TW200906737A - Recycling method for copper resource in process - Google Patents

Recycling method for copper resource in process Download PDF

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TW200906737A
TW200906737A TW96129106A TW96129106A TW200906737A TW 200906737 A TW200906737 A TW 200906737A TW 96129106 A TW96129106 A TW 96129106A TW 96129106 A TW96129106 A TW 96129106A TW 200906737 A TW200906737 A TW 200906737A
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Taiwan
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copper
solution
steel
item
process described
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TW96129106A
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Chinese (zh)
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de-xin Jiang
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Trinity Resources Technology Holding Inc
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Abstract

In a recycling method for copper resource in a of the process of the present invention, the acidic etching waste solution containing copper, produced in the etching process, mainly is treated with an alkaline solution, so as to form the electroplating solution containing copper for electroplating and to be again used in the process of electro-coppering again. Metal copper is not reduced from the etching waste liquid by using the method of the invention, therefore the highly contaminated extracting solution or the expensive ion-selective membrane are not used. Melting copper with high temperature and highly electricity-consuming purifying by electric shocking also are not employed. Certainly, outsourcing is not necessary, so as to be free of the problem happened during the process of delivering the contaminants.

Description

200906737 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種資源循環再生方法,尤指製 曰表权肀銅資源循 環再生方法。 【先前技術】 -般來說,對電路板製造業來說,若要_環鱗求,首先 是減量化(Reduce )’減少能源和原材料耗用詈, 里 消除或減少有 毒有害化學品的賴量,麵消耗少、效率高、無污染或少污& 的工藝、設㈣代落後的X藝、設備。如層壓板怖Z 致癌的溴化物阻_,而以無4覆銅板代替;_含錯的锡錯合 金’而改由無錯代替。在電路板製程中的電鍍工藝中(即化學鍍 銅、電鍍銅、電鍍錫錯合金、電鍍鎳和電鍛金等),已將電^工 藝採用氰化物,改成無氰的硫酸銅電鍍。 其次,是再使用(Reuse),最大限度地利用能源和原材料, 實現物料最大限度的廠内迴圈。在·板製造程序中,需要大量 的水和電。解料面板生產巾水缸料少於五道,雙面板^ 產中水洗工序不少於十道,多層板水洗功更多。因此,對於 路板製造廠練,若不提高再生量,㈣廢水微量也多,使 廢水治理成本也面。若減少濕處理工序,就可喊少廢水排放量。 5 200906737 例如’若採用加HjL藝,就不需侃彳水洗卫序。此外,改進設 備设施,如清洗水採取逆流漂洗,冷卻水的回用等,也有一定的 節水效果。最常見的方式,就是把廢水經去除雜質處理後回用等 等。 再來’是資源回收(Recycle ),把最終産生的有限的廢棄物 再次變成資源’得以回收糊。電路板廠的廢棄物主要有報廢電 路板和基板廢料’対針败加工得到鱗金屬,而非金屬材 料可用於建材魏緣材料的填充料。細舰和賴廢液都含有 銅等金屬,故可藉著電解、置換、還原、吸附等方法提取金屬物。 若是含有有機彳邊_廢水,則經分解沈殿處理的泥潰,可能成 爲肥料。 在資源回收中,已有許多人提出各類專利,例如美國專利第 7175819號(在氯化銅溶液中加入硫酸,而回收銅)、美國專利第 6521117號(利用隔膜技術並配合萃取液,再實施回收或電解回 收’以回收金屬銅或硫酸銅)、美國專利第疆188號(利用隔膜 技術’由微健液中’回收金屬銅)、美國專利第59〇6749號(調 整廢液PH值,並加入鐵粉,以回收銅包鐵心粉末)、美國專利第 5560838號(將鹼液與廢液加熱,並混合反應,以製造氧化銅)、美 國專利第51887G3號(將驗性氨鋼廢液酸化,以沉澱雙晶銅土,再 轉製氧化銅或硫酸銅)、美國專利第4622344號(利用離子選擇膜 和溶液萃取’電解回收金屬銅鱗化結晶硫酸銅)。 200906737 然而,在上述方法中,為了從侧廢液還原出金屬銅,反而 需用到容易污_水的萃取溶液或昂貴的離子選擇膜,也須用到 高溫熔銅與非常耗電的電取純化。若電路板騎要委外處理時, 還會有運送污染物的過程中可能產生的問題。 【發明内容】 本發明之主要目的在提供—種製程巾靖源循環再生方法, 藉著將處贿的侧練,人猶製針,崎舰源頭減 廢,實現最環保的循環再生模式。 基於上述目的’在本發明製程中銅:錄循環再生方法中,當 触刻製程產生出含銅_紐_廢㈣,主要是儀雜溶液處 理含銅的酸祕刻廢液,㈣成電鍍用的含銅的電錢溶液,並再 度投入電賴賴針。祕本發财料概侧舰還原出 金屬銅,科再需關料污雜水科取溶液或昂貴的離子選 擇膜’也無須關高溫熔銅鱗常耗電的電取純化,當然也無須 委外處理’而沒有運送污雜的触巾可能產生的問題。 關於本發明之優點與精神可以藉由以下的發明詳述及所附圖 式得到進一步的瞭解。 【實施方式】 在本發明製程中銅資源循環再生方法中,當钱刻製程產生出 200906737 含銅的酸性姓刻廢液時,本發明方法主要是利用鹼性溶液處理含 銅的酸性餘刻廢液,以形成電鏡用的含銅的電鍍溶液,並再产产 入電錢銅的製程中。 又又 /. 採用了上述方式之後,由於已不再從侧廢液_出金屬 銅,而不再需用到容易污染藥水的萃取溶液或昂貴的離子選擇 膜,也無須用到高溫熔銅與非常耗電的電取純化,當然也=須委 外處理’而沒有運送污染物的過程中可能產生的問題。… 若於不同_麻賴產生的_廢液,在上_環過程中 略有些許不同,底下試以氯化鐵與氯化舰刻溶液為 步說明。 口月參閱第1圖’第1圖為本發明製程中銅資源循環再生方法 。如第1圖所示,在本發明製程中銅資源循環再生 w理犧性蝴廢液為氯化銅溶㈣,可被鹼性溶液 麵7·5至8.G),與水洗處 、、、件,,/爭的氫氧化銅溶液的電錢溶液、以及中性廢水。 上述鹼/·生冷液為虱氧化納溶液時,含銅沈殺物 ,恤爾 _ d 之21 ’第2圖為本發_程中銅資源循環再生方法 方法中,騎示,在本發_財鋼資源猶環再生 雜细顧為航麟树,领驗性· 4 鐵沈叙物與含銅的溶液(PH3. 5至4)。接著,含 200906737 銅的/谷液可被驗性溶液巾和處理成含銅沈殿物的溶液(PH? $至 8·〇) ’再湘壓軸水洗將含銅沈麟液處理賴於含鋼的 電鍍溶液。上親性驗為氫氧化液時,含銅沈蝴為氣氣 化銅。若上述驗性溶㈣微鹽餘時,含減麟為碳酸鋼乳 氯化鐵的水额呈強酸性。若將該氣化鐵溶液稀釋,並以域 緩慢中和’靡e(_6]3+便脫去—姆子而生成黃色的 [Fe(OH)(_5] 4+和二聚體[Fe_2_)8] 4+;若進一步中 ^ ’則生成褐色的氣態狀續⑽;溫度升高時,便有氫氧物尤 ^殿出來。 此外,氣氧化鐵沈殺物可被酸性溶液中和處理成氯化鐵溶液 (0.3N H+) ’而使含銅的酸性蝕刻廢液再生成蝕刻溶液。 藉由以上難频細狀詳述,鱗魏更加清楚描述本 發明之特徵與精神,而並相上述所揭露的較佳具體實施例來對 本發明之齡加以限制。相反地,其目的是希望能涵蓋各種改變 及具相等性的鋪於本發騎欲申請之專概圍的範嘴内。 【圖式簡單說明】 第 第 1圖為本發日贿财銅資轉顧生方法之實施示意圖。 2圖為本發明製財銅資轉環再生方法之實施示意圖。 200906737 【主要元件符號說明】200906737 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a resource recycling method, and more particularly to a method for recycling a copper resource cycle. [Prior Art] In general, for the circuit board manufacturing industry, if you want to find the circumstance, first of all, reduce 'reducing energy and raw material consumption, and eliminating or reducing the toxic and harmful chemicals. The amount, the surface consumption is low, the efficiency is high, the pollution-free or less pollution && For example, the bromide resistance of the laminate Z is carcinogenic, and it is replaced by the absence of 4 copper clad plates; In the electroplating process in the circuit board process (ie, electroless copper plating, electroplating copper, electroplating tin alloy, electroplated nickel, and electric forging gold, etc.), the electro-process has been changed to cyanide-free copper sulfate plating. Secondly, it is Reuse, which maximizes the use of energy and raw materials to achieve maximum factory loops. In the board manufacturing process, a large amount of water and electricity are required. The material of the unloading panel production towel is less than five, and the double-panel ^ production process is not less than ten, and the multi-layer board has more water washing work. Therefore, for the road board manufacturer to practice, if the amount of regeneration is not increased, (4) there are too many traces of wastewater, so that the cost of wastewater treatment can also be met. If you reduce the wet treatment process, you can shout less wastewater discharge. 5 200906737 For example, if you use HjL art, you don't need to wash your order. In addition, improved equipment facilities, such as countercurrent rinsing of washing water, reuse of cooling water, etc., also have a certain water saving effect. The most common way is to recycle the wastewater after removing impurities and reuse it. Come again, it is Recycle, and the limited waste that will eventually be produced becomes a resource again. The wastes of the circuit board factory mainly include scrapped circuit boards and substrate wastes, which are used to produce scale metals, while non-metal materials can be used as fillers for building materials. Both the fine ship and the slag waste liquid contain metals such as copper, so the metal can be extracted by electrolysis, displacement, reduction, adsorption, and the like. If it contains organic waste water, the mud that has been treated by the decomposition of the sedimentation chamber may become a fertilizer. In the recycling of resources, many people have proposed various patents, such as US Patent No. 7175819 (adding sulfuric acid to copper chloride solution to recover copper), US Patent No. 6521117 (using membrane technology and mixing with extract, and then Carry out recycling or electrolytic recovery 'to recover metal copper or copper sulfate', US Patent No. 188 (using membrane technology 'recovering metallic copper from micro-health liquid'), US Patent No. 59〇6749 (adjusting waste liquid PH value) And adding iron powder to recover copper-clad core powder), US Pat. No. 5,560,838 (heating the lye and waste liquid, and mixing the reaction to produce copper oxide), US Patent No. 51887G3 (to be tested for ammonia steel waste) The liquid is acidified to precipitate the double crystal copper, and then converted into copper oxide or copper sulfate. U.S. Patent No. 4,622,344 (Using an ion selective membrane and a solution to extract 'electrolytic recovery of copper squamous copper sulphate). 200906737 However, in the above method, in order to reduce the metallic copper from the side waste liquid, it is necessary to use an easy-to-soil extraction solution or an expensive ion-selective membrane, and also to use high-temperature molten copper and a very power-consuming electric extraction purification. . If the board is to be handled outside, there may be problems in the process of transporting contaminants. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method for recycling the Jingyuan cycle of a process towel, which realizes the most environmentally friendly recycling mode by reducing the side of the bribe and making the needles and reducing the source of the ship. Based on the above purpose, in the copper: recording and recycling method in the process of the present invention, when the engraving process produces copper-containing _new_waste (four), mainly the solution of copper-containing acid secret engraving liquid is treated by the instrument solution, and (4) for electroplating. The copper-containing electricity money solution, and once again put the electric reliance on the needle. The secret source of the material is reduced by the side of the ship to reduce the metal copper, the department needs to turn off the waste water to take the solution or the expensive ion-selective membrane, and there is no need to turn off the high-temperature molten copper scale to consume electricity, and of course, there is no need to Handling 'without the problems that can be caused by shipping contaminated touch towels. The advantages and spirit of the present invention will be further understood from the following detailed description of the invention. [Embodiment] In the copper resource recycling method in the process of the present invention, when the engraving process produces 200,906,737 copper-containing acid surviving waste liquid, the method of the present invention mainly uses an alkaline solution to treat copper-containing acidic residual waste. The liquid is formed into a copper-containing plating solution for electron mirrors, and is then produced into a process of producing copper. Moreover, after adopting the above method, since the copper metal is no longer discharged from the side waste liquid, the extraction solution which is easy to contaminate the syrup or the expensive ion selective membrane is no longer needed, and the high temperature molten copper is not required. The power-consuming electricity is purified, and of course, it must be handled separately, and there may be problems in the process of transporting pollutants. ... If the _ waste liquid produced by the different _ Ma Lai is slightly different in the process of the upper _ ring, the next step is to use the ferric chloride and chlorinated ship engraving solution as a step. Refer to Figure 1 for the month of the month. Figure 1 is a method for recycling copper resources in the process of the present invention. As shown in Fig. 1, in the process of the present invention, the copper resource recycling is a copper chloride solution (four), which can be used as an alkaline solution surface 7·5 to 8.G), with a water wash, , pieces,, /, the electricity money solution of copper hydroxide solution, and neutral wastewater. When the above alkali/·cooling liquid is a bismuth oxide nano-solution, the copper-containing sinking substance, the _ _ _ 21 of the second figure is the method of the copper resource recycling method in the hair _ Cheng Zhong, riding, in the present _ Caigang resources are still recycled, and they are regarded as Hang Linshu, and they are tested. 4 Iron-sinking and copper-containing solutions (PH 3. 5 to 4). Next, the 200906737 copper/cold solution can be treated with a solution solution and treated into a solution containing copper and sediments (PH? $ to 8·〇). The water is washed with copper and the copper is treated with steel. Plating solution. When the parental test is a hydroxide solution, the copper-containing film is a gasified copper. If the above-mentioned test (4) micro-salt remains, the amount of water containing ferric chloride is reduced. If the iron-iron solution is diluted, and the domain is slowly neutralized with '靡e(_6)3+, the yellow-[Fe(OH)(_5] 4+ and dimer [Fe_2_) are formed. 8] 4+; if further ^', a brown gaseous form is formed (10); when the temperature rises, there is a hydroxide and oxygen. In addition, the iron oxide precipitate can be neutralized by an acidic solution. The ferric chloride solution (0.3N H+)' causes the copper-containing acidic etching waste liquid to regenerate the etching solution. By the above detailed description of the difficulty frequency, the scale and the spirit more clearly describe the characteristics and spirit of the present invention, and The preferred embodiment disclosed is intended to limit the age of the present invention. Conversely, it is intended to cover various variations and equivalents of the general purpose of the application. Brief description of the formula] The first figure is a schematic diagram of the implementation of the method of returning the bribes to the copper resources. 2 Figure is a schematic diagram of the implementation of the method for regenerating the copper resources of the invention. 200906737 [Description of main components]

Claims (1)

200906737 十、申請專利範圍·· .、一種製程中鋼資源循環再生方法,該循環再生方 法包含: 利用鹼it /合液處理含銅的酸性蝕刻廢液,以形成 電鍍用的含鋼的電鍍溶液。 2如申明專利範圍第丨項所述之製程中銅資源循環 再生方法’其中該循環再生方法進-步包含: 一銅Q f生银刻廢液為氯化銅溶液時,可被驗性 溶液中和處理成含銅沈殿物的溶液(PH7 5至 8. 0) ; · 將3鋼沈’殿物的溶液處理成屬於含銅的電鑛 液。 如申明專利乾圍第2項所述之製程中铜資源循環 去其中驗性溶液為氫氧化納溶液時,人 銅沈殿物為氫氧化銅。 含 卜如申請專利範圍第2項所述之製程中銅資源循環 法其中驗性溶液為礙酸鹽溶液時,人 沈澱物為碳酸銅。 3、'5 )如申π專利範圍第i項所述之主機間操作切換裝 11 200906737 置’其中其中該循環再生方法進—步包含: 含銅的酸性蝕刻廢液為氯化 … 合液時,可被鹼性 洛液中和處理成氫氧仆错、山 虱虱化鐵沈澱物與含銅的溶 液(ΡΗ3.5至4); 澱 含銅的溶液可被驗性溶液中和處理成含銅沈 物的溶液(ΡΗ7.5至8.0); 的電鍍溶 將含銅沈殿物的溶液處理成屬於含鋼 液。 6、 =專利範圍第5項所述之製程中銅資源_ 再&,其中驗性溶液為氫氧化納溶液時,: 銅沈澱物為氫氧化銅。 3 7、 如申:專利範圍第5項所述之製程中鋼資源揭产 再生法’其中驗性溶液為碳酸鹽溶液時,人及 沈澱物為碳酸銅。 3鋼 12200906737 X. Patent application scope ···. A process for recycling steel resources in a process. The cycle regeneration method comprises: treating a copper-containing acidic etching waste liquid with an alkali/liquid mixture to form a steel-containing plating solution for electroplating . (2) The copper resource recycling method in the process described in the third paragraph of the patent scope of the invention, wherein the cycle regeneration method further comprises: when the copper Qf raw silver etching waste liquid is a copper chloride solution, the test solution can be Neutralize and treat the solution into a copper-containing sediment (pH 7 5 to 8. 0); · Process the solution of the 3 steel sink into a copper-containing electric ore. For example, if the copper resource in the process described in item 2 of the patent dry circumference is recycled, the copper solution is copper hydroxide. In the process of copper resource recycling in the process described in item 2 of the patent application scope, wherein the test solution is an acid salt solution, the human precipitate is copper carbonate. 3. '5) The inter-host operation switching device as described in item ith of the application of the π patent scope 11 200906737 wherein the cycle regeneration method includes: the acid etching waste liquid containing copper is chlorinated... It can be neutralized by alkaline solution to form hydrogen hydroxide, iron oxide precipitate and copper-containing solution (ΡΗ3.5 to 4); copper-containing solution can be neutralized by the test solution. The solution containing copper deposits (ΡΗ7.5 to 8.0); the plating solution treats the solution containing copper sediments into steel-containing liquid. 6. The copper resource _ re- & in the process described in item 5 of the patent scope, wherein the test solution is a sodium hydroxide solution, the copper precipitate is copper hydroxide. 3 7. If Shen: The process of reclaiming the steel resources in the process described in item 5 of the patent scope, where the test solution is a carbonate solution, the human and the precipitate are copper carbonate. 3 steel 12
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398410B (en) * 2010-01-14 2013-06-11 Te Hsin Chiang Method for producing copper oxide from solution containing copper ions
CN103451676A (en) * 2012-06-01 2013-12-18 库特勒自动化系统(苏州)有限公司 System and method for treating printing plate etching waste liquid
CN103451675A (en) * 2012-06-01 2013-12-18 库特勒自动化系统(苏州)有限公司 System and method for treating printing plate etching waste liquid
CN103628092A (en) * 2012-08-28 2014-03-12 库特勒自动化系统(苏州)有限公司 Printing plate etching waste liquid treatment system and method
CN103787483A (en) * 2012-11-05 2014-05-14 厦门市铜鑫环保科技有限公司 Method and equipment for treating acidic etching waste liquor
TWI454428B (en) * 2010-08-11 2014-10-01 Organo Corp Copper sulfate recovery method and copper sulfate recovery device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398410B (en) * 2010-01-14 2013-06-11 Te Hsin Chiang Method for producing copper oxide from solution containing copper ions
TWI454428B (en) * 2010-08-11 2014-10-01 Organo Corp Copper sulfate recovery method and copper sulfate recovery device
CN103451676A (en) * 2012-06-01 2013-12-18 库特勒自动化系统(苏州)有限公司 System and method for treating printing plate etching waste liquid
CN103451675A (en) * 2012-06-01 2013-12-18 库特勒自动化系统(苏州)有限公司 System and method for treating printing plate etching waste liquid
CN103451676B (en) * 2012-06-01 2016-03-02 陶克(苏州)机械设备有限公司 Printed circuit board etching waste liquid treatment system and method
CN103451675B (en) * 2012-06-01 2016-06-22 库特勒自动化系统(苏州)有限公司 Printed circuit board etching waste liquid processes system and method
CN103628092A (en) * 2012-08-28 2014-03-12 库特勒自动化系统(苏州)有限公司 Printing plate etching waste liquid treatment system and method
CN103628092B (en) * 2012-08-28 2016-03-02 陶克(苏州)机械设备有限公司 Printed circuit board etching waste liquid treatment system and method
CN103787483A (en) * 2012-11-05 2014-05-14 厦门市铜鑫环保科技有限公司 Method and equipment for treating acidic etching waste liquor

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