200905374 九、發明說明： 【發明所屬之技術領域】 本發明{有關⑥-種製造罩幕基底m及光罩之 造方法。 【先前技術】 於用以平板顯示器（Flat Panel Display，FpD)元件的 罩幕基底（FPD用的罩幕基底）中，在遮光膜、半透光膜等 上形成抗蝕膜。此抗蝕膜是在蝕刻前述薄膜時作為蝕刻罩 幕使用。但是，於FPD用的罩幕基底巾，由於需要形成抗 蝕膜的則述薄膜表面的面積大，例如是與LS丨用的罩幕基 -荨相比谷易產生抗姓膜的塗佈不均或面内的膜厚均勻 性的惡化。 而且，於FPD用的光罩等中，於近年來，由於所形成 的圖案的高精度化，期望能夠形成橫越大型基板全面且厚 度均勻的抗飯膜的技術。 鑑於上述情況，在FPD用的罩幕基底以及光罩的製造 領域，例如被檢討使用通稱為rCAp塗佈器（CAp⑶討打）」 的塗佈裝置。於此種「CAP塗佈器」中，在儲存有液體狀 抗蝕劑的液槽中，沈浸有具有毛細管狀間隙的塗佈管嘴。 另一方面，以被塗佈面朝向下方的姿勢而藉由吸著板來保 持基板，其次，使塗佈管嘴從抗蝕劑中上升，並使此塗佈 管嘴的上端部接近基板的被塗佈面。依此，液槽中所儲存 的液體狀的抗蝕劑藉由塗佈管嘴的毛細管現象上升，此抗 2130-9569-PF;Ahddub 5 200905374 餘塗佈劑經由塗佈管嘴的上端部而與基板的被塗佈面接 觸。於此種的抗蝕劑與被塗佈面的接觸狀態中，液槽以及 塗佈管嘴降至一定的「塗佈高度」的位置（塗佈間隙G的位 置）。於此狀態’使塗佈管嘴以及被塗佈面以橫越被塗佈面 的方式相對移動，藉此橫越被塗佈面的全面而形成抗蝕劑 的塗佈膜。 但疋’即使是在如同上述使用CAP塗佈器的情況下， 為了因應更尚精度圖案的要求，必須進一步的追求膜厚的 均勻性。因此，在塗佈後的乾燥時防止面内的乾燥不均發 生’亦成為提昇膜厚均勻性的重要要素。 此處，本案申請人為了防止清潔室内的垂直層流的氣 流所引起的乾燥不均而導致的抗蝕膜的膜厚不均，開發出 了在基板的被塗佈面保持向下的狀態’以一定的速度移動 基板並乾燥的抗蝕劑塗佈方法（專利文獻丨：特開 4 31 1884 5虎么報），或是從被塗佈面的下方向抗钱膜供200905374 IX. Description of the Invention: [Technical Field to Be Invented by the Invention] The present invention {is related to a method for manufacturing a mask base m and a photomask. [Prior Art] In a mask substrate (a mask substrate for FPD) for a flat panel display (FpD) device, a resist film is formed on a light shielding film, a semi-transmissive film, or the like. This resist film is used as an etching mask when etching the aforementioned film. However, in the mask base towel for FPD, the surface area of the film is large because it is necessary to form a resist film. For example, compared with the mask base of LS, the coating of the film is resistant to the film. The uniformity of the film thickness in the uniform or in-plane. Further, in a mask for FPD or the like, in recent years, due to the high precision of the formed pattern, it has been desired to form a technique against a large-sized substrate having a uniform thickness and a uniform anti-rice film. In view of the above, in the field of manufacturing a mask base for FPD and a mask, for example, a coating device called a rCAp applicator (CAp (3)) has been reviewed. In such a "CAP applicator", a coating nozzle having a capillary gap is immersed in a liquid tank in which a liquid resist is stored. On the other hand, the substrate is held by the absorbing plate in a posture in which the coated surface faces downward, and then the coating nozzle is lifted from the resist, and the upper end portion of the coating nozzle is brought close to the substrate. The coated surface. Accordingly, the liquid-like resist stored in the liquid tank rises by capillary action of the coating nozzle, and the anti- 2130-9569-PF; Ahddub 5 200905374 excess coating agent passes through the upper end portion of the coating nozzle It is in contact with the coated surface of the substrate. In the state in which the resist is in contact with the surface to be coated, the liquid bath and the coating nozzle are lowered to a certain "coating height" position (position of the coating gap G). In this state, the coating nozzle and the coated surface are relatively moved so as to traverse the coated surface, thereby forming a coating film of the resist across the entire surface to be coated. However, even in the case where the CAP applicator is used as described above, in order to meet the requirements of a more precise pattern, it is necessary to further pursue the uniformity of the film thickness. Therefore, prevention of uneven drying in the surface during drying after application is also an important factor for improving the uniformity of the film thickness. Here, the applicant of the present invention developed a state in which the coated surface of the substrate is kept downward in order to prevent uneven thickness of the resist film caused by uneven drying caused by the vertical laminar flow in the cleaning chamber. A resist coating method for moving a substrate at a certain speed and drying (Patent Document No. 4 31 1884 5 Tiger Report), or an anti-money film from the lower side of the coated surface
給清潔氣體，以抑㈣直層《人被塗佈㈣抗触劑塗佈 方法（專利文獻2 :特許第3658355號公報），並在先前提 出申請。 的 【發明内容】 然而，如同上述的方法， 塗佈裝置時1明發生了乾燥 在使用於如下說明的具體 不均。 為裝置前面（載入器 的吸著或脫離的型 詳細而言，圖7所示的塗佈裝置 (loader))側於吸荽4 次考板3進行對基板 2130-9569-PF;Ahddub 6 200905374 式的裝置，具有如下所述的吸著以及脫離機構。亦即是， 吸著以及脫離機構在裝置前面側（圖中c的位置）以吸著板 3吸著基板1 〇，向圖中右方向移動吸著板3與基板1 〇 ,並 藉由塗佈管嘴22於基板1 〇的被塗佈面上進行抗蝕劑的塗 佈，以形成抗蝕劑的塗佈膜21 a(詳細如後述）。塗佈結束 後，於圖中右方向的略微移動吸著板3與基板丨〇的位置（稱 為塗佈結束位置），使吸著板3與基板1〇的移動停止。其 •人’向圖中左方向移動吸著板3與基板1〇，在裝置前面侧 (圖中C的位置）進行基板1G自吸著板3的脫離。以下基板 1 〇的圖中右端部稱為塗佈開始側，圖中左端部稱為塗佈結 圖7所示的塗佑奘罟本 伸衮置塗佈結术的基板1 0暫時停止在 圖中A的位置（塗佈！士击和^ ¥、 置）。其後，基板1 〇向载入器側 移動，於圖中Β的位置下方 益側 r万所叹置的清潔供氣單元31進行 抗钮膜表面的教烽，廿 幻乾森並向載入器側移動。 此乾燥法的問題點在於涂 丁—且π 、塗佈方向與乾燥方向為逆向， 不谷易传到均勻的乾燥時每 ^ ^ a H . ’ B。貫際上是由塗佈結束側先接 又來自圖中B的位置下方的供 *德i β备从 Ζ、礼早兀（air unit)31的風， 敢後才疋塗佈開始側。 因此，塗佈後c移叙& — 佈返回速度）過高的話，在、°及著板3的移送速度（塗 8所示的縱方向的雲紋不均二的乾燥不充分，產生如圖 速度低的話，雖然縱方向的：：不均）。相反的塗佈返回 域（塗佈開始側）在到達圖中二不均減輕，但塗佈開始區 的也1置之前就自然乾燥，因 2130-9569-PF;Ahddub 200905374 此如圖9所示的不 ., ^ w 土隹踅佈開始區域 的中心。雖然改變塗佈返回速度、 蚁虱早元的數目、高产、 風量而進行了多數的測試，無法將 又 +a , 肝故方向的雲紋不均盥不 規則的雲紋不均同時抑制為可以容許的浐声 、 —尚且’圖"的位置亦在其下方設：:氣單元32以進 仃軋燥。但是，此處的乾燥是將基 $ β社t· 罝於載入态，用以促 進連接下一個步驟程度的抗蝕膜的 ?|丨、专「亡·^ ± :、由於其為後述的 ^ +/i4f 卞因而解明了對於上述 云紋不均並不會造成影響。 本發明鑑於上述課題，其目的氣 制m 〃目的為提供-料幕基底的 衣w方法，具有能夠不產生前述 心：、·、又不均的將已塗 蝕劑乾燥的步驟。 1怖的抗 本發明具有以下的構成。 (構成1) \ -種罩幕基底的製造方法，製造附抗蝕膜罩幕基底， 具有下述抗蝕劑塗佈步驟：從具有 " 供給口的塗佈管嘴吐出抗㈣丄：二—液 方向使前述塗佈管嘴以及基板 °相父的 敬的破塗佈面相對移動，以於 刖述塗佈面塗佈前述抗蝕劑， 其特徵在於： 已塗佈的抗银劑的乾、择且古τ、+_此 劑的塗佈膜表面的平::二:…從相對於抗· (構成2) 向供―m並進行乾燥。 如構成！所述的罩幕基底的製造方法，其特徵在於： 8 2130-9569-PF；Ahddub 200905374 已塗佈的抗姓劑的乾燥具有下述步驟： 於抗钱劑的塗佈膜表面相對向的設置整流板， 、在刚述抗餘劑的塗佈膜表面與前述整流板之間供給产 潔氣體’並進行乾燥。 (構成3) 如構成1或2所述的罩幕基底的製造方法，其特徵在 於：對前述抗蝕劑的塗佈膜表面，從塗佈開始 一 f 束側供給清潔氣體。 佈、， ' (構成4) 、如構成1〜3的其中任一項所述的罩幕基底的製造方 法’其特徵在於：下述抗钱劑塗佈步驟··使液槽中所儲存 的液體狀抗蝕劑藉由塗佈管嘴的毛細管現象上升，並使美 板的被塗佈面朝向下方以接近前述塗佈管嘴的上端部，二 述藉由塗佈管嘴上升的抗蝕劑經由前述塗佈管嘴的上" 而與前述被塗佈面接觸，在抗钮劑與基板的被塗佈面接觸 (j $狀態下，使液槽以及塗佈f嘴下降至—定的塗佈高度的 位置，於此狀態使前述塗佈管嘴以及前述被塗佈面相^ 動，以於前述塗佈面塗佈前述抗蝕劑。 夕 (構成5 ) -種光罩的製造方法，其特徵在於：使用構成卜‘的 其中任一項所述的罩幕基底的製造方法所得到的罩幕基底 以製造光罩。 _ 如依本發明，能夠提供-種罩幕基底的製造方法，其 具有能夠不產生前述雲紋不均的將已塗佈的抗蝕劑乾燥的 2130-9569-PF;Ahddub 9 200905374 步驟。 以下更詳細的說明本發明。 本發明的罩幕基底的製造方法，其為附抗蝕膜罩幕基 底的製造方法，具有下述抗蚀劑塗佈步驟：從具有於一方 向延伸的抗蝕液供給口的塗佈管嘴吐出抗蝕液，並向與前 述—方向相交的方向使前述塗佈管嘴以及基板的被塗佈面 相對移動，以於前述塗佈面塗佈前述抗蝕劑， 其特徵在於： 已塗佈的抗蝕劑的乾燥具有下述步驟：從相對於抗蝕 劑的塗佈膜表面的平行方向供給清潔氣體、並進行乾：(構 依上述構成1的發明的話’已塗佈的抗蝕劑的乾把 是從相對於抗峨塗佈膜表面(亦即由已： 所形成的塗佈膜表面，也就是抗兹膜的表面，以下相: :平行方向供給清潔㈣，並進行乾燥，藉 心 ㈣驟，與相料抗㈣的塗佈膜表㈣垂直方向供; :乳體的情況相比，乾燥氣流的流向 ； 乾燥不均。 』I万止了 尚且，上述構成i 使清潔氣體與前述塗佈 塗佈膜表面所揮發並滞 可從塗佈膜表面被強制 的發明沿著抗蝕劑的塗佈膜表面， 膜表面平行的流動，藉此抗蝕劑的 留在塗佈膜表面附近的溶劑蒸汽， 的帶離開。 於本發明中， 持續進行乾燥直至 藉由供給清潔氣體的強制乾燥，較佳是 可以防止因為強制乾燥不足而導致在強 2l30-9569-PF；Ahddub 200905374 制乾燥之後產生自然乾燥所引起的乾燥不均產生的狀態 (以下稱為充分乾燥狀態）為止。 。；本♦明中’如同後述的’藉由供給清潔氣體的強制 乾無，較佳是持續進行乾燥直至可以防止在強制乾燥前所 自然乾燥所引起的乾燥不均產生，並達到充分乾燥 狀/¾為止。 於本發明中，並中P + Μ > t ，、甲已塗佈的抗蝕劑的乾燥具有下述步 ==:佈膜“相對向的設置整流板，在前述 進行乾燥（構成2)i與^整“之間供給清潔氣體’並 此處，如果在抗钱劑的塗佈膜表面未 -板’從相對於抗钱劑的塗佈膜表： 潔氣體，會從前述塗佈臈表面向 ：方向供給的清 如依上述構成2,由於在""的方向發散。 的設置H 由於在^虫劑的塗佈膜表面相對向 置“板，因此從相對於抗餘齊“ 方向供給的清潔氣體 、表面的平行 面的方向發散。因此能夠表面向遠離表 風。 對抗1 虫劑的塗佈膜表面均勻的送 而且’如依上述禮忐9 ^ 塗佈膜表面的垂直方为 '發明’與從相對於抗蝕劑的 此到達充分乾燥給清潔氣體相比乾燥效率高。因 其他的乾燥方法的乾1了以“。相對於此， 需要的時間長，在藉由，矣—’因此到達充分乾燥狀態所 為止的期間，會發生^風的強制乾燥到達充分乾燥狀態 因自嶋所引起的乾燥不均。而且， 213〇~9569'PF；Ahddub 200905374 ^達充刀乾絲精f要的時間長的話 疋不利的。如果優先考慮生產率而縮… 羊的方面 燥時間的話，由於強制 /且错由送風的強制乾 乾燥，從而產生乾燥不::不足而在強制乾燥後發生自然 於本發明中，抗蝕劑 隔，由充分發揮上述作用μ 與整流板表面的間 ^ 用的觀點來看較佳為1〜^。而且， 更佳的疋於此間隔藉由適當 且 清潔氣體。 喷嘴而均勻的送入 於本發明中，前述塗佈膜表面與整流板之間供 的清潔氣體的流速，由充分發 '通過 佳為〇.2〜lffi/sec。 揮上述作用的觀點來考慮較 清潔氣體的流速(氣體強度)過高的話，如圖5所示， 會發生肋骨狀的乾燥不均。 y' 清潔氣體的流速（氣體強度）過低的話，如圖6所示， ㈣結束區域(塗佈結束側)在到達充分乾燥前會自：乾 魅，並發生因自然乾燥所引發的不規則狀的雲紋不均（喬狀乙 不均）。 於本發明中，前述整流板較佳相對於抗蝕劑的塗佈臈 表面（亦即基板表面或吸著板表面）平行配設。亦即是，抗 敍劑的塗佈膜表面與整流板表面的間隔，較佳是在抗钱劑 的塗佈膜表面的任意部位都為一定的間隔。 於本發明中，前述整流板的面積較佳為大於抗蝕劑的 塗佈膜表面的面積，更佳為與基板的面積相等或是大於基 板的面積（亦即是覆蓋吸著板的尺寸）。 2130-9569-pF;Ahddub 12 200905374 於本發明中，发 , 佈開始側向塗佈h中對前述抗蝕劑的塗佈膜表面，從塗 依上述構：、=側供給清潔氣體(構成3)。 結東側供給清潔氣二發明的f，藉由從塗佈開始側向塗饰 側)進行乾燥，塗佈門::：夠從塗佈開始區域(塗佈開始 的強制乾燥前因自：:=會發生在藉由供給清潔氣體 清潔氣體供給側的：二繼不均。這是因為接近 下風侧）更侧風側）會比其他區域（亦即 於本發明Φ 始側的邊緣…從抗钱劑的塗佈膜表面的塗佈開 勻的 7^劑的塗㈣表面的塗佈結束側的邊緣均 J的供給清潔氣體。 置)停止本月中’塗佈結束後在其附近的位置(塗佈結束位 施上if的㈣’於此基板的移動停止的狀g，能夠實 把上迖本發明的乾燥步驟(方法υ。 余、；本毛明中，旎夠使基板以一定速度移動並進 夠^佈=施本發明的乾燥步驟（方法2)。例如是，能 土 g始則或塗佈剛開始後供給清潔氣體並進行上述 毛明的乾燥步驟。而且，能夠從塗佈開始而塗佈-定面 又開始供給清潔氣體並實施本發明的乾燥步驟。而 t*夠攸塗佈岡,j結束之後開始供給清潔氣體並實施本發 明的乾燥步驟。 尚且，塗佈開始側與塗佈結束側相比，由被塗佈後開 始所經歷的時間長’有可能發生在藉由供給清潔氣體的強 制乾燥前因自然乾燥所引起乾燥不均，但依照上述方法1 2130-9569*-pF. Ahddub 13 200905374 2因為此夠縮知藉由供給清潔氣體的強制乾燥開 始為止的時間，因此能夠防止此種的疑慮。 本發明能夠適用於通稱為狹縫塗佈器的塗佈裝置，其 中：縫塗佈器為從具有於一方向延伸的抗蝕液供給口的塗 佈β吐出抗敍液，並向與前述一方向相交的方向使前述 塗佈官嘴以及基板的被塗佈面相對移動，以於前述被塗佈 面塗佈前述抗钱劑。於狹縫塗佈器中，塗佈管嘴與基板的 2置關係並沒有特別限制，包含有相對於床面保持水平的 “反的上方設置塗佈管嘴的型態，或是塗佈管嘴與基板的 兩方相對於床面保持垂直的型態等。 本發明能夠適用於使用通稱為「CAp塗佈器」的塗佈 裝置的情形（構成4)。 本發明的光罩的製造方法，使用上述本發 底的製造方法所得到的罜農 土、 ]的罩幕基底以製造光罩（構成5)。 成罩月的罩幕基底中’包含成膜於基板上的用於形 成罩幕圖案的薄模以及成膜於此薄膜上方的抗银臈。 於本發明中’罩幕基底亦包括光罩基底'相轉移基底、 反射型罩幕基底、植入用轉印平板基底。而且’於^ 蝕膜罩幕基底。於相轉移罩幕基底包含具有半 5月膜、遮光膜的，降jjy p ' 士 、 。尚且，於此情形，用於形成罩慕同 案的薄膜所指的Θ主 幕圖 β 周膜、遮光膜。而且，於反射型罩1 :底的情形’包含有在多層反射膜上或在 = 上的緩衝層上，犯+ > 日汉射膜 料的 V成有作為轉印圖案的鈕系材料或鉻李材 科的吸收體膜的構成。而在植入用轉印平板基底的情^材 2l30-9569-PF；Ahddub 14 200905374 形成t ^為轉印平板的基材上形成鉻系材料等的轉印圖案 =薄膜的構成。於罩幕含有光罩、相轉移罩幕、反射 植人用轉印平板。罩幕亦含標線板（reticle)。 於本發明中，作為用以形成罩幕圖案的薄膜，例如是 遮斷曝光光的遮光膜，調整、控制曝光光的透過量的半透 先膜’調整、控制曝光光等的反射率的反射率控制膜（包含 抗反射膜），對曝光光改變相位的相轉移膜，具有遮光機能 以及相轉移機能的半調膜。 於本發明的罩幕基底中，作為用以形成前述罩幕圖案 的薄膜’可列舉金屬膜。作為金屬膜可列舉鉻、组、鉬、 σ鎢或疋含此些元素的合金，又或是含上述元素 或上述合金的材料所構成的膜。 而且於本發明的罩幕基底中，作為用以形成前述罩 幕圖案的4膜’可列舉含有⑦的含秒膜。作為含秒膜可列 舉石夕膜或含石夕與鉻、组、翻、鈦、铪、鶴的金屬的金屬石夕 化膜’進—步的亦可為切膜或金屬破化膜中含氧、氮、The cleaning gas is given to the (4) straight-layer "human coated (four) anti-touching agent coating method (Patent Document 2: Patent No. 3685355), and the application is previously filed. SUMMARY OF THE INVENTION However, as in the above method, the coating apparatus is dried at the time of use, and is used for the specific unevenness as explained below. For the front of the device (the type of the suction or detachment of the loader, the loading device shown in Fig. 7) is applied to the substrate 2130-9569-PF by sucking 4 times of the test plate 3; Ahddub 6 A device of the type 200905374 has a sorption and disengagement mechanism as described below. That is, the absorbing and detaching mechanism sucks the substrate 1 吸 on the front side of the apparatus (the position of c in the drawing) by the absorbing plate 3, and moves the absorbing plate 3 and the substrate 1 向 in the right direction in the drawing, and by coating The cloth nozzle 22 is coated with a resist on the coated surface of the substrate 1 to form a coating film 21a of a resist (details will be described later). After the application is completed, the position of the absorbing plate 3 and the substrate ( (referred to as the coating end position) is slightly moved in the right direction in the drawing, and the movement of the absorbing plate 3 and the substrate 1 停止 is stopped. The person's movement of the absorbing plate 3 and the substrate 1 向 in the left direction of the drawing causes the detachment of the substrate 1G from the absorbing plate 3 on the front side of the apparatus (the position at C in the drawing). In the figure of the following substrate 1 〇, the right end portion is referred to as a coating start side, and the left end portion in the figure is referred to as a coating layer. The substrate 10 of the coating method shown in FIG. 7 is temporarily stopped. The position of the middle A (coating! Shi hit and ^ ¥, set). Thereafter, the substrate 1 is moved toward the loader side, and the clean air supply unit 31, which is located at the lower side of the position in the figure, is pressed against the surface of the button film, and is loaded and loaded. Move on the side of the device. The problem with this drying method is that the coating is - and π, the coating direction and the drying direction are reversed, and the grain is easily transferred to a uniform drying time per ^ ^ a . In the meantime, the wind is applied from the end of the coating side and from the position below the position of B in the figure, and the wind is supplied from the air unit 31. Therefore, if the c-removal and/or the cloth return speed is too high after the application, the transfer speed of the film and the sheet 3 is insufficient (the drying of the moiré in the longitudinal direction indicated by the coating 8 is insufficient). If the graph speed is low, although the vertical direction is: uneven. The opposite coating return field (coating start side) was reduced in the unevenness of the arrival map, but the coating start zone was naturally dried before being placed, because 2130-9569-PF; Ahddub 200905374, as shown in FIG. No., ^w The bandit began the center of the area. Although most of the tests have been carried out to change the coating return speed, the number of ants, the high yield, and the air volume, it is impossible to suppress the irregularity of the moiré and the uneven moiré in the direction of the liver. The allowed hum, the position of the 'picture' is also set below it: the gas unit 32 is rolled and dried. However, the drying here is based on the loading state of the base, and is used to promote the connection of the next step to the extent of the resist film?|丨, special "death ^^ ±: because it is described later ^ + / i4f 卞 卞 卞 卞 卞 卞 卞 卞 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The step of drying the etchant is not uniform. The composition of the invention is as follows: (Construction 1) Manufacture of a mask base, manufacturing a resist mask base There is a resist coating step of discharging the anti-(four) 丄 from the coating nozzle having the "supply port": the second-liquid direction is opposite to the coating surface of the coating nozzle and the substrate Moving to apply the foregoing resist to the coating surface, characterized in that: the coated anti-silver agent is dry, and the surface of the coated film of the agent is flat:: two: ...drying from -m to the anti- (construction 2). The composition of the mask base as described above , characterized by: 8 2130-9569-PF; Ahddub 200905374 The drying of the coated anti-surname agent has the following steps: setting the rectifying plate opposite to the surface of the coating film of the anti-money agent, The method of manufacturing the mask base according to the first or second aspect is characterized in that the surface of the coating film of the agent is supplied with the cleaning gas. The surface of the coating film is supplied with a cleaning gas from the side of the coating to the f-beam side. The method for producing a mask base according to any one of the above-mentioned items 1 to 3 is characterized in that: The following anti-money agent coating step: The liquid-like resist stored in the liquid bath is raised by the capillary phenomenon of the coating nozzle, and the coated surface of the sheet is directed downward to approach the coating tube The upper end portion of the nozzle, the resist which is raised by the coating nozzle, is in contact with the coated surface via the upper surface of the coating nozzle, and the resist agent is in contact with the coated surface of the substrate ( In the j $ state, the liquid tank and the coating f nozzle are lowered to a position of a predetermined coating height. In this state, the coating nozzle and the coated surface are moved to apply the resist to the coated surface. (Configuration 5) - A method of manufacturing a reticle, characterized in that the composition is used A mask substrate obtained by the method for manufacturing a mask base according to any one of the preceding claims, wherein a mask is produced. According to the present invention, a method for manufacturing a mask base can be provided, which is capable of not producing the aforementioned Moiré uneven 2130-9569-PF which has been coated with a resist; Ahddub 9 200905374. The present invention will be described in more detail below. The method for producing a mask substrate of the present invention is a resist film The method for producing a mask base has a resist coating step of discharging a resist liquid from a coating nozzle having a resist supply port extending in one direction, and causing the aforementioned direction in a direction intersecting the aforementioned direction The coating nozzle and the coated surface of the substrate are relatively moved to apply the resist to the coating surface, wherein the drying of the applied resist has the following steps: from relative to the resist Parallel side of the coating film surface of the agent The cleaning gas is supplied and dried: (Construction of the invention according to the above configuration 1) The dried handle of the applied resist is from the surface of the anti-crack coating film (that is, formed by the coating) The surface of the membrane, that is, the surface of the membrane, the following phases: : supply in parallel (4), and dry, by the heart (four), with the phase of the coating (4) coated film (four) vertical direction;: the situation of the milk Compared to the flow direction of the dry gas stream; uneven drying. In the above, the above configuration i causes the cleaning gas to volatilize and the surface of the coating film to be volatilized. The invention which is forced from the surface of the coating film is along the surface of the coating film of the resist, and the surface of the film is parallel. The flow, whereby the strip of solvent vapor remaining in the vicinity of the surface of the coating film is removed. In the present invention, the drying is continued until the forced drying by supplying the cleaning gas, and it is preferable to prevent the drying caused by the natural drying after the drying of the strong 2l30-9569-PF; Ahddub 200905374 drying due to insufficient forced drying. The state that is generated (hereinafter referred to as the sufficiently dry state). . In the present invention, as described later, by forced drying of the cleaning gas, it is preferred to continue drying until the drying unevenness caused by natural drying before forced drying can be prevented, and sufficient drying is achieved. 3⁄4 so far. In the present invention, P + Μ > t , the drying of the applied coating resist has the following steps ==: the film is "provided to face the rectifying plate, and is dried as described above (constitution 2) i and ^ supply "cleaning gas between" and here, if the surface of the coating film of the anti-money agent is not - plate 'from the surface of the coating film relative to the anti-money agent: clean gas, will be coated from the foregoing The surface direction: the supply of the direction is as follows 2, due to the divergence in the direction of "". Since the setting of the coating film on the surface of the insecticide is relatively opposite to the "plate", it is diverged from the direction of the parallel surface of the cleaning gas and the surface supplied with respect to the anti-resonant direction. Therefore, it is possible to face away from the wind. The surface of the coating film against the insecticide is uniformly sent and 'as in the above-mentioned manner, the vertical direction of the surface of the coating film is 'invention' and is dry compared to the cleaning gas from the arrival of the resist with sufficient drying. efficient. In the other drying method, the drying process has been completed. In contrast, the time required for the drying method is long, and the forced drying of the wind reaches a sufficiently dry state due to the fact that the crucible is in a sufficiently dry state. The drying unevenness caused by self-depreciation. Moreover, 213〇~9569'PF; Ahddub 200905374 ^It is unfavorable to take a long time to fill the knife. If the priority is given to productivity, the sheep's aspect is dry time. Because the forced/and wrong is forced dry drying by the air supply, the drying does not occur: the shortage occurs after the forced drying naturally occurs in the present invention, and the resist is separated by the effect of the above-mentioned effect μ and the surface of the rectifying plate. From the viewpoint of use, it is preferably 1 to 2. Further, it is more preferable that the space is uniformly fed into the present invention by a nozzle, and the surface of the coating film is supplied between the surface of the coating film and the rectifying plate. The flow rate of the cleaning gas is sufficient to pass the 〇.2~lffi/sec. If the flow rate (gas intensity) of the cleaner gas is too high, as shown in Fig. 5, ribs will occur. y' When the flow rate (gas intensity) of the cleaning gas is too low, as shown in Fig. 6, (4) The end region (coating end side) will be self-drying and dry due to natural drying before reaching the full drying. The irregular moiré is uneven (Joy B uneven). In the present invention, the rectifying plate is preferably opposite to the coated crucible surface (ie, the substrate surface or the absorbing plate surface) of the resist. That is, the distance between the surface of the coating film of the anti-synthesis agent and the surface of the rectifying plate is preferably a certain interval at any portion of the surface of the coating film of the anti-money agent. In the present invention, the foregoing The area of the rectifying plate is preferably larger than the area of the surface of the coating film of the resist, more preferably equal to or larger than the area of the substrate (that is, the size of the absorbing plate). 2130-9569-pF Ahddub 12 200905374 In the present invention, the surface of the coating film on the resist is applied to the side of the coating, and the cleaning gas (constitution 3) is supplied from the side of the coating and the side of the coating. Clean air two invention f, by the side from the coating side to the finishing side ) Drying, coating door::: From the coating start area (before the forced drying from the start of coating, since::= will occur on the supply side of the cleaning gas by supplying the cleaning gas: the second step is uneven. This is Because the leeward side is closer to the leeward side), it is closer to the other areas (that is, at the edge of the Φ start side of the present invention... the coating of the surface of the coating film from the anti-money agent is spread on the surface of the coating (4). The cleaning gas is supplied to the edge of the coating end side. ()) The position in the vicinity of the coating after the end of the coating is stopped (the fourth end of the coating is applied to the fourth (the fourth) is stopped). The drying step of the present invention can be carried out (method υ.; in the present invention, the substrate is moved at a constant speed and fed into the fabric = the drying step of the invention (method 2). For example, it is possible to supply a cleaning gas immediately after the start of the coating or after the coating, and to carry out the drying step of the above-mentioned hair. Further, it is possible to start the supply of the cleaning gas from the start of coating and the application of the surface to the stationary surface, and to carry out the drying step of the present invention. And t* is enough to coat the coating, and after the end of j, the supply of the cleaning gas is started and the drying step of the present invention is carried out. Further, the coating start side is longer than the coating end side, and the time elapsed from the start of coating is likely to occur due to drying unevenness caused by natural drying before forced drying by supplying the cleaning gas, but according to The above method 1 2130-9569*-pF. Ahddub 13 200905374 2 Since this is enough to shorten the time until the forced drying of the cleaning gas is supplied, such a concern can be prevented. The present invention can be applied to a coating apparatus generally called a slit coater, wherein the slit coater discharges the anti-slurry from the coating β having a resist supply port extending in one direction, and The direction in which the directions intersect causes the coating nozzle and the coated surface of the substrate to relatively move to apply the anti-money agent to the coated surface. In the slit coater, the relationship between the coating nozzle and the substrate is not particularly limited, and includes a pattern of a coating nozzle that is horizontally disposed opposite to the bed surface, or a coating tube. Both the nozzle and the substrate are perpendicular to the bed surface, and the like. The present invention can be applied to a case where a coating device called a "CAp applicator" is used (Configuration 4). In the method for producing a photomask according to the present invention, a mask base made of the above-described method of the present invention is used to produce a photomask (configuration 5). The masked substrate in the hood covers a thin mold formed on the substrate for forming a mask pattern and an anti-silver which is formed over the film. In the present invention, the mask substrate also includes a reticle base phase transfer substrate, a reflective mask substrate, and a transfer transfer substrate for implantation. Moreover, the film is covered by a mask. The phase transfer mask substrate comprises a film having a half-moon film and a light-shielding film, which is reduced by jjy p's. Further, in this case, it is used to form a film of the main surface of the ruthenium film, which is referred to as a film of the same type, and a light-shielding film. Moreover, in the case of the reflective cover 1 : the bottom 'contains on the multilayer reflective film or on the buffer layer on the =, the V of the Japanese photographic film is formed into a button material as a transfer pattern or The composition of the absorber film of the chrome Lee family. On the substrate for transfer printing, a transfer pattern of a chromium-based material or the like is formed on the substrate on which the transfer plate is formed, and the composition of the film is formed. The mask has a reticle, a phase transfer mask, and a reflective transfer plate for reflection. The mask also contains a reticle. In the present invention, as a film for forming a mask pattern, for example, a light-shielding film that blocks exposure light, a semi-transparent film that adjusts and controls the amount of transmission of exposure light, and a reflection of reflectance of exposure light or the like are controlled. A rate control film (including an antireflection film), a phase transfer film that changes the phase of the exposure light, and a half adjustment film having a light blocking function and a phase transfer function. In the mask base of the present invention, a metal film as a film for forming the above-mentioned mask pattern can be cited. Examples of the metal film include chromium, a group, molybdenum, stellungium or an alloy containing such an element, or a film composed of the above-mentioned element or the above-mentioned alloy. Further, in the mask base of the present invention, as the film 4 for forming the above-mentioned mask pattern, a second film containing 7 is exemplified. Examples of the second-containing film include a stone film or a metal-plated film containing a metal of stellite and chromium, a group, a turn, a titanium, a ruthenium, or a crane, which may be a film or a metal-degraded film. Oxygen, nitrogen,
碳的至少一種的膜。 於本發明中，作為FPD用的罩幕基底以及光罩，可列 舉用於製造LCD(液晶顯示面板）、電漿顯示器、有機EL(電 激發光）顯示器等的FPD元件的罩幕基底以及光罩。 於LCD用罩幕中，含有製造lcd時所必要的罩幕，例 如疋包含用於形成TFT(薄膜電晶體），特別是TFT通道部 或接觸窗開π部、低溫石夕m、彩色濾光膜、反射板（黑矩 陣）等的基板。於其他的顯示裝置製造用罩幕中，含有製造 2130-9569-PF;Ahddub 15 200905374 有機EL(電激發光）顯示器、電_示器等的基板。 【實施方式】 以下參照圖式並說明本發明的實施型能。 冷圖1所示為用以說明本發明的實施型態的通稱為「CAP 塗佈器」w塗佈裝置以及本發 私备步驟的一型能的姆 式的側面圖。圖2為圖1的主要部位的平面圖。模 圖1以及圖2所示的塗佈裝置’為在裝置前面（載入写） =、吸者板3:行基板10的吸著與脫離的型式的震置，具 有如下所述吸著以及脫離機構。 ' 構在裝置前面侧(圖"的位置二:;板：…脫離機 向圖中右方向移動吸著…C者基板1〇’ 扳1 〇，並错由塗佈管嘴 =板㈣被塗佈面上進行抗_的塗佈，以 的塗佈膜仏（詳細如後述）。塗佈結束後，於圖中右方向 :略被移動二及者板3與基板i。的位置(稱為塗佈結束位 ’使吸者板3與基板1Q的移動停止。其次，向圖 =移動吸著板3與基板1G，在裝置前面側（圖中C的位 置）進行基板1〇自吸著板3的脫離。以下基板㈣圖中右 端部稱為塗佈開始側，圖中左端部稱為塗佈結束側。 #圖1以及圖2所示的塗佈裝置，在與抗银劑的塗佈膜 表面(亦即抗蝕劑的塗佈膜21a的表面)相對向的設置整流 板50。整流板50相對於抗钮劑的塗佈膜表面以—定間隔L 水平設置。而且’整流板5。如圖2所示，為覆蓋基板1〇 以及吸者板3的尺寸。整流板5〇設置為鄰接（接近）塗佈管 2l30-9569-PF/Ahddub 16 200905374 嘴u。 於圖1所示的塗佈裝、、 側供給清潔氣體的方式、，以從塗佈開始側向塗佈結束 面側，設置作為清潔 2置前面側之相反側的裝置背 供氣單元^彳^供給機構的供氣單元60。 蝕劑的塗佈膜21a的：目對於抗蝕劑的塗佈膜表面(亦即抗 佈膜21a的表面平行面）的平行方向供給清潔氣體（與塗 表面與整流板之間，的方式設置，於抗姓劑的塗佈膜 清潔氣體流動。& 4劑的塗佈膜表面且平行的使 供氣單元60如圖2斛- η μ ^ μ, 不，沿著抗蝕劑的塗佈膜表面的 塗佈開始側的邊緣設置 n# ± ® 6^, ^ ，依此能夠由抗蝕劑的塗佈 膜表卸的塗佈開始側的 給清潔氣體。 、、n术側的邊緣均勾的供 6。例如是具有發生氣流的風扇以及配備在 此風扇刖方的空裔禍、.念 I-通過空氣過滤器提供清潔氣 此處作為空氣過濾器較佳例如I# * 過遽器〇ughEmcientPa t•疋使用"效率微粒空氣a film of at least one of carbon. In the present invention, as a mask base and a photomask for FPD, a mask base and light for manufacturing an FPD element such as an LCD (Liquid Crystal Display Panel), a plasma display, an organic EL (Electrically Excited Light) display, and the like can be cited. cover. In the mask for LCD, it is necessary to cover the mask used in the manufacture of lcd, for example, yttrium for forming TFT (thin film transistor), especially TFT channel portion or contact window opening π, low temperature stone m, color filter A substrate such as a film or a reflector (black matrix). Other masks for manufacturing display devices include substrates for manufacturing 2130-9569-PF; Ahddub 15 200905374 organic EL (electroluminescence) displays, electrophoresis devices, and the like. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a side view showing a type of energy which is referred to as a "CAP applicator" w coating apparatus and a private preparation step of the embodiment of the present invention. Fig. 2 is a plan view showing the main part of Fig. 1. The coating device shown in FIG. 1 and FIG. 2 is a type of suction and detachment of the front substrate (loading write) =, the suction plate 3: the row substrate 10, and has the following suction and Get out of the organization. 'Constructed on the front side of the device (Fig. 2) Position 2: Plate: ... moves away from the machine to the right in the direction of the suction... C substrate 1 〇 ' Pull 1 〇, and wrong by the coating nozzle = plate (four) The coated film is coated with an anti-coating layer (details will be described later). After the application is completed, in the right direction in the drawing, the position of the second plate 3 and the substrate i is slightly moved. The coating end position 'stops the movement of the sucker plate 3 and the substrate 1Q. Next, the drawing is performed to move the suction plate 3 and the substrate 1G, and the substrate 1 is self-priming on the front side of the apparatus (the position of C in the drawing). The detachment of the plate 3. The right end portion of the following substrate (four) is referred to as the coating start side, and the left end portion is referred to as the coating end side. The coating device shown in Figs. 1 and 2 is coated with an anti-silver agent. The surface of the film (that is, the surface of the coating film 21a of the resist) is disposed oppositely to the rectifying plate 50. The rectifying plate 50 is horizontally disposed at a predetermined interval L with respect to the surface of the coating film of the anti-buckling agent. 5. As shown in Fig. 2, the size of the substrate 1〇 and the absorber plate 3 is covered. The rectifying plate 5 is disposed adjacent to (close to) the coating tube 2l30-9569-PF/Ahddub 16 2 00905374 mouth u. The method of supplying the cleaning gas to the coating and the side shown in Fig. 1 is provided with a device for supplying the opposite side of the cleaning side from the coating start side to the coating end surface side. The air supply unit 60 of the supply unit of the gas supply unit. The coating film 21a of the etching agent supplies the cleaning gas to the parallel direction of the surface of the coating film of the resist (that is, the surface parallel surface of the anti-cloth film 21a). (Setting between the coating surface and the rectifying plate, the coating film cleaning gas flows against the surname agent. & 4 coating film surface and parallel to the gas supply unit 60 as shown in Fig. 2斛-η μ ^ μ, No, n# ± ® 6^, ^ is provided along the edge on the coating start side of the surface of the coating film of the resist, whereby the coating start side which can be discharged from the coating film of the resist can be removed. For the cleaning gas, the edge of the n side is hooked for 6. For example, there is a fan with airflow and a emptiness in the fan. I think I-clean the air through the air filter. As an air filter, for example, I# * filter 〇 ughEmcientPa t • 疋 use " efficiency particles Gas
HlClentPartlculateAirFiiter，HEpA)。 圖3所示為以塗佈管嘴22對基板1〇的被塗佈面塗佈 ^虫劑的狀態的斷面圖。圖4所示為用以詳細的說明塗佈 管嘴22等的動作的斷面圖。 「CAP塗佈器」裝置’首先’進行基板1。的抗蝕劑的 塗佈開始部位與塗料元2的塗料嘴22的上端部的位置 對準（未圖示）。基板10的抗蝕劑的塗佈開始部位，為此基 板1 〇的一側緣部。 2130-9569-PF;Ahddub 17 200905374 同且，此1 CAP塗佈器」 、 ^ 1欠化叼，具有水 吸著板3的水平驅動機構’使液槽、塗佈管嘴個別 上下移動的上下驅動機構（未圖 « ^ ;控制水千驅動機構以 及控制上下驅動機構以調整液槽以及塗佈管嘴高度位置的 控制部（未圖示）。 21至^1狀態中’控制部如圖4所示，使儲存有抗钱劑 -二面位置為止的液槽2〇與完全沈浸於此抗㈣ 21中的塗佈官嘴22 一起 塗佈面10a。 （上升從下方側接近基板1〇的被 而且’塗佈管嘴22藉由 20内。& ^ ^。 杯28支撐而收納於液槽 向二Λ 以及液槽2G具有與基板心橫方 . 〇〇 〇方向）的—邊長度相當的長度。 ^ 者其長邊方向具有缝隙狀的毛細管狀間隙 23。此塗佈管嘴22 “大間隙 有上端部的寬度變窄…'嘴狀 ，而具 的上端部，於塗佈管嘴：:：:形狀。毛細管狀間隙23 的略全長而開口為縫隙’二部中橫越此塗佈管嘴22 管嘴的下方側開口卜“ 仏”間隙23亦向塗佈 々W開口（凊參照圖3、4)。 其次’控制部使液槽2〇 塗佈管嘴22的上端側從9 ，，如圖3所示的使 方侧突出。此時，由於塗Γ1 抗敍劑21的液面向上 21 、佈S嘴22是從完全沈浸在抗蝕劑 f的狀態（睛參照圖4) w 出，因此毛W社 的液面的上方側突 U此毛細官狀間隙23 照圖3)。黑曰士 ^充滿抗蝕劑21的狀態（請參 Π 撐扣28為以可上下移動的狀態貫通設 2130 —9569~阶廊触 18 200905374 置於液槽20的底部的穴2〇b。然後， 從穴20b與支撐桿28之間的微;、了避免抗蝕劑21 22與液槽20的穴的周圍之間’以^兔漏，在塗佈管嘴 ^ ίή -V' ^ ^ ^ G覆支擇桿2 8 —部 伤的方式§又置伸縮自如的蛇腹2 9。 而且，控制部使塗佈管嘴22比液样 細管狀的開π 2Ga更上升，使塗佈管嘴胃、上端部中毛 劑2!與基板10的被編此 、上端部的抗钱 牧啊、啃參照圖3)。 於此接觸時，較佳使塗佈管嘴22 山 t n _ $别立而部與被塗佈面 1心以相對小的狀態開始接觸，其次，使塗佈管嘴 22的刖i而部與被塗佈面〗〇 社……土 為相對大的狀態而 、，.σ束接觸較佳。具體而言，較佳例如β Λ 早隹例如疋瞬間保持接觸間隔 小的狀態並開始接觸，亦即是 觸間隔而結束接觸。 不（泡的接觸速度擴張接 其次，控制部在塗佈管嘴22的上端部令的抗蝕劑2i 與基板10的被塗佈面10a接觸的狀態，將液槽2。 !嘴2211降至-定的「塗佈高度」的位置，設定實施塗佈 才的土佈官嘴22的前端部與被塗佈面1 〇a的間隔(塗佈門 隔G)(請參照圖3)。 饰間 、此處的塗佈間隔G ’是指比暫時接觸的抗蝕劑21脫離 被塗佈面10a的脫離間“更小的範圍内，使其盡量的 大。亦即是，塗佈間隔G至少為脫離間隔G，的50%以上， 希望為脫離間隔G，的70%至95%以上。 於上述狀態’控制部使基板1 0於與塗佈管嘴22的上 ^ °卩中的毛細管狀間隙23形成的狹鏠直交的方向（圖3中 2130-9569-pp;Ahddub 19 200905374 箭頭V所示的方 万向）移動，塗佈管嘴22 佈面1 〇a的全面而P ^ 鳊邛橫越被塗 曲而私動，以橫越被塗佈面丨 ， 抗银劑21的塗佈膜21 a。 、王面形成 尚且’基板10與塗佈管嘴22的相對… 預先設定的管嘴間隔、浐 迷度，疋以 ^抗蝕劑的黏度、液面高度以β泠佑 間隔G為前提，佶泠德时q度以及塗佈 使塗佈M 21a形成所希望的 藉由控制部進行控制。 予的方式而 以下基於實施例而更詳細的說明本發明。 (實施例1) 使用具有上述發明的實 的塗佈裝置，依昭實施… 圖1〜圖4的構成 • …、貫施型態所述方法，在罩幕基底的薄膜 上塗佈抗敍劑並使之數、麼 , "" 4 1便之乾燥，形成附抗蝕膜罩幕基底。 此時，塗佈的條件熹 - 7成1 # m的抗Ί虫膜而設定 液面高度、塗佈間隔、移動速度等。 而且，乾燥的條件是以在如圖i、圖2所示的塗佈結 <置（圖中A的位置）使基板的移動停止，於此基板的移 動停止狀態、，藉由供氣單元6〇，以與抗钱劑的塗佈膜表面 平行的使清潔氣體流動。此日车彡上為々丨以± 勒此時抗蝕劑的表面與整流板的表 面的間隔為1〜2cm。而η ，舒、+，么& 且則逑塗佈膜表面與整流板之間 所供給通過的清潔廣體的、.古；击达n r 月為乱體的抓速為〇. 5n]/sec。清潔氣體的供 給時間（乾燥時間）為10分鐘。 “尚且’作為罩幕基底’可使用在大型玻璃基板(合成石 4(QZ)10_厚、尺寸85〇關xl2〇〇mm)上，具有用於形成罩 幕圖案的薄膜的基板。 20 2130-9569-PF;Ahddufo 200905374 查已塗：：：的附杬蝕膜罩幕基底，在經由-定時間後檢 一 ” 乾燥的抗蝕膜，並不I fMUr ffi 8 Μ _ 向的雲紋不均不…見如圖8所不的縱方 Q课狀不均），亦不會發現如 則狀的雲紋不均(霧狀不均)。 的不規 而且使用_L述所得的附抗㈣罩幕 進—步將此光罩用於制从pn 衣作尤罩， 、，有看到、P 在光罩以及FPD兩方面都 常。 為是因抗钮膜的上述乾燥不均所51起的異 (比較例1) 使用如圖7所示的塗佈裝置以形成附抗鞋美 底。而且塗佈條件與實施例1相同。 " 、塗怖後山向A~>B~>C移動的吸著板的移送速度（塗佈返 回速度）過咼的話，於位置 示的縱方向的4不^ 不充分，產生如圖8所 u幻π紋不均（靄狀不均）。 相反的’塗佈返回速度過 雲紋不均，但是塗佈開始區域在到達位置方:的 然乾燥，因此如圖9所示的不規則m級自 將會以塗佈開始區域為中心發生。 J; 雖然對㈣返料度藉由㈣供㈡元31古 度、風量而進行種種的測試，無法達成將时 ^ (參考例丨） 卩料^料的程度。 气於圖」所示的塗佈裝置中，於在圖中^位置下 -置的❹供料凡31相同，在圖中α的位置下方(未圖 2130-9569-PF;Ahddub 21 200905374HlClentPartlculateAirFiiter, HEpA). Fig. 3 is a cross-sectional view showing a state in which a coating agent 22 is applied to a coated surface of a substrate 1A by a coating nozzle 22. Fig. 4 is a cross-sectional view for explaining the operation of the coating nozzle 22 and the like in detail. The "CAP applicator" device 'first' performs the substrate 1. The coating start portion of the resist is aligned with the position of the upper end portion of the coating nozzle 22 of the coating material 2 (not shown). The coating start portion of the substrate 10 is the one edge portion of the substrate 1 为此. 2130-9569-PF; Ahddub 17 200905374 In addition, this 1 CAP applicator", ^1 undercut, has a horizontal drive mechanism for the water suction plate 3, so that the liquid tank and the coating nozzle are individually moved up and down. Drive mechanism (not shown « ^ ; control water thousand drive mechanism and control unit that controls the upper and lower drive mechanism to adjust the liquid tank and the height of the coating nozzle (not shown). In the state of 21 to ^1, the control unit is shown in Figure 4. As shown, the liquid tank 2〇 in which the anti-money agent-two-face position is stored is coated with the coating head 22a completely immersed in the anti-(4) 21 (the rise is close to the substrate 1 from the lower side). The length of the side of the coating nozzle 22 is equivalent to the length of the side of the substrate, which is supported by the cup 20 and supported by the cup 28, and the liquid groove 2G has a lateral direction of the substrate. The length of the hole has a slit-like capillary-like gap 23. The coating nozzle 22 "larger gap has a narrower width at the upper end portion...' mouth shape, and the upper end portion is coated with a nozzle :::: shape. The full length of the capillary gap 23 and the opening is the gap 'crossing the two The lower opening of the nozzle 22 of the cloth nozzle 22 is also opened to the coating port (see Figs. 3 and 4). Next, the control unit causes the upper end side of the nozzle 22 to be coated. 9 , the side is protruded as shown in Fig. 3. At this time, since the liquid of the coating agent 21 is facing upward 21 and the cloth S nozzle 22 is completely immersed in the state of the resist f (see Fig. 4) ) w, so the upper side of the liquid surface of the hair W is a capillary-like gap 23 as shown in Fig. 3). The black gentleman is filled with the state of the resist 21 (please refer to the buckle 28 for moving up and down) The state is set to 2130 - 9569 - step 18; 200905374 is placed at the bottom of the tank 20 2b. Then, between the hole 20b and the support rod 28; to avoid the resist 21 22 and liquid Between the circumferences of the cavities of the trough 20, the rabbits are leaked, and the coating nozzles are ή V V V V 2 2 2 2 2 2 2 2 2 § § § § § § § § § § § § § § § § § § § § § § The control unit causes the coating nozzle 22 to rise more than the thin tubular opening π 2Ga of the liquid sample, so that the coating nozzle stomach, the upper end portion of the hair agent 2! and the substrate 10 are knitted and the upper end portion is resistant to money.啃 Refer to Figure 3 When the contact is made, it is preferable that the coating nozzle 22 is in contact with the core of the coated surface 1 in a relatively small state, and secondly, the coating nozzle 22 is 刖i. The portion and the coated surface are in a relatively large state, and the σ beam contact is preferable. Specifically, for example, β Λ is early, for example, the yttrium is kept in a state in which the contact interval is small and starts to contact. In other words, the contact between the contact portion and the coated surface 10a of the substrate 10 at the upper end portion of the coating nozzle 22 is controlled by the control portion. Will tank 2 . The mouth 2211 is lowered to a predetermined "coating height" position, and the interval between the front end portion of the soil cloth nozzle 22 to be coated and the surface to be coated 1 〇a is set (coating door gap G) (please refer to image 3). The inter-decoration, the application interval G' here means that the resist 21 that is temporarily in contact with the detachment of the coated surface 10a is "in a smaller range, so as to be as large as possible. That is, the coating interval. G is at least 50% or more of the separation gap G, and is desirably 70% to 95% or more of the separation gap G. In the above state, the control unit causes the substrate 10 to be in the upper portion of the coating nozzle 22 The narrow gap direction formed by the capillary gap 23 (2130-9569-pp in Fig. 3; the square direction indicated by the arrow V of Ahddub 19 200905374) moves, coating the nozzle 22 on the surface of the 1a full and P ^ The 鳊邛 traverse is smeared and smothered, and the coating film 21 a of the anti-silver agent 21 is traversed across the coated surface. The formation of the king surface and the relative relationship between the substrate 10 and the coating nozzle 22 are preset. The nozzle spacing, the enthalpy, the viscosity of the resist, and the liquid level are based on the β-interval G, and the Q degree of the coating and the coating to form the coating M 21a are desired. The control unit performs the control. The present invention will be described in more detail below based on the embodiments. (Embodiment 1) Using the above-described invention Coating device, according to the implementation of the Figure 1 ~ Figure 4 ... ..., the method according to the state, the coating on the film on the base of the mask to apply anti-study agent, and how, "" 4 1 is dried to form a resist mask base. At this time, the coating conditions are 熹- 7 into 1 m m anti-mite film to set the liquid level, coating interval, moving speed, etc. Moreover, drying The condition is such that the movement of the substrate is stopped in the coating junction as shown in FIGS. i and 2 (the position of A in the figure), and the movement of the substrate is stopped, and the gas supply unit 6 is closed. The cleaning gas flows in parallel with the surface of the coating film of the anti-money agent. On this day, the ruth is 々丨 ± 勒 此时 此时 此时 此时 此时 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀舒,+,么& and 清洁 清洁 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑 逑The gas supply time (drying time) is 10 minutes. "Also as 'mask base' can be used on large glass substrates (synthetic stone 4 (QZ) 10_ thick, 85〇 inch off the xl2〇〇mm), a substrate for forming a thin film having the mask pattern. 20 2130-9569-PF;Ahddufo 200905374 Check the coated base of the etched film::: After the lapse of time, check the "dry film", not the cloud of I fMUr ffi 8 Μ _ The unevenness of the grain is not... see the vertical Q-shaped inhomogeneity as shown in Fig. 8), and the unevenness of the moiré (the haze is uneven) is not found. Attached to the (four) mask into the step - step to use this mask to make a hood from the pn clothing, and, see, P in the reticle and FPD are both often. Because of the above-mentioned uneven drying of the anti-button film The difference of 51 (Comparative Example 1) was carried out using a coating device as shown in Fig. 7 to form an anti-shoe sole. The coating conditions were the same as in Example 1. ", Tu Houshan to A~>B When the transfer speed of the absorbing plate (the coating return speed) is too large, the 4 in the longitudinal direction of the position is not sufficient, and the unevenness of the π pattern is generated as shown in Fig. 8. The opposite 'coating return speed is uneven over the moiré, but the coating start area is at the position of the position: it is dry, so the irregular m-class as shown in Fig. 9 will start with coating. The domain occurs as the center. J; Although the (4) return rate is tested by (4) for the (2) yuan 31 ancient degree and the air volume, the degree of the time ^ (refer to the example) is not achieved. In the coating device shown, the ❹ supply in the position of the figure is the same as 31, which is below the position of α in the figure (not shown in Figure 2130-9569-PF; Ahddub 21 200905374)
塗佈結束的基板停止於圖中A 的 示）設置清潔供氣單元，在 位置（塗佈結束位置）的 _ , 心 ，由下方設置的清潔供氣單 7L向已塗佈抗蝕劑的 ' 焊…士 $ t 佈膜表面供給清潔氣體以進行乾 各其結果，發生 尚且’本發明並不僅限制 a 获明I匕ΛΛ 〃 限制於則迷貫施例，在不脫離本 要曰的靶圍當然可以進行各種的變更。 【圖式簡單說明】 型感的模式的側面 圖1所示為用以說明本發明的 圖 圖2所示為圖1的主要部位的平面圖。 圖3所示為本發明的— „ .. ,, AA I心的塗佈裝置其塗佈機構進 灯塗佈的狀態的斷面圖。 機構的主要部位的 圖4所示為圖3的塗佈裝置的塗佈 構成的斷面圖。 的乾燥不均的一型態 圖5所示為用以說明依乾燥條件 的模式圖。 的乾燥不均的其他型 圖6所示為用以說明依乾燥條件 態的模式圖。 圖7為用以說明從前的乾择牛跡认 面圖 乾备步驟的一型態的模式的側 圖8為用以說明依從前的乾择牛跡仏& 早己你步驟的乾燥不均的一型 態的模式圖。 驟的乾燥不均的一型 圖9為用以說明依從前的乾躁步 2130-9569-PF;Ahddub 200905374 態的模式圖。 【主要元件符號說明】 3~吸著板； 2 0〜液槽； 21〜抗蝕劑； 22〜塗佈管嘴； 28〜支撐桿； 31 ~清潔供氣單元； 5 0 ~整流板； G ~塗佈間隔。 2〜塗佈單元； 10 ~基板； 20b〜穴； 2&~塗佈膜； 23~毛細管狀間隙； 29〜蛇腹； 32~清潔供氣單元； 60〜供氣單元； 2130-9569-PF;Ahddub 23The coated substrate is stopped at the display of the drawing A in the figure), and the clean air supply unit is set, at the position (coating end position), the heart, and the clean air supply sheet 7L disposed below is applied to the resist. Soldering ... 士 $ t cloth film surface to supply clean gas to dry the results, the occurrence of the present invention and not only limit a clear I 匕ΛΛ 限制 limit to the simplistic application, without leaving the target Of course, various changes can be made. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view for explaining the present invention. Fig. 2 is a plan view showing a main part of Fig. 1. Fig. 3 is a cross-sectional view showing a state in which the coating mechanism of the present invention is applied to the lamp coating apparatus of the present invention. The main part of the mechanism is shown in Fig. 4 as shown in Fig. 3. A cross-sectional view of the coating configuration of the cloth device. A pattern of drying unevenness is shown in Fig. 5 to illustrate a pattern according to drying conditions. Other types of drying unevenness are shown in Fig. 6. Fig. 7 is a schematic view showing a mode of a type of dry preparation step of the former dry selection track diagram. Fig. 8 is a view for explaining the dry selection of the track before the obedience & A pattern diagram of the type of dry unevenness of your step. Figure 9 is a pattern of dry unevenness 2130-9569-PF; Ahddub 200905374. Component symbol description] 3~ suction plate; 2 0~ liquid tank; 21~ resist; 22~ coating nozzle; 28~ support rod; 31 ~ clean air supply unit; 5 0 ~ rectifying plate; G ~ coating Cloth interval 2 ~ coating unit; 10 ~ substrate; 20b ~ hole; 2 & ~ coating film; 23 ~ capillary gap; 29 ~ snake belly; 32 ~ clean gas supply Unit; 60~ gas supply unit; 2130-9569-PF; Ahddub 23