200906545 九、發明說明： 【發明所屬之技術領域】 本發明大體上係關於基板處理，更精確地，係關於用 . 以拋光一基板邊緣之方法與設備。 【先前技術】 在預備一即將用來製造半導體裝置之基板時，通常需 (清潔及/或拋光基板邊緣。典型地，需對一研磨帶施以某種 程度的力，以拋光基板邊緣上之斜角。可供應一流體來協 助拋光及/或沖去脫離的粒子。吾人已證實在這類拋光製程 中欲一致地控制施加至研磨帶的力量是相當困難的。此 外，基板邊緣上因供應流體所致之濕環境，也會污染部分 的拋光設備。因此，需要一種可用於拋光一基板邊緣之改 良方法與設備。 【發明内容】 Ο 在本發明一第一實施態樣中，提供適於拋光一基板邊 緣之設備。該設備包含（1)一拋光帶，其具有一拋光表面及 一第二表面；及（2)—拋光臂，其具有一縱軸，並適於迫使 該拋光帶之該拋光表面與一基板邊緣接觸。該拋光臂包含 i) 一拋光頭，其適於接觸該拋光帶之該第二表面；Π)—搖 臂，其耦合至該拋光頭，並適於環繞該拋光臂之該縱軸旋 轉該拋光頭；及iii) 一負載臂，其延伸鄰接該搖臂，並適 於以一垂直於該拋光臂之該縱軸之方向移動該拋光頭。 5 200906545 在本發明另一實施態樣中，提供適於拋光一基板邊緣 之系統。該系統包含一外殼；及一或多個邊緣拋光設備。 該一或多個設備包含（1) 一拋光帶，其具有一拋光表面及一 第二表面；及（2) —拋光臂，其具有一縱軸，並適於迫使該 拋光帶之該拋光表面與一基板邊緣接觸。該拋光臂包含i) 一拋光頭，其適於接觸該拋光帶之該第二表面；ii) 一搖 臂，其耦合至該拋光頭，並適於繞著該拋光臂之該縱軸旋 轉該拋光頭；及iii) 一負載臂，其延伸鄰接該搖臂，並適 於以一垂直於該拋光臂縱轴之方向移動該拋光頭。 在本發明尚有另一實施態樣中，提供用於拋光一基板 邊緣之方法。該方法包含以一大致垂直於一拋光臂之縱軸 之方向收起一致動器並遠離一基板；回應該致動器之收起 動作而旋轉一框軸機構（例如，以逆時針方向）；回應該樞 軸機構之移動而向前朝該基板延伸一負載臂；及回應該負 載臂之向前移動而使該基板邊緣與一拋光帶接觸。 本發明之其他特徵及實施態樣由下列詳細敘述、附加 之申請專利範圍、及伴隨之圖式將變得更加完整明白。 【實施方式】 本發明提供用於清潔及/或拋光一基板邊緣之改善的 方法與設備。當基板旋轉或以其他方式移動（例如，振盪） 時，該基板邊緣可藉由施加一研磨拋光帶至邊缘上來拋 光。研磨拋光帶可藉由一拋光頭施加至基板邊緣。根據本 發明，拋光頭可放置在一拋光臂之末端。拋光臂可包含一 6200906545 IX. INSTRUCTIONS OF THE INVENTION: FIELD OF THE INVENTION The present invention relates generally to substrate processing, and more particularly to methods and apparatus for polishing a substrate edge. [Prior Art] When preparing a substrate to be used in the manufacture of a semiconductor device, it is usually necessary to (clean and/or polish the edge of the substrate. Typically, a certain amount of force is applied to a polishing tape to polish the edge of the substrate. Beveled. A fluid can be supplied to assist in polishing and/or rinsing off the detached particles. It has proven to be quite difficult to consistently control the force applied to the abrasive belt during such polishing processes. The wet environment caused by the fluid also contaminates part of the polishing apparatus. Therefore, there is a need for an improved method and apparatus for polishing a substrate edge. [Invention] In a first embodiment of the present invention, a suitable Apparatus for polishing a substrate edge. The apparatus comprises (1) a polishing tape having a polishing surface and a second surface; and (2) a polishing arm having a longitudinal axis and adapted to force the polishing tape The polishing surface is in contact with a substrate edge. The polishing arm includes i) a polishing head adapted to contact the second surface of the polishing tape; a rocker arm coupled to the polishing head, And adapted to rotate the polishing head about the longitudinal axis of the polishing arm; and iii) a load arm extending adjacent the rocker arm and adapted to move the polishing head in a direction perpendicular to the longitudinal axis of the polishing arm . 5 200906545 In another embodiment of the invention, a system suitable for polishing the edge of a substrate is provided. The system includes a housing; and one or more edge polishing devices. The one or more devices comprise (1) a polishing belt having a polishing surface and a second surface; and (2) a polishing arm having a longitudinal axis and adapted to force the polishing surface of the polishing belt Contact with the edge of a substrate. The polishing arm includes i) a polishing head adapted to contact the second surface of the polishing belt; ii) a rocker arm coupled to the polishing head and adapted to rotate about the longitudinal axis of the polishing arm a polishing head; and iii) a load arm extending adjacent the rocker arm and adapted to move the polishing head in a direction perpendicular to a longitudinal axis of the polishing arm. In still another embodiment of the invention, a method for polishing an edge of a substrate is provided. The method includes retracting the actuator in a direction substantially perpendicular to a longitudinal axis of a polishing arm and away from a substrate; rotating the frame mechanism (eg, in a counterclockwise direction) in response to the retracting action of the actuator; Retrieving the movement of the pivot mechanism and extending a load arm toward the substrate; and returning the forward movement of the load arm to bring the edge of the substrate into contact with a polishing tape. Other features and embodiments of the present invention will be more fully understood from the appended claims. [Embodiment] The present invention provides an improved method and apparatus for cleaning and/or polishing the edge of a substrate. When the substrate is rotated or otherwise moved (e.g., oscillated), the edge of the substrate can be polished by applying an abrasive polishing tape to the edge. The abrasive polishing tape can be applied to the edge of the substrate by a polishing head. According to the invention, the polishing head can be placed at the end of a polishing arm. The polishing arm can contain a 6
200906545 搖臂’其適於相對一正切基板邊緣之軸旋轉拋光頭， 供對介於拋光帶和基板邊緣間之接觸之控制；拋光臂 包含一框轴的負載臂’其適於在以一第一方向在樞轴 動時’驅動拋光頭朝向基板，並返使（「裝載」）拋光 觸基板邊緣’而當以一第二的相反方向在樞輔上轉動 其收起拋光頭使之遠離接觸基板邊緣。 吾人已發現以此方式裝載抛光帶改善力的控制， 由基板邊緣快速移除/收回拋光頭作準備，以便防止粒 /或流體積聚在拋光頭上’否則其可產生與基板邊緣之 的接觸。 第1圖顯示根據本發明之一示範的基板邊緣拋光 或「模組」（「邊緣拋光模組」）之頂視圖。邊緣拋光 100可整合在一較大的基板預備系統（未顯示）内部以 電子裝置製造設施中使用。舉例來說’除了拋光模# 如，邊緣拋光模組1〇〇)之外’基板預備系統可包含一 介面，其用於接收新的、未預備/未處理的基板；及一 個清潔模組，其用於由基板移除任何粉塵或粒子。基 備系統可用於調節基板以用於後續製程’例如’蝕刻 積等。 邊緣拋光模組可包含外殼101 ’ 一或多個邊 光設備102、104、106係放置於其中。雖然所示的實 包含三（3)個設備，可使用其他數目的設備（例如，1、2 5、6、或更多）。邊緣拋光設備102、104、106可放置 中心平台ι〇8(示於第2圖），在其上可架置或支撐 並提 亦可 上轉 帶接 時， 並為 子及 延長 系統 模組 在一 a (例 工廠 或多 板預 、沈 緣拋 施例 、4、 環繞 基板 200906545 1 1 0。中心平台1 〇 8可藉由驅動器1 1 1 (例如，馬達、齒輪、 皮帶、鏈等）（亦示於第2圖）而為可旋轉的，並可包含 空卡盤或其他機構，以用於在中心平台108旋轉期間適举 乂备 地支承基板1 1 0。在所描畫的實施例中，基板11 〇為胃I 形，其具有定向於水平平面中之主表面。不過，在替代的 實施例中，基板1 1 0可具有其他形狀及定向》 各邊緣拋光設備102、104、106可藉由一組對應的抛 光帶線軸112、114、116耦合至並供應以一研磨拋光帶（示 於第2圖）。各組拋光帶線軸112、114、116可包含一供應 線軸及一捲取線軸（示於第2圖）。供應線軸可儲存未使用 的拋光帶，其可用於鬆開並拉進放置在鄰接基板110處之 對應的拋光設備102、104、106中，而捲取線軸可適於接 收已使用及/或已磨耗的拋光帶。供應及捲取線軸之一或二 者可分度以精確控制前進至對應的邊緣拋光設備1 02、 104、106之拋光帶的量。在某些實施例中，拋光帶可在線 軸間連續移動。 邊緣拋光模組1 〇〇亦可包含控制器1 20(例如，軟體驅 動電腦、程式化處理器、微控制器、閘陣列、邏輯電路、 嵌入式即時處理器等），其適於指揮邊緣拋光模組之部件之 操作，包含拋光設備102、104、106、驅動器Η〗、及線軸 組1 1 2、1 1 4、1 1 6。在一或多個實施例中，各拋光設備i 0 2、 104、106可配備其自有的控制器。控制器12〇可包含，或 耦合至’記憶艘資源（例如’ RAM、R0M '快閃記憶體、光 碟、局部區域網路（LAN)儲存器）（未顯示）。在一或多個實 200906545 施例中’控制器1 2 0可適於存取關於邊緣拋光模組1 〇 〇之 操作之資料’其可儲存在儲存於記憶體資源内部之查詢可 存取的資料庫中。 各邊緣拋光設備1 〇2、1 〇4、1 06可適於在供應以來自 對應的線轴組112' 114、116之拋光帶時，強迫地裝載拋 光帶與基板110之邊緣接觸。線軸組Π2、114、116可垂 直定向以便最小化由線軸組〗i 2、丨丨4、丨丨6佔用的佔地面 積（亦即，佔用及在製造設施内部分配給裝備之面積）。 轉向第2圖’其描畫一邊緣拋光設備，例如，1 〇 2，之 示意圖。設備102可包含拋光臂201 '其在近乎正切基板 110之邊緣202之水平平面中對準，並由框203支撐。在 其他實施例中’拋光臂2 01可不同地對準，舉例來說，為 垂直或以相對於水平平面之一角度。拋光臂2〇1可包含拋 光頭區段204(「頭」），其適於在基板】1〇由中心平台ι〇8 或由某些其他機構（例如，驅動滾輪）轉動時，強迫地施加 拋光帶206至基板邊緣2〇2。頭204可環繞正切基板邊緣 2 0 2之一車由旋轉及/或有角度地移位，以便以不同角度施加 力至基板邊緣202上。有角度的移位可為振盪的，以致頭 204在基板邊緣202之上方及下方來回「搖動」。藉由這類 旋轉及/或有角度的移位’頭204可在不接觸基板11()分配 給裝置製造之部分的情況下，使拋光帶2〇6與基板11〇之 邊緣202上之頂部及底部斜角（亦即’有角度的表面）、和 頂部及底部排除區接觸；排除區可充當邊緣2〇2及基板u〇 分配給裝置製造之部分間之缓衝區。頭204可包含底及/ 200906545 動 觸 合 於 中 後 舉 對 設 備 可 或 備 多 室 間 序 之 所 4 係 或充氣墊（「底墊」）208，其適於在拋光臂201透過一致 器（未顯示）迫使頭204緊靠旋轉中的基板邊緣202時接 拋光帶206。底墊208可為軟式及/或包含或形成適於符 基板邊緣202之輪廓之輪廓。底墊208之示範實施例示 圖5A至5D，並於下文敘述。 邊緣拋光可使用一或多個拋光設備（例如，2 0 0 )執行 在一或多個實施例中，複數個拋光設備2 0 0可使用，其 f . 各拋光設備2 0 0可具有類似或不同的特徵及/或機構。在200906545 The rocker arm' is adapted to rotate the polishing head relative to the axis of a tangential substrate for control of the contact between the polishing tape and the edge of the substrate; the polishing arm comprises a frame arm load arm 'which is suitable for One direction pivots to 'drive the polishing head toward the substrate, and returns ("loads") the polished substrate edge ' while rotating in a second opposite direction to pivot the polishing head away from contact The edge of the substrate. We have found that the control of loading the polishing tape in this manner is improved by the rapid removal/retraction of the polishing head from the edge of the substrate in order to prevent the particle/or stream from accumulating on the polishing head. Otherwise it may create contact with the edge of the substrate. Figure 1 shows a top view of a substrate edge finish or "module" ("edge polishing module") in accordance with one exemplary embodiment of the present invention. Edge polishing 100 can be integrated into a larger substrate preparation system (not shown) for use in an electronics manufacturing facility. For example, 'except for the polishing die #, such as the edge polishing module 1') the substrate preparation system may include an interface for receiving a new, unprepared/unprocessed substrate; and a cleaning module, It is used to remove any dust or particles from the substrate. The substrate system can be used to condition the substrate for subsequent processing, such as etching, etc. The edge polishing module can include a housing 101' or one or more edge optical devices 102, 104, 106 are placed therein. Although three (3) devices are shown, other numbers of devices (e.g., 1, 2, 5, 6, or more) may be used. The edge polishing apparatus 102, 104, 106 can be placed on the center platform ι 8 (shown in Figure 2), on which it can be mounted or supported and lifted up and down, and the sub- and extension system modules are A (for example, factory or multi-plate pre-sampling, sinking, 4, surrounding substrate 200906545 1 1 0. The center platform 1 〇8 can be driven by the driver 1 1 1 (eg, motor, gear, belt, chain, etc.) Also shown in FIG. 2) is rotatable and may include an empty chuck or other mechanism for supporting the substrate 110 in a suitable manner during rotation of the center platform 108. In the depicted embodiment The substrate 11 is a stomach I shape having a major surface oriented in a horizontal plane. However, in an alternative embodiment, the substrate 110 may have other shapes and orientations. Each edge polishing device 102, 104, 106 may A set of corresponding polishing belt spools 112, 114, 116 are coupled to and supplied with a polishing belt (shown in Figure 2). Each set of polishing belt spools 112, 114, 116 may include a supply spool and a take-up Spool (shown in Figure 2). Supply spool can store unused A light strip that can be used to loosen and pull into a corresponding polishing apparatus 102, 104, 106 placed adjacent to the substrate 110, and the take-up spool can be adapted to receive a polished belt that has been used and/or worn. One or both of the take-up spools can be indexed to precisely control the amount of polishing belt advanced to the corresponding edge polishing apparatus 102, 104, 106. In some embodiments, the polishing belt can be continuously moved between the spools. The polishing module 1 can also include a controller 1 20 (eg, a software-driven computer, a programmed processor, a microcontroller, a gate array, a logic circuit, an embedded instant processor, etc.) that is adapted to command an edge polishing die The operation of the components of the group includes polishing apparatus 102, 104, 106, a drive, and a set of spools 1 1 2, 1 1 4, 1 16 . In one or more embodiments, each polishing apparatus i 0 2. 104, 106 can be equipped with its own controller. Controller 12 can include, or be coupled to, 'memory ship resources (eg 'RAM, ROM' flash memory, CD, local area network (LAN) storage) (not shown). One or more real 200906545 The 'controller 120' can be adapted to access information about the operation of the edge polishing module 1' which can be stored in a query accessible database stored in the memory resource. 〇2, 1 〇4, 106 may be adapted to forcibly load the polishing tape into contact with the edge of the substrate 110 while supplying the polishing tape from the corresponding spool set 112' 114, 116. The spool set Π 2, 114, 116 The orientation can be oriented vertically to minimize the footprint occupied by the spool sets ii, 丨丨4, 丨丨6 (i.e., occupancy and area allocated to the equipment within the manufacturing facility). Turning to Fig. 2', a schematic diagram of an edge polishing apparatus, for example, 1 〇 2, is depicted. Apparatus 102 can include polishing arm 201' aligned in a horizontal plane of edge 202 of tangent substrate 110 and supported by frame 203. In other embodiments, the polishing arm 201 can be aligned differently, for example, perpendicular or at an angle relative to a horizontal plane. The polishing arm 2〇1 can include a polishing head section 204 ("head") that is adapted to be forcedly applied when the substrate is rotated by the center platform ι 8 or by some other mechanism (eg, a drive roller) Polish the strip 206 to the edge 2' of the substrate. The head 204 can be rotated and/or angularly displaced around the edge of the tangential substrate 2 0 2 to apply force to the substrate edge 202 at different angles. The angular shift can be oscillating such that the head 204 "sways" back and forth above and below the edge 202 of the substrate. By this type of rotation and/or angular displacement 'head 204, the top of the edge 202 of the polishing tape 2〇6 and the substrate 11 can be made without contacting the substrate 11() to the portion where the device is fabricated. And the bottom bevel (ie, the 'angled surface), and the top and bottom exclusion zones; the exclusion zone acts as a buffer between the edge 2〇2 and the substrate u〇 assigned to the device fabrication. The head 204 can include a base and/or 200906545, a 4 series or inflatable cushion ("bottom pad") 208 that can be moved in and out of the device to be equipped with a multi-chamber sequence, which is adapted to pass through the aligner at the polishing arm 201 ( Not shown) forcing the head 204 against the rotating substrate edge 202 when the polishing tape 206 is attached. The bottom pad 208 can be soft and/or include or form a contour that is contoured to the edge of the substrate substrate 202. Exemplary embodiments of the bottom pad 208 are shown in Figures 5A through 5D and are described below. Edge polishing can be performed using one or more polishing devices (eg, 200) in one or more embodiments, a plurality of polishing devices 200 can be used, f. Each polishing device 200 can have a similar or Different characteristics and / or institutions. in
I 面的實例中，特定的拋光設備2 0 0可用於特定的操作。 例來說，複數個拋光設備2 0 0之一或多個可適於執行相 粗糙的拋光及/或調整，而另外的一或多個該複數個拋光 備 2 0 0可適於執行相對精細的拋光及/或調整。拋光設 2 0 0可依序使用，以便，舉例來說，一粗糙的拋光程序 在初始執行，且一精細的拋光程序可隨後使用以依需要 根據拋光配方調整一相對粗糙的拋光。複數個拋光設 200可位於一單一室或模組（例如，100)中，或者，一或 (j 個拋光設備200可位於分開的室或模組中。當使用多個 時，可使用機器人或另一類型的傳送機構以在室與室之 移動基板1 〇 〇，以便在分開的室中之拋光設備2 0 0可依 或以其他方式使用。 第3圖顯示根據本發明之拋光臂2 0 1之示範實施例 特寫圖。頭204係放置在拋光臂201之一第一遠端。如 示，頭204包含支撐塊302(在第3圖中不可見，但在第 圖中可見），其具有暴露的外部表面（未顯示），底墊208 10 200906545In the example of the face I, a particular polishing device 200 can be used for a particular operation. For example, one or more of the plurality of polishing devices 200 may be adapted to perform phase rough polishing and/or adjustment, and the other one or more of the plurality of polishing stations 200 may be adapted to perform relatively fine Polishing and / or adjustment. The polishing setup 200 can be used sequentially so that, for example, a rough polishing procedure is performed initially, and a fine polishing procedure can be used subsequently to adjust a relatively rough finish as desired depending on the polishing recipe. The plurality of polishing devices 200 can be located in a single chamber or module (eg, 100), or one or (j polishing devices 200 can be located in separate chambers or modules. When multiple uses, robots or Another type of transport mechanism is used to move the substrate 1 in the chamber to the chamber so that the polishing apparatus 200 in the separate chamber can be used or otherwise used. Figure 3 shows the polishing arm 20 in accordance with the present invention. A close-up view of an exemplary embodiment of 1. The head 204 is placed at a first distal end of one of the polishing arms 201. As shown, the head 204 includes a support block 302 (not visible in Figure 3, but visible in the figures), With exposed external surface (not shown), bottom pad 208 10 200906545
穩固地耦合至其上。頭2 0 4耦合（例如，牢固地）至搖臂 304’其沿著抛光臂201縱向延伸。搖臂3〇4可環繞抛光臂 2〇1之縱軸3 06(如環繞轴306之曲線箭頭所示）旋轉或以連 續或間歇的振盈運動來回「搖動」。在所描畫的實施例中， 搖臂304之橫剖面為C形，且因而具有中空的内部空間。 搖臂304可具有其他的橫剖面形狀。搖臂3〇4可透過安裝 架3 10輛合至搖動馬達308 ’並由搖動馬達3〇8驅動以相 對一「原位置」（零度）旋轉近乎正及負9〇度；頭2〇4之底 墊208在原位置中之定向近乎垂直基板u〇之邊緣。 搖臂304可以其他角度旋轉。 拋光臂201可進一步包含一或多個放置於安裝架3⑺ 内部、或介於安裝架310及搖臂3〇4間之機械耦合（例如， 塾圈、旋轉秘承等）（未顯示），以幫助搖動馬達3〇8之操作。 密封平板312可放置在搖臂3〇4及機械麵合間以保護機械 耗合及搖動馬it 3〇8免於由拋光製程產生之污染(例如，基 板粒子、清潔流體）。 土 負載臂314可沿著拋光臂2〇1鄰接搖臂3〇4縱向延 伸在4少個搖臂3 04具有c形橫剖面輪廊之實施例 中，負載臂川可放置在搖臂3〇4之内部空間内部。在這 類實施例中’搖f 3Q4可與負載臂314-起環繞拋光臂2〇1 之縱轴306旋轉。負巷壁a 土 、 之遠端可耦合（例如，牢固地） 至支樓塊302，而負載劈3彳4 + 1 之近鳊可透過樞軸機構3丨6(示 ； 圖）耦合至致動器318。致動 紅(如所示卜壓電元件… 包含氣動汽 電磁驅動活塞、或任何其他能夠 200906545 以一線性方向延伸或收起之裝置。在一或多個實施例中， 致動器318可放置在拋光臂201之近端遠離基板110之若 干距離處。吾人已發現此配置保護致動器3 1 8免於暴露至 濕環境及由拋光製程產生之污染。Securely coupled to it. The head 220 is coupled (e.g., securely) to the rocker arm 304' which extends longitudinally along the polishing arm 201. The rocker arm 3〇4 can be rotated around the longitudinal axis 306 of the polishing arm 2〇1 (as indicated by the curved arrow around the axis 306) or “swaying” back and forth in a continuous or intermittent vibrational motion. In the depicted embodiment, the rocker arm 304 has a C-shaped cross section and thus has a hollow interior space. Rocker arm 304 can have other cross-sectional shapes. The rocker arm 3〇4 can be driven by the mounting frame 3 to the rocking motor 308' and driven by the rocking motor 3〇8 to rotate approximately [negative] and negative 9 degrees relative to a "home position" (zero degree); the head 2〇4 The bottom pad 208 is oriented in the home position to the edge of the vertical substrate u〇. The rocker arm 304 can be rotated at other angles. The polishing arm 201 can further include one or more mechanical couplings (eg, loops, rotating secrets, etc.) placed inside the mounting bracket 3 (7) or between the mounting bracket 310 and the rocker arms 3〇4 (not shown) to Helps shake the operation of the motor 3〇8. The sealing plate 312 can be placed between the rocker arm 3〇4 and the mechanical face to protect the machine from consuming and rocking the ball 3 (8) from contamination caused by the polishing process (e.g., substrate particles, cleaning fluid). The soil load arm 314 can extend longitudinally along the polishing arm 2〇1 adjacent to the rocker arm 3〇4. In the embodiment where the four rocker arms 307 have a c-shaped cross-section wheel gallery, the load arm can be placed on the rocker arm 3〇. 4 inside the interior space. In this type of embodiment, the rocker 3 3 can be rotated with the load arm 314 to extend around the longitudinal axis 306 of the polishing arm 2〇1. The negative wall a soil can be coupled (for example, firmly) to the branch block 302, and the near 劈3彳4 + 1 can be coupled through the pivot mechanism 3丨6 (shown) Actuator 318. Actuation of red (as shown in the piezoelectric element... comprises a pneumatic vapor-electromagnetically actuated piston, or any other device capable of extending or retracting in a linear direction 200906545. In one or more embodiments, the actuator 318 can be placed At some distance from the proximal end of the polishing arm 201 away from the substrate 110, we have found that this configuration protects the actuator 3 18 from exposure to the wet environment and contamination by the polishing process.
如下文參照第6 A及6 B圖所討論般，致動器3 1 8之移 動可導致負載臂314以與致動器318之移動方向相反之方 向在樞轴上轉動，朝向或遠離基板110之邊緣202。由於 負載臂3 1 4及支撐塊3 02間之耦合，負載臂3 1 4朝向基板 110之樞軸轉動移動頭204(例如，頭204之底墊208)與基 板110之邊緣202接觸，而負載臂314遠離基板110之樞 軸轉動導致頭204收起並移動遠離基板110之邊緣202。 吾人已發現與習用技術相比，在負載臂3 1 4之一擊期間， 使用縱向延伸之負載臂3 1 4來按壓頭 2 04緊靠基板邊緣 202在頭204及基板110間提供更一致的角度。 再次參照第2圖，如上文所提及，拋光帶206可由一 組包含供應線軸 2 0 9及捲取線軸 2 1 0之線軸供應給頭 2 0 4。線軸2 0 9、2 1 0可由一或多個驅動器（例如，伺服馬達） 驅動，其可提供分度能力以允許特定量之未使用的拋光帶 206前進或連續饋送至基板邊緣，及/或拉緊能力以允許拋 光帶206拉緊並施加壓力至基板邊緣202。此外，拋光帶 206可進一步由一或多個放置在頭204上、或其他位置之 拉緊滾輪212(如所示）拉緊。拉緊滾輪212可適於施加可 變量之拉力至拋光帶206,從而至基板202，以便達到對一 邊緣拋光製程之精確控制，其可在由基板邊緣202移除材 12 200906545 料時用於補償不同的邊緣幾何及基板110中之變化。 在一或多個實施例中，拋光帶2 0 6之研磨部件可由一 或多種不同材料製成，其包含，舉例來說，鑽石、氧化鋁、 . 氧化矽、碳化矽等。亦可使用其他材料。在某些實施例中， 用在拋光帶2 0 6中之研磨劑之尺寸範圍可由約0.2 5微米上 達約3微米，雖然可使用其他尺寸。不同的拋光帶206之 寬度（範圍由約〇 · 2英吋至約1 · 5英吋）可使用（雖然可使用 f 其他寬度）。在一或多個實施例中，拋光帶206可為約0.002 至約0.0 2英吋厚，且在使用墊之實施例中能夠耐受約1至 5磅的拉力，而在沒有墊之實施例中則為約3至約8磅的 '拉力。可使用其他具有不同厚度及強度之帶。在某些實施 例中，線軸2 0 9、2 1 0之直徑可為近乎1英吋至近乎4英吋， 支撐近乎5000英吋的拋光帶206，並可由任何適用的材料 構成，例如，聚氨酯、聚偏二氟乙烯（PVDF)等。可使用其 他材料。線軸2 0 9、2 1 0亦可具有其他尺寸大小並支撐其他 量的拋光帶206。 Q 在某些實施例中，邊緣拋光模組1 0 0之拋光設備1 〇 2、 104、106可支撐不同類型的拋光帶（例如，具有不同研磨 粒度之帶），其可並行、以預先定義的序列、或在不同時間 使用。拋光設備102、104、106之頭204亦可以不同位置 配置以允許所支撐的帶拋光不同部分之旋轉中的基板 Π 0 之邊緣202。 轉向第4圖，其描晝拋光帶206及基板110之邊緣202 間之一拋光接觸之示意特寫圖。如所示，拋光帶206可按 13 200906545 壓緊靠（例如’如箭頭402所指示）基板11〇之邊緣 與之輪廓相符。舉例來說’雖然可使用其他速率，基 可緊靠拋光帶206以範圍為約50至約1〇〇〇每分 (RPM)之速率旋轉。拋光帶206可接觸基板11〇之邊 達約1 5至1 5 0秒’其係依所使用的帶類型、帶粒度 速率、所需的拋光量等而定。可使用更長或更短的 如所示，抛光帶206係由配置鄰接拋光帶206之3 如’非研磨側）之底墊208支撐。底墊208可由支撐塊 可轉而由致動器318推動（示於第3圖））朝基板邊緣 壓。底墊208上之壓力可導致底墊2〇8及/或拋光帶 合基板邊緣202之輪廓。因此，拋光帶2〇6及基板邊 間之摩擦力（例如，研磨接觸）可包含兩個元素·在基 緊靠拋光帶2 0 6旋轉期間所施加的扭矩、及將拋光 按®至基板110之邊緣2〇2上所施加的力。在某些 中，在接觸點上之結合力範圍可為約〇 5磅至約4 使用其他量的力。 在某些實施例中’一或多個流體通道4〇4(例如 喷嘴或喷桿）可設置以傳送化學藥品及/或水以幫助 緣2 0 2之抛光/清潔、潤滑基板丨丨〇、及/或洗去移 料。流體通道404可適於傳送流體至基板丨丨〇、至 206、及/或至墊208。流體可包含去離子水，其可 滑劑並將粒子沖去。界面活性劑及/或其他已知的清 亦可包含在其中。在某些實施例中，音波（例如，資 喷嘴可用於傳送經音波處理的流體至基板邊緣2 〇 2 202並 板1 1 〇 鐘轉速 緣2〇2 、旋轉 時間。 ί側（力 302(其 202按 20 6符 緣202 板11 0 帶206 實施例 碑。可 ，喷霧 基板邊 除的材 拋光帶 充當潤 潔化學 i音波） 以補充 14 200906545 清潔。流體亦可通過拋光帶2 0 6及/或墊2 0 8傳送至基板邊 緣 202 °As discussed below with reference to Figures 6A and 6B, movement of the actuator 3 18 may cause the load arm 314 to pivot on a direction opposite the direction of movement of the actuator 318 toward or away from the substrate 110. Edge 202. Due to the coupling between the load arm 314 and the support block 302, the load arm 314 moves toward the pivoting movement head 204 of the substrate 110 (e.g., the bottom pad 208 of the head 204) contacts the edge 202 of the substrate 110, and the load The pivoting of the arm 314 away from the substrate 110 causes the head 204 to be stowed and moved away from the edge 202 of the substrate 110. We have found that a longitudinally extending load arm 3 1 4 is used to provide a more uniform press between the head 204 and the substrate edge 202 between the head 204 and the substrate 110 during one shot of the load arm 3 1 4 compared to conventional techniques. angle. Referring again to Figure 2, as mentioned above, the polishing belt 206 can be supplied to the head 220 by a set of spools including a supply spool 2 0 9 and a take-up spool 2 1 0. The spools 2 0 9 , 2 1 0 can be driven by one or more actuators (eg, servo motors) that can provide indexing capabilities to allow a certain amount of unused polishing belt 206 to be advanced or continuously fed to the edge of the substrate, and/or The tightening ability is to allow the polishing tape 206 to be tensioned and apply pressure to the substrate edge 202. In addition, the polishing belt 206 can be further tensioned by one or more tension rollers 212 (as shown) placed on the head 204 or at other locations. The tension roller 212 can be adapted to apply a variable amount of tension to the polishing belt 206 to the substrate 202 to achieve precise control of an edge polishing process that can be used to compensate for material 12 200906545 removed from the substrate edge 202 Different edge geometries and variations in the substrate 110. In one or more embodiments, the abrasive component of the polishing strip 206 can be made of one or more different materials including, for example, diamond, alumina, yttrium oxide, tantalum carbide, and the like. Other materials can also be used. In certain embodiments, the size of the abrasive used in the polishing belt 206 can range from about 0.25 microns to about 3 microns, although other sizes can be used. The width of the different polishing strips 206 (ranging from about 〇 2 吋 to about 1 · 5 inches) can be used (although other widths can be used). In one or more embodiments, the polishing tape 206 can be from about 0.002 to about 0.02 inches thick, and can withstand a pull force of about 1 to 5 pounds in embodiments using a pad, while in the absence of a pad embodiment Medium is about 3 to about 8 pounds of 'pull. Other tapes having different thicknesses and strengths can be used. In certain embodiments, the spools 2 0 9 , 2 1 0 may have a diameter of from about 1 inch to nearly 4 inches, support a polishing belt 206 of approximately 5,000 inches, and may be constructed of any suitable material, such as polyurethane. , polyvinylidene fluoride (PVDF) and the like. Other materials can be used. The spools 2 0 9 , 2 1 0 may also have other sizes and support other amounts of polishing tape 206. Q In some embodiments, the polishing apparatus 1 〇 2, 104, 106 of the edge polishing module 1000 can support different types of polishing belts (eg, belts having different abrasive grain sizes), which can be paralleled, pre-defined The sequence, or at different times. The heads 204 of the polishing apparatus 102, 104, 106 can also be configured in different positions to allow the supported belt to polish the edges 202 of the substrate Π 0 in rotation. Turning to Figure 4, a schematic close-up of a polished contact between the polishing tape 206 and the edge 202 of the substrate 110 is depicted. As shown, the polishing tape 206 can be pressed against (e.g., as indicated by arrow 402) the edge of the substrate 11 与 to conform to its contour as in 13 200906545. For example, although other rates may be used, the base may be rotated against the polishing belt 206 at a rate ranging from about 50 to about 1 Torr (RPM). The polishing tape 206 can contact the side of the substrate 11 for about 15 to 150 seconds. Depending on the type of tape used, the tape size rate, the amount of polishing required, and the like. Longer or shorter can be used. As shown, the polishing tape 206 is supported by a bottom pad 208 that is disposed adjacent to the 3 of the polishing tape 206, such as the 'non-abrasive side. The bottom pad 208 can be urged by the actuator 318 (shown in Figure 3) to be pressed against the edge of the substrate. The pressure on the bottom pad 208 can result in the contour of the bottom pad 2〇8 and/or the polishing tape substrate edge 202. Therefore, the polishing tape 2〇6 and the frictional force between the sides of the substrate (for example, the abrasive contact) may include two elements, the torque applied during the rotation of the base against the polishing belt 206, and the polishing to the substrate 110. The force exerted on the edge 2〇2. In some, the bonding force at the point of contact may range from about 5 pounds to about 4 using other amounts of force. In some embodiments, one or more fluid passages 4〇4 (eg, nozzles or spray bars) may be configured to deliver chemicals and/or water to aid in the polishing/cleaning of the edge 20, lubricating the substrate, And / or wash away the material. Fluid channel 404 can be adapted to deliver fluid to substrate 丨丨〇, to 206, and/or to pad 208. The fluid may contain deionized water, which slips the particles off the particles. Surfactants and/or other known clearing agents may also be included. In some embodiments, a sound wave (eg, a nozzle can be used to transport the sonicated fluid to the substrate edge 2 〇 2 202 and the plate 1 1 转速 clock edge 2 〇 2, rotation time. ί side (force 302 (its 202 press 20 6 edge 202 plate 11 0 with 206 embodiment monument. Yes, the material polishing strip removed by the spray substrate acts as a clean chemical i-wave) to supplement 14 200906545 cleaning. The fluid can also pass the polishing belt 206. / or pad 2 0 8 transfer to the edge of the substrate 202 °
轉向第5Α至5D圖，其描晝底墊208A、208B、208C、 及208D之不同的示範實施例。除了在基板110不存在時 與拋光帶206共面之平坦表面之底墊208(如第4圖所示） 外，底墊208A(示於第5A圖）可包含匹配基板110之邊緣 202之輪廓之凹表面。或者，如第5B圖所示，底墊208B(示 於第 5B圖）可包含雙凹表面以更佳匹配基板 110之邊緣 202之輪廓。 在某些實施例中，如第5C圖所示，底墊208C可具有 可調整量之符合基板邊緣2 0 2之能力。舉例來說，底墊2 0 8 C 可包含充氣囊 501，以致於藉由添加更多空氣或液體或其 他流體，墊2 0 8 C可變得更硬，而藉由減少囊5 01中之空 氣或液體或其他流體的量，墊2 0 8 C可變得更加符合。囊 5 0 1可經由流體通道 5 02填滿（及/或倒空）來自流體供應 5 0 4之流體。在某些實施例中，流體供應5 0 4可在操作者、 或程式及/或使用者操作之控制器的指示下充氣/抽氣囊 5 0 1。在這類實施例中，一彈性材料（例如，矽橡膠或其類 似材料）可用作囊501以進一步增強墊208C拉緊及符合基 板邊緣2 02之能力。這一類實施例可允許操作者/控制器藉 由，例如，限制灌入囊5 01中之流體量，而精確控制拋光 帶206及基板邊緣202間之接觸表面面積。舉例來說，一 旦基板邊緣202與抽氣的囊501 —起放置緊靠墊208C，囊 501可充氣以便墊208C受壓迫而捲繞，並在未捲繞或延伸 15 200906545 至基板i10保留給裝置製造區域的情況^ ’符合基板邊緣 2 0 2之拋光及/或切割表面’例如’斜角或外部邊緣、及排 除區域（「晶邊排除區J )。須注意在某些實施例中’多個 囊可用於墊208中，且不同形狀的充氣囊5〇1可用在不同 形狀的墊（例如，208、208 A、208B)内部。Turning to Figures 5 through 5D, various exemplary embodiments of bottom pads 208A, 208B, 208C, and 208D are depicted. The bottom pad 208A (shown in FIG. 5A) may include the contour of the edge 202 of the mating substrate 110, except for the bottom pad 208 (shown in FIG. 4) of the flat surface that is coplanar with the polishing tape 206 when the substrate 110 is not present. Concave surface. Alternatively, as shown in FIG. 5B, the bottom pad 208B (shown in FIG. 5B) can include a biconcave surface to better match the contour of the edge 202 of the substrate 110. In some embodiments, as shown in Figure 5C, the bottom pad 208C can have an adjustable amount of ability to conform to the edge of the substrate. For example, the bottom pad 2 0 8 C may include an inflatable bladder 501 such that by adding more air or liquid or other fluid, the pad 2 0 8 C may become harder, while reducing the pocket 5 01 The amount of air or liquid or other fluid, pad 2 0 8 C can become more consistent. The bladder 5 0 1 can be filled (and/or emptied) with fluid from the fluid supply 504 via the fluid passage 502. In some embodiments, the fluid supply 504 can be inflated/drained by an operator, or a program and/or a controller operated by the user. In such embodiments, an elastomeric material (e.g., silicone rubber or the like) can be used as the bladder 501 to further enhance the ability of the mat 208C to be tensioned and conform to the edge of the substrate. This type of embodiment may allow the operator/controller to precisely control the amount of contact surface between the polishing strip 206 and the substrate edge 202 by, for example, limiting the amount of fluid being poured into the bladder 501. For example, once the substrate edge 202 is placed against the evacuated bladder 501 against the cushion 208C, the bladder 501 can be inflated so that the cushion 208C is compressed and wound, and left unwound or extended 15 200906545 to the substrate i10 for device fabrication. The case of the area ^ 'conforms the polished and/or cut surface of the substrate edge 2 '2' such as 'bevel or outer edge, and the exclusion area ("edge edge exclusion zone J". It should be noted that in some embodiments 'multiple The bladder can be used in the pad 208, and differently shaped inflatable bladders 5〇1 can be used inside pads of different shapes (eg, 208, 208 A, 208B).
第5 D圖顯示「滚動」底墊2 0 8 D之一實施例’其係以 輪狀形成。滾動底塾208D可為充氣及/或111定式或充氣及/ 或符合式的。滾動底墊208D可藉由在拋光帶206分度時 旋轉而影響（例如’增加或減少）作用在据光帶2 0 6之運動 上之摩擦力，並可從而改善拋光效能。 底整 208、208A、208B、208C、208D 可由例如，縮 搭樹脂（例如，由杜邦公司製造的Delrin®)、PVDF、聚氨 酯密閉性發泡、矽橡膠等材料製成。可使用其他材料。這 類材料可具有彈性或為墊208之厚度或密度之函數之符合 能力。材料可以其彈性為基礎來選擇。所需的彈性可以所 需的拋光類型為基礎來選擇。底墊208、208A、208B、 2〇 8C、208D之任一者或全體可偏心地裝配在拋光頭204 上以，舉例來說，拋光基板110或基板邊緣202之頂部及 底部表面之不同面積。 如上文參照第5 C圖所提及，在某些實施例中，用於 幫助拋光之流體可經由墊208、208A、208B、208C、208D 傳送至基板邊緣202。雖然示於第5C圖之流體通道502係 耦合至囊501，在替代的實施例中，流體通道502可設置 以滴下或喷灑流體在墊上或至墊中。或者，示於第5C圖 16 200906545 之囊50 1可具有一半滲透性膜，其允許流體緩慢釋放並傳 送至拋光γ 206(例如，通過墊）。在這類實施例中，墊2〇8、 208Α' 2〇8B、208C、2〇8D可以吸收及/或保留所用流體（例 如，聚乙烯醇（PVA)等）之材料覆蓋、製成、及/或包含該材 料。 第6A圖為說明根據本發明之一實施例之拋光臂2〇 ! 之負載臂3 1 4之橫剖面頂视圖，其係放置以經由拋光頭2〇4 和底墊208施加力至拋光帶2〇6(未顯示）與基板邊緣2〇2 上。如所示，在操作中，當致動器318(例如，氣動汽缸） 以大體上垂直拋光臂201之縱軸並遠離基板ιι〇之方向收 起時（舉例來說，回應電或機電訊號），收起可導致框轴機 構316之逆時針運動。反過來，柩轴機構316之逆時針運Figure 5D shows an embodiment of a "rolling" bottom pad 2 0 8 D which is formed in a wheel shape. The rolling bottom 208D can be inflated and/or 111 shaped or inflated and/or conformed. The rolling bottom pad 208D can affect (e.g., 'increasing or decreasing) the frictional force acting on the motion of the optical tape 206 by rotating while the polishing tape 206 is indexed, and thereby improve polishing performance. The bottom 208, 208A, 208B, 208C, 208D may be made of, for example, a shrink resin (e.g., Delrin® manufactured by DuPont), PVDF, polyurethane airtight foam, silicone rubber, or the like. Other materials can be used. Such materials may have elasticity or compliance with a function of the thickness or density of the mat 208. Materials can be selected based on their elasticity. The required elasticity can be selected based on the type of polishing required. Either or all of the bottom pads 208, 208A, 208B, 2A, 8C, 208D can be eccentrically mounted on the polishing head 204 to, for example, polish different areas of the top and bottom surfaces of the substrate 110 or substrate edge 202. As mentioned above with reference to Figure 5C, in some embodiments, the fluid used to aid in polishing can be delivered to the substrate edge 202 via pads 208, 208A, 208B, 208C, 208D. Although the fluid channel 502 shown in Figure 5C is coupled to the balloon 501, in an alternative embodiment, the fluid channel 502 can be configured to drip or spray fluid onto or into the pad. Alternatively, capsule 50 1 shown at 5C Figure 16 200906545 may have a semi-permeable membrane that allows for slow release of fluid and delivery to polishing gamma 206 (e.g., through a pad). In such embodiments, the pads 2〇8, 208Α' 2〇8B, 208C, 2〇8D may absorb, and/or retain, the material used (eg, polyvinyl alcohol (PVA), etc.) for material coverage, fabrication, and / or contain the material. Figure 6A is a cross-sectional top view showing the load arm 3 1 4 of the polishing arm 2 〇! according to an embodiment of the present invention, placed to apply force to the polishing belt via the polishing head 2 〇 4 and the bottom pad 208 2〇6 (not shown) on the edge of the substrate 2〇2. As shown, in operation, when the actuator 318 (eg, a pneumatic cylinder) is retracted in a direction substantially perpendicular to the longitudinal axis of the polishing arm 201 and away from the substrate (eg, in response to electrical or electromechanical signals) The stowage can cause counterclockwise movement of the frame shaft mechanism 316. Conversely, the counter-clockwise movement of the boring mechanism 316
動可導致負載臂314朝向基板"Ο之向前運動(如由第6A 圖之左側上之箭頭所示）。負截璧1 』貝戰# 314之向前運動可帶動頭 204 '底墊208、及拋光帶2 1禾顯不）與基板110之邊緣 202接觸。換言之’負載臂314 拋#辟 直或本質上垂直於 拋先臂201之縱軸306之方向移動 中，·^ + 動頭204。在某些實施例 垂直運動可以線性負載臂達成， 似之。 次了以旋轉負載臂近 第6Β圖為說明位於收起位置之負 頂視圖。在操作中，當致㈣318以垂臂304之橫剖面 縱轴並朝向基板1 1 G之方向延伸時（舉例=光臂20 1之 電訊號），延伸可導致樞軸機構31 回應電或機 來，樞車由機構316之順時針運動可導致=時針運動。反過 員栽臂3 1 4向後運 17 200906545 動遠離基板110，並收起頭204及底墊208。在此收起位置 中，沒有任何力由頭204施加至拋光帶206上，且拋光並 未發生。 . 致動器3 1 8之操作可由控制器1 2 0指示，其可適於決 定施加至基板1 1 0之力的量，及欲施加這類力之時間量等。 前文之敘述僅揭示本發明之示範實施例。落在本發明 之範圍内之上文所揭示的設備及方法之修改對那些在此技 ξ . 術中具有一般技能者來說將可立即明白。舉例來說，雖然 搖臂 3 0 4之旋轉軸已顯示為共面並正切基板 1 1 0之邊緣 2 0 2，旋轉軸可朝向或遠離基板1 1 0之中心偏移以改變位於 或接近基板1 1 〇之晶逼排除區之拋光特徵。 此外，雖然僅揭示清潔圓形基板之範例，本發明可修 改以清潔具有其他形狀之基板（例如，用於平板顯示器之玻 璃或聚合物平板）。進一步地，雖然上文顯示由該模組處理 單一基板，在某些實施例中，該模組可並行處理複數個基 板。 1 J 因此，雖然本發明已連同其示範實施例一起揭示，須 了解其他實施例可落在本發明之精神與範圍内，如由下列 申請專利範圍所定義。 【圖式簡單說明】 第1圖為本發明一實施例用於邊緣拋光之示範系統的 不意頂視圖， 第 2圖為本發明一實施例之一邊緣拋光設備之透視 18 200906545 圖； 第3圖為本發I 明一 實 施例之 拋光臂及拋 光 頭 之 透 視 圖； 第4圖為本發明 所描 繪 之一部 分的邊緣拋 光 δ又 備 與 基 板邊 緣接觸之一範例 實施 例 略圖， 第5A至5D圖為 適於 與 本發明 實施例併用 之 底 塾 之 不 同實 施例之特寫透視 圖， 第6A圖為依據 本發 明 一實施 例所描繪之 負 載 臂 在 欲 施加 力於基板邊緣之 位置 之 頂視橫 剖面圖； 第6B圖為根據 本發 明 之一實 施例描繒之 負 載 臂 位 於 一收 起位置之頂視橫 剖面 圖 0 【主 要元件符號說明 ] 100 邊緣拋光模組 101 外殼 102 、104、106 邊緣拋光設備 108 中心平台 110 基板 111 驅動器 112 > 114' 116 拋 光 帶 線 軸 120 控制器 201 拋光臂 202 基板邊緣 203 框 204 拋光頭區段（「 頭」 ) 206 拋光帶 208 、208A、 208B ' ： 208C 、 208D 底墊 209 供應線軸 210 捲取線軸 2 12 拉緊滾輪 302 支撐塊 304 搖臂 306 拋光臂縱轴 19 200906545 308 搖 動 馬 達 3 10 安 裝 架 3 12 密 封 平 板 3 14 負 載 臂 3 16 樞 軸 機 構 3 18 致 動 器 402 箭 頭 404 流 體 通 道 50 1 充 氣 囊 502、 504 流 體通道 20Movement may cause the load arm 314 to move forward toward the substrate " as indicated by the arrow on the left side of Figure 6A. The forward motion of the negative parabola 1 』Bei war # 314 can drive the head 204 'bottom pad 208, and the polishing tape 2 1 to be in contact with the edge 202 of the substrate 110. In other words, the load arm 314 is moved or moved in a direction perpendicular to the longitudinal axis 306 of the throwing arm 201, and the moving head 204 is moved. In some embodiments vertical motion can be achieved with a linear load arm. The negative top view of the stowed position is illustrated by the rotating load arm near the sixth drawing. In operation, when the (four) 318 extends in the direction of the longitudinal axis of the cross section of the vertical arm 304 and toward the substrate 1 1 G (for example, the electrical signal of the optical arm 20 1 ), the extension may cause the pivot mechanism 31 to respond to electricity or the machine. The clockwise movement of the pivot by mechanism 316 can result in an = hour hand movement. The counter-arming arm 3 1 4 is transported backwards 17 200906545, moving away from the substrate 110, and retracting the head 204 and the bottom pad 208. In this stowed position, no force is applied by the head 204 to the polishing belt 206, and polishing does not occur. The operation of the actuator 3 18 can be indicated by the controller 120, which can be adapted to determine the amount of force applied to the substrate 110, the amount of time to apply such force, and the like. The foregoing description discloses only exemplary embodiments of the invention. Modifications of the above-disclosed apparatus and methods that fall within the scope of the present invention will be immediately apparent to those of ordinary skill in the art. For example, although the axis of rotation of the rocker arm 104 has been shown to be coplanar and tangential to the edge 2 0 2 of the substrate 110, the axis of rotation can be offset toward or away from the center of the substrate 110 to change the substrate at or near the substrate. 1 1 The polishing characteristics of the grain exclusion zone. Moreover, although only an example of cleaning a circular substrate is disclosed, the present invention can be modified to clean substrates having other shapes (e.g., glass or polymer plates for flat panel displays). Further, while the above shows that a single substrate is processed by the module, in some embodiments, the module can process a plurality of substrates in parallel. Thus, the present invention has been described in connection with the exemplary embodiments thereof, and it is to be understood that other embodiments may be within the spirit and scope of the invention as defined by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top plan view of an exemplary embodiment of an edge polishing apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view of an edge polishing apparatus according to an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4 is a perspective view of a polishing arm and a polishing head according to an embodiment of the present invention; FIG. 4 is a schematic view showing an exemplary embodiment of edge polishing δ and contact with a substrate edge of a portion of the present invention, FIGS. 5A to 5D. A close-up perspective view of a different embodiment of a bottom raft suitable for use with embodiments of the present invention, FIG. 6A is a top cross-sectional view of the load arm depicted at a location where a force is applied to the edge of the substrate, in accordance with an embodiment of the present invention. Figure 6B is a top cross-sectional view of the load arm in a stowed position according to an embodiment of the present invention. [Main component symbol description] 100 edge polishing module 101 outer casing 102, 104, 106 edge polishing Device 108 center platform 110 substrate 111 driver 112 > 114' 116 polishing belt spool 120 controller 201 polishing arm 202 substrate edge 203 frame 204 polishing head section ("head") 206 polishing tape 208, 208A, 208B ': 208C, 208D bottom pad 209 supply spool 210 roll Take the bobbin 2 12 Tighten the roller 302 Support block 304 Rocker arm 306 Polishing arm longitudinal axis 19 200906545 308 Shake motor 3 10 Mounting bracket 3 12 Sealing plate 3 14 Load arm 3 16 Pivot mechanism 3 18 Actuator 402 Arrow 404 Fluid channel 50 1 inflatable bladder 502, 504 fluid passage 20