. A roller 48 provides a roll (four) to which the substrate is attached. In the assembly stage 5, the second substrates under the tape 49 and the sealing frames disposed on the roll (4) are joined. The web 45 is then removed from the assembled first substrate and sealing member by a roller (10) and collected on a take-up roll. The register wheel 53 is provided with a reel 5 comprising a first substrate (the strips and 54 are transported into the Lok 55 containing a second fluid 56). The second substrates disposed under the web 49 in the cold bath face the first substrates disposed on the web 54 of 136124.doc • 20-200946956. a filling/combination platform is partially disposed above the bath and in the bath, and then performing two steps of filling the first substrate and bonding the two substrates. During the filling step, the two tapes are made The distance between 49 and 54 is sufficiently large for a dispenser to pass over the first substrate to dispense a first fluid onto the first substrate. For clarity, the dispenser is not shown in the figure. After the filling step, the second substrate and the first substrate are aligned and in close contact. In the bonding step, the two substrates are pressed together and the seal between the two substrates is cured to form an assembled device.

該兩個捲帶49及54將該等經組裝的裝置從該浴槽”輸送 出。一輥輪58將該捲帶49從該等裝置中移除,且將其導引 至一捲取輥59。保持該等裝置之該捲帶54則進給至一捲取 輥60。 應瞭解以上實施例乃作為本發明之闡釋性實例。得構想 本發明之進一步實施例。應瞭解就任何一項實施例所述之 任何特點可單獨使用,亦可與其他所述特點組合使用甚 至與任何其他實施例之一或多個特點組合使用或用於任 何其他實施例之任一組合。此外,在不脫離所附請求項中 斤界疋之本發明之範圍下,亦可採用以上未描述之等效物 及修改。 【圖式簡單說明】 圖la顯示一第一基板之一俯視圖; 圖lb顯示一第二基板之一俯視圖; 圖顯示在組裝前該等基板之一橫載面; 136l24,cJ〇c -21 · 200946956 圖id顯示在組裝後該等基板之一橫截面; 圖2a顯示一包括密封材料之密封框架之一橫截面; 圖2b顯示一替代密封框架之一橫截面; 圖3a及3b顯示在結合之前之兩個基板; 圖4顯示複數個裝置之一橫截面及一俯視圖; 圖5顯示複數個裝置之一俯視圖; 圖6顯示複數個裝置之一橫截面及一俯視圖; 圖7顯示一種用於製造裝置之設備。 【主要元件符號說明】 1 第一基板 2 第一表面區域 3 第二表面區域 4 顯示區域 5 第二基板 6 密封材料 7 第一流體 8 密封構件 9 孔穴 10 第二流體 12 檢視側 13 後側 15 密封構件 16 層 17 剝落層 136124.doc -22· 200946956The two webs 49 and 54 transport the assembled devices from the bath. A roller 58 removes the web 49 from the devices and directs it to a take-up roll 59. The web 54 holding the devices is fed to a take-up roll 60. It is to be understood that the above examples are illustrative of the invention. Further embodiments of the invention are contemplated. Any of the features described in the examples can be used alone or in combination with other features described, or in combination with any one or more of the features of any other embodiment, or in any combination of any of the other embodiments. The equivalents and modifications not described above may also be used in the scope of the present invention in the appended claims. [Simplified Schematic] FIG. 1a shows a top view of a first substrate; FIG. a top view of one of the substrates; the figure shows a cross-sectional surface of the substrates before assembly; 136l24, cJ〇c - 21 · 200946956 Figure id shows a cross section of the substrates after assembly; Figure 2a shows a sealing material One of the sealing frames Figure 2b shows a cross section of an alternative sealing frame; Figures 3a and 3b show two substrates before bonding; Figure 4 shows a cross section and a top view of a plurality of devices; Figure 5 shows a top view of a plurality of devices; Figure 6 shows a cross section and a top view of one of a plurality of devices; Figure 7 shows an apparatus for manufacturing a device. [Description of main components] 1 First substrate 2 First surface area 3 Second surface area 4 Display area 5 Two substrate 6 sealing material 7 first fluid 8 sealing member 9 hole 10 second fluid 12 inspection side 13 rear side 15 sealing member 16 layer 17 peeling layer 136124.doc -22· 200946956

18 19 20 21 22 25 26 27 28 29 30 31 35 36 37 38 45 46 47 48 49 50 51 52 密封構件 層 層 載體 剝落層 第一基板 裝置 表面區域 第二基板 密封材料 第一基板 第二基板 第一基板 第二基板 密封材料 線 捲帶 輥輪 切割台 輥輪 捲帶 組裝台 輥輪 捲取輥 136124.doc -23- 200946956 53 輥輪 54 捲帶 55 浴槽 56 第二流體 57 填充-組裝台 58 輥輪 59 捲取輥 60 捲取輥 ⑩ 136124.doc -24-18 19 20 21 22 25 26 27 28 29 30 31 35 36 37 38 45 46 47 48 49 50 51 52 Sealing member Layer carrier peeling layer First substrate device Surface area Second substrate sealing material First substrate Second substrate First Substrate Second Substrate Sealing Material Line Reel Roller Cutting Table Roller Reel Assembly Table Roller Reel Roller 136124.doc -23- 200946956 53 Roller 54 Reel 55 Bath 56 Second Fluid 57 Filling - Assembly Table 58 Roller Wheel 59 take-up roll 60 take-up roll 10 136124.doc -24-

Claims (1)

200946956 十、申請專利範固: 1. 一種製造-包含—第—基板、—第二基板及—密封構件 之=濕潤襄置之方法,該方法包括: 一 步驟將一第一流體及一第二流體施加於該第 -一板上’該第—流體及該第二流體為不互溶; -第二後續步驟,將該密封構件附著至該第一基板; 將該密封構件附著至該第二基板之-步驟; ❹ ❹ 該密封構件之該财宴_报 ^ 附者形成—由該第一基板、該第二基 及該第:::件所圍封之孔穴,該孔穴包含該第-流體 固化該密封構件之一步驟。 板盘::1之方法其包括下列步驟:在組合該第-基 於;第:基板之前,將該密封構件以-預定圖案施加 於該第二基板上。 3.如請求項1之方法, 作”匕括下列步驟··提供該密封構件 二 密 其中該密封構件依下列順序包含 一密封材料之一第一屉 〜I貝斤匕3 封材料之一第二層。層、-固體材料之-載體’及 ΠΓ3之方法,其中該密封構件包含-剝落層。 6.如睛求項丨之方法,其 割或衝模切割在該密封 驟.較佳藉由雷射切 …求項!之方法ΓΓ中形成該圖案。 且該第—基板 ,、该第―流體料電性或極性, 基板具有相對於該第二流體較為不可㈣之一 I36124.doc 200946956 第表面區域,及相對於兮笛 -身以 第—流體較為可濕潤之-第 面區域上之步驟。 “密封構件施加於該第二表 8.如請求項7之方法,其包 __A 、 列步驟:透過存在於該第 二板上之該第二流體之—層而黏合至該第二表面區 I 之方法,其中利用施加壓力於該密封構件上 ❹ 使°亥密封構件黏合至該等基板。 1〇.如請求項1之方法,其中該密封構件之 玎饵仵之s亥固化包含將UV 释射或熱施加於該密封構件。 11. 一種製造複數個如請求項!之電濕淵裝置之方法,其中 該第—基板係共用於該等裝置,該方法包括在形成該等 孔穴後切割該第一基板之步驟。 12. 如請求項丨丨之製造複數個電濕潤裝置之方法,該方法包 括下列步驟:針對該等裝置之各者提供一密封構件及一 ® 第二基板;及組合該等第二基板之各者與該共同第一美 板0 13. 14. 15. 如請求項12之製造複數個電濕潤裝置之方法,其中在切 割後,該第一基板與該第二基板具有一不同形狀。 置之方法’該方法包 共用於該等裝置之第 如請求項11之製造複數個電濕潤裝 括下列步驟:提供一密封構件及一 二基板;組合該共同第一基板與該共同第二基板;及切 割該第—基板及該第二基板。 如請求項11至14中任一項之製造複數個電濕潤裝置之方 136124.doc 200946956 法’其中該等步驟之至少—者係以—連續程 16. 種製造一或多個如請求項1至14中杯—s w . _ . . ^ 中任一項之電濕潤裝 置之方法’其中該電濕潤震置為一電濕潤顯示裝置。 17. -種用於利用一如請求項114中任一項之 電濕潤裝置之設備。 18. 一:i含一第一基板及一第二基板之電漏潤裝置,該第 板及該第一基板係藉由一密封構件而結合並且形成 〇 ::六,該孔穴包含-第-流艘及一第二導電性或極性 流體’該第-流體及該第二流體為不互溶,該第一基板 具有相對於該第二流體較為不可濕潤" 〜弟一表面區域 及相對於該第二流體較為可濕潤之一 弗一表面區域,其 中該密封構件係配置於該第二表面區域上。 19. 如請求項18之電濕潤裝置,其中 在封構件包含一密封 材料之兩層之間的一固體材料之一栽體。 20. 如請求項18之電濕潤裝置,其中該 乐基板與該第二基 ❹ 板具有一不同形狀。 21 一種包含一第一基板及一第二基板 w <電濕潤裝置,該第 一基板及該第二基板係藉由一密封構件 何件而結合並且形成 一孔穴’該孔穴包含一第一流體及一笛_播 第一導電性或極性 流體,該第—流體及該第二流It為不互溶,該第一基板 具有相對於該第二流體較為不可濕潤 弟^一表面區域 及相對於該第二流體較為可濕潤之—笛_ 第一表面區域,其 中該密封構件包含一壓敏黏合劑。 22.如請求項21之電濕潤裝置’其中該 在封構件包含一密封 136124.doc 200946956 材料之兩層之間的一固體材料之—載體 23. 如請求項21之電濕潤裝置,其中兮银 丹肀該第一基板與該第二恭 板具有一不同形狀, 24. 如請求項18至23中任一項之電濕 "氣电屑潤裝置,其中該電濕濶 裝置為一電濕潤顯示裝置。 25· —種製造包含一第一基板、一第-其知 弟一基板及一密封構件之 一電濕潤裝置之方法,該方法包括: ❹ Ο 將第-流體及一第二流體施加於該第—基板上之〆 步驟,該第一流體及該第二流體為不互溶; 將該密封構件附著至該第一基板之一步驟; 將該密封構件附著至該第二基板之一步驟;及 固化該密封構件之一步驟; 當該密封構件附著至該第一基板及該第二基板且固化 時’形成由該第一基板、該第二基板及該密封構件所圍 封之孔穴’該孔穴包含該第一流體及該第二流體。 136124.doc -4 -200946956 X. Patent application: 1. A method for manufacturing a -including - a substrate, a second substrate and a sealing member = a wet device, the method comprising: a step of a first fluid and a second Applying a fluid to the first plate: the first fluid and the second fluid are immiscible; - a second subsequent step of attaching the sealing member to the first substrate; attaching the sealing member to the second substrate The step of the sealing member is formed by a hole enclosed by the first substrate, the second base and the first::: the hole containing the first fluid One step of curing the sealing member. The method of the plate::1 includes the step of applying the sealing member to the second substrate in a predetermined pattern before combining the first substrate. 3. The method of claim 1, wherein "the following steps are provided: the sealing member is provided. The sealing member comprises one of the sealing materials in the following order: one of the first drawers - one of the three sealing materials. a layer, a method of - a solid material - a carrier, and a crucible 3, wherein the sealing member comprises a peeling layer. 6. A method of cutting or die cutting in the sealing step. The pattern is formed in the method of laser cutting, and the first substrate, the first fluid is electrically or polar, and the substrate has one (four) relative to the second fluid. I36124.doc 200946956 a surface area, and a step on the first surface area relative to the flute-body-wet-wet fluid. "The sealing member is applied to the second table 8. The method of claim 7, the package __A, column a method of bonding to the second surface region I through a layer of the second fluid present on the second plate, wherein the sealing member is bonded to the substrate by applying pressure to the sealing member . The method of claim 1, wherein the sealing member of the sealing member comprises applying UV release or heat to the sealing member. 11. One way to make multiple items like a request! The method of an electric wetland device, wherein the first substrate is used in combination with the device, the method comprising the step of cutting the first substrate after forming the holes. 12. The method of claim 1, wherein the method comprises the steps of: providing a sealing member and a second substrate for each of the devices; and combining the second substrates 13. The method of manufacturing a plurality of electrowetting devices of claim 12, wherein the first substrate and the second substrate have a different shape after cutting. The method of manufacturing the plurality of electrowettings as claimed in claim 11 is the following steps: providing a sealing member and a substrate; combining the common first substrate and the common second substrate And cutting the first substrate and the second substrate. The method of manufacturing a plurality of electrowetting devices according to any one of claims 11 to 14 136124.doc 200946956 The method wherein at least one of the steps is a continuous process 16. One or more such as claim 1 The method of electrowetting device of any one of the four cups - sw. _ . . ^ wherein the electrowetting is an electrowetting display device. 17. Apparatus for utilizing an electrowetting device according to any one of claims 114. 18. A: an electric leakage device comprising a first substrate and a second substrate, wherein the first plate and the first substrate are combined by a sealing member and form a crucible: six, the cavity comprising - the first The flow vessel and a second conductive or polar fluid 'the first fluid and the second fluid are immiscible, the first substrate has a non-wettable relative to the second fluid and a surface area relative to the second fluid The second fluid is more wettable than the surface area, wherein the sealing member is disposed on the second surface area. 19. The electrowetting device of claim 18, wherein the sealing member comprises a carrier of a solid material between two layers of a sealing material. 20. The electrowetting device of claim 18, wherein the music substrate has a different shape than the second substrate. 21 includes a first substrate and a second substrate w < electrowetting device, the first substrate and the second substrate are combined by a sealing member and form a hole. The hole comprises a first fluid And a flute _ broadcasting a first conductive or polar fluid, the first fluid and the second flow It are immiscible, the first substrate has a surface area that is relatively non-wettable relative to the second fluid and relative to the The second fluid is relatively wettable - the first surface area, wherein the sealing member comprises a pressure sensitive adhesive. 22. The electrowetting device of claim 21, wherein the sealing member comprises a solid material between the two layers of the seal 136124.doc 200946956. The carrier 23. The electrowetting device of claim 21, wherein the silver is immersed in silver The first substrate of the tantalum has a different shape from the second square, 24. The electrowetting "air power chipping device of any one of claims 18 to 23, wherein the electric wet device is an electrowetting device Display device. 25. A method of manufacturing an electrowetting device comprising a first substrate, a substrate, and a sealing member, the method comprising: applying a first fluid and a second fluid to the first a step on the substrate, the first fluid and the second fluid being immiscible; a step of attaching the sealing member to the first substrate; a step of attaching the sealing member to the second substrate; and curing a step of sealing the member; forming a hole surrounded by the first substrate, the second substrate, and the sealing member when the sealing member is attached to the first substrate and the second substrate and curing The first fluid and the second fluid. 136124.doc -4 -
TW097145223A 2007-11-21 2008-11-21 Method of making an electrowetting device, apparatus for carrying out the method and electrowetting device TWI456256B (en)

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