TW200937082A - Light-emitting diode chip module and light source module - Google Patents

Abstract

A light-emitting diode (LED) chip module including a LED chip and a brightness enhancement film is provided. The LED chip has a light exit surface. The brightness enhancement film is disposed on the light exit surface, and has a first surface facing the LED chip and a second surface facing away from the LED chip. The brightness enhancement film has a plurality of polygonal pyramid portions located at the first surface and/or the second surface and arranged in a polygonal array. The LED chip module provides a more convergent light beam. An light source module using a brightness enhancement film is also provided.

Description

200937082 IX. Description of the Invention: [Technical Field] The present invention relates to a wafer module and a light source module, and in particular to a light-emitting diode chip module and a light source module using a brightness enhancement film group. [Prior Art] ugh Light-emitting diodes (LEDs) have advantages such as long life, small size, high shock resistance, low heat generation and low power consumption, and thus have been widely used in homes and various devices. Indicator or light source. In recent years, light-emitting diodes have developed toward multiple colors and high brightness, so their applications have expanded to large outdoor billboards, traffic signs, lights and related fields. In the future, light-emitting diodes may even become the main source of illumination for both power saving and environmental protection functions. 1 is a schematic cross-sectional view of a conventional surface mount device (SMD) luminescence > one-pole wafer module. Referring to FIG. 1, the surface-mount LED module 100 includes a light-emitting diode chip 110, a lead frame 120, a molding element 130, and a light-transmissive sealant ( Transparent encapsulant) 140. The LED wafer 110 is disposed on the lead frame 120. The molded member 130 encloses a portion of the lead frame 120 and has an opening 132 that exposes the light emitting diode wafer 110. A light-transmissive encapsulant 140 is filled in the opening 132 to protect the LED wafer 110. The LED chip 110 is adapted to emit a beam Π2, and the beam 112 penetrates the light-transmissive encapsulant 5 200937082 140 disposed in the opening 132 and propagates to the outside. In the conventional surface-adhesive LED chip assembly 100, since the width of the opening 132 is larger than the width of the LED wafer 110 to accommodate the LED wafer 11 , the beam 112 has a certain degree. The divergence angle. If the surface-adhesive LED chip module is to be used in a light source requiring good collimation, it is necessary to arrange a condensing lens on the surface-adhesive LED chip module. ® SUMMARY OF THE INVENTION The present invention provides a light emitting diode chip module that provides a relatively concentrated beam of light. The present invention provides a light source module that provides a light source of higher brightness. The invention provides a light emitting diode chip module comprising a light emitting diode chip and a brightness enhancement flm (BEF). The illuminating-polar body wafer has a light exiting surface. The brightness enhancing film is disposed on the illuminating surface and has a first surface facing the illuminating diode chip and a second surface facing away from the illuminating diode chip. The brightness enhancing film has a plurality of polygonal pyramids which are located on the first surface and/or the second surface and are arranged in a polygonal array. In an embodiment of the invention, the LED chip module further includes a fluorescent layer disposed on the brightness enhancement film. In addition, the light emitting diode chip module may further include a carrier and a light transmissive encapsulant. The light-emitting diode chip is disposed on the carrier, and the 6 200937082 light-transmissive sealant covers the light-emitting diode chip and the brightness enhancement film. , which includes one hair. Light Emitting Dipole ° Brightening Film Configuration The present invention further provides a light emitting diode chip module, a photodiode wafer, a phosphor layer, and the brightness enhancing film having a light emitting surface. The phosphor layer is disposed on the illuminating layer on the phosphor layer. The following is a list of two embodiments of the above two types of light-emitting diodes.

Inventive--In the embodiment, the LED chip module further comprises a crying T carrier: a crucible and a light transmissive encapsulant. The light emitting diode chip is disposed on the carrying port. The m is first encapsulated to cover the light-emitting diode wafer, the brightness enhancement film and the phosphor layer. In one embodiment of the present invention, these are: the apex angle of the pyramid is directed to the light-emitting diode crystal wi; The polygonal pyramids are located in the second front direction, and the first surface of the first surface light emitting diode wafer and the 'one of these are located on the first surface light emitting diode wafer, and the apex angles of the f angle tapers are directed away from the light emitting The apex angle of the polygon taper of the diode chip is further proposed by the present invention. A hair electrode r carrier, a light emitting diode chip, and a handle group include a 5 diode chip disposed on On the carrier, the film is brightened. The light-emitting sealer is coated with a light-emitting diode 曰 /, and has a younger light-emitting surface. The lens is transparent and has a second illuminating surface. Brightening 7 200937082 On the second illuminating surface, the second illuminating surface is located between the brightness enhancement film and the =1 surface. The brightness enhancing film has a first surface facing the light transmissive sealant facing the second surface of the light transmissive sealant and having a plurality of polygonal pyramids. Here, the horn pyramid is located on the second surface and/or the second surface and arranged in a polygonal array. In the embodiment of the invention, the first light-emitting surface and the second light-emitting surface face in the same direction. Only corner

In an embodiment of the invention, the LED chip module further includes a phosphor layer disposed on the first light emitting surface. The light-transmissive sealant further covers the phosphor layer, and the second light-emitting surface is located between the brightness enhancement film and the phosphor layer. In one embodiment of the invention, the polygonal pyramids are located on the first surface. The apex angles of the polygonal pyramids point toward the light-transmissive sealant, and the second surface faces. Hooks Ten In one embodiment of the invention, the polygonal pyramids are located on the second surface. The apex angle of these polygonal pyramids points away from the direction of the light-transmissive sealant, and the first surface is a flat surface. In one embodiment of the invention, the polygonal pyramids are located on the first surface and the second surface. The apex angle of the polygonal taper on the first surface points toward the light-transmissive sealant, and the apex angle of the polygonal taper on the second surface points away from the direction of the light-transmissive sealant. The invention further provides a light source module comprising at least one light emitting element, a light guiding unit and a brightness enhancing film. The illuminating element is adapted to emit a light beam. The light guiding unit is disposed on the transmission path of the light beam and has a light incident surface and a light emitting surface. The brightness enhancement film is disposed on the light incident surface. The light beam from the illuminating element will sequentially penetrate the brightness enhancing film and the light incident surface into the light guiding unit, and will be transmitted from the light emitting surface to the outside of the light guiding unit. In one embodiment of the invention, the brightness enhancing film has a first surface facing the light incident surface and a second surface facing away from the light incident surface. The brightness enhancing film has a plurality of polygonal pyramids which are located on the first surface and/or the second surface and are arranged in a polygonal array. The apex angles of the polygonal pyramids may be directed toward the light entrance surface or directed away from the light entrance surface. In one embodiment of the invention, the brightness enhancing film has a first surface facing the light incident surface and a second surface facing away from the light incident surface. The brightness enhancing film has a plurality of first strip-shaped protrusions on the first surface, the first strip-shaped protrusions are arranged along a first direction, and each of the first strip-shaped protrusions is along a first A direction extending substantially perpendicular to the second direction. The brightness enhancing film may further have a plurality of second strip-shaped protrusions on the second surface, the second strip-shaped protrusions are arranged along a third direction, and each of the second strip-shaped protrusions is along a Extending in a fourth direction that is substantially perpendicular to the third direction. The angle between the fourth direction and the second direction is greater than the twist. In one embodiment of the invention, the fourth direction is substantially perpendicular to the second direction. In one embodiment of the invention, the brightness enhancing film has a first surface facing the light incident surface and a second surface facing away from the light incident surface. The brightness enhancing film has a plurality of second strip-shaped protrusions on the second surface, the second strip-shaped protrusions are arranged along a third direction, and each of the second strip-shaped protrusions is along a first The three directions extend in a substantially vertical fourth direction. In the light-emitting diode chip module according to an embodiment of the present invention, the light emitted by the light source and the polar body wafer is first transmitted through the brightness enhancement film and then propagated to the outside, so that the light emitting diode chip module can Provide a more concentrated beam. In the light source module of the present invention, the light source module can provide a light source with higher brightness because the light-emitting element emits a lighter and then rides the light guide unit. The above described features and advantages of the invention will be apparent from the following description. [Embodiment] FIG. 2A is a cross-sectional view of a light-emitting diode chip module according to a first embodiment of the present invention, and FIG. 2B is a schematic cross-sectional view of the light-emitting diode chip of FIG. 2A. FIG. 2A is a bottom view of the brightness enhancement film of FIG. 2A with its first surface facing upwards and FIG. 2D is a lower view of the brightness enhancement film of FIG. 2A. Referring to FIG. 2A to FIG. 2D, the LED module 2A of the present embodiment includes a light emitting diode chip 210, a brightness enhancing film 250, and a phosphor layer 260. The light-emitting diode wafer 210 has a light-emitting surface 212. The brightness enhancement film is disposed on the light exit surface 212. The phosphor layer 260 is disposed on the bright film 25A. The light-emitting diode chip 21 is adapted to emit a light beam 2M. After the light beam is emitted from the light exit surface m, it passes through the brightness enhancement film 250 and the phosphor layer 26 in sequence. In this embodiment, the LED array 21 includes a first electrode 272a, a semiconductor substrate π disposed on the first electrode layer 272 & π, and a first semiconductor layer disposed on the semiconductor substrate 274. a, a second semiconductor layer 配置 disposed on the first semiconductor layer 276a, and a second electrode 272b disposed on the 10th 200937082 second semiconductor layer 276b. The second electrode 272b exposes a portion of the second semiconductor layer 276b, and the surface of the second semiconductor layer 276b facing away from the first semiconductor layer 276a is the light exit surface 212. The first semiconductor layer 276a and the second semiconductor layer 276b are, for example, a p-type semiconductor layer and an n-type semiconductor layer, respectively, or an N-type semiconductor layer and a P-type semiconductor layer, respectively. . The light beam 214 emitted by the p-n junction between the first semiconductor layer 276a and the second semiconductor layer 276b penetrates the second semiconductor layer 276b' and exits the LED substrate 210 via the light exit surface 212. It should be noted that the LED array 210 illustrated in FIG. 2B is a surface emitting type LED chip, and the structure thereof is only used for example and not to limit the present invention. In other embodiments not shown, the light-emitting monolithic wafer may be an edge emitting type light emitting diode chip and the brightness enhancing film is disposed on the light emitting surface of the side emitting light emitting diode chip. on. Alternatively, the light emitting diode chip may be a light emitting diode wafer of another structure. In the present embodiment, the brightness enhancing film 250 has a first surface 256 facing the LED array 210 and a second surface 258 facing away from the LED substrate 21A. Further, the 'brightening film 25' has a plurality of polygonal pyramid portions 251 which are located on the first surface 256 and are arranged in a polygonal array. The polygonal pyramid portion 251 is, for example, an N-corner taper portion, wherein Ng3. In the present embodiment, the outer corner taper portion 251 is, for example, a quadrangular pyramid portion, and these quadrangular pyramid portions are arranged in a quadrangular array. Moreover, in the present embodiment, the apex angle 259 of the polygonal pyramid portions 251 is directed to the LED array 210, that is, the polygonal pyramid portions 251 11 200937082 are convex toward the LED array 210. Additionally, the second surface 258 is, for example, planar. The polygonal tapered portion 251 is, for example, a positive N-corner taper, and each inner corner of the bottom surface of the opposing apex angle 259 is equal to 180 (N_2) / N degrees, where N23. In the present embodiment, N = 4, so each inner angle of the bottom surface is equal to 90 degrees. However, in other embodiments, the polygonal pyramid portion may also be an N-corner tapered portion whose sides are not completely equal. In the present embodiment, the phosphor layer 260 is a film layer doped with a fluorescent substance. The fluorescent material is, for example, Yttrium Aluminum Garnet (YAG) or other suitable fluorescent material. In the present embodiment, the light-emitting diode chip 210 can be disposed on a carrier 220 and electrically connected to the carrier 220. Specifically, the carrier 220 is, for example, a lead frame. However, in other embodiments, the carrier can also be a circuit board or other suitable carrier. In addition, in the embodiment, the LED package 200 further includes a light-transmissive seal 240 ′ to cover the LED wafer 210 and the brightness enhancement film 250. Further, a portion of the carrier 220 in the present embodiment may be selectively covered by a molding member 230. The molding member 230 has an opening 232 to expose the LED wafer 210, the brightness enhancing film 250, and the phosphor layer 260, and the light transmissive encapsulant 240 is filled in the opening 232. Further, the molded member 230 is made of, for example, a material that is opaque to light. In this embodiment, the LED chip assembly 200 has a brightness enhancement film 250' and the light beam 214 emitted by the LED chip 21 is passed through the brightness enhancement film 25, and the beam 214 is in a first direction dl. The divergence angle 0 丨 and the divergence angle (not shown) in the second direction d2 perpendicular to the first direction dl in 12 200937082 may be reduced by the refraction of the polygonal pyramid portion 251, so the light emitting diode chip module 200 can provide a relatively concentrated beam 214. In this way, the light flux density of the light beam 214 can be higher, and the light-emitting diode chip module 2 can also be applied to applications requiring a higher collimating light source. 3A is a cross-sectional view of a light-emitting diode chip module according to a second embodiment of the present invention, and FIG. 3B is a perspective view of the brightness enhancing film of FIG. 3A with its second surface facing upward. Referring to FIG. 3A and FIG. 3B, the LED array 200a of the present embodiment is similar to the above-described LED chip module 2 (see FIG. 2A). The difference between the two is as follows. In the light-emitting diode wafer module 200a, the first surface 256a of the brightness enhancing film 250a is, for example, a flat surface. Further, the polygonal pyramid portion 253 of the brightness enhancement film 250a is located on the second surface 258a. The outer corner taper 253 is, for example, an N-corner taper. The apex angle 259 of the polygonal tapered portion 253 is directed away from the direction of the light-emitting diode wafer 210, that is, the polygonal tapered portion 253 is convex toward the direction away from the light-emitting diode wafer 210. In the present embodiment, the polygonal tapered portion 253 is similar to the above-described polygonal tapered portion 251 (shown in Fig. 2C). However, in other embodiments, the polygonal taper on the second surface may also be similar to the other types of polygonal pyramids located on the first surface, and the difference between the first surface and the polygonal taper on the second surface. The top corners point to different directions. In the light-emitting diode chip module 200a, after the light beam 214a emitted by the light-emitting diode chip 13 200937082 210 passes through the brightness enhancement film 250, the divergence angle of the light beam 214a in the first direction d1 and the second direction d2 may be Since the polygonal tapered portion 253 is reduced in refraction, the light-emitting diode chip module 200a can provide a relatively concentrated light beam 214a. In this way, the light flux of the light beam 214a can be higher, and the light emitting diode chip module 2〇〇a can also be applied to a situation where a higher collimating light source is required. 4A is a cross-sectional view of a light emitting diode chip module according to a third embodiment of the present invention, and FIG. 4B is a perspective view of the brightness enhancing film of FIG. 4A. Referring to FIG. 4A and FIG. 4B, the LED array 2B of the present embodiment is similar to the LED chip module 2 (please refer to FIG. 2A), and the difference between the two is as follows. . In the light-emitting diode chip module 2〇〇b, the brightness enhancement film 25〇b has the above-described polygonal pyramid portions 251 (please refer to FIG. 2c to FIG. 4B at the same time) and the above-described polygonal pyramid portions 253 (please refer to FIG. SR at the same time). And the figure), wherein the polygonal pyramid portion 25 is located on the first surface 256b of the brightness enhancement film 25%, and the polygonal pyramid portion 253 is located in the second surface 258b of the brightness enhancement film 25A. In the light-emitting diode chip module 2B of the present embodiment, since the film 250b has both the polygonal taper portion 251 and the polygonal pyramid portion (5), the light beam emitted from the diode chip 21 is present. The luminous flux density and collimation of the beam 214b can be further enhanced by brightening the film. Poor Embodiment 14 200937082 FIG. 5 is a cross-sectional view showing a light emitting diode chip module according to a fourth embodiment of the present invention. Referring to FIG. 5, the LED module 2〇〇c of the embodiment is similar to the LED chip module 200 (please refer to FIG. 2A), and the difference between the two is that the brightness enhancement film 250 and the fluorescent film are combined. The relative arrangement positions of the layers 260 are different. In the light-emitting diode chip module 200c, the phosphor layer 260 is disposed on the light-emitting surface 212 of the light-emitting diode wafer 210, and the brightness enhancement film 250 is disposed on the phosphor layer 260. The advantages and effects of the LED chip module 2〇〇c are similar to those of the above-described LED chip module 2 (please refer to FIG. 2A), and will not be repeated here. It should be noted that the brightness enhancement film 250 in the LED chip module 2〇〇c can also be replaced by the brightness enhancement film 250a (please refer to FIG. 3B) or the brightness enhancement film 250b (please refer to FIG. 4B). The other two kinds of light-emitting one-pole wafer modules are formed. Fifth Embodiment FIG. 6 is a cross-sectional view showing a light emitting diode chip module according to a fifth embodiment of the present invention. Referring to Fig. 6, the difference between the LED array 200d of the present embodiment and the above-described LED array 200 (see Fig. 2A) is similar as follows. The light-emitting diode chip module 2 does not have the above-mentioned phosphor layer 260, and the light-transmissive sealant 240d covers the light-emitting diode chip '210 and the brightness enhancement film 250. In the present embodiment, the light-transmissive sealant 24〇d is doped with a camphorescent substance. However, in other embodiments, the light-transmissive sealant 240d may be replaced by a light-transmissive sealant that is not doped with a glory material. It is worth noting that the brightness of the light-emitting diode chip module 2〇〇d is 15

The film 250 may be replaced by the brightness enhancement film 25A (see Fig. 3B) or the brightness enhancement film 250b (see Fig. 4B) to form two other light emitting diode chip modules. Sixth Embodiment Fig. 7 is a cross-sectional view showing a light emitting diode chip module according to a sixth embodiment of the present invention. Referring to FIG. 7, the LED chip module 200e of the present embodiment is similar to the above-described LED chip module 2〇〇c (please refer to FIG. 5), and the difference between the two is as follows. In the light-emitting diode chip module 2〇〇e, the brightness enhancement film 250 is disposed outside the light-transmissive sealant 24〇e without being covered by it. Specifically, the light-transmissive encapsulant 240e covers the light-emitting diode chip 21 and the light-emitting layer 260, and has a light-emitting surface 242. The brightness enhancement film 25 is disposed on the light exit surface 242 of the solder paste 240e, wherein the light exit surface 242 is located between the contact layer 250 and the phosphor layer 260. In addition, the polygonal pyramid of the brightness enhancing film 250 is pointed at the apex angle 259 of the brightness enhancing film 250. ^ 251 In addition, the illuminating diode in the LED chip module 200e can also be replaced by the brightness enhancement film 25A (refer to FIG. 3A), and a light-emitting diode chip module The apex angle 259 of the brightness enhancement film 25A is directed away from the light-transmissive sealant 240e. g, the power, the lightening film 250 in the photodiode chip module 200e can also be replaced by > film 250b (please refer to FIG. 4B) to form another path to increase the redundancy and especially the second pole The wafer module 'in which the polygonal pyramid portion 251 of the brightness enhancement film 250b is TS & the angle 259 is directed to the light-transmissive encapsulant 240e, and the apex angle of the polygonal pyramid portion 253 is 259 _ ^ the direction of the transparent encapsulant 24〇e . Gastric Detachment 200937082 Seventh Embodiment FIG. 8 is a cross-sectional view showing a light emitting diode chip module according to a seventh embodiment of the present invention. Referring to FIG. 8, the LED chip module 200f of the present embodiment is similar to the LED chip module 200e (please refer to FIG. 7), and the difference between the two is as follows. The light-emitting diode chip module 200f does not have the above-described phosphor layer 260 (please refer to FIG. 7), and the light-transmitting sealant 240f covers the light-emitting diode chip 210. In the present embodiment, the light-transmissive encapsulant 240f is doped with a glory material. However, in other embodiments, the light-transmissive sealant 240f may be replaced by a light-transmissive sealant that is not doped with a camping material. In addition, the brightness enhancement film 250 in the 'light emitting diode chip module 200f may be replaced by the brightness enhancement film 250a (please refer to FIG. 3B) or the brightness enhancement film 25〇b (please refer to FIG. 4B) to form other Two kinds of light-emitting diode chip molds are shown in Fig. 9. Fig. 9 is a bottom view of the square film of the light-emitting diode chip module according to the eighth embodiment of the present invention. Referring to FIG. 9, the brightness enhancement film 250g of the LED chip module of the present embodiment is similar to the brightness enhancement film 250 (shown in FIG. 2D). The difference between the two is that the brightness enhancement film is 25 〇g. The pyramid portion 251g is a triangular tapered portion' and the polygonal tapered portion 251g is arranged in a triangular array. 10A is a perspective view showing a structure of a light source module according to a ninth embodiment of the present invention, and FIG. 10A is a perspective view of a brightness enhancement film in FIG. Referring to FIG. 10A and FIG. 10B, the light source module 300 of the present embodiment includes a light emitting element 310, a light guiding unit 320, and a brightness enhancing film 350. The light-emitting element 31 is adapted to emit a light beam 312. In the present embodiment, the light-emitting element 31 is, for example, a light-emitting diode or other suitable light-emitting element. The light guiding unit 320 is disposed on the transmission path of the light beam 312 and has a light incident surface 322 and a light emitting surface 324. In this embodiment, the light guiding unit 32 is, for example, a light guide, and the light incident surface 322 is an end surface of the light guiding column. In addition, the light guiding unit 32 can have a surface 326 opposite to the light emitting surface 324, and the light incident surface 322 is connected between the light emitting surface 324 and the surface 326. However, in other embodiments, the light guide can also be a light guide. The clam shell pancreas 35 ϋ is disposed on the light incident surface 322. The bundles 312 from the illuminating elements will sequentially penetrate the brightness enhancement film 350 and the light entrance 322 into the light guide 320, and be transmitted from the light exit surface 324 to the light guide unit 32, on the surface 326. Configurable with a reflective unit%

Light beam 312 is reflected to light exit surface 324 where a single magic reflection sheet or reflective film is reflected. In the present embodiment, the brightness enhancement film 35A has a second surface facing the intern-surface 356 and the back-facing light-emitting surface 322. = film 35. There may be a plurality of the first strips 351 located at the first surface 356. The first strip-like protrusions 351 are along a first direction; the convex portion and each of the - strip-like protrusions 351 are along a The first direction ^ 1 is perpendicular to the second direction d2 and extends. Specifically, the first is a triangular shape of the first strip-shaped convex portion 351, for example, a triangular shape and a tip 359 ′ and the tip end 359 t does not define the first strip-shaped convex portion. Smooth surface 322. However, in the present invention and the embodiment, the first strip-like projections are in the form of strips which are not given to the other in the case of other examples which are not green. The lifting section may also have a traverse of the strip-shaped projections, and the second surface 358 is, for example, a plane. Replace the above-mentioned tip willow. In this embodiment, the light beam 312 emitted by the light source module 3 of the light source module 3 is divergent angle Θ1 in the shape of the film 351, which is reduced by the first strip-like convex portion and the action. Therefore, the light beam 312 (4) emitted by the light-emitting surface 324 is added, so that it is worth noting that the light source module 3 is not limited to the number of the light-emitting elements 31. In other implementations, the light source mode, the φ can have a plurality of light-emitting elements, and the light-emitting elements can be disposed beside the light incident surface of the single turn. Further, the present invention does not limit the first direction to be perpendicular to the light exit surface 324, and does not define the second direction d2, which is parallel to the light exit surface. In other embodiments, the second direction d2 may be perpendicular to the light exit surface 32), and the first direction dl' may be parallel to the light exit surface 324. Alternatively, the first direction d! and the second direction d2 may be inclined with respect to the light exit surface 324. Fig. 11A is a perspective view showing the structure of a light source module according to a tenth embodiment of the present invention, and Fig. 11B is a perspective view showing a bright film of Fig. 11A. Referring to FIG. 19 Ο Ο 200937082 11Α and FIG. 11β, the difference between the light source module 300a of the present embodiment and the light source module 300 (the eye is similar to FIG. 1A) is as follows. In the light source module 300a, the first surface 356a of the brightness enhancement film 350a is a flat surface. Further, the brightness enhancement film 350a has a plurality of second strip-like projections 353 on the second surface 358a. In the present embodiment, the shape of the second strip-shaped convex portion 353 is the same as that of the first strip-shaped convex portion 351 (please refer to FIG. 1B), and the tip end of the triangular-shaped cross-section of the second strip-shaped convex portion 353 359 points away from the direction of the light incident surface 322. However, in other embodiments not shown, the second strip-like projections 53 may also be in the form of strips of other shapes. The second strip-like protrusions are arranged in a stone-second direction d3', and each of the second strip-shaped protrusions is in a normal-to-third direction d3, a substantially vertical fourth direction such as /port In the light source module 300a, after the light-emitting element 3 3 is moved through the brightness enhancement film, the beam is at the jth angle, and the angle is caused by the refraction of the second strip-shaped protrusion 353. The brightness of the light source that can be provided. Further, the k s is preceded by the 曰, and the present invention is not limited to the fourth direction * is vertical = in the embodiment, the third direction may be illusory with the first face and the fourth direction d4, parallel to the light exit face 324. Alternatively, the g-out surface 324' fourth direction (10) may be an oblique direction with respect to the light-emitting surface, and an embodiment of the light-receiving embodiment is shown in FIG. 12B for the structure of the light source module according to the eleventh embodiment of the present invention, and FIG. 12B For the selection in Figure 12A: 3: = ): 3: : ί The difference is as follows: the source of the daytime film has the above-mentioned first chrome Λ = 51 (please refer also to ® 1 〇Β and Figure 12 Β ) and the upper part, please also _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The first part: surface 358b. Further, the angle between the fourth direction d4, that is, the second strip-shaped convex portion, the extending direction, and the second direction d2, that is, the extending direction of the first strip-shaped convex portion 351 is larger than 0 degree. In the present embodiment, the fourth direction d4 and the second direction d2 are, for example, substantially perpendicular to each other. In the light source module 30〇b of the present embodiment, since the brightness enhancement film 35〇b has the first strip-shaped convex portion 351 and the second strip-shaped convex portion 4 353 having different extending directions, the light-emitting element 310 After the emitted light beam 312b passes through the increased 匕 film 350b, the divergence angle of the light beam 312b in the first direction dl' and the third direction d3 is reduced, so that the light source module 3 〇〇b can provide the light source The brightness is further improved. It should be noted that the present invention also does not limit the first direction dl, is perpendicular to the light exit surface 324' and does not define the second direction d2, is parallel to the light exit surface, and does not limit the third direction d3' is parallel to the light exit surface. The fourth direction d4 ′ is not limited to be perpendicular to the light exit surface 324 . In other embodiments, the second direction d2 may be perpendicular to the first direction dl of the light exit surface 324', parallel to the light exit surface 324. The third direction d3' is perpendicular to the light exit surface 324, and the fourth direction d4 is parallel to the output. 21 200937082 Smooth surface 324. Alternatively, the first direction di, the second direction d2, the third direction d3' and the fourth direction may be inclined with respect to the light exit surface 324. 12 is a schematic view of the structure of a light source module according to a twelfth embodiment of the present invention. Referring to FIG. 13, the light source module 3〇〇c of the embodiment is similar to the light source module 300 (shown in FIG. 2A), and the difference between the two is as follows. ❹ In the light source module 300c, the light incident surface 322c and the light exit surface 324c of the light guiding unit 320c face each other, and the plurality of light emitting elements 31 are disposed beside the light incident surface 322c. It should be noted that in other embodiments not shown, the brightness enhancement films 350, 35A, 350b of the light source modules 300, 300a to 300c can also use the brightness enhancement film of the first to eighth embodiments. Substituted, for example, by brightness enhancing films 250, 250a, 250b, 250g, wherein first surfaces 256, 256a, 256b face light entrance surfaces 322, 322c, and second surfaces 258, 258a, 258b face away from light entrance surfaces 322, 322c The apex angle 259 of the polygonal pyramid portion 251 is directed to the light incident surfaces 322, 322c' and the apex angle 259 of the polygonal pyramid portion 253 is directed away from the light incident surfaces 322, 322c. In summary, in one embodiment of the present invention, since the light beam emitted from the LED chip passes through the brightness enhancement film and then propagates to the outside, the LED chip module can provide a relatively concentrated luminous flux. A light beam with a higher density. In this way, the LED chip module can be applied to a situation where a relatively collimated light source is required. In addition, in the light source module according to an embodiment of the present invention, the light source emitted by the light source module passes through the brightness enhancement film before passing through the light guiding unit 22 200937082, so that the light source module provides a higher light level. . The invention has been described above in terms of a plurality of embodiments, which are intended to be illustrative of the present invention, and those of ordinary skill in the art, which are within the spirit and scope of the invention, may be modified. And, the door does not therefore have the scope of protection of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a conventional surface-adhesive light-emitting diode chip module. σ Figure 2 is a cross-sectional view of a light-emitting diode chip module according to a first embodiment of the present invention. ’ 'Figure.

Figure 2 is a detailed cross-sectional view of the light-emitting diode wafer of Figure 2A. Figure 2C is a bottom view of the brightness enhancing film of Figure 2 with its first surface facing upwards. Figure 2D is a bottom view of the brightness enhancing film of Figure 2 . 3 is a cross-sectional view showing a light emitting diode chip module according to a second embodiment of the present invention. Figure 3 is a perspective view of the brightness enhancing film of Figure 3 with its second surface facing up. 4 is a cross-sectional view showing a light emitting diode chip module according to a third embodiment of the present invention. '' 23 200937082 ❹ Figure 4B is a perspective view of the brightness enhancement film of Figure 4A. Fig. 5 is a schematic view showing the mold surface of a light-emitting diode wafer according to a fourth embodiment of the present invention. And FIG. 6 is a schematic view showing the surface of the light-emitting diode chip according to the fifth embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 7 is a schematic view showing the surface of a light-emitting diode wafer according to a sixth embodiment of the present invention. Fig. 8 is a schematic view showing the wafer surface of a light-emitting diode according to a seventh embodiment of the present invention. Figure 9 is a bottom view of a bright film of a light-emitting diode wafer according to an eighth embodiment of the present invention. 10A is a perspective view showing a structure of a light source module according to a ninth embodiment of the present invention, and FIG. 10B is a perspective view of a brightness enhancement film in FIG. 1A. FIG. 11A is a tenth embodiment of the present invention. Fig. 11B is a perspective view of the brightness enhancement film in Fig. 11B. 12A is a perspective view of a light source module according to an eleventh embodiment of the present invention, and FIG. 12B is a perspective view of the brightness enhancement film of FIG. Fig. 13 is a perspective view of a light source module according to a twelfth embodiment of the present invention. Q傅不图图 [Main component symbol description] 100: surface-adhesive LED chip module 110, 210, LED chip 112, 214, 2l4a, 214b, 312, 312a, 3l2b: light 24 200937082 120: lead frame 130, 230: molded member 132, 232: opening 140, 240, 240d, 240e, 240f: light transmissive seal 200, 200a, 200b, 200c, 200d, 200e, 200f: light emitting diode chip Modules 212, 324, 324c: light-emitting surfaces 220, 380: carrier Ό 250, 250a, 250b, 250g, 350, 350a, 350b: brightness enhancement film 251, 251g, 253: polygonal pyramid 256, 256a, 256b, 356 , 356a, 356b: first surface 258, 258a, 258b, 358, 358a, 358b: second surface 259: apex angle 260: phosphor layer 272a: first electrode 272b: second electrode © 274: semiconductor substrate 276a: First semiconductor layer 276b: second semiconductor layer 300, 300a, 300b, 300c: light source module 310: light-emitting elements 320, 320c: light-guiding unit 322, 322c: light-incident surface 326 · surface 25 200937082 330 : reflection unit 351 : first strip-shaped convex portion 353 : second strip-shaped convex portion 359 : tip end dl, dl': first direction d2 d2 ': second direction d3': a third direction d4 ': fourth direction 0 1, β Γ: divergence angle

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Claims (1)

200937082 X. Patent application scope: 1. A light-emitting diode chip module, comprising: a light-emitting diode chip having a light-emitting surface; and a brightness enhancement film disposed on the light-emitting surface and having a surface facing a first surface of the light emitting diode chip and a second surface facing away from the light emitting diode chip, and the brightness enhancing film has a plurality of polygonal pyramid portions, the polygonal pyramid portions are located on the first surface and/or the The second surface is arranged in a polygonal array. 2. The illuminating diode chip module of claim 1, wherein the polygonal pyramids are located on the first surface, and the apex angles of the polygonal pyramids are directed to the LED chip, and The second surface is a flat surface. 3. The illuminating diode chip module of claim 1, wherein the polygonal pyramids are located on the second surface, and the apex angles of the polygonal pyramids are directed away from the LED substrate. Direction, and the first surface is a plane. 4. The illuminating diode chip module of claim 1, wherein the polygonal pyramid is located on the first surface and the second surface, and the plurality of pyramids located on the first surface The apex angle is directed to the LED chip, and the apex angles of the polygonal pyramids on the second surface are directed away from the LED substrate. 5. The light emitting diode chip module of claim 1, further comprising a phosphor layer disposed on the brightness enhancing film. 6. The light emitting diode chip module of claim 5, further comprising: a carrier, wherein the light emitting diode chip is disposed on the carrier 27 200937082; and a light transmissive sealant And coating the light emitting diode chip, the brightness enhancing film and the fluorescent layer. The illuminating diode chip module of the first aspect of the invention further includes: a carrier, wherein the illuminating diode chip is disposed on the carrier and a light transmissive sealant, The light emitting diode chip and the brightness enhancing film are coated. 8. A light-emitting diode chip module, comprising: a light-emitting diode chip having a light-emitting surface; a phosphor layer disposed on the light-emitting surface; and a brightness enhancement film disposed on the phosphor layer And having a first surface facing the LED chip and a second surface facing away from the LED chip, and the brightness enhancing film has a plurality of polygonal pyramids, wherein the polygonal pyramids are located The first surface and/or the second surface are arranged in a polygonal array. 9. The light emitting diode chip mold set 10 according to claim 8, wherein the polygonal pyramid portions are located on the first surface, and the apex angles of the polygonal pyramid portions are directed to the light emitting diode chip. And the second surface is a flat surface. 10. The illuminating diode chip module of claim 8, wherein the polygonal pyramids are located on the second surface, and the apex angles of the polygonal pyramids are directed away from the LED substrate. Direction 'and the first surface is a plane. The illuminating diode chip module of claim 8, wherein the polygonal pyramid is located on the first surface and the second surface, 28 200937082, the plurality of pyramids located on the first surface The top corner of the portion is directed to the LED chip, and the apex angles of the plurality of pyramids on the second surface are directed away from the LED chip. 12. The illuminating diode chip module of claim 8, further comprising: a carrier, wherein the illuminating diode chip is disposed on the carrier; and ©-translucent encapsulant, The light emitting diode chip, the phosphor layer and the brightness enhancing film are coated. 13. A light-emitting diode chip module, comprising: a carrier; a light-emitting diode chip disposed on the carrier and having a first light-emitting surface; a light-transmissive sealant covering the light a diode chip having a second light-emitting surface; and a brightness enhancement film disposed on the second light-emitting surface, wherein the second light-emitting surface is located between the brightness-increasing film and the first light-emitting surface, The brightness enhancing film has a first surface facing the light transmissive sealant and a second surface facing away from the light transmissive sealant, and has a plurality of polygonal pyramid portions, the polygonal pyramid portions are located on the first surface and/or Or the second surface and arranged in a polygonal array. The light-emitting diode chip module of claim 13, wherein the polygonal pyramid portion is located on the first surface, the top corners of the polygonal pyramid portions are directed to the light-transmissive sealant, and The second surface is a flat surface. 15. The group of light emitting diode chip molds 29 200937082 according to claim 13, wherein the polygonal pyramid portions are located on the second surface, and the apex angles of the polygonal pyramid portions are directed away from the light transmissive sealant. The direction, and the first surface is a plane. The illuminating diode chip module of claim 13, wherein the polygonal pyramids are located on the first surface and the second surface, and the plurality of pyramids located on the first surface The top corner points to the light transmissive sealant, and the apex angles of the polygonal pyramids on the second surface point away from the light transmissive sealant. The light-emitting diode chip module of claim 13, wherein the first light-emitting surface and the second light-emitting surface face substantially in the same direction. The light-emitting diode chip module of claim 13 further comprising a phosphor layer disposed on the first light-emitting surface, wherein the light-transmissive sealant further covers the phosphor layer. And the second light emitting surface is located between the brightness enhancing film and the phosphor layer. 19. A light source module, comprising: at least one light emitting element adapted to emit a light beam; ❹ a light guiding unit disposed on the light transmission path of the light beam and having a light incident surface and a light exiting surface; and a brightening a light film disposed on the light incident surface, wherein the light beam from the light emitting element sequentially penetrates the brightness enhancing film and the light incident surface into the light guiding unit, and is transmitted from the light emitting surface to the light guiding surface Outside the unit. The light source module of claim 19, wherein the brightness enhancing film has a first surface facing the light incident surface and a second surface facing away from the light incident surface, and the brightness enhancing film The plurality of polygonal pyramids are located on the first surface and/or the second surface and arranged in a polygonal array. The light source module of claim 20, wherein the apex angles of the polygonal pyramids are directed toward the light incident surface or directed away from the light incident surface. The light source module of claim 19, wherein the brightness enhancing film has a first surface facing the light incident surface and a second surface facing away from the light incident surface, and the brightening The film has a plurality of first strip-shaped protrusions on the first surface, the first strip-shaped protrusions are arranged along a first direction, and each of the first strip-shaped protrusions is along a The first direction extends in a substantially vertical second direction. The light source module of claim 22, wherein the brightness enhancing film further has a plurality of second strip-shaped protrusions on the second surface, the second strip-shaped protrusions along Arranging in a third direction, and each of the second strip-like protrusions extends along a fourth direction substantially perpendicular to the third direction, the angle between the fourth direction and the second direction being greater than the twist. The light source module of claim 23, wherein the fourth direction is substantially perpendicular to the second direction. The light source module of claim 19, wherein the brightness enhancing film has a first surface facing the light incident surface and a second surface facing away from the light incident surface, and the brightness enhancing film Having a plurality of second strip-shaped protrusions on the second surface, the second strip-like protrusions are arranged along a third direction and each of the second strip-shaped protrusions is along The third direction extends in a substantially vertical fourth direction. 31