TW200939172A - Resin sheet for circuit substrates, sheet for circuit substrates, and circuit substrate for displays - Google Patents

Resin sheet for circuit substrates, sheet for circuit substrates, and circuit substrate for displays Download PDF

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Publication number
TW200939172A
TW200939172A TW98102704A TW98102704A TW200939172A TW 200939172 A TW200939172 A TW 200939172A TW 98102704 A TW98102704 A TW 98102704A TW 98102704 A TW98102704 A TW 98102704A TW 200939172 A TW200939172 A TW 200939172A
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Taiwan
Prior art keywords
circuit board
resin sheet
sheet
meth
wiring
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TW98102704A
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Chinese (zh)
Inventor
Tatsuo Fukuda
Yasunori Karasawa
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Lintec Corp
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Publication of TW200939172A publication Critical patent/TW200939172A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

Resin sheet for circuit substrates (2) containing a layer for forming wiring which is a resin sheet obtained from energy ray curing polymer material. The cured product of the resin sheet by irradiating with an energy ray at a quantity of light of 300 mJ/cm2 has a swelling rate after being dipped in ethanol at 23 DEG C for 10 minutes satisfies the following relation (1): Swelling rate (%)=[(thickness of the sheet after being dipped-thickness of the sheet before being dipped)/(thickness of the sheet before being dipped)]x100 ≤ 4.0. . . (1). The resin sheet for circuit substrates (2) can advantageously be used for efficiently producing circuit substrate for displays, particularly planer displays into which circuit chips (3) is embedded for controlling each of the pixels in a high quality and at a high productivity.

Description

200939172 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種顯示器用之電路基板用樹脂片、電 路基板用片及顯示器用電路基板。更詳言之，本發明係關 於爲了在品質佳、高生產性之狀況下有效率的製作爲了控 制顯示器用（尤其，平面顯示器用）之各像素，而埋入電 路晶片之電路基板的硬化物之耐藥品性優良的顯示器用之 電路基板用樹脂片、電路基板用片、及使用其所得之由埋 Q 入電路晶片而成之顯示器用電路基板。 【先前技術】 - 習知，於液晶顯示器所代表之平面顯示器中，例如， 藉由CVD法（化學蒸氣沈積法）等，在玻璃基板上依序積 層絕緣膜、半導體膜等，經歷相同於製作半導體積體電路 之步驟，在構成畫面之各像素附近，形成薄膜電晶體（TFT) 等之微小電子元件，藉此以進行各像素的開、關、濃淡之 控制。亦即，在玻璃基板上之位置點製作TFT等之微小電 〇 子元件。然而，於如此之技術中，步驟既爲多階段且繁雜， 將無法避免成本變高，另外，一旦顯示面積擴大時，也具 有爲了在玻璃基板上形成膜之CVD裝置等將大型化，成本 將大幅上升等之問題。 因此，以成本削減爲目的，有人揭示一種技術，其係 如印刷墨水之方式，來使微小結晶矽積體電路晶片附著於 印刷原板，藉由印刷技術等之手段，以將該印刷原板移至 顯示器用之玻璃基板上的既定位置而予以固定（例如，參 照專利文獻1 )。此情形下，預先在玻璃基板上形成高分 200939172 子膜，藉由印刷技術等之手段，以將微小結晶矽積體電路 晶片移至該高分子膜上，並利用熱成形或加熱壓縮等之方 法，進行將該晶片埋入高分子膜中。然而，利用如此之方 法，除了高分子膜之歪斜或發泡等之不恰當將容易發生之 外，也由於加熱上費時，並非有效率的。 另外，已揭示一種電路基板用片，其係使用得自能量 線硬化型高分子材料之電路基板用樹脂片以取代該高分子 膜，藉由將電路晶片埋入時及埋入後之各自的儲存彈性係 〇 數控制於既定範圍，即使不進行加熱，電路晶片埋入也爲 可能（例如，參照專利文獻2 )。 藉由使用如此之電路基板用樹脂片，基於高的生產 I) ' 性，能夠有效製作埋入電路晶片之顯示器用電路基板。然 而，由現有之能量線硬化型髙分子材料而成之樹脂片的硬 化物，針對耐藥品性，未必能夠充分滿足，在埋入電路晶 片之該硬化物表面進行配線形成之際，具有配線脫落或剝 離之情形等問題。 Ο 專利文獻1:曰本專利特開2003-248436號公報 專利文獻2:日本專利特開2006-323335號公報 【發明内容】 發明所欲解決之技術問題 於如此之狀況下，本發明之目的在於提供一種顯示器 用之電路基板用樹脂片、電路基板用片、及使用其所得之 由埋入電路晶片而成之顯示器用電路基板，其中該電路基 板用樹脂片係基於品質佳、高生產性，爲了有效製作用以 控制顯示器用（尤其，平面顯示器用）之各像素而埋入電 200939172 路晶片之電路基板。 解決問題之技術丰跺 本發明人等爲了達成該目的，不斷鑽硏之結果發現： 將配線形成層中得自能量線硬化型高分子材料作爲電路基 板用樹脂片使用，並且若利用其硬化物之特定方法所測出 的膨潤率爲某値以下的話，配線於配線形成時，脫落或剝 離將被抑制，能夠生產性佳地得到品質佳的顯示器用電路 基板，能夠達成其目的，於是完成本發明。 〇 亦即，本發明係提供下列之內容： 〔1〕一種電路基板用樹脂片，其配線形成層係得自能 量線硬化型高分子材料之樹脂片，，其特徵爲以曝光量 3 00mJ/cm2照射能量線而予以硬化之情形，於23°C之乙醇 中浸漬10分鐘後的膨脹率符合下式（1)之關係： 膨潤率（％ )=〔（浸漬後膜厚-浸漬前膜厚）/浸漬 前膜厚〕X 100S4.0..· ( 1 )。 〔2〕上述〔1〕項揭示之電路基板用樹脂片，其中配 〇 線形成層係得自能量線硬化型高分子材料之樹脂片，以曝 光量3 0 0mJ/cm2照射能量線而予以硬化之情形，於23°c之 2.38質量％四甲基銨氫氧化物水溶液中浸漬10分鐘後的 膨脹率符合下式（2)之關係： 膨潤率（％) =〔（浸漬後膜厚—浸漬前膜厚）/浸漬 前膜厚〕X 100S0.6…（2 )。 〔3〕上述〔1〕或〔2〕項揭示之電路基板用樹脂片， 其中電路基板用樹脂片爲由單層之配線形成層而成，該樹 脂片中之能量線硬化型高分子材料係以10〜50質量％之 200939172 比例含有（甲基）丙烯酸酯系共聚物，而該（甲基）丙烯 酸酯系共聚物係具有1〜35質量％之含羥基的單體單位。 〔4〕上述〔1〕或〔2〕項揭示之電路基板用樹脂片， 其中電路基板用樹脂片係由複數層而成，在其一側之最外 表面具有符合下式（3)之關係的配線形成層： 配線形成層之膜厚/電路基板用樹脂片之總膜厚 >0.5··· (3) 〇 〔5〕上述〔4〕項揭示之電路基板用樹脂片，其中配 0 線形成層中之能量線硬化型高分子材料係以10〜50質量 %之比例含有（甲基）丙烯酸酯系共聚物，而該（甲基） 丙烯酸酯系共、聚物係:^有1〜35質量％之含羥基的單體單 _ 位。 〔6〕一種電路基板用片，其特徵係在載體上形成上述 〔1〕至〔5〕項中任一項揭示之電路基板用樹脂片的單面。 〔7〕一種顯示器用電路基板，其特徵係在上述〔6〕 項揭示之電路基板用片之電路基板用樹脂片表面中，埋入 〇 電路晶片，對其照射能量線而予以硬化。 〔8〕上述〔7〕項揭示之顯示器用電路基板，其係由 在埋入電路晶片之側的表面上形成電路而成。 發明之效果 若根據本發明，能夠提供一種顯示器用之電路基板用 樹脂片、電路基板用片、及使用其所得之由埋入電路晶片 而成之顯示器用電路基板，其中該電路基板用樹脂片係基 於品質佳、高生產性，爲了有效製作用以控制顯示器用（尤 其，平面顯示器用）之各像素而埋入電路晶片之電路基板 200939172 的硬化物係具優越之耐藥品性。 【實施方式】 本發明之電路基板用樹脂片可以爲單層之配線形成 層，也可以爲由配線形成層與其他層之複數層所形成。首 先，針對單層之配線形成層的電路基板用樹脂片加以說明。 〔電路基板用樹脂片〕 本發明之單層電路基板用樹脂片之配線形成層係得自 能量線硬化型高分子材料之樹脂片，其硬化物具有以下之 〇 耐藥品性。 亦即，以曝光量3 00mJ/Cm2照射能量線而予以硬化之 ' 情形，於2 3 °C之乙醇中浸漬1 0分鐘後的膨脹率必須符合 ' 下式（1 )之關係： 膨潤率（％ )=〔（浸漬後膜厚一浸漬前膜厚）/浸漬 前膜厚〕X 1 00S4.0··· ( 1 )。 再者，以曝光量300mJ/cm2照射能量線而予以硬化之 情形，於23 °C之2.38質量％四甲基銨氫氧化物水溶液中浸 Ο 漬分鐘後的膨潤率較佳爲符合下式（2)之關係： 膨潤率（％ )=〔（浸漬後膜厚一浸漬前膜厚）/浸漬 前膜厚〕X 1 00S0.6 …（2 )。 還有，照射能量線而予以硬化之電路基板用樹脂片的 膜厚並未予以特別限制，約爲1 0〜1 0 0 0 μπι，符合上式（1 )， 若進一步更佳符合上式（2)的話，能夠發揮本發明之效果。 將電路晶片埋入該樹脂片中，照射能量線而予以硬 化’在其表面予以形成配線（電路）之情形，通常採用光 刻技術，可使用顯像液（一般爲四甲基銨氫氧化物水溶液 200939172 等之鹼液）或用以去除阻劑圖案之蝕刻液（一般爲乙醇等 之有機溶劑）。 本發明人等發現：於如此之配線形成過程中，硬化之 電路基板用樹脂片將膨潤，其對於配線之脫落或剝離將造 成重要的影響；藉由將相對於乙醇或2.38質量％之四甲基 銨氫氧化物水溶液的膨潤率規定於既定之値，能夠有效抑 制配線之脫落或剝離，使其予以明確化而完成本發明。 相對於乙醇的膨潤率爲4.0%以下，較佳爲 3.5%以 〇 下。另外，相對於2.38質量％之四甲基銨氫氧化物水溶液 的膨潤率較佳爲0.6%以下，更佳爲0.4%以下。 ^ 剝離於輕剝離型剝離片與重剝離型剝離片之間所形成 ‘ 之厚度100 μιη的電路基板用樹脂片之輕剝離型剝離片，於 氮氣環境中，以照度400mW/cm2、曝光量3 00mJ/cm2之條 件，從剝落該電路基板用樹脂片之輕剝離片的側面，照射 將熔融製Η燈泡作爲光源的紫外線而予以硬化，接著，從 硬化後之電路基板用樹脂片剝離重剝離型剝離片，藉由定 〇 壓厚度測定器〔TECLOCK CORPORATION 製之型式 「PG-02」〕測定電路基板用樹脂片之膜厚，得到浸漬前膜 厚。接著，於23 °C，分別浸漬於乙醇或2.38質量％之四甲 基銨氫氧化物水溶液中，經過10分鐘浸漬之後，取出該電 路基板用樹脂片，迅速除去附著於表面之液滴，再藉定壓 厚度測定器（同上），以再度測定膜厚，得到浸漬後膜厚。 將此等之結果作爲依據，利用下式以算出相對於乙醇或 2.38質量％之四甲基銨氫氧化物水溶液的膨潤率： 膨潤率（％) =〔（浸漬後膜厚一浸漬前膜厚）/浸漬 200939172 前膜厚〕xioo 還有’膨潤率係表示分別進行5次測定之平均値。 〔能量線硬化型高分子材料〕 於本發明中’所謂能量線硬化型高分子材料，其係指 於電磁波或荷電粒子線之中具有能量量子者，亦即藉由照 射紫外線或電子線等進行交聯的高分子材料。 本發明所用之該能量線硬化型高分子材料，例如，可 列舉：含有（甲基）丙烯酸酯系共聚物與能量線硬化型聚 〇 合性寡聚物及/或聚合性單體與依需求之光聚合引發劑的 高分子材料。 • 於該高分子材料中，（甲基）丙烯酸酯系共聚物可列 舉：醋部分的院基碳數1〜20之（甲基）丙稀酸醋、與含 有具依需求所用之活性氫的官能基之單體及其他單體的共 聚物’亦即較佳可列舉（甲基）丙烯酸酯系共聚物。於本 發明中，所謂「（甲基）丙烯酸…」係意指「丙烯酸…」 及「甲基丙烯酸…」之二者。 〇 於此’醋部分的院基碳數1〜20之（甲基）丙稀酸醋 之例子’可列舉：（甲基）丙烯酸甲酯、（甲基）丙烯酸 乙酯、（甲基）丙嫌酸丙酯、（甲基）丙嫌酸丁醋、（甲 基）丙烯酸戊酯、（甲基）丙烯酸己酯、（甲基）丙烯酸 環己酯、（甲基）丙烯酸-2-乙基己酯、（甲基）丙烯酸異 辛酯、（甲基）丙烯酸癸酯、（甲基）丙烯酸十二烷酯、 (甲基）丙烯酸十四烷酯、（甲基）丙烯酸十六烷酯、（甲 基）丙烯酸十八烷酯等。此等（甲基）丙烯酸酯可以單獨 使用，也可以組合二種以上而使用。 -10- 200939172 另一方面，基於使所得之電路基板用樹脂片的硬化物 之耐藥品性成爲良好之觀點，含有具依需求所用之活性氫 的官能基之單體較佳爲含羥基之單體。例如，含此羥基之 單體可列舉：（甲基）丙烯酸-2-羥基乙酯、（甲基）丙烯 酸-2-羥基丙酯、（甲基）丙烯酸-3-羥基丙酯、（甲基）丙 烯酸-2-羥基丁酯、（甲基）丙烯酸-3-羥基丁酯、（甲基） 丙烯酸-4-羥基丁酯等之（甲基）丙烯酸羥基烷酯。於本發 明中，（甲基）丙烯酸酯系共聚物中之該含羥基的單體單 〇 位之含量通常約爲1〜35質量％，較佳爲2〜30質量％。 另外，於本發明之目的不受損害之範圍，含有具其他 活性氫之官能基的單體，例如，適宜使用：（甲基）丙烯[Technical Field] The present invention relates to a resin sheet for a circuit board for a display, a sheet for a circuit board, and a circuit board for a display. More specifically, the present invention relates to a cured product of a circuit board embedded in a circuit chip for controlling the pixels for a display (particularly for a flat panel display) in an efficient and high-productivity condition. A resin sheet for a circuit board for a display having excellent chemical resistance, a sheet for a circuit board, and a circuit board for a display obtained by using the obtained Q-incorporated circuit wafer. [Prior Art] Conventionally, in a flat panel display represented by a liquid crystal display, for example, an insulating film, a semiconductor film, or the like is sequentially laminated on a glass substrate by a CVD method (chemical vapor deposition method) or the like, and the same process is performed. In the step of the semiconductor integrated circuit, a small electronic component such as a thin film transistor (TFT) is formed in the vicinity of each pixel constituting the screen, thereby controlling the opening, closing, and shading of each pixel. That is, a minute electric component such as a TFT is formed at a position on the glass substrate. However, in such a technique, the steps are both multi-stage and complicated, and the cost is not high. Moreover, when the display area is enlarged, the CVD apparatus or the like for forming a film on the glass substrate is enlarged, and the cost will be increased. A problem such as a sharp rise. Therefore, for the purpose of cost reduction, a technique has been disclosed in which a method of printing ink is used to attach a microcrystalline condensate circuit wafer to a printing original plate, and the printing original plate is moved to a printing technique or the like by means of printing technology or the like. The predetermined position on the glass substrate for the display is fixed (for example, refer to Patent Document 1). In this case, a high-resolution 200939172 sub-film is formed on the glass substrate in advance, and the micro-crystal slab circuit wafer is transferred to the polymer film by a printing technique or the like, and is subjected to thermoforming or heat compression. In the method, the wafer is buried in a polymer film. However, with such a method, it is not easy to be effective in addition to the deterioration of the polymer film, such as skew or foaming, and it is also inefficient because of heating. Further, a sheet for a circuit board in which a resin sheet for a circuit board obtained from an energy ray-curable polymer material is used in place of the polymer film, when the circuit wafer is buried and after embedding, is disclosed. The storage elastic system number is controlled within a predetermined range, and it is possible to embed the circuit wafer without heating (for example, refer to Patent Document 2). By using such a resin sheet for a circuit board, it is possible to efficiently produce a circuit board for a display embedded in a circuit wafer based on high production I). However, the cured product of the resin sheet made of the conventional energy ray-curable ruthenium molecular material is not necessarily sufficiently satisfactory for chemical resistance, and the wiring is detached when wiring is formed on the surface of the cured material embedded in the circuit wafer. Or problems such as the situation of stripping.专利 Patent Document 1: Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. 2006-323335. SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION In such a situation, the object of the present invention is Provided is a resin sheet for a circuit board for a display, a sheet for a circuit board, and a circuit board for a display obtained by embedding the circuit wafer, wherein the resin sheet for the circuit board is based on high quality and high productivity. In order to effectively manufacture a circuit board for embedding a 200939172 chip for controlling each pixel of a display (particularly for a flat panel display). In order to achieve the object, the inventors of the present invention have found that the energy ray-curable polymer material obtained from the wiring forming layer is used as a resin sheet for a circuit board, and the cured product is used. When the swelling ratio measured by the specific method is less than or equal to a certain value, the wiring can be prevented from falling off or peeling off when the wiring is formed, and the circuit board for display having good quality can be obtained with good productivity, and the object can be achieved, and the present invention can be achieved. invention. In other words, the present invention provides the following: [1] A resin sheet for a circuit board, wherein the wiring forming layer is a resin sheet obtained from an energy ray-curable polymer material, and is characterized by an exposure amount of 300 mJ/ When the cm2 is irradiated with an energy ray and hardened, the expansion ratio after immersion in ethanol at 23 ° C for 10 minutes conforms to the relationship of the following formula (1): swelling ratio (%) = [(film thickness after immersion - film thickness before immersion) ) / film thickness before impregnation] X 100S4.0..· ( 1 ). [2] The resin sheet for a circuit board according to the above [1], wherein the twist line forming layer is obtained from a resin sheet of an energy ray-curable polymer material, and is hardened by irradiating an energy ray with an exposure amount of 300 mJ/cm 2 . In the case of the immersion in a 2.38 mass% tetramethylammonium hydroxide aqueous solution at 23 ° C for 10 minutes, the expansion ratio is in accordance with the following formula (2): swelling ratio (%) = [(film thickness after dipping - impregnation) Front film thickness) / film thickness before immersion] X 100S0.6 (2). [3] The resin sheet for a circuit board according to the above [1] or [2], wherein the resin sheet for a circuit board is formed by a single layer wiring, and the energy ray-curable polymer material in the resin sheet is The (meth)acrylate copolymer is contained in a ratio of 10 to 50% by mass of 200939172, and the (meth)acrylate copolymer has 1 to 35% by mass of a hydroxyl group-containing monomer unit. [4] The resin sheet for a circuit board according to the above [1] or [2], wherein the resin sheet for a circuit board is formed of a plurality of layers, and has a relationship conforming to the following formula (3) on the outermost surface of one side thereof. Wiring formation layer: Film thickness of wiring formation layer / total film thickness of resin sheet for circuit board > 0.5 (3) 〇 [5] The resin sheet for circuit board disclosed in the above [4], wherein 0 The energy ray-curable polymer material in the wire-forming layer contains a (meth) acrylate-based copolymer in a ratio of 10 to 50% by mass, and the (meth) acrylate-based co-polymer system: ~35 mass% of the hydroxyl group-containing monomer single _ position. [6] A sheet for a circuit board, characterized in that one side of the resin sheet for a circuit board disclosed in any one of the above items [1] to [5] is formed on a carrier. [7] A circuit board for a display, characterized in that a surface of a resin sheet for a circuit board for a circuit board sheet according to the above [6] is embedded in a ruthenium circuit wafer, and is irradiated with an energy ray to be cured. [8] The circuit board for a display disclosed in the above [7], which is formed by forming a circuit on a surface of the side on which the circuit wafer is buried. According to the present invention, it is possible to provide a resin sheet for a circuit board for a display, a sheet for a circuit board, and a circuit board for a display obtained by embedding a circuit wafer obtained by using the resin sheet for a circuit board. The cured product of the circuit board 200939172 embedded in the circuit chip for controlling the pixels for display (especially for flat panel display) is excellent in chemical resistance, based on high quality and high productivity. [Embodiment] The resin sheet for a circuit board of the present invention may be a single layer wiring formation layer or a plurality of layers of a wiring formation layer and other layers. First, a resin sheet for a circuit board in which a wiring layer of a single layer is formed will be described. [Resin sheet for circuit board] The wiring layer of the resin sheet for a single-layer circuit board of the present invention is a resin sheet obtained from an energy ray-curable polymer material, and the cured product has the following chemical resistance. That is, in the case where the energy is irradiated with an exposure amount of 300 mJ/cm 2 and hardened, the expansion ratio after immersion in ethanol at 23 ° C for 10 minutes must conform to the relationship of the following formula (1): swelling ratio ( %) = [(film thickness after immersion - film thickness before immersion) / film thickness before immersion] X 1 00S4.0 · (1). Further, in the case where the energy beam is irradiated with an exposure amount of 300 mJ/cm 2 and hardened, the swelling ratio after immersion in a 2.38 mass% tetramethylammonium hydroxide aqueous solution at 23 ° C is preferably in accordance with the following formula ( 2) Relationship: The swelling ratio (%) = [(film thickness after immersion - film thickness before immersion) / film thickness before immersion] X 1 00S0.6 (2). Further, the film thickness of the resin sheet for a circuit board which is cured by irradiation with an energy ray is not particularly limited, and is approximately 10 to 1 0 0 0 μπι, which conforms to the above formula (1), and further better conforms to the above formula ( 2), the effects of the present invention can be exerted. The circuit chip is embedded in the resin sheet, and is irradiated with an energy ray to be hardened. In the case where a wiring (circuit) is formed on the surface thereof, a photolithography technique is usually employed, and a developing solution (generally tetramethylammonium hydroxide) can be used. An aqueous solution of an aqueous solution 200939172 or the like or an etching solution for removing a resist pattern (generally an organic solvent such as ethanol). The present inventors have found that in such a wiring formation process, the resin sheet for hardened circuit substrate is swollen, which will have an important influence on the peeling or peeling of the wiring; by being equal to ethanol or 2.38 mass% The swelling ratio of the aqueous solution of the aqueous solution of the ammonium hydroxide is predetermined, and the present invention can be completed by effectively eliminating the detachment or peeling of the wiring. The swelling ratio with respect to ethanol is 4.0% or less, preferably 3.5% by weight. Further, the swelling ratio with respect to the 2.38 mass% tetramethylammonium hydroxide aqueous solution is preferably 0.6% or less, more preferably 0.4% or less. ^ A light-peelable release sheet of a resin sheet for a circuit board having a thickness of 100 μm formed between the light release type release sheet and the heavy release type release sheet, and having an illuminance of 400 mW/cm 2 and an exposure amount of 3 in a nitrogen atmosphere 00 mJ/cm2, the side surface of the light release sheet of the resin sheet for the circuit board is peeled off, and the ultraviolet ray is used as a light source by the molten ray bulb, and the resin sheet is peeled off from the cured resin sheet. In the peeling sheet, the film thickness of the resin sheet for a circuit board was measured by a constant thickness measuring device ("PG-02" manufactured by TECLOCK CORPORATION) to obtain a film thickness before immersion. Then, it was immersed in ethanol or a 2.38 mass% tetramethylammonium hydroxide aqueous solution at 23 ° C, and after immersing for 10 minutes, the resin sheet for the circuit board was taken out, and the droplets adhering to the surface were quickly removed, and then The thickness of the film was measured by a constant thickness tester (ibid.) to obtain a film thickness after immersion. Based on the results, the swelling ratio of the aqueous solution of tetramethylammonium hydroxide relative to ethanol or 2.38 mass% was calculated by the following formula: swelling ratio (%) = [(film thickness after immersion - film thickness before immersion) ) / impregnation 200939172 front film thickness] xioo and 'swelling rate' means the average enthalpy of five measurements. [Energy ray-curable polymer material] In the present invention, the term "energy ray-curable polymer material" refers to an energy quantum which is included in an electromagnetic wave or a charged particle beam, that is, by irradiation with ultraviolet rays or electron beams. Crosslinked polymer material. The energy ray-curable polymer material used in the present invention may, for example, be a (meth) acrylate-based copolymer and an energy ray-curable poly chelating oligomer and/or a polymerizable monomer. A polymer material of a photopolymerization initiator. • Among the polymer materials, the (meth)acrylate copolymer may be a (meth) acrylate vinegar having a phenolic portion having a carbon number of 1 to 20, and an active hydrogen having a desired amount. A copolymer of a monomer of a functional group and another monomer is preferably a (meth)acrylate copolymer. In the present invention, "(meth)acrylic acid" means both "acrylic acid" and "methacrylic acid". Examples of the (meth)acrylic acid vinegar having a carbon number of 1 to 20 in the 'vinegar portion' may be exemplified by methyl (meth) acrylate, ethyl (meth) acrylate, or (meth) propyl. Propionic acid propyl ester, (meth)acrylic acid butyl vinegar, amyl (meth) acrylate, hexyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-ethyl (meth) acrylate Hexyl ester, isooctyl (meth)acrylate, decyl (meth)acrylate, dodecyl (meth)acrylate, tetradecyl (meth)acrylate, cetyl (meth)acrylate, Octadecyl (meth)acrylate, and the like. These (meth) acrylates may be used singly or in combination of two or more. -10-200939172 On the other hand, from the viewpoint of improving the chemical resistance of the cured product of the obtained resin sheet for a circuit board, the monomer having a functional group having an active hydrogen used as required is preferably a hydroxyl group-containing single. body. For example, examples of the monomer having such a hydroxyl group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 3-hydroxypropyl (meth)acrylate, (methyl). A hydroxyalkyl (meth)acrylate such as 2-hydroxybutyl acrylate, 3-hydroxybutyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate. In the present invention, the content of the hydroxyl group-containing monomer in the (meth) acrylate-based copolymer is usually from about 1 to 35% by mass, preferably from 2 to 30% by mass. Further, a monomer having a functional group having another active hydrogen in the range which is not impaired by the object of the present invention, for example, is suitably used: (meth) propylene

D 酸單甲胺基乙酯、（甲基）丙烯酸單乙胺基乙酯、（甲基） 丙烯酸單甲胺基丙酯、（甲基）丙烯酸單乙胺基丙酯等之 (甲基）丙烯酸單烷胺基烷酯；丙烯酸、甲基丙烯酸、巴 豆酸、馬來酸、衣康酸、檸康酸等之乙烯性不飽和羧酸等。 另外，依需求所用之其他單體例子，可列舉：醋酸乙 G 烯酯、丙酸乙烯酯等之乙烯酯類；乙烯、丙烯、異丁烯等 之烯烴類：氯乙烯、偏氯乙烯等之鹵化烯烴類；苯乙烯、α-甲基苯乙烯等之苯乙烯系單體；丁二烯、異戊二烯、氯丁 二烯等之二烯系單體；丙烯腈、甲基丙烯腈等之腈系單體； 丙烯醯胺、Ν -甲基丙烯醯胺、Ν，Ν -二甲基丙烯醯胺等之丙 烯醯胺等。此等單體可以單獨使用，也可以組合二種以上 而使用。（甲基）丙烯酸酯系共聚物中，此等單體單位能 夠含有〇〜30質量％。 於該高分子材料中，作爲丙烯酸系聚合物所用之（甲 -11- 200939172 基）丙烯酸酯系共聚物，針對其共聚合形態，並無特別之 限制’可以爲無規、嵌段、接枝共聚物中任一種。另外， 分子量係重量平均分子量，較佳爲5萬〜200萬。 還有，上述重量平均分子量係利用凝膠滲透層析儀 (GPC )法測出的標準聚苯乙烯換算之値。 於本發明中，此（甲基）丙烯酸酯系共聚物可以單獨 使用一種，也可以組合二種以上而使用。 另外，能量線硬化型聚合性寡聚物，例如，可列舉： 〇 聚酯丙烯酸酯系、環氧丙烯酸酯系、胺甲酸酯丙烯酸酯系、 聚醚丙烯酸酯系、聚丁二烯丙烯酸酯系、矽氧烷丙烯酸酯 系等。於此，例如，聚酯丙烯酸酯系寡聚。物係藉由利用（甲 基）丙烯酸以酯化在根據多價羧酸與多元醇的縮合所得之 兩末端具有羥基的聚酯寡聚物之羥基，或是利用（甲基） 丙烯酸以酯化將環氧烷加成於多價羧酸所得之寡聚物末端 的羥基而能夠得到。例如，環氧丙烯酸酯系寡聚物係藉由 反應（甲基）丙烯酸與較低分子量之雙酚型環氧樹脂或酚 〇 醛型環氧樹脂之環氧乙烷環而能夠得到。另外，也能夠使 用藉二鹽基性羧酸酐以部分改性此環氧丙烯酸酯系寡聚物 之羧基改性型環氧丙烯酸酯系寡聚物。例如，胺甲酸酯丙 烯酸酯系寡聚物能夠藉由利用（甲基）丙烯酸以酯化在依 照聚醚多元醇或聚酯多元醇與聚異氰酸酯的反應所得之聚 胺甲酸酯寡聚物而能夠得到；多元醇丙烯酸酯系寡聚物係 藉由利用（甲基）丙烯酸以酯化在聚醚多元醇之羥基而能 夠得到。 上述聚合性寡聚物之重量平均分子量係利用GPC法測 -12- 200939172 出的標準聚苯乙烯換算之値，較佳爲500〜100,〇〇〇，更佳 爲1,000〜70,000，進一步更佳爲3,000〜40,000之範圍予 以選定。 還有，上述重量平均分子量係利用凝膠滲透層析儀 (GPC )法測出的標準聚苯乙烯換算之値，只要無特別申 明，透過本發明而利用以下之條件加以測定。 裝置：GPC測定裝置〔Toso股份公司製、商品名 「HLC-8 02 0層析儀」〕 0 管柱：〔Toso股份公司製、商品名「TSK-GELGMHXL」 (2 支）及「TSK-GEL G2000HXL」（1 支）〕 溶出溶劑：四氫呋喃 |> 濃度1 % 注入量：8 0 μ 1 溫度：40°C 流速：1.0ml/分鐘 此聚合性寡聚物可以單獨使用一種，也可以組合二種 〇 以上而使用。 另一方面，能量線硬化型聚合性單體，例如，可列舉： (甲基）丙烯酸環己酯、（甲基）丙烯酸-2-乙基己酯、（甲 基）丙烯酸月桂酯、（甲基）丙烯酸硬脂酸酯、（甲基） 丙烯酸異莰院酯等之單官能性丙烯酸酯類；二（甲基）丙 烯酸-1，4· 丁二醇酯、二（甲基）丙烯酸-1，6_己二醇酯、二 (甲基）丙烯酸新戊二醇酯、二（甲基）丙烯酸聚乙二醇 酯、二（甲基）丙烯酸新戊二醇己二酸酯、二（甲基）丙 烯酸羥基三甲基乙酸新戊二醇酯、二（甲基）丙烯酸二環 -13- 200939172 戊酯、二（甲基）丙烯酸己內酯改性二環戊酯、二（甲基） 丙烯酸環氧乙烷改性磷酸酯、二（甲基）丙烯酸烯丙基化 環己酯、二（甲基）丙烯酸異氰酸酯、二經甲基三環癸烷 二（甲基）丙烯酸酯、三（甲基）丙烯酸三羥甲基丙烷酯、 三（甲基）丙烯酸二季戊四醇酯、三（甲基）丙烯酸丙酸 改性二季戊四醇酯、三（甲基）丙烯酸季戊四醇酯、三（甲 基）丙烯酸環氧丙烷改性三羥甲基丙烷酯、異氰酸參（丙 烯醯氧乙基）酯、五（甲基）丙烯酸丙酸改性二季戊四醇 φ 酯、六（甲基）丙烯酸二季戊四醇酯、七（甲基）丙烯酸 三季戊四醇酯、六（甲基）丙烯酸己內酯改性二季戊四醇 酯、己內酯改性參（丙烯醯氧乙基）異氰酸酯等。其中， 基於分子中之雙鍵比例高的觀點，較佳爲二羥甲基三環癸 烷二（甲基）丙烯酸酯、己內酯改性參（丙烯醯氧乙基） 異氰酸酯、六丙烯酸二季戊四醇酯、七丙烯酸三季戊四醇 酯等。此等之聚合性單體可以使用一種，也可以組合二種 以上而使用。 ❹另外，（甲基）丙烯酸酯系共聚物也可以使用在側鏈 中已導入能量線硬化性基之能量線硬化型官能基的（甲基） 丙烯酸酯系共聚物。已導入能量線硬化型官能基的（甲基） 丙烯酸酯系共聚物，例如，可能與具有上述（甲基）丙烯 酸酯系共聚物中所含之活性氫的官能基起反應而鍵結，並 且使具有能量線硬化性基之化合物與該官能基予以反應而 能夠得到。例如，如此之化合物可列舉：2-(甲基）丙烯 醯氧乙基異氰酸酯、甲基丙烯醯基異氰酸酯、烯丙基異氰 酸酯、甲基丙烯酸縮水甘油酸酯等。 -14- 200939172 基 甲 交 中、 物粒 聚微 共機 系無 酯/ 酸劑 烯發 丙引 >合 聚 <光 Μ ^ 化述 硬上 線加 量添 能而 於求 ， 需 外依 另以 可 也 劑 收 吸 線 外 紫 、 硬 劑線 與量 陚能 著非 黏與 、 以 劑可。 聯也用 之 型 化 基 甲 倂 等物 劑聚 化共 軟系 i酯 1酸 定唏 安丙 光丙 爲了實現該式（1 )或（2 )之膨潤率，於能量線硬化 型高分子材料中，通常具有10〜50質量％之以該比例具有 該含羥基之單體的（甲基）丙烯酸酯系共聚物，較佳爲具 φ 有25〜45質量％。再者，於該能量線硬化型高分子材料 中’以該比例具有該含羥基之（甲基）丙烯酸酯系共聚物 與該能量線硬化型聚合性寡聚物及/或聚合性單體的摻合 比例較佳爲1_〇: 0.8〜1·0: 4.0之範圍，更佳爲〗.〇:〗.〇 〜1 ·0 : 3.0之範圍。 相對於1.0質量份之以該比例具有該含羥基之單體的 (甲基）丙烯酸酯系共聚物，將該能量線硬化型聚合性寡 聚物及/或聚合性單體設爲低於0.8質量份之情形，具有使 ❹ m 1¾ 基板用樹脂片予以硬化時之耐藥品性將變得不足、配 線形成時將膨潤之可能性。另一方面，相對於1·0質量份 之以該比例具有該含羥基之（甲基）丙烯酸酯系共聚物， 超過4.0質量份之該能量線硬化型聚合性寡聚物及/或聚合 性單體而摻合之情形’將有發生電路晶片埋入性等問題之 可能性而不佳。 另外，通常照射作爲能量線之紫外線或電子線，於照 射紫外線之際，能夠使用光聚合引發劑。例如，此光聚合 引發劑可列舉：苯偶姻、苯偶姻甲基醚、苯偶姻乙基醚、 -15· 200939172 苯偶姻異丙基醚、苯偶姻正丁基醚、苯偶姻異丁基醚、苯 乙酮、二甲胺基苯乙酮、2,2 -二甲氧基-2 -苯基苯乙酮、1-〔4- (2-羥基乙氧基）苯基〕-2-羥基-2-甲基-1-丙-1-酮、 2 -节基-2 -二甲胺基-1-( 4 -嗎啉苯基）-1-丁酮、氧化雙 (2,4,6-三甲基苄基）苯基膦、氧化-2,4,6-三甲基苄基二苯 基膦、2,2-二甲氧基-1,2-二苯基乙-1-酮、2,2-二乙氧基-2-苯基苯乙酮、2-羥基-2-甲基-1-苯基丙-1-酮、2-羥基-1-〔 4-〔4-(2-羥基-2-甲基丙醯基）苄基〕苯基〕-2-甲基丙-1-D 酮、1-羥基環己基苯基酮、2-甲基-1-〔4-(甲硫基）苯基〕 -2-嗎啉丙-1-酮、4- (2-羥基乙氧基）苯基- 2-(羥基-2-丙 基）酮、二苯甲酮、對苯基二苯甲酮、4，4’-二乙胺二苯甲 酮、二氯二苯甲酮、2-甲基蒽、2-乙基蒽、2-三級丁基蒽、 2-胺基蒽、2-甲硫基噻噸酮、2-乙硫基噻噸酮、2-氯噻噸酮、 2，4-二甲基噻噸酮、2，4-二乙基噻噸酮、苄基二甲基縮酮、 苯乙酮二甲基縮酮、對二甲胺安息香酸酯、〔2-羥基-2-甲 基- l-〔 4-(1-丙醯基）苯基〕丙酮〕寡聚物等。此等光聚 〇 合引發劑可以使用一種，也可以組合二種以上而使用。 相對於100質量份之上述能量線硬化型高分子材料的 固形成分，摻合量通常爲〇.〇1〜10質量份。 於本發明中，基於抑制藉所得之電路基板用樹脂片的 能量線所造成之硬化時的體積收縮，並且使耐熱性提高等 之目的下，能夠使該能量線硬化型材料中含有無機微粒。 例如，該無機微粒能夠使用矽、鈦、锆、錫、鋁、鐵 等之各種金屬元素的氧化物或碳化物等，此等無機微粒之 中，基於體積收縮之抑制效果、透光性、經濟性等均衡之 -16 - 200939172 觀點，較佳爲二氧化矽微粒。 於本發明中，此無機粒子可以單獨使用一種，也可以 組合二種以上而使用。另外，基於透明性、均勻分散性、 抑制體積收縮效果等之觀點，其平均粒徑較佳爲3〜50μιη 之範圍，更佳爲5〜30μιη之範圍。還有，於本發明中之平 均粒徑係基於藉BET法所得之算出値。 使用二氧化矽微粒之情形，二氧化矽微粒適宜爲分散 於醇系或溶纖素系等之有機溶劑中的二氧化矽溶膠寡聚 ❹ 物。 於本發明中，該無機微粒係用以二次凝聚、予以均質 分散於能量線硬化型高分子材料中，較佳爲使用已進行表 |> 面修飾處理之無機微粒。表面修飾處理方法並無特別之限 制，例如，習知方法可列舉：使用有機矽烷化合物之方法 或使用界面活性劑之方法等，按照無機微粒之種類與能量 線硬化型高分子材料之種類，較佳加以適當選擇。例如， 將二氧化矽微粒作爲無機微粒使用之情形下，有利於使用 〇 有機矽烷化合物以進行表面修飾處理；二氧化矽微粒以外 的無機微粒之情形下，有利於使用界面活性劑以進行表面 修飾處理。 於該能量線硬化型高分子材料中，於本發明之效果不 受損害之範圍內，能夠依需求而添加交聯劑、黏著賦與劑、 抗氧化劑、紫外線吸收劑、光安定劑、軟化劑等。 例如，該交聯劑可列舉：聚異氰酸酯化合物、環氧樹 脂、三聚氰胺樹脂、尿素樹脂、二醛類、羥甲基聚合物、 氮呒化合物、金屬螯合物、金屬醇鹽、金屬鹽等’較佳使 -17- 200939172 用聚異氰酸酯化合物。相對於100質量份之上述（甲基） 丙烯酸酯系共聚物的固形成分此交聯劑能夠摻合0〜30質 量份。 於此，聚異氰酸酯化合物之例子，可列舉：甲苯二異 氰酸酯、二苯基甲烷二異氰酸酯、二甲苯二異氰酸酯等之 芳香族聚異氰酸酯；六亞甲基二異氰酸酯等之脂肪族聚異 氰酸酯；異佛酮二異氰酸酯、加氫之二苯基甲烷二異氰酸 酯等之脂環式聚異氰酸酯等、及此等之縮合二脲物、異氰 〇 酸酯物，再者，與乙二醇、丙二醇、新戊二醇、三羥甲基 丙烷、篦麻油等之含低分子活性氫化合物之反應物的加成 物等。此等交聯劑可以單獨使用一種，也可以組合二種以 上而使用。 (電路基板用樹脂片之形態） 接著’本發明之電路基板用樹脂片能夠作成由複數層 而成之構造。例如，能夠作成由配線形成層與下層而成之 二層構造。此情形下，於配線形成層中，硬化物爲具有上 Ο 述物性之能量線硬化型高分子材料，較佳爲使用以10〜50 質量％之比例含有具有1〜35質量％之含羥基的單體單位 (甲基）丙烯酸酯系共聚物。另一方面，下層可使用能量 線硬化型高分子材料’其種類並無特別之限制，能夠使用 含有上述之（甲基）丙烯酸酯系共聚物、能量線硬化型聚 合性寡聚物及/或聚合性單體與依需求之光聚合引發劑等 之高分子材料。 具體而言，下層之能量線硬化型高分子材料能夠藉由 賦與下層之機能而加以適當選擇。賦與下層之機能，可列 -18- 200939172 舉：使配線形成層與載體的緊貼性得以提高’或是使電路 晶片的埋入性得以改善之機能。 例如，使配線形成層與載體之緊貼性得以提高之情形 下，並非將具有構成上述（甲基）丙烯酸酯系共聚物的活 性氫之單體設爲含羥基之單體’而是較佳設爲含羧酸之單 體。 於本發明之電路基板用樹脂片中，將〔配線形成層之 膜厚/電路基板用樹脂片之膜厚〕設爲p値之情形，基於對 0 顯像液或蝕刻液承受性之觀點，該P値較佳爲0 · 5以上， 更佳爲0.6以上。此P値爲1之情形，本發明之電路基板 用樹脂片係僅由配線形成層所構成之一層構造。 >> (電路基板用樹脂片之製造方法） 以下，列舉製造本發明之電路基板用樹脂片之方法。 但是，本發明並未因此而予以特別限制。 藉由利用習知方法，例如刮刀塗布法、輥塗布法、桿 塗布法、刮板塗布法、模頭塗布法、照相凹版塗布法等， Ο 成爲既定厚度之方式’來將已調整至含有該能量線硬化型 高分子材料之適當濃度的塗布液塗布/乾燥於剝離片之剝 離劑層上’形成一層構造之電路基板用樹脂片。該剝離片 也可以爲了電路基板用樹脂片之保管或保護而予以直接積 層。再者’在電路基板用樹脂片之另—面，可以積層與該 剝離片之剝離力不同的剝離片，也可以不予以積層而直接 使用於所後述之電路基板用片的製作。 於此’電路基板用樹脂片之厚度係根據其使用條件， 通常約爲50〜ΙΟΟΟμπι’較佳爲8〇〜5〇〇μιη。還有，增加電 -19- 200939172 路基板用樹脂片的厚度之情形，藉由積層依照 用樹脂片之製造方法所製作之樹脂層，能夠作 用樹脂片。 另外，作成二層構造之情形下，配線形成 夠依照上述之製造方法加以製作，藉由積層各 配線形成層與下層，能夠作成二層構造之電路 片。 該剝離片並無特別之限制，可列舉：在聚 0 聚丙烯薄膜等之聚烯烴薄膜、聚對苯二甲酸乙 酯薄膜上塗布矽氧烷樹脂等之剝離劑而設置剝 離片等。此剝離片之厚度通常約爲20〜150 μιη 〔電路基板用片〕 接著，針對本發明之電路基板用片加以說 之電路基板用片係由在載體上形成該電路基板 單面的構造所構成。該電路基板用樹脂片較佳 造係如上所述。 〇 另一方面，針對載體並無特別之限制，通 爲顯示器用載體所使用之透明載體之中，適當 載體而使用。如此之載體可列舉：玻璃基板、 薄膜狀之塑膠載體等。例如，玻璃基板能夠使 玻璃、含鋇/鋸之玻璃、鋁矽酸玻璃、鉛玻璃、硒 鋇硼矽酸玻璃、石英等而成之載體。另一方面 膜狀之塑膠載體，例如，能夠使用由聚碳酸酯 酸樹脂、聚對苯二甲酸乙二酯樹脂、聚硫醚樹 脂、聚環烯烴樹脂等而成之載體。此等載體之 該電路基板 成電路基板 層及下層能 自所製作之 基板用樹脂 乙烯薄膜或 二酯等之聚 離劑層之剝 明。本發明 用樹脂片之 之摻合等構 常能夠從作 選擇任意之 或是板狀或 用由鹼石灰 I矽酸玻璃、 ，板狀或薄 樹脂、丙烯 脂、聚碾樹 厚度係按照 -20- 200939172 用途而加以適當選定，通常約爲20μιη〜5mm，較佳爲50μηι 〜2 m m。 〔電路基板用片之製造方法〕 以下，針對製造此電路基板用片之方法，加以舉例。 但是，本發明並未因此而予以特別限制。 第1種方法係在該電路基板用樹脂片之兩側積層剝離 片之情形，首先，藉由剝離輕剝離型剝離片，將此剝離之 面與該載體相貼合以製作電路基板用片。 〇 第2種方法係藉由利用該方法而在剝離片上製作電路 基板用樹脂片，之後，藉由直接與載體相貼合以製作電路 〇 基板用片。 第3種方法係藉由利用習知方法，例如刮刀塗布法、 輥塗布法、桿塗布法、刮板塗布法、模頭塗布法、照相凹 版塗布法等，成爲既定厚度之方式來直接將該塗布液塗布/ 乾燥於該載體上，並藉由形成電路基板用樹脂片以直接製 作電路基板用片。 © 第1種方法係適合於使用如玻璃基板的剛性載體之情 形’第2、第3種方法係適合於如薄膜狀塑膠之載體。 〔顯示器用電路基板〕 本發明之顯示器用電路基板係藉由將電路晶片埋入如 上述所得之電路基板用片的電路基板用樹脂片表面中，對 其照射能量線予以硬化而能夠製作。 若針對具體之方法加以說明，將被埋入之電路晶片置 於'附剝離片之玻璃基板上等，使電路基板用樹脂片之配線 形成層面（電路基板用樹脂片與剝離片相貼合之情形，預 -21- 200939172 先剝離後而使用）連接於該電路晶片之方式來將電路基板 用片放置於其上，藉由約0.05〜2.0MPa之載重，較佳於〇 〜150 °C，更佳於5〜1〇〇 °C之溫度埋入該晶片，照射能量 線而使電路基板用樹脂片予以硬化之後，藉由剝離已放置 該電路晶片的附剝離片之玻璃基板，將可以得到本發明之 顯示器用電路基板。還有，加熱而埋入電路晶片之情形下， 能量線之照射可以於電路基板用樹脂片被加熱之狀態下進 行，也可以冷卻至室溫後進行。 〇 通常能量線係使用紫外線或電子線。紫外線係藉由高 壓水銀燈、熔融Η燈、氙燈等而得到，另一方面，電子線 係藉電子線加速器等而得到。於此能量線之中，尤以紫外 線特別適合。此能量線之照射量係加以適當選擇，例如， 紫外線之情形下，曝光量較佳爲100〜5000mJ/cm2;電子 線之情形，較佳約爲10〜lOOOkrad。 第1(a)圖〜第1(c)圖係使用本發明之電路基板用 片’顯示埋入電路晶片方法之一例的步驟說明圖。 ® 首先’在載體1上，準備得自未硬化狀態之能量線硬 化型高分子材料的本發明之電路基板用樹脂片2的同時， 也將電路晶片3放置於附剝離片之玻璃基板4上〔（a)〕。 接著’使電路基板用樹脂片2之配線形成層側連結於電路 晶片3之方式來加以放置，藉載重以埋入該晶片，照射能 量線而予以硬化〔（b )〕。依照此操作，未硬化狀態之電 路基板用樹脂片2係變成硬化層，將電路晶片3埋入其中， 加以固定的同時，本發明之顯示器用電路基板5也容易從 附剝離片之玻璃基板4被剝離〔（c )〕。 -22- 200939172 若根據如此之方法，並非加熱高分子膜再埋入電路晶 片，而是藉由使用能量線硬化型高分子材料、埋入電路晶 片、之後加以硬化；爲了固定化電路晶片，使用高分子膜 之情形的不恰當將難以發生’能夠縮短操作時間，係有效 率的。 還有，埋入電路晶片之方法，也可以採取下列之方法： 將電路晶片置於電路基板用樹脂片中，使附剝離片之玻璃 基板4連接於電路晶片3之方式來加以放置而埋入。 〇 適合於如此之方法，再者，能夠提供一種埋入電路晶 片之顯示器用電路基板，其具優越之埋入性，並且硬化時 之體積收縮小，對載體具有充分緊貼性的同時，也具有高 的耐熱性。 (配線形成） 進行如此方式，通常由埋入電路晶片、予以硬化處理、 固定化而成之顯示器用電路基板係在其表面形成配線（電 路）。 G 此配線形成之方法並無特別之限制，能夠由習知所進 行的方法之中，適當選擇任意之方法而加以實施。能夠利 用例如光刻技術以進行配線形成。若顯示其一例，首先將 正型或負型之光阻液塗布於由埋入電路晶片、經硬化處理 而成之電路基板用片上，形成光阻劑層。接著，隔著既定 之光罩圖案，曝光上述光阻劑層之後，使用四甲基銨氫氧 化物水溶液等之鹼顯像液以顯像處理，使光阻圖案予以形 成。 接著，例如藉由使用作爲配線材料之鉻靶的濺鍍等， -23- 200939172 在上述光阻圖案上形成既定厚度的鉻膜之後，將此電路基 板用片浸漬於乙醇等之蝕刻液中，藉由進行光阻之蝕刻而 能夠形成所需求之配線。 於本發明中，由於電路基板用樹脂片之硬化物使用具 優越之耐藥品性之物，於此配線形成中，能夠防止配線之 脫落或剝離。 實施例 接著，藉實施例以更詳細說明本發明，本發明係根據 〇 此等例子而並未予以任何限定。 還有，各例所得之電路基板用樹脂片的硬化物膨潤率 係進行如下方式而測出： » 膨潤率之測宙 遵照後述之實施例1〜3及比較例1〜2而分別製作厚 度100 μιη之電路基板用樹脂片。該電路基板用樹脂片係剝 離輕剝離型剝離片，於氮氣環境中，以照度400mW/cm2、 曝光量3 00mJ/cm2之條件下，照射將熔融製Η燈泡作爲光 © 源之紫外線而予以硬化。所硬化之電路基板用樹脂片係剝 離重剝離型剝離片，藉定壓厚度測定器〔TECLOCK CORPORATION製、型式「PG-02」〕以測定膜厚（浸漬前 膜厚）。接著，於23 °C，將該電路基板用樹脂片10分鐘 浸漬於乙醇或2.38質量％之四甲基銨氫氧化物水溶液。經 過10分鐘後，取出該電路基板用樹脂片，迅速去除附著於 表面之液滴，藉定壓厚度測定器（同上）以再度測定膜厚 (浸漬後膜厚）。基於此等之結果，藉由下式以算出乙醇 或2.38質量％之四甲基銨氫氧化物水溶液的膨潤率： -24- 200939172 膨潤率（％ )=〔（浸漬後膜厚一浸漬前膜厚）/浸漬 前膜厚〕X100 還有’膨潤率係表示分別進行5次測定的平均値。 另外’配線之脫落、剝離係利用數位顯微鏡〔Keyence 股份公司製之商品名「數位顯微鏡VHX-200」〕，以倍率 100觀察的同時，使用測試器加以確認配線之導通，將導 通者設爲〇，未導通者設爲X。 實施例1 0 (1)電路基板用樹脂片之形成 於乙酸乙酯/甲基乙基酮混合溶劑（質量比50:50)中， 相對於1〇〇質量份之使97質_份之甲基丙烯酸甲酯與3質 量份之甲基丙烯酸-2-羥基乙酯予以反應而得之甲基丙烯 酸酯共聚物溶液（固形成分濃度35質量％、重量平均分子 量10萬）之固形成分，使5.0質量份之光聚合引發劑的2,2-二甲氧基-1,2 -二苯基乙-1-酮〔Ciba Specialty Chemicals 股 份公司製、商品名「Irgacure 651」〕、200質量份之由能 〇 量線硬化型多官能單體而成之組成物〔日本共榮社化學股 份公司製、商品名「Light Acrylate DCP-A」〕與5.0質量 份之由聚異氰酸酯化合物而成之交聯劑〔日本三井化學聚 胺甲酸酯股份公司製、商品名「TakenateD-140N」〕予以 溶解，最後添加甲基乙基酮而將固形成分濃度調整至40質 量％，直到成爲均勻溶液爲止，加以攪拌而作成塗布液。 藉由刮刀塗布機將調製之塗布液塗布於聚對苯二甲酸 乙二酯薄膜之單面已設置矽氧烷系剝離劑層的重剝離型剝 離片〔Lintec股份公司製、商品名「PET3811」〕的剝離處 -25- 200939172 理面，於90°C、加熱乾燥90秒鐘，形成由厚度5〇μιη之能 量線硬化型高分子材料而成之樹脂層。進行同樣方式，將 該塗布液塗布於聚對苯二甲酸乙二酯薄膜之單面已設置矽 氧烷系剝離層之輕剝離型剝離片〔Lintec股份公司製、商 品名「PET3801」〕的剝離處理面上，於90°C加熱乾燥90 秒鐘，形成由厚度50μιη之能量線硬化型高分子材料而成 之樹脂層。在該輕剝離型剝離片上形成的樹脂層，積層在 該重剝離型剝離片上形成的樹脂層，最後被輕剝離型剝離 D 片與重剝離型剝離片所夾住之厚度1 ΟΟμιη的能量線硬化型 高分子材料，得到僅由一層配線形成層而成之電路基板用 樹脂片。 1 針對此電路基板用樹脂片，測定藉乙醇及四甲基銨氫 氧化物水溶液所得之膨潤率。將結果顯示於表1。 (2)電路晶片之配置與埋入 剝離在上述（1)所製作之電路基板用樹脂片的輕剝離 型剝離片，積層於5cmx5 cm之玻璃基板上，最後剝離重剝 ❹ 離型剝離片。接著，以間隔3 cm配置2個電路晶片（電路 晶片：縱5mmx橫5mmx厚50μιη)。另外準備一片5cmx5cm 之附剝離片的玻璃板，按在電路基板用片上g電路晶片， 使用平面壓縮機，以0.3 MPa之壓力壓住5分鐘。回到常壓 之後，以照度400mW/cm2、曝光量3 00mJ/cm2之條件，照 射將熔融製Η燈泡的光源作爲紫外線而使電路基板用片予 以硬化。 (3 )配線形成 藉由旋轉塗布機，以旋轉數3000 rpm、時間40秒鐘， -26- 200939172 將正型阻劑液〔日本東京應化工業股份公司製、商品名 「OFPR- 8 00」〕整面均勻塗布於上述（2)所得之埋入電 路晶片的電路基板用片上，之後，於100 °C乾燥5分鐘。 接著進行曝光，由於僅在電路晶片間形成配線，使配線寬 度成爲2mm之方式，來使用光罩曝光。曝光後，將電路基 板用片1分鐘浸漬於顯像液〔日本東京應化工業股份公司 製、商品名「NMD-3」〕後，利用精製水洗淨，於i〇〇°C、 乾燥5分鐘以進行顯像。之後，使用鉻（Cr)靶，藉濺鍍 ❹ 以在電路基板用片上形成50nm之鉻（Cr)膜。最後，10 分鐘浸漬於乙醇中，進行阻劑之蝕刻，在晶片間形成Cr之 配線。 針對進行如此方式所形成之配線，觀察脫落、剝離的 同時，確認配線之導通。將其結果顯示於表1。 實施例2 (1)電路基板用樹脂片之形成 於醋酸乙酯/甲基乙基酮混合溶劑（質量比50:50)中， 〇 使50質量份之丙烯酸丁酯、20質量份之甲基丙烯酸甲酯 與30質量份之丙烯酸-2_羥基乙酯予以反應而得之丙烯酸 酯共聚物溶液（固形成分濃度35質量％)中，使相對於共 聚物中100莫耳之丙烯酸-2-羥基乙基單位成爲80莫耳之 方式來添加2 -甲基丙烯醯氧乙基異氰酸酯，於氮氣環境 中、4(TC予以反應48小時，得到在側鏈中具有能量線硬化 性基之重量平均分子量85萬的共聚物，而該共聚物係由導 入能量線硬化型官能基而成。相對於1 〇〇質量份之由導入 所得之能量線硬化型官能基而成的共聚物溶液之固形成 -27- 200939172 分，使5.0質量份之光聚合引發劑的2,2-二甲氧基-1，2-二 苯基乙-1-酮〔CibaSpecialtyChemicals股份公司製、商品 名「Irgacure 651」〕、150質量份之由能量線硬化型胺甲 酸酯寡聚物而成之組成物〔曰本合成化學工業股份公司 製、商品名「紫光UV-1700B」、重量平均分子量：1800〕 與5.0質量份（固形成分3·8質量份）之由聚異氰酸酯化合 物而成之交聯劑〔日本三井化學聚胺甲酸酯股份公司製、 商品名「TakenateD-14〇N」〕予以溶解，最後添加甲基乙 G 基酮而將固形成分濃度調整至40質量％，直到成爲均勻溶 液爲止，加以攪拌而作成塗布液。 藉由刮刀塗布機以將調製之塗布液塗布於聚對苯二甲 酸乙二酯薄膜之單面已設置矽氧烷系剝離劑層的重剝離裂 剝離片〔Lintec股份公司製、商品名「PET381 1」〕的剝離 處理面，於9〇°C、加熱乾燥90秒鐘，形成由厚度50μηι之 能量線硬化型高分子材料而成之樹脂層。進行同樣方式， 將該塗布液塗布於聚對苯二甲酸乙二酯薄膜之單面已設饞 © 矽氧烷系剝離層之輕剝離型剝離片〔Lintec股份公司製、 商品名「PET3 8 0 1」〕的剝離處理面上，於9〇。(：、加熱乾 燥90秒鐘’形成由厚度50μιη之能量線硬化型高分子材料 而成之樹脂層。在該輕剝離型剝離片上形成的樹脂層，積 層在該重剝離型剝離片上形成的樹脂層，最後被輕剝離型 剝離片與重剝離型剝離片所夾住之厚度1 〇〇 μιη的能量線硬 化型高分子材料，得到僅由一層配線形成層而成之電路基 板用樹脂片。 隹十對此電路基板用樹脂片，測定藉乙醇及四甲基銨氫 -28- 200939172 氧化物水溶液所得之膨潤率。將結果顯示於表1。 (2)電路晶片之配置與埋入、配線形成 使用上述（1)所製作之電路基板用樹脂片，進行相同 於實施例1之（2)及（3)之方式，以進行電路晶片之配 置與埋入、及配線形成。 針對進行如此方式所形成之配線，觀察脫落、剝離的 同時，確認配線之導通。將其結果顯示於表1。 實施例3 2層構造之電路基板用樹脂片 φ (1)配線形成層之形成 使用相同於實施例2之塗布液，藉由刮刀塗布機以將 此塗布液塗布於聚對苯二甲酸乙二酯薄膜之單面已設置矽 氧烷系剝離劑層的重剝離型剝離片〔Lintec股份公司製、 商品名「PET3811」〕的剝離處理面，於90°C加熱乾燥90 秒鐘，形成由厚度75 μιη之能量線硬化型高分子材料而成 之樹脂層（配線形成層）。 (2)下層之形成 φ 於乙酸乙酯/甲基乙基酮混合溶劑（質量比50:50)中， 使80質量份之丙烯酸丁酯、20質量份之丙烯酸予以反應 而得之丙烯酸酯共聚物溶液（固形成分濃度35質量％) 中，使相對於共聚物中1〇〇莫耳之丙烯酸單位成爲30莫耳 之方式來添加2-甲基丙烯醯氧乙基異氰酸酯，於氮氣環境 中、在40°C予以反應48小時，得到導入了在側鏈中具有 能量線硬化性基之重量平均分子量85萬的能量線硬化型 官能基而成之共聚物。相對於1〇〇質量份之由導入所得之 能量線硬化型官能基而成的共聚物溶液之固形成分，使3.0 -29- 200939172 質量份之光聚合引發劑的2,2-二甲氧基-1，2-二苯基乙-1- 酮〔Ciba Specialty Chemicals 股份公司製、商品名「Irgacure 651」〕、100質量份（固形成分80質量份）之由能量線 硬化型多官能單體及寡聚物而成之組成物〔日本大日精化 工業股份公司製' 商品名「14-29B ( NPI )」、重量平均分 子量：2000〕與1.2質量份（固形成分0.45質量份）之由 聚異氰酸酯化合物而成之交聯劑〔日本東洋墨水股份公司 製、商品名「Oribain BHS-8515」〕予以溶解，最後添加 φ 甲基乙基酮而將固形成分濃度調整至40質量％，直到成爲 均勻溶液爲止，加以攪拌而作成塗布液。 藉由刮刀塗布機以將調製之塗布液塗布於聚對苯二甲 ·» 酸乙二酯薄膜之單面已設置矽氧烷系剝離劑層的重剝離型 剝離片〔Lintec股份公司製、商品名「PET3 80 1」〕的剝離 處理面上’於90°C、加熱乾燥90秒鐘，形成由厚度25μπι 之能量線硬化型高分子材料而成之下層用樹脂層。 (3)電路基板用樹脂片之形成 ❾ 在上述（1 )之重剝離型剝離片上形成的配線形成層， 積層在上述（2 )之輕剝離型剝離片上形成的下層，最後得 到具備由重剝離型剝離片、配線形成層、下層、輕剝離型 剝離片之厚度1〇〇μιη的能量線硬化型高分子材料而成之電 路基板用樹脂片。 針對此電路基板用樹脂片，測定藉乙醇及四甲基銨氫 氧化物水溶液所得之膨潤率，將結果顯示於表1。 (4)電路晶片之配置與埋入、配線形成 使用上述（3)所製作之電路基板用樹脂片，進行相同 -30- 200939172 於實施例1之（2)及（3)之方式，以進行電路晶片之配 置與埋入、及配線形成。 針對進行如此方式所形成之配線，觀察脫落、剝離的 同時，確認配線之導通。將其結果顯示於表1。 實施例4 進行相同於實施例1之方式，以製作電路基板用樹脂 片，進行電路晶片之配置與埋入。 <配線形成> φ 剝離負型乾膜阻劑〔日本旭化成電子股份公司製、商 品名「SUNFORTAQ-2796」〕之剝離膜後，藉由積層而於 ll〇°C、〇.3MPa積層於埋入電路晶片之電路基板用片上。 ·> 接著進行曝光，爲了僅於電路晶片間形成配線，使配線寬 度成爲2mm之方式來使用光罩加以曝光。曝光後，將電路 基板用片3分鐘浸漬於顯像液（1質量％之碳酸鈉水溶液） 中之後，利用精製水洗淨，於1 〇〇 °C乾燥5分鐘後進行顯 像。之後，使用鉻（Cr)靶’藉濺鍍以在電路基板用片上 〇 形成50 nm之鉻（Cr)膜。最後，10分鐘浸漬於乙醇中， 進行阻劑之蝕刻，在晶片間形成Cr之配線。 針對進行如此方式所形成之配線’觀察脫落、剝離的 同時，確認配線之導通。將其結果顯示於表1。 比較例1 (1)電路基板用樹脂片之形成、電路晶片之配置與埋入、 配線形成 於乙酸乙酯/甲基乙基酮混合溶劑（質量比50:. 50)中’ 使80質量份之丙嫌酸丁酯、2〇質量份之丙烯酸予以反應 -31 - 200939172 而得之丙烯酸酯共聚物溶液（固形成分濃度35質量％) 中，使相對於共聚物中莫耳之丙烯酸單位成爲30莫耳 之方式來添加2 -甲基丙烯醯氧乙基異氰酸酯，於氮氣環境 中、40 °C予以反應48小時，得到導入了在側鏈中具有能量 線硬化性基之重量平均分子量85萬的能量線硬化型官能 基而成之共聚物。相對於100質量份之由導入所得之能量 線硬化型官能基而成的共聚物溶液之固形成分，使3.0質 量份之光聚合引發劑的2,2-二甲氧基-1，2-二苯基乙-1-酮 ❺ 〔Ciba Specialty Chemicals 股份公司製、商品名「Irgacure 651」〕、100質量份（固形成分80質量份）之由能量線 硬化型多官能單體及寡聚物而成之組成物〔日本大日精化 工業股份公司製、商品名「14-29B(NPI)」〕與1.2質量 份（固形成分0.45質量份）之由聚異氰酸酯化合物而成之 交聯劑〔曰本東洋墨水股份公司製 '商品名「Oribain BHS-85 15」〕予以溶解，最後添加甲基乙基酮而將固形成 分濃度調整至40質量％，直到成爲均勻溶液爲止，加以攪 〇 拌而作成塗布液。 藉由刮刀塗布機以將調製之塗布液塗布於聚對苯二甲 酸乙二酯薄膜之單面已設置矽氧烷系剝離劑層的重剝離型 剝離片〔Lintec股份公司製、商品名「PET3811」〕的剝離 處理面，於90 °C加熱乾燥90秒鐘，形成由厚度50μιη之能 量線硬化型高分子材料而成之樹脂層。進行同樣方式，將 該塗布液塗布於聚對苯二甲酸乙二酯薄膜之單面已設置矽 氧烷系剝離層之輕剝離型剝離片〔Lintec股份公司製、商 品名「PET3801」〕的剝離處理面上，於90°C加熱乾燥90 -32- 200939172 秒鐘，形成由厚度50μιη之能量線硬化型高分子材料而成 之樹脂層。在該輕剝離型剝離片上形成的樹脂層，積層在 該重剝離型剝離片上形成的樹脂層，最後被輕剝離型剝離 片與重剝離型剝離片所夾住之厚度1 〇〇μιη的能量線硬化型 高分子材料而成之電路基板用樹脂片。 針對此電路基板用樹脂片，測定藉乙醇及四甲基銨氫 氧化物水溶液所得之膨潤率。將結果顯示於表1。 (2)電路晶片之配置與埋入、配線形成 Φ 使用上述（1 )所製作之電路基板用樹脂片，進行相同 於實施例1之（2)及（3)之方式，以進行電路晶片之配 ^置與埋入、及配線形成。 針對進行如此方式所形成之配線，觀察脫落、剝離的 同時，確認配線之導通。將其結果顯示於表1。 比較例2 (1) 電路基板用樹脂片之形成 於實施例3中，除了將配線形成層作成25 μιη、下層作 〇 成75 μιη以外，進行相同於實施例3之方式，以製作電路 基板用樹脂片。 針對此電路基板用樹脂片，測定藉乙醇及四甲基銨氫 氧化物水溶液所得之膨潤率。將結果顯示於表1。 (2) 電路晶片之配置與埋入、配線形成 使用上述（1)所製作之電路基板用樹脂片，進行相同 於實施例1之（2)及（3)之方式，以進行電路晶片之配 置與埋入、及配線形成。· 針對進行如此方式所形成之配線，觀察脫落、剝離的 -33- 200939172 同時，確認配線之導通。將其結果顯示於表1。 表1D acid monomethylaminoethyl ester, (meth)acrylic acid monoethylaminoethyl ester, (meth)acrylic acid monomethylaminopropyl ester, (meth)acrylic acid monoethylaminopropyl (meth) acrylate, etc. A monoalkylaminoalkyl acrylate; an ethylenically unsaturated carboxylic acid such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid or citraconic acid. Further, examples of other monomers used as required include vinyl esters such as ethyl acetate and vinyl propionate; and olefins such as ethylene, propylene and isobutylene; halogenated olefins such as vinyl chloride and vinylidene chloride. Styrene monomer such as styrene or α-methylstyrene; diene monomer such as butadiene, isoprene or chloroprene; nitrile such as acrylonitrile or methacrylonitrile Monomer; acrylamide, such as acrylamide, hydrazine-methacrylamide, hydrazine, hydrazine-dimethyl methacrylate. These monomers may be used singly or in combination of two or more. In the (meth) acrylate-based copolymer, these monomer units can contain 〇 30% by mass. In the polymer material, the (A-11-200939172-based) acrylate-based copolymer used as the acrylic polymer is not particularly limited in terms of its copolymerization form, and may be random, block, or graft. Any of the copolymers. Further, the molecular weight is preferably a weight average molecular weight of 50,000 to 2,000,000. Further, the above weight average molecular weight is a standard polystyrene conversion measured by a gel permeation chromatography (GPC) method. In the present invention, the (meth) acrylate-based copolymer may be used singly or in combination of two or more. Further, examples of the energy ray-curable polymerizable oligomer include phthalocyanine acrylate type, epoxy acrylate type, urethane acrylate type, polyether acrylate type, and polybutadiene acrylate. A system, a siloxane acrylate system, and the like. Here, for example, a polyester acrylate oligomer is used. The system is esterified with (meth)acrylic acid by esterification of a hydroxyl group of a polyester oligomer having a hydroxyl group at both terminals obtained by condensation of a polyvalent carboxylic acid with a polyhydric alcohol by using (meth)acrylic acid. It can be obtained by adding an alkylene oxide to a hydroxyl group at the terminal of the oligomer obtained from the polyvalent carboxylic acid. For example, an epoxy acrylate oligomer can be obtained by reacting (meth)acrylic acid with an oxirane ring of a lower molecular weight bisphenol type epoxy resin or a phenolphthalein type epoxy resin. Further, a carboxyl group-modified epoxy acrylate oligomer having a partial modification of the epoxy acrylate oligomer by a dibasic carboxylic acid anhydride can also be used. For example, a urethane acrylate oligomer can be obtained by esterification with (meth)acrylic acid in a polyurethane oligomer obtained by reacting a polyether polyol or a polyester polyol with a polyisocyanate. Further, a polyol acrylate-based oligomer can be obtained by esterifying a hydroxyl group of a polyether polyol with (meth)acrylic acid. The weight average molecular weight of the above polymerizable oligomer is measured by a GPC method in the range of standard polystyrene of -12 to 200939172, preferably 500 to 100, more preferably 1,000 to 70,000, further preferably A range of 3,000 to 40,000 is selected. Further, the above-mentioned weight average molecular weight is measured by standard gel in terms of a gel permeation chromatography (GPC) method, and is measured by the following conditions by the present invention unless otherwise specified. Device: GPC measuring device (manufactured by Toso Co., Ltd., trade name "HLC-8 02 0 Chromatograph") 0 Column: [Toso Corporation, product name "TSK-GELGMHXL" (2 pieces) and "TSK-GEL" G2000HXL" (1)] Dissolving solvent: tetrahydrofuran|> Concentration 1 % Injection amount: 8 0 μ 1 Temperature: 40 ° C Flow rate: 1.0 ml/min This polymerizable oligomer may be used alone or in combination of two. It is used above the species. On the other hand, examples of the energy ray-curable polymerizable monomer include cyclohexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and lauryl (meth)acrylate. Monofunctional acrylates such as acrylic acid stearate, (meth)acrylic acid isophthalic acid ester; di(meth)acrylic acid-1,4.butylene glycol ester, di(meth)acrylic acid-1 , 6_ hexanediol ester, neopentyl glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate adipate, di(a) Ethyl hydroxytrimethylacetate neopentyl glycol ester, di(methyl) acrylate dicyclo-13- 200939172 pentyl ester, di(methyl) acrylate caprolactone modified dicyclopentyl ester, di(methyl) Ethylene oxide acrylate modified phosphate, allylcyclohexyl (meth)acrylate, di(meth)acrylic acid isocyanate, di-methyltricyclodecane di(meth)acrylate, three ( Trimethylolpropane methyl methacrylate, dipentaerythritol tris(meth)acrylate, tris(meth) propylene Propionic acid modified dipentaerythritol ester, pentaerythritol tri(meth)acrylate, trimethylolpropane tris(meth)acrylate modified trimethylolpropane, isocyanate (propylene oxyethyl) ester, five ( Methyl)acrylic acid propionic acid modified dipentaerythritol φ ester, dipentaerythritol hexa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, caprolactone modified hexa(meth)acrylate, dipentaerythritol ester An ester modified ginseng (propylene oxyethyl) isocyanate or the like. Among them, based on the viewpoint of a high ratio of double bonds in the molecule, it is preferably dimethylol tricyclodecane di(meth)acrylate, caprolactone modified ginseng (propylene oxyethyl) isocyanate, hexaacrylic acid Pentaerythritol ester, tripentaerythritol heptaerythritol, and the like. These polymerizable monomers may be used alone or in combination of two or more. Further, as the (meth) acrylate-based copolymer, a (meth) acrylate-based copolymer having an energy ray-curable functional group in which an energy ray-curable group is introduced in a side chain may be used. The (meth) acrylate-based copolymer to which the energy ray-curable functional group has been introduced may, for example, be bonded to a functional group having an active hydrogen contained in the above (meth) acrylate-based copolymer, and A compound having an energy ray-curable group can be obtained by reacting the functional group with the functional group. For example, examples of such a compound include 2-(meth)acryloyloxyethyl isocyanate, methacrylonitrile isocyanate, allyl isocyanate, and methacrylic acid glycidyl ester. -14- 200939172 Base A, medium particle, micro-common machine, no ester / acid agent, olefin, propionate ><Light Μ ^ Description The hard line adds the amount of energy to the demand, and the external ray is required to receive the outer line of purple, the hard agent line and the amount of 硬 can be non-adhesive, and the agent can be used. The combination of the type of methacrylate and the like is used to polymerize the co-soft i-ester 1 acid to determine the swelling rate of the formula (1) or (2) in the energy ray-hardening polymer material. In the above, the (meth)acrylate copolymer having the hydroxyl group-containing monomer in this ratio is usually 10 to 50% by mass, and preferably has a φ of 25 to 45% by mass. Further, in the energy ray-curable polymer material, the hydroxyl group-containing (meth) acrylate copolymer and the energy ray-curable polymerizable oligomer and/or polymerizable monomer are present in the ratio. The blending ratio is preferably in the range of 1_〇: 0.8~1·0: 4.0, more preferably 〗 〖. 〇: 〇. 〇 〜1 · 0: 3.0 range. The energy ray-curable polymerizable oligomer and/or the polymerizable monomer is set to be less than 0.8 with respect to 1.0 part by mass of the (meth) acrylate-based copolymer having the hydroxyl group-containing monomer in the ratio. In the case of the mass portion, there is a possibility that the chemical resistance when the resin sheet for the ❹ m 13⁄4 substrate is cured is insufficient, and the wiring is swollen when the wiring is formed. On the other hand, the energy ray-curable polymerizable oligomer and/or polymerizable property of the hydroxyl group-containing (meth) acrylate-based copolymer in an amount of more than 4.0 parts by mass based on 1.0 part by mass. In the case where the monomer is blended, there is a possibility that there is a possibility that a problem such as embedding of a circuit chip occurs. Further, an ultraviolet ray or an electron beam as an energy ray is usually irradiated, and when a ray is irradiated, a photopolymerization initiator can be used. For example, examples of the photopolymerization initiator include benzoin, benzoin methyl ether, benzoin ethyl ether, -15· 200939172 benzoin isopropyl ether, benzoin n-butyl ether, benzophenone Isobutyl butyl ether, acetophenone, dimethylaminoacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-[4-(2-hydroxyethoxy)phenyl -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-2-dimethylamino-1-(4-morpholinylphenyl)-1-butanone, oxidized double 2,4,6-trimethylbenzyl)phenylphosphine,-2,4,6-trimethylbenzyldiphenylphosphine oxide, 2,2-dimethoxy-1,2-diphenyl Ethyl-1-one, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 2-hydroxy-1-[4 -[4-(2-hydroxy-2-methylpropenyl)benzyl]phenyl]-2-methylpropan-1-D ketone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1 -[4-(Methylthio)phenyl]-2-morpholinpropan-1-one, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)one, diphenyl Methyl ketone, p-phenyl benzophenone, 4,4'-diethylamine benzophenone, dichlorobenzophenone, 2-methyl hydrazine, 2-ethyl hydrazine, 2-tributyl fluorene 2-amino hydrazine 2-methylthiothioxanthone, 2-ethylthiothioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, benzyl di Methyl ketal, acetophenone dimethyl ketal, p-dimethylamine benzoate, [2-hydroxy-2-methyl-l-[4-(1-propenyl)phenyl]propanone] Polymer, etc. These photopolymerization initiators may be used alone or in combination of two or more. The blending amount is usually 〇1 to 10 parts by mass based on 100 parts by mass of the solid content of the energy ray-curable polymer material. In the present invention, the energy ray-curable material can contain inorganic fine particles for the purpose of suppressing volume shrinkage at the time of curing by the energy ray of the obtained resin sheet for a circuit board, and improving heat resistance. For example, the inorganic fine particles can be an oxide or a carbide of various metal elements such as ruthenium, titanium, zirconium, tin, aluminum, or iron, and the like, such as suppression effect by volume shrinkage, light transmittance, and economy among the inorganic fine particles. Sexual equivalence - 16 - 200939172 Viewpoint, preferably cerium oxide particles. In the present invention, the inorganic particles may be used singly or in combination of two or more. Further, the average particle diameter is preferably in the range of 3 to 50 μm, more preferably in the range of 5 to 30 μm, from the viewpoints of transparency, uniform dispersibility, suppression of volume shrinkage effect, and the like. Further, the average particle diameter in the present invention is calculated based on the BET method. In the case of using cerium oxide microparticles, the cerium oxide microparticles are preferably cerium oxide sol oligomers dispersed in an organic solvent such as an alcohol system or a cellosolve system. In the present invention, the inorganic fine particles are used for secondary aggregation and are homogeneously dispersed in the energy ray-curable polymer material, and it is preferred to use inorganic fine particles which have been subjected to surface modification treatment. The surface modification treatment method is not particularly limited. For example, a conventional method may be exemplified by a method using an organic decane compound or a method using a surfactant, and depending on the type of the inorganic fine particles and the type of the energy ray-curable polymer material. Good to choose. For example, when cerium oxide fine particles are used as the inorganic fine particles, it is advantageous to use a cerium organodecane compound for surface modification treatment; in the case of inorganic fine particles other than cerium oxide microparticles, it is advantageous to use a surfactant for surface modification. deal with. In the energy ray-curable polymer material, a crosslinking agent, an adhesion agent, an antioxidant, an ultraviolet absorber, a light stabilizer, and a softener can be added as needed within the range in which the effects of the present invention are not impaired. Wait. For example, the crosslinking agent may, for example, be a polyisocyanate compound, an epoxy resin, a melamine resin, a urea resin, a dialdehyde, a methylol polymer, a hydrazine compound, a metal chelate compound, a metal alkoxide or a metal salt. It is preferred to use a polyisocyanate compound for -17-200939172. The crosslinking agent can be blended in an amount of from 0 to 30 parts by mass based on 100 parts by mass of the solid component of the above (meth) acrylate-based copolymer. Here, examples of the polyisocyanate compound include aromatic polyisocyanates such as toluene diisocyanate, diphenylmethane diisocyanate, and xylene diisocyanate; aliphatic polyisocyanates such as hexamethylene diisocyanate; and isophorone; An alicyclic polyisocyanate such as a diisocyanate or a hydrogenated diphenylmethane diisocyanate; and the like, and a condensed diurea or isocyanate, and further, ethylene glycol, propylene glycol, and neopentyl An adduct of a reactant containing a low molecular weight active hydrogen compound such as an alcohol, trimethylolpropane or castor oil. These crosslinking agents may be used singly or in combination of two or more. (Form of Resin Sheet for Circuit Board) Next, the resin sheet for a circuit board of the present invention can be formed into a plurality of layers. For example, a two-layer structure in which a wiring layer and a lower layer are formed can be formed. In this case, in the wiring forming layer, the cured product is an energy ray-curable polymer material having the above-described physical properties, and it is preferable to use a hydroxyl group having 1 to 35% by mass in a ratio of 10 to 50% by mass. Monomer unit (meth) acrylate copolymer. On the other hand, the energy ray-curable polymer material of the lower layer can be used. The type thereof is not particularly limited, and the above-mentioned (meth)acrylate copolymer, energy ray-curable polymerizable oligomer, and/or the like can be used. A polymer material such as a polymerizable monomer and a photopolymerization initiator as required. Specifically, the lower layer of the energy ray-curable polymer material can be appropriately selected by imparting the function of the lower layer. For the function of the lower layer, it can be listed as -18-200939172: to improve the adhesion between the wiring forming layer and the carrier or to improve the embedding of the circuit chip. For example, in the case where the adhesion between the wiring forming layer and the carrier is improved, the monomer having the active hydrogen constituting the (meth) acrylate-based copolymer is not preferably a monomer having a hydroxyl group. It is set as a monomer containing a carboxylic acid. In the resin sheet for a circuit board of the present invention, the film thickness of the wiring forming layer/the thickness of the resin sheet for the circuit board is p値, and based on the viewpoint of the reliability of the 0 developing solution or the etching liquid, The P 値 is preferably 0·5 or more, more preferably 0.6 or more. In the case where the P 値 is 1, the resin sheet for a circuit board of the present invention has only one layer structure composed of a wiring forming layer. >> (Manufacturing Method of Resin Sheet for Circuit Board) Hereinafter, a method of producing the resin sheet for a circuit board of the present invention will be described. However, the present invention is not particularly limited as such. By using a conventional method such as a doctor blade coating method, a roll coating method, a rod coating method, a blade coating method, a die coating method, a gravure coating method, or the like, Ο becomes a predetermined thickness method A coating liquid having an appropriate concentration of the energy ray-curable polymer material is applied/dried on the release agent layer of the release sheet to form a resin sheet for a circuit board having a layer structure. The release sheet may be directly laminated for storage or protection of the resin sheet for a circuit board. In addition, the release sheet having a different peeling force from the release sheet may be laminated on the other surface of the resin sheet for a circuit board, or may be used as it is for the production of the circuit board sheet to be described later. The thickness of the resin sheet for a circuit board is usually about 50 to ΙΟΟΟμπι', preferably 8 〇 to 5 μm, depending on the conditions of use. In the case of increasing the thickness of the resin sheet for the circuit board, the resin sheet produced by the method for producing a resin sheet can be used as a resin sheet. Further, in the case of the two-layer structure, the wiring is formed in accordance with the above-described manufacturing method, and by forming the layers and the lower layers by wiring, it is possible to form a circuit board having a two-layer structure. The release sheet is not particularly limited, and a release agent such as a decyl oxide resin is applied to a polyolefin film or a polyethylene terephthalate film such as a poly-polypropylene film, and a release sheet or the like is provided. The thickness of the peeling sheet is usually about 20 to 150 μm. [The sheet for a circuit board] The sheet for a circuit board according to the sheet for a circuit board of the present invention is composed of a structure in which one surface of the circuit board is formed on a carrier. . The resin sheet for a circuit board is preferably as described above. On the other hand, the carrier is not particularly limited, and it is used as a suitable carrier among the transparent carriers used for the carrier for display. Examples of such a carrier include a glass substrate, a film-form plastic carrier, and the like. For example, the glass substrate can be a carrier made of glass, bismuth/saw glass, aluminosilicate glass, lead glass, selenium borosilicate glass, quartz or the like. On the other hand, as the film-form plastic carrier, for example, a carrier made of a polycarbonate resin, a polyethylene terephthalate resin, a polysulfide resin, a polycycloolefin resin or the like can be used. The circuit substrate of the carrier is formed into a circuit board layer and a lower layer which can be peeled off from a polymer layer such as a resin vinyl film or a diester. The blending isoform of the resin sheet of the present invention can be optionally selected from a plate shape or a soda lime glass, a plate-like or thin resin, a propylene resin, a poly-tree thickness system according to -20 - 200939172 is appropriately selected for use, and is usually about 20 μm to 5 mm, preferably 50 μm to 2 mm. [Manufacturing Method of Sheet for Circuit Substrate] Hereinafter, a method of manufacturing the sheet for a circuit board will be exemplified. However, the present invention is not particularly limited as such. In the first method, when the release sheet is laminated on both sides of the resin sheet for a circuit board, first, the peeling surface is bonded to the carrier by peeling off the light release type release sheet to form a sheet for a circuit board. 〇 In the second method, a resin sheet for a circuit board is produced on a release sheet by this method, and then a film for a circuit board is produced by directly bonding the carrier. The third method directly forms the predetermined thickness by a conventional method such as a doctor blade coating method, a roll coating method, a rod coating method, a blade coating method, a die coating method, a gravure coating method, or the like. The coating liquid is applied/dried on the carrier, and a sheet for a circuit board is directly produced by forming a resin sheet for a circuit board. © The first method is suitable for the use of a rigid carrier such as a glass substrate. The second and third methods are suitable for a carrier such as a film-like plastic. [Circuit board for display] The circuit board for a display of the present invention can be produced by embedding a circuit wafer on the surface of a resin sheet for a circuit board obtained as described above, by irradiating an energy ray to the surface of the resin sheet for a circuit board. For the specific method, the buried circuit chip is placed on the glass substrate with the release sheet, and the wiring layer of the resin substrate for the circuit board is formed (the resin sheet for the circuit board and the release sheet are bonded to each other). In the case, pre--21-200939172 is used after being stripped, and the circuit substrate is placed on the circuit chip, and the load is about 0.05 to 2.0 MPa, preferably 〇 150 ° C. It is more preferable to embed the wafer at a temperature of 5 to 1 ° C, irradiate the energy ray to cure the resin sheet for the circuit board, and then peel off the glass substrate with the release sheet on which the circuit wafer is placed, thereby obtaining A circuit board for a display of the present invention. Further, in the case where the circuit wafer is buried by heating, the irradiation of the energy ray may be performed while the resin sheet for the circuit board is heated, or may be cooled to room temperature. 〇 Normally the energy line uses ultraviolet or electronic wires. The ultraviolet ray is obtained by a high pressure mercury lamp, a fused xenon lamp, a xenon lamp or the like, and the electron beam is obtained by an electron beam accelerator or the like. Among the energy lines, especially ultraviolet rays are particularly suitable. The irradiation amount of the energy ray is appropriately selected. For example, in the case of ultraviolet rays, the exposure amount is preferably from 100 to 5,000 mJ/cm 2 ; in the case of an electron beam, it is preferably from about 10 to 100 kr. Fig. 1(a) to Fig. 1(c) are diagrams showing the steps of an example of a method of displaying a buried circuit wafer using the circuit board sheet of the present invention. First, the resin sheet 2 for a circuit board of the present invention obtained from the energy-hardening type polymer material in an uncured state is prepared on the carrier 1, and the circuit wafer 3 is also placed on the glass substrate 4 with the release sheet. [(a)]. Then, the wiring layer forming layer side of the resin sheet 2 for a circuit board is placed so as to be connected to the circuit wafer 3, and the wafer is buried by the load to be hardened by irradiation of the energy ray [(b)]. According to this operation, the resin sheet 2 for a circuit board in an uncured state is a hardened layer, and the circuit wafer 3 is embedded therein and fixed, and the circuit board 5 for a display of the present invention is also easily removed from the glass substrate 4 to which the release sheet is attached. Stripped [(c)]. -22- 200939172 According to such a method, instead of heating the polymer film and embedding it in the circuit wafer, it is hardened by using an energy ray-hardening polymer material, embedding the circuit wafer, and then hardening it; Inappropriate conditions in the polymer film will be difficult to occur 'can shorten the operation time and be efficient. In addition, the method of embedding the circuit wafer may be carried out by placing the circuit wafer in a resin sheet for a circuit board, and attaching and burying the glass substrate 4 with the release sheet to the circuit wafer 3. . 〇 Suitable for such a method, and further, it is possible to provide a circuit board for a display embedded in a circuit chip, which has excellent embedding property, and has a small volume shrinkage during hardening, and has sufficient adhesion to the carrier, Has high heat resistance. (Wiring formation) In this manner, a wiring (circuit) is usually formed on a surface of a display circuit board which is embedded in a circuit wafer, hardened, and fixed. G The method of forming the wiring is not particularly limited, and any of the conventional methods can be appropriately selected and implemented. Wiring formation can be performed using, for example, photolithography. When an example is shown, first, a positive or negative photoresist is applied onto a sheet for a circuit board which is cured by a buried circuit wafer to form a photoresist layer. Next, the photoresist layer is exposed through a predetermined mask pattern, and then subjected to development processing using an alkali developing solution such as a tetramethylammonium hydroxide aqueous solution to form a photoresist pattern. Then, for example, by sputtering using a chromium target as a wiring material, -23-200939172, a chromium film having a predetermined thickness is formed on the photoresist pattern, and then the circuit substrate sheet is immersed in an etching solution such as ethanol. The desired wiring can be formed by etching the photoresist. In the present invention, since the cured product of the resin sheet for a circuit board is excellent in chemical resistance, it is possible to prevent the wiring from falling off or peeling off during the wiring formation. EXAMPLES Next, the present invention will be described in more detail by way of examples, which are not limited by the examples. In addition, the cured product swelling ratio of the resin sheet for a circuit board obtained in each of the examples was measured as follows: » The measurement of the swelling ratio was made to have a thickness of 100 in accordance with Examples 1 to 3 and Comparative Examples 1 and 2 to be described later. A resin sheet for a circuit board of μιη. This circuit board is peeled off with a resin sheet, and the light-peelable release sheet is cured in a nitrogen atmosphere under the conditions of an illuminance of 400 mW/cm 2 and an exposure amount of 300 mJ/cm 2 . . The resin sheet for the circuit board to be cured is peeled off from the heavy release type release sheet, and the film thickness (film thickness before immersion) is measured by a thickness gauge (manufactured by TECLOCK CORPORATION, model "PG-02"). Then, the resin sheet for a circuit board was immersed in ethanol or a 2.38 mass% tetramethylammonium hydroxide aqueous solution for 10 minutes at 23 °C. After 10 minutes, the resin sheet for a circuit board was taken out, and the droplets adhering to the surface were quickly removed, and the thickness gauge (the same as above) was used to measure the film thickness (film thickness after immersion). Based on the results, the swelling ratio of ethanol or 2.38 mass% tetramethylammonium hydroxide aqueous solution was calculated by the following formula: -24- 200939172 swelling ratio (%) = [(film thickness after impregnation-pre-impregnation film) Thickness / film thickness before immersion] X100 The 'swelling ratio' indicates the average enthalpy of measurement performed five times. In addition, the wire is cut off and the peeling is performed by a digital microscope (manufactured by Keyence Co., Ltd., "Digital Microscope VHX-200"), and the tester is used to confirm the conduction of the wiring, and the turn-on is set to 〇. , the non-conductor is set to X. Example 1 (1) The resin sheet for a circuit board was formed in a mixed solvent of ethyl acetate/methyl ethyl ketone (mass ratio: 50:50), and was made to be 97 parts by mass relative to 1 part by mass. The solid component of the methacrylate copolymer solution (solid content concentration: 35 mass%, weight average molecular weight: 100,000) obtained by reacting methyl acrylate with 3 parts by mass of 2-hydroxyethyl methacrylate to make 5.0 2,2-dimethoxy-1,2-diphenylethan-1-one (manufactured by Ciba Specialty Chemicals Co., Ltd., trade name "Irgacure 651") of a photopolymerization initiator of a mass part, and 200 parts by mass A composition obtained by measuring a linearly-curable polyfunctional monomer (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Light Acrylate DCP-A") and 5.0 parts by mass of a crosslinking agent derived from a polyisocyanate compound [Made in Japan Mitsui Chemical Polyurethane Co., Ltd., trade name "Takenate D-140N") was dissolved, and finally methyl ethyl ketone was added to adjust the solid content concentration to 40% by mass until it became a homogeneous solution. And make a coating liquid. The prepared coating liquid was applied to a heavy-peelable release sheet having a silicone-based release agent layer on one side of a polyethylene terephthalate film by a knife coater (manufactured by Lintec Co., Ltd., trade name "PET3811"). The peeling portion of the -25-200939172 surface was heated and dried at 90 ° C for 90 seconds to form a resin layer made of an energy ray-curable polymer material having a thickness of 5 μm. In the same manner, the coating liquid was applied to a strip of a light-peelable release sheet (manufactured by Lintec Co., Ltd., trade name "PET3801") having a siloxane-based release layer provided on one side of a polyethylene terephthalate film. The treated surface was dried by heating at 90 ° C for 90 seconds to form a resin layer made of an energy ray-curable polymer material having a thickness of 50 μm. The resin layer formed on the light release type release sheet is laminated with a resin layer formed on the heavy release type release sheet, and finally the energy line hardened by the thickness 1 ΟΟ μηη sandwiched between the light release type release sheet and the heavy release type release sheet. In the polymer material, a resin sheet for a circuit board obtained by forming a layer of only one layer of wiring is obtained. (1) The swelling ratio of the aqueous solution of ethanol and tetramethylammonium hydroxide was measured for the resin sheet for the circuit board. The results are shown in Table 1. (2) Arrangement and embedding of the circuit wafer The light-peelable release sheet of the resin sheet for a circuit board produced in the above (1) was laminated on a glass substrate of 5 cm x 5 cm, and finally, the peel-off release sheet was peeled off. Next, two circuit wafers (circuit wafer: vertical 5 mm x width 5 mm x thickness 50 μm) were placed at intervals of 3 cm. Further, a 5 cm x 5 cm glass plate with a release sheet was prepared, and pressed on a chip for a circuit board using a planar compressor, and pressed at a pressure of 0.3 MPa for 5 minutes. After returning to the normal pressure, the light source of the molten bulb was irradiated with ultraviolet light to illuminate the sheet for the circuit board under the conditions of an illuminance of 400 mW/cm 2 and an exposure of 300 mJ/cm 2 . (3) Wiring is formed by a spin coater at a number of revolutions of 3000 rpm for 40 seconds, and -26-200939172 is a positive resist liquid (manufactured by Tokyo Chemical Industry Co., Ltd., trade name "OFPR- 8 00" The entire surface was uniformly coated on the sheet for a circuit board of the embedded circuit wafer obtained in the above (2), and then dried at 100 ° C for 5 minutes. Then, the exposure was carried out, and the wiring was used to form a wiring between the circuit wafers so that the wiring width was 2 mm. After the exposure, the circuit board was immersed in a developing solution (manufactured by Tokyo Ohka Kogyo Co., Ltd., trade name "NMD-3") for 1 minute, and then washed with purified water at i〇〇°C and dried. Minutes for visualization. Thereafter, a chromium (Cr) target was used, and a chromium (Cr) film of 50 nm was formed on the sheet for a circuit board by sputtering. Finally, it was immersed in ethanol for 10 minutes, and etching was performed to form a wiring of Cr between the wafers. For the wiring formed in this manner, the disconnection and peeling were observed, and the wiring was confirmed to be turned on. The results are shown in Table 1. Example 2 (1) A resin sheet for a circuit board was formed in an ethyl acetate/methyl ethyl ketone mixed solvent (mass ratio: 50:50), and 50 parts by mass of butyl acrylate and 20 parts by mass of methyl group were obtained. An acrylate copolymer solution (solid content concentration: 35 mass%) obtained by reacting methyl acrylate with 30 parts by mass of 2-hydroxyethyl acrylate to give 100 moles of acrylic acid 2-hydroxyl group relative to the copolymer The ethyl group was added in a manner of 80 moles to add 2-methylpropenyloxyethyl isocyanate, and 4 (TC was reacted for 48 hours in a nitrogen atmosphere to obtain a weight average molecular weight having an energy ray-curable group in the side chain. a copolymer of 850,000, which is obtained by introducing an energy ray-curable functional group, and is formed by solidification of a copolymer solution obtained by introducing an energy ray-curable functional group obtained by introducing 1 part by mass - 27-200939172, 5.0 parts by mass of a photopolymerization initiator, 2,2-dimethoxy-1,2-diphenylethan-1-one (manufactured by Ciba Specialty Chemicals Co., Ltd., trade name "Irgacure 651"), 150 parts by mass of energy line hardening amine A composition of an ester oligomer (manufactured by Sakamoto Synthetic Chemical Industry Co., Ltd., trade name "Purple UV-1700B", weight average molecular weight: 1800] and 5.0 parts by mass (solid component: 3.8 parts by mass) A cross-linking agent made of an isocyanate compound (manufactured by Mitsui Chemicals Polyurethane Co., Ltd., trade name "Takenate D-14〇N") was dissolved, and finally methyl ethyl G ketone was added to adjust the solid content concentration to 40. % by mass, until a homogeneous solution is obtained, and the mixture is stirred to prepare a coating liquid. The prepared coating liquid is applied to one side of the polyethylene terephthalate film by a knife coater to provide a layer of a decane-based release agent. The peeling-treated surface of the heavy peeling peeling sheet (manufactured by Lintec Co., Ltd., trade name "PET381 1") was dried by heating at 90 ° C for 90 seconds to form an energy ray-curable polymer material having a thickness of 50 μm. In the same manner, the coating liquid was applied to a light-peelable release sheet of a polyethylene terephthalate film which was provided with a ruthenium oxide layer on one side of a polyethylene terephthalate film [Lintec Co., Ltd. The peeling-treated surface of the product name "PET3 8 0 1" was 9 〇. (:, drying by heating for 90 seconds) A resin layer formed of an energy ray-curable polymer material having a thickness of 50 μm was formed. A resin layer formed on the light release type release sheet, a resin layer formed on the heavy release release sheet, and an energy ray-cured type having a thickness of 1 〇〇μηη sandwiched between the light release release sheet and the heavy release release sheet. In the polymer material, a resin sheet for a circuit board formed by forming only one layer of wiring is obtained. 隹10 The resin sheet for the circuit board is used to measure the swelling ratio of the aqueous solution of ethanol and tetramethylammonium hydroxide-28-200939172. . The results are shown in Table 1. (2) Arrangement, embedding, and wiring of the circuit wafer The resin sheet for a circuit board produced in the above (1) is used in the same manner as (2) and (3) of the first embodiment to arrange the circuit wafer. Formed with buried, and wiring. For the wiring formed in this manner, the disconnection and peeling were observed, and the wiring was confirmed to be turned on. The results are shown in Table 1. Example 3 Resin sheet φ for a circuit board having a two-layer structure (1) Formation of a wiring forming layer Using the same coating liquid as in Example 2, the coating liquid was applied to polyethylene terephthalate by a knife coater. A release-treated surface of a heavy release-type release sheet (manufactured by Lintec Co., Ltd., trade name "PET3811") having a silicone layer-based release agent layer on one side of the ester film, and dried by heating at 90 ° C for 90 seconds to form a thickness. A resin layer (wiring forming layer) made of an energy-hardening polymer material of 75 μm. (2) Formation of lower layer φ acrylate copolymer obtained by reacting 80 parts by mass of butyl acrylate and 20 parts by mass of acrylic acid in an ethyl acetate/methyl ethyl ketone mixed solvent (mass ratio: 50:50) In the solution (solid content concentration: 35 mass%), 2-methylpropenyloxyethyl isocyanate was added so as to be 30 mols per 1 mol of the acrylic acid in the copolymer, in a nitrogen atmosphere, The reaction was carried out at 40 ° C for 48 hours to obtain a copolymer obtained by introducing an energy ray-curable functional group having a weight average molecular weight of 850,000 in an energy ray-curable group in a side chain. The solid content of the copolymer solution obtained by introducing the obtained energy ray-curable functional group to 1 part by mass of the 2,2-dimethoxy group of the photopolymerization initiator of 3.0 -29 to 200939 172 parts by mass -1,2-diphenylethan-1-one (manufactured by Ciba Specialty Chemicals Co., Ltd., trade name "Irgacure 651"), 100 parts by mass (solid content: 80 parts by mass) of an energy ray-curable polyfunctional monomer and A composition made of an oligomer (product name "14-29B (NPI)", manufactured by Nippon Seiki Co., Ltd., weight average molecular weight: 2000] and 1.2 parts by mass (solid content: 0.45 parts by mass) of polyisocyanate The compound-formed cross-linking agent (manufactured by Toyo Ink Co., Ltd., trade name "Oribain BHS-8515") was dissolved, and finally φ methyl ethyl ketone was added to adjust the solid content concentration to 40% by mass until it became a homogeneous solution. The coating liquid was prepared by stirring. A heavy-peelable release sheet (manufactured by Lintec Co., Ltd.) in which a coating liquid to be applied is applied to a single layer of a polyethylene terephthalate-based ethylene glycol diester film by a knife coater. The peeling-treated surface of the name "PET3 80 1" was heat-dried at 90 ° C for 90 seconds to form an underlayer resin layer made of an energy ray-curable polymer material having a thickness of 25 μm. (3) Formation of Resin Sheet for Circuit Substrate 配线 The wiring formation layer formed on the heavy release release sheet of the above (1) is laminated on the lower layer formed on the light release release sheet of the above (2), and finally obtained by heavy peeling A resin sheet for a circuit board made of an energy ray-curable polymer material having a thickness of 1 μm of a thickness of 1 〇〇 μηη of a release sheet, a wiring formation layer, a lower layer, and a light release release sheet. The swelling ratio of ethanol and tetramethylammonium hydroxide aqueous solution was measured for the resin sheet for a circuit board, and the results are shown in Table 1. (4) The arrangement, the embedding, and the wiring of the circuit chip are performed by using the resin sheet for a circuit board produced in the above (3), and performing the same method as (2) and (3) of the first embodiment in the following -30-200939172. The arrangement, embedding, and wiring formation of the circuit chip. For the wiring formed in this manner, the disconnection and peeling were observed, and the wiring was confirmed to be turned on. The results are shown in Table 1. (Example 4) The same procedure as in Example 1 was carried out to prepare a resin sheet for a circuit board, and the arrangement and embedding of the circuit wafer were performed. <Wiring formation> φ peeling off the release film of the negative dry film resist [manufactured by Asahi Kasei Electronics Co., Ltd., trade name "SUNFORTAQ-2796"), and laminating it at ll ° ° C, 〇 . 3 MPa by lamination It is embedded in a chip for a circuit board of a circuit chip. Then, exposure was carried out, and exposure was performed using a photomask so that wiring was formed only between the circuit wafers and the wiring width was 2 mm. After the exposure, the circuit board was immersed in a developing solution (1% by mass aqueous sodium carbonate solution) for 3 minutes, washed with purified water, and dried at 1 ° C for 5 minutes, and then developed. Thereafter, a chromium (Cr) target was used to form a 50 nm chromium (Cr) film on the circuit substrate sheet by sputtering. Finally, it was immersed in ethanol for 10 minutes, and etching was performed to form a wiring of Cr between the wafers. At the same time as the wiring formed in this manner was observed to fall off and peel off, the wiring was confirmed to be turned on. The results are shown in Table 1. Comparative Example 1 (1) Formation of a resin sheet for a circuit board, arrangement and embedding of a circuit wafer, and wiring formation in an ethyl acetate/methyl ethyl ketone mixed solvent (mass ratio 50:.50)' 80 parts by mass In the acrylate copolymer solution (solid content concentration: 35 mass%) obtained by reacting acrylic acid butyl acrylate and 2 parts by mass of acrylic acid, the acrylic acid unit relative to the copolymer in the copolymer is 30. In a molar manner, 2-methylpropenyloxyethyl isocyanate was added and reacted in a nitrogen atmosphere at 40 ° C for 48 hours to obtain a weight average molecular weight of 850,000 having an energy ray-curable group in the side chain. A copolymer of energy ray-hardening functional groups. The solid content of the copolymer solution obtained by introducing the energy ray-curable functional group obtained by introducing 100 parts by mass of 2,2-dimethoxy-1,2-di of 3.0 parts by mass of the photopolymerization initiator Phenylethyl-1-ketone oxime (manufactured by Ciba Specialty Chemicals Co., Ltd., trade name "Irgacure 651"), and 100 parts by mass (solid component 80 parts by mass) of an energy ray-curable polyfunctional monomer and oligomer The composition (manufactured by Dainippon Seika Co., Ltd., trade name "14-29B (NPI)") and 1.2 parts by mass (solid content: 0.45 parts by mass) of a cross-linking agent made of a polyisocyanate compound [Sakamoto Toyo The product name "Oribain BHS-85 15" manufactured by Ink Co., Ltd. was dissolved, and finally methyl ethyl ketone was added to adjust the solid content concentration to 40% by mass until it became a homogeneous solution, and the mixture was stirred and mixed to prepare a coating liquid. . The coating liquid which has been prepared by applying a prepared coating liquid to a single layer of a polyethylene terephthalate film by a knife coater is provided with a peeling type release sheet of a silicone-based release agent layer (manufactured by Lintec Co., Ltd., trade name "PET3811" The peeling-treated surface of the film was dried by heating at 90 ° C for 90 seconds to form a resin layer made of an energy ray-curable polymer material having a thickness of 50 μm. In the same manner, the coating liquid was applied to a strip of a light-peelable release sheet (manufactured by Lintec Co., Ltd., trade name "PET3801") having a siloxane-based release layer provided on one side of a polyethylene terephthalate film. The treated surface was heated and dried at 90 ° C for 90 - 32 to 2009 39172 seconds to form a resin layer made of an energy ray-curable polymer material having a thickness of 50 μm. The resin layer formed on the light release release sheet is laminated with a resin layer formed on the heavy release release sheet, and finally the energy line of the thickness 1 〇〇 μηη sandwiched between the light release release sheet and the heavy release release sheet. A resin sheet for a circuit board made of a hardened polymer material. The swelling ratio of the aqueous solution of ethanol and tetramethylammonium hydroxide was measured for the resin sheet for a circuit board. The results are shown in Table 1. (2) Arrangement, embedding, and wiring formation of the circuit wafer Φ The resin sheet for a circuit board produced in the above (1) is used in the same manner as (2) and (3) of the first embodiment to perform a circuit chip. The device is placed, embedded, and wired. For the wiring formed in this manner, the disconnection and peeling were observed, and the wiring was confirmed to be turned on. The results are shown in Table 1. (Comparative Example 2) The resin sheet for a circuit board was formed in the same manner as in Example 3 except that the wiring layer was formed to be 25 μm and the lower layer was made to have a thickness of 75 μm. Resin sheet. The swelling ratio of the aqueous solution of ethanol and tetramethylammonium hydroxide was measured for the resin sheet for a circuit board. The results are shown in Table 1. (2) Arrangement, embedding, and wiring of the circuit chip The resin sheet for a circuit board produced in the above (1) is used, and the configuration of the circuit wafer is performed in the same manner as in (2) and (3) of the first embodiment. Formed with buried, and wiring. - For the wiring formed in this way, observe the peeling and peeling -33- 200939172 At the same time, confirm the wiring continuity. The results are shown in Table 1. Table 1

膨潤率（％) 有無配線之 脫落/剝離 導通之 確認 乙醇 四甲基銨氫氧化物 7]C溶液 實施例1 3.5 0.4 無 〇 實施例2 2.5 0.2 無 〇 實施例3 3.9 0.4 Λτττ m 〇 實施例4 3.5 0.4 ^ΤΤΤ 1 11 1 -川、 〇 比較例1 6.2 1.2 有 X 比較例2 5.1 0.8 有 X 由表1可得知，實施例1〜4中任一電路基板用樹脂片 之藉乙醇及四甲基銨氫氧化物水溶液所得之膨潤率係低於 4.0%，無配線之觀察脫落、剝離，導通爲合格。 相對於此，比較例1及比較例2，電路基板用樹脂片 之藉乙醇所得之膨潤率超過4.0%，另外，藉四甲基銨氫氧 化物水溶液所得之膨潤率係〇 . 8〜1 . 2 %，觀察到配線之觀 察脫落、剝離，導通並不合格。 產業上利用之可能性 基於品質佳、高生產性，本發明之電路基板用樹脂片， 其硬化物具優越之耐藥品性，能夠有效提供用以控制顯示 器用（尤其，平面顯示器用）之各像素而埋入電路晶片之 電路基板。 【圖式簡單說明】 -34- 200939172 第1(a)圖〜第1(c)圖係使用本發明之電路基板用 樹脂片，顯示埋入電路晶片之方法一例的步驟說明圖。 【主要元件符號說明】 1 載體 2 電路基板用樹脂片 3 電路晶片 4 附剝離片之玻璃基板 5 顯示器用電路基板 ❹Swelling rate (%) With or without wire breakage/peeling conduction Confirmation of ethanol tetramethylammonium hydroxide 7] C solution Example 1 3.5 0.4 No ruthenium Example 2 2.5 0.2 No ruthenium Example 3 3.9 0.4 Λτττ m 〇Example 4 3.5 0.4 ^ΤΤΤ 1 11 1 - Sichuan, 〇Comparative Example 1 6.2 1.2 With X Comparative Example 2 5.1 0.8 With X It can be seen from Table 1 that the resin sheets for any of the circuit boards of Examples 1 to 4 are ethanol and The swelling ratio obtained by the aqueous solution of tetramethylammonium hydroxide was less than 4.0%, and the peeling and peeling were observed without wiring, and the conduction was acceptable. On the other hand, in Comparative Example 1 and Comparative Example 2, the swelling ratio of the resin sheet for a circuit board by ethanol was more than 4.0%, and the swelling ratio by the aqueous solution of tetramethylammonium hydroxide was 〇. 8 to 1. 2%, the observation of the wiring was observed to fall off and peel off, and the conduction was not acceptable. The possibility of industrial use is based on the high quality and high productivity. The resin sheet for a circuit board of the present invention has excellent chemical resistance and can be effectively provided for controlling displays (especially for flat panel displays). A pixel is embedded in a circuit substrate of a circuit chip. [Brief Description of the Drawings] -34- 200939172 Fig. 1(a) to Fig. 1(c) are diagrams showing an example of a method of embedding a circuit chip using the resin sheet for a circuit board of the present invention. [Explanation of main component symbols] 1 Carrier 2 Resin sheet for circuit board 3 Circuit wafer 4 Glass substrate with peeling sheet 5 Circuit board for display ❹

-35--35-

Claims (1)

200939172 七、申請專利範圍： 1.—種電路基板用樹脂片，其特徵係配線形成層係得自能 量線硬化型高分子材料之樹脂片，以曝光量3〇()mj/cm2 照射能量線而予以硬化之情形，於2 3 t：之乙醇中浸漬i 〇 分鐘後的膨脹率符合下式（1)之關係： 膨潤率（％ )=〔（浸漬後膜厚一浸漬前膜厚）/浸漬前 膜厚〕X100S4.0 …（1)。 2 .如申請專利範圍第1項之電路基板用樹脂片，其中配線 〇 形成層係得自能量線硬化型高分子材料之樹脂片，以曝 光量3 00mJ/cm2照射能量線而予以硬化之情形，於m 之2.38質量％四甲基銨氫氧化物水溶液中浸漬1〇分鐘 後的膨脹率符合下式（2)之關係： 膨潤率（％ )=〔（浸漬後膜厚一浸漬前膜厚）/浸漬前 膜厚〕χ1〇〇€〇·6··· (2)。 3. 如申請專利範圍第1或2項之電路基板用樹脂片，其中 電路基板用樹脂片爲由單層之配線形成層而成，該樹脂 〇 片中之能量線硬化型高分子材料係以10〜50質量％之 比例含有（甲基）丙烯酸酯系共聚物，而該（甲基）丙 烯酸酯系共聚物係具有1〜35質量％之含羥基的單體單 位。 4. 如申請專利範圍第丨或2項之電路基板用樹脂片，其中 電路基板用樹脂片係由複數層而成，在其一側之最外表 面具有符合下式（3)之關係的配線形成層： 配線形成層之膜厚/電路基板用樹脂片之總膜厚20.5… -36- 200939172 ， 5.如申請專利範圍第4項之電路基板用樹脂片，其中配線 形成層中之能量線硬化型高分子材料係以10〜5〇質量 %之比例含有（甲基）丙烯酸酯系共聚物，而該（甲基） 丙嫌酸酯系共聚物係具有1〜35質量％之含經基的單體 單位。 6·—種電路基板用片，其特徵係在載體上形成如申請專利 範圍第1至5項中任一項之電路基板用樹脂片的單面。 7. —種顯示器用電路基板，其特徵係在如申請專利範圍第 e 6項之電路基板用片之電路基板用樹脂片表面中，埋入 電路晶片，對其照射能量線而予以硬化。 8. 如申請專利範圍第7項之顯示器用電路基板，其係由在 <y 埋入電路晶片之側的表面上形成電路而成。 〇 -37-200939172 VII. Patent application scope: 1. A resin sheet for a circuit board, characterized in that the wiring forming layer is a resin sheet obtained from an energy ray-hardening type polymer material, and the energy line is irradiated with an exposure amount of 3 〇 () mj/cm 2 . In the case of hardening, the expansion ratio after immersion for i 〇 in 2 3 t: ethanol is in accordance with the following formula (1): swelling ratio (%) = [(film thickness after immersion - film thickness before immersion) / Film thickness before impregnation] X100S4.0 (1). 2. The resin sheet for a circuit board according to the first aspect of the invention, wherein the wiring layer forming layer is obtained from a resin sheet of an energy ray-curable polymer material, and is cured by irradiating an energy ray with an exposure amount of 300 mJ/cm 2 . The expansion ratio after immersion for 1 minute in a 2.38 mass% tetramethylammonium hydroxide aqueous solution of m conforms to the following formula (2): swelling ratio (%) = [(film thickness after immersion - film thickness before immersion) ) / film thickness before immersion] χ1〇〇€〇·6··· (2). 3. The resin sheet for a circuit board according to the first or second aspect of the invention, wherein the resin sheet for a circuit board is formed by a single layer wiring, and the energy ray-hardening polymer material in the resin sheet is The ratio of 10 to 50% by mass contains a (meth) acrylate-based copolymer, and the (meth) acrylate-based copolymer has 1 to 35% by mass of a hydroxyl group-containing monomer unit. 4. The resin sheet for a circuit board according to the second or second aspect of the invention, wherein the resin sheet for a circuit board is formed of a plurality of layers, and the wiring on the outermost surface of one side has a relationship conforming to the following formula (3) Forming layer: The film thickness of the wiring forming layer/the total film thickness of the resin sheet for a circuit board 20.5... -36-200939172, 5. The resin sheet for a circuit board according to the fourth aspect of the patent application, wherein the energy line in the wiring forming layer The hardening type polymer material contains a (meth) acrylate type copolymer in a proportion of 10 to 5 % by mass, and the (meth) propyl cation type copolymer has a basis group of 1 to 35% by mass. Monomeric unit. A sheet for a circuit board, which is characterized in that one side of a resin sheet for a circuit board according to any one of claims 1 to 5 is formed on a carrier. 7. A circuit board for a display, which is characterized in that a circuit chip is embedded in a surface of a resin sheet for a circuit board for a circuit board sheet of the application of the invention, and is irradiated with an energy ray to be cured. 8. The circuit board for a display of claim 7, which is formed by forming a circuit on the surface of the side of the circuit chip embedded in <y. 〇 -37-
TW98102704A 2008-01-31 2009-01-23 Resin sheet for circuit substrates, sheet for circuit substrates, and circuit substrate for displays TW200939172A (en)

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