TW200917348A - Apparatus using electrosprayed fluids for cleaning surfaces with reduced residual contaminants, and method related thereto - Google Patents

Apparatus using electrosprayed fluids for cleaning surfaces with reduced residual contaminants, and method related thereto Download PDF

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Publication number
TW200917348A
TW200917348A TW97129239A TW97129239A TW200917348A TW 200917348 A TW200917348 A TW 200917348A TW 97129239 A TW97129239 A TW 97129239A TW 97129239 A TW97129239 A TW 97129239A TW 200917348 A TW200917348 A TW 200917348A
Authority
TW
Taiwan
Prior art keywords
liquid
electrode
opening
source
acid
Prior art date
Application number
TW97129239A
Other languages
English (en)
Chinese (zh)
Inventor
John F Mahoney
Julius Perel
James K Finster
Original Assignee
Ehd Technology Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ehd Technology Group Inc filed Critical Ehd Technology Group Inc
Publication of TW200917348A publication Critical patent/TW200917348A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW97129239A 2007-08-02 2008-08-01 Apparatus using electrosprayed fluids for cleaning surfaces with reduced residual contaminants, and method related thereto TW200917348A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US96343907P 2007-08-02 2007-08-02
US99370707P 2007-09-13 2007-09-13

Publications (1)

Publication Number Publication Date
TW200917348A true TW200917348A (en) 2009-04-16

Family

ID=40429269

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97129239A TW200917348A (en) 2007-08-02 2008-08-01 Apparatus using electrosprayed fluids for cleaning surfaces with reduced residual contaminants, and method related thereto

Country Status (2)

Country Link
TW (1) TW200917348A (fr)
WO (1) WO2009032459A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114829149A (zh) * 2019-12-16 2022-07-29 三星显示有限公司 喷墨印刷设备和用于对准偶极子的方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5653864A (en) * 1994-06-30 1997-08-05 Nok Corporation Protein biosensor and method for protein measurement with the same
US5571385A (en) * 1995-05-08 1996-11-05 Cleveland State University Method and apparatus for water purification
US6159421A (en) * 1995-10-17 2000-12-12 Ebara Corporation Method of cleaning gases
US5796111A (en) * 1995-10-30 1998-08-18 Phrasor Scientific, Inc. Apparatus for cleaning contaminated surfaces using energetic cluster beams
US6106634A (en) * 1999-02-11 2000-08-22 Applied Materials, Inc. Methods and apparatus for reducing particle contamination during wafer transport
NL1012451C1 (nl) * 1999-06-28 2001-01-02 Cds Engineering B V Inrichting en werkwijze voor het scheiden van aardgas en water.
US6784439B2 (en) * 2001-07-19 2004-08-31 Ut Battelle, Llc Thin-channel electrospray emitter
US6953047B2 (en) * 2002-01-14 2005-10-11 Air Products And Chemicals, Inc. Cabinet for chemical delivery with solvent purging
JP2005136374A (ja) * 2003-10-06 2005-05-26 Matsushita Electric Ind Co Ltd 半導体製造装置及びそれを用いたパターン形成方法
US20060102471A1 (en) * 2004-11-18 2006-05-18 Karl Maurer Electrode array device having an adsorbed porous reaction layer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114829149A (zh) * 2019-12-16 2022-07-29 三星显示有限公司 喷墨印刷设备和用于对准偶极子的方法
CN114829149B (zh) * 2019-12-16 2024-04-19 三星显示有限公司 喷墨印刷设备和用于对准偶极子的方法
US12017465B2 (en) 2019-12-16 2024-06-25 Samsung Display Co., Ltd. Inkjet printing apparatus and method for aligning dipoles

Also Published As

Publication number Publication date
WO2009032459A1 (fr) 2009-03-12

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