200915054 九、發明說明： 【發明所屬之技術領域】 一本發明係涉及一種散熱裝置’尤其係涉及—種用於 子元件散熱之散熱裝置。 【先前技術】 —諸如電腦中央處理器、北橋晶片、顯卡等高功率電子 几件在運订時會產生大量之熱量，這些熱量如果不能被有 效地散去，將直接導致溫度急劇上升，而嚴重影響到電子 ^牛之正f運行。為此，需要散熱裝置來對這些電子元件 進行政熱’傳統之散熱裝置通常包括散熱器以及將散熱器 固定到電子元件上之扣具。 上述散熱裝置在使用時，先將散熱器裝設到電子元件 頂面上後，再利用扣具與相關元件或結構（例如電路板上之 孔洞)間之勾扣並緊抵住散熱器，而將散熱器緊密貼合到電 子元件上。參見美國專利第5,64〇,3〇5及5,428,897號等， 該-專利均揭示一扣具，其中’該扣具係由一金屬桿體彎 斤而成之，且该金屬桿體係另外通過一_^制在散埶器内 彈片之夹持作用而定位在散熱器上之。在這種十方式 中，該金屬桿體具有一水平抵壓部及從該抵壓部兩端大致 反=分別垂直彎折延伸而出之㈣，每—臂部之末端延伸 出—鉤扣部，通過鉤扣部與相關元件或結構間之勾扣，就 將散熱H緊密貼合到電子元件頂面上；該彈#之截面大致 呈V形，其彎折區域夾持住金屬桿體之抵壓部，而兩末端 200915054 緣則卡制在散熱器之散熱鰭片上。惟，常用之這種設計方 式而另外通過一彈片先夾持住金屬桿體之抵壓部，然後再 將該彈片及金屬桿體-起卡制定位在散熱器内，因此操作 上複雜、不方便且需要單獨成型該彈片，成本較高。 【發明内容】 有鑒於此，實有必要提供一種結構簡單、拆裝方便且 成本較低之散熱裝置。 種散熱裝置，用以對一電路板上之發埶電件 行散熱，其包括-散熱器以及-扣線，該散熱^包括一^ $以及形成於基座上之複數散熱鰭片，該散熱器上開設有 貝穿該等散熱鰭片之-容置槽，該容置槽傾斜於該底板之 相對兩侧邊，該扣線包括容置在該容置槽内之一主體及從 ，主體兩端並分別向該主體兩側反向延伸之二扣臂，該扣 臂分別位於該底板兩側，且其末端與電路板扣合。 上述扣線可由彈性金屬線彎折而成，其製造簡單且成 '本低，並且該扣線之使用操作簡單，無需相關工具輔助， 只需將扣線放置于該散熱器容置槽内，再先後旋轉該扣線 兩端之扣臂扣合到電路板上即可。 【實施方式】 圖1至圖2揭示本發明一優選實施例中之散熱裝置， ，、用於政發安裝於電路板（圖未示）上之電子元件（圖未示） :放之熱里’遠散熱裝置包括一散熱器忉以及用於將散熱 裔10固定到電路板上與電子元件貼合之一扣具組合2〇。 200915054 上述散熱器ίο由鋁、銅等高導熱材料一體形成，其包 括一大致呈矩形之底板12及從底板12垂直向上延伸之複 數散熱鰭片14。這些散熱鰭片14相互間隔且平行於底板 12之一對侧邊，其在靠近該兩侧邊位置各開設有兩間隔之 通槽140。這些通槽140分別靠近兩側，垂直於散熱鰭片 14，將靠近兩侧之散熱鰭片14切割成大致矩形之柱體。這 些散熱鰭片14之中間位置開設有傾斜貫穿這些散熱鰭片 14之一容置槽142，該容置槽142位於這些通槽140之間 並與這些通槽140成一小角度傾斜，該容置槽142用於與 該扣具組合20配合。 上述扣具組合20包括一扣線21和固定於該扣線21 — 侧之一操作件23。該扣線21可由彈性金屬線彎折而成，其 包括一主體210及連接於該主體210兩端之二扣臂212。該 主體210容置在該散熱器10之容置槽142内，其包括一限 定部2102及分別位於該限定部2102兩端之二抵壓部 2104。該限定部2102從該主體210中間突起並平行於該二 抵壓部2104，用於限定該主體210以至整個扣線21在該散 熱器10容置槽142内旋轉。該二扣臂212從該主體210兩 端分別向兩側反向並向上傾斜延伸，該二扣臂212均傾斜 於該主體210所在之平面，且當該主體210容置於該散熱 器10容置槽142内時，該二扣臂212均平行於該散熱器10 之散熱鰭片14。該二扣臂212之末端分別形成有一扣鉤 2120，該扣鉤2120係由該扣臂212末端向下彎折再彎曲向 内向上延伸而成，其用於與該電路板或固定在該電路板上 200915054 之扣環（圖未示）扣合而將該散熱器1 〇固定到該電路板上。 上述操作件23由塑膠材料一體形成，其包括一頂板 230及從該頂板230相鄰之兩侧邊緣垂直向下延伸之二側 板232。該兩側板232在它們之間之轉角處形成一缺口，其 内侧壁形成各形成平行該頂板230 —扣槽2320。 上述扣具組合20處於組裝狀態時，該扣線21之抵壓 部2104靠近扣臂212之一端及該扣臂212靠近該抵壓部 2104之一端分別緊密地容置在該操作件23側板232之扣槽 2320内，從而將該操作件23固定到該扣線21上。 如圖3和圖4所示，上述散熱裝置在使用時，該散熱 器10放置在電路板上，其底板12與電子元件接觸；該扣 具組合20放置在該散熱器10上，其扣線21主體210放置 在該散熱器10容置槽142内，該主體210之抵壓部2104 抵壓在該散熱器10容置槽142底面上；該扣線21 —端未 固定有操作件23之扣臂212向下旋轉使該扣臂212末端之 扣鉤2120扣到電路板上，再下壓該操作件23使另一扣臂 \+ 212向下旋轉後將該扣臂212末端之扣鉤2120扣到電路板 上，這樣散熱器10就被固定到該電路板之上。 由於該扣線21兩端之扣臂212均向下旋轉後固定，使 整個扣線21處於扭曲狀態，該扣線21之兩抵壓部2104在 彈性形變下向下抵壓散熱器10容置槽142之底面，從而使 該散熱器10保持向下緊貼電路板上之電子元件上。 由此可見，上述扣線21可由彈性金屬線彎折而成，其 9 200915054 製造簡單且成本低；並且該扣線21之使用操作簡單，無需 相關工具輔助，只需將扣線21放置於該散熱器1〇容置槽 142内，再先後旋轉該扣線21兩端之扣臂212扣合到電路 板上即可。此外，該散熱器之容置槽142相對散熱器1〇 兩側傾斜a又置，這樣能起到防止該散熱器1〇沿該扣線 方向移動之作用。 =上所述，本發明符合發明專利要件，爰依法提出專 ^:明淮，以上所述者僅為本發明之較佳實施例，舉凡 本案技蟄之人士’在爰依本發明精神所作之等效修飾 3交化，應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置實施例之一立體分解圖。 圖2係圖1所示散熱裝置之立體分解圖。 圖3係圖2所示散熱裝置之側視圖。 圖4係圖2所示散熱裝置之俯視圖。 【主要元件符號說明】 散熱器 10 散熱鰭片 14 容置槽 142 扣線 21 定部 2102 扣臂 212 操作件 23 底板 12 通槽 140 扣具組合 20 主體 210 抵壓部 2104 扣釣 2120 頂板 230 200915054 側板 232 扣槽 2320 11200915054 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, particularly to a heat dissipating device for dissipating heat of a sub-element. [Prior Art] - High-power electronic components such as computer central processing unit, north bridge chip, graphics card, etc. will generate a large amount of heat during the operation, if this heat can not be effectively dissipated, it will directly lead to a sharp rise in temperature, and serious It affects the operation of the electronic ^ cow. To this end, heat sinks are needed to heat these electronic components. Conventional heat sinks typically include a heat sink and a clip that secures the heat sink to the electronic component. When the heat dissipating device is used, the heat sink is first mounted on the top surface of the electronic component, and then the hook between the buckle and the related component or structure (such as a hole on the circuit board) is fastened and pressed against the heat sink. Attach the heat sink to the electronic components. See U.S. Patent Nos. 5,64, 3, 5, 5, 428, 897, and the like, each of which discloses a fastener in which the fastener is formed by a metal rod and the metal rod system is additionally passed. A _^ system is positioned on the heat sink by the clamping action of the elastic piece in the diffuser. In the ten-way manner, the metal rod body has a horizontal pressing portion, and the two ends of the pressing portion are substantially reversely bent and extended vertically (four), and the end of each arm portion extends out - the hook portion The heat dissipation H is closely attached to the top surface of the electronic component through the hook between the hook portion and the related component or structure; the cross section of the bullet # is substantially V-shaped, and the bent region holds the metal rod body The pressing part and the edge of the two ends 200915054 are stuck on the heat sink fins of the heat sink. However, the commonly used design method additionally holds the pressing portion of the metal rod body through a spring piece, and then the spring piece and the metal rod body are clamped and positioned in the heat sink, so the operation is complicated and not It is convenient and requires the molding of the shrapnel separately, which is costly. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink having a simple structure, convenient assembly and disassembly, and low cost. The heat dissipating device is configured to dissipate heat from a hairpin on a circuit board, and includes a heat sink and a buckle wire, and the heat sink includes a plurality of heat dissipating fins formed on the base, the heat dissipation The receiving device is provided with a receiving groove for the heat dissipating fins, and the receiving groove is inclined to the opposite side edges of the bottom plate, the buckle wire includes a main body and a slave body received in the receiving groove Two latching arms extending at opposite ends and oppositely extending to opposite sides of the main body, the latching arms are respectively located at two sides of the bottom plate, and the ends thereof are engaged with the circuit board. The buckle wire can be bent by an elastic metal wire, and the manufacturing process is simple and low, and the use of the buckle wire is simple and easy to operate, and the fastener wire is only required to be placed in the heat sink receiving groove. Then, the buckle arms at both ends of the buckle are rotated and fastened to the circuit board. 1 to 2 disclose a heat dissipating device in a preferred embodiment of the present invention, and an electronic component (not shown) for mounting on a circuit board (not shown): The 'extreme heat sink includes a heat sink and a combination of a clip for attaching the heat sink 10 to the circuit board and attaching the electronic components. 200915054 The heat sink ίο is integrally formed of a highly thermally conductive material such as aluminum or copper, and includes a substantially rectangular bottom plate 12 and a plurality of heat radiating fins 14 extending vertically upward from the bottom plate 12. The heat dissipating fins 14 are spaced apart from each other and are parallel to one of the side edges of the bottom plate 12, and two spaced apart slots 140 are formed adjacent to the two side edges. The through grooves 140 are respectively adjacent to the two sides, and perpendicular to the heat dissipation fins 14, the heat dissipation fins 14 near the two sides are cut into substantially rectangular columns. A receiving slot 142 is defined in the middle of the heat dissipating fins 14 . The receiving slot 142 is located between the slots 140 and is inclined at a small angle with the slots 140 . The slot 142 is for mating with the buckle assembly 20. The fastener assembly 20 includes a buckle 21 and an operating member 23 fixed to the side of the buckle 21 . The buckle wire 21 is formed by bending an elastic metal wire, and includes a main body 210 and two fastening arms 212 connected to opposite ends of the main body 210. The main body 210 is received in the receiving groove 142 of the heat sink 10. The fixing body 2102 includes a limiting portion 2102 and two pressing portions 2104 respectively located at opposite ends of the defining portion 2102. The defining portion 2102 protrudes from the middle of the main body 210 and is parallel to the two pressing portions 2104 for defining the main body 210 such that the entire buckle wire 21 rotates within the heat sink 10 receiving groove 142. The two fastening arms 212 are opposite to the two sides of the main body 210 and extend upwardly. The two fastening arms 212 are inclined to the plane of the main body 210, and when the main body 210 is received in the heat sink 10 The two fastening arms 212 are parallel to the heat dissipation fins 14 of the heat sink 10 when the slots 142 are disposed. The ends of the two fastening arms 212 are respectively formed with a hook 2120. The hook 2120 is bent downwardly and then bent inwardly and upwardly for the circuit board or fixed to the circuit. The buckle of the 200915054 (not shown) is fastened to fix the heat sink 1 该 to the circuit board. The operating member 23 is integrally formed of a plastic material and includes a top plate 230 and two side plates 232 extending vertically downward from adjacent side edges of the top plate 230. The two side plates 232 form a notch at a corner between them, and the inner side walls are formed to form parallel to the top plate 230 - a buckle groove 2320. When the buckle assembly 20 is in the assembled state, the pressing portion 2104 of the buckle 21 is adjacent to one end of the buckle arm 212 and the buckle arm 212 is closely received at one end of the pressing portion 2104 respectively on the side plate 232 of the operating member 23 The inside of the groove 2320 is fastened to fix the operating member 23 to the buckle 21. As shown in FIG. 3 and FIG. 4, when the heat dissipating device is in use, the heat sink 10 is placed on the circuit board, and the bottom plate 12 is in contact with the electronic component; the clip assembly 20 is placed on the heat sink 10, and the buckle is fastened. The main body 210 is placed in the receiving groove 142 of the heat sink 10. The pressing portion 2104 of the main body 210 is pressed against the bottom surface of the receiving groove 142 of the heat sink 10. The end of the fastening wire 21 is not fixed with the operating member 23 The buckle arm 212 is rotated downward to fasten the hook 2120 at the end of the buckle arm 212 to the circuit board, and then the operating member 23 is pressed down to rotate the other buckle arm \+ 212 downward, and the buckle end of the buckle arm 212 is buckled. The 2120 is snapped onto the board so that the heat sink 10 is secured to the board. Since the buckle arms 212 at both ends of the buckle wire 21 are rotated downward and fixed, the entire buckle wire 21 is in a twisted state, and the two pressing portions 2104 of the buckle wire 21 are pressed down against the heat sink 10 under elastic deformation. The bottom surface of the slot 142 is such that the heat sink 10 remains downwardly against the electronic components on the circuit board. It can be seen that the buckle wire 21 can be bent by an elastic metal wire, and the 9 200915054 is simple to manufacture and low in cost; and the use of the buckle wire 21 is simple and easy to operate, and the button wire 21 is only required to be placed thereon. The heat sink 1 is disposed in the slot 142, and the buckle arm 212 at both ends of the buckle 21 is sequentially fastened to the circuit board. In addition, the accommodating groove 142 of the heat sink is inclined with respect to both sides of the heat sink 1 ,, which can prevent the heat sink 1 移动 from moving in the direction of the buckle line. In the above, the present invention complies with the requirements of the invention patents, and the above is a special embodiment of the present invention. The above is only a preferred embodiment of the present invention, and the person skilled in the art is 'in accordance with the spirit of the present invention. Equivalent modification 3 cross-linking should be included in the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective exploded view of one embodiment of a heat sink device of the present invention. 2 is an exploded perspective view of the heat sink shown in FIG. 1. Figure 3 is a side view of the heat sink shown in Figure 2. 4 is a top plan view of the heat sink shown in FIG. 2. [Main component symbol description] Heat sink 10 Heat sink fin 14 accommodating groove 142 Buckle wire 21 Fixed portion 2102 Buckle arm 212 Operating member 23 Base plate 12 Through groove 140 Buckle combination 20 Main body 210 Pressing part 2104 Buckle fishing 2120 Top plate 230 200915054 Side plate 232 buckle groove 2320 11