200922421 九、發明說明： 【發明所屬之技術領域】 • 切明係有關於-印刷電路板，更詳而言之，俨捫於 一種具有特殊形狀以防止焊接不良、焊接‘關於 •現象之焊塾，士m 予接不良&接兀件引腳龜起等 焊墊加製㈣本及製料間形成該 干上、、°構之焊墊結構形成方法。 【先如技術】 高密度佈線 在印制千々力強大、以及溥板化等方向發展，如何 电路板設計過程中充分考量到電性連接的良 施二保證信號傳輸時的完整性’而採取有效之控^措 作爲印:成：當今印刷電路板設麵中之熱門課題。而 構焊接電子一接介質，結 目前印刷電路板在製作過程中，通常由電路板供 卩刷電路板表面鋪設—層㈣，崎 敍 =方式形成事先設計好之電路圖案，以供後續二 2 =叙該電路圖案具有許多心焊接電子元 冓，請一併參閒第1A圖及第1B圖，係顯示習 供形成Z電路板具有基板10以及鋪設於該基板10上以 需要、雨:士圖案110之銅羯層11 ’上述焊塾結構中存在 電性=镇114將焊塾實體111與該電路圖案no 的烊墊結構，以達到將焊接於該焊墊結構上之電 Π0412 5 ZOW22421 ，子元件甩性連接至該電路圖案 能。 、〇中，完成預定之電路功 然而，由於電路板供應商 •刷電路板，其表面鋪設的銅箱並5表面鋪設有銅羯之印 此銅箱於餘刻形成焊塾結構^均勻平坦，若直接以 該電子元件烊接不良，甚仃、接電子元件，會使得 於在對餘刻形成的該焊墊έ士構=引腳會趣起；另外，由 的速度與電場強度有直接質沉積 …形形狀、電極的位置關係而變化，：；強度又^電錢的圖 細，端部越尖，與電極的距 般進仃電鍍的銅结越 這個部位的電錄層就越厚。^近，電==就越大，所以， 大，而大面積的片銅箱114面積較 度變化很大，所以㈣的:::=間的厚 墊實體ill上表面带@3士 问。所以在後續於該焊 夠Μ平P 44會使料㈣粒電鑛層不 ㈣勾千坦，從而使得該電子元 + U引腳會翹起，形成“荚碑，，規意„„ 不良，甚至烊接之 電性連接，使重影響整個電路圖案的 1使正個印刷電路板的質量下降，甚至報廢。 況進行手工=對=Ϊ產生焊接不良、焊接引腳輕起等狀 H 1’則需要對該焊墊結構做單獨處理，因為 ^正塊印刷電路板會產生多種焊墊結構，所以不僅辦加 了人力，且嚴重影響工作效率。 曰 •因此，如何克服上述先前技術之缺失，提供一種印刷 2路板之焊塾結構及其形成方法，以使得焊墊結構表面均 二平整，易於焊接並谭接牢固，避產生焊接不良、元件引 110412 6 200922421 腳翹•起等現象ψ . •号見象出現，不增加製作成本 刖所亟待解決之課題。 τ吩間，實為目 【發明内容】 上i4f知技術之缺失，本發明之 ^種印刷電路板之焊塾結構，使得焊 在於提 [易於焊接並焊接牢固，避產生焊接不、;表面均句平 起等現象出現。 良、70件弓！腳翹 本發明之另—曰么+ 。墊結構形成方法，不增加製^^:刷電路板之焊 ^ ^ ^ t ί t ί rs"gp ^~ '4 Hp ",j - ^ 圖案的印刷電路板:二基板及設於該基板上之電路 本肢，係形成於該基板表面，且具匕括.烊墊 接之複數延伸邻.德'、/、^電路圖案電性連 以及電鑛層：:=域，係形成於各該延伸部之間； :層絲成於該焊墊本體上表面。 /、中，該延伸部係呈“T，，字形、‘ “ 面結構其中之一者；而該φ Υ ’字形剖 為、查μ、+.、 /电、’又0係為銅材電鍍結構。 板之焊墊結構形成方法，得用古t “供—種印刷電路 乂乃法係用於形成焊墊钍 及鋪設於該基板上以供形成電'、。構U基板 路板，該印刷電路板之焊墊結構；層之印刷電 該銅箱層表面形成具有預定形狀I焊墊^步驟包括：於 表面形成該電路圖案並同時 圖木，於該銅領層 上表面-併形成焊墊本體，且 菜於㈣冷層 谇墊本體係具有複數與該 Π0412 7 200922421 .電路圖案電性連接之延伸部，而各該延伸部之間形成鐘介 區域；以及以電鍵材質施加電鑛層於該焊塾本體表面。工 =刷電路板之焊墊結構係透㈣狀方式於該銅 .面，形成該電路圖案以及與該電路圖案電性連接 之坏墊本體。而該延伸部係呈“τ，，字形、‘‘个”字形、“Υ”字 形其中之—者；該電鍍層之材質係為銅。 子 传搓Si習知技術，本發明之印刷電路板之焊墊結構， 广係ki、-種具有特殊形狀之焊墊結構，透過上述本發明之 =結構中具有複數延伸部以及各該延伸部之間的鏤空 二二！知大片銅羯以複數小片彼此間分隔的銅箱代 =墊結構表面均句平整，從而易於燁接牢固，避 生焊接不良、元件引腳翹起等現象出現；另外， 路板之焊塾結構形成方法，係於習知設計電： 处二構及飯刻過程時’形成具有預定形狀之谭墊 、、。構《而在不增加製作成本及時間的基礎上，形成 ϋ上述功效之印刷電路板之焊墊結構。 八 【實施方式】 、下藉由知·疋的具體實施例說明本發明之實於 =4悉此技蟄之人士可由本說明書所揭示之内容輕 瞭解本發明之其他優點及功效。本發明亦 =雜實施例加以施行或應用，本說明書中的各項 土於不同的觀點與應用，在不悖離本發明之精神下 各種修飾與變更。 丁 明併麥閲第2Α-2Β圖，其中，第2Α圖係顯示本發 1]〇412 8 200922421 明之印刷電路板之焊塾結構立體截面圖。如圖所示 刷電路板〇Mnted Circuit Board，p⑻具有基板2〇 ^ 於该基板20上之電路圖案21〇,其中，該電路圖案21°又0 係通過相關軟體設計，並 21 ^ 八有疋的電路功能。該印刷電路柘夕卢 體211、鏤空區域213、電錄層加。 20上=墊f體211，係以預定形狀之㈣形成於該基板 焊墊本體211為該㈣層心刻為該： 210電性連接之複數延伸部仙，t接：：路圖案 圖，係該電㈣案21G°請參閲第⑽ 如圖== 路板之料結構W見圖， 為“τ”字形。另外，於其他實二= 疋形狀可為“个，，字形或者“r字形。 亥預 該鏤空區域213，係形成於 即於峰夺，將各該延伸部21 :二2111之間’ 掉，將該焊墊处槿卢疮之間的銅箱層21蝕刻 形成之結構/ 的銅鎮變成由複數小塊銅箱 該電鍍層215,係電鍍於該焊墊 本實施例中，該電錢層215之 肢211上表面。於 覆蓋於該焊墊本體211上表面^為銅’即以銅材質電錢 清參閱第3A-3C圖，係磲干太a nn 墊結構形成方法步驟示二電路㈣ 月之印刷電路板之焊墊 110412 200922421 =形:::係用於形輪結 ，、中’该印刷電路板具有基板 反上 形成電路圖案21〇之銅箱層2 ”:二：板二以供 箱層21上表面預設且右子百6 弟3A圖所不’於該麵 利用相Η + 、八有預疋形狀之焊墊圖案212,例如， 關电路板設計軟體於設計焊墊紝構時，i 該預定形狀，於本實施例中，構日㈣其设計為 於其他實施例中，該預定中/玄預疋形狀為“T”字形，而 如第㈣心字形或者“γ”字形。 的形=:== 該電路:Hit 該延伸部2⑴之間的㈣，並形:鏤==去掉各 如第3C圖所示，以電參姑晰 塾本體2U上表面，如圖中:：广力二鑛層215於該焊 2⑴以及該延伸部二門由於具有該延伸部 使得屌太士 η 成之鏤空區域213,從而 表=2 “爲小片的㈣，於這些小片的銅箱 ^勻平^二鑛時’與電極的距離間隔變小，從而使得表面 ^上所述’本發明之印刷電路板之料結構，係提供 廷構路板之焊墊結構及其形成方法，透過上述嬋墊 :中/、有稷數延伸部以及各該延伸部之間的鏤空區 將白知大片銅箔以複數小片彼此間分隔的銅箔代替， ，谭墊結構表面均勾平整，從而易於焊接牢固，避免產 焊接不良、元件引腳翹起等現象出現；另外，本發明復 】】0412 10 200922421 ^供一種印刷電路板之料結構形成方法，係於習知設計 本發明之焊塾= 時’形成具有預定形狀之 、、Ό構伙而在不增加製作成本及時間的基礎 ， >成具有上述功效之印刷電路板之焊墊結構。 上述實施例僅為例示性說明本發明 效，而非用於限制本發明，亦即，本發明 ς力 發明之精神及範田壽下，對上、/^之人士均可在不違背本 明之權利保護範圍，岸如後例進行修改。因此本發 【圖式簡單說I月】 後述之”專利範圍所列。 圖，為習知印刷電路板谭墊結構立體截面圖； 圖；圖係顯示習知印刷電路板焊塾結構正面俯視200922421 IX. Description of the invention: [Technical field to which the invention pertains] • The invention relates to printed circuit boards, and more specifically, to a solder joint with a special shape to prevent poor soldering and soldering.士 m 接 接 不 & 兀 引脚 引脚 引脚 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟 龟[Before technology] High-density wiring is developed in the direction of printing thousands of powerful forces and seesaws. How to ensure the integrity of electrical connection in the process of designing the circuit board to ensure the integrity of signal transmission? The control of the control as a mark: into: the hot topic in today's printed circuit board set. The welding electrons are connected to the medium, and the current printed circuit board is usually laid by the circuit board for the surface of the printed circuit board. The layer (4) is formed in advance to form a pre-designed circuit pattern for subsequent two 2 = The circuit pattern has a number of core-welded electronic components, please refer to the 1A and 1B drawings together, which shows that the Z-circuit board has a substrate 10 and is laid on the substrate 10 for need, rain: The beryllium layer 11 of the pattern 110 has electrical properties in the above-mentioned soldering structure = the padding structure of the soldering body 111 and the circuit pattern no of the town 114 to reach the electric wire 0412 5 ZOW22421 to be soldered to the pad structure, The sub-element is electrically connected to the circuit pattern. In the middle of the process, the predetermined circuit is completed. However, due to the circuit board supplier and the brush circuit board, the copper box on the surface of the board and the surface of the copper plate are covered with a copper plaque. If the electronic component is directly connected to the poor, and the electronic component is connected, it will make the solder pad formed by the remaining moments interesting. In addition, the speed and electric field strength are directly qualitative. The shape of the deposit and the positional relationship of the electrodes change, and the intensity is further reduced. The sharper the end, the sharper the end of the electrode, the thicker the electro-recording layer of this part is. ^ Near, electricity == is larger, so large, and the area of the large-area copper box 114 varies greatly, so (4):::= between the thick pad entity ill upper surface with @3士问. Therefore, in the subsequent welding, the P 44 will be enough to make the material (four) grain electric ore layer not (four) hook thousands of tan, so that the electronic element + U pin will be lifted up, forming a "pod,, regulation..." Even the electrical connection of the connection makes the quality of the entire printed circuit board 1 degrade or even scrapped. The manual = pair = Ϊ produces poor soldering, the soldering pin is light, etc. H 1 ' The pad structure needs to be treated separately, because the positive block printed circuit board will produce a variety of pad structures, so it not only adds manpower, but also seriously affects work efficiency. 因此 • Therefore, how to overcome the above-mentioned lack of prior art, The invention provides a soldering structure of a printed 2-way board and a forming method thereof, so that the surface of the soldering pad structure is evenly leveled, easy to solder and firmly connected, avoiding the phenomenon of poor soldering, component lead 110412 6 200922421, and the like. • The number appears to appear, and does not increase the production cost. It is an urgent problem to be solved. τ 间 , , 实 【 【 【 【 【 【 【 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上The welding is done [easy to weld and welded firmly, avoiding welding, etc.; the surface is evenly flattened, etc.. Good, 70 pieces of bow! The foot is the other part of the invention - 曰 + +. The structure of the pad structure, no increase in system ^^:Welding the brush board ^ ^ ^ t ί t ί rs"gp ^~ '4 Hp ",j - ^ Patterned printed circuit board: two substrates and the circuit body on the substrate, the system is formed On the surface of the substrate, and having a plurality of extensions adjacent to each other, the ', /, ^ circuit pattern electrical connection and the electric ore layer: : = domain, formed between each of the extensions; The wire is formed on the upper surface of the pad body. In the middle, the extension portion is one of "T,, glyph," "face structure; and the φ Υ '-shaped shape is cut, and μ, +., / The electric and '0' are copper electroplating structures. The method for forming the pad structure of the board can be used to form a solder pad and to be deposited on the substrate for forming electricity. ',. a U-substrate road board, a solder pad structure of the printed circuit board; a printed circuit of the layer, the surface of the copper box layer is formed with a predetermined shape, and the soldering step comprises: forming the circuit pattern on the surface and simultaneously drawing the wood on the copper collar The upper surface of the layer - and the formation of the pad body, and the dish in the (four) cold layer padding system has a plurality of extensions electrically connected to the circuit pattern of the Π0412 7 200922421, and a bell-shaped region is formed between each of the extensions; An electric ore layer is applied to the surface of the soldering body body by a key material. The solder pad structure of the brush circuit board is formed in a transparent manner in the copper surface to form the circuit pattern and the bad pad body electrically connected to the circuit pattern. The extension is in the form of "τ," glyph, ‘‘one', and “Υ”; the material of the plating layer is copper. A soldering pad structure of a printed circuit board according to the present invention, a pad structure having a special shape, and a plurality of extending portions and each of the extending portions in the structure of the present invention The gap between the two! Knowing that a large piece of copper plaque is separated by a plurality of small pieces of copper box = the surface of the pad structure is flat, so that it is easy to splicing firmly, avoiding poor soldering, component pin lifting and the like; in addition, the welding pad structure of the road plate The formation method is based on the conventional design of electricity: forming a tan pad having a predetermined shape at the time of the two structures and the cooking process. Based on the construction cost and time, the pad structure of the printed circuit board having the above-mentioned effects is formed. [Embodiment] The present invention will be described with reference to the specific embodiments of the present invention. Those skilled in the art can understand the other advantages and effects of the present invention by the contents disclosed in the present specification. The present invention is also to be construed as being limited to the various embodiments and embodiments of the invention, and various modifications and changes may be made without departing from the spirit and scope of the invention. Ding Ming and Mai read the second Α-2 Β diagram, wherein the second Α diagram shows a three-dimensional cross-sectional view of the solder joint structure of the printed circuit board of the present invention 1 〇 412 8 200922421. As shown in the figure, the circuit board 〇Mnted Circuit Board, p(8) has a circuit pattern 21〇 on the substrate 20, wherein the circuit pattern 21° and 0 are designed by the related software, and 21 ^ 疋Circuit function. The printed circuit has a 211, a hollowed out area 213, and an electric recording layer. 20 upper = pad f body 211, formed in a predetermined shape (4) in the substrate pad body 211 for the (four) layer of the heart is the: 210 electrical connection of the plurality of extensions, t:: road pattern, system For the electric (4) case 21G°, please refer to the (10) figure == The material structure of the road board is shown in the figure, which is “τ”. In addition, the other real two = 疋 shape may be "one," glyph or "r-shaped". The pre-empted area 213 is formed in the structure of the copper box layer 21 between the sulcus and the sulcus. The copper town is changed into a plurality of small copper boxes, and the plating layer 215 is electroplated on the upper surface of the limb 211 of the electric money layer 215 in the present embodiment. Covering the upper surface of the pad body 211, the surface is made of copper, that is, the material of the copper material is referred to the 3A-3C, and the method of forming the structure of the pad structure is shown in the second circuit (4). Pad 110412 200922421 = Shape::: is used for the shape of the wheel, in the 'the printed circuit board has a copper box layer 2 on the reverse side of the substrate to form the circuit pattern 21": two: board two for the upper surface of the box layer 21 In the case of the right sub-segment, the 3A figure does not use the pad pattern 212 of the phase Η + , eight pre-forms on the surface, for example, when the circuit board design software is designed to design the pad structure, i the predetermined shape In the present embodiment, the configuration (4) is designed such that in other embodiments, the predetermined medium/definite shape is a "T" shape, and the shape of the (4) heart shape or the "γ" shape is: == The circuit: Hit (4) between the extensions 2(1), and the shape: 镂 == remove each as shown in Figure 3C, to the surface of the 2U upper surface of the electric body, as shown in the figure:: Guangli No.2 Mine The layer 215 is in the weld 2 (1) and the extension door has a hollowed out area 213 due to the extension, so that the table = 2 "is a small piece In the copper box of these small pieces, the distance between the electrodes and the electrodes becomes smaller, so that the surface of the printed circuit board of the present invention is provided with the pad of the circuit board. The structure and the method for forming the same, through the above-mentioned mattress: the middle/, the number of extensions and the hollowed-out area between the extensions, the white copper foil is replaced by a plurality of copper foils separated by a plurality of small pieces, and the pad structure The surface is flattened, so that it is easy to be welded firmly, and the phenomenon of poor soldering and component pinching is avoided. In addition, the present invention is a method for forming a material structure of a printed circuit board, which is known in the art. When the soldering boring of the present invention is designed to form a base having a predetermined shape and a sturdy structure without increasing the manufacturing cost and time, > is formed into a pad structure of a printed circuit board having the above-described effects. The above embodiments are merely illustrative of the effects of the present invention, and are not intended to limit the present invention, that is, the spirit of the present invention and Fan Tianshou, who may or may not violate the present disclosure. The scope of protection of rights, the shore as modified in the following examples. Therefore, the present invention [simplified in the drawing, I month] is described in the following patent scope. The figure is a three-dimensional sectional view of a conventional printed circuit board Tan pad structure; the figure shows the front view of the conventional printed circuit board soldering structure
2 Α圖係本發明 之印刷電路板之焊墊結構 立體截面2 Α图 is a solder pad structure of a printed circuit board of the present invention
第2B圖係顯 俯視圖；以及 示本發明之印刷電路板 之焊塾結構正面 形成方法步驟示意圖。 【主要元件符號說明 10 ' 20 基板 第3A至3C圖係顯示本發明 方法步驟示音阁。 之㈣-路板之焊塾結構 11 ' 21 銅箔層 110、 210電路圖案 111、 211焊墊本體 110412 11 200922421 114 大片銅箔 212 焊墊圖案 213 鏤空區域 215 電鍍層 2111 延伸部Fig. 2B is a plan view showing the method of forming the front side of the solder fillet structure of the printed circuit board of the present invention. [Main component symbol description 10 '20 substrate Figures 3A to 3C show the method steps of the present invention. (4) - Road plate soldering structure 11 ' 21 Copper foil layer 110, 210 circuit pattern 111, 211 pad body 110412 11 200922421 114 Large piece of copper foil 212 Pad pattern 213 Hollow area 215 Plating layer 2111 Extension