TW200924032A - Ion beam irradiation method and ion beam irradiation device - Google Patents

Ion beam irradiation method and ion beam irradiation device Download PDF

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Publication number
TW200924032A
TW200924032A TW097132060A TW97132060A TW200924032A TW 200924032 A TW200924032 A TW 200924032A TW 097132060 A TW097132060 A TW 097132060A TW 97132060 A TW97132060 A TW 97132060A TW 200924032 A TW200924032 A TW 200924032A
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Taiwan
Prior art keywords
ion beam
substrate
beam irradiation
column
ion
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TW097132060A
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Chinese (zh)
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TWI389182B (en
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Yasuhiro Okute
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Nissin Ion Equipment Co Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1337Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • G02F1/13378Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs

Abstract

This invention provides an ion beam irradiation method and an ion beam irradiation device which can prevent adverse effects on the processing of a region to be processed in the substrate even when a cutting process is carried out on a single substrate, therefore applicable to the processing of substrates with a width greater than the beam width. Relative to substrate (10) having a plurality of units (20) formed therein for holding row formation cutting belt (22) and column formation cutting belt arranged in a m-row by n-column manner (wherein m is an integer greater than 3, n is an integer greater than 2), ion beam (4), whose two ends along Y-axis are respectively located at two row formation cutting belts (22) of units (20) held at p row (wherein p is an integer greater than or equal to 1 and less than or equal to (m-2)), is used to perform ion beam irradiation steps a plurality of times in which substrate (10) is moved along X-axis and ion beam (4) is irradiated to form ion beam irradiation region (30). In addition, during the time interval of the ion beam irradiation steps, a substrate position modifying step is performed for modifying the position of substrate (10) and the row of units (20) of ion beam (4) so as to connect to a plurality of ion beam irradiation regions (30) and to irradiate ion beam (4) on all units (20). The connection parts (32) of the plurality of ion beam irradiation regions (30) are located at row formation cutting belt (22), and an optical mask is employed to direct the two ends of ion beam (4) along Y-axis to substantially parallel to X-axis.

Description

200924032 六、發明說明: 【發明所屬之技術領域】 本發明關於一種朝基板照射離子束而對基板例如實施離 - 子注入、離子束配向處理等處理’而製造例如平板顯示器(液 • 日日顯示态、有機EL(Electroluminescence,電致發光)顯示 器等)等時所使用的離子束照射方法及離子束照射裝置。 【先前技術】 〇 由於提高平板顯示器等之生產性等,基板具有大型化之傾 向。 虽基板大型化時,對應於此,為了朝該基板照射離子束而 貫施處理必須使用束寬大之離子束,而為了應對該情形, 離子源等之離子束產生震置會大型化。於具有質量分離磁鐵 之It形時’該質量分離磁鐵亦大型化。若該等裝置大型化, 則會引起與製作、輸送、成本、收喊築物等相關之各種問 〇 題。 作為種抑制如此之離子料大魏之技術,於專利文獻 1—中揭示有將—片基板分㈣複數健域而進行處理、即進 订所明的刀副處理之技術。具體而言,記載有—種如下技術 (方法及裝置),即’對分割區域一邊按照各區域依次改變位 X $ a 行照射’上述分割區域係於離子束之長度 方向上刀副基板面内之薄膜電晶體形成區域而成,離子束於 長度方向兩侧部分具有剖面積減少部分’且朝鄰接之分割區 97132060 200924032 域分別照射離子束時,使剖面積減少部分之一方被照射的照 射減少區域與下一剖面積減少部分之另一方重疊而進行照 射。 根據該技術,照射減少區域為合成兩次離子束照射之離子 量的形狀,離子注入量與其他區域大致相等,因此即便使用 束寬小於基板寬度之離子束對一片基板進行分割處理,亦可 遍及基板之整個面進行離子注入量大致均一的離子注入。 ) [專利文獻1]曰本專利特開2007-163640號公報(段落 0008、0022、0025、圖 2〜圖 5) 【發明内容】 (發明所欲解決之問題) 上述專利文獻1所揭示之技術中,巧妙地調整光罩之長度 方向兩端傾斜之開口量減少部分形狀,使通過其之離子束量 減少至目標量,且重疊照射兩次通過該開口量減少部分之離 J 子束,此時必須為與一次通過其他部分之離子束的照射量大 致相等。 然而,正因如此’光罩之開口 ΐ減少部分之形狀的調整較 難,此外,進行第二次照射離子束時光束量或減少量有時會 發生變動,因此重疊兩次離子束照射時,於重疊部分上離子 束照射量會多於其他部分之照射量或者少於其他部分之照 射量,導致照射量不均一 ’對基板内所需之處理區域(專利 文獻1之情形時,係薄膜電晶體形成區域)之處理會產生不 97132060 5 200924032 良影響。 因此,本發明之主要目的在於提供一種離子束照射方法及 裝置,其係對一片基板進行分割處理者,即便進行分割處理 亦可防止對基板内所需之處理區域之處理產生不良影響,藉 此可對寬度大於束寬之基板進行處理。 (解決問題之手段) 對於基板而言,有如下基板,即,為了進行將一片基板(有[Technical Field] The present invention relates to a flat panel display (liquid/day display) for irradiating an ion beam toward a substrate and performing processing such as ion implantation and ion beam alignment processing on the substrate. An ion beam irradiation method and an ion beam irradiation apparatus used in the case of an organic EL (Electroluminescence) display or the like. [Prior Art] The substrate has a tendency to increase in size due to improvement in productivity such as a flat panel display. In the case of increasing the size of the substrate, it is necessary to use an ion beam having a large beam width in order to irradiate the substrate with an ion beam. In order to cope with this, the ion beam of the ion source or the like is increased in size. When it has an It shape with a mass separation magnet, the mass separation magnet is also enlarged. If these devices are large, they will cause various problems related to production, transportation, cost, and shouting. As a technique for suppressing such an ion material, the technique disclosed in Patent Document 1 discloses a technique in which a substrate is divided into four (four) complex domains and processed, that is, a knife-side treatment is defined. Specifically, the following techniques (methods and devices) are described, that is, 'the X X $ a row is sequentially changed for each of the divided regions. The above-described divided region is in the longitudinal direction of the ion beam. The thin film transistor is formed in a region where the ion beam has a cross-sectional area reduction portion on both sides in the longitudinal direction and the ion beam is irradiated to the adjacent segment region 97132060 200924032, respectively, so that the irradiation of one of the reduced area portions is reduced. The area is overlapped with the other of the reduced area of the next sectional area to be irradiated. According to this technique, the irradiation reduction region is in the shape of synthesizing the ion amount of the two ion beam irradiations, and the ion implantation amount is substantially equal to the other regions. Therefore, even if one substrate is divided by the ion beam having a beam width smaller than the substrate width, it is possible to The entire surface of the substrate is ion-implanted with a substantially uniform ion implantation amount. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2007-163640 (paragraphs 0008, 0022, 0025, and FIG. 2 to FIG. 5) [Problems to be Solved by the Invention] The technique disclosed in Patent Document 1 above In the meantime, the shape of the opening portion of the slanted end of the length direction of the reticle is skillfully adjusted to reduce the amount of the ion beam passing therethrough to the target amount, and the overlapping irradiation is performed twice by the amount of the reduction of the amount of the J beam. The amount of exposure to the ion beam that passes through the other portions must be approximately equal. However, it is difficult to adjust the shape of the opening portion of the mask, and the amount or amount of decrease in the amount of the beam may be changed when the ion beam is irradiated for the second time. Therefore, when the ion beam is irradiated twice, The amount of ion beam irradiation on the overlapping portion may be more than the irradiation amount of other portions or less than the irradiation amount of other portions, resulting in uneven irradiation amount to the required processing region in the substrate (in the case of Patent Document 1, the film is electrically charged) The processing of the crystal formation area will produce a good influence not 97132060 5 200924032. Accordingly, it is a primary object of the present invention to provide an ion beam irradiation method and apparatus which are capable of performing a division process on a single substrate, and even if the division process is performed, it is possible to prevent adverse effects on the processing of a desired processing region in the substrate. The substrate having a width greater than the beam width can be processed. (Means for Solving the Problem) For the substrate, there is a substrate, that is, for performing one substrate (there is

時將其稱作母基板)分#]為複數個小基板之多次倒角等,於 基板之面内,形成有夾持後步驟用以分割基板等之縫隙即列 形成分割帶及行形成分割帶且矩陣狀排列的複數個單元 (即’既定之處理圖案的重複單位)。亦可不對該列形成分割 π及打形成分割帶照射離子束。本發明係著眼於如此之基板 而巧妙地利用列形成分割帶者。 土 即’本發明之離子束照射方法之一,係將彼此正交之兩個 方向β又為Χ方向及¥方向’朝面内形成有炎持沿X方向延伸 之列及沿γ方向延伸之行形成分割帶且矩陣狀 排列為《η列η行(m為3以上之整數、n為2以上之整 複數個單元的基板,照射γ方向之尺寸大於X方向之尺寸之 ::二的離子束照射方法;其特徵在於:使用γ方向之兩端 ^ 夹持Ρ列⑽1把(Μ)之整數)之上述單元 :成广帶上之束寬之離子束,實施複數次-邊使 ^ 方向移動-邊朝該基板照射上述離子束而於 97132060 200924032 上述基板上形成離子束照射區域的離子束照射步驟,且於上 述離子束照射步驟之_即上述離子束未照射至上述基板 之期間’實施f更上述基板之位置而變更照射上述離子束之 '上述單元之列的基板位置變更步驟,連接複數個上述離子束 •照射區域並朝上述單元全部騎上述離子束,而且使連接上 述複數個離子束照射區域之連接部位於上述列形 上,且藉由光罩將上述離子束之Y方向兩端部整形為與χ Ο 方向實質上平行。 根據該離子束照射方法,可連接複數個離子束照射區域而 朝全部單元照射料束。m連接複數個料束照射區 域之連接部位於列形成分割帶上,因此可避免連接部之存在 對朝單元均一地照射離子束產生不良影響。更進一步,藉由 光罩將離子束之γ方向兩端部整形為與x方向實質上平9行, 因此與不以此方式進行整形之情形相比,可減小連接部之丁寬 u度,㈣職分郷之寬度較小之情科,亦可料地使連 接部位於列形成分割帶上。 其結果為,即便對一片基板進行分割處理,亦可防止對美 板内之所需處理區域即單元的處理產生不良影響,藉此獨 -寬度大於束寬之基板進行處理。 - 树明之離子束照射方法之其他形態,係將彼此正交之兩 伸之列形成分割帶及沿γ方向延伸之行形成分割帶且矩陣 97132060 7 200924032 f 狀排列為,列n行(m、n均為2以上之整數)之複數個單元 的基板,照射U向之尺寸大於χ方向之尺寸之離子束的離 子絲射方法;其特徵在於:使Η方向之束寬包含上述m 歹J之半數以上的列之上述單元之尺寸的離子束,實施兩次一 邊使上述基板朝X方向移動—邊朝該基板騎上述離子 束’而於上述基板上形成離子束照射區域的離子束照射步 驟,且於上_子束㈣步狀卩上_子束未照射至 實施變更上述基板之位置而變更照射上述 “早TL的狀基板位置變更步驟 域並朝上述單元之全部照射上述離子束,且^ ^上述兩個離子束照射區域之連接部位於上述列形成分 於上述連接部側之端部整形為束;^方方向^個上^中至少位When it is referred to as a mother substrate, it is a plurality of chamfers of a plurality of small substrates, and a step is formed in the surface of the substrate to form a slit and a line for dividing a substrate or the like. A plurality of cells arranged in a matrix and arranged in a matrix (ie, a repeating unit of a predetermined processing pattern). Alternatively, the column may be formed by splitting π and forming a splitting strip to illuminate the ion beam. The present invention focuses on the use of such a substrate and skillfully utilizes columns to form a segmentation band. The soil is one of the ion beam irradiation methods of the present invention, in which two directions orthogonal to each other are in the Χ direction and the ¥ direction, and a row extending in the X direction and extending in the γ direction are formed in the plane. Rows are formed in a row and are arranged in a matrix of "n columns η rows (m is an integer of 3 or more, n is a substrate of a plurality of units of 2 or more, and the size of the irradiation γ direction is larger than the size of the X direction:: two ions a beam irradiation method; characterized in that: the above-mentioned unit is sandwiched between two ends of the gamma direction (10) and an integer of (Μ): an ion beam of a beam width on a wide band, and a plurality of times-edges are performed. An ion beam irradiation step of irradiating the substrate with the ion beam to form an ion beam irradiation region on the substrate of 97132060 200924032, and performing the ion beam irradiation step, that is, the period during which the ion beam is not irradiated onto the substrate f changing the position of the substrate to change the substrate position changing step of irradiating the ion beam to the row of the cells, connecting a plurality of the ion beam/irradiation regions, and riding all of the ion beams toward the cells, and connecting The connection portion of the plurality of ion beam irradiation regions is located on the column shape, and both ends of the ion beam in the Y direction are shaped to be substantially parallel to the χ 方向 direction by a photomask. According to the ion beam irradiation method, a plurality of ion beam irradiation regions can be connected to irradiate the entire beam toward the entire unit. The connection portion where m is connected to the plurality of beam irradiation regions is located on the column forming division belt, so that the existence of the connection portion can be prevented from adversely affecting the uniform irradiation of the ion beam toward the unit. Further, since both ends of the ion beam in the γ direction are shaped by the photomask to be substantially nine lines in the x direction, the width of the connection portion can be reduced as compared with the case where the shaping is not performed in this manner. (4) The syllabus with a smaller width of the occupational division may also be such that the connecting portion is located on the column forming the dividing belt. As a result, even if a single substrate is divided, it is possible to prevent the substrate from being processed by the substrate having a width larger than the beam width by adversely affecting the processing of the unit which is a desired processing region in the sheet. - The other form of the ion beam irradiation method of Shuming is to form a dividing strip by forming two strips orthogonal to each other and a strip extending in the γ direction, and the matrix 97132060 7 200924032 f is arranged in a row, n rows (m, n An ion beam method for irradiating an ion beam having a size larger than a dimension in the χ direction by a substrate having a plurality of units of 2 or more integers; characterized in that the bundle width in the Η direction includes half of the above m 歹 J The ion beam of the size of the unit in the above column is subjected to an ion beam irradiation step of forming an ion beam irradiation region on the substrate while moving the substrate in the X direction twice while riding the ion beam toward the substrate, and In the upper _ sub-beam (four) step 卩 _ sub-beam is not irradiated to the position where the substrate is changed, and the irradiation of the "early TL substrate position changing step field is performed, and the ion beam is irradiated toward all of the cells, and ^ ^ The connecting portion of the two ion beam irradiation regions is formed at the end portion of the column forming portion on the side of the connecting portion, and is shaped into a beam;

O 本發明=子相财法之“其他形態,賴此正 兩:方向4 X方向及γ方向,朝面内形夾 延伸之列形成分割帶及沿Υ方向延伸之行开2 Χ方向 陣狀排列m列n 仃形成为割帶且矩 之於其Y方向二二η均為2以上之整數)之複數個單元 基板,照射γ方=央料有上述卿成分割帶中之一個的 束照射方法,方向之尺寸之離子東的離子 列之半數以於’❹U向之束寬為包含上述m 邊使上述騎尺相離子束’實施兩次一 χ方向移動一邊朝該基板照射上述離子 97132060 200924032 c 束,而於上述基板上形成離子束照射區域的離子束照射步 驟’且於上述離子束照射步驟之間隔即上述離子束未照射至 上述基板之顧,實施使上述基板以其中心部為中心於基板 -面内旋轉18〇度,而變更照射上述離子束之上述單元之列的 .基《轉㈣,連接兩個上述軒賴射輯助上述單元 之全部照射上述離子束,而且使連接上述兩個離子束照射區 域之連接部位於上述基板中央部之列形成分割帶上,且藉由 光罩將上述離子束之γ方向之兩個端部中至少位於上述連 接部侧之端部整形為與χ方向實質上平行。 〇 执本發明之離子束照射裝置之―,係將彼此正交之兩個方向 ,:、、、方向及Υ方向,朝面内形成有夹持沿X方向延伸之列 形成分割帶及沿Υ方向延伸之行形成分割帶且矩陣狀排列 為:列η行(m為3以上之整數、η為2以上之整數)之複數 個早70的基板’照射γ方向之尺寸大於义方向之尺寸之離子 束的離子相射裝置;其雜在於包括:料束產生裝置, 產生γ方向之束寬包含㈠价係叫“之整數)之上述單 子束;光罩’使上述離子束產生裝置產生之離 …正形為其¥方向之兩端部與χ方向實質上平行,同時將 =子束之υ方向之兩端部整形為分別位於夾持ρ列(ρ為1 P$(m—2)之整數)之上述單元之兩㈣形成分割 、寬以使其通過;基板闕裝置,具有使上述基板朝 χ方向及u㈣狀功能;以妨歸置,财進行如下 97132060 200924032 控制之功能,即,賦予表示上述基板於γ方向上之位置資 訊、表示該基板上之上述列形成分割帶之丫方向位置的資訊 及表示通過上述光罩之離子束之γ方向兩端部之位置資 訊,使用鮮資訊㈣上述基板,_裝置,實施複數次一邊 使上述基板朝X ^向移動—邊朝該基板照射通過上述光罩 之離子束而於上述基板上形成離子束照射區域的離子束照 射步驟,且於該離子束照射步驟之間隔即上述離子束未照射 至上述基板之期間’實施使上述基板朝γ方向移動而變更昭 射上述離子束之上料元之列板位置較步驟,連接複 =上逑離子束照射區域並朝上述單元之全部照射上述離 子束的功能,以及使連接上述複數個離 部位於上述卿成分割㈣魏。Κ射區域之連接 二明之離子束照射裝置之其他形態,係將彼此正交之兩 向叹為X方向及Υ方向,朝面内形成 伸之列形成分割帶及沿γ方向延伸 二χ方向延 狀排列為,列· η均為2以上成广帶而矩陣 的基板,崎γ方向之財大於之魏個單元 子束照射農置;其特徵在於包括:離子 ^離子束的離 方向之克官白Αμ、+、 , 生裝置· ’產生γ 半數以上㈣之 I的離子束;鮮,將上祕子束產㈣^ ^尺 ;=Y方向之兩個端部中至少下述連接部側之端:二 ”員上平行,同時將該離子束之Υ;^束寬^包含 97132060 口 I 3 200924032 上述m列之半數以上的列之上述單元的束寬而使其通過;基 板驅動裝置’具有使上述基板朝χ方向及γ方向移動之功能 及於基板面内旋轉之功能;以及控制裝置,具有進行如下控 - 制之功能,即,賦予表示上述基板之γ方向位置之資訊、表 . 示戎基板上之上述列形成分割帶之Υ方向位置的資訊及表 示通過上述光罩之離子束之下述連接部側之端部位置的資 讯,使用該等資訊控制上述基板驅動裝置,實施兩次一邊使 〇 上述基板朝X方向移動一邊朝該基板照射通過上述光罩之 離子束而於上述基板上形成離子束照射區域的離子束照射 步驟’且於該離子束照射步驟之間隔即上述離子束未照射至 上述基板之期間,實施使上述基板旋轉180度且朝γ方向移 動而變更照射上述離子束之上述單元之列的基板位置變更 步驟’連接兩個上述離子束照射區域而朝上述單元之全部照 射上述離子束的功能,以及使連接上述兩個離子束照射區域 ^ 之連接部位於上述列形成分割帶的功能。 本發明之離子束照射裝置之進而其他形態,係將彼此正交 之兩個方向設為X方向及γ方向,朝面内形成有失持A χ 方向延伸之列形成分割帶及沿γ方向延伸之行形成分宝彳帶 而矩陣狀排列為m列η行(m、η均為2以上之整數)之複數 • 個單元的基板,照射Υ方向之尺寸大於X方向之尺寸之離子 束的離子束照射裝置;其特徵在於包括:離子束產生裝置, 產生Υ方向之束寬包含上述m列之半數以上的列之上述單元 97132060 200924032 之尺寸的離子束;光罩,將上述離子束產生裝置產生之離子 束整开> 為其Y方向之兩端部與X方向實質上平行,同時將該 離子束之Y方向束保持為包含上述爪列之半數以上的列之 上述單元的束寬而使其通過;基板驅動裝置,具有使上述基 板朝X方向及Υ方向移動之功能;以及控制裝置,具有進行 如下控制之功冑b,即,賦予表示上述基板之γ方向位置之資 訊、表示該基板上之上述列形成分割帶之γ方向位置的資訊 及表不通過上述光罩之離子束之下述連接部侧之端部位置 的貧訊,使用該等資訊而控制上述基板驅動裝置,實施兩次 一邊使上述基板朝X方向移動一邊朝該基板照射通過上述 光罩之離子束*於上述基板上形成離子束照射區域的離子 束照射步驟’且於該離子束照射步驟之間隔即上述離子束未 照射至上述基板之期間,實施使上述基板朝γ方向而變更照O The present invention = "other forms of the sub-phase financial method, depending on the direction of the direction 4 X direction and the γ direction, the extension of the in-plane shape clip forms a segmentation band and the line extending in the direction of the 开 is opened 2 Χ direction a plurality of unit substrates in which m columns n 仃 are formed as a cutting tape and whose moments are integers of 2 or more in the Y direction, and the gamma side=the central material has one of the above-mentioned singular division bands In the method, the half of the ion column of the ion size of the direction is such that the beam width of the ❹U beam is such that the ion beam of the riding ruler phase is moved twice in a direction, and the ion is irradiated toward the substrate 97132060 200924032 c beam, and the ion beam irradiation step of forming an ion beam irradiation region on the substrate; and the ion beam is not irradiated onto the substrate at the interval of the ion beam irradiation step, and the substrate is centered on the center portion thereof Rotating 18 degrees in the substrate-plane, and changing the base of the above-mentioned unit that illuminates the ion beam, "turning (four), connecting two of the above-mentioned elements to assist the entire unit to illuminate the ion beam, and making the connection The connecting portions of the two ion beam irradiation regions are located on the center of the substrate to form a dividing strip, and the ends of the two ends of the ion beam in the γ direction are at least located on the side of the connecting portion by the photomask. In order to be substantially parallel to the χ direction, the 离子 〇 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子The dividing strips and the rows extending in the zigzag direction form a dividing strip and are arranged in a matrix such that a plurality of substrates 70 in the row η rows (m is an integer of 3 or more and η is an integer of 2 or more) illuminate the γ direction. An ionizing device of an ion beam having a size larger than a size of a sense direction; the hybrid comprising: a beam generating device, wherein the beam width in the gamma direction comprises (1) the valence is an integer of the "single beam"; the reticle The ion beam generating device generates a positive direction in which the both ends of the positive direction of the beam are substantially parallel to the χ direction, and the both ends of the 子 direction of the sub beam are shaped to be respectively located in the ρ column (ρ is 1). Above the integer of P$(m-2) The two (4) elements are divided and wide to pass through; the substrate crucible device has a function of causing the substrate to face in the χ direction and the u (four) shape; and the function of controlling the following is 97132060 200924032, that is, giving the above-mentioned substrate Position information in the γ direction, information indicating the position of the column on the substrate in the 丫 direction, and position information indicating the γ direction of the ion beam passing through the reticle, using the information (4) the substrate, _ The apparatus performs an ion beam irradiation step of forming an ion beam irradiation region on the substrate by irradiating the substrate with the ion beam of the photomask while moving the substrate toward the X^ direction a plurality of times, and performing the ion beam irradiation step in the ion beam irradiation step In the period in which the ion beam is not irradiated onto the substrate, the step of moving the substrate in the γ direction is performed to change the position of the column of the ion beam on the ion beam, and the connection is made to the upper ion beam irradiation region. The function of illuminating the ion beam toward all of the above units, and causing the plurality of disconnections to be connected to the above-mentioned segmentation (four) Wei. In the other aspect of the ion beam irradiation apparatus in which the radiation region is connected, the two directions orthogonal to each other are slanted in the X direction and the Υ direction, and the extension lines are formed in the plane to form the division band and the γ direction extends in the χ direction. Arranged, the column η is a substrate with a matrix of 2 or more and a wide band, and the gamma directional direction is larger than the Wei unit cell beam irradiation; the feature is: the ionization beam of the ion beam Αμ, +, , 生装置· 'Ion beam that produces γ half or more (4) I; fresh, the upper Mizui bundle (4) ^ ^ feet; = at least the following side of the joint side of the Y direction : The two members are parallel, and at the same time, the ion beam; ^ beam width ^ contains 97132060, I 3 200924032, more than half of the above-mentioned m columns, the beam width of the above unit is passed; the substrate driving device 'has a function of moving the substrate in the χ direction and the γ direction and a function of rotating in the surface of the substrate; and a control device having a function of controlling the gamma direction of the substrate, and displaying the information. The above column formation on the substrate Information on the position of the slashing direction and information indicating the position of the end portion on the side of the connecting portion on the side of the ion beam of the photomask, and using the information to control the substrate driving device, the substrate is turned on twice An ion beam irradiation step of irradiating an ion beam of the photomask to the substrate to form an ion beam irradiation region on the substrate while moving in the X direction, and the ion beam is not irradiated to the substrate at an interval of the ion beam irradiation step In the meantime, the substrate position changing step of changing the substrate in which the substrate is rotated by 180 degrees and moving in the γ direction is changed, and the two ion beam irradiation regions are connected to irradiate the ion beam to all of the cells. The function and the connection portion connecting the two ion beam irradiation regions ^ are located in the above-described columns to form a dividing belt. In still another aspect of the ion beam irradiation apparatus of the present invention, the two directions orthogonal to each other are set to the X direction. And the γ direction, forming a strip extending in the direction of the misalignment A 朝 in the plane to form a split strip and a row extending in the γ direction The ion beam irradiation device of the ion beam in which the size of the plurality of cells is arranged in a matrix of m columns and n rows (m and η are integers of 2 or more), and the ion beam having a size larger than the size of the X direction is irradiated in a matrix. The present invention includes: an ion beam generating device that generates an ion beam of a size of the above-mentioned unit 97132060 200924032 including a plurality of columns of the above m columns in a beam width direction; a photomask that generates an ion beam generated by the ion beam generating device The entire opening portion is substantially parallel to the X direction in the Y direction, and the Y-direction beam of the ion beam is held as a beam width of the unit including the half or more of the claw rows; The substrate driving device has a function of moving the substrate in the X direction and the X direction; and the control device has a function of controlling the position in the gamma direction of the substrate to indicate the above-described information on the substrate. The column forms the information of the position in the gamma direction of the segmentation band and indicates that the position of the end portion on the side of the connection portion of the ion beam of the photomask is not used, and the information is used. Controlling the substrate driving device, performing an ion beam irradiation step of irradiating the substrate in the X direction and irradiating the substrate with the ion beam* passing through the photomask to form an ion beam irradiation region on the substrate twice and performing the ion beam irradiation step In the interval between the irradiation steps, that is, during the period in which the ion beam is not irradiated onto the substrate, the substrate is changed in the γ direction.

射上述離子束之上述單元之列的基板位置變更步驟,連接兩 個上述離子束照射區域而朝上述單元全部照射上述離子束 的功能,以及使連接上述兩個離子束照射區域之連接部位於 上述列形成分割帶的功能。 =發明之離子絲射裝置之進而其他義,係將彼此正交 方白=向料χ方向及γ方向’朝_形成有夹持沿X 方向^之卿成分割帶及沿γ方向㈣ 於其Υ方向之中央部具有上述列形成分割帶中一 97132060 200924032 個的基板’照射Y方向之尺寸方向之尺寸之離子束的 離子束照射裝置;其特徵在於包括:離子束產生裝置,產生 Y方向之束寬包含上itm列之半數以上的列之上述單元之尺 寸的離子束;光罩,將±述離子束產生裝置產生之離子束整 •形為其Y方向兩個端部t至少下述連接部側之端部與乂方向 實質上平行’並且使該連接部侧之端部位於上述基板中央部 之列形成分割帶上,且將該離子Η方向之束寬保持為包含 〇上述m列之半數以上的列之上述單元的束寬而使其通過;基 板驅動裝置’具有使上述基板朝χ方向移動之功能及使上述 基板以其中々部為中心而於基板面内旋轉的功能;以及控制 裝置―,具有進行如下控制之功能,即,控制上述基板驅動裝 置貝施兩-人if使上述基板朝X方向移動一邊朝該基板照 射通過上述光罩之離子束而於上述基板上形成離子束照: 區域的離子束照射步驟,且於該離子束照射步驟之間隔即上 G述離子束未騎至上述基板之顧,實施使上述基板以其中 心部為中心旋轉⑽度而變更照射上述離子束之上述單元 之_基板旋轉步驟,連接兩個上述離子束照射區域,而朝 上速單7L之王。P照射上述離子束的功能,以及使連接上述兩 •個離子束照射區域之連接部位於上述基板中央部之列形成 .分割帶的功能。 (發明效果) 根據申請專利範圍第1項、第2項、第7項之發明,可連 97132060 13 200924032 接複數個離子束照射區域,朝全部單元照射離 使連接複數個離子束照㈣域之連接部位於_成分則帶 =可避免連接部之存在對朝單元均一照射離子束產生 不良衫響。更進-步’藉由光罩將離子束之γ方向兩端部整 形為與X方向實質上平行,因此與不以此方式整形之情形相 比,可減小連接部之寬度’故於卿成分割帶之寬度較小之 情形時’亦可容易地使連接部位於列形成分割帶上。a substrate position changing step of the unit for emitting the ion beam, a function of connecting the two ion beam irradiation regions to the entire unit to irradiate the ion beam, and a connection portion connecting the two ion beam irradiation regions The columns form the function of the split strip. = Further meaning of the inventive ionizing device, which is to be orthogonal to each other, to the direction of the material, and to the direction of the gamma, and to form a dividing zone along the X direction and in the gamma direction (4) The central portion of the Υ direction has an ion beam illuminating device for arranging an ion beam of a size of a size of the substrate in the direction of the Y direction of the 97132060 200924032 of the plurality of divided strips, and is characterized by comprising: an ion beam generating device that generates the Y direction The beam width includes an ion beam of a size of the above-mentioned unit of more than half of the columns of the itm column; the photomask is formed by the ion beam generated by the ion beam generating device, and the two ends t in the Y direction are at least connected as follows The end portion on the side of the portion is substantially parallel to the 乂 direction, and the end portion on the side of the connecting portion is positioned on the center of the substrate to form a dividing strip, and the bundle width in the ion Η direction is maintained to include the above-mentioned m columns. More than half of the rows of the above-mentioned cells pass through the beam width; the substrate driving device 'has a function of moving the substrate in the x-direction and rotating the substrate in the substrate plane centering on the crotch portion thereof And a control device having a function of controlling the substrate driving device to move the substrate toward the X direction while irradiating the substrate with the ion beam of the photomask on the substrate The ion beam irradiation step of the region is formed: and the ion beam irradiation step of the region is performed, and the ion beam is not mounted on the substrate at the interval of the ion beam irradiation step, and the substrate is rotated (10) around the center portion thereof. The substrate rotation step of the unit that irradiates the ion beam is changed, and the two ion beam irradiation regions are connected, and the king of the upper speed is 7L. The function of irradiating the ion beam and the connecting portion connecting the two ion beam irradiation regions to the central portion of the substrate forms a function of dividing the band. (Effect of the Invention) According to the inventions of the first, second, and seventh aspects of the patent application, a plurality of ion beam irradiation regions may be connected to 97132260 13 200924032, and all of the cells are irradiated to connect a plurality of ion beam irradiation (four) domains. The connection portion is located in the _ component band = the presence of the connection portion can be avoided, and the uniform irradiation of the ion beam to the unit is uniformly caused. Further step-by-shaping the both ends of the ion beam in the γ direction to be substantially parallel to the X direction, so that the width of the connection portion can be reduced as compared with the case of not shaping in this manner. When the width of the divided strip is small, the connecting portion can be easily placed on the column to form the dividing strip.

其結果為,即便對一片基板進行分割處理,亦可防止對基 =内之所需處理區域即單元之處理產生不良影響,藉此可對 寬度大於束寬之基板進行處理。進而,可抑制離子源等離子 束產生裝置、質量分離磁鐵等之大型化。 根據申請專利範圍第3項〜第6項、第8項〜第10項之 發明,可連接兩個離子束照射區域並朝全部單元照射離子 束。而且,使連接兩個離子束照射區域之連接部位於列形成 分割帶,因此可避免連接部之存在對朝單元均—照射離子束 產生不良影響。更進一步’藉由光罩將離子束之Υ方向兩個 端部中至少位於連接部側之端部整形㈣"向實質上平 行,故與不以此方式整形之情形相比,可減小連接部之寬 度,因此即便於列形成分割帶之寬度較小之情形,亦可容易 地使連接部位於列形成分割帶上。 結果,即便對-片基板進行分割處理,亦可防止對基板内 之所需處理區域即單元之處理產生不良影響,藉此可對寬度 97132060 14 200924032 大於束寬之基板進行處理。進而,可抑制離子源等離子束產 生裝置、質量分離磁鐵等之大型化。 【實施方式】 - 圖1係表示實施本發明離子束照射方法的離子束照射裝 • 置之一例的概略圖。再者’圖1〜圖3與圖4及其以後之圖 中,圖示之方向相差90度(參照圖中之χ、γ)。 (1)第1實施形態之離子束照射方法及裝置 〇 簡言之,第1實施形態之離子束照射方法及離子束照射裝 置係如下者’使用Υ方向之兩端部分別位於包含1列以上之 單元的兩個列形成分割帶上之束寬的離子束,進行複數次離 子束照射步驟。 再者,按照大體之劃分,上述第1及下述第2、第3實施 形態詳細而言,存在各實施形態中包含若干實施形態之情 形。 〇 上述實施形態之離子束照射方法及離子束照射裝置係如 下者,將彼此正交之兩個方向設為X方向及γ方向,如圖5 所示例,朝面内形成有夾持沿X方向延伸之列形成分割帶 22及沿Υ方向延伸之行形成分割帶24且矩陣狀排列為m列 - η行(m為3以上之整數、η為2以上之整數)之複數個單元 . 20的基板10,如圖2、圖6等示例所示,照射γ方向尺寸 大於X方向尺寸的離子束4。 再者,列行之排列方式並非必須如圖示例般係圖式之左右 97132060 15 200924032 方向為列、上下方向為行,本說明書中,將沿離子束4長度 方向(Y方向)之方向設為行,將其垂直方向設為列。 參照圖5,基板10例如係四邊形(例如長方形)之玻璃基 - 板,且於其表面形成有例如平板顯示器形成用之複數個單元 - 20。更具體而言,各列形成分割帶22及各行形成分割帶24 係直線狀延伸。各單元20分別為四邊形且實質上尺寸相 同。於單元形成區域之外侧通常存在剩餘部26、28等剩餘 〇 部(空白)。 圖6表示放大圖5所示之基板10之一部分以及離子束4。 若例示各元件之尺寸,則基板10之Y方向尺寸W3例如為 1000匪〜2000 mm左右,各單元20之對角尺寸例如為50丽 〜500 mm左右,各列形成分割帶22之Y方向寬度例如為4匪 〜20顏左右,通過下述光罩6之離子束4的Y方向束寬W2 例如為500 mm〜800 mm左右。 〇 圖5所示例中,單元2 0之列行數為5列6行(即m = 5、η =6),但並不限定於此。例如參照圖18之例(4列6行)。 遠多於該等之列行數亦可。 例如X方向實質上係水平方向、Y方向實質上係垂直方As a result, even if the substrate is divided, the substrate can be prevented from being adversely affected by the processing of the desired processing region, i.e., the substrate having a width greater than the beam width. Further, it is possible to suppress an increase in size of the ion source plasma beam generating device, the mass separation magnet, and the like. According to the invention of claims 3 to 6, and 8 to 10, the two ion beam irradiation regions can be connected and the ion beam can be irradiated toward all the cells. Further, the connection portion connecting the two ion beam irradiation regions is positioned to form the division band, so that the presence of the connection portion can be prevented from adversely affecting the irradiation of the ion beam toward the cell. Further, the shape of the at least the end portion of the two ends of the ion beam in the direction of the connection portion is substantially parallel by the reticle, so that the connection can be reduced as compared with the case where the shaping is not performed in this manner. Since the width of the portion is small, even in the case where the width of the column forming slit is small, the connecting portion can be easily positioned on the column to form the dividing tape. As a result, even if the substrate is subjected to the division process, it is possible to prevent the substrate of the desired processing region in the substrate from being adversely affected, whereby the substrate having a width greater than 97132060 14 200924032 can be processed. Further, it is possible to suppress an increase in size of the ion source plasma beam generating device, the mass separation magnet, and the like. [Embodiment] FIG. 1 is a schematic view showing an example of an ion beam irradiation apparatus for carrying out the ion beam irradiation method of the present invention. Further, in the drawings of Figs. 1 to 3 and Fig. 4 and subsequent figures, the directions shown are different by 90 degrees (see χ, γ in the figure). (1) Ion beam irradiation method and apparatus according to the first embodiment, the ion beam irradiation method and the ion beam irradiation apparatus according to the first embodiment are as follows: The two columns of cells form a beamwidth beam beam on the segmentation strip and are subjected to a plurality of ion beam illumination steps. Further, in the above-described first and second and third embodiments, there are a plurality of embodiments in the respective embodiments. The ion beam irradiation method and the ion beam irradiation apparatus according to the above embodiment are as follows. The two directions orthogonal to each other are defined as the X direction and the γ direction. As shown in FIG. 5, the clamping direction is formed in the X direction. The extending row forms the dividing strip 22 and the rows extending in the x direction to form the dividing strip 24 and are arranged in a matrix in a matrix of m columns - η rows (m is an integer of 3 or more, and η is an integer of 2 or more). The substrate 10, as exemplified in FIGS. 2 and 6 and the like, irradiates the ion beam 4 having a size larger than the X direction in the γ direction. Furthermore, the arrangement of the rows and columns is not necessarily as shown in the figure. The left and right sides of the pattern are 97132060 15 200924032. The direction is the column and the vertical direction is the row. In this specification, the direction along the length direction (Y direction) of the ion beam 4 is set. For the row, set its vertical direction to the column. Referring to Fig. 5, the substrate 10 is, for example, a quadrilateral (e.g., rectangular) glass-based plate, and a plurality of cells - 20 for forming a flat panel display are formed on the surface thereof. More specifically, each of the columns forming the dividing tape 22 and the respective rows forming the dividing tape 24 extend linearly. Each unit 20 is quadrilateral and substantially the same size. There are usually remaining portions (blanks) of the remaining portions 26, 28 on the outer side of the unit forming region. Fig. 6 shows an enlarged view of a portion of the substrate 10 shown in Fig. 5 and an ion beam 4. When the dimensions of the respective elements are exemplified, the Y-direction dimension W3 of the substrate 10 is, for example, about 1000 匪 to 2000 mm, and the diagonal dimension of each unit 20 is, for example, about 50 Å to 500 mm, and the columns form the Y-direction width of the dividing tape 22 . For example, it is about 4 to 20 mm, and the Y-direction beam width W2 of the ion beam 4 passing through the mask 6 described below is, for example, about 500 mm to 800 mm. 〇 In the example shown in Fig. 5, the number of rows of cells 20 is 5 columns and 6 rows (i.e., m = 5, η = 6), but is not limited thereto. For example, refer to the example of Fig. 18 (four columns and six rows). Far more than the number of such rows. For example, the X direction is substantially horizontal and the Y direction is substantially vertical.

- 向,或者反之X方向實質上係垂直方向、Y方向實質上係水 . 平方向、即XY平面實質上係垂直面,但並不限定於此,XY 平面實質上可為水平面,亦可為在水平面與垂直面之間傾斜 之面。 97132060 16 200924032 於該實施形態中,圖1所示之離子束照射裝置作為產生γ 方向之束覓Wl為下述既定尺寸之離子束4的離子束產生裝 置一例,其具備離子源2(於下述其他實施形態亦同)。圖工 所示之離子束照射裝置更進一步包括光罩6、光罩驅動裝置 8、支持具12、基板驅動裝置14、離子束監視器16以及控 制裝置18。 離子源2係產生γ方向之尺寸大於χ方向之尺寸、且γ 方向之束寬Wl為包含q列(q為lgqgm之整數)之上述單元 20之尺寸的離子束4。設為之原因在於,若不如此設 疋,則無法處理至少1列之單元2 〇。 上述離子源2產生之離子束4及藉由光罩6整形後照射至 基板10的離子束4之剖面形狀,係於Y方向上為細長之長 方形狀或者大致為長方形狀。如此之離子束4亦稱作帶狀之 離子束4。 於該實施形態中,亦參照圖2,光罩6係如下者,將離子 源2產生之離子束4截斷為其Y方向之兩端部與)(方向實質 上平行’且以該兩端部與x方向實質上平行之方式整形:並 且整形為該離子束4之Y方向兩端部分別位於失持P _ 係1把q且⑹ra—2)之細之上述單元2()的兩個列形 成分割帶22上之束寬W2後使上絲子束4通過。因此,光 罩6之内侧端6a實質上與χ方向平行。 設為之原因在於,若不如此設置,則無法處理至少 97132060 17 200924032 1列之單元20。藉由光罩6截斷離子束4,因此p之最大為 〇、即?$(1。設為1)$(111—2)之目的在於,即便於111最小(即 m= 3)時,亦滿足夾持單元20之兩個列形成分割帶22存在 . 之條件。m = 3時p = 1。 . 於該實施形態中,光罩6係設置於離子束4之Y方向兩 側。並且,於上述實施形態中,兩個光罩6分別如箭頭F、 G所示於Y方向上可動(可動式),藉由光罩驅動裝置8而分 f) 別往復直線驅動。 各光罩驅動裝置8由控制裝置18所控制。於各光罩驅動 裝置8内可預先設置編碼器等之位置檢測器,自各光罩驅動 裝置8朝控制裝置18分別供給兩個光罩6之Y方向内側端 6a的位置資訊,上述實施形態係以如此之方式進行。 光罩6可於對具有某種固定之單元20排列之基板10進行 處理等情形時為固定式,而若如該實施形態預先設為可動 〇 式,則可靈活地對應具有各種單元20排列的多種基板10。 然而,如參照下述圖14〜圖21而說明之第2及第3實施 形態所示,藉由光罩6將離子束4之Y方向兩個端部中位於 連接部32側之端部實際整形為X方向之情形時,亦可預先 . 僅於該整形側設置光罩6。 . 不論光罩6設置於兩側、單側之任一者,用於通過光罩6 而照射至單元20之離子束4,如圖3所示例,較佳為處於 離子束電流密度分布均一之範圍AR内。如此,可對各單元 97132060 18 200924032 20實施均一性良好之離子束照射處理(例如離子注入)。 若光罩6預先配置於離子源2與支持具12上之基板1〇 間’則可實現上述離子束整形之作用,但較佳為儘可能接近 基板10配置。若如此,則離子束4受空間電荷效應引起之 發散的景> 響將會非常小,故可朝基板10照射鮮明之離子束 4 〇 支持具12係用以保持基板10。支持具12之形狀、構造 C'1 並非必須為如圖示例之平板狀,並無特別限定。 基板驅動裝置14具有使基板10與支持具12 一併於χ方 向及Y方向上往復直線移動的功能。除此以外,上述基板驅 動裝置14亦可具有使基板1〇與支持具12 —併以基板1〇 之中心部10a(例如參照圖4)為中心而旋轉的功能。 圖4表示基板驅動裝置η之構造之一例。該基板驅動裝 置14包括使基板1〇與支持具12 一併於χ方向上往復直線 移動之X方向直進機構40、於Υ方向上往復直線移動之γ 方向直進機構46以及以基板10之中心部i〇a為中心而旋轉 之旋轉袭置52°X方向直進機構40包括導件42以及驅動部 44。Y方向直進機構46包括導件48以及驅動部50。旋轉裝 • 置52係用於使基板10旋轉180度之實施形態者,例如可朝 • 箭頭R方向(或者反方向)單向旋轉,亦可為可反轉式。下述 離子束照射步驟、基板位置變更步驟、基板旋轉步驟中基板 10之移動、旋轉中,係使用上述基板驅動裝置14。 97132060 19 200924032 基板驅動裝置14由控制裝£ 18而控制。於該實施形態 中,基板驅動裳置14具有編瑪器等之位置檢測器,且自該 基板驅動裝置14朝控制裝置18供給基板1〇之χ方向及γ -方向之位置資訊。於使基板1〇旋轉之情形時,亦供給基板 10之旋轉方向之位置資訊。 離子束_ππ_視益16具有測定通過光罩β離子束4之γ方向 上兩端部之位置的功能。然而,如上所述藉由光罩6對離子 〇 束4之單個端部進行整形之實施形態的情形時,可具有測定 該端部位置之功能。該離子束監視器16較佳為靠近基板10 而配置,且於靠近基板10之位置處測定離子束4。 離子束監視器16例如可為具有於γ方向上併設之複數個 離子束檢測器(例如法拉第杯)之多點離子束監視器,亦可為 1個離子束檢測器於γ方向上移動之構造者。或者,亦可為 複數個離子束電流_電極等。當藉_子束監視器16測 〇定離子束4時’預先使支持具12及基板1〇移動(退離)至不 妨礙其測定的位置即可。 ^上所述’於將光罩6靠近基板酉己置之情形時,考慮 到光罩6之Y方向内側端6a之位置、與通過光罩6之離子 束4之Y方向端部之位置,實f上相同,目此亦可將光罩6 之Y方向内側端6a之位置資訊用作表示離子束4之γ方向 端部之位置的資訊。 離子束監視器16亦可更進一步具有測定通過光罩6離子 97132060 20 200924032 束4之Y方向上離子束電流密度分布的功能。可使用具有如 此功能之離子束監視器16、與Υ方向具有複數個燈絲之離 子源2,例如按照日本專利第3736196號公報中揭示之技 - 術,根據由離子束監視器16所測定之離子束電流密度分布 - 而對流經各燈絲中之燈絲電流進行反饋控制,藉此將由離子 源2產生之離子束4於Υ方向上的離子束電流密度分布控制 為均一化。如此一來,可使離子源2產生離子束電流密度分 〇 布均一之範圍AR(參照圖3)更廣、且其均一性更高的離子束 4。上述控制裝置18亦可具有上述均一化控制功能,亦可預 先設置具有該功能之其他控制裝置。 再者,亦可於離子源2與基板10之間,更具體而言於離 子源2與光罩6之間,設置進行離子束4之質量分離的質量 分離磁鐵。 其次,對使用如上述離子束照射裝置之離子束照射方法的 Ο 第1實施形態加以說明。 亦參照圖6、圖7,該實施形態之離子束照射方法中使用 如下離子束4:該離子束4如上述之Y方向兩端藉由光罩6 而整形為實質上與X方向平行,且具有Y方向之兩端部4a、 . 4b分別位於夾持p列(p為1 SpS (m — 2)之整數)之單元20 , 的兩個列形成分割帶22上之束寬W2。圖6係p = 3之示例, 圖7係p == 2之示例,但並不限定於該等。- or vice versa, the X direction is substantially perpendicular to the vertical direction, and the Y direction is substantially water. The flat direction, that is, the XY plane is substantially a vertical plane, but is not limited thereto, and the XY plane may be substantially a horizontal plane or may be A plane that is inclined between a horizontal plane and a vertical plane. In the embodiment, the ion beam irradiation apparatus shown in FIG. 1 is an example of an ion beam generating apparatus that generates an ion beam 4 having a predetermined size in the γ direction, and includes an ion source 2 (in the lower part). The same applies to other embodiments. The ion beam irradiation apparatus shown in the drawings further includes a reticle 6, a reticle driving device 8, a holder 12, a substrate driving device 14, an ion beam monitor 16, and a control device 18. The ion source 2 generates an ion beam 4 having a size larger than the χ direction in the γ direction and a beam width W1 in the γ direction being the size of the above unit 20 including q columns (q is an integer of lgqgm). The reason for this is that if you do not set this, you cannot process at least one column of cells 2 〇. The cross-sectional shape of the ion beam 4 generated by the ion source 2 and the ion beam 4 irradiated to the substrate 10 by the mask 6 is elongated or elongated in the Y direction or substantially rectangular. Such an ion beam 4 is also referred to as a ribbon-shaped ion beam 4. In this embodiment, also referring to FIG. 2, the mask 6 is such that the ion beam 4 generated by the ion source 2 is cut into both ends of the Y direction (the direction is substantially parallel) and the both ends are Shaped in a manner substantially parallel to the x direction: and shaped into two columns of the above-mentioned unit 2() in which the two ends of the ion beam 4 in the Y direction are respectively located at the position of the missing P _ system 1 q and (6) ra - 2) After the beam width W2 on the dividing tape 22 is formed, the upper wire bundle 4 is passed. Therefore, the inner end 6a of the reticle 6 is substantially parallel to the χ direction. The reason for this is that if it is not set, the unit 20 of at least 97132060 17 200924032 1 column cannot be processed. The ion beam 4 is cut by the mask 6, so the maximum value of p is 〇, that is, ? The purpose of $(1. is set to 1)$(111-2) is to satisfy the condition that the two columns of the gripping unit 20 form the splitting strip 22 even when the minimum of 111 (i.e., m = 3). When m = 3, p = 1. In this embodiment, the photomask 6 is provided on both sides of the ion beam 4 in the Y direction. Further, in the above embodiment, the two masks 6 are movable (movable) in the Y direction as indicated by arrows F and G, respectively, and are driven by the mask driving device 8 to be reciprocally linearly driven. Each reticle drive unit 8 is controlled by a control unit 18. A position detector such as an encoder may be provided in each of the mask driving devices 8, and position information of the two inner ends 6a of the mask 6 in the Y direction is supplied from each of the mask driving devices 8 to the control device 18. In this way. The mask 6 can be fixed when the substrate 10 having the fixed unit 20 is processed, and the like, and if it is previously set as the movable type, it can flexibly correspond to the arrangement of the various units 20. A variety of substrates 10. However, as shown in the second and third embodiments described with reference to FIG. 14 to FIG. 21 below, the end portion of the ion beam 4 in the Y direction on both sides of the connection portion 32 is actually provided by the mask 6. When the shaping is in the X direction, the mask 6 may be provided only in advance on the shaping side. Regardless of whether the reticle 6 is disposed on either side or on one side, the ion beam 4 for illuminating the unit 20 through the reticle 6, as exemplified in FIG. 3, preferably has a uniform ion beam current density distribution. Within the scope AR. In this manner, uniform ion beam irradiation treatment (e.g., ion implantation) can be performed for each unit 97132060 18 200924032 20. If the mask 6 is disposed in advance between the ion source 2 and the substrate 1 on the holder 12, the ion beam shaping operation can be realized, but it is preferably arranged as close as possible to the substrate 10. If so, the ion beam 4 will be very small due to the effect of the space charge effect, so that the substrate 10 can be illuminated with a sharp ion beam. 4 The support 12 is used to hold the substrate 10. The shape of the support member 12 and the structure C'1 are not necessarily required to be in the form of a flat plate as shown in the drawings, and are not particularly limited. The substrate driving device 14 has a function of reciprocating linearly moving the substrate 10 and the holder 12 in the meandering direction and the Y direction. In addition, the substrate driving device 14 may have a function of rotating the substrate 1 and the holder 12 and centering on the center portion 10a of the substrate 1 (see, for example, Fig. 4). FIG. 4 shows an example of the structure of the substrate driving device η. The substrate driving device 14 includes an X-direction linear motion mechanism 40 that reciprocates linearly in the x-direction with the support member 12 and the support member 12, a γ-direction straight-moving mechanism 46 that reciprocates linearly in the x-direction, and a central portion of the substrate 10. The rotary rotation of the i〇a centering 52° X direction straightening mechanism 40 includes a guide 42 and a driving portion 44. The Y-direction straight advance mechanism 46 includes a guide 48 and a drive portion 50. The rotating device 52 is an embodiment for rotating the substrate 10 by 180 degrees, and for example, can be unidirectionally rotated in the direction of the arrow R (or in the opposite direction), or can be reversed. The substrate driving device 14 is used in the following ion beam irradiation step, substrate position changing step, and movement and rotation of the substrate 10 in the substrate rotation step. 97132060 19 200924032 The substrate drive unit 14 is controlled by a control device 18 . In this embodiment, the substrate driving skirt 14 has a position detector such as a coder, and the position information of the substrate 1 and the γ-direction is supplied from the substrate driving device 14 to the control device 18. When the substrate 1 is rotated, the positional information of the rotation direction of the substrate 10 is also supplied. The ion beam _ππ_view 16 has a function of measuring the position of both end portions in the γ direction of the photomask β ion beam 4. However, in the case of the embodiment in which the single end portion of the ion beam bundle 4 is shaped by the mask 6 as described above, it is possible to have a function of measuring the position of the end portion. The ion beam monitor 16 is preferably disposed adjacent to the substrate 10 and measures the ion beam 4 at a location near the substrate 10. The ion beam monitor 16 may be, for example, a multi-point ion beam monitor having a plurality of ion beam detectors (for example, Faraday cups) arranged in the γ direction, or a configuration in which one ion beam detector moves in the γ direction. By. Alternatively, it may be a plurality of ion beam currents_electrodes or the like. When the ion beam beam 4 is measured by the sub beam monitor 16, the holder 12 and the substrate 1 are moved (retracted) in advance to a position where the measurement is not hindered. In the case where the photomask 6 is placed close to the substrate, the position of the Y-direction inner end 6a of the mask 6 and the position of the Y-direction end of the ion beam 4 passing through the mask 6 are considered. The same is true for f, and the position information of the Y-direction inner end 6a of the mask 6 can also be used as information indicating the position of the end portion of the ion beam 4 in the γ direction. The ion beam monitor 16 may further have the function of measuring the ion beam current density distribution in the Y direction through the beam 6 ion 97132060 20 200924032 beam 4. An ion beam monitor 16 having such a function and an ion source 2 having a plurality of filaments in the x-direction can be used, for example, according to the technique disclosed in Japanese Patent No. 3736196, according to the ion measured by the ion beam monitor 16. The beam current density distribution - feedback control of the filament current flowing through each filament, thereby controlling the ion beam current density distribution of the ion beam 4 generated by the ion source 2 in the x direction to be uniform. In this way, the ion source 2 can be made to produce an ion beam 4 having a wider range of AR (see Fig. 3) and a higher uniformity of ion beam current density distribution. The control device 18 may also have the above-described uniform control function, and other control devices having the function may be provided in advance. Further, a mass separation magnet for performing mass separation of the ion beam 4 may be provided between the ion source 2 and the substrate 10, more specifically, between the ion source 2 and the reticle 6. Next, a first embodiment using an ion beam irradiation method as described above for an ion beam irradiation apparatus will be described. Referring also to FIGS. 6 and 7, in the ion beam irradiation method of this embodiment, an ion beam 4 is used in which the both ends of the Y direction are shaped to be substantially parallel to the X direction by the mask 6 as described above, and The two rows having the Y-direction end portions 4a, .4b are respectively located in the cell 20 sandwiching the p-column (p is an integer of 1 SpS (m-2)), and the two columns form the beam width W2 on the segmentation tape 22. Fig. 6 is an example of p = 3, and Fig. 7 is an example of p == 2, but is not limited to these.

並且,參照圖7〜圖10,實施複數次一邊使基板10朝X 97132060 21 200924032 方向移動一邊朝基板10照射離子束4以於基板10上形成離 子束照射區域30的離子束照射步驟,且於離子束照射步驟 之間隔即離子束4未照射至基板10之期間,實施變更基板 - 10之位置而變更照射離子束4之單元20之列的基板位置變 - 更步驟,連接複數個離子束照射區域30,並朝全部單元20 照射離子束4。且,使連接複數個離子束照射區域30之連 接部32位於列形成分割帶22上。 () 再者,離子束照射區域30係於圖中附上影線而表示。上 述影線並未表示剖面。又,圖7〜圖9中,或許會看出離子 束4之位置在改變,但並非如此,離子束4之位置係固定, 改變的為基板10之X方向及Y方向上的位置。下述圖14〜 圖16中亦相同。圖18〜圖20中,基板10之X方向上之位 置會改變。 若更詳細說明圖7〜圖10所示之離子束照射方法,則首 〇 先如圖7所示,根據需要使基板10朝Y方向移動使離子束 4之一端部4b位於所需之列形成分割帶22上的狀態下(此 時離子束4之Y方向上之另一端部4a例如位於剩餘部26 上),實施一邊使基板10如箭頭A所示朝X方向移動一邊朝 - 基板10照射離子束4而於基板10上形成圖8所示之離子束 . 照射區域30的離子束照射步驟。 其次,如圖8中之箭頭B所示,實施使基板10朝Y方向 移動等於或大致等於離子束4之束寬W2的距離,而變更照 97132060 22 200924032 離子束tr=〇之列的基板位置變更步驟。此時,使 =2:1 :位於之前的離子束照射步驟中所形成 22上如方向之端部所在的列形成_ 22上如此,因離子束4之束寬 另一端部4b位於夾持"之列^34者,故基板4之 帶22上。 ^成刀割帶22的列形成分割 再者,如上所述或者如下所 對準例如可由人進行,亦可二=f1Q對基板4之位置 在下述其他實施形態中亦相同下相制裝置18來進行》 其次,如圏8中之箭頭。所示 方向(但與圖7方向相反)移動—邊減^使基板1〇朝X 而於基板π»切成B9所…邊=1Q照射離子束4 步驟。藉此,可連接兩個離子束照射區域 4上述連接部32位於列形成分割帶22上。Further, referring to FIG. 7 to FIG. 10, an ion beam irradiation step of irradiating the substrate 10 with the ion beam 4 toward the substrate 10 while the substrate 10 is moved in the direction of X97132060 21 200924032 is performed, and the ion beam irradiation region 30 is formed on the substrate 10, and The interval between the ion beam irradiation steps, that is, the period in which the ion beam 4 is not irradiated onto the substrate 10, the position of the substrate 10 is changed, and the substrate position change of the unit 20 for irradiating the ion beam 4 is changed, and a plurality of ion beam irradiations are connected. Region 30 and illuminate ion beam 4 towards all cells 20. Further, the connecting portion 32 connecting the plurality of ion beam irradiation regions 30 is positioned on the column forming dividing strip 22. () Further, the ion beam irradiation region 30 is indicated by a hatching attached to the drawing. The above hatching does not indicate the section. Further, in Figs. 7 to 9, it may be seen that the position of the ion beam 4 is changed, but this is not the case, and the position of the ion beam 4 is fixed, and the position of the substrate 10 in the X direction and the Y direction is changed. The same applies to the following Figs. 14 to 16 . In Figs. 18 to 20, the position of the substrate 10 in the X direction changes. To explain the ion beam irradiation method shown in FIG. 7 to FIG. 10 in more detail, first, as shown in FIG. 7, the substrate 10 is moved in the Y direction as needed to form one end portion 4b of the ion beam 4 in a desired column. In the state in which the tape 22 is separated (in this case, the other end portion 4a of the ion beam 4 in the Y direction is located, for example, on the remaining portion 26), the substrate 10 is irradiated toward the substrate 10 while moving in the X direction as indicated by an arrow A. The ion beam 4 is formed on the substrate 10 to form an ion beam irradiation step of the irradiation region 30. Next, as shown by an arrow B in FIG. 8, the substrate is moved in the Y direction by a distance equal to or substantially equal to the beam width W2 of the ion beam 4, and the substrate position of the ion beam tr=〇 is changed according to the 97132260 22 200924032 ion beam. Change step. At this time, let =2:1: the column formed on the 22 formed in the previous ion beam irradiation step as the end of the direction is formed as _22, because the beam bundle width 4 and the other end portion 4b are located at the clamp &quot The list is ^34, so the substrate 4 is on the belt 22. The column of the cutting tape 22 is divided into two, and as described above or aligned as follows, for example, it can be performed by a person, or the position of the substrate 4 can be the same as in the other embodiments described below. Carry out" Secondly, the arrow in 圏8. The direction shown (but opposite to the direction of Fig. 7) is moved - the edge is reduced so that the substrate 1 is turned toward X and the substrate π is cut into B9. Thereby, the two ion beam irradiation regions 4 can be connected. The above-described connecting portion 32 is located on the column forming division tape 22.

,、-人,如圖9中之箭頭D 移動等於或大致等於離子,使基板10朝γ方向 4、離子束4之束寬W2的距離而變更照射 元2G之列的基板位置變更步驟。此時,使離 子之‘Ma位於之前離子束照射步驟中所形成之離 子束照射區域3RY方向上的端料在的_成分割帶22 上。如此’因離子束4之束U為上述者,故若基板1〇之 Y方向上寬度較大’則基板4之另一端部仆位於失持P列 之列形成分割帶22的列形成分割帶22上。若基板之γ 97132060 23 200924032 方向上寬度較小,則如圖9所示位於基板10外。 Ο Ο 其次’如圖9中之箭頭Ε所示,實施-邊使基板10朝χ 方向(但與圖8方向相反)移動一邊朝基板1〇照射離子束4 而於基板1G上形成圖9所示之第三離子束照射區域3〇的第 一-人離子束照射步驟。藉此,如圖1〇所示可連接三個離子 束照射區域30。而且可使上述各連接部32分別位於列形成 分割帶22上。藉此,於上述實施形態之情形時可朝基板 上之全部單元20照射離子束’因此可完成離子束照射。 當基板10之Υ方向±寬度較大、仍存在離子束照射未完 成之單元20之列時,進而重複如上所述之動作即可。 上述各連接部32中,鄰接之兩個離子束照射區域30,(a) 可如圖9、圖10所示無縫隙地連接上,⑹可如圖u所示 存在縫隙’⑻亦可如_12所㈣有重疊。但独—情形時 均使連接部32位於列形成分割帶22上。此時,連接部犯 最好位於卿齡料22之Y方向上中央附近。其原因在 於可易於避免對單元20造成料^上說·下述其他實 施形態中亦同。 ' 上述說明書中,在包含上述㈤Me)之3種狀態之含義 下,使用「連接」、「連接部 」〈頸的用語,但亦可於包含上 述3種狀態之含義下,換作「垃 合線」、「接縫」等。、」、「接合」、「連合」、「接 圖13表不上述(a)之情形時 硬接部32附近之離子束電 97132060 24 200924032 流密度分布的概略例。連接部32位於列形成分割帶22上, 故可防止其兩側之單元2〇中離子束電流密度產生混亂。 再者,上述各離子束照射步驟中,代替如上述實施形態使 - 基板10朝X方向移動一次,為了獲得所需的離子束照射量 ' (例如離子注入量)等,亦可進行包含往復在内之複數次移 動。在下述其他實施形態中亦相同。 根據該離子束㈣方法,可連接複數健子束照射區域 C) 30’並朝全部單元20照射離子束4而實施離子注入等處理。 且’使連接複數個離子束照射區域3〇之連接部32位於列形 成分割帶22上,因此可避免連接部32之存在對朝單元2〇 照射均一之離子束產生不良影響。 更進—步,離子束4之Y方向兩端部4a、牝藉由光罩6 而1形為實質上與χ方向平行,因此與不以此方式整形之情 形相可減小連接部32之寬度,故即便於列形成分割帶 ;22之寬度較小的情形時,亦可容易地使連接部32位於列形 成分割帶22上。 ^結果為,即便對—片基板10進行分财理,亦可防止 :基:反10内之所需處理區域即單元2〇之處理產生不良影 、稭此可對寬度大於束寬之基板1Q進行處理。 •如二二可抑制離子源2等之大型化。於離子束產生裝置為 形之構成的情形時,可抑制其大型化(下述其他實施 "'、相同)。於具有質量分離磁鐵之情形時,亦可抑制 97132060 200924032 其大型化。 再者’於上述基板位置變更步辦,通㈣由使基板1〇 :::向移動而使連接部32位於列形成分割帶22便可,但 10朝^需要M吏基板10於其面内旋轉180度、並使基板 又,於㈣多動’而使連接部32位於列形成分割帶22上。 板H)之,離子束照射步驟之間^卩離子束4未照射至基 束4相’亦可根據需要使用離子束監視器關定離子 均-性在4上之離子束電流密度分布,確認其均一性,若 各許範圍内,則進行使離子源2產生之離子束4 制。Μ 離子束電絲度分㈣控 如此,可對基板1〇上之全部單元 束照射。Y 20進仃更均一之離子 卜述其他實施形態亦相同。 於構成第i實施形態之離子束照射 制裝置1R 裒置之情形時’上述控The movement of the arrow D in Fig. 9 is equal to or substantially equal to the ion, and the substrate position changing step of changing the distance between the substrate 10 and the beam width W2 of the ion beam 4 is changed. At this time, the "Ma" of the ion is placed on the _-segmented belt 22 in the direction of the ion beam irradiation region 3RY formed in the previous ion beam irradiation step. Thus, since the beam U of the ion beam 4 is the above, if the substrate 1 has a large width in the Y direction, the other end portion of the substrate 4 is placed in the column of the missing P column to form the division band 22 to form the division band. 22 on. If the width of the substrate in the γ 97132060 23 200924032 direction is small, it is located outside the substrate 10 as shown in FIG. Ο Ο Next, as shown by the arrow Ε in Fig. 9, the substrate 10 is moved in the χ direction (but opposite to the direction of Fig. 8) while the ion beam 4 is irradiated toward the substrate 1 to form the substrate 1G. A first-human ion beam irradiation step of the third ion beam irradiation region 3〇 is shown. Thereby, three ion beam irradiation regions 30 can be connected as shown in Fig. 1A. Further, each of the above-described connecting portions 32 may be positioned on the column-dividing strip 22. Thereby, in the case of the above embodiment, the ion beam can be irradiated to all the cells 20 on the substrate, so that ion beam irradiation can be completed. When the substrate 10 has a large width ± width and there is still a cell 20 in which the ion beam irradiation is not completed, the above operation may be repeated. In each of the above-mentioned connecting portions 32, the adjacent two ion beam irradiation regions 30, (a) can be connected without gaps as shown in Figs. 9 and 10, and (6) there can be a gap as shown in Fig. 5 (8). There are overlaps between 12 (4). However, in the case of the case, the connecting portion 32 is placed on the column forming dividing belt 22. At this time, the connection portion is preferably located near the center in the Y direction of the Qingnian material 22. The reason for this is that it is easy to avoid causing the material of the unit 20 to be the same as in the other embodiments described below. In the above description, the words “connection” and “joining unit” are used in the meaning of the three states including the above-mentioned (five) Me), but the meaning of the above three states may be used instead. Line, "seam", etc. "," "joining", "joining", and "the case of the above-mentioned (a) is shown in Fig. 13 is a schematic example of the flow density distribution of the ion beam in the vicinity of the hard portion 32. The connection portion 32 is in the column forming division. With the belt 22, it is possible to prevent the ion beam current density from being disturbed in the unit 2〇 on both sides. Further, in the above-described ion beam irradiation step, instead of moving the substrate 10 in the X direction as in the above embodiment, in order to obtain The required ion beam irradiation amount ' (for example, ion implantation amount) or the like may be performed in plural times including reciprocation. The same applies to the other embodiments described below. According to the ion beam (four) method, a plurality of health beam bundles can be connected. The irradiation region C) 30' is irradiated to the entire unit 20 to perform ion implantation or the like, and the connection portion 32 that connects the plurality of ion beam irradiation regions 3 is placed on the column formation division belt 22, thereby avoiding the connection. The presence of the portion 32 adversely affects the irradiation of the uniform ion beam toward the unit 2 。. Further, the Y-direction end portions 4a of the ion beam 4 and the 牝 are formed by the reticle 6 in a substantially χ direction Since the width of the connecting portion 32 can be reduced as compared with the case where the shaping is not performed in this manner, even when the width of the column forming the dividing tape 22 is small, the connecting portion 32 can be easily arranged in the column to form the dividing portion. The result of the tape 22 is that even if the substrate substrate 10 is divided into money, it can prevent: the base: the processing area required in the reverse 10, that is, the processing of the unit 2 产生 produces a bad shadow, and the straw can be wider than the bundle The wide substrate 1Q is processed. • If the ion source 2 is large in size, the size of the ion beam generator can be suppressed. (In other cases, the following implementations are the same) In the case of a mass-separating magnet, it is also possible to suppress the enlargement of 97132060 200924032. In addition, the step of changing the substrate position is performed, and the connection portion 32 is formed in the column by moving the substrate 1〇::: The dividing tape 22 is sufficient, but it is necessary for the M 吏 substrate 10 to be rotated 180 degrees in its plane, and the substrate is again moved (4) to move the connecting portion 32 to form the dividing tape 22 on the column. , the ion beam irradiation step is not between the ion beam 4 The ion beam current density distribution of the ion uniformity at 4 can be determined by using an ion beam monitor as needed to confirm the uniformity. If the range is within the range, the ion source 2 is generated. Ion beam 4 system. 离子 Ion beam wire degree (four) control, so that all the unit beams on the substrate 1 照射 can be irradiated. Y 20 仃 仃 仃 离子 离子 离子 离子 离子 离子 离子 离子 。 。 。 。 。 。 。 。 。 。 。 。 When the ion beam irradiation device 1R is placed, the above control

U Y方向位’酬予絲基板1〇之 方向上位复貝/不基板1〇上之列形成分割帶22之Υ 兩端部4a^訊以及表示通過鮮6之離子束㈣Υ方向 裝置ui*置之資訊,並使用該等資訊控制基板驅動 板位置變㈣子束騎㈣,且實施上述基 單元她娜子束騎_ 3G並朝全部 97132060 形成分割帶Si:的功能’以及使上述連接部32位於列 參照圖】、圖6對賦予至控制裝置18的資訊更具體例加 26 200924032 以說明。 表示基板10的Y方向位置之資訊係由基板驅動裝置14 而賦予。例如,賦予基板10之¥方向一端之γ座標yl。 表示通過光罩6的離子束4之γ方向兩端部4a、4b之位 置的資訊由離子束監視器丨6賦予。例如賦予該兩端部如、 4b之Y座標Yl、γ?。又,如上所述,亦可使用光罩6之内側 端6a之Y座標來代替。The direction of the UY direction is 'received to the silk substrate 1 上 in the direction of the upper shell / no substrate 1 〇 on the column to form the dividing strip 22 两端 both ends 4a ^ and the ion beam (four) Υ direction device ui* placed Information, and use the information to control the position of the substrate driving board to change (4) the sub-beam ride (4), and implement the above-mentioned base unit, she is riding the _ 3G and forming the function of splitting the Si: toward all 97132060' and the above-mentioned connecting portion 32 is located Referring to the drawings, FIG. 6 adds a more specific example of the information given to the control device 18 to 26 200924032 for explanation. Information indicating the position of the substrate 10 in the Y direction is given by the substrate driving device 14. For example, the γ coordinate yl of the one end of the substrate 10 in the direction of the ¥ is given. Information indicating the positions of the both end portions 4a and 4b of the ion beam 4 passing through the mask 6 in the γ direction is given by the ion beam monitor 丨6. For example, the Y coordinates Y1 and γ? of the both end portions such as 4b are given. Further, as described above, the Y coordinate of the inner end 6a of the mask 6 may be used instead.

C 表示基板10上之列形成分割帶22之丫方向位置的資訊, 作為基板貧訊之—部分而賦予至控制裝置18。該資訊例如 有如下_。以扣)、⑹可認从表示基板 10上之列形成分割帶22之Y方向位置的資訊。 ⑨⑷賦予基板H)上之各列的單元2()之¥方向兩端之7座 標 y2、y3、y4、y5、yr" 〇 出。 上述Y座標…^卞^…亦表示各列形成分割帶以之 Υ方向兩端的γ座標’因此根據該等可知各列形成分割帶22 之Υ方向位置。若需要各列形成分割帶22之中央之Υ胖 ew· ’則亦可於控制裝置18内進行例如下式之運算= [數1] ei= (y3—y4)/2 e2= (ys- y6)/2 97132060 27 200924032 (b)賦予基板l〇上之列形成分割帶22之列數『、各單元 20之Y方向之寬度b、各列形成分割帶22之γ方向之寬度 a、以及Υ方向之剩餘部26的寬度c。與上述γ座標…相^ 侧之剩餘部28之寬度d並非必須。 • 可根據該等資訊與上述基板10之γ方向—端之γ座標 y! ’例如按照下式而求出基板1〇上之各列的單元別之Y方 向兩端之上述Y座標y2、y3、y4、y5、y6.·· ’因此亦可於控 〇制裝置18内進行上述運算。其他與上述⑷之情形相同。 [數2] y2 = yi — c y3 = y2 —b = yi-c-b y4 = y3 — a = yi — c — b—a •«· 上述(a)或者(b)之資訊例如以數值資訊輸入至控制裝置 G 18,亦可將具有上述資訊之條形碼㈣先賦予基板 10或者 基板收納匣等,藉由讀取頭讀取上述資訊並將其賦予控制裝 置18。又,亦可藉由相機讀取所需之列形成分割帶22之位 置並將該位置資訊賦予控制裳置18。 , 再者,並非必須將表示基板1〇上之全部列形成分割帶22 , 之Y方向位置的資訊賦予控制裝置18中,亦可賦予至少表 示上述連接部32所在之列形成分割帶22之位置的資訊。在 下述其他實施形態中亦相同。 97132060 28 200924032 根據具備如上述之離子源2、光罩6、基板驅動襄置μ、 控制裝置18等之第1實施形態之離子束照射裝置,實現與 上述第1實施形態之離子束照射方法所實現之上述效果相 同的效果。 . (2)第2實施形態之離子束照射方法及裝置 簡言之’第2實施形態之離子束照射方法及離子束照射裝 置,使用Y方向之束寬為包含半數以上之列的單元之尺寸的 離子束,進行兩次離子束照射步驟。 圖Η〜圖17係用以說明第2實施形態之離子束照射方法C indicates that the information on the substrate 10 at the position in the 丫 direction of the division tape 22 is given to the control device 18 as a part of the substrate lag. The information is as follows _. The information indicating the position of the dividing belt 22 in the Y direction is formed by the row on the substrate 10. 9(4) gives 7 coordinates y2, y3, y4, y5, yr" at both ends of the unit 2 () in the column on the substrate H). The above-mentioned Y coordinates ... 卞 卞 ... 亦 亦 亦 亦 亦 亦 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 If it is necessary for each column to form the center of the dividing zone 22, then the operation of the following equation can be performed in the control device 18 = [number 1] ei = (y3 - y4) / 2 e2 = (ys - y6 /2 97132060 27 200924032 (b) The number of columns in which the dividing strips 22 are formed on the substrate 〇, the width b of each unit 20 in the Y direction, the width y of the γ direction of each of the columns 22, and Υ The width c of the remaining portion 26 of the direction. The width d of the remaining portion 28 on the side opposite to the above γ coordinate is not necessary. • Based on the information and the γ-coordinate y! of the γ-direction of the substrate 10, for example, the Y-coordinates y2 and y3 at both ends of the Y-direction of the cells of each column on the substrate 1 are obtained according to the following equation. , y4, y5, y6.·· 'Therefore, the above calculation can also be performed in the control device 18. Others are the same as in the case of (4) above. [Number 2] y2 = yi — c y3 = y2 — b = yi-cb y4 = y3 — a = yi — c — b—a • «· The information of (a) or (b) above is entered, for example, by numerical information. The control device G 18 may also provide the barcode (4) having the above information to the substrate 10 or the substrate storage cassette, etc., and the information is read by the reading head and given to the control device 18. Alternatively, the position of the segmentation tape 22 can be formed by reading the desired column by the camera and the positional information can be imparted to the control skirt 18. Further, it is not necessary to provide the information indicating the Y-direction position of all the columns on the substrate 1 to the control device 18, and to provide at least the position where the connecting portion 32 is formed to form the dividing tape 22. Information. The same applies to the other embodiments described below. 97132060 28 200924032 The ion beam irradiation method according to the first embodiment of the present invention is realized by the ion beam irradiation apparatus according to the first embodiment including the ion source 2, the mask 6, the substrate driving device μ, and the control device 18 as described above. The same effect as the above effect is achieved. (2) The ion beam irradiation method and apparatus according to the second embodiment, in the ion beam irradiation method and the ion beam irradiation apparatus of the second embodiment, the beam width in the Y direction is the size of a cell including more than half of the columns. The ion beam is subjected to two ion beam irradiation steps. FIG. 17 to FIG. 17 are diagrams for explaining an ion beam irradiation method according to a second embodiment.

I 及離子束照射裝置的圖。以下,對與上述第丨實施形態相同 或者相當之部分附上相同符號,而主要說明與上述第1實施 形態之不同點。 與上述第1實施形態不同,該實施形態中無須滿足即便m 最小時亦存在夾持單元2〇之兩個列形成分割帶22的條件, G 因此m、n均為2以上之整數即可。下述第3實施形態中亦 相同。 上述實施形態中,例如圖14所示,使用γ方向之束寬W2 為包含上述m列之半數以上之列的單元2〇之尺寸的離子束 • 4。圖14係5、束寬%包含3列的單元20之情形的示例, 但並不限定於此。 而且’實施兩次一邊使基板1〇朝X方向移動一邊朝基板 10照射離子束4而於基板10上形成離子束照射區域30的 97132060 29 200924032 離子束照射步驟,且於離子束照射步驟之間隔即離子束4 未照射至基板10之期間’實施變更基板1〇之位置以變更照 射離子束4之單元20之列的基板位置變更步驟,連接兩個 離子束照射區域30朝全部單元20照射離子束4。且使連接 兩個離子束照射區域30之連接部32位於列形成分割帶Μ 上,且藉由上述光罩6(參照圖丨、圖2)將離子束4之γ方 ΟI and the diagram of the ion beam irradiation device. In the following, the same or corresponding portions as those of the above-described embodiment are denoted by the same reference numerals, and the differences from the above-described first embodiment will be mainly described. Unlike the above-described first embodiment, in the embodiment, it is not necessary to satisfy the condition that the division band 22 is formed in two rows of the clamping unit 2〇 even when m is the smallest, and therefore, m and m are both integers of 2 or more. The same applies to the third embodiment described below. In the above embodiment, for example, as shown in Fig. 14, the beam width W2 in the γ direction is an ion beam 4 having a size of a cell 2 包含 including a half or more of the m columns. 14 is an example of a case where the bundle width % includes three rows of cells 20, but is not limited thereto. Further, 'the ion beam irradiation step of irradiating the substrate 1 to the X direction while irradiating the substrate 1 to the X direction and forming the ion beam irradiation region 30 on the substrate 10 is performed at intervals of the ion beam irradiation step. In other words, during the period in which the ion beam 4 is not irradiated onto the substrate 10, the substrate position changing step of changing the position of the substrate 1 to change the cell 20 for irradiating the ion beam 4 is performed, and the two ion beam irradiation regions 30 are connected to irradiate ions to all the cells 20. Bunch 4. Further, the connecting portion 32 connecting the two ion beam irradiation regions 30 is positioned on the column forming strip, and the gamma of the ion beam 4 is obtained by the mask 6 (see Fig. 2, Fig. 2).

向兩個端部4a、4b中至少位於連接部32側之端部仆整形 為實質上與X方向平行。 於上述情形時,離子束4之與上述端部4b相反—侧之端 4 4a可藉由光罩6而整形,亦可不整形。其原因在於,上 述端部4a並不位於連接部32側。又,若滿足上述束寬% 之條件,則該端部4a之Y方向位置並不限定於特定之位置 上。例^ ’如圖14所示可位於基板1G外,亦可位於基板 —而°卩,還可位於剩餘部26上。亦無須將端部4a之位 置貝成靖予控制裝置18。在下述第3實施形態中亦相同。 、=更詳細地說日 14〜圖17所示之離子束照射方法,則 ::圖14所示’於根據需要使基板_γ方向移動並使 竹,4之上述端部4b位於所需之列形成分割帶22上的狀 : 福-邊使基板1Q如箭頌A所示朝χ方向移動一邊 朝基板10照射離子束4而於基柘 '丞叛10上形成圖14所示之離 子采j射區域3G的離子束照射步驟。 其-欠’如圖15中之箭則所示(或者其反方向),實施使 97132060 30 200924032 基板10例如以其中心部l〇a為中心於基板面内 轉 180 度,其次如圖16中之箭頭Β所示使基板1〇朝γ方内移動 藉此變更照射離子束4之單元20之列的基板位置變更步 驟。此時,離子束4之上述端部4b位於之前的離子束照射 -步驟中所形成的離子束照射區域30之γ方向上之端部所在 的列形成分割帶22上。此時,亦可同時進行使基板1〇如箭 頭R所示旋轉、以及如箭頭B所示移動。 Γ 其次,如圖16中之箭頭c所示,實施一邊使基板1〇朝χ 方向(但與圖14方向相反)移動一邊朝基板1〇照射離子束4 而於基板10上形成圖17所示之第二離子束照射區域30的 第二次離子絲射㈣。H此,可連接兩娜子束照射區域 30。而且’可使上述連接部32位於列形成分割帶22上。藉 〇 此,於該實施形態之情形時,可朝基板Η)上之全部單元20 照射離子束,因此完成離子束照射。 根據該離子束照射方法,可連接兩個離子束照射區域30 並朝全部單元2G照射離子束,而實施離子注人等處理。且, =兩個離子束照射區域3〇之連接部犯位於列形成分割 Γ離子束//避免連接部%之存在對朝單元照射均一 之離子束產生不良影響。 至由光罩6將離子束4之¥方向之兩個端部中 =12不\32側之”45整形為與X方向實質上平 W之情形相比’可減小連接部32 97132060 31 200924032 之寬度’故即便列形成分割帶22之寬度較小之情料 可容易地使連接部32位於列形成分割帶22上。7 、 其結果為,即便對一片基板1〇進行分割處理,亦可防止 =基=〇内之所需處理區域即單元2〇的處理產生不良影 # ’藉可對寬度大於束寬之基板1G進行處理。 進而,可抑制離子源2等之大型化。於具有質量分離磁鐵 之情形時,亦可抑制其大型化。The end portions of the both end portions 4a, 4b at least on the side of the connecting portion 32 are shaped to be substantially parallel to the X direction. In the above case, the end 4 4a of the ion beam 4 opposite to the end portion 4b may be shaped by the mask 6, or may not be shaped. The reason for this is that the end portion 4a is not located on the side of the connecting portion 32. Further, if the condition of the bundle width % is satisfied, the position of the end portion 4a in the Y direction is not limited to a specific position. The example ^' may be located outside the substrate 1G as shown in FIG. 14, or may be located on the substrate - and may be located on the remaining portion 26. It is also not necessary to position the end portion 4a to the control device 18. The same applies to the third embodiment described below. More specifically, the ion beam irradiation method shown in the day 14 to FIG. 17 is as follows: as shown in FIG. 14 , the substrate _γ is moved as necessary, and the end portion 4b of the bamboo 4 is located at a desired level. The column forms a shape on the dividing strip 22: the buck-side causes the substrate 1Q to move in the x-direction as indicated by the arrow A, and irradiates the ion beam 4 toward the substrate 10 to form the ion collecting shown in FIG. 14 on the substrate The ion beam irradiation step of the j-ray region 3G. Its - owing as shown by the arrow in Fig. 15 (or its opposite direction), the implementation of the 97132260 30 200924032 substrate 10, for example, with its central portion l 〇 a centered on the substrate surface 180 degrees, and then as shown in Figure 16 The arrow Β moves the substrate 1 〇 in the γ direction to change the substrate position changing step of the unit 20 that irradiates the ion beam 4 . At this time, the end portion 4b of the ion beam 4 is positioned on the division band 22 in which the end portion of the ion beam irradiation region 30 formed in the previous ion beam irradiation step is located in the γ direction. At this time, it is also possible to simultaneously rotate the substrate 1 as indicated by the arrow R and move as indicated by the arrow B. Next, as shown by an arrow c in Fig. 16, the ion beam 4 is irradiated toward the substrate 1 while the substrate 1 is moved in the χ direction (but opposite to the direction of Fig. 14), and the substrate 10 is formed on the substrate 10 as shown in Fig. 17. The second ion beam of the second ion beam illuminates the region 30 (four). H, the two-beam beam irradiation area 30 can be connected. Further, the connecting portion 32 can be positioned on the column forming dividing belt 22. By this, in the case of this embodiment, all of the cells 20 on the substrate 照射 can be irradiated with an ion beam, thereby completing ion beam irradiation. According to this ion beam irradiation method, the two ion beam irradiation regions 30 can be connected and the ion beam can be irradiated to all the cells 2G, and processing such as ion implantation can be performed. Further, the connection portion of the two ion beam irradiation regions 3〇 is located in the column to form the split Γ ion beam // the presence of the avoidance of the connection portion % has an adverse effect on the uniform irradiation of the ion beam toward the unit. It is possible to reduce the connection portion 32 97132060 31 200924032 by the photomask 6 in which the "45" of the two ends of the ion beam 4 in the direction of the ? = not \32 side is shaped to be substantially flat with respect to the X direction. Since the width is small, even if the width of the column-forming division tape 22 is small, the connection portion 32 can be easily placed on the column-forming division tape 22. 7 As a result, even if one substrate 1 is divided, It is possible to prevent the substrate 1G having a width larger than the beam width from being processed by the processing of the unit 2〇 which is the required processing area in the base = 〇. Further, it is possible to suppress the enlargement of the ion source 2 and the like. When the magnet is separated, it is also possible to suppress the increase in size.

又’與上述第1實施形態相比’具有光罩6亦可(及設置 光罩驅動裝置8之情形時該光罩驅動裝置8亦可)設置於單 侧之優點。 、 第2實施形態之離子束照射裝置中,上述離子源2產生束 寬仏包含上述!!!列之半數以上的列之上述單元的離子束。 上述光罩6係如下者,將離子源2產生之離子束4整形為 其Y方向之兩個端部中至少上述連接部32側之端部與X方 向實質上平行,同時將該離子束4之¥方向束寬保持為包含 上述m列之半數以上的列之單元2〇的束寬W2,而使其通過。 因此,光罩6亦可(設置光罩驅動裝置8之情形時光罩驅動 裝置8亦可)僅設置於單側。 於上述實施形態之情形時,上述基板驅動裝置14具有使 基板10朝X方向及Y方向移動之功能以及使基板10於基板 面内旋轉之功能。 上述控制裝置18具有如下控制功能,即,被賦予表示基 97132060 32 200924032 板10之Y方向位置之資訊、表示該基板10上之列形成分割 帶22之Υ方向位置的資訊及表示通過光罩6的離子束4之 連接部32側之端部4b位置的資訊,使用該等資訊控制基板 - 驅動裝置14,實施兩次上述離子束照射步驟,且實施上述 . 基板位置變更步驟,連接兩個離子束照射區域30並朝全部 單元20照射離子束4的功能,以及使上述連接部32位於列 形成分割帶22上之功能。賦予至該控制裂置Μ之資訊之更 f)具體例與第1實施形態中所說明者大致相同,此處省略其重 複說明。 根據具備如上述之離子源2、光罩6、基板驅動裝置14、 控制裝置18等的第2實施形態之離子束照射裝置,可實現 與上述第2實施形態之離子束照射方法所實現之上述效果 相同的效果。 再者’亦可藉由光罩6將離子束4之γ方向兩端部4a、 ϋ 4b整形為與X方向實質上平行。於該情形時,上述基板位 置變更步驟中亦可不使基板10旋轉而使基板㈣γ方向移 動’藉此變更基板1 〇之位置使連接冑32位於列形成分割帶 22上。其原因在於,對基板10之Υ方向的兩端部4a、4b -進行整形,故與上述第1實施形態之情形相同,即便不使基 •板1G旋轉亦可使用離子束4之兩端部4a、4b而連接兩個離 子束照射區域30。此時,基板驅動裝置U可省略使基板10 旋轉之功能(例如旋轉裝置52)。 97132060 33 200924032 (3)第3實施形態之離子束照射方法及裝置 簡言之,第3實施形態之離子束照射方法及離子束照射裝 置係使用Y方向之束寬包含半數以上的列之單元之尺寸的 離子束,對Y方向之中央部具有一個列形成分割帶之基板進 . 行兩次離子束照射步驟。 圖18〜圖21係用以說明第3實施形態之離子束照射方法 及離子束照射裝置之圖。第3實施形態與第2實施形態類 () 似’故以下主要對與上述第2實施形態之不同點加以說明。 該實施形態例如圖18之示例,朝Y方向之中央部具有列 形成分割帶22中之一個的基板1 〇照射離子束4。 作為離子束4,與第2實施形態之情形相同,使用Y方向 之束寬I包含上述m列之半數以上的列之單元2〇之尺寸的 離子束4。圖18係m:=4、束寬W2包含2列之單元20之情 形例,但並不限定於此。 G 並且,實施兩次一邊使基板10朝X方向移動一邊朝基板 10照射離子束4而於基板10上形成離子束照射區域30之 離子束照射步驟,且於離子束照射步驟之間隔即離子束4 未照射至基板10之期間,實施使基板1〇以其中心部1〇a 為中心於基板面内旋轉18〇度,而變更照射離子束之單元 20之列的基板旋轉步驟,連接兩個離子束照射區域30並朝 全部早兀20照射離子束4。而且使連接兩讎子束照射區 域30之連接部32位於基板中央部之列形成分割帶22上, 97132060 34 200924032 且藉由上述光罩6(參照圖1、圖2)將離子束4之Y方向的 兩個端部4a、4b中至少位於連接部32側之端部4b整形為 與X方向實質上平行。 當更詳細說明圖18〜圖21所示之離子束照射方法,則首 - 先如圖18所示,於使離子束4之上述端部4b位於基板中央 之列形成分割帶22上之狀態下,實施一邊使基板10如箭頭 A所示朝X方向移動一邊朝基板10照射離子束4而於基板 10上形成圖19所示離子束照射區域30的離子束照射步 驟。例如可藉由上述光罩6之位置調整,而使離子束4之端 部4b位於基板中央之列形成分割帶22上。雖亦可藉由使基 板10朝Y方向移動而實現,但此時基板10之Y方向移動手 段為必須,故較簡單方式係藉由光罩6而進行。 其次,實施如圖19中之箭頭R所示(或其反方向),使基 板10以其中心部10a為中心於基板面内旋轉180度,藉此 〇 變更照射離子束4之單元20之列的基板旋轉步驟。藉此, 下一離子束照射步驟中照射之離子束4之上述端部4b,位 於之前的離子束照射步驟中所形成之離子束照射區域30之 Y方向之端部所在的列形成分割帶22上。 - 其次,實施如圖20中之箭頭C所示,一邊使基板10朝X . 方向(但與圖18方向相反)移動一邊朝基板10照射離子束4 而於基板10上形成圖21所示第二離子束照射區域30的第 二次離子束照射步驟。藉此,可連接兩個離子束照射區域 97132060 35 200924032 30。而且可使該連接部32位於中央之列形成分割帶22上。 藉此’於該實施形態之情形時,可朝基板1〇上之全部單元 20照射離子束,而完成離子束照射。 * 根據上述離子束照射方法,可實現與上述第2實施形態之 - 離子束照射方法所實現之效果相同的效果。又,與上述第2 實施形態相比’具有可不使基板1〇朝γ方向移動之優點。 因此’上述基板驅動裝置14可省略使基板10朝γ方向移動 Ο 之功能(例如Y方向直進機構46)。 第3實施形態之離子束照射裝置中,上述光罩6係如下 者’將離子源2產生之離子束4整形為。方向之兩個端部 中至少上述連接部32側之端部與χ方向實f上平行,同時 使該連接部32側之端部位於基板中央部之列形成分割帶22 上’且將該離子束4之Y方向的束寬保持為包含上“列之 半數以上的列之單元2〇的束寬W2而使該離子束4通過。 ° 上述基板驅動裝置14亦可不具有使基板10朝Y方向移動 之功旎(例如γ方向直進機構46),而可具有使基板1〇朝χ 方向移動之功能及使基板10以其中心部10a為中心於基板 面内旋轉之功能。 - 上述控制裝置18於該實施形態之情形時,具有如下控制 - 功能,即,控制基板驅動裝置14,實施兩次上述離子束照 射步驟,且實施上述基板旋轉步驟,連接兩個離子束照射區 域30並朝全部單元2〇照射離子束&之功能,以及使上述連 97132060 36 200924032 接部32位於基板中央部之列形成分割帶22上之功能。 該控制裝置18亦可不控制基板1〇朝γ方向移動,故亦可 不賦予Y方向位置控制所需之資訊、例如表示上述基极1q 之Y方向位置的資訊、表示基板1〇上之列形成分割帶0 之Y方向位置的資訊以及表示通過光罩6的離子束4之端部 位置的資訊。 根據具備如上述離子源2、光罩6、基板驅動裝置14、抑 D 制裝置18等之第3實施形態之離子束照射裝置,可實現: 上述第3實施形態之離子束照射方法所實現之上述欵果相 同的效果。 (4)離子束產生裝置之示例Further, in comparison with the above-described first embodiment, there is an advantage that the mask 6 can be provided (and the mask driving device 8 can be provided when the mask driving device 8 is provided) on one side. In the ion beam irradiation apparatus according to the second embodiment, the ion source 2 generates an ion beam having a beam width 上述 the unit including the half or more of the !!! column. The photomask 6 is formed such that the ion beam 4 generated by the ion source 2 is shaped such that at least the end portion on the side of the connecting portion 32 of the two end portions in the Y direction is substantially parallel to the X direction, and the ion beam 4 is simultaneously The bundle direction width is maintained as the bundle width W2 of the unit 2〇 including the half or more of the above-mentioned m columns, and is passed. Therefore, the mask 6 can also be provided on only one side (the mask driving device 8 can also be provided in the case where the mask driving device 8 is provided). In the case of the above embodiment, the substrate driving device 14 has a function of moving the substrate 10 in the X direction and the Y direction and a function of rotating the substrate 10 in the substrate surface. The control device 18 has a control function of giving information indicating the position of the substrate 10 in the Y direction of the substrate 97132060 32 200924032, indicating the position of the column on the substrate 10 to form the position of the dividing band 22, and indicating the passing of the mask 6 The information on the position of the end portion 4b on the side of the connection portion 32 of the ion beam 4 is controlled by the substrate-driving device 14 using the information, and the above-described ion beam irradiation step is performed twice, and the substrate position changing step is performed to connect the two ions. The beam irradiation region 30 has a function of irradiating the entire unit 20 with the ion beam 4, and a function of causing the above-described connecting portion 32 to be positioned on the column forming the divided strip 22. The information given to the control splitting is more specific. The specific example is substantially the same as that described in the first embodiment, and the repeated description thereof is omitted here. According to the ion beam irradiation apparatus of the second embodiment including the ion source 2, the mask 6, the substrate driving device 14, and the control device 18, the above-described ion beam irradiation method according to the second embodiment can be realized. The same effect. Further, the γ-direction both end portions 4a and 4b of the ion beam 4 may be shaped to be substantially parallel to the X direction by the mask 6. In this case, in the substrate position changing step, the substrate (4) may be moved in the γ direction without rotating the substrate 10, thereby changing the position of the substrate 1 so that the connection port 32 is positioned on the column formation division tape 22. This is because the both end portions 4a and 4b of the substrate 10 in the meandering direction are shaped. Therefore, as in the case of the first embodiment, the both ends of the ion beam 4 can be used without rotating the base plate 1G. The two ion beam irradiation regions 30 are connected to 4a and 4b. At this time, the substrate driving device U can omit the function of rotating the substrate 10 (for example, the rotating device 52). (I) In the ion beam irradiation method and the ion beam irradiation apparatus of the third embodiment, the beam width in the Y direction includes a unit of more than half of the columns. The ion beam of a size is subjected to two ion beam irradiation steps for a substrate having a column forming a division band at a central portion in the Y direction. 18 to 21 are views for explaining an ion beam irradiation method and an ion beam irradiation apparatus according to a third embodiment. The third embodiment and the second embodiment are similar to each other, and the differences from the second embodiment will be mainly described below. In this embodiment, for example, as shown in Fig. 18, the substrate 1 having one of the divided bands 22 formed in the center portion in the Y direction illuminates the ion beam 4. As the ion beam 4, as in the case of the second embodiment, the beam width I in the Y direction includes the ion beam 4 having the size of the cell 2 of the above-described column of the m columns or more. Fig. 18 is an example of a case where m: = 4 and the beam width W2 includes two rows of cells 20, but is not limited thereto. G. An ion beam irradiation step of irradiating the substrate 10 with the ion beam 4 while the substrate 10 is moved in the X direction and forming the ion beam irradiation region 30 on the substrate 10, and the ion beam is irradiated at intervals of the ion beam irradiation step. 4. During the period when the substrate 10 is not irradiated, the substrate 1 is rotated by 18 degrees around the center portion 1A of the substrate, and the substrate rotation step of changing the unit of the ion beam is performed to connect the two substrates. The ion beam illuminates the region 30 and illuminates the ion beam 4 toward all of the early enthalpy 20. Further, the connecting portion 32 connecting the two beam irradiation regions 30 is positioned on the center of the substrate to form the dividing strip 22, and the photomask 4 is replaced by the mask 6 (see Figs. 1 and 2). At least the end portion 4b of the both end portions 4a, 4b in the direction on the side of the connecting portion 32 is shaped to be substantially parallel to the X direction. When the ion beam irradiation method shown in Figs. 18 to 21 is explained in more detail, first, as shown in Fig. 18, the end portion 4b of the ion beam 4 is placed on the division strip 22 in the center of the substrate. The ion beam irradiation step of irradiating the ion beam 4 toward the substrate 10 and forming the ion beam irradiation region 30 shown in FIG. 19 on the substrate 10 while moving the substrate 10 in the X direction as indicated by an arrow A is performed. For example, the position of the mask 6 can be adjusted so that the end portion 4b of the ion beam 4 is positioned in the center of the substrate to form the dividing strip 22. Although it is also possible to move the substrate 10 in the Y direction, it is necessary to move the Y direction of the substrate 10 at this time, so that the simpler method is performed by the mask 6. Next, as shown by an arrow R in FIG. 19 (or a reverse direction thereof), the substrate 10 is rotated 180 degrees in the plane of the substrate centering on the center portion 10a thereof, thereby changing the column of the unit 20 that irradiates the ion beam 4 The substrate rotation step. Thereby, the end portion 4b of the ion beam 4 irradiated in the next ion beam irradiation step is formed in the column in which the end portion of the ion beam irradiation region 30 formed in the previous ion beam irradiation step is located in the Y direction. on. - Next, as shown by an arrow C in FIG. 20, while the substrate 10 is moved in the X direction (opposite to the direction of FIG. 18), the ion beam 4 is irradiated toward the substrate 10, and the substrate 10 is formed on the substrate 10. The second ion beam irradiation step of the second ion beam irradiation region 30. Thereby, two ion beam irradiation regions 97132060 35 200924032 30 can be connected. Further, the connecting portion 32 can be positioned in the center to form the dividing tape 22. Thereby, in the case of this embodiment, the ion beam can be irradiated to all the cells 20 on the substrate 1 to complete the ion beam irradiation. * According to the above-described ion beam irradiation method, the same effects as those achieved by the ion beam irradiation method of the second embodiment described above can be achieved. Further, compared with the second embodiment described above, there is an advantage that the substrate 1〇 can be moved in the γ direction. Therefore, the substrate driving device 14 can omit the function of moving the substrate 10 in the γ direction (for example, the Y-direction straight-moving mechanism 46). In the ion beam irradiation apparatus according to the third embodiment, the photomask 6 is formed by shaping the ion beam 4 generated by the ion source 2 as follows. At least one of the two end portions of the direction is parallel to the side of the connecting portion 32, and the end portion of the connecting portion 32 is located on the side of the central portion of the substrate to form the dividing strip 22' and the ion The beam width of the bundle 4 in the Y direction is maintained so as to pass the beam width W2 of the unit 2 上 of the upper half or more columns. The substrate driving device 14 may not have the substrate 10 facing the Y direction. The function of moving (e.g., the γ-direction straight-moving mechanism 46) may have a function of moving the substrate 1 in the χ direction and a function of rotating the substrate 10 in the plane of the substrate about the center portion 10a. - The above control device 18 In the case of this embodiment, the control-function is such that the substrate driving device 14 is controlled to perform the above-described ion beam irradiation step, and the substrate rotation step is performed to connect the two ion beam irradiation regions 30 to all the cells. The function of the illuminating ion beam & and the function of the above-mentioned 97132060 36 200924032 connecting portion 32 on the central portion of the substrate to form the dividing strip 22. The control device 18 can also control the substrate 1 to γ Since the direction is shifted, information necessary for position control in the Y direction, for example, information indicating the position of the base 1q in the Y direction, information indicating the position of the column on the substrate 1 in the Y direction of the division band 0, and indicating the passing light may be omitted. Information on the position of the end of the ion beam 4 of the cover 6. According to the ion beam irradiation apparatus of the third embodiment including the ion source 2, the mask 6, the substrate driving device 14, and the D device 18, the following: The same effect as the above-described result achieved by the ion beam irradiation method of the third embodiment. (4) Example of ion beam generating device

L 產生Y方向之束寬I為如上述之既定尺寸之離子束的離 子束產生4置’例如可為:⑷可如上述各實施形態之離子 源2 ’自其出π產生既定束寬Wi之離子束4之離子源;⑻ 亦可例如日本專利特開贏-139996號公報所揭示,包括產 狀、(具體而言係沿著γ方向之扇狀)擴展之離子束的 ^1、叹如❹電場或磁钱·^料源產生之離子 =“抑制該離子束之擴展從而導出上述 == 束的離子束偏向手段的構成;(〇 二離子 3358336號八# 『例如日本專利第 由電場,包難生料束铸μ '以及藉 離子源產生之離子束進行^^具_言 叫描W述編,之離子束 37 200924032 描手段的構成。 於上述(b)之情形時,上述離子束偏向手段最好更進一步 具備使離子束平行離子束化之功能。或者,亦可除上述離子 • 束偏向手段以外,於其下游侧更具備使離子束平行離子束化 ‘ 之離子束平行化手段。於上述(c)之情形時,最好於上述離 子束掃描手段之下游侧更具備使離子束平行離子束化之離 子束平行化手段。任一情形下,均使離子束平行離子束化, 〇 而可使連接上述複數個離子束照射區域30、及使其連接部 32位於列形成分割帶22較容易進行。 根據本發明,基於與上述(a)之離子源之情形相同之理 由,於上述(b)、(c)之情形時亦可抑制離子束產生裝置之大 型化。 【圖式簡單說明】 圖1係表示實施本發明離子束照射方法之離子束照射裝 U 置之一例的概略圖。 圖2係表示自箭頭P方向觀察圖1中之光罩及離子束之俯 視圖。 圖3係表示離子束之Y方向之離子束電流密度分布之一例 . 的圖。 . 圖4係表示基板驅動裝置之一例的俯視圖。 圖5係表示面内形成有矩陣狀排列之單元的基板一例的 俯視圖。 97132060 38 200924032 圖6係表示基板、單元、離子束等之位置關係之一例的圖。 圖7係用以說明第1實施形態之離子束照射方法及裝置之 圖,圖8接續表示。 - 圖8係用以說明第1實施形態之離子束照射方法及裝置之 • 圖,圖9接續表示。 圖9係用以說明第1實施形態之離子束照射方法及裝置之 圖,圖10接續表示。 () 圖10係用以說明第1實施形態之離子束照射方法及裝置 之圖,表示離子束照射完成之狀態。 圖11係表示鄰接之離子束照射區域之連接部之其他例的 圖。 圖12係表示鄰接之離子束照射區域之連接部之進而其他 例的圖。 圖13係表示連接部附近之離子束電流密度分布之概略例 〇 的圖。 圖14係用以說明第2實施形態之離子束照射方法及裝置 之圖,圖15接續表示。 圖15係用以說明第2實施形態之離子束照射方法及裝置 . 之圖,圖16接續表示。 . 圖16係用以說明第2實施形態之離子束照射方法及裝置 之圖,圖17接續表示。 圖17係用以說明第2實施形態之離子束照射方法及裝置 97132060 39 200924032 之圖’且表示離子束照射完成之狀態。 圖18係用以說明第3實施形態之離子束照射方法及裝置 之圖,圖19接續表示。 圖19係用以說明第3實施形態之離子束照射方法及裝置 之圖’圖20接續表示。 圖20係用以說明第3實施形態之離子束照射方法及茫置 之圖,圖21接續表示。 圖21係用以說明第3實施形態之離子束照射方法及裝置 之圖,且表示離子束照射完成之狀態。 【主要元件符號說明】 2 離子源 4 離子束 4a ' 4b 端部 6 光罩 6a 内側端 8 大(罩驅動裝置 10 基板 10a 中心部 12 支持具 14 基板驅動裝置 16 離子束監視器 18 控制裝置 97132060 40 200924032L. The beam width I in the Y direction is the ion beam generation of the ion beam of a predetermined size as described above. For example, (4) the ion source 2' of the above embodiments may generate a predetermined beam width Wi from the π. The ion source of the ion beam 4; (8) can also be disclosed, for example, in Japanese Patent Application Laid-Open No. Hei-139996, which includes the ion beam of the production, and (in particular, the fan-like direction along the gamma). The electric field generated by the electric field or magnetic money source = "the composition of the ion beam deflecting means for suppressing the expansion of the ion beam to derive the above == beam; (〇二离子3358336号八# "For example, the Japanese patent is made of electric field, The package is difficult to produce and the ion beam is generated by the ion beam. The ion beam generated by the ion source is used to describe the composition of the ion beam 37 200924032. In the case of the above (b), the ion beam is Preferably, the deflecting means further has a function of ion beam paralleling the ion beam. Alternatively, in addition to the ion beam deflecting means, the ion beam parallelizing means for ion beam parallel ion beaming on the downstream side thereof may be further provided. In the above (c) In the case of the shape, it is preferable to further provide an ion beam parallelization means for ion beam parallel ion beaming on the downstream side of the ion beam scanning means. In either case, the ion beam is parallel ion beamed, and the above may be connected. The plurality of ion beam irradiation regions 30 and the connection portion 32 are located in the column forming the division band 22 are easier to perform. According to the present invention, based on the same reason as the ion source of the above (a), in the above (b), In the case of c), the size of the ion beam generating device can be suppressed. Fig. 1 is a schematic view showing an example of the ion beam irradiation device U for carrying out the ion beam irradiation method of the present invention. A plan view of the reticle and the ion beam in Fig. 1 is seen from the direction of the arrow P. Fig. 3 is a view showing an example of the ion beam current density distribution in the Y direction of the ion beam. Fig. 4 is a plan view showing an example of the substrate driving device. Fig. 5 is a plan view showing an example of a substrate in which cells arranged in a matrix are formed in a plane. 97132060 38 200924032 Fig. 6 is a view showing an example of a positional relationship between a substrate, a cell, an ion beam, and the like. Fig. 7 is a view for explaining an ion beam irradiation method and apparatus according to the first embodiment, and Fig. 8 is a view of Fig. 8. Fig. 8 is a view for explaining an ion beam irradiation method and apparatus according to the first embodiment, and Fig. 9 is continued Fig. 9 is a view for explaining an ion beam irradiation method and apparatus according to the first embodiment, and Fig. 10 is a view showing the same. Fig. 10 is a view for explaining an ion beam irradiation method and apparatus according to the first embodiment. Fig. 11 is a view showing another example of the connection portion of the adjacent ion beam irradiation region. Fig. 12 is a view showing still another example of the connection portion of the adjacent ion beam irradiation region. A schematic diagram of a current distribution of ion beam current density in the vicinity of a connecting portion. Fig. 14 is a view for explaining an ion beam irradiation method and apparatus according to a second embodiment, and Fig. 15 is continued. Fig. 15 is a view for explaining an ion beam irradiation method and apparatus according to a second embodiment, and Fig. 16 is continued. Fig. 16 is a view for explaining an ion beam irradiation method and apparatus according to a second embodiment, and Fig. 17 is continued. Fig. 17 is a view for explaining the ion beam irradiation method and apparatus of the second embodiment, and the state of the ion beam irradiation is completed. Fig. 18 is a view for explaining an ion beam irradiation method and apparatus according to a third embodiment, and Fig. 19 is continued. Fig. 19 is a view for explaining an ion beam irradiation method and apparatus according to a third embodiment. Fig. 20 is a view continuously showing. Fig. 20 is a view for explaining the ion beam irradiation method and the apparatus of the third embodiment, and Fig. 21 is continued. Fig. 21 is a view for explaining an ion beam irradiation method and apparatus according to a third embodiment, and showing a state in which ion beam irradiation is completed. [Main component symbol description] 2 Ion source 4 Ion beam 4a ' 4b End portion 6 Photomask 6a Inner end 8 is large (cover drive unit 10 substrate 10a Center portion 12 support device 14 substrate drive device 16 ion beam monitor 18 control device 97132060 40 200924032

20 口口 — 早兀 22 列形成分割帶 24 行形成分割帶 26、28 剩餘部 30 離子束照射區域 32 連接部 40 X方向直進機構 42、48 導件 44、50 驅動部 46 Y方向直進機構 52 旋轉裝置 a ' b、c、d 寬度 A、B、C、D、E、F、G、P、R 箭頭 AR 範圍 Wi ' w2 ' w3 束寬 Yi、Y2、yi、y2、y3、y4、ys、ye、y7、ys 座標 X、Y 方向 97132060 4120 mouth - early 22 columns forming the dividing belt 24 rows forming the dividing belt 26, 28 remaining portion 30 ion beam irradiation region 32 connecting portion 40 X-direction straight-moving mechanism 42, 48 guide 44, 50 driving portion 46 Y-direction straight-moving mechanism 52 Rotating device a ' b, c, d width A, B, C, D, E, F, G, P, R arrow AR range Wi ' w2 ' w3 beam width Yi, Y2, yi, y2, y3, y4, ys , ye, y7, ys coordinates X, Y direction 97132060 41

Claims (1)

200924032 七、申請專利範圍: 子核財法,係職此正交之兩財向設為χ 杨,朝面_騎祕沿χ方向延伸 成分 靜及/Υ方向延伸之㈣成分割帶絲陣狀排料 行(m為3以上之整激、& 、 為2以上之整數)之複數個單元 (⑽基板,射^向之尺寸大於χ方向之尺寸之離子 束的離子束照财法;其特徵在於: 使用Y方向之兩端部分別位於夾持p mp為⑸❿一 2)之整數)之上述單元之兩個列形成分割帶上之束寬的離子 束, 實施複數-人-邊使上述基板朝x方向移動一邊朝該基板 照射上述離子束,而於上述基板上形成離子相射區域的離 子束照射步驟, 且於上述料束騎步狀間隔即上述離子束未昭射至 上述基板之制’實施變更上述基板之位置㈣更照射上述 離子束之上述举元之列的基板位置變更步驟, 連接複數個上述離子束照射區域並朝全部上述單元照射 上述離子束’如此之方法, 而且使連接上述複數個離子束照射區域之連接部位於上 述列形成分割帶上, 且藉由光罩將上述離子束之γ方向的兩料整形為與x 方向實質上平行。 97132060 42 200924032 2.如申請專利範圍第1項之離子束照射方法,直中 上述基板位置變更步驟中,使上述基板朝γ方向 更二基板之位置使上述連接部位於上述變 加種離子束照射方法,係將彼此正交之^個為 二Τ方向,朝面内形成有夹持沿X方向延伸之列::、χ ^及沿Υ方向延狀行料分料且轉狀_為=刀 η均為2以上之整數)之複數個單元的基板,昭射η 方向之尺寸大於X方向之尺寸之離子束的 昭^ 法;其特徵在於·· 束…、射方 使用Υ方向之束寬包含上.列之半數以上 兀之尺寸的離子束, 上边早 =邊使上述基板朝χ方向移動一邊朝該基板照 =:子束’而於上述基板上形成離子束照射區域的離子 束照射步驟, ^上述離子束照射步驟之間隔即上述離子束未照射至 期間’實施變更上述基板之位置而變更照射上述 離子束之上述單元之列的基板位置變更步驟, 個上述離子束照射區域並朝全部上述單元照射上 述離子束’如此之方法, 形上述兩個離子束照射區域之連接部位於上述列 且藉由光罩將上述離子束之Υ方向的兩個端部 t至少位 97132060 43 200924032 於上述連接部侧之端部整形為與χ方向實質上平行。 4. 如申請專利範圍第3項之離子束照射方法,其中, 於上述基板位置變更步驟中,使上述基板於其面内旋轉 ⑽度並使上述基板朝Q向移動,而變更上述基板之位置 - 使上述連接部位於上述列形成分割帶。 5. 如申請專利_第3項之離子束照射方法,其中, 藉由光罩將上述離子束之γ方向的兩端部整形為盘X方向 〇 實質上平行, 、 ▲於上述基板位置變更步驟中,使上述基板朝γ方向移動, 變更上述基板之位置使上述連接部位於上述列形成分割帶。 6. -種離子束照射方法,係將彼此正交之兩個方向設為X 方:及Υ方向’朝面⑽成有夹持沿χ方向延伸之列形成分 割帶及沿Υ方向延伸之行形成分割帶且矩陣狀排列為m列η 打(m、n均為2以上之整數)之複數個單元的基板、且對在 G 其γ方向之中央部具有上述列形成分割帶中之一個的基 板’照射Y方向之尺寸方向之尺寸之離子束的離子束 照射方法;其特徵在於: 使用Y方向之束寬包含上述m列之半數以上的列之上述單 元之尺寸的離子束, 實施兩次一邊使上述基板朝X方向移動一邊朝該基板照 射上述離子束,而於上述基板上形成離子束照射區域的離子 束照射步驟, 97132060 44 200924032 且於上述離子束照射步驟之間隔即上述離子束未照射至 上述基板之期間,實施使上述基板以其中心部為中心於基板 面内旋轉180度,而變更照射上述離子束之上述單元之列的 基板旋轉步驟, ' 賴㈣上述離子束照射區域並朝全部上料元照射上 述離子束,如此之方法, 且使連接上述兩個離子束照射區域之連接部位於上述基 Ο 板中央部之列形成分割帶, 且藉由光罩將上述離子束之γ方向的兩個端部中至少位 於上述連接部側之端部整形為與X方向實質上平行。 7. 一種離子賴射裝置,係將彼此正交之兩财向設為X 方向及γ方向’朝面_成有婦沿X方向延伸之列形成分 h及々Υ方向延伸之仃形成分割帶且矩陣狀排列為m列η (3 U上之' η為2以上之整數)之複數個單元的 G ^板,照射¥方向之尺寸大於X方向之尺寸之離子束的離子 束照射裝置;其特徵在於,其包括: 離子束產生裝置,產峰v+丄 ± ^ ¥方向之束寬包含q列(q為 =m之整數)之上料元之尺寸的軒束; — =罩,將上述離子束產生裝置產生之離子束整形為其γ =之兩端部與X方向實質上平行,同時 之 方向之兩端部整形為公n <r ^別位於夾持P列(P為 S (m—2)之整數)之 μ 〇〇 _ Q 卫· Ρ 97132060 )之上述早元之兩個列形成分割帶的束寬以 Q71 45 200924032 使其通過; 基板驅動裝置’具有使上述基板朝X方向及γ方向移動之 功能;以及 控制裝置,具有進行如下控制之功能,即,賦予表示上述 - 基板之γ方向位置之資訊、表示該基板上之上述列形成分割 帶之γ方向位置的資訊及表示通過上述光罩之離子束之γ 方向兩端部位置的資訊,使用該等資訊控制上述基板驅動裝 P 置,實施複數次一邊使上述基板朝X方向移動一邊朝該基板 照射通過上述光罩之離子束而於上述基板上形成離子束照 射區域的離子束照射步驟,且於該離子束照射步驟之間隔即 上述離子束未照射至上述基板之期間,實施使上述基板朝γ 方向移動而變更照射上述離子束之上述單元之列的基板位 置變更步驟’連接複數個上述離子束照射區域並朝全部上述 單元照射上述離子束的功能,以及使連接上述複數個離子束 ο 照射區域之連接部位於上述列形成分割帶的功能。 8. —種離子束照射裝置,係將彼此正交之兩個方向設為χ 方向及Y方向,朝面内形成有夹持沿χ方向之列形成分割帶 及沿Y方向延伸之行形成分割帶且矩陣狀排列為m列請 • (m η均為2以上之整數)之複數個單元的基板,照射γ方 . 向之尺寸大於X方向之尺寸之離子束的離子束照射裝置;其 特徵在於,其包括: 離子束產生裝置,產生Υ方向之束寬包含上述1〇列之半數 97132060 46 200924032 以上的列之上述單元之尺寸的離子束; 光罩,將上述離子束產生裝置產生之離子束,整形為里γ 方向之兩個端部中至少下述連接部側之端部與χ方向〇 上平行,同時將該離子束之γ方向的束寬保持為包含上= 列之半數以上的狀上述單元的束寬而使 基板驅動裝置,具有使上述基板似方向及Γ方向移動之 功能以及使上述基板於基板面内旋轉之功能;以及 、控制裝置,具有進行如下控制之功能,即,賦予表示上述 基板之Υ方向位置的資訊、表示該基板上之上述列形成分割 帶之Υ方向位置的資訊以及表示通過上述光罩之離子束之 下述連接部侧之端部位置的資訊,使用該等資訊控制上述基 板驅動裝置,實施兩次-邊使上述基板朝义方向移動一邊朝 該基板照射通過上述光罩之離子束而於上述基板上形成離 子束照射區域的離子束昭斯牟 ο 不、射步驟,且於該離子束照射步驟之 間隔即上述離子束未照射至上述基板之顧,實施使上述基 板旋轉180度並使其朝γ方向移動而變更照射上述離子束之 上述單元之列的基板位置變更步驟,連接兩個上述離子束昭 射區域並朝全部上述單元料上㈣子束的魏,使連接I 述兩個離子束照射區域之連接部位於上述列形成分割帶的 功能。 ^一種料束闕裝置,係將彼此正交之兩财向設為X 方向及Υ方向,朝面内形虑古 取有失持沿X方向延伸之列形成分 97132060 200924032 割帶及沿γ方向延伸之扞 丁开少成刀割帶且矩陣狀排列為„1列η 行(m、η均為2以上之敕垂i〇 正數)之複數個單元的基板,照射γ 方向之尺寸大於X方向 之尺寸之離子束的離子束照射褒 置;其特徵在於,其包括. 離子束產生裝置’產生γ方向之束寬包含上述田列之半數 以上的列之上述單元之尺寸的離子束;200924032 VII. The scope of application for patents: Sub-nuclear financial law, the two accounting lines of the department are set to χ Yang, facing the surface _ riding secret along the direction of the 延伸 extension of the static and / / Υ direction of the extension (four) into a segmented wire array a plurality of cells ((10) substrate, ion beam irradiation method of an ion beam whose size is larger than the size of the x-direction in a discharge row (m is a triple or more excitation, and is an integer of 2 or more); The method is characterized in that: using two columns of the above-mentioned cells in which the both ends of the Y direction are located at an integer of (5) ❿ 2), the ion beam of the beam width on the segmentation band is formed, and the complex-human-edge is implemented. An ion beam irradiation step of forming an ion beam region on the substrate while the substrate is moved in the x direction, and the ion beam is not incident on the substrate; a step of changing a substrate position in which the position of the substrate is changed (4) to irradiate the ion beam, and connecting a plurality of the ion beam irradiation regions to irradiate the ion beam to all of the cells. Method, and the connecting portion for connecting the plurality of ion beam irradiation area is located on the dicing tape formed of said columns, and by the two photomask γ feed direction of the shaping of the ion beam is substantially parallel to the x-direction. 2. The method of ion beam irradiation according to claim 1, wherein in the step of changing the substrate position, the substrate is placed at a position of the substrate in the γ direction, and the connecting portion is located in the ion beam irradiation. The method is that the two orthogonal to each other are in the direction of the two turns, and the column extending in the X direction is formed in the face: :, χ ^ and the material is distributed along the Υ direction and the _ is = knife a substrate in which a plurality of units of η are each an integer of 2 or more, and an ion beam whose size in the η direction is larger than the size of the X direction; characterized in that the beam is used in the Υ direction and the beam width is used in the Υ direction. An ion beam irradiation step of forming an ion beam irradiation region on the substrate by moving the ion beam of the size of the upper or lower half of the upper column to the substrate while moving the substrate in the x direction a step of changing the substrate position in which the ion beam irradiation step is not irradiated, and the substrate position changing step of changing the position of the substrate to change the position of the substrate is performed. Irradiating the ion beam in the region of the ion beam and irradiating the ion beam to the entire unit. The connecting portion of the two ion beam irradiation regions is located in the column and the two ends of the ion beam are twisted by the photomask. At least the position of the connecting portion side of the 97132060 43 200924032 is shaped to be substantially parallel to the χ direction. 4. The ion beam irradiation method according to claim 3, wherein in the substrate position changing step, the substrate is rotated (10) degrees in the plane and the substrate is moved in the Q direction to change the position of the substrate. - forming the splitting zone by positioning the connecting portion at the above-mentioned column. 5. The ion beam irradiation method according to claim 3, wherein both ends of the ion beam in the γ direction are shaped into a disk X direction by a photomask substantially parallel, and ▲ is changed in the substrate position step. The substrate is moved in the γ direction, and the position of the substrate is changed such that the connecting portion is positioned in the column to form a divided strip. 6. The ion beam irradiation method is characterized in that two directions orthogonal to each other are set to the X side: and the Υ direction 'toward the surface (10) is formed by sandwiching the column extending in the χ direction to form the dividing strip and extending in the Υ direction. a substrate in which a plurality of cells of a m-column η (m and n are integers of 2 or more) are arranged in a matrix, and one of the column-forming sub-bands is formed at a central portion of the G in the γ direction. The ion beam irradiation method of the ion beam of the size of the substrate in the dimension direction of the Y direction; wherein the ion beam of the size of the cell including the half or more of the m columns in the Y direction is used twice An ion beam irradiation step of forming an ion beam irradiation region on the substrate while moving the substrate in the X direction while moving the substrate in the X direction, 97132060 44 200924032 and the ion beam is not separated by the ion beam irradiation step While the substrate is being irradiated, the substrate is rotated 180 degrees around the central portion of the substrate, and the column of the unit that irradiates the ion beam is changed. In the substrate rotating step, the above-mentioned ion beam irradiation region is irradiated to the entire ion beam by the above-mentioned ion beam irradiation region, and the connection portion connecting the two ion beam irradiation regions is formed in the central portion of the base plate. The slit strip is formed by shaping at least an end portion of the both end portions of the ion beam in the γ direction on the side of the connecting portion to be substantially parallel to the X direction by a photomask. 7. An ion-relaying device in which two orthogonal directions are set to an X-direction and a γ-direction to face-to-face _ into a column extending in the X direction to form a sub-h and a 延伸-direction extension to form a division band And arranged in a matrix form as a G^ plate of a plurality of cells of m columns η (the number of 'n is an integer of 2 or more on 3 U), and an ion beam irradiation device that irradiates an ion beam whose size in the direction of the ¥ is larger than the size of the X direction; The method comprises the following steps: the ion beam generating device, the peak of the peak v+丄±^ ¥ direction includes a q-column (q is an integer of m), and the size of the element is undone; The ion beam generated by the beam generating device is shaped such that both ends of γ = are substantially parallel to the X direction, and both ends of the direction are shaped into a common n < r ^ is located in the clamping P column (P is S (m -2) the integer ) Q Q Q Q 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 132 And the function of moving in the γ direction; and the control device having the function of performing the following control The information indicating the position in the γ direction of the substrate, the information indicating the position in the γ direction of the column forming the division band on the substrate, and the information indicating the position of both ends in the γ direction of the ion beam passing through the mask can be given. Using the information to control the substrate driving device P, and performing ion beam irradiation to form an ion beam irradiation region on the substrate by irradiating the substrate with the ion beam of the photomask while moving the substrate in the X direction. In the step of the ion beam irradiation step, that is, during the period in which the ion beam is not irradiated onto the substrate, a substrate position changing step of connecting the substrate in the γ direction and changing the irradiation of the ion beam is performed. The ion beam irradiation region has a function of irradiating the ion beam to all of the cells, and a function of connecting the connection portions connecting the plurality of ion beams to the irradiation region to form the segmentation band. 8. An ion beam irradiation apparatus in which two directions orthogonal to each other are set to a χ direction and a Y direction, and a split band formed along a χ direction and a row extending in the Y direction are formed in the face to form a split. An ion beam irradiation device that irradiates a gamma square with a plurality of cells in a matrix of m columns (m η is an integer of 2 or more), and an ion beam having a size larger than the size of the X direction; The present invention includes: an ion beam generating device that generates an ion beam having a beam width in a width of the above-mentioned one of the cells of the array of 97312060 46 200924032 or more; and a photomask, the ion generated by the ion beam generating device The bundle is shaped such that at least the end portion on the side of the connecting portion of the two ends in the γ direction is parallel to the χ direction, and the beam width in the γ direction of the ion beam is maintained to include more than half of the upper = column The substrate driving device has a function of moving the substrate in the direction of the substrate and the meandering direction, and a function of rotating the substrate in the substrate surface, and a control device having a beam width of the unit The function of controlling the position indicating the position of the substrate in the x-direction, the information indicating the position of the column forming the zigzag direction on the substrate, and the connection side of the ion beam passing through the photomask are described below. The information on the position of the end portion is controlled by the information, and the substrate driving device is controlled to perform ion beam irradiation on the substrate by irradiating the substrate with the ion beam of the photomask while moving the substrate in the sense direction twice. The ion beam of the region is not irradiated, and the ion beam is not irradiated onto the substrate at the interval of the ion beam irradiation step, and the substrate is rotated by 180 degrees and moved in the γ direction. a substrate position changing step of irradiating the array of the ion beams to connect the two ion beam illuminating regions to the junction of the (four) sub-beams on the entire unit material, so that the connection portion of the two ion beam irradiation regions is connected The above columns form the function of dividing the strip. ^A bundle device, which sets the two fiscal directions orthogonal to each other to the X direction and the Υ direction, and forms an extension in the X direction toward the in-plane shape. The formation is divided into 97132060 200924032 cutting belt and along the γ direction. The extending dicing is a substrate in which a plurality of units are arranged in a matrix and arranged in a matrix of „1 column η rows (m, η are both 2 or more), and the size in the γ direction is larger than the X direction. An ion beam irradiation device of a size ion beam; characterized in that it comprises: an ion beam generating device that generates an ion beam having a beam width in a gamma direction comprising a size of said cell of a column or more of said column; 光罩,將上述離子束產生裝置產生之離子束整形為其Υ 端部與χ方向實質上平行’同時將該離子束之γ 方向之束寬保持為包含上述m列之半數以上的列之上述單 元的束寬以使其通過; 基板驅動裝置,具有使上述基板朝x方向及γ方向移動之 功能;以及 控制裝置’具有進行如下控制之功能,即,賦予表示上述 基板之Υ方向位置之資訊、表示該基板上之上述舰成分割 °帶之γ方向位置的資訊以及表示通過上述光罩之離子束之 下述連接部狀端部位置的資訊,使用該”難制上述基 板驅動裝置,實施兩次一邊使上述基板朝χ方向移動一邊朝 該基板照射通過上述光罩之離子束而於上述基板上形成離 子束照射區域的離子束照射步驟,且於該離子束照射步驟之 間隔即上述離子束未照射至上述基板之期間,實施使上述基 板朝γ方向移動而變更照射上述離子束之上述單元之列的 基板位置變更步驟,連接兩個上述離子束照射區域並朝全部 97132060 48 200924032 上述單元照射上述離子束的功能,以及使連接上述兩個離子 束照射區域之連接部位於上述列形成分割帶的功能。 ίο.—種離子束照射裝置,係將彼此正交之兩個方向設為 X方向及Y方向,朝面内形成有夾持沿X方向延伸之列形成 • 分割帶及沿Y方向延伸之行形成分割帶且矩陣狀排列為m 列η行(m、η均為2以上之整數)之複數個單元之在其γ方 向之中央部具有上述列形成分割帶中之一個的基板,照射γ 方向之尺寸大於χ方向之尺寸之離子束的離子束照射裝 置;其特徵在於,其包括: 離子束產生裝置’產生Υ方向之束寬包含上述111列之半數 以上的列之上述單元之尺寸的離子束; 光罩,將上述離子束產生裝置產生之離子束整形為其γ 方向之兩個端部中至少下述連接部側之端部與χ方向實質 上平行,同時使該連接部侧之端部位於上述基板中央部之列 〇形成分割帶’且將該離子束口方向的束寬保持為包;上述 m列之半數以上的列之上述單元的束寬而使其通過; 基板驅動裝置,具有使上述基板朝χ方向移動之功能及使 上述基板以其中心部為中心於基板面内旋轉之功能;以及 ㈣裝置,具有進行如下控制之功能,即,控制上述基板 驅雜置’實施兩次-邊使上述基板朝U向移動—邊朝該 基板照射通過上述光罩之離子束而於上述基板上形成離子 束照射區域麟子束照射步驟,且於_子絲射步驟之間 97132060 49 200924032 隔即上述離子束未照射至上述基板之期間,實施使上述基板 以其中心部為中心旋轉180度而變更照射上述離子束之上 述單元之列的基板旋轉步驟,連接兩個上述離子束照射區域 並朝全部上述單元照射上述離子束的功能,以及使連接上述 兩個離子束照射區域之連接部位於上述基板中央部之列形 成分割帶的功能。In the mask, the ion beam generated by the ion beam generating device is shaped such that the end portion thereof is substantially parallel to the χ direction, and the beam width in the γ direction of the ion beam is maintained to be more than half of the columns of the m columns. The beam width of the unit is passed through; the substrate driving device has a function of moving the substrate in the x direction and the γ direction; and the control device has a function of controlling to give information indicating the position of the substrate in the x direction Information indicating the position in the gamma direction of the ship-divided zone on the substrate, and information indicating the position of the connecting end portion of the ion beam passing through the photomask, which is difficult to manufacture using the substrate driving device An ion beam irradiation step of irradiating the substrate with the ion beam of the photomask to form an ion beam irradiation region on the substrate while moving the substrate in the x direction, and the ion is irradiated at the interval of the ion beam irradiation step While the beam is not irradiated onto the substrate, the substrate is moved in the γ direction to change the irradiation of the ion beam. a step of changing the substrate position of the cells, connecting the two ion beam irradiation regions and irradiating the ion beam to all of the units of 97132060 48 200924032, and connecting the connecting portions connecting the two ion beam irradiation regions to the above columns to form a segmentation 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 a substrate in which a plurality of cells having a m-column η row (m and η are integers of 2 or more) are formed in a row in the direction of the direction, and the substrate having one of the columns formed in the gamma direction at the central portion in the γ direction is formed. An ion beam irradiation apparatus for irradiating an ion beam having a size larger than a χ direction in a γ direction; characterized in that the ion beam generating apparatus generates a unit having a beam width including a half or more of the 111 columns a size ion beam; a photomask that shapes the ion beam generated by the ion beam generating device into at least the following two ends of the gamma direction The end portion on the side of the portion is substantially parallel to the χ direction, and the end portion on the side of the connection portion is located at a row in the central portion of the substrate, and a split band is formed, and the beam width in the direction of the ion beam is maintained as a package; And the substrate driving device has a function of moving the substrate in the x direction and a function of rotating the substrate in the substrate surface centering on the center of the substrate; and (4) The device has a function of controlling the substrate to be driven to perform two times while moving the substrate toward the U direction, and irradiating the substrate with the ion beam of the photomask to form ions on the substrate In the beam irradiation region, the lining beam irradiation step is performed, and the substrate is rotated by 180 degrees around the center portion of the substrate while the ion beam is not irradiated to the substrate during the period of the _ sub-silver step, 97132060 49 200924032. a substrate rotation step of the above-mentioned unit of the ion beam, connecting the two ion beam irradiation regions and irradiating the ion beam to all of the cells Function, and the connecting portion connecting the two ion beam irradiation area located at the center portion of the column substrate formed with the division function. 97132060 5097132060 50
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