TW200917301A - Element assembly, and its manufacturing method - Google Patents

Abstract

In the upper face of a substrate (22), there are formed a plurality of recesses (25). In one recess, a variable condenser (27) is formed by mounting a plate-shaped stationary electrode (30) on the bottom face of the recess (25) and by mounting a plate-shaped movable electrode (31) in a confronting manner on the back of a cover (23). In another recess, a stationary electrode (33) is mounted on the bottom of the recess (25), and a moving electrode (34) is mounted in a confronting manner on the back of the cover (23), so that a high resistor (35) is formed between the two electrodes, thereby to form a variable resistor (28). In still another recess, a variable inductor (29) is formed by mounting a plate-shaped stationary electrode (36) on the bottom of the recess (25) and by mounting a zigzag-meandering movable electrode (37) in a confronting manner on the back of the cover (23).

Description

200917301 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to an assembly of elements and a method of manufacturing the same. Specifically, the present invention relates to a component assembly in which a passive component such as a capacitor, a resistor, an inductor, a transformer, or the like is integrated, and a method of manufacturing the same. [Prior Art] Mobile devices such as mobile phones have been expanding information in recent years due to Internet support or single-key support. With the development of multi-band, one mobile phone has been able to cope with multiple frequency bands or multiples. way of communication. In order to achieve the expansion of the transmission information, it is necessary to prevent high-band signal loss. In order to reduce the signal loss in the high-frequency band, it is effective to miniaturize the circuit, shortening the signal wiring, and reducing the component size. In addition, in order to realize multi-band, the number of components of the circuit is extremely large, and in order to mount the circuit component group in the mobile device, it is necessary to (1) integrate a plurality of components and a large number of components, and (2) The components are miniaturized, and (3) various components are combined to make them multifunctional. In terms of active components such as FETs, a high degree of integration has been achieved, and passive components such as resistors or capacitors are also incorporated. However, such a semiconductor integrated circuit is manufactured on a semiconductor substrate such as a substrate or a GaAs substrate by a semiconductor fabrication technique. Therefore, there is a problem that the cost is high, and it takes a long period of time from π to 10,000. Therefore, it is mainly expected that the passive elements can be integrated at a low cost and with a simple manufacturing structure. 132236.doc 200917301 In addition, if a component with variable component constant, such as a variable (capacitor) capacitor or a variable resistor, is used, the number of required components can be reduced, or the circuit specifications can be reduced, but the semiconductor integrated body can be incorporated. In a passive component in a circuit, the circuit constant cannot be made variable. As a variable capacitor incorporated in a substrate, it is known that the structure is shown in the figure (Patent Document υ. The variable capacitor u is interposed in the gap portion 15 provided on the insulating support 14 to support the film body in the opposite direction. When the external bias is applied between the fixed electrode 12 and the movable electrode 13, the movable electrode 13 is deflected by the electrostatic attractive force, and the distance between the electrodes is changed, resulting in the variable capacitor 11 The electrostatic capacitance changes. Therefore, the electrostatic capacitance of the variable capacitor ii can be controlled by adjusting the external bias voltage. However, the variable capacitor thus constructed is used as a discrete component, and is therefore any combination of any of them. In particular, when a plurality of variable capacitors are integrated to form a circuit, the variable electrodes of the variable capacitors or the fixed electric 1 are connected to each other. Therefore, when an external bias is applied to a variable capacitor, This will cause the variable capacitor connected to it to be externally biased, so that the variable capacitor cannot be controlled separately. Therefore, the variable capacitor product is multiplied. In order to solve the problem of the present invention, the present invention is based on the fact that the variable capacitors have not been considered for use in the high frequency band. [Patent No. 1] Japanese Patent Laid-Open Publication No. Hei 5-74655. The result of the development of such a technical subject is to provide 132236.doc 200917301 for a combination of components, which can integrate capacitors, circuit components such as resistors and inductors, and is easy to manufacture at low cost. The component assembly according to the present invention is characterized in that it includes a substrate assembly including a plurality of concave portions, and a component assembly covering the opening portion covering the opening of the concave portion, and I'in the concave portion An electrode is disposed on a bottom surface of at least a portion of the concave portion and a rear surface of the covering portion, and an element including the electrode is formed on a bottom surface of the concave portion and a rear surface of the covering portion facing the bottom surface of the concave portion, thereby providing a plurality of elements. According to the element assembly of the present invention, various elements can be formed by electrodes provided on the bottom surface of the concave portion and electrodes provided on the back surface of the covering portion. In particular, if a group of components is used, a variety of circuit components can be formed, and the composite can be formed by using a resin substrate and a cover portion in which a plurality of recesses are formed, and thus a semiconductor is used on the semiconductor substrate. In the case where the manufacturing technique is manufactured, it can be manufactured simply and inexpensively. Therefore, the design freedom can be shortened during the period of designing the design. The embodiment of the component assembly of the present invention is characterized in that the embodiment is characterized in that The depth of the partial concave portion of the concave β is different from the depth of the other concave portions. According to this embodiment, the distance between the electrodes can be changed by changing the depth of the concave portion in each element, so that the element constant and the like can be adjusted. According to another embodiment of the component assembly of the present month, the cover portion is elastically bendable and at least a part of the elements are disposed on the back surface of the cover portion. = is provided on the bottom surface of the recess and constitutes a variable capacitor by two electrodes. In this case, 132236.doc 200917301, the electrode on the bottom surface of the recess, and the electrode of the inviting portion face each other to form an electric grid, and the back of the cover is also caused by the deflection of the shading portion. Therefore, the electrode is deflected so that the electrode is pitched by deflecting the cover portion, and the capacitor capacitance is made variable. An embodiment of the device assembly of the present invention is characterized in that the covering portion is elastically bendable, and at least a part of the elements, δ is an electrode 古/ancient electrode on the back surface of the covering portion, The electrode disposed on the bottom surface of the concave portion is a fixed lightning pole, and the two electrodes constitute a variable resistor. In this embodiment, the resistance is formed by the medium between the electrode of the concave bottom surface and the electrode of the back surface of the covering portion by ω t ^, and the back surface of the covering portion is also caused by the deflection of the covering portion. Since the electrode is deflected, the corrugated parachute causes the length of the medium between the electrodes to be changed by bending the covering portion, and the resistance value is made variable. The component assembly of the present invention is characterized in that the cover portion is elastically bendable, and at least part of the elements, the electrode provided on the back surface of the cover portion is a movable electrode. The electrode provided on the bottom surface of the concave portion is a fixed electrode, and the variable inductor is configured by the two electrodes. In this embodiment, the magnetic flux generated by the lightning-producing method A m plus ten motor into the bottom surface of the concave bottom and the electrode in the back surface of the covering portion passes through the other electrode. The deflection is caused by the deflection of the cover portion so that the distance between the electrodes changes, so that the inductance changes. Still another aspect of the device assembly of the present invention is characterized in that the cover portion is elastically bendable, and in at least a part of the elements, an electrode provided on a back surface of the cover portion is a movable electrode, and an electrode provided on a bottom surface of the concave portion The electrode is fixed and the variable transformer is constructed by two electrodes. 132236.doc 200917301 In this example, 'the right current flows into the electrode on the bottom surface of the concave portion and one of the electrodes in the surface of the cover portion, and a magnetic flux is generated, because the magnetic flux is interlinked with the other electrode. Current flows into the other electrode. Therefore, the transformer ’ is formed by the two electrodes and the deflection of the cover portion causes the electrode on the back surface of the cover portion to also flex. Therefore, the energy conversion efficiency of the transformer can be made variable by bending the cover portion.

According to still another aspect of the present invention, the concealing portion is elastically curved, and a part of the elements are one of a back surface of the upper cover portion and a bottom surface of the concave portion. For: the other electrode 'the bottom surface of the above-mentioned cover portion and the bottom of the concave portion: the middle: the electrode / the middle ' corresponding to - the above-mentioned electrode between the above-mentioned deflection, and the second: into a switch. According to this embodiment, the electrodes can be electrically connected to each other by bringing the electrodes of the pair-to-electrode to each other (4) in contact with the electrodes, thereby functioning as a switch. The further embodiment of the component assembly of the present invention;

As a variable capacitor, the wire # is characterized in that at least a part of the concave portion of the material is sealed with two electric materials. According to this embodiment, the variable capacitor can be further formed, and further embodiments are characterized in that: the recessed portion or the movable electrode and the fixed electrode are respectively formed by the electrode and the fixed electrode. Can increase the electrostatic capacitance of the mover. Therefore, another embodiment in which the assembly of the variable capacitance 増 can be enlarged is characterized in that 132236.doc 200917301 is disposed between the movable electrode as the variable resistor and the fixed electrode, and is deformable High resistance body. According to this embodiment, the resistance value of the variable resistor can be increased by providing a high resistance body between the two electrodes. Further, when the cover portion is deflected, the length of the high-resistance body is shortened, and the cross-sectional area of the high-resistance: is increased, so that the change in the resistance value can be increased. Still another embodiment of the 7L assembly of the present invention is characterized in that the movable electrode and the fixed electrode are the variable inductors

One electrode is formed in a serpentine shape. According to this embodiment, since the serpentine-shaped electrode can function as the coil, the two electrodes can be used as the variable inductor. Still another embodiment of the assembly of the present invention is characterized in that the movable electrode and the fixed electrode as the variable transformer are formed in a meandering shape. According to this embodiment, since the two electrodes formed in a serpentine shape serve the same function as the coil, the two electrodes can be used as the variable transformer.

Still another aspect of the component assembly of the present invention is characterized in that the stopper is disposed in the back surface of the cover portion or in the recessed portion of the substrate to prevent the electrode provided in the cover portion from being disposed in the recess portion : The electrode of the surface i is in contact. According to this embodiment, since the two electrodes can be prevented from being contacted by the stopper, it is possible to prevent the two electrodes from being short-circuited, or to prevent the two electrodes from being too close. Still another aspect of the 7L assembly of the present invention is characterized in that a filter is provided on an upper surface of the cover portion, and the filter has electrodes formed on both surfaces of the piezoelectric phase. According to this embodiment, the FBAR type filter can be formed by sandwiching the piezoelectric film with the electrode 132236.doc 200917301. Still other embodiments of the component assembly of the present invention are characterized in that = a plurality of components are electrically connected to form an array of circuit components. According to this, various circuit element arrays can be formed by connecting various elements. The method for producing a component assembly of the present invention is characterized by comprising: a step of forming a resin substrate having a plurality of recesses by hardening it in a state of being dusted to a resin in a smelted or softened state; a step of forming a fixed electrode on a bottom surface of the concave portion; a step of forming a movable electrode on a back surface of the covering portion; covering the opening portion of the concave portion by frost

The portion is disposed on the base of the base; and the W surface includes a step of forming a plurality of elements including the electrodes between the bottom surface of the concave portion and the back surface of the covering portion opposite to the bottom surface of the concave portion. According to the method for producing a component assembly of the present invention, since the resin substrate is molded by using a stamper, the substrate can be mass-produced at low cost. Further, since the fine recesses can be formed with high precision, it is easy to downsize or integrate the element assembly. Furthermore, the mechanism of the present invention which solves the above-mentioned problems is characterized by appropriately combining the constituent elements described above. The present invention can realize diversity change according to a combination of constituent elements. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. (First Embodiment) Hereinafter, a first embodiment of the present invention will be described with reference to Figs. 2 to 19 . 2 is a perspective view of the component assembly 21 according to the first embodiment of the present invention, and FIG. 3 is a perspective view showing a state in which the substrate 22 of the component assembly 2 1 is separated from the cover portion 23 and a portion of the substrate 22 is partially broken. Figure 4 is a cross-sectional view of line XX of Figure 2. The element assembly 21 includes a synthetic resin substrate 22, a cover portion 23, and a circuit element array 24. The substrate 22 is formed of a resin such as a cycloolefin resin or a PMMA (polymethyl methacrylate) (polymethyl methacrylate), and a plurality of concave portions 25 having a truncated pyramid shape are formed on the upper surface as shown in Fig. 5 . The cover portion 23 is formed into a film shape by a resin such as a fluororesin such as PTFE (polytetrafluoroethylene) or a cycloolefin resin or PMMA (poly(mercapto methacrylate), and the thickness thereof is formed to be elastically bendable. . The cover portion 23 includes a plane area approximately the same as that of the substrate 22, and is bonded to the upper surface of the substrate 22 so as to cover the recess portion 25. The respective elements constituting the circuit element array 24 are disposed at positions of the respective recesses 25, and are connected by the signal wirings 26 to constitute a target circuit. In Fig. 5, a single element region (hereinafter referred to as an element region) indicating the substrate 22 is surrounded by a one-dot chain line. In the first embodiment, each element includes a variable capacitor 27, a variable resistor 28, and a variable inductor 29. 2 and 3 show an example of the arrangement of the variable electric grid 27, the variable resistor 28, and the variable inductor 29, and the wiring example of the k-number wiring 26, but the number, arrangement, and wiring method of each element are shown. Change the visual circuit purpose as appropriate. For example, a variable resonant circuit or a variable filter circuit can be formed by combining a plurality of elements. Fig. 6(a) is a cross-sectional view showing the structure of the variable capacitor 27, and Fig. 6(b) is a plan view showing a state in which the covering portion 23 is removed. Further, Fig. 7(a) is a plan view showing a state in which the /gluent electrode 31 is further removed, and Fig. 7(b) is a cross-sectional view taken from the intersection of Fig. 6 (&) 132236.doc • 13-200917301. The variable capacitor 27 includes a flat fixed electrode 3A made of a metal thin film provided on the bottom surface of the concave portion 25, and a flat plate-shaped movable body formed of a metal thin film which is provided on the cover portion 23 opposite to the fixed electrode 3A. Electrode 31. A signal wiring % is connected to the fixed electrode 30, and the signal wiring % is extended from the concave portion 25 toward the upper surface of the substrate 22, and is connected to other components or external connection terminals. A signal wiring 26 is also connected to the movable electrode 31, and the signal wiring 26 is also connected to other components or external connection terminals. Further, among the signal wirings 26 connected between the ohms, there are those provided on the upper surface of the substrate 22 and on the back surface of the cover portion 23. Fig. 8(a) is a cross-sectional view showing the structure of the variable resistor 28, and Fig. 8(b) is a plan view showing a state in which the covering portion 23 is removed. χ, Fig. 9(4) is a plan view showing a state in which the movable electrode is removed, and Fig. 9(b) is a cross-sectional view in the direction orthogonal to Fig. 8(4). The variable resistor 28 includes a flat fixed electrode 33 made of a thin metal foil provided on the bottom surface of the concave portion 25, and a flat movable electrode 34 made of a metal thin film provided on the back surface of the covering portion 23 opposite to the fixed electrode 、. A high-resistance body is provided between the fixed electrode 33 and the movable electrode 34 by 2. A signal wiring 26 is connected to the solid electrode 33, and the signal wiring 26 is extended from the concave portion 25 toward the upper surface of the substrate 22, and is connected to other elements or external connection terminals. A signal wiring 26 is also connected to the movable electrode 34, and the signal wiring (10) is connected to its 匕 element or external connection terminal. The high-resistance body 35 is made of, for example, an epoxy-based conductive material (liquid, condensate, elastomer, or the like) which is larger than the electric 355, and has an area of a horizontal cross section + an electrode area of the fixed electrode 33 and the movable electrode 34, and It is preferable that at least one of the upper end and the lower end of the high resistance body 35 is fixed to the fixed electrode 33 or the movable electrode 34. 132236.doc 200917301 Fig. 10(a) is a cross-sectional view showing the structure of the variable inductor 29, and Fig. 1(b) is a plan view showing a state in which the covering portion 23 is removed. Further, Fig. 11(a) is a plan view showing a state in which the movable electrode is removed. Fig. 11(b) is a plan view of the direction orthogonal to Fig. 1(a). The variable inductor 29 includes a flat-plate-shaped fixed electrode 36 (core electrode) including a metal thin film provided on the bottom surface of the concave portion 25, and a zigzag-shaped metal thin film provided on the back surface of the covering portion η opposite to the fixed electrode 36. A linear movable electrode 37 (coiled electrode). Signal wirings 26 are connected to both ends of the movable electrode 37, and the signal wirings 26 are connected to other components or external connection terminals. The fixed electrode 36 is not connected to the signal wiring 26'. The fixed electrode 36 functions as a core of the coil (the movable electrode 37). Further, although not shown, the fixed electrode 36 provided on the bottom surface of the concave portion 25 may be a zigzag-shaped linear coil electrode, and the movable electrode 37 provided on the back surface of the cover portion 23 may be a flat-shaped core electrode. Further, as shown in Figs. 12 and 2, external connection terminals 38 39 and 40 for connecting the circuit element array 24 to the external circuit are provided at the end of the element assembly 21. These are external connection terminals 38 for connecting, for example, an antenna, an external connection terminal 39 for signal input, and an external connection terminal 40 for signal output. The external connection terminals 38, 39, and 4'' are respectively connected to the signal wiring 26 by the through holes 38a, 39a, 4 provided through the cover portion 23, and the thickness of the substrate 22 is 2〇. 〇~1000 μηι or so, the length of one side of a piece (7L piece area) is about 5 mm, and the distance between the fixed electrode and the movable electrode (the distance between the electrodes when the movable electrode is not bent) is about 1 to 30 μηι. 132236.doc -15- 200917301 The ground electrode film 42 is formed on the upper surface of the cover portion 23, and further, on the upper surface of the ground electrode film 42, a cover 邛23 is elastically bent in each element region. The activity generating unit 4丨. The ground electrode film is formed on substantially the entire upper surface of the cover portion 23 except for the region where the external connection terminals 38, 39, and 4G are provided. The movable force generating portion "includes a bimorph or a single-layer piezoelectric film (see FIG. 13) in which two piezoelectric films such as NT are laminated, and is provided separately in each element region. In each component region, A driving terminal 44 (grounding terminal) is provided on the upper surface of the grounding electrode film 42, and a driving terminal 45' is provided on the upper surface of the movable force generating portion 41. The driving wiring 46 is connected to each of the driving terminals 44 and 45. The self-driving wiring is self-driven. Each of the drive terminals 44 and 45 applies a voltage to each of the movable force generating portions 41. Further, the drive terminal 44 as the ground terminal need not be provided in each of the element regions, and one place can be provided at any place of the ground electrode 42. (Refer to the case of the second embodiment.) Fig. 13 illustrates the action of the movable force generating unit 41. The movable force generating unit "converts a two-layer piezoelectric film 43& which contains a ferroelectric material such as ZnO or PZT to form a double pressure. Electric wafer. When a DC power source 47' connected to the driving terminal 44 and the driving terminal 45 is applied to, for example, a voltage generating portion of a certain component, the piezoelectric thin film 43a, 4 is driven by the driving terminal 45 and the ground electrode film 42. Apply voltage to the child. Thereby, the piezoelectric film 43a contracts in the x direction as indicated by the arrow, and the piezoelectric film 43b expands in the film direction as indicated by the arrow, so that the 'moving force generating portion 41 is curved, and the central portion of the element portion of the covering portion 23 is directed to the concave portion. Within the decline. Further, in the case where the movable force generating portion 41 uses a single-layer galvanic film, the movable force generating portion Μ 132236.doc •16- 200917301 test piece, the covering portion 23 by applying the electric single layer (four) film I. The central portion of the element region is lowered into the concave portion μ. As a result, in the case of the variable capacitor 27, as shown in Fig. 14, the distance between the electrodes between the fixed electrode 30 and the movable electrode 31 is reduced, so that the electrostatic capacitance of the variable capacitor 27 is increased. Further, the electrostatic capacitance of the variable capacitor 27 can be controlled by adjusting the voltage applied to the movable force generating portion 41. In the case of the varistor 28, when the urging force generating portion 41 is subjected to voltage application, the central portion of the element region of the covering portion 23 is lowered into the concave portion, as shown in FIG. Electrode 33 and movable electrode

The length of the high-resistance body 35 will be shortened, and the cross-sectional area of the horizontal section will become larger, so that the resistance value becomes small. Further, the resistance value of the variable resistor 28 can be controlled by adjusting the voltage applied to the movable force generating portion 41. In the variable inductor 29, the movable electrode 37 functions as a coil, and the fixed electrode 36 functions as a core of the coil. Then, as shown in Fig. 16, the proximity of the movable electrode 37 to the @ fixed electrode 36 corresponds to the insertion of the iron core into the coil w, and the movable electrode 37 is separated from the fixed electrode 36, and the core 36a is pulled out from the coil w. Therefore, in the case of the variable inductor 29, if the applied voltage is lowered by the movable force generating portion 41 in the element region of the cover portion 23, the inductance of the variable inductor 29 is increased. Big. Further, the inductance of the inductor 29 can be controlled by adjusting the voltage applied to the movable force generating portion 41. # & Therefore, if, for example, a circuit or a variable filter circuit is formed by, for example, the circuit element array 24, it may be changed. • Electrical valley state 27, variable resistor, constant of variable inductor 29, variable frequency or variable frequency or frequency loss of variable filter circuit. 132236.doc 200917301 Next, a method of manufacturing each element will be described. 17 and 18 show a method of manufacturing the variable capacitor 27 region. Figures i7(a) to (c) show the manufacturing steps of the substrate 22, Figs. 17(d) to (f) show the manufacturing steps of the mask portion 23, and Figs. 18(a) to (e) show the substrate 22 and the mask portion 23. The step of forming the variable capacitor 27 is performed. Hereinafter, the steps will be described. The stamper 48 shown in Fig. 17 (a) is formed by forming a plurality of convex portions 49 having a truncated cone shape on the lower surface. The stamper 48 is pressed onto, for example, an ultraviolet curable resin, and the resin is dusted. After the ultraviolet curable resin is irradiated with ultraviolet rays to be cured, the stamper 48' is removed to obtain a plurality of recesses on the upper surface. 25 substrate 22. Further, when a thermosetting resin is used for the substrate molding, the stamper 48 is similarly pressed to a thermosetting resin in a molten or softened state, and the resin is further dispersed to form a thermosetting resin. After the cooling and hardening, the stamper 48 is removed to obtain the substrate 22 having a plurality of recesses 25 formed on the upper surface. Alternatively, the substrate 22 may be formed by injection molding or the like. Then, as shown in FIG. 17(b), the electrode material is deposited on the entire surface of the substrate 22 by a sputtering method or the like, and after the metallization layer 5 is formed into a film, the metallization layer 50 is etched. The excess portion is removed, and the fixed electrode 3A and the signal wiring 26 are formed in the recess 25. On the other hand, as shown in Fig. 17 (d), the cover portion 23 is formed into a film shape by extrusion molding or the like, and as shown in Fig. 7(e), the electrode material is deposited on the cover by sputtering or the like. On the entire lower surface of the portion 23, the metallization layer 5 i is formed into a film. Then, as shown in Fig. 17 (1), the excess portion of the metallization layer 51 is removed by etching, and the movable electrode 31 and the signal wiring 26 are formed on the lower surface of the mask portion 23. 132236.doc -18- 200917301 Thereafter, as shown in Fig. 18(a), the cover portion 23 is overlapped and positioned on the substrate 22', and as shown in Fig. 18(b), laser irradiation or heat welding is used. In the method, the cover portion 23 is joined to the upper surface of the substrate 22. Next, as shown in Fig. 18(c), through holes are formed at specific positions to form external connection terminals 38, 39, and 4''. As shown in FIG. 18(d), the ground electrode film 42, the movable force generating portion 41, and the metallization layer 52 are formed on the upper surface of the cover portion 23, and as shown in FIG. 18(e), the ground electrode 42 is grounded. The movable force generating portion 41 is patterned, and the metallization layer 52 is surnamed to form the drive terminals 44 and 45 and the drive wiring 46 to form the element assembly 21. Fig. 19 is a view showing a method of manufacturing the region of the variable resistor 28, and Figs. 19(a) to (f) show the steps of forming the variable resistor 28 by integrating the substrate 22 and the cover portion 23. The substrate 22 of Fig. 19(a) is provided with a fixed electrode 36 on the bottom surface of the concave portion 25 by the same steps as those of Figs. 17(a) to 17(c). On the upper surface of the fixed electrode 33 in the concave portion 25, the columnar high-resistance body 35 is fixed by ejecting a high-resistance material from the ink-jet head. Then, as shown in Fig. 19, the cover portion 23 is provided. The surface alignment is superimposed on the substrate 22 such that the movable electrode 37 on the back surface of the cover portion 23 is in contact with the upper end surface of the high-resistance body 35, and as shown in FIG. 19(c), by laser irradiation or heat welding. The cover portion is joined to the upper surface of the substrate 22. Further, the cover portion 23 shown in Fig. 19(b) is provided with the movable electrode 3 on the back surface of the cover portion 23 by the same steps as those of Figs. 17(4) to 17(f). 7. Thereafter, as shown in 圊i9(4), through holes are formed at specific positions to form external connection terminals 38, 39, 4 (). As shown in Fig. 19(e), the ground electrode is provided on the upper surface of the cover portion The film 42, the movable force generating portion Μ, and the metallized layer Μ 132236.doc 19 200917301 are formed into a film, and as shown in FIG. 19(f), the ground electrode film 42 and the movable force generating portion 41 are patterned, and further the metal is formed. The layer 52 is etched, whereby the drive terminals 44 and 45 and the drive wiring 46 are formed to form the element assembly 21. The steps of FIGS. 19(b) to (f) are the same as the steps of FIGS. 8(a) to 8(e). Further, the variable inductor 29 is basically different from the electrode pattern and the like. In the element assembly 21 according to the first embodiment of the present invention, as described above, the resin substrate 22 and the cover portion 23 including the plurality of concave portions 25 are used, and The fixed electrode provided on the bottom surface of the recessed portion 25 and the movable electrode provided on the back surface of the cover portion 23 constitute an element such as the variable capacitor 27, the variable resistor 28, and the variable inductor 29. Since the structure is simple, a plurality of components can be formed. In particular, the passive element can be integrated, and the element assembly 21 can be miniaturized. In particular, when the concave portion 25 is formed on the substrate by press molding, it can be easily and inexpensively compared with the etching process of the tantalum substrate or the like. The component assembly 21 is mass-produced, and the components in the component assembly 21 can be made fine. Further, since the structure is simple, the period from the design to the manufacture can be shortened. Further, according to the component assembly 21, Multiple components integrated miniaturization Therefore, it is also possible to cope with high-frequency use. In particular, the method of the following modification can also increase the adjustment range of the element constant, and therefore, it is also possible to easily fabricate the element assembly 21 suitable for a high frequency band. Further, the element assembly 21 In the case where the 邛41 can be generated by driving the movable force, the movable electrode is elastically deformed, and the distance between the electrode of the movable electrode and the fixed electrode is changed. Therefore, the constant of each element can be changed. Therefore, the complex array circuit has the same configuration. For the circuit with only different component constants 132236.doc • 20- 200917301 In the middle, the constant force of each component can be changed by the movable force generating unit 41, and the component assembly 21 can function as a plurality of circuits, so The device in which the component assembly 21 is assembled is miniaturized. (Modification 1) * Fig. 2 is a cross-sectional view showing a variable capacitor 27 of a different form of the variable capacitor 27, which has a large dielectric constant in the recess 25 (The specific dielectric constant is 1 〇 or more), and is filled with a sturdy: "sports" (for example, a non-alcoholic organic dielectric elastomer). In such a variable capacitor 27, since the high dielectric constant elastic dielectric 54 is filled between the fixed electrode 3A and the movable electrode η, the electrostatic capacitance between the two electrodes is higher than that of the cavity. The variable capacitor 27 has the same electrostatic capacitance, so that its internal size is smaller than that of the cavity. Further, since the elastic dielectric 54 is filled inside, it can be reduced by filling a fixed amount of the elastic dielectric 54' during manufacture. The processing accuracy level required to adjust the distance between the electrodes. (Modification 2) Figs. 21, 22, and 23 show the variable capacitor 27 of the second modification. The variable capacitor 27' is shown in Fig. 21 as the fixed electrode 3. () and the movable electrode 31: a dielectric material having a large dielectric constant is maintained. The dielectric material is a dielectric liquid (for example, a non-alcoholic organic dielectric liquid) or An elastomer having a large dielectric constant. Preferably, the dielectric has a specific dielectric constant of ίο or more. The dielectric material 56 has a horizontal cross section smaller than the area of the solid electrode 33 and the movable electrode 34 when the movable electrode 31 is not deflected, and is concentrated at the center. Further, when the dielectric material 56 is an elastomer or the like, the dielectric quality of the surface is 132236.doc -21 · 200917301 or the T surface is bonded to the movable electrode 31 or g] the fixed electrode 3 is the "electricity 56" In the case of a liquid, a treatment is performed on a region other than the center portion of the movable electrode 31 and the fixed portion so as to be able to repel the dielectric 5 6 . Such a variable thunder is crying. 7 ...

In the case of the turtle 1"27, the electrostatic capacitance between the electrodes 30 and 31 becomes larger than that of the cavity because the dielectric constant is temporarily maintained between the fixed electrode 30 and the movable electrode 31. Further, when the cover portion 23 is not bent, as shown in Figs. 22 (4) and 23 (3), the dielectric 56 is concentrated in the central portion of the fixed electrode 3 and the movable electrode 31. When the movable force generating unit 41 causes the imaginary part 23 to be bent, as shown in FIG. 2 and FIG. 23(b), the dielectric material 56 is pressed and thinned, and at the same time, it spreads to the periphery and the area becomes large. Therefore, the amount of change in the electrostatic capacitance of the variable capacitor 27 can be made very large. Further, since the variable capacitor 27 has an air layer in the recessed portion 25, the movable electrode 31 is more easily displaced than the modified portion in which the elastic portion M is filled in the recessed portion 25, so that the variable portion can be more variable. The amount of capacitance change of the capacitor ^. Fig. 24 is a view showing a method of manufacturing the variable capacitor 27 in Modifications i and 2, and Figs. 24 (4) to (f) show the steps of forming the substrate 22 and the mask portion into the variable capacitor 27. The substrate 22 of Fig. 24 (4) is provided with the fixed electrode 36 on the bottom surface of the concave portion 25 by the same steps as those of Figs. 17 (4) to 17 (C). In the case of deformation m, as shown in Fig. 24 (a), the elastic dielectric 54' is ejected from the ink jet head 53, and a fixed amount of the elastic dielectric material 54 is filled into the concave portion. Although not shown, in the case of Modification 2, the dielectric 56 is ejected from the ink jet head, and the dielectric f56g] is set on the fixed electrode % in the recess. 132236.doc -22- 200917301 Then, as shown in Fig. 24(b), the cover portion 23 is aligned on one side and overlapped on the substrate 22', and as shown in Fig. 24(c), laser irradiation or thermal fusion is used. The method 'the cover portion 23 is bonded to the upper surface of the substrate 22. Further, the mask portion 23 shown in Fig. 24 (8) is provided with the movable electrode η on the back surface of the cover «Ρ 23 by the same steps as 017 (d) to Fig. 17_. - After - As shown in Fig. 24 (d), a through hole is formed at a specific position to form a buzz. P connects terminals 3, 39, 40. As shown in Fig. 24(e), the ground electrode film 42, the movable force generating portion 41, and the metallized layer are formed on the upper surface of the mask portion 23, and the ground electrode film is formed as shown in Fig. 24(f). 42. Activity generation (4) Patterning is performed to perform (4) on the metallization layer 52, whereby the drive terminals 44 and 45 and the drive wiring 46 are formed to form a variable capacitor. (Modification 3) FIG. 25 is a good example. An exploded perspective view of the component assembly of Fig. 3. The plan view shows a plan view of the component structure in the third modification, Fig. (8) is a cross-sectional view of the line γ-γ of Fig. (Fig. 26(c) The J-side view of the line 于 is shown in FIG. 26, and the variable capacitor 27 is exemplified. However, in the configuration of the third modification, the variable resistor 28 or the variable inductor 29 or the components other than those described later are also The same is true. In the variable capacitor of the example of FIG. 26, the signal wiring 26 of the solid-state 极=3G and the signal wiring % of the movable electrode 31 are both covered by the k23 hole. 57a and 58a are connected to the external connection terminals 57 and 58 on the upper surface of the cover portion 23. In the component assembly of the third modification, as shown in Fig. 25, each 7L The signal wiring 26 is connected to the external terminals 57, 58 of the upper surface of the cover portion 23, so that the external connection terminals 57, 58 of the respective components can be connected to each other by the 132236.doc -23. 200917301 in the upper surface of the cover portion 23. And the circuit is freely arranged from the rear side. Or 'With the external connection terminals 57, 58, the upper surface of the cover 423 can be covered by the female Ic (integrated core), etc. ', (Modification 4) 27(a) is a cross-sectional view of the variable capacitor 27 of Modification 4, and FIG. 27A is a plan view showing a state in which the covering portion 23 is removed. In this modification, each of the plurality of protrusions 65 and 66 is formed. The fixed electrode 30 and the movable electric power '31. The protrusions 65 and 66 may have a conical shape such as a conical shape or a pyramidal shape, a frustum shape such as a truncated cone shape or a truncated cone shape, a hemispherical shape, and a triangular cross section (wedge shape). Further, in the recessed portion 25 and in the outer side region of the movable electrode 31, the stopper 67 higher than the projection 66 protrudes to the back surface of the covering portion 23. Further, the stopper 67 is disposed on the inner surface of the recessed portion 25 and fixed. In the outer side region of the electrode 3〇, it is higher than the protrusion 65. According to such a modification, since the electrode surface area of the fixed electrode 3〇 and the electrode surface area of the movable electrode 31 are larger than the area of the fixed electrode 3〇 and the movable electrode 31, the capacitance can be increased without increasing the size of the variable capacitor 27. Further, since the stopper 67' higher than the projection 66 (or the projection 65) is provided, the distance between the electrodes can be strictly controlled, even if the fixed electrode 30 or the movable electrode 3 1 is constituted by the projection 65, α The fixed electrode 3 防止 is prevented from coming into contact with the movable electrode 3 1 . (Variation 5) FIG. 28 is a cross-sectional view showing the structure of a component assembly 2 1 according to Modification 5. In the element assembly 21, the depth of the concave portion 25 in each element region is not fixed, and the depth of the concave portion 25 is different depending on the element region. Therefore, the distance between the electrodes can be adjusted for each element region by different types of elements 132236.doc -24· 200917301 or different circuit constants in the same component to achieve the optimum distance between electrodes. Further, since the components having various characteristics can be obtained in one process, it is easy to optimize the component assembly 21. Further, in the substrate of the component assembly 21, even if the depth of the concave portion is different, if the substrate is formed by a stamper as described above, the fluidity of the resin at the time of forming can be easily formed, and the molding can be easily performed. Further, in the component assembly 21 of Fig. 28, since the thickness of the covering portion 23 in each element region is not fixed, the covering portion 23 has a different thickness depending on the element region. Therefore, the rigidity of the covering portion 23 can be adjusted for each element region by changing the thickness of the covering portion 23, and the bending difficulty of the covering portion 23 can be optimized. FIG. 28 is a perspective view showing a component assembly according to a second embodiment of the present invention, and FIG. 30 is an exploded perspective view of the component assembly according to the second embodiment of the present invention. . Further, Fig. 31 is an exploded perspective view of the covering portion. Fig. 32 is a plan view showing the element assembly 71 in a state in which the covering portion 23 is separated. The element assembly 71 (or a part of the element assembly) includes two elements of the variable capacitor 27 and the variable inductor 29. As shown in FIG. 30, two recesses 25 are formed in the substrate 22, one of the recesses 25 is provided with a flat fixed electrode 3〇, the other recess is provided with a flat solid electrode 36, and the signal wiring 26 is self-fixed. 3〇 is wired toward the upper surface of the substrate. 132236.doc -25- 200917301. On the lower surface of the cover portion 23, a flat movable electrode 3i and a serpentine movable electrode 37 are provided. The signal wiring 26 is from the movable electrode 3 1 The signal electrode 26 is connected to the end of the movable electrode 31 and the movable electrode 37. Further, the signal wiring 26 extends from the other end of the movable electrode 37 toward the movable electrode 31 side. When the cover portion 23 is bonded to the upper surface of the substrate 22, the solid electrode 30 and the movable electrode 31 are opposed to each other to form a variable capacitor 27, and the fixed electrode 36 is opposed to the movable electrode 37 to form a variable electric power. Sensor ". Further, at this time, the signal wiring 26 extending from the other end of the movable electrode 37 is electrically connected to the signal wiring 26 extending from the solid-state electrode 3A toward the upper surface of the substrate 22, so that the variable capacitor 27 can be made The variable inductors 29 are connected in parallel. As shown in FIG. 31, through holes 72a and 73a are provided on both sides of the cover portion 23, and an input terminal 72 is provided on the through hole 72a, and an output terminal 73 is provided on the through hole. The upper surface of the cover portion 23 separates the input terminal 72 and the output terminal 73 so that the ground electrode film 42 is formed into a film, and the movable force generating portion is formed on the upper surface of the ground electrode film 42 opposite to the concave portion 25, respectively. 41. A drive terminal 44 is provided on the upper surface of the ground electrode film 42. Further, a drive terminal 45 is provided on the upper surface of each of the movable force generating portions 41. The drive wiring 46 connected to the drive terminal 45 is formed on the ground electrode film. The upper portion of the insulating film 74 on the 42 is guided to the edge of the element assembly 71. Therefore, the element assembly 71 can be used as an LC (inductance-capacitance) in which the variable capacitor 27 and the variable inductor 29 are connected in parallel. The inductance and capacitance are 132236.doc -26- 200917301. Further, since the movable portion generating portion 41 can be deflected by applying a voltage to the driving wiring 46, the capacitance of the variable capacitor 27 can be adjusted. Variable power (Embodiment 3) FIG. 33 is a plan view showing a component assembly 76 according to a third embodiment of the present invention. FIG. 34 is a plan view showing a component assembly 76 in a state in which the cover portion 23 is removed. The component assembly 76 (or a portion of the component assembly) includes four variable capacitors 27. As shown in Fig. 34, each of the variable capacitors 27 includes a fixed electrode 30 and a movable electrode 31, and two variable capacitors 27 are connected in series, respectively. The two variable capacitors 27 connected in series and connected in parallel are connected in parallel to each other. The input terminal 72 and the output terminal 73 of the element assembly 76 in which the four variable capacitors 27 are connected in series and in parallel are provided on the upper surface of the cover portion 23. In the same manner as in the second embodiment, the movable force generating portion 41 is provided for each element region on the upper surface of the covering portion 23. According to such a component assembly 76, the electrostatic capacitance can be made larger than that of the single element, and thus (Embodiment 4) FIG. 35 is a plan view showing a component assembly si according to a fourth embodiment, and FIG. 36 is a plan view showing a state in which the cover portion 23 is removed. The block assembly 81 includes one variable capacitor 27 and two variable inductors 29 (hereinafter, two variable inductors | § 29 are distinguished as variable inductors 29a and 29b, respectively). The fourth embodiment is described below. Three recesses 25 are provided on the upper surface of the substrate 22, and one recess 25 132236.doc -27- 200917301 is provided with a flat fixed electrode 30, and the like. The flat fixed electrode 36 is provided in each of the two concave portions. On the back surface of the cover portion 23, the movable electrode 31' is disposed opposite to the fixed electrode 3'', and the variable capacitor 27 is formed by the fixed electrode 3'' and the movable electrode 31. Further, on the back surface of the cover portion 23, two movable electrodes 3 7 of zigzag meandering are provided, and the movable electrodes 37 are opposed to the two fixed electrodes 36, respectively, and the two sets of the fixed electrode 36 and the movable electrode 37 are provided. The variable inductor 29a and the variable inductor 29b are formed. The inductances of the two variable inductors 29a and 29b are different. Thus, one of the variable capacitors 27 and the two variable inductors 29a and 29b formed between the substrate 22 and the cover portion 23 is star-connected by the signal wiring 26 as shown in Fig. 36. The open end of one of the variable inductors 29a is connected to the input terminal 82 provided on the upper surface of the cover portion 23 via the signal wiring 26 and the through hole '. The open end of the other variable inductor 29b is connected to the input terminal 83 provided on the upper surface of the cover portion 23 via the signal wiring 26 and the through hole. Further, the open end of the variable capacitor 27 is connected to the output terminal 84 provided on the upper surface of the cover portion 23 via the signal wiring 26 and the through hole. Further, on the upper surface of the cover portion 23, the movable force generating portion 41 is formed on the variable capacitor 27 or each of the variable inductors 29 & 29, 29b in the same manner as in the second or third embodiment. When the element assembly 81 is used as a band pass filter, for example, as shown in FIG. 37, the control circuit 85 is connected to the respective drive terminals 44, 45, the signal source S1 is connected to the input terminal 82, and the signal source is connected. 82 is connected to the input terminal 83. Then, the control circuit 85 turns on and off the respective movable force generating portions 41 of the variable capacitor 27 and the variable inductors 29a and 29b. 132236.doc -28- 200917301 Each signal path A The pass frequency of B and B changes in the manner shown in FIG.

Here, the term "the active force generating portion 41" refers to a state in which a voltage is applied between the drive terminals 44 and 45 to deflect the cover portion 23 (the movable electrode 31 or 37). It means that no voltage is applied between the drive terminals 44 and 45, and the cover portion 23 (the movable electrode 31 or 37) is not deflected. Further, the signal path A refers to a signal number input from the input terminal 82 by the signal source 81, and a signal path output from the output terminal 84 through the variable inductor and the variable electric grid 27' on the left side toward the side of FIG. The signal path B is a signal input from the input terminal 83 by the signal source S2, and the signal path output from the output terminal 84 through the variable inductor 29b and the variable capacitor 27 on the right side in Fig. 36. Fal~Fa4, outer 丨~Fb4 are used to indicate whether the frequency is the same or different, and does not indicate a specific frequency 〇 according to the component assembly 81, as shown in FIG. 38, the signal passing through the signal paths A and B can be (Variation of the fifth embodiment) Fig. 39 is a plan view showing the element assembly of the fifth embodiment, and Fig. 4 is a plan (4) of the state in which the cover portion 23 is removed. The (fourth) set (4) is the component aggregate 81 of the fourth embodiment, and the switch % is further added. The switch 92 is inserted in series between the variable capacitor 27 and the variable inductor 29b as shown in Fig. 40. ~ Figure 41 (a) shows the switch off state. FIG. 41 is a view showing a state of a cross-sectional view of the structure of the switch 92. FIG. 41(b) shows a switch-on shape 132236.doc • 29-200917301 and a 疋 electrode 93' is separated from the back surface of the cover portion 23. A pair of movable electrodes 94a and 94b are provided at an opening distance, and the fixed electrode 93 and the movable electrodes 94a and 9 face each other to constitute a switch 92. Here, the end (active contact) of the movable electrode 94a is opposed to one end (fixed contact) of the solid electrode 93, and the end of the movable electrode 94b (active contact) and the other end of the fixed electrode % Part (fixed contact is opposed. In the normal state, as shown in Fig. 41 (a), the movable electrodes 94a, 9 are kept at an insulating distance from the fixed electrode 93, and therefore, the movable electrodes 94 & In this state, the switch 92 is kept in the off state. On the other hand, if the movable force generating material provided on the upper surface of the cover portion 23 in the switch region is turned on to cover, and the 卩23 is deflected, the movable electrodes 94a and 94b are deflected. Thereafter, the fixed electrode 93 is brought into contact with each other, and the movable electrodes 94 & 9 are placed in a conducting state via the fixed electrode 93. Therefore, the switch 92 is turned on. When the element assembly 91 is used as a band pass filter For example, as shown in Fig. 42, 'the control circuit 85 is connected to the respective drive terminals 44, 45, the signal source S1 is connected to the input terminal 82, and the signal source 82 is connected to the input terminal 83. Then, if it is controlled by the control circuit 85 Variable capacitor 27, variable power When the movable force generating portions 41 of the sensors 29a and 29b are turned on and off, and the switches 92 are turned on and off, the passing frequencies of the signal paths a and B are as shown in FIG. In this case, the "on-acting force generation unit 41" is a state in which a voltage is applied between the drive terminals 44 and 45 to deflect the cover portion 23 (the movable electrode 31 or 37), and the so-called disconnection force generation occurs. The portion 41 refers to a state in which no voltage is applied between the drive terminals 44 and 45, and the cover portion 23 (the movable electrode 3 1 or 37) is not deflected by the state of 132236.doc -30- 200917301. Further, the path 6 is indicated by the signal The source Si and the signal input from the input terminal 82 pass through the variable inductor 29a and the variable capacitor 27 on the left side of FIG. 36 and the signal path which is rotated from the output terminal 84. The signal path b is referred to by the signal source S2. The signal input from the input terminal 83 is output from the output terminal 84 through the variable inductor 29b on the right side and the variable capacitor 27 in Fig. 36. The frequency Fai~Fa4, Fbi~4 is used. To indicate whether the frequency is the same or different, not indicating According to the element assembly 91', as shown in Fig. 43, not only the pass frequency of the signal transmitted in the signal paths A, B but also the signal entering the input terminal 83 can be cut off. Fig. 44 (a) is a cross-sectional view showing a sixth embodiment of the present invention, showing a plan view of the movable electrode by removing the cover portion 23, and a plan view (4) showing a plan view of the fixed electrode. In the sixth embodiment, one element of the element assembly can be changed to the transformer 1 (H. In the variable transformer 101, as shown in Fig. 44 (c), the bottom surface of the concave portion 25 provided on the upper surface of the substrate 22 is provided with a shape. The fixed electrode 102 is serrated, and the signal wiring % is respectively extended from the both ends of the fixed electrode 102 to the upper surface of the substrate 22. Further, on the lower surface of the cover portion 23, a movable electrode 1?3 which is opposed to the fixed electrode 102 and has a serrated shape is provided, and the signal wiring 26 is respectively protruded from both ends of the movable electrode 103. The variable transformer 101 thus constructed, as shown in FIG. 45(a), acts as a secondary coil, for example, the magnetic flux 1〇4 generated in the movable electrode 1〇3 and the fixed electrode 102 on the secondary side are interlinked, Therefore, due to the alternating current on the flow side, the 2 132236.doc •31 - 200917301 human side produces a hunger voltage as the same function as the transformer ι〇5 of Fig. 45(b). Further, in the variable transformer (8), not only the ratio of the number of folds of the fixed electrode ι 2 and the movable electrode H) 3 (the number of the mineral teeth) but also the second side can be Voltage ratio or current ratio, etc., and the energy conversion of the variable transformer 1〇1 can be adjusted by using the movable force generating portion to move the movable electrode 103 to change the distance between the fixed electrode 1〇2 and the movable electrode ι〇3. effectiveness. (Embodiment 7) Fig. 4 (a) is a plan view showing a filter cartridge according to a seventh embodiment of the present invention, and Fig. 46 (b) is a cross-sectional view thereof. In this embodiment, as shown in Fig. 46 (b), a concave portion 25 is provided on the upper surface of the substrate 22, and a filter 111 is provided on the surface of the upper surface of the substrate 22 which is bonded to the upper surface of the substrate 22. The filter ln forms a film on the upper surface of the cover portion 23, and forms a piezoelectric film 113 on the upper surface of the movable electrode 112, and a terminal electrode ι4 on the movable electrode 112. A terminal electrode 115 is provided on the film 113. Further, it is not necessary to provide an electrode for the bottom surface of the concave portion or the back surface of the covering portion 23. In this manner, the filter 1U of the electrode (the ground electrode film 112 and the terminal electrode 115) is provided on both surfaces of the piezoelectric film 113, and is called an FBAR (fUm accoustic resonator) type filter. According to the filter 111, when the piezoelectric vibration is excited in the piezoelectric film 丨丨3 by the input signal, the cover portion 23 will resonate with the piezoelectric vibration when the signal and the natural vibration number of the cover portion 23 are equal. Vibration in the thickness direction. The selection 'only allows a signal having a frequency equal to the natural vibration number of the mask portion 23 to be transmitted 132236.doc -32- 200917301 between the terminal electrode m and the terminal electrode 115, so that it can be used as a signal erasing ferrite. Further, according to such a waver iu, it is possible to: a ferrite having a high Q value which causes a sharp change in frequency characteristics.

The chopper m is made into a batch production process as an activity generating unit with other components. That is, the ground electrode m and the piezoelectric film (1) of the filter 相同i丄 are the same as the ground electrode film 42, the movable force generating portion 41, the drive terminal 44, and the drive terminal 45 of the other elements. Here, the thickness of the covering portion 23 is made thin in this region so as not to attenuate the vibration of the filter ui until the thickness corresponds to the resonant frequency of the chopper 111. Further, the frequency of the vibration can be made by the depth of the concave portion 25. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of a prior art. Fig. 2 is a perspective view of a component assembly according to a third embodiment of the present invention. Fig. 3 is a perspective view showing a state in which the substrate is separated from the covering portion and a part of the substrate is broken in the component assembly according to the first embodiment of the present invention. Figure 4 is a cross-sectional view of the line χ_χ of Figure 2. Fig. 5 is a plan view showing a substrate used in the second embodiment. Fig. 6 (a) is a cross-sectional view showing a structure of a variable capacitor used in the first embodiment, and Fig. 6 (b) is a plan view showing a state in which the covering portion is removed. Fig. / (a) is a plan view showing a state in which the movable electrode is removed, and Fig. 7 (b) is a cross-sectional view in the direction orthogonal to Fig. 6 (a). Fig. 8(a) is a cross-sectional view showing a varistor structure according to a second embodiment. Fig. 8(b) is a plan view showing a state in which the covering portion is removed. 132236.doc -33- 200917301 Fig. 9(a) is a plan view showing a state in which the movable electrode is removed, and a cross-sectional view taken in the direction orthogonal to Fig. 8(a). Fig. 10 (a) is a cross-sectional view showing a structure of a variable inductor used in the first embodiment. Fig. 10 (b) is a plan view showing a state in which the covering portion is removed. Fig. 11 (a) is a plan view showing a state in which the movable electrode is removed, and Fig. 11 (b) is a cross-sectional view taken in the direction orthogonal to Fig. 1 (a). Fig. 12 is a cross-sectional view showing the structure of the end portion of the element assembly provided in the second embodiment, and the structure for connecting the circuit element array to the external connection terminal of the external circuit. Fig. 13 is a schematic view showing the principle of operation of the movable force generating unit. Fig. 14 is a schematic cross-sectional view showing a state in which the movable electrode of the variable capacitor is deflected by the movable force generating portion. Fig. 15 is a schematic cross-sectional view showing a state in which the movable electrode of the variable resistor is deflected by the movable force generating portion, and the high-resistance body is compressed. Fig. 16 is a view showing the reason why the change in the distance between the movable electrode and the fixed electrode of the variable inductor causes a change in inductance. Figs. 17(a) to 17(c) are views showing a substrate manufacturing step, and Figs. 17(d) to (7) are views showing a manufacturing step of the mask portion. Fig. 18 (a) to (e) are views showing a step of integrating a substrate and a cover portion to produce a variable capacitor. 19(a) to 19(f) are views showing a step of integrating a substrate and a cover portion to form a variable resistor. Figure 20 is a modification! A cross-sectional view of the variable capacitor. 132236.doc •34- 200917301 Figure 21 is a cross-sectional view of a modified example 2 99r .. + J I electric valley device. A cross-sectional view showing the state in which the movable force generating portion is not in the power generation. 8122(b) shows that the kinetic force generating unit is driven. Fig. 23(4) shows the kinetic energy generating unit in the dielectric state of the dielectric material in the case of driving in the second modification. The plan view 'Fig. 23(b) shows The kinetic force produces a plan view of the dielectric state of the M6.

Fig. 4(f) is a view showing a step of manufacturing a variable capacitor of the modification and the second embodiment without integrating the substrate and the covering portion. Fig. 25 is an exploded perspective view showing the component assembly of Modification 3. Fig. 26 (4) is a plan view showing the structure of one element in Modification 3, Fig. (1) is a sectional view of a line Y'Y of Fig. 26 (a), and Fig. 26 (4) is a sectional view of a line Ζ-Ζ of Fig. 26 (a). Fig. 27 (a) is a cross-sectional view showing a variable capacitor of a modification 4, and Fig. 27 (b) is a plan view showing a state in which the covering portion is removed. Fig. 28 is a cross-sectional view showing the structure of a component assembly in a fifth modification. Fig. 29 is a perspective view showing a component assembly according to a second embodiment of the present invention. Fig. 30 is an exploded perspective view showing the component assembly of the second embodiment of the present invention. Fig. 3 is an exploded perspective view showing a covering portion used in the component assembly of the second embodiment of the present invention. Fig. 32 is a plan view showing the component assembly of the second embodiment shown in a state in which the covering portion is separated. Fig. 33 is a plan view showing the element assembly of the third embodiment of the present invention. Fig. 34 is a plan view showing the element assembly of the third embodiment in a state in which the cover portion is removed. Fig. 3 is a plan view showing the element assembly of the fourth embodiment. Fig. 36 is a plan view showing the element assembly of the fourth embodiment in a state in which the covering portion is removed. Fig. 3 is a schematic view showing a signal connection state of the element assembly of the fourth embodiment.

Fig. 3 is a view showing a frequency of passage of each signal path after switching the movable force generating portion of each element in the element assembly of the fourth embodiment. Fig. 39 is a plan view showing the element assembly of the fifth embodiment. Fig. 40 is a plan view showing the element assembly of the fifth embodiment in a state where the covering portion is removed. Fig. 41 (a) is a cross-sectional view showing a switch structure used in the fifth embodiment, and Fig. 41 (b) is an explanatory view showing the operation thereof. Fig. 42 is a schematic view showing a signal connection state of the element assembly of the fifth embodiment. Fig. 43 is a view showing the frequency of passage of each signal path after the movable force generating portion of the fifth embodiment. Fig. 44 (4) shows a variable transformer y of the sixth embodiment of the present invention. Fig. 44 (b) is a plan view showing a state in which the covering portion is removed, and a plan view showing a state in which the movable electrode is removed. 45(4) and (b) are diagrams for explaining the variable transformer shown in Fig. 44. Θ I32236.doc -36- 200917301 Fig. 46 (a) is a plan view showing a filter according to a seventh embodiment of the present invention, and Fig. 46 (b) is a cross-sectional view thereof. [Main component symbol description]

21, 71, 76, 81, 91 component assembly 22 substrate 23 cover portion 25 recess 26 signal wiring 27 variable capacitor 28 variable resistor 29 ' 29a ' 29b variable inductor 30 fixed electrode 31 movable electrode 33 fixed electrode 34 Movable electrode 35 high-resistance body 36 fixed electrode 37 movable electrode 38, 39, 40 external connection terminal 38a, 39a, 40a through hole 41 movable force generating portion 42 ground electrode film 44, 45 drive terminal 46 drive wiring I32236.doc 37· 200917301 48 Stamper 49 Projection 53 Inkjet head 54 Elastic dielectric 56 Dielectric 57 > 58 External connection terminal 57a ' 58a Through hole 65 ' 66 Protrusion 67 Stopper 72 Input terminal 73 Output terminal 72a, 73a Through hole 74 Insulation film 92 Switch 101 Variable transformer 111 Tears 132236.doc -38-

Claims (1)

200917301 X. Patent application scope: A component assembly comprising: a resin substrate of a base portion; a component assembly covering a cover portion of the concave portion; and a force eight disposed in the concave portion An electrode is disposed on at least a portion of the concave back surface; and the covering portion includes the element including the electrode on the bottom surface of the concave portion and the covering surface of the concave portion facing the concave portion Pieces. The β is further divided into a plurality of elements. 2. The component assembly of claim 1, wherein the depth of the concave portion is different from the depth of the other concave portions. 3. The component assembly according to claim 1, wherein the covering portion is elastically bendable, and at least a part of the above-mentioned elements, the movable electrode provided on the back surface of the covering portion is provided on the bottom surface of the concave portion as a fixed electrode, and A variable capacitor is formed by two electrodes. 4. The component assembly according to claim 1, wherein the cover portion is elastically bendable, and at least a part of the elements are provided on an electrode provided on a back surface of the cover portion=active electric S, and an electrode provided on a bottom surface of the concave portion is a fixed electrode. And a variable resistor is formed by the two electrodes. 5. The component assembly of claim 1, wherein the cover portion is elastically bendable, and 132236.doc 200917301 is provided on the back surface of the cover portion as a movable electrode, and the bottom surface of the concave portion is formed by two electrodes. Variable inductor. And a component assembly according to claim 5, wherein the cover portion is elastically bendable, and the electrode is disposed on the back surface of the cover portion, and the electrode is provided on the bottom surface of the recess portion. To fix the electrode, and to hunt the two transformers to form a variable transformer. 1. The component assembly according to claim 1, wherein the covering portion is elastically bendable, and the plurality of the elements are disposed on the one of the covering bottom surfaces to provide a pair of the surface of the electrode # and the concave portion. The ridge is disposed on the top surface of the cover portion and the bottom surface of the concave portion _m core to correspond to a pair of the electrodes, and the ^ + = packet constitutes a switch. 8. The component assembly of claim 3, wherein at least one of said recesses is material. The P-cavity J is sealed with a high dielectric constant 9, such as the component assembly of claim 3, in which the movable electrode and the fixed projection are fixed. The U U electrodes are respectively provided with recesses or 10, such as the component assembly of claim 4, in which a high resistance body which is deformable between the movable electrode and the fixed electrode is disposed. 11. The component assembly of claim 5, wherein 132236.doc 200917301 is formed by one of the movable electrodes and one of the fixed electrodes. 12. The component assembly of claim 6, wherein the movable electrode and the fixed electrode are formed in a meandering shape. 13. The component assembly according to claim 1, wherein a stopper is provided on the back surface of the cover portion or the recessed portion of the substrate to prevent an electrode provided on the cover portion from coming into contact with an electrode provided on the surface of the recess portion. _ The element assembly according to claim 1, wherein a filter is provided on an upper surface of the covering portion, and the filter has electrodes formed on both surfaces of the piezoelectric film. The component assembly of claim 1, wherein the plurality of components are electrically connected to each other to form an array of circuit components. 16_ A method for producing a component assembly, comprising: a resin base comprising a plurality of recesses by hardening a stamper in a state of being pressed to a molten or softened state; a step of forming a fixed electrode on a bottom surface of the concave portion; a step of forming a movable electrode on a back surface of the covering portion; and covering the opening portion of the concave portion, the covering portion is disposed on an upper surface of the substrate, and is formed on a bottom surface of the concave portion A step of forming a plurality of elements including the electrodes between the back surface of the cover portion and the bottom surface of the recess portion. 132236.doc