200905976 九、發明說明： L發明所屬之技術領域3 發明領域 本發明係有關一種搭載有手機、PDA、MP3播放器等 5 小型可攜機器之外層殼體等所使用之電路圖案之樹脂成形 體及其製造方法。 【先前技術3 發明背景 手機本身，PDA、MP3播放器等小型可攜電子機器均 10 需要天線以發揮與外界之通訊功能。上述天線為求小型化 及外觀設計等，宜不突出於電子機器之外部而裝設於内部 (參照諸如特開2001-136255號公報(專利文獻1))。 又，手機、PDA、MP3播放器等小型可攜電子機器亦 需要用於操作之輸入裝置。輸入裝置之一例則有電容式感 15 測器，該電容式感測器亦求小型化及外觀設計等，而有未 露出於可攜電子機器之外部而裝設於内部者。 然而，機器内部存在有用以排除電磁波之輻射之影響 之金屬罩盒、接地平面，而有其等對天線功能造成影響之 問題。為減少對上述機器内部之金屬層之天線之影響，可 20 使外層殼體與天線複合化，以使天線儘可能遠離金屬層。 又，電容式感測器則有因機器内部之多餘電容引起誤 操作之問題。減少上述機器内部之影響之方法之一，則宜 為外裝殼體與電容式感測器之複合化，以儘可能遠離機器 内部之電器電路等電荷之發生源。 200905976 天線或電容式感測器（以下僅簡稱為「天線」等）與外層 设體之複合形態’首先可為1)於外層殼體之外側表面上形 成有導電層所構成之平面天線等之形態，2)於外層殼體之 内側表面上形成有前述平面天線等之形態等（參照第8圖）。 5 然而’丨）有易受外界衝擊等而損傷平面天線等之問題，且， 由於天線等露出於外部’故殼體之設計上仍有限制。2)除 因外層殼體内面之夾層等之凹凸形狀而使天線等之圖案受 限平面天線等之位置將與金屬層至少接近外層殼體之厚 度程度。 1〇 由上述理由’可推論具體構成於外裝殼體本體上設置 天線等，並使用積層有構成裝飾膜3與天線等之薄膜6之内 嵌薄膜7 ’再於構成外裴殼體本體之樹脂成形體2與覆蓋該 樹脂成形體2之外側表面之裝飾膜3間，夾設於薄膜基材5上 形成有由導電層所構成之平面天線4等之薄膜6等，即可解 15決上述問題(參照第9圖）。 【發'明内容】 發明揭示 發明欲解決之課題 然而，使用積層有裝飾膜3與薄膜6等之内嵌薄膜7，並 2〇於成形用模具内進行内嵌成形，而製造内嵌 脂已一體化之外裝殼_，為對天線等進行供電== 脂成形體2設置開口呈圓形或方形之供電用貫通孔h，並使 平面天線4等之供電部4a露出。此時，覆蓋供電用貫通孔^ 之部分内嵌薄膜將朝該貫通孔2a之相反側變形，而有容易 200905976 發生凸起9之問題(參照第1〇 發生於樹脂成形體2之收缩二：二凸起係因冷_ 貫通孔2a之中谢於—點^^日成_之供電用 必然發生之問題。 1者’而為進行内嵌成形 5 10 之部4a連接料時，舉财之，係對樹月匕 之貝通孔内嵌附彈簣銷而對端子部4a予以重壓而/月 二Γ:僅由表面上業經積層之薄膜所覆蓋，藉= 端子部4,則因彈簧之壓力而變形 進而使其凸起增大。甚之’可能因薄膜6之變形而衫 子部域射實連接，而無法獲得連接可#性。”，、吏端 因此，本發明之目的即在解決上述問題，並提供 ==:供電用貫通―樹脂成形 用以欲解決課題之手段 本發明為解決上述之技術問題，而提供_種構成 之樹脂成形體及其製造方法。 α 依據本發明之第1態様，可提供一種樹脂成形體，使用 於外裝殼體，並於内部搭載有電路圖案，前述樹脂成形體 於第1樹脂成形部與第2樹脂成形部之間夾設有内嵌薄二 20且該内嵌薄膜於基體薄膜之表面上形成有電路圖安二’ 屯&固系’前述 第2樹脂成形部於其厚度方向上設有供電用貫通孔，且^ 電路圖案之一部分自該供電用貫通孔露出作為供電部。^ 依據本發明之第2態樣，可提供一種樹脂成形體之製造 方法，用以製造於第1樹脂成形部與第2樹脂成形部之間= 200905976 該方法使用於基體薄膜之表BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molded body of a circuit pattern used in an outer casing of a small portable device such as a mobile phone, a PDA, or an MP3 player, and the like. Its manufacturing method. [Prior Art 3 Background] A mobile phone itself, a small portable electronic device such as a PDA or an MP3 player, requires an antenna to perform communication with the outside world. In order to reduce the size and design of the antenna, the antenna is preferably installed outside the electronic device (see, for example, JP-A-2001-136255 (Patent Document 1)). In addition, small portable electronic devices such as mobile phones, PDAs, and MP3 players also require input devices for operation. One example of the input device is a capacitive sensor, which is also required to be miniaturized and designed, and is installed outside the portable electronic device. However, there are metal housings and ground planes that are useful inside the machine to eliminate the influence of electromagnetic wave radiation, and have problems affecting the antenna function. To reduce the effect on the antenna of the metal layer inside the machine, the outer casing can be combined with the antenna to keep the antenna as far as possible from the metal layer. Moreover, the capacitive sensor has a problem of malfunction due to excess capacitance inside the machine. One of the methods for reducing the influence of the inside of the above-mentioned machine is to combine the outer casing with the capacitive sensor so as to be as far as possible from the source of electric charge such as electrical circuits inside the machine. 200905976 Antenna or capacitive sensor (hereinafter simply referred to as "antenna", etc.) and the outer layer of the composite form 'first can be 1') a planar antenna formed by forming a conductive layer on the outer surface of the outer casing. In the form, 2) the form of the planar antenna or the like is formed on the inner surface of the outer casing (see Fig. 8). 5 However, there is a problem that the planar antenna or the like is easily damaged by an external impact or the like, and since the antenna or the like is exposed to the outside, there is still a limit in the design of the casing. 2) Except for the uneven shape of the interlayer or the like on the inner surface of the outer casing, the pattern of the antenna or the like is restricted. The position of the planar antenna or the like is at least as close as possible to the thickness of the outer layer of the metal layer. In the above-mentioned reason, it is inferred that an antenna or the like is provided on the outer casing body, and an in-line film 7' in which the film 6 constituting the decorative film 3 and the antenna is laminated is used to form the outer casing body. Between the resin molded body 2 and the decorative film 3 covering the outer surface of the resin molded body 2, a film 6 such as a planar antenna 4 composed of a conductive layer is formed on the film substrate 5, and the like. The above problem (refer to Figure 9). [Explaining the contents of the invention] The present invention discloses a problem to be solved by the invention. However, the inlaid film 7 in which the decorative film 3 and the film 6 are laminated is used, and the inlaid film 7 is formed in the molding die to produce the embedded resin. In addition, the power supply unit 4a such as the planar antenna 4 is exposed to the power supply unit 4a. At this time, a part of the in-line film covering the through hole for power supply is deformed toward the opposite side of the through hole 2a, and there is a problem that the protrusion 9 is easily generated in 200905976 (refer to the contraction of the first molded article 2 in the resin molded body 2: The two bulging system is inevitably caused by the power supply in the cold _ through hole 2a. The one is used for the in-line forming 5 10 part 4a. The terminal portion 4a is pressed against the shell-shaped pin in the shell hole of the tree, and the second portion is covered by the film which is laminated on the surface, and the terminal portion 4 is used for the spring. The deformation of the pressure causes the protrusion to increase. Even the 'mose of the film 6 may be connected by the deformation of the film 6 and the connection may not be obtained.", the end, therefore, the object of the present invention is In order to solve the above problems, and to provide a method for solving the problem, the present invention provides a resin molded body having a constitution and a method for producing the same. In the first state, a resin molded body can be provided, which is used outside. a circuit pattern is mounted inside the casing, and the resin molded body is provided with an inlaid thin film 20 between the first resin molded portion and the second resin molded portion, and the embedded film is formed on the surface of the base film. In the second resin molding portion of the circuit diagram, the second resin molding portion is provided with a through hole for supplying power in the thickness direction thereof, and a part of the circuit pattern is exposed as a power supply portion from the through hole for power supply. In a second aspect, a method of producing a resin molded body can be provided, which is produced between the first resin molded portion and the second resin molded portion = 200905976. The method is applied to the surface of the base film.
，將第1熔融樹脂射出至 至前述第1模穴内，製成黏著有前 設有内嵌薄膜之樹脂成形體，該; 面上形成有電路圖案之内嵌薄膜， 述:欲薄膜之第1樹脂成形部；在前述共通模内收納有黏著 有别述内肷薄膜之第！樹月旨成形部之狀態下開模，並將前述 替換欺換成前述第2替再度合模，使前述鎖之 刖而一 i述内甘欠薄膜之電路圖案接觸；及將第2熔融樹脂射 15出至可述第2模穴内，t成黏著有前述内嵌薄膜之第2樹脂 成形部。 依據本發明之第3態樣，可提供一種樹脂成形體之製造 方法’用以製造於第1樹脂成形部與第2樹脂成形部之間夾 設有内嵌薄膜之樹脂成形體，該方法使用於基體薄膜之表 20面上形成有電路圖案之内嵌薄膜，且使用具有第1模穴之第 1樹月曰成幵y第1模、與前述第1樹脂成形第1模組合使用並可 保持前述内嵌薄膜之第1樹脂成形第2模、可收納使用前述 第1樹月曰成形第1模與前述第1樹脂成形第2模而製得之黏著 有則述内嵌薄犋之第1樹脂成形部之第2樹脂成形第1模、及 200905976 與前述第2樹脂成形第1模組合使用並具有於内部立設有鱗 之第2模穴之第2樹脂成形第2模，以製造内部搭載有電路圖 案之樹脂成形體’本方法包含以下步驟：於前述第丨樹脂成 形第1模與前述第1Μ脂成形弟2模間，供給於前述基體薄膜 5表面上形成有前述電路圖案之前述内嵌薄膜；合模後，在 將前述内嵌薄膜保持於前述第1樹脂成形第2模之模穴形成 面之狀態下，將第1熔融樹脂射出至前述第1模穴内，製成 黏著有前述内欲薄膜之第1樹脂成形部；取出黏著有前述内 嵌薄膜之第1樹脂成形部，並將該第1樹脂成形部收納於前 10述第2樹脂成形第1模内且露出内嵌薄膜側；將第2樹脂成形 第1模與第2樹脂成形第2模合模，使前述鎖之前端與前述内 嵌薄膜之電路圖案接觸；及將第2溶融樹脂射出至前述第2 模穴内，製成於第1樹脂成形部與第2樹脂成形部之間失設 有内嵌薄膜之第2樹脂成形部。 15 發明效果 依據本發明，由於構成對模具間送入内嵌薄膜，並藉 雙色射出成形而於内嵌薄膜之兩面上設置樹脂成形部，故 可簡化夾設有内嵌薄膜之樹脂成形體。又，可藉設於第2替 換模或第2樹脂成形第2模之銷，而設置連通至内嵌薄膜之 2〇表面上所設之電路圖案之供電部之貫通孔，並可確實由電 路圖案供電。進而，由於貫通孔之隔有内嵌薄膜之裏側設 有第1樹脂成形部，故可抑制内嵌薄膜之凸起，對貫通孔内 嵌由彈簧賦與勢能之鎖等以確保由電路圖案供電時，亦不 致產生薄膜之凸起。 9 200905976 圖式簡單說明 本發明之前述與其他目的與特徵可由與針對添附圖式 之較佳實施形態有關的以下說明來了解。該圖式中 第1A圖係顯示本發明之樹脂成形體之製造方法所製造 5 之樹脂成形體之外觀構造之立體圖。 第1B圖係第1A圖之樹脂成形體之局部放大截面圖。 第2A圖係顯示第1A圖之樹脂成形體所使用之内嵌薄 膜之構造之局部放大截面圖。 第2B圖係顯示内嵌薄膜之其它構造之局部放大截面圖。 10 第3圖係顯示作為電路圖案之天線圖案之構造例之模 式圖。 第4A圖係顯示用以製造第1A圖之樹脂成形體之模具 構造者。 第4B圖係顯示用以製造第1A圖之樹脂成形體之模具 15 構造者。 第5A圖係顯示製造第1A圖之樹脂成形體之步驟者。 第5B圖係接續顯示製造第1A圖之樹脂成形體之步驟者。 第5C圖係顯示製造第1A圖之樹脂成形體之第5B圖之 後續步驟者。 20 第5D圖係顯示製造第1A圖之樹脂成形體之第5C圖之 後續步驟者。 第5E圖係顯示製造第1A圖之樹脂成形體之第5D圖之 後續步驟者。 第5F圖係顯示製造第1A圖之樹脂成形體之第5E圖之 10 200905976 後續步驟者。 第6A圖係顯示用以製造第1A圖之樹脂成形體之第1樹 脂成形模之構造者。 第6 B圖係顯示用以製造第1A圖之樹脂成形體之第2樹 5 脂成形模之構造者。 第7A圖係顯示使用第6A圖及第6B圖而製造樹脂成形 體之步驟者。 第7B圖係顯示使用第6A圖及第6B圖而製造樹脂成形 體之第7A圖之後續步驟者。 10 第7C圖係顯示使用第6A圖及第6B圖而製造樹脂成形 體之第7B圖之後續步驟者。 第8圖係顯示附天線之外裝殼體之一例之手機之分解 立體圖。 第9圖係顯示習知技術之樹脂成形體與裝飾薄膜間夾 15 設有天線薄膜之附天線外裝殼體之局部放大截面圖。 第10圖係顯示内嵌成形所致附天線外裝殼體之外觀瑕 疵之局部放大截面圖。 【實施方式3 用以實施發明之最佳形態 20 以下，就本發明一實施例之樹脂成形體之製造方法， 參照圖示加以說明。 第1A圖係顯示本發明之實施例之樹脂成形體之外觀構 造之立體圖。第1B圖係第1A圖之樹脂成形體之局部放大截 面圖。第1A圖之樹脂成形體1係使用於諸如手機、PDA、 11 200905976 播放器等小型可攜電子機器之外層殼體等者，其内部 設有天線、電容式感測器等電路圖案。 電路圖案設於内嵌_17之表面，並藉纽於構成樹 月曰成瓜體之外^卩刀之第丨樹脂成形部U與第2樹脂成形部 12間，而配置於樹脂成形體之内部。 本實施例中’第1樹脂成形部u係由透明樹脂（聚甲基 丙稀酸曱Sa &丨)所構成’並構成可由外側確認内欲薄膜 17。第1樹脂成形部11並與内料助之表面黏著而保持内 嵌薄膜17。第1樹脂成形部所使用之樹脂不限於上述透明樹 10脂，亦可使用不透明樹脂。舉例言之，可使用丙稀腈-苯乙 烯共聚物樹脂（AS)、丙烯腈-丁二烯-苯乙烯共聚物樹脂 (ABS)、丙酸纖維樹脂、聚碳酸醋樹脂(pC)、聚苯乙烯樹脂 (PS)、聚酯樹脂、聚乙烯樹脂及其等之聚合物陣列等。 第2樹脂成形部12之表面上設有供電用貫通孔12a。供 15 電用貫通孔12a係朝第2樹脂成形部12之厚度方向貫通而設 之孔洞’可露出設於内嵌薄膜17表面之電路圖案之供電部 14a。供電部14a設有2處之電路圖案亦可設置2處之貫通 孔。本實施例中，第2樹脂成形部12係由不透明樹脂所構 成，可使用諸如聚甲基丙烯酸甲酯樹脂、丙烯腈-苯乙烯共 20聚物樹脂(AS)、丙烯腈-丁二烯_苯乙烯共聚物樹脂(ABS)、 丙酸纖維樹脂、聚碳酸酯樹脂(PC)、聚苯乙烯樹脂(PS)、聚 酯樹脂、聚乙烯樹脂及其等之聚合物陣列等。第2樹脂成形 部所使用之樹脂不限於上述之不透明樹脂’亦可使用透明 樹脂。 12 200905976 第2A圖係顯示第ία圖之樹脂成形體1〇所使用之内嵌 薄膜之構造之局部放大截面圖。内嵌薄膜17係構成於基體 薄膜15表面上設有電路圖案14，基體薄膜15之未設有電路 圖案之側之面上貼合有修錦薄膜13。 5 修飾薄膜13係用以裝飾樹脂成形體10之層，通常，可 使用於透明樹脂薄膜之至少一面上形成有修飾層18者。透 明樹脂薄膜之材質則宜使用與第丨樹脂成形部丨丨之黏著性 較好者，可使用諸如聚碳酸酯系、聚醯胺系、聚醚酮系之 工程塑膠m聚對笨二甲酸乙m聚對苯二甲 ίο酸二丁醋系等之樹脂薄臈。又，修饰層18通常係著色墨水 層，可使用包含以胺甲酸乙酯樹脂、PC樹脂、乙烯樹脂、 來西曰樹脂等，尤其以胺甲酸乙酯系樹脂甚至其彈性體作為 黏著劑而以適當顏色之顏料或染料作為著色劑之著色墨水。 修飾層18之形成方法則可採用平版印刷法 、凹版印刷 is法、網版印刷法等印刷法、凹版塗布法、滾塗法、刮刀式 塗布法等塗布法。 另’上述修飾薄膜13可配合所欲表現之修飾而於透明 樹脂薄膜整體上設置修飾層18，亦可僅於透明樹脂薄膜之 一部分設置而構成翻t部分。χ，修飾賴13不用以裝 0飾樹月曰成形體10之外側表面整體時，亦可使用透明樹脂薄 膜中包含以適當顏色之顏料或染料作為著色劑者，以代替 修飾層之形成。 另第2Α圖中’修飾層18雖形成於透明樹脂薄膜之與 基體薄膜15接觸側之面上，但亦可設於與基體薄膜15相反 13 200905976 側之面上。如上所述，本實施例中，第丨樹脂成形部η位於 内欲薄膜之表面上，故可防止因磨損等而損傷修錦層。 内嵌薄膜17之基體薄膜15作為電路圖案14之支持某 板，可為任何適用之材質，而可使用諸如與修飾薄膜13之 5透明樹脂薄膜相同之聚碳酸醋系、$酿胺系、綱系之 工程塑膠、丙烯系、聚對苯二甲酸乙二酯系、聚對苯二甲 酸二丁酯系等樹脂薄膜。 設於内嵌薄膜上之電路圖案14若由具有天線功能及電 容開關之功能之導電性物質所構成，則無特別之限制。具 10有導電性之素材’若為金屬，則可使用諸如金、白金、銀、 銅、鋁、鎳、辞、鉛、鐵等。又，亦可使用導電性高分子 等具有導電性之高分子化合物。另，其等之電路圖案可藉 敷箔、糊劑、鍍層而形成於基體薄膜15之表面上。 使用電路圖案14作為天線時，該圖案可依頻域及用途 15而適當進行選擇。舉例言之，可選擇使用於無線LAN、 bluetooth(商標）rfid、GPS、ETC、通訊等之圖案。具體例 則可選擇第3圖所示之螺旋天線、雙極天線等之圖案。又， 平面天線之圖案，在導電層係由糊劑構成時，可以網版印 刷法；導電層由敷箔、鍍層等所構成時，可以使用印刷抗 20 蝕劑、感光性抗蝕劑之蝕刻法等泛用之方法進行形成。 使用電路圖案作為電容開關時，本實施例之樹脂成形 體10係構成於樹脂成形部11、12間設置電路圖案，而作為 可由樹脂成形部11、12任一之面輸入之開關元件使用。又’ 舉例言之，使用上述樹脂成形體作為可攜機器終端之保護 14 200905976 套時，在沿本體表面呈閉合狀態下，可以露出於外側之側 之面作為開關輸入面，在打開保護套之狀態下，則可以位 於本體表面之上側之内側面作為開關輸入面。 另，亦可構成就電容開關及天線共用電路圖案。此時， 5若保瘦套閉合，則電路圖案作為電容開關使用，在打開保 護套後，則可作為天線使用。 本實施例之樹脂成形體於機器之外裝殼體内埋設有電 路圖案14,並於構成機器之外裝殼體本體之第2樹脂成形部 經供電用貫通孔12a而對電路圖案供電，且對於内嵌薄膜17 10 在供電用貫通孔12a之相反側設有第1樹脂成形部11，故可 抑制内嵌薄膜之凸起之產生。 另，減薄第1樹脂成形部11後，則可進而使用第2B圖所 示之内嵌薄膜以防止凸起之產生。第2B圖之内嵌薄膜藉於 修飾薄膜13與基體薄膜15間内嵌補強板19，而可抑制内嵌 薄膜17a之變形、凸起之產生。 補強板19之面積宜至少包含樹脂成形體1〇之供電用貫 通孔121a全部。補強板19宜為合成及熱收縮率較小者，以 抑制覆蓋樹脂成形體10之供電用貫通孔12a之修飾薄膜13 及基體薄膜15之變形、凸起，而以使用液晶聚合物膜、玻 20璃布、玻璃不織布等，或以其等為主構造層之聚醯亞胺膜 等之積層體為佳。修飾薄膜13、基體薄膜15及補強板19可 分別藉透明黏著劑進行貼合。透明黏著劑宜為熱熔性者， 可視所使用之膜質而適當加以選擇。 樹脂成形體10若使用内嵌薄膜而藉雙色射出成形製成 15 200905976 内嵌成形品，則可製得製造上較安定之成品。以第1成形部 11及第2成形部12夾設有内嵌薄膜之樹脂成形體之製造過 程如下。 第4 A圖及第4 B圖係顯示用以製造樹脂成形體之模具 5 之概略構造者。模具20包含共通模21、可與共通模21組合 使用之第1替換模22及第2替換模23。 共通模21 '第1替換模22及第2替換模23構成可相互開 閉。本實施例中，共通模21係可動模，第1替換模22及第2 替換模23係固定模。 10 如第4A圖、第4B圖所示，共通模21設有用以形成第1 樹脂成形部11之第1模穴28，用以對該第1模穴射出第1熔融 樹脂之澆口 27則沿模具面而設置。 澆口27與第1替換模22之射出澆口24相連通，由第1替換 模之射出澆口 24射出之第1熔融樹脂則可射出至第丨模穴内。 15 如第4A圖所示，第1替換模22之分離面26構造平坦，該 面上則可保持内嵌薄膜17。第1替換模2 2並設有用以保持内 嵌薄膜17之吸引孔25。另，分離面亦可為曲面。 如第4B圖所示’第2替換模23設有第2模穴30及用以對 第2模穴30射出第2溶融樹脂之射出洗口 29。第2模穴30係用 20以形成樹脂成形體1〇之第2樹脂成形部12者，並設有用於形 成貫通孔12a之銷31。銷31可設於電路圖案之供電部l4a所 位在之處，銷31之高度則構成可於合模時接觸内嵌薄膜之 電路圖案之高度。本實施例中，銷31雖以圓柱形之構件構 成，但亦可使用可覆蓋供電部14a之筒狀者，以避免損傷供 200905976 電部14a。 使用上述模具20之樹脂成形體1 〇之内戒成形係依以下 步驟進行者。第5Α、5Β、5C、5D、5Ε、5F圖係顯示第1Α 圖之樹脂成形體之内嵌成形步驟者。 5 首先，將貼合修飾薄膜13之一面與基體薄膜15之未設 有電路圖案之側之面而製造之第2Α圖所示之内嵌薄膜17送 入模具20内。内嵌薄膜係朝基鱧薄膜15與第1替換模22之分 離面26對向之方向送入。内嵌薄膜17可如第5Α圖所示，就 各枚片分別送入單枚，亦可間歇送入長形之内嵌薄膜之必 10 要部分。 所送入之内嵌薄膜17可藉來自吸引孔25之吸力，而吸 附保持於第1替換模22之分離面26上。送入内嵌薄膜17後， 則如第5Β圖所示，移動共通模21而合模。 其次，如第5C圖所示，由設於第1替換模22之射出澆口 15 24送入第1熔融樹脂。射出澆口24與澆口 27相連通，第1熔 融樹脂則充填於第1模穴28内，而形成第1樹脂成形部11。 第1溶融樹脂之冷卻固化則可黏著内嵌薄膜17之修飾薄膜 13及第1樹脂成形部而加以一體化。 第1溶融樹脂固化後，開啓共通模21與第1替換模22， 20再將第1替換模22更換成第2替換模23(第5D圖）。 其次，將共通模21及第2替換模23合模（第5Ε圖）。此 時，第2替換模23之銷31之前端與黏著於第〖樹脂成形部u 之内敌薄膜17之基體薄膜Μ之表面緊貼，而覆蓋基體薄膜 15表面之電路圖案之供電部14玨。 17 200905976 該狀態下，由第2替換模23之射出澆口 29射出第2熔融 樹脂，並加以充填於第2模穴内（第汗圖）。如上所述，第2 模穴30设有銷31，故熔融樹脂不致流入該銷31部分。第2熔 融樹脂之冷卻固化則可使内嵌薄骐17之基體薄膜丨5與第2 5 樹脂成形部黏著而一體化。 第2樹脂成形部12冷卻固化後，開啓模具取出樹脂成形 品，並視需要去除樹脂成形品周緣之内嵌薄膜17之多餘部 分，即完成樹脂成形體1〇。設有銷31之位置上不會流入熔 融樹脂，故由第2替換模23取出該樹脂成形體1〇，即可於第 10 2樹脂成形部側形成貫通孔12a。 另，亦可不使用共通模而利用2組模具製造樹脂成形體 作為變形例。即，二模具係可在内鼓有内故薄膜之狀態下 形成第1樹脂成形部11之第1模40，以及可在内嵌有第丨模所 製造之第1樹脂成形部η之狀態下，形成第靖脂成形部之 15 第2模50。 第6Α圖係顯示上述變形例之用以製造樹脂成形體之第 1模之概略構造者。第1樹脂成形模4〇包含第i樹脂成形第i 杈41及可與第1樹脂成形第1模組合使用之第丨樹脂成形第2 模42。 2〇 帛1樹脂成形第1模41與第1樹脂成形第2模42構成可相 互開閉。本實施例中，第1樹脂成形第增㈣可動模，第i 樹脂成形第2模42則為固定模。 如第6A圖所示’第1樹脂成形第增“設有用以形成第i 樹脂成形部U之第i模穴48’用以對該第！模穴射出^炫融 18 200905976 樹脂之澆口 4<7則沿模具面而設置。澆口 47與第1樹脂成形第 2模42之射出澆口44相連通，由第1樹脂成形第2模42之射出 澆口 44射出之第1熔融樹脂則可射出至第1模穴内。 如第6A圖所示，第1樹脂成形第2模42之分離面46構造 5 平坦，該面上則可保持内嵌薄膜17。第1樹脂成形第2模42 設有用以保持内嵌薄膜17之吸引孔45。另，分離面亦可為 曲面。 第6B圖係顯示上述變形例之用以製造樹脂成形體之第 2樹脂成形模之概略構造者。第2樹脂成形模50包含第2樹脂 10 成形第1模51及可與第2樹脂成形第1模組合使用之第2樹脂 成形第2模52。 第2樹脂成形第1模51與第2樹脂成形第2模52構成可相 互開閉。本實施例中，第2樹脂成形第1模51係可動模，第2 樹脂成形第2模52則為固定模。 15 如第6B圖所示，第2樹脂成形第1模51包含用以收納固 定藉第1樹脂成形模40而形成之第1樹脂成形部11之固定用 凹部58。固定用凹部58之深度大小亦可小於第1樹脂成形部 11之厚度大小。此時，如後述般對第2樹脂成形第1模51固 定第1樹脂成形部11時，第1樹脂成形部將自第2樹脂成形模 20 50之分離面突出。 第2樹脂成形第2模52設有第2模穴53及用以對第2模穴 53射出第2熔融樹脂之射出澆口 59。第2模穴53係用以形成 樹脂成形體10之第2樹脂成形部12者，並設有用於形成貫通 孔12a之銷54。銷54可設於電路圖案之供電部14a所位在之 19 200905976 處’銷54之高度則構成合模時可接觸内嵌薄膜之電路圖案 之高度。本實施例申，銷54雖由圓柱形之構件構成，但亦 可使用可覆蓋供電部14a之筒狀者，以避免損傷供電部14a。 使用上述模具40、50之樹脂成形體10之内嵌成形係依 5以下步驟進行。第7A、7B、7C圖係顯示使用上述變形例之 模具而進行第1A圖之樹脂成形體之内嵌成形步驟者。另， 上述製程中’使用第1樹脂成形模40而製作第1樹脂成形部 11之步驟與使用第4A、4B圖所示模具而進行之步驟共通， 故省略其說明。 10 自第1樹脂成形模40取出以與第5A〜5C圖之步驟相同 之步驟而藉第1樹脂成形模40製成之第1樹脂成形體，再如 第7A圖所示’嵌入第2樹脂成形模5〇以使内嵌薄膜側露出。 其次，對第2樹脂成形第1模51之固定用凹部58嵌入第1 樹脂成形部11，而進行固定及對位作業，再將第2樹脂成形 15第1模51與第2樹脂成形第2模52合模，並將第1樹脂成形部 11收納於第2模穴53内（第7B圖）。此時，第2樹脂成形第2模 52之銷54前端與黏著於第1樹脂成形部u之内嵌薄膜I?之 基體溥膜15表面緊貼，而覆蓋基體薄膜15表面之電路圖案 之供電部14a。 20 該狀態下，則由第2樹脂成形第2模52之射出澆口59射 出第2炫融樹脂’並充填於第2模穴内。如上所述，第2模穴 53設有銷54，故熔融樹脂不致流入該鎖54部分。第2熔融樹 脂之冷卻固化則可使内嵌薄膜17與基體薄膜15與第2樹脂 成形部黏著而一體化（第7C圖）。 20 200905976 第2樹脂成形部〗2冷卻固化後，開啓第2樹脂成形模5〇 而取出樹脂成形品，並視需要去除樹脂成形品周緣之内嵌 薄膜17之多餘部分，即完成樹脂成形體1〇。設有銷％之位 置不會流入溶融樹脂，故自第2樹脂成形第2模52取出樹脂 5成形體10，即可於第2樹脂成形部側形成貫通孔12a。 如以上之說明，本實施例之樹脂成形體之製造方法可 對模具間送入内嵌薄膜，並藉雙色射出成形對内嵌薄膜之 兩面上設置樹脂成形部，故可簡化夾設有内嵌薄膜之樹脂 成形體之製造。又，藉設於第2替換模之銷，則可設置連通 10至内嵌薄膜表面上所設之電路圖案之供電部之貫通孔，並 確實自電路圖案供電。進而，貫通孔之裏側設有第丨樹脂成 形部，故可抑制内嵌薄膜之凸起之產生，即便對貫通孔内 嵌由彈簧賦與勢能之銷等以確保由電路圖案供電時，亦不 致產生薄膜之凸起。 15 另，本發明不限於上述之實施例，而可以其它各種態 樣進行實施。 舉例言之，第1A圖所示之例中，内嵌薄膜構成具有大 致與树月曰成形體之主面相同之面積，而露出於樹脂成形體 之側面側’但亦可縮小内嵌薄膜而加以收納於内側。 2〇 本發明已參照附圖就較佳實施例充分進行揭露，彳曰熟 習本技術之人員則可輕易進行各種變形及修正實施。該等 變形及修正若未逸脫後附之申請專利範圍所界定之本發明 範圍’即應包含在上述範圍内。 【圈式簡單說^明】 21 200905976 第1A圖係顯示本發明之樹脂成形體之製造方法所製造 之樹脂成形體之外觀構造之立體圖。 第1Β圖係第1Α圖之樹脂成形體之局部放大截面圖。 第2Α圖係顯示第1Α圖之樹脂成形體所使用之内嵌薄 5 膜之構造之局部放大截面圖。 第2Β圖係顯示内嵌薄膜之其它構造之局部放大截面圖。 第3圖係顯示作為電路圖案之天線圖案之構造例之模 式圖。 第4Α圖係顯示用以製造第1Α圖之樹脂成形體之模具 10 構造者。 第4 Β圖係顯示用以製造第1Α圖之樹脂成形體之模具 構造者。 第5A圖係顯示製造第1A圖之樹脂成形體之步驟者。 第5B圖係接續顯示製造第1A圖之樹脂成形體之步驟者。 15 第5C圖係顯示製造第1A圖之樹脂成形體之第5B圖之 後續步驟者。 第5 D圖係顯示製造第1A圖之樹脂成形體之第5 C圖之 後續步驟者。 第5E圖係顯示製造第1A圖之樹脂成形體之第5D圖之 20 後續步驟者。 第5F圖係顯示製造第1A圖之樹脂成形體之第5E圖之 後續步驟者。 第6A圖係顯示用以製造第1A圖之樹脂成形體之第1樹 脂成形模之構造者。 22 200905976 第6 B圖係顯示用以製造第1A圖之樹脂成形體之第2樹 脂成形模之構造者。 第7A圖係顯示使用第6A圖及第6B圖而製造樹脂成形 體之步驟者。 5 第7B圖係顯示使用第6A圖及第6B圖而製造樹脂成形 體之第7A圖之後續步驟者。 第7C圖係顯示使用第6A圖及第6B圖而製造樹脂成形 體之第7B圖之後續步驟者。 第8圖係顯示附天線之外裝殼體之一例之手機之分解 10 立體圖。 第9圖係顯示習知技術之樹脂成形體與裝飾薄膜間夾 設有天線薄膜之附天線外裝殼體之局部放大截面圖。 第10圖係顯示内嵌成形所致附天線外裝殼體之外觀瑕 疯之局部放大截面圖。 15 【主要元件符號說明】 卜2…樹脂成形體 9···凸起 2a···供電用貫通孔 11…第1樹脂成形部 3…裝飾膜 12···第2樹脂成形部 4…平面天線 12a···供電用貫通孔 4a…供電部 13…修飾薄膜 4a…端子部 14···電路圖案 5…薄膜基材 14a···供電部 6…薄膜 15···基體薄膜 7…内傲薄膜 17，17a…内嵌薄膜 23 200905976 18…修飾層 19···補強板 20…模具 21…共通模 22…第1替換模 23…第2替換模 24…射出澆口 25···吸引孔 26…分離面 27…洗口 28…第1模穴 29…射出澆口 30···第2模穴 31…鎖 40…第1樹脂成形模 41…第1樹脂成形第1模 42…第1樹脂成形第纖 44…射出澆口 45···吸引孔 46".分離面 47…澆口 48…第1模穴 50…第2樹脂成形模 51···第2樹脂成形第1模 52…第2樹脂成形第2模 53…第2模穴 54…銷 58…固定用凹部 59…射出澆口 121a…供電用貫通孔 24And ejecting the first molten resin into the first cavity to form a resin molded body having an embedded film disposed thereon, wherein an in-line film having a circuit pattern is formed on the surface, and the first film is formed. a resin molded portion; a portion in which the inner film is adhered to the common mold; The mold is opened in the state of the forming portion, and the replacement is replaced by the second replacement mold, so that the lock is twisted and the circuit pattern of the film is contacted; and the second molten resin is used. The film 15 is discharged into the second cavity which can be described, and t is a second resin molded portion to which the embedded film is adhered. According to a third aspect of the present invention, a method of producing a resin molded body can be provided, in which a resin molded body in which an embedded film is interposed between a first resin molded portion and a second resin molded portion is provided. An in-line film having a circuit pattern is formed on the surface of the surface of the base film, and the first mold having the first cavity is used, and the first mold is used in combination with the first mold. The first resin-molding second mold that holds the inlay film, and the first mold that is formed by using the first tree-form molding first mold and the first resin molding second mold, and the in-line thin layer (1) The second resin molding first mold of the resin molding portion, and the second resin molding second mold which is used in combination with the second resin molding first mold and has the second molding cavity in which the scale is provided inside, and is manufactured. The present invention comprises the steps of: forming a circuit pattern on a surface of the base film 5 between the first resin molding first mold and the first resin molding second mold; The aforementioned inline film; after clamping, in The in-line film is held in the cavity forming surface of the second resin molding second mold, and the first molten resin is ejected into the first cavity to form a first resin molding portion to which the inner film is adhered. The first resin molded portion to which the inlay film is adhered is taken out, and the first resin molded portion is housed in the first resin molded first mold of the first tenth embodiment to expose the inlaid film side; and the second resin is molded into the first portion. Forming a second mold with the second resin, bringing the front end of the lock into contact with the circuit pattern of the embedded film; and ejecting the second molten resin into the second cavity to form the first resin molded portion The second resin molded portion in which the film is embedded is lost between the second resin molded portions. According to the present invention, since the resin-molded portion is provided on both surfaces of the inlaid film by the two-color injection molding by feeding the in-line film between the dies, the resin molded body in which the embedded film is interposed can be simplified. Further, the pin of the second mold can be formed by the second replacement mold or the second resin, and the through hole of the power supply portion that communicates with the circuit pattern provided on the surface of the second surface of the embedded film can be provided. Pattern power supply. Further, since the first resin molded portion is provided on the inner side of the through-hole via the in-line film, the projection of the embedded film can be suppressed, and a lock for the potential energy can be embedded in the through hole to ensure power supply from the circuit pattern. At the same time, no protrusion of the film is produced. BRIEF DESCRIPTION OF THE DRAWINGS The foregoing and other objects and features of the present invention will be understood from the following description of the preferred embodiments. In the drawings, Fig. 1A is a perspective view showing an appearance structure of a resin molded body produced by the method for producing a resin molded body of the present invention. Fig. 1B is a partially enlarged cross-sectional view showing the resin molded body of Fig. 1A. Fig. 2A is a partially enlarged cross-sectional view showing the structure of the inlaid film used in the resin molded body of Fig. 1A. Figure 2B is a partially enlarged cross-sectional view showing another configuration of the in-line film. 10 Fig. 3 is a view showing a configuration example of an antenna pattern as a circuit pattern. Fig. 4A is a view showing a mold builder for manufacturing the resin molded body of Fig. 1A. Fig. 4B is a view showing the structure of the mold 15 for manufacturing the resin molded body of Fig. 1A. Fig. 5A is a view showing the steps of manufacturing the resin molded body of Fig. 1A. Fig. 5B is a view showing the steps of manufacturing the resin molded body of Fig. 1A. Fig. 5C is a view showing the subsequent steps of the fifth embodiment of the resin molded body of Fig. 1A. 20 Fig. 5D shows the subsequent steps of the 5Cth drawing of the resin molded body of Fig. 1A. Fig. 5E is a view showing the subsequent steps of the fifth drawing of the resin molded body of Fig. 1A. Fig. 5F is a view showing the subsequent steps of the manufacture of the resin molded body of Fig. 1A in Fig. 5E. Fig. 6A is a view showing the structure of the first resin molding die for producing the resin molded body of Fig. 1A. Fig. 6B is a view showing the structure of the second tree 5 fat forming mold for producing the resin molded body of Fig. 1A. Fig. 7A shows a step of producing a resin molded body using Figs. 6A and 6B. Fig. 7B is a view showing the subsequent steps of Fig. 7A for producing a resin molded body using Figs. 6A and 6B. 10 Fig. 7C shows the subsequent steps of Fig. 7B for producing a resin molded body using Figs. 6A and 6B. Fig. 8 is an exploded perspective view showing the mobile phone with an example of an outer casing with an antenna. Fig. 9 is a partially enlarged cross-sectional view showing an antenna housing with an antenna film, showing a sandwich between a resin molded body and a decorative film of the prior art. Fig. 10 is a partially enlarged cross-sectional view showing the appearance of the outer casing of the antenna attached by the in-line molding. [Embodiment 3] Best Mode for Carrying Out the Invention 20 Hereinafter, a method of manufacturing a resin molded body according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1A is a perspective view showing the appearance of the resin molded body of the embodiment of the present invention. Fig. 1B is a partially enlarged cross-sectional view showing the resin molded body of Fig. 1A. The resin molded body 1 of Fig. 1A is used for a casing of a small portable electronic device such as a mobile phone, a PDA, or a 200905976 player, and has a circuit pattern such as an antenna or a capacitive sensor. The circuit pattern is provided on the surface of the in-line _17, and is disposed between the second resin molded portion U and the second resin molded portion 12, which are formed by the shovel and the shovel. internal. In the present embodiment, the first resin molded portion u is made of a transparent resin (Sa & Sa & ’) and constitutes an inner film 17 which can be confirmed from the outside. The first resin molded portion 11 is adhered to the surface of the inner material to hold the in-line film 17. The resin used in the first resin molded portion is not limited to the above transparent resin 10, and an opaque resin may be used. For example, acrylonitrile-styrene copolymer resin (AS), acrylonitrile-butadiene-styrene copolymer resin (ABS), propionic acid fiber resin, polycarbonate resin (pC), polyphenylene can be used. A polymer array such as a vinyl resin (PS), a polyester resin, a polyethylene resin, or the like. The power supply through hole 12a is provided on the surface of the second resin molded portion 12. The through hole 12a for the electric passage 15a penetrates the thickness of the second resin molded portion 12 to expose the power supply portion 14a of the circuit pattern provided on the surface of the embedded film 17. The power supply unit 14a is provided with two circuit patterns and two through holes. In the present embodiment, the second resin molded portion 12 is composed of an opaque resin, and for example, polymethyl methacrylate resin, acrylonitrile-styrene copolymer 20 resin (AS), acrylonitrile-butadiene can be used. A polymer array of styrene copolymer resin (ABS), propionic acid fiber resin, polycarbonate resin (PC), polystyrene resin (PS), polyester resin, polyethylene resin, and the like. The resin used in the second resin molded portion is not limited to the above-mentioned opaque resin. A transparent resin may also be used. 12 200905976 Fig. 2A is a partially enlarged cross-sectional view showing the structure of the inlaid film used for the resin molded body 1 of the Fig. The in-line film 17 is formed on the surface of the base film 15 with a circuit pattern 14 on its side, and the surface of the base film 15 on the side where the circuit pattern is not provided is bonded to the mask film 13. The modified film 13 is used to decorate the layer of the resin molded body 10, and usually, the decorative layer 18 may be formed on at least one side of the transparent resin film. The material of the transparent resin film should preferably be used in combination with the second resin molded portion, and an engineering plastic such as polycarbonate, polyamine or polyether ketone can be used. m Polyphenylene terephthalate, dibutyl vinegar, etc. Further, the modification layer 18 is usually a colored ink layer, and may be used by using an urethane resin, a PC resin, a vinyl resin, a lysine resin, or the like, particularly an urethane resin or even an elastomer thereof as an adhesive. A colored ink of a suitable color of pigment or dye as a colorant. The method of forming the decorative layer 18 may be a coating method such as a lithographic method, a gravure is method, a screen printing method, or the like, a gravure coating method, a roll coating method, or a doctor blade coating method. Further, the above-mentioned modified film 13 may be provided with a decorative layer 18 as a whole in the transparent resin film in accordance with the modification desired, or may be provided only in a part of the transparent resin film to constitute a t-part. In other words, when the outer surface of the outer surface of the molded article 10 is not used, the transparent resin film may be used as a coloring agent containing a pigment or a dye of an appropriate color instead of the formation of the decorative layer. Further, in the second drawing, the decorative layer 18 is formed on the surface of the transparent resin film on the side in contact with the base film 15, but may be provided on the side opposite to the base film 15 on the side of the 2009 200905976 side. As described above, in the present embodiment, the second resin molded portion η is located on the surface of the inner film, so that the repair layer can be prevented from being damaged by abrasion or the like. The base film 15 of the embedded film 17 is a supporting plate of the circuit pattern 14, and may be any suitable material, and a polycarbonate such as a transparent resin film of the modified film 13 may be used. It is a resin film such as engineering plastics, propylene, polyethylene terephthalate or polybutylene terephthalate. The circuit pattern 14 provided on the embedded film is not particularly limited as long as it is composed of a conductive material having an antenna function and a function of a capacitance switch. The material having 10 conductivity can be used as metal, such as gold, platinum, silver, copper, aluminum, nickel, rhodium, lead, iron, and the like. Further, a conductive polymer compound such as a conductive polymer can also be used. Further, the circuit patterns thereof may be formed on the surface of the base film 15 by applying a foil, a paste, or a plating. When the circuit pattern 14 is used as an antenna, the pattern can be appropriately selected depending on the frequency domain and the use 15. For example, a pattern for wireless LAN, Bluetooth (trademark) rfid, GPS, ETC, communication, etc. can be selected. As a specific example, a pattern such as a helical antenna or a dipole antenna shown in Fig. 3 can be selected. Further, the pattern of the planar antenna may be a screen printing method when the conductive layer is composed of a paste; and when the conductive layer is composed of a foil, a plating layer or the like, etching using a photoresist and a photoresist may be used. Forms such as the law are generally used. When the circuit pattern is used as the capacitance switch, the resin molded body 10 of the present embodiment is formed by providing a circuit pattern between the resin molded portions 11 and 12, and is used as a switching element that can be input from any of the resin molded portions 11 and 12. In other words, when the above-mentioned resin molded body is used as the protection of the portable machine terminal 14 200905976, the surface which can be exposed on the outer side is used as the switch input surface when the body surface is closed, and the protective cover is opened. In the state, the inner side of the upper side of the body surface can be used as the switch input surface. Alternatively, a circuit pattern can be shared between the capacitor switch and the antenna. At this time, if the thin sleeve is closed, the circuit pattern is used as a capacitor switch, and after opening the sheath, it can be used as an antenna. In the resin molded body of the present embodiment, the circuit pattern 14 is embedded in the casing of the machine, and the second resin molded portion of the casing body is configured to supply power to the circuit pattern through the power supply through hole 12a. Since the first resin molded portion 11 is provided on the side opposite to the power supply through hole 12a for the in-line film 17 10, the occurrence of the projection of the embedded film can be suppressed. Further, after the first resin molded portion 11 is thinned, the in-line film shown in Fig. 2B can be further used to prevent the occurrence of protrusions. The in-line film of Fig. 2B is formed by embedding the reinforcing plate 19 between the modified film 13 and the base film 15, and the deformation and projection of the inlaid film 17a can be suppressed. It is preferable that the area of the reinforcing plate 19 includes at least all of the through holes 121a for supplying power of the resin molded body 1〇. The reinforcing plate 19 is preferably one having a smaller synthesis and heat shrinkage ratio, and suppresses deformation and projection of the modified film 13 and the base film 15 covering the power supply through-hole 12a of the resin molded body 10, and uses a liquid crystal polymer film or glass. It is preferable that a glass cloth, a glass non-woven fabric, or the like, or a laminate of a polyimine film such as a main structural layer is preferable. The modified film 13, the base film 15, and the reinforcing plate 19 can be bonded together by a transparent adhesive. The transparent adhesive is preferably a hot melt, and may be appropriately selected depending on the film quality to be used. When the resin molded body 10 is formed by two-color injection molding using an inlaid film, it is possible to obtain a finished product which is relatively stable in manufacture. The manufacturing process of the resin molded body in which the embedded film is interposed between the first molded portion 11 and the second molded portion 12 is as follows. Figs. 4A and 4B show a schematic structure of a mold 5 for producing a resin molded body. The mold 20 includes a common mold 21 and a first replacement mold 22 and a second replacement mold 23 which can be used in combination with the common mold 21. The common mode 21' first replacement die 22 and the second replacement die 23 are configured to be openable and closable. In the present embodiment, the common mold 21 is a movable mold, and the first replacement mold 22 and the second replacement mold 23 are fixed molds. 10, as shown in FIG. 4A and FIG. 4B, the common mold 21 is provided with a first cavity 28 for forming the first resin molded portion 11, and a gate 27 for discharging the first molten resin to the first cavity is provided. Set along the mold surface. The gate 27 communicates with the gate 24 of the first replacement mold 22, and the first molten resin which is emitted from the gate 24 of the first replacement mold can be emitted into the second cavity. As shown in Fig. 4A, the separation surface 26 of the first replacement mold 22 is flat, and the in-line film 17 can be held on the surface. The first replacement mold 22 is provided with a suction hole 25 for holding the in-line film 17. In addition, the separation surface can also be a curved surface. As shown in Fig. 4B, the second replacement mold 23 is provided with a second cavity 30 and an ejection port 29 for emitting the second molten resin to the second cavity 30. The second cavity 30 is formed of 20 to form the second resin molded portion 12 of the resin molded body 1 and is provided with a pin 31 for forming the through hole 12a. The pin 31 can be placed where the power supply portion 14a of the circuit pattern is located, and the height of the pin 31 constitutes the height of the circuit pattern that can contact the embedded film during mold clamping. In the present embodiment, the pin 31 is formed of a cylindrical member, but a tubular member covering the power supply portion 14a may be used to avoid damage to the electrical part 14a of the 200905976. The resin molded body 1 using the above-described mold 20 is subjected to the following steps. The 5th, 5th, 5th, 5th, 5th, and 5F drawings show the step of insert molding of the resin molded body of Fig. 1 . 5 First, the inlaid film 17 shown in Fig. 2, which is produced by laminating one surface of the modified film 13 and the side of the base film 15 on the side where the circuit pattern is not provided, is fed into the mold 20. The inlaid film is fed in the direction in which the base film 15 and the separation surface 26 of the first replacement mold 22 oppose each other. The in-line film 17 can be fed into a single piece as shown in Fig. 5, or can be intermittently fed into a necessary portion of the elongated in-line film. The inserted in-line film 17 can be sucked and held by the separation surface 26 of the first replacement mold 22 by the suction force from the suction hole 25. After the in-line film 17 is fed, as shown in Fig. 5, the common mold 21 is moved to close the mold. Next, as shown in Fig. 5C, the first molten resin is fed from the gates 15 24 provided in the first replacement mold 22. The injection gate 24 communicates with the gate 27, and the first molten resin is filled in the first cavity 28 to form the first resin molded portion 11. When the first molten resin is cooled and solidified, the modified film 13 of the embedded film 17 and the first resin molded portion can be bonded and integrated. After the first molten resin is cured, the common mold 21 and the first replacement mold 22 are opened, and the first replacement mold 22 is replaced with the second replacement mold 23 (Fig. 5D). Next, the common mold 21 and the second replacement mold 23 are clamped (Fig. 5). At this time, the front end of the pin 31 of the second replacement mold 23 is in close contact with the surface of the base film crucible adhered to the inner film 17 of the resin molding portion u, and the power supply portion 14 that covers the circuit pattern on the surface of the base film 15 . 17 200905976 In this state, the second molten resin is injected from the injection gate 29 of the second replacement mold 23, and is filled in the second cavity (the sweat map). As described above, the second cavity 30 is provided with the pin 31, so that the molten resin does not flow into the pin 31 portion. When the second molten resin is cooled and solidified, the base film crucible 5 in which the thin crucible 17 is embedded is adhered to the second resin molded portion and integrated. After the second resin molded portion 12 is cooled and solidified, the resin molded article is opened by opening the mold, and the excess portion of the inner film 17 of the periphery of the resin molded article is removed as necessary, that is, the resin molded body 1 is completed. Since the molten resin is not allowed to flow at the position where the pin 31 is provided, the resin molded body 1 is taken out by the second replacement mold 23, so that the through hole 12a can be formed on the side of the 10th resin molded portion. Further, a resin molded body may be produced by using two sets of molds without using a common mold as a modification. In other words, the two molds can form the first mold 40 of the first resin molded portion 11 in a state in which the inner drum has a film, and the first resin molded portion η manufactured by the second mold can be embedded therein. Forming the second mold 50 of the first grease forming portion. Fig. 6 is a view showing a schematic structure of a first mold for producing a resin molded body according to the above modification. The first resin molding die 4 includes an i-th resin molding i-th 41 and a second resin-molding second die 42 which can be used in combination with the first resin molding first die. 2〇 The resin molding first mold 41 and the first resin molding second mold 42 are configured to be able to open and close each other. In the present embodiment, the first resin is molded by the fourth (fourth) movable mold, and the i-th resin molded second mold 42 is a fixed mold. As shown in Fig. 6A, the "first resin molding first increase" is provided with the i-th mold cavity 48' for forming the i-th resin molded portion U for emitting the second cavity of the first mold cavity. 7 is provided along the mold surface. The gate 47 communicates with the injection gate 44 of the first resin molding second mold 42, and the first molten resin which is formed by the first resin molding the injection gate 44 of the second mold 42 is The first resin molding second mold 42 has a flat structure 5, and the in-line film 17 can be held on the surface. The first resin molding second mold 42 is formed as shown in Fig. 6A. A suction hole 45 for holding the in-line film 17 is provided. The separation surface may be a curved surface. Fig. 6B is a view showing a schematic structure of a second resin molding die for producing a resin molded body of the above modification. The resin molding die 50 includes a first resin 51 for molding the first resin 51 and a second resin molding second mold 52 for use in combination with the second resin molding first mold. The second resin molding first mold 51 and the second resin molding method The two molds 52 are configured to be openable and closable. In the present embodiment, the second resin molding first mold 51 is a movable mold, and the second resin is molded into a second mold 52. As shown in Fig. 6B, the second resin molding first mold 51 includes a fixing recess 58 for accommodating the first resin molded portion 11 formed by the first resin molding die 40. The fixing concave portion is provided. The depth of the first resin molding portion 11 may be smaller than the thickness of the first resin molded portion 11. When the first resin molded portion 11 is fixed to the second resin molded first mold 51, the first resin molded portion will be the second resin molded portion. The separation surface of the resin molding die 20 50 protrudes. The second resin molding second mold 52 is provided with a second cavity 53 and an injection gate 59 for emitting the second molten resin to the second cavity 53. The second cavity 53 The second resin molded portion 12 for forming the resin molded body 10 is provided with a pin 54 for forming the through hole 12a. The pin 54 can be provided at the power supply portion 14a of the circuit pattern at 19 200905976 'pin 54 The height is the height of the circuit pattern that can be in contact with the embedded film when the mold is closed. In the embodiment, the pin 54 is formed of a cylindrical member, but a tube that can cover the power supply portion 14a can be used to avoid damage. Power supply unit 14a. The in-line molding system of the resin molded body 10 using the above-described molds 40 and 50 5 is performed in the following steps. The 7A, 7B, and 7C drawings show the step of insert molding the resin molded body of Fig. 1A using the mold of the above-described modification. In the above process, the first resin molding die 40 is used. The step of producing the first resin molded portion 11 is the same as the step of using the mold shown in Figs. 4A and 4B, and therefore the description thereof is omitted. 10 The first resin molding die 40 is taken out and is the same as the steps of the fifth and fifth embodiments. In the first resin molded body formed by the first resin molding die 40, the second resin molding die 5 is embedded in the second resin molding die 5 as shown in Fig. 7A to expose the inlaid film side. Then, the first resin molded portion 11 is fitted into the first resin molded portion 11 to fix and align the second resin molded first mold 51, and the second resin is molded into the first mold 51 and the second resin. The mold 52 is clamped, and the first resin molded portion 11 is housed in the second cavity 53 (Fig. 7B). At this time, the tip end of the pin 54 of the second resin molded second mold 52 is in close contact with the surface of the base film 15 adhered to the first resin molded portion u, and the circuit pattern covering the surface of the base film 15 is supplied. Part 14a. In this state, the second molten resin is injected from the exit gate 59 of the second resin 52 in the second resin molding, and is filled in the second cavity. As described above, the second cavity 53 is provided with the pin 54, so that the molten resin does not flow into the portion of the lock 54. The cooling and solidification of the second molten resin allows the in-line film 17 and the base film 15 to adhere to the second resin molded portion to be integrated (Fig. 7C). 20 200905976 After the second resin molding unit 2 is cooled and solidified, the second resin molding die 5 is opened, and the resin molded article is taken out, and if necessary, the excess portion of the inlaid film 17 on the periphery of the resin molded article is removed, that is, the resin molded body 1 is completed. Hey. Since the position where the pin % is provided does not flow into the molten resin, the resin 5 molded body 10 is taken out from the second resin molded second mold 52, and the through hole 12a can be formed on the second resin molded portion side. As described above, the method for producing a resin molded body of the present embodiment can feed the inlaid film between the molds, and the resin forming portion is provided on both sides of the inlaid film by the two-color injection molding, so that the inlay can be simplified. Production of a resin molded body of a film. Further, by the pin provided in the second replacement mold, a through hole that communicates with the power supply portion of the circuit pattern provided on the surface of the embedded film can be provided, and power is supplied from the circuit pattern. Further, since the second resin forming portion is provided on the back side of the through hole, it is possible to suppress the occurrence of the projection of the inlaid film, and it is not possible to embed the pin of the potential energy by the spring in the through hole to ensure the power supply from the circuit pattern. Produces a convexity of the film. Further, the present invention is not limited to the above embodiments, but can be implemented in other various aspects. For example, in the example shown in FIG. 1A, the in-line film has an area which is substantially the same as the main surface of the tree slab shaped body, and is exposed on the side surface side of the resin molded body, but the in-line film can be reduced. Stored on the inside. 2 The present invention has been fully disclosed in its preferred embodiments with reference to the drawings, and various modifications and modifications can be readily made by those skilled in the art. Such variations and modifications are intended to be included within the scope of the invention as defined by the appended claims. [Circle type simple description] 21 200905976 Fig. 1A is a perspective view showing an appearance structure of a resin molded body produced by the method for producing a resin molded body of the present invention. Fig. 1 is a partially enlarged cross-sectional view showing a resin molded body of Fig. 1 . Fig. 2 is a partially enlarged cross-sectional view showing a structure in which a thin film is embedded in a resin molded body of Fig. 1 . Fig. 2 is a partially enlarged cross-sectional view showing another configuration of the embedded film. Fig. 3 is a view showing a configuration example of an antenna pattern as a circuit pattern. Fig. 4 is a view showing the structure of the mold 10 for manufacturing the resin molded body of Fig. 1 . The fourth drawing shows the mold builder for manufacturing the resin molded body of Fig. 1 . Fig. 5A is a view showing the steps of manufacturing the resin molded body of Fig. 1A. Fig. 5B is a view showing the steps of manufacturing the resin molded body of Fig. 1A. 15 Fig. 5C shows the subsequent steps of the fifth embodiment of the resin molded body of Fig. 1A. Fig. 5D shows the subsequent steps of the fifth C-picture of the resin molded body of Fig. 1A. Fig. 5E is a view showing the subsequent steps of the fifth drawing of the resin molded body of Fig. 1A. Fig. 5F is a view showing the subsequent steps of the fifth embodiment of the resin molded body of Fig. 1A. Fig. 6A is a view showing the structure of the first resin molding die for producing the resin molded body of Fig. 1A. 22 200905976 Fig. 6B shows the structure of the second resin molding die for producing the resin molded body of Fig. 1A. Fig. 7A shows a step of producing a resin molded body using Figs. 6A and 6B. 5 Fig. 7B shows the subsequent steps of Fig. 7A for producing a resin molded body using Figs. 6A and 6B. Fig. 7C shows the subsequent steps of the 7B drawing of the resin molded body using Figs. 6A and 6B. Fig. 8 is a perspective view showing the exploded view of the mobile phone with an example of an external casing with an antenna. Fig. 9 is a partially enlarged cross-sectional view showing the antenna outer casing with the antenna film interposed between the resin molded body of the prior art and the decorative film. Fig. 10 is a partially enlarged cross-sectional view showing the appearance of the antenna housing casing caused by the in-line molding. 15 [Description of main component symbols] 2: Resin molded body 9···Bumps 2a··Power supply through-holes 11...First resin molded part 3...Decorative film 12···Second resin molded part 4...Flat Antenna 12a···Power supply through hole 4a...Power supply unit 13...Modified film 4a...Terminal portion 14···Circuit pattern 5...Film substrate 14a···Power supply unit 6...Film 15···Base film 7... Proud film 17,17a...Inline film 23 200905976 18...Modification layer 19···Reinforcing plate 20...Mold 21...Common mold 22...First replacement mold 23...Second replacement mold 24...Import gate 25···Attraction Hole 26...separation surface 27...washing port 28...first cavity 29...injecting gate 30···second cavity 31...lock 40...first resin molding die 41...first resin molding first die 42... 1 resin molding first fiber 44... injection gate 45··· suction hole 46" separation surface 47... gate 48... first cavity 50... second resin molding die 51... second resin molding first die 52 ...the second resin molding second mold 53...the second mold cavity 54...the pin 58...the fixing recess 59...the injection gate 121a...the power supply through hole 24