TW200936970A - Cooling apparatus - Google Patents

Abstract

Provided is a compact cooling apparatus without jeopardizing a desired cooling efficiency. A secondary cooling apparatus 70 includes a heat-exchanging section 60 condensing a gasified refrigerant flowing through a condensing path 47 to a liquefied refrigerant, and an evaporator EP disposed below the heat-exchanging section 60 and evaporating the liquefied refrigerant flowing through an evaporating pipe 52 to the gasified refrigerant. The secondary cooling apparatus 70 has a plurality of natural circulation circuits 72 which are independent from one another. In each of the natural circulation circuits 72, the liquefied refrigerant flows from the condensing path 47 of the heat-exchanging section 46 via a liquid piping 48 down to the evaporation pipe 52 of the evaporator EP, and the gasified refrigerant flows from the evaporating pipe 52 of the evaporator EP via a gas piping 50 to the condensing path 47 of the heat-exchanging section 46.

Description

200936970 • VI. Description of the invention: . [Technical field to which the invention belongs]. The tree side has a thoroughness. > [Previous technique] > Use a thermosiphon (thermosiphon) that produces natural convection of the refrigerant. The cooling device is adopted by the robbery equipment. As shown in Fig. 9, the cooling device of the known example has a condenser H) 2 of the first conventional refrigerant having a thermosiphon; U = Γ is condensed and becomes liquid 夂The condenser 102 is liquefied and cooled to be a vaporized refrigerant eliminator 1α4; and the liquefied refrigerant is discharged from the condenser 1〇2 through the liquid pipe 106 to the ejector 1〇4, and The natural circulation circuit (10) through which the vaporized refrigerant flows from the evaporator 1〇4^108 to the condenser 102 constitutes a refrigerant passage #102a disposed inside the condenser 1〇2 and the evaporator 1〇4. The refrigerant circulating in the middle is condensed or evaporated by heat exchange with other media such as outside air or water. That is, since the cooling efficiency of the cooling device depends on the heat exchanged between the refrigerant and the other medium, the cooling device of the first conventional example shown in FIG. 9 is connected to the condenser 102 and the evaporator. The meandering refrigerant path 102a, 1 〇 4a ' is set to 1 〇 4 to increase the contact area between the refrigerant paths i 〇 2a, 1 〇 4a and other media (hereinafter referred to as heat exchange area). In addition, as for the cooling device of the second conventional example shown in Fig. 1, there is also proposed a method in which two refrigerant paths are separated from one liquid distribution 320739 200936970, and two refrigerant paths ι_ are disposed in the steaming-stolen 104 In addition, the two refrigerant passages lQ4a and i〇4a are merged to form a gas piping 1G8 and connected to the condenser (10) (for example, JP-A-2005-283022). : In addition, as shown in Fig. 11, there is also a cooling device for the third conventional example of the condenser of the i-seat, and the third conventional device is proposed. A configuration in which a plurality of objects are cooled (for example, refer to Japanese Laid-Open Patent Publication No. 2004-60956). In the cold unit of the third conventional example, the liquid pipes 1〇6 connected to the condenser 1〇2 are branched into liquid branch pipes 1〇6a corresponding to the respective evaporators 104, and are liquefied via the liquid branch pipes 106a. The refrigerant is supplied to the refrigerant path i〇4a of the evaporator 1〇4, and the gas branch pipe i〇8a connected to the outflow end of the refrigerant path i〇4a of each evaporator 104 is merged with the gas pipe 108, and is merged with the gas pipe log. The vaporized refrigerant is again refluxed to the condenser 102. [Explanation] ❹ (Problems to be solved by the invention) However, in the cooling device of the first conventional example, if heat is set to ensure the desired cooling efficiency is obtained When the length of the piping required for the exchange area is increased, the refrigerant passages 102a to 104a are increased, the flow resistance of the refrigerants of the passages 102a and 10a is increased, and the refrigerant passages are made to be miniaturized in order to reduce the size of the increased refrigerant passages 102a and 104a. The bent portions of the crucibles 2a and 104a are increased, so that the flow resistance of the refrigerant is further increased. In the method of using a thermosiphon as shown in the cooling device of the first conventional example, since the temperature gradient between the condenser 1Q2 and the evaporator 104 is utilized, the natural convection of the refrigerant is generated, compared with In the way of pumping A to withdraw, mh ^ θ " medium forced circulation, the refrigerant's micro-lire loss or the suspicion of the refrigerant, '中二二盈盈: The medium 1 flows smoothly. In the refrigerant path 1〇2a, 1〇4a, 浐=1, 〇〇, and inside; if the air flows smoothly, the natural, hot and cold transport capacity including the evaporator 104 is caused by the refrigerant flowing back. ®!·!· There is a decrease in the rate of failure to efficiently cool the object. In the cooling device of the conventional example of the six-hearted blind, the refrigerant path l〇2a is used in order to prevent the cooling effect and to respond to the circulation amount of the refrigerant. L〇4a cuts the refrigerant (4) to reduce the friction, so it is necessary to make the === force loss also have a greater impact on the circulation of the refrigerant = Ί,,, * ' will constitute the refrigerant path l〇2a, l〇4a The piping shape is large: "There is a large restriction on the formation of the refrigerant path" and the size of the condenser 102 and the evaporator 1〇4 is increased, and the cost is increased. Further, in the cooling device according to the second conventional example, as the evaporator (10) ❹ Z is configured to make the refrigerant passages (4) 4a and _ divergent, the shaft can reduce the pressure loss by reducing the bent portion of the cold = path 104a, but it is difficult to make the pressure loss. The refrigerant is diverted to the different refrigerant paths _, 1 () 4a. Similarly, in the cooling device of the conventional example, even if a plurality of evaporators are arranged in parallel, it is difficult to cool the refrigerant path 〇4a of each evaporator, and the right amount of refrigerant is disposed on the refrigerant path. The 1(10)& cycle not only reduces the cooling efficiency in the refrigerant path 1〇4a where the refrigerant supply is small, but also has a large influence on the overall circulation balance of the natural circulation circuit, resulting in a decrease in the overall cooling efficiency. Therefore, in the cold unit of the third conventional example, the control valve 11 for opening and closing the line is interposed and inserted into the liquid branch pipe connected to the evaporator 104, and according to evaporation! The temperature of the refrigerant on the inlet side of the m〇4 and the temperature of the refrigerant on the outlet side of the evaporation of 104 are controlled by the control means C to open and close the respective control ports 110, thereby regulating the supply of the refrigerant to each evaporation H1 (M) However, in the cooling device of the third embodiment, it is necessary to provide the control valve 11 (), 帛 to measure the temperature of the refrigerant, and the control means ", such as the control means", so that the structure of the cooling device becomes In this way, in the cooling device using the hot siphon, the refrigerant path is inspected and reduced in order to reduce the flow resistance of the refrigerant in the refrigerant path hall and the in-process refrigerant. It is also difficult to ensure the equal circulation of the refrigerant between the refrigerant paths for the purpose of achieving the purpose, and to reduce the flow resistance of each of the refrigerants and the refrigerants by the refrigerant passages 102 & With the technically high difficulty. That is, the present invention is an invention proposed in the prior art cooling device and which is proposed to properly solve the problems, and an object of the present invention is to provide a In the natural circulation loop in which the thermosiphon is used to generate natural convection of the refrigerant, under the maintenance of the desired cooling efficiency, the flow resistance of the refrigerant, the amount of refrigerant filled in the circuit, and the sectional area of each path are not increased. The cooling device which reduces the cost and achieves miniaturization. (Effect of the Invention) The cooling device according to the present invention can maintain the desired cooling rate without causing the flow resistance of the refrigerant and the amount of refrigerant to be filled in the circuit. And the increase in the cross-sectional area of each path, and the cost reduction and miniaturization. [Embodiment] 6 320739 200936970 • So far, in the equipment with the refrigeration phase (four) material cooling device, the magic material to prevent global warming, The use of media is limited. Especially in the business of cold-blowing machines, etc. = large. Because of the large amount of fluorine reduction, (4) the reduction of the amount of processing or the requirement of non-chlorofluorocarbonation is extremely high. Therefore, The second loop type cold rolling circuit composed of the more favorable circuit is greatly affected. The j-loop cold nuclear system is a medium heat exchanger and will be cold. For the forced circulation, the county-reduced-secondary wheel and the money thermosiphon are used to make the refrigerant from the secondary side of the lining flow. The two sides are connected to each other, and other than the gas chlorine can be used. The heat medium is used as the cold cut road of the cold cut mf known in the middle cycle, compared with the mechanical compression type cold using the mouse chlorocarbon as the refrigerant; the east loop right 装置 device is large and large, and requires a large amount. Compared with the conventional equipment that uses oxycarbon carbon, the size and price are not: the impediment to non-fluorine gas carbonization. Therefore, '_^^ invented the species without damaging expectations. Under the cooling efficiency, the cooling device of the present invention having a miniaturization and a low cost is realized. For example, the cooling device of the present invention is applicable to the secondary loop type cold shower circuit, and can be equal in size and cost to the equipment using the chlorocarbon. Under the equipment, the equipment of the i-loop type cold (four) road, the above shortcomings shouted the city's competitiveness. That is to say, 'the second point of view to prevent global warming: f-channel refrigeration circuit to promote the popularization of non-chlorofluorocarbonization technology: a long time s 'the cooling device of the invention, with extremely effective technology Positioning. In this way, the cold-slipping device of the present invention can be used in the secondary loop type cold-loop circuit, and can be said to be extremely lacking in the past.

St Λ Dong Nai Road's large-scale and cost point, and the month b has become the invention of the general technical significance. Next, the preferred embodiment will be described with reference to the accompanying drawings to illustrate the cold-part device of the present invention. In the embodiment, a large-sized refrigerator which can be used for a business use such as a store, which can receive a large amount of vegetables or meat, and the like, and an application of the cooling device of the present invention to the secondary circuit will be described. The secondary loop type enthalpy cooling circuit is adopted as the cooling device of the refrigerator. [Embodiment 1] As shown in Fig. 1, a refrigerator 10 includes a casing 12 that is internally partitioned into a heat insulating structure of the storage chamber 14, and is disposed above the casing 12, and is provided by a metal flat plate 18 To form the casing 16 of the outer wall. The opening 12a of the casing 12 that is open to the side of the article and which is the inlet and outlet of the article is opened in communication with the storage chamber 14. The opening i2a is closed by the heat insulating door 22, and the heat insulating door 22 is not shown in the figure. The displayed hinge is supported in an openable and closable manner at the front of the box body 12. • The internal compartment of the front casing 16 is partitioned into a machine room 20'. Here, a part of the cooling device 31 for cooling the storage chamber 14 and a control power for controlling the cooling device 31 are disposed. Box (not shown). A platen 24 that is placed on the top plate 12b of the casing 12 and serves as a common substrate of the machine disposed in the machine room 20 is provided at the bottom of the machine room. The metal flat plate 18 forming the outer wall of the casing 16 is provided with an air circulation hole (not shown) communicating with the machine room 20 at an appropriate portion, and the ambient gas in the machine room 20 can be externally connected to the outside through the air circulation hole. Gas exchange. · 320739 8 200936970 The seven sides of the storage chamber 14 are coherent at regular intervals, and the cooling duct 26 is slid from the bottom of the top plate 12b of the casing 12 and through the casing 12. The gap 12c between the platen 24 on the 14 side of the plate 12b reaches the storage chamber and is separated into the cooling chamber 28 by the cooling guide zone. The cooling chamber 28 is provided with a suction port 26a on the front side of the cold air outlet 26b on the side and a blower fan 3a formed on the front side, and is connected to the outlet chamber 14. The air supplied to the suction port 26a is driven by the blower fan 30, and the cold air in the storage chamber can be blown out from the cold air to the cooling chamber 28', and the cooling chamber 28 port 12c is sent out to the storage chamber by the platen. 14. The missing chamber 28) of the top plate 12b is closed in a gastight manner with the machine room 2, and the storage chamber 14 (the cold space (refer to the second drawing) is separated by the platen 24 to become independent of each other. 70) as the secondary side circuit T, the secondary cooling device of the first embodiment (the cooling circuit is shown in Fig. 2, and the cooling circuit D is the schematic circuit diagram of the device 31. For example, the Tiss and n Tao's system are used twice. In the loop type cold-washing circuit, the two-way type cold heading circuit is a unit that performs heat exchange via the heat exchanger HE: a mechanical compression type primary cooling device that forcibly circulates the refrigerant (primary side interesting road) 34, and The secondary cooling device 7' formed by the thermosiphon which causes the natural convection of the refrigerant is connected (cascade) in a heat-transferable manner. The heat exchanger HE is disposed in the machine room 20' and has: The primary heat exchange unit 36 constituting the primary cooling device 34 and the other system different from the one heat exchange unit 36 constitute a secondary heat exchange unit (heat exchange unit) 46 of the secondary cooling unit 7〇. That is, 'on the primary cooling device 34 and the secondary cooling device 70, Do not form a refrigerant independent cycle back 320739 200936970 * Road, in the secondary cooling device 70 circulating secondary refrigerant (refrigerant), - the use of non-toxic, flammable and corrosive safety is higher In contrast, the primary refrigerant circulated in the primary cooling device 34 is a refrigerant or ammonia such as a butyl furnace such as a furnace or a saturated pressure, which is preferably a refrigerant, or the like. In the case of 1, the propane is used. That is, the cooling device 31 does not need to use chlorofluorocarbon as the refrigerant. The heat exchange = HE can be, for example, a flat plate type, a double pipe type, and the derivative type or the like. The apparatus 34 is a compressor CM for compressing a gas phase-sub-refrigerant, a condenser CD for liquefying the compressed primary refrigerant, a pressure expansion valve ev for lowering the pressure of the liquid phase-sub-refrigerant, and a liquid mixture by a refrigerant pipe 38. The secondary heat exchange unit 36 of the heat exchanger he is vaporized by the primary refrigerant is connected (refer to Fig. 2). The compressor (10) and the condenser (3) are commonly disposed in the platen 24 in the machine room 20 on The condenser fan FM for forcibly cooling the condenser (3) is also disposed opposite to the condenser (3) on the plate 24 in the human cold portion device 34, and is cooled by the compressor a. The sub-reduction of the county (3), the condenser CD, the Lai valve EV, the heat exchange unit % of the heat exchanger and the CM of the heat exchanger are forced to cycle, under the action of each machine, in one heat exchange ^6 The required cooling is carried out (refer to Fig. 2). The human cold part device 7G system includes a heat exchanger unit for heat exchange of a gas phase secondary refrigerant (gasification refrigerant). 46. The evaporator which vaporizes the liquid-phase secondary refrigerant (liquefied refrigerant), that is, the secondary heat exchanger EP corresponds to the relationship of -1 to 1 (refer to Fig. 2); The lanthanide system has a liquid distribution technology that connects the secondary heat exchange unit and the steam 320739 200936970. The Ep liquid distribution technology "circuit 72, which is provided with a natural circulation" body piping 48 and a liquid helium loop circuit 72 Under the action of gravity, via liquid

G: the device EP is slowly supplied by the gas secondary heat exchange unit 46 to the vaporization reflux to the second-deficient body L'50', so that the gas-phase secondary refrigerant is juxtaposed from the evaporator to form a portion 46° in the first embodiment. The secondary cooling device, the plurality of natural circulation interesting roads 79 (the illustrated example is three circuits), and the evaporator one after the first heat exchange unit 46 is disposed in the machine room 20, 28, and the scoop water is matched with The mode of the virtual cooling plate 24 located in the cooling chamber below the machine chamber 2 is further lowered than the secondary heat exchange portion 46, and the evaporator heat exchanger portion 46 is disposed, juxtaposedly A plurality of strips (in the actual number 47 chasing strip) are provided with a condensing path 47 (when special distinction is required, the symbol is added to the right, α, stone, Τ...). In addition, in the evaporator EP, a plurality of strips are arranged in parallel (three in the first embodiment, when a special distinction is required, ## in the symbol 5?殆丄叮你❹ β 7 B is added 、:, /3,> ..·) Evaporation tube (evaporation path) 52. In the drawing, the condensing path 47' is indicated by a straight path from the inflow end 47a connected to the gas pipe 50 to the outflow end 47b connected to the liquid pipe 48, and is connected from the inflow end connected to the liquid pipe 48. The linear path from the start of 52a to the outflow end 52b of the gas pipe 50 indicates the heat generating pipe 52', but the condensation path 47 and the evaporation pipe 52 may be meandered, or may be formed in a straight line shape. Here, in the secondary cooling device 70, a plurality of condensation path lights 47, a plurality of evaporation tubes 52, and a plurality of liquid pipes 48 (when special distinction is required) is added to the symbol 48 to add α, stone, γ... and plural The gas piping 5〇 (when special distinction is required, the symbol 5〇 is added to α 11 320739 200936970 is the same number / in each natural circulation loop, and the liquid piping 48 connects the upper end (starting end) to the secondary heat exchange portion 46 The outflow end 47b of the path is piped through the table top 24, and the lower end (terminal) on the side of the cooling chamber 28 is connected to the inflow end 52a of the evaporating tube 52 of the crucible. In each of the natural circulation circuits 7? i „the 'oxygen piping 50 is disposed below the cooling chamber 28 1 and ends through the first end of the evaporator tube 52 (4) of the evaporation tube 52, and is located on the side of the machine room 20 Upper end

Φ (,,,;; end) is connected to the inflow end 47a of the condensation path 47 of the Αα A1 咕7/Mota, and the change 46. Reference numeral 74 is a refrigerant injection port for setting a acre to + m X medium to each natural circulation circuit 72. In the secondary cooling device 7, a temperature ladder is formed between the primary heat exchange unit 46 and the evaporator Ep which are naturally exchanged by the heat exchange with the forced cooling-secondary heat exchange unit 36. The secondary refrigerant is subjected to natural convection in the secondary heat exchange unit 46, the liquid piping 48, and the evaporator f gas piping 50, and returns to the second: 埶22:46 to form a cycle of the refrigerant. In Fig. 2, the plurality of evaporations are in the upper-lower relationship 'but can be juxtaposed in the horizontal direction. Λ [Operation of the first embodiment] Next, the operation of the cooling device 31 including the secondary cooling device 7 of the first embodiment will be described. In the cooling device 31, once the cooling operation is started, the cycle of the cold 5 is started in the secondary cooling device 34 and the secondary cooling device 70, respectively. First, the primary cooling device 34 will be described. The compressor and the 'condenser fan FM' are driven to compress the gas phase primary refrigerant in the compressor CM, and the primary refrigerant is supplied to the condenser CD via the refrigerant pipe 38, and is solidified by A.器八320739 12 200936970 The forced cooling of the fan FM is carried out for the cold-headed refrigerant in the expansion means _ by _, and in the liquid phase once, 'change Qiu φ /AA, ;..., father for Sen HE's a son-in-law The heat-dissipation (heat absorption) is obtained by the under-heating (heat absorption) circulated in the secondary heat-crossing portion 46, and is rapidly expanded and vaporized. In this way, the two parts are in the heat exchange request #= - the two person heat exchange unit 46 performs forced cooling. Yu Yu once cooled the gas phase in 36, and the 仫壬 / person hot father changed the part Ο sr•, and the medium repeatedly repeated the forced circulation cycle of the refrigerant to the compressor CJI.

In the secondary cooling device 7, the secondary heat exchange unit & is cooled by the primary heat exchange unit 36, and therefore flows through the respective condensation paths 47 of the secondary heat exchange unit 46. In the process, the gas phase 'primary refrigerant will dissipate heat and condense', and the specific gravity increases due to the change from the gas phase to the liquid phase. Therefore, under the action of gravity, the liquid secondary refrigerant will follow the second: underheat exchange portion 46. Each of the condensation paths 47 flows down. In the secondary cooling device 7, the secondary heat exchange unit 46 is disposed in the machine room 20, and the evaporator EP is disposed in the cooling chamber 28 below the machine room 2〇, and in the secondary heat A drop is provided between the exchange portion 46 and the evaporator EP. In other words, in the respective circulation circuits 72, the liquid-phase secondary refrigerant flows naturally toward the evaporator Ep via the liquid piping 48 connected to the lower portion of the secondary heat exchange unit 46 by the action of gravity. In the process in which the liquid secondary refrigerating medium flows through the respective evaporation tubes 52 of the evaporator EP, heat is taken from the ambient gas of the evaporator Ep to evaporate and become a gas phase. The gas phase secondary refrigerant is refluxed from the evaporator EP to the secondary heat exchange portion 46 via the gas distributor 5'. In the secondary cooling palm 70, no power such as a pump or a motor is required, but in each natural circulation loop X 13 320739 200936970 • 72 Lieutenant; repeat the cycle of secondary cold_cycle. The empty material of the storage chamber U of 28 is cooled to the cooling chamber. The evaporator sand which is cooled with the evaporator Ei4=f can be used, whereby the cooling chamber 28 is cooled by the cold air. Thereafter, the storage compartment 14 is cooled by this, and the cold air is sent out to the storage compartment 14 for a period of time. 26a is returned to the circulation cycle in the cooling chamber 28. The secondary cooling device is not provided with the circuit 72, and the liquid pipe 48 is not accompanied by the road 72 which is independent of the road or the pipe. The gas piping is connected to the loop, so 52 n is due to the natural circulation loop 72 ^ alone = 47, so the condensation paths 47, 47 and the gas piping are independent of each other or the condensation path π., ' 〇 each other The inter- and non-uniform sentences exist, and it is possible to suppress the secondary refrigerant in the secondary refrigerant by two = 52; the path 47 and the evaporation tubes 52 are flown in addition, because the effect is in the second attack. And other factors, the change in the outside temperature of each of the 7Gs in the absence of production, the scavenging path 72 or the second medium may not exist, the ground exists in the condensation path 47. In the tube 52, in July, it is not possible == The ring scales 72 are formed separately from each other. 2, 47 and 2 tubes. Therefore, even if the condensing path produces a two-: unequal yield =: 320739 14 200936970 - the amount of the secondary refrigerant flowing through the condensing path 47 and the evaporation tube 52 is made uniform, so there is no need to set The adjustment means of the equalizing valve of the secondary refrigerant is adjusted to simplify the configuration of the secondary cooling device 70. Further, in the natural circulation circuit 72, since the secondary refrigerant can smoothly convect naturally, the cooling efficiency of the evaporator EP can be improved. By arranging the natural circulation circuit 72 corresponding to the number of heat exchange areas required in the heat exchange unit 46 and the evaporator EP to the secondary cooling device 70, the required condensation path 47 and the evaporation pipe 52 can be disposed. The heat exchange portion 46 and the evaporator EP ensure the heat exchange area required for the entire apparatus. In the secondary cooling device 70, a plurality of condensation paths 47 and evaporation tubes 52 can be disposed in each of the heat exchange units 46 and the evaporator EP. That is, the heat exchange area required for each of the condensation paths 47 and the evaporation tubes 52 can be reduced, and the lengths of the respective condensation paths 47 and the respective evaporation tubes 52 can be shortened. Thereby, in each of the condensation paths 47 and the respective evaporation tubes 52, the number of times of bending to achieve the required pipe length can be reduced, and the φ bending portion which becomes the flow resistance can be reduced, so that the condensation path can be reduced. 47 and the pressure loss of the secondary refrigerant flowing through the evaporation pipe 52. In addition, since the natural circulation circuit 72 does not need to diverge the liquid pipe 48, the gas pipe 50, the condensation path 47, and the evaporation pipe 52, it can be constituted by one refrigerant passage, and therefore, it is not caused by a branch portion such as a pipe. Pressure loss. Furthermore, in each of the natural circulation circuits 72, since the drop of the secondary refrigerant required for natural convection between the condensation path 47 and the evaporation tube 52 can be reduced, the requirement between the condensation path 47 and the evaporation tube 52 can be made. The drop is reduced, and the arrangement interval between the secondary heat exchange portion 46 and the evaporator EP is reduced, and the secondary cooling device 15 320739 200936970 is brought into shape. In addition, the loss of the fortune of the natural and female sub-refrigerant is small, so in the ^^72, the second is the liquid pipe 48 and the gas is matched to the thin pipe diameter medium in the loop_ring, shouting less loop overall ^2 (4) Secondary cooling, such as 1 can be produced, and the amount of refrigerant condensed on each condensing road. Degree or to the area, so that not only the length of the second evaporating tube 52 can be reduced, the miniaturization can be reduced, and the cyclic cold-replacement = or evaporation can be reduced to alleviate the pressure of the natural circulation circuit 72. It is possible to reduce the C of the expansion tank (not shown) by the capacity, etc., so that the entire secondary cooling device 7° is reduced to a small size, which is a cost. Further, by reducing the diameter of the liquid pipe 48, the gas distribution, and the use of 52, it is possible to reduce the required thickness of these pipes 48, 5, and 52 to ensure the withstand voltage performance. In other words, not only can the diameters of the respective pipes 4 and 2 be reduced, but also the synergistic effect between the pipes 48 and 5, and the number of the pipes can be reduced, and the piping can be further reduced in summer, and more cut costs. The effect of reducing the cost due to the narrowing of the piping such as the liquid piping 48, the gas piping 5, and the evaporation pipe 52 will be specifically described. For example, the thickness t of the pipe having the pressure resistance performance p is taken by the following formula. σ is the allowable stress of the material, and D is the outer diameter of the pipe. t=PD/2(cr+P) (1) The pipe weight M of the length L· is obtained by the following formula. c is the material: The specific gravity 'Di is the inner diameter of the pipe. M=7t LC(D2-Di2)/4 ······ (II) In addition, since it can be represented by Di=D—2t, if this is substituted into 320739 16 200936970 (π), the following formula can be derived. child. M=7rLC(Dt-t2) ...... (Ill)

If the formula (III) is substituted into (D formula, the following formula D Μ = (1 - Ρ / 2 (σ + Ρ)) Χ 7 ΓΐχΡΡ 2 / 2 (σ + Ρ) · · · · · (IV) can be derived. ❹ ❹ The formula (IV) indicates the weight of the pipe with the financial performance ρ. In the formula dv), if the conditions other than D are not changed, the conditions of π, L, C, ρ, σ can be regarded as constant. Therefore, the pipe weight (outer diameter D of the pipe) having the pressure resistance performance ρ can be expressed by the following formula. Μ={(ΐ-ρ/2(σ+Ρ))Χ7ΓΙΧΡ/2(σ+Ρ)}Χϋ2. · · · · · (ν) Since the {} in the above formula (V) is a constant as described above, The rabbit has the pressure resistance P outer diameter Dl of the pipe weight is the pressure resistance performance P of the outer diameter 〇 2 of the pipe weight leg. AD2^AD^^ Furthermore, the 'pipe weight MD! and the pipe weight · let l Expressed. f D^tb example is the following formula MD2 / MDi = D22 / D12 · ·. * · (vn the specific number into the above (VI) type but in the device 'the outer diameter of the evaporation tube is mostly set at = Ming ° in general If the cooling device of the first embodiment is the same as the condition: the same as this: use the evaporation tube with the outer diameter of 6.35. With these conditions, the following results can be obtained. Substituting the details (VI) MD.6.35/MD 9.52=(6. 35)V(9.52)2=:〇u In addition, in the cooling device of Example 1, the following results were obtained when the evaporation tube was used. The outer diameter of the field was 4.76 ηιιη 320739 17 200936970 MDiM 76/MD<49 52=(4. 76)7(9.52)2=0 25 That is, since the weight ratio of the pipe can be regarded as the material of the pipe, the secondary cooling device according to the embodiment 1 7〇, compared with the ratio, but the device can further reduce the diameter of the pipe, and the cooling device 31 can be greatly cooled. The heat exchanger HE is connected to the secondary cooling 34 and the secondary cooling device 70. In the heat exchanger HE, the primary refrigerant and the secondary cooling of the secondary 34; the secondary refrigerant of the $7 η and the farmer G are ordered by the evaporation and the cold rushing. Compared with the heat exchange only: the heat exchange is very high, but the heat transfer between the 34 and the secondary cooling device, and the secondary refrigerant are caused by the latent heat. The relatively small amount of Shishi Taizheng conveys more heat-cooling devices (4), and reduces the internal volume of -C 7〇 of a cooling device 34. Therefore, The secondary refrigerant secondary cooling device 7 (J lowering, and the miniaturization of the secondary cooling device 34 and the cooling device 31) of the cooling device 31 is reduced. The amount of refrigerant required for the above-mentioned cutting device 34 is small, and it is below the upper limit of the amount of refrigerant specified by laws and regulations, and the selection of the type of cold _ type of slanting medium 4 1. In addition, the m-coagulation $CD and the crusher CM are air-cooled, and the 'mechanical system is formed as an open space for the replaceable air. Thus, since the primary cold-storage unit 34 is disposed at the machine to zero, even the secondary refrigerant Unexpectedly leaking 18 320739 200936970 . Out, will not stay in the machine room 20. In addition, due to machinery The chamber 20 forms an airtight partition with the storage chamber 14 belonging to the closed space by the table. The leak-free secondary refrigerant does not flow into the storage chamber 14, and the ammonia from the articles contained in the storage chamber 14 is formed. Or a corrosive gas such as hydrogen sulfide does not flow into the 'mechanical to. And the cooling device 31 is constituted by the secondary loop type cold heading circuit of the primary cooling device 34 and the secondary cooling device 70, thereby selecting Female carbon dioxide is used as a secondary refrigerant. That is, in the secondary cooling device 70, the evaporator EP faces the storage chamber ι4 (cooling chamber 28), that is, the secondary refrigerant leaks into the storage chamber 14, and the safety to the user can be ensured. With respect to the primary squeezing device 34 and the secondary cooling device 70, the primary heat exchange portion 36 of the heat exchanger HE and the secondary heat exchange portion 46 are heat-transfer-connected, and the circulation paths of the refrigerant are independent of each other. When the cooling device 31 (compressor CM: stop) is stopped, in the primary cooling device 34, the high-temperature liquid phase primary refrigerant flows from the condenser CD to the primary heat exchange portion 36. Although the heat exchanger HE is heated up, since the secondary cooling device 10 70 is independent, the evaporator EP does not rise, and the temperature of the storage chamber 14 when the cooling device 31 is stopped is increased slowly. That is, the storage chamber 14 is cooled to a desired set temperature by the cooling device 31, whereby the time until the cooling device 31 is driven again can be extended after the device 31 is stopped. Therefore, the operation rate of the cooling device 3Γ is lowered to contribute to the reduction in power consumption. Thus, by applying the secondary cooling device 70 of the first embodiment to the cooling device 31' formed by the secondary loop type refrigeration circuit, it can be designed at the same size and cost as the conventional apparatus using the chlorofluorocarbon. The cooling device 320739 19 200936970-31 can eliminate the need for a large installation area and a cost increase due to the large size of the device as compared with the mechanical compression type of the refrigerant that is used as a refrigerant after the use of chlorofluorocarbon. And gain competitiveness in the market. In other words, the secondary cooling device 70 of the embodiment is extremely effective in terms of promoting the spread of non-chlorofluorocarbonization technology in a secondary loop refrigeration circuit that has been emphasized from the viewpoint of preventing global warming. Technical positioning. [Embodiment 2] Fig. 3 is a schematic circuit diagram showing a secondary cooling device (cooling device) 44 of the second embodiment as a cooling device for the secondary side interesting road. The cooling sigh 32 of the implementation Ή 2 is disposed in the refrigerator 10 说明 described in the embodiment, and the cooling device 32 of the second embodiment is a secondary ring type cold/east circuit as in the third embodiment. The second: the domain road type cold; the east circuit fine (four) heat exchanger one 仃 / hot father replacement method, the mechanical compression type human cold part device (primary side circuit) 34 which will force the refrigerant to circulate, and the generation of the refrigerant Natural convection: The secondary cooling device 44 formed by the siphon officer is connected in a heat transfer manner (cascade connection). The heat exchanger HE is disposed in the machine room 20, and includes: a primary heat exchange portion 36 of the permanent cooling device 34; and a system different from the heat exchange portion 36 of the first and second And constitutes a secondary heat exchange unit (heat exchange unit) 46 of the second cold unit 44. That is, the 'secondary refrigerant, which is circulated in the secondary cooling device 44, which is formed by the Dig' of the independent refrigerant inlet and the secondary cooling device 44', respectively, The high _ oxygen is not toxic, flammable and rot-resistant. Compared with rabbits, one of the cycles in the primary cooling device 34 is 20 320739 200936970 - secondary refrigerant, using evaporation heat or saturation pressure, etc. In the case of the refrigerant, HC-based refrigerant such as butane or propane, or ammonia, is preferred. In the second embodiment, propylene is used. That is, the cooling device 32 does not require the use of chlorofluorocarbon as a refrigerant. The heat exchanger HE may be, for example, a flat plate type, a double pipe type, and the like, or may be used. The primary cooling device 34 is a compressor CM that compresses the primary vapor-phase refrigerant by the refrigerant pipe 38, a condenser CD that liquefies the compressed primary refrigerant, an expansion valve EV that lowers the pressure of the liquid primary refrigerant, and ® The primary heat exchange unit 36' of the heat exchanger HE which is vaporized by the liquid phase primary refrigerant is connected (refer to Fig. 3). The compressor CM and the condenser CD are commonly disposed on the platen 24 in the machine room 20, and the condenser fan FM forcibly cooling the condenser CD is also disposed on the platen opposite to the condenser CD. 24 on. In the primary cooling device 34, the primary refrigerant is compressed by the primary heat exchange unit 36 of the compressor CM, the condenser CD, the expansion valve EV, the heat exchanger HE, and the compression φ by the compression of the primary refrigerant by the compressor CM. The order of the machine CM is forcedly cycled, and under the action of each machine, the required heat is cooled in the primary heat exchange unit 36 (refer to Fig. 3). The secondary cooling device 44 includes a secondary heat exchange unit 46 of a heat exchanger HE that liquefies a gas phase secondary refrigerant (vaporized refrigerant), and a liquid secondary refrigerant (liquefied refrigerant). The evaporator EP, the secondary heat exchange unit 46 and the evaporator EP correspond in a one-to-one relationship (refer to Fig. 3). Further, the secondary cooling device 44 includes a liquid pipe 48 and a gas pipe 50 that connect the secondary heat exchange unit 46 and the evaporator EP, and is provided with a natural circulation circuit 45 that is subjected to gravity by the action of gravity. Liquid 21 320739 200936970 • The body piping 48 supplies the liquid-phase secondary refrigerant from the secondary heat exchange unit to the apparatus EP, and flows the vapor-phase secondary refrigerant from the evaporation to the secondary heat exchange unit 46 via the gas piping 50. As described above, the secondary heat exchange unit is/returned to the machine room 20, and the evaporator EP is disposed in the cooling chamber 28 below the machine to the lower portion of the machine. The evaporator EP is disposed below the secondary heat changing portion 46. Reference numeral 74 is a refrigerant injection port provided by the parent to fill the natural circulation circuit 45. ^ The secondary cooling device 44 of the second example will be used. Since the natural circulation circuit 45 is a single ~ the refrigerant injection port 74 and the safety valve or the expansion tank (these are not shown in the figure, only one set is required. Sufficient. Equal to the above-described secondary hot-family changing portion 46, a plurality of (three in the example 2) condensation paths 47 are arranged in parallel (when special distinction is required, the number 47 is added to the α, /3. τ...) Further, in the evaporator EP, a plurality of strips are provided in parallel (three in the embodiment 2, and when special distinction is required, = α, β7 is added to the symbol 52). Evaporation tube (evaporation path) 52. In the drawings of Fig. 3, the condensation path 47 is indicated by a straight path from the inflow end 47 connected to the gas pipe 50 to the outflow end 47b connected to the liquid pipe 48, and is connected to the liquid pipe. The inflow end 52a of 48 starts to be connected to the outflow end 52b of the gas pipe 50 to indicate the evaporation pipe 52. However, the condensation path 47 and the evaporation pipe 52 may be meandered or formed in a straight line. In the secondary cooling device 44, a plurality of condensation paths 47, plural The evaporation tube 52 and the plurality of liquid pipes 48 (additional α, call, τ, etc. to the symbol 48) and a plurality of gas pipes 50 (when special distinction is required, the symbol is added, cold, ^) ···) 22 320739 200936970 • The same number. The liquid piping 48 is such that the upper end (starting end) is connected to the secondary heat exchange, the outflow end 47b of the condensing path C of the changing portion 46, and penetrates the Δ plate 24 tube, so that it is cooled. The lower end (terminal) of the chamber 28 is connected to the inflow end 52a of the evaporator 52 of the generator. The gas piping 50 is such that the lower end (starting end) of the cooling chamber 28 is connected to the outflow end of the evaporator of the evaporator EP. .52b, and through the platen 24, the pipe 'connects the upper end (terminal) of the machine chamber 2 to the inflow end 47a of the condensation path 47 of the secondary heat exchange portion 46. 前述 In the foregoing secondary cooling device 44, The liquid pipe 48 connected to the outflow end 47b of the condensation path 47 is connected to the evaporation pipe 52 to which the evaporation pipe 52 connected to the gas pipe 50 connected to the inflow end 47a of the condensation path 47 is different. In the secondary cooling device 44, The gas pipe 5〇 connected to the outflow end 52b of the evaporation pipe 52 is connected to the condensation path 47 connected to the liquid pipe 48 connected to the inflow end 52a of the evaporation pipe 52 as a different condensation path 47, and by A plurality of condensation paths 47, a plurality of evaporation tubes 52, a plurality of liquid piping 铛, and a plurality of enthalpy gas pipings 50 constitute a natural circulation circuit 45. In the secondary cooling device 44, A temperature gradient is formed between the secondary heat exchange unit 46 of the heat exchange unit of the heat exchange unit 36 of the forced cooling unit and the evaporator Ep, and the secondary refrigerant is in the secondary heat exchange unit 46 and the liquid piping 48. The evaporator EP and the gas piping 50 are naturally convected, and are returned to the secondary heat exchange unit 46 again to form a cycle of the refrigerant. In Fig. 3, a plurality of evaporation tubes 52 are in an upper-lower relationship, but may be juxtaposed in the direction. Regarding the natural circulation back to 320790 23 200936970 * Road 45 constructed in the aforementioned secondary cooling device 44, it will be explained in more detail with reference to FIG. In the secondary-cooling device 44 of the second embodiment, the secondary heat exchange unit 46 is provided with three condensation paths 47α, 470,000, and 47 r as the refrigerant path, and the evaporator EP is provided as the refrigerant path. Strip evaporation tubes 52 α, 52/3, 52 r. The beginning end of the first liquid pipe 48α is connected to the outflow end 47b of the first condensation path 47α, and the end of the first liquid pipe 48α is connected to the inflow end 52a of the first evaporation pipe 52α to allow the secondary liquefied refrigerant to pass through. The first liquid pipe 48α is supplied from the first condensation path 47α to the first evaporation pipe 52α. The beginning end of the first gas pipe 50α is connected to the outflow end 52b of the first ® evaporation pipe 52α, and the terminal end of the first gas pipe 50α is connected to the inflow end 47a of the second condensation path 47泠 to cause secondary gasification. The refrigerant is returned from the first evaporation pipe 52α to the second condensation path 47/3 via the first gas pipe 50α. The beginning end of the second liquid helium pipe 48 is connected to the outflow end 47b of the second condensation path 47, and the end of the second liquid pipe 48/3 is connected to the cold inflow end 52a of the second evaporation pipe 52 to make the second The liquefied refrigerant is supplied from the second condensation path 47 to the second evaporation pipe 52 via the second liquid pipe 48 φ /3. The beginning end of the second gas pipe 50/3 is connected to the outflow end 52b of the second evaporation pipe 52/3, and the cold end of the second gas pipe 50 is connected to the inflow end 47a of the third condensation path 47r so that The secondary vaporization refrigerant is sent back from the second evaporation pipe 52 to the third condensation path 47 r via the second gas pipe 50/3. The beginning end of the third liquid pipe 48r is connected to the outflow end 47b of the third condensation path 47r, and the end of the third liquid pipe 48? is connected to the inflow end 52a of the third evaporation pipe 52r to be secondarily liquefied. The refrigerant is supplied from the third condensation path 47 7 to the third evaporation tube 52 r via the third liquid pipe 48 r . The beginning end of the third gas pipe 50 7 is connected to the outflow end 52b of the third evaporation pipe 52 24 320739 200936970 - r , and the end of the third gas pipe 50 r is connected to the inflow end of the first condensation path 47 (2) 47a, the secondary vaporization refrigerant is returned from the third evaporation pipe 52r to the first condensation path 47α via the third gas pipe 50r, and the secondary refrigerant is circulated once in the natural circulation circuit 45. [Example 2 [Function] Next, the operation of the cooling device 32 including the secondary cooling device 44 of the second embodiment will be described. In the cooling device 32, once the cooling operation is started, the refrigerant is started in the primary cooling device 34 and the secondary cooling device 44, respectively. The circulation of the primary cooling device 34 is the same as that described in [Effect of the first embodiment], and therefore the description is omitted. In the secondary cooling device 44, the secondary heat exchange portion 46 is heated by one heat. Since the exchange unit 36 is cooled, the gas-phase secondary refrigerant dissipates heat and condenses during the flow in the respective condensation paths 47 of the secondary heat exchange unit 46. Since the specific gravity increases due to the change from the gas phase to the liquid phase, the specific gravity increases. In the work of gravity @用,液The secondary refrigerant flows down along the respective condensation paths 47 of the secondary heat exchange unit 46. In the secondary cooling device 44, the secondary heat exchange unit 46 is disposed in the machine room 20, and the evaporator EP is disposed at the position The cooling chamber 28 below the machine room 20 is provided with a drop between the secondary heat exchange portion 46 and the evaporator EP. That is, under the action of gravity, the liquid secondary refrigerant can be connected to the secondary heat exchange. The liquid pipe 48 at the lower portion of the portion 46 naturally flows down toward the evaporator EP. The liquid secondary refrigerant passes through the respective evaporation tubes 52 of the evaporator EP, and heat is taken from the ambient gas of the evaporator EP. Evaporation to become the gas phase. The gas-phase secondary refrigerant is recirculated to the secondary heat exchange via the gas 25 320739 200936970 with the g 50攸 evaporator, and the second set 44 does not need to use the power of the pump or the motor, but can: The cycle of the natural circulation of the secondary refrigerant is repeated. The early natural structure and the natural circulation of the secondary cooling device 44 connect the plurality of condensation paths 4 in different ways, and the path 47 is the same number. Evaporating tube 52, borrowed One and = condensed to circulate in a condensation road (four) and the force strip evaporation tube 52 and ^ ^ mutual ❹ = road two =; ^ tube 52 divergence, and can be in this, due to the natural evaporation of the tube 52. Since the A condensing path _ ^ is composed of one refrigerant path as a whole, between the 47 and 47 and the gas pipes 50 and 50 and the door 2 = between the road (4) and the evaporation pipe 52, the secondary cooling can be suppressed. = two sub-sequences can make the amount of the secondary refrigerant in each of the condensation paths 47 and the respective evaporation tubes 52 uniform. The flow φ in the H 52 is a variation of the outside air temperature acting on the secondary cooling device 44. The secondary refrigerant in the Central Jurassic ring may also be inconsistent from the second production 7 breaks the light 47 or the evaporation tube 52 _ either. However, since the road 45 is composed of one hot-cylinder pipette, the secondary refrigerant "is also said that the amount of the secondary refrigerant which is caused by each of the condensation paths 47 and the respective evaporation pipes is one." Therefore, in each of the condensation paths 47 and the respective vapors, it is less likely to cause unevenness of the secondary refrigerant, and even if there is a second-order hook, the adjustment force acts to cause the secondary refrigerant to flow through the condensation evaporation pipe 52. The amount of the secondary cooling device 44 is simplified by the adjustment means such as a valve for adjusting the equalization of the secondary refrigerant. Moreover, in the natural circulation loop, since the secondary refrigerant can smoothly convect naturally, the cooling efficiency of the evaporator enthalpy can be improved. Therefore, a plurality of condensation paths 47 and evaporation tubes 52 can be disposed in the heat exchange unit 46 and the evaporator, and the heat exchange area can be obtained without bending or diverging the condensation path 47 and the evaporation tube 52. In the secondary cooling device 44, a plurality of condensation paths 47 and evaporation tubes 52 may be disposed in each of the heat exchange portions 46 and the base unit. That is, the heat exchange area required for each of the condensation paths 47 and the evaporation tubes 52 can be reduced and the lengths of the respective condensation paths 47 and the evaporation tubes 52 can be shortened. Therefore, it is possible to reduce the number of times of the greening and the number of the windings required for the length of the pipe required for the nine-way's condensing path 47 and the evaporating tube 52, and to reduce the amount of the flow resistance. The pressure loss of the secondary refrigerant circulating in the condensation path 47 and the evaporation tube. In addition, since the natural circulation is repeated, the liquid piping 48, the gas piping 5, the condensation path 47, and the steaming 52 are not required to be separated by one refrigerant passage, so that the branch portion such as the & The pressure loss caused. In the natural circulation circuit 45, since the difference between the condensation path 47 and the evaporation tube 52 is naturally required: the drop of the undercooling medium can be reduced, so that the required drop between the condensation path 47 and the evaporation 52 can be reduced. On the other hand, the arrangement interval between the secondary heat exchange unit 46 and the upper and lower sides of the heat exchanger unit 46 is reduced, and the secondary cooling device 44 is reduced. Further, in the natural circulation circuit 45, since the pressure of the secondary refrigerant is small, the smaller the diameter of the pipe is selected as the liquid pipe 48 and the manifold pipe 50, the same amount of secondary refrigerant can be used in the circuit. Internal circulation, = 320739 27 200936970 The amount of secondary refrigerant filled in the whole of the small circuit. In this way, since the condensation path 47 and the degree or the cross-sectional area can be reduced, only the secondary heat exchange unit 46 or ^ can be miniaturized, and the amount of refrigerant in the loop can be reduced, thereby reducing the amount of refrigerant. In order to alleviate the pressure of the natural circulation circuit 45, the hoisting of the hoisting groove (not shown), and the like, the secondary cooling device 44 is miniaturized and reduced in cost. By thinning the piping such as the liquid piping n gas piping 蒸发 the evaporation pipe 52, the required thickness for the withstand voltage performance in these fn 52 can be reduced. In other words, not only can the pipes 48, 50, and 52 be thinned, but also the number of pipes 48 u = thickness can be reduced by the multiplication effect of the two phases, and the pipe weight can be further reduced and the cost can be further reduced. . Furthermore, even the cooling device 32' of the second embodiment can achieve the effect described on the 16th line of the 16th page to the 5th line of the second page. The secondary cooling cluster 44' of the second embodiment is formed by a single natural circulation loop 45, so that the refrigerant injection port 74 is only required to correspond to the number of the natural circulation circuits 45 or to prevent excessive pressure. Attached equipment such as a rising safety valve or expansion tank (not shown). That is, compared with the secondary cooling device 7 of the first embodiment, the configuration of the plurality of independent natural circulation circuits 72 is capable of maintaining the prevention of uneven flow of the secondary refrigerant or the piping (four) fine diameter scale. Advantages... The cost can be reduced by making the device smaller. Further, the secondary cooling unit 4 of the second embodiment performs the process or maintenance; the refrigerant is filled in, so that workability and maintainability can be improved. 320739 28 200936970 • The secondary cooling device of the foregoing embodiment 2 can also be modified as follows. In the modified example, the configuration of the second embodiment is adopted unless otherwise specified. (1) Fig. 4 is a schematic view showing a cooling device of Modification 1. The cooling device 6 of the first modification includes a plurality of (three-seat) secondary heat exchange units 46A, 46B, and 46C, and the same number (three blocks) of evaporation as the second heat exchange units 46A, 46B, and 46C. EP1, EP2, EP3. Further, one condensing path 47 is provided in each of the secondary heat exchange units 46A, 46B, and 46C, and one evaporator tube 52 is provided in each of the evaporators ε, ρ, EP2, and EP3. In the natural circulation circuit of the first modification, the liquid pipe 48 connected to the outflow end 47b of the condensation path is connected to the evaporation pipe 52 connected to the gas pipe 50 connected to the inflow end 47a of the condensation path 47. The evaporation pipe 52 is connected to the gas pipe 50 connected to the outflow end 52b of the evaporation pipe 52, and the condensation path 47 connected to the liquid pipe 48 connected to the inflow end 52a of the evaporation pipe 52 is a different condensation path 47. The whole structure is one loop. Here, in the cooling device 60 of the first modification, the vaporization refrigerant is returned from the evaporation pipe 52 of each of the crucible evaporators EP to the secondary heat exchange unit having the condensation path 47 that receives the supply of the liquefied refrigerant. The condensation path 47 of the heat exchange unit 46 is different from each other. Further, in the cooling device 60 of the first modification, the liquefaction refrigerant is supplied from the condensation path of each of the secondary heat exchange units 46 to be different from the evaporator Ep having the evaporation & 52 of the supply of the vaporized refrigerant. It is constituted by an evaporation tube of the evaporator Ep. The cooling device 60 according to the first modification has the same operational effects as those described in the second embodiment. Further, even if a plurality of secondary heat exchange units 46 and evaporators Ep are provided, the relationship between the two pairs of heat is also provided by the one-to-one relationship 320739 29 200936970 - the (four) pipe 48 and the gas-gas 5G are connected to the condensation path 47 and the respective liquid pipes 48 and The size of the gas pipe 5G is shortened with respect to the entire self-loop circuit, and the flow resistance of the refrigerant in each of the liquid pipe 48 and each gas pipe 5 is lowered, and the pressure loss can be reduced. Fig. 5 is a schematic view showing the cooling skirt of Modification 2. The cooling device 62 of the second embodiment has a second heat exchange unit, for example, and a plurality of (three) evaporators EP1, EP2, and EP3. Each of the ❹^, EP2, and EP3 is provided with one evaporation tube 52, and the secondary heat exchange 4 46 is provided with the same condensation path as the total number of evaporations f 52 . In the natural circulation circuit of the second modification, the still liquid pipe 48 connected to the condensation path is connected to the evaporation pipe 52 connected to the gas pipe 50 connected to the inflow end 47a of the condensation path pinch 47 as a different evaporation pipe. 52' and the gas pipe 5〇 connected to the outflow end 52b of the evaporation pipe 52, and the condensation path 47 connected to the liquid pipe 48 connected to the inflow end 52a of the evaporation pipe 52 is a different strip of the condensation path 47, and The total composition © is one loop. Here, in the cooling device 62 of the second modification, the liquefied refrigerant is supplied from the respective condensation paths 47 of the two underheat exchange units 46 to the evaporator EP having the evaporation tube 52 having the supply of the vaporized refrigerant. The evaporation tube 52 of the evaporator EP is different. The cooling device 62' according to the modification 2 has the same operational effects as those described in the second embodiment. Further, even if a plurality of evaporators EP are provided, the amount of the liquefied refrigerant supplied to the evaporator tubes 52 of the respective evaporators EP is uniform, so that each of the objects is uniformly cooled by the plurality of evaporators EP. The evaporation tube 30 320739 200936970 52 provided in the plurality of evaporators E P is not limited to a strip, and even if the plurality of strips are two or more as in the sixth embodiment, the number of cold portions differs. It is also possible to make the mother evaporator core (3) change the fourth example but the outline of the device 66. The cooling device 66 of the modified example 4 has: a plurality of blocks, a second block, a tree, a partial, a 46C; The evaporator is just. Further, in each of the second, second, and fourth sides, the change portions 46A, 46B, and 46C are respectively provided with i condensation paths, and the evaporator EP is provided with a condensation path 47-; The natural circulation loop of the modified example 4: the same as the (3) evaporation of the outflow end, the liquid piping is still 4δ=connected to the condensation road pinch 47, the inflow end 47&<> and the core is connected to the condensation path 47 The evaporation tube 52 to which the 侔 玄 ^ 连接 连接 为 为 为 = = = = = = = = = = = = = = = = = = 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 m is a different type of condensation path through the 66, which is obtained from Jiu Tze, and is cooled in the modified example 4, and is connected to the evaporation tube 52 which is connected to the liquid, and the vaporization refrigerant is recirculated 4 :=^, the condensation path-heating is constituted by the condensation path 47 of the modification 4: cold setting. The above-described effects and effects of the teachings 66 have the same effects as those of the multiple secondary flaws described in the second embodiment. Further, even if the unevenness of the refrigerant in the secondary heat exchange portions 46 in the condensation path 47 is set to be the same as the amount of the vaporized refrigerant, the cooling can be avoided. In the +HEP, the condensation path 320739 31 200936970 47 of each pair 4 to the other exchange unit 46 can be efficiently limited to one, even if the cooling device 68 of the modification 5 is as shown in FIG. The number of the strips in each of the secondary heat exchange units 46 may be different for two or more plural strips. (4) The cooling device of the second embodiment and the modified example is configured by one natural circulation circuit, but may be configured by a plurality of natural circulation circuits that are independent of each other. (i) The cooling device of the present invention can also be applied to a cooling device such as an air conditioner. (i i) The evaporator may be an evaporator of a type that forms a refrigerant path by partitioning the inside of the casing by a wall. (iii) The cooling device of the present invention can also be applied to cold, so-called storages such as Dongku, cold-camp, cold storage, display cabinets and pre-storage. (iv) Absorption or other refrigeration circuits may also be used as primary cooling devices for cooling equipment. Further, the cooling device of the present invention may be an air-cooling type in which the heat exchange portion is cooled by blowing air or the like by a fan. (v) The heat exchanger may constitute a primary heat exchange unit and a secondary heat exchange unit by different constituents, or may be other types of heat exchangers. (vi) In the embodiment, the expansion valve is used as a means for decompressing the liquefied refrigerant in the primary cooling device. However, the present invention is not limited thereto, and a capillary tube or other means may be employed. (vii) In the embodiment, the description will be made by using a cooling device of the present invention as an example of a secondary side of a cooling apparatus including a secondary loop type refrigerating circuit. As described above, since the disadvantage of the cooling device having the secondary loop type refrigerating circuit can be eliminated, the cooling device of the present invention is applied to the second 32 320739 200936970 secondary bad road type cold; Limited; very useful. However, the cooling of the monomer of the present invention as a (four) ^ in the two-cut type circuit loop, may also be used (vii i) in a plurality of 1 cooling devices, which can be cooled by one heat exchange unit; Each of the east circulation circuits is provided with a plurality of individual, 4 π 5 condensation paths in one heat exchange unit, and a vapor path corresponding to one cold bed of each evaporator is provided. Further, in the cooling device of the first embodiment, one evaporator can be provided for the plurality (four) exchange portion. That is, the evaporators of the factory are provided with Wei cold; each evaporation path of the east circulation loop, and a condensation path corresponding to the cold Laiwei road of each heat exchange section is provided. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side cross-sectional view of a refrigerator in which a secondary circuit of a cooling device is used as a cooling device of the present invention. Fig. 2 is a schematic circuit diagram showing a main part of a cooling device including a cooling device of the embodiment as a secondary circuit. ❷ Fig. 3 is a schematic circuit diagram showing a main part of a cooling device including the cooling device of the second embodiment as a secondary circuit. Fig. 4 is a schematic circuit diagram showing a cooling device of a modified example. Fig. 5 is a schematic circuit diagram showing a cooling device of Modification 2. Fig. 6 is a schematic circuit diagram of the cold material set in the third example. The f 7 diagram shows a schematic circuit diagram of the cooling device of Modification 4. Fig. 8 is a schematic circuit diagram showing the cooling device of Modification 5. Fig. 9 is a schematic circuit diagram showing the cold portion of the first conventional example. Fig. 10 is a schematic circuit diagram of a cooling device of a second conventional example. 320739 33 200936970 A schematic circuit diagram. ❹ 10 12a 12c 16 20 24 26a 28 31, 34 36 45, 46, refrigerator opening notch casing mechanical room platen suction port 12 12b 14 18 22 26 26b 30 box top storage room metal flat plate insulation door cooling duct air-conditioning Blowing outlet fan cooling chamber 32, 6〇, 62, 64, 66 Cooling equipment - secondary cooling money (~ material circuit) 38 refrigerant piping 72 heat exchange unit 100 natural commissioning ❹ circuit ❹ 46A, 46B, 46C 47α > 47^ ' 47r 47a, 52a Inflow end 48 α, 48 Cold, 48 7, 50 α '50/3 ' 50 Τ ' 52 α, 52/3, 52 r Secondary heat exchange unit (heat exchange unit) Condensation path 47b 52b outflow end 106 liquid pipe 108 gas pipe evaporation pipe (evaporation path) 70, 44 secondary cooling device (cooling device) 74 refrigerant injection port 102, CD condenser 102a, 104a refrigerant path 1〇4, EP, EP1, EP2 , EP3 evaporator 106a liquid branch pipe l〇8a gas branch pipe 34 320739 200936970 110 control valve C control means CM compressor EV expansion valve (expansion means) FM condenser fan HE heat exchanger Ο 35 320739

Claims (1)

200936970 . . VII. Patent application scope: .h _ kinds of cold section device 'has: gas that will flow in condensation road # (47), = 2 = heat exchange for liquefied refrigerant _); and . The evaporation path _ , . _ / ... is made into an evaporator (EP) for rolling the refrigerant; and " · condensing the liquefied refrigerant from the heat exchange portion (46); ό (6) through the liquid pipe (10) to the evaporator ( The evaporation path (10) of Ep) flows down, and the vaporization refrigerant is obtained from the evaporation path of the evaporator (Ep). (10) The gas pipe (10) is passed to the condensation circuit (10) (10) of the heat exchange unit (10) through a natural circulation circuit (72), and the characteristics of the cooling device are 2. There are a plurality of natural circulation loops (72) that are independent of each other. 〇 A cooling device, which is a gasification refrigerant that will be circulated in the (6) towel to be cooled into a liquefied cold heat exchange unit (10); And an evaporator (10) which is disposed below the heat exchange unit (10) and which is a liquefied refrigerant in the limb path (10) and which becomes a vaporized refrigerant; and a liquefied refrigerant from the heat exchange unit (10) Condensation path (47), & steaming from liquid helium tube (48) to evaporator (four) The path (10)) flows down, and the vaporization refrigerant passes from the evaporation path (52) of the evaporator (4) to the condensation path of the heat exchange unit (46) via the gas distribution s (5G) (the natural circulation circuit (45) is still flowing, but the material is still flowing. The device is characterized in that: the natural circulation circuit (45) is provided with: a plurality of evaporation path names = and the same number of enthalpies as the plurality of evaporation paths (10) will be connected to the outflow end (47b) of the condensation path (47) Liquid selection 320739 36 200936970 The piping (48) is connected to an evaporation path (52) which is different from the evaporation path (52) connected to the gas piping (50) of the inflow end (47a) of the condensation path (4). And connecting the gas pipe (10) connected to the evaporation path (10) to the liquid pipe (10) connected to the liquid pipe (10) connected to the inflow end (52a) of the evaporation path (52) as "the condensation path" 47) Different condensation paths (47), and the whole is a self-loop circuit (45:) 〇〇 3. As claimed in the patent scope! Or a cooling device of the above, wherein the 1-4 or the plurality of heat exchange portions (10) are provided with W or a plurality of evaporators. 4. The cooling device according to any one of claims 4 to 3, \The hot way is connected to the mechanically compacted primary circuit (34) that forced the refrigerant to circulate. b ❹ 320739 37