TW200942826A - Probe unit - Google Patents
Probe unitInfo
- Publication number
- TW200942826A TW200942826A TW98104606A TW98104606A TW200942826A TW 200942826 A TW200942826 A TW 200942826A TW 98104606 A TW98104606 A TW 98104606A TW 98104606 A TW98104606 A TW 98104606A TW 200942826 A TW200942826 A TW 200942826A
- Authority
- TW
- Taiwan
- Prior art keywords
- needles
- coil spring
- substrate
- plunger
- needle
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
A probe unit, maintainable with ease and at low costs, comprises: a plurality of contact probe respectively including a plurality of substantively pin-shaped first plunger; a coil spring connected to the first plunger with one end and being extensible and contractible along the axe of the first needle; a second needle of which the longitudinal length being greater than the first needles and a part of which being freely insertable into the inner peripheral portion of the coil spring from the other end of the coil spring and freely removable therefrom vice versa; a retaining substrate for receiving the first needles and the coil springs separately; and a cartridge substrate configured to receive the second needles respectively and being detachable attached to the retaining substrate upon alignment of longitudinal axes of the first needles, coil springs, and second needles. With the cartridge substrate being attached to the retaining substrate, the second needles are in contact with a compact wound portion of the coil spring, wherein the longitudinal axis of the compact wound portion is aligned with that of the second needles.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008033507 | 2008-02-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200942826A true TW200942826A (en) | 2009-10-16 |
TWI388839B TWI388839B (en) | 2013-03-11 |
Family
ID=40957060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW98104606A TWI388839B (en) | 2008-02-14 | 2009-02-13 | Probe unit |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5394264B2 (en) |
TW (1) | TWI388839B (en) |
WO (1) | WO2009102030A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI457573B (en) * | 2010-11-17 | 2014-10-21 | Nhk Spring Co Ltd | Probe unit |
CN109143024A (en) * | 2017-06-28 | 2019-01-04 | 株式会社友华 | Contact measuring head and checking tool |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101415722B1 (en) * | 2010-06-25 | 2014-07-25 | 니혼 하츠쵸 가부시키가이샤 | Contact probe and probe unit |
MY184937A (en) | 2012-08-03 | 2021-04-30 | Yamamoto Precious Metal Co Ltd | Alloy material, contact probe, and connection terminal |
JP6556612B2 (en) * | 2015-12-04 | 2019-08-07 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
JP2021085725A (en) * | 2019-11-27 | 2021-06-03 | 株式会社日本マイクロニクス | probe |
US11215642B2 (en) * | 2020-03-04 | 2022-01-04 | Winway Technology Co., Ltd. | Electronic test device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1795906B1 (en) * | 2000-06-16 | 2009-10-28 | Nhk Spring Co.Ltd. | Microcontactor probe |
JP2002062312A (en) * | 2000-08-22 | 2002-02-28 | Toyo Denshi Giken Kk | Contact device |
JP2005292060A (en) * | 2004-04-02 | 2005-10-20 | Totsuka Densi Kk | Inspection tool for printed circuit board |
JP2007322136A (en) * | 2006-05-30 | 2007-12-13 | Inoue Shoji Kk | Continuity inspection tool for printed wiring board |
-
2009
- 2009-02-13 WO PCT/JP2009/052428 patent/WO2009102030A1/en active Application Filing
- 2009-02-13 TW TW98104606A patent/TWI388839B/en not_active IP Right Cessation
- 2009-02-13 JP JP2009553467A patent/JP5394264B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI457573B (en) * | 2010-11-17 | 2014-10-21 | Nhk Spring Co Ltd | Probe unit |
CN109143024A (en) * | 2017-06-28 | 2019-01-04 | 株式会社友华 | Contact measuring head and checking tool |
Also Published As
Publication number | Publication date |
---|---|
JP5394264B2 (en) | 2014-01-22 |
WO2009102030A1 (en) | 2009-08-20 |
TWI388839B (en) | 2013-03-11 |
JPWO2009102030A1 (en) | 2011-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |