JP2003101002A - Camera module and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure of a camera module, in which unwanted light is not made incident on the light-receiving face of an image pickup element, even if respective members including a substrate used for mounting the image pickup element have transmittance. SOLUTION: The image pickup element 4 is flip-flop mounted on the substrate 2 where a through-hole 2a is made. A lens unit, having a lens 6 facing the light-receiving face 4a of the image pickup element 4 through the through-hole, is fitted to a side opposite to the image pickup element of the substrate 2. A resin part 20A constituted of opaque resin, is disposed near the inner face of the through-hole 2a. Thus, transmitted light which is made incident on the through-hole 2a is interrupted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a camera module, and more particularly to a camera module including an image sensor and a lens for forming a subject image on the image sensor.

In recent years, mobile phones and handy personal computers (portable personal computers) incorporating small cameras have been developed. For example, a mobile phone equipped with a small camera captures the image of the caller with the small camera, captures it as image data, and transmits the image data to the other party. As a small camera system used for such an application, a camera module including a signal processing system using an image sensor has been developed, but it is required to be installed in a small information terminal such as a personal computer or a portable videophone. Along with this, there is an increasing demand for miniaturization of camera modules.

[0003]

2. Description of the Related Art As a camera module which can be miniaturized, an image pickup device is flip-chip mounted on one surface of a light-transmissive substrate provided with a through hole for light reception, and a space above the light receiving portion is provided on the other surface. There is a camera module having a structure in which a lens unit for image formation is mounted in a covered state. Come on the camera module. The image sensor detects light from the element surface where the light receiving section and the microlens are present, performs photoelectric conversion, and supplies the image signal obtained by this to a signal processing circuit or the like to display an image on the screen of a display or the like. .

FIG. 1 is a sectional view showing an example of a conventional camera module. The conventional camera module shown in FIG. 1 has a configuration in which the image pickup device 4 is mounted on one surface side of the substrate 2 and the lens holder 8 to which the lens 6 is mounted is mounted on the one surface side of the substrate 2. The lens 6 is fixed to the lens barrel portion 10, and the lens barrel portion 10 is screwed to the lens holder 8. A filter 12 is provided on the lens barrel 10. The lens holder 8 is fixed to the substrate 2 with an adhesive 14.

The image pickup device 4 is a C-MOS sensor or CCD.
The light-receiving surface 4a is flip-chip mounted on the substrate 2 via the bumps 4b with the light-receiving surface 4a facing the substrate (face down). The light receiving surface 4a is arranged corresponding to the through hole 2a formed in the substrate 2 and faces the lens 6 through the opening 2a. Thereby, the light incident on the lens 6 is
An image is formed on the light receiving surface 4a of the image pickup element 4 via the filter 12, and an electric signal corresponding to the image on the light receiving surface 4a is output from the image pickup element 4.

[0006]

In the camera module having the above structure, a thin flexible substrate is used as the substrate 2. Generally, such a flexible substrate has a structure in which a wiring layer 2B patterned by etching is formed on a base material 2A such as a polyimide film by forming a layer of a conductive member such as copper (Cu). . The wiring layer 2B does not transmit light, but the base material 2A made of a resin material has a light-transmitting property.

When light other than the light that has passed through the lens 6 is incident on the light-receiving surface 4a of the image pickup device 4, such light becomes noise (ghost image) in the image and the quality of the obtained image deteriorates. I will end up. Therefore, when the flexible substrate 2 as described above is used, light is incident on the through hole 2a from the outside through the light-transmissive base material 2A, and as a result, unnecessary light is incident on the light receiving surface 4a. Therefore, there is a problem that the image quality is deteriorated.

Also, the underfill material 16 used when flip-chip mounting the image pickup device uses an insulating linear resin or an anisotropic conductive resin based on epoxy, and the light transmitted through the underfill material is received. There is also a possibility of incidence on the surface 4a. Further, the adhesive for fixing the lens holder 8 to the substrate 2 is also a resin material, and light may enter from this portion.

The present invention has been made in view of the above points, and even if each member including a substrate used for mounting an image pickup element is a translucent material, the light receiving surface of the image pickup element is An object is to provide a structure of a camera module in which unnecessary light does not enter.

[0010]

In order to solve the above problems, the present invention is characterized by taking the following means.

According to a first aspect of the present invention, there is provided a substrate having a through hole, an image pickup device flip-chip mounted on the first surface of the substrate, and a first surface of the substrate opposite to the first surface. Two
And a lens unit having a lens facing the light receiving surface of the image sensor through the through hole, wherein a resin portion made of an opaque resin is provided in the vicinity of the inner surface of the through hole. By disposing it, the transmitted light entering the through hole is blocked.

According to the first aspect of the present invention, the resin portion made of an opaque resin provided in the vicinity of the inner surface of the through hole of the substrate blocks the transmitted light incident on the through hole by dropping the base material of the substrate. can do. Therefore, it is possible to prevent unnecessary light from entering the light-receiving surface of the image sensor and generating noise in the image.

The invention according to claim 2 is the camera module according to claim 1, wherein the resin portion is formed so as to cover the inner surface of the through hole.

According to the second aspect of the present invention, the resin portion can be easily formed by applying the liquid resin around the through hole.

The invention according to claim 3 is the camera module according to claim 1, wherein the resin portion is formed around the through hole on the first surface of the substrate. To do.

According to the third aspect of the invention, it is possible to block the transmitted light from the underfill material provided between the image pickup device and the substrate. In addition, the resin portion can prevent the underfill material from flowing into the light receiving surface of the image pickup element. The resin portion can be easily formed by applying a resin resist on the substrate and then punching it at the same time as the through holes.

According to a fourth aspect of the present invention, in the camera module according to the first aspect, the resin portion is disposed in a through groove formed around the through hole of the substrate. It is what

According to the fourth aspect of the invention, the resin portion can be easily formed by filling the liquid resin into the through groove.

The invention according to claim 5 is the camera module according to claim 4, wherein the resin portion is formed of an underfill material provided between the image pickup device and the substrate. To do.

According to the fifth aspect of the invention, the resin portion can be easily formed by using the underfill material.

According to a sixth aspect of the present invention, a substrate provided with a through hole, an image pickup device flip-chip mounted on the first surface of the substrate, and a first surface of the substrate opposite to the first surface. Two
And a lens unit having a lens facing the light receiving surface of the image sensor through the through hole, the lens unit being formed on the second surface of the substrate. And a mold resin portion having a portion covering the inner surface of the through hole and molded by an opaque resin, and a lens support portion attached to the mold resin portion and supporting the lens. To do.

According to the sixth aspect of the present invention, it is possible to block the transmitted light that passes through the base material of the substrate and enters the through hole by the mold resin portion. Further, the mold resin portion functions as a pedestal to which the lens support portion is attached, and the lens support portion can be reliably fixed to the substrate.

According to a seventh aspect of the invention, there is provided the camera module according to the sixth aspect, wherein the lens support portion is fitted and fixed to an opening formed in the mold resin member.

According to the seventh aspect of the invention, the lens supporting portion can be easily attached to the mold resin portion.
Further, since the mold resin portion has high dimensional accuracy, it is not necessary to adjust the distance between the lens and the light-receiving surface simply by fitting and fixing the lens support portion.

According to an eighth aspect of the present invention, an image pickup device is flip-chip mounted on a first surface of a substrate having a through hole and a through groove formed around the through hole, and the image pickup device is mounted in the through groove of the substrate. A lens unit having a lens that is filled with an opaque liquid resin and cured, and that faces the light receiving surface of the image pickup device through the through hole on a second surface of the substrate opposite to the first surface. It is characterized by attaching.

According to the eighth aspect of the present invention, the opaque resin portion can be easily formed by filling the opaque liquid resin in the through groove, and the opaque resin portion is transmitted through the substrate to enter the through hole. It is possible to block transmitted light. Therefore, it is possible to prevent unnecessary light from entering the light-receiving surface of the image sensor and generating noise in the image.

According to a ninth aspect of the present invention, an opaque underfill material made of liquid resin is applied to the first surface of a substrate having a through hole and a through groove formed around the through hole to form an image sensor. Flip-chip mounting is performed on the first surface of the substrate via the underfill material, the underfill material is filled in the through groove, and the first surface of the substrate opposite to the first surface is filled. A lens unit having a lens facing the light receiving surface of the image pickup device through the through hole is attached to the second surface.

According to the ninth aspect of the present invention, the opaque resin portion can be easily formed by filling the through groove with the underfill material made of the opaque resin.
The transmitted light that passes through the substrate and enters the through hole can be blocked. Therefore, it is possible to prevent unnecessary light from entering the light-receiving surface of the image sensor and generating noise in the image.

According to a tenth aspect of the present invention, the first surface of the substrate having the through hole and the through groove formed around the through hole is provided with a mold resin portion including a portion accommodated in the through groove. Formed by transfer molding using an opaque resin, the image pickup element is flip-chip mounted on the first surface of the substrate, and the second surface of the substrate opposite to the first surface is It is characterized in that a lens unit having a lens facing the light receiving surface of the image pickup device is attached through a through hole.

According to the tenth aspect of the present invention, the opaque mold resin portion can block the transmitted light that passes through the substrate and enters the through hole. Therefore, it is possible to prevent unnecessary light from entering the light-receiving surface of the image sensor and generating noise in the image.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings.

First, a first embodiment of the present invention will be described with reference to FIG. FIG. 2 is a sectional view of a camera module according to the first embodiment of the present invention. In FIG. 2, FIG.
Parts that are the same as the parts shown in FIG. 4 are given the same reference numerals, and descriptions thereof will be omitted.

The camera module according to the first embodiment of the present invention has the same basic structure as that of the camera module shown in FIG. 1, except that the resin portion 2 is formed in the vicinity of the periphery of the through hole 2a of the substrate 2.
0A is arranged to block the light incident on the through hole 2a from the substrate 2 and its vicinity. for that reason,
An opaque epoxy resin is used as the resin portion 20A, for example. Here, the opaque resin means a resin that does not transmit light, for example, a dark black or gray resin that can substantially block light.

To form the resin portion 20A, first, the image pickup device 4 is flip-chip mounted on the substrate 20, and then the resin 2 is formed.
A resin forming 0 is applied to the periphery of the through hole 2a and the portion where the lens holder 8 is fixed. Then, the lens holder 8 is arranged on the substrate 2 via the applied resin, and the resin is cured to fix the lens holder 8 to the substrate 2. As described above, in this embodiment, the resin portion 20A is used as the adhesive for fixing the lens holder 8, and it is not necessary to apply the adhesive 14. Here, in this embodiment, the lens unit is configured by the lens barrel portion 10 having the lens 6 and the lens holder 8, and the lens unit is fixed to the substrate 2 by fixing the lens holder 8 to the substrate. Becomes

As described above, in this embodiment, the inner surface of the through hole 2a of the substrate 2 and the end surface of the underfill material 16 are
Since it is covered with the opaque (non-translucent) resin portion 20A, light transmitted through these members does not enter the through hole 2a, and unnecessary light enters the light receiving surface 4a of the image sensor 4. Can be prevented.

Here, instead of using the resin of the resin portion 20A as the adhesive for fixing the lens holder 8 to the substrate, the adhesive 14 may be used as shown in FIG.
That is, the thickness of the adhesive for adhering the lens holder 8 affects the distance between the lens 6 and the light receiving surface 4a, so that it is preferable to make the thickness as uniform as possible. Therefore, the resin portion 20B provided for blocking the light and the adhesive 14 for adhering the lens holder 8 are separately provided, and the resin (adhesive) that performs the optimum function is selected.

Although the resin portion 20B is in contact with the lens holder 8 in FIG. 3, it need not necessarily be in contact with the lens holder 8 as long as it substantially covers the end portion of the adhesive 14. .

Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a sectional view of a camera module according to a second embodiment of the present invention. 4, parts that are the same as the parts shown in FIG. 1 are given the same reference numerals, and descriptions thereof will be omitted.

The camera module according to the second embodiment of the present invention has the same basic structure as that of the camera module shown in FIG. 1, except that the resin portion 2 is provided in the vicinity of the periphery of the through hole 2a of the substrate 2.
0C is arranged to block the light that passes through the underfill material 16 and enters the through hole 2a.

The resin portion 20C is a resist made of, for example, an opaque resin, and is formed on the substrate 2 in advance. Figure 5
FIG. 6 is a diagram for explaining a method of forming the resin portion 20C.
First, as shown in FIG. 5A, a resin made of a resist is applied and cured on the wiring layer 2A side of the substrate 2 before the through holes 2a are formed. As this resin, a resin of a color that is opaque and transmits light as little as possible is selected. Also, the resin part 2
The thickness of 0C is determined in consideration of the height of the bumps 4a of the image pickup device 4, and the shape and area of the resin portion 20C to be applied are set so as to be within the array of the bumps 4a.

Next, after the resin portion 20C is cured, FIG.
As shown in (b), the resin portion 20C and the portion corresponding to the through hole 2a of the substrate 2 are removed by punching so that the outer peripheral portion of the resin portion 20C remains on the substrate 2. This allows
On the wiring layer 2B side of the substrate 20, the substrate 2 having the resin portion 20C formed on the outer periphery of the through hole 2a is formed. This board 2
Then, the image pickup device 4 is flip-chip mounted via the underfill material 16.

Since the resin portion 20C covers the inner peripheral side of the underfill 16, light passing through the underfill material 16 is blocked by the resin portion 20C. Further, by providing the resin portion 20C, it is possible to prevent the underfill 16 from flowing out to the light receiving surface 4a of the image pickup element 4 or the lens holder 8 side.

Although the resist is used as the material of the resin portion 20C in this embodiment, the invention is not limited to this.
Any opaque resin that can be applied to the substrate 2 and cured and is hard to transmit light may be used.

Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 6 is a sectional view of a camera module according to a third embodiment of the present invention. 6, parts that are the same as the parts shown in FIG. 1 are given the same reference numerals, and descriptions thereof will be omitted.

The camera module according to the third embodiment of the present invention has the same basic structure as that of the camera module shown in FIG. 1, but the resin portion 2 is provided near the outside of the through hole 2a of the substrate 2.
0D is arranged to block the light that passes through the substrate 2 and enters the through hole 2a. As a material for forming the resin portion 20D, for example, a liquid epoxy resin which has a low viscosity at room temperature and is opaque is used, and a color that does not transmit light, for example, a deep black epoxy resin is suitable.

FIG. 7 is a diagram for explaining a method of forming the resin portion 20D in the substrate around the through hole 2a. First, when the through hole 2a of the substrate 2 is formed by punching or the like, the through groove 2b for forming the resin portion 20D is formed around the through hole 2a. Next, the image pickup device 4 is flip-chip mounted on the substrate 2 with the underfill material 16 interposed therebetween. In this state, the bottom portion of the through groove 2b is closed by the underfill material 16. Then, as shown in FIG. 7A, the through groove 2b is filled with the liquid resin by using a coating device such as a dispenser. When the liquid resin is cured, a resin portion 2D is formed around the through hole 2a of the substrate 2 as shown in FIG. 7 (b).

In the method of forming the resin portion 2D described above, since the through groove 2b is formed in the substrate 2 and the opaque resin is simply filled, the process is free compared with the method of arranging the resin using a molding die, for example. This is advantageous when handling a wide variety of products or when design changes of the board occur. That is, since it is not necessary to remake the mold according to the change of the product type and the substrate, it is advantageous in cost.

The through groove 2b is preferably provided over the entire circumference of the through hole 2a, but if the through groove 2b is formed so as to completely surround the through hole 2a, the through groove 2b will be formed.
A portion 2c between b and the through hole 2a is separated from the substrate 2. Therefore, for example, the outside and inside of the through groove 2b are left connected in the vicinity of the four corners of the square through hole 2a.

The through groove 2b shown in FIG. 6 penetrates both the base material 2A and the wiring layer 2B of the substrate 2, but since it is the base member 2A that has a light-transmitting property, only the base member 2A is present. It is also possible to form the through groove 2b and to form the resin portion 20D. In this case, even if the through groove 2b is formed so as to completely surround the through hole 2a, since it is connected by the wiring layer, the portion 2 between the through groove 2b and the through hole 2a is formed.
The c is not separated from the substrate 2.

As described above, in this embodiment, since the opaque resin portion 20D is formed around the through hole 2a, the substrate 2
The light transmitted through the base material 2A does not enter the through hole 2a, and it is possible to prevent unnecessary light from entering the light receiving portion 4a of the image sensor 4.

Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 8 is a sectional view of a camera module according to a fourth embodiment of the present invention. 8, parts that are the same as the parts shown in FIG. 1 are given the same reference numerals, and descriptions thereof will be omitted.

The camera module according to the fourth embodiment of the present invention has the same basic structure as the camera module shown in FIG. 1, except that the resin portion 2 is provided near the outside of the through hole 2a of the substrate 2.
0E is arranged to block the light that passes through the substrate 2 and enters the through hole 2a. The resin portion 20E is
As shown in FIG. 8, it is formed as a part of the underfill material 16. The underfill material of this embodiment is selected from an opaque resin material.

FIG. 9 is a diagram for explaining a method of forming the resin portion 20E. First, similarly to the third embodiment described above, when the through hole 2a of the substrate 2 is formed by punching or the like, the through hole 2
A through groove 2b for forming the resin portion 20E is formed around a. Next, as shown in FIG. 9, an underfill material 16 made of resin is applied to the periphery of the through groove, and the image sensor 4 is flip-chip mounted. At this time, as shown in FIG. 9B, the underfill material 16 filled between the image pickup device 4 and the substrate 2 has a through groove 2b during the flip chip mounting.
The underfill material 1 also enters the inside of the through groove 2b.
6 is filled. The resin portion 20E is formed by curing the underfill material 16. The application amount of the underfill material 16 is determined in advance so that the through groove 2b is filled with an appropriate amount.

As described above, in this embodiment, since the opaque resin portion 20E is formed around the through hole 2a, the light transmitted through the base material 2A of the substrate 2 does not enter the through hole 2a, and the imaging is performed. It is possible to prevent unnecessary light from entering the light receiving portion 4a of the element 4. Further, since the resin portion 20E is formed in the step of filling and forming the underfill material 16, the number of steps can be reduced.

Next, a fifth embodiment of the present invention will be described with reference to FIG.
Will be described with reference to. FIG. 10 is a sectional view of a camera module according to a fifth embodiment of the present invention. 10, parts that are the same as the parts shown in FIG. 1 are given the same reference numerals, and descriptions thereof will be omitted.

The camera module according to the fifth embodiment of the present invention has the same basic structure as that of the camera module shown in FIG. 1, except that a mold resin portion 20F is arranged in the vicinity of the through hole 2a of the substrate 2, It is characterized in that it blocks light that passes through the substrate 2 and enters the through hole 2a. As shown in FIG. 10, the mold resin portion 20F is formed so as to cover the inner surface of the through hole 2a of the substrate and the periphery of the through hole 2a of the substrate 2.

The mold resin portion 20F is formed of a mold resin material such as black or gray which has very little light transmission. A part of the mold resin portion 20 </ b> F enters into the through groove 2 b provided around the through hole of the substrate 2 and is integrated with the substrate 2.

FIG. 11 is a cross-sectional view showing a die for integrally transfer-molding the mold resin portion 20F on the substrate 2. The mold comprises an upper mold half 32 and a lower mold half 34, and an upper mold half 32 and a lower mold half 3
The board 2 is sandwiched between the board 4 and the board 4. The resin flow hole 32a is provided in the upper mold 32. A through groove 2b is formed in advance on the substrate 2 as in the above-described embodiment, and the through groove 2b is filled with a mold resin. As a result, the mold resin portion 20F is formed integrally with the substrate.

In this embodiment, the mold resin portion 20F is molded into a shape that also covers the inner surface of the through hole 12a. With such a shape, it is possible to prevent peeling of the mold resin portion 20F in the portion 2c between the through groove 2b and the through hole 2a. However, when the peeling at the portion 2c of the substrate 2 does not pose a problem, as shown in FIG. 12, the mold resin portion 2 does not have a portion that covers the inner surface of the through hole 2a.
It may be 0G.

Mold resin portion 20F or 20 of this embodiment
G can perform the resin filling step stably and easily, especially when the through hole 2a and the through groove 2b of the substrate 2 are small, and can reliably form the resin portion that blocks light.

Further, the mold resin portion 20F or 20G
Also functions as a pedestal for mounting the lens holder 8, and the lens holder 8 can be reliably mounted on the substrate 2. The lens holder 8 is fixed to the mold resin portion 20F or 20G by the adhesive 14.

Further, in the present embodiment, the lens supporting portion is constituted by the lens barrel portion 10 to which the lens 6 is attached and the lens holder 8, and the lens supporting portion and the mold resin portion 20F or 20.
A lens unit is configured with G.

As described above, in this embodiment, since the opaque mold resin portion 20G or 20G is formed around the through hole 2a, the light transmitted through the base material 2A of the substrate 2 is incident on the through hole 2a. The light receiving section 4a of the image sensor 4
It is possible to prevent unnecessary light from entering.

Next, a sixth embodiment of the present invention will be described with reference to FIG.
Will be described with reference to. FIG. 13 is a sectional view of a camera module according to a sixth embodiment of the present invention. 13, parts that are the same as the parts shown in FIG. 1 are given the same reference numerals, and descriptions thereof will be omitted.

In the camera module according to the sixth embodiment of the present invention, the image pickup device 4 is flip-chip mounted on the substrate 2, and the lens 6 and the light receiving surface 4a of the image pickup device 4 face each other through the through hole 2a of the substrate 2. The structure is the same as that of the camera module shown in FIG.
Is integrally formed on the substrate 2, and the mold resin portion 20
The difference is that the lens barrel portion 10A is attached to H.

The mold resin portion 20H is made of a mold resin material such as black or gray that has very little light transmission, and as shown in FIG. 13, the through hole 2a of the substrate.
Is formed so as to cover the inner surface of the substrate and the periphery of the through hole 2a of the substrate 2. Further, in the mold resin portion 20H, a part of the mold resin portion 20H is inserted into a through groove provided around the through hole 2a of the substrate 2 and integrated with the substrate 2.

That is, the mold resin portion 20H is formed around the through hole 2a of the substrate 2 in the same manner as in the fifth embodiment, and blocks the light transmitted through the base material 2A of the substrate 2. Here, the mold resin portion 20H of the present embodiment has a height higher than that of the mold resin portion 20F of the fifth embodiment described above, and the lens barrel portion 10A is fitted and fixed in the central opening.

Therefore, in this embodiment, the lens holder 6
Is not provided, and it is not necessary to form a screw connection portion in the lens barrel portion 10A as in the lens barrel portion 10. Lens holder 8
When the lens barrel portion 10 is attached to the lens by screw connection, the position adjustment of the lens 6 with respect to the light receiving surface 4a is performed by rotating the lens barrel portion 10. However, in the present embodiment, by utilizing the fact that the dimensional accuracy of the mold resin portion 20H is good, the lens 6 is accurately positioned only by fitting and fixing the lens barrel portion 10A to the central opening of the mold resin portion 20H. There is an advantage that you can. As a result, the structure of the lens unit is simplified and the manufacturing cost can be reduced.

As described above, in this embodiment, since the opaque mold resin portion 20H is formed around the through hole 2a, the light transmitted through the base material 2A of the substrate 2 does not enter the through hole 2a. It is possible to prevent unnecessary light from entering the light receiving portion 4a of the image pickup device 4. Further, the position adjustment of the lens 6 is not required, the structure of the lens unit is simplified, and the manufacturing cost can be reduced.

In this embodiment, the lens barrel portion 10A to which the lens 6 is attached corresponds to the lens supporting portion, and the lens supporting portion and the mold resin portion 20H constitute a lens unit.

As described above, according to the present invention, various effects described below can be realized.

According to the first aspect of the invention, the resin portion made of an opaque resin provided in the vicinity of the inner surface of the through hole of the substrate blocks the transmitted light incident on the through hole by dropping the base material of the substrate. can do. Therefore, it is possible to prevent unnecessary light from entering the light-receiving surface of the image sensor and generating noise in the image.

According to the second aspect of the present invention, the resin portion can be easily formed by applying the liquid resin around the through hole.

According to the third aspect of the invention, it is possible to block the transmitted light from the underfill material provided between the image pickup device and the substrate. In addition, the resin portion can prevent the underfill material from flowing into the light receiving surface of the image pickup element. The resin portion can be easily formed by applying a resin resist on the substrate and then punching it at the same time as the through holes.

According to the fourth aspect of the invention, the resin portion can be easily formed by filling the liquid resin into the through groove.

According to the fifth aspect of the invention, the resin portion can be easily formed by using the underfill material.

According to the sixth aspect of the present invention, the mold resin portion can block the transmitted light that passes through the base material of the substrate and enters the through hole. Further, the mold resin portion functions as a pedestal to which the lens support portion is attached, and the lens support portion can be reliably fixed to the substrate.

According to the seventh aspect of the invention, the lens supporting portion can be easily attached to the mold resin portion.
Further, since the mold resin portion has high dimensional accuracy, it is not necessary to adjust the distance between the lens and the light-receiving surface simply by fitting and fixing the lens support portion.

According to the present invention, the opaque liquid resin can be easily formed by filling the through groove with the opaque liquid resin, and the opaque resin portion is transmitted through the substrate and is incident on the through hole. It is possible to block transmitted light. Therefore, it is possible to prevent unnecessary light from entering the light-receiving surface of the image sensor and generating noise in the image.

According to the ninth aspect of the present invention, the opaque resin portion can be easily formed by filling the through groove with the underfill material made of the opaque resin.
The transmitted light that passes through the substrate and enters the through hole can be blocked. Therefore, it is possible to prevent unnecessary light from entering the light-receiving surface of the image sensor and generating noise in the image.

According to the tenth aspect of the present invention, the opaque mold resin portion can block the transmitted light that passes through the substrate and enters the through hole. Therefore, it is possible to prevent unnecessary light from entering the light-receiving surface of the image sensor and generating noise in the image.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a conventional camera module.

FIG. 2 is a sectional view of a camera module according to a first embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a modified example of the camera module shown in FIG.

FIG. 4 is a sectional view of a camera module according to a second embodiment of the present invention.

FIG. 5 is a diagram for explaining a method of forming the resin portion shown in FIG. 4 on a substrate.

FIG. 6 is a sectional view of a camera module according to a third embodiment of the present invention.

FIG. 7 is a diagram for explaining a method of forming the resin portion shown in FIG. 6 in the substrate.

FIG. 8 is a sectional view of a camera module according to a fourth embodiment of the present invention.

9 is a diagram for explaining a method of forming the resin portion shown in FIG. 8 in a substrate.

FIG. 10 is a sectional view of a camera module according to a fifth embodiment of the present invention.

11 is a cross-sectional view of a mold for forming the mold resin portion shown in FIG.

12 is a cross-sectional view of a mold for forming a modified example of the mold resin portion shown in FIG.

FIG. 13 is a sectional view of a camera module according to a sixth embodiment of the present invention.

[Explanation of symbols]

2 substrates 2a through hole 2b through groove 2A base material 2B wiring layer 4 image sensor 4a Light receiving surface 6 lenses 8 lens holder 10 Lens barrel 12 filters 14 Adhesive 16 Underfill material 20A, 20B, 20C, 20D, 20E Resin part 20F, 20G Mold resin part 32 Mold upper mold 34 Lower mold

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Izumi Kobayashi             4-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa             No. 1 within Fujitsu Limited (72) Inventor Shin Moriya             4-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa             No. 1 within Fujitsu Limited (72) Inventor Hiroshi Kaiya             4-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa             No. 1 within Fujitsu Limited (72) Inventor Toshiyuki Honda             4-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa             No. 1 within Fujitsu Limited F-term (reference) 2H044 AD01 AJ06                 4M118 AA05 AA10 AB01 GD03 GD07                       HA02 HA23 HA25 HA31 HA40                 5C024 AX01 BX01 CY47 CY48 EX22                       EX24 EX42 EX51 HX01                 5F088 BA03 BA15 BB03 JA06 JA09                       JA12

Claims (10)

[Claims] 1. A substrate having a through hole, an image pickup device flip-chip mounted on a first surface of the substrate, and a second surface of the substrate opposite to the first surface. A camera unit having a lens unit having a lens facing the light receiving surface of the image pickup device through the through hole, wherein a resin portion made of an opaque resin is provided near the inner surface of the through hole. A camera module, which blocks transmitted light entering the through hole. 2. The camera module according to claim 1, wherein the resin portion is formed so as to cover an inner surface of the through hole. 3. The camera module according to claim 1, wherein the resin portion is formed around the through hole on the first surface of the substrate. 4. The camera module according to claim 1, wherein the resin portion is arranged in a through groove formed around the through hole of the substrate. 5. The camera module according to claim 4, wherein the resin portion is formed of an underfill material provided between the image pickup device and the substrate. 6. A substrate having a through hole, an image pickup device flip-chip mounted on a first surface of the substrate, and a second surface of the substrate opposite to the first surface. And a lens unit having a lens facing the light receiving surface of the image sensor through the through hole, wherein the lens unit is formed on the second surface of the substrate, and the through hole A camera module having a portion that covers the inner surface of the molded resin portion, the molded resin portion being molded with an opaque resin, and the lens support portion that is attached to the molded resin portion and supports the lens. 7. The camera module according to claim 6, wherein the lens support is fitted and fixed in an opening formed in the mold resin member. 8. A method of manufacturing a camera module, wherein an image pickup device is flip-chip mounted on a first surface of a substrate having a through hole and a through groove formed around the through hole, and the through hole of the substrate is provided. An opaque liquid resin is filled in the groove and cured, and a lens facing the light receiving surface of the image pickup element through the through hole is formed on the second surface of the substrate opposite to the first surface. A method of manufacturing a camera module, comprising mounting the lens unit having the same. 9. A method of manufacturing a camera module, wherein an opaque underfill material made of liquid resin is applied to a first surface of a substrate having a through hole and a through groove formed around the through hole, The image pickup device is flip-chip mounted on the first surface of the substrate via the underfill material, and the underfill material is filled in the through groove, and the imaging element is opposite to the first surface of the substrate. A method of manufacturing a camera module, wherein a lens unit having a lens facing the light receiving surface of the image pickup device through the through hole is attached to the second surface on the side. 10. A method for manufacturing a camera module, comprising: a mold including a portion housed in the through-groove on a first surface of a substrate having the through-hole and the through-groove formed around the through-hole. The resin portion is formed by transfer molding with an opaque resin, the image pickup element is flip-chip mounted on the first surface of the substrate, and the second surface of the substrate opposite to the first surface is mounted. A method of manufacturing a camera module, wherein a lens unit having a lens facing the light receiving surface of the image pickup element is attached to the lens unit via the through hole.