TW200924599A - Solid state drive (SSD) with open top and bottom covers - Google Patents

Solid state drive (SSD) with open top and bottom covers Download PDF

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Publication number
TW200924599A
TW200924599A TW97112170A TW97112170A TW200924599A TW 200924599 A TW200924599 A TW 200924599A TW 97112170 A TW97112170 A TW 97112170A TW 97112170 A TW97112170 A TW 97112170A TW 200924599 A TW200924599 A TW 200924599A
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Taiwan
Prior art keywords
screw hole
housing
brackets
circuit board
frame
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TW97112170A
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Chinese (zh)
Inventor
Siew S Hiew
Jim Ni
Abraham Chih Kang Ma
qi-jin Li
Nan Nan
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Super Talent Electronics Inc
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Priority claimed from US11/929,917 external-priority patent/US7517231B2/en
Application filed by Super Talent Electronics Inc filed Critical Super Talent Electronics Inc
Publication of TW200924599A publication Critical patent/TW200924599A/en

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Abstract

A solid state drive (SSD) device includes a printed-circuit board assembly (PCBA), a connector mounted on the circuit board, an open-frame support-type housing including first and second parallel elongated brackets extending along opposing peripheral edges of said circuit board, each bracket including a first connecting structure for securing the circuit board to the housing, and a second connecting structure for connecting the housing to an internal rack frame of a host system. The open-frame support type housing does not include a top cover and a bottom cover, whereby both of said opposing first and second surfaces are exposed by first and second openings. The housing includes optional end rails that form a box-like frame. The elongated brackets are formed using die-cast metal, stamped metal, or molded plastic with copper posts. Optional clamp-type brackets clamp along side edges of the PCBA.

Description

200924599 九、發明說明: 本發明係共同審理中之中請案的部分延伸案(CIp),此些共同審理中 的申請案包含有2007年3月7號申請之美國專利11/683292 “ΤΜη此付 Drive with 2-Piece-Casing and Ground Pin Standoff to Reduce ESD Damage to Stacked PCBA’s”、2006年10月u號申請之美國專利 11/309’843”Thin Flash-Hard-Drive With Tw〇_piece 作 ii 月 號申請之美_m_0,887,,Light_WeightFlashHardDrive With Plastic Frame11。 【發明所屬之技術領域】 本發明係有關-種快閃記憶體固態硬碟的製作方法,特別是指一種具 有開放式框木支撐型態封裝與單一或雙層堆疊印刷電路板之快閃 記憶體固態硬碟的製作方法。 【先前技術】 口匕硬碟(SSD)疋-種記紐資料儲存元件,其利制態記憶體(例 )·夬門至匕、的#揮發性§己憶體”或者同步動態隨機處理記憶體 ⑽AM) ”揮發性記憶體,,)來儲存長存資料(㈣耐她)。施 可以取代傳統的硬碟咖(Hard Disk Drive)是因為腿機械轉動部分造 成較It的咳與寫速度的原因。在娜中缺少轉盤與機械元件大幅度地改善 電、干擾物體衝擊性與可靠度。然而,相較於傳統的飼服電動機硬 碟是較容易被靜電放電損害與咖她,_的紀錄表面是利用具有高· 抵抗的磁騎料卿成,所以它的抗靜電放電雜比㈣。本發明提供接 地點給位於PBCA上之接地所魏子料至較大_地板,財腿上較 200924599 弱的零件翻傷前提絲麵靜储職。錄高翻 Γ實際容置酬,熱也變成綱蝴—個2= 的電子元件傾向下,優良的熱傳遞加上低重量的封裝或者殼體將獲 有鑑於此,本發明遂針對對具有重量輕且能夠提高靜電荷防護盘改盖 SSD⑹慨,提出一種_物额輯咖固態 硬碟(SSD) ’以有效克服上述之該等問題。 【發明内容】 本發明之主要目的在提供一種包含有一開放式_框架型態殼體(例如沒 有頂或底蓋)繩、《⑽)元件,伽购-或者兩個堆 登_電路板總成⑽A)之第一與第二托架。本發明之開放式-框架型態 成體精由赠蓋謂A (s)表面咖,因此她於财技術之娜具 有低成本與重餘的優點’纽改散空氣雌,以提高咖上的電子元件 冷卻效率,藉此增進娜蝴運作。因為它的重量較輕,本發明非常適 合應用於可攜錢置。職式__型驗_外麵不是重要的部分,因 為娜讀是嵌設社要裝置彳_記型制、桌面與其它需要記憶體趙 動器的可攜式電子機件的底座内部。更者,開放式—框架型態殼體是具有較 佳的熱對流,續供f子元件在高度運作情況下齡卻環境。更者,藉由 /頂^底蓋來減少製作成本,以減少殼體材料。此外,開放式一框架型態 /V又體因為無須使用螺絲組配,可快速的生產製作。 之另目的,此處所描述的每一具體施例包含有用以防護esd 知傷的轉,其係提供一由咖腿至不同開放式—框架支樓型態殼體金 200924599 屬部的電流路徑與由每-殼體至具有SSD裝設於上的主系統之内部機架框 架(internal rack frame)的電流路徑。依據本發明之另一目的電流路 徑是在組配/銳步料建立(例如侧第—獅或其它細件將pcBA與 殼體間連接的組輯程中,與_第二獅或其_件連接殼體與主系統 之内部機架框架的組配過程)。 依據具體實施例第-系列,每一開放式_框架支撐型態殼體是一壓禱金 屬結構’其包含有整合連接至第一與第二托架的端圍欄,以形成—圍繞腿 的矩形開π框架。每-該第—與第二平行細長托架與該第—與第二端圍搁 包含有- L形凸緣’其具有-水平凸緣部與—垂直延伸至水平凸緣部的垂 直凸緣部。連接ϋ是定位於聰的末端邊緣並且設置在端關之一的開口 間隙上。支撐柱是設置在該托架之垂直部_表面並且界定出第一螺孔, 第-螺孔在組配時係對準位於PCBA的第二觀,並且第一螺絲是插設穿過 第二螺孔並且插設人第-螺孔,⑽PGBA_至殼體。某些螺孔具有連接 至PCBA接地板的金屬;裒,藉此插設第一螺絲的動作提供介於殼體與舰 間的電流路徑,以減少咖對PCBA的損傷機會。每—垂直凸緣部具有一平 坦外部層面(outward-faeing)表面’其界定—第三螺孔,藉此殼體連接 至主系統的内部機架框架。 依據具體實補另-㈣’第—與第二平行細長托架包含有本質上相 同的分離結構,每-包含有讀結構與觀,以支職連接至舰,藉此 第-與第二平行細長托架是藉由舰與第—螺絲緊密連接。第—與第二托 架是壓鑄金縣者壓印/摺疊金顧者具有金屬插人_瓣結構,以提供 200924599 ESD防護。在—些且 籍制―於二:㈣二托架包含有上方與下方 容、特點及蝴,嫩咖她之目的' 技術内 【實施方式】 藝::::=:件的,下_述是__技 的方向性叫;:,::機:Γ咖解這裡所描述 前面,,、”背面,,、”直立,,,”、τ部,,、”向下,,、” 水平都僅是提供-個相對位置的 述並不心絕對的準則。除此之外’,,整個連接,,與’,整個模子,,是 用來描述早-拉子或者機械結構兩部分間的關係,並且與,,連接,,或者” 結合”(沒有整個這個修飾字眼的)做區隔,”連接,,或者”結俨指出 兩個了利用如黏者劑、扣件、鉗子或者可移動的接頭來做接合的可分開結 構。對具體實施例的各種修錦職悉該項技藝者而^_易知的,紅 魏所定_斯咖獅細。批,她咖限制於具體 實知例所錄或者贿,但符合這裡簡示师理麵娜徵的廣泛範嘴。 發明人瞭_職SSDS是_賦補更射#,但SSDS可能遭受 靜電放電⑽)而產生可靠賴題。特別是#積體電路(IG)特徵尺寸持 續縮小’以產生高記憶體密度,ESD損傷的敏感性將增加。因此,這裡所描 述的每-具體實施例包含有用以避免ESD損傷的工具,藉由提供—由覆蓋 ICs之SSD PCBA至本發明之數個開放式—框架支撑型態殼體的電流路徑與由 開放式框架支擇型態殼體至SSD依附的主機系統内部機架框架的電流路 200924599 徑。依照本發明之另一觀點,電流路徑是在裝配/相嵌過程建立(例如連接 PCBA與殼體間是在_第—個螺絲或者其它扣件方法裝配時建立,連接殼 體與主紐_部機_架是在_第二獅或其它扣件方式時建立)。 第KA)與1⑻圖是3.5” SATA(串行趟嘗⑹咖戰techn〇_ a饱ch贈)型態之SSD元件⑽的元件分解透視圖與組合後透視圖,此 SSD元件議包含有一印刷電路板總成⑽Α) ιι〇,其具有陣列的記憶體 晶片⑽、控制器晶片125與一嵌設於其上的連接器13〇與一開齡框架 支撐型態殼體150,如本發明之第—具體實施例所示。請在參閱第}⑷ 圖的上方部分侧說含有—電路板⑴具有相職的上與下表面⑴ 與113。電路板1U為_現有的印刷電路板技術 置於不具傳導性材料(請)上或者層晴線(圖中未 可在各種赌於這裡的零件(如記憶體晶請與控制器晶片卿間轉 由連接器130將訊號傳遞至主機系統C_ (參閱第i⑻圖)的接觸墊 m内進行傳輸。電路板ηι的周圍邊緣是裁切或者用其它方式形成數個校 準溝槽(蝴115,細下列的描述方式校準電路板m容置於殼體胁 數個螺絲孔m是_路板lu的設定位置,以易於經由)螺絲 則印刷㈣m⑽。♦她㈣包含有一經由 ^祕電^接至電路板lu的—接地面(圖中未示)的金屬環㈤㈣, 错此樹撕輸請_简㈣ 是敌設於電触lu,錢方絲 片動含有非揮發性(例如㈣技術。記憶體晶 、忍)圮憶體晶胞或者揮發性(例如同 200924599 步動態«處理記髓⑽AM))記舰晶胞,其是㈣有聽組裝與操 作。雖然财未示…綠衫_加記㈣^⑽可裝設於絲面⑴。 也是依據現有的規範,控制器晶片125包含有—輸入/輸出介面電路,以與 主機系統CPU 50 (第1⑻圖所示)以及一處理單元形成接面以存取記 憶體晶片120,來對接收自輸人/輸出介面電路的主機祕cp腳指令做出 回應。控制器晶片125也可包含有-鎖相迴路與一暫存器或者緩衝器迴路。 PCBA110是SATA SSD元件100的核心電子小組合。除此之外,記憶體晶片 120與控晶片125、被動元件與其它邏輯元件以及積體電路(圖中未示) 是設置在表面112與113的單-或者雙面上。在揭露的實施射,連接器 130是-標準22-獅SATA型態連接器,其經由引線131電性連接至控制 器125,引線131是依據現有實施方式利用表面黏著技術(SMT)坪接至電 路板111的接雕1U上。這個實酬也可以制在與整合電子式驅動介 ® (IDE) ^ PCIE (Peripheral Component Interconnect Express) ^ 器型態的接合。連接器130是丧設在電路板ln上,因此它的插座135可 經由如標準麟(®巾未示)連接至主系統〇>。開放式_框架支撐型態 殼體150是利用金屬壓鑄所形成的整合金屬框架。金屬壓禱是一種製程方 法’其係將熔齡屬注人模具巾,並在模具巾翻,並且賴開啟模具或 者將模具部分由壓鑄模型移除。任何適合的金屬都可以用來製作殼體15〇 , 鋁因為它的質地較輕與相對較低的熔點,因此是一個典型的選擇材料。殼 體150的表面也可塗成黑色或者彩色。另外,最外層可有—電鑛金屬薄層, 如電鍍鉻在殼體150的表面。開放式—框架支撐殼體15〇包含有相對的第一 200924599 與第二側圍欄(長形托架)151A與151B,以及第-與第二端_ 152A與 152B,第一、第二側圍攔(長形托架)151A、151B與第一、第二端圍攔152A、 152B整合連接在末端,以形成矩形條架結構環繞在腿u的周邊緣,當 如第1 (B)圖所示PCBA110嵌設於蓋體150上時。每一側圍攔與端圍欄(例 如關152A)包含有-具有一底(水平)部15礼與一垂直延伸至底部15礼 上(垂直)部153U的L型凸緣。當PCBA110嵌設於蓋體150時,如第1⑻ 圖所不’圍攔152A末端界定出-可容納連接器13〇的開放間隙154。依照 本發明之—目的’導件柱服與校準柱155B由底(水平)凸緣部15礼延 伸並且設於側圍攔15U與151B的上(垂直)凸緣部ι53υ内表面上。當 PCBA110嵌設於蓋體;[50時,如第丨(B)圖所示,導件柱155A與校準柱π邪 分別接合内部對應電路板m的校準溝#115,藉此提供一自動機制,以精 準設置PCBA11G,以減少裝配時間與減小製程成本。依據另—觀點,殼體 150也包含有數個支撐柱156,其每一個具有一螺孔157,以形成第一連接 結構,供鎖固PCBA110至殼體150。支撐柱156由底(垂直)凸緣部巧孔 沿著侧櫊151A與151B的上(垂直)凸緣部153U的内表面延伸,但是較 導件柱155A與校準柱155B短。如第1 (A)所示,裝配時支擇柱156接合 與支撐電路板Π1的對應部分,因此電路板lu的螺孔117是與螺孔157 對準,藉此有助於便於將印刷電路板Π1利用螺絲1〇7連接至殼體丨 田 鎖固至殼體15G時,需注意的是支揮柱156的高度是基於下列的選擇, PCBA110維持在一水平(例如水平)方向與上表面122與開放間隙154邊緣 同水平高度並且大致上位於側圍襴151A與151B的上(垂直)部153u與端 12 200924599 圍攔驗與娜的中心位置。讀注意的是螺物穿過環螺孔⑽, 以提㈣嫌於麵1G蝴15_電子路#。舰本發明之其 它目的’每-側關⑸A與㈣的上外表面(垂直)部的螺絲謂 是形成連接蓋體⑽至主齡統5G之内部機架框架55的第 就如在第1⑻騎示之,獅⑽是穿設過位於内部機架節5上賴 應孔58並且至螺絲孔158,藉此快速且便利的裝設置主機5〇上。腿娜 元件⑽的配件是如第丨(A)圖所示並且全部組配後是如第丨⑻圖所示。 依照本發明之另-目的,殼體⑽不包含有一上蓋與底蓋,藉此pa綱 的兩表面112與113可以顯露於對應上的上方開口⑽與下方開口服,其 係各自界定介於側圍攔脇與151Β與介於端圍攔152α與ΐ52β間。藉由 省略頂與底蓋’殼體15〇相較於f知具有較低成本與難的重量,並 且改善通風’以更有效率地冷卻記與控批# 125,因此增進 SSD元件1〇〇的)·生月b。也需注意連接器^3〇是設置於上方開口服上(例如 開口間隙154連接開口 165) ’藉此讓連接器13〇能夠簡單便利地在組配步 驟則連接至PCBA11G上。依據另-目的,每—較高的導件柱腿所界定的 -螺孔159係為了易於連接至其它元件(圖中未示),其可組配置至主系統 的内部機架框架55。在第1⑻圖所示之完整組配後,可在殼體或者PCBA2l〇 的空白(未使用)11域雜上採雷射標籤或印刷賊(®巾未示)的隨意 條碼、組配日期碼、記憶體大小、製造商與其它製作過程資料。第2 (A)200924599 IX. INSTRUCTIONS: The present invention is a partial extension (CIp) of the co-practice, and the co-practice application includes US Patent 11/683292 filed on March 7, 2007. Pay with 2-Piece-Casing and Ground Pin Standoff to Reduce ESD Damage to Stacked PCBA's", US Patent 11/309'843" applied in October 2006, "Thin Flash-Hard-Drive With Tw〇_piece" The beauty of the monthly application _m_0, 887,, Light_WeightFlashHardDrive With Plastic Frame 11. [Technical Field] The present invention relates to a method for manufacturing a flash memory solid state hard disk, and more particularly to an open frame wood support type A method of manufacturing a flash memory solid-state hard disk with a single-layer or double-layer stacked printed circuit board. [Prior Art] A hard disk (SSD) device - a data storage component for a state-of-the-art memory Example)·夬门至匕,# volatile § 己 体 ” or synchronous dynamic random processing memory (10) AM) “volatile memory,”) to store long-term data ((4) resistant to her) Replacing the traditional Hard Disk Drive is due to the fact that the mechanical rotation of the leg causes the coughing and writing speed of It. In the absence of the turntable and mechanical components, the impact and reliability of the electric and interference objects are greatly improved. However, compared to the traditional feeding motor hard disk is easier to be damaged by electrostatic discharge with her, the record surface of the _ is to use the magnetic resistance of the high resistance, so its anti-static discharge ratio (four). The invention provides a grounding point to the grounding place of the grounding place on the PBCA to the larger floor, and the part of the financial leg which is weaker than the 200924599 is the condition of the wire surface static storage. The record height is turned into the actual capacity, and the heat becomes In view of this, the excellent heat transfer plus low-weight package or housing will be obtained. In view of this, the present invention is directed to the SSD (6) which has a light weight and can improve the electrostatic charge protection plate. A material solid-state hard disk (SSD) is proposed to effectively overcome the above problems. SUMMARY OF THE INVENTION The main object of the present invention is to provide an open-frame type housing (example) There is no top or bottom cover) rope, "(10)) component, gamma- or two stacks of the first and second brackets of the circuit board assembly (10) A). The open-frame type adult body of the present invention is The gift cover is A (s) surface coffee, so she has the advantage of low cost and heavy weight in the technology of the financial technology, the new air conditioner to improve the cooling efficiency of the electronic components on the coffee, thereby enhancing the operation of the butterfly. Because of its light weight, the present invention is well suited for use in portable money. The job type __ type test _ is not an important part outside, because the reading is the interior of the base of the portable electronic device that needs to be installed in the _ _ type system, the desktop and other memory devices. Moreover, the open-frame type housing has better thermal convection, and the continuation of the f sub-element is at an age of high operating conditions. Moreover, the manufacturing cost is reduced by the / top bottom cover to reduce the housing material. In addition, the open-frame type /V is also available for rapid production because it does not require the use of screws. Alternatively, each of the specific embodiments described herein includes a turn that is useful to protect against esd, which provides a current path from the leg of the coffee to the different open-frame-type building shells of the 200924599 genus. The current path from each housing to the internal rack frame of the main system on which the SSD is mounted. According to another object of the present invention, the current path is set in the assembly/rear material (for example, the side lion or other fine parts connecting the pcBA to the housing, and the _ second lion or its _ piece The assembly process of connecting the housing to the internal frame frame of the main system). According to a first embodiment of the embodiment, each open frame support profile housing is a puncture metal structure that includes an end fence integrally connected to the first and second brackets to form a rectangle around the legs Open the π frame. Each of the first and second parallel elongated brackets and the first and second end brackets include an -L-shaped flange having a horizontal flange portion and a vertical flange extending perpendicularly to the horizontal flange portion unit. The port is positioned at the end edge of the Cong and is placed on the opening gap of one of the ends. The support post is disposed on a vertical portion of the bracket and defines a first screw hole, the first screw hole is aligned with the second view at the PCBA when assembled, and the first screw is inserted through the second Screw the hole and insert the human screw hole, (10) PGBA_ to the housing. Some of the tapped holes have metal attached to the PCBA ground plane; 裒, the action of interposing the first screw provides a current path between the housing and the ship to reduce the chance of damage to the PCBA. Each of the vertical flange portions has a flat outward-faeing surface which defines a third screw hole whereby the housing is coupled to the inner frame frame of the main system. According to the specific implementation - (4) 'the first and second parallel elongated brackets contain essentially the same separation structure, each containing a read structure and view, connected to the ship by branch, whereby the first and second parallel The slender bracket is tightly connected by the ship and the first screw. The first and second brackets are die-cast gold county embossed/folded gold guests with a metal insert _ petal structure to provide 200924599 ESD protection. In the case of - and the system - two: (four) two brackets contain the upper and lower capacity, features and butterflies, the purpose of tender coffee her 'technical' [implementation] art::::=: pieces, the next _ Is the direction of __ technology called;:,:: machine: Γ 解 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里 这里It is only a guideline that provides a relative position and is not absolutely absolute. In addition, ', the whole connection, and ', the whole mold, is used to describe the between the early-pull or the mechanical structure. Relationship, and with,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The joints are used to make the separable structure of the joint. For the various embodiments of the specific embodiment, the skill is well known to the skilled person, and the red Wei is determined by the singer. The batch is limited to specific examples. Recorded or bribed, but in line with the general statement of the teacher's face in the slogan. The inventor _ job SSDS is _ Fu Bujima #, but SSDS may suffer from electrostatic discharge (10)) and produce reliable problems. In particular, the #IGO circuit (IG) feature size continues to shrink 'to produce high memory density, the sensitivity of ESD damage will increase. Therefore, Each of the specific embodiments described herein includes tools useful to avoid ESD damage by providing - a current path from the SSD PCBA covering the ICs to the several open-frame support type housings of the present invention The frame supports the type of housing to the current path of the internal frame frame of the host system to which the SSD is attached. In accordance with another aspect of the present invention, the current path is established during the assembly/intercalation process (eg, between the connection PCBA and the housing) Established when the _first screw or other fastener method is assembled, the connection housing and the main _ _ machine _ frame is established in the _ second lion or other fastener mode.) KA) and 1 (8) is 3.5" SATA (serial 趟 ( (6) 咖 tech 6 a a a a a a a a ) S S S S S S S S S S S S S S S S S S SATA SATA SATA SATA SATA SATA SATA SATA 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷Its array of memories ⑽ wafer, and a controller chip 125 embedded thereon 13〇 connector with a housing opening patterns instar support frame 150, as in the first invention of the present - the specific embodiment illustrated. Please refer to the upper part of the figure on the side of the figure (4) to say that the circuit board (1) has the upper and lower surfaces (1) and 113. The board 1U is _ existing printed circuit board technology is placed on the non-conducting material (please) or the layer of clear lines (the parts in the picture are not gambling here (such as memory crystal and controller wafers) The signal is transmitted by the connector 130 to the contact pad m of the host system C_ (refer to the figure i (8)) for transmission. The peripheral edge of the circuit board ηι is cut or otherwise formed into several calibration grooves (butterfly 115, fine below) Description: The calibration circuit board m is placed in the housing. Several screw holes m are set to the position of the road board lu, so that it can be easily printed via the screw. (4) m (10). ♦ She (4) contains a cable to the circuit board. Lu - the metal ring of the grounding surface (not shown) (five) (four), the wrong tree tearing please _ Jane (four) is the enemy set in the electric touch lu, the money side wire movement contains non-volatile (such as (four) technology. Memory crystal , forbearance) 圮 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 体 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( (10) can be installed on the silk surface (1). It is also controlled according to the existing specifications. The wafer 125 includes an input/output interface circuit for forming a junction with the host system CPU 50 (shown in FIG. 1(8)) and a processing unit to access the memory chip 120 for receiving the input/output interface circuit. The host cp foot command responds. The controller chip 125 may also include a phase-locked loop and a register or buffer loop. The PCBA 110 is a core electronic small combination of the SATA SSD component 100. In addition, the memory The body wafer 120 and the control wafer 125, the passive components and other logic components, and the integrated circuitry (not shown) are disposed on the single or both sides of the surfaces 112 and 113. In the disclosed embodiment, the connector 130 is - The standard 22-lion SATA type connector is electrically connected to the controller 125 via a lead 131. The lead 131 is spliced to the splicing 1U of the circuit board 111 by surface adhesion technology (SMT) according to the prior embodiment. The remuneration can also be made in conjunction with the integrated electronic driver interface (IDE) ^ PCIE (Peripheral Component Interconnect Express). The connector 130 is placed on the circuit board ln, so that its socket 135 can be connected via Zhun Lin (® towel not shown) is connected to the main system 〇. The open _ frame support type housing 150 is an integrated metal frame formed by metal die casting. Metal pressure prayer is a process method It is a man-made mold towel, and it is turned over in the mold towel, and the mold is opened or the mold part is removed from the die-casting model. Any suitable metal can be used to make the casing 15〇, because of its lighter texture and relative The low melting point is therefore a typical choice. The surface of the housing 150 can also be painted black or colored. Alternatively, the outermost layer can have a thin layer of electro-mineral metal, such as chrome-plated on the surface of the housing 150. The open-frame support housing 15 includes an opposing first 200924599 and second side rails (long brackets 151A and 151B), and first and second ends 152A and 152B, first and second side panels Barriers (long brackets) 151A, 151B are integrally joined to the first and second end fences 152A, 152B at the ends to form a rectangular strip structure surrounding the peripheral edge of the leg u, as shown in Figure 1 (B) When the PCBA 110 is embedded in the cover 150. Each side fence and end fence (e.g., 152A) includes an L-shaped flange having a bottom (horizontal) portion 15 and a vertical extension to the bottom 15 (vertical) portion 153U. When the PCBA 110 is embedded in the cover 150, as shown in Fig. 1(8), the end of the enclosure 152A defines an open gap 154 that can accommodate the connector 13A. The guide column and the calibration post 155B in accordance with the present invention are extended from the bottom (horizontal) flange portion 15 and are provided on the inner surface of the upper (vertical) flange portion ι 53 of the side fences 15U and 151B. When the PCBA 110 is embedded in the cover body; [50], as shown in the figure (B), the guide post 155A and the calibration column π are respectively engaged with the calibration groove #115 of the internal corresponding circuit board m, thereby providing an automatic mechanism. To accurately set PCBA11G to reduce assembly time and reduce process cost. According to another aspect, the housing 150 also includes a plurality of support posts 156 each having a threaded bore 157 to form a first attachment structure for locking the PCBA 110 to the housing 150. The support post 156 extends from the bottom (vertical) flange portion along the inner surface of the upper (vertical) flange portion 153U of the side turns 151A and 151B, but is shorter than the guide post 155B. As shown in FIG. 1(A), the supporting post 156 is engaged with the corresponding portion of the supporting circuit board Π1 during assembly, so that the screw hole 117 of the circuit board lu is aligned with the screw hole 157, thereby facilitating the convenience of the printed circuit. When the plate 1 is connected to the casing by the screw 1〇7 to the casing 15G, it should be noted that the height of the support column 156 is based on the following selection, and the PCBA 110 is maintained in a horizontal (e.g., horizontal) direction and an upper surface 122. It is at the same level as the edge of the open gap 154 and is located substantially at the upper (vertical) portion 153u and the end 12 200924599 of the side sills 151A and 151B. It is noted that the screw passes through the ring screw hole (10), so as to mention (4) the face 1G butterfly 15_electronic road #. Other purposes of the invention of the present invention are as follows: the screw of the upper outer surface (vertical) portion of each of the side closures (5) A and (4) is said to form the inner frame frame 55 of the connection cover body (10) to the main age system 5G as in the first (8) ride. In other words, the lion (10) is placed over the inner frame section 5 to the hole 58 and to the screw hole 158, thereby quickly and conveniently mounting the main unit 5 。. The accessories of the leg element (10) are as shown in the figure (A) and all are assembled as shown in the figure (8). According to another aspect of the present invention, the housing (10) does not include an upper cover and a bottom cover, whereby the two surfaces 112 and 113 of the pa-type can be exposed to the corresponding upper opening (10) and the lower opening, respectively, which are defined on the side. The flank is between 151 and the end of the 152α and ΐ52β. By omitting the top and bottom cover 'housing 15', it is known that it has lower cost and harder weight, and the ventilation is improved to more efficiently cool the control batch #125, thus enhancing the SSD element 1〇〇 )) birth month b. It is also noted that the connector ^3 is disposed on the upper opening garment (e.g., the opening gap 154 is connected to the opening 165) to thereby allow the connector 13A to be easily and conveniently connected to the PCBA 11G in the assembly step. Depending on the other purpose, the screw holes 159 defined by each of the upper guide legs are for easy connection to other components (not shown) which can be assembled to the internal frame frame 55 of the main system. After the complete assembly shown in Figure 1(8), the laser barcode or the random barcode of the printed thief (not shown) or the date code can be used on the blank (unused) 11 area of the casing or PCBA2〇. , memory size, manufacturer and other production process data. 2 (A)

'、2 ⑻圖疋 1.3 IDE (Integrated Drive Electronics)型態的 SSD 元件200的元件分解示意圖與組配透視圖,ssd元件220包含有_ pcba21〇. 13 200924599 其嵌設有一記憶體晶片220陣列 '一控制晶片225與一連接器230,以及一 開放式-框架支樓型態殼體250 ’依據本發明之第二具體實施例。pCBA2i〇 與PCBA110 (先前所述)相似,並且包含有一電路板211,其具有相對的上 方與下方表面212與213。螺絲孔217是定義為在適當位置穿過電路板2h, 以便於利用(第一)螺絲將印刷電路板211連接至殼體250。連接器是 標準40-接腳的IDE型態連接器,其係電性連接至控制器225,其連接方式 如同先前所述。一主/從交換器227是設置於電路板211的邊緣相對於連接 器230,使易於手動設置SSD元件200於主動或者被動操作型態。這具體實 施例也可用於接和SATA與PCIE連接器型態。 開放式-框架支撐型態殼體250是一整合壓鑄金屬框架,其包含有相對 的第一、第二側圍攔(細長的托架)251A、251B與第一、第二端圍攔252A、 252B ’以形成一矩型似框架結構。側圍攔251A、251B與端圍欄252A包含 有一 L形凸緣’ L形凸緣具有一下(水平的)凸緣部253L並且上方(垂直) 凸緣部253U垂直延伸至下凸緣部253L。圍攔252A端點僅包含有下凸緣部 253L並且定義出一以供容納連接器23〇的開口間隙254。側圍欄25u、251b 與端圍欄252A定義出一大小係可緊緊容納pCBA21〇的矩形開口。 殼體250包含有數個支撐柱256,其每一個具有一螺絲孔257形成於 上,以形成可供鎖固PCBA210至殼體250的第一連接結構。支撐柱256由 下方(水平)凸緣部253L沿著側圍攔251A、251B的上方(垂直)凸緣部 253U的内表面延伸。如同第2⑷圖所示,支撐柱256容納並支撐電路板 211的對應部,在裳配過程中,因此電路板211的螺絲孔217是對準螺絲孔 14 200924599 257,藉此易於利用螺絲207將電路板211連接至殼體250。 每一側圍欄251A、251B的上方(垂直)部253U的外表面形成有螺孔 ' 258,以形成連接殼體250至主系統(圖中未示)内部機架框架的第二連接 - 結構,而連接方式係相似於先前所述。IDE SSD元件200的組配是如第£ (A)圖所示並且組配後的元件整體外觀係如第2 (B)圖所示。如同先前的 具體實施例,殼體250並不包含有頂蓋與底蓋,藉此pGB删的兩個表面 212、213由相互對應的上方開口 260與下方開口 265顯露出,上方開口 26〇 與下方開口撕是各自界定於讎攔251A、㈣與賴攔252A、2卿間。 第2 (B)圖所示之完整組配後頂面’可在殼體或者pCM21〇的空白(未使 用)區域黏貼上採雷射標籤或印刷標籤(圖中未示)猶意條碼、組配日 期碼、記憶體大小、製造商與其它製作過程資料。 第3 (A)與3⑻®是依據本發明之第三具體實施例之18”咖型 態的SSD兀件300 &元件分解示意圖與組配透視圖,娜元件3〇〇包含有— PCBA310 ’其上嵌設有一記憶體晶片32〇陣列、一控制晶片⑽中未示)與 -連接H 330,以及-開放式-框架支撐型態殼體35〇。pcB刪是相似於 PCBA110 (先前所述)並且包含有一具有相對的上與下表面312與⑽的電 路板311。螺絲孔317是定義為在適纽置穿過電路板3n,以便於利用(第 -)螺絲307將印刷電路板311連接至殼體·。連接器33〇是標準22物 的SATA型態連接器,其係電性連接至控制器325,而連接方式如同先前所0 述。這具體實施例也可用於接和IDE與PCIE連接器型態。 開放式-框蚊樓型態殼體350是一整合壓缚金屬框架,其包含有相對 200924599 的第一、第二側圍攔(細長的托架)351A、351B與第一、第二端圍攔352A、 352B,以开/成矩型似框架結構。側關251A、251B與端圍欄252A包含 有一具有一上(水平的)凸緣部353U與一垂直延伸至上凸緣部祁邪的下 方(垂直)凸緣部353L的L形凸緣。侧圍攔351A、351B與端圍欄352A、 352B定義出一大小係可緊緊容納PCBA310的矩形開口,並且端圍欄352β定 義一用以容納連接器330的開口間隙354。', 2 (8) Figure IDE 1.3 IDE (Integrated Drive Electronics) type SSD component 200 component decomposition diagram and assembly perspective, ssd component 220 contains _ pcba21 〇. 13 200924599 It is embedded with a memory chip 220 array ' A control wafer 225 and a connector 230, and an open-frame abutment type housing 250' are in accordance with a second embodiment of the present invention. pCBA2i is similar to PCBA 110 (described previously) and includes a circuit board 211 having opposing upper and lower surfaces 212 and 213. The screw hole 217 is defined to pass through the circuit board 2h at an appropriate position in order to connect the printed circuit board 211 to the housing 250 with the (first) screw. The connector is a standard 40-pin IDE type connector that is electrically coupled to controller 225 in a manner similar to that previously described. A master/slave switch 227 is disposed at the edge of the circuit board 211 with respect to the connector 230, making it easy to manually set the SSD component 200 in an active or passive mode of operation. This embodiment can also be used for connection and SATA and PCIE connector types. The open-frame support profile housing 250 is an integrated die cast metal frame that includes opposing first and second side fences (elongated brackets) 251A, 251B and first and second end fences 252A, 252B 'to form a rectangular shaped frame structure. The side rails 251A, 251B and the end rail 252A include an L-shaped flange. The L-shaped flange has a lower (horizontal) flange portion 253L and the upper (vertical) flange portion 253U extends vertically to the lower flange portion 253L. The end of the barrier 252A includes only the lower flange portion 253L and defines an opening gap 254 for receiving the connector 23A. The side rails 25u, 251b and the end rail 252A define a rectangular opening of a size that tightly accommodates the pCBA 21A. The housing 250 includes a plurality of support posts 256 each having a screw hole 257 formed therein to form a first connection structure for locking the PCBA 210 to the housing 250. The support post 256 extends from the lower (horizontal) flange portion 253L along the inner surface of the upper (vertical) flange portion 253U of the side fences 251A, 251B. As shown in FIG. 2(4), the support post 256 receives and supports the corresponding portion of the circuit board 211. During the dressing process, the screw hole 217 of the circuit board 211 is aligned with the screw hole 14 200924599 257, thereby facilitating the use of the screw 207 The circuit board 211 is connected to the housing 250. An outer surface of the upper (vertical) portion 253U of each of the side fences 251A, 251B is formed with a screw hole '258 to form a second connection-structure connecting the housing 250 to the inner frame frame of the main system (not shown), The connection method is similar to that previously described. The assembly of the IDE SSD component 200 is as shown in Fig. (A) and the overall appearance of the assembled components is as shown in Fig. 2(B). As with the previous embodiment, the housing 250 does not include a top cover and a bottom cover, whereby the two surfaces 212, 213 of the pGB are exposed by the corresponding upper opening 260 and lower opening 265, and the upper opening 26 is The lower opening tears are defined between the 251B, (4) and Lai 252A, 2 Qing. The complete rear top surface shown in Figure 2 (B) can be attached to the housing or the blank (unused) area of the pCM21〇. The laser label or printed label (not shown) is still bar code, group. With date code, memory size, manufacturer and other production process data. 3(A) and 3(8)® are schematic diagrams and assembled perspective views of an 18" coffee-type SSD element according to a third embodiment of the present invention, and the element 3 includes - PCBA310' It is embedded with a memory chip 32 array, a control wafer (10) and a connection H 330, and an open-frame support type housing 35. The PCB is similar to the PCBA 110 (previously described) And includes a circuit board 311 having opposing upper and lower surfaces 312 and (10). The screw holes 317 are defined to pass through the circuit board 3n at an appropriate position so as to connect the printed circuit board 311 with the (first) screw 307. To the housing, the connector 33 is a standard 22 SATA type connector, which is electrically connected to the controller 325, and the connection is as described above. This embodiment can also be used for connection and IDE. PCIE connector type. The open-frame mosquito type housing 350 is an integrated restraint metal frame that includes the first and second side fences (slim brackets) 351A, 351B and the first with respect to 200924599. First, the second end of the perimeter 352A, 352B, in the open / into a rectangular like frame structure. The side closures 251A, 251B and the end rail 252A include an L-shaped flange having an upper (horizontal) flange portion 353U and a lower (vertical) flange portion 353L extending perpendicularly to the upper flange portion. The 351A, 351B and end rails 352A, 352B define a rectangular opening that is sized to receive the PCBA 310 tightly, and the end rail 352β defines an open gap 354 for receiving the connector 330.

殼體350包含有四個角落柱355與三個支撐柱356,每一支撐柱具有一 螺孔357,其形成將PCBA310鎖固至殼體35〇的連接結構。由上(水平)凸 緣部353U沿著下(垂直)&緣部353L内面延伸的支撐柱咖。如第3⑴ 圖所示,支標柱356容納並支撐電路板311的相對部份,因此在組配過程 中包路板311的螺孔317是對準螺孔357,藉此來便利地將印刷電路板311 利用螺絲307連接至殼體350。每一側圍攔351A、351B的下(垂直)柱353L 的外表面形成有螺孔358,作為第二連接結構,以將殼體以如同先前所 述之方法連接至主系統(圖中未示)的内機架框架。 SATA SSD元件300的組配如第3 (A)圖所示,而完整裝配後之元件如 第3 (B)圖所示。如同先前的具體實施例,殼體35〇並沒有包含有頂蓋與 底蓋,藉此PCBA310的兩表面312、313係經由相對的上方開口 360與下方 開口 365顯露出’上方開口 360與下方開口祁5是各定界定於側圍欄351A、 351B間與端圍攔352A、352B間。第3 (B)圖所示之完整組配後頂面,可 在设體350或者PCBA310的空白(未使用)區域黏貼上採雷射標籤或印刷 私籤(圖中未示)的隨意條碼、組配日期碼、記憶體大小、製造商與其它 16 200924599 製作過程資料。 第4 (A)與4 (B)圖是依據本發明之第4具體實施例之8,,堆叠式 SATA型態的SSD元件棚的元件分解示意圖與組配透視圖,娜元件棚 包含有兩個PCM4HH、-2,其每-個包含有—記憶體“陣列·、 一控制晶片(圖中未示)與-連接器(圖中未示)紐於上,以及一開放 式-框架支撐龍殼體。SSD元件儀本質上與娜元件相同,不 同的是開放式-框架支撑型態殼體450是架構為容納腿41〇1與41〇_2兩 者,並利用橡膠墊470來物性與電性隔離PCBA41〇—丨、41〇_2並定位設置 PCBA4HH與剔-2,因此連接器43(H、43〇一2兩者皆透過開口間隙伽 顯露於外。如同絲的具體實補’殼體不包含有頂蓋與底蓋,藉此 PC_(M ' 41"的表面是由相對應的上方開口偏與下方開口杨顯露 出。 第5 (A)與5 (B)圖是依據本發明之第5具體實施例之2. 5” $愚型 態的SSD元件500的元件分解示意圖與組配透視圖,ssd元件5〇〇包含有一 PCBA510,其包含有一記憶體晶片陣列520、一控制晶片525與一連接器53〇 嵌致於上’以及一開放式-框架支撐型態殼體550。pcba510是與PCBA110 (先前所述)相似並且包含有具有相對的上與下表面512、5132的電路板 511。螺絲孔517是定義為在適當位置穿過電路板511,以便於利用(第一) 螺絲507將印刷電路板511連接至殼體550。連接器530是標準22_pin的 SATA型態連接器,其係電性連接至控制器525,而連接方式如同先前所述。 這具體實施例也可用於接和IDE與PCIE連接器型態。 17 200924599 開放式-框架支撑型態殼體550是—整合壓禱金屬框架,其包含有相對 的第- '第二側圍欄(細長的托架)551A、551b與第一、第二端關552a、 552B ’以形成-矩型似框架結構。侧攔551Α、551β與端圍搁552a包含 有-L形狀的凸緣’其具有一下(水平)凸緣部55礼與一垂直延伸至下凸 緣部553L的上(垂直)凸緣部553ϋ。側圍攔551八、551β與端圍棚珊、 552B定義出-矩糊α ’其大小係可緊緊容納pGB刪,並且端圍搁測 定義一用以容納連接器530的開口間隙554。 殼體550包含有支撐柱556,每一支標柱具有一螺孔职,其形成將 PCBA510鎖固至殼體550的第一連接結構。支樓柱舰由上(水平)凸緣部 553U 著下(垂直)凸緣部553L的内表面延伸。如第5⑴圖所示,在 組配時,支 556容納並支樓電路板5n相對應的部分,因此電路板5ιι 的螺孔517對準螺孔557,藉此來易於利用螺絲5〇7的方式將電路板圯接 連至殼體550。每-侧圍攔551A、㈣的上(垂直)凸緣部的外表面具有 一螺孔棚,其形成第二連接結構,以利用如同先前所述的方法連接殼體 550至主機系統(圖中未示)的内部機架框架。 SATA SSD元件_的組配如第5⑴圖所示,而完整裝配後之元件 如第5⑻圖所示。如同先前的具體實施例嗜體卿並沒有包含有頂蓋 與底蓋’藉此麵H)的兩表面512、513係經由相對的上方開口 _與下 方開口撇顯露出,上方開口 560與下方開口 565是各界定於側圍觸A、 551B間與端圍襴552A、552B間。 第6⑴與6⑻圖是依據本發明之第6具體實施例之& 5”堆叠式 18 200924599 SATA型態的SSD元件R加 旰bO〇的元件分解示意圖與組配透視圖,SSD元件6〇〇 包含有一 PCBA61〇~i & ” blOj,其每一個包含有一記憶體晶片陣列62〇與一 控制晶片625嵌設於μ 、 、,—連接器630,以及一開放式-框架支撐型態殼體 650。SSD 元件 6〇〇 太;L fc a 貝上與SSD元件500相同,不同的是開放式—框架支撺 型態蓋體咖是架構為可容臟删-1與㈣兩者,並具有橡雜謂, 因此連接器咖是透過開口間隙脱顯露於外。如同先前的具體實施例, 殼體·不包含有頂蓋與底蓋,藉細删+ ⑽面是由相對應 的上方開口 _與下方開口咖顯露出。 第7⑷與7⑻圖是依據本發明之第7具體實施例之1.8” IDE型 L的SSD it件700的几件分解示意圖與組配透視圖,娜元件·包含有一 PCBA710 ’其包含有—記憶體晶片陣列72〇與一控制晶片(圖中未示)與一 零插入力(Zero Inserti〇n F〇rce,ZIF)型態的連接器7㈣設於上,以 及開放式-框架支撐型態殼體75〇。pcBA71〇是與順11〇 (先前所述)相 似並且包含有電路板71卜其具有相對的上與下表面712、713。螺絲孔717 疋定義為在適畲位置穿過電路板711,以便於利用(第一)螺絲7〇7將印刷 電路板711連接至殼體750。連接器730是標準4〇-pin的IDE ZIF型態連 接器’其係電性連接至控織’而連接方式如同先祕述。這具體實施例 也可用於接和SATA與PCIE連接器型態。 開放式-框架支撐型態殼體750是一整合壓鑄金屬框架,其包含有相對 的第一、第二側圍欄(細長的托架)751A、751B與第一、第二端圍欄752A、 752B,以形成一矩型似框架結構。側圍欄751A、751B與端圍欄752A包含 19 200924599 有-L形狀的凸緣’其具有-下(水平)凸緣部753L與—垂直延伸至下凸 緣部753L的上(垂直)凸緣部753U。側圍攔751A、屬與端圍攔752A、 752B定義出-矩形開口,其大小係可緊緊容納pcM71〇並且端圍搁752B定 義一用以容納連接器730的開口間隙754。 殼體750包含有支標柱756,每-支撐柱具有一螺孔757,其形成將 PCBA710鎖固至殼體750的第-連接結構。支樓柱756由下(水平)凸緣部 753L沿著上(垂直)凸緣部753u的内表面延伸。如第7 (A)圖所示,在 組配時’支撐柱756容納並支撐電路板711相對應的部分,因此電路板7n 的螺孔717對準螺孔757,藉此來易於利用螺絲707的方式將電路板711接 連至殼體750。每-側圍攔751A、751B的JL (垂直)凸緣部753U的外表面 具有一螺孔(圖中未示)’其形成第二連接結構,以利用如同先前所述的方 法連接设體750至主機系統(圖中未示)的内部機架框架。 IDE ZIF SSD元件700的組配如第7 (A)圖所示,而完整裝配後之元 件如第7 (B)圖所示。如同先前的具體實施例,殼體75〇不包含有頂蓋與 底蓋,藉此PCBA710的兩個表面712、713是由相對應的上方開口 76〇與下 方開口 765顯露出,其係各自界定於側圍攔751A、751B間與端圍攔752a、 752B 間。 依據本發明,本發明在一些具體實施例中藉由省略端圍欄(例如形成開 气框^支撐型態设體如同兩個分開的部分設置在PCBA的兩相對邊緣) 來實現減少開放式-框架支撐型態殼體的重量。除了減少重量,這兩部分的 殼體因較少的材料需求而具有較低生產成本的特性’再者,因為壓鑄模式 20 200924599 (當使用來產生兩部分時)的製作是較便宜且一次製作過程可產生較高數 量的部分元件。更者,藉由設計兩部分殼體的兩個部分是相同結構,一單 一壓鑄模組或者其它壓印/成形工具可以用來產生這兩部分,以更簡化與減 少殼體生產的成本。 第8 (A)與8 (B)圖是依據本發明之第8具體實施例之& 5” SATA型 態的SSD元件800的元件分解示意圖與組配透視圖,SSD元件_包含有— PCBA810,其包含有一記憶體晶片陣列82〇與一控制晶片825與一 sata型 ,1、的連接器830肷设於上,以及-兩部分開放式—框架支擇型態殼體850。 PCBA81G是與PCBA11G (先前所述)相似並且包含有電路板811,其具有相 對的上與下表面812、813。螺絲孔817是定義為在適當位置穿過電路板 8U,以便於利用(第一)螺絲8〇7將印刷電路板811連接至殼體850。連 接器830是標準22-Pin的SATA型態連接器,其係電性連接至控制器咖, 而連接方式如同先前所述。 。月參閱第8 (A)圖,殼體850包含有壓鑄成型之相對第一與第二細長 托架(側圍攔)851A、851B,其係與殼體15Q側圍攔ι51Α、151B (請參閱 第1 (A)與第1⑻圖)相似’但各自形成並且沒有連接至端關(例如 藉由PCBA81G單獨地連接細長姉851A、851B)。第—與第二平行細長托架 A 851B疋相同的結構,因此兩者皆可利用相同的模具來壓鑄(製造), 4是可因^製程變化來些微修改。藉由使肋同托架結構來形成兩部分 又韓850的兩部分,本發明利用減少模具數目或者增加生產力來減少製作 成本。細長的托架851A、關包含有_ L形狀的凸緣,其具有—下方(水 200924599 平)部853L與-垂直延伸至下方部舰的上方(垂直)部853u。每一細 長托4 851Α 851Β包含有支撐柱856 ’每-支擇柱具有一螺孔857,以利 用之摘述的方法形成將Ρ〔遞10鎖目至贿85〇㈣__連接結構。支樓 柱856由下方(水平)部853L沿著上方(垂直)部關的内表面延伸。 如同第8 (A)圖所不’當組配時,支撐柱咖容納並支撐電路板811的對 應因此電路板811的螺孔817對準螺孔奶7,藉此利用螺絲807便利地 將印刷電路板811連接至殼體。每—細長托架隱、851β包含有導引 柱855A與由下方(水平)⑽部驗延伸並且設置在上方(垂直)凸緣 部853U的内表面的對準柱謹,其係以第丄(A)圖所示之方法各自容納 内部對應的對準溝槽’此對準溝槽係形成於電路板811上。每一細長托架 851A、851B的上方(垂直)部853U具有螺孔,以形成將殼體㈣連接至主 系統(圖中未示)之内部機架框架的第二連接結構,以如㈣前所述的方 法。 SATA SSD兀件_的組配如帛8 (A)圖所示,而完整裝配後之元件如 第8 (B)騎示。連接器83〇是嵌設在電路板811的邊緣,介於細長托架 851A、851B間。如同先前的具體實施例,殼體85〇不包含有頂蓋與底蓋, 藉此PCBA810的兩個表面812、813是由相對應的上方開口 86〇與下方開口 865顯露出,其係各自界定於側圍攔851A、851B間。 第9 (A)與9 (B)圖是依據本發明之第9具體實施例之18” SATA型 態的SSD το件900的元件分解示意圖與組配透視圖,SSD元件9〇〇包含有— PCBA910 ,其包含有—記憶體晶片陣列92〇與一控制晶片犯5與一 sata型 22 200924599 態的連接器930嵌設於上,以及-兩部分開放式—框架支撐型態殼體㈣。 POBA910是與PCBA110 (先岫所述)相似並且包含有電路板911,其具有相 對的上與下表面912、913。螺絲孔917是定義為在適當位置穿過電路板 9H,以便於利用(第一)螺絲907將印刷電路板911連接至殼體95〇。連 接器930是標準22-pin的SATA型態連接器,其係電性連接至控制器奶, 而連接方式如同先前所述。 請參閱第9 (A)圖,殼體950包含有塵鑄成型之相對第一與第二細長 托架(側圍攔)951A、951B,其係與殼體35〇側圍欄351Α、351β (請參閱 第3 (A)與第3⑻®)她,但各自形成並且沒有連接至端關(例如 藉由PCBA910單獨地連接細長托架951A、_)。每—細長托架95ia、咖 包含有支撐柱956 ’每-支撐柱具有一螺孔957,以形成如同先前所述的方 法利用螺絲907將PCBA910鎖固至殼體950的第一連接結構。每一上方細 長托架951A、851B的外表面具有螺孔958,以如同先前所述的方法形成 將喊體95G連接至主系統(圖中未示)之内部機架框架的第二連接結構。 SATA SSD元件900的組配如第9 (A)圖所示,而完整裝配後之元件如 第9 (B)圖所示。連接器93〇是敌設在電路板911的邊緣,介於細長托架 951A、951B間。如同先前的具體實施例,殼體95〇不包含有頂蓋與底蓋, 藉此PCBA910的兩個表面912、913是由相對應的上方開口 96〇與下方開口 965顯露出,其係各自界定於側圍欄951Α、951β間。 第10 (A)與10 (B)圖是依據本發明之第10具體實施例之2 5” sata 型態的SSD元件1000的元件分解示意圖與組配透視圖,SSD元件1〇〇〇包含 23 200924599 有PCBA1010,其包含有一§己憶體晶片陣列1020與一控制晶片i〇25與一 SATA型態的連接器1030②設於上,以及一兩部分開放式框架支樓型態殼 體1050〇PCBA1010是與PCM110(先前所述)相似並且包含有電路板丨叫, 其具有相_上與下表面1G12、刪。螺絲孔1G17是定義為在適當位置穿 過電路板1011,以便於利用(第一)螺絲丨將印刷電路板1〇11連接至 忒體1050。連接器1〇3〇是標準22-pin的SATA型態連接器,其係電性連接 至控制器1025,而連接方式如同先前所述。 請參閱第10 (A)圖,殼體1〇5〇包含有壓鑄成型之相對第一與第二細長 托架(側圍攔)1051A、1051B,其係與殼體550側圍攔551A、551B (請參 閱第5(A)圖)相似,但各自形成並且沒有連接至端圍攔(例如藉由pcBAi〇i〇 單獨地連接細長托架1051A、1051B)。每一細長托架1051A、1051B包含有 支撐柱1056,每一支撐柱具有一螺孔1057,以形成使用之前所述之方法利 用螺絲1007將PCBA1010鎖固至殼體1〇5〇的第一連接結構。每一上方細長 托架1051A、1051B的外表面具有螺孔1058 ’以形成將殼體1〇5〇連接至主 系統(圖中未示)之内部機架框架的第二連接結構,以如同先前所述的方 法。 SATA SSD元件1〇〇〇的組配如第10⑴圖所示,而完整裝配後之元件 如第10 (B)圖所示。連接器1〇3〇是嵌設在電路板1〇11的邊緣,介於細長 托架1051A、1051B間。如同先前的具體實施例,殼體1()50不包含有頂蓋 與底蓋,藉此PCBA1010的兩個表面1〇12、1〇13是由相對應的上方開口 1〇6〇 與下方開口 1065顯露出,各自界定於側圍攔ι〇51Α、1051B間。 24 200924599 另外,先前所述的兩部分殼體可以是利用既有技術由薄金屬板壓印/塑 造形成。壓印與塑造是製作各種型態SSD驅動器之托架最有效且低成本的 方法。此外,利用相同托架設計來嵌設於PCBA週緣,相同壓印/塑造設備 可用於托架兩者’藉此簡化製作過程並且進—步降低製作成本。絲塑造 托架1151A、1151B的金屬元件也可以經由連接的螺絲成為ESD釋放路徑。 第11 (A)與11 (B)圖是依據本發明之第u具體實施例之2 5” IDE 型態的SSD το件lioo的元件分解示意圖與組配透視圖,SSD元件丨ι〇〇包含 有一 PCBA1110,其包含有一記憶體晶片陣列112〇與一控制晶片ιΐ25與一 IDE型態的連接器H30後設於上’以及-兩部分開放式_框架支樓型態殼體 1150。PCBA1110是與PCBA110 (先前所述)相似並且包含有電路板mi, 其具有相對的上與下表面1112、1113。_孔1117是定義為在適當位置穿 過電路板1111,以便於利用(第一)螺絲1107將印刷電路板llu連接至 设體1150。連接器1130是IDE型態的連接器,其係電性連接至控制器1125, 其連接方式如同先前所述。 參閱第11 (A)圖,殼體1150包含有經壓印/塑造的相對第一與第二細 長托架(側圍攔)1151A、1151B,其係各自成形(例如沒有連接至端圍攔), 因此細長托架1151A、1151B單獨地連接至PCBA1110並且對稱(大致上相 同)。每一托架1151A、1151B包含有一垂直凸緣部U53V與數個水平凸緣 部1153H1、1153H2,其係垂直延伸至垂直凸緣部ι153ν。每一垂直凸緣部 Π53Η1的中心位置具有一第一螺孔1157,其係用以藉由螺絲11〇7鎖附於 PCBA1110上。用來塑造托架1151A、1151B的金屬元件也可成為es])釋放路 25 200924599 徑’經由延伸穿過PCBA1110上對應螺孔1117與水平凸緣部115腿孔1157 的螺絲11G7,以經由接地環/孔(金屬環圖中未示)電性連接托架mu、 1151B與PCBA1110的接地面。下方水平凸緣部U53H2的每—個是用來鎖固 SSD1100至其它元件(圖中未示)。如同在第u⑻圖所示,四個凹口是 位於PCBA111G的週緣’以與下方水平凸緣部n53H2對準這些凹口是多餘 的並且1^間可轉定為PCBA111Q實際棚醜外佈局。上方細長托架 1151A、1151B的外表面具有(第三)螺孔1158,其係作為將殼體㈣連 接至主系統(圖中未示)_部機雜架的第二連接結構,以與先前所述 方法。 SATA SSD S件llGG的組配如第n⑷圖所示,❿完整裝配後之元件 如第11 (B)圖所示。連接H 113G是嵌設在電路板mi的邊緣,介於細長 托架1151A、1151B間。如同先前的具體實施例,殼體⑽不包含有頂蓋 與底蓋,藉此PCBA111G的兩個表面1112、1113是由相對應的上方開口· 與下方開α 1165顯露出’其係各自界^於側關115u、n51B間。 另外’本發明之兩部分殼體的每一托架也可以是兩個箝制結構,其係使 用現有技術將薄金屬板輯或者壓印/錢所職。在下列具體實施例中所 描述k兩部分箝制結構提高本發明之兩部分殼體_性,以幫助保護 PCBA,當PCBA自身無法提供足__。兩部分箝制結構的另—優點是藉 由減少突Μ ^丨柱,來使聰的可使用實際面積最大化。 第12(A)與12(B)圖是依據本發明之帛12具體實施例之15” ZIFSATA 型態的SSD το件1200的元件分解示意圖與組配透視圖,SSD元件12〇〇包含 26 200924599 有一 PCBA1210,其包含有一記憶體晶片陣列122〇與一控制晶片(圖中未示) 與一 SATA型態的連接器1230嵌設於上,以及一兩部分開放式_框架支樓型 態设體1250。PCBA1210是與PCBA110 (先前所述)相似並且包含有電路板 1211,其具有相對的上與下表面1212、1213。螺絲孔1217是定義為在適當 位置穿過電路板1211,以便於利用(第一)螺絲12〇7將印刷電路板1211 連接至殼體㈣。連接器是ZIF型態的連接n,其係電性連接至控制 ’其連接方式如同先前所述。 如第12 (A)圖所示’殼體125〇包含有相對第—與第二細長托架(側 圍攔)1251A、1251B ’其中每-托架包含有相對箝制結構,其係箝制至 PCBA1210的邊緣’藉此細長托架1251Α、1251β是單獨地連接至pcMi2i〇。 與一上方箝制結構 第-細長托架1251A包含有-下方箝制結構 1251A-2 ’第二細長托架1251B包含有一下方箝制結構ΐ25ΐβ—)與一上方箱 制結構丨漏-2。每-下方箝制結構卿A—丨、125m大致上是相同的(例 如利用相同壓鑄模具形成)並且每_上方籍制結構m2、!腿也是 大致上相IS]每柑制結構具有數個螺孔,其係對準於相對應的腿測 上的螺孔㈣,來說,下方結構結構㈣^包含 有對準於相對朗_1Q㈣二觀1217㈣―螺孔腦小與相對 應貫穿上方箝制結構1251A-2的第二螺;^丨19ς7Α。 弟一螺孔1257Α-2,在箝制步驟中經由組合 的螺絲1207來連接。用來塑造托架1 1〇 朱U51A、1251Β的金屬元件也可以經由 連接的螺絲成為ESD釋放路徑。 圖所示,而完整裝配後之元件 SATA SSD元件1200的組配如第a (a) 27 200924599 如第12 (B)圖所示。連接器123〇是嵌設於電路板1211的邊緣,介於細長 托架1251A、1251B之間。如同先前的具體實施例,殼體125〇不包含有頂 盍與底蓋,藉此PCBA1210的兩個表面1212、1213是由相對應的上方開口 1260與下方開口 1265顯露出’其係各自界定於側圍攔1251a、125ib間。 第13 (A)與13 (B)圖是依據本發明之第13具體實施例之〇 85” ZIF SATA型態的SSD元件1300的元件分解示意圖與組配透視圖,SSD元件13〇〇 包含有- PCBA1310 ’其包含有一記憶體晶片陣列132〇與一控制晶片(圖中 未示)與-ZIF SATA型態的連接器(圖中未示)傲設於上,以及一兩部分 開放式-框絲做撐型態蓋H 135〇。pGM131G是與pGBAn() W前所述) 相似並且包含有電路板1311,其具有相對的上與下表面1312、1313。螺絲 孔1317是定義為在適當位置穿過電路板,則更於利用(第一)螺絲 1307將印刷電路板1311連接至殼體135〇。 如第13 (Α)圖所示,殼體包含有相一與第二細長托架(側 圍攔)1351Α、1351Β ’其中每-托架包含有相對箝制結構,其係箝制至 PCBA1310的邊緣,藉此細長托架1351Α、1351β是單獨地連接至腿ΐ3ι〇。 第-細長托架1351Α包含有-下方箝制結構1351h與一上方籍制結構 1351A-2,第二細長托架1351B包含有-下方箝制結構既㈣與一上方籍 制結構1351B-2。每-下方箝制結構1351h、135阳大致上是相同的(例 如利用相同壓鑄模具形成)並且每—上方箝制結構135U—2、i35iB_2也是 大致上相同。每-制結魏個,聽解_職的腿刪 上的螺孔13Π,以助於箝制步驟,例來說,下方結構結構i35iA—i包含 28 200924599 有第一螺孔1357A-1 ’其係對準於相對應的PCBA1310的第二螺孔1357與相 對應的第三螺孔1357A-2,其係貫穿上方箝制結構1351A-2,在箝制步驟中 係經由用以組合螺絲1307來連接。The housing 350 includes four corner posts 355 and three support posts 356, each of which has a screw hole 357 that forms a connection structure for locking the PCBA 310 to the housing 35〇. A support post extending from the upper (horizontal) flange portion 353U along the inner surface of the lower (vertical) & edge portion 353L. As shown in FIG. 3(1), the support post 356 receives and supports the opposite portion of the circuit board 311, so that the screw hole 317 of the bypass board 311 is aligned with the screw hole 357 during assembly, thereby facilitating the printed circuit. The plate 311 is coupled to the housing 350 with screws 307. The outer surface of the lower (vertical) post 353L of each side of the dam 351A, 351B is formed with a screw hole 358 as a second connection structure to connect the housing to the main system as previously described (not shown) ) The inner frame of the frame. The SATA SSD component 300 is assembled as shown in Figure 3(A), and the fully assembled component is shown in Figure 3(B). As in the previous embodiment, the housing 35 does not include a top cover and a bottom cover, whereby the two surfaces 312, 313 of the PCBA 310 are exposed through the opposite upper opening 360 and the lower opening 365. The upper opening 360 and the lower opening are exposed.祁5 is defined between the side fences 351A, 351B and the end fences 352A, 352B. The complete rear top surface shown in Figure 3 (B) can be attached to the blank (unused) area of the body 350 or PCBA310 with random barcodes for printing laser labels or printed private labels (not shown). Date code, memory size, manufacturer and other 16 200924599 production process data. 4(A) and 4(B) are exploded perspective views and assembled perspective views of a stacked SATA type SSD component shed according to a fourth embodiment of the present invention. PCM4HH, -2, each of which contains a "memory" array, a control chip (not shown) and a connector (not shown), and an open-frame support dragon The SSD component is essentially the same as the Na component, except that the open-frame support profile 450 is configured to accommodate both legs 41〇1 and 41〇_2 and utilizes a rubber pad 470 for physical properties. Electrically isolated PCBA41〇—丨, 41〇_2 and positioned to set PCBA4HH and Tick-2, so the connector 43 (H, 43〇2 is exposed through the opening gap. As the specific compensation of the wire) The housing does not include a top cover and a bottom cover, whereby the surface of the PC_(M '41" is exposed by the corresponding upper opening and the lower opening Yang. The 5th (A) and 5 (B) drawings are based on this 5′′ of the fifth embodiment of the invention. FIG. 5′′ is an exploded view of the component of the SSD component 500 and the assembled perspective view, and the ssd component 5〇〇 There is a PCBA 510 comprising a memory chip array 520, a control wafer 525 and a connector 53 embedded in the upper portion and an open-frame support type housing 550. The pcba 510 is similar to the PCBA 110 (described previously). Also included is a circuit board 511 having opposing upper and lower surfaces 512, 5132. Screw holes 517 are defined to pass through the circuit board 511 in place to facilitate connecting the printed circuit board 511 to the housing with the (first) screw 507. Body 550. Connector 530 is a standard 22-pin SATA type connector that is electrically connected to controller 525 and is connected as previously described. This embodiment can also be used for connection and IDE and PCIE connector types. 17 200924599 Open-frame support type housing 550 is an integrated pressure metal frame that includes opposing - 'second side rails (slender brackets) 551A, 551b and first and second ends 552a, 552B' are formed into a rectangular-like frame structure. The side blocks 551Α, 551β and the end wall rest 552a include a -L-shaped flange having a lower (horizontal) flange portion 55 and a vertical extension to a lower convex Upper edge of vertical edge 553L (vertical The flange portion 553 ϋ. The side dam 551, 551β and the end hull, the 552B defines a squeegee α 'the size of which can tightly accommodate the pGB deletion, and the end circumference projection defines an opening for accommodating the connector 530 The gap 554. The housing 550 includes a support post 556, each of which has a screw hole position that forms a first connection structure for locking the PCBA 510 to the housing 550. The branch column is provided by the upper (horizontal) flange portion The inner surface of the 553U lower (vertical) flange portion 553L extends. As shown in Fig. 5(1), at the time of assembly, the branch 556 accommodates the portion corresponding to the branch circuit board 5n, so that the screw hole 517 of the circuit board 5 ι is aligned with the screw hole 557, thereby facilitating the use of the screw 5〇7. The method connects the circuit board to the housing 550. The outer surface of the upper (vertical) flange portion of each of the side dams 551A, (4) has a threaded hole shed that forms a second connection structure to connect the housing 550 to the host system using the method as previously described (in the figure) Internal frame frame not shown). The SATA SSD component _ is assembled as shown in Figure 5(1), and the fully assembled component is shown in Figure 5(8). As in the previous embodiment, the two surfaces 512, 513 of the top cover and the bottom cover 'by the surface H' are exposed through the opposite upper opening _ and the lower opening ,, the upper opening 560 and the lower opening 565 is defined between the side circumferences A, 551B and the end circumferences 552A, 552B. 6(1) and 6(8) are exploded view and assembled perspective view of the SSD component R plus bO〇 of the & 5" stacked 18 200924599 SATA type according to the sixth embodiment of the present invention, the SSD component 6〇〇 A PCBA 61〇~i & blOj is included, each of which includes a memory chip array 62 and a control wafer 625 embedded in the μ, , - connector 630, and an open-frame support type housing 650. The SSD component is 6 〇〇 too; L fc a is the same as the SSD component 500. The difference is that the open-frame support type cover is designed to be visibly visibly deleted -1 and (4), and has a rubber That is to say, the connector coffee is exposed through the gap of the opening. As in the previous embodiment, the housing does not include a top cover and a bottom cover, and the (10) face is exposed by the corresponding upper opening _ and the lower opening coffee. 7(4) and 7(8) are several exploded views and assembled perspective views of a 1.8" IDE type L SSD it piece 700 according to a seventh embodiment of the present invention, and the Na element includes a PCBA 710 which includes a memory. The wafer array 72 is connected to a control wafer (not shown) and a zero insertion force (Zero Insertion) type connector (4), and an open-frame support type housing. 75. The pcBA71 is similar to the cis 11 (described previously) and includes a circuit board 71 having opposing upper and lower surfaces 712, 713. The screw holes 717 疋 are defined as passing through the board 711 in an appropriate position. In order to connect the printed circuit board 711 to the housing 750 using the (first) screw 7〇7. The connector 730 is a standard 4〇-pin IDE ZIF type connector 'which is electrically connected to the control fabric' The connection is as described first. This embodiment can also be used for connection and SATA and PCIE connector types. The open-frame support type housing 750 is an integrated die-cast metal frame that contains the first and the first. Two side fences (slim brackets) 751A, 751B and first and second End rails 752A, 752B to form a rectangular frame-like structure. Side rails 751A, 751B and end rails 752A include 19 200924599 -L-shaped flanges having - lower (horizontal) flange portions 753L and - vertically extending The upper (vertical) flange portion 753U of the lower flange portion 753L. The side fence 751A, the genus and end brackets 752A, 752B define a rectangular opening, the size of which can tightly accommodate the pcM71 〇 and the end circumference 752B defines An opening gap 754 for receiving the connector 730. The housing 750 includes a support post 756, each of which has a screw hole 757 that forms a first-connecting structure that locks the PCBA 710 to the housing 750. 756 extends from the lower (horizontal) flange portion 753L along the inner surface of the upper (vertical) flange portion 753u. As shown in Fig. 7(A), the support column 756 accommodates and supports the circuit board 711 phase during assembly. Corresponding portions, therefore, the screw holes 717 of the circuit board 7n are aligned with the screw holes 757, whereby the circuit board 711 is easily attached to the housing 750 by means of the screws 707. JL (vertical) of each side brackets 751A, 751B The outer surface of the flange portion 753U has a screw hole (not shown) which forms a second connection The internal frame frame is connected to the host system (not shown) by means of the method as previously described. The assembly of the IDE ZIF SSD component 700 is as shown in Figure 7 (A), and is completely assembled. The latter component is shown in Figure 7(B). As in the previous embodiment, the housing 75 does not include a top cover and a bottom cover, whereby the two surfaces 712, 713 of the PCBA 710 are correspondingly open at the top. The 76 〇 and the lower opening 765 are exposed, each of which is defined between the side dams 751A, 751B and the end ribs 752a, 752B. In accordance with the present invention, the present invention achieves a reduced open-frame by omitting the end rails (e.g., forming an air-opening frame) as if two separate portions are disposed on opposite edges of the PCBA in some embodiments. The weight of the support type housing. In addition to reducing weight, the two parts of the housing have lower production cost characteristics due to less material requirements' again, because die casting mode 20 200924599 (when used to produce two parts) is cheaper and one-time production The process can produce a higher number of partial components. Moreover, by designing the two portions of the two-part housing to be identical, a single die-cast module or other embossing/forming tool can be used to create the two portions to further simplify and reduce the cost of housing production. 8(A) and 8(B) are exploded perspective views and assembled perspective views of a & 5" SATA type SSD device 800 in accordance with an eighth embodiment of the present invention, the SSD device_containing - PCBA810 It comprises a memory chip array 82 and a control wafer 825 and a sata type, 1, a connector 830 is disposed on the upper, and a two-part open-frame-selective type housing 850. The PCBA81G is The PCBA 11G (described previously) is similar and includes a circuit board 811 having opposing upper and lower surfaces 812, 813. The screw holes 817 are defined to pass through the circuit board 8U in place to facilitate utilization of the (first) screw 8 The 〇7 connects the printed circuit board 811 to the housing 850. The connector 830 is a standard 22-pin SATA type connector that is electrically connected to the controller coffee, and the connection method is as previously described. 8 (A), the housing 850 includes die-cast opposing first and second elongated brackets (side rails) 851A, 851B that are attached to the housing 15Q side fences ι 51 Α, 151B (see section 1 ( A) similar to Figure 1(8)) but each formed and not connected to the end (eg by P) The CBA81G is separately connected to the elongated 姊 851A, 851B). The first structure is the same as the second parallel elongated bracket A 851B ,, so both can be die-cast (manufactured) using the same mold, 4 can be changed by the process By making the ribs and the bracket structure to form two parts of the two parts and the Han 850, the present invention reduces the manufacturing cost by reducing the number of molds or increasing the productivity. The elongated bracket 851A, the cover contains the _L shape convex The rim has a lower (water 200924599 flat) portion 853L and a vertical extension to the upper (vertical) portion 853u of the lower portion of the ship. Each of the elongated supports 4 851 Β 851 Β includes a support post 856 'each-supporting column has a snail The hole 857 is formed by the method of the above-described method to form a joint structure. The branch column 856 is extended from the lower (horizontal) portion 853L along the inner surface of the upper (vertical) portion. As shown in FIG. 8(A), the support column accommodates and supports the corresponding circuit board 811. Therefore, the screw hole 817 of the circuit board 811 is aligned with the screw hole milk 7, whereby the screw 807 is conveniently used. A printed circuit board 811 is attached to the housing. - the elongated bracket hidden, 851β comprises a guide post 855A and an alignment post extending from the lower (horizontal) (10) portion and disposed on the inner surface of the upper (vertical) flange portion 853U, which is tied with a third (A) The methods shown in the figures each accommodate internal corresponding alignment trenches. The alignment trenches are formed on the circuit board 811. The upper (vertical) portion 853U of each elongated bracket 851A, 851B has a screw hole to form The housing (four) is connected to the second connection structure of the inner frame frame of the main system (not shown) in the manner as described in (4) above. The SATA SSD assembly _ is shown in Figure 8 (A), and the fully assembled components are shown in Figure 8 (B). The connector 83A is embedded in the edge of the circuit board 811 between the elongated brackets 851A, 851B. As with the previous embodiment, the housing 85 does not include a top cover and a bottom cover, whereby the two surfaces 812, 813 of the PCBA 810 are exposed by the corresponding upper opening 86 and lower opening 865, each of which is defined Between the 851A and 851B on the side. 9(A) and 9(B) are an exploded perspective view and a perspective view of an 18" SATA type SSD 190 device according to a ninth embodiment of the present invention, the SSD device 9 〇〇 includes - The PCBA 910 includes a memory chip array 92 and a control chip 5 and a sata type 22 200924599 state connector 930 embedded thereon, and a two-part open-frame support type housing (4). Is similar to PCBA 110 (described above) and includes a circuit board 911 having opposing upper and lower surfaces 912, 913. Screw holes 917 are defined to pass through the circuit board 9H in place for ease of use (first The screw 907 connects the printed circuit board 911 to the housing 95. The connector 930 is a standard 22-pin SATA type connector that is electrically connected to the controller milk and is connected as previously described. In Fig. 9(A), the housing 950 includes dust-molded opposing first and second elongated brackets (side brackets) 951A, 951B which are attached to the housing 35 side fences 351A, 351β (see 3 (A) and 3 (8)®) she, but each formed and not connected to the end (eg The elongate brackets 951A, _) are separately connected by the PCBA 910. Each of the elongate brackets 95ia, the coffee cup includes a support post 956 'a per support post having a threaded hole 957 to form a screw 907 as in the previously described method The PCBA 910 is secured to the first attachment structure of the housing 950. The outer surface of each of the upper elongate brackets 951A, 851B has a threaded bore 958 to connect the shouting body 95G to the main system as previously described (not shown) The second connection structure of the internal frame frame of the display. The assembly of the SATA SSD component 900 is as shown in Fig. 9(A), and the components after the complete assembly are as shown in Fig. 9(B). The connector 93〇 It is hosted on the edge of the circuit board 911 between the elongated brackets 951A, 951B. As in the previous embodiment, the housing 95 does not include a top cover and a bottom cover, whereby the two surfaces 912, 913 of the PCBA 910 It is formed by the corresponding upper opening 96 〇 and the lower opening 965, which are respectively defined between the side fences 951 Α, 951 β. The 10th (A) and 10 (B) drawings are according to the 10th embodiment of the present invention. 2 5" sata type SSD component 1000 component decomposition diagram and assembly perspective, The SSD component 1 includes 23 200924599 having a PCBA 1010 including a CMOS array 1020 and a control chip i 〇 25 and a SATA type connector 10302, and a two-part open frame The floor-type housing 1050〇PCBA1010 is similar to the PCM 110 (described previously) and includes a circuit board squeak having phase-upper and lower surfaces 1G12, deleted. The screw hole 1G17 is defined to pass through the circuit board 1011 in an appropriate position in order to connect the printed circuit board 1〇11 to the body 1050 with the (first) screw 。. The connector 1〇3〇 is a standard 22-pin SATA type connector that is electrically connected to the controller 1025 in the same manner as previously described. Referring to FIG. 10(A), the housing 1〇5〇 includes die-cast opposing first and second elongated brackets (side brackets) 1051A, 1051B, which are coupled to the housing 550 side enclosures 551A, 551B. (See Figure 5(A)) is similar, but each is formed and not connected to the end fence (e.g., the elongate brackets 1051A, 1051B are individually connected by pcBAi〇i〇). Each elongate bracket 1051A, 1051B includes a support post 1056, each support post having a threaded hole 1057 to form a first connection for locking the PCBA 1010 to the housing 1〇5〇 using screws 1007 using methods previously described. structure. The outer surface of each of the upper elongated brackets 1051A, 1051B has a threaded bore 1058' to form a second connecting structure that connects the housing 1〇5〇 to the inner frame frame of the main system (not shown), as before Said method. The SATA SSD component is assembled as shown in Figure 10(1), and the fully assembled component is shown in Figure 10(B). The connector 1〇3〇 is embedded at the edge of the circuit board 1〇11 between the elongated brackets 1051A and 1051B. As in the previous embodiment, the housing 1 () 50 does not include a top cover and a bottom cover, whereby the two surfaces 1 〇 12, 1 〇 13 of the PCBA 1010 are opened by the corresponding upper opening 1 〇 6 〇 1065 is revealed, each of which is defined between the side walls 〇 51〇, 1051B. 24 200924599 Additionally, the two-part housing previously described may be formed by stamping/plasticizing a thin metal sheet using prior art techniques. Embossing and shaping are the most efficient and cost-effective ways to make brackets for a wide variety of SSD drives. In addition, with the same cradle design embedded in the periphery of the PCBA, the same embossing/shaping device can be used for both cradle', thereby simplifying the manufacturing process and further reducing manufacturing costs. Wire Molding The metal elements of the brackets 1151A, 1151B can also be ESD release paths via the attached screws. 11(A) and 11(B) are an exploded view and a perspective view of an assembly of a 2 5" IDE type SSD το lioo according to a uth embodiment of the present invention, the SSD component 丨ι〇〇 includes There is a PCBA1110 comprising a memory chip array 112 and a control wafer ι 25 and an IDE type connector H30 which are then disposed on the upper 'and-two-part open _ frame slab type housing 1150. PCBA1110 is The PCBA 110 (described previously) is similar and includes a circuit board mi having opposing upper and lower surfaces 1112, 1113. The hole 1117 is defined to pass through the circuit board 1111 in place to facilitate utilization of the (first) screw 1107. The printed circuit board 11u is connected to the body 1150. The connector 1130 is an IDE type connector electrically connected to the controller 1125 in the same manner as previously described. Referring to Figure 11 (A), the housing 1150 includes embossed/shaped opposing first and second elongated brackets (side rails) 1151A, 1151B that are each shaped (eg, not connected to the end fence) such that the elongated brackets 1151A, 1151B are individually Connected to PCBA1110 and symmetrical (substantially Each of the brackets 1151A, 1151B includes a vertical flange portion U53V and a plurality of horizontal flange portions 1153H1, 1153H2 extending perpendicularly to the vertical flange portion ι 153 ν. The center position of each vertical flange portion Π 53 Η 1 has a a first screw hole 1157 for locking to the PCBA 1110 by means of a screw 11 〇 7. The metal element for shaping the brackets 1151A, 1151B can also be es]) release path 25 200924599 diameter 'via extension through PCBA1110 The screw 11G7 corresponding to the screw hole 1117 and the horizontal flange portion 115 of the leg hole 1157 is electrically connected to the grounding surface of the bracket mu, 1151B and the PCBA 1110 via a grounding ring/hole (not shown in the metal ring diagram). The lower horizontal flange Each of the U53H2 is used to lock the SSD1100 to other components (not shown). As shown in the u(8) diagram, the four notches are located at the periphery of the PCBA111G to align with the lower horizontal flange portion n53H2. These notches are redundant and can be transferred to the actual layout of the PCBA111Q. The outer surface of the upper elongated brackets 1151A, 1151B has a (third) screw hole 1158 which is used to connect the housing (four) to the main System (not shown) The second connection structure is in the same manner as the previously described method. The SATA SSD S piece llGG is assembled as shown in the nth (4) figure, and the fully assembled component is as shown in Fig. 11(B). The connection H 113G is embedded in The edge of the board mi is between the elongated brackets 1151A, 1151B. As in the previous embodiment, the housing (10) does not include a top cover and a bottom cover, whereby the two surfaces 1112, 1113 of the PCBA 111G are exposed by the corresponding upper opening · and the lower opening α 1165 'the respective boundaries ^ It is between the side 115u and n51B. Further, each of the brackets of the two-part housing of the present invention may also be two clamped structures which are used in the prior art to form a thin metal plate or an imprint/money. The two-part clamp structure described in the following specific embodiments enhances the two-part housing of the present invention to help protect the PCBA when the PCBA itself is unable to provide the foot. Another advantage of the two-part clamping structure is that the actual area that can be used by Cong is maximized by reducing the sudden force. 12(A) and 12(B) are schematic exploded view and assembled perspective view of a 15" ZIFSATA type SSD τ 1200 according to a 帛12 embodiment of the present invention, SSD component 12 〇〇 26 2624 There is a PCBA1210 comprising a memory chip array 122 and a control chip (not shown) and a SATA type connector 1230 embedded therein, and a two-part open type _ frame branch type installation 1250. The PCBA 1210 is similar to the PCBA 110 (described previously) and includes a circuit board 1211 having opposing upper and lower surfaces 1212, 1213. The screw holes 1217 are defined to pass through the circuit board 1211 in place for ease of use ( The first) screw 12〇7 connects the printed circuit board 1211 to the housing (4). The connector is a ZIF-type connection n that is electrically connected to the control 'its connection as described previously. As in section 12 (A) The illustrated housing 125 includes an opposing first and second elongated brackets (side brackets) 1251A, 1251B 'where each bracket contains a relatively clamped structure that is clamped to the edge of the PCBA 1210' thereby elongated Bracket 1251Α, 1251β is connected separately The upper elongate bracket 1251A includes an under-clamping structure 1251A-2'. The second elongate bracket 1251B includes a lower clamping structure ΐ25ΐβ-) and an upper box structure -2-2 Each of the lower clamping structures A-丨, 125m is substantially the same (for example, formed by the same die-casting mold) and each of the top structures m2, ! legs are also substantially upper phase IS] each citrus structure has several snails The hole is aligned with the corresponding screw hole on the leg (4), for example, the lower structure (4)^ is aligned with the relative 朗_1Q(4)2 view 1217(4)-the screw hole is small and correspondingly penetrates the upper clamp structure The second screw of 1251A-2; ^丨19ς7Α. The first screw hole 1257Α-2 is connected by the combined screw 1207 in the clamping step. The metal component used to shape the bracket 1 1〇U51A, 1251Β can also be The connected screws become the ESD release path. As shown in the figure, the assembled SATA SSD component 1200 is as shown in Figure 12 (B). On the edge of the circuit board 1211, between the slender support Between 1251A and 1251B. As in the previous embodiment, the housing 125 does not include a top and bottom cover, whereby the two surfaces 1212, 1213 of the PCBA 1210 are exposed by the corresponding upper opening 1260 and lower opening 1265. 'These are each defined between the side fences 1251a, 125ib. 13(A) and 13(B) are exploded perspective views and assembled perspective views of a ”85" ZIF SATA type SSD device 1300 according to a thirteenth embodiment of the present invention, the SSD device 13 〇〇 - PCBA1310' includes a memory chip array 132 and a control chip (not shown) and a -ZIF SATA type connector (not shown) on top, and a two-part open-frame The wire is a stent cover H 135. The pGM131G is similar to that described for pGBAn() W and includes a circuit board 1311 having opposing upper and lower surfaces 1312, 1313. The screw holes 1317 are defined as being in place. Passing through the circuit board, the printed circuit board 1311 is further connected to the housing 135 by using the (first) screw 1307. As shown in Fig. 13 (Α), the housing includes a phase and a second elongated bracket ( Side brackets 1351Α, 1351Β ' each of the brackets includes a relatively clamped structure that is clamped to the edge of the PCBA 1310, whereby the elongated brackets 1351Α, 1351β are individually connected to the leg ΐ3ι〇. The first elongated bracket 1351Α Including a lower-clamping structure 1351h and an upper-made structure 1351A-2, The second elongated bracket 1351B includes a lower-lowering structure (4) and an upper structure 1351B-2. Each of the lower clamp structures 1351h, 135 is substantially the same (for example, formed by the same die-casting mold) and each-upper The clamped structures 135U-2 and i35iB_2 are also substantially the same. Each of the braids is formed, and the screw holes 13Π of the legs are read to assist the clamping step. For example, the lower structure i35iA-i contains 28 200924599 has a first screw hole 1357A-1' which is aligned with the corresponding second screw hole 1357 of the PCBA 1310 and the corresponding third screw hole 1357A-2, which penetrates the upper clamp structure 1351A-2, in the clamping step The middle is connected by means of a combination screw 1307.

SATA SSD元件1300的組配如第13 (A)圖所示,而完整裝配後之元 件如第13 (B)圖所示。連接器1330是嵌設於電路板1311的邊緣,介於細 長托架1351A、1351B之間。如同先前的具體實施例,殼體1350不包含有 頂蓋與底蓋’藉此PCBA1310的兩個表面1312、1313是由相對應的上方開 口 1360與下方開口 1365顯露出,其係各自界定於側圍欄1351A、1351b間。 第14(A)與14(B)圖是依據本發明之第14具體實施例之1·〇” ZIF SATA 型態的SSD元件1400的元件分解示意圖與組配透視圖,SSD元件14〇〇包含 有一 PCBA1410,其包含有一記憶體晶片陣列142〇與一控制晶片1425與一 ZIF SATA型態的連接器(圖中未示)嵌設於上,以及一兩部分開放式—框架 箝制支撐型悲殼體1450。PCBA1410是與PCBA110 (先前所述)相似並且包 3有電路板1411,其具有相對的上與下表面14丨2、1413。螺絲孔1417是 定義為在適當位置穿過電路板1411 ’以便於利帛(第一)螺絲廝將印刷 電路板1411連接至蓋體1450。 如第14⑴圖所示’殼體包含有相對第—與第二細長托架(側 圍攔)1451A、1451B,其中每-托架包含有相對箝制結構,其係箝制至 PCBA141G的邊緣,藉此細長托架丨纽、1451β是_地連接至腹剛。 第-細長托架1451Α包含有-下方箝制結構145μ—}與―上方籍制結構 H51A-2,第二細長托架1451B包含有一下方箝制結構ι45ΐβ—i與一上方籍 29 200924599 制結構1451B-2。每-下方箝制結構i451A-;l、1451B-1大致上是相同的(例 如利用相同壓鑄模具形成)並且每一上方箝制結構1451A_2、1451B_2也是 大致上相同。每-箝継構具有數個螺孔,⑽鱗於減綱pcM141〇 上的螺孔1417 ’以助於箝制步驟。舉例來說,下方結構麟⑷旧包含 有第一螺孔1457A-1,其係對準於相對應的PCBA131〇的第二螺孔1417與相 對應的第三螺孔1457八-2,其係貫穿上方箝制結構1451八_2,在箝制步驟中 係經由用以組合螺絲1407來連接。 SATA SSD元件1400的、组配如第14 (A) _示,而完整裝配後之元件 如第14 (B)圖所示。連接器1430是後設於電路板1411的邊緣,介於細長 托架1451A、1451B之間。如同先前的具體實施例,殼體145〇不包含有頂 蓋與底蓋,藉此PCBA1410的兩個表面1412、1413是由相對應的上方開口 1460與下方開口 1465顯露出,其係各自界定於侧圍欄1451Α、1451β間。 另外,本發明之兩部分殼體的每一托架也可以是使用現有技術利用塑 膠模造而成,以進一步減少材料與製作成本。然而,利用塑膠包圍的SSDs 的接地是-個問題,_在讎殼找乎沒有金屬騎pCB接地。為了避 免廷個問題,在下列的具體實施例中,發明人在塑膠托架與PCB間增加一 個殼-接地接腳,來減弱塑膠殼因使用者所引起的小ESD電流。雖然塑膠殼 是絕緣體,某些塑膠仍可傳導小電流。# SSD元件是插入主機,施加於塑 膠托架的ESD電流可以透過殼—接地接腳至peg接地端來轉移並且隨後透過 一連接器至主機與主機的底架接地。The assembly of the SATA SSD component 1300 is as shown in Figure 13 (A), and the fully assembled components are shown in Figure 13 (B). The connector 1330 is embedded in the edge of the circuit board 1311 between the elongated brackets 1351A, 1351B. As with the previous embodiment, the housing 1350 does not include a top cover and a bottom cover 'where the two surfaces 1312, 1313 of the PCBA 1310 are exposed by the corresponding upper opening 1360 and the lower opening 1365, each of which is defined on the side Between the fences 1351A and 1351b. 14(A) and 14(B) are an exploded perspective view and a perspective view of a SSD component 1400 of a 1 〇" ZIF SATA type according to a 14th embodiment of the present invention, the SSD component 14 〇〇 There is a PCBA1410 comprising a memory chip array 142 and a control chip 1425 and a ZIF SATA type connector (not shown) embedded therein, and a two-part open-frame clamp support type of sad shell Body 1450. PCBA 1410 is similar to PCBA 110 (described previously) and package 3 has a circuit board 1411 having opposing upper and lower surfaces 14 丨 2, 1413. Screw holes 1417 are defined to pass through circuit board 1411 in place. In order to facilitate the (first) screw 连接 to connect the printed circuit board 1411 to the cover 1450. As shown in Fig. 14(1), the housing includes opposite first and second elongated brackets (side brackets) 1451A, 1451B, Each of the brackets includes a relatively clamped structure that is clamped to the edge of the PCBA 141G, whereby the elongated bracket button, 1451β is connected to the belly. The first elongated bracket 1451 includes a lower-clamping structure 145μ. } and the above-mentioned system structure H51A-2, the first The elongated bracket 1451B includes a lower clamping structure ι45ΐβ-i and a top 29 200924599 structure 1451B-2. The lower-lower clamping structures i451A-;l, 1451B-1 are substantially identical (eg, formed using the same die-casting mold) And each of the upper clamping structures 1451A_2, 1451B_2 is also substantially identical. Each of the jaws has a plurality of threaded holes, and (10) scales the threaded holes 1417' on the reduced pcM141's to assist in the clamping step. For example, below The structural lining (4) includes a first screw hole 1457A-1 which is aligned with the corresponding second screw hole 1417 of the PCBA 131 与 and the corresponding third screw hole 1457 八-2, which penetrates the upper clamping structure 1451. Eight_2, in the clamping step, is connected by means of a combination screw 1407. The assembly of the SATA SSD component 1400 is shown in Figure 14 (A), and the fully assembled component is as shown in Figure 14 (B). The connector 1430 is disposed at an edge of the circuit board 1411 between the elongated brackets 1451A, 1451B. As in the previous embodiment, the housing 145 does not include a top cover and a bottom cover, whereby the two PCBA 1410 Surfaces 1412, 1413 are by corresponding upper openings 14 60 and the lower opening 1465 are exposed, which are respectively defined between the side fences 1451Α, 1451β. In addition, each bracket of the two-part housing of the present invention can also be molded by using the prior art to further reduce the material. And the cost of production. However, the grounding of SSDs surrounded by plastic is a problem, _ in the clam shell to find no metal riding pCB ground. In order to avoid the problem, in the following specific embodiments, the inventor adds a case-ground pin between the plastic bracket and the PCB to reduce the small ESD current caused by the user of the plastic case. Although the plastic case is an insulator, some plastics can conduct small currents. # SSD components are plugged into the main unit. The ESD current applied to the plastic carrier can be transferred through the case-ground pin to the peg ground and then grounded through a connector to the chassis of the host and the host.

第15 (A)與15 (B)圖是依據本發明之第15具體實施例之2. 5” IDE 30 200924599 型態的SSD元件1500的元件分解示意圖與組配透視圖,SSD元件1500包含 有一 PCBA1510,其包含有一記憶體晶片陣列1520與一控制晶片1525與一 IDE型態的連接器1530嵌設於上,以及一兩部分塑膠/金屬開放式-框架符 制支撐型態殼體1550。PCBA1510是與PCBA110 (先前所述)相似並且包含 有電路板1511 ’其具有相對的上與下表面1512、1513。螺絲孔1517是定 義為在適當位置穿過電路板1511,以便於利用(第一)螺絲15〇7將印刷電 路板1511連接至殼體1550。連接器1530是IDE型態的連接器,其係電性 連接至控制Is 1525,其連接方式如同先前所述。 如第15 (A)圖所示,殼體1550包含有相對第一與第二細長托架(側 圍攔)1551A、1551B,其係個別連接至PCBA1510的邊緣,藉此細長托架 1551A、1551B是單獨地連接至PCBA1510。 第16(A)與16(B)圖顯示出托架1551A額外的細節(托架1551B大 致上與托架1551A相同)。托架1551A包含有一鑄造的細長塑膠結構1553, 其包含有設置在相對兩端的第一與第二中空結構、1554_2,與第一 與第二殼-接地接腳(金屬結構)1555_丨、1555_2,其各自設置在第一與第 —中空結構1554-1 ' 1554-2内。每一殼-接地接腳(金屬結構)、 1555-2包含有第一部1556 ’其具有利用先前所述方法鎖固至pCBA15i〇的 第-螺孔1557與-第二部·,其具有用連接托架卿八至主系統内部機 架框架的第二螺孔1558 ’以如先前所述之方法,如第丨⑻圖所示。如第 16 (B)圖所示,第三螺孔1558是透過側壁開口 1554_u、1554-2a存取, 側壁開口 1554-1A' 1554-2A是貫穿中空結構1554-1、1554-2的相對壁。 200924599 冋第16 (A)圖所示,每—殼-接地接腳1555-卜1555-2具有兩軸_ 一主軸是解觀簡’大部分魏辆孔·作為接_姻是位於中 心’而第二軸是作為導電圈的對準螺孔·,其係鎖固於職⑽上,以 與PCB接電端電性接觸。圍繞主轴的金屬(例如第二部15剛是作為額外 的接地金屬,來增加接地電容並且減弱可能對pcBAi5iG的K造成損傷的 ESD電流。因為主軸被第二軸抵銷,提供較大片的金屬來作為第二部㈣ 圍繞著主轴,以供第—部1556形成第二轴,藉此增加金屬接地匯點—如 ground sink)的大小並且增加它的效力。 請再參閱第15 ( A )與第15⑻圖,每一托架1551 a、1551B是利 用螺絲1507鎖固的方式來裝設,螺絲15〇7穿過pCM 151〇上的螺孔⑸7 與對應的第-螺孔1557,其係設置於中空結構^+^54-2的下方。㈣ SSDtl件1500的組配如第15(A)圖所示,而完整裝配後之元件如第15 (幻 圖所示。連接器1530是嵌設於電路板1511的邊緣,介於細長托架1551A、 1551B之間。如同先前的具體實施例,殼體155〇不包含有頂蓋與底蓋,藉 此PCBA1510的兩個表面1512、1513是由相對應的上方開口 1560與下方開 口 1565顯露出’而各自界定於側圍攔1551A、1551B間。 第Π(Α)與17(B)圖是依據本發明之第17具體實施例之2. 5” SATA 型態的SSD元件1600的元件分解示意圖與組配透視圖,SSD元件1600包含 有一 PCBA1610,其包含有一記憶體晶片陣列1620與一控制晶片1625與一 IDE型態的連接器1650嵌設於上,以及一兩部分塑膠/金屬開放式-框架箝 制支撐型態殼體1650。PCBA1610是與PCBA110 (先前所述)相似並且包含 32 200924599 有具有相對的上與下表面1612' 1613的電路板1611。螺絲孔1617是定義 為在適當位置穿過電路板16U,以便於湘(第一)螺絲薦將印刷電路 板1611連接至设體165〇。連接器163〇是標準的SATA型態連接器,其係電 性連接至控制器1625,其連接方式如同先前所述。 如第17 (A)圖所示,殼體165〇包含有相對第一與第二細長托架(側 圍攔)1651A、1651B ’其係各自成形且連接至pcM161〇的邊緣,藉此細長 托架1651A、1651B是單獨地連接至PCBA161〇。 第18 (A)與18 (B)圖顯示出托架1651A額外的細節(托架1651B大 致上與托架觀A _)。托架腿A包含有—鑄造的細長瓣結構·, 其包含有設置在相對兩端的第一與第二中空結構丨防^、1654_2,與各自 設置在第-與第二中空結構脳q '脳-2内的第-與第二殼-接地接腳 (佘屬結構)1655-卜1655-2。每一殼-接地接腳(金屬結構)丨、丨655 2 包含有第一部1656,其具有利用先前所述方法鎖固至pCBA161〇的第一螺孔 1657與一第二部1659,第二部1659具有第三螺孔1658,以利用先前所述 之方法連接托架1651A至主系統内部機架框架,如帛!⑻圖所示。如第 16 (B)圖所示’第三螺孔1658是透過側壁開口 1654_1A、1654—2a存取, 側壁開口 1654-1A、1654-2A是貫穿中空結構1654—1、1654-2的相對壁。 請再參閱第17 (A)與第17 ( B )圖,每一托架1651A、1651B是利 用螺絲1607鎖固的方式來裝設,螺絲1607穿過PCBA161〇上的螺孔1617 與對應的第一螺孔1657 ’其係設置於中空結構丨654_丨、丨654—2的下方。SATA SSD元件woo的組配如第17(a)圖所示,而完整裝配後之元件如第17(B) 33 200924599 圖所示。連接器1630是嵌設於電路板1611的邊緣,介於細長托架1651A、 1651B之間。如同先前的具體實施例,殼體1650不包含有頂蓋與底蓋,藉 此PCBA1610的兩個表面1612、1613是由相對應的上方開口 166〇與下方開 口 1665顯露出’其係各自界定於侧圍攔1651A、1651B間。 唯以上所述者,僅為本發明之較佳實施例而已’並非用來限定本發明 實施之範圍。故即凡依本發明申請範圍所述之特徵及精神所為之均等變化 或修飾’均應包括於本發明之申請專利範圍内。 【圖式簡單說明】 第1 (A)與1 (B)圖是依據本發明之具體實施例之具有一框架型態壓鑄金 屬開放式-框架支擇型態殼體之3. 5” SATA型態娜元件的元件分解透視 圖與組合後透視圖。 第2 (A)與2 (B)圖是依據本發明之另一具體實施例之具有一框架型態壓 鑄金屬開放式-框架支撐型態殼體之13”舰型態娜元件的元件分解透 視圖與頂面透視圖。 第3 (A)與3⑻圖是依據本發明之另—具體實施例之具有一框架型態塵 縳金屬開放式-框架支撐型態殼體之丨.8,’ sm型態SSD元件的播分解 透視圖與頂面透視圖。 第4 (A)與4⑻圖是依據本發明之具體實施例之具有—框架型態壓禱金 屬開放式-框架支揮型態殼體之丨.8”堆疊型態sm型態SSD树的元件 分解透視圖與頂面透視圖。 第5 (A)與5⑻圖是依據本發明之另—具體實施例之具有—框架型態壓 鳞金屬開放式-框架支撐型態殼體之2. 5” 3愚型態娜元件的元件分解 34 200924599 透視圖與頂面透視圖。 第6 (A)與6 (B)圖是依據本發明之另—具體實施例之具有—柩架型態壓 鑄金屬開放式—框架支撐型態殼體之2. 5”堆疊型態SATA型態SSD元件的 70件分解透視圖與頂面透視圖。 第7 (A)與7⑻岐依據本發明之另—具體實施例之具有—框架型態壓 轉金屬開放式-框架支撐型態殼體之L δ”腿養(具有ΖΙρ連接器)娜 元件的元件分解透視圖與頂面透視圖。 第8 (A)與8⑻圖是依據本發明之具體實施例之具有_兩部分壓禱金屬 開放式-框架支標型態殼體之3· 5” SATA型態娜元件的元件分解透視圖 與組合後透視圖。 第9 (A)與9 (B)圖是依據本發明之另—具體實施例之具有—兩部分麼禱 金屬開放式-框架支撑型態殼體之8” SATA型態SSD元件的元件分解透 視圖與頂面透視圖。 第10 (A)與10 (B)圖是依據本發明之另一具體實施例之具有一兩部分壓 轉金屬開放式-框架支撐型態殼體之2_5” SATA型態SSD元件的元件分解 透視圖與頂面透視圖。 第11 (A)與11 (B)圖是依據本發明之另一具體實施例之具有一兩部分壓 印金屬開放式-框架型態殼體之2. 5” IDE型態SSD元件的元件分解透視圖 與頂面透視圖。 第12 (A)與12 (B)圖是依據本發明之另一具體實施例之具有一兩部分箝 制型態壓鑄金屬開放式-框架型態殼體之2 8” SATA型態SSD元件的元件 35 200924599 分解透視圖與頂面透視圖。 第13 (Α)與13 (Β)圖是依據本發明之另—具體實施例之具有—兩部分箱 制型態壓鑄金屬開放式—框架型態殼體之G 58” ZIF sm型態娜元件的 元件分解透視圖與頂面透視圖。 第14 (A)與14 (B)圖是依據本發明之另一具體實施例之具有一兩部分箝 制型悲壓鑄金屬開放式-框架型態殼體之1()”训逼型態娜猶的元 件分解透視圖與頂面透視圖。 第15 (A)與15 (B)圖是依據本發明之另_具體實施例之具有一兩部分塑 谬/金屬開放式-框架型態殼體之2. 5” IDE型態SSD元件的元件分解透視 圖與頂面透視圖。 第16 (A)與16 (B)圖是詳細描繪出第15 與15 (B)之SSD之托架 的分解透視圖與頂面透視圖。 第17 (A)與17 (B)圖是依據本發明之另一具體實施例之具有一兩部分塑 膠/金屬開放式-框架型態殼體之2· 5” SATA型態SSD &件的元件分解透祝 圖與頂面透視圖。 第18 (A)與18 (B)圖是詳細描繪出第17 (A)與17 (B)之SSD之托架 的分解透視圖與頂面透視圖。 【主要元件符號說明】15(A) and 15(B) are an exploded perspective view and a perspective view of a SSD component 1500 of the Model 5 200924599 according to the fifteenth embodiment of the present invention, the SSD component 1500 having a The PCBA 1510 includes a memory chip array 1520 and a control wafer 1525 and an IDE type connector 1530 embedded therein, and a two-part plastic/metal open-frame carrier support type housing 1550. PCBA1510 Is similar to PCBA 110 (described previously) and includes a circuit board 1511' having opposing upper and lower surfaces 1512, 1513. Screw holes 1517 are defined to pass through circuit board 1511 in place for ease of use (first) The screw 15〇7 connects the printed circuit board 1511 to the housing 1550. The connector 1530 is an IDE type connector that is electrically connected to the control Is 1525 in the same manner as previously described. For example, item 15 (A) As shown, the housing 1550 includes opposing first and second elongated brackets (side rails) 1551A, 1551B that are individually connected to the edges of the PCBA 1510, whereby the elongated brackets 1551A, 1551B are individually connected to the PCBA 1510. 16(A) and 16(B) Additional details of the bracket 1551A are shown (the bracket 1551B is substantially identical to the bracket 1551A). The bracket 1551A includes a cast elongated plastic structure 1553 that includes first and second hollow structures disposed at opposite ends, 1554_2 And first and second shell-grounding pins (metal structures) 1555_丨, 1555_2, each of which is disposed within the first and first hollow structures 1554-1 ' 1554-2. Each shell-grounding pin ( Metal structure), 1555-2 comprises a first portion 1556' having a first screw hole 1557 and a second portion locked to the pCBA15i〇 by the method previously described, which has a connection bracket for the eighth system to the main system The second screw hole 1558' of the inner frame frame is as shown in the above, as shown in the figure (8). As shown in Fig. 16(B), the third screw hole 1558 is through the side wall opening 1554_u, 1554- 2a access, side wall opening 1554-1A' 1554-2A is the opposite wall penetrating the hollow structures 1554-1, 1554-2. 200924599 冋 16 (A), each shell-grounding pin 1555-b 1555 -2 has two axes _ a spindle is a solution to the simple 'most Wei Weikong · as the connection _ marriage is located in the center' and the first The shaft is an alignment screw hole as a conductive ring, which is locked on the working (10) to make electrical contact with the electrical connection end of the PCB. The metal surrounding the main shaft (for example, the second portion 15 is just an additional grounding metal, Increase the grounding capacitance and attenuate the ESD current that could damage the K of the pcBAi5iG. Because the main shaft is offset by the second shaft, a larger piece of metal is provided as a second portion (4) around the main shaft for the first portion 1556 to form a second shaft, thereby increasing the size of the metal grounding junction, such as a ground sink, and Increase its effectiveness. Please refer to the 15th (A) and 15th (8) diagrams. Each bracket 1551 a, 1551B is fixed by means of screws 1507. The screws 15〇7 pass through the screw holes (5) 7 on the pCM 151〇 and the corresponding The first screw hole 1557 is disposed below the hollow structure ^+^54-2. (4) The assembly of the SSDtl member 1500 is as shown in Fig. 15(A), and the components after the complete assembly are as shown in Fig. 15 (the magic diagram is shown. The connector 1530 is embedded on the edge of the circuit board 1511, and is disposed between the elongated brackets. Between 1551A and 1551B. As in the previous embodiment, the housing 155 does not include a top cover and a bottom cover, whereby the two surfaces 1512, 1513 of the PCBA 1510 are exposed by the corresponding upper opening 1560 and the lower opening 1565. And each of them is defined between the side fences 1551A and 1551B. The second (Α) and 17 (B) diagrams are schematic diagrams of the components of the 2. 5" SATA type SSD component 1600 according to the 17th embodiment of the present invention. In conjunction with the perspective view, the SSD component 1600 includes a PCBA 1610 including a memory die array 1620 and a control wafer 1625 and an IDE type connector 1650 embedded therein, and a two-part plastic/metal open type - The frame clamps the support profile housing 1650. The PCBA 1610 is similar to the PCBA 110 (described previously) and includes 32 200924599 having a circuit board 1611 having opposing upper and lower surfaces 1612' 1613. The screw holes 1617 are defined to pass through in place Circuit board 16U, so that Xiang The first) screw recommends connecting the printed circuit board 1611 to the body 165. The connector 163A is a standard SATA type connector that is electrically connected to the controller 1625 in the same manner as previously described. As shown in Fig. 17(A), the housing 165'' includes the opposite first and second elongated brackets (side brackets) 1651A, 1651B' which are each shaped and connected to the edge of the pcM161, whereby the elongated bracket 1651A The 1651B is separately connected to the PCBA161. The 18th (A) and 18(B) diagrams show additional detail of the bracket 1651A (the bracket 1651B is substantially aligned with the bracket view A_). The bracket leg A contains - a cast elongated slab structure comprising: first and second hollow structures 丨, 1654_2 disposed at opposite ends, and first and second respectively disposed in the first and second hollow structures 脳q '脳-2 a second shell-grounding pin (female structure) 1655-b 1655-2. Each shell-grounding pin (metal structure) 丨, 丨 655 2 includes a first portion 1656 having a lock using the method previously described Fixed to the first screw hole 1657 of the pCBA161〇 and a second portion 1659, the second portion 1659 has a third screw hole 1658 for utilizing The method connects the bracket 1651A to the internal frame frame of the main system, as shown in Fig. 8 (B). As shown in Fig. 16(B), the third screw hole 1658 is accessed through the side wall openings 1654_1A, 1654-2a. The side wall openings 1654-1A, 1654-2A are opposing walls that extend through the hollow structures 1654-1, 1654-2. Please refer to the 17th (A) and 17th (B) diagrams. Each bracket 1651A and 1651B is installed by means of a screw 1607. The screw 1607 passes through the screw hole 1617 on the PCBA161〇 and the corresponding number. A screw hole 1657' is disposed below the hollow structures 丨654_丨 and 丨654-2. The assembly of the SATA SSD component woo is shown in Figure 17(a), and the fully assembled components are shown in Figure 17(B) 33 200924599. The connector 1630 is embedded in the edge of the circuit board 1611 between the elongated brackets 1651A, 1651B. As with the previous embodiment, the housing 1650 does not include a top cover and a bottom cover, whereby the two surfaces 1612, 1613 of the PCBA 1610 are exposed by the corresponding upper opening 166 and the lower opening 1665. Side fence between 1651A and 1651B. The above is only the preferred embodiment of the invention and is not intended to limit the scope of the invention. Therefore, any changes or modifications of the features and spirits described in the scope of the present invention should be included in the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1(A) and 1(B) are a 3. 5” SATA type having a frame type die-cast metal open-frame-selective type housing according to a specific embodiment of the present invention. An elemental exploded perspective view and a combined rear perspective view of a state element. FIGS. 2(A) and 2(B) are diagrams showing a frame type die-cast metal open-frame support type according to another embodiment of the present invention. An exploded perspective view and a top perspective view of the 13" ship-type Na element of the housing. 3(A) and 3(8) are broadcast decompositions of a 丨.8,' sm type SSD element having a frame type dust-bonded metal open-frame support type housing according to another embodiment of the present invention. Perspective and top perspective. 4(A) and 4(8) are diagrams of a ”.8" stacked sm-type SSD tree having a frame-type pray metal open-frame slewing type housing in accordance with an embodiment of the present invention. 5 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 3 elements of the stupid Na Na component 34 200924599 perspective and top perspective. Figure 6 (A) and 6 (B) is a truss type die-cast metal open-frame support type housing according to another embodiment of the present invention 2. 5" stacked type SATA type 70-piece exploded perspective view and top perspective view of the SSD component. 7(A) and 7(8), according to another embodiment of the present invention, having a frame-type compression metal open-frame support type housing An exploded view of the elements of the L δ" leg (with ΖΙρ connector) Na element and a top perspective view. 8(A) and 8(8) are exploded perspective views of elements of a 3·5" SATA type Na-shaped element having a two-part pray metal open-frame framing type housing in accordance with an embodiment of the present invention. Figure 9 (A) and 9 (B) are 8" SATA type SSDs with a two-part prayer metal open-frame support type housing in accordance with another embodiment of the present invention. An exploded perspective view of the components and a top perspective view. 10(A) and 10(B) are exploded perspective views of a 2_5" SATA type SSD component having a two-part compression metal open-frame support type housing in accordance with another embodiment of the present invention. Figure and top perspective view. Figures 11 (A) and 11 (B) are a two-part embossed metal open-frame type housing according to another embodiment of the present invention. An exploded perspective view and a top perspective view of a type of SSD component. 12(A) and 12(B) are diagrams showing a 28" SATA type SSD component having a two-part clamp-type die-cast metal open-frame type housing in accordance with another embodiment of the present invention. 35 200924599 Decomposition perspective and top perspective view. The 13th (Α) and 13 (Β) diagrams are two-part box type die-cast metal open-frame type shells according to another embodiment of the present invention. The elemental G 58” ZIF sm type Na element has an exploded perspective view and a top perspective view. 14(A) and 14(B) are diagrams showing a 1()"-type" of a two-part clamp-type sad-cast metal open-frame type housing according to another embodiment of the present invention. An exploded perspective view of the elements and a top perspective view. Figures 15(A) and 15(B) are diagrams of a two-part plastic/metal open-frame type housing in accordance with another embodiment of the present invention. 2. 5" IDE type SSD component component perspective and top perspective. The 16th (A) and 16(B) drawings are an exploded perspective view and a top perspective view of the bracket of the SSDs 15 and 15 (B) in detail. 17(A) and 17(B) are diagrams showing a 2" 5" SATA type SSD & piece having a two-part plastic/metal open-frame type housing in accordance with another embodiment of the present invention. The element is exploded and the top perspective view. The 18th (A) and 18th (B) drawings are an exploded perspective view and a top perspective view of the bracket of the 17th (A) and 17 (B) SSD. [Main component symbol description]

50 CPU 55内部機架框架 100 SSD元件 u〇印刷電路板總成(PCBA) 36 200924599 111電路板 112上表面 113下表面 114接觸墊 115校準溝槽 117螺絲孔 120記憶體晶片 125控制器晶片 130連接器 131引線 135插座 150殼體 151A第一側圍欄 151B第二側圍欄 152A第一端圍襴 152B第二端圍欄 153L底(水平)部 153U上(垂直)部 154開放間隙 155A導件柱 155B校準柱 37 200924599 156支撐柱 157螺孔 158螺絲孔 159螺孔 160上方開口 165下方開口 200 SSD元件 207螺絲 210 PCBA 211電路板 212上方表面 213下方表面 217螺絲孔 220記憶體晶片 225控制晶片 227主/從交換器 230連接器 250殼體 251A第一側圍欄 251B第二側圍欄 252A第一端圍欄 38 200924599 252B第二端圍欄 253L下(水平的)凸緣部 253U上方(垂直)凸緣部 254開口間隙 256支撐柱 257螺絲孔 258螺孔 260上方開口 265下方開口 300 SSD元件 307螺絲50 CPU 55 internal frame frame 100 SSD component u〇 printed circuit board assembly (PCBA) 36 200924599 111 circuit board 112 upper surface 113 lower surface 114 contact pad 115 calibration trench 117 screw hole 120 memory chip 125 controller chip 130 Connector 131 Lead 135 Socket 150 Housing 151A First Side Fence 151B Second Side Fence 152A First End Cofferdam 152B Second End Fence 153L Bottom (Horizontal) Portion 153U Upper (Vertical) Portion 154 Open Gap 155A Guide Post 155B Calibration column 37 200924599 156 support column 157 screw hole 158 screw hole 159 screw hole 160 upper opening 165 lower opening 200 SSD component 207 screw 210 PCBA 211 circuit board 212 upper surface 213 lower surface 217 screw hole 220 memory chip 225 control wafer 227 main / slave switch 230 connector 250 housing 251A first side rail 251B second side fence 252A first end fence 38 200924599 252B second end fence 253L lower (horizontal) flange portion 253U upper (vertical) flange portion 254 Opening gap 256 support column 257 screw hole 258 screw hole 260 upper opening 265 lower opening 300 SSD component 307 screw

310 PCBA 311電路板 312上表面 313下表面 317螺絲孔 320記憶體晶片 330連接器 350殼體 351A第一側圍欄 351B第二側圍欄 200924599 352A第一端圍欄 352B第二端圍欄 353U上(水平的)凸緣部 35L下方(垂直)凸緣部 354開口間隙 355角落柱 356支撐柱 357螺孔 358螺孔 400 SSD元件310 PCBA 311 circuit board 312 upper surface 313 lower surface 317 screw hole 320 memory chip 330 connector 350 housing 351A first side fence 351B second side fence 200924599 352A first end fence 352B second end fence 353U (horizontal Flange portion 35L lower (vertical) flange portion 354 opening gap 355 corner post 356 support post 357 screw hole 358 screw hole 400 SSD element

410-1 > 410-2 PCBA 420記憶體晶片陣列 430-1、430-2 連接器 450殼體 454開口間隙 460上方開口 465下方開口 470橡膠墊 500 SSD元件 507螺絲410-1 > 410-2 PCBA 420 Memory Chip Array 430-1, 430-2 Connector 450 Housing 454 Opening Clearance 460 Upper Opening 465 Lower Opening 470 Rubber Pad 500 SSD Component 507 Screw

510PCBA 40 200924599 511電路板 512上表面 513下表面 517螺絲孔 520記憶體晶片陣列 525控制晶片 530連接器 550殼體 551A第一側圍欄 551B第二側圍欄 552A第一端圍欄 552B第二端圍欄 553L下(水平)凸緣部 553U上(垂直)凸緣部 554開口間隙 556支撐柱 557螺孔 558螺孔 560上方開口 565下方開口 600SSD元件 200924599510PCBA 40 200924599 511 circuit board 512 upper surface 513 lower surface 517 screw hole 520 memory chip array 525 control wafer 530 connector 550 housing 551A first side fence 551B second side fence 552A first end fence 552B second end fence 553L Lower (horizontal) flange portion 553U (vertical) flange portion 554 opening gap 556 support column 557 screw hole 558 screw hole 560 above opening 565 opening 600SSD element 200924599

610-1 > 610-2 PCBA 620記憶體晶片陣列 625控制晶片 630連接器 650殼體 654開口間隙 660上方開口 665下方開口 670橡膠墊 700 SSD元件 707螺絲610-1 > 610-2 PCBA 620 memory chip array 625 control chip 630 connector 650 case 654 opening gap 660 upper opening 665 lower opening 670 rubber pad 700 SSD component 707 screw

710 PCBA 711電路板 712上表面 713下表面 717螺絲孔 720記憶體晶片 730連接器 750殼體 751A第一側圍攔 751B第二側圍欄 42 200924599 752A第一端圍欄 752B第二端圍欄 753L下(水平)凸緣部 753U上(垂直)凸緣部 754開口間隙 756支撐柱 757螺孔 760上方開口 765下方開口 800 SSD元件 807螺絲710 PCBA 711 circuit board 712 upper surface 713 lower surface 717 screw hole 720 memory chip 730 connector 750 housing 751A first side fence 751B second side fence 42 200924599 752A first end fence 752B second end fence 753L ( Horizontal) flange portion 753U upper (vertical) flange portion 754 opening gap 756 support column 757 screw hole 760 above opening 765 opening 800 SSD component 807 screw

810 PCBA 811電路板 812上表面 813下表面 817螺絲孔 820記憶體晶片 825控制晶片 830連接器 850殼體 851A第一細長托架 43 200924599 851B第二細長托架 853L下方(水平)部 853U上方(垂直)部 855A導引柱 855B對準柱 856支撐柱 857螺孔 860上方開口 865下方開口 900 SSD元件 907螺絲810 PCBA 811 circuit board 812 upper surface 813 lower surface 817 screw hole 820 memory chip 825 control chip 830 connector 850 housing 851A first elongated bracket 43 200924599 851B second elongated bracket 853L below (horizontal) portion 853U ( Vertical) portion 855A guide post 855B alignment post 856 support post 857 screw hole 860 above opening 865 opening 900 SSD component 907 screw

910 PCBA 911電路板 912上表面 913下表面 920記憶體晶片 925控制晶片 930連接器 950殼體 951A第一細長托架 951B第二細長托架 200924599 956支撐柱 957螺孔 958螺孔 960上方開口 965下方開口 1000 SSD 元件 1007螺絲 1010 PCBA 1011電路板 1012上表面 1013下表面 1020記憶體晶片 1025控制晶片 1030連接器 1050殼體 1051A第一細長托架 1051B第二細長托架 1056支撐柱 1057螺孔 1058螺孔 1060上方開口 45 200924599 1065下方開口 1100 SSD 元件 1107螺絲 1110 PCBA 1111電路板 1112上表面 1113下表面 1120記憶體晶片 1125控制晶片 1130連接器 1150殼體 1151A第一細長托架 1151B第二細長托架 1153V垂直凸緣部 1153H1、1153H2水平凸緣部 1157螺孔 1158螺孔 1160上方開口 1165下方開口 1200 SSD 元件 1207螺絲 200924599 1210 PCBA 1211電路板 1212上表面 1213下表面 1217螺絲孔 1220記憶體晶片 1230連接器 1250殼體 1251A第一細長托架 1251A-1下方箝制結構 1251A-2上方箝制結構 1251B第二細長托架 1251B-1下方箝制結構 1251B-2上方箝制結構 1257螺孔 1257A-1第一螺孔 1257A-2第三螺孔 1260上方開口 1265下方開口 1300 SSD 元件 1307螺絲 200924599 1310 PCBA 1311電路板 1312上表面 1313下表面 1317螺絲孔 1320記憶體晶片 1330連接器 1350殼體 1351A第一細長托架 1351A-1下方箝制結構 1351A-2上方箝制結構 1351B第二細長托架 1351B-1下方箝制結構 1351B-2上方箝制結構 1357螺孔 1357A-1第一螺孔 1357A-2第三螺孔 1360上方開口 1365下方開口 1400 SSD 元件 1407螺絲 48 200924599 1410 PCBA 1411電路板 1412上表面 1413下表面 1417螺絲孔 1420記憶體晶片 1425控制晶片 1450殼體 1451A第一細長托架 1451A-1下方箝制結構 1451A-2上方箝制結構 1451B第二細長托架 1451B-1下方箝制結構 1451B-2上方箝制結構 1457A-1第一螺孔 1457A-2第三螺孔 1460上方開口 1465下方開口 1500 SSD 元件 1510 PCBA 1511電路板 200924599 1512上表面 1513下表面 1517螺絲孔 1520記憶體晶片 1525控制晶片 1530連接器 1550殼體 1551A第一細長托架 1551B第二細長托架 1553塑膠結構 1554-1第一中空結構 1554-2第二中空結構 1554-1A側壁開口 1554- 2A側壁開口 1555- 1第一殼-接地接腳 1555-2第二殼-接地接腳 1556第一部 1557第一螺孔 1558第三螺孔 1559第二部 1560上方開口 200924599 1565下方開口 1600 SSD 元件 1607螺絲 1610 PCBA 1611電路板 1612上表面 1613下表面 1617螺絲孔 1620記憶體晶片 1625控制晶片 1630連接器 1650殼體 1651A第一細長托架 1651B第二細長托架 1653塑膠結構 1654-1第一中空結構 1654-2第二中空結構 1654-1A側壁開口 1654- 2A側壁開口 1655- 1第一殼-接地接腳 1655-2第二殼-接地接腳 200924599 1656第一部 1657第一螺孔 1658第三螺孔 1659第二部 1660上方開口 1665下方開口910 PCBA 911 circuit board 912 upper surface 913 lower surface 920 memory chip 925 control wafer 930 connector 950 housing 951A first elongated bracket 951B second elongated bracket 200924599 956 support column 957 screw hole 958 screw hole 960 upper opening 965 Lower opening 1000 SSD component 1007 screw 1010 PCBA 1011 circuit board 1012 upper surface 1013 lower surface 1020 memory wafer 1025 control wafer 1030 connector 1050 housing 1051A first elongated bracket 1051B second elongated bracket 1056 support column 1057 screw hole 1058 Opening above screw hole 1060 45 200924599 1065 opening below 1100 SSD component 1107 screw 1110 PCBA 1111 circuit board 1112 upper surface 1113 lower surface 1120 memory wafer 1125 control wafer 1130 connector 1150 housing 1151A first elongated bracket 1151B second slender support 1153V vertical flange portion 1153H1, 1153H2 horizontal flange portion 1157 screw hole 1158 screw hole 1160 upper opening 1165 lower opening 1200 SSD component 1207 screw 200924599 1210 PCBA 1211 circuit board 1212 upper surface 1213 lower surface 1217 screw hole 1220 memory wafer 1230 Connector 1250 housing 1251A first elongated bracket 1251A-1 under the clamping structure 1251A- 2 upper clamping structure 1251B second elongated bracket 1251B-1 lower clamping structure 1251B-2 upper clamping structure 1257 screw hole 1257A-1 first screw hole 1257A-2 third screw hole 1260 upper opening 1265 lower opening 1300 SSD component 1307 screw 200924599 1310 PCBA 1311 circuit board 1312 upper surface 1313 lower surface 1317 screw hole 1320 memory chip 1330 connector 1350 housing 1351A first elongated bracket 1351A-1 lower clamping structure 1351A-2 upper clamping structure 1351B second elongated bracket 1351B -1 lower clamping structure 1351B-2 upper clamping structure 1357 screw hole 1357A-1 first screw hole 1357A-2 third screw hole 1360 upper opening 1365 lower opening 1400 SSD component 1407 screw 48 200924599 1410 PCBA 1411 circuit board 1412 upper surface 1413 Lower surface 1417 screw hole 1420 memory wafer 1425 control wafer 1450 housing 1451A first elongated bracket 1451A-1 lower clamping structure 1451A-2 upper clamping structure 1451B second elongated bracket 1451B-1 lower clamping structure 1451B-2 upper clamping Structure 1457A-1 first screw hole 1457A-2 third screw hole 1460 upper opening 1465 lower opening 1500 SSD component 1510 PCBA 1511 circuit board 200924599 1512 Upper surface 1513 lower surface 1517 screw hole 1520 memory wafer 1525 control wafer 1530 connector 1550 housing 1551A first elongated bracket 1551B second elongated bracket 1553 plastic structure 1554-1 first hollow structure 1554-2 second hollow structure 1554-1A side wall opening 1554- 2A side wall opening 1555-1 first case-grounding pin 1555-2 second case-grounding pin 1556 first part 1557 first screw hole 1558 third screw hole 1559 second part 1560 Opening 200924599 1565 opening 1600 SSD component 1607 screw 1610 PCBA 1611 circuit board 1612 upper surface 1613 lower surface 1617 screw hole 1620 memory wafer 1625 control wafer 1630 connector 1650 housing 1651A first elongated bracket 1651B second elongated bracket 1653 Plastic structure 1654-1 first hollow structure 1654-2 second hollow structure 1654-1A side wall opening 1654- 2A side wall opening 1655-1 first case-grounding pin 1655-2 second case-grounding pin 200924599 1656 first Part 1657 first screw hole 1658 third screw hole 1659 second portion 1660 upper opening 1665 lower opening

Claims (1)

200924599 十、申請專利範圍: :固態硬碟(SSD)元件,其係提供具有—内部機架框架之主系統永 久的記憶體,該s SD元件包含有: 一印刷電路板總成,其包含有一電路板,該電路板具有相對的第一與第二 表面,數個記憶體晶片,其嵌設於該電路板的該第一與第二表面之至少 -面上;-控制器晶片’其嵌設於該電路板之該第—與第二表面之一, 該控制器具有一輸入/輸入介面電路,以接繫主系統,以及一處理器單200924599 X. Patent application scope: Solid-state hard disk (SSD) component, which provides a permanent memory of a main system having an internal frame frame, the s SD component comprising: a printed circuit board assembly including a circuit board having opposite first and second surfaces, a plurality of memory chips embedded on at least the surface of the first and second surfaces of the circuit board; Provided on one of the first and second surfaces of the circuit board, the controller has an input/output interface circuit for connecting the main system, and a processor single 元’其係存取該數個記麵晶片,朗應由該輪人/輪出介面電路所接 收的該主系統之指令; 一連接器,其嵌設於該電路板上,以連接該控制器晶片至該主系統;以及 -開放式-框架支推型態殼體,其包含有沿著該電路板的相對周緣延伸的 第-與第二平行細長托架’每一該第一與第二托架包含有一位於該殼體 内的第-連接結構,以供將該電路板鎖固至該殼體,與—位於該殼體外 表面的第二連接結構’以供連接至該主系統的該内部機架框架, 其中該開放式-框架支揮型態殼體並不包含有—頂蓋與—下蓋藉此該兩 相對第-與第二表面係各由第一與第二開口顯露出,因此延伸於該第一 與第二細長托架間,以及 其中該連接器是設置於該第一與第二開口之_。 2.如申請專利範圍第丨項所述之s s D元件,其中該開放式.支撑型態 殼體更包含有第-與第二端側圍,其係整合連接至該第一與第二托架, 因此該第-與第二端圍攔與該第一與第二托架形成一框架, 其中每—該第—與第二平行細長托架無第—與第二端關包含有一 L 53 200924599 形凸緣,其具有一水平凸緣部與一垂直延伸至該水平凸緣部的垂直凸緣 部’以及 其中該連接器是設置於一開口間隙,其位於該第一與第二端圍欄之一的垂 直部。 3. 如申請專利範圍第2項所述之s SD元件,其中每一該第一連接結構包 含有一支撐柱,其設置於該第一與第二托架之一的該垂直部的内表面, 該支撐柱上形成有一第一螺孔, 其中該PCBA有一第二螺孔, 其中該PCBA是嵌設於該支撐柱上,因此第一螺孔是對準該第二螺孔,以 及 其中該SSD元件更包含有第-螺孔,其穿過該第二螺孔並插設熱該第一螺 孔。 4. 如申請專利範圍第3項所述之SSD元件,其中該開放式-框架支撑型態殼 體更包含有第-與第二柱,其係設置於該第一與第二托架之—的該垂直 部的一内側表面,鄰近該支撐柱, 其中該PCBA的魏雜更包含有鮮_,魏沿著該電雜周緣,因 此當該PCBA嵌設至該開放式-框架支擇型態殼體時,該柱被容納於該谢 準溝槽内,因此該PCBA是設置在相對該開放式-框蚊樓型態殼體,該 第二螺孔對準該第一螺孔。 5. 如申請專利範圍第3項所述之SSD元件,其中該第一連接結構的至少一 個更包含有-金屬環,其設置在該電路板上圍繞—對應的該第二螺孔, 54 200924599 該金屬環係利用金屬佈線電性連接至該電路板的一接地板,以及 其中該第一螺絲的一對應者延伸穿過該對應的第二螺孔,該對應者是電性 連接至該金屬環,以提供一介於該接地板與該開放式-框架支撐型態殼 體間的電流路徑。 6. 如申請專利範圍第2項所述SSD元件,其中每一該第二連接結構包含有 一或者以上個第三螺孔,其係設置於該第一與第二托架之一的該垂直部 的一外表面上。 7. 如申請專利範圍第丨項所述之SSD元件,其中該第一與第二平行細長托 架包含有本質上相同的結構, 其中每一該第一連結構包含有數個螺孔,其係位於該第一與第二托架 上, 其中該PCBA界定第二螺孔, 其十該PCBA嵌設於每一該第一與第二平行細長托架的該支撐柱上因 此每一第一螺孔是對準於該第二螺孔之一相對應者, Λ中該SSD元件更包含有數個第一螺絲,每一第一螺絲穿設過該第二螺 孔的-對應者並_§_插設人它對應的第—螺孔,藉此該第—與第二平 仃細長托架透過該pCBA與該第一螺絲連接在一起。 8. 如申請專利範圍第7項所述之SSD元件,其中每-該第-與第二平行細 長托架包3有壓鑄金屬結構,其包含有—水平凸緣部與—垂直凸緣 邛,其垂直延伸至該水平凸緣部, -中每》亥第-連接結構包含有數個支樓柱,其設置於每一該第一與第 55 200924599 一托架之該垂直凸緣部的該内表面,每一該支撐柱界定一該第一螺 孔的一相對者,以及 其中每一該第二連接結構包含有數個第三螺孔,其係設置於每一該第一與 第一托架之該垂直凸緣的外表面上。 9. 如申請專利細第7項所述之娜元件,其中每一該第—與第二平行細 長托架包含有-壓印金屬結構,其包含有一細長垂直凸緣部, 其中每-該第-連接結構包含有數個水平凸緣部,其垂直延伸至每一該第 -與第二托架的該垂直凸緣部,每—該水平凸緣部界定—該第—螺孔的 相對者,以及 其中每-該第二連接結構包含有數個第三螺孔,其係設置於每一該第一與 第二托架之該垂直凸緣部的外表面上。 10. 如申請專利範圍第7項所述之SSD元件,其中每一該第一與第二平行細 長托架包含有-下方卿結構與—上方箝制結構 ,以及 其中母I該第-連接結構包含有該第一螺孔,其界定為穿過每一該第一與 第二平行細長托架之該下方箝制結構,並且第三螺孔界定為穿過每一該 第—與第二平行細長托架之該上方箝制結構 ,以及 其中母-該第-螺絲穿過—相對第三螺孔,f過—相對第二螺孔並且插設 入相對第-概’藉此該peBA傲設於每—該第—與第二平行細長托 架之該上方嵌設結構與該下方嵌設結構間。 11 ·如申:專利範圍第7項所述之娜元件,其中每一該第一與第二平行細 13有模田長塑膠結構,其包含有第一與第二中空結構,其 56The element 'accesses the plurality of face wafers, the instructions of the main system received by the wheel/round interface circuit; a connector embedded on the circuit board to connect the control a wafer to the main system; and an open-frame thrust type housing comprising first and second parallel elongated brackets extending along opposite edges of the circuit board each of the first and the The second bracket includes a first connection structure in the housing for locking the circuit board to the housing, and a second connection structure on the outer surface of the housing for connection to the main system The inner frame frame, wherein the open-frame slewing type housing does not include a top cover and a lower cover, whereby the two opposite first and second surface systems are respectively exposed by the first and second openings And extending between the first and second elongated brackets, and wherein the connector is disposed in the first and second openings. 2. The ss D component of claim 2, wherein the open support type housing further comprises first and second end sides, which are integrally connected to the first and second support The first and second end brackets form a frame with the first and second brackets, wherein each of the first and second parallel elongated brackets has no first and second ends including an L 53 200924599 a flange having a horizontal flange portion and a vertical flange portion extending perpendicularly to the horizontal flange portion and wherein the connector is disposed in an opening gap located at the first and second end fences One of the vertical parts. 3. The SD component of claim 2, wherein each of the first connection structures includes a support post disposed on an inner surface of the vertical portion of one of the first and second brackets, Forming a first screw hole in the support post, wherein the PCBA has a second screw hole, wherein the PCBA is embedded on the support post, so the first screw hole is aligned with the second screw hole, and wherein the SSD The component further includes a first screw hole that passes through the second screw hole and is inserted into the first screw hole. 4. The SSD component of claim 3, wherein the open-frame support type housing further comprises first and second posts disposed on the first and second brackets - An inner side surface of the vertical portion is adjacent to the support column, wherein the PCBA of the PCBA further comprises fresh _, Wei along the electrical peripheral edge, so when the PCBA is embedded to the open-frame selective type In the case of the housing, the post is received in the X-ray groove, so the PCBA is disposed opposite to the open-frame mosquito-type housing, and the second screw hole is aligned with the first screw hole. 5. The SSD component of claim 3, wherein at least one of the first connection structures further comprises a metal ring disposed on the circuit board to correspond to the second screw hole, 54 200924599 The metal ring is electrically connected to a ground plate of the circuit board by using a metal wire, and wherein a corresponding one of the first screws extends through the corresponding second screw hole, and the corresponding one is electrically connected to the metal a ring to provide a current path between the ground plate and the open-frame support type housing. 6. The SSD component of claim 2, wherein each of the second connection structures includes one or more third screw holes disposed in the vertical portion of one of the first and second brackets On an outer surface. 7. The SSD component of claim 2, wherein the first and second parallel elongated brackets comprise substantially the same structure, wherein each of the first connectors comprises a plurality of screw holes, Located on the first and second brackets, wherein the PCBA defines a second screw hole, and the PCBA is embedded in the support post of each of the first and second parallel elongated brackets, thus each first screw The hole is aligned with one of the second screw holes, wherein the SSD component further comprises a plurality of first screws, each of the first screws passing through the corresponding counterpart of the second screw hole and _§_ Inserting a corresponding first screw hole thereof, whereby the first and second flat elongated brackets are coupled to the first screw through the pCBA. 8. The SSD component of claim 7, wherein each of the first and second parallel elongated carrier packages 3 has a die cast metal structure including a horizontal flange portion and a vertical flange 邛, And extending vertically to the horizontal flange portion, wherein each of the first-connection structures comprises a plurality of branch columns disposed in the vertical flange portion of each of the first and 55th 200924599 brackets a surface, each of the support columns defining a counterpart of the first screw hole, and each of the second connection structures includes a plurality of third screw holes disposed in each of the first and first brackets On the outer surface of the vertical flange. 9. The nano element as claimed in claim 7, wherein each of the first and second parallel elongated brackets comprises an embossed metal structure comprising an elongated vertical flange portion, wherein each The connection structure includes a plurality of horizontal flange portions extending perpendicularly to the vertical flange portion of each of the first and second brackets, each of the horizontal flange portions defining - the opposite of the first screw holes, And wherein each of the second connection structures includes a plurality of third screw holes disposed on an outer surface of the vertical flange portion of each of the first and second brackets. 10. The SSD component of claim 7, wherein each of the first and second parallel elongated brackets comprises a lower-lower structure and an upper clamped structure, and wherein the female-first-connected structure comprises There is the first screw hole defined as the lower clamping structure passing through each of the first and second parallel elongated brackets, and the third screw hole is defined to pass through each of the first and second parallel elongated brackets The upper clamping structure of the frame, and wherein the female-the first-screw passes through - relative to the third screw hole, f--relative to the second screw hole and is inserted into the relative-first" thereby the peBA is proudly located in each - The upper and second parallel elongated brackets are disposed between the upper embedded structure and the lower embedded structure. 11. The method of claim 7, wherein the first and second parallel thin portions 13 have a die-length plastic structure including first and second hollow structures, 56
TW97112170A 2007-10-30 2008-04-03 Solid state drive (SSD) with open top and bottom covers TW200924599A (en)

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