TW200913806A - Integration device for printed circuit board - Google Patents

Integration device for printed circuit board Download PDF

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Publication number
TW200913806A
TW200913806A TW96132795A TW96132795A TW200913806A TW 200913806 A TW200913806 A TW 200913806A TW 96132795 A TW96132795 A TW 96132795A TW 96132795 A TW96132795 A TW 96132795A TW 200913806 A TW200913806 A TW 200913806A
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TW
Taiwan
Prior art keywords
board
hard
unit
pcb
soft
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TW96132795A
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Chinese (zh)
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TWI337512B (en
Inventor
Hui-Ying Kuo
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Everlight Electronics Co Ltd
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Application filed by Everlight Electronics Co Ltd filed Critical Everlight Electronics Co Ltd
Priority to TW96132795A priority Critical patent/TWI337512B/en
Priority to JP2007331399A priority patent/JP4884362B2/en
Publication of TW200913806A publication Critical patent/TW200913806A/en
Application granted granted Critical
Publication of TWI337512B publication Critical patent/TWI337512B/en

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Abstract

An integration device for printed circuit board including a flexible printed circuit (FPC) and a rigid printed circuit (RPC) is disclosed. The flexible printed circuit has a body, a FPC conductive unit and a FPC channel unit wherein the FPC conductive unit is formed on the body, and the FPC channel unit is set through the body. The rigid printed circuit has a first body and a second body which respectively has a conductive unit and a channel unit wherein each channel unit is set through each conductive unit. The first body and the second body are respectively positioned on the flexible printed circuit bilaterally to connect the channel units with each other.

Description

200913806 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種電路基板,且特別是有關於一種 接著穩固牢實的PCB軟硬板結合裝置。 【先前技術】 可動式機體的電子產品之產生’造就了軟板市場之開 發’例如:手機、筆記型電腦、數位相機(DSC : Digital鹽200913806 IX. Description of the Invention: [Technical Field] The present invention relates to a circuit board, and more particularly to a PCB hard and soft board bonding apparatus which is then firmly secured. [Prior Art] The generation of electronic products of the movable body has created the development of the soft board market. For example: mobile phones, notebook computers, digital cameras (DSC: Digital Salt)

Camara)以及數位攝影機(Dv : Digital Video)等電子產品。 在可動式機體方面’折疊式(Clamshell)或掀蓋式、 滑蓋式的電子產品的結構設計中,若以PCB軟板取代原有 的PCB硬板,可以有較好的產品表現與產品穩定度,但因 為軟板的生產難度高,且價格昂貴,所以一種軟硬板隨即 迎運而生,以滿足現今科計市場之需求。 另一方面,軟硬板在消費性電子產品中,以數位相 機、數位攝影機的應用最多,因為數位化的電子產品訊號 傳輸量較大,軟硬板可以有較好的訊號通路,而數位相機 與數位攝影機的設計趨向於小體積且高耐用性,盡量減少 接點組裝所造成的不良率,所以軟硬板亦是合適的零件。 傳統的軟硬板結合技術,單純將軟板與硬板利用金屬 墊(Pad)作表面銲結,此一單結合界面的固定方式,容易因 活動頻繁而被扯斷。為避免被扯斷,在生產當時,亦有業 者利用銲固、膠合同步來定位,但是,實際使用下,還是 容易脫離,穩定度不甚良好。 200913806 【發明内容】 因此本發明的目的就是在提供一種PCB軟硬板結合 裝置,藉以孔(Via)對孔(Via)的結合方式,使軟硬板壓合成 一體,可強化軟硬板整體結合的應力,並可提高產品品質。 根據本發明所提出之一種PCB軟硬板結合裝置,包含 一 PCB軟板與一 PCB硬板。 該PCB軟板,包含一軟板本體、一軟板導體單元以及 一軟板通道單元,該軟板導體單元形成於該軟板本體上, 該軟板通道單元係貫穿該軟板本體。 該PCB硬板,包含一第一硬板本體與一第二硬板本 體,該第一硬板本體包含一第一導體單元以及一第一通道 單元,該第一通道單元係貫穿該第一硬板本體;該第二硬 板本體包含一第二導體單元以及一第二通道單元,該第二 通道單元係貫穿該第二硬板本體;該第一硬板本體與該第 二硬板本體對夾於該PCB軟板兩側,使該PCB軟板之通 道單元對應於該第一硬板本體的第一通道單元與該第二 硬板本體的第二通道單元,相鄰接的通道單元中並設有一 接合材料用以將兩者固接為一體。 根據本發明所提出之另一種PCB軟硬板結合裝置,包 含一 PCB軟板與一 PCB硬板。 該PCB軟板,包含一軟板本體、一軟板導體單元以及 一軟板墊體單元,該軟板導體單元與該軟板墊體單元相連 接,並且形成於該軟板本體上;以及 200913806 該PCB硬板,包含一第一硬板本體與一第二硬板本 體,該第一硬板本體包含一第一導體單元以及一第一墊體 單兀,該第一導體單元與該第一墊體單元相連接,並且形 成於該弟一軟板本體上;該第二硬板本體包含一第二導體 單元以及一第二墊體單元,該第二導體單元與該第二墊體 單元相連接,並且形成於該第二軟板本體上;該第一硬板 本體與該第二硬板本體對夾於該PCB軟板兩側,使該pcb 軟板之通道單元對應於該第一硬板本體的第一通道單元 與該第二硬板本體的第二通道單元’相鄰接的通道單元中 並設有一接合材料用以將兩者固接為一體。 本發明藉以孔(Via)對孔(Via)或金屬墊(pad)對金屬塾 (Pad)的結合方式,讓軟硬板相互銲結,可強化整體結合的 應力’且可保護電路’不會因板材過軟而造成斷路,故可 降低軟硬板製作上的困難及不良率,相對地可提高產品品 質。 【實施方式】 參照第1圖之平面分解圖與第2圖之組合平面圖,本 發明之PCB軟硬板結合裝置的第一實施例,包含一 PCB 軟板100與一 PCB硬板200。在此實施例中,此PCB硬板 200是用來載設多數發光二極體(LED),圖未揭示》 參照第1圖、第2圖與第3圖之組合剖視圊,該PCB 軟板100包含一軟板本體110、一第一連結端120、一第二 連結端130、一軟板導體單元140以及一軟板通道單元 200913806 150(Via)。 參照第1圖、第2圖與第4圖,此第4圖係為第3圖 中局部放大之詳細剖視圖。該第一連結端12〇供 ㈣硬板該第二連結端⑽為—金手指,、供連結= 電子產品的電路板上(圖未揭示)。該軟板導體單元^仂是 多數個形成於該軟板本體110上的Lay〇m佈局,並且連接Camara) and electronic products such as digital video cameras (Dv: Digital Video). In the structural design of the movable body, the Clamshell or the cover type and the slide type electronic product, if the PCB hard board is used to replace the original PCB hard board, the product performance and product stability can be better. Degree, but because the production of soft boards is difficult and expensive, a kind of soft and hard board will be born to meet the needs of today's scientific market. On the other hand, soft and hard boards are the most widely used digital cameras and digital cameras in consumer electronics. Because digital electronic products transmit a large amount of signals, soft and hard boards can have better signal paths, and digital cameras. The design of the digital camera and the digital camera tends to be small in size and high in durability, and the defect rate caused by the assembly of the contacts is minimized, so the soft and hard board is also a suitable part. The traditional soft and hard board bonding technology simply uses a metal pad (Pad) for surface soldering of the soft board and the hard board. This single joint interface is easy to be broken due to frequent activities. In order to avoid being torn off, at the time of production, some companies used welding and gluing to synchronize the positioning. However, under actual use, it was easy to disengage and the stability was not good. Therefore, the object of the present invention is to provide a PCB soft and hard board bonding device, by means of a combination of a Via and a Via, to integrate the soft and hard boards into one, and to strengthen the overall combination of the soft and hard boards. Stress and improve product quality. A PCB soft and hard board bonding apparatus according to the present invention comprises a PCB flexible board and a PCB hard board. The flexible board of the PCB comprises a flexible board body, a flexible board conductor unit and a flexible board channel unit. The flexible board conductor unit is formed on the flexible board body, and the flexible board channel unit extends through the flexible board body. The PCB hard board includes a first hard board body and a second hard board body, the first hard board body includes a first conductor unit and a first channel unit, and the first channel unit runs through the first hard unit The second hard plate body includes a second conductor unit and a second channel unit, the second channel unit extends through the second hard plate body; the first hard plate body and the second hard plate body pair Sandwiching on both sides of the PCB flexible board, the channel unit of the PCB flexible board corresponding to the first channel unit of the first hard board body and the second channel unit of the second hard board body, adjacent to the channel unit A bonding material is provided to secure the two together. Another PCB soft and hard board bonding apparatus according to the present invention comprises a PCB flexible board and a PCB hard board. The PCB flexible board comprises a flexible board body, a flexible board conductor unit and a soft board body unit, the soft board conductor unit is connected to the soft board body unit and formed on the soft board body; and 200913806 The PCB hard board includes a first hard board body and a second hard board body, the first hard board body includes a first conductor unit and a first mat body, the first conductor unit and the first The pad unit is connected to the body of the soft board; the second board body comprises a second conductor unit and a second body unit, the second conductor unit and the second body unit Connecting and forming on the second flexible board body; the first hard board body and the second hard board body are opposite to each side of the PCB flexible board, so that the channel unit of the pcb flexible board corresponds to the first hard A channel material adjacent to the first channel unit of the board body and the second channel unit of the second hard board body is provided with a bonding material for fixing the two together. The invention combines the Via (Via) or the metal pad (Pad) with the hole (Via) or the metal pad (Pad), so that the soft and hard plates are welded to each other, which can strengthen the overall combined stress 'and protect the circuit' Due to the softness of the sheet, the circuit can be broken, so that the difficulty in manufacturing the soft and hard board and the defect rate can be reduced, and the product quality can be relatively improved. [Embodiment] Referring to the combined plan view of the plan view and Fig. 2 of Fig. 1, the first embodiment of the PCB soft and hard board bonding apparatus of the present invention comprises a PCB flexible board 100 and a PCB hard board 200. In this embodiment, the PCB hard board 200 is used to mount a plurality of light-emitting diodes (LEDs), and the figure is not disclosed. Referring to the combination of FIG. 1 , FIG. 2 and FIG. 3 , the PCB is soft. The board 100 includes a flexible board body 110, a first connecting end 120, a second connecting end 130, a flexible board conductor unit 140, and a soft board channel unit 200913806 150 (Via). Referring to Fig. 1, Fig. 2, and Fig. 4, this Fig. 4 is a detailed cross-sectional view of a portion enlarged in Fig. 3. The first connecting end 12 is provided with a (four) hard board, the second connecting end (10) is a gold finger, and is connected to a circuit board of an electronic product (not shown). The flexible board conductor unit is a plurality of Lay〇m layouts formed on the flexible board body 110, and connected

Ο 在該第一連結端120與該第二連結端13〇之間。該軟板通 道單元150為多數個貫穿該軟板本體1〇〇之一穿孔16〇的 金屬管。 參照第1圖、第2圖與第3圖,該PCB硬板2〇〇包含 一第一硬板本體300與一第二硬板本體4〇〇。此pCB硬板 300的材質可為型號fr_4、FR-5的玻璃纖維。 參照第1圖、第2圖與第4圖’該第一硬板本體3〇〇 包含一第一導體單元310以及一第一通道單元320(Via)。 該第一導體單元310係形成於該第一硬板本體3〇〇上的 LAYOUT佈局。在本實施例中,該第一通道單元32〇為多 數個貫穿該第一硬板本體300之一穿孔301的金屬管。 該第二硬板本體400包含一第二導體單元410以及一 第二通道單元420(Via)。該第一導體單元410係形成於該 第二硬板本體400上的Layout佈局。在本實施例中,該第 二通道單元420為多數個貫穿該第二硬板本體400之一穿 孔401的金屬管。 整體組合結構,是將該第一硬板本體300與該第二硬 板本體400對夾於該PCB軟板100兩侧,使該PCB軟板 200913806 100之第一連結端120上的通道單元15〇對應於該第一硬 - 板本體300的第一通道單元320與該第二硬板本體4〇〇的 • 第二通道單元42〇,讓PCB軟板100與PCB硬板2〇〇壓合 在一起°〇 between the first connecting end 120 and the second connecting end 13〇. The flexible board channel unit 150 is a plurality of metal tubes penetrating through a 16 穿孔 of one of the flexible board bodies 1 . Referring to Figures 1, 2 and 3, the PCB hard board 2 includes a first hard board body 300 and a second hard board body 4''. The material of the pCB hard plate 300 can be glass fiber of the models fr_4 and FR-5. Referring to Figures 1, 2 and 4, the first rigid plate body 3A includes a first conductor unit 310 and a first channel unit 320 (Via). The first conductor unit 310 is formed on the LAYOUT layout of the first hard plate body 3〇〇. In this embodiment, the first channel unit 32 is a plurality of metal tubes penetrating through the through holes 301 of the first hard plate body 300. The second rigid board body 400 includes a second conductor unit 410 and a second channel unit 420 (Via). The first conductor unit 410 is a layout layout formed on the second hard board body 400. In this embodiment, the second channel unit 420 is a plurality of metal tubes extending through the through hole 401 of the second hard plate body 400. The overall combination structure is that the first hard board body 300 and the second hard board body 400 are opposite to each other on the two sides of the PCB flexible board 100, so that the channel unit 15 on the first connecting end 120 of the PCB flexible board 200913806 100 〇 corresponds to the first channel unit 320 of the first hard-board body 300 and the second channel unit 42〇 of the second hard-board body 4〇〇, so that the PCB flexible board 100 and the PCB hard board 2 are pressed together Together

此等通道單元150、320、420相互對應,並藉由一接 合材料500(錫料)將該PCB軟板1〇〇之軟板通道單元15〇 與該第一硬板本體300之第一通道單元320與該第二硬板 〇 本體400之第二通道單元420黏接為一體,此時,該pCB 軟板100之第一連結端12〇與該PCB硬板2〇〇之黏結處, 將會留下孔洞《當然,此接合材料5〇〇亦可成為一實心導 體以將此等通道單元150、320、42〇固結成一體,圖未揭 7f\ 〇 據上可知,本發明採以軟硬板結合,不但可降低耗材 問,以降低製造成本。而在電路Lay0ut導體單元時,將 軟板與硬板分開設計,藉以在結合處以孔對孔的對夾結 〇 合’並將硬板與軟板壓合固定,最後再施以接合材料固 以構成穩疋牢實的結合關係,一來可保護電路,不會 因為板材過軟而造成斷路;二來可降低軟硬板製作上的困 難度與不良率。 參照第5圖與第6圖,此第6圖係為第5圖中局部放 大之詳細剖視圖。本發明之PCB軟硬板結合裝置的第二實 施例’包含—pCB軟板1 〇〇與一 PCB硬板200。 在此實施例中,與第一實施例不同的地方,只是將通 道單元(Via)改為金屬墊(Pad)的結構,整體結合上,是將該 200913806 第一硬板本體300與該第一硬板本體400’對夾於該pcB 軟板100兩側,使該PCB軟板1〇〇之一墊體單元15〇,對應 於該第一硬板本體300,的一第一墊體單元32〇,與該第二 硬板本體400’的一第二墊體單元42〇,,讓pcB軟板1〇〇 與PCB硬板200壓合在一起。 在封裝上,再配合適量接合材料5〇〇將該pcB軟板 100之墊體150’與該第一硬板本體300,之第一墊體單元 320’與該第二硬板本體400’之第二墊體單元42〇,黏接為一 體,此時,該PCB軟板1〇〇與該PCB硬板2〇〇將以金屬 墊(Pad)對金屬墊(Pad)結合方式組合在一起。至於此第二實 施例預期可達成的功效與第一實施例相同,不再贅述。 歸納上述,有鑒於傳統完全使用軟板之價昂的缺點, 以及相較於傳統軟硬板結合容易扯斷的缺點;本發明軟硬 板材結合下,不但可大幅降低製造、材料成本,而且本案 以孔(Via)對孔(Via)或金屬墊(Pad)對金屬墊(pad)的結合方 式,可強化整體結合的應力,且可保護電路,不會因板材 過軟而造成斷路,故可降低軟硬板製作上的困難及不良 率,相對地可提高產品品質。 雖然本發明已以二個實施例揭露如上,然其並非用以 限定本發明,任何熟習此技藝者,在不脫離本發明之精神 和範圍内,當可作各種之更動與潤飾,因此本發明之保護 庫&圍▲視後附之申請專利範圍所界定者為準。 “ 【圖式簡單說明】 200913806 之上述和其他目的、特徵、優點與實施例 所附圖式之詳細說明如下: 第1圖係為本發明第-實施例的PCB軟硬板結合裝置 的平面分解圖。 第2圖係為該第一實施例的組合正面圖。 第3圖係為該第—實施例之組合剖視圖。The channel units 150, 320, and 420 correspond to each other, and the flexible board channel unit 15 of the PCB board is folded into the first channel of the first board body 300 by a bonding material 500 (tin). The unit 320 is integrally bonded to the second channel unit 420 of the second hard board body 400. At this time, the first connecting end 12 of the pCB board 100 and the PCB board 2 are bonded to each other. The hole will be left. "Of course, the bonding material 5〇〇 can also be a solid conductor to solidify the channel units 150, 320, 42〇 into one body. Figure 7f is not disclosed. The combination of hard boards not only reduces consumables, but also reduces manufacturing costs. In the case of the circuit Lay0ut conductor unit, the soft board and the hard board are separately designed, so that the pair of holes and holes of the hole are combined at the joint, and the hard board and the soft board are pressed and fixed, and finally the joint material is applied. It constitutes a stable and solid combination, which can protect the circuit, and will not cause the circuit breaker to be broken due to the softness of the board; secondly, it can reduce the difficulty and defect rate in the production of soft and hard boards. Referring to Figures 5 and 6, this sixth drawing is a detailed cross-sectional view of the partial enlargement in Figure 5. The second embodiment of the PCB flexible board bonding apparatus of the present invention includes a -pCB board 1 and a PCB board 200. In this embodiment, the difference from the first embodiment is that the channel unit (Via) is changed to the structure of the metal pad. The overall combination is the first hard plate body 300 of the 200913806 and the first The hard board body 400 ′ is sandwiched between the two sides of the pcB flexible board 100 , so that the one of the PCB board 1 is corresponding to the first board unit 32 of the first board body 300 . Then, with the second pad unit 42 of the second rigid board body 400', the pcB flexible board 1 is pressed together with the PCB hard board 200. The package body is further provided with a suitable amount of bonding material 5, the pad body 150' of the pcB flexible board 100 and the first hard board body 300, the first pad unit 320' and the second hard board body 400' The second pad unit 42 is bonded and integrated. At this time, the PCB board 1 and the PCB board 2 are combined by a metal pad (Pad) to a metal pad (Pad). The achievable effects of this second embodiment are the same as those of the first embodiment and will not be described again. In summary, in view of the shortcomings of the traditional use of soft boards, and the disadvantages of easy tearing compared with the combination of traditional soft and hard boards; the combination of soft and hard boards of the invention can not only greatly reduce the manufacturing and material costs, but also the case The combination of a Via or a metal pad to a metal pad can strengthen the overall bonding stress and protect the circuit from being broken due to the softness of the board. Reduce the difficulty and non-performing rate of soft and hard board production, and relatively improve product quality. Although the present invention has been disclosed in the above two embodiments, it is not intended to limit the present invention, and the present invention can be modified and retouched without departing from the spirit and scope of the present invention. The protection library & 围 ▲ 视 视 。 。 。 。 。 。 。 。 。 。 。 。 。 。 BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention are described in detail as follows: FIG. 1 is a planar decomposition of a PCB soft and hard board bonding apparatus according to a first embodiment of the present invention. Fig. 2 is a front view of the combination of the first embodiment. Fig. 3 is a sectional view of the combination of the first embodiment.

為讓本發明 能更明顯易懂, 第4圖係為第3圖中局部結構的詳細剖視圖。 第5圖係為本發明第二實施例之組合剖視圖。 第6圖係為第5圖中局部結構的詳細剖視圖。 【主要元件符號說明】 100 : PCB軟板 110 :軟板本體 120 : 第一連結端 130 :第二連結端 140 : 導體單元 150 :通道單元 160 : 穿孔 200 : PCB 硬板 300 : 第一硬板本體 300’ :第一硬板本體 301 : 穿孔 310 :第一導體單元 320 : 第一墊體單元 320’ :第一通道單元 400 : 第二硬板本體 400’ :第二硬板本體 401 : 穿孔 410 :第二導體單元 420 : 第二墊體單元 420’ :第二通道單元 500 : 接合材料In order to make the present invention more apparent, Fig. 4 is a detailed cross-sectional view of the partial structure in Fig. 3. Figure 5 is a cross-sectional view of the combination of the second embodiment of the present invention. Figure 6 is a detailed cross-sectional view of the partial structure in Figure 5. [Main component symbol description] 100 : PCB flexible board 110 : Soft board body 120 : First connection end 130 : Second connection end 140 : Conductor unit 150 : Channel unit 160 : Perforation 200 : PCB Hard board 300 : First hard board The body 300': the first hard plate body 301: the through hole 310: the first conductor unit 320: the first pad body unit 320': the first channel unit 400: the second hard plate body 400': the second hard plate body 401: perforated 410: second conductor unit 420: second pad unit 420': second channel unit 500: bonding material

Claims (1)

200913806 十、申請專利範圍: 1. 一種PCB軟硬板結合裝置,包含: 一 PCB軟板,包含一軟板本體、一軟板導體單元以及 一軟板通道單元,該軟板導體單元形成於該軟板本體上, 該軟板通道單元係貫穿該軟板本體;以及 一 PCB硬板,包含一第一硬板本體與一第二硬板本 體,該第一硬板本體包含一第一導體單元以及一第一通道 單元’該第一通道單元係貫穿該第一硬板本體;該第二硬 板本體包含一第二導體單元以及一第二通道單元,該第二 通道單元係貫穿該第二硬板本體;該第一硬板本體與該第 二硬板本體對夾於該PCB軟板兩侧,使該PCB軟板之通 道單元對應於該第一硬板本體的第一通道單元與該第二 硬板本體的第二通道單元,相鄰接的通道單元中並設有一 接合材料用以將兩者固接為一體。 2. 如申請專利範圍第1項所述之PCB軟硬板結合裝 置,其中,該PCB軟板的軟板通道單元是一套穿在該軟板 本體之一穿孔的金屬管。 3·如申請專利範圍第1項所述之PCB軟硬板結合裝 置其中,该第一硬板本體的第一通道單元是一套穿在該 第一硬板本體之-穿孔的金屬管。 12 200913806 4. 如申請專利範圍第1項所述之pCB軟硬板結合裝 置,其中,該第二硬板本體的第二通道單元是一套穿在該 第二硬板本體之一穿孔的金屬管。 5. 如申請專利範圍第1項所述之pCB軟硬板結合裝 置,其中,該接合材料為錫料。 6. —種PCB軟硬板結合裝置,包含: 一 PCB軟板,包含一軟板本體、一軟板導體單元以及 一軟板塾體單元,該軟板導體單元與該軟板塾體單元相連 接’並且形成於該軟板本體上;以及 一 PCB硬板,包含一第一硬板本體與一第二硬板本 體’該第一硬板本體包含一第一導體單元以及一第一墊體 單元’該第一導體皁元與該第一塾體單元相連接,並且形 成於該第一軟板本體上;該第二硬板本體包含一第二導體 單元以及一第二墊體單元,該第二導體單元與該第二墊體 單元相連接,並且形成於該第二軟板本體上;該第一硬板 本體與該第二硬板本體對夾於該PCB軟板兩側,使該pcb 軟板之通道單元對應於該第一硬板本體的第一通道單元 與該第二硬板本體的第二通道單元’相鄰接的通道單元中 並設有一接合材料用以將兩者固接為一體。 7. 如申請專利範圍第6項所述之PCB軟硬板結合裝 置,其中’該第一硬板本體的第一墊體單元與該第二硬板 13 200913806 本體的第二墊體單元皆為一種金屬墊。 8.如申請專利範圍第6項所述之PCB軟硬板結合裝 置,其中,該接合材料為錫料。 十一、圖式: 如次頁200913806 X. Patent application scope: 1. A PCB soft and hard board bonding device, comprising: a PCB flexible board comprising a soft board body, a soft board conductor unit and a soft board channel unit, wherein the soft board conductor unit is formed The flexible board body extends through the flexible board body; and a PCB hard board includes a first hard board body and a second hard board body, the first hard board body includes a first conductor unit And a first channel unit extending through the first hard plate body; the second hard plate body includes a second conductor unit and a second channel unit, the second channel unit extending through the second The first hard board body and the second hard board body are opposite to each other on the two sides of the PCB flexible board, so that the channel unit of the PCB flexible board corresponds to the first channel unit of the first hard board body and the The second channel unit of the second hard board body is provided with a bonding material in the adjacent channel unit for fixing the two together. 2. The PCB soft and hard board bonding apparatus according to claim 1, wherein the soft board channel unit of the PCB board is a set of metal tubes pierced in one of the board bodies. 3. The PCB soft and hard board bonding apparatus according to claim 1, wherein the first channel unit of the first hard board body is a set of perforated metal tubes penetrating the first board body. The pCB soft and hard board bonding device according to the first aspect of the invention, wherein the second channel unit of the second hard board body is a set of metal pierced through one of the second hard board bodies tube. 5. The pCB soft and hard board bonding apparatus according to claim 1, wherein the bonding material is a tin material. 6. A PCB soft and hard board bonding apparatus comprising: a PCB flexible board comprising a flexible board body, a flexible board conductor unit and a flexible board body unit, the flexible board conductor unit and the soft board body unit Connecting and forming on the flexible board body; and a PCB hard board comprising a first hard board body and a second hard board body. The first hard board body comprises a first conductor unit and a first mat body The first conductor soap element is connected to the first body unit and formed on the first flexible board body; the second hard board body comprises a second conductor unit and a second body unit, The second conductor unit is connected to the second pad unit and formed on the second flexible board body; the first hard board body and the second hard board body are opposite to each side of the PCB flexible board, so that the second conductor unit The channel unit of the pcb flexible board corresponds to the channel unit adjacent to the first channel unit of the first hard board body and the second channel unit of the second hard board body, and is provided with a bonding material for fixing the two Connected together. 7. The PCB soft and hard board bonding apparatus according to claim 6, wherein the first body unit of the first hard board body and the second body unit of the second hard board 13 200913806 body are A metal mat. 8. The PCB soft and hard board bonding apparatus of claim 6, wherein the bonding material is a tin material. XI. Schema: as the next page 1414
TW96132795A 2007-09-03 2007-09-03 Intergration device for printed circuit board TWI337512B (en)

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Application Number Priority Date Filing Date Title
TW96132795A TWI337512B (en) 2007-09-03 2007-09-03 Intergration device for printed circuit board
JP2007331399A JP4884362B2 (en) 2007-09-03 2007-12-25 Rigid flex printed wiring board coupling device

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Application Number Priority Date Filing Date Title
TW96132795A TWI337512B (en) 2007-09-03 2007-09-03 Intergration device for printed circuit board

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TWI337512B TWI337512B (en) 2011-02-11

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03262195A (en) * 1990-03-12 1991-11-21 Sharp Corp Manufacture of composite multilayer printed wiring board
US5359767A (en) * 1993-08-26 1994-11-01 International Business Machines Corporation Method of making multilayered circuit board
JP2005109299A (en) * 2003-10-01 2005-04-21 Fujikura Ltd Multilayer wiring board and its manufacturing method
WO2004093508A1 (en) * 2003-04-18 2004-10-28 Ibiden Co., Ltd. Rigid-flex wiring board

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