TW200928172A - Liquefied gas supply device and supply method - Google Patents

Abstract

To provide a liquefied gas supply facility and a supply method, wherein liquefaction of low vapor pressure liquefied gases in the supply piping is prevented and a stable amount can be supplied, due to excellent operability and compact configuration. Liquefied gas supply facility wherein liquefied gas is supplied from the filling container through the piping in a gaseous state to the processing device 5 which is separated from the facility, characterized in that liquid phase temperature To of the liquefied gas in the filling container la is kept below the lowest value of ambient temperature Ta of the primary piping system 2, liquefaction temperature Tc in the re-liquefaction means 3a or Tc and the storage temperature Ts in the storage means 3b are kept below liquid phase temperature To of the liquefied gas in the filling container la, and liquid-phase liquefied gas temperature Tg in the secondary vaporization means 3c is kept below the lowest value of ambient temperature Tg of the secondary piping system 4.

Description

200928172 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a liquefied gas supply device and a supply method, and more particularly to a liquefied gas supply for providing a low vapor pressure special material gas and various process gases for semiconductor production. The apparatus and the supply method, wherein the gas systems are represented by, for example, HF, CLF3, BCLs, SiH2CL2, and WF6. [Technical Background] ϋ W [Prior Art] Low vapor pressure liquefied gas systems typified by HF, CLF3, BCL3, SiH2CL2, and WF6 are often used as special material gases and various processing gases in semiconductor manufacturing processes and various other processes. . These low vapor pressure liquefied gases are generally filled with a high pressure gas container (hereinafter referred to as a "container") in a liquid state, and are delivered to, for example, a device or a variety of other processing equipment of a semiconductor production plant that consumes the liquefied gas. In these cases, a semiconductor manufacturing plant and a variety of other processing devices (hereinafter referred to as "processing devices" for liquefied gas consumption are not in a liquid state, but receive liquefied gases in a gaseous state and use them in a gaseous state. At this time, the container filled with the liquefied gas is installed in a gas supply device called a steel bottle, and the gas system is vaporized in the container into a gaseous state and transmitted through a pipe connected to the processing device. In such a device, the only energy used to feed the vaporized liquefied gas in the vessel to the processing unit is pressure energy, which is the vapor pressure of the liquefied gas cartridge' and typically does not require the use of external energy such as a pump. For this reason, in the low vapor pressure liquefied gas supply system, since the liquefied gas itself is vaporized, the gas system is very low, so the gas system is fed into the pipeline in a state close to the saturated vapor state with little pressure reduction. Therefore, there has been a technical problem of turning a liquefied gas into a liquid in a pipe due to the presence of a local low temperature section of the supply pipe and effects such as seasonal variations and changes in air conditioning conditions. In the conventional liquefied gas supply system, as shown in Figs. 6 and 7, it has been customary to place the liquefied gas supply cylinder cabinet 301 and the processing apparatus 3〇2 in the same air conditioning area to avoid local low temperature zones in the pipeline. The impact of the segment and changes in air conditioning conditions. Figure 6 shows an embodiment in which the cylinder cabinet 3〇1 is securely placed in the same room as the treatment unit 302 (clean room 3〇〇), and Figure 7 shows an embodiment in which the cylinder cabinet 3 is almost straightforward Placed under processing device 302, which is attached to layer 408, referred to as an inflator, is in the underlying region of clean chamber layer 3〇3 where processing device 302 is placed. The grid layer is placed between the clean room layer 3〇3 and the inflator layer 3〇4, so that the air of the air conditioner flows downward from the top of the layer, and thus the cylinder cabinet 301 and the processing device 3〇2 are actually placed The same air conditioning area. Further, as a method of avoiding liquefaction of the liquefied liquid in the supply piping system, a liquefied gas supply device as shown in Figs. 8(A) and (B) has been proposed. That is, in Fig. 8(A), the heating means is used to heat the material gas supply b-channel 105 to a vaporization temperature higher than the gas. Since the pipe route is heated to the vaporization temperature of the liquefied gas, reliquefaction of the liquefied gas supplied to the liquefied material gas supply pipe 105 is avoided. In this configuration, a 1〇1 system/melon controller.丨02 is a temperature sensor that detects the temperature of the liquefied material gas. 1〇3 series temperature control circuit, 1〇4 series heater for material gas supply system pipe heating, and 1〇5 system for supplying liquefied material gas ❶1〇6 system 200928172 processing chamber and 1〇7 system liquefied material gas Store the cylinders. In Fig. 8(b), the liquefied material is covered with a heat insulating covering material from the storage cylinder 1经7 of the liquefied material gas to the mass flow controller ι〇ι, and from the mass flow controller to the processing chamber 1Q6. The entire surface of the gas supply pipe 1〇5 is protected from the influence of the surrounding environment, and the reliquefaction of the liquefied material gas is suppressed. As described above, by applying the heat insulating covering material 108 on the piping of the liquefied material gas supply system and stably supplying the liquefied material gas (for example, see Patent Document 1), it is possible to achieve stable film formation and pattern etching. of. In addition, because many hazardous gas systems having properties such as toxicity, flammability, and corrosivity are used as work for replacing their containers in liquefied gases such as semiconductor manufacturing process equipment, risks are often involved. For this reason, it is desirable to concentrate the cylinder cabinets involved in the replacement of containers in a room dedicated to some steel cabinets, which is separated from the room where the general worker works, and because of the safety relationship, the room is limited only Let the approved personnel enter. In fact, as shown in item 9, the cylinders 301 supplying most of the gas are concentrated in the room 306, and a method of supplying materials to the processing device 302 through the pipes 3〇7 from the room is generally used. Furthermore, as for the explosive gas system such as decane gas, the condensed gas system for the liquefied gas supplied is supplied through the pipeline to the production processing device in the production and processing building.

[Patent Document 1] The unexamined application of the present disclosure 1998 ΐ 2556 β [Summary of the Invention] [Explanation of the Invention] [Problems to be Solved by the Invention] 8 200928172 However, it has been checked that the following problem may occur on the above The liquefied gas supply device. (i) Limitation of the installation position of the low vapor pressure liquefied gas supply device In the liquefied gas supply device shown in Figs. 6 and 7, since the vapor pressure of the liquefied gas is too low, the liquefaction is carried out in a gaseous state through the through-pipe. The loss of pressure at the time of gas does not allow the liquefied gas to be supplied to the treatment device 302 with sufficient pressure, and there is always a problem of generating flow rate stability. For this reason, in addition to placing the cylinder cabinet 301 adjacent to the processing unit 302, there is no other option, and the liquefied gas supplied from the dedicated gas supply area is always transmitted through a long-distance pipeline as the other gases are independent of the production process 302. Have trouble coming. At present, there is no alternative to placing it in the placement of the processing device 3〇2, and there is an increasing demand from the viewpoint of the safety of the process worker and the management of the device utility. (11) Since the liquefied gas is reliquefied in the liquefied gas supply pipe, the supply is unstable. In a liquefied gas supply device used in, for example, a production process, it is desirable to place the cylinder cabinet in a room different from the processing device. However, because the liquefied gas supply pipe must cross different rooms, the pipe will pass through different ambient temperature areas, and it is difficult to maintain the entire pipe at an appropriate temperature to avoid reliquefaction of the liquefied gas. When the liquefied gas is reliquefied in the liquefied gas supply line, the reliquefied liquefied gas may completely or partially block the pipe, resulting in unstable supply pressure of the liquefied gas, and productivity due to unstable production process environment. Reduction (production in the semiconductor process (4) reduction), especially for low vapor pressure liquefied gases, 9 200928172 It is difficult to ensure the initial supply pressure and even more difficult to avoid reliquefaction in the supply pipeline 'and in Figure 8 ( In the liquefied gas supply device using the heat-insulating pipe shown in A), the work of installing the heat-insulating pipe and eliminating the inconsistent isolation becomes a problem 'and the liquefied gas supply using the heated pipe as shown in Fig. 8(B) In the device, an increase in the energy load installed along the pipe heated at a high temperature and its influence on the surrounding operating environment become a problem. (ill) Because of the corrosion of the pipe caused by the reliquefaction of the material in the supply pipe, many of the liquefied gas systems used in semiconductor manufacturing process equipment corrode the biomass, and when the liquefied gas in the supply pipe is reliquefied, the following may occur. problem. (iii-Ι) Reduced process yield due to corrosion of the pipeline. Corrosion products generated by corrosion in the pipeline may be contaminated by the transport of gaseous liquefied gases, for example, in semiconductor manufacturing processes, during processing to and from the Japanese yen. Metals contaminate impurities, resulting in defective semiconductor products and thus reduced productivity. (iii-2) Failure of the piping equipment due to corrosion products, as the corrosion products conveyed may cause failure of the components of the valve and mass flow controller as in the liquefied gas supply piping, and because each time these failures occur, replacement The reduced run time of the device caused by the operation of the pipe components 'causes the productivity of the production process to decrease. (iii-3) Shortened pipe life due to severe deterioration of the pipeline caused by the rot. If the pipe is corroded, the thickness of the pipe wall will decrease. Furthermore, the corrosion does not only proceed uniformly, but also locally in the perforation. Considering the corrosion of these 10 200928172 forms, the pipeline life is likely to be Ms. Yamaha, the j-rudder is greatly shortened, and these expensive internal pipes are effectively stupid, only in the semiconductor process. In terms of production costs, it will be a considerable burden. (w) Limitation of the flow rate of the liquefied gas supply due to insufficient (four) force supply in the liquefied gas supply system that vaporizes the liquefied gas and feeds it into the process in the gas phase' when the supply pipe becomes very long, because It is impossible to feed the liquefied gas with sufficient pressure due to the energy loss caused by the resistance of the pipeline.

of. Therefore, there is a problem that it is impossible to feed a liquefied gas at a flow rate desired by the process. This problem becomes a more serious obstacle when branching the gas supply from a steel cabinet to multiple processing units. Therefore, in a processing apparatus in which the liquefied gas flow rate becomes a critical factor, it is necessary to prepare a steel cylinder cabinet for each processing apparatus, and thus the equipment cost for that portion is increased. (v) Safety problem φ In the production processing apparatus shown in Fig. 9, although it is possible to ensure a certain degree of safety, because of the fact that the gas has a low vapor pressure, it is difficult to use a low vapor pressure liquefied gas cylinder. Range of pipes to supply gas, and in the liquefied gas competition system as shown in Figures 6 and 7, because of the fact that the gas is supplied in a saturated vapor state, the gas tends to reliquefy in the pipe, so the cylinder system It is placed in the same area as the processing device, which is the environment in which the general worker appears, and cannot be concerned about the disadvantages of safety. The main task is to ensure that the safety of such a dangerously toxic, flammable, corrosive, low vapor pressure liquefied gas is handled in the order of 200928172. The object of the present invention is to provide a liquefied gas supply device and supply, which can avoid the low vapor pressure liquefied gas supplied in the gas phase in the official passage, and stably supply the liquefied gas and the tight composition. The desired flow rate. This purpose is to provide a liquefied gas supply device with a high degree of danger and a corrosive gas, such as a semiconductor special material gas, to provide a stable flow rate. Supply is possible. ❹

[Means for Solving the Problem] The inventors of the invention reached the present invention after accumulating specialized research, and achieved the aforementioned object by the liquefied gas supply device and the supply method described below. The present invention relates to a liquefied gas supply device characterized by comprising a primary liquefied gas supply device having a container filled with a liquefied gas, a primary vaporization tool for vaporizing the liquefied gas filled with helium, and measuring the liquefied rolling body in the container a tool for the liquidus temperature To, and a tool for controlling the liquidus temperature τ〇 of the liquefied gas in the above container, a primary piping system having a primary conduit for supplying the liquefied gas in a gaseous state, and measuring a piping system including the primary conduit For the second-degree tool, see 'The wind has a reliquefaction tool that reliquefies the liquefied gas supplied in the gas phase - a secondary liquefied gas supply device, a storage tool that stores the liquefied gas in a liquid state, and is used for regasification to a liquid phase. a secondary vaporization tool for storing the liquefied gas, a tool for measuring the liquefaction temperature Tc in the reliquefaction tool, a tool for measuring the temperature Ts stored in the above-mentioned 12 200928172 storage tool, and measuring the liquid phase liquefaction in the above secondary vaporization tool a tool for gas temperature Tg, and controlling the liquefaction temperature described above

a tool for Tc, the above-described storage temperature Ts and the liquid phase liquefied gas temperature Tg, and a secondary piping system having a secondary pipe for supplying the liquefied gas to the gas consuming device in a gaseous state, and measuring the pipe including the secondary pipe A tool for the ambient temperature Tb inside the system. ❸ the liquefied gas supply device 'in which the liquefied gas system is supplied from the above-mentioned container through the pipe to the gas consuming device separated from the device in a gaseous state, and is characterized in that the liquefied gas temperature T 上述 of the liquid phase is controlled to be lower than The lowest temperature of the ambient temperature Ta, the liquefaction temperature Te or the storage temperature Ts is controlled to be lower than the liquefied gas temperature τ〇 of the liquid phase, and the liquefied gas temperature Tg of the liquid phase is controlled to be lower than the ambient temperature Tb. lowest temperature. Further, the present invention is a liquefied gas supply device characterized in that φ is supplied to a liquefied gas supply method for supplying a liquefied gas vaporized in a vessel to a separate gas consuming apparatus: (1) to be filled in the above-mentioned container a process for liquefied gas gasification once, (2) a process of supplying a gasified liquefied gas through a primary pipe system, (3) a process of reliquefying the liquefied gas supplied in a gas phase, (4) the reliquefaction a process in which a liquefied gas is stored in a liquid phase, (5) a process of secondary gasification of the liquid liquefied gas, and (6) secondary supply of the vaporized liquefied gas to the gas through a secondary piping system. And (7) a process for replenishing the liquid liquefied gas used in the process (5) with the liquefied gas stored in the process, and at the same time characterized by: controlling the temperature of the liquid liquefied gas in the process (〗) It is lower than the lowest temperature of the piping system in the above process (2), and is controlled at the liquefaction temperature of the above process (3) or the liquefaction temperature and the storage temperature in the above process (4). Below it is lower than the minimum temperature of the secondary conduit system in the above process (6) of the above process (1) the liquidus temperature of the liquefied gas, liquefied gas and liquid temperature control in the above process (5). In a liquefied gas supply device, such as, for example, a semiconductor manufacturing process, a stable supply of liquefied gas is required, and when a low vapor pressure liquefied gas is used, problems such as reliquefaction and pressure loss in the gas flow path have not been The conventional liquefied gas supply device is effectively processed. In view of these two problems, the present invention has re-vaporized the supplied vaporized liquefied gas by liquefying it in the vicinity of the treatment device as a gas consuming facility, and then feeds it into the treatment device in a gaseous state, so that Providing re-liquefaction in gas supply pipes (primary and secondary pipes) and ensuring gas from a vessel filled with liquefied gas (hereinafter referred to as "filling vessel") to the treatment device even when a low vapor pressure liquefied gas is used The liquefied gas supply device and the supply method of the phase supply pressure become possible. That is, re-liquefaction is avoided by performing a three-stage treatment of the liquefied gas - a heating process in a primary vaporization tool, a low temperature process in a reliquefaction tool, a heating process in 200928172, and a secondary vaporization tool. And it is ensured that gas supply pressures due to different processing energies become possible. Further, by the following method, it is possible to avoid reliquefaction in the gas supply pipe and ensure the gas supply pressure even under the temperature conditions limited by the installation conditions of the filled container and the processing means: the heating temperature set in the primary vaporization tool The temperature difference between the primary vaporization tool and the reliquefaction tool and the heating temperature set in the secondary heating tool correspond to the boiling point of the target liquefied gas (ie, the vapor pressure of the liquefied gas). For avoiding reliquefaction in liquefied gas supply and supply methods and ensuring gas supply pressure's temperature of primary vaporization tool, primary pipe (pipe system), reliquefaction tool, secondary vaporization tool, and secondary pipe (pipe system) Control is also important. The present invention makes it possible to avoid and ensure the gas supply pressure in the gas supply pipe even when the low vapor pressure liquefied gas (corresponding to the boiling point of the target liquefied gas) is supplied, by using the above 3-stage process Foundation, using a relationship between the following to control temperature: (a) - secondary vaporization tool and primary pipe, (b) primary vaporization tool and reliquefaction tool (storage tool), and (c) secondary vaporization tool and secondary pipe . That is, 'mainly from the viewpoint of avoiding reliquefaction in the gas supply pipe, (a) controlling the liquid phase liquefied gas in a primary vaporization tool (hereinafter referred to as "primary liquidus temperature,") is lower than the minimum of the primary piping system. Temperature, and (c) controlling the liquid phase liquefied gas in the secondary vaporization tool (hereinafter referred to as "secondary liquidus temperature,") lower than the minimum temperature of the secondary piping system; and mainly from the viewpoint of ensuring gas supply pressure See '(b) Controlling the liquefaction temperature in the reliquefaction tool below the primary liquidus temperature, or simultaneously controlling the storage temperature below the primary liquidus temperature. 15 200928172 Here, in the above-described process 〇) in the liquefied gas supply method described above, it is desirable to have the following functions; (1-1) cooling the above-mentioned container with a cooling source before the liquefied gas is supplied in a gaseous state, and Controlling the temperature of the liquid phase liquefied gas to be lower than the normal control temperature, and simultaneously lower than the minimum temperature and ambient temperature of the primary piping system, (1-2) supplying the liquefied gas in a gaseous state from the above container, and (1) 3) Heating the liquid phase liquefied gas which has been cooled by supplying the liquid phase liquefied gas in a gaseous state together with the heat source and controlling it at a normal temperature. The vapor pressure of the liquefied gas in the packed vessel is the saturated vapor pressure at the initially set ambient temperature. Meanwhile, in the liquefied gas supply device, when the gas supply of the liquefied gas starts, since the temperature of the vaporization heat accompanying the liquid phase vaporization starts to become low, "under these conditions, when the liquefied gas is supplied in a gaseous state, there is It is necessary to avoid reliquefaction in the gas supply line and to ensure that the supply pressure is disordered. In the present invention, the filling container is first cooled by a cooling source before the liquefied gas is supplied, so that the temperature of the liquid liquefied gas is lower than the normal control temperature, lower than the lowest temperature of the primary piping system, and lower than the ambient temperature. It is ensured that the re-liquefaction in the gas supply line is avoided even when the minimum temperature of the primary piping system is lower than the ambient temperature, and the supply pressure of the gas is ensured by subsequently increasing the temperature and moderately controlling the temperature. The present invention is the liquefied gas supply device as described above, characterized in that the above secondary liquefied gas supply device has a reliquefaction tool, at least two components serving as a storage tool and a secondary vaporization tool, and allowing the tools to be independently executed And at the same time can be converted from one tool to another 200928172 can. The present invention is a liquefied gas supply apparatus as described above, characterized in that it has at least two processing systems which allow the above-described processes (3) to (5) to be carried out in at least one of the processing systems by the above processes (3) and 4) a reliquefaction storage mode consisting of performing a revaporization mode containing the above process (5) in at least one other processing system, and alternately converting these after the combined process steps are maintained for a predetermined period of time Process system

In the case of Ο, the liquefied gas is continuously supplied in a gaseous state to the gas consuming equipment of a later stage. It is necessary to continuously and stably temporarily require a large volume. In the case of many various production processes, a liquefied gas is supplied in a milky state, and in some cases, a liquefied gas. In the case of a low vapor pressure liquefied gas, there is a limit to the volume of liquefied gas that can be fed from the filling vessel through a single primary pipe in a gaseous state, and there has been a "liquefied gas due to insufficient supply pressure" as described above. The problem of the supply flow limit". The use of the liquefied gas supply device i of the present invention has made it possible to respond to an emergency, which continuously stores a specified amount of liquefied gas, wherein the liquefied gas system is converted into a storage tool by a reliquefaction tool. a liquid phase, and ensuring that a specified amount of liquefied gas is present in the storage unit by a treatment system that reliquefies H and recharges the liquefied gas supplied from the filling vessel in a gaseous state, and liquefies the secondary gasification of the storage. The process of the gas ", (4) is independent in the body supply equipment. Continuous vaporization of the night rolling 17 200928172 becomes possible, and these functions are independent and simultaneously alternately convertible 'to be vaporized in the latter When the amount of the liquefied gas becomes small, the liquefied gas can be vaporized by being converted to the former. Therefore, even when a low vapor pressure liquefied gas is used, it is possible to provide a liquefied gas supply device which can quickly follow the change in the amount of liquefied gas required.

G The present invention is a liquefied gas supply device as described above, characterized in that any one of the tools constituting the component parts is in a function of converting the aforementioned component parts from a function as a reliquefaction tool and a storage tool to a function as a re-evaporation tool or Conversely, when the state of the function is ensured, the control temperature of each tool is pre-converted to the control temperature of each of the above functions. The functions of the reliquefaction tool and the storage tool and the function of the secondary vaporization tool independently process the liquefied gas, and as described above, their temperature control plays an important role at the same time. However, when these functions are alternately switched, if the liquefied gas treatment function is relatively easily converted, it is difficult to ensure rapid temperature conversion in each tool when the gas phase and the liquid phase coexist. By pre-adjusting the actual operating temperature of each tool to the control temperature of each function when the functions consisting of the components are converted into functions, the present invention enables a fast conversion of each It is possible to supply liquefied gas functionally and stably. The present invention is directed to a liquefied gas supply apparatus as described above, characterized by comprising a primary vaporization tool for supplying said stored liquid liquefied gas accompanying a secondary carrier gas in said secondary liquefied gas supply apparatus. In a manufacturing process such as a semiconductor process, a process gas to be supplied is used in some cases by blending a process a body with a low concentration of liquefied gas or a multi-dragon type liquefied gas 200928172. In these cases, it is also desirable in some cases not to supply the liquefied gas in a pure material manner, but rather to accompany it with the carrier gas in the secondary vaporization tool. In particular, when the process gas adjusted in the primary liquefied gas supply device is to be supplied to the treatment device in a gaseous state, it is difficult to avoid reliquefaction and ensure the stability of the flow rate and the stability of the supplied liquefied gas in the piping system. Compliant operation because in many cases the secondary liquefied gas supply equipment is installed close to the treatment unit and has safety and legal restrictions on the supply of liquefied gas from the above-mentioned primary liquefied gas supply to the secondary liquefied gas supply The variable supply system of the process gas is required, and it is possible to effectively use the excellent function of the present invention, which allows the liquid phase liquefied gas near the processing device to be supplied to the secondary liquefied gas supply device in a gaseous state, and provides further high flexibility. A liquefied gas supply device. The present invention is the liquefied gas supply device as described above, characterized in that the primary piping system is constituted by a branch line such that a plurality of the above-described secondary liquefied gas supply devices can be connected to one of the above-mentioned primary liquefied gas supply devices and allows simultaneous The liquefied gas from the above-mentioned primary liquefied gas supply device is supplied to some of the above secondary liquefied gas supply devices. Since various manufacturing processes including semiconductor processes operate under various conditions, in some cases, not only a variety of different liquefied gas supplies are required, but also their pressure conditions are different. In many of these cases, it is very difficult to correspond to these differences in a primary supply of a liquefied gas supply because changes in a primary piping system may be required. By using the liquefied gas supply device of the present invention, it is possible to simultaneously supply liquefied gas from a single liquefaction 19 200928172 gas supply device to a plurality of secondary liquefied gas supply devices by combining and connecting a primary piping system with a branch line The secondary liquefied gas supply device is supplied to a primary liquefied gas supply device, wherein each of the primary liquefied gas supply devices, the primary piping system, the secondary liquefied gas supply device, and the secondary piping system are highly independent. It is also possible to effectively use the technical effect of the present invention because the liquefied gas in all the primary piping systems can be supplied in a gaseous state, which can avoid reliquefaction in the gas supply piping and ensure the gas supply pressure.

[Effects of the Invention] As described above, using the liquefied gas supply device and the supply method of the present invention, it has become possible to provide a liquefied gas supply device and a supply method which avoid reliquefaction in the gas supply pipe and ensure the gas supply pressure. [Embodiment] [Best configuration for carrying out the invention] The configuration for carrying out the invention is described below in the drawings. The basic configuration here is to supply the liquefied gas in a gaseous state from the filling container through the pipe to the separated gas consuming device, the secondary liquefied gas supply device, and the system in the filling container are equipped once with the filling container. Vaporization tool, liquid temperature measurement tool temperature control tool,

A primary piping system with primary piping and ambient temperature measurement, with secondary liquefied gas supply equipment with reliquefaction tools and storage

Secondary vaporization tools, liquefaction temperature measurement I, storage temperature measurement, liquid phase temperature measurement tools, and temperature control 20, 200928172 tools in secondary, and 'flying tools', and with secondary piping and ambient temperature A secondary piping system for measuring tools for avoiding reliquefaction in the gas supply line and ensuring gas supply pressure from the filling vessel to the processing unit even when low vapor pressure liquefied gas is used. The liquidus temperature in the vessel is lower than the lowest temperature of the ambient temperature of the primary piping system, controlling the liquefaction temperature or liquefaction temperature and storage temperature to be lower than the liquidus temperature in the filling vessel, and controlling the secondary vaporization tool The liquidus temperature in the middle is lower than the lowest temperature of the secondary piping system. <Embodiment of Basic Composition of Liquefied Gas Supply Apparatus of the Present Invention> Fig. 1 is a view showing an embodiment of a basic composition of a liquefied gas supply apparatus (hereinafter referred to as "the present apparatus") of the present invention. The processing unit 5 of the consuming apparatus is provided with a dedicated liquefied gas chamber (hereinafter referred to as "liquefied gas supply chamber 1 〇,") separated by a chamber (hereinafter referred to as "clean room 3"'). a supply device 1, a secondary liquefied gas supply device 3 disposed adjacent to the processing device, a primary piping system 2 connected to the upper two, and a secondary conduit connected to the processing device 5 and the secondary liquefied gas supply device 3 The system 4 is composed of. In Fig. 1, the processing device 5 is disposed on the clean room layer 30a in the clean room 3, and the secondary liquefied gas supply device 3 is disposed on the inflator layer 3b. The liquefied gas system in the filling vessel u of the primary liquefied gas supply device 1 is vaporized in a primary vaporization tool lb. The gaseous liquefied gas system is fed in a gaseous state through a primary piping system 2 equipped with a primary conduit 2a to a secondary liquefied gas. Equipment 3. Gas-gas fed liquefied gas system by re-liquid 21 200928172 Chemical tool 3a in secondary liquefied gas supply equipment 3 _ reliquefied and then stored in liquid state in storage tool 3b ^ stored liquefied gas in secondary vaporization tool 3 c is gasified. The liquefied gas which is converted to a gaseous state is fed to the treatment device 5 in a gaseous state by the secondary piping system 4. The exhaust gas (including the fed liquefied gas) from the treatment device 5 is discharged through the exhaust treatment device 6 Since the operation of the filling container la delivered from the liquefied gas manufacturing station is completely and only completed in the liquefied gas supply chamber, the dangerous work of opening the pipe to the atmosphere in the clean room 5 can be avoided, wherein The clean room 5 is where the general operator operates and the treatment device 5 is placed. Therefore, it is possible to completely separate all liquefied gases, including low vapor pressure liquefied gases, from the clean room 30 (which is conventionally impossible) ), and providing a centralized supply 'greatly improved safety and work efficiency. [One liquefied gas supply equipment 1] In detail, the liquid shown in Figure 2 (A) The gas supply device 1 has a filling container u filled with a liquid liquefied gas inside the casing lz, and the casing 1z is equipped with a built-in temperature control system (not shown) The temperature of the liquefied gas in the filling vessel la is lowered to a cooling section 1 c such as a preset temperature of the two-person/li tool 1 b and the regenerative loss of vaporization heat when the liquefied gas is gassed and supplied, So that the liquefied gas temperature is not lower than the preset temperature heating section Id, and the heating section is. For the cooling section lc, if it can be from the bottom, side or % temperature of the filling container U ( It is generally 10 to 30 ° C) and is cooled by about 10. 〇: is sufficient, and it may provide, for example, a method of using a cooling medium from the cooling medium unit 6 as shown in Fig. 2(A) as a cooling source. For the heating section Id, it is possible 22 200928172 to provide a method for heating the bottom or sides of the filling tank 1 a using, for example, a method such as heating air or a lamp as a heat source. Here, the device is also equipped with a tool for measuring the liquid phase liquefied gas temperature To in the filling container (not shown) and a tool for controlling the liquid liquefied gas temperature T〇 in the filling container (not shown in the figure). ). Further, another feature that is different from the conventional method is that, in the desuperheating state and the method of maintaining the saturated vapor pressure to feed the liquefied gas, in the &amp; primary liquefied gas supply device 1 and the gas supply piping system, the control gas It is not necessary to supply a pressure regulating valve, and it is feasible to use a secondary liquefied gas supply device 3 to control the pressure; wherein the pressure regulating valve is not necessary because the liquefied gas is fed in a desuperheated state and the saturated vapor pressure is maintained. . In the frame of the liquefied gas supply device ,, it is also possible, as in the conventional method, to add a flushing gas (such as an inert gas such as nitrogen) into the pipe and the vent pipe to be installed in the device or to remove the filling. The container u is flushed to the portion of the filling container 1 and the primary pipe 2a, and is separated from the gas supply piping system in which the φ is connected to the primary pipe 2a. In addition, since the apparatus does not directly supply the liquefied gas to the processing apparatus 5 as the gas consuming apparatus, and only stores it once in the storage tool (storage tank) 3b of the secondary liquefied gas supply apparatus 3, it only needs to be stored. The filling is performed before the gas of the storage tool 3b is used up, regardless of the supply mode of the liquefied gas to the processing device 5. Therefore, it is not necessary to synchronize the supply with the consumption flow rate at the processing apparatus 5, and it is also unnecessary to prepare two containers for supplying gas in a gaseous state to ensure continuous supply when converting them, and a system of 1 is sufficient. 23 200928172 Since the pressure vessel delivered is also a pressure vessel that fills the vessel la and is transported back and forth between the liquefied gas manufacturing and the liquefied gas supply, it is difficult to directly place a temperature sensor inside the vessel to measure the temperature of the liquefied gas. . Here, by using a pressure sensor (not shown in the figure) at the outlet pipe, and using this pressure valve, the pressure of the vaporized liquefied gas can be monitored continuously, which is unique from the liquefied gas. "Saturated steam mill versus temperature, properties to calculate the liquidus temperature of the liquefied gas in the filling vessel la, and from a rapid and accurate measurement point of view, it is desirable to use this method. In the present device, it is desirable to take The feedback control method is such that the liquidus temperature obtained by the method is maintained at a preset temperature. Because the detection of the amount of liquefied gas remaining in the filling container la is generally carried out by the weighing element into a 'filled barrage', the load is carried on the load element if Above, and when the remaining amount becomes low, the filling container 1a is replaced. Fig. 2(B) shows a modified embodiment of the primary liquefied gas supply device 丄 in the apparatus. The basic composition is the same as Fig. 2(A), but The difference is that it has a carrier gas introduction section lg and a carrier gas introduction pipe lh which almost reaches the liquid phase liquefied gas bottom layer as a method of gasifying a liquid liquefied gas in the filling vessel 1a. Tool lb, it is possible to use a carrier gas to increase the milk supply pressure in addition to the vapor pressure at the liquid liquefied gas temperature, especially when the distance between the primary pipe 2a is long and the pressure loss is large. It is possible to supplement the pressure loss and adjust the forced gas supply pressure by using the carrier gas in addition to the gas supply pressure obtained from the difference between the vapor pressure of the primary vaporization tool lb and the vapor pressure of the reliquefaction tool 3a. Liquefied gas supply rate. It is also possible to avoid 24 200928172 because of the heat of vaporization and the temperature of the liquid phase temperature caused by bubbles to supply a highly stable liquefied gas. Furthermore,::: Liquefaction of gasification to the treatment unit 5 after gasification The amount of gas is because it is possible to set the flow rate to the storage tool 3b, so even when the liquefied gas is diluted with the == carrier gas, it is possible to ensure the required amount of stored gas by increasing the supply rate of the C body of the rare (four) knife. And re-liquefaction in the primary pipe 2a is avoided.

In the present apparatus, it is effective to use a liquefied gas accompanying the carrier gas, and not only a foaming method for introducing the carrier gas into the liquid phase gas as shown by the ® 2 (B), but also may be used. A method in which a carrier gas passes through a surface of a liquid phase gas or a method in which a carrier gas of a primary vaporization tool is diluted by additionally adding an X carrier gas. In this case, with regard to the reference temperature adjusted in the secondary liquefied gas supply device 1, for accuracy, it is desirable to use the dew point of the carrier gas to control rather than the temperature measured by each measuring tool. For carrier gases, it is generally desirable to use inert gases such as He, Ar and N2. However, when SiHCh is used as a liquefied gas in the case of an epitaxial wafer processing process, it is desirable to use a gas. [Secondary liquefied gas supply device 3] The secondary liquefied gas supply device 3 has a function of reliquefying the gaseous liquefied gas supplied from the secondary liquefied gas supply device 3 and the primary piping system 2, and temporarily storing it as a liquid liquefied gas ( The function, hereinafter referred to as "reliquefaction storage mode", and the function of regasifying the previously stored liquefied gas and supplying it to the processing device in a gaseous state (hereinafter referred to as "re-evaporation mode,"). Among them, it is desirable to have a 'reliquefaction storage mode, at least 25 200928172, which can be alternately operated and alternately converted as shown in Figures 3(A) and (B), because For the operating treatment device, the liquefied gas supply device is "large." Continue to ensure that the liquid in the storage tool 3b can be, the body #卩 and the supply of liquefied gas will be the desired force and flow rate will become m. More specifically, in Figure 3 (4), there are two storage tanks 3ia and Sichuan. The storage tank 3 la acts as a storage tank for the liquefied gas supplied from the secondary liquefied gas supply device via the reversing port 33a (open) in a gaseous state and reliquefied in the revaporizing tool 3 & The stored reliquefied liquefied gas ' is regasified and supplied to the gas via a reversing valve 33d (open). The action of the two storage tanks and 3ib allows the liquefied gas to the treatment unit 5 to be continuously supplied while switching the two functions. That is, when the storage tank 31a is in the "reliquefaction storage mode, the reversing valve 33 &amp; is open and the reversing valve 33c is closed, while the storage tank 31b is in the "re-evaporation mode" and its commutation The valve 33b is closed and the reversing valve 33d is opened. Conversely, when the crucible storage tank 31b is in the "reliquefaction storage mode, the reversing valve 33b is opened and the reversing valve 33d is closed, and stored. The groove 3 la is in the "re-evaporation mode", and its reversing valve 33a is closed and the reversing valve 33c is opened. The reversing valves 33a to 33d in the 'open state' in Fig. 3(a) are displayed in white, and those in the closed state are displayed in black. The two storage tanks 3 la and 3 lb are controlled to alternately switch between the two functions in the "reliquefaction storage mode," and "re-evaporation mode", and the liquefied gas can be continuously supplied to the processing device 5. When in the "re-evaporation mode," the amount of liquid remaining in the storage tank 31b is lower than a preset degree, a transition occurs. As for the detection of the remaining amount in the tank 26 200928172, the tank is generally weighed, and thus The two tanks are placed on the load cell 32. In more detail, the performance of the storage tank 31a in the "reliquefaction storage mode" is as follows. When the liquefied gas is fed from the primary liquefied gas supply device in a gaseous state, When the liquefaction tool 3a is cooled and reliquefied, the liquid phase liquefied gas system is gradually stored in the storage tool 3b. When the stored amount reaches a predetermined level in this manner, the reversing valve in the storage tank 31 &amp;33&amp; will automatically turn off φ, and at the same time the temperature control temperature setting will automatically switch from the previous reliquefaction setting to the regasification setting. This avoids the pressure shortage in the conversion mode, which is caused by In the reliquefaction storage mode, before switching to the "re-evaporation mode", the temperature setting in the "reliquefaction storage mode, the side standby mode liquid temperature is switched to the "re-evaporation mode" beforehand. The storage tanks 3 la and 3 lb have a temperature control function to lower the temperature and maintain the temperature to a certain extent. That is, there is a tool for measuring the liquefaction temperature Tc of the reliquefaction tool, and measuring the storage temperature Ts of the storage tool 3b 〇 Tool, a tool for measuring the liquid phase liquefied gas temperature Tg of the secondary vaporization tool 3e, and a tool for controlling the liquefaction temperature Tc, the storage temperature Ts, and the liquid phase liquefied gas temperature Tg (not shown), so that The liquefied gas supplied from the liquefied gas supply device 1 is lower than sufficient to be reliquefied, and then controlled to be regasified to be fed to the treatment device 5 in a gaseous state. The temperature control of the storage tanks 31a and 31b in the secondary liquefied gas supply device 3 is designed to control the temperature depending on the operation modes of the storage tanks 3 i a and 3 1 b, respectively. That is, it is desirable that in the "reliquefaction storage mode, the temperature control of the storage tank 31a is feedback-controlled so that the side surface of the storage tank 3i is at a preset temperature, and the "re-evaporation mode" The temperature control of the storage tank 31b is completed by continuously monitoring the pressure, which is calculated by using the outlet pipe pressure sensor 34b in the credit slot 3 lb and using the "re-evaporation mode" pressure value. From "saturated vapor pressure versus temperature", the liquid phase temperature of the characteristic map, which is unique to the liquefied gas system, allows the calculated liquid temperature to be fed back at a predetermined level, as in a filling vessel of a liquefied gas supply device 1 a temperature control. ❺ Although the above explains the use of the storage tanks 31 &amp; and 31b, equipped with the function of switching between the "reliquefaction storage mode" and the "re-evaporation mode", the use of the device is not limited to these cases, and In the 're-liquefaction storage mode' and the "re-evaporation mode, the batch transfer of a single storage tank 3 la, or the arrangement of the storage tank 31a exclusive to the "reliquefaction storage mode," and the storage tank 31b exclusive to the "re-evaporation mode" ,, the situation of being connected in series is also possible. Fig. 3(B) shows a variant embodiment of the secondary liquefied gas supply device 3 in the present apparatus. The basic composition is the same as that of Fig. 3 (A), but differs in that the flow controller 35, the steering valves 36a and 36b, and the carrier gas introduction pipe lh which is close to the bottom layer of the liquid phase liquefied gas are stored as liquid re-gasification. A method of storing liquefied gases in tanks 31a and 31b. As a secondary vaporization tool, it is possible to use a carrier gas 'to force a gas supply to improve the supply pressure of the gas in addition to the vapor pressure of the liquid phase liquefied gas temperature. Particularly when the distance of the secondary pipe 4a is long and the pressure loss is large, it is possible to obtain the gas obtained by the difference from the vapor pressure of the primary vaporization tool 1b and the vapor pressure of the reliquefaction tool 3a. In addition to the supply pressure, the carrier gas is also used to adjust the forced gas supply pressure to supplement the pressure loss and adjust the supply rate of the liquefied gas 28 200928172. Further, in the case where it is required to supply a low-concentration liquefied gas to the treatment device 5, or when a plurality of types of liquefied gases are mixed and used, by supplying an inert gas as a carrier gas accompanying the liquefied gas, it is possible to provide a corresponding Liquefied gas supply under operating conditions and a highly versatile liquefied gas supply. At this time, the flow rate control of the carrier gas can be used to control the amount of liquefied gas accompanying the carrier gas (generally referred to as "collection rate"). That is, when the liquid helium temperature is controlled to an almost fixed condition, it is possible to increase the collection rate by controlling the mass flow controller 35 to increase the carrier gas flow rate. Furthermore, if there is no limitation on the amount of the liquefied gas accompanying the carrier gas, it is also possible to use a method of causing the carrier gas to bypass the surface of the liquid phase surface instead of introducing the carrier gas into the liquid phase as shown in Fig. 3(b). A method of foaming a gas. It is desirable to use a HeW-like gas or &amp; as a carrier gas carrier, as illustrated in the above [primary liquefied gas supply equipment]. [Primary gas supply piping system 2] between the St gas supply device 1 and the secondary liquefied gas supply device 3...a, that is, the liquefied gas supply flow rate of the primary piping system Outside the S-channel diameter, there is no special specification, and it is sufficient for the t-body liquefied gas supply pipe. Furthermore, in the prior art, in order to avoid re-liquefaction of the tools required in the primary tube 1 ^ ^ Ra ^ ^ 2 &amp;, like heat and heat, as described above, because many low vapor =, The point is also very important. However, the 10m, 、, liquefied gas system is corrosive and toxic, and is generally used through the internal surface of the pipe (SUS). In the unloaded steel body supply piping system 2 which is reinforced on the inner surface of the -4, it is desirable to measure the ambient temperature Ta of the system 29 200928172, and estimate the lower limit of the fluctuation (4) of the ambient temperature Ta of the primary gas supply piping system 2, The control temperature of the liquid phase liquefied gas temperature 7 中 in the liquefied gas supply device 1 is set to be lower than the lower limit. [Secondary gas supply piping system 4] This is a secondary piping 4a between the secondary liquefied gas supply apparatus 3 and the processing apparatus 5 which is a gas consuming apparatus, that is, a secondary piping system*. As in the case of the © sub-pipe 2a, there is no special specification other than the e-channel diameter having a suitable liquefied gas supply flow rate, and it is generally sufficient for the semiconductor liquefied gas supply pipe. Furthermore, in the prior art, tools required to avoid reliquefaction in the pipeline, such as thermal insulation and heating means, are not required at all. Materials such as sus are used in secondary pipelines, as in the case of primary piping systems, and it is desirable to control the temperature by measuring the ambient temperature of the secondary camp system 4. [Operation method of this unit] ® In order to use the function described above effectively, it is desirable to operate the unit with the following procedures. (1) a process of re-liquefying the liquefied gas filled in the filling vessel la (2) a process of reliquefying the liquefied gas supplied in a gaseous state by a process (3) of supplying the vaporized liquefied gas through the primary pipe 2a once (4) The process of reliquefying the liquefied liquefied gas in a liquid state (5) The process of secondary gasification of the liquid liquefied gas (6) through the secondary pipe 4a to supply the vaporized liquefied gas to the second place 200928172 Process (7) of the device 5 is supplemented with a liquid liquefied gas used in the process (5) using a liquefied liquid stored in the process (4). With these steps, it is possible, even when using a low vapor pressure liquefied gas. Avoid re-liquefaction of the gas supply pipe (in both the primary pipe 2a and the secondary pipe buckle), ensure the gas pressure from the filling container la to the processing device 5, and stabilize the desired flow rate of the supply. The liquefied gas supplied in a gaseous state close to the treatment device 5 is forced to liquefy once it is once liquefied, and then supplied to the treatment device 5. &lt;Temperature Control of the Present Device&gt; The apparatus is characterized in that the temperature (primary liquidus temperature) τ 液相 of the liquid liquefied gas in the filling vessel 13 is controlled to be lower than the temperature of the primary conduit system 2 The lowest temperature, the liquefaction temperature Tc in the secondary liquefied gas supply device 3 or the above storage temperature Ts is lower than the liquid phase liquefied gas temperature T〇, and the liquid phase liquefied gas temperature Tg (secondary liquidus temperature) is lower than Week Φ around the minimum temperature of the Tb. Thereafter, the preset primary liquid phase temperature is referred to as "Tsetl", and the preset liquefaction temperature (the side surface temperature at the bottom of the storage tank 31a in the "reliquefaction storage mode") is referred to as "Tset2,,, and The secondary vaporization temperature (the liquidus temperature of the storage tank 31b in the recrystallization mode) is referred to as "Tset3". Using conventional supply methods, because of reliquefaction and insufficient pressure supply problems, it is difficult to supply low vapor pressure liquefied gases through long distance pipelines, especially when using low vapor pressure liquefied gases, where the force supply system The pressure difference Δ P from the primary liquefied gas supply device 1 to the processing device 5 is referred to. Conversely, the device makes it possible to set the liquefied gas flow through a pipe between the primary liquefied gas supply device 1 and the secondary liquefied gas supply device 3, respectively, from the pressure required by the processing device 31 200928172 The pressure of 2a is installed in the middle of the gas supply pipe by introducing a so-called "liquefied gas relay section", that is, the secondary liquefied gas supply device 3. Because of this type, the problem of reliquefaction in long-distance pipelines and the problem of insufficient pressure in long-distance pipelines can be simultaneously eliminated by lowering the saturated vapor temperature of the liquefied gas flowing in the primary conduit 2a to not in the pipeline. The degree of reliquefaction.

More specifically, if the liquidus temperature (TsetD of the primary liquefied gas supply device ( (for example, 10 〇 is set lower than the ambient temperature Ta of any part of the primary pipe (for example, 15 to 30 〇C), the primary pipe is avoided. Further, in the case of 2a, it is possible to adjust the temperature of the storage tank 3U in the second liquefied gas supply n and the reliquefaction tank 3 (7), for example, at 〇C, and the control is about The gas force of about 2 〇 to 30 kPa is obtained in ±2 〇匸. The m function can effectively use the function of the device. As for the re-vaporization storage tank 31b, the liquidus temperature (D) is set. The clock f is at a temperature of, for example, 15 °c', that is, higher than the temperature at which Tset2 is reliquefied, and at the same time: : in the 2Γ device 5, the ambient temperature of any part of the gas supply pipe is set to "5: 〇, and is controlled at ± Within 2 ° 'to ensure that the supply of equipment required for the treatment of about 30 ~ riding pa is possible. : That is, as shown in Figure 4, at this temperature control system degree (- secondary tube two?: liquid The phase temperature T is at least warmer than the surrounding. Thereby, the large-scale ^m, Ta) is 3 °cc °c to carry out the steam-k la official road. The surface of the heat flow in the pipe Yin 32 200928172 :: in the direction of the liquefied gas from the outside of the pipe to the gasification of the gas. The tool of liquefied gas at the π temperature in the saturated vapor state will continue to flow from the pipe 2 through the flow process The pipe takes heat 4 to move to the superheated steam path again, and thus re-liquefaction of the liquefied gas in the relay pipe as in the conventional method does not occur.

❹ When preparing a liquefied gas supply device, it is placed in a room different from the clean room 30 in which the treatment device 5 is placed. For example, it is assumed that BY is the temperature of the ambient temperature of the primary pipe la and the low temperature is sufficient. &amp; Once the pipeline la /, will flow through the production process building. In this case, if the liquidus temperature in the filling container la of the primary liquefied gas supply device 1 is set and accurately controlled to a temperature sufficiently lower than 15 or approximately ι〇% ± 2 °C, the above target Can be implemented. Further, in the present apparatus, it is preferred to start the supply of the liquefied gas in accordance with the following operations (丨丨) to G-3). (1-1) making the liquefied gas temperature of the liquid phase lower than the normal control temperature and lower than the minimum temperature and ambient temperature of the primary piping system by cooling the above by the cooling source before the initial liquefied gas supply Fill the container. (1-2) The liquefied gas is supplied in a gaseous state from the above-described filling container. (1-3) The liquid phase liquefied gas whose gas supply has been further cooled is heated by a heat source to be controlled to a normal control temperature. That is, by following these steps, it is ensured that the reliquefaction system in the supply line is avoided, even when the minimum temperature of the primary piping system is lower than the ambient temperature and because of subsequent temperature rise and proper temperature control, by first Before the liquefied gas begins to supply, the above-mentioned filling vessel 33 200928172 is cooled by a cooling source to a temperature lower than the normal control temperature and lower than the minimum temperature and ambient temperature of the primary piping system to ensure the gas supply pressure. [With the example] Reliquefaction in the pipeline can be avoided, and the pressure difference ΔΡ at both ends of the pipe connected to the primary liquefied gas supply device 1 and the secondary liquefied gas supply device 3 can be ensured at the reported level. The preset temperatures of Tset1, Tset2, and Tset3 of each type of liquefied gas set in each of the tanks shown in Table 1. In Table 1, the ambient temperature Ta is passed through the temperature of the primary pipe 2a between the primary liquefied gas supply device 1 and the secondary liquefied gas supply device 3; the ambient temperature Tb is at the secondary liquefied gas supply device 3 and the processing device The temperature of the secondary pipe 4a between 5. As shown in 纟i, since the ambient temperatures Ta and Tb fluctuate with position, time, and season, the system setting takes into account the lowest expected temperature in the surrounding environment of the low-vapor waste liquefied gas supply equipment. ❹ 34 200928172 [Table i] Preset temperature preset temperature (basic setting) Recommended actual setting (reference) Tset 1 is set at a temperature lower than the lowest setting of the ambient temperature Ta by 3 °C, considering the edge of re-liquefaction risk avoidance, it is recommended It is set to a temperature lower than Ta by 5. 0 Tset 2 _______—- Set at 5 °C lower than Tsetl. It is recommended to set the temperature to a temperature as low as 1 〇 0 C from Tsetl to save the liquefied gas supply device. A liquid phase material that is discharged to a liquefied gas supply device. Tset 3 is set to be at most 3 °C lower than the lowest setting of the ambient temperature Tb. Since the ambient temperature is low and the pressure supplied to the processing device is reduced when Tset3 is too low, it is recommended to set the temperature to the ambient temperature. The minimum setting of Tb is as low as 3 ° C, where the ambient temperature Tb is the temperature in the clean room. The y-side table shows an example of analysis of a preset temperature when using the apparatus of the present invention (see Fig. 3) for various types of low vapor pressure liquefied gases. (1) When SiH2Cl2 was used Φ (1 -1) condition The analysis was carried out under the conditions shown in Table 2. 35 200928172 [Table 2]

SiH2Cl2 primary liquefied gas supply equipment primary pipeline secondary liquefied gas supply equipment (when in reliquefaction storage mode) preset temperature at the time of pressure ambient temperature: &gt; 15 °C preset temperature at that time pressure 10 °c 110 kPa -- ----------------&gt; o°c 75 kPa treatment unit secondary pipeline secondary liquefied gas supply equipment (when in re-evaporation mode) desired pressure in the unit Ambient temperature: &gt;20 °C Preset temperature at the time of pressure &gt;50kPa &gt;20 °C «---------------- 15 °C 130 kPa (1-2) Analysis As a result, no re-liquefaction occurs in the primary pipe 2a, and sufficient pressure AP (35 kPa) can be secured to ensure supply to the processing device 5. Further, no re-liquefaction occurs in the secondary pipe 4a, and sufficient pressure (80 kPa) can be secured to ensure supply to the processing device 5. (2) When CLF3 was used (2-1) Conditions The analysis was performed under the conditions shown in Table 3. 36 200928172 [Table 3] C1F3 Primary liquefied gas supply equipment Primary pipeline secondary liquefied gas supply equipment (when in reliquefaction storage mode) Preset temperature at the time of pressure ambient temperature: &gt; 15 °C Preset temperature at that time pressure 10 °c 110 kPa ------------------&gt; o°c 65 kPa treatment unit secondary pipe secondary liquefied gas supply equipment (when in re-evaporation mode) Temperature around the temperature inside the device: &gt;20 °C Preset temperature at the time of pressure &gt;50 kPa &gt;20°C «---------------- 15 °C 115 kPa

(2-2) Analysis results No re-liquefaction occurred in the primary pipe 2a, and sufficient pressure ΔΡ (30 kPa) was secured to ensure supply to the processing apparatus 5. Further, no re-liquefaction occurs in the secondary pipe 4a, and sufficient pressure (65 kPa) is secured to ensure supply to the processing apparatus 5. (3) When BCL3 was used (3-1) Conditions The analysis was performed under the conditions shown in Table 4. 37 200928172 [Table 4] BCh primary liquefied gas supply equipment primary pipeline secondary liquefied gas supply equipment (when in reliquefaction storage mode) Preset temperature at the time of pressure surrounding temperature: &gt; 15 °C Preset temperature at that time pressure 10 °c 90 kPa ------------------&gt; o°c 60 kPa treatment unit secondary pipe secondary liquefied gas supply equipment (when in re-evaporation mode) Temperature around the temperature inside the device: &gt;20 °C Preset temperature at the time of pressure &gt;50kPa &gt;20 °C «--------------------- ----- 15 °C llOkPa (3-2) analysis results did not reliquefy in the primary pipe 2a, and sufficient pressure △ P (30 kPa) was ensured to ensure the supply to the processing device 5. Further, no reliquefaction occurs in the secondary pipe 4a, and sufficient pressure (60 kPa) can be secured to ensure supply to the processing apparatus 5. (4) When HF was used (4-1) Conditions The analysis was performed under the conditions shown in Table 5. 38 200928172 [Table 5]

HF primary liquefied gas supply equipment primary pipeline secondary liquefied gas supply equipment (when in reliquefaction storage mode) Preset temperature at the time of pressure surrounding temperature: &gt; 15 °C Preset temperature at that time pressure 10 °c 75 kPa --- ---------------&gt; o°c 50kPa treatment unit secondary pipeline secondary liquefied gas supply equipment (when in re-evaporation mode) desired pressure within the temperature of the device :&gt;20 °C Preset temperature at the time of pressure&gt;50kPa &gt;20 °C «-------------------- 15 °C 90 kPa (4-2 The analysis results that no re-liquefaction occurred in the primary pipe 2a, and sufficient pressure AP (25 kPa) was ensured to ensure supply to the processing device 5. Further, no re-liquefaction occurs in the secondary pipe 4a, and sufficient pressure (40 kPa) can be secured to ensure supply to the processing device 5. These types of gases are used as examples for illustrative applications; there are other similar applications for other low vapor pressure liquefied gases. Furthermore, the secondary liquefied gas supply device 3 is used together with the third storage tank 31c (not shown); when the storage tank 3 1 c is in the standby mode, the temperature of the storage tank 3 1 c in the standby mode can be controlled. Controlling to control the fluctuation of the supply pressure when switching from the standby mode to the re-vaporization mode by making it the same temperature as the re-vaporization mode, and controlling the temperature/pressure of the liquefied gas in the storage tank 3 lc of the standby mode, 39 200928172 so that it becomes the same temperature/pressure as in the storage tank 3 lb of the revaporization mode. [Other Embodiments of the Liquefied Gas Supply Apparatus of the Present Invention] The embodiment of the above configuration illustrates a case where a primary liquefied gas supply apparatus is connected to a secondary liquefied gas supply apparatus; however, the present invention enables establishment by branching A liquefied gas supply device (hereinafter referred to as "device 2") composed of a primary pipe is made possible, and can simultaneously supply liquefied gas from a single liquefied gas supply device to a plurality of secondary liquefied gas supply devices, which is A secondary liquefied gas supply device is connected to a primary liquefied gas supply device. As illustrated in Fig. 5, the apparatus 2 is a specific example in which three secondary liquefied gas supply apparatuses 3x, 3y and 3z are connected to a primary liquefied gas supply apparatus. In this specific example, the 'secondary liquefied gas supply devices 3χ, 3y and 3z can be placed in the same clean room area, which have the same ventilation temperature, or they can be placed in different clean rooms 30x, 30y and 30z. Areas with different ventilation temperatures. As explained above, also in the device 2, the gas supply pressures at the secondary liquefied gas supply devices 3x, 3y, and 3z can be set independently of each other with the gas supply pressure of the primary liquefied gas supply device. In 2, the primary liquefied gas supply device 丨, the primary pipe 2a, the secondary liquefied gas supply devices 3x, 3y, and 3z, and the secondary piping systems 4χ, 4丫, and 4z are all independent, and thus the primary piping system 2 can be assembled. There is a branch, and the liquefied gas from the primary liquefied gas supply device 1 can be supplied under different conditions by operating the secondary liquefied gas supply devices 3x, 3y, and 3z. Example 200928172 For example, various liquefied gases with controlled--current name a*^ to the processing device 5χ, Γ二气5 body supply pressure can be supplied 5y and 5Ζ. Furthermore, it is also possible to supply secondary gas to the treatment devices 5x, 5y and 5z under various strips. ‘ [possible industrial application]

It is mainly a description of a supply device and a supply method for supplying a special wire having a special degree of filament production in a +conductor production or for use in an FD body; however, the present invention is not limited to the liquefied gas used for these electronic products, It can be applied to liquefied gases used in various processes. It is particularly useful for manufacturing processes that require the supply of low vapor pressure liquefied gases. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] Fig. 1 is a view showing an example of a basic configuration of a liquefied gas supply apparatus of the present invention. Fig. 2 is an explanatory view showing a primary liquefied gas supply apparatus of the liquefied gas supply apparatus of the present invention. Fig. 3 is an explanatory view for explaining a secondary liquefied gas supply apparatus of the liquefied gas supply apparatus of the present invention. Fig. 4 is an explanatory view for explaining a method of setting a temperature of a liquefied gas supply device of the present invention. Fig. 5 is an explanatory view for explaining another configuration example of the liquefied gas supply apparatus of the present invention. [Fig. 6] is a diagram illustrating the future development of a gas supply device. [Fig. 7] is a diagram illustrating the future development of a gas supply device. [Fig. 8] is a diagram illustrating the future development of a gas supply device. 200928172 [Fig. 9] is a diagram illustrating the future development of a gas supply device. [Main component symbol description] 1 : Primary liquefied gas supply device 1 a : Filling container 1 b : - Secondary vaporization tool 1 c : Cooling section 1 d. Heating section 1 e : Cooling medium unit © 1 f : Load weight lg : carrier gas introduction section lh: carrier gas introduction pipe 1 z : frame housing 2 of secondary liquefied gas supply device 1 : secondary pipe system 2 a : - secondary pipe 3 : secondary liquefied gas supply device 3 a : reliquefaction tool ® 3b : Storage tool 3 c : Secondary vaporization tool 3x : Secondary liquefied gas supply device 3y for device 2 : Secondary liquefied gas supply device for device 2 3z : Secondary liquefied gas supply device for device 2 : Secondary pipe System 4a: secondary pipe 4x: secondary pipe system 42 of device 2 200928172 4y: secondary pipe system 4z of device 2: secondary pipe system 5 of device 2: processing device 5x: processing device 5y: processing device 5z: processing Device 6: exhaust treatment device 10: liquefied gas supply room

30: clean room 30a: clean room layer 30b: inflator layer 30x: clean room 30y: clean room 30z: clean room 31a: storage tank 31b: storage tank 32: load cell 33a: reversing valve 33b: Reversing valve 33c: Reversing valve 33d: Reversing valve 34b: Pressure sensor 35: Mass flow controller 3 6a: Reversing valve 43 200928172 36b: Reversing valve 101: Mass flow controller 102: Temperature sensor 103: temperature control circuit 104: heater 105: liquefied material gas supply pipe 106: processing chamber

107: liquefied material gas storage cylinder 108: heat insulation covering material 300: clean room 301: cylinder cabinet 302: processing device 303: layer 304: layer 305: lattice layer 3 06: inflator layer 307: pipe T a . Ambient temperature

Tb. ambient temperature T c . liquefaction temperature

Tg : liquid liquefied gas temperature T 〇 : liquid phase liquefied gas temperature

Tsetl: preset primary liquidus temperature

Tset2: preset liquefaction temperature 44 200928172

Tset3: secondary vaporization temperature

45

Claims (1)

200928172 X. Patent application scope: i A liquefied gas supply device characterized by comprising a primary liquefied gas supply device having a container filled with a liquefied gas, a vaporization tool for gasifying the filled liquefied gas, and measuring in the above container a tool for liquefying the gas phase temperature To and a tool for controlling the liquidus temperature To of the liquefied gas in the above-mentioned container, having a primary pipe 以, which is supplied once in a gaseous state with the liquefied gas, and measuring The tool for the internal ambient temperature of the pipeline system of the official road, the secondary liquefied gas supply device for reliquefying the liquefied gas supplied in the gas phase, and the storage device for storing the liquefied gas in a liquid state for regasification a secondary vaporization tool for storing a liquefied gas in a liquid phase, a tool for measuring a liquefaction temperature Tc in the above reliquefaction tool, a tool for measuring a temperature Ts stored in the storage tool, and measuring a liquid phase liquefaction in the secondary vaporization tool a tool for controlling the gas temperature Tg, and controlling the liquefaction temperature O Tc and the storage temperature Ts a tool for the liquid phase liquefied gas temperature Tg, and a secondary piping system having a primary passage for supplying the liquefied gas to the gas consuming apparatus in a gaseous state, and a tool for measuring a temperature Tb around the inside of the piping system including the secondary piping, The liquefied gas supply device, wherein the liquefied gas system is supplied from the above-mentioned container through the pipe in a gaseous state to the gas consuming device separated from the device, and is characterized in that the liquefied gas temperature of the liquid phase is controlled to be lower than the surrounding The lowest temperature of the temperature Ta, the liquefaction temperature Tc or the storage temperature Ts is controlled to be lower than the liquefied gas temperature τ〇 of the liquid phase, and the liquefied gas temperature Tg of the 46 200928172 liquid phase is controlled to be lower than the ambient temperature Tb. The lowest temperature. _ , according to the liquefied gas invitation supply device of claim 1 of the patent scope, characterized in that the above secondary liquefied gas supply device has a reliquefaction tool, at least two components serving as a storage tool and a secondary vaporization tool, and Allows you to perform functions that are independently executed by the tool and that can be converted from one tool to another at the same time. 3. According to the towel, please select the liquefied gas for the second item (4), which is characterized in that the function of the constitutive part is used as the reliquefaction tool and the storage tool. As a function of the re-evaporation tool or vice versa, the state of the function can be ensured, and the control degree of each tool is previously converted to the control temperature of each of the above-mentioned y-forces. 4. The liquefied gas supply device according to the above-mentioned Patent No. 2 or 3, characterized in that it has a secondary vaporization tool for supplying the above-mentioned medium accompanying the secondary carrier gas in the above secondary liquefied gas supply device. Store liquid phase liquefied gas. 5. The liquefied gas supply device according to any one of claims 1, 2 or 3 of the present invention, characterized in that the above-mentioned secondary piping system is constituted by branch lines, so that a plurality of the above-mentioned secondary liquefied gas supply devices can be connected to the above One of the primary liquefied gas supply devices, and allows simultaneous supply of the liquefied gas from the above-described primary liquefied gas supply device to some of the above secondary liquefied gas supply devices. 6. The liquefied gas supply device according to claim 4, characterized in that the primary piping system is constituted by a branch line, so that a plurality of the above-mentioned 47 200928172 secondary liquefied gas supply devices can be connected to the above-mentioned primary liquefied gas supply device. One, and allows simultaneous supply of the liquefied gas from the above-described primary liquefied gas supply device to some of the above secondary liquefied gas supply devices. 7. A liquefied gas supply device, characterized in that in a liquefied gas supply method for supplying a liquefied gas gasified in a vessel to a separate gas consuming apparatus, there is: (1) liquefied gas to be filled in the above vessel once The gasification process, (2) the D process of supplying the vaporized liquefied gas through the primary pipeline system once, ' (3) the process of reliquefying the liquefied gas supplied in the gas phase, (4) reliquefying the gas a process for storing a liquefied gas in a liquid phase, (5) a process for secondary gasification of the liquid liquefied gas, and (6) a process of supplying the vaporized liquefied gas to the gas consuming device twice through the secondary piping system, And (7) a process for replenishing the liquid liquefied gas used in the process (5) with the liquefied gas stored in the process (4), and simultaneously characterized by: controlling the temperature of the liquid liquefied gas in the above process (1) Lowering it to the lowest temperature of the primary piping system of the above process (2), controlling the liquefaction temperature of the above process (3) or the liquefaction temperature and the storage temperature of the above process (4) to make it lower than Liquidus temperature of said liquefied gas process (1), and the control in the above process (5) so that the liquidus temperature of the liquefied gas is below the minimum temperature of the secondary conduit system in the above process (6) of. 48 200928172 8_ The liquefied gas supply device according to claim 7 of the patent application, characterized in that it has the following operations: (1-1) cooling the above-mentioned barn with a cooling source and controlling the liquid phase before the liquefied gas is supplied in a gaseous state The temperature of the liquefied gas is made lower than the normal control temperature' and at the same time lower than the minimum temperature and ambient temperature of the primary piping system, (1 - 2) supplying the liquefied gas in a gaseous state from the above container, and (1-3) heating The liquid phase liquefied gas that has been cooled is supplied by the liquid phase liquefied gas in a gaseous state together with the heat source and controlled at a normal control temperature. 9. The liquefied gas supply device according to claim 7 or 8, characterized in that it has at least two processing systems which allow said processes (3) to (5) to be carried out in at least one of said processing systems a reliquefaction storage mode consisting of (3) and (4), performing a re-evaporation mode containing the above process (5) in at least one other processing system, and after maintaining the combined process steps for a predetermined period of time, While alternately converting these processing systems, the liquefied gas is continuously supplied in a gaseous state to the gas consuming equipment of a later stage. Eleven, circle: as the next page 49