200911705 -- 九、發明說明： .【發明所屬之技術領域】 本發明涉及一種用於模造光學鏡片之模仁，尤其涉及 一種可控制成型精度之模仁。 【先前技術】 模仁廣泛應用於模壓成型製程，特別係用於製造光學 鏡片產品，如非球面光學鏡片、球透鏡、棱鏡等，採用直 接模壓成型（Direct Press-molding)技術可直接生產高品質 之光學鏡片產品（請參見 “Quartz Glass Molding by Precision Glass Molding Method55, Trans. IEE Jpn., pp. 494-497, 2002)，而且無需打磨、拋光等後續加工步驟，可大大提高 生產效率和產量。 模造光學鏡片成型時，多以控制壓縮行程決定冷卻時 機，但將高溫高壓轉變為室溫常壓必須經過缓慢之過程， 這樣一來光學鏡片之最終尺寸與冷卻點之理想尺寸會有一 定之偏差。一般方法係通過經驗值補正偏差，惟，隨機台 狀況及操作方法之不同需要經常進行調整，光學鏡片之精 度無法得到保證。 【發明内容】 有鑒於此，提供一種可控制成型精度之模仁實為必要。 一種模造光學鏡片之模仁，其包括模仁基底，該模仁 基底具有一模壓面。該模壓面上具有一壓電陶竞層，該壓 電陶瓷層與一控制其發生機械形變之外部電路相連接。 由於壓電陶瓷之尺寸變化範圍通常於奈米級至微米級 5 200911705 之間，因此於模麼面上設置壓電陶瓷層可實現比一般機械 控制具有更高精密度之尺寸偏差補償。且壓電陶兗具有車交 高之機械強度、硬度及韌性，可承受模造光學鏡片製程中 之南溫尚壓。 【實施方式】 請參閱圖1，第一實施例提供一種模造光學鏡片之模 。該模仁10包括模仁基底11，該模仁基底U具有—模 壓面110,該模壓面110之部分呈凹陷之圓弧面，該凹陷之 圓弧面限定一型腔111。於本實施例中，該型腔U1之表面 呈凹陷之圓弧面，當然也可根據欲模造之光學鏡片之形狀 而"又计型腔111表面之形狀，例如凹陷或突起之非球面、 圓球面等。 該模仁基底11可由高強度之超硬化合金、碳化物陶： (例如碳化鎢）或金屬陶瓷製成。 3 於本實施例中，該模壓面11G上進—步具H 竟層仏該壓電陶兗·層12與—控制其發生機械形變之^ 電路二相連接。該壓姆層12之材料主要選 d〇3)、鈦酸錯（PbTi〇3)、結鈦酸錯（pbzrTi〇3)等壓1 竞材料。該壓電嶋12也可是銳 ' 系壓電陶瓷等。 私网更’二7| 該壓電陶莞層12可通過黏接、鎮套 壓面110固定於一起。通過卜 一 方法與指 _ a 上述方法製成模仁10首务+ f 通過燒結方法製成廢電陶莞層12 先而要 上述壓電陶瓷材料中之—種 〈：’百先’將 種次成種均勻混合；然後將混合 200911705 之物料20置於第一模仁21中，該第一模仁2i具有與上述 型腔111表面形狀相同之型腔211，且該型腔211比型腔m 立曰加了一疋之深度，所增加之深度等於壓電陶瓷層之厚 度。請一併參見圖3 1第二模仁22施以壓力於第一模仁 21内之物料20,該第二模仁22具有與第一模仁型腔2ιι 形狀2全吻合之模壓面22〇，將初步擠壓成型之物料2如放 置於高溫中進行燒結，從而形成壓電陶曼層12;利用微細 加工雕卿成所需光學透鏡曲面；最後將壓電陶莞層^通 過黏接、鑲套、焊接等方法與模壓面110固定。 另外，也可將模仁基底11與壓電陶瓷層12 —同進行 燒結，形成模仁10。請參閱圖4，首先將模仁基底U之材 ;斗30(例如以奴化鎢為主之超硬材料微粒）先置於第一模仁 31上’ji用第二模仁32施以壓力於第一模仁31上之材料 30 ’該第二模仁32具有與型腔m形狀完全吻合之模壓面 物料：上刪陶刪中之一種或幾種均勾混合後之 底材料30之上（參見圖5)，再用第三模仁34 仁模仁31内之物料33(參見圖6)，該第三模 r f "型腔111形狀完全吻合之模壓面340 ;將初半 背垄成型之物體放置於高溫中進行燒έ士，從而形#I少 庙11伽两& 仗而形成杈仁基 工雕列；Τ Α層12相結合之模仁⑴最後利用微細加 工雕刻形成所需光學透鏡曲面。 麼加陶究材料本身機械和電性耗合作用，外部電 ;1電陶瓷層12產生電場就會使壓 機械形變。合訪厭*险卞& _ 一义全电㈣尤層12產生 田以電陶竞層12受外部控制電路所加之電場 200911705 用f ’其電偶極矩會被拉長或縮短，該屢電陶莞層u會 ^電场方向伸縮。於本實施例中，外部電塵所產生之外 電場之方向優選為使賴仁1G製造鏡片時壯ig ^ 方向’―般與模造過程中模仁1G移動之方向相同 陶竟層12將會隨著外加電屢值大小而改變厚度，外加電】 越大，壓電陶瓷層12之厚度也合 要控制電塵大小控制墨電嶋12之尺°、虞實際需 與第==::==之— 於 姊10之》。構基本相同’其區別僅在 層43 Μ及塵電陶究層42之間進一步形成一中間 S 3 43起增強結合性之作用，使模仁基底41與 口m屬層42緊密結合，提高穩定性，中間層43可由鈕 或鶴金屬構成，其厚度可較薄，例如小於！微米。 上述第二實施例模仁40由模仁基底41、塵電陶究層 可^由中=、43構成’其中模仁基底41及壓電陶竟層41 如=:法製備’而中間層4 3則可由讀法形成。例 级㈣成ί Γ第一實施例之方法，利用擠壓成型及燒 ;、=Γ—f:41;再爾法於模仁基底表面形成 鎢涛膜’即中間層43;最後以擠麗成型、燒 座電^層42,並施以精細加工形成所需光學透鏡曲面。 級，因:=:面亮上之尺寸變化範圍通常於奈米級至微米. 制呈置壓電陶究層可實現比一般機械控 之機之尺寸偏差補償。且麗電陶究具有較高 械強度、硬度及章刀性，可承受模造光學鏡片製程中之 200911705 而溫南壓。 可理解，上述模仁不僅僅可應用於製造光學鏡片，也 可用於其他通過模壓成型方法成型之製程中，通過設計不 同之模壓面就可成型不同之產品。 ’宗上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式γ自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 一圖1係本發明第—實施例模造光學鏡片之模仁之結構 實施例中壓電陶瓷層 圖2及圖3係用燒結法製造第 之過程示意圖。 圖 體燒結 圖 剖7F圖 4至圖6係第一實施例中模仁基底與壓電陶瓷層— 之過程示意圖。 曰 7係本發明第二實施例模造光學鏡片之模仁之結構 10，40 11 12，42 20 ， 20a ， 33 21，31 【主要元件符號說明】 模仁 模仁基底 壓電陶瓷層 物料 第一模仁 9 200911705 第二模仁 22，32 材料 30 第三模仁 34 中間層 43 模壓面 110 ， 220 ， 320 型腔 111 ， 211 外部電路 120 10BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold for molding an optical lens, and more particularly to a mold which can control molding precision. [Prior Art] Molding is widely used in the molding process, especially in the manufacture of optical lens products, such as aspherical optical lenses, ball lenses, prisms, etc. Direct die-molding technology can directly produce high quality. Optical lens products (see "Quartz Glass Molding by Precision Glass Molding Method 55, Trans. IEE Jpn., pp. 494-497, 2002", and without subsequent processing steps such as sanding, polishing, etc., can greatly improve production efficiency and yield. When molding optical lenses, the cooling timing is determined by controlling the compression stroke. However, the conversion of high temperature and high pressure to room temperature and atmospheric pressure must go through a slow process, so that the final size of the optical lens and the ideal size of the cooling point will deviate. The general method corrects the deviation by the empirical value. However, the situation of the random stage and the operation method need to be adjusted frequently, and the precision of the optical lens cannot be guaranteed. [Invention] In view of this, a mold core capable of controlling the molding precision is provided. It is necessary. A mold for molding optical lenses, including molds a substrate having a molded surface on the molding surface, the piezoelectric surface having a piezoelectric ceramic layer connected to an external circuit for controlling mechanical deformation thereof. From nanometer to micrometer 5 200911705, the piezoelectric ceramic layer on the mold surface can achieve higher precision dimensional deviation compensation than general mechanical control. The strength, the hardness and the toughness can withstand the south temperature pressure in the process of molding the optical lens. Embodiments Please refer to Fig. 1. The first embodiment provides a mold for molding an optical lens. The mold core 10 includes a mold base 11, The mold base U has a molding surface 110, and a portion of the molding surface 110 has a concave arc surface, and the circular arc surface defines a cavity 111. In the embodiment, the surface of the cavity U1 is concave. The arc surface, of course, may also be according to the shape of the optical lens to be molded. The shape of the surface of the cavity 111, such as the aspheric surface of the depression or protrusion, the spherical surface, etc. The base of the mold core 11 may be high-strength. The super hardened alloy, the carbide ceramic: (for example, tungsten carbide) or cermet. 3 In this embodiment, the molding surface 11G is advanced, the step H is layered, and the piezoelectric ceramic layer 12 is Control the mechanical deformation of the circuit two-phase connection. The material of the layer 12 is mainly selected d) 3), titanic acid (PbTi〇3), titanic acid (pbzrTi〇3) and other pressure materials. The piezoelectric crucible 12 can also be a sharp-type piezoelectric ceramic, etc. The private network is more 'two 7| The piezoelectric ceramic layer 12 can be fixed together by bonding, the sleeve pressing surface 110. a The above method is made into the mold core 10 first service + f by the sintering method to make the waste electric ceramic layer 12 first, the above-mentioned piezoelectric ceramic material - <: 'Bai Xian' will be evenly mixed; The material 20 of the mixed 200911705 is placed in the first mold core 21, and the first mold core 2i has a cavity 211 having the same shape as that of the cavity 111, and the cavity 211 is added to the cavity m. The depth, the increased depth is equal to the thickness of the piezoelectric ceramic layer. Referring to FIG. 3, the second mold core 22 is applied with the material 20 in the first mold core 21, and the second mold core 22 has a molding surface 22 which is fully matched with the shape 2 of the first mold cavity 2 ι. The preliminary extruded material 2 is placed in a high temperature for sintering to form a piezoelectric ceramic layer 12; the microlens is used to form a desired optical lens surface; finally, the piezoelectric ceramic layer is bonded, The method of inserting, welding, etc. is fixed to the molding surface 110. Alternatively, the mold base 11 and the piezoelectric ceramic layer 12 may be sintered together to form the mold core 10. Referring to FIG. 4, the material of the base of the mold base U is firstly placed; the bucket 30 (for example, the super hard material particles mainly composed of sinned tungsten) is first placed on the first mold core 31, and the pressure is applied to the second mold core 32. The material 30 on the first mold core 31 'the second mold core 32 has a molding surface material that completely conforms to the shape of the cavity m: one or more of the top and bottom materials 30 Referring to Fig. 5), the material 33 (see Fig. 6) in the third mold core 34 is used, and the third mold rf " cavity 111 is completely conformed to the molding surface 340; the first half of the back ridge is formed. The object is placed in a high temperature to burn the gentleman, so that the shape #I Shaomiao 11 gamma & 仗 杈 杈 杈 杈 杈 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基Optical lens surface. The mechanical and electrical consumption of the ceramic material itself is external, and the electric field of the electric ceramic layer 12 causes the mechanical deformation. Interview with 厌 卞 卞 amp amp 一 一 一 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 The electric ceramics layer will be stretched in the direction of the electric field. In the present embodiment, the direction of the electric field generated by the external electric dust is preferably such that the Lai Ren 1G manufactures the lens in the direction of the ig ^ direction - the same direction as the movement of the mold 1G in the molding process is the same as the ceramic layer 12 will follow The thickness of the externally applied electric power is changed, and the thickness is increased. The larger the thickness of the piezoelectric ceramic layer 12 is, the more the electric dust is controlled to control the size of the electric ink, and the actual need and the ==::== - Yu Yu 10". The structure is basically the same 'the difference is that the intermediate S 3 43 is further formed between the layer 43 and the dust-electric ceramic layer 42 to enhance the bonding property, so that the mold base 41 and the m-genus layer 42 are tightly combined to improve stability. The intermediate layer 43 may be composed of a button or a crane metal, and its thickness may be thin, for example, less than! Micron. In the above-mentioned second embodiment, the mold core 40 is composed of the mold base 41 and the dust electric ceramic layer, which may be composed of medium=43, wherein the mold base 41 and the piezoelectric ceramic layer 41 are prepared as follows: and the intermediate layer 4 3 can be formed by reading. Example (4) into the method of the first embodiment, using extrusion molding and firing; ==Γ-f:41; and forming a tungsten film on the surface of the base of the mold, ie, the intermediate layer 43; The electric layer 42 is formed and fired, and finely processed to form a desired optical lens curved surface. Level, because: =: The size of the surface is usually changed from nanometer to micrometer. The piezoelectric ceramic layer can achieve the dimensional deviation compensation of the general mechanical control machine. And Lidian ceramics has high mechanical strength, hardness and knife-knife, and can withstand the 200911705 and Wennan pressure in the process of molding optical lenses. It can be understood that the above-mentioned mold core can be applied not only to the manufacture of optical lenses, but also to other processes formed by the compression molding method, and different products can be formed by designing different molding surfaces. As stated above, the invention has indeed met the requirements of the invention patent and has filed a patent application in accordance with the law. However, the above description is only the preferred embodiment of the present invention, and γ cannot limit the scope of the patent application in this case. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a structure of a mold core for molding an optical lens according to a first embodiment of the present invention. Fig. 2 and Fig. 3 are schematic views showing a process of manufacturing the first method by a sintering method. Fig. 7F Fig. 4 to Fig. 6 are schematic views showing the process of the mold base and the piezoelectric ceramic layer in the first embodiment.曰7 is a structure of a mold core for molding an optical lens according to a second embodiment of the present invention. 10, 40 11 12, 42 20 , 20a , 33 21, 31 [Description of main component symbols] The first mode of the base piezoelectric ceramic layer material of the mold core仁9 200911705 Second mold core 22, 32 Material 30 Third mold core 34 Intermediate layer 43 Molded surface 110, 220, 320 Cavity 111, 211 External circuit 120 10