TW200904243A - Reinforced organic light emitting diode - Google Patents
Reinforced organic light emitting diode Download PDFInfo
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- TW200904243A TW200904243A TW097100223A TW97100223A TW200904243A TW 200904243 A TW200904243 A TW 200904243A TW 097100223 A TW097100223 A TW 097100223A TW 97100223 A TW97100223 A TW 97100223A TW 200904243 A TW200904243 A TW 200904243A
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- luminescent material
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- 239000000758 substrate Substances 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 10
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 238000005192 partition Methods 0.000 claims description 2
- -1 polyethylene terephthalate Polymers 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000005361 soda-lime glass Substances 0.000 claims description 2
- 241000251468 Actinopterygii Species 0.000 claims 1
- 229910004298 SiO 2 Inorganic materials 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 239000004575 stone Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000011521 glass Substances 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000005336 safety glass Substances 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3031—Two-side emission, e.g. transparent OLEDs [TOLED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
200904243 九、發明說明： 【發明所屬之技術領域】 本發明係關於有機|各并_ 桊光—極體（OLED)，更明確地說係 關於在製造期間鱼扃畀銘 一在最後裝配中更強固與更易於處理的 OLED裝置。 【先前技術】 傳統上，〇L卿置係m薄或超薄的玻璃基板上， 其尤其適合於形成顯示器與撓性裝置，例如晶片卡。然 而此通薄玻璃基板易碎且在該等〇led裝置之製造或最 後裝配期間易於損壞。美國專利6,66G，547說明-種方法， ?使用可定位於基板之上部、下部或兩個表面上並係由環 氧樹脂、黏合劑或黏附於該基板的其他類型之材料製成之 一支撐邊緣來使該基板穩定。超薄基板上、整合於晶片卡 及其他撓性應用中的〇LED顯示器可藉由—覆蓋蓋來強 化’如美國專利7,〇26,758所說明。 【發明内容】 本發明之一目的係提供在製造期間與最後裝配中更強固 與更易於處理的OLED裝置。 β亥目的係藉由形成於一基板上並包含配置於第一與第二 電極之間的至少一層發光材料的裝置來解決，其中該基板 具有大於大約5毫米之厚度。目前，OLED係製造於薄或超 薄玻璃基板上。因此，較大〇LED裝置（例如燈）通常係藉 由硬化或安全玻璃覆蓋以使其適合於外部應用、安全應用 或公共空間，其將此類裝置之厚度增加至數公分。因為首 127442.doc 200904243 μ產―薄且很昂貴之基板並接著使用-厚玻璃來覆蓋其 以滿足客戶的規格顯然係迂迴的，故本發明之另—目 提供OLED裝置之1化” 口而，依據本發明之一態樣，提供一 〇LED裝置，其允 許更強固的生產與裝配程序。在本發明之另一態樣中，提 供一用於製造強固且易於裝配之OLED裝置的方法。在本 發明之另-態樣中’提供〇LED裝置，其可以係用於照 明，例如公共空間照明、外部照明、内部照明、傢倶照^ 或環境照明。 在本發明之另—態樣中，提供一 OLED裝置，其中不需 要額外的保護性硬玻璃覆蓋。此不僅可減低生產成本還可 改良最終產品的光學效能。 參考下述具體實施例將說明並明白本發明之此等及其他 態樣。 〃 【實施方式】 在本發明之一具體實施例中，提供一裝置，其中配置於 第一與第二電極之間的至少一層發光材料可以係形成於一 具有一大於5毫米之厚度的基板上。當與（例如丨圖丨所示之 傳統OLED裝置（a)相比較時，該〇LED裝置在製造期間與 最後裝配中較為強固並更易於處理。在圖1中，配置於第 一與第二電極之間的發光材料（e)係沈積於一玻璃基板（b) 上’其通常係0.7毫米厚的鈉鈣玻璃基板。為防止該很薄 基板（b)之破損，一硬化或安全玻璃之厚保護薄片（d)係置 於該OLED裝置上。 127442.doc 200904243 圖2顯示依據本發明之一且體眚# η ^ πτ·、" “之-體實施例的-製造的 删⑷裝置。可提供一基板⑴，其(例如)可由玻璃(例如 棚石夕酸鹽玻璃或_玻璃）製成。其他透明材料（例如聚石户 酸酉旨或聚對苯二甲酸乙二醋）亦適用。在本發明之範例: 具體實施例中’該基板係—拋光的玻璃。該基板之厚度大 於大約5毫来’例如從大約5毫米至1〇〇毫米，或從大二〇 毫米至80毫米，例如大約50毫米。 f 可藉由傳統方法在該基板⑴上形成配置於第一與第二電 極之間的至少一層發光材料(g)。通常’陽極會係一薄獏， 例如可藉由粒子束濺鍍沈積之半透明氧化銦錫（ITO)。接 者’可將發光有機層沈積於塗布的基板上，例如藉由蒸 鍍、昇華或旋塗。最後，通常可藉由諸如一適當陰極金屬 在真空中之熱蒸鍍或濺鑛的方法來在有機層上沈積陰極 層。該陰極層之材料可以係非透明金屬或透明材料，例如 ιτο。在此情況下，該〇LED能夠透過兩個電極發光。此 外，可藉由一覆蓋板（h)來密封該〇LED裝置（e)以防止氧氣 或水氣滲透進該發光材料中。可藉由一可由（例如）與該基 板（f)相同之材料製成的覆蓋板（h)來密封該〇LED裝置…）。 此將導致一向兩側發光之OLED中的透明基板與電極的情 況。還可將此類OLED用作建築物中之窗戶、建築物正 面、架子、辦公室隔板等。與結構電極及/或一或多個發 光層一起’還可將此類OLED用作顯示装置。 在本發明之一具體實施例中，一用於製造一 〇LED裝置 之方法可（例如）包含以下步驟：提供具有一大於5毫米厚度 127442.doc 200904243 的基板，在該基板上形成—Si〇2阻障層；以及在 形成配置於第—與第二電極之間的至少-層發光材料。 在本發明之另-具體實施例中，1於製造—⑽D裝 置之方法可(例如)包含以下步驟：提供—覆蓋板㈨；在該 覆盍板⑻上形成配置於第—與第二電極之間的至少一層發 光材料（g);以及在該材料（g)卜附至a 士 可付U)上附者具有—大於5毫米之厚 度的基板（f)。200904243 IX. INSTRUCTIONS: [Technical field to which the invention pertains] The present invention relates to organic | _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Robust and easier to handle OLED devices. [Prior Art] Traditionally, it has been placed on a thin or ultra-thin glass substrate, which is particularly suitable for forming displays and flexible devices, such as wafer cards. However, the thin glass substrate is fragile and susceptible to damage during manufacture or final assembly of the 〇led devices. U.S. Patent No. 6,66, 547 describes a method of using one of the other types of materials that can be positioned on the upper, lower or both surfaces of a substrate and bonded by epoxy, adhesive or other types of materials. The edges are supported to stabilize the substrate. 〇LED displays on ultra-thin substrates, integrated in wafer cards and other flexible applications can be enhanced by covering the cover as described in U.S. Patent 7, 〇26,758. SUMMARY OF THE INVENTION One object of the present invention is to provide an OLED device that is stronger and easier to handle during manufacturing and final assembly. The spectroscopy is solved by a device formed on a substrate and comprising at least one layer of luminescent material disposed between the first and second electrodes, wherein the substrate has a thickness greater than about 5 mm. Currently, OLEDs are fabricated on thin or ultra-thin glass substrates. Therefore, larger xenon LED devices (e.g., lamps) are typically covered by hardened or safety glass to make them suitable for external applications, security applications, or public spaces, which increase the thickness of such devices to a few centimeters. Because the first 127442.doc 200904243 μ-produced a thin and expensive substrate and then used - thick glass to cover it to meet customer specifications is clearly devious, so the other aspect of the present invention provides a OLED device In accordance with one aspect of the present invention, an LED device is provided that allows for a more robust manufacturing and assembly process. In another aspect of the invention, a method for fabricating a robust and easy to assemble OLED device is provided. In another aspect of the invention, a "LED" device is provided that can be used for illumination, such as public space lighting, exterior lighting, interior lighting, home lighting, or ambient lighting. In another aspect of the invention Providing an OLED device in which no additional protective hard glass coverage is required. This not only reduces production costs but also improves the optical performance of the final product. These and other aspects of the present invention will be described and understood with reference to the following specific embodiments. [Embodiment] In an embodiment of the present invention, a device is provided, wherein at least one layer of luminescent material disposed between the first and second electrodes may be Formed on a substrate having a thickness greater than 5 mm. When compared to a conventional OLED device (a) as shown, for example, the tantalum LED device is stronger and easier during manufacturing and final assembly. In Fig. 1, the luminescent material (e) disposed between the first and second electrodes is deposited on a glass substrate (b) which is usually a 0.7 mm thick soda lime glass substrate. The thin substrate (b) is damaged, a hardened or safety glass thick protective sheet (d) is placed on the OLED device. 127442.doc 200904243 Figure 2 shows one of the inventions according to the invention 眚# η ^ πτ·, " A device (1) can be provided, for example, from a glass (e.g., glass or glass). Other transparent materials (e.g., polylithic households) Acidic or polyethylene terephthalate is also suitable. In an example of the invention: In the embodiment, the substrate is a polished glass. The thickness of the substrate is greater than about 5 millimeters, for example from about 5 millimeters. To 1 mm, or from twentieth to 80 m For example, about 50 mm. f. At least one layer of luminescent material (g) disposed between the first and second electrodes may be formed on the substrate (1) by a conventional method. Usually, the anode may be thin, for example, by The translucent indium tin oxide (ITO) deposited by particle beam sputtering can be deposited on the coated substrate by, for example, evaporation, sublimation or spin coating. Finally, usually by suitable The cathode metal is thermally evaporated or splashed in a vacuum to deposit a cathode layer on the organic layer. The material of the cathode layer may be a non-transparent metal or a transparent material, such as ιτο. In this case, the 〇LED can pass through The two electrodes emit light. Further, the xenon LED device (e) can be sealed by a cover plate (h) to prevent oxygen or moisture from penetrating into the luminescent material. The germanium LED device can be sealed by a cover plate (h) which can be made, for example, of the same material as the substrate (f). This will result in a transparent substrate and electrodes in the OLED that are illuminated on both sides. Such OLEDs can also be used as windows in buildings, facades of buildings, shelves, office partitions, and the like. Such OLEDs can also be used as display devices with structural electrodes and/or one or more light-emitting layers. In one embodiment of the invention, a method for fabricating a germanium LED device can, for example, comprise the steps of providing a substrate having a thickness greater than 5 mm 127442.doc 200904243, on which a Si 形成 is formed a barrier layer; and at least a layer of luminescent material disposed between the first and second electrodes. In another embodiment of the present invention, the method of manufacturing a device of (10)D may, for example, comprise the steps of: providing a cover plate (9); forming a first and second electrode on the cover plate (8) At least one layer of luminescent material (g); and a substrate (f) having a thickness of greater than 5 mm attached to the material (g) attached to a s.
在-範例性具體實施例中，可❹任何適當的固定構件 來將配置於第一與第二電極之間的至少一層發光材料⑻附 者於該基板⑴，例如使用光學透明”、膠水、熱塑㈣ (例如PVB)、樹脂等。此還可提供（例如）改良光耗出之可 能性的益處。 在另-範例性具體實施例中，可藉由一可由（例如）與該 基板⑺相同之材料製成的覆蓋板⑻來密封該〇·裝置 ⑷。 可以-簡單並具成本效率的程序來有利地生產依據本發 明之具體實施例的0LED裝置。使用具有—大於5毫米之厚 度的基板，可顯著減低該等裝置之易碎性並可生產（例如） 厚達600x600毫米的更大〇LEE)。 應注意，上述具體實施例解說而非限制本發明，並且熟 習此項技術者應能夠設計許多替代性具體實施例但不脫離 隨附申請專利範圍之範_。詞語”包含”並不排❺該些在申 請專利範®巾列丨之外的元件或步驟的存在。於—元件之 前的詞語”一 ”或”一個"並不排除存在複數個此類元件。 127442.doc 200904243 【圖式簡單說明】 圖1顯示一傳統OLED裝置。 圖2顯示依據本發明之OLED裝置。 【主要元件符號說明】 a OLED裝置 b 基板 c 發光材料 d 保護薄片 e OLED裝置 f 基板 g 發光材料 h 覆蓋板 127442.docIn an exemplary embodiment, at least one layer of luminescent material (8) disposed between the first and second electrodes may be attached to the substrate (1), such as using optically transparent, glue, heat, by any suitable securing member. Plastic (iv) (e.g., PVB), resin, etc. This may also provide, for example, the benefit of improving the likelihood of light loss. In another exemplary embodiment, it may be, for example, the same as the substrate (7) A cover plate (8) made of a material is used to seal the device (4). An OLED device according to a specific embodiment of the present invention can be advantageously produced in a simple and cost effective procedure. A substrate having a thickness of greater than 5 mm is used. , can significantly reduce the fragility of such devices and can produce, for example, larger 〇 LEEs as thick as 600 x 600 mm. It should be noted that the above specific embodiments are illustrative and not limiting, and those skilled in the art should be able to A number of alternative embodiments are designed without departing from the scope of the appended claims. The word "comprising" does not exclude the existence of the elements or steps in the application of the patent. . In the - preceding an element of "a" or "an " does not exclude the presence of a plurality of such elements. 127442.doc 200904243 [Simple description of the drawing] Fig. 1 shows a conventional OLED device. Figure 2 shows an OLED device in accordance with the present invention. [Main component symbol description] a OLED device b substrate c luminescent material d protective sheet e OLED device f substrate g luminescent material h cover plate 127442.doc
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP07100155 | 2007-01-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200904243A true TW200904243A (en) | 2009-01-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097100223A TW200904243A (en) | 2007-01-05 | 2008-01-03 | Reinforced organic light emitting diode |
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| TW (1) | TW200904243A (en) |
| WO (1) | WO2008084412A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2640168A1 (en) | 2012-03-15 | 2013-09-18 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Submount, assembly including submount, method of assembling and assembling device |
| JP6318693B2 (en) * | 2014-02-25 | 2018-05-09 | セイコーエプソン株式会社 | Display device and electronic device |
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| US7060153B2 (en) * | 2000-01-17 | 2006-06-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of manufacturing the same |
| JP2005041982A (en) * | 2003-05-29 | 2005-02-17 | Seiko Epson Corp | Light emitting material, method of purifying light emitting material and method of manufacturing light emitting layer |
| JP4396827B2 (en) * | 2004-02-12 | 2010-01-13 | 東北パイオニア株式会社 | Manufacturing method of organic EL panel |
| US20060012985A1 (en) * | 2004-07-15 | 2006-01-19 | Eastman Kodak Company | Flat panel lighting for enclosed space illumination |
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2008
- 2008-01-02 WO PCT/IB2008/050001 patent/WO2008084412A1/en active Application Filing
- 2008-01-03 TW TW097100223A patent/TW200904243A/en unknown
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| WO2008084412A1 (en) | 2008-07-17 |
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