TW200942826A - Probe unit - Google Patents

Probe unit

Info

Publication number
TW200942826A
TW200942826A TW98104606A TW98104606A TW200942826A TW 200942826 A TW200942826 A TW 200942826A TW 98104606 A TW98104606 A TW 98104606A TW 98104606 A TW98104606 A TW 98104606A TW 200942826 A TW200942826 A TW 200942826A
Authority
TW
Taiwan
Prior art keywords
needles
coil spring
substrate
plunger
needle
Prior art date
Application number
TW98104606A
Other languages
Chinese (zh)
Other versions
TWI388839B (en
Inventor
Toshio Kazama
Kohei Hironaka
Shigeki Ishikawa
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of TW200942826A publication Critical patent/TW200942826A/en
Application granted granted Critical
Publication of TWI388839B publication Critical patent/TWI388839B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A probe unit, maintainable with ease and at low costs, comprises: a plurality of contact probe respectively including a plurality of substantively pin-shaped first plunger; a coil spring connected to the first plunger with one end and being extensible and contractible along the axe of the first needle; a second needle of which the longitudinal length being greater than the first needles and a part of which being freely insertable into the inner peripheral portion of the coil spring from the other end of the coil spring and freely removable therefrom vice versa; a retaining substrate for receiving the first needles and the coil springs separately; and a cartridge substrate configured to receive the second needles respectively and being detachable attached to the retaining substrate upon alignment of longitudinal axes of the first needles, coil springs, and second needles. With the cartridge substrate being attached to the retaining substrate, the second needles are in contact with a compact wound portion of the coil spring, wherein the longitudinal axis of the compact wound portion is aligned with that of the second needles.
TW98104606A 2008-02-14 2009-02-13 Probe unit TWI388839B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008033507 2008-02-14

Publications (2)

Publication Number Publication Date
TW200942826A true TW200942826A (en) 2009-10-16
TWI388839B TWI388839B (en) 2013-03-11

Family

ID=40957060

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98104606A TWI388839B (en) 2008-02-14 2009-02-13 Probe unit

Country Status (3)

Country Link
JP (1) JP5394264B2 (en)
TW (1) TWI388839B (en)
WO (1) WO2009102030A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI457573B (en) * 2010-11-17 2014-10-21 Nhk Spring Co Ltd Probe unit
CN109143024A (en) * 2017-06-28 2019-01-04 株式会社友华 Contact measuring head and checking tool

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101415722B1 (en) * 2010-06-25 2014-07-25 니혼 하츠쵸 가부시키가이샤 Contact probe and probe unit
MY184937A (en) 2012-08-03 2021-04-30 Yamamoto Precious Metal Co Ltd Alloy material, contact probe, and connection terminal
JP6556612B2 (en) * 2015-12-04 2019-08-07 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
JP2021085725A (en) * 2019-11-27 2021-06-03 株式会社日本マイクロニクス probe
US11215642B2 (en) * 2020-03-04 2022-01-04 Winway Technology Co., Ltd. Electronic test device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1795906B1 (en) * 2000-06-16 2009-10-28 Nhk Spring Co.Ltd. Microcontactor probe
JP2002062312A (en) * 2000-08-22 2002-02-28 Toyo Denshi Giken Kk Contact device
JP2005292060A (en) * 2004-04-02 2005-10-20 Totsuka Densi Kk Inspection tool for printed circuit board
JP2007322136A (en) * 2006-05-30 2007-12-13 Inoue Shoji Kk Continuity inspection tool for printed wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI457573B (en) * 2010-11-17 2014-10-21 Nhk Spring Co Ltd Probe unit
CN109143024A (en) * 2017-06-28 2019-01-04 株式会社友华 Contact measuring head and checking tool

Also Published As

Publication number Publication date
JP5394264B2 (en) 2014-01-22
WO2009102030A1 (en) 2009-08-20
TWI388839B (en) 2013-03-11
JPWO2009102030A1 (en) 2011-06-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees