TW200904262A - Plasma processing apparatus - Google Patents

Abstract

To eliminate abnormal discharge onto an inner surface of an ejection port on a ground electrode of a plasma processing apparatus. A dielectric member (60) is arranged on a discharge surface (42), which is of a ground electrode (40) of a plasma processing apparatus and facing an electric field applying electrode (30). On the dielectric member (60), an ejection guide hole (62) continuous to a discharge space (1p) between the electrodes is formed, and on the ground electrode (40), an ejection port (41) continuous to the ejection guide hole (62) is formed. An inner surface of the ejection guide hole (62) on the dielectric member (60) is protruded from an inner surface of the ejection port (41) on the ground electrode (40).; On the dielectric member (60), a step surface (64) is extended as the same surface from an abutting surface (63) which abuts to the ground electrode (40).

Description

200904262 IX. Description of the Invention: [Technical Field] The present invention relates to a plasma processing apparatus [Prior Art] For example, in the patent literature! There is described a plasma processing apparatus in which the upper and lower sides are arranged in opposite directions. The upper electrode is connected to a power source: an electrode. The lower electrode is electrically grounded to become a ground electrode. An electric field is applied between & to generate an atmospheric_photodischarge, and the gas is vaporized. A slit-shaped spray is formed on the ground electrode on the lower side: a port. The processing gas is discharged downward from the discharge port. The object to be treated is disposed below the ground electrode. The object to be processed is ejected from the discharge port, and the body is rolled to perform surface treatment. A solid dielectric layer formed of a sprayed film of alumina is formed on the upper surface of the ground electrode (the opposite surface to the electric field application electrode). [Patent Document 1] Japanese Patent Laid-Open No. 2004-006211 [Problem to be Solved by the Invention] In the plasma processing apparatus of the above configuration, when the inner surface of the discharge port of the ground electrode made of metal is exposed, the arc may fall on the inner surface. In particular, the end of the electrode application electrode side where the electric field is concentrated on the discharge port causes a discharge having a stronger luminescence intensity, or an arc may fall on the end edge. Such a problem arises in that metal contaminants or particles are generated so as to adhere to the object to be treated. 129982.doc 200904262 [Technical means for solving the problem] In order to solve the above problems, the present invention discharges a processing gas in a discharge space and discharges it, and arranges the object to be disposed on the outside of the discharge space. A device for treating a surface of a plasma, which is characterized in that: an electro-depleted electrode (hot electrode (h〇t eiectr〇de)) connected to a power source; an earth electrode (earth electr〇de), a discharge surface facing the electric field application electrode and a treatment surface facing the workpiece arrangement portion, and electrically grounded; and a dielectric member on the ground side abutting on the discharge surface of the ground electrode and facing the electric field An electrode is formed to form the discharge space and is formed of a solid dielectric body; and a discharge via hole connected to the discharge space is formed on the dielectric member, and an upper electrode a is formed on the ground electrode and the discharge guide is formed The holes are connected and the self-described discharge surface penetrates through the discharge port of the processing surface, and the inner surface of the discharge guide hole of the dielectric member is higher than the grounding An end edge of the inner surface of the discharge port on the side of the discharge surface protrudes further inward in the radial direction of the nozzle, and the electric member has an abutting surface that abuts against the discharge surface of the ground electrode, and the abutting surface from the abutting surface The step surface of the step between the inner surface of the discharge guide hole and the inner surface of the discharge port is extended and formed on the surface. Thereby, it is possible to prevent an abnormal discharge such as an arc from falling on the end edge of the discharge surface side of the inner surface of the discharge port of the ground electrode, thereby preventing metal contaminants and preventing the adhesion of the specific metal contaminant or particles. The size and shape of the nozzle outlet at the location may be fixed in the thickness direction of the ground electrode. The end edge of the discharge side of the inner surface which serves as the discharge port and which can abnormally discharge the arc or the like does not fall on any one of the inner surfaces.

The size and shape of the discharge guide hole may be fixed in the penetration direction of the discharge guide hole (the thickness direction of the dielectric member). Thereby, the discharge guide holes can be easily formed. The size of the end portion of the discharge port on the processing surface side may be smaller than the size of the end portion on the discharge surface side. Thereby, it is possible to prevent the abnormal discharge of the arc or the like from being on the end edge of the discharge surface side of the inner surface of the discharge port of the ground electrode, and to prevent the external ambient gas from entering the discharge port, thereby ensuring the force of the discharge of the process gas. Can improve processing efficiency.

The generation of particles is on the physical object. The through-direction of the discharge port is not only easy to be formed, but also does not fall on the discharge. The size of the discharge port can be smoothly reduced as it approaches the treatment surface. Thereby, it is possible to prevent the electric field from being concentrated on the inner surface of the discharge port, thereby reliably preventing the abnormal discharge from falling. The size and shape of the end portion of the discharge port on the processing surface side may substantially match the size and shape of the discharge guide hole. Thereby, the entry of the external environmental gas can be sufficiently prevented, the force of the processing gas can be sufficiently ensured, and the abnormal discharge can be reliably prevented from falling on the inner surface of the discharge port. Preferably, the plasma processing apparatus according to the present invention further includes a position restricting mechanism that allows the position of the electric component to be 129982.doc 200904262 in a plane parallel to the discharge surface with respect to the ground electrode. error. Thereby, the dielectric member and the ground electrode can be thermally expanded independently of each other, and the dielectric member can be prevented from being damaged due to the difference in expansion between the two. Preferably, the width of the step surface in the state in which the dielectric member is in the normal position is larger than the tolerance of the error. Thereby, even if there is a positioning error of the dielectric member, abnormal discharge can be reliably prevented from falling. Further, the electropolymerization processing apparatus according to the present invention may further include a covering member including an insulator different from the dielectric member, and provided so as to cover an inner surface of the discharge port of the ground electrode. Thereby, it is possible to more reliably prevent the abnormal discharge from falling on the inner surface of the discharge port. It is preferable that the thickness of the covering member is substantially the same as the width of the step surface in the protruding direction. Thereby, the inner surface of the discharge guide hole of the dielectric body and the inner wall of the covering member can be made one surface, and the defects such as the corner portion of the covering member can be reliably prevented, and the generation of fine particles can be prevented. The present invention is applicable to plasma treatment under substantially atmospheric dust (at normal pressure). Here, in the vicinity of the approximate atmospheric pressure (the range is right, considering the ease of pressure adjustment and the simplification of the agricultural structure, it is preferable that i 333χι〇4~ι〇 _1〇4

Pa, better is 9_331xl〇4~10.397x1〇4pa. [Effects of the Invention] According to the present invention, it is possible to prevent an abnormal discharge such as an arc from falling on the edge of the discharge surface side of the inner surface of the ground electrode, thereby preventing the particles from being 129982.doc 200904262 [Embodiment] Embodiments of the present invention will be described based on the drawings. Figures 1 to 3 show the first aspect of the present invention! Implementation form. The atmospheric piezoelectric slurry processing apparatus includes a processing head 1 and a workpiece arrangement unit 2. The workpiece arrangement unit 2 is configured by a stage or a conveyor, and the workpiece w is disposed on the upper side. The object to be processed W is, for example, a glass substrate or a semiconductor substrate. The workpiece arrangement unit 2 can place the object to be processed w in the direction orthogonal to the plane of the drawing.

Move on. It is also possible to fix the position of the object to be processed, and to move the processing head 1 in the direction orthogonal to the plane of the paper of Fig. 1. The processing head 1 is supported on a stand (not shown) and is located at a position away from the upper side of the workpiece arrangement portion 2. The processing head has an upper cover member ι, a frame 20, an electric field applying electrode 30, and a bottom plate 4, and extends in one direction (the left-right direction of Fig. i, the direction perpendicular to the plane of the drawing of Fig. 2). The upper cover member 10 is made of a resin (insulator) having high corrosion resistance and extends in the longitudinal direction of the processing head 1. As shown in Fig. 3, the frame 20 has a pair of long side frame portions 21 and a pair of short side frame portions 22, and is formed in a rectangular shape in plan view with an internal opening. The long side frame portion 21 constitutes the long side of the processing head i. The short side frame portion 22 constitutes the short side of the processing head. A peripheral portion of the upper cover structure (4) is placed on the upper surface of the frame 20. As shown in Fig. 2, the shorter bolt 91 penetrates vertically through the cover member ig (four) to the frame. The upper cover member 1〇 and the frame 2〇 are coupled by bolts 91. The upper cover member 10 seals the inner space of the frame 20 from the upper side. The pair of long side frame portions 21 are respectively shaped to form a red body, and the body is introduced into the path 20a. The gas introduction path 20a extends in the long sound length direction of the processing head 1. From the process 129982.doc -10· 200904262, the gas supply path 气体 of the gas source 4 is connected to one end of the gas introduction path 2〇a. The rolling body introduction port 20b is branched from the side of the gas introduction path 2A. The gas inlet port 20b is provided at a plurality of intervals in the extending direction of the gas introduction path 2a (the direction perpendicular to the plane of the drawing of Fig. 2). Each of the gas introduction ports 2 is filled to the inner side surface of the long side frame portion 2 1 and opened. Further, a processing gas corresponding to the purpose of the treatment is accumulated in the processing gas source 4.

A ground-side cooling path 2〇C is formed on the lower side of the gas introduction path 2〇a inside the frame 20. The cooling medium from the cooling medium supply mechanism (not shown) is passed through the ground side cooling path 2〇c. The material is cooled, for example, using water. An electric field application side dielectric member 50 is disposed inside the processing head 1. The dielectric member 50 has a bottom plate portion 5t and a pair of side wall portions, μ. The bottom plate portion 51 extends in the longitudinal direction of the processing head 1. The pair of side wall portions 52, 52 are formed in the width direction 51 of the bottom plate portion 51 and the side wall portions 52, 52. The edges of the two sides protrude upward. The cross-section of the dielectric member 50 in combination with the bottom plate portion is formed so as to be substantially U-shaped, and the bottom plate portion 51 is disposed on the dielectric layer in which the discharge and discharge of the electrode 3 is stabilized. The electroformed surface is designed so that it is not integral with the electrode 30 and can be divided as shown in Fig. 2, and has a pair of side gaps 1c. The ends are connected. The gas inlet port 20b is formed between the opposite side 2°卩52 and the long side frame portion 21, and the upper cover member 10 is inserted through the upper cover member 10 perpendicularly to the upper side gap 1c and screwed into the side wall portion 5 2 129982. Doc 11 200904262. The member 10 and the dielectric member 50 are connected to the upper and lower jaw members by bolts 93. The electric component 50 is housed in the inside of the electric component 50. Made of metal such as stainless steel or aluminum. The electrode electrode is formed by ^ ^ ^ ώ. The longitudinal direction is oriented in the left-right direction of FIG. 1 (the same direction as the processing head 1 toward (four)...), and the width direction is oriented in the direction orthogonal to the plane of the paper of FIG. Leiji 3 sister is connected to the electric bungee by the power supply line 3a, and the bottom handle of the second is Qiu W ^ electrostructure (4) " Thereby, the lower surface of the electrode 30 (the electric field application side discharge surface) is covered by the plate portion 51 of the body layer as a solid (the electric field is applied to the inside of the electrode 30). The cooling medium of the cooling medium supply mechanism is supplied from the uncooled cooling unit L through the cold heading path 32c. For example, water is used as the cooling medium. An end block is provided between the portions 22 of the crucible (the coffee has an end piece 35 to the short side frame and an end piece 35. The end block is made of oxidized porcelain = body). The electrode is made by the end block 35. % and frame 1. The elongation deformation of the edge electrode 3〇 at both ends of the length direction of the electricity (4) (10) U 5 U has the allowable ^. / dry interval. The end block 35 is connected to the electric field application side dielectric member 50 The slit is completely caulked by the adhesive connection. As shown in Fig. 2, both side faces of the electrode 30 in the width direction are opposed to the side wall portion 52. The side insulating gap ld is in the side. The upper surface of the electrode portion 3 is formed with an upper cover structure (four) formed between the side wall portions 52. An upper insulation is formed between the electrodes 10 Fa1 丨 upper cover member edge gap le. The upper insulation gap edge Id is connected to each other. Xingbian 4 129982.doc 200904262 As shown in Fig. 1 to Fig. 3, a bottom plate 40 is disposed at the bottom of the processing head 1. The bottom plate 40 is formed as The longitudinal direction is a flat plate shape in the left-right direction of the drawing (the same direction as the longitudinal direction of the processing head cymbal) and the width direction is orthogonal to the plane of the paper surface of the drawing. The peripheral edge portion of the bottom plate 40 abuts against the lower surface of the frame 2〇. And the longer bolt 92 (Fig. 2) vertically penetrates the upper cover member 10 and the frame 20 and is screwed into the peripheral portion of the bottom plate 40. The bottom plate 4 is coupled to the frame 2 by a bolt 92. The bottom plate 40 is lowered from the bottom. The inner space of the frame 2 is sealed on the side. The bottom plate 40 is made of a metal having high heat resistance such as stainless steel and high corrosion resistance. The bottom plate 40 is electrically grounded via the grounding wire 3b (Fig. 2). The ground electrode is opposed to the electric field applying electrode 30. Hereinafter, the bottom plate 40 is appropriately referred to as "ground electrode 40." The upper surface of the ground electrode 40 is a ground-side discharge surface 42 facing the electric field applying electrode 3 (applied to an electric field) Electrode 3〇 The ground electrode 40 is opposed to the workpiece arrangement portion 2 and further to the workpiece w, and a processing space la is formed between the ground electrode 40 and the workpiece w. The lower surface of the ground electrode button (with discharge) The surface opposite to the surface 42 is a processing surface 43 facing the object to be processed (provided on the discharge surface (upper surface) 42 where the processing space 丨 & There is a ground-side dielectric member 6A. The dielectric member 60 is made of a ceramic (solid dielectric) such as alumina, and the dielectric member 60 is formed in a flat plate shape extending in the same direction as the ground electrode 4A. The dielectric member 60 covers the discharge surface of the ground electrode 4, and functions as a dielectric layer for stabilizing the discharge. The dielectric member 60 is housed inside the frame 20. The periphery and the frame of the dielectric member 6〇 Between the inner circumferential surfaces of the crucibles, there is a gap between the inner surface of the dielectric member 60 that is sufficient to allow the dielectric member 60 to expand or to house the dielectric member 60 in the frame 2〇. The interval is large = the dielectric can be made The degree of accommodation operation of the member 60, for example, the core, 1 mm. The frame 20 serves as a position limiting mechanism that limits the position of the dielectric member 6 on the surface 42 of the ground electrode *. For the dielectric member, the above interval is allowed. The size of the dl (<1_) phase error (refer to Fig. 5). <The two ends of the longitudinal direction of the dielectric member 60 are formed with the convex portion 6 of the upward dog, and the convex portion 61 The end of the electrical member 6〇 extends in the longitudinal direction. The end portions of the bottom plate portion 51 of the electrical component 50 are placed on the convex portions 61 at both ends in the longitudinal direction. The bottom plate portion 51 and the dielectric member 6〇 are formed to be narrower The lower gap lb. The central portion of the lower gap lb becomes a discharge space 如. The upper surface of the ground side dielectric structure (4) faces the electric field application side dielectric member 5 and thus the electric field application electrode %. The ground side dielectric member 60 The upper surface is a surface on which the discharge space is formed. As shown in the drawing, the both ends of the lower gap 1b in the width direction are respectively connected to the lower end portions of the side gaps lc. The discharge structure of the processing head 1 will be described. A plurality of discharge guides (four) are formed on the dielectric member 60. The spray (10) penetrates from the upper surface of the dielectric member 60 (the surface on which the discharge space is formed) to the surface of the ground electrode 40 in the thickness direction. The discharge guide holes Μ are connected to the electric space 1P. The size and shape of the discharge guide holes 62 are fixed in the vertical direction of the penetration side. For example, the discharge guide holes 62 are formed into a circular cross section of a fixed size having a diameter of about 1 mm. 129982.doc -14- 200904262 A plurality of discharge ports 41 are formed in the ground electrode 40. The nozzle outlet 41 penetrates from the upper surface (discharge surface 42) of the ground electrode 40 to the lower surface (processing surface 43) in the thickness direction. Export 41 The small shape and the shape are fixed in the through-direction (up-and-down direction). For example, the discharge port 41 is formed into a circular cross section of a fixed size having a diameter of about 3 mm. The discharge port 41 and the ground-side dielectric member 6 are sprayed through the guide holes. 62—corresponding to a ground, and connected to the corresponding discharge guide holes 62, and connected to the processing space 1a. The discharge port 41 and the discharge guide hole 62 are regularly arranged. For example, as shown in Fig. 6(a) (The discharge port 41 and the discharge guide hole 62 may be arranged in a square lattice shape. Alternatively, as shown in Fig. 6(b), the discharge port 41 and the discharge guide hole 62 may be arranged in a triangular lattice shape or the like. As shown in Fig. 4(a), each of the discharge ports 41 is larger than the discharge guide holes 62. The inner surface of the discharge guide hole 62 is more outwardly directed toward the inner side of the discharge port than the inner surface of the discharge port 41. The lower surface of the I electrical member 6 includes an abutting surface (1) and a step surface 64. The surface 63 is a portion of the lower surface of the dielectric member 6A that abuts against the discharge surface 42 of the ground electrode f 4 . The step surface 64 and the abutting surface 63 form the same-flat I ® ' and the self-contact surface 63 The radially inner side of the discharge port 41 is extended on one side. The step surface 64 forms a P white i P white surface 64 between the inner surface of the discharge guide hole 62 and the inner surface of the nozzle outlet 41 is formed along the discharge port 4 And a ring shape which is ejected from the periphery of the guide hole 。. As shown in Fig. 4(b), 1 is viewed from above (the side of the electric field application electrode 30) / τ', then the peripheral portion of the discharge guide hole 62 of the 丨 electric member 60 is spread over Covering the upper end edge & (the end edge of the discharge surface 42 side) of the crucible outlet 41 of the ground electrode 40 over the entire circumference. The discharge port 4 1 is more than the diameter of the discharge guide hole 62. 129982.doc 200904262 0 · 5~4 mm or so 'better is about 2 mm. The width wl of the step surface 64 (the amount of protrusion from the end edge of the discharge port 41) is about 1 == 1 mm. The difference is greater than a face width wl 64 6〇 dielectric member of the positioning error tolerance of dl (< l mm) (wl > dl). The sequence of assembly on the handling head 1 will be described.

The frame 20 is placed on the bottom plate, that is, the ground electrode 4A. The ground-side dielectric member 60 is housed inside the frame 20. The dielectric member 6 is placed on the upper surface 42 of the ground electrode 40. Thereby, the discharge guide hole 62 of the dielectric member 6 is in communication with the discharge port 41 of the ground electrode 40. The inner surface of the discharge guide hole 62 protrudes more inward than the inner surface of the discharge port 4, and a step 64 is formed between the inner surface of the discharge guide hole 02 and the inner surface of the discharge port 41. A space is formed between the dielectric member and the frame 20, and the dielectric member 6A can be easily accommodated. Since the interval is extremely small (dl < 1 mm), the dielectric member 6 可 can be positioned substantially accurately on the ground electrode 40. As shown in Fig. 5 (4), even if there is a positioning error of the dielectric member 'the tolerance (4) is smaller than the width w1 of the step surface 64 in the normal positioning state (Fig. 4 (4)) (dl < wl), the ejection via Q The entire circumference of the inner surface must protrude more inward than the inner surface of the discharge port 41. Therefore, as shown in Fig. 5(b), the entire circumference of the upper edge 喷 of the discharge (9) must be covered by the peripheral portion of the discharge guide hole 62 of the dielectric member 60 as viewed from the upper side. Further, the electric field application side dielectric member 5A is inserted into the frame plus the inside. The electric field application side dielectric member 5'' is placed on both ends in the longitudinal direction. The electric field application electrode 30 is placed on the bottom plate portion 51 of the electric field application side dielectric member 5''. The spleen is attached to the upper end of the electric field applying electrode 30 in the ^ direction. The end (4) is completely interstitial with the electric field by applying an electric field to the joint of the electric member 129982.doc 200904262 side "electric member 5. Next, the upper cover member 10 is covered on the members 2〇, 3〇, 5〇 by the shank short screw picking 9! The frame 2〇 is fixed on the upper cover member workpiece, and the grounding electrode is grounded by the longer bolt 92 4〇 is fixed to the frame 2〇, and the upper cover member 丨〇 is fixed to the electric field application side dielectric member π by the intermediate length screw 93. The bolts 91, 92, 93 are all oriented in the same direction (vertical), so that it is not necessary to: fasten in parallel, and can be easily screwed in any order. When the surface treatment is performed by the plasma processing apparatus having the above configuration, the workpiece w is placed on the workpiece arrangement portion 2. The processing gas from the processing gas source 4 is supplied to the gas introduction path 20a of the processing head 1 via the gas supply path hook. The process gas is introduced into the lower gap lb from the plurality of gas introduction ports into the side gaps 2 and further introduced into the lower gaps lb. In parallel here, a voltage is supplied from the power source 3 to the electric field application electrode 3A. By generating an atmosphere between the electric field applying electrode 30 and the ground electrode 4?, the central portion of the lower gap 113 of the glow discharge becomes the discharge space lp' to plasmaize the processing gas of the space lp (including decomposition, excitation, activation, and radicals). Chemistry, ionization). The <plasma processing gas is ejected from the discharge port Μ through the discharge port 62 to the processing space U below, and is brought into contact with the workpiece w. Thereby, the reaction of only the surface of the object W is introduced, and the desired surface treatment is performed. Further, the object to be processed is scanned in the right and left.卩2, in this way, the entire object W can be processed. The inner surface of the nozzle outlet hole 62 of the ground-side dielectric member 6 is protruded more inward than the inner surface of the ground electrode 40 129982.doc • 17- 200904262. Therefore, if the electrode is applied from the side of the electric field application electrode 3 The discharge guide hole of the dielectric member 60 covers the inner surface of the discharge port 41 with the peripheral portion. Therefore, abnormal discharge such as arcing can be prevented from falling on the upper end edge 41a of the inner surface of the spray 1, as shown in Fig. 5. There is a positioning error of the dielectric member 6〇, and it is inevitable that the entire circumference of the upper end edge 41a of the discharge port 41 can be covered by the dielectric member 60. Thereby, abnormal discharge can be reliably prevented, thereby preventing metal contaminants and particles. This is to prevent the adhesion of the metal contaminants or fine particles to the workpiece w. Next, another embodiment of the present invention will be described. In the embodiment of the present invention, the same reference numerals are attached to the drawings, and appropriate 7 is a modification of the shape of the discharge port 41. As shown in the figure (a), in the modification, the inner diameter of the upper end edge of the discharge port 41 of the ground electrode 4 is larger than the discharge guide hole 62. Inner diameter, Further, the discharge port 41 has a tapered shape in which the diameter is reduced downward. Therefore, the size of the discharge port 41 is smoothly reduced as it approaches the lower surface (the treatment surface 43) of the ground electrode 40. The inner diameter of the lower edge of the discharge port 41 is processed. The size of the end portion on the side of the surface 43 is smaller than the inner diameter of the upper end edge 4 (the size of the end portion on the side of the discharge surface 42). Further, as shown in Fig. 7 (b), the lower end edge 41b of the discharge port 41 The inner diameter is the same as that in the f & IU 62; that is, the size and shape of the end portion 4lb of the processing surface side of the 'discharge port 4' is substantially the same as the size and shape of the lead-out guide hole. It is possible to prevent the abnormal discharge of the electric power or the like from falling on the inner surface of the discharge port 41, particularly on the upper and lower end edges 41a, 41b, and to prevent the external environmental gas from entering the discharge port 41. Further, the electric power is discharged in the discharge space lp. Slurry treatment 129982.doc -18- 200904262 When the rolled body passes through the discharge holes 62 and passes through the discharge port 4, it is concentrated in order, and the discharge port 41 can be strongly discharged. As a result, the processing efficiency can be improved. Instead of making the discharge port "formed as a tapered hole, the discharge port 41 can also be made The portion 44 of the side (discharge surface side) has a large diameter such that a portion 45 of the lower side (treatment surface side) of the discharge port has a small diameter, and a step 46 is formed between the upper portion 44 and the lower portion 45, and the spray is formed. The outlet 41 is formed in a stage shape. The upper side portion: 44 has a diameter larger than the diameter of the discharge guide hole 62. The diameter of the lower side portion is substantially the same as the diameter of the discharge guide hole 62. In the modification shown in Fig. 9, the covering member 7 (sleeve) is provided on the inner surface of the discharge port 41 similar to the first embodiment (the same as the drawing). The covering member 7 is connected to the ground side dielectric member. 60. The insulator of the covering member 70 is preferably a material having high plasma resistance and heat resistance, for example, may be a gas resin, quartz, glass, etc. The covering member 70 is formed into a cylindrical shape. The outer peripheral surface of the outer surface of the discharge member 41 is in contact with the inner surface of the discharge port 41. The thickness of the covering member 70 is the same as the width w of the step surface 64. Therefore, the inner circumferential surface of the covering member 70 and the inner surface of the discharge guide hole 62 are one side. The internal space of the covering member 70 in the discharge port 41 is connected to the discharge guide hole 62. The plasma-treated process gas in the discharge space lp is ejected through the discharge guide hole 62 through the internal space of the covering member 70. In this manner, the inner surface of the metal outlet 40 of the metal outlet 40 is covered by the covering member 70. Therefore, abnormal discharge can be reliably prevented. The inner circumferential surface of the covering member 70 and the inner surface of the discharge guiding hole 62 are One side, This prevents particles from being generated from the upper edge or the like of the inner peripheral surface of the covering member 70. 129982.doc -19- 200904262 =1 ' ' can be used only for the ground electrode 4 〇 and the central portion of the dielectric member. The discharge port 41 and the discharge guide hole 62 are provided. When the workability or the like is considered, the cross-sectional shape of the discharge port 41 is preferably positive but not limited thereto, and may be elliptical or long _, or may be a quadrilateral shape or the like. In the embodiment shown in Fig. U, the discharge port 41 and the nozzle outlet hole (4) are formed in a long hole shape. The long diameters of the discharge port 41 and the discharge guide hole 62 are oriented in the first direction ( Here, the length direction of the processing head is 1), the long diameter is larger than the long diameter of the discharge guide hole 62. The short diameter of the discharge σ41 is larger than the nozzle guide hole, and the internal space of the discharge guide hole 62 is integrated with The discharge port 4" is connected. A step surface 64 is formed between the inner surface of the outlet 41 and the inner surface of the discharge guide hole 62. The step surface 64 is formed along the periphery of the discharge port 41 and the discharge guide hole 62. It is a long ring shape, a plurality of long hole-shaped discharge ports 41 and a discharge guide hole Μ; The rows of the discharge ports 41 and the discharge guide holes 62 adjacent to the width direction of the processing head 1 are offset from each other in the longitudinal direction of the processing head i, and the rows are also mutually In the embodiment shown in FIG. 12, the discharge σ41 and the discharge guide hole 62 can be formed to be closer to the processing head than the long hole-shaped discharge port 41 and the discharge guide hole 62 of FIG. The slit shape of the slit-shaped discharge port 41 is longer than the length of the slit-shaped discharge guide hole 62. The slit-shaped discharge port has a larger width than the slit-shaped discharge guide hole 62. The width of the inner space of the slit-like discharge guide hole 相连 is connected to the slit-shaped discharge port 41. A gap between the inner surface of the slit-like discharge port 41 and the inner surface of the slit-shaped discharge guide hole 62 is formed with a step 129982.doc • 20-200904262 and a gap 64 of the discharge guide hole 62. The step surface μ is formed in a slit shape along the slit-like periphery to form a long ring shape.

In the slit-shaped discharge port 41 and the discharge guide hole 62, only the plurality of slit-shaped discharge ports 41 and the discharge guide holes 62 may be disposed in the width direction of the processing head 1 in the center in the width direction of the treatment. Configured by opening the space. As shown in the figure, the long hole-shaped or slit-shaped discharge port 41 and the discharge guide can also extend in the width direction of the processing head! In the figure ", a plurality of ejections 41 and ejection orifices 62 are respectively extended in the width direction of the processing head, and are disposed at intervals in the longitudinal direction of the processing head 1. As shown in Fig. 14, the "long hole-shaped or slit-like discharge core" and the discharge guide hole 62 may extend obliquely with respect to the longitudinal direction and the width direction of the processing head i. In Fig. 14, a plurality of the inclined discharge ports 41 and the discharge guide hole processing heads 1 are arranged at intervals in the longitudinal direction. The present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. For example, it is preferable that the cross-sectional shape of the discharge guide hole 62 is similar to the cross-sectional shape of the discharge port 41, and the discharge guide hole 62 may be formed as long as the ground electrode 4G is exposed inside the discharge guide hole 62 in plan view. It is not in the shape of the discharge port 41. In addition to the frame 20 serving as the position restricting mechanism of the dielectric member 6A, a convex portion or the like may be provided on the ground electrode 4G or the dielectric member 5A and the convex portion may be used as a position for restricting the position of the dielectric member 60. The restriction mechanism can also assemble a dedicated member for restricting the position of the dielectric member 60 as a mechanism on the processing head. 129982.doc -21 - 200904262 A plurality of embodiments can be combined with each other. For example, the long hole-shaped or slit-shaped discharge port 41 of Figs. 11 to 14 may be narrowed downward as shown in the embodiment of Fig. 7. Alternatively, as shown in the embodiment of Fig. 8, a step may be formed on the inner surface of the long hole-shaped or slit-shaped discharge port 41. It is also possible to embed a long annular insulating covering member (see FIG. 9) on the long hole-shaped or slit-shaped discharge port 4 1 'the entire inner peripheral surface of the long annular covering member The circumference may be one side of the inner peripheral surface of the long hole-shaped or slit-shaped discharge guide hole 62. The present invention is applicable to various types such as cleaning, surface modification (hydrophilization, hydrophobizing, etc.), etching, film formation, and the like. Surface treatment. However, it is not limited to the plasma treatment under the vicinity of atmospheric pressure, and can also be applied to plasma treatment under vacuum. [Industrial Applicability] The present invention is applicable to, for example, a surface treatment in a glass substrate for a flat panel display or a semiconductor substrate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side cross-sectional view showing an atmosphere I' piezoelectric slurry processing apparatus according to an i-th embodiment of the present invention taken along the line I-Ι in Fig. 2; Figure 2 is /. A front cross-sectional view of the above-described atmospheric piezoelectric slurry processing apparatus of the g knqj line. Fig. 3 is an exploded perspective view of the above processing head. Fig. 4(a) is an enlarged front elevational view showing the electrode portion of the processing head, and Fig. 4(b) is a plan view taken along line iIVb_IVb of Fig. 4(a). 5 is a solid line showing the positional displacement of the ground-side dielectric member in FIG. 4, and a normal position is indicated by a broken line, and FIG. 5(4) is an enlarged sectional view of the electrode 129982.doc • 22-200904262, Fig. 5(b) is a plan view showing the Vb-Vb line of Fig. 5(a) of Fig. 6(a). Fig. 6(a) is a bottom view showing an example of the arrangement of the above-mentioned processing outlets and the discharge guide holes. Fig. 6(b) is a bottom view showing an example of the arrangement of the discharge head and the discharge guide hole of the above-mentioned treatment head, and Fig. 7 is a modification of the discharge port of the electrode portion, Fig. 7 (4) Fig. 7 is a plan view showing a state in which the discharge port of the electrode portion is not shown. Fig. 9 is an enlarged cross-sectional view showing a modification of the discharge port of the electrode portion. Fig. 9 is a view showing a deformation of the discharge port of the electrode portion. Fig. 10 is a cross-sectional view showing a modification of the discharge structure of the processing head. Fig. 11 is a bottom view showing a modification of the shape of the discharge port and the discharge guide hole of the processing head. The change of the discharge port of the above processing head and the change of the discharge guide hole Fig. 13 is a bottom view showing a modification of the discharge port and the discharge guide hole of the processing head. Fig. 14 is a bottom view showing a modification of the discharge port and the discharge guide hole of the processing head. Explanation of main component symbols] 1 Processing head la Processing space 1 p Discharge space 129982.doc -23- 200904262 2 Object arrangement part 3 Power supply 20 Frame (position limiting mechanism) 30 Electric field application electrode 40 Base plate (ground electrode) 41 Discharge port 41a End edge 41b of the discharge port side of the discharge port End edge f 42 of the process face side of the discharge port 42 Discharge surface 43 Treatment surface 60 Ground side dielectric member 62 Discharge guide hole 63 Abutment surface 64 Step surface 70 Covering member W Treated material 129982.doc -24-

Claims (1)

200904262 X. Patent application scope: 1' An electropolymerization processing device' is configured to eject a processing gas in a discharge space, and to be disposed on the object arrangement portion outside the discharge space The apparatus for performing plasma surface treatment is characterized in that: the electric field applying electrode is connected to a power source; and the ground electrode has a discharge surface facing the electric field application electrode and facing the workpiece arrangement portion. Treating the surface and electrically grounding, forming the discharge space by r λ and "electrical member' abutting on the discharge surface of the ground electrode and facing the electric field application electrode, and being composed of a solid dielectric; a discharge guide hole connected to the discharge space is formed on the dielectric member; and a discharge port connected to the discharge guide hole and penetrating from the discharge surface to the processing surface is formed on the ground electrode; The inner surface of the discharge guide hole of the dielectric member protrudes radially inward from the end edge of the discharge surface side of the inner surface of the discharge port of the ground electrode; the dielectric member has the ground An abutting surface on which the discharge surface of the electrode abuts, and a step surface extending from the abutting surface on the surface to form a step difference between the inner surface of the discharge guide hole and the inner surface of the discharge port. The plasma processing apparatus according to claim 1, wherein the size and shape of the discharge port are fixed in a penetration direction of the discharge port 129982.doc 200904262. The plasma processing apparatus according to claim 1, wherein the end portion of the processing surface of the discharge port has a size smaller than an end portion of the discharge surface side. 4. The electropolymerization processing apparatus according to claim 3, wherein the size of the outlet is smoothly changed as approaching the processing surface. 5. The plasma processing apparatus of claim 3 or 4, wherein the mouth outlet is The above processing is known as _. The size and shape of P 6. The size and shape of the guide holes are approximately the same. The plasma processing apparatus of claim 1, wherein the device has an error in a plane opposite to the grounding electrode and the power tapping surface of the k; the position of the electric component and the medium The electrical component is located in the normal & f 2 4 τ face Shanghai, the above-mentioned step difference in the state of the mountain %. The width of the dog out direction is greater than the allowable amount of the above error. Further, the plasma processing apparatus further includes a covering member which is provided in an insulating type different from that of the upper body and the thin electric component. The inner surface of the outlet is provided. 8. The plasma processing apparatus of claim 7 , the order: the thickness of the covering member is substantially the same as the width of the above step. The upper 4 out direction I29982.doc