200924244 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種發光單元，特別關於一種具有密閉 空間的發光單元。 【先前技術】 由於發光二極體（Light Emitting Diode, LED)具有高 亮度及省電等優點，因此，隨著發光二極體的技術逐漸成 熟，其應用領域也越來越廣泛，例如光源及背光源。 請參照圖1所示，一種習知的發光單元1包含一基板 11、複數個發光二極體晶粒12、一封膠體13及一反射殼 體（lamp house) 14。其中，發光二極體晶粒12係設置於 基板11上，並利用打線接合（wire bonding)的方式與基 板11電性連接。封膠體13為透光材料，並用以密封保護 發光二極體晶粒12，反射殼體14係用以反射集中發光二 極體晶粒12的出光方向。 在習知技術中，當發光二極體晶粒12發光時，其會 產生大量的熱能，且發光二極體晶粒12、固化後之封膠體 13、基板11及反射殼體14四者之材質的熱膨脹程度並不 相同，因此將會造成夾置於發光二極體晶粒12、封膠體 13、基板11及反射殼體14之間的導線W，受到擠壓或拉 扯而產生變形或斷裂，進而可能造成發光二極體晶粒12 無法發光的情形，也會使得發光單元1產生缺陷。其中， 熱膨脹程度不同所造成的影響，尤其是在具有大面積封膠 200924244 體的發光單元中更為嚴重。 另外，習知技術架構亦不能改善發光二極體散熱的問 題。溫度最高的PN界面（junction)仍包覆在高厚度的封 膠體之中，因此只能藉由熱傳導方式將熱導引至基板。 因此，如何提供一種能避免發光二極體晶粒之導線因 殼體、封膠體、發光二極體晶粒與基板四者之間熱膨脹程 度不同而產生斷裂的發光單元，以及能夠改善散熱的發光 單元，已成為重要課題之一。 【發明内容】 有鑑於上述課題，本發明之一目的為提供一種能提高 發光二極體晶粒之散熱效果的發光單元。 有鑑於上述課題，本發明之另一目的為提供一種能避 免發光二極體晶粒之導線因殼體、封膠體、發光二極體晶 粒與基板之熱膨脹程度不同而產生斷裂的發光單元。 為達上述目的，依據本發明之一種發光單元具有一密 閉空間，發光單元包含至少一基板、複數個發光二極體晶 粒及一膠體或一流體。該等發光二極體晶粒係設置於基板 之上，並位於密閉空間，其中至少二發光二極體晶粒係電 性串聯或電性並聯。膠體或流體係充填於密閉空間。 承上所述，因依據本發明之一種發光單元係將發光二 極體晶粒置於一密閉空間内，因此發光單元不需再利用大 面積且高厚度的封膠體將該等複數發光二極體晶粒整個 包覆。發光二極體晶粒少了封膠體的阻隔後，其散熱路徑 200924244 除經由下方基板作散熱外，亦可直接經由上方 一 膠體或流體之熱對流效應則更可提高該=猎由 =的散熱效果。並可避免發光二極體晶粒與基晶 導線受拉扯或擠壓而產生變形或斷裂的 妾的 殼體可保護發光二極體晶粒不受水氣或灰塵等外界= 影響。又，本發明之發光單元仍可利用部分覆：单: 出光效率及出光範圍的功能。 體曰曰粒之 ^另外，本發明之發光單元更可包含-反射層及—普朵 轉^材料。設置有反射層的透光殼體上除可增加固定方= ^先效率外，並可使複數個發光二極體晶 .=透光，行混光，以使發光單元能發出= ”而赏光轉換材料則可用以改變發光單元的出光海 色，以增加發光單元的應用範圍。 出光顏 【實施方式】 以下將參照相關圖式，說明依據 製造方法’其中相同元件係以相同標號： 弟—貫施例 2且Γ參，圖2所示，本發明第一實施例之一種發光單元 複數Γ^、閉空間211 ’發光單元2包含至少—基板22、 固發先一極體晶粒23及一膠體或 ， 體例如為液態膠沪忒2。·^ 體。另外，性膠體’而流體24例如為油質流 ；貝列中，發光單元2更包含一透光殼體 200924244 透光殼體21係可具有一透光部及一非透光部，意即 透光殼體21可部分透光、部分不透光，當然，透光殼體 21亦可全部透光。其中，透光部的材質例如為高分子聚合 材料、玻璃或石英之至少其中之一，而非透光部的材質例 如為高分子聚合材料、陶竞，或金屬之至少其中之一。於 本實施例中，透光殼體21以透明高分子聚合材料為例作 說明，而高分子聚合材料係選自聚苯乙稀（polystyrene, PS)、聚碳酸酯（polycarbonate, PC)、苯乙烯-曱基丙烯酸 甲酯樹脂（methylstyrene，MS )、聚甲基丙烯酸甲醋 (polymethylmethacrylate, PMMA)或丙烯晴-丁二烯-苯乙 烯（Acrylonitrile Butadiene Styrene, ABS )至少其中之—。 另外，若透光殼體21為金屬材質，則於發光二極體晶粒 23的出光面具有一開口’以使光線射出。由於金屬本身具 有的高反射率、良好的散熱效果及容易加工成型等優點， 藉此可增加發光單元2的應用範圍。 利用高分子聚合材料之透光殼體21，其亦可摻雜複數 個散射體（scattering center )’以增加光擴散的效果。其中 散射體例如為散射粒子或散射氣泡，而散射粒子之材'料$ 利用與透光殼體21之折射料同的有機散射粒子或/無機 散射粒子’例如硫酸鋇（BaS〇4)'二氧仆功、 干u 矽（Sl〇2) 化鋁（ai2〇3)等。 4年1i 基板22例如為一玻璃基板、一樹腊基板、 — 板或一金屬基板，其並可與透光殼體21形成密閉空 200924244 該等發光二極體晶粒23係可為一維排列、二維排列 或陣列排列設置於基板22之上，且發光二極體晶粒23可 利用覆晶接合（flip-chip)或打線接合（wire-bonding)方 式與基板22電性連接，其中至少二發光二極體晶粒23係 電性串聯或電性並聯。於本實施例中，該等發光二極體晶 粒23以二維排列打線接合方式設置於基板22。 發光二極體晶粒23之發射光譜例如為可見光範圍及/ 或紫外光範圍，其中該等發光二極體晶粒23之發射光譜 若為可見光範圍，則發光二極體晶粒23可選自紅光發光 二極體晶粒、綠光發光二極體晶粒、藍光發光二極體晶粒 及其組合所構成的群組。 膠體或流體24係充填於密閉空間211内，且膠體或 流體24之折射率係大於1.3。另外，當透光殼體21之表 面為曲面時，膠體或流體24的折射率係可大於或等於透 光殼體21，藉此可造成集光的功能，使透光殼體21的出 光面形成類似凸透鏡的效果。 本實施例中，發光單元2更包含至少二連接電極25。 該等連接電極25係與發光二極體晶粒23電性連接，且連 接電極25係可設置於基板22之一端或是分別設置於基板 22之兩端。其中，連接電極25係設置於透光殼體21之外 部。在本實施例中，該等連接電極25係以設置於基板22 之一端為例。 承上所述，由於該等發光二極體晶粒23係位於透光 殼體21的密閉空間211，因此，本實施例之發光單元2不 200924244 需再利用大面積且高厚度的封膠體來包覆發光二極體晶 粒23。發光二極體晶粒23少了封膠體的阻隔後，其散熱 路徑除經由下方基板22作散熱外，亦可直接經由上方散 熱，藉由液態膠體、彈性膠體或油質流體之熱對流效應則 更可提高該等發光二極體晶粒23的散熱致果。另外，藉 由透光殼體21可保護發光二極體晶粒23不受水氣或灰塵 等外界環境因素的影響，並可避免發光二極體晶粒23與 基板22間連接的導線，受拉扯或擠壓而產生變形或斷裂 的情形。 另外，請參照圖3所示，發光單元2A亦可利用直條 型基板22A與透光殼體21A，藉此即可設置更多的發光二 極體晶粒23於基板22A上，以增加應用範圍。其中密閉 空間211A中亦充填膠體或流體24。 本實施例之發光單元亦可利用部分覆蓋單顆發光二 極體晶粒的封膠體作為提高發光二極體晶粒之出光效率 及出光範圍的功能。請參照圖4所示，發光單元2更包含 至少一封膠體26，其係覆蓋該等發光二極體晶粒23之至 少其中之一的至少一部分面積，意即，封膠體26並未完 全包覆發光二極體晶粒23。其中，封膠體26係可覆蓋發 光二極體晶粒23之出光面，或覆蓋發光二極體晶粒23與 至少一導線W的接觸點，且封膠體26未完全覆蓋導線W。 封膠體26可為一多層折射率材料結構，其材料特性 為隨著與各發光二極體晶粒23的距離由近到遠，材料的 折射率由大至小作排列。因此，藉由封膠體26多層折射 10 200924244 率材料結構的特性，即可避免該等發光二極體晶粒^介 間W發生全反射所導致的出光效率下降，進而使發 光早元2的出光效率提高。 第二實施例 請同時參照圖5A及圖5B所示，其中圖沾為沿圖5a ^ _ A直線的發光單元3剖面圖’本發明第二實施例之 先早兀3與第-實施例的差異在於：發光單元3更包含 ::射部及至少一螢光轉換材料38。其中，反射部可以係 /i斜Ϊ设體31之—部分，或是如本實施例所述係外加一 反射層37。 反射層37係設置於透光殼體31之外表面，其並具有 =一開口部371，且開口部371係對應於該等發光二極 二！Hi之—出光面。反射層37之材料係、選自反射頻譜 2卜先波段（2Q(M_m)、可見光藍光波段（彻_彻腿） 或可見光全波段（40〇_78〇nm)其中之— 少大於5〇%以上。另外，反射# 介且〃、反射率至 ,Δ1 ^ , 另外反射層37亦可利用氧化鋁 2 3)、—氧化鈦（Tl〇2)或硫酸鋇（BaS〇4)等材料 以塗佈或印刷來形成於透光殼體31之外表面，或將上 材料加入塑膠材料中，再以壓出成形、射出成形等方式形 成反射層37。又’或亦可藉由一反射膜片、—鏡片或一夕 層鍍膜材料於透光殼體31之外表面來達成。/夕 營光轉換材料38係可設置於至少部分的透光殼體31 之部分外表面、部分内表面及/或直接摻雜於透光殼體31 内。於本實施财，f光轉㈣料38係對應設置於開口 200924244 部371的透光殼體31的外表面。且螢光轉換材料％為選 自一黃色螢光轉換材料、一紅色螢光轉換材料、一綠色螢 光轉換材料或一藍色螢光轉換材料之至少其中之一。 藉由反射層37的設置可集中發光單元3的出光方 向’且可利用反射層37使該等發光二極體晶粒33發出的 光線先於透光殼體31内進行混光後再射出，以使發光單 元3能發出均勻的光源。又，藉由螢光轉換材料38則巧* 改變發光單元3的出光顏色。另外，充填於密閉空間3Π 的液態膠體、彈性膠體或油質流體34則同樣可用來增加 該等發光二極體晶粒33的散熱效果。 另外，請參照圖6A所示，反射層37A亦可設置於透 光殼體31之内表面，且反射層37A亦具有開口部371，其 係對應於該等發光二極體晶粒33之出光面，而螢光轉換 材料38亦可設置於對應於開口部37;[的透光殼體31的内 表面或外表面。於此則以設置於對應於開口部371的透光 设體31的内表面為例作說明。又，請參照圖6b所示，亦 可同時於透光殼體31之内表面及外表面設置反射層37B 及反射層37C。需注意者，設置於透光殼體31之内表面及 卜表面的反射層37B及反射層37C係為錯位設置，但應避 免覆蓋住出光用的開口部371。 請參照圖7所示，螢光轉換材料亦可改以利用一螢光 體膠帶（phosphor tape) 丁來取代，螢光體膠帶τ係設置 於至少部分的透光殼體31之外表面及/或内表面，於此螢 光體膠帶τ是以黏貼設置於透光管體31之外表面為例作 12 200924244 說明。螢光體膠帶T例如具有一黏著層T1及一螢光層Τ2, 螢光層Τ2中則摻雜有螢光體，以改變出光顏色。其中需 注意者，螢光體膠帶Τ依不同的需求可有不同的組成。 另外，上述之反射層係以設置於透光殼體為例說明， 然而，反射層亦可設置於基板之表面。請參照圖8所示， 基板32之一表面係設置有複數發光二極體晶粒33，而與 上述實施例相同，發光二極體晶粒33係可以覆晶接合或 打線接合於基板32之上，於此係以覆晶接合為例。一反 射層37D係設置基板32上之該等發光二極體晶粒33的周 圍。利用反射層37D將由發光二極體晶粒33所射至基板 32的光線反射，藉此可增加該等發光二極體晶粒33所發 出光線的利用率。其中若基板32為透明基板，則反射層 37D亦可設置於與發光二極體晶粒33相對的另一表面。反 射層37D之材質係與上述實施例中的反射層之材質相同， 於此不再贅述。 另外，請參照圖9所示，基板32上該等發光二極體 晶粒33周邊亦可設置有一反射殼體（lamp house) L，藉 此可用以反射集中發光二極體晶粒33的出光方向。 第三實施例 請同時參照圖10A及圖10B所示，本發明第三實施例 之發光單元4‘與第一實施例的差異在於：發光單元4的密 閉空間411係由二殼體元件412、413所構成。基板42之 上設置有複數發光二極體晶粒43及二連接電極45，該等 發光二極體晶粒43以二維方式排列，基板42夾置於二殼 13 200924244 體元件412、413之間。其中，一反射層47係可設置或形 成於基板42之上，另外，反射層47亦可設置於該等殼體 元件412、413至少其中之一的部分外表面及/或部分内表 面，而一螢光轉換材料48則可設置或形成於殼體元件 412、413至少其中之一，於本實施例以設置於殼體元件 412為例，然其非限制性，其變化態樣亦可參照上述實施 例，當然螢光轉換材料亦可改以利用螢光體膠帶來取代。 另外，殼體元件412、413之至少其中之一可具有一反射 部及一透光部。 殼體元件412、413亦可部分透光、部分不透光，亦 可全部透光，例如於基板42下的殼體元件413可為不透 光，然其非用以限制本發明。又，殼體元件412、413之 至少其中之一可具有複數個散射體，散射體的材質已於第 一實施例中詳述，於此不再贅述。 該等殼體元件412、413係在對應設置後，利用膠合 或熔合等方式結合，以形成密閉空間411。其中，膠合方 式包含封膠後紫外光固化、封膠後熱固化或封膠後自然乾 燥等。另外，該等殼體元件412、413亦可先以鎖合或卡 合結合後，再以膠合或熔合方式作結合。同樣的，密閉空 間411内係充填液態膠體、彈性膠體或油質流體44，由於 液態膠體、彈性膠體或油質流體44之性質已於第一實施 例中詳述，於此不再贅述。 另外，請參照圖11所示，發光單元5之密閉空間511 亦可由一中空殼體51所形成。其中，中空殼體51可具有 14 200924244 I反射部’巾空殼體51可部分透光、部分不透光，亦可 二:番中空殼體51亦可具有-反射層及-螢光轉換 材料，設置於部分的中空殼體51之—外表面及/或一内表 ^當然螢光轉換材料亦可改以利用螢光體膠帶來取代。 另外，中空殼體51的截面形狀非限制性，其例如可為圓 形、橢圓形、三角形、四、嘉π m π ^ . 、形、夕邊形或不規則形，依不 ，计可有不同的變化態樣，且中空殼 =施_峨複數個散射體。密閉空間5ΐι内則二 可充填液恝膠體、彈性膠體或所 ’ 光二極體晶粒53的散熱效果體54來增加該等發 53中1外，請參照圖12所示，若於該等發光二極體晶粒 則形等形或不規 =:?了具有一透鏡結構S，藉由透 此====細效果。於 明，然其非限制性。 -體5U的外表面為例作說 弟四貫施例 請茶照固13所示，本發明笼〜 盥第一實施例的 -弟四貫施例之發光單元6 ，、弟员細例的之發先早兀2差異在於 等發光二極體晶粒63至少其 、^先早兀6之該 (die to die)相互打線方式， 1藉由曰曰粒對晶粒 其中，發光二極體晶粒63的電極^串聯或電性並聯。 光二極體晶…間係藉由導線(例如二= 15 200924244 線連接彼此的電極，而形 二極體晶粒63彼此間皆藉 以名先 極接到第二晶粒的P極，；由而將第-晶粒^ 的P極，第三晶粒的二妾:^ 你丨…… 則接到弟四晶粒的P極的態樣為 此類推即可形成該等發光二極體晶粒63的電性串 因此，基板62上即可不兩机 光殼體61端部的發光二極路層，㈣靠近透 . 日日粒63來與空腔外部的連接 电極65(或一控制電路） 安 極體晶粒63進行控制。发中連^ #可對所有的發光二 的一部分，也可以是外加的^接電極65可以是基板62 在一起。 ' 個70件’而與基板62黏合 由於基板62上沒有電路芦， 基板，以, 9 口此基板02可為一金屬 有效地k升發光單元ό的％& t φ 板62為-透光性基板，少=熱效果。另外，若基 射後再射出的機率，並進而提高 ==板62内反 綠使用率。另外，基板62少了;公，》粒《的光 夕卜，並可進—步地提升製程效公==降低材料成本 枉體晶教63間將近一半的金 手毛先— 科成本。 展用夏，亦可更降低整體材 電政臨 田於基扳62Α 曰’因此當該等發光二極體晶粒63藉由 元另:=:」4A及圖14β所示，其為本實施例之發光單 電路層，@ 木分拉片， 由於基板62Α、62丑上無 晶 晶粒 粒對 16 200924244 打線設置完成後，即可對基板62A、_進行彎折 (bending)加工，使基板62A、62B之凹面朝向發光二極 體晶粒63 (如圖14A)或凹面背對發光二極體晶粒幻（如 圖14B)。其中，當基板62A、62B的厚度愈小，則其可^ - 性愈好（例如其材質為玻璃、金屬、陶瓷、石英或高分^ 聚合物)。利用基板62A、62B具有可撓性的特點，即可瓖 發光單元6A、6B貼附於更多物件的表面，進而增加了發 光單元6A、6B的應用範圍。值得一提的是，基板62a : 62B除彎折加工成為曲面外，依不同的要求亦可加工 他形狀。 两八 综上所述，因依據本發明之一種發光單元係將發光二 極體晶粒置於-密閉空間内，因此發光單元不需再彻: ::且高厚度之封膠體將該等複數發光二極體晶粒整個 已復。發光二極體晶粒少了封膠體的阻隔後 除經由下方基板作散熱外，亦可直接經由上方散孰:= ' 彈性膠體或油質流體之熱對流效崎可“高 =以二極體晶粒的散熱效果。另外，藉由殼體可保護 體晶，不受水氣或灰塵等外界環境因素的影 ㉟免發光—極體晶粒與基板間連接的導線受拉扯 ^㈣產生變形或斷裂的情形。又’本發明之發光單元 高發=7”單顆發光二極體晶粒之封膠體作為提 X —f體日日粒之出光效率及出光範圍的功能。 轉換更可包含—反射層及一營光 …、5又置有反射層的透光殼體上除可增加固定方向 17 200924244 之出光效率外，並可使複數個發光二極體晶粒所發出的光 線先於透光殼體内進行混光後射出。而螢光轉換材料則可 用以改變發光單元的出光顏色，以增加發光單元的應用範 圍。螢光轉換材料更可改以利用螢光體膠帶來取代，來增 加製程效率及產品可靠度。 又，由於基板上沒有電路層，因此基板可為一金屬基 板，以有效地提升發光單元的散熱效果。另外，若基板為 一透光性基板，少了電路層的遮蔽，則可有效地提升由發 光二極體晶粒晶背發出之光線於基板内反射後再射出的 機率，並進而提高發光二極體晶粒的光線使用率。另外， 基板少了電路層除可降低材料成本外，並可進一步地提升 製程效率，且藉由減少該等發光二極體晶粒間將近一半的 金線用量，亦可更降低整體材料成本。 以上所述僅為舉例性，而非為限制性者。任何未脫離 本發明之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 圖1為一種習知的發光單元示意圖； 圖2為本發明第一實施例之一種發光單元示意圖； 圖3為本發明第一實施例之發光單元另一變化態樣示 意圖； 圖4為本發明第一實施例之發光單元又一變化態樣示 意圖； 18 200924244 圖5A為本發明第二實施例之發光單元示意圖，圖5B 為沿圖5A中之A-A直線的發光單元剖面圖； 圖6A及圖6B為本發明第二實施例之發光單元的一變 化態樣示意圖； 圖7為本發明第二實施例之發光單元的另一變化態樣 不意圖， 圖8為本發明之反射層設置於基板上的變化態樣示意 圖； 圖9為本發明第二實施例之發光單元的又一變化態樣 示意圖； 圖10A及圖10B為本發明第三實施例之發光單元示意 圖； 圖11為本發明第三實施例之發光單元的變化態樣示 意圖； 圖12為本發明第三實施例之發光單元的另一變化態 樣示意圖； 圖13為本發明第四實施例之發光單元示意圖；以及 圖14A及圖14B為本發明第四實施例之發光單元的另 一組變化態樣示意圖。 【主要元件符號說明】 I、 2、2 A、3、4、5、6、6 A、6B :發光單元 II、 22、22A、32、42、62、62A、62B :基板 12、23、33、43、53、63 :發光二極體晶粒 19 200924244 13、 26 :封膠體 14、 L :反射殼體 21、21A、31、61、61A、61B :透光殼體 211、211A、311、411、511 :密閉空間 24、 34 ' 44、54 :流體 25、 45、65 :連接電極 412、413 :殼體元件 51、51A :中空殼體 37、 37A〜37D、47 :反射層 371 :開口部 38、 48 :螢光轉換材料 A-A :直線 S :透鏡結構 T:螢光體膠帶 T1 :黏著層 T2 :螢光層 W :導線 20200924244 IX. Description of the Invention: TECHNICAL FIELD The present invention relates to a lighting unit, and more particularly to a lighting unit having a confined space. [Prior Art] Since the Light Emitting Diode (LED) has the advantages of high brightness and power saving, as the technology of the LED is gradually matured, its application fields are more and more extensive, such as light source and Backlight. Referring to FIG. 1, a conventional light-emitting unit 1 includes a substrate 11, a plurality of light-emitting diode chips 12, a gel 13 and a lamp house 14. The light-emitting diode die 12 is disposed on the substrate 11 and electrically connected to the substrate 11 by wire bonding. The encapsulant 13 is a light transmissive material and is used for sealing and protecting the LED dipoles 12, and the reflective housing 14 is for reflecting the light exiting direction of the concentrated LED dipoles 12. In the prior art, when the light emitting diode die 12 emits light, it generates a large amount of thermal energy, and the light emitting diode die 12, the cured sealing body 13, the substrate 11 and the reflective casing 14 are all The degree of thermal expansion of the material is not the same, so that the wire W sandwiched between the LED die 12, the encapsulant 13, the substrate 11 and the reflective casing 14 is deformed or broken by being squeezed or pulled. Further, it may cause the light-emitting diode die 12 to fail to emit light, and the light-emitting unit 1 may also cause defects. Among them, the influence of the degree of thermal expansion is especially serious in the illuminating unit with large area sealant 200924244. In addition, the conventional technical architecture cannot improve the heat dissipation of the LED. The highest temperature PN junction is still encapsulated in the high-thickness sealant, so heat can only be directed to the substrate by thermal conduction. Therefore, how to provide a light-emitting unit capable of avoiding breakage of a wire of a light-emitting diode die due to a difference in thermal expansion between a casing, a sealant, a light-emitting diode die and a substrate, and a light-emitting luminescence capable of improving heat dissipation Unit has become one of the important topics. SUMMARY OF THE INVENTION In view of the above problems, it is an object of the invention to provide a light-emitting unit capable of improving the heat dissipation effect of a light-emitting diode die. In view of the above problems, another object of the present invention is to provide a light-emitting unit capable of preventing a lead wire of a light-emitting diode die from being broken due to a difference in thermal expansion degree between a casing, a sealant, and a light-emitting diode crystal grain. To achieve the above object, a light-emitting unit according to the present invention has a closed space, and the light-emitting unit comprises at least one substrate, a plurality of light-emitting diode crystal grains, and a colloid or a fluid. The illuminating diode dies are disposed on the substrate and are located in a sealed space, wherein at least two of the illuminating diode dies are electrically connected in series or electrically in parallel. The colloid or flow system is filled in a confined space. As described above, since the light-emitting unit according to the present invention places the light-emitting diode crystal grains in a sealed space, the light-emitting unit does not need to utilize the large-area and high-thickness sealant to form the plurality of light-emitting diodes. The bulk crystal grains are entirely coated. After the LED of the LED is less than the barrier of the encapsulant, the heat dissipation path 200924244 can be used to dissipate heat through the lower substrate or directly through the thermal convection effect of a colloid or fluid above. effect. The casing which can avoid deformation or breakage of the light-emitting diode and the base wire by being pulled or extruded can protect the light-emitting diode crystal grains from external influences such as moisture or dust. Moreover, the light-emitting unit of the present invention can still utilize the function of partial coverage: single: light-emitting efficiency and light-emitting range. In addition, the light-emitting unit of the present invention may further comprise a reflective layer and a material. The light-transmitting shell provided with the reflective layer can increase the fixed square = ^ first efficiency, and can make a plurality of light-emitting diode crystals. = light-transmitting, mixing light, so that the light-emitting unit can emit = "" and enjoy the light The conversion material can be used to change the light-emitting color of the light-emitting unit to increase the application range of the light-emitting unit. [Embodiment] The following description will be made with reference to the related drawings, wherein the same components are labeled with the same reference numerals: Embodiment 2 and ginseng, as shown in FIG. 2, a light-emitting unit of the first embodiment of the present invention, the closed space 211 'the light-emitting unit 2 includes at least the substrate 22, the solid-state first-pole crystal grains 23 and one The colloid or body is, for example, a liquid glue. 2. In addition, the colloidal body and the fluid 24 are, for example, an oily flow; in the shell, the light-emitting unit 2 further comprises a light-transmissive housing 200924244. The light transmissive housing 21 can be partially transparent and partially opaque. Of course, the light transmissive housing 21 can also be completely transparent. The material is, for example, a polymer material, glass or quartz. At least one of the materials of the non-transmissive portion is, for example, at least one of a polymer material, a ceramic, or a metal. In the embodiment, the transparent shell 21 is made of a transparent polymer material. The polymer material is selected from the group consisting of polystyrene (PS), polycarbonate (PC), styrene-methyl methacrylate (MS), polymethyl methacrylate (polymethylmethacrylate, PMMA) or at least Acrylonitrile Butadiene Styrene (ABS). Further, if the light-transmitting casing 21 is made of a metal material, the light is emitted from the light-emitting diode crystal grains 23. The mask has an opening to emit light. Due to the high reflectivity of the metal itself, good heat dissipation and easy processing, the application range of the light-emitting unit 2 can be increased. The body 21 may also be doped with a plurality of scattering centers to increase the effect of light diffusion, wherein the scatterers are, for example, scattering particles or scattering bubbles, and scattering particles The material 'materials' utilizes the same organic scattering particles or/or inorganic scattering particles as the refracting material of the light-transmitting casing 21, such as barium sulfate (BaS〇4)' dioxobic work, dry ruthenium (Sl〇2) aluminum (ai2〇3), etc. The 4 year 1i substrate 22 is, for example, a glass substrate, a wax substrate, a plate or a metal substrate, and can form a sealed space with the light-transmitting casing 21 200924244. The 23 series may be disposed on the substrate 22 in a one-dimensional arrangement, a two-dimensional arrangement or an array arrangement, and the light-emitting diode crystal grains 23 may be flip-chip or wire-bonded to the substrate. 22 is electrically connected, wherein at least two of the light emitting diode crystal grains 23 are electrically connected in series or electrically connected in parallel. In the present embodiment, the light-emitting diode particles 23 are provided on the substrate 22 in a two-dimensionally arranged wire bonding manner. The emission spectrum of the light-emitting diode crystal grains 23 is, for example, a visible light range and/or an ultraviolet light range. If the emission spectrum of the light-emitting diode crystal grains 23 is in the visible light range, the light-emitting diode crystal grains 23 may be selected from the group consisting of A group of red light emitting diode crystal grains, green light emitting diode crystal grains, blue light emitting diode crystal grains, and combinations thereof. The colloid or fluid 24 is filled in the enclosed space 211 and the refractive index of the colloid or fluid 24 is greater than 1.3. In addition, when the surface of the light-transmitting casing 21 is a curved surface, the refractive index of the colloid or the fluid 24 may be greater than or equal to that of the light-transmitting casing 21, thereby causing a function of collecting light to make the light-emitting surface of the light-transmitting casing 21. Forms a convex lens-like effect. In this embodiment, the light emitting unit 2 further includes at least two connecting electrodes 25. The connection electrodes 25 are electrically connected to the LED die 23, and the connection electrodes 25 may be disposed at one end of the substrate 22 or at both ends of the substrate 22. The connection electrode 25 is provided outside the light-transmitting casing 21. In the present embodiment, the connection electrodes 25 are exemplified by being disposed at one end of the substrate 22. As described above, since the light-emitting diode dies 23 are located in the sealed space 211 of the light-transmitting casing 21, the light-emitting unit 2 of the present embodiment does not need to use a large-area and high-thickness sealant for 200924244. The light-emitting diode crystal grains 23 are coated. After the light-emitting diode die 23 has less barrier of the sealing body, the heat dissipation path can be directly radiated through the lower substrate 22, and the heat convection effect by the liquid colloid, the elastic colloid or the oily fluid is Further, the heat dissipation of the light-emitting diode crystal grains 23 can be improved. In addition, the light-emitting housing 21 can protect the LED die 23 from external environmental factors such as moisture or dust, and can avoid the wires connecting the LED die 23 and the substrate 22, Pulling or squeezing to cause deformation or breakage. In addition, as shown in FIG. 3, the light-emitting unit 2A can also use the straight-line substrate 22A and the light-transmitting casing 21A, thereby providing more LED die 23 on the substrate 22A to increase the application. range. The sealed space 211A is also filled with a colloid or fluid 24. The light-emitting unit of this embodiment can also utilize a sealant partially covering a single light-emitting diode die as a function of improving the light-emitting efficiency and light-emitting range of the light-emitting diode die. Referring to FIG. 4, the light-emitting unit 2 further includes at least one colloid 26 covering at least a portion of an area of at least one of the light-emitting diode dies 23, that is, the sealant 26 is not completely covered. The light-emitting diode die 23 is covered. The encapsulant 26 can cover the light-emitting surface of the light-emitting diode die 23 or cover the contact point of the light-emitting diode die 23 with at least one wire W, and the sealant 26 does not completely cover the wire W. The encapsulant 26 can be a multi-layered refractive index material having a material property such that the refractive index of the material is arranged from large to small as the distance from the respective crystal grains 23 of the light-emitting diodes is from near to far. Therefore, by the multi-layer refracting the characteristics of the material structure of the sealing body 26, the light-emitting efficiency of the light-emitting diodes can be prevented from being caused by the total reflection of the light-emitting diodes, and the light-emitting element 2 is emitted. to raise efficiency. The second embodiment is also shown in FIG. 5A and FIG. 5B, wherein the figure is digested as a cross-sectional view of the light-emitting unit 3 along the line of FIG. 5a _A, and the second embodiment of the present invention is preceded by the third embodiment and the first embodiment. The difference is that the light emitting unit 3 further includes: a shooting portion and at least one fluorescent conversion material 38. The reflecting portion may be a portion of the body 31, or a reflecting layer 37 may be added as in the embodiment. The reflective layer 37 is disposed on the outer surface of the light-transmitting casing 31, and has an opening portion 371, and the opening portion 371 corresponds to the light-emitting diodes 2! Hi - the light side. The material of the reflective layer 37 is selected from the group consisting of a reflection spectrum 2 (2Q (M_m), a visible blue light band (complete_sharp leg) or a visible light full band (40〇_78〇nm) - less than 5〇% In addition, the reflection # 〃, the reflectance to Δ1 ^, and the reflective layer 37 may also be coated with materials such as alumina 2 3), titanium oxide (Tl〇2) or barium sulfate (BaS〇4). The cloth or printing is formed on the outer surface of the light-transmitting casing 31, or the upper material is added to the plastic material, and the reflective layer 37 is formed by extrusion molding, injection molding, or the like. Alternatively, it may be achieved by a reflective film, a lens or an overnight coating material on the outer surface of the light-transmitting casing 31. The camping light conversion material 38 may be disposed on at least a portion of the outer surface of the light transmissive housing 31, a portion of the inner surface, and/or directly doped into the light transmissive housing 31. In the present embodiment, the f-light (four) material 38 is disposed on the outer surface of the light-transmitting casing 31 of the portion 371 of the opening 200924244. And the fluorescent conversion material % is at least one selected from a yellow fluorescent conversion material, a red fluorescent conversion material, a green fluorescent conversion material or a blue fluorescent conversion material. The light-emitting direction of the light-emitting unit 3 can be concentrated by the arrangement of the reflective layer 37, and the light emitted by the light-emitting diode crystal grains 33 can be mixed before being emitted by the light-emitting housing 31, and then emitted. In order to enable the light-emitting unit 3 to emit a uniform light source. Further, the light-emitting color of the light-emitting unit 3 is changed by the fluorescent conversion material 38. Further, the liquid colloid, the elastic colloid or the oleaginous fluid 34 filled in the sealed space 3 can also be used to increase the heat dissipation effect of the light-emitting diode crystal grains 33. In addition, as shown in FIG. 6A, the reflective layer 37A may also be disposed on the inner surface of the light-transmitting housing 31, and the reflective layer 37A also has an opening portion 371 corresponding to the light output of the light-emitting diode crystal grains 33. The phosphor conversion material 38 may be disposed on the inner surface or the outer surface of the light transmissive housing 31 corresponding to the opening portion 37. Here, the inner surface of the light-transmitting body 31 corresponding to the opening 371 will be described as an example. Further, as shown in Fig. 6b, the reflective layer 37B and the reflective layer 37C may be provided on the inner surface and the outer surface of the light-transmitting casing 31 at the same time. It is to be noted that the reflection layer 37B and the reflection layer 37C provided on the inner surface and the surface of the light-transmitting casing 31 are disposed in a staggered manner, but the opening portion 371 for light emission should be prevented from being covered. Referring to FIG. 7, the fluorescent conversion material may be replaced by a phosphor tape, which is disposed on the outer surface of at least part of the transparent housing 31 and/or Or the inner surface, wherein the phosphor tape τ is disposed on the outer surface of the light-transmitting tube body 31 as an example 12 200924244. The phosphor tape T has, for example, an adhesive layer T1 and a phosphor layer Τ2, and the phosphor layer Τ2 is doped with a phosphor to change the color of the light. Among those who need to be aware, the phosphor tape can have different compositions depending on different needs. In addition, the reflective layer described above is exemplified as being disposed in the light-transmitting case. However, the reflective layer may be disposed on the surface of the substrate. Referring to FIG. 8 , a plurality of light emitting diode crystal grains 33 are disposed on one surface of the substrate 32 , and the light emitting diode crystal grains 33 can be flip-chip bonded or wire bonded to the substrate 32 as in the above embodiment. Above, this is an example of flip chip bonding. A reflective layer 37D is provided around the light-emitting diode crystal grains 33 on the substrate 32. The light emitted from the light-emitting diode crystal grains 33 to the substrate 32 is reflected by the reflective layer 37D, whereby the utilization of the light emitted from the light-emitting diode crystal grains 33 can be increased. Wherein the substrate 32 is a transparent substrate, the reflective layer 37D may be disposed on the other surface opposite to the light-emitting diode die 33. The material of the reflective layer 37D is the same as that of the reflective layer in the above embodiment, and will not be described again. In addition, as shown in FIG. 9, a light-emitting diode die 33 on the substrate 32 may also be provided with a light reflecting house L, which can be used to reflect the light output of the concentrated light-emitting diode die 33. direction. The third embodiment differs from the first embodiment in that the light-emitting unit 4' of the third embodiment of the present invention is different from the first embodiment in that the sealed space 411 of the light-emitting unit 4 is composed of two housing elements 412, 413 is composed. A plurality of light emitting diode crystal grains 43 and two connecting electrodes 45 are disposed on the substrate 42. The light emitting diode crystal grains 43 are arranged in a two-dimensional manner, and the substrate 42 is sandwiched between the two shells 13 200924244 body elements 412, 413 between. A reflective layer 47 can be disposed on or formed on the substrate 42. Alternatively, the reflective layer 47 can be disposed on a portion of the outer surface and/or a portion of the inner surface of at least one of the housing members 412, 413. A fluorescent conversion material 48 can be disposed or formed on at least one of the housing members 412, 413. In the embodiment, the housing member 412 is exemplified, but it is not limited, and the variation can also be referred to. In the above embodiments, of course, the fluorescent conversion material may be replaced by a fluorescent tape. Additionally, at least one of the housing members 412, 413 can have a reflective portion and a light transmitting portion. The housing members 412, 413 may also be partially transparent, partially opaque, or entirely transparent. For example, the housing member 413 under the substrate 42 may be opaque, which is not intended to limit the invention. Further, at least one of the housing members 412, 413 may have a plurality of scatterers, and the material of the scatterer is detailed in the first embodiment, and details are not described herein. The housing members 412, 413 are joined together by gluing or fusion to form a sealed space 411. Among them, the gluing method includes ultraviolet curing after sealing, heat curing after sealing, or natural drying after sealing. In addition, the housing members 412, 413 may be combined by gluing or fusing after being combined by locking or snapping. Similarly, the closed space 411 is filled with a liquid colloid, an elastomeric colloid or an oleaginous fluid 44. The nature of the liquid colloid, elastomeric colloid or oleaginous fluid 44 is detailed in the first embodiment and will not be described again. In addition, referring to FIG. 11, the sealed space 511 of the light-emitting unit 5 may also be formed by a hollow casing 51. The hollow housing 51 can have a reflection portion of the 2009 200924244. The hollow housing 51 can be partially transparent, partially opaque, or two: the hollow housing 51 can also have a reflective layer and a fluorescent The conversion material is disposed on the outer surface of the hollow housing 51 and/or an inner surface. Of course, the fluorescent conversion material may be replaced with a fluorescent tape. In addition, the cross-sectional shape of the hollow casing 51 is not limited, and may be, for example, a circle, an ellipse, a triangle, a quad, a π m π ^ . , a shape, an empire shape, or an irregular shape. There are different variations, and the hollow shell = Shi 峨 峨 multiple scatterers. In the closed space, the inside of the air can be filled with liquid colloid, elastic colloid or the heat-dissipating effect body 54 of the light-emitting diode 53 to increase the brightness of the hair 53, as shown in Fig. 12, if the light is emitted The diode grains are shaped or irregular =: ? has a lens structure S, by which the ==== fine effect. Yu Ming, however, is not restrictive. - The outer surface of the body 5U is exemplified as a four-part example. Please refer to the tea-lighting solid 13, the cage of the present invention - the light-emitting unit 6 of the fourth embodiment of the first embodiment, and the fine example of the brother The difference between the first and second rays is that the illuminating diodes 63 are at least the first to die, and the dies are to be dies. The electrodes of the crystal grains 63 are connected in series or in electrical parallel. The photodiode crystals are connected to each other by wires (for example, two = 15 200924244 wires, and the diode diodes 63 are connected to each other by a first pole to the P pole of the second die; The P-pole of the first die ^, the second die of the third die: ^ You 丨... Then the P-pole of the four die of the fourth die is shaped like this to form the light-emitting diode crystal grains. Therefore, the electrical string of 63 can be used on the substrate 62 without the light-emitting diode layer at the end of the optical housing 61, and (4) close to the transparent electrode 63 to the external electrode of the cavity 65 (or a control circuit) The anode electrode 63 is controlled. The emitter may be part of all of the light-emitting diodes, or the additional electrode 65 may be the substrate 62 together. '70 pieces' bonded to the substrate 62 Since there is no circuit on the substrate 62, the substrate, to 9, the substrate 02 can be a metal effective k liter light unit ό% & t φ plate 62 is a light transmissive substrate, less = thermal effect. If the probability of injection after the base shot, and then increase == anti-green usage rate in the board 62. In addition, the substrate 62 is less; public, "grain" And can further improve the process efficiency == reduce the cost of materials. In the body of 63, nearly half of the gold hand hair - the cost of the department. Exhibition in summer, can also reduce the overall material power Lin Tian Yu Ji pull 62Α Therefore, when the light-emitting diode crystal grains 63 are represented by the element:=:"4A and FIG. 14β, it is the light-emitting single circuit layer of the embodiment, @木分拉片, because the substrate 62Α, 62 Ugly amorphous grain grain pair 16 200924244 After the wire setting is completed, the substrate 62A, _ can be bent, so that the concave surface of the substrate 62A, 62B faces the light-emitting diode die 63 (Fig. 14A) Or the concave surface faces the illuminating diode lens illusion (Fig. 14B). Among them, the smaller the thickness of the substrate 62A, 62B, the better its properties (for example, the material is glass, metal, ceramic, quartz or High score ^ polymer). The substrate 62A, 62B has the characteristics of flexibility, that is, the light-emitting units 6A, 6B are attached to the surface of more objects, thereby increasing the application range of the light-emitting units 6A, 6B. It is mentioned that the substrate 62a: 62B can be processed according to different requirements except for bending and processing into a curved surface. According to the invention, a light-emitting unit according to the present invention places the light-emitting diode crystal grains in a-closed space, so that the light-emitting unit does not need to be completely: :: and the high-thickness sealant will The plurality of light-emitting diode crystal grains are completely recovered. The light-emitting diode crystal grains are less blocked by the sealing body, and the heat can be directly dissipated through the lower substrate: = ' Elastomeric colloid or oily fluid The heat convection effect can be “high=the heat dissipation effect of the diode crystals. In addition, the shell can protect the crystal body from the external environmental factors such as moisture or dust. The wire connected to the substrate is subjected to pulling (4) to cause deformation or breakage. Moreover, the sealing element of the single-emitting diode die of the light-emitting unit of the present invention has the function of extracting the light-emitting efficiency and the light-emitting range of the X-f body. The conversion can further include a reflective layer and a battalion. In addition to increasing the light extraction efficiency of the fixed direction 17 200924244, the light-transmitting shells with the reflective layer and the reflective layer may have the light emitted by the plurality of light-emitting diode grains before the light-transmitting shell. The light-converting material can be used to change the light-emitting color of the light-emitting unit to increase the application range of the light-emitting unit. The fluorescent conversion material can be replaced by a fluorescent tape to increase process efficiency and products. Moreover, since there is no circuit layer on the substrate, the substrate can be a metal substrate to effectively improve the heat dissipation effect of the light-emitting unit. Further, if the substrate is a light-transmissive substrate, the shielding of the circuit layer is reduced. Effectively increasing the probability that the light emitted from the back of the crystal grain of the light-emitting diode is reflected in the substrate and then emitting it, thereby further increasing the light utilization rate of the light-emitting diode crystal grains. In addition to lowering the material cost, the circuit layer can further improve the process efficiency, and the overall material cost can be further reduced by reducing the amount of gold wire between the light-emitting diode grains by nearly half. It is intended to be illustrative, and not restrictive, and any equivalents and modifications may be included in the scope of the appended claims. 1 is a schematic diagram of a conventional light-emitting unit; FIG. 2 is a schematic diagram of a light-emitting unit according to a first embodiment of the present invention; FIG. 3 is a schematic view showing another variation of the light-emitting unit according to the first embodiment of the present invention; FIG. 5A is a schematic view of a light emitting unit according to a second embodiment of the present invention, and FIG. 5B is a cross-sectional view of the light emitting unit along the line AA of FIG. 5A; FIG. 6A and FIG. 6B are schematic views of a light emitting unit according to a second embodiment of the present invention; FIG. 7 is a schematic diagram of a variation of the illumination unit according to the second embodiment of the present invention; FIG. 7 is a different embodiment of the illumination unit according to the second embodiment of the present invention, and FIG. 8 is the inverse of the present invention. FIG. 9 is a schematic diagram of another embodiment of a light emitting unit according to a second embodiment of the present invention; FIG. 10A and FIG. 10B are schematic diagrams of a light emitting unit according to a third embodiment of the present invention; FIG. 12 is a schematic diagram of another embodiment of a light emitting unit according to a third embodiment of the present invention; FIG. 13 is a schematic diagram of a light emitting unit according to a fourth embodiment of the present invention; 14A and FIG. 14B are schematic diagrams showing another variation of the light-emitting unit according to the fourth embodiment of the present invention. [Description of Main Components] I, 2, 2, A, 3, 4, 5, 6, 6 A, 6B : Light-emitting unit II, 22, 22A, 32, 42, 62, 62A, 62B: substrate 12, 23, 33, 43, 53, 63: light-emitting diode die 19 200924244 13, 26: sealant 14, L: Reflective housing 21, 21A, 31, 61, 61A, 61B: light-transmitting housing 211, 211A, 311, 411, 511: sealed space 24, 34' 44, 54: fluid 25, 45, 65: connecting electrode 412, 413: housing member 51, 51A: hollow housing 37, 37A to 37D, 47: reflective layer 371: opening 38, 48 : Fluorescent conversion material A-A : Straight line S : Lens structure T: Phosphor tape T1 : Adhesive layer T2 : Fluorescent layer W : Wire 20