TW200908838A - Method of attaching flexible material - Google Patents

Method of attaching flexible material Download PDF

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Publication number
TW200908838A
TW200908838A TW097112376A TW97112376A TW200908838A TW 200908838 A TW200908838 A TW 200908838A TW 097112376 A TW097112376 A TW 097112376A TW 97112376 A TW97112376 A TW 97112376A TW 200908838 A TW200908838 A TW 200908838A
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Taiwan
Prior art keywords
soft material
substrate
mark
axis
error
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TW097112376A
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Chinese (zh)
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TWI364250B (en
Inventor
Se-Young Kim
Cheon-Hee Kim
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Seho Robot Ind Co Ltd
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Publication of TW200908838A publication Critical patent/TW200908838A/en
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Publication of TWI364250B publication Critical patent/TWI364250B/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0008Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

To provide a method of highly accurately attaching and depositing a flexible material on a substrate.The attaching method attaches the flexible material having a plurality of marks on a substrate having marks corresponding to the marks provided on the material. The method includes a step of acquiring image data of the flexible material, a step of acquiring image data of the substrate, a step of calculating an error angle between at least a line connecting the marks of the substrate and a line for connecting the marks of the flexible material corresponding to the line of the substrate, a step of rotating the flexible material or the substrate by an angle calculated using the error angle, a step of calculating at least a displacement between the marks of the substrate and the marks of the flexible material, and a step of moving the flexible material or the substrate using the calculated displacement.

Description

200908838 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種軟性材料附著方法,具體來說,是關 於一種將用於保護基板上圖案等的各種軟性材料附著於基 板上的軟性材料附著方法。 • 【先前技術】 - PCB(印刷電路板,printed circuit board)或 FPCB(軟性印 刷電路板’ flexible printed circuit board)等基板上印刷有 f^ 構成電路之導電性圖案。為在基板製造步驟及使用中保護 圖案’將聚醯亞胺薄膜(polyimide film)等覆蓋膜附著於基 板表面,但基板上應安裝電子零件之部位則不附著覆蓋 膜。覆蓋膜之一面塗佈有枯著劑(adhesive)。該釉著劑在 被加熱後就會熔化而附著於基板表面。覆蓋膜之粘著劑由 離型紙加以保護,覆蓋膜、粘著劑及離型紙所組成之覆蓋 膜片(cover lay sheet)卷於滾筒上。另一方面,覆蓋膜除用 於基板以外,還用於附著保護半導體中導線。 ϋ 本發明係關於將例如覆蓋膜等軟性材料附著於基板等之 方法。 力該等基板與軟性材才斗附著之㈣,重I的是使基板與 軟性材料上之圖案一致地高精度對準並附著。 【發明内容】 [發明所欲解決之問題] 因此,本發明為解決前述以往技術之問題之方案,其目 的係提供-種將基板與軟性材才斗高精度對準並附著之方 130133.doc 200908838 法。 [解決問題之技術手段] f 為達成前述目的,本發明提供一種使設有多個標記之軟 性材料附著於設有對應該軟性材料上標記之標記之基板上 之軟性材料附著方法,其包含有下述步驟:⑷獲取前述軟 !生材料之圖像資料之步驟;(b)獲取前述基板之圖像資料之 步驟;⑷計算前述基板上標記間至少j條相連轴線與前述 軟性材料上標記間對應於前述基板上軸線之相連軸線之誤 差角度之誤差角度計算步驟;⑷以前述誤差角度所計算之 角度,旋轉前述軟性材料與基板中至少一方之誤差角度修 正步驟,⑷進行前述誤差角度修正步驟之後,計算前述基 板上標記與前述軟性材料上對應標記之間至少一處位移: = 多計算步驟;⑴以前述位移計算步驟中所得 =計算後得出之值,移動前述軟性材料與前述基板中 ’ 方之誤差位移修正步驟。 [發明之效果] 如前所述,依據本發明之軟性材料 軟性材料之圖案將高精度對準並附著,可 率及提高生產性之效果。 ’夕不良 【實施方式】 以下參照附圖對本發 首先,參照圖】,對用以=行詳細說明。 法之軟性材料附… 施本發明之軟性材料附著方 〈軟性材科附著裝置1〇〇進行說明 考万 裝置⑽可將例如覆蓋膜、薄膜 ^軟性材料附著 専片專各種軟性材料2〇 130133.doc 200908838 才著於PCB或FPCB等各種基板ι〇上。軟性材料2〇之内面塗 佈有粘著劑22。該粘著劑22加熱後將熔化而附著於基板1〇 之表面。 本實施例,如圖3圖4所示,以基板丨〇及軟性材料2〇之成 «口圖案之4周各設有丨個標記之情形為例,進行說明。 如圖3所示,基板1〇以中央為基準,於四角設有第丨標記 〜第4標記Μ丨〜%。對角線方向所設之第!標記%與第3標記BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of attaching a soft material, and more particularly to a soft material attached to a substrate for protecting various soft materials such as patterns on a substrate from a substrate. method. • [Prior Art] - A conductive pattern constituting a circuit is printed on a substrate such as a PCB (printed circuit board) or an FPCB (flexible printed circuit board). In order to protect the pattern in the substrate manufacturing step and during use, a cover film such as a polyimide film is attached to the surface of the substrate, but the portion where the electronic component is to be mounted on the substrate does not adhere to the cover film. One side of the cover film is coated with an adhesive. The glaze is melted and adhered to the surface of the substrate after being heated. The adhesive for the cover film is protected by a release paper, and a cover sheet composed of a cover film, an adhesive, and a release paper is wound on the drum. On the other hand, the cover film is used for attaching and protecting the wires in the semiconductor in addition to the substrate. ϋ The present invention relates to a method of attaching a soft material such as a cover film to a substrate or the like. The force is such that the substrate and the soft material are adhered to each other (4). The weight I is such that the substrate is aligned and adhered with high precision in accordance with the pattern on the soft material. SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] Accordingly, the present invention is directed to solving the problems of the prior art described above, and an object thereof is to provide a method for accurately aligning and attaching a substrate to a flexible material. 130133.doc 200908838 Law. [Technical means for solving the problem] f In order to achieve the above object, the present invention provides a method of attaching a soft material having a plurality of marks to a substrate provided with a mark corresponding to a mark on a soft material, which includes The following steps: (4) obtaining the image data of the soft material; (b) obtaining the image data of the substrate; and (4) calculating at least j connected axes between the marks on the substrate and the marking on the soft material The error angle calculating step corresponding to the error angle of the connected axis of the upper axis of the substrate; (4) rotating the error angle correcting step of at least one of the soft material and the substrate at an angle calculated by the error angle, and (4) performing the error angle correction After the step, calculating at least one displacement between the mark on the substrate and the corresponding mark on the soft material: = multi-calculation step; (1) moving the soft material and the substrate by using the value obtained after the calculation in the displacement calculation step The error correction step in the square. [Effect of the Invention] As described above, the pattern of the flexible material of the soft material according to the present invention is aligned and adhered with high precision, and the productivity and the effect of productivity are improved. [Embodiment] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. The soft material of the method is attached... The soft material adhering to the invention is applied to the soft material attachment device. The Cowan device (10) can be used, for example, to cover the film, the film, the soft material, and the soft material. Doc 200908838 is on various substrates such as PCB or FPCB. The inner surface of the soft material 2 is coated with an adhesive 22. After the adhesive 22 is heated, it is melted and adhered to the surface of the substrate 1A. In the present embodiment, as shown in FIG. 3 and FIG. 4, a case where a plurality of marks are formed on each of the four sides of the substrate pattern and the soft material is described as an example. As shown in Fig. 3, the substrate 1 is provided with a second mark to a fourth mark Μ丨 to % at the four corners with reference to the center. The first set in the diagonal direction! Mark % and 3rd mark

3相連升成第1軸線Ll,對角線方向所設之第2標記與 第4標記M4相連形成第2軸線L2,第1轴線^與第2轴線^交 基板10之第1標s己〜第4標記⑷〜仏或印刷於基板⑺之 表面,或設為鑽孔。 °圖4所示,軟性材料20上設有與基板10之P標記〜第4 標記Ml〜M4相對準而得以使軟性材料20接合於基板1〇上之 =5標記〜第8標記%,。對角線方向所設之第5標記吣盥 第7標記M7相連形成第3軸線對角線方向所設之第6標 議與請記M8相連形成第4軸線μ,第3轴線^第伟 線L4交又。軟性材料20上之第5標記〜第8標 設為鑽孔。 5 8刀j 參照圖i及圖2,軟性材料附著裝置刚具有作為固定基3 is connected to the first axis L1, and the second mark provided in the diagonal direction is connected to the fourth mark M4 to form the second axis L2, and the first axis ^ and the second axis are intersected with the first target s of the substrate 10. The ~4th mark (4)~仏 is printed on the surface of the substrate (7) or is drilled. As shown in Fig. 4, the soft material 20 is provided with the mark 5 to the fourth mark M1 to M4 of the substrate 10 so that the soft material 20 is bonded to the substrate 1〇 from the mark 5 to the eighth mark %. The fifth mark 吣盥 the seventh mark M7 provided in the diagonal direction is connected to form the third axis, and the sixth mark is set in the diagonal direction of the third axis to form the fourth axis μ, and the third axis is the third axis. Line L4 is handed over again. The fifth mark to the eighth mark on the soft material 20 are set as drill holes. 5 8 knife j Referring to Figure i and Figure 2, the soft material attachment device has just as a fixed base

上it::真空台110,及將軟性材料20搬運至基板!。 空頭h之機械手臂120。機械手臂120構成為藉由真 二vae_ ead)122吸附軟性材料,沿X軸、γ 7 軸直線往返移動,以7紅A ± 神、Z 台11。之内側安褒有用二:進行旋轉移動。真空 有用於加熱基板10之第1加熱器130,於 I30J33.doc 200908838 真二頭122之内側安裝有用於加熱軟性材料2〇之第2加熱器 140。 參照圖2,軟性材料附著裝置1〇〇具有獲取基板1〇之第i 標s己〜第4標記Μ广Μ#與軟性材料2〇之第5標記〜第8標記 Ms〜Ms之圖像資料,並對機械手臂12〇進行控制之圖像處 理裝置150。圖像處理裝置15〇具有獲取吸附於真空台ιι〇 上基板1 〇之圖像並輸出圖像資料之第丨照相機丨52,獲取吸 附於機械手臂120上軟性材料2〇之圖像並輸出圖像資料之 第2照相機丨54,程序處理從第!照相機丨52及第2照相機丨54 輸入之基板10之圖像資料及軟性材料20之圖像資料並控制 機械手臂作動使基板10之第丨標記〜第4標記Μ^Μ4與軟性 材料20之第5標記〜第8標記Ms〜Ms對準並附著之電腦丨56。 電腦156通過監視器1 58等顯示裝置顯示基板1〇與軟性材料 20之圖像資料。機械手臂12〇之作動係由與電腦156連接之 控制器進行控制。 以下,參照圖8,對採用前述軟性材料附著裝置1〇〇使軟 性材料附著於基板上之本發明所涉及之軟性材料附著方法 進行說明。 第2照相機154獲取並輸出機械手臂ι2〇所持之軟性材料 20之圖像資料,電腦156對從第2照相機154輸入之軟性材 料20之圖像資料進行處理,算出第5標記〜第8標記 之各自座標值。 真空台110上載置基板10後,第丨照相機152獲取基板1〇 之圖像並輸出圖像資料,電腦156對從第1照相機152輸入 130133.doc 200908838 之基板10之圖像資料處理,算出第1標記〜第4標記Mi〜M4 之各自座標值。 然後,電腦156進行大小誤差檢查步驟(S1〇〇),對前述 獲得之基板1 0與軟性材料2〇之圖像資料進行處理,算出基 板與軟性材料之大小誤差。 即,電腦156對第1標記〜第8標記M]〜M8之座標值進行處 理,按照第1標記〜第4標記Ml〜M4之順序,算出第丨標記〜 第4標記Μ广Μ*間之第i距離〜第4距離D广&,按照第5標記 〜第8標記Ms〜Ms之順序,算出第5標記〜第8標記 之第5距離〜第8距離d5〜A。 電腦156對第1距離〜第4距離D〗〜D4與第5距離〜第8距離 Ds〜是否滿足容許誤差進行判斷(sl〇2) 〇 電腦156若判斷第!距離〜第4距離Dl〜D4與第5距離〜第8距 離Ds〜Ds不滿足容許誤差,則將啟動第}加熱器與第2加熱 器130、140 ’對基板10與軟性材料2〇中任意一方加熱或對 基板10與軟性材料2〇同時分別加熱,藉此進行減少基板1〇 與軟性材料20大小誤差之加熱步驟(sl〇4)。啟動第1加熱 器與第2加熱器130、140對基板1〇與軟性材料2〇加熱後, 重新回到獲取基板1 〇與軟性材料2〇之圖像資料步驟。 基板1 0與軟性材料20可能會因溫度、濕度、張力等影響 而伸縮。此種情形,可能會使基板丨〇之第丨標記〜第4標記 Μ丨〜M4分別與軟性材料2〇之第5標記〜第8標記m5〜m8對應 位置產生偏差。 根據基板1 0與軟性材料20之伸縮性及位置偏差,會發生 130133.doc -10- 200908838 第1標記〜第4標記μ广M4與第5標記〜第8標記‘A無法在 ^許誤差範圍内一 一對準之情形。比如,第i標記與第4 才示議之第4距離〇4為2〇〇 mm ’第5標記%與第8標記% 之第8距離〇8為196 mm之情形,將第ι標記Μ丨與第$標記⑷ 對準使基板1G與軟性材料2G接合時,第4標記M4與第8標記 Ms就無法在容許誤差範圍内對準。The upper:: vacuum table 110, and the soft material 20 is transported to the substrate! The robot arm 120 of the short head h. The robot arm 120 is configured to adsorb a soft material by the true two vae_ead 122, and linearly reciprocate along the X-axis and the γ-axis, 7 red A ± god, Z stage 11. The inner side of the ampoule is useful for two: performing a rotational movement. Vacuum The first heater 130 for heating the substrate 10 is provided, and a second heater 140 for heating the soft material 2 is attached to the inside of the true two-head 122 of I30J33.doc 200908838. Referring to Fig. 2, the soft material attachment device 1 has image data of the fifth mark to the eighth mark Ms to Ms of the first to fourth marks of the substrate 1 and the fourth mark of the soft material 2 And an image processing device 150 that controls the robot arm 12〇. The image processing device 15 has a camera camera 52 that acquires an image of the substrate 1 吸附 adsorbed on the vacuum table and outputs image data, and acquires an image of the soft material 2 吸附 adsorbed on the robot arm 120 and outputs an image. The second camera 丨54 of the document, the program processing from the first! The camera 丨52 and the second camera 丨54 input the image data of the substrate 10 and the image data of the soft material 20 and control the robot arm to move the third mark to the fourth mark 与^Μ4 and the soft material 20 of the substrate 10. 5 mark ~ 8th mark Ms ~ Ms aligned and attached to the computer 丨 56. The computer 156 displays the image data of the substrate 1 and the soft material 20 through a display device such as a monitor 1 58. The robot arm 12 is controlled by a controller connected to the computer 156. Hereinafter, a method of adhering a soft material according to the present invention in which a soft material is adhered to a substrate by the soft material adhering device 1 will be described with reference to Fig. 8 . The second camera 154 acquires and outputs the image data of the soft material 20 held by the robot arm ι2, and the computer 156 processes the image data of the soft material 20 input from the second camera 154 to calculate the fifth mark to the eighth mark. Coordinate values. After the substrate 10 is placed on the vacuum table 110, the second camera 152 acquires the image of the substrate 1 and outputs image data, and the computer 156 processes the image data of the substrate 10 of 130133.doc 200908838 from the first camera 152 to calculate the image. 1 mark ~ 4th mark Mi ~ M4 respective coordinate values. Then, the computer 156 performs a size error checking step (S1) to process the image data of the substrate 10 and the soft material 2〇 obtained as described above, and calculate the size error of the substrate and the soft material. In other words, the computer 156 processes the coordinate values of the first mark to the eighth mark M] to M8, and calculates the third mark to the fourth mark Μ Μ Μ* in the order of the first mark to the fourth mark M1 to M4. The i-th distance to the fourth distance D-wide are calculated from the fifth mark to the eighth mark Ms to Ms, and the fifth to eighth distances d5 to A of the fifth to eighth marks are calculated. The computer 156 determines whether the first distance to the fourth distance D to D4 and the fifth distance to the eighth distance Ds to satisfy the allowable error (s1〇2) 若 If the computer 156 determines the first! When the distance from the fourth distance D1 to D4 and the fifth distance to the eighth distance Ds to Ds do not satisfy the tolerance, the first heater and the second heater 130, 140' are activated to the substrate 10 and the soft material 2 One of them is heated or heated simultaneously with the substrate 10 and the soft material 2, whereby a heating step (sl4) for reducing the size error of the substrate 1 and the soft material 20 is performed. After the first heater and the second heaters 130 and 140 are turned on, the substrate 1 and the soft material 2 are heated, and then returned to the image data of the substrate 1 and the soft material 2 . The substrate 10 and the soft material 20 may expand and contract due to effects such as temperature, humidity, and tension. In this case, the position of the second mark to the fourth mark Μ丨 to M4 of the substrate 与 may be different from the position corresponding to the fifth mark to the eighth mark m5 to m8 of the soft material 2〇. According to the flexibility and positional deviation of the substrate 10 and the soft material 20, 130133.doc -10- 200908838 The first mark to the fourth mark μ wide M4 and the fifth mark ~ the eighth mark 'A cannot be in the error range The situation of one-to-one alignment. For example, the fourth distance 〇4 of the i-th mark and the fourth one is 2〇〇mm 'the fifth mark % and the eighth mark % of the eighth distance 〇8 are 196 mm, and the first mark Μ丨When the substrate 1G is bonded to the soft material 2G in alignment with the first mark (4), the fourth mark M4 and the eighth mark Ms cannot be aligned within the tolerance range.

於真二口 110上吸附基板1〇之狀態下啟動第丨加熱器 130基板1〇受到第!加熱器13〇之加熱而產生熱膨脹。機 械手们20之真空頭122上吸附軟性材料2〇之狀態下啟動第 2加熱器140,生材料2〇受到第2加熱器14〇之加熱產生熱 膨脹。經由基板10與軟性材料2〇之如此熱膨脹,可將糾 標記〜第4標記Ml〜M4與第5標記〜第8標記仏為之座標值 調節至:致或在容許誤差範圍内。從而,可使軟性材料2〇 正確附著於基板1 〇上。前述大小誤差計算步驟(s⑽)〜加 熱步驟(S 104)考慮到基板丨〇與軟性材料2〇之伸縮性、精密 性等可予以省略。 另方面,對基板10與軟性材料20之加熱可通過考慮基 板10與軟性材料2G之尺寸與熱變形率後啟動第以熱器及 第2加熱器130、14〇預加熱來實施。 即,數次進行大小誤差計算步驟,掌握基板1〇與軟性材 料20之加熱溫度後,以後作業時無需每次都從大小誤差計 算步驟(S 1 00)開始,重復直接以之前所掌握之溫度對真空 台11 0與真空頭122分別預加熱後使軟性材料2〇附著於基板 1 0上之作業之方法,亦可進行本發明所涉及之軟性材料附 130133.doc 200908838 著方法。 以下,對軟性材料20相對於基板1〇排列並使每個標記正 確一致地附著之方法進行說明。 首先,分別進行利用第2照相機154獲取軟性材料2〇之圖 像資料步驟(⑷步驟、_),與利用^照相機152獲取基 板10之圖像資料步驟((b)步驟、S108)。 '、、:後進行誤差角度计算步驟(⑷步驟、s η 〇),算出連 _反10上標記Μ丨〜吣間軸線L丨、L2及與該軸線Li、匕2所 ( 冑應之連接軟性材料2G上標記m5〜m8間軸線、L4之誤差 角度。 ^ β…、圖5,電腦156對第1標記〜第8標記μ丨〜M8之座 標值*進行處理,算出通過基板10中央之連接第i標記%與 第3払5己]\43之第丨軸線L】,與通過軟性材料中央之連接第 5標記叫與第7標記%之第3軸線L3所成之約角度θι。另, ^出連接第2;^ s£im2與第4標記μ4之第2軸線l2與連接第6 (j 與第8標記M8之第4軸線L4所成之第2角度θ2。電腦 十算出第1角度Θ,與第2角度θ2之平均值(0i+02)/2((c) 步驟SU〇)。若第1角度〜為6.1。,第2角度02為3.8。,則 平均值為4.95。。 接者,進行誤差角度修正步驟(⑷步驟、SU2) ’根據誤 差角度計算所得之角度旋轉軟性材料20與基板〗〇中至少一 方。 參照圖6,電腦156控制機械手臂i2〇之作動,根據對於 1角度θΐ和第2角度θ2之平均值(θι + θ2)/2反方.向之旋轉角 130133.doc -12· 200908838 度值-((θ1 + θ2)/2)旋轉軟性材料2()。若第}角度1為6」。,第 :角度92為3.8。,則旋轉角度為_4 95。。軟性材料2〇旋轉完 後’第1角度Θ丨'為1,15。,第2角度θ2,為115。。 如圖6所不’誤差角度修正步驟((d)步驟、S112)完成 後,旋轉後之第5標記〜第8標記%%,各座標值相對於第 1標圯〜第4標記Μι〜M4各座標值形成了 χ軸位移值與γ軸位 移值。 、 為修正該X軸位移值與丫轴位移值,使用電腦156進行位 移計算步驟(⑷步驟、SU4),算出基板⑺上標記與軟性材 料2〇上對應標記間之位移值。即,電腦156計算旋轉後第5 私δ己〜第8標記Μ/〜Ms'各標記之X軸位移值與γ軸位移值步 驟((e)步驟、S114)。 剛述位移計算步驟((e)步驟、SU4),既可在誤差角度修 正步驟((d)步驟、S112)完成之後,利用第1照相機152與第 2照相機154再次獲取基板1〇與軟性材料2〇之圖像計算出位 移值,亦可根據進行前述(a)步驟(sl〇6)與(b)步驟(Sl〇8)所 獲得之基板1 〇與軟性材料2〇之圖像,以旋轉誤差角度計算 步驟((c)步驟、S110)所算出之誤差角度後’用電腦156計 鼻出位移值。 然後’進行誤差位移修正步驟((f)步驟、S116),對進行 位移計算步驟((e)步驟、S114)所得到之位移值進行計算, 根據計算所得值移動前述軟性材料與基板中至少一方。 本實施例以根據各X軸位移值與γ軸位移值中最大值與 最小值之平均值移動軟性材料20之情形為例進行說明。 130133.doc 13 200908838 即,算出第5標記〜第8標記M5'〜M8'各標記之X軸位移值 與Y軸位移值中X軸最大值XMax、X軸最小值XMin、Y軸最 大值YMax、Y轴最小值YMin。電腦156再算出X軸最大值 X軸最小值XMit^平均值(XMax+XMin)/2,算出Y軸最 大值YMax與Y軸最小值YMil^平均值(YMax+YMin)/2。 參照圖7,算出X軸平均值(XMax+XMin)/2與Y軸平均值 ' (YMax+YMin)/2後,電腦156控制機械手臂120作動並根據與 X轴平均值(XMax+XMin)/2反方向之X轴移動值-〇 ((XMax+XMin)/2)、與 Y軸平均值(YMax+YMin)/2 反方向之 Y軸 移動值-((YMax+YMin)/2)移動軟性材料20((f)步驟,S116)。 最後,電腦156控制機械手臂120作動而將軟性材料20附 著於基板10上。 [表1] 分類 軟性材_ 卜旋轉後 軟性材带 移動後 X轴位移值 (mm) Y軸位移值 (mm) X軸位移值 (mm) Y軸位移值 (mm) 第5標記 -0.98 1.62 -1.48 1.18 第6標記 -1.22 -1.23 -1.72 -1.57 第7標記 2.22 -1.58 1.72 -1.92 第8標記 1.87 2.26 1.37 1.92 如表1所示,軟性材料20在旋轉後,X軸最大值XMax為 2.22 mm,X軸最小值XMin為-1.22 mm之情形,X軸平均值 (XMax + XMin)/2為0·5 mm。軟性材料20在旋轉後,Y軸最大 值丫\^為2.26 mm,Y軸最小值YMin為-1.58 mm之情形,Y 軸平均值(YMax+YMin)/2 為 0.34 mm。 130133.doc • 14- 200908838 如圖6與圖7所示,軟性材料2〇沿乂軸及γ轴方向各移動·When the second substrate 110 is used to adsorb the substrate 1 启动, the third heater is activated. The heater 13 is heated to cause thermal expansion. The second heater 140 is activated in a state where the soft material is adsorbed by the vacuum head 122 of the robot 20, and the raw material 2 is heated by the heating of the second heater 14 to generate thermal expansion. By such thermal expansion of the substrate 10 and the soft material 2, the coordinate values of the correction marks - 4th mark M1 to M4 and the 5th mark to the 8th mark 调节 can be adjusted to or within the allowable error range. Thereby, the soft material 2〇 can be properly attached to the substrate 1 . The size error calculation step (s(10)) to the heating step (S104) may be omitted in consideration of the flexibility and precision of the substrate 丨〇 and the soft material 2〇. On the other hand, the heating of the substrate 10 and the soft material 20 can be carried out by considering the size of the substrate 10 and the soft material 2G and the heat deformation rate, and then starting the heating of the first heater and the second heaters 130 and 14 . That is, the size error calculation step is performed several times, and after grasping the heating temperature of the substrate 1〇 and the soft material 20, it is not necessary to start from the size error calculation step (S 1 00) every time, and repeat the temperature directly before the operation. The method of pre-heating the vacuum stage 110 and the vacuum head 122 to adhere the soft material 2〇 to the substrate 10 can also be carried out by the method of the soft material 130133.doc 200908838 of the present invention. Hereinafter, a method in which the soft material 20 is aligned with respect to the substrate 1 and each mark is properly adhered will be described. First, the image data step ((4) step, _) of acquiring the soft material 2 利用 by the second camera 154 is performed, and the image data of the substrate 10 is acquired by the camera 152 (step (b), S108). ',,: After the error angle calculation step ((4) step, s η 〇), calculate the mark Μ丨~吣 axis L丨, L2 on the continuous_reverse 10 and the connection with the axis Li, 匕2 The soft material 2G marks the axis of error between m5 and m8 and the error angle of L4. ^β..., Fig. 5, the computer 156 processes the coordinate value * of the first mark to the eighth mark μ丨 to M8, and calculates the center of the substrate 10; The first axis % and the third axis 5' of the third element are connected to the center of the soft material, and the fifth mark is called the angle θι of the third axis L3 of the seventh mark %. , ^ s£im2 and the second axis l2 of the fourth mark μ4 and the second angle θ2 formed by the sixth (j and the fourth axis L4 of the eighth mark M8). The angle Θ is the average value of the second angle θ2 (0i+02)/2 ((c) step SU〇). When the first angle 〜 is 6.1, and the second angle 02 is 3.8, the average value is 4.95. The operator performs an error angle correction step (step (4), SU2) 'at least one of the angular rotation soft material 20 and the substrate 计算 calculated based on the error angle. Referring to FIG. 6, the computer 156 The robot arm i2 is actuated according to the average value (θι + θ2)/2 of the angle θΐ and the second angle θ2. The angle of rotation is 130133.doc -12· 200908838 degrees -((θ1 + θ2) /2) Rotating soft material 2 (). If the angle 1 is 6", the angle 92 is 3.8. The rotation angle is _4 95. The soft material 2〇 is rotated after the first angle Θ丨' is 1,15., the second angle θ2 is 115. If the error angle correction step ((d) step, S112) is completed as shown in Fig. 6, the fifth mark to the eighth mark %% after the rotation, Each coordinate value forms a χ axis displacement value and a γ axis displacement value with respect to the coordinate values of the first to fourth marks Μι to M4. To correct the X-axis displacement value and the 丫-axis displacement value, the computer 156 is used for displacement. The calculation step (step (4), SU4) calculates the displacement value between the mark on the substrate (7) and the corresponding mark on the soft material 2〇. That is, the computer 156 calculates the 5th private δ~8th mark 〜/~Ms' mark after the rotation. The X-axis displacement value and the γ-axis displacement value step ((e) step, S114). The displacement calculation step ((e) step, SU4) can be corrected at the error angle. After the step (d), the step S112 is completed, the first camera 152 and the second camera 154 acquire the image of the substrate 1 and the soft material 2 再次 again to calculate the displacement value, and the step (a) may be performed according to the above (a). The image of the substrate 1 〇 and the soft material 2 获得 obtained by sl〇6) and (b) step (S10) is calculated by the rotation error angle calculation step ((c) step, S110). Use the computer 156 to measure the nasal displacement value. Then, 'the error displacement correction step (step (f), S116) is performed, and the displacement value obtained by performing the displacement calculation step (step (e), S114) is calculated, and at least one of the soft material and the substrate is moved according to the calculated value. . In the present embodiment, a case where the soft material 20 is moved based on the average value of the maximum value and the minimum value among the X-axis displacement values and the γ-axis displacement values will be described as an example. 130133.doc 13 200908838 That is, the X-axis displacement value and the Y-axis displacement value of the X-axis displacement values and the Y-axis displacement values of the fifth to eighth markers M5' to M8' are calculated as X-axis maximum value XMax, X-axis minimum value XMin, and Y-axis maximum value YMax. , Y axis minimum YMin. The computer 156 calculates the X-axis maximum value X-axis minimum value XMit^ average value (XMax+XMin)/2, and calculates the Y-axis maximum value YMax and the Y-axis minimum value YMil^ average value (YMax+YMin)/2. Referring to Fig. 7, after calculating the X-axis average value (XMax+XMin)/2 and the Y-axis average value '(YMax+YMin)/2, the computer 156 controls the robot arm 120 to operate and according to the X-axis average value (XMax+XMin). /2 reverse direction X-axis movement value - 〇 ((XMax + XMin) / 2), and Y-axis average (YMax + YMin) / 2 reverse Y-axis movement value - ((YMax + YMin) / 2) The flexible material 20 is moved (step (f), S116). Finally, the computer 156 controls the robot arm 120 to actuate to attach the soft material 20 to the substrate 10. [Table 1] Classification of soft materials _ After the rotation of the soft material, the X-axis displacement value after moving (mm) Y-axis displacement value (mm) X-axis displacement value (mm) Y-axis displacement value (mm) 5th mark -0.98 1.62 -1.48 1.18 6th mark-1.22 -1.23 -1.72 -1.57 7th mark 2.22 -1.58 1.72 -1.92 8th mark 1.87 2.26 1.37 1.92 As shown in Table 1, after the soft material 20 is rotated, the X-axis maximum value XMax is 2.22. Mm, the X-axis minimum value XMin is -1.22 mm, and the X-axis average value (XMax + XMin)/2 is 0·5 mm. After the soft material 20 is rotated, the Y-axis maximum value 丫\^ is 2.26 mm, and the Y-axis minimum value YMin is -1.58 mm, and the Y-axis average value (YMax+YMin)/2 is 0.34 mm. 130133.doc • 14- 200908838 As shown in Fig. 6 and Fig. 7, the soft material 2〇 moves along the x-axis and γ-axis directions.

〇.5 _與-0.34 _後’相對於第1標記〜第4標記Μι〜Μ4 座仏值移動後之第5標記〜第8標記MAM〆之χ軸與γ轴位 移值中X軸最大值為i 72咖、χ轴最小值為j η咖、γ 車由最大值為1.92 mm、Y轴最小值為118麵。由此可以看 出’移動後之第5標記〜第8標記%,,〜%,,之χ軸與γ軸位移 值比碇轉後之第5標記〜第8標記MAM〆之χ軸與γ軸位移 值整體而吕偏差大幅減小。且,移動後之第Μ度及第2角 度01”、θ2',與旋轉後之第1角度及第2角度θι,、θ2·相同或大 致上未變動。如此’對基板W上第1標記〜第4標記Μ,% 與軟性材料20上第5標記〜第8標記m5〜M8各自4點分別識別 後,以所識別之4點為基準,旋轉及移動軟性材料2〇,將 軟性材料20正確附著於基板1〇上。 以上,以一較佳實施例對本發明所涉及之軟性材料附著 方法進行了說明,但本發明之制範圍並不受限於前述圖 示之方法。 匕如雖以基板與軟性材料之成品圖案上設有4個標記 之情形為例進行說明,但設有2個、6個、多個標記之情形 亦適用於本發明之軟性材料附著方法。 另,進行前述誤差位移修正步驟((f)步驟,SU6)時雖 以X軸最大位移值與最小位移值之平均值反方向移動軟性 材料、以Y軸最大位移值與最小位移值之平均值反方向移 動軟性材料,但亦可以X軸位移之平均值反方向移動軟性 材料、以Y軸位移之平均值反方向移動軟性材料之方法進 130133.doc 15 200908838 行誤差位移修正步驟。除此之外,也可不移動軟性材料但 移動基板之方法來進行誤差位移修正步驟。 另,進行前述大小誤差檢查步驟(S100)時,雖以通過比 較^板上標記間距離與軟性材料上對應標記間距離計算大 小誤差之方法進行說明,但亦可採用其它多種方法計算大 小誤差。比如,用電腦對基板之圖像資料與軟性材料之圖 像資料處理,根據與前述誤差角度修正步驟中所說明之方 >類乜之方法,算出軟性材料相對於基板虛擬旋轉後各標 、田 移後由所彳于之位移值計算加熱基板及軟性材料之 亦可未進行角度及位移修正而直接將軟性材料 試驗性附著於基板上後,在基板與軟性材料附著之狀態 下,算出基板與軟性材料對應標記間之位移,繼而可曾出 2板與軟性材料之大小誤差。根據情況,也可通過算出基 軟性材料上由各自3個以上標記所圍成之面積,比較 基板與軟性材料之大小。 【圖式簡單說明】 圖1係用於實施本發明所步 性材料附菩㈣軟性材料附著方法之軟 性材科附著裝置之結構正面示意圖。 圖2係控制圖〗所示之軟 之結構方塊圖。 材抖附者裝置之圖像處理裝置 圖3係適用本發明所涉及之軟性材料 —例之俯視圖。 凌之基板之 圖4係適用本發明所涉及之軟性材料 料之一例之俯視圖。 法之軟性材 I30I33.doc 16 200908838 圖5〜圖7係對根據本發明所涉及之軟性材料附著方法將 軟性材料附著於基板之過程進行說明之圖。 圖8係對本發明所涉及之軟性材料附著方法之一實施例 進行說明之流程圖。 【主要元件符號說明】 10 基板 20 軟性材料 100 軟性材料附著裝置 110 真空台 120 機械手臂 130 第1加熱器 140 第2加熱器 150 圖像處理裝置 152 第1照相機 154 第2照相機 156 電腦 〇i~D8 第1距離〜第8距離 Li 〜L8 第1軸線〜第8軸線 Μ]〜Mg 第1標記〜第8標記 130133.doc 17〇.5 _ and -0.34 _ after 'relative to the first mark ~ the fourth mark Μι ~ Μ 4 seat 仏 value after the movement of the fifth mark ~ the eighth mark MAM 〆 axis and γ axis displacement value of the X axis maximum For i 72 coffee, the minimum value of the axis is j η coffee, the maximum value of the γ car is 1.92 mm, and the minimum value of the Y axis is 118 faces. From this, it can be seen that the '5th mark to the 8th mark after moving, the %%, the χ axis and the γ axis displacement value are compared with the 5th mark to the 8th mark MAM〆 after the 碇 turn and the γ axis and γ The axis displacement value is overall and the Lu deviation is greatly reduced. Further, the second degree after the movement and the second angles 01" and θ2' are the same as or substantially the same as the first angle and the second angles θι, θ2· after the rotation. Thus, the first mark on the substrate W ~4th mark Μ,% and 4 points from the 5th mark to the 8th mark m5~M8 on the soft material 20 are respectively recognized, and the soft material is rotated and moved 2 为 based on the identified 4 points, and the soft material 20 is used. The method of attaching the flexible material according to the present invention has been described above with reference to a preferred embodiment. However, the scope of the present invention is not limited to the method described above. The case where four marks are provided on the finished pattern of the substrate and the soft material will be described as an example, but the case where two, six or more marks are provided is also applicable to the soft material attachment method of the present invention. In the displacement correction step (step (f), SU6), the soft material is moved in the opposite direction from the average value of the maximum displacement value and the minimum displacement value of the X-axis, and the soft material is moved in the opposite direction from the average value of the maximum displacement value and the minimum displacement value of the Y-axis. , but also X-axis displacement Moving the soft material in the opposite direction of the average value, moving the soft material in the opposite direction with the average value of the Y-axis displacement. 130133.doc 15 200908838 The line error displacement correction step. In addition, the method of moving the substrate without moving the soft material is also possible. The error displacement correction step is performed. When the size error checking step (S100) is performed, the method of calculating the size error by comparing the distance between the marks on the board and the distance between the corresponding marks on the soft material is described, but other methods may be used. A variety of methods are used to calculate the size error. For example, the image data of the substrate and the soft material are processed by a computer, and the soft material is calculated relative to the substrate according to the method described in the error angle correction step described above. After the virtual rotation, after the standard shift and the field shift, the heating substrate and the soft material may be calculated from the displacement values, and the soft material may be directly attached to the substrate without the angle and displacement correction, and then the substrate is attached to the soft material. In the state, the displacement between the corresponding mark of the substrate and the soft material is calculated, and then it can be produced 2 The size of the board and the soft material are different. According to the situation, the area of the substrate and the soft material can be compared by calculating the area enclosed by the three or more marks on the soft base material. [Simplified illustration] Figure 1 is used for The front view of the structure of the soft material attachment device for carrying out the method for attaching the step material of the present invention to the bud (4) soft material attachment. Fig. 2 is a block diagram of the soft structure shown in the control chart. The image processing device of the material shaker device Fig. 3 is a plan view showing a soft material to which the present invention is applied. Fig. 4 is a plan view showing an example of a soft material material to which the present invention is applied. Soft material of the method I30I33.doc 16 200908838 Fig. 5 to Fig. 7 is a view for explaining a process of attaching a soft material to a substrate according to the method of attaching a soft material according to the present invention. Fig. 8 is a flow chart for explaining an embodiment of a method of attaching a soft material according to the present invention. [Description of main component symbols] 10 Substrate 20 Flexible material 100 Flexible material adhering device 110 Vacuum table 120 Robot arm 130 First heater 140 Second heater 150 Image processing device 152 First camera 154 Second camera 156 Computer 〇i~ D8 1st distance to 8th distance Li to L8 1st axis to 8th axis Μ]~Mg 1st mark ~ 8th mark 130133.doc 17

Claims (1)

200908838 十、申請專利範圍: L 一種軟性材料之附著方法,用於將設有多個標記之軟性 材料附著於設有對應該軟性材料上標記之標記之基板 上’其特徵為具有下述步驟: (a) 獲取前述軟性材料之圖像資料之步驟; (b) 獲取前述基板之圖像資料之步驟;200908838 X. Patent application scope: L A method for attaching a soft material for attaching a soft material provided with a plurality of marks to a substrate provided with a mark corresponding to a mark on a soft material, which is characterized by the following steps: (a) a step of obtaining image data of the aforementioned soft material; (b) a step of acquiring image data of the aforementioned substrate; (c) 计算前述基板上標記間至少〗條相連軸線,與前述 軟f生材料上標記間對應於前述基板上軸線之相連軸線之 誤差角度之誤差角度計算步驟; ⑷以前述誤差角度計算所得之角度,旋轉前述軟性材 料與基板中至少-方之誤差角度修正步驟; ⑷計算前述基板上標記與前述軟性材料上 間至少一處位移之位移計算步驟; H己之 ⑺以前述位料算步驟中所得到之前述位移加以計算 後得出之值,移動前述軟性材料與前述基板中至少一方 之誤差位移修正步驟。 2.=求们之軟性材料附著方法,其具有在進行前述⑷ σ)步驟前’加熱前述基板與前述軟性材料中至,、 -方使之膨脹,藉而減小前述基板與前述軟性材料之: 小誤差之加熱步驟。 -3- 如謂求項 本你逆仃則迷加埶 …則’先進行獲取前述基板與前述軟性材料 二 料並計算前述基板與前述軟性象: 差計算步驟, …决差之大小誤 130133.doc 200908838 再進行前述加熱步驟 4.如請求項卜3令任1減小别述大小誤差。 誤差角度修正步驟係,,軟性二:附著方法,其中前述 根據相對該平均值反M 錢之平均值, 料與前述基板中至少—方旋轉角度值旋轉前述軟性材 5.如請求項1〜3中任一項之軟性材料附著方 誤差位移修正步驟係, 、别述 分別以X軸位移值中最大值與最小值之平均 移動前述軟性材料與前述基板中至少一方, D 分別以Y軸位移值中最大值與最小值 A 移動前述軟性材料與前述基板中至少—方。 ° 6 ·如凊求項1〜3中任一項之軟性材料附著方法 誤差位移修正步驟係, 〜中則述 分別以X軸位移值之平均值反方向移動於 咖二 助別述軟性材料 與刖述基板中至少一方, 分別以Y軸位移值之平均值反方向移動龄、上 _ 』述軟性材料 與鈿述基板中至少一方。 130133.doc(c) calculating an error angle calculation step of an error angle of at least one of the connecting axes between the marks on the substrate and the mark on the soft f-material corresponding to the upper axis of the substrate; (4) calculating by the aforementioned error angle Angle, rotating at least the square error angle correction step of the soft material and the substrate; (4) calculating a displacement calculation step of at least one displacement between the mark on the substrate and the soft material; H (7) in the foregoing bit calculation step The obtained displacement is calculated and calculated, and the error displacement correcting step of at least one of the soft material and the substrate is moved. 2. a method for adhering a soft material, which comprises: heating the substrate and the soft material to expand before the step (4) σ), thereby reducing the substrate and the soft material. : Small error heating step. -3- If you are looking for the item, you will add it to the 仃 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 先 先 先 先 先 先 先 先 先 先 先 先 先 先Doc 200908838 Then carry out the aforementioned heating step 4. If the request item 3 command 1 reduces the size error. The error angle correction step is a softness method: the attachment method, wherein the foregoing is based on an average value of the inverse M-money relative to the average value, and rotates the soft material with at least a square rotation angle value in the substrate. 5. Request items 1 to 3 The soft material attachment side error displacement correction step of any one of the above, wherein the soft material and at least one of the substrates are moved by an average of the maximum value and the minimum value of the X-axis displacement values, respectively, and D is respectively shifted by the Y-axis. The medium maximum value and the minimum value A move at least the above-mentioned soft material and the aforementioned substrate. ° 6 · The error-correcting step of the soft material adhesion method according to any one of the items 1 to 3, wherein the average value of the X-axis displacement value is reversed in the opposite direction, and the soft material is At least one of the substrates is moved in at least one of the soft material and the description substrate in the opposite direction with respect to the average value of the Y-axis displacement values. 130133.doc
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CN115140531A (en) * 2021-12-11 2022-10-04 武汉帝尔激光科技股份有限公司 Alignment method suitable for large-size flaky materials

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