TW200924045A - Composition, method and process for polishing a wafer - Google Patents

Composition, method and process for polishing a wafer Download PDF

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Publication number
TW200924045A
TW200924045A TW097134422A TW97134422A TW200924045A TW 200924045 A TW200924045 A TW 200924045A TW 097134422 A TW097134422 A TW 097134422A TW 97134422 A TW97134422 A TW 97134422A TW 200924045 A TW200924045 A TW 200924045A
Authority
TW
Taiwan
Prior art keywords
wafer
abrasive
polyelectrolyte
working fluid
working liquid
Prior art date
Application number
TW097134422A
Other languages
English (en)
Chinese (zh)
Inventor
Nai-Chao Li
Philip Gerard Clark
John James Gagliardi
Patricia Marie Savu
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200924045A publication Critical patent/TW200924045A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW097134422A 2007-10-31 2008-09-08 Composition, method and process for polishing a wafer TW200924045A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US98421707P 2007-10-31 2007-10-31

Publications (1)

Publication Number Publication Date
TW200924045A true TW200924045A (en) 2009-06-01

Family

ID=40591398

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097134422A TW200924045A (en) 2007-10-31 2008-09-08 Composition, method and process for polishing a wafer

Country Status (7)

Country Link
US (1) US20100243471A1 (https=)
EP (1) EP2217670A4 (https=)
JP (1) JP2011502362A (https=)
KR (1) KR20100093537A (https=)
CN (1) CN101910353A (https=)
TW (1) TW200924045A (https=)
WO (1) WO2009058463A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8092707B2 (en) * 1997-04-30 2012-01-10 3M Innovative Properties Company Compositions and methods for modifying a surface suited for semiconductor fabrication
JP5464055B2 (ja) * 2009-06-02 2014-04-09 日信化学工業株式会社 水性切削液及び水性切削剤
CN102437183B (zh) * 2010-09-29 2015-02-25 中国科学院微电子研究所 半导体器件及其制造方法
WO2014047014A1 (en) * 2012-09-21 2014-03-27 3M Innovative Properties Company Incorporating additives into fixed abrasive webs for improved cmp performance
JP6204029B2 (ja) * 2013-03-06 2017-09-27 出光興産株式会社 水性加工液
EP3789519A1 (en) * 2019-09-03 2021-03-10 Imec VZW Nano-ridge engineering
KR102251921B1 (ko) * 2019-10-02 2021-05-17 주식회사 케이씨텍 표면처리 조성물 및 그것을 이용한 표면처리 방법
KR102358801B1 (ko) * 2019-12-27 2022-02-08 주식회사 케이씨텍 표면 처리 조성물 및 이를 이용한 표면 처리 방법
CN118617296A (zh) * 2023-03-03 2024-09-10 长鑫存储技术有限公司 一种半导体结构的制备方法及半导体结构

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152917B1 (en) * 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5958794A (en) * 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US6194317B1 (en) * 1998-04-30 2001-02-27 3M Innovative Properties Company Method of planarizing the upper surface of a semiconductor wafer
US6294470B1 (en) * 1999-12-22 2001-09-25 International Business Machines Corporation Slurry-less chemical-mechanical polishing
US6964923B1 (en) * 2000-05-24 2005-11-15 International Business Machines Corporation Selective polishing with slurries containing polyelectrolytes
US6602834B1 (en) * 2000-08-10 2003-08-05 Ppt Resaerch, Inc. Cutting and lubricating composition for use with a wire cutting apparatus
US6632129B2 (en) * 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
US6679928B2 (en) * 2001-04-12 2004-01-20 Rodel Holdings, Inc. Polishing composition having a surfactant
US6677239B2 (en) * 2001-08-24 2004-01-13 Applied Materials Inc. Methods and compositions for chemical mechanical polishing
US7063597B2 (en) * 2002-10-25 2006-06-20 Applied Materials Polishing processes for shallow trench isolation substrates
WO2004062849A1 (en) * 2003-01-10 2004-07-29 3M Innovative Properties Company Pad constructions for chemical mechanical planarization applications
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
EP1566420A1 (en) * 2004-01-23 2005-08-24 JSR Corporation Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
US6997785B1 (en) * 2004-12-23 2006-02-14 3M Innovative Properties Company Wafer planarization composition and method of use
US7449124B2 (en) * 2005-02-25 2008-11-11 3M Innovative Properties Company Method of polishing a wafer
JP2007220891A (ja) * 2006-02-16 2007-08-30 Toshiba Corp ポストｃｍｐ処理液、およびこれを用いた半導体装置の製造方法

Also Published As

Publication number Publication date
US20100243471A1 (en) 2010-09-30
CN101910353A (zh) 2010-12-08
KR20100093537A (ko) 2010-08-25
JP2011502362A (ja) 2011-01-20
WO2009058463A1 (en) 2009-05-07
EP2217670A1 (en) 2010-08-18
EP2217670A4 (en) 2011-07-13

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