200907451 .九、發明說明： 【發明所屬之技術領域】 本發明涉及一種鏡頭模組，尤其涉及一種具有良好抗 電磁波干擾能力之鏡頭模組。 【先前技術】 照相功能已經成為各種可檇式電子產品例如手機及個 人數位助理（PDA)不可或缺之主要功能之一。照相模組通常 包括至少一個鏡頭模組，以及一個與鏡頭模組相對設置之 影像感測器元件。鏡頭模組通常包括鏡頭座、設置於鏡頭 座之鏡筒、以及沿光軸方向依次固定於鏡筒内之透鏡組、 間隔環及濾光片等光學元件。而影像感測器元件通常封裝 於鏡頭座内，或是直接封裝於該鏡筒底部，與鏡頭模組配 合用於成像。 惟，現有之鏡頭模組之鏡頭座與鏡筒之材料以塑膠如 PC/ABS (聚丙烯/丙烯腈-丁二烯-苯乙烯）工程塑料、聚四 氟乙烯等居多，通常不具備良好抗電磁波干擾能力，影像 感測器元件容易受到外界電磁波之干擾而產生雜訊，該電 磁波之干擾可通過如Zhenguang Liang等人於2006年10月 SPIE系統檢測儀錶與控制技術第六次國際研討會（Sixth International Symposium on Instrumentation and Control Technology)上發表之論文 Radiated electromagnetic interference (EMI) measuring system 中揭示之電磁干擾測 量糸統測得。該電磁波之干擾導致無法獲得清晰之圖像’ 造成成像品質不佳。當成像解析度較高時，外界電磁波對 6 200907451 之影響就更為明 影像感測器元件干擾所造成之對成像 顯。 ' 【發明内容] 因此’有必要提供一種I有_ ^ , 、有良好抗電磁波干擾能力之 鏡頭核組，以有效提高成像之品質。 —種鏡頭模組，包括鏡頭座 ^ * 貝度興固疋於鏡頭座之鏡筒， 该鏡頭座外表面套設有一電磁 , 电嗞屏敝套，该電磁屏蔽套之形 狀與鏡赫之外表面相匹配，該電磁屏蔽套之材料為金屬。 與先前技術相比，該鏡頭模組在鏡頭座之外表面套設 有電磁屏蔽套，該電磁屏蔽套由金屬材料形成，具有良好 之抗電磁波干擾能力’可有效屏蔽外界電磁波，大大降低 電磁波對與鏡頭模組相配合之影像感測器元件之干擾，從 而提高成像之品質。 【實施方式】 下面結合附圖對本發明實施例提供之鏡頭模組1〇作進 一步說明。 請參閱圖1與圖2,實施例提供之鏡頭模組1〇，其包 括鏡筒110、濾光片120、間隔環130、透鏡組14〇及鏡頭 座 150。 該鏡筒110呈中空圓筒體，用於容納濾光片12〇、間隔 環130以及透鏡組140。该鏡筒11〇包括第一端部in與相 對之第一端部112。該第一端部in開設有入光孔ns，光 線可由g亥入光孔113進入鏡頭模組1 〇，並依次透過滅光片 120及透鏡模組140。該鏡筒11 〇之外壁可設有螺紋，其用 200907451 於與鏡頭座150所設之螺紋相配合，使得鏡筒110可固定 於鏡頭座150。當然，鏡筒110也可通過其他方式固定於鏡 頭座150。 由鏡筒110之第一端部111至第二端部112，濾光片 120、間隔環130以及透鏡組140沿光軸方向依次固定於鏡 筒110内。 該鏡頭座150具有容置腔151，用於容納固定鏡筒110 和影像感測器元件20。該鏡頭座150具有第一基座部152 與相對之第二基座部153。該第一基座部152内壁設有螺 紋，其與鏡筒110之第二端部112外壁之螺紋相配合，用 於將鏡筒110固定於鏡頭座150。該第二基座部153可用於 與其他元件或裝置相連。本實施例中，該第二基座部153 固定于封裝有影像感測器元件20之電路板22上，從而使 得影像感測器元件20設置於該第二基座部153。該影像感 測器元件20將由入光孔113進入鏡頭模組10，並依次透過 濾光片120與透鏡模組140之光訊號轉換成電訊號，從而 獲取數位圖像訊號。該影像感測器元件20可為電荷耦合元 件（Charge Coupled Device，CCD)或者互補金屬氧化物半 導體元件（Complementary Metal Oxide Semiconductor， CMOS)。 該鏡頭模組10進一步包括一電磁屏蔽套30,該電磁屏 蔽套30套設於鏡頭座150之外表面。本實施例鏡頭座150 之外表面呈階梯狀，與之相匹配之電磁屏蔽套30也呈階梯 狀，該電磁屏蔽套30包括一端部接觸部302、一第一接觸 200907451 152 ^ 3〇6 ^ ^ „ 3〇2 „ ^ ^ 面相接觸:配，且與第-基座部152之端部表 卸相接觸’该第一接觸部3〇 與第一基座端152及mf 分別具有 # 一基座4 153之外表面相匹配开> 狀，且分別與第一基座端152及第 :匹配之❿ 接觸。本實施中，該端部接觸；：卜表面 第二接觸部观為一體結構。 帛接觸部304及一 該電磁屏蔽套30之材料選自銅、叙 不銹鋼等之其中一種，該雷斑尸#太 螺鈦以及 1微来卒Λ 并敝套30之厚度範圍優選為 I米。該_屏蔽套％料屏蔽外界電磁波對 =象感測器元件20之干擾，從而提升成像品質。；=對 δ亥電磁屏蔽套3〇與鏡頭座15〇之固定 解 並不限於本實施例；另外，電H、他方式， 實際需求設計。 電磁屏蔽套30之厚度也可根據 ⑽蔽套3G之形成並套設於鏡頭座 料之厚度優選範圍為1微_片狀金屬材 定，·其次，狀之r二=也可依實際需要而 型為鏡頭座15〇外表面之勉制（f〇㈣之方法成 m A 面之輪廓形狀’即形成電磁屏蔽套 :广人，將電磁屏蔽套30套設於鏡 = 曰直接固定（snap on)於鏡頭座ls〇表面， 屏蔽套30與鏡頭座15〇外$ ，可於電磁 外表面之間塗覆或喷塗枯膠，以將 200907451 電磁屏蔽套30與鏡頭座15〇更好地固定。 當然，也可於鏡筒11〇之外表面套設電磁屏蔽套，、 進一步增強鏡頭模纽對電磁波之屏蔽效果，減少外界以 波對影像感測為元件20之干擾，從而提升成像之品質^磁 綜上所述，本發明確已符合發明專利之要件，遂依 提出專利申請。惟’以上所述者僅為本發明之較佳實^方 式自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修_或變二 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明實施例提供之鏡頭模組之剖視圖。 圖2係本發明實施例提供之鏡頭模組之部分θ八 意 圖 〇 , /V^ 透鏡組 140 鏡頭座 15〇 容置腔 151 第一基座部 152 第二基座部 153 端部接觸部 302 第一接觸部 304 第一接觸部 306 鏡頭模組 30 【主要元件符號說明】 鏡頭模組 1 〇 影像感測器元件20 電路板 22 鏡筒 11〇 第一端部 in 第二端部 112 入光孔 113 濾光片 120 間隔環 1 3 π200907451. IX. INSTRUCTIONS: TECHNICAL FIELD The present invention relates to a lens module, and more particularly to a lens module having good resistance to electromagnetic interference. [Prior Art] Camera functions have become one of the main functions that are indispensable for various portable electronic products such as mobile phones and PDAs. The camera module typically includes at least one lens module and an image sensor component disposed opposite the lens module. The lens module generally includes a lens holder, a lens barrel disposed on the lens holder, and an optical element such as a lens group, a spacer ring, and a filter that are sequentially fixed in the lens barrel in the optical axis direction. The image sensor component is usually packaged in the lens mount or directly packaged on the bottom of the lens barrel for use with the lens module for imaging. However, the lens holder and the lens barrel of the existing lens module are mostly made of plastic such as PC/ABS (polypropylene/acrylonitrile butadiene styrene) engineering plastics, polytetrafluoroethylene, etc., and usually do not have good resistance. Electromagnetic wave interference capability, image sensor components are susceptible to external electromagnetic waves to generate noise, and the electromagnetic wave interference can be passed through the sixth international seminar on instrumentation and control technology of SPIE system in October 2006 (Zhenguang Liang et al.) The electromagnetic interference measurement system disclosed in the Radiated electromagnetic interference (EMI) measuring system is published in the paper published on Sixth International Symposium on Instrumentation and Control Technology. The interference of the electromagnetic wave causes a clear image to be obtained, resulting in poor image quality. When the imaging resolution is high, the influence of the external electromagnetic wave on 6 200907451 is more obvious to the imaging caused by the interference of the image sensor components. [Explanation] Therefore, it is necessary to provide a lens core group that has _ ^ , and has good resistance to electromagnetic interference to effectively improve the quality of imaging. - A lens module, including a lens holder ^ * Betty Xingfu is attached to the lens barrel of the lens holder. The outer surface of the lens holder is provided with an electromagnetic, electro-optical screen sleeve, and the shape of the electromagnetic shielding sleeve is different from that of the mirror housing. The surface is matched, and the material of the electromagnetic shielding sleeve is metal. Compared with the prior art, the lens module is provided with an electromagnetic shielding sleeve on the outer surface of the lens holder. The electromagnetic shielding sleeve is formed of a metal material and has good anti-electromagnetic interference capability, which can effectively shield external electromagnetic waves and greatly reduce electromagnetic wave pairs. The interference of the image sensor components in conjunction with the lens module improves the quality of the image. [Embodiment] Hereinafter, a lens module 1 according to an embodiment of the present invention will be further described with reference to the accompanying drawings. Referring to FIG. 1 and FIG. 2, the lens module 1A of the embodiment includes a lens barrel 110, a filter 120, a spacer ring 130, a lens group 14A, and a lens holder 150. The lens barrel 110 has a hollow cylindrical body for accommodating the filter 12A, the spacer ring 130, and the lens group 140. The barrel 11 includes a first end in and a first end 112 opposite. The first end portion is provided with an optical aperture ns, and the optical line can enter the lens module 1 through the optical aperture 113, and sequentially passes through the extinction film 120 and the lens module 140. The outer wall of the lens barrel 11 can be provided with a thread which is matched with the thread provided by the lens holder 150 by 200907451, so that the lens barrel 110 can be fixed to the lens holder 150. Of course, the lens barrel 110 can also be fixed to the lens holder 150 by other means. From the first end portion 111 to the second end portion 112 of the lens barrel 110, the filter 120, the spacer ring 130, and the lens group 140 are sequentially fixed in the lens barrel 110 in the optical axis direction. The lens mount 150 has a receiving cavity 151 for receiving the fixed lens barrel 110 and the image sensor element 20. The lens mount 150 has a first base portion 152 and an opposite second base portion 153. The inner wall of the first base portion 152 is provided with a thread which cooperates with the thread of the outer wall of the second end portion 112 of the lens barrel 110 for fixing the lens barrel 110 to the lens holder 150. The second base portion 153 can be used to connect with other components or devices. In this embodiment, the second base portion 153 is fixed to the circuit board 22 on which the image sensor component 20 is packaged, so that the image sensor component 20 is disposed on the second base portion 153. The image sensor component 20 enters the lens module 10 through the light entrance hole 113, and sequentially converts the optical signals transmitted through the filter 120 and the lens module 140 into electrical signals to obtain a digital image signal. The image sensor element 20 can be a Charge Coupled Device (CCD) or a Complementary Metal Oxide Semiconductor (CMOS). The lens module 10 further includes an electromagnetic shielding sleeve 30 that is sleeved on the outer surface of the lens holder 150. The outer surface of the lens holder 150 of the embodiment is stepped, and the electromagnetic shielding sleeve 30 matched with the step is also stepped. The electromagnetic shielding sleeve 30 includes an end contact portion 302 and a first contact 200907451 152 ^ 3〇6 ^ ^ „ 3〇2 „ ^ ^ Surface contact: matched, and is in contact with the end of the first base portion 152. The first contact portion 3〇 and the first base end 152 and mf respectively have a #基基The outer surfaces of the seats 4 153 are matched to each other and are in contact with the first base end 152 and the first: matching ❿. In this embodiment, the end portion is in contact; the surface of the second contact portion is an integral structure. The material of the 帛 contact portion 304 and the electromagnetic shielding sleeve 30 is selected from the group consisting of copper, stainless steel, etc., and the thickness of the stalk and the stalk 30 is preferably 1 meter. The _ shielding sleeve % material shields the external electromagnetic wave pair from the interference of the sensor element 20, thereby improving the imaging quality. ;= The fixed solution of the δ海 electromagnetic shielding sleeve 3〇 and the lens holder 15〇 is not limited to this embodiment; in addition, the electric H, his mode, the actual demand design. The thickness of the electromagnetic shielding sleeve 30 can also be formed according to the (10) shielding sleeve 3G and the thickness of the lens housing is preferably set to 1 micro_sheet metal material, and secondly, the shape r 2 can also be according to actual needs. The type is the outer surface of the lens housing 15〇 (f〇(4) method is the contour shape of the m A surface] that forms the electromagnetic shielding sleeve: wide people, the electromagnetic shielding sleeve 30 is set on the mirror = 曰 directly fixed (snap on ) On the surface of the lens holder ls〇, the shielding sleeve 30 and the lens holder 15 are $ outside, and the glue can be coated or sprayed between the electromagnetic outer surfaces to better fix the 200907451 electromagnetic shielding sleeve 30 and the lens holder 15〇. Of course, an electromagnetic shielding sleeve can also be placed on the outer surface of the lens barrel 11 to further enhance the shielding effect of the lens mold on the electromagnetic wave, thereby reducing the interference of the external image wave sensing on the component 20, thereby improving the quality of the imaging. In the above, the invention has indeed met the requirements of the invention patent, and the patent application is filed. However, the above description is only the preferred embodiment of the invention, and the scope of the patent application of the present invention cannot be limited thereby. Those who are familiar with the skills of this case BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a lens module according to an embodiment of the present invention. FIG. 2 is an embodiment of the present invention. Part of the lens module θ8 is intended to be 〇, /V^ lens group 140 lens holder 15 〇 accommodating cavity 151 first base portion 152 second base portion 153 end contact portion 302 first contact portion 304 first contact 306 lens module 30 [Description of main component symbols] Lens module 1 〇 image sensor component 20 circuit board 22 lens barrel 11 〇 first end in second end 112 light entrance 113 filter 120 spacer ring 1 3 π