TW200905225A - Method and device for aligning a test system with an electric element to be tested - Google Patents

Abstract

The invention is directed a method for locating an electrically conductive element (5c) on the surface of a circuit (5), comprising the steps of: placing the circuit in a device for testing or measuring electrically conductive elements, comprising at least one source (1a) of a light beam (2), and a control unit (CNTL) to apply the light beam on several impact points on the circuit surface, to apply a light beam (2) on several impact points on the surface of the circuit (5), in order to generate a flux of particles on the circuit surface, the detectable intensity of which flux depends on the nature of the material at the impact point of the light beam, comparing the variations in intensity of the particle flux generated at each impact point, and deriving the position of the conductive element on the circuit surface. Application of the invention to accurate location of a circuit in a test device using the photoelectric effect.

Description

200905225 IX. Description of the invention: [Technical field to which the invention pertains] η ΐ $ = for testing or measuring the characteristics of electrical components, in particular conductors or groups of ν electrical and electronic components. The present invention relates to, for example, testing conductors present on a connection support, such as printing, roads, and those integrated circuits that exist on a flat screen, such as liquid crystal or liquid crystal LCD (OLED). Polar-Emitting Diode) LCOS (LiqUid Crystal on Silicon). [Previous Technique #f] Prior to marketing, electronic components, such as integrated circuits, flat screens, and printed circuits, were tested and formed part of their overall manufacturing process. Some of the tests performed provide a means to establish continuity, insulation, impedance, characteristic impedance (zo), capacitance or conductor self-inductance or passive or active components mounted on the circuit. The conductors tested are generally conductive traces distributed over one or a plurality of layers of electrical insulation. Conductive formed on different insulating layers

The traces may be connected by metallized holes through the insulating layer, which are referred to as "vias" or "microvias." By reducing the size of the electronic components 'printing The density of circuit traces can be significantly increased. The testing of these circuits is therefore very important. In particular, it must be checked that there are no wires on the conductive traces, and there is no short circuit between the conductive traces. The number of conductive traces can reach several thousand. And it can be distributed over tens of layers. For circuits with the highest degree of integration, these measurements are made between points that are separated by a distance of tens of micrometers (//m). Conventional contact testers, which operate on needle beds, have proven to reach their limits both technically and economically. 200905225 In fact, needle beds are no longer in most complex circuits. The distances of the test points are accommodated in the area. The cost represented by the needle bed increases exponentially with the degree of miniaturization, and its reliability is also reduced. “Some printed circuit manufacturing lines include automatic optical inspection (AOI, “ Au Tomatic Optical Inspection"), which allows an operator to see visible shorts or breaks in the conductive traces on a 'detection' screen. But 'this solution does not allow viewing of the traces formed on the inner layer of the circuit, as well as checking the integration of the vias, nor does it measure, such as impedance measurements (resistance, inductance or capacitance measurements) ). In order to avoid these problems, it has been developed that the conductor of the conductor to be tested is composed of a strong electric field and a conductor of tin-lead-lead, and the light source used may be a short τ dry: = the electron beam may also allow 4 ==3⁄4Additional] is based on the energy of the main (incident) electron. The cow is like π plus, and some of its testing tools combine the use of the beam with the network of the electronic receiving thunder. By relatively injecting the electrons, the electric electrode can allow the current to be injected into the effect to be tested. Injecting electrons into the charge. The photoelectric case w_6 is fine 94 jade = butterfly road, if the patent application worker is using one or more beams, the tester is required to copy P" for the (four) test circuit to accurately "1. The beam must be accurately applied to the time On the contrary, it is also allowed to obtain meaningful measurement results.,, #, 兀牛, by 200905225% of the material. Like ~::: meaning 2 digits can be identified by the stamp provided, for example, so that the circuit to be tested is The circuit support to be tested must be difficult to maintain during vacuum pumping. It is: ===^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ Mechanical benchmark. When the “Department: ΐ position is very inaccurate. In other test tools ί = is a camera for transmitting images of the circuit to be tested, the laser provides a wavelength of ultraviolet light. The optical system generally optimizes the wavelength of the laser, so that it is captured. The wavelength in the visible spectrum. Non-achromatic systems are much more expensive. (4) Color difference 7^ to the system 'The ratio Μ ϋ ί 膨 The substrate can be observed in the expansion/contraction J, which can be, like (depending on the axial direction). In order to consider these phenomena, a large number of circuit points must be considered when positioning the laser beam.田付p τ ” #测试的路路 provides a method and a fixed-form; can be easily used without increasing the complexity of the test tool. [Invention] The present invention is observed in the presence of a collecting electric field == number When applying - beam to - electrical, it is close to zero, and when it is correctly concentrated at one center, it reaches the maximum value. Therefore, using one beam can be used not only for two tests, such as insulation and electrical continuous testing, but also In contrast to the test 200905225 ==: Trial circuit 'and, where necessary, more accurate with respect to the measurement, the present invention provides a method of setting a surface. According to an example, the method package i is U:fl The circuit is provided in a test or measuring device for a conductive element, comprising at least one beam source, and a control unit for a plurality of impact points of the light beam on the surface of the circuit, σ ^ a plurality of impact points on the surface of the circuit, thereby The circuit = is generated, the intensity of the flow is based on the intensity of the particles flowing out at each impact point at the point of impact of the beam, and the position of the conductive elements on the surface of the circuit is taken. It - example, the light-generating light flux i accordance with an example, which generates a beam of the electron flux circuit table position of the conductive element obtained from the Department of fluorescence intensity changes of the flux generated on the circuit surface of the beans.

Leaving the conductive elements on the surface of the circuit, the position of the I = component on the circuit is derived from the change in the amount of electrons in the generated electron flux. According to an example, the position of the conductive element is determined based on a collision position, wherein the number of generated electron fluxes reaches the two maximum values. According to an example, the position of the conductive element is determined based on the position of the adjacent impact point' which exhibits the greatest change between the number of electron fluxes produced. According to an example, the method comprises the steps of: placing an electron collecting electrode close to a surface of the circuit; measuring several on the surface of the circuit, each measurement at one point including application focusing on the circuit The beam at the point, the electrode collects electrons in the electron flux emitted by the g path, and measures the characteristics of a 200905225 signal emitted by the electrode; and according to the nature of the signal measured during each measurement The position of the conductive elements on the surface of the circuit is determined. According to an example, the method includes the step of reinitializing the conductive element between sequences of at least one transmission of the beam. According to an example, the conductive element potential reinitialization step is established between the conductive element and the voltage source - the electron injection in the case where the electrical contact does not contact the conductive element. @ According to a spine example, the conductive element to be placed is made of metal. According to an example, the impact point matrix configuration on the surface of the circuit is spread.龈 According to an example, the impact point on the surface of the circuit is rooted = configuration is spread at a fixed pitch, where the position of the conductive element is 匕 3 several measurement series, each using a matrix group 鲅, = continued series The matrix configuration between measurements has the same J-reduced low-thickness target, and the xenon beam is -s 酊 〇 〇 ' ' ' ' ' ' ' ' ' ' ' ' 该 该 该 该 该 该 该 该 ' ' ' ' ' ' ' ' w 二 范例 / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / A correspondence table is established between the locations. The circuit configuration is determined by the method in which the method includes a step determined by the step of 7°. [4] The present invention also relates to a method of setting a circuit comprising a method of a., a position of at least two conductive elements on the surface of the circuit 200905225, and for use for two conductive The position of the 7L piece determines the circuit group bear. This is the electric &

According to the example, the decision of the circuit configuration includes determining the rotation angle of the circuit relative to the -A quasi-axis. The soil is semi-glazed to determine the correction factor to determine the position of a circuit conductor. According to the method, the method comprises a step relative to the reference. The invention also relates to a method for testing a circuit, the pot being applied to a first position of a conductive element in the circuit, the electric being released under the effect of the beam, the beam The released n port f亟: collects and measures the signal from the electrode "and;; the electrical disturbance characteristic is obtained by the measurement. According to the example, the square == is set according to the setting - the previously defined circuit method According to the foregoing, it includes a fundamental invention relating to a device for electronic testing or measuring-circuiting, comprising: at least one beam source, and a control sheet: a plurality of impact points on the surface of the circuit, thereby Produce on the surface of the 3H circuit - particle flux, the nature of the basin. According to; for example: the installation = ΐ = the intensity of the particle flux generated at the point of attack = 'and' by the conductive elements on the surface Position to achieve this 200905225 According to an example 'the beam produces a fluorescent light on the surface of the circuit' wherein the test device is arranged to take the intensity change of the generated glory to obtain the position of the conductive element on the surface of the circuit. According to an example, an electron flux entering or exiting a conductive element is generated by the light beam on the surface of the circuit, wherein the measurement is performed by a change in the amount of electrons in the generated electron flux. The position of the conductive element on the surface of the circuit. According to an example, the apparatus is adapted to determine the position of the conductive element based on the position of the impact point, wherein the number of generated electron fluxes reaches a maximum value. According to an example, the apparatus is The position of the conductive element is determined based on the position of the impact point, which exhibits the largest change between the number of electrons in the output. According to the example, the device comprises: at least one electricity: test, piece, For the number of rows on the surface of the circuit;;; death: the electrons collected by the electrode in the == Ο μ μ, and measure the 俨 放射 匕 该 该 该 该 该 该 该The unit is adapted to determine the position of the conductive element on the surface of the circuit according to the characteristics of each measurement period. According to an example, the apparatus is used to reinitialize between at least the sequence of the smoke of the beam. The The potential of the conductive element. In the case of Dogan/Personal, the re-priming of the potential of the conductive element is the case where the conductive element is not connected to the conductive element. According to an example, the conductive element to be provided is made of metal. 12 200905225 According to an example, the device is used to transmit a point of impact on the surface of a beam of light, which is based on a matrix configuration. According to an example, the device is used to transmit a beam of light on the surface of the impact point on the surface, which is based on a matrix configuration with two j-distances, ', between two consecutive series of measurements Have the same or reduced spacing. According to an example, the beam is a laser beam. According to an example, the laser beam is output in a pulsed manner and exhibits a wavelength of less than 240 nm. According to the r example, the sample is used for calibration. The position of the circuit is determined at the position of the electrical component of the circuit and based on the position of the two.冤 件 件 ’ ’ 难 难 仙 于 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Guardian Λ Λ — - Example 'The device is used to determine the two corners of the circuit relative to a reference axis based on the position of the two conductive elements = decision. According to an example, the device is used to determine the The position of the circuit conductor is relative to the reference axis. The invention also relates to the use of the test member. The test element is used to test or measure the conductive element to the root === a device conductive element on the surface of the circuit. The apparatus includes: at least one beam of light 13 200905225 source 'and a control unit' to apply the beam to a plurality of impact points on the surface of the circuit. [Embodiment] Figs. 1a, 1b, and 2 show a test apparatus in which the setting method according to the present invention can be carried out. The test apparatus shown in FIG. 1a has a "chip carrier" or "1C package substrate, (IC package Substrate) type of circuit to be tested 5 in this example. This is the interconnection of the Mars gap type. Supporting, which results in an interconnection pitch of an electronic component of the semiconductor wafer type having a relatively high connection density, which is adjusted to a printed circuit pitch of one of the lmm grades. The circuit 5 comprises an insulating substrate 5a disposed on the substrate 5a a conductive trace on the upper surface, a conductive trace disposed on a lower surface of the substrate 5a, and a trace 5b (a trace including a "via") passing through the substrate. Each trace is included in the substrate At least one contact pad 5c on the upper surface, and/or at least one contact pad 5d on the lower surface of the substrate. The contact pad 5c is, for example, of the C4 type ("Controlled Collapsed Chip Connection") or has A metal coating (gold, nickel/gold, platinum, tin with or without lead, etc.). The contact 塾 5d is, for example, a BGA (Ball Grid Array) type. These various contact ridges are arranged in a matrix form on the surface of the substrate 5a. The test device comprises a device 1 which supplies a laser beam 2, For example, an ultraviolet laser beam, an electron collecting plate 3' disposed on the circuit 5, a network of conductive pads 7, and an anisotropic conductive sheet 6, which provides each of the contact pads 5d to the network 7. The connection of the contact pad 7a, and a measuring instrument device 4, which is connected between the collecting plate 3 and the network 7. The device 1 comprises a source la, which supplies a laser beam 2, and a refractive member lb which guides the beam 2 To the area of the circuit under test 5. The board 3 is substantially transparent to the laser beam 2 and comprises a conductor 14 200905225 electrical region 3a connected to the device 4. The device 4 comprises a source voltage such as two 4b to measure an electrical characteristic. , for example, Ampere ^, the device contact port 7a is addressed and connected to the instrument device 4 to allow - a CNTL control device to control the position of the laser on the conductive trace on the circuit, in this case Test example of a conductive component a step, the e° pad 7 and the network of the anisotropic conductive sheets 6 provide a flashing element, and the application of the laser beam 2 to the conductive traces & the conductive charge is taken out by the conductive element by the photoelectric effect, and the The characteristics of the signal of the collecting plate 3 are measured, and the electrical characteristics 'such as the continuity of the conductor, or the electrical insulation of the other conductor, can be obtained from the measurement." The test shown in Figure lb of the circuit The device is different from the network 7 16 by a set of probes 6a (or "nails", ribs (1) instead of nails, such as a contact pad 5d connected to the circuit under test 5, as controlled by a CNTL device - the switch is connected to the instrument The device* surface, the device to be tested is entirely optical, and allows testing without any contact of the disk=circuit 5. The second device 1T applies the laser beam 2T to the upper surface of the circuit 5 for the upper surface. The collecting plate 3Τ, on the other hand, the light beam 2 is drawn to the lower surface of the circuit 5, and the opposite surface of the circuit 5; the main plate 3Β. An instrument device 4Τ is connected to the plate 3Τ, and the instrument is connected to the plate 3Β. , 3 Β by the spacer 8 、, 8 Β ^ ^ ^ 5 surface has - The entire device is controlled by the control device. 1 The laser beams 2, 2T, 2B shown in Figures 1a and 2 can also be used to inject electrons into the circuit under test according to the teaching of WO 2006/082294. The electronic injection is illustrated in the figure. 3' which provides a more flat detail of the conductive trace 5b via the circuit under test 5 and connects - the lower contact 塾% to 15 200905225 The potential applied to one of the solder balls 5f is less than the circuit 5 Contact 塾5c = Beam is taken from the outside * 3. The s of this reflection is reduced by the electric potential injected by the charge dQ, which is caused by the injection of electrons onto it. ^In order to accurately apply the laser beam 2, 2, 2, 2, or 5b or a rear 塾 5d = accurate positioning relative to the axial movement of the laser 2.寻贝J Circuit 5 L Page Effect Placement Example 'The connection 塾 is based on the fact that the photoelectricity 2, = touches one of the electrical insulation areas of the circuit under test. On the other hand, if the beam is correctly positioned in the center of a conductive pad, the electron age emitted by the photoelectric effect is gR, and the number of pens is the largest. In other words, the emitted electrons are increased by ί:=ί when covered by a laser beam. So ^ can be bundled at several points above the surface of the circuit, and month b establishes an image of the conductive area on the surface of the circuit. The law is shown as an example of implementing this silk method. Here, the square = f; with respect to the two travel axes of the laser beam 2, the user has two standbys, the way 5' has an origin of 0, and forms a reference OXY: = the circuit under test 5 is exposed to The surface of the beam 2 is t Γχ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The axes X and X form the angle Θ, the axis Υ and Υ, the same. The range of the wind/wind is exciting, and the circuit to be tested is placed at a known position, and its error pad, Meijin. The pattern (contact soil/etc.) that is set by the circuit is therefore found in the range of hundreds of claw widths. For 16 200905225, why not confuse the choice of style to be set. The domain is full, or set at the edge of the area. Where the italic density is too high for the conductor, and it is not possible to set the circuit 5 to each other to include two reference conductive pad coordinates in this case. The reference pad is, for example, a contact 塾u or the like: the center of the reference 塾-, the Γ is connected to the center, and is used to form the origin of the coordinates 0, χ, γ of the circuit to be tested, and the reference point 塾12 relative to the point, the center position

U = can be set to the axis χ '' γ' ‘that is, ‘the angle θ is determined. The choice of the reference ί makes them sufficiently far apart from each other to allow the circuit 5 to have the most likely correct position. The center of the reference 塾U, u is for example positioned in a series of measurements on a search area, wherein the contact pad is assumed to be the area known by the topology of the circuit, and is considered in the test The positioning error of the circuit 5 in the s-type device. Each measurement includes the step of applying the laser beam to circuit 5 = a point to measure the characteristics of the signal collected by collector 3. The beam moves between each measurement, so that the point at which the measurement characteristic of the signal reaching a maximum value is located can be located. In this way, the anchor point corresponds to the point to be searched. a The measurement to be performed by positioning a component is, for example, spread according to a matrix configuration covering the search area ^ measurement point, as shown in FIG. The matrix configuration is expressed as a grid pattern of horizontal lines and vertical lines, and its intersection determines the position of the measurement point. In the example shown, the moment configuration contains 81 coordinate measurement points (xi, yj), where i and j are integers varying between 1 and 9. For laser beams between 50 and 150/zm in diameter, the measuring points are separated from each other by 1〇 to 50 #m along the X and Y axes, and the width of a conductive pad is the same as the diameter of the laser beam. 17 200905225 Small grade. After each shot, the laser beam moves along one of the X or gamma axes of the laser beam travel according to a fixed pitch (equal to the distance between two adjacent horizontal or vertical lines). When the measurement is performed according to the matrix configuration of FIG. 5, the measurement values in the allowable domain 32, 33, 33 are close to the desired one, and the highest value is obtained in the vicinity of the center of the contact pad 5c to be searched. . ‘, V』1w π 夕 屌 屌 屌 屌 屌 隹琢 隹琢

The accuracy of the signal, measurement equipment, and the laser energy between each shot =)' - The conductive pads can be positioned based on the average of the emissions that are spatially close to each other. It can also be performed based on the same measurements, to calculate the average of the measurements taken for this configuration; The τ mothers must know that the resolution of the obtained image can be 1 P( d)' of the number of points, and the distribution of the laser spot, and fE represents the diameter d considered. The round hole is sent to the test 1 to set the h". In this area, the ^ image is collected, and the ^ ^ f; * ^ state repeats the previous job. So _, 2 distance matrix group rough spacing, for example for 9 1 matrix group cancer rendering - the positioning of the first point in the circuit (such as point redundancy: !,, ':: = in this) brother a Zhuo father fine matrix 18 200905225 ΐ磓ΓΐFor the distance between 5x5 points 25"m, you can use f = to locate the first point. , position, and positioning the other two 4f soil f lesson dlchotomic algorithmς, 甘量量式,十字心: ί pattern already contains the ♦ by a brother, a series of measurements Then the maximum measurement can be in the measurement of column j 'parallel through the previously identified maximum measurement position. The position of the largest measurement on the second first axis corresponds to the conductor position to be sought. It can also plan the contour of the conductive profile. By calculating the change in measurement between adjacent d 1 points (the spatial variation of the measurement signal is set at those measurement points, where the measurement changes to the maximum.

θ According to an example, calibration of the test device will be performed, particularly for calibration of the current mirror control, which refracts the laser to a precise point on the circuit under test. For this purpose, a calibration test pattern is placed in the test device to replace the circuit under test. Figure 6 shows an example of a calibration test pattern comprising a conductive surface having 16 χ 16 vias having a diameter of 200 "m' In order to locate the test style point ' it uses a reference 位m in the center of the test pattern

Xm, Ym. Therefore, the hole A positioned at the lower left of the test pattern will have a coordinate (-7.5, -7.5). The galvanometer that reflects the 5 Hz laser beam is controlled by an electric grinder, which may vary, for example, from -10 to +10V. The galvanometer will first accept zero voltage. Therefore, the laser beam is applied near the center of the test pattern Om. Then, the centers of the holes A, B, C, and D located at the lower left, lower right, upper left, and upper right of the test pattern can be positioned by changing between ϊ ΐ 1〇/] 1GV applied to the ammeter 19 200905225. The coordinates of the holes a, b, c, and d are recorded. Then, the other holes are coordinates, in the test pattern, the holes 2 = ϊ The coordinates of the 1 Xm volts emitted by the laser around each hole are stored in a calibration table related to the reference 矣炊 < m-coordinate . It is calculated by the voltage applied to the galvanometer by compiling f 2 # +, and 四 and (4) are determined by the angles θ of the known coordinates, A, and Y axes of the reference 0m, Xm, and Ym. In the example shown in Figure 2, the voltmeter coordinates of the ϋ and column laser beams are 0, and the volt coordinates are calculated based on mm and volts + j mm. Then click 〇, the coordinates of the coordinates of the laser beam in the " is the distance between the f: ί :: the variation between f Δχ, △" point and 0, table, #方关f rotation angle θ. Then use the calibration table to compile the surface of a modified path]; the reference 0, χ, γ, establish the voltage of the meter to be measured, the relationship between the Γΐ, and the current to be applied to the current ^ 吏 ° Impact on these points. The electric pad 撷T:, the electrons will increase from the photoelectric effect to the self-conducting position. If the right side is large and the j4 is not connected to a voltage source, the latter if it has a high lightning The charge is drawn from this pad, in other words, the electricity #' relative to the electricity drawn by each shot 20 200905225 = 1 塾 potential will only increase from one transmission to the next transmission, on the other hand, if The laser beam is on the center of the pad, and the amount of charge collected by the mother-slave emission will decrease, causing the signal due to the f-set of the charge to gradually decrease. When the contact is charged, the effectively collected charge will be too low. To take in this case, it needs to lower the problem again and then the electricity of the conductive pad In one or two laser hair Γ

kJ ίίΐ status is set. When the circuit includes a high-density shot on the surface, it is connected to the other surface: pre-contact j, re-initialization of the connection pad between parent-to-send emissions 1 = two low-density 塾 build-electrical contact to reach (Testing device in Figure 1a or Figure lb). Figure 2 can not establish electrical contact with the circuit under test (such as the re-initialization of the potential of the electric raft, the cable, and the I pad) can also be exemplified by the injection of the gas-filled application WO 2006/082 294. Therefore, the 'collecting plate 3 is grounded. If: the conductive area of the collecting plate, causing the;; ^. Retrieving, the field is received by the conductor whose potential needs to be reinitialized, and the re-initialization of the potential of the collecting plate can be The two lasers are fired as shown in the test device 'the first one; the beam only enters the beam to ^ into / · β + a beam is only grounded. When applied to the individual surfaces of the two i circuits and by - through When the trace is touched, this solution is particularly suitable for a conductor having a pass or equal target, preferably at least one limit value 21 200905225 and a circuit having a size greater than the sum of the beam diameters of the fly equal to four shots. The maximum deviation of 5 is selected. The first beam 2τ is used for "electron emission" on the contact 塾 5e of the conductor. In the configuration, it allows the collection of the charge to locate the conductor close to the position at which the laser beam is applied. Second beam 2B In the "injection" configuration of the other contact pad for the conductor, it is simultaneously or slightly delayed relative to the first beam 2T. The beam 2Β has sufficient energy to inject the number of electrons, and the beams are emitted The number of electrons in the electricity = ; = electricity = initialization,

Large ''contrast'. The electric ordering operation, for the purpose of charge collection is the most ml position, so a conductor will be selected in the electric meter, and the circuit 5 has a deviation to hunt to achieve the latter reinitialization. The laser beam emission increases the potential of the contact pad to remain at any offset when the correction factor is applied to the location of the laser beam, typically to the correction of the laser beam to the laser beam. By borrowing more complicated expansion/receiving _, 苴 can be ^ ^ considering the influence of the substrate on the surface of the circuit is more / / ί number is, the position is formulated when the correction formula is about to take into account Beam 22 200905225 Because the laser beam used to position the laser beam simultaneously with the component is used for positioning and 'electric phase: the method also allows the automatic calibration circuit of the test device: when it is clear, but also in a circuit clock Not only a variety of offsets at the beginning (laser light wind ^ the current mirror of the beam controlled at all positions in the beam positioning is combined with the beam relative to the circuit ^: sex, shift), it can be very high Accurate beam strikes up to To the measurement of the accuracy. During the test 4 can be carried out high in the 'its material _ the invention road. Real; Γ two electric way / two conductor position to locate - electric conductive elements to determine; stand: J; to On the surface of the Jfif circuit - one of the single-degrees, for example, the width or length of the circuit. 15 Knowing a conductive trace to achieve a good position - the electrode of the plate m Vi 11 radiating electrons It is not necessary that Ο type = electrode \ ^ sin close to the circuit. It can be considered any other ^ (four) pole 'such as - metal grid. Or charge is limited to measuring the type of current test device radiated by the electrode ^ ^The characteristic of the signal measurement of the electrode is based on the measurement of the contact with the circuit to be tested; == will be. Within the circumference, the conductive element, which may also be emitted in the element of the beam of the invention, is emitted by the thunder The X-ray electrode is injected to inject electrons into the conductor. The potential of the electrode and the electrode can be adjusted so that the laser beam is from the electrode 23 200905225. The two electrons are '= two poles, allowing electrons to be 'full' Short ground to

Basic ί = or strip the insulation. The required wavelength is or is in accordance with the gold; The laser = ring? The peeling threshold of the miscellaneous material on the surface of the shot/circuit. The Thunder 2: ί 2 1 laser source is generated, the frequency is multiplied by a factor of 5 to obtain the wavelength of servant # 213 nanoseconds. An it + but, the invention is not limited to the use of a laser beam. Other light beams that can take electrons from the device can also be used, all within the target perimeter of the present invention. Therefore, an incoherent light source can also be used.

_ Because the method of the present invention searches for the electron flux generated by the J-number J or the region where the change in the number between the two 4-mesh neighbors is the largest, it only requires this amount of relative or indirect measurement. Components other than a collection electrode can be used to make these relative measurements. /, Therefore, for example, the fluorescent light generated by the laser beam is detected by a photodetector at the wavelength of the emitted fluorescent light, and generates a current whose light intensity changes. A variety of materials can be fluoresced to emit light in this manner if exposed to UV photon radiation. Therefore, glass and ceramic materials are generally highly fluorescent. Polymer Overview A small amount of light can be emitted by fluorescence. On the other hand, the metal actually does not emit light due to the fluorescent light. The effect of fluorescence is significantly magnified in the presence of a strong light 24 200905225 flux, such as those used in the aforementioned test apparatus. Therefore, it is also possible to position the conductive element on the surface of a circuit by locating the dark area on the background of the fluorescent light radiated from the resistive surface of the circuit. It must be noted that the fluorescence can be easily distinguished by the incident beam because the latter exhibits a wavelength range of wavelength light. The invention is based on the extraction of particles (electrons or photons) produced by a beam of light onto one of the impact points to be positioned. The positioning method according to the present invention may have other applications, such as reading or - View of the outline of the electrode [Simplified description of the drawing] Formula ================================================================================== A variation of the test device shown in Fig. 13 is a type of test of L2, which is a diagram of the laser beam to the two surfaces of the circuit to be tested, and the Lm injection method has a cross-section method through the connection; _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Circuit to be tested 25 200905225

Figure 6 is a calibration test pattern for one of the test devices. [Main component symbol description] 1 device la source lb refractive member 2 laser beam 3 electron collecting plate 3a conductive region 4 measuring instrument device 4a source voltage 4b measuring device 5 circuit 5a insulating substrate 5b trace 5c contact pad 5d contact pad 5f soldering Ball 6 anisotropic conductive sheet 6a probe 6b switch 7 network 7 conductive pad 7a contact pad 11 conductive pad (contact pad) 26 200905225

12 Conductive 塾 (Contact 塾) 13 Conductive pad (contact pad) 14 Conductive pad (contact pad) IT device IB device 2T Laser beam 2B Laser beam 3T Collector plate 3B Collector plate 4T Instrument device 4B Instrument device 8T Spacer 8B Interval 31 area 32 area 33 area A sub LB sub LC sub LD sub L 27

Claims (1)

200905225 十一 1. 2. 3. 4. 5. Apply for Patent Scope: (4) = Apply the beam to the circuit table (face == yoke plus beam (2) to the surface of the circuit (5) . Occupying, the surface of the circuit is produced with an intensity tapping '玷, in the particle flux of this property, the material point at the county point where the lack of entanglement is generated at each impact point and by these f Material==' If the method of applying the patent range i, "set. =) on the - glory flux 'table, the road surface is taken from the generated output ==... piece (10) bit 1 method Wherein the beam (7) produces an electron or the conductive element (10) on the surface of the circuit, the position of the intermediate electronic component being taken from the generated electron flux basis, wherein the conductive element (5c) The number of positions reaches the method of determining the 'C range of the electron flux generated in item 3'. Among the conductive elements (5c·the second position of the mosquitoes, the Wei is the largest among the number of generated electrons 1) Change. The method of any of the items in items 3 to 5 of the T patent scope includes the following; The collector (3) is disposed adjacent to a surface 28 of the circuit (5) 200905225 测量 Measuring a number of points on the surface of the circuit (xi, the second measurement includes applying the point concentrated at the point J of the circuit - at each point of the collection at a given point The electron flux emitted by the circuit ''the beam(2)' is characterized by the signal of one of the electrodes; and, electrons, and is measured from the conductive elements on the surface of the road measured during each measurement (5C) The position of the ° ^ determines the method between the sequence of at least - the emission of the light beam in the third to sixth items of the patent application, which includes the step of the potential at (5c). The conductive element is the method of claim 7, wherein the new initialization step is included in the conductive element virtual component (5c) potential I, or is not in contact with the conductive element positioned as in the scope of the patent application! (5c) is a metal. The method of the item, which requires 2 patent scopes! To 9 of the II, the impact point (xi, yj) on the surface is based on - matrix power, eight: in electricity. Apply for a patent scope! Configuration to distribute. The method of striking the Tonglu π# term on the surface of the circuit, in which the j cloth, and a fixed distance of conduction, use a moment Chen έ 能 ν. _ . ', 】 series, each of which Having the same or minus the spacing of the ^., the method of continuation of the matrix configuration between the I series, any one of items 1 to 11, wherein the beam ^ 凊 凊 凊 凊 12 12 12 12 12 放射 放射 , , , , , , , The laser beam is a wave with a pulse of less than 240 nm. If the patent application is used for 7 days and the length is used to locate the 兮: Shuang/Shangyu item, the method includes the school Steps for the member (10) on the surface of the circuit ί 8. 9. 10 12 13. 29 14. 200905225 23::? During the quasi-pattern, a correspondence table is established between the count position of the beam ( beam (2) transmitted to the positioning member (11). 15· The method of any of the items 1 to 14 of the scope 2 includes a stage based on the position of the mosquito circuit (5) determined by the position of the “7〇(2). 16. Γίϊί" The method is intended to include a step % of determining the position of the circuit (5) table fj>, one of the conductive elements (11, 12) according to the method described in items 1 to 15 of the Dow range And for determining the configuration of the circuit using the position determined for the two conductive elements. The method of item 7 of the equation 4, wherein the two conductive elements (11, 12) are selected such that they are as far apart as possible from each other. For example, in the method of Item 16 or 17, wherein the circuit (5) =, and the sorrow 3 determines the circuit relative to a reference axis (the angle of rotation (Θ) ° 19, ί, the patent range of items 16 to 18 The method of any of the preceding, wherein: the path state comprises determining a correction factor to determine a position of the circuit conductor relative to a reference axis (OX). ϋ 20. The method of claim 19, comprising a reference axis 21 (ΟΧ) Step of 5 weeks to position the circuit (5). A method of testing a circuit, comprising the following steps: Applying a light beam (2) to a first position on the conductive element (5c) of the circuit to discharge the charge under the effect of applying the light beam, collecting the discharged charge by a collecting electrode (3), measuring the radiation emitted by the electrode The characteristic of a signal and the electrical characteristics of the conductive element (5c) obtained from the measurement are characterized by comprising the step of determining the position of the circuit according to the method of claim 16 to 2. 30 200905225 22. 23, a method of manufacturing a circuit, and the second step of the test - the test step, specifically included in the application of the patent = for employment or measurement in the circuit (5) towel conductive element (10) At least - the source of the beam (2) - the source (10), and the particle flux of the (4) nature of the first scale of the beam, depending on the fact that the particle is turned over at each point of impact The intensity change of I (4) produces 2 upper conductive elements (5〇 position. The circuit surface routing device is obtained by the newization] where the light beam (2) is in electricity 25. As in the patent application, the 23rd conductive element (5c) Electric setting 'where to enter or leave - Raw, wherein the test Ο determines the position of the position of the conductive element on the surface to determine the conductive element ^5^= based on the impact of the 27 "test number; ^ county point position of 25 test device, which is used for collision based (d) The position of the electrical component (5c), at the location of the impact point 2 28, ί, the maximum amount of electrons in the generated electron flux. The test device of the patent range No. 25 to 27, including: at least one electronic collection The electrodes (3), and · quantity, ?ff?, are used to measure at several points on the surface of the circuit (5), and the α-point is measured. The measurement includes the application of the 31 200905225 points concentrated in the circuit. The upper beam (2), the electrode collects the electrons hit from the circuit, and measures the signal from one of the electrodes (丨|, the control unit (CNTL)' which is used for measuring according to each The signal mosquitoes are guided on the surface of the Wei. 29. As in the scope of claims 25 to 28, the weight of the beam is at least - the sequence of emission of the beam: ^ ^ ^ ^ ^ The potential of (5c). .蜍30. The test device of claim 29, wherein the reinitialization of the potential is performed by the conductive element and the two 3 (5c) '; 'ί = or is not in contact with the conductive element (5: G 32. As in the scope of patent application No. 23 to 31 - Item 3 is distributed in the matrix configuration of the emission-beam (7) to the circuit hit point n. "Riqing Point" and according to - 33. = patent application range 23 to,] 32 of any Cj 2 emission - beam (2) to the surface of the circuit / the matrix configuration between the same or Decrease::, 4, as in the patent application range 23 to 33, the beam (7) is a test device of any one of the laser beam shells, 5, as in the test device of claim 34, :: Radiation, and present less than 24 〇 nm;: = beam for calibration used for the use of - (4) measurement, the value of which is established with the capture command signal 罝 - correspondence table. 32 200905225 37 · The test device of any of the items in the 23rd term, wherein the test device of any one of the items 23 to 37 is determined based on the position determined by the conductive element (9), and the parallel circuit (the parallel device) 5) The position of the two conductive elements (ιι, ΐ2) on the surface 'bit i; the position determined by the two conductive elements determines the 39. The test device of the 38th scope of the range' is used to select two guides ▲ ( , 12) 'Make them as far apart as possible from each other. Patent & Scope 23 to 39 - The test device of the item 41 determines the rotation angle (Θ) for a reference axis (οχ) by the position determined by the two conductive elements (11, 12). ΐΐί Patent range Nos. 23 to 40 Test device, 1 42. The correction factor is set, which allows the determination of a circuit conductor relative to the reference axis (ox). The use of the test component (Bu 1T, 1B) in the -I setting Method, = for testing or measuring a conductive element to define a conductive element on the surface of the circuit (5) according to the method of any of the claims, the device comprising: at least one of the light beam (2) Source (la), and unit (c muscle), used to apply the beam to the surface of the circuit to double the impact point.