TW200931553A - Image-capturing device of the optical detection equipment for cleaving wafer - Google Patents

Image-capturing device of the optical detection equipment for cleaving wafer Download PDF

Info

Publication number
TW200931553A
TW200931553A TW97101097A TW97101097A TW200931553A TW 200931553 A TW200931553 A TW 200931553A TW 97101097 A TW97101097 A TW 97101097A TW 97101097 A TW97101097 A TW 97101097A TW 200931553 A TW200931553 A TW 200931553A
Authority
TW
Taiwan
Prior art keywords
wafer
image
image capturing
component
capturing device
Prior art date
Application number
TW97101097A
Other languages
English (en)
Chinese (zh)
Other versions
TWI353032B (es
Inventor
hong-ming Zhang
jun-li Zhang
Sheng-Xiong Yang
Original Assignee
Horng Terng Automation Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Horng Terng Automation Co Ltd filed Critical Horng Terng Automation Co Ltd
Priority to TW97101097A priority Critical patent/TW200931553A/zh
Publication of TW200931553A publication Critical patent/TW200931553A/zh
Application granted granted Critical
Publication of TWI353032B publication Critical patent/TWI353032B/zh

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW97101097A 2008-01-11 2008-01-11 Image-capturing device of the optical detection equipment for cleaving wafer TW200931553A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97101097A TW200931553A (en) 2008-01-11 2008-01-11 Image-capturing device of the optical detection equipment for cleaving wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97101097A TW200931553A (en) 2008-01-11 2008-01-11 Image-capturing device of the optical detection equipment for cleaving wafer

Publications (2)

Publication Number Publication Date
TW200931553A true TW200931553A (en) 2009-07-16
TWI353032B TWI353032B (es) 2011-11-21

Family

ID=44865335

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97101097A TW200931553A (en) 2008-01-11 2008-01-11 Image-capturing device of the optical detection equipment for cleaving wafer

Country Status (1)

Country Link
TW (1) TW200931553A (es)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447829B (es) * 2011-10-12 2014-08-01
TWI498990B (zh) * 2012-12-19 2015-09-01 Genesis Photonics Inc 劈裂裝置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447829B (es) * 2011-10-12 2014-08-01
TWI498990B (zh) * 2012-12-19 2015-09-01 Genesis Photonics Inc 劈裂裝置

Also Published As

Publication number Publication date
TWI353032B (es) 2011-11-21

Similar Documents

Publication Publication Date Title
JP4468696B2 (ja) 半導体ウエハ検査装置
TW522447B (en) Method and apparatus for embedded substrate and system status monitoring
US20130044316A1 (en) Device and method for inspecting moving semicondutor wafers
EP1636572B1 (en) Systems for inspection of patterned or unpatterned wafers and other specimen
TW511214B (en) Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques
WO2007141857A1 (ja) 外観検査装置
US20090097737A1 (en) Visual inspection apparatus
US20090196489A1 (en) High resolution edge inspection
JPWO2006118152A1 (ja) 外観検査装置及び外観検査方法並びに外観検査装置に装着可能な周縁部検査ユニット
US20090011525A1 (en) Method for joining adhesive tape to semiconductor wafer and method for separating protective tape from semiconductor wafer
WO2006059647A1 (ja) 表面検査装置及び表面検査方法
JP2001082926A (ja) 焦点位置制御機構及び方法、並びに、半導体ウェハの検査装置及び方法
JP2007155448A (ja) 端面検査装置
JP2008064595A (ja) 基板検査装置
KR20110010749A (ko) 관찰 장치 및 관찰 방법
JP2004170495A (ja) 表示用基板の検査方法及び装置
JP2008032433A (ja) 基板検査装置
JP2019027915A (ja) 検査方法及び検査装置
CN111654242B (zh) 检测太阳能晶片上的豁口的方法和系统
KR101402123B1 (ko) 웨이퍼 정렬장치
TW200931553A (en) Image-capturing device of the optical detection equipment for cleaving wafer
JP2007333672A (ja) 外観検査装置および外観検査方法
JP6101481B2 (ja) 積層構造を有するワークの内部検査装置
JP5458345B2 (ja) 欠陥検査方法
JP2000046747A (ja) 液晶基板の外観検査方法および装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees