TW200930966A - Substrate heat-treating furnace - Google Patents

Substrate heat-treating furnace Download PDF

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Publication number
TW200930966A
TW200930966A TW097134916A TW97134916A TW200930966A TW 200930966 A TW200930966 A TW 200930966A TW 097134916 A TW097134916 A TW 097134916A TW 97134916 A TW97134916 A TW 97134916A TW 200930966 A TW200930966 A TW 200930966A
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TW
Taiwan
Prior art keywords
hot air
heat treatment
filter
furnace
substrate heat
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TW097134916A
Other languages
Chinese (zh)
Inventor
Tadahiro Ohmi
Yusuke Muraoka
Yasuyoshi Miyaji
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Univ Tohoku
Future Vision Inc
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Application filed by Univ Tohoku, Future Vision Inc filed Critical Univ Tohoku
Publication of TW200930966A publication Critical patent/TW200930966A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Furnace Details (AREA)

Abstract

The invention relates to a substrate treating furnace which can efficiently discompose organic matter contained in discharged hot wind by heating treatment. A glass substrate (W) is subject to heating treatment by blowing hot wind into the internal of a main body (10) of the furnace. The hot wind discharged from the main body (10) of the furnace returns to the main body (10) of the furnace again through a circulating path (20). Part of the hot wind is discharged to an exhaust pipe (23) in the midway of the circulating path. A catalyst filter portion (71) is provided by carrying catalyst on a metal filter disposed on the exhaust pipe (23). Thereby, contact efficiency between the hot wind and the catalyst becomes higher and decomposition efficiency of organic mater is enhanced. In addition, organic particles are captured and decomposition efficiency of organic matter is totally increased.

Description

200930966 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種基板熱處理爐,其對液晶顯示裝置用 玻璃基板、PDP(Plasma Display Panne卜電漿顯示面板)用 玻璃基板或半導體晶圓等之薄板狀電子零件用基板(以下 僅稱為「基板」)進行加熱處理。 【先前技術】 彩色濾光片之製程之一係對玻璃基板進行燒成之步驟, 該玻璃基板上以喷墨之方式而附著有彩色油墨。於已升溫 至特定燒成溫度之燒成爐中,在大氣環境下將玻璃基板保 持特定時間,藉此進行上述燒成步驟。又,當於玻璃基板 上形成金屬配線時,於同樣之燒成爐中’在氮氣等之惰性 氣體環境下對玻璃基板進行燒成。於任一個燒成處理步驟 中玻璃基板上之彩色油墨等之被燒成物所含之有機溶劑 會揮發或氧化·熱分解’藉此,大量之有機物會產生並擴 散至環境中。 因此,於燒成處理中,不斷地將潔淨之熱風送入至燒成 爐中’並且亦持續地進行排氣,以使有機物不會殘留於燒 成爐中由於無法將自燒成爐排出之含有大量有機物之氣 體直接釋放至外氣中,故而藉由洗氣器等而進行捕集所排 出之氣體中之有機物之處理。 另方面,自節省能源之方面考慮’亦已嘗試於自燒成 爐排出之熱風與重新供給至燒成爐之氣體之間進行熱交 換°亦即’當利用洗氣器對來自燒成爐之排氣進行處理 134338.doc 200930966 時,所損耗之熱能非常多,能效較差,因此,嘗試將所排 出之氣體與重新供給之氣體導入至熱交換器,藉由於該等 耽體之間進行熱交換,而回收自燒成爐排出之熱量。 若將自燒成爐排出之氣體直接導入至熱交換器,則有機 物會附著於熱交換器内之構造物而產生堵塞,因此必需對 排出氣體進行觸媒處理,在分解有機物之後,將其導入至 熱父換器。關於在對自爐排出之排氣進行觸媒處理之後將 ❹ 其導入至熱父換器之技術,例如已揭示於專利文獻1中。 [專利文獻1 ]曰本專利特開2〇〇 1 _ 201271號公報 【發明内容】 [發明所欲解決之問題] 然而先前,為了減小排氣管路中之風阻,將觸媒形成為 格子狀之板狀構件,排出氣體與觸媒之接觸效率降低,從 而使刀解效率降低。尤其,極難以分解以粒子狀態經過之 有機物、或昇華物固形化後形成之物質。又,排氣之溫度 ❹ ⑨低亦會使分解效率降低。因此最終,總體之有機物之: 解效率降低。 因此’即便對自玻璃基板之燒成爐排出之氣體進行觸媒 處理,亦無法充分除去有機物,其結果為於較短時間内, 附著物會堵塞熱交換器,最終無法進行常時間之連續運 轉,因此裝置運轉率變低,經濟性不佳。 本發明❹於上述問題開發而成者,其目的在於:提供 能夠高效率地分解藉由加熱處理而排出之熱風中所含之有 機物的基板熱處理爐。 134338.doc 200930966 [解決問題之技術手段] 為了解決上述問題,請求項1之發明之特徵在於:其係 對基板進行加熱處理之基板熱處理爐,且包含:爐體本體 部,其將基板收容於内部;導出部,將自上述爐體本體部 , 排出之熱風之至少一部分導出至溫度低於上述熱風之部 分;以及過濾器,其設置於上述導出部,且承載有觸媒, 藉由上述過濾器而將導出至上述導出部之上述熱風所含之 有機物加以分解。 又’如請求項1之發明之基板熱處理爐,請求項2之發明 之特徵在於:上述過濾器為金屬過濾器,且附帶設置有對 上述過濾器及導入至上述過濾器之熱風之至少一方進行加 熱之加熱機構。 又,如請求項2之發明之基板熱處理爐,請求項3之發明 之特徵在於:上述加熱機構將上述過濾器以及導入至上述 過渡器之熱風之至少一方加熱至2〇〇〇c至4〇(rc。 ❹ 又,如請求項1之發明之基板熱處理爐,請求項4之發明 之特徵在於其包含包圍至少上述爐體木體部之框體,且於 該框體外設置有上述過濾器。 、 又,如請求項1之發明之基板熱處理爐,請求項5之發明 之特徵在於其包含包圍至少上述爐體本體部以及上述過濾 器之框體。 / ' 又,如請求項1之發明之基板熱處理爐,請求項6之發明 之特徵在於:上述觸媒包含光觸媒。 又,如請求項6之發明之基板熱處理爐,請求項?之發明 ,34338.doc 200930966 之特徵在於:上述光觸媒包含鈦氧化物。 之二之發明之基板熱處理爐’請求項8之發明 機=徵在於步包切錢射至上述域叙光照射 又,如請求項1之發明之基板熱處理爐,請求項9之 之特徵在於:上述觸媒包含鉑。 ❹ ❹ 又’如請求項!至請求項9中任一項發明之基板熱處理 爐’請求項10之發明之特徵在於其包含:循環特,其使 自上述爐體本體部排出之熱風循環,並再度供給至上述爐 體本體部;循環風扇’其設置於上述循環路徑,並使熱風 循環;爐體用加熱機構,其設置於上述循環路徑,並對熱 風進行加熱;以及主過濾器部,其設置於上述循環路徑, 並供熱風通過,且上述導出部自上述循環路徑分支。 又,如請求項10之發明之基板熱處理爐,請求項u之發 明之特徵在於其包含:兩個吸附塔,其並排地設置於上述 循環路徑之途中,並吸附二氧化碳及/或水分;切換機 構,擇一性地對熱風之流路進行切換,以使熱風通過上述 兩個吸附塔中之任一方;以及切換控制機構,其對上述切 換機構進行控制’以使熱風交替地通過上述兩個吸附塔。 又’如印求項10之發明之基板熱處理爐’請求項12之發 明之特徵在於:將上述主過濾器部之熱風出口連接於上述 爐體本體部之熱風供給口。 又’如請求項10之發明之基板熱處理爐,請求項13之發 明之特徵在於:其更進一步包含將已加熱之外氣供給至上 134338.doc -10- 200930966 述循環路徑之外氣供給機構。 又’如請求項10之發明之基板熱處理爐,請求項14之發 之特徵在於:將熱風之1G至15%自上述循環路徑引導至 :述導出部’將該熱風之剩餘部分引導至上述爐體本體 又,如請求項10之發明之基板熱處理爐,請求項15之發 Γ之特徵在於:上述基板具有被燒成媒,於上述爐體本體 邛之内部進行該被燒成臈之燒成。 又,如請求項15之發明之基板熱處理爐,請求項16之發 明之特徵在於··上述被燒成膜為抗㈣塗層膜、有機物塗 層膜或噴墨塗佈膜。 [發明之效果]200930966 IX. The invention relates to a substrate heat treatment furnace for a glass substrate for a liquid crystal display device, a glass substrate for a PDP (Plasma Display Panne Display Panel), a semiconductor wafer, or the like. The thin plate-shaped electronic component substrate (hereinafter simply referred to as "substrate") is subjected to heat treatment. [Prior Art] One of the processes of the color filter is a step of firing a glass substrate on which a color ink is attached by inkjet. The firing step is carried out by holding the glass substrate for a predetermined period of time in an atmosphere in a firing furnace which has been heated to a specific firing temperature. Further, when a metal wiring is formed on a glass substrate, the glass substrate is fired in an inert gas atmosphere such as nitrogen in the same firing furnace. In any of the calcination treatment steps, the organic solvent contained in the burned material such as the color ink on the glass substrate volatilizes or oxidizes/thermally decomposes, whereby a large amount of organic matter is generated and diffused into the environment. Therefore, in the firing process, the clean hot air is continuously sent to the firing furnace' and the exhaust gas is continuously exhausted so that the organic matter does not remain in the firing furnace because the self-heating furnace cannot be discharged. The gas containing a large amount of organic matter is directly released into the outside air, so that the treatment of the organic matter in the discharged gas is performed by a scrubber or the like. On the other hand, in terms of energy saving, 'there has been attempted to exchange heat between the hot air discharged from the furnace and the gas re-supplied to the furnace. That is, when using a scrubber for the furnace. Exhaust gas treatment 134338.doc 200930966, the heat energy lost is very much, the energy efficiency is poor, therefore, try to introduce the discharged gas and the re-supply gas into the heat exchanger, because the heat exchange between the carcasses And recover the heat discharged from the firing furnace. When the gas discharged from the calcination furnace is directly introduced into the heat exchanger, the organic matter adheres to the structure in the heat exchanger and is clogged. Therefore, it is necessary to carry out the catalyst treatment on the exhaust gas, and then introduce the organic matter after it is decomposed. To the hot parent converter. A technique for introducing ❹ to a hot parent after the catalyst treatment of the exhaust gas discharged from the furnace is disclosed, for example, in Patent Document 1. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei No. Hei. No. 201271 [Invention] [Problems to be Solved by the Invention] However, in order to reduce the wind resistance in the exhaust line, the catalyst is formed into a lattice. In the shape of the plate-like member, the contact efficiency between the exhaust gas and the catalyst is lowered, so that the knives efficiency is lowered. In particular, it is extremely difficult to decompose an organic substance which has passed through a particle state or a substance which is formed by solidification of a sublimate. Moreover, the low temperature of the exhaust gas ❹ 9 also lowers the decomposition efficiency. Therefore, in the end, the overall organic matter: the efficiency of the solution is reduced. Therefore, even if the gas discharged from the firing furnace of the glass substrate is subjected to the catalyst treatment, the organic matter cannot be sufficiently removed, and as a result, the deposit clogging the heat exchanger in a short period of time, and finally the continuous operation cannot be performed for a long period of time. Therefore, the device operation rate is low and the economy is not good. The present invention has been made in view of the above problems, and an object of the invention is to provide a substrate heat treatment furnace capable of efficiently decomposing an organic matter contained in hot air discharged by heat treatment. 134338.doc 200930966 [Technical Solution to Problem] In order to solve the above problem, the invention of claim 1 is characterized in that it is a substrate heat treatment furnace that heats a substrate, and includes a furnace body portion that houses the substrate in a lead-out portion that leads at least a part of the hot air discharged from the body main body portion to a portion where the temperature is lower than the hot air, and a filter that is disposed in the lead-out portion and carries a catalyst by the filtering The organic matter contained in the hot air derived from the lead-out unit is decomposed. Further, in the substrate heat treatment furnace according to the invention of claim 1, the invention of claim 2 is characterized in that the filter is a metal filter and is provided with at least one of the filter and the hot air introduced into the filter. Heating mechanism for heating. Further, in the substrate heat treatment furnace according to the invention of claim 2, the invention of claim 3 is characterized in that the heating means heats at least one of the filter and the hot air introduced into the transition device to 2 〇〇〇 c to 4 〇. Further, in the substrate heat treatment furnace according to the invention of claim 1, the invention of claim 4 is characterized in that it comprises a frame surrounding at least the wood body portion of the furnace body, and the filter is provided outside the frame. Further, in the substrate heat treatment furnace according to the invention of claim 1, the invention of claim 5 is characterized in that it comprises a frame surrounding at least the furnace body portion and the filter. / ' Further, the invention of claim 1 The substrate heat treatment furnace according to the invention of claim 6 is characterized in that the catalyst comprises a photocatalyst. The substrate heat treatment furnace of the invention of claim 6 is the invention of claim 3, 34338.doc 200930966 characterized in that the photocatalyst comprises titanium Oxide. The substrate heat treatment furnace of the invention of the second invention of the invention of claim 8 is characterized by the step of cutting the money into the above-mentioned domain, and the substrate of the invention of claim 1 In the processing furnace, the claim 9 is characterized in that: the catalyst contains platinum. ❹ ❹ The invention of the substrate heat treatment furnace according to any one of the claims 9 to claim 9 is characterized in that it comprises: The circulation is characterized in that the hot air discharged from the main body of the furnace body is circulated and supplied to the main body portion of the furnace body; the circulation fan is disposed in the circulation path and circulates the hot air; and the heating mechanism for the furnace body is disposed on the circulation body The circulation path is heated by the hot air; and the main filter unit is disposed in the circulation path and is supplied with hot air, and the lead-out unit branches from the circulation path. Further, the substrate heat treatment furnace according to the invention of claim 10 The invention of claim u is characterized in that it comprises: two adsorption towers arranged side by side on the way of the circulation path and adsorbing carbon dioxide and/or moisture; and a switching mechanism for selectively switching the flow path of the hot air , so that hot air passes through any one of the two adsorption towers; and a switching control mechanism that controls the switching mechanism to make heat The invention is characterized in that: the substrate heat treatment furnace of the invention of claim 10 is characterized in that the hot air outlet of the main filter portion is connected to the hot air of the body portion of the furnace body. Further, in the substrate heat treatment furnace of the invention of claim 10, the invention of claim 13 is characterized in that it further comprises supplying the heated outside air to the upper 134338.doc -10- 200930966 A substrate heat treatment furnace according to the invention of claim 10, wherein the request item 14 is characterized in that: 1 G to 15% of the hot air is guided from the circulation path to: the deriving portion 'directs the remaining portion of the hot air Further, in the substrate heat treatment furnace according to the invention of claim 10, the substrate of claim 15 is characterized in that the substrate has a fired medium, and the fired medium is formed inside the furnace body 邛Burnt. Further, in the substrate heat treatment furnace according to the invention of claim 15, the invention of claim 16 is characterized in that the fired film is an anti-(four) coating film, an organic coating film or an inkjet coating film. [Effects of the Invention]

根據本發明,由於在導出熱風之一部分之導出部中包含 承載有觸媒之過濾器,故而所排出之熱風與觸媒之接觸效 率變尚並且亦可捕集粒子狀之有機物,從而能夠高效率 地分解藉由加熱處理而排出之熱風中所含之有機物。 尤其根據请求項2之發明,由於附帶設置有對過濾器以 及導入至過濾器之熱風之至少一方進行加熱之加熱機構, 故而能夠藉由過濾器而進一步提高有機物之分解效率。 又’尤其根據請求項4之發明,由於將過濾器設置於包 圍爐體本體部之框體之外,故而過濾器之維護變得容易。 又’尤其根據請求項5之發明,由於包含包圍爐體本體 部以及過渡器之框體,故而能夠藉由來自爐體本體部之熱 量而對過渡器進行加熱’從而無需特殊之過濾器用再加熱 134338.doc -11- 200930966 機構。 又,尤其根據請求項6之發明,由於承載於過濾器之觸 媒包含光觸媒’故而亦能夠完全地分解殘留於過濾器上之 有機物》 又,尤其根據請求項11之發明,於循環路徑之途中並排 地叹置兩個吸附塔,並使熱風交替地通過該等吸附塔,因 此,月b夠自熱風除去藉由加熱處理而產生之二氧化碳及/ 或水分,從而能夠使基板熱處理爐長時間地連續運轉。 又’尤其根據請求項14之發明,由於將熱風之10%至 15%自循環路徑引導至導出部,故而能夠充分地管理循環 之熱風之環境’同時能夠抑制伴隨導入新的外氣而產生之 運轉成本之上升。 【實施方式】 以下’ 一面參照圖式’一面對本發明之實施形態加以詳 細說明。 圖1係表示本發明之基板熱處理爐之要部構成的圖。該 基板熱處理爐係對方形之玻璃基板W進行加熱處理,並對 塗佈膜進行燒成處理之熱風爐,其中該方形之玻璃基板w 上形成有噴墨塗佈膜等之被燒成膜。基板熱處理爐包含: 於内部收容玻璃基板w並進行加熱處理之爐體本體部10、 使熱風循環之循環路徑20、吸附熱風中所含之水分及二氧 化碳之吸附塔30、循環風扇40、主加熱器50、主過濾器 60、設於排氣管路23之觸媒單元70以及熱交換器80。又, 於本實施形態之基板熱處理爐中設置有控制部又,於 134338.doc -12· 200930966 圖1所示之構成中,爐體本體部10、循環路徑2〇、吸附塔 3〇、蝶形閥31a、31b、32a、32b、循環風扇40、主加熱器 50以及主過濾器60包圍於框體a中,觸媒單元7〇設置於框 體A之外部。 爐體本體部10係可多段(本實施形態中為4〇段)地收容玻 璃基板W之框體。將爐體本體部1〇之内側設為大致四稜柱 形狀之熱處理空間。於爐體本體部1〇之内壁面上,内設有 省略圖示之多數個又架。各又架係自爐體本體部1〇之内壁 面朝熱處理空間,沿著水平方向而延伸設置。利用包含沿 著水平方向排列之複數根又架而構成1段之架部,形成有 40#又此種架部。於各段之架部上,能夠以水平姿勢载置1 塊玻璃基板W。 於爐體本體部10之正面側(圖丨之紙面左側)設置有隔栅 型之擋板11。擋板1丨係包含多段地積層複數個隔柵而構 成。各隔栅上附帶設置有省略圖示之升降驅動機構,從而 可使每個隔柵升降。當圖外之搬送機械手相對於爐體本體 部10搬出或搬人玻璃基板科,以僅使與作為搬出搬入目 的地之架部相對向的部位成為進出用開口之方式,使高度 與該架部大致相同之位置之隔柵上升。藉此,使搬出搬入 玻璃基板W時之開口為所必需之最小限度,從而能夠將伴 隨搬出搬入所產生之熱能之洩漏抑制為最小限度。再者, 當驅動擋板11之比較處於下部之隔栅時,較該隔桃更靠上 段之隔栅亦會連動地受到驅動,因此,必需預先設置能夠 獲得足以驅動下部之隔栅之較大輸出的驅動機構。 134338.doc -13- 200930966 於爐體本體部10之側面,相對向地設置有用以將熱風供 給至内部之熱處理空間的供給口 J 2、以及用以排出熱風之 排氣口 14。亦即,自爐體本體部1〇之一方之側面所供給之 熱風沿著玻璃基板W之面,水平地在熱處理空間内流動, 並流向相反側之側面。供給口 12以及排氣口 14設置於爐體 本體部10之内壁面中之、至少與收容玻璃基板…之多段之 整個系邛相對應尚度的位置。因此,將熱封均勻地供給至 收容於爐體本體部10之複數塊之玻璃基板貿上,從而能夠 進行均質之燒成處理。 循環路徑20係可供氣體經過之流路,其將爐體本體部1〇 之排氣口 14與供給口 12連通,使自爐體本體部1〇排出之熱 風循環並再次供給至爐體本體部1〇。循環路徑2〇中設置有 吸附塔30、循環風扇4〇以及主加熱器5〇。於本實施形態 中,自循環路徑20之上游側依序設置有吸附塔3〇、循環風 扇40、以及主加熱器5〇。再者,所謂循環路徑2〇之上游 側係心靠近爐體本體部10之排氣口 14之側,相反地所謂 下游側’係指靠近供給口 12之側。 又’自循環路徑20分支而形成有排氣管路23以及供氣管 路26。排氣管路23係用以自循環路徑20將熱風之一部分排 出之氣體配管路徑,供氣管路26係用以吸入與所排出之熱 風相當之量之新鮮外氣(空氣),並將該新鮮外氣供給至循 環路徑20之氣體配管路徑。排氣管路23以及供氣管路26分 別自較循環路徑2〇中之主加熱器5〇更靠下流部分、以及較 循環風扇40更靠上流部分分支。 134338.doc • 14 - 200930966 又’本實施形態中’兩個吸附塔3G、观排地設於循環 路徑則中。亦即,循環路徑2〇之一部分分支為兩個流 路,於該分支之兩低|流政_ , 瓜路中分別設置有吸附塔30〇各吸附 塔3 0於内部填充有用於吸附_ 次附一巩化碳(C〇2)以及水分(h2〇) 之吸附劑(本實施形態中為活0^ ό Τ馮活性碳)。於循環路徑20中流動 之熱風經過吸附塔3 0,藉此,6π „人丄 择 稽此’自熱風除去二氧化碳以及水 分0According to the present invention, since the filter that carries the catalyst is included in the lead-out portion that derives one of the hot air, the contact efficiency between the hot air discharged and the catalyst is increased, and the particulate organic substance can also be trapped, thereby enabling high efficiency. The organic matter contained in the hot air discharged by the heat treatment is decomposed. In particular, according to the invention of claim 2, since the heating means for heating at least one of the filter and the hot air introduced into the filter is provided, the decomposition efficiency of the organic substance can be further improved by the filter. Further, in particular, according to the invention of claim 4, since the filter is disposed outside the casing surrounding the body portion of the furnace body, the maintenance of the filter becomes easy. Further, in particular, according to the invention of claim 5, since the frame body surrounding the main body portion of the furnace body and the transition device is included, the transition piece can be heated by the heat from the body portion of the furnace body, so that no special filter is required for reheating. 134338.doc -11- 200930966 Agency. Further, in particular, according to the invention of claim 6, the catalyst carried on the filter contains the photocatalyst, so that the organic matter remaining on the filter can be completely decomposed, and in particular, according to the invention of claim 11, on the way of the circulation path The two adsorption towers are slanted side by side, and the hot air is alternately passed through the adsorption towers. Therefore, the monthly b is sufficient to remove the carbon dioxide and/or moisture generated by the heat treatment from the hot air, thereby enabling the substrate heat treatment furnace to be heated for a long time. Continuous operation. Further, in particular, according to the invention of claim 14, since 10% to 15% of the hot air is guided from the circulation path to the delivery unit, the environment of the hot air of the circulation can be sufficiently managed, and the introduction of new external air can be suppressed. The increase in operating costs. [Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is a view showing the configuration of a main part of a substrate heat treatment furnace of the present invention. In the substrate heat treatment furnace, a rectangular glass substrate W is subjected to heat treatment, and a hot air furnace in which the coating film is subjected to a baking treatment is formed, in which a fired film such as an inkjet coating film is formed on the square glass substrate w. The substrate heat treatment furnace includes: a furnace body portion 10 that accommodates the glass substrate w and heat-treated therein, a circulation path 20 for circulating hot air, an adsorption tower 30 that adsorbs moisture and carbon dioxide contained in the hot air, a circulation fan 40, and main heating The device 50, the main filter 60, the catalyst unit 70 provided in the exhaust line 23, and the heat exchanger 80. Further, in the substrate heat treatment furnace of the present embodiment, a control unit is provided, and in the configuration shown in Fig. 1, the furnace body portion 10, the circulation path 2〇, the adsorption tower 3〇, and the butterfly are provided in the configuration shown in Fig. 1 . The valve 31a, 31b, 32a, 32b, the circulation fan 40, the main heater 50, and the main filter 60 are enclosed in the casing a, and the catalyst unit 7 is disposed outside the casing A. The furnace body portion 10 is a casing that accommodates the glass substrate W in a plurality of stages (four stages in the present embodiment). The inner side of the furnace body portion 1 is a heat treatment space having a substantially quadrangular prism shape. On the inner wall surface of the main body portion 1 of the furnace body, a plurality of racks (not shown) are provided inside. Each of the frames extends from the inner wall of the body portion of the furnace body toward the heat treatment space and extends in the horizontal direction. A frame portion including one frame is formed by a plurality of frames including a plurality of roots arranged in the horizontal direction, and a frame portion of 40# is formed. One glass substrate W can be placed in a horizontal posture on the frame portion of each segment. A barrier type shutter 11 is provided on the front side of the furnace body portion 10 (on the left side of the paper surface). The baffle 1 is composed of a plurality of barriers stacked in a plurality of stages. Each of the barriers is provided with an elevation drive mechanism (not shown) so that each of the barriers can be lifted and lowered. When the transport robot outside the figure is carried out or moved to the glass substrate section with respect to the furnace main body part 10, the height and the rack part are made into the opening-and-out opening only by the part which opposes the rack part which is a carrying-in destination. The barriers at approximately the same position rise. As a result, the opening when the glass substrate W is carried in and out is minimized, and the leakage of heat energy accompanying the loading and unloading can be minimized. Moreover, when the comparison of the driving baffle 11 is at the lower barrier, the upper grille of the upper partition is driven in conjunction with each other. Therefore, it is necessary to pre-set a larger enough to obtain a lower grille. The drive mechanism for the output. 134338.doc -13- 200930966 On the side of the furnace body portion 10, a supply port J2 for supplying hot air to the internal heat treatment space and an exhaust port 14 for discharging hot air are disposed oppositely. That is, the hot air supplied from the side surface of one of the main body portions of the furnace body flows horizontally in the heat treatment space along the surface of the glass substrate W, and flows to the side surface on the opposite side. The supply port 12 and the exhaust port 14 are provided in the inner wall surface of the furnace body portion 10 at a position corresponding to at least the entire system of the plurality of sections of the glass substrate. Therefore, the heat seal is uniformly supplied to the glass substrate of the plurality of blocks housed in the main body portion 10 of the furnace body, whereby the homogeneous baking treatment can be performed. The circulation path 20 is a flow path through which the gas passes, and communicates the exhaust port 14 of the body main body portion 1 with the supply port 12, and circulates the hot air discharged from the main body portion 1 of the furnace body and supplies it to the body of the furnace body again. Department 1〇. An adsorption tower 30, a circulation fan 4A, and a main heater 5A are disposed in the circulation path 2A. In the present embodiment, the adsorption tower 3A, the circulation fan 40, and the main heater 5A are provided in this order from the upstream side of the circulation path 20. Further, the upstream side of the circulation path 2A is close to the side of the exhaust port 14 of the furnace body portion 10, and the opposite side is referred to as the side close to the supply port 12. Further, the exhaust pipe 23 and the air supply pipe 26 are formed by branching from the circulation path 20. The exhaust line 23 is a gas piping path for discharging a part of the hot air from the circulation path 20, and the air supply line 26 is for inhaling fresh external air (air) in an amount equivalent to the discharged hot air, and the fresh air The external air is supplied to the gas piping path of the circulation path 20. The exhaust line 23 and the supply line 26 are further branched from the lower portion of the main heater 5 in the comparative circulation path 2, and further upstream than the circulating fan 40. 134338.doc • 14 - 200930966 Further, in the present embodiment, the two adsorption towers 3G are disposed in the circulation path. That is, one part of the circulation path 2〇 is branched into two flow paths, and two adsorption channels are respectively disposed in the two branches of the branch, and the adsorption towers 30 are respectively disposed in the melon roads. An adsorbent (in the present embodiment, active 0^ Τ Τ 活性 activated carbon) is attached to the carbonized carbon (C〇2) and the water (h2〇). The hot air flowing in the circulation path 20 passes through the adsorption tower 30, whereby 6π „ 丄 择 ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ 自 自 自 自 自

❹ 選擇並使用兩個吸附物、辦之任—個。亦即,選擇 性地僅打開已分支之兩個流路中之一方,於循環路徑中 流動之熱風僅經過兩個吸附塔3〇中之任一方。此種流路之 切換係藉由四個蝶形閥3丨a、3丨b、3 2 a、3 2 b而執行;當打 開蝶形閥3U、31b,並關閉蝶形閥32a、32b時,僅選;性 地使用圖丨之紙面上側之吸料3()。相反地,#打開蝶形 閥32a、32b,並關閉蝶形閥31a、心時,僅選擇性地使用 圖1之紙面下側之吸附塔3 〇。 循環風扇40包含省略圖示之馬達與旋轉葉片,馬達使旋 轉葉片轉動’藉此,使循環路徑2G中產生自上游側流向下 游側之循環氣流(亦即,自排氣口 14流向供給口 12之氣 流)。 主加熱器50藉由通電而發熱,藉此對於循環路徑2〇中流 動之熱風進行加熱。主過濾器60設置於循環路徑2〇之終 點,亦即設置於爐體本體部1〇之供給口 12之上游側附近。 藉此,主過濾器60之熱風出口連接於爐體本體部1〇之供給 口 12。主過濾器60例如藉由耐熱HEPA(High Efficiency 134338.doc •15- 200930966❹ Select and use two adsorbents and do whatever you want. That is, only one of the two branched paths is selectively opened, and the hot air flowing in the circulation path passes through only one of the two adsorption towers 3〇. The switching of such flow paths is performed by four butterfly valves 3丨a, 3丨b, 3 2 a, 3 2 b; when the butterfly valves 3U, 31b are opened and the butterfly valves 32a, 32b are closed , only select; use the suction 3 () on the upper side of the paper. Conversely, when the butterfly valves 32a, 32b are opened and the butterfly valve 31a and the core are closed, only the adsorption tower 3 下 on the lower side of the paper of Fig. 1 is selectively used. The circulation fan 40 includes a motor (not shown) and a rotary vane, and the motor rotates the rotary vane, thereby generating a circulating airflow from the upstream side to the downstream side in the circulation path 2G (that is, flowing from the exhaust port 14 to the supply port 12) Airflow). The main heater 50 generates heat by energization, whereby the hot air flowing in the circulation path 2 is heated. The main filter 60 is disposed at the end of the circulation path 2, i.e., near the upstream side of the supply port 12 of the body portion 1 of the furnace body. Thereby, the hot air outlet of the main filter 60 is connected to the supply port 12 of the body portion 1 of the furnace body. The main filter 60 is made of, for example, heat-resistant HEPA (High Efficiency 134338.doc •15- 200930966

Paniculate Air,高效率粒子空氣)過濾器而構成,使經由 循環路徑20送來之熱風通過,除去熱風中所含之粒子而使 熱風變得潔淨。 本實施形態中,由循環路徑20之循環風扇4〇送出之氣體 經主加熱器50加熱之後,藉由主過濾器6〇而經淨化,並自 供給口 12供給至爐體本體部10内部之熱處理空間。繼而, 自爐體本體部10之排氣口 14排出之熱風,藉由吸附塔3〇而 被除去二氧化碳以及水分之後,再次藉由循環風扇4〇而送 ® 出至循環路徑20之下游側。 然而,若對玻璃基板貿進行加熱,則玻璃基板w上之被 燒成臈(喷墨塗佈膜等)所含之有機溶劑會揮發或者氧化· 熱分解,藉此會產生大量之有機物.於爐體本體部1〇之内 部空間中不斷地形成熱風之氣流,因此,脫離玻璃基板w 之有機物會與氣流一併自排氣口 14流入至循環路徑2〇。若 將基板熱處理爐之熱風循環系統設為完全封閉之系統,則 _ 會藉由大量之有機物而抑制新的有機物之燒成,或主過濾 器60會迅速堵塞而劣化,因此,於本實施形態中將新的 氣體自供氣管路26供給至循環路徑20,並且,經由排氣管 路23而排出來自循環路徑2〇之氣體。再者,熱風中除了有 機物之外,亦會同時產生少量之二氧化碳或水分。 排氣k路(導出部)23連接於較循環路徑2〇之主加熱器5〇 更罪^游側處。X,排氣管路23之另一端連通地連接於熱 父換J80。於排氣管路23之路徑途中插入有流量調節閥μ 以及觸媒單疋70。流量調節間24對在排氣管路23中流動之 I34338.doc -16 - 200930966 排氣流量進行調整。 另一方面,供氣管路26連接於較循環路徑2〇之循環風扇 4〇更靠上游侧處(吸附塔3〇與循環風扇4〇之間)。供氣管路 26之另一端亦連通地連接於熱交換器8〇。於供氣管路%之 路徑途中插入有流量調節閥27。流量調節閥27對在供氣管 路26中流動之排氣流量進行調整。 熱交換器80係於氣體與氣體之間進行熱交換之機器,例 如可使用蓄熱式熱交換器等,該蓄熱式熱交換器使所供給 之氣體與所排出之氣體交替地經過旋轉之蓄熱體,並進行 熱交換。本實施形態之熱交換器8〇使熱量自排氣管路23中 流動之熱排氣’轉移至由供氣管路26吸入之新的氣體,藉 此進行熱回收。或者’熱交換器80亦可為交互地流動有氣 體之多段板式熱交換器等之壓力損耗較少者。 觸媒單元70包含觸媒過濾器部71、再熱器72以及光源 73。觸媒過濾器部71係使由金屬製之篩網(本實施形態中 為不鏽鋼製之篩網)構成之金屬過濾器,承載作為觸媒而 發揮功能之鉑(Pt)或鉑铑(Pt-Rh)之粒子者。又,本實施形 態中’在所承載之觸媒之一部分中混入有作為光觸媒而發 揮功能之氧化鈦(TiOJ。觸媒過濾器部71兼具有如下兩種 功能,即’作為用以對熱排氣中所含之有機物進行分解之 觸媒的功能、以及作為除去粒子之過濾器之功能。再者, 亦可於金屬過濾器與觸媒層之間形成氧化鋁(Al2〇3)或氧化 鉻(Cr2〇3)之中間層。藉由設置此種陶瓷之中間層,能夠提 兩不鑛鋼之耐久性及对熱性’從而能夠延長金屬過渡器之 134338.doc -17- 200930966 哥命。 再熱益72係如下之熱源,該熱源藉由通電而發熱,藉此 U過觸媒單元70之熱排氣進行加熱。於觸媒單元7〇中, 再,、,、器72以及觸媒過渡器部71自排氣管路之上游侧依序 連績地配置。藉此,經再熱器72加熱後之熱排氣會立即流 入至觸媒過;慮器部7卜又,光源乃將光照射至觸媒過渡器 部71。觸媒過據器部71所承載之光觸媒接收來自光源73之 光’藉此顯示ώ觸媒作用。 ❹#為設於基板熱處理爐之控制部9〇之硬體的構成與一般 之電腦相同《亦即,控制部9〇包含:進行各種運算處理之 CPU(Central Processing Unit,中央處理單元)、作為儲存 基本程式且專用於讀取之記憶體的R〇M(Read 〇nly Memory,唯讀記憶體)、作為儲存各種資訊且自如地進行 讀寫之記憶體的RAM(Random Access Memory,隨機存取 記憶體)、以及預先儲存有控制用應用程式或資料等之磁 ,碟等。控制部90電性連接於四個蝶形閥31a、31b、32a、 32b之各個’並對該等蝶形閥之動作進行控制。又,控制 部90亦對整個基板燒成爐之各動作機構(循環風扇4〇、主 加熱器50、再熱器72、光源73、流量調節閥24、27以及擋 板11之升降驅動機構等)之動作進行控制。 其次’對具有上述構成之基板熱處理爐之動作内容加以 說明。首先,於加熱處理中,圖外之搬送機械手以固定間 隔’依序將玻璃基板W搬入至爐體本體部1〇中,並將其放 置於特定之段之架部。藉由來自供給口 12之熱風,將載置 134338.doc -18- 200930966 於構成架部之叉架之玻璃基板w升溫至燒成溫度為止。繼 而’藉由該搬送機械手,將在爐體本體部10内經過特定之 燒成時間之玻璃基板W搬出。 本實施形態中,對在上表面上已形成有噴墨塗佈膜等之 被燒成膜之方形的玻璃基板W進行加熱處理,以進行該被 燒成膜之燒成處理。被燒成膜並不限定於噴墨塗佈膜,亦 可為抗钱劑塗層膜或有機物塗層膜。無論被燒成膜為何種 膜,玻璃基板W上之被燒成膜所含之有機溶劑會揮發或氧 化,藉此,產生大量之有機物,該有機物會擴散至爐體本 體部10内之環境氣體中。又,藉由燒成處理,亦會同時產 生少量之水分及二氧化碳。繼而,含有有機物等之熱環境 氣體作為熱風而自爐體本體部10之排氣口 14排出。自排氣 口 14排出之熱風藉由循環風扇40而於循環路徑20内循環, 經主加熱器50加熱之後,經由主過濾器6〇而再次自供給口 12供給至爐體本體部10之内部。 於循環路徑20内循環之熱風所含之粒子等會被主過渡器 60捕獲。又,於循環路徑2〇之途中並排地設置有兩個吸附 塔30,以使熱風僅經過該等吸附塔3〇中之任一方之方式, 藉由四個蝶形閥31a、31b、32a、32b而選擇性地切換熱風 之流路《於吸附塔30中,吸附並除去於燒成時產生之熱風 中所含之水分以及二氧化碳。藉由主過濾器60而除去粒子 等’藉由吸附塔30而除去水分以及二氧化碳,藉此,可使 在循環路徑2〇内循環之熱風變得潔淨,從而能夠於爐體本 體部10之内部穩定地形成適合於燒成處理之環境。 134338.doc 19 200930966 於有熱風經過之一方之吸附塔30中,由於活性碳之吸附 能力逐步降低,故而無法充分地吸附並除去水分以及二氧 化碳。因此,需以適當之時序來對所使用之吸附塔3〇進行 切換。亦即,控制部90對四個蝶形閥31a、31b、32&、3沘 之開閉進行控制,以使熱風交替地經過兩個吸附塔3〇。對 於對所使用之吸附塔30進行切換之時序而言,可於吸附塔 30之運轉時間經過特定時間之時點進行切換,又,亦可於 熱風中所含之水蒸氣或二氧化碳之濃度超過特定值之時點 ® 進行切換。 於對所使用之吸附塔30執行切換之後,對使用至此之吸 附塔30進行再生處理。對於再生處理而言,例如可於吸附 。30中„又置再生用之加熱器,藉此對活性碳進行加熱,以 使已吸附之水以及二氧化碳脫離,從而恢復吸附能力。亦 可藉由控制部90而自動地對此時之加熱器之溫度進行控 制又’再生處理亦可為如下形態,即,僅將吸附塔3〇之 參 # 碳更換為新的活性炭。再者’該加熱器、作為所需之 外氣流通機構之風扇、及再生用流路並未圖示。 亦即’再次切換四個蝶形閥31a、31b、32a、32b,以使 …、風經過在再生處理結束之後恢復了吸附能力之吸附塔 3〇 °繼而’以同樣之方式對另一方之吸附塔30進行再處 理。藉此,能夠使基板熱處理爐不停歇地連續運轉。 又’於循環路徑2〇内循環之熱風之一部分流向排氣管路 23並排出至外部。本實施形態中,控制部9〇對流量調節 閱24 27進行調整,藉此,將在循環路徑2〇中循環之熱風 134338.doc -20· 200930966 申之10%至15%導入至排氣管路23,並將剩餘之熱風導入 至爐體本體部10。若自排氣管路23排出之熱風不足ι〇%, 則僅利用主過濾器60或吸附塔3〇,無法充分地對在循環路 徑20内循環之熱風之環境進行f理,χ,若上述熱風超過 15%,則伴隨自供氣管路26導入新的外氣所產生之運轉成 本變高。 流入至排氣管路23之熱風藉由再熱器72而經再加熱。本 實施形態中,再熱器72將導出至排氣管路23之熱風再加熱 至200。(:至400。(:。繼而,該經再加熱之熱風經過觸媒過濾 器。卩71。此處,代替對熱風進行加熱,或者除了對熱風進 行加熱之外’亦可將觸媒過濾器部71加熱至2〇〇t:〜4〇〇 C 於°亥情形時’可藉由感應加熱、燈加熱或電阻加熱等 而對觸媒過濾器部71進行加熱。 導出至排氣管路23之熱風經過觸媒過濾器部71,藉此, 同時對熱風中所含之有機物進行加熱分解與氧化分解。具 體而言,有機物經氧化而分解為水與二氧化碳。本實施形 態中,由金屬製之篩網所構成之金屬過濾器中承載有觸 媒’因此,所排出之熱風與觸媒之接觸效率變高,從而可 提向有機物之分解效率。又,即便熱風中包含以粒子狀態 經過之有機物、或昇華物固形化而成之物質,由於利用金 屬過據器來構成觸媒過濾器部7丨,故而此種物質亦會被觸 媒過濾器部71捕集。 進而’藉由再熱器72而再加熱至20CTC至400°C之熱風流 入至觸媒過濾器部71,因此,觸媒過濾器部71之觸媒溫度 134338.doc •21 · 200930966 亦會變’從而能夠高效率地分解熱風中所含之有機物。 亦即’自上游側連續地配置再熱器72與觸媒過濾器部7i, 藉 將自再熱器72至觸媒過渡器部71為止之熱風之溫度 下降抑制為最小限度,從而最大限度地提高觸媒過濾器部 71之分解效率。The Paniculate Air (high-efficiency particle air) filter is configured to pass hot air sent through the circulation path 20, and removes particles contained in the hot air to clean the hot air. In the present embodiment, the gas sent from the circulation fan (4) of the circulation path (20) is heated by the main heater (50), purified by the main filter (6), and supplied from the supply port 12 to the inside of the furnace body (10). Heat treatment space. Then, the hot air discharged from the exhaust port 14 of the furnace body portion 10 is removed by carbon dioxide and moisture by the adsorption tower 3, and then sent to the downstream side of the circulation path 20 by the circulation fan 4〇. However, when the glass substrate is heated, the organic solvent contained in the calcined crucible (inkjet coating film or the like) on the glass substrate w is volatilized or oxidized/thermally decomposed, whereby a large amount of organic matter is generated. The airflow of the hot air is continuously formed in the internal space of the main body portion of the furnace body. Therefore, the organic matter separated from the glass substrate w flows into the circulation path 2〇 from the exhaust port 14 together with the air flow. When the hot air circulation system of the substrate heat treatment furnace is a completely closed system, the sintering of a new organic substance is suppressed by a large amount of organic substances, or the main filter 60 is quickly clogged and deteriorated. Therefore, in the present embodiment, The new gas is supplied from the gas supply line 26 to the circulation path 20, and the gas from the circulation path 2 is discharged through the exhaust line 23. In addition, in addition to organic matter, hot air also produces a small amount of carbon dioxide or water. The exhaust k-way (derivation unit) 23 is connected to the main heater 5〇 of the circulation path 2〇. X, the other end of the exhaust line 23 is connected in communication to the hot parent for J80. A flow regulating valve μ and a catalyst unit 70 are inserted in the path of the exhaust line 23. The flow regulating chamber 24 adjusts the exhaust flow rate of I34338.doc -16 - 200930966 flowing in the exhaust line 23. On the other hand, the air supply line 26 is connected to the upstream side of the circulation fan 4〇 of the circulation path 2〇 (between the adsorption tower 3〇 and the circulation fan 4〇). The other end of the gas supply line 26 is also connected in communication to the heat exchanger 8A. A flow regulating valve 27 is inserted in the middle of the path of the gas supply line %. The flow rate adjusting valve 27 adjusts the flow rate of the exhaust gas flowing through the air supply pipe 26. The heat exchanger 80 is a device that exchanges heat between a gas and a gas. For example, a regenerative heat exchanger can be used. The regenerative heat exchanger alternately passes the supplied gas and the discharged gas through a rotating regenerator. And carry out heat exchange. The heat exchanger 8 of the present embodiment transfers heat from the hot exhaust gas ' flowing from the exhaust line 23 to a new gas sucked into the gas supply line 26, thereby performing heat recovery. Alternatively, the heat exchanger 80 may have a small pressure loss such as a multi-stage plate heat exchanger in which a gas is alternately flowed. The catalyst unit 70 includes a catalytic filter portion 71, a reheater 72, and a light source 73. The catalyst filter unit 71 is a metal filter made of a metal mesh (a screen made of stainless steel in the present embodiment), and supports platinum (Pt) or platinum rhodium (Pt-) functioning as a catalyst. The particle of Rh). Further, in the present embodiment, 'the titanium oxide (TiOJ) functioning as a photocatalyst is mixed in one of the supported catalysts. The catalyst filter unit 71 also has the following two functions, that is, as the heat for use The function of the catalyst for decomposing the organic matter contained in the exhaust gas and the function of the filter for removing the particles. Further, alumina (Al 2 〇 3) or oxidation may be formed between the metal filter and the catalyst layer. The intermediate layer of chromium (Cr2〇3). By providing such an intermediate layer of ceramics, it is possible to improve the durability and heat resistance of the two non-mineral steels, thereby prolonging the life of the metal transition device. Reheat 72 is a heat source that generates heat by energization, whereby the heat of the U-catalyst unit 70 is heated. In the catalyst unit 7 , , , , , , and the catalyst The transition portion 71 is disposed in succession from the upstream side of the exhaust line. Thereby, the hot exhaust gas heated by the reheater 72 immediately flows into the catalyst; the light source portion is again Light is irradiated to the catalyst transition unit 71. The catalyst is carried by the catalyst unit 71. The catalyst receives the light from the light source 73 to thereby display the action of the catalyst. The structure of the hardware provided in the control unit 9 of the substrate heat treatment furnace is the same as that of a general computer. That is, the control unit 9 includes: A CPU (Central Processing Unit) that performs various arithmetic processing, and R〇M (Read 〇nly Memory) that is a memory that stores a basic program and is dedicated to reading, and is freely stored as various information. A RAM (Random Access Memory) for reading and writing memory, a magnetic disk, etc., in which a control application or data is stored in advance, etc. The control unit 90 is electrically connected to the four butterfly valves. Each of 31a, 31b, 32a, and 32b' controls the operation of the butterfly valves. Further, the control unit 90 also operates the respective operating mechanisms of the entire substrate firing furnace (circulation fan 4〇, main heater 50, and then The operation of the heat exchanger 72, the light source 73, the flow regulating valves 24 and 27, and the lifting and lowering drive mechanism of the shutter 11 is controlled. Next, the operation of the substrate heat treatment furnace having the above configuration will be described. In the heat treatment, the transport robot outside the drawing carries the glass substrate W into the furnace body portion 1 at a fixed interval, and places it on the rack portion of the specific section. By the supply port 12 In the hot air, the glass substrate w constituting the fork frame of the rack portion is heated to the firing temperature. Then, the transfer robot is used to pass the specific body in the furnace main body portion 10 by the 134338.doc -18-200930966. In the present embodiment, the glass substrate W having the square shape of the fired film formed on the upper surface such as the inkjet coating film is heat-treated to perform the fired film. The firing treatment. The film to be fired is not limited to the inkjet coating film, and may be an anti-stick coating film or an organic coating film. Regardless of the film to be fired, the organic solvent contained in the fired film on the glass substrate W is volatilized or oxidized, whereby a large amount of organic matter is generated, and the organic substance is diffused into the atmosphere of the furnace body portion 10. in. Also, by baking, a small amount of water and carbon dioxide are simultaneously produced. Then, a hot ambient gas containing an organic substance or the like is discharged as hot air from the exhaust port 14 of the furnace body portion 10. The hot air discharged from the exhaust port 14 is circulated in the circulation path 20 by the circulation fan 40, heated by the main heater 50, and then supplied again from the supply port 12 to the inside of the furnace body portion 10 via the main filter 6〇. . The particles and the like contained in the hot air circulating in the circulation path 20 are captured by the main transition unit 60. Further, two adsorption towers 30 are arranged side by side on the way of the circulation path 2〇 so that the hot air passes only one of the adsorption towers 3〇, by the four butterfly valves 31a, 31b, 32a, 32b and selectively switching the flow path of the hot air. In the adsorption tower 30, moisture and carbon dioxide contained in the hot air generated at the time of firing are adsorbed and removed. By removing the water and carbon dioxide by the adsorption tower 30 by the main filter 60, the hot air circulating in the circulation path 2〇 can be cleaned and can be inside the furnace body portion 10. An environment suitable for the firing treatment is stably formed. 134338.doc 19 200930966 In the adsorption tower 30 which has one of the hot air passing through, the adsorption capacity of activated carbon is gradually lowered, so that moisture and carbon dioxide cannot be sufficiently adsorbed and removed. Therefore, it is necessary to switch the adsorption tower 3〇 used at an appropriate timing. That is, the control unit 90 controls the opening and closing of the four butterfly valves 31a, 31b, 32 &, 3沘 so that the hot air alternately passes through the two adsorption towers 3〇. For the timing of switching the adsorption tower 30 to be used, the operation time of the adsorption tower 30 may be switched at a specific time, or the concentration of water vapor or carbon dioxide contained in the hot air may exceed a specific value. At the time of the point ® to switch. After the switching is performed on the adsorption tower 30 to be used, the adsorption tower 30 thus used is subjected to regeneration treatment. For the regeneration treatment, for example, it can be adsorbed. In the 30th, the heater for regenerating is used to heat the activated carbon to remove the adsorbed water and the carbon dioxide, thereby restoring the adsorption capacity. The heater can be automatically controlled by the control unit 90 at this time. The temperature control and the regeneration treatment may be in the form of replacing only the carbon of the adsorption tower 3 into a new activated carbon. Further, the heater is used as a fan of the required air flow passage mechanism. And the flow path for regeneration is not shown. That is, the four butterfly valves 31a, 31b, 32a, and 32b are switched again so that the wind passes through the adsorption tower 3〇 which recovers the adsorption capacity after the end of the regeneration process. 'Reprocessing the other adsorption tower 30 in the same manner. Thereby, the substrate heat treatment furnace can be continuously operated without stopping. Further, part of the hot air circulating in the circulation path 2〇 flows to the exhaust line 23 and In the present embodiment, the control unit 9 adjusts the flow rate adjustment 24 27, thereby introducing 10% to 15% of the hot air 134338.doc -20· 200930966 circulating in the circulation path 2〇. To exhaust The line 23 and the remaining hot air are introduced into the furnace body portion 10. If the hot air discharged from the exhaust line 23 is less than 〇%, only the main filter 60 or the adsorption tower 3〇 is used, and the hot air cannot be sufficiently The environment of the hot air circulating in the circulation path 20 is f, and if the hot air exceeds 15%, the running cost associated with the introduction of the new external air from the air supply line 26 becomes high. The hot air flowing into the exhaust line 23 The reheater 72 is reheated by the reheater 72. In the present embodiment, the reheater 72 reheats the hot air discharged to the exhaust line 23 to 200. (: to 400. (:. Then, the reheated The hot air passes through the catalytic filter. 卩 71. Here, instead of heating the hot air or heating the hot air, the catalyst filter unit 71 may be heated to 2 〇〇 t: 〜4 〇〇 C In the case of °H, the catalytic filter unit 71 can be heated by induction heating, lamp heating, resistance heating, etc. The hot air that is led to the exhaust line 23 passes through the catalytic filter unit 71, thereby simultaneously Organic matter contained in hot air undergoes thermal decomposition and oxidative decomposition. Specifically The organic substance is decomposed into water and carbon dioxide by oxidation. In the present embodiment, the metal filter composed of the metal mesh screen carries the catalyst. Therefore, the contact efficiency between the discharged hot air and the catalyst becomes high. It is possible to improve the decomposition efficiency of the organic matter. Further, even if the hot air contains a substance which is solidified by the organic matter or the sublimate in the state of the particles, the catalyst filter unit 7 is formed by the metal catalyst. The substance is also trapped by the catalytic filter unit 71. Further, the hot air reheated to 20 CTC to 400 °C by the reheater 72 flows into the catalytic filter unit 71, and therefore, the catalytic filter unit 71 Catalyst temperature 134338.doc •21 · 200930966 will also change 'so that it can efficiently decompose the organic matter contained in the hot air. In other words, the reheater 72 and the catalytic filter unit 7i are continuously disposed from the upstream side, and the temperature drop of the hot air from the reheater 72 to the catalyst transition unit 71 is minimized, thereby maximizing the maximum The decomposition efficiency of the catalytic filter portion 71 is improved.

經過觸媒過濾器部71後已除去了有機物之熱風流入至熱 交換器80。另一方面,為了補充經由排氣管路23所排出之 熱風,自供氣管路26供給新的氣體。該重新供給之氣體亦 會經過熱交換器80。於熱交換器80中,在自排氣管路23排 出之熱風、與經由供氣管路26而重新供給之氣體之間進行 熱交換。藉此,排出氣體之溫度降低,並且供給氣體受到 加熱,其溫度上升。此時,自排氣管路23排出之熱風中所 含之有機物幾乎已被分解,因此,附著於熱交換器8〇内之 構造物之有機物非常少,可防止堵塞熱交換器8〇,從而能 夠使熱交換器80長期間地穩定運轉。 經由熱交換器80後溫度已降低之排出氣體釋放至外部之 排熱官等H該排出之氣流中亦幾乎不含有有機物。 另-方面,經過熱交換器8〇後溫度已上升之供給氣體,經 過流量調節閥27而流入至循環路徑2〇。重新供給之氣體流 入至較主加熱H50更靠上游侧’因此,無使供給至爐體: 體部10之熱風之溫度降低之虞,i述重新供給之氣流經主 加熱器50加熱之後’自供給口 12供給至爐體本體部ι〇之内 部。如此’若能夠使用熱交換㈣來進行供給氣體與排出 氣體之間之熱交換,則可提高基板熱處理爐之能效。 134338.doc -22- 200930966 如上所述,於本實施形態中,由於將在金屬過濾器中承 載有觸媒之觸媒過濾器部71設置於排氣管路23中,故而與 先前相比較,所排出之熱風與觸媒之接觸效率變高,可提 高有機物之分解效率。又,亦能夠捕集粒子狀之有機物, 從而可提高總體之有機物之分解效率。進而,藉由再熱器 72而將流入至觸媒過濾器部71之熱風再加熱至2〇〇<»c至4〇〇 C,因此,可進一步提高有機物之分解效率,能夠可靠地 分解自排氣管路23排出之熱風中所含之有機物。又,由於 將觸媒單元7 0设置於框體A之外部’故而包含觸媒過濾器 部71之觸媒單元70之維護變得容易。 又,本實施形態之觸媒單元70中包含光源73,觸媒過濾 器部71中所承載之觸媒之一部分中含有光觸媒。當以適當 之時序,將光自光源73照射至觸媒過濾器部71時,觸媒過 濾器部71之光觸媒藉由接收光而產生觸媒作用,能夠有效 地分解殘留附著於一部分之金屬過濾器之有機物。亦即, 將光自光源73照射至觸媒過濾器部7丨,藉此,能夠執行一 種清潔處理❶再者,亦可不設置光源73,而是利用來自室 内照明器具等之光來使觸媒過濾器7丨產生觸媒作用。 以上,對本發明之實施形態進行了說明,但本發明只要 不脫離其宗旨,則除了上述實施形態之外,亦可進行各種 變更。例如,於上述實施形態中包含熱交換器8〇,於熱排 乳與重新供給之外軋之間進行熱交換,但亦可於不包含熱 交換器80之排氣管路中設置觸媒單元7〇。即便如此,亦能 夠同效率地分解藉由加熱處理而排出之熱風中所含之有機 134338.doc •23· 200930966 物。總之,只要將承載有觸媒之金屬過濾器配置於導出 部,則能夠高效率地分解所排出之熱風中所含之有機物, 其中,上述導出部將自爐體本體部10排出之熱風之至少一 部分導出至溫度低於該熱風之部分。 又,亦可將觸媒過濾器部71所承载之所有觸媒設為光觸 媒。於該情形時,當自排氣管路23排出熱風時,總是將光 自光源73照射至觸媒過濾器部7 j。 ❹The hot air from which the organic matter has been removed after passing through the catalytic filter unit 71 flows into the heat exchanger 80. On the other hand, in order to supplement the hot air discharged through the exhaust line 23, a new gas is supplied from the air supply line 26. The re-supplied gas also passes through the heat exchanger 80. In the heat exchanger 80, heat is exchanged between the hot air discharged from the exhaust line 23 and the gas re-supplied via the supply line 26. Thereby, the temperature of the exhaust gas is lowered, and the supply gas is heated, and the temperature thereof rises. At this time, since the organic matter contained in the hot air discharged from the exhaust line 23 is almost decomposed, the organic matter adhering to the structure in the heat exchanger 8 is extremely small, and the heat exchanger 8 is prevented from being clogged. The heat exchanger 80 can be stably operated for a long period of time. The exhaust gas whose temperature has been lowered after passing through the heat exchanger 80 is released to the outside, and the exhaust gas which is discharged to the outside also contains almost no organic matter. On the other hand, the supply gas whose temperature has risen after passing through the heat exchanger 8 passes through the flow rate adjusting valve 27 and flows into the circulation path 2A. The re-supplied gas flows into the upstream side of the main heating H50. Therefore, there is no supply to the furnace body: the temperature of the hot air of the body portion 10 is lowered, and the re-supply flow is heated by the main heater 50. The supply port 12 is supplied to the inside of the main body portion of the furnace body. Thus, if heat exchange (four) can be used to exchange heat between the supply gas and the exhaust gas, the energy efficiency of the substrate heat treatment furnace can be improved. 134338.doc -22- 200930966 As described above, in the present embodiment, since the catalytic filter portion 71 carrying the catalyst in the metal filter is disposed in the exhaust line 23, compared with the prior art, The contact efficiency between the discharged hot air and the catalyst is increased, and the decomposition efficiency of the organic substance can be improved. Moreover, it is also possible to collect particulate organic substances, thereby improving the decomposition efficiency of the overall organic matter. Further, the hot air flowing into the catalytic filter unit 71 is reheated to 2 〇〇 <»c to 4 〇〇C by the reheater 72, so that the decomposition efficiency of the organic substance can be further improved and the decomposition can be reliably performed. The organic matter contained in the hot air discharged from the exhaust line 23. Further, since the catalyst unit 70 is disposed outside the casing A, maintenance of the catalyst unit 70 including the catalytic filter unit 71 is facilitated. Further, the catalyst unit 70 of the present embodiment includes the light source 73, and a portion of the catalyst carried in the catalyst filter unit 71 contains a photocatalyst. When the light is irradiated from the light source 73 to the catalytic filter portion 71 at an appropriate timing, the photocatalyst of the catalytic filter portion 71 generates a catalytic action by receiving light, and can effectively decompose the metal that remains attached to a part of the filter. Organic matter. In other words, the light is irradiated from the light source 73 to the catalytic filter unit 7丨, whereby a cleaning process can be performed, or the light source 73 can be used instead of the light source 73. The filter 7 produces a catalytic effect. The embodiments of the present invention have been described above, but the present invention can be variously modified in addition to the above embodiments without departing from the scope of the invention. For example, in the above embodiment, the heat exchanger 8 is included, and heat exchange is performed between the hot milk discharge and the re-feeding, but the catalyst unit may be provided in the exhaust line not including the heat exchanger 80. 7〇. Even so, it is possible to efficiently decompose the organic 134338.doc •23· 200930966 contained in the hot air discharged by the heat treatment. In short, if the metal filter carrying the catalyst is disposed in the lead-out portion, the organic matter contained in the discharged hot air can be efficiently decomposed, wherein the lead-out portion discharges at least the hot air discharged from the furnace body portion 10. A portion is exported to a portion where the temperature is lower than the hot air. Further, all of the catalysts carried by the catalyst filter unit 71 may be used as photocatalysts. In this case, when hot air is exhausted from the exhaust line 23, light is always irradiated from the light source 73 to the catalytic filter portion 7j. ❹

又,代替觸媒過濾器部71之金屬過濾器,亦可於燒結陶 瓷之過濾器中承載觸媒。 又,於上述實施形態中,將活性碳用作吸附塔3〇之吸附 劑,但並不限定於此,只要是吸附二氧化碳及/或水分之 素材,則例如亦可使用矽膠或沸石。 又’熱交換器80並不限定於蓄熱式熱交換器,亦可為具 有使供給氣體與排出氣體交替地經過之流路的板式熱交換 器等。 、 又,可收容於基板燒成爐之爐體本體部1〇之玻璃基板w 之塊數並不限定於40塊,亦可設為任意之數量。 又,如圖2所示,亦可利用共同之框體3來包圍爐體本體 部1〇、吸附塔30、循環風扇40、主加熱器5〇、主過濾器⑽ 以及觸媒單元7(^藉此,能夠藉由來自爐體本體部ι〇之熱 量而對觸媒過濾器部71進行加熱,因此無需再熱器72。再 者’圖2中之剩餘之構成與圖1相同。 又’根據本發明之基板熱處理爐,成為燒成處理之對象 之基板並不限定於玻璃基板W,亦可為半導體晶圓。 134338.doc •24- 200930966 【圖式簡單說明】 圖1係表示本發明之基板熱處理爐之要部構成之圖。 圖2係表示基板熱處理爐之要部構成之其他例之圖。 【主要元件符號說明】 10 爐體本體部 20 循環路徑 23 排氣管路 24 > 27 流量調節閥 © 26 供氣管路 30 吸附塔 31a ' 31b、 32a、32b 蝶形閥 40 循環風扇 50 主加熱器 60 主過濾器 70 ❹ 觸媒單元 71 72 觸媒過濾器部 再熱器 73 光源 80 90 熱交換器 控制部 134338.doc -25-Further, instead of the metal filter of the catalytic filter unit 71, the catalyst may be carried in the filter of the sintered ceramic. Further, in the above embodiment, activated carbon is used as the adsorbent for the adsorption tower 3, but the present invention is not limited thereto, and as long as it is a material for adsorbing carbon dioxide and/or water, for example, silicone or zeolite may be used. Further, the heat exchanger 80 is not limited to the regenerative heat exchanger, and may be a plate type heat exchanger or the like having a flow path through which the supply gas and the exhaust gas alternately pass. Further, the number of the glass substrates w that can be accommodated in the main body portion 1 of the substrate baking furnace is not limited to 40, and may be any number. Further, as shown in FIG. 2, the common body 3 can be used to surround the furnace body portion 1A, the adsorption tower 30, the circulation fan 40, the main heater 5, the main filter (10), and the catalyst unit 7 (^ Thereby, the catalyst filter unit 71 can be heated by the heat from the main body of the furnace body, so that the reheater 72 is not required. The remaining configuration in Fig. 2 is the same as that of Fig. 1. According to the substrate heat treatment furnace of the present invention, the substrate to be subjected to the baking treatment is not limited to the glass substrate W, and may be a semiconductor wafer. 134338.doc • 24-200930966 [Simplified Schematic] FIG. 1 shows the present invention. Fig. 2 is a view showing another example of the configuration of the main part of the substrate heat treatment furnace. [Description of main components] 10 Furnace body portion 20 Circulation path 23 Exhaust line 24 > 27 Flow control valve © 26 Air supply line 30 Suction tower 31a ' 31b, 32a, 32b Butterfly valve 40 Circulating fan 50 Main heater 60 Main filter 70 触 Catalyst unit 71 72 Catalytic filter unit Reheater 73 Light source 80 90 heat exchanger control 134338.doc -25-

Claims (1)

200930966 十、申請專利範圍: 其係對基板進行加熱 l 一種基板熱處理爐,其特徵在於·· 處理者,且包含: 溋趙本體部,其將基板收容於内部; 導出部,將自上述爐體本體部 八樓, 1排出之熱風之至少一部 刀導出至溫度低於上述熱風之部分;以及 過據器,其設置於上述導出部,且承載有觸媒;200930966 X. Patent application scope: The invention relates to heating a substrate. The invention relates to a substrate heat treatment furnace, which is characterized in that: the processor comprises: a body portion of the body, which houses the substrate inside; and a lead-out portion from the furnace body On the eighth floor of the main body, at least one of the hot gases of the exhausted air is led to a portion where the temperature is lower than the hot air; and the passer is disposed at the lead-out portion and carries the catalyst; Ο 將導出至上述導出部之上述熱風所含之有機物以 過濾器分解。 2. 如請求項丨之基板熱處理爐,其中 上述過濾器為金屬過濾器,且 附設有加熱機構,將上述過濾器及導入至上述過滤器 之熱風之至少· 方加熱。 3. 如凊求項2之基板熱處理爐,其中 上述加熱機構將上述過濾器及導入至上述過滤器之熱 風之至少一方加熱至2〇〇。(:至400Χ:。 4·如請求項1之基板熱處理爐,其中 包含包圍至少上述爐體本體部之框體,且於該框體外 設置有上述過濾器。 5.如請求項1之基板熱處理爐,其中 包含包圍至少上述爐體本體部以及上述過濾器之框 體。 6.如請求項1之基板熱處理爐,其中 上述觸媒包含光觸媒。 134338.doc 200930966 7·如請求項6之基板熱處理爐,其中 上述光觸媒包含鈦氧化物。 8. 如請求項7之基板熱處理爐’其中 進而包含將光照射至上述光觸媒之光照射機構。 9. 如請求項1之基板熱處理爐,其中 上述觸媒包含鉑。 10. 如凊求項1至9中任一項之基板熱處理爐,其中包含:有机 The organic matter contained in the hot air that is led to the above-described deriving unit is decomposed by a filter. 2. The substrate heat treatment furnace according to claim 1, wherein the filter is a metal filter and a heating mechanism is attached, and the filter and at least the hot air introduced into the filter are heated. 3. The substrate heat treatment furnace according to claim 2, wherein the heating means heats at least one of the filter and the hot air introduced into the filter to 2 Torr. (: to 400 Χ: 4. The substrate heat treatment furnace according to claim 1, comprising a frame surrounding at least the body portion of the furnace body, and the filter is provided outside the frame. 5. Substrate heat treatment according to claim 1 The furnace comprising a frame body surrounding at least the above-mentioned furnace body portion and the filter. 6. The substrate heat treatment furnace according to claim 1, wherein the catalyst comprises a photocatalyst. 134338.doc 200930966 7. The substrate heat treatment according to claim 6 The furnace, wherein the photocatalyst comprises titanium oxide. 8. The substrate heat treatment furnace of claim 7, which further comprises a light irradiation mechanism for irradiating light to the photocatalyst. 9. The substrate heat treatment furnace of claim 1, wherein the catalyst The substrate heat treatment furnace according to any one of items 1 to 9, which comprises: 循環路徑,其使自上述爐體本體部排出之熱風循環並 再度供給至上述爐體本體部; 循環風4,其設置於上述循環路#,並使熱風循環; 爐體用加熱機構’其設置於上述循環路徑,並將熱風 加熱;以及 主過濾器部,其設置於上述循環路徑,並使熱風通 過,且 上述導出部自上述循環路徑分支。 11.如請求項10之基板熱處理爐,其中包含: 兩個吸附塔,其並排地設置於上述循環路徑之途中, 並吸附二氧化碳及/或水分; 切換機構’其選擇性地切換熱風之流路,以使熱風通 過上述兩個吸附塔中之任一方;以及 切換控制機構,其控制上述切換機構,以使熱風交替 地通過上述兩個吸附塔。 12.如請求項1〇之基板熱處理爐,其中 將上述主過濾器部之熱風出口連接於上述爐體本體部 I34338.doc 200930966 之熱風供給口。 如°月求項10之基板熱處理爐,其中 進而包含將已加熱之外氣供給至上述循環路徑 供給機構。 卜乳 14. 如請求項10之基板熱處理爐,其中 將熱風之10至15%自上述循環路徑引導至上述導出 部’將該熱風之剩餘部分引導至上述爐體本體部。 ❹ 15. 如請求項10之基板熱處理爐其中 上述基板具有被燒成膜,且 於上述爐體本體部之内邱 _ 円^進行該被燒成膜之燒成。 16·如請求項15之基板熱處理爐,其中 上述被燒成膜為抗餘劑涂爲时 層膜、有機物塗層膜或喷墨 塗佈膜。 ❹ 134338.doca circulation path for circulating hot air discharged from the body portion of the furnace body to the furnace body portion; a circulating air 4 disposed on the circulation path # and circulating hot air; and a heating mechanism for the furnace body The hot water is heated in the circulation path; and the main filter portion is disposed in the circulation path to allow hot air to pass therethrough, and the lead portion branches from the circulation path. 11. The substrate heat treatment furnace of claim 10, comprising: two adsorption towers disposed side by side on the path of the circulation path and adsorbing carbon dioxide and/or moisture; and a switching mechanism that selectively switches the flow path of the hot air , so that hot air passes through any one of the two adsorption towers; and a switching control mechanism that controls the switching mechanism to allow hot air to alternately pass through the two adsorption towers. 12. The substrate heat treatment furnace according to claim 1, wherein the hot air outlet of the main filter unit is connected to the hot air supply port of the furnace body portion I34338.doc 200930966. A substrate heat treatment furnace according to item 10 of the above aspect, which further comprises supplying the heated outside air to the circulation path supply means. A substrate heat treatment furnace according to claim 10, wherein 10 to 15% of the hot air is guided from the circulation path to the above-described lead-out portion' to guide the remaining portion of the hot air to the furnace body portion. 15. The substrate heat treatment furnace according to claim 10, wherein the substrate has a fired film, and the fired film is fired in the body of the furnace body. The substrate heat treatment furnace according to claim 15, wherein the fired film is coated with a residual agent as a film, an organic coating film or an inkjet coating film. ❹ 134338.doc
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