TW200903570A - Method of molding barrier ribs with hygroscopic polymeric molds - Google Patents

Method of molding barrier ribs with hygroscopic polymeric molds Download PDF

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Publication number
TW200903570A
TW200903570A TW96146559A TW96146559A TW200903570A TW 200903570 A TW200903570 A TW 200903570A TW 96146559 A TW96146559 A TW 96146559A TW 96146559 A TW96146559 A TW 96146559A TW 200903570 A TW200903570 A TW 200903570A
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TW
Taiwan
Prior art keywords
mold
relative humidity
temperature
substrate
microstructure
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TW96146559A
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Chinese (zh)
Inventor
Akira Yoda
Hiroshi Kikuchi
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3M Innovative Properties Co
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Publication of TW200903570A publication Critical patent/TW200903570A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/241Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
    • H01J9/242Spacers between faceplate and backplate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20Constructional details
    • H01J2211/34Vessels, containers or parts thereof, e.g. substrates
    • H01J2211/36Spacers, barriers, ribs, partitions or the like

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymerisation Methods In General (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The present invention relates to a method of making a flexible mold with a hygroscopic support, the flexible mold, and methods of using the mold to make microstructures.

Description

200903570 九、發明說明: 【先前技術】 顯示技術中之進展(包括電漿顯示面板(pDp)及電漿定址 液晶(PALC)顯示器之發展)已在於玻璃基板上形成電絕緣 阻隔翼肋中受到關注,阻隔翼肋分離單元,其中惰性氣體 可由施加於相反電極之間的電場來激發。氣體放電在單元 内發射紫外(UV)輻射。在PDp之情況下,以當由uv輕射激 發時發出紅、綠或藍色可見光之鱗光體塗佈單元内部。單 元之大小確定顯示器中像元(像素)之大小。舉例而言, PDP及PALC顯示器可用作高清晰度電視(HDTv)或其他數 位電子顯示設備之顯示器。 一可在玻璃基板上形成阻隔翼肋之方式為藉由直接模 製。此涉及將一模具層壓於基板上,其間安置玻璃或陶究 形成組合物。適當組合物描述於(例如)美國專利第 6,3 52,763號中。接著固化玻璃或陶瓷形成組合物並移除模 具。最後,藉由在約55(TC至約I600t之溫度下進行燒製 來熔合或燒結阻隔翼肋。玻璃或陶瓷形成組合物具有分散 於有機黏合劑中之呈微米大小顆粒的玻璃粉。有機黏合劑 之使用允許在生坯狀態下固化阻隔翼肋,以使得燒製將玻 璃顆粒熔合於基板上之適當位置。參見(例如)w〇 2〇〇4/ 010452、WO 2004/043664 及日本申請案第 2004_108999 號。 用於產生阻隔翼肋之模具可為可撓性模具。可撓性模具 可包含支撐件及賦形層,如wo 2006/113412中所描述,其 127318.doc 200903570 包含至少一種(甲基)丙烯醯基寡聚物與至少一種(甲基)丙 稀酿基單體之反應產物。可撓性模具可自與最終阻隔翼肋 具有大體相同微結構化圖案之轉印模具產生。 、 US 2005/0212182描述一種包含支撐件之可撓性模具, 該支撐件含有因預先應用之濕氣吸收處理而在使用時在一 溫度及相對濕度下飽和之濕氣。如在第〇〇31段中所描述, 當允許P E T薄膜充分吸收濕氣以穩定化其尺寸且接著將其200903570 IX. Invention Description: [Prior Art] Progress in display technology (including the development of plasma display panels (pDp) and plasma-addressed liquid crystal (PALC) displays) has attracted attention in the formation of electrically insulating barrier ribs on glass substrates. A barrier rib separation unit, wherein the inert gas is excited by an electric field applied between the opposite electrodes. The gas discharge emits ultraviolet (UV) radiation within the unit. In the case of PDp, the inside of the unit is coated with a scale, which emits red, green or blue visible light when excited by uv light. The size of the cell determines the size of the pixels (pixels) in the display. For example, PDP and PALC displays can be used as displays for high definition television (HDTv) or other digital electronic display devices. One way to form the barrier ribs on the glass substrate is by direct molding. This involves laminating a mold onto a substrate with a glass or ceramic forming composition therebetween. Suitable compositions are described, for example, in U.S. Patent No. 6,3,52,763. The glass or ceramic is then cured to form a composition and the mold is removed. Finally, the barrier ribs are fused or sintered by firing at a temperature of about 55 (TC to about I600 t. The glass or ceramic forming composition has glass powder of micron-sized particles dispersed in an organic binder. Organic bonding The use of the agent allows the barrier ribs to be cured in the green state so that the firing fuses the glass particles in place on the substrate. See, for example, w〇2〇〇4/ 010452, WO 2004/043664, and Japanese application. No. 2004_108999. The mold for producing the barrier ribs may be a flexible mold. The flexible mold may comprise a support member and a shaping layer, as described in WO 2006/113412, which has at least one of (the 127318.doc 200903570) A reaction product of a methyl) propylene sulfhydryl oligomer and at least one (meth) propylene monomer. The flexible mold can be produced from a transfer mold having substantially the same microstructured pattern as the final barrier rib. US 2005/0212182 describes a flexible mold comprising a support member containing moisture that saturates at a temperature and relative humidity during use due to pre-applied moisture absorption treatment. As described in paragraph 〇〇31, when film P E T sufficient to allow absorption of moisture to stabilize its dimension and then it

用以製造模具時,可抑制模具在製造後之尺寸變化。 【實施方式】 本發明係關於-種製造可撓性模具之方法、該可撓性模 具及使用該模具製造微結構之方法。下文中,將參:適用 於製造諸如阻隔翼肋之微結構的可撓性模具來_本發明 之實施例。可聚合樹脂及可撓性模具可與其他(例如,微 結構化)設備及物品(諸如’具有毛細通道及照明應用之電 泳板)一起利用。 由端點來敍述數值範圍包括包含於該_内之所有數字 (例如,範圍1至10包括卜15、3 33及1〇)。 除非另有指示,否則說 的表示成份之數量、性質 理解為在所有例子中可藉 明書中及申請專利範圍中所使用 之量測及其類似物之所有數字應 由術語”約”而修改。 甲基丙烯酸脂 '(甲基)丙烯醯基,,指代包括丙烯酸酯 丙烯醯胺及甲基丙烯醯胺之官能基。 甲基)丙烯酸㈣代丙稀酸醋與(甲基)丙稀酸S旨化合 物0 127318.doc 200903570When the mold is used to manufacture, the dimensional change of the mold after manufacture can be suppressed. [Embodiment] The present invention relates to a method of manufacturing a flexible mold, the flexible mold, and a method of manufacturing a microstructure using the mold. In the following, reference will be made to an embodiment of the invention which is suitable for the manufacture of flexible moulds such as microstructures which block ribs. Polymerizable resins and flexible molds can be utilized with other (e.g., microstructured) equipment and articles such as 'electrophoretic panels having capillary channels and lighting applications. The range of values recited by the endpoints includes all numbers included in the _ (for example, ranges 1 through 10 include bl, 15, 33, and 1 〇). Unless otherwise indicated, the quantities and properties of the indicated components are to be understood as all the numbers of the measurements and their analogs that can be used in the claims and in the scope of the patent application in all examples, which should be modified by the term "about". . The methacrylate '(meth) acrylonitrile group, refers to a functional group including acrylate acrylamide and methacrylamide. Methyl)acrylic acid (tetra) acrylic acid acrylate and (meth)acrylic acid S compound 0 127318.doc 200903570

圖1為展示說明性(例如,可撓性)模具ι〇〇之部分透視 圖。可撓性模具1〇〇大體具有兩層結構,其具有平面支撐 層U〇及提供於該支撐件上的在本文中稱為賦形層120之微 結構化表面。圖丨之可撓性模具1〇〇適用於在電漿顯示面板 之(例如,電極圖案化的)背板上產生柵格狀翼肋圖案(亦稱 為晶格圖案)的阻隔翼肋。另一常用阻隔翼肋圖案(未圖示) 包含彼此平行配置之複數個(非交又)翼肋,亦稱為線性圖 案。可撓性模具將視成品物品(例如,顯示面板)之大小來 適當地設定大,卜舉例而言,可撓性模具在形狀上可為矩 形(700 mmx400 mm)。 賦形層之微結構的深度、間距及寬度可視所要成品物品 而變化。微結構化(例如’凹槽)圖案125之深度(對應於阻 隔翼肋高度)大體為至少1()〇 μΓη,且通常至少15〇 μπι。此 外,該深度通常不大於5〇〇 μιη,且通常小於3〇〇 。微結 構化(例如,凹槽)圖案之間距在縱向方向上與橫向方向上 相比可為不同的。該間距大w ^ / V V/ ΧΑΧ Ρ"Ι - _Ϊ.ΓΤ3 fTJ -|> 2/0 μιη。§亥間距通常不大於6〇〇 μηι,且較佳小於_ _。 微結構化(例如,凹槽)圖案4之寬度在上表面與下表面之間 可為不同的,尤其當如此形成之阻隔翼肋為楔形時。該寬 度大體為至少1〇 ,且通常至少5 〇 常不大於1〇〇 μιη,且通常小於8〇 μιη μιη。此外,該寬度通 代表性賦形層之厚度為至少5 μιη,通常至少1 〇 ,且 更通常至少50 μιη。此外,賦形層之厚度不大於1,000 通常小於800 μηι’且更通常小於7〇〇陣。當賦形層 127318.doc 200903570 之厚度低於5 μπι時,通常無法獲得所要翼肋高度。當賦形 層之厚度大於1,000 μηι時,可歸因於過度收縮而產生模具 之翹曲及尺寸精確性降低。 聚合性支撐薄膜之厚度通常為至少〇〇25毫米,且通常 至少0.075毫米。此外,聚合性支撐薄膜之厚度大體小於 〇.5毫米,且通常小於0.300毫米。聚合性支撐薄膜之拉伸 強度大體至少約5 kg/mm2,且通常至少約1〇 kg/mm2。聚 合性支撐薄膜通常具有約6(TC至約2〇〇。〇之玻璃轉變溫度 (Tg)。 可撓性模具通常係由轉印模具或母模具製備,其具有與 可撓性模具相應相反之微結構化表面圖案。舉例而言,圖 2中描繪適用於製造圖丨之可撓性模具之說明性轉印模具或 母模具200的透視圖。圖3A中描繪沿線以-…截取之圖2之 轉印模具200的剖視圖。諸如公開之美國申請案第 205/02_34號中所描述,#印模具可具有由經固化(例 如,聚矽氧橡膠)聚合材料組成之微結構化表面。或者, 母模具(例如,具有金屬支撐層)可如WO 2005/013308中所 述而製備。 在如圖3A至圖3C所描繪以轉印模具(例如,圖2之轉印模 具)製造可撓性模具(例如,圖!之可撓性模具)的具體化方 法中,將可聚合樹脂組合物35〇至少提供於聚合性轉印模 具或母模具200之微結構化表面的凹部中。此可藉由諸如 刀塗佈機或刮棒塗佈機之已知慣常塗佈構件來完成。將包 含可撓性聚合性薄膜之支樓件則堆疊於填充有可聚合樹 127318.doc 200903570 脂之模具上,使得樹脂與支撐件接觸。當以此方式堆疊 時’固化可聚合樹脂組合物^光固化通常係較佳的。對於 此實施例’支撐件以及可聚合組合物較佳係足夠光學透明 的’使得照射以進行固化之光線可穿過支撐件。通常,可 撓性模具具有小於1 5%,通常小於10%且更通常不大於5% 之混濁度(如根據實例中所描述之測試方法所量測)。一旦 固化,便將可撓性模具100(其中支撐薄膜38〇整體黏合在 由經固化可聚合樹脂形成之賦形層上)與轉印模具2〇〇分 離0 眾k丰發明之模具的方法中,調節吸濕性聚合性支撐 件,且在具有第—溫度及相對濕度之適當環境下製備模 在製1^模具之方法期間所利用之(亦即,第一)溫度及/ 或相對濕度係不同於在製造陶瓷微結構之方法期間模具所 處之(亦即,第二)溫度及/或相對濕度。在此情況下,可在 模具製造過程期間調整模具之微結構的尺寸(例如,間 田藉以形成可撓性模具之母模具或轉印模具有大於 二於目標尺寸之尺寸(例如,間距)時,此態樣係尤其有 用的,該目標尺计立@ & 寸為隨後由可撓性模具形成之微 如’陶瓷阻隔翼肋、沾p上 利用A & 、、尺寸。若在與模具製造操作期間所 利用的條件相同之條件Γ ^ 撓性楹且 ' '、ρ,溫度及相對濕度)下使用可 視性棋具來模製陶瓷奮 門拓、—社 ,則模具之微結構尺寸(例如’ 間距)在其製造時鱼使 同的。 /、 杈具來模製陶瓷膏體時相比係相 在—些態樣中,第_、w 皿& /、第一溫度大體相同(亦即, 127318.doc 200903570 差距不致使可調整模具尺寸)。因 於第二相對濕度。當(例如)母模具 =濕度不同 目標時’模具製造環境之(亦即, :具之間距大於 在使用模具來製造陶究 ·、濕度通常大於 即,第二)溫度及/或相對渴度 使用的(亦 模具之間距在製造模具二此,微結構膨脹,使得 犋具之方法期間可減小至目栌尺♦。相 反地,當母模具或轉印模且 、 产产厂……,、之間距小於目標時,模具製造 %境之溫度及/或相對渴唐诵蚩 降低以使微結構收縮,藉 此使間距增加至目標尺寸。 第-相對濕度與第二相對濕度之間的相對濕度差可自約 服Η至高達約4G%RH變化。通常,製備模具之環境且有 與預調節吸濕性支撑件所使用的溫度及相對濕度相同或相 對接近的(亦即,第一)溫度及相對濕度。舉例而言,差通 常不大於約 10%RH(例如 ’ 9%RH、8%RH、7%RH、 6%RH、5%RH、4%RH),且可小至 1%肪、2%rh 或 3 /i>RH。第一皿度及相對濕度亦相對接近但不等於第二溫 度及相對濕度。在此情況下,在製造模具之方法期間對微 結構之調整通常在每百分比相對濕度高達約5 ppm之數量 級0 各種吸濕性塑膠薄膜材料可用於可撓性模具之支樓件, 諸如聚對苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酉旨 (PEN)、展延性聚丙烯、聚碳酸酯及三乙酸纖維素。此等 塑膠薄膜可用作單層薄膜,或用作兩種或兩種以上加以組 合的複合或層壓薄膜。支撐件之表面可經處理以促進對可 127318.doc 200903570 聚合樹腊組合物之黏著。適當的基於聚醋之材BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a partial perspective view showing an illustrative (e.g., flexible) mold. The flexible mold 1 has a two-layer structure having a planar support layer U and a microstructured surface referred to herein as a shaped layer 120 provided on the support. The flexible mold 1 丨 is adapted to produce a barrier rib having a grid-like rib pattern (also referred to as a lattice pattern) on a back panel of a plasma display panel (e.g., electrode patterned). Another commonly used barrier rib pattern (not shown) includes a plurality of (non-intersecting) ribs, also referred to as linear patterns, arranged in parallel with one another. The flexible mold is appropriately set to be large depending on the size of the finished article (e.g., display panel). For example, the flexible mold may be rectangular in shape (700 mm x 400 mm). The depth, spacing and width of the microstructure of the shaped layer may vary depending on the desired article. The depth of the microstructured (e. g., 'groove) pattern 125 (corresponding to the height of the barrier ribs) is generally at least 1 () 〇 μ η, and typically at least 15 〇 μπι. In addition, the depth is usually no more than 5 〇〇 μιη, and is usually less than 3 〇〇. The distance between the micro-deposition (e.g., grooves) patterns may be different in the longitudinal direction than in the lateral direction. The spacing is large w ^ / V V / ΧΑΧ Ρ "Ι - _Ϊ.ΓΤ3 fTJ -|> 2/0 μιη. § The pitch of the sea is usually not more than 6 〇〇 μηι, and preferably less than _ _. The width of the microstructured (e.g., groove) pattern 4 can be different between the upper and lower surfaces, especially when the barrier ribs so formed are wedge shaped. The width is generally at least 1 〇 and is usually at least 5 〇 often not more than 1 〇〇 μηη, and usually less than 8 〇 μιη μιη. Moreover, the width of the representative shaped layer has a thickness of at least 5 μηη, typically at least 1 〇, and more typically at least 50 μηη. Moreover, the thickness of the shaped layer is no greater than 1,000, typically less than 800 μηι' and more typically less than 7 arrays. When the thickness of the shaping layer 127318.doc 200903570 is less than 5 μm, the desired rib height is usually not obtained. When the thickness of the shaped layer is more than 1,000 μm, warpage of the mold and dimensional accuracy are lowered due to excessive shrinkage. The thickness of the polymeric support film is usually at least 毫米25 mm, and usually at least 0.075 mm. Further, the thickness of the polymeric support film is substantially less than 〇5 mm, and is usually less than 0.300 mm. The polymeric support film has a tensile strength of at least about 5 kg/mm2, and usually at least about 1 〇 kg/mm2. The polymeric support film typically has a glass transition temperature (Tg) of from about 6 (TC to about 2 Torr.) The flexible mold is typically prepared from a transfer mold or master mold that has a corresponding opposite to the flexible mold. Microstructured surface pattern. For example, a perspective view of an illustrative transfer mold or master mold 200 suitable for use in fabricating a flexible mold of the figure is depicted in Figure 2. Figure 2A depicts Figure 2 taken along line -... A cross-sectional view of the transfer mold 200. As described in the published U.S. Application Serial No. 205/02-34, the #-printing mold may have a microstructured surface composed of a cured (e.g., polyoxymethylene rubber) polymeric material. A master mold (e.g., having a metal support layer) can be prepared as described in WO 2005/013308. A flexible mold is fabricated in a transfer mold (e.g., transfer mold of Figure 2) as depicted in Figures 3A-3C In the embodiment of the flexible mold (for example, the flexible mold of Fig.), the polymerizable resin composition 35 is provided in at least the concave portion of the microstructured surface of the polymer transfer mold or the mother mold 200. Such as a knife coater or scraping The known coating member of the bar coater is completed by stacking a building member comprising a flexible polymerizable film on a mold filled with a polymerizable tree 127318.doc 200903570, so that the resin is in contact with the support. When cured in this manner, the curing of the polymerizable resin composition is generally preferred. For this embodiment, the support and the polymerizable composition are preferably sufficiently optically transparent to allow illumination to be cured. Passing through the support. Typically, the flexible mold has a haze of less than 1 5%, typically less than 10% and more typically no more than 5% (as measured by the test methods described in the examples). Once cured, once cured Adjusting the moisture absorption of the flexible mold 100 (in which the support film 38 is integrally bonded to the shaped layer formed of the cured polymerizable resin) and the transfer mold 2 are separated from the mold of the invention a polymeric support member, and the (i.e., first) temperature and/or relative humidity utilized during the method of preparing the mold in a suitable environment having a first temperature and a relative humidity is different from The temperature at which the mold is placed (i.e., the second) temperature and/or relative humidity during the method of making the ceramic microstructure. In this case, the size of the microstructure of the mold can be adjusted during the mold manufacturing process (for example, by thinning to form This aspect is especially useful when the mother mold or transfer mold of the flexible mold has a size (eg, pitch) greater than two of the target size, the target gauge is @@ amps for subsequent flexible molds The formation is as follows: 'ceramic barrier ribs, immersed on A &, size. If the conditions used during the mold manufacturing operation are the same conditions 楹 ^flexible and ' ', ρ, temperature and relative humidity Under the use of visual chess to mold ceramics, the microstructure size of the mold (such as 'pitch') is the same when it is manufactured. /, When the cookware is used to mold the ceramic paste, the first temperature is the same as that of the first phase, and the first temperature is substantially the same (that is, 127318.doc 200903570 does not make the adjustable mold size). Due to the second relative humidity. When, for example, the mother mold = humidity target is different, the mold manufacturing environment (that is, the distance between the molds is greater than the mold used to make the ceramics, the humidity is usually greater than the second temperature) and/or the relative temperature is used. (The distance between the molds is also in the manufacturing mold, the microstructure is expanded, so that the method of the cookware can be reduced to the target ♦. Conversely, when the mother mold or transfer mold, and the production plant..., When the distance between the distances is less than the target, the temperature of the mold manufacturing % and/or the relative temperature is reduced to shrink the microstructure, thereby increasing the pitch to the target size. The relative humidity between the first relative humidity and the second relative humidity The difference can vary from about 5% to about 4 G% RH. Typically, the mold environment is prepared and has the same or relatively close (i.e., first) temperature as the temperature and relative humidity used to pre-adjust the hygroscopic support. And relative humidity. For example, the difference is typically no greater than about 10% RH (eg, '9% RH, 8% RH, 7% RH, 6% RH, 5% RH, 4% RH) and can be as small as 1% Fat, 2% rh or 3 / i > RH. The first dish and relative humidity are also opposite But not equal to the second temperature and relative humidity. In this case, the adjustment of the microstructure during the method of manufacturing the mold is usually on the order of about 5 ppm per percent relative humidity. 0 Various hygroscopic plastic film materials can be used for flexibility. Branches for molds, such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), ductile polypropylene, polycarbonate, and cellulose triacetate. The plastic film can be used as a single layer film, or as a composite or laminate film in which two or more combinations are combined. The surface of the support member can be treated to promote adhesion to the 127318.doc 200903570 polymeric wax composition. Appropriate based on vinegar

含相片級聚對苯二甲酸乙二㈣及具有根據美國專利第匕 4,340,276朗描述之方法㈣成之表㈣聚對苯 二醇酯(PET)。 G 對吸濕性支樓件之預調節可包括在用以製造模具之前對 塑膠薄膜施加濕氣。用於施加濕氣之適當方式包括 將薄膜浸沒於(例如,熱)水十,或藉由使薄膜通過諸如塞 汽之高溫高濕度氣氛。通常,在溫度及濕度受控之腔室中、 調節塑膠薄膜以獲得所要第一濕度。 可撓性模具H)0可用以在諸如(例如,電聚)顯示面板之 基板上產生(例如,阻隔翼肋)微結構。 在用於該方法之前,通常在濕度及溫度受控之腔室(例 T ’ 22。〇/55。/。相對濕度)中調節轉印模具及支撐薄膜,以 取小化其任何尺寸變化。鑒於藉由使用與製造可撓性模具 期間所使用的不同的(亦即’第一)相對濕度而完成對微結 構之尺寸調整,模具通常具有目標尺寸,I因此不需要諸 如WO 2004/043664中所描述之進一步調整。 參看圖4A至圖4C,提供具有(例如,條帶狀)電極圖案之 平坦透明(例如,玻璃)基板41。本發明之可撓性模具 1〇〇(例如)藉由使用諸如電荷耦合設備相機之感應器而定 位,使得模具之阻隔圖案與基板之電極圖案對準。可以多 種方式將阻隔翼肋前驅物45(諸如可固化陶瓷膏體)提供於 基板與可撓性模具之賦形層之間。可直接將可固化材料置 放於模具之圖案中,繼而將模具及材料置放於基板上,可 127318.doc -12- 200903570 將材料置放於基板上,繼而將模具壓抵基板上之材料,或 可在藉由機械或其他方式將模具與基板置於一起時將材料 引入模具與基板之間的間隙中。如圖4A中所描繪,一(例 如,橡膠)滚筒43可用以藉由阻隔翼肋前驅物來嚙合可撓 性基板100。翼肋前驅物45展布於玻璃基板41與模具之 賦形表面之間,從而填充模具之凹槽部分。換言之,翼肋 前驅物45順序地替換凹槽部分之空氣。隨後,固化翼肋前 驅物。如在圖4B上所描繪,較佳藉由對穿過透明基板“及/ 或穿過模具1〇〇之(例如,UV)光線的輻射曝露來固化翼肋 前驅物。如圖4C中所示,移除可撓性模具1〇〇,而所得經 固化翼肋45仍黏合至基板41。 儘管模具可包含其他(例如,經固化)聚合材料,但至少 模具之模製表面(例如’微結構化表面)包含可聚合組合物 之光聚合反應產物,該組合物大體包含至少一種烯系不飽 和寡聚物及至少一種烯系不飽和稀釋劑。烯系不飽和稀釋 劑可與稀^飽和寡聚物共聚合。寡聚物大體具有如由凝 膠渗透層析法(在實财被更詳細描述)確定的至少丨,刪 莫耳,且通常小於50,000 g/莫耳之重量平均分子量(补 烯系不飽和稀釋劑大體具有小於!,〇〇〇 g/莫耳,且更通常 小於800 g/莫耳之mw。 募聚物及單體具有在曝露至光後即發生反應(例如,交 聯)之g此性。光可聚合基團之代表性實例包括環氧基, (甲基)丙烯酸酯基、烯碳碳雙鍵、稀丙氧基、α_甲基苯乙 烯基、(甲基)丙稀醯胺基、氰酸酯基、乙烯基醚基、此等 127318.doc 200903570 基團之組合及其類似物。可自由基聚合基團係較佳的。在 此等基團中,(甲基)丙稀醯基官能性係典型的,且(甲基) 丙烯酸酯官能性更為典型。通常,可聚合組合物之成份中 之至少一者,且更通常寡聚物,包含至少兩個(甲基)丙烯 醯基。 可使用具有(甲基)丙烯酿基官能基之各種已知寡聚物。 適當寡聚物包括(甲基)丙烯酸酯化之胺基甲酸酯(亦即,胺 基曱酸酯(甲基)丙烯酸酯)、(甲基)丙烯酸酯化之環氧基(亦 即’環氧基(甲基)丙稀酸醋)、(甲基)丙烯酸g旨化之聚醋(亦 即,聚酯(甲基)丙烯酸酯)、(甲基)丙烯酸酯化之(甲基)丙 烯酸系物、(甲基)丙稀酸酯化之聚謎(亦即,聚謎(甲基)丙 烯酸輯)及(甲基)丙烯酸酯化之聚烯烴。募聚物及單體較佳 分別具有約-80°C至約60°C之玻璃轉變溫度(Tg),此意謂其 均聚物具有此等玻璃轉變溫度。 寡聚物大體與占模具之總的可聚合組合物的5重量%至 90重量%之量的單體組合。通常,寡聚物之量為至少2〇重 里%,更通常至少30重量。/。,且更通常至少4〇重量%。在 至少一些較佳實施例中,寡聚物之量為至少5〇重量%、 重量%、70重量%或8〇重量0/〇。 在-些實施例中,可撓性模具之可聚合組合物可包含一 或多種胺基甲酸酯(甲基)丙烯酸酯募聚物,諸如可自Photographically graded polyethylene terephthalate (IV) and a method described in U.S. Patent No. 4,340,276, the disclosure of which is incorporated herein by reference. G Preconditioning of the absorbent building member may include applying moisture to the plastic film prior to use in the manufacture of the mold. Suitable means for applying moisture include immersing the film in (e.g., hot) water, or by passing the film through a high temperature, high humidity atmosphere such as a plug. Typically, the plastic film is conditioned in a temperature and humidity controlled chamber to achieve the desired first humidity. The flexible mold H) 0 can be used to create (e.g., block rib) microstructures on a substrate such as a (e.g., electropolymer) display panel. Prior to use in the process, the transfer mold and support film are typically adjusted in a humidity and temperature controlled chamber (e.g., T' 22. 〇/55. /. relative humidity) to minimize any dimensional changes. In view of the sizing of the microstructures by using a different (i.e., 'first' relative humidity) used during the manufacture of the flexible mold, the mold typically has a target size, I therefore does not need to be as in WO 2004/043664 Further adjustments as described. Referring to Figures 4A through 4C, a flat transparent (e.g., glass) substrate 41 having a (e.g., strip-like) electrode pattern is provided. The flexible mold of the present invention is positioned, for example, by using an inductor such as a charge coupled device camera such that the barrier pattern of the mold is aligned with the electrode pattern of the substrate. A barrier rib precursor 45, such as a curable ceramic paste, can be provided in a variety of ways between the substrate and the shaped layer of the flexible mold. The curable material can be directly placed in the pattern of the mold, and then the mold and the material are placed on the substrate, and the material can be placed on the substrate, and then the mold is pressed against the material on the substrate. Alternatively, the material may be introduced into the gap between the mold and the substrate when the mold is placed together with the substrate by mechanical or other means. As depicted in Figure 4A, a (e.g., rubber) roller 43 can be used to engage the flexible substrate 100 by blocking the rib precursor. The rib precursor 45 is spread between the glass substrate 41 and the shaped surface of the mold to fill the groove portion of the mold. In other words, the rib precursor 45 sequentially replaces the air of the groove portion. Subsequently, the rib precursor is cured. As depicted on Figure 4B, the rib precursor is preferably cured by radiant exposure through the transparent substrate "and/or through the (e.g., UV) light of the mold 1" as shown in Figure 4C. The flexible mold 1 is removed and the resulting cured rib 45 remains bonded to the substrate 41. Although the mold may comprise other (eg, cured) polymeric material, at least the molded surface of the mold (eg, 'microstructured' a photopolymerization reaction product comprising a polymerizable composition, the composition generally comprising at least one ethylenically unsaturated oligomer and at least one ethylenically unsaturated diluent. The ethylenically unsaturated diluent can be combined with a dilute saturated oligomer Polymer copolymerization. The oligomer generally has at least a ruthenium, as defined by gel permeation chromatography (described in more detail in the real economy), and is generally less than 50,000 g/mole of weight average molecular weight (complement The ethylenically unsaturated diluent generally has a mw of less than !, 〇〇〇g/mole, and more typically less than 800 g/mole. The merging polymer and monomer have a reaction upon exposure to light (eg, crossover) G) This is the nature of photopolymerizable groups. Illustrative examples include epoxy groups, (meth) acrylate groups, olefin carbon double bonds, diloxy propoxy groups, α-methyl styryl groups, (meth) acrylamide groups, cyanate groups, Vinyl ether groups, combinations of such groups of 127318.doc 200903570, and analogs thereof. Free radically polymerizable groups are preferred. Among such groups, (meth) propyl sulfhydryl functional groups are typical And (meth) acrylate functionality is more typical. Typically, at least one of the components of the polymerizable composition, and more typically the oligomer, comprises at least two (meth) acrylonitrile groups. Various known oligomers having (meth)acryloyl functional groups. Suitable oligomers include (meth)acrylated urethanes (ie, amino phthalate (meth) acrylates) Ester), (meth)acrylated epoxy group (ie, 'epoxy (meth) acrylate vinegar), (meth) acrylate g liquefied (ie, polyester (A) (meth)acrylate, (meth)acrylated (meth)acrylic, (meth)acrylated The mystery (ie, poly(meth)acrylic acid) and (meth)acrylated polyolefin. The polymer and monomer preferably have a glass transition temperature of about -80 ° C to about 60 ° C, respectively. (Tg), which means that its homopolymer has such glass transition temperatures. The oligomer is generally combined with a monomer in an amount of from 5% by weight to 90% by weight of the total polymerizable composition of the mold. The amount of the polymer is at least 2% by weight, more usually at least 30% by weight, and more usually at least 4% by weight. In at least some preferred embodiments, the amount of the oligomer is at least 5% by weight, % by weight, 70% by weight or 8 〇 by weight 0 / 〇. In some embodiments, the polymerizable composition of the flexible mold may comprise one or more urethane (meth) acrylate merging agents, Such as self-sufficient

Daicel UCB Co·,Ltd以商標名"EB 270”及”EB 8402,'購得之 寡聚物纟其他實施例中,可棱性模具之可聚合組合物可 13或夕種聚烯烴(甲基)丙烯酸酯募聚物,諸如可自 127318.doc •14- 200903570Daicel UCB Co., Ltd. under the trade names "EB 270" and "EB 8402," purchased oligomers. In other embodiments, the polymerizable composition of the prismatic mold can be 13 or a polyolefin of the kind (A Acrylate condensate, such as available from 127318.doc •14- 200903570

Osaka Organic Chemical Industry Ltd.以商標名”SpDBA"睛 得之寡聚物。其他適當可撓性模具組合物係已知的。 各種(曱基)丙烯醯基單體係已知的,包括(例如):芳族 (甲基)丙烯酸醋’包括本乳基乙基丙稀酸g旨、苯氧臭乙其 聚乙二醇丙烯酸酯、壬基苯氧基聚乙二醇、3_經基苯^ 基丙基丙烯酸酯及氧化伸乙基改質之雙酚的(甲基)丙稀酸 酯;羥基烷基(甲基)丙烯酸酯,諸如4_羥基丙烯酸丁酯; 伸烧基二醇(曱基)丙烯酸酯及烷氧基伸烷基二醇(曱美)丙 烯酸酯,諸如曱氧基聚乙二醇單丙烯酸酯及聚丙二醇二丙 烯酸酯;聚已酸内酯(曱基)丙烯酸醋;烷基卡必醇(甲基) 丙烯酸酯,諸如乙基卡必醇丙烯酸酯及2_乙基己基卡必醇 丙烯酸酯;以及各種多官能性(曱基)丙烯醯基單體,包括 2-丁基-2-乙基-1,3-丙二醇二丙烯酸酯及三羥曱基丙烷三 (甲基)丙烯酸酯。 用於製造可撓性模具之較佳可聚合組合物描述於公開之 美國專利申請案第2006/023 1728號中。 光可固化翼肋前驅物(亦稱為”聚體”或,,膏體,,)除剛描述 之光引發劑之外亦包含至少三種組份。第―組份為玻璃或 陶瓷形成之微粒材料(例如,粉末)。粉末最終將藉由燒製 2融合或燒結以形成微結構。第二組份為能夠成形且隨後 藉由固化、加熱或冷卻而硬化之可固化有機黏合劑。黏合 对I允許水體可成形為硬質或半硬質之"生坯狀態"的微結 構。黏合劑通常在解黏及燒製期間揮發,i因此亦可稱作 短效黏CF知|第二組份為稀釋劑。稀釋劑通常在硬化黏 127318.doc 200903570 合劑材料後可促進自模具釋放。或者或除此之外,在燒製 微結構之陶瓷材料之前,稀釋劑可在解黏期間促進快速且 大體上完全耗盡黏合劑。黏合劑硬化後,稀釋劑較佳保持 液態,以使得稀釋劑在硬化期間與黏合劑材料相位分離。 翼肋前驅物組合物較佳具有小於2〇,〇〇〇 cps且更佳小於 1〇,〇〇〇 cps之黏度,以在不夾帶空氣之情況下均句地填充 可撓性模具之所有微結構化凹槽部分。翼肋前驅物組合物 較佳在(M/秒之剪切速率下具有約2〇 Pas至_ Pa_s之間 的黏度’且在100/秒之煎切速率下具有i Pa ^2〇 間的黏度。 可使用各種可固化有機黏合劑。可固化有機黏合劑可 (例如)藉由曝露至輻射或熱而固化。黏合劑可包含任何组 合之單體與募聚物,只要具有無機微粒材料之混合物且有 適當黏度即可。通常黏合劑較佳在等溫條件川即,無 溫度變化)係輻射可固化的。此 此降低知因於模具與基板之 不同熱膨脹特性而移位或膨脹 風險u使得可在翼肋前 驅物硬化時維持模具之精確置放及對準。 /釋劑並非僅為樹脂之溶劑化合物。稀釋劑較佳足夠可 浴以併入於處於未固化狀態人 y. f月日此σ物中。在固化漿體 之黏合劑後,稀釋劑應與參盘 物八舱, 麥與交聯過程之單體及/或寡聚 物相位刀冑。較佳地’稀釋劑相位分 連續基質中形成液態材料的離 :®罐曰之 合玻璃粉之顆粒或衆體之陶究粉太囊八中經固化樹脂黏 生坧壯能_ 是叔末。以此方式,經固化的 生坯狀態微結構的實體完整性 甚至在使用稍高含量的稀釋 127318.doc 200903570 劑(亦即,大於約1:3之稀釋劑與樹脂比)時亦無受極大損 害。此提供兩個優勢。第一,藉由在硬化黏合劑時保持液 態,稀釋劑可降低經固化黏合劑材料黏附至模具之風險。 第二,藉由在硬化黏合劑時保持液態,稀釋劑與黏合劑材 料相位分離,藉此形成一稀釋劑之小液囊或液滴分散於整 個經固化黏合劑基質中的互相貫穿網路,而促進解黏過 程。 視情況’光可固化翼肋前驅物組合物可包含分散劑及/ 或觸變劑。此等添加劑中之每一者可以自總的翼肋前驅物 組合物之約0.05重量❹/◦至2.0重量%之量使用。通常,此等 添加劑中之每一者的量不大於約〇·5重量❶/〇。此外,翼肋前 驅物可包含諸如矽烧偶合劑之增黏劑以促進對基板(例 如,PDP之玻璃面板)之黏著。翼肋前驅物亦可視情況包含 各種添加劑’包括(但不限於)此項技術中已知之界面活性 劑、催化劑等。 大體而s ’無機觸變膠可包含黏土(例如,膨潤土)、石夕 石 '雲母、蒙脫石及其他’其具有小於〇·1 μπι之粒徑。大 體而言’有機觸變膠可包含脂肪酸、脂肪酸胺、氫化藥麻 油、乾路素(casin)、膠、明膠、植物膠(gluten)、大豆蛋 白、海藻酸錢、海藻酸鉀、海藻酸鈉、阿拉伯膠、瓜爾膠 (guar gUm)、大豆卵磷脂、果膠酸(pectin acid)、澱粉、瓊 脂、聚丙烯酸銨、聚丙烯酸鈉、聚曱基丙烯酸銨、鉀鹽 (例如’經改質丙烯酸聚合物及共聚物)、聚羥基羧酸胺及 酿月女(諸如可購自BYK-Chemie Co.之商標名"BYK 405")、 127318.doc -17- 200903570 聚乙烯醇、乙烯系聚合物(乙烯基曱基醚/順丁烯二酸酐)、 乙烯吡咯啶酮共聚物、聚丙烯醯胺、脂肪酸醯胺或其他脂 族醯胺化合物、羧化甲基纖維素、羥甲基纖維素、羥乙基 纖維素、黃原酸纖維素、羧化澱粉、胺基甲酸酯脲、油酸 及石夕酸納。 在一些態樣中,分散劑為驗性聚合物,亦即,具有至少 一中等至強極性路易斯(Lewis)鹼性官能性可共聚單體的均 聚物、券聚物或共聚物。極性(例如,氫或離子結合能力) 常常藉由使用諸如"強"、”中等,,及,,弱"之術語來描述。描 述此專及其他溶解性術§吾之參考文獻包括"S〇ivents paint testing manual”,第 3 版,G.G. Seward,Ed.,AmericanOsaka Organic Chemical Industry Ltd. under the trade name "SpDBA", other suitable flexible mold compositions are known. Various (mercapto) acrylonitrile-based single systems are known, including (for example ): aromatic (meth)acrylic acid vinegar 'includes the present milk methyl ethyl acrylate acid, phenoxy odor b, its polyethylene glycol acrylate, nonyl phenoxy polyethylene glycol, 3 _ benzene ^ (meth) acrylate of propyl acrylate and ethoxylated ethyl modified bisphenol; hydroxyalkyl (meth) acrylate, such as 4-butyl hydroxy acrylate; alkyl diol ( Mercapto acrylate and alkoxyalkylene glycol acrylates, such as decyloxy polyethylene glycol monoacrylate and polypropylene glycol diacrylate; polycaprolactone (fluorenyl) acrylate vinegar; Alkyl carbitol (meth) acrylates such as ethyl carbitol acrylate and 2-ethylhexyl carbitol acrylate; and various polyfunctional (fluorenyl) propylene fluorenyl monomers, including 2- Butyl-2-ethyl-1,3-propanediol diacrylate and trishydroxypropylpropane tris(methyl)propane A preferred polymerizable composition for making a flexible mold is described in the published U.S. Patent Application Serial No. 2006/023 1728. Photocurable rib precursor (also known as "polymer" or , paste, and) contain at least three components in addition to the photoinitiator just described. The first component is a particulate material (eg, powder) formed of glass or ceramic. The powder will eventually be fused by firing 2 Or sintering to form a microstructure. The second component is a curable organic binder that can be formed and then hardened by curing, heating or cooling. The bonding pair I allows the water body to be formed into a hard or semi-rigid state. "Microstructure. The adhesive usually volatilizes during debonding and firing, so it can also be called short-acting viscosity CF. The second component is thinner. The thinner is usually hardened. 127318.doc 200903570 Mixture material Thereafter, the release from the mold may be promoted. Alternatively or in addition, prior to firing the microstructured ceramic material, the diluent may promote rapid and substantially complete depletion of the binder during debonding. Good to maintain Liquid, such that the diluent is phase separated from the binder material during hardening. The rib rib precursor composition preferably has a viscosity of less than 2 〇, 〇〇〇cps and more preferably less than 1 〇, 〇〇〇cps, to All of the microstructured groove portions of the flexible mold are uniformly filled with entrained air. The rib rib precursor composition preferably has a flow rate of about 2 〇 Pas to _ Pa s at a shear rate of M/sec. Viscosity 'and viscosity at i Pa ^ 2 煎 at 100/sec.. Various curable organic binders can be used. Curable organic binders can be cured, for example, by exposure to radiation or heat. The binder may comprise any combination of monomers and agglomerates as long as it has a mixture of inorganic particulate materials and has an appropriate viscosity. Usually, the binder is preferably curable by radiation in an isothermal condition, i.e., without temperature change. This reduces the risk of displacement or expansion due to the different thermal expansion characteristics of the mold and the substrate. This allows the precise placement and alignment of the mold to be maintained as the rib precursor is hardened. The release agent is not only a solvent compound of the resin. Preferably, the diluent is bathable for incorporation into the sigma in an uncured state. After curing the binder of the slurry, the diluent should be phased with the monomer and/or oligomer of the eight compartments of the tray, the wheat and the crosslinking process. Preferably, the diluent phase is divided into a liquid material to form a liquid material: the cans of the glass powder or the powder of the body of the ceramic powder is too strong. In this way, the physical integrity of the cured green state microstructure is not greatly increased even when using a slightly higher level of dilution 127318.doc 200903570 (i.e., a ratio of diluent to resin greater than about 1:3) damage. This provides two advantages. First, the diluent reduces the risk of adhering the cured adhesive material to the mold by maintaining a liquid state while the adhesive is being cured. Second, by maintaining a liquid state while hardening the binder, the diluent is phase separated from the binder material, thereby forming a diluent sac or droplets dispersed throughout the network of the cured binder matrix. And promote the debonding process. Optionally, the photocurable rib precursor composition may comprise a dispersing agent and/or a thixotropic agent. Each of these additives can be used in an amount of from about 0.05% by weight to about 2.0% by weight of the total ribbed precursor composition. Typically, the amount of each of these additives is no greater than about 〇·5 weight ❶/〇. In addition, the rib precursor may comprise a tackifier such as a smouldering coupler to promote adhesion to a substrate (e.g., a glass panel of a PDP). The rib precursors may also optionally include various additives including, but not limited to, surfactants, catalysts, and the like, which are known in the art. The substantially s ' inorganic thixotrope gum may comprise clay (e.g., bentonite), shixi stone 'mica, montmorillonite, and the others' having a particle size less than 〇·1 μπι. In general, 'organic thixotropes can include fatty acids, fatty acid amines, hydrogenated sesame oil, casin, gums, gelatin, gluten, soy protein, alginic acid money, potassium alginate, sodium alginate. , gum arabic, guar gum (guar gUm), soy lecithin, pectin acid, starch, agar, ammonium polyacrylate, sodium polyacrylate, ammonium polythiolate, potassium salt (eg 'modified Acrylic polymers and copolymers), polyhydroxycarboxylic acid amines and brewed women (such as the trade name BYK-Chemie Co. "BYK 405"), 127318.doc -17- 200903570 polyvinyl alcohol, vinyl Polymer (vinyl mercapto ether / maleic anhydride), vinyl pyrrolidone copolymer, polypropylene decylamine, fatty acid decylamine or other aliphatic decylamine compound, carboxylated methyl cellulose, hydroxymethyl fiber , hydroxyethyl cellulose, cellulose xanthate, carboxylated starch, urethane urea, oleic acid and sodium alginate. In some aspects, the dispersing agent is an inspective polymer, i.e., a homopolymer, a valence polymer or a copolymer having at least one medium to strong polar Lewis basic functional copolymerizable monomer. Polarity (eg, hydrogen or ionic binding capacity) is often described by the use of terms such as "strong", "medium," and "weak". Describes this and other solubility techniques. "S〇ivents paint testing manual", 3rd edition, GG Seward, Ed., American

Society for Testing and Materials,Philadelphia, Pennsylvania 及"A three-dimensional approach to solubility" ’ Journal of Paint Technology,第 38卷,第 496 5虎,弟269至280頁。已知各種驗性聚合物分散劑,諸如可 以商標名"Ajisper PB 821"購自 Ajinomoto-Fine-Techno Co. 之基於陰離子聚醯胺的聚合分散劑。 在其他實施例中,可使用酸性聚合物作為分散劑。舉例 而言,翼肋前驅物可包含〇_1至1重量份的基於磷之化合 物’其具有單獨地或與0.1至1重量份的基於磺酸鹽之化合 物組合的至少一磷酸基團。此等化合物描述於W〇 2005/0 19934中。用作分散劑之其他酸性聚合物可購得, 諸如以商標名"SolPlus D520”購自Noveon。 翼肋前驅物組合物中的可固化有機黏合劑的量通常為至 127318.doc •18- 200903570 少2重量%,更通常至少5重量%,且更通常至少丨〇重量 %。翼肋前驅物組合物中的稀釋劑的量通常為至少2重量 % ’更通常至少5重量% ’且更通常至少丨〇重量%。有機組 伤之總置通常為至少10重量。/。、至少15重量%或至少20重 量%。此外,有機化合物之總量通常不大於50重量%。無 機试粒材料之量通常為至少40重量%、至少5〇重量%,或 至少60重量%。無機微粒材料之量不大於%重量%。添加 劑之量大體小於1 〇重量%。 可藉由習知混合技術來製備膏體。舉例而言,可將玻璃 或陶瓷形成微粒材料(例如,粉末)與稀釋劑及分散劑以約 1 〇至15重量份的稀釋劑比進行組合;繼而添加其餘膏體成 份。通常將膏體過濾至5微米。 在較佳實施例中,可撓性模具可再使用。可撓性模具可 再使用之次數與製造微結構之方法中所使用的翼肋前驅物 組合物有關。藉由如本文中所述而恰當選擇翼肋前驅物組 合物γ可撓性模具可再使用至少丨次再使用至至少5次再使 用之範圍中的任何次數。在較佳實施例中,聚合性轉印模 =可再使用至少1()次,至少15次,至少2〇次或至少3〇次。、 田可撓I1生模具之微結構化表面的膨脹程度小於丄㈣,且更 通 於5%(如可藉由以顯微鏡進行之視覺檢測來確定 時,可再使用轉印模具。 對於翼肋前驅物經由姑· M @ a τ* 切厶宙可撓性模具而固化之實施例,當 棱性M具足夠透料,可撓性模具適於再使用。足夠透明 之可撓性核具通f在—次使用後具有小於⑽、較佳 127318.doc •19· 200903570 10%且更佳不大於5%混濁度 土卡旦、,、 1如根據實例中描述之測試方 法來量測)。甚至更佳地,可 挽f生模具在至少5次再使用後 具有剛剛描述之混濁度準則。 丹便用後 在較佳實施例中’翼肋前驅物包含溶解性參數小於可固 化有機黏合劑之稀釋劑。 各種單體之溶解性參數δί # x /数傯耳塔)可習知地使用下式來 計算: δ=(ΔΕν/ν)1/2, 其中ΔΕν為給定溫度下之汽仆栌旦 ηΛ , 又r又/飞化此里,且ν為相應莫耳體 積。根據Fedors方法,可藉由化學結構來計算sp (R.F.Fedors, P〇lym. Eng. Set,14(2),M147W > 1974 «Society for Testing and Materials, Philadelphia, Pennsylvania and "A three-dimensional approach to solubility" ’ Journal of Paint Technology, Vol. 38, 496 5 Tiger, 269-280 pages. Various anionic polymeric dispersants are known, such as anionic polyamine-based polymeric dispersants available under the trade designation "Ajisper PB 821 " from Ajinomoto-Fine-Techno Co. In other embodiments, an acidic polymer can be used as a dispersing agent. For example, the rib precursor may comprise from 1 to 1 part by weight of the phosphorus-based compound' having at least one phosphate group, either alone or in combination with from 0.1 to 1 part by weight of the sulfonate-based compound. These compounds are described in W〇 2005/0 19934. Other acidic polymers used as dispersants are commercially available, such as from Noveon under the trade name "SolPlus D520." The amount of curable organic binder in the rib precursor composition is typically up to 127318.doc • 18- 200903570 2% by weight, more usually at least 5% by weight, and more usually at least 丨〇% by weight. The amount of diluent in the rib rib precursor composition is typically at least 2% by weight 'more usually at least 5% by weight' and more Usually at least 丨〇% by weight. The total set of organic group damage is usually at least 10% by weight, at least 15% by weight or at least 20% by weight. Further, the total amount of organic compounds is usually not more than 50% by weight. Inorganic test material The amount is usually at least 40% by weight, at least 5% by weight, or at least 60% by weight. The amount of the inorganic particulate material is not more than % by weight. The amount of the additive is substantially less than 1% by weight. Preparing a paste. For example, a glass or ceramic-forming particulate material (eg, a powder) may be combined with a diluent and a dispersant in a diluent ratio of from about 1 Torr to 15 parts by weight; Ingredients. The paste is typically filtered to 5 microns. In a preferred embodiment, the flexible mold can be reused. The number of times the flexible mold can be reused is combined with the rib precursor used in the method of fabricating the microstructure. Depending on the preferred embodiment, the ribbed precursor composition gamma flexible mold can be reused at any number of times from at least one re-use to at least five re-uses. Medium, polymerizable transfer mold = can be reused at least 1 () times, at least 15 times, at least 2 times or at least 3 times. The microstructure of the Tianke's I1 mold is less than 丄 (4). And more than 5% (if it can be determined by visual inspection with a microscope, the transfer mold can be reused. For the rib precursor to be cured by the Gu M @ a τ* cutting 可 flexible mold In an embodiment, the flexible mold is suitable for reuse when the prismatic M is sufficiently permeable, and the flexible core is sufficiently transparent to have less than (10), preferably 127318.doc • 19·200903570 after the use. 10% and more preferably no more than 5% turbidity, turbid, 1, and 1 The test method described in the examples is to measure.) Even more preferably, the mold can have the turbidity criterion just described after at least 5 re-uses. After use, in the preferred embodiment, the rib precursor is used. The material contains a diluent having a solubility parameter smaller than that of the curable organic binder. The solubility parameter of each monomer δί # x / 偬 塔 ) can be calculated by the following formula: δ = (ΔΕν / ν) 1 / 2, where ΔΕν is the steam servant ηΛ at a given temperature, and r is/flying here, and ν is the corresponding molar volume. According to the Fedors method, the chemical structure can be used to calculate sp (RFFedors, P 〇lym. Eng. Set,14(2),M147W > 1974 «

Polymer Handbook 第 4版,由 j.Brandrup、E H Jmmergut及 E.A.Grulke編輯之 ”Solubility Parameter Values”)。 可固化黏合劑與稀釋劑之溶解性參數之間的差為至少i [MJ/m3]1’2 ’且通常至少2 [MJ/m3]w2。可固化黏合劑與稀 釋劑之溶解性參數之間的差較佳為至少3 [Μ"〆]!/2、4 [MJ/m3]"2或5 [MJ/m3]1/2。可固化黏合劑與稀釋劑之溶解 性參數之間的差更佳為至少6 [MJ/m3]1,2、7 [MJ/m3]"2或8 [MJ/m3]1/2。 可視可固化有機黏合劑之選擇而使用各種有機稀釋劑。 大體而言,適當稀釋劑包括各種醇及二醇,諸如伸烷基二 醇(例如’乙二醇、丙二醇、三丙二醇)、烷基二醇(例如, 1,3丁二醇)及烷氧基醇(例如,2-己氧基乙醇2-(2-己氧基) 乙醇、2-乙基己氧基乙醇);醚,諸如二伸烧基二醇烧基醚 127318.doc -20- 200903570 (例如,二乙二醇單乙基醚、二丙二醇單丙基醚、三丙二 醇單甲基醚);酯’諸如乳酸酯及乙酸酯,且詳言之二烷 二醇烧基趟乙酸酯(例如,二乙二醇單乙基鍵乙酸酯);破 轴酸烷基酯(例如,琥珀酸二乙酯),戊二酸烷基酯(例如, 戊一酸二乙醋)及已二酸烧基酯(例如,已二酸二乙酯)。 基於微結構之最終應用及微結構將黏附的基板之性質來 選擇玻璃或陶瓷形成微粒材料(例如,粉末)。一考慮因素 為基板材料(例如’ PDP之玻璃面板)之熱膨脹係數(CTE)。 較佳地,本發明之漿體的玻璃或陶瓷形成材料的CTE與基 板材料(例如,PDP之電極圖案化玻璃面板)之cte的差異 不大於10%。當基板材料具有遠小於或遠大於微結構的陶 瓷材料之CTE的CTE時,微結構可能在處理期間翹曲、爆 裂、破裂、移位或自基板完全脫落。此外,基板可能歸因 於基板與經燒製微結構之間的高CTE差異而翹曲。適用於 本發明之激體中的無機微粒材料較佳具有約5 X 10_6厂〇至 i3xi(r6/°c之熱膨脹係數。 L用於本發明之衆體中的玻璃及/或陶究材料通常具有 低於約600t且通常高於4〇〇t之軟化溫度。陶瓷粉末之軟 化伽·度指不熔合或燒結粉末材料所必須達到的溫度。基板 大體具有高於翼肋前驅物之陶瓷材料的軟化溫度之軟化溫 度。選擇具有低軟化溫度之玻璃及/或陶瓷粉末允許使用 亦具有相對較低軟化溫度的基板。 適田組合物包括(例如)i)ZnO與B2〇3 ; ii)Ba〇與B2〇3 ;Polymer Handbook 4th Edition, "Solubility Parameter Values" edited by j.Brandrup, E H Jmmergut and E.A. Grulke). The difference between the solubility parameters of the curable binder and the diluent is at least i [MJ/m3] 1'2 ' and usually at least 2 [MJ/m3] w2. The difference between the solubility parameters of the curable binder and the diluent is preferably at least 3 [Μ"〆]!/2, 4 [MJ/m3]"2 or 5 [MJ/m3] 1/2. The difference between the solubility parameters of the curable binder and the diluent is preferably at least 6 [MJ/m3] 1, 2, 7 [MJ/m3] " 2 or 8 [MJ/m3] 1/2. Various organic diluents can be used depending on the choice of curable organic binder. In general, suitable diluents include various alcohols and diols such as alkylene glycols (eg, 'ethylene glycol, propylene glycol, tripropylene glycol), alkyl diols (eg, 1,3 butanediol), and alkoxylates. Alcohol (for example, 2-hexyloxyethanol 2-(2-hexyloxy)ethanol, 2-ethylhexyloxyethanol); ether, such as di-alkyl diol alkyl ether 127318.doc -20- 200903570 (for example, diethylene glycol monoethyl ether, dipropylene glycol monopropyl ether, tripropylene glycol monomethyl ether); esters such as lactate and acetate, and in detail dialkyl glycol alkyl hydrazine Acetate (eg, diethylene glycol monoethyl carboxy acetate); alkyl stearate (eg, diethyl succinate), alkyl glutarate (eg, pentane monoacetate) And hexanoic acid ester (for example, diethyl adipate). The glass or ceramic is selected to form a particulate material (e.g., a powder) based on the final application of the microstructure and the nature of the microstructure to which the microstructure will adhere. A consideration is the coefficient of thermal expansion (CTE) of the substrate material (e.g., the glass panel of the 'PDP). Preferably, the CTE of the glass or ceramic forming material of the slurry of the present invention differs from the cte of the substrate material (e.g., the electrode patterned glass panel of the PDP) by no more than 10%. When the substrate material has a CTE that is much smaller or much larger than the CTE of the ceramic material of the microstructure, the microstructure may warp, burst, crack, shift, or completely fall off the substrate during processing. In addition, the substrate may be warped due to high CTE differences between the substrate and the fired microstructure. The inorganic particulate material suitable for use in the excimer of the present invention preferably has a coefficient of thermal expansion of from about 5 X 10_6 to i3xi (r6/°c. L) is generally used in the glass and/or ceramic materials of the present invention. A softening temperature of less than about 600 t and usually greater than 4 〇〇 t. The softening gamma of a ceramic powder refers to the temperature that must be achieved without fusing or sintering the powder material. The substrate generally has a ceramic material that is higher than the rib precursor. Softening temperature softening temperature. Selection of glass and/or ceramic powders having a low softening temperature allows the use of substrates which also have a relatively low softening temperature. Suitable compositions include, for example, i) ZnO and B2〇3; ii) Ba〇 With B2〇3;

Ui)Zn〇 ' Ba〇^B2〇3 ; iv)La2〇3^B2〇3 ; A ν)Α12〇3 . ZnO 127318.doc -21 · 200903570 與P2〇5。可藉由將一定量的錯、絲或磷併入材料中來獲得 較低軟化溫度陶究材料。其他低軟化溫度陶究材料在^項 技術中係已知的。可將其他完全可溶、不可溶或部分可溶 的組份併人漿體之陶曼材料中以獲得或修改各種性質。' 翼肋前驅物的微粒狀玻璃或陶瓷形成材料的較佳大小視 待於圖案化基板上形成並對準之微結構的大小而定。顆粒 之平均大小❹徑it常不大於待形成並對準 < 微結構的所 關注最小特性尺寸之大小的約1〇%至ls%。舉例而言,對 於PDP阻隔翼肋而言,平均粒徑通常不大於約2或3微米。 用於製造模具或在製造陶瓷微結構中用作黏合劑之光可 固化可聚合組合物較佳包含一或多種光引發劑,其濃度在 可聚合樹脂組合物之〇·05重量%至5重量%之範圍内。適當 光引發劑包括(例如)2·羥基-2-甲基-1-苯基丙烷酮;^ [4 (2經基乙乳基)_本基]_2_經基_2_曱基_ι_丙院_ι__ ; 2,2_ 一甲氧基_〗,2-—笨基乙燒-1-闕;2-甲基_1-[4-(甲硫基)苯 基]-2-嗎啉基_ 1 _丙酮;及其混合物。適當光引發劑組合描 述於美國專利第6M3952號及2006年10月5日申請之申請中 的美國專利申請案第1 1/538933號中。Ui)Zn〇 ' Ba〇^B2〇3 ; iv)La2〇3^B2〇3 ; A ν)Α12〇3 . ZnO 127318.doc -21 · 200903570 and P2〇5. A lower softening temperature ceramic material can be obtained by incorporating a certain amount of mis, silk or phosphorus into the material. Other low softening temperature ceramic materials are known in the art. Other fully soluble, insoluble or partially soluble components can be incorporated into the human slurry of the Tauman material to obtain or modify various properties. The preferred size of the particulate glass or ceramic forming material of the rib precursor depends on the size of the microstructure formed and aligned on the patterned substrate. The average size of the particles is often no greater than about 1% to ls% of the size of the smallest characteristic size to be formed and aligned to the microstructure. For example, for PDP barrier ribs, the average particle size is typically no greater than about 2 or 3 microns. The photocurable polymerizable composition for use in the manufacture of a mold or as a binder in the manufacture of a ceramic microstructure preferably comprises one or more photoinitiators at a concentration of from 0.05% by weight to 5 parts by weight of the polymerizable resin composition. Within the range of %. Suitable photoinitiators include, for example, 2·hydroxy-2-methyl-1-phenylpropanone; ^[4 (2-based ethyl lactyl)-benzyl]_2_trans-base_2_mercapto-_ι _丙院_ι__ ; 2,2_ monomethoxy _, 2-- phenyl Ethylene-1-yl; 2-methyl-1-[4-(methylthio)phenyl]-2-? Lolinyl _ 1 _ acetone; and mixtures thereof. A suitable photoinitiator combination is described in U.S. Patent Application Serial No. 1 1/538,933, the entire disclosure of which is incorporated herein by reference.

可用於本文所描述之本發明中的各種其他態樣在此項技 術中係已知的’包括(但不限於)以下專利中之每一者:美 國專利第6,247,986號;美國專利第6,537,645號;美國專利 第 6,352,763 號;U.S. 6,843,952、U.S. 6,306,948 ; WO 99/60446 ; WO 2004/062870 ; WO 2004/007166 ; WOVarious other aspects that may be used in the present invention as described herein are known in the art including, but not limited to, each of the following patents: U.S. Patent No. 6,247,986; U.S. Patent No. 6,537,645; US Patent No. 6,352,763; US 6,843,952, US 6,306,948; WO 99/60446; WO 2004/062870; WO 2004/007166; WO

03/032354 ; WO 03/032353 ; WO 2004/010452 ; WO 127318.doc •22· 200903570 2004/064104 ;美國專利第6,761,607號;美國專利第 6,821,178 號;WO 2004/043664 ; WO 2004/062870 ; W02005/042427 ; W02005/019934 ; W02005/021260 ;及 W02005/013308。 藉由以下非限制性實例來說明本發明。 實例: 吸濕性聚合性支撐件預調節 作為用於製造模具之吸濕性聚合性支撐件,具有250微 米厚之聚酯薄膜的4個不同樣本(商標名:Tetron film HS250,由Teijin Dupont Film製造)各自使用3種不同預調 節環境來預調節24小時。 支撐件預調節A : 22°C/55%RH 支撐件預調節B : 22°C/58%RH 支撐件預調節C : 22°C/61%RH 母工具之製備 製備具有晶格型PDP阻隔翼肋圖案之母工具。如WO 2005/013308及公開的美國專利申請案第U.S. 2005/ 0206034-A1號中所述,使用聚矽氧材料及不鏽鋼基板,自 金屬母工具製造矩形轉印模具。單元間距在較長側之方向 上為0.270 mm,且在較短側之方向上為0.808 mm。 可撓性模具之製備 如下製備用作模具之賦形層的光可固化樹脂: 脂族族丙烯酸胺基曱酸酯寡聚物 80份 (由 Daicel UCB 製造之 Ebecryl (EB) 8402) 127318.doc -23- 200903570 經内酯改質之丙稀酸酿單體 20份 (由 Daicel UCB 製造之 FA2D) 光引發劑 1份 (由 Chiba-Geigy製造之Irgacure 2959) 樹脂之黏度為l〇,000 CPS(具有5號軸之Brookfield黏度 計,以2〇rpm之旋轉速度)。 在四個獨立的實驗中’將此樹脂塗佈於工具之微始構彳 表面上,使得微结構化表面之凹部得以填充。 在具有與用於預調節PET支撐薄膜之溫度及相對濕度相 同的溫度及相對濕度的環境中將經預調節之聚酯薄膜中& 每一者層壓至填充有光可固化樹脂之工具表面。藉由彳吏用 , 由 低壓汞燈(化學用燈,輻射波長:300 nm至4〇〇 nm Mitsubishi Osram製造),藉由照射通過經預調節之聚醋薄 膜支撐件的3,000 mJ/cm2的UV來光固化樹脂。接著自工具 移除模具。 第一溫度及RH(亦即,模具製 造環境之溫度及RH) 在22°C/55%RH(亦即,第二溫度 及RH)下的微結構之間距 比較實例-22°C/55%RH 一__ 相同轉印模具及母工具 一 22〇C/58%RH -在長度方向上·9 ppm間距 -在寬度方向上-14 ppm間距 22〇C/61%RH -在長度方向上-28 ppm間距 -在寬度方向上-33 ppm間距 結果展示,間距可調整每度相對濕度約5 ppm。 【圖式簡單說明】 圖1為適用於製造阻隔翼肋之說明性可撓性模具的透視 圖。 127318.doc -24- 200903570 圖2為適用於製造圖丨之可撓性模具之說明性轉印模具的 透視圖。 圖3A至圖3C為依次展示自轉印模具製造可撓性模具之 說明性方法的剖視圖。 圖4A至圖4C依次為藉由使用可撓性模具製造精細結構 (例如’阻隔翼肋)之說明性方法的剖視圖。 【主要元件符號說明】 41 基板 43 滚筒 45 阻隔翼肋前驅物 100 可撓性模具 110 平面支撐層 120 賦形層 125 试結構化圖案 200 轉印模具或母模具 350 可聚合樹脂組合物 380 支撐件/支撐薄膜 127318.doc •25-WO 03/032353; WO 2004/010452; WO 127318.doc • 22·200903570 2004/064104; U.S. Patent No. 6,761,607; U.S. Patent No. 6,821,178; WO 2004/043664; WO 2004/062870; W02005/042427; W02005/019934; W02005/021260; and W02005/013308. The invention is illustrated by the following non-limiting examples. Example: Hygroscopic polymeric support pre-conditioning As a hygroscopic polymeric support for the manufacture of molds, 4 different samples of 250 micron thick polyester film (trade name: Tetron film HS250, by Teijin Dupont Film) The manufacturing) was preconditioned for 24 hours using 3 different preconditioning environments. Support pre-adjustment A : 22°C/55%RH Support pre-adjustment B : 22°C/58%RH Support pre-adjustment C : 22°C/61%RH Master tool preparation with lattice-type PDP barrier The mother tool of the rib pattern. A rectangular transfer mold is fabricated from a metal master tool using a polyoxyxylene material and a stainless steel substrate as described in WO 2005/013308 and U.S. Patent Application Serial No. U.S. The cell pitch is 0.270 mm in the direction of the longer side and 0.808 mm in the direction of the shorter side. Preparation of Flexible Mold The photocurable resin used as the shaped layer of the mold was prepared as follows: 80 parts of aliphatic amide phthalate oligomer (Ebecryl (EB) 8402 manufactured by Daicel UCB) 127318.doc -23- 200903570 20 parts of lactone-modified monomer (FA2D manufactured by Daicel UCB) 1 part of photoinitiator (Irgacure 2959 by Chiba-Geigy) The viscosity of the resin is l〇,000 CPS (Brookfield viscometer with a 5th axis, rotating at 2 rpm). This resin was applied to the surface of the micro-structure of the tool in four separate experiments so that the recess of the microstructured surface was filled. The preconditioned polyester film is laminated to the surface of the tool filled with the photocurable resin in an environment having the same temperature and relative humidity as the temperature and relative humidity for preconditioning the PET support film. . By using a low-pressure mercury lamp (chemical lamp, radiation wavelength: 300 nm to 4 〇〇 nm Mitsubishi Osram), by irradiating 3,000 mJ/cm2 of UV through a preconditioned polyester film support. Light curing resin. Then remove the mold from the tool. The first temperature and RH (ie, the temperature of the mold manufacturing environment and RH) are between 22 ° C / 55% RH (ie, the second temperature and RH) microstructure comparison between the examples - 22 ° C / 55% RH a __ same transfer mold and master tool 22 〇C/58%RH - 9 ppm pitch in the length direction - 14 ppm pitch in the width direction 22 〇 C / 61% RH - in the length direction - 28 ppm Spacing - Shows -33 ppm pitch in the width direction. The spacing can be adjusted to approximately 5 ppm per degree of relative humidity. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of an illustrative flexible mold suitable for use in the manufacture of barrier ribs. 127318.doc -24- 200903570 Figure 2 is a perspective view of an illustrative transfer mold suitable for use in making flexible molds of the drawings. 3A to 3C are cross-sectional views sequentially showing an illustrative method of manufacturing a flexible mold from a transfer mold. 4A through 4C are, in order, cross-sectional views of an illustrative method of fabricating a fine structure (e.g., 'blocking rib) using a flexible mold. [Major component symbol description] 41 Substrate 43 Roller 45 Barrier rib precursor 100 Flexible mold 110 Planar support layer 120 Shaped layer 125 Test structure pattern 200 Transfer mold or master mold 350 Polymerizable resin composition 380 Support /Support film 127318.doc •25-

Claims (1)

200903570 十、申請專利範圍: 1 · 一種產生一微結構化物品 又万法,其包含以下步驟: 徒供一包含一吸溻性*拎 、w 牙件之模具,其中該模具係在 第一 /皿度及相對濕度下製備; 在苐一溫度及相對渴;θ: π # 儿主 '、、又下於一基板與該模具之微結構 化表面之間提供_开& ’、 化陶瓷膏體材料,該第二溫度及 相對濕度在溫度、濕度或复_ 次,、—組合上與該第一溫度及濕 度不同; 固化該材料’從而形成與該基板整體地黏合之微結 構;及 自該微結構化物品移除該模具。 2.如請求们之方法,其中製備該模具包含提供一具有一 微結構化表面之聚合性轉印模具或母模具; '、在。亥模具之該微結構化表面的凹部中提供一可聚 合樹脂組合物; 將該經預調節之支禮件摊聂2P # 日 又?牙仔堆疊至該模具之該微結構化表 面上; 固化該可聚合樹脂組合物;及 自該模具移除該經固化可聚合樹脂組合物連同該支撐 件’藉此形成一可撓性模具。 3.如請求項2之方法,#中該轉印模具或母模具之該微結 構化表面包含以一間距安置之微結構,且該第一溫度或 相對濕度調整該等微結構之該間距。 4_如5月求項2之方法中該轉印模具或母模具之該微結 127318.doc 200903570 構化表面具有一間距大於一目標間距之微結構。 5. 如請求項4之方法,其中該第一相對濕度比該第二相對 濕度高1%至40%。 6. 如請求項4之方法,其中該第一相對濕度比該第二相對 濕度兩1 %至1 〇 %。 7. 如請求項4之方法,其中該第一相對濕度比該第二相對 濕度高1 °/。至5 。 8. 如請求項2之方法,丨中該轉印模具或母模具具有1 距小於一目標間距之微結構。 9·如請求項8之方法’其中該第一相對濕度比該第二相對 濕度低1 %至4 〇 。 10. 如π求項8之方法,其中該第一相對濕度比該第二相對 濕度低1 %至1 〇 %。 11. 如„月求項8之方法’其中該第一相對濕度比該第二相對 濕度低1%至5%。 月长項2之方法,其中該可聚合組合物包含至少—種 烯系不飽和寡聚物與至少一種烯系不飽和單體之反應產 13.如請求項12之方法’其中該募聚物包含一胺基甲 基)丙烯酸酯寡聚物。 14 ·如請求項1 t、、+ ,其中該固化包含穿過該模具、穿 該基板或其組合而進行光@化。 過 15.如請求们之方法’其中該基板為一顯示面板 件且該等微結構 127318.doc 200903570 弟一溫度相 1 6.如請求項1之方法,其中該第一溫度與 同。 127318.doc200903570 X. Patent application scope: 1 · A method for producing a microstructured article, which comprises the following steps: a mold containing a sucking *拎, w tooth piece, wherein the mold is first/ Prepared under the degree of dish and relative humidity; at the temperature of the first temperature and relatively thirsty; θ: π # 母主', and under a substrate and the microstructured surface of the mold to provide _ open & ', ceramic paste a bulk material, the second temperature and relative humidity are different from the first temperature and humidity in temperature, humidity, or combination; curing the material to form a microstructure integrally bonded to the substrate; The microstructured article removes the mold. 2. The method of claimant, wherein preparing the mold comprises providing a polymeric transfer mold or master mold having a microstructured surface; A polymerizable resin composition is provided in the recess of the microstructured surface of the mold; the pre-adjusted cake is spread 2P #日? The dent is stacked onto the microstructured surface of the mold; the polymerizable resin composition is cured; and the cured polymerizable resin composition is removed from the mold together with the support' thereby forming a flexible mold. 3. The method of claim 2, wherein the microstructured surface of the transfer mold or master mold comprises microstructures disposed at a pitch, and the first temperature or relative humidity adjusts the pitch of the microstructures. 4_ The microjunction of the transfer mold or the master mold in the method of the second aspect of the present invention. 127318.doc 200903570 The structured surface has a microstructure having a pitch greater than a target pitch. 5. The method of claim 4, wherein the first relative humidity is between 1% and 40% higher than the second relative humidity. 6. The method of claim 4, wherein the first relative humidity is between 1% and 1% by weight of the second relative humidity. 7. The method of claim 4, wherein the first relative humidity is 1 °/ higher than the second relative humidity. To 5 . 8. The method of claim 2, wherein the transfer mold or the master mold has a microstructure having a distance less than a target pitch. 9. The method of claim 8, wherein the first relative humidity is 1% to 4 低 lower than the second relative humidity. 10. The method of claim 8, wherein the first relative humidity is between 1% and 1% lower than the second relative humidity. 11. The method of [Section 8] wherein the first relative humidity is 1% to 5% lower than the second relative humidity. The method of Moon Length 2, wherein the polymerizable composition comprises at least one type of olefinic system Reaction of a saturated oligomer with at least one ethylenically unsaturated monomer. 13. The method of claim 12 wherein the polymer comprises an aminomethyl acrylate oligomer. And, wherein the curing comprises passing light through the mold, through the substrate, or a combination thereof. 15. The method of claim [wherein the substrate is a display panel member and the microstructures 127318.doc 200903570 弟一温相相1 6. The method of claim 1, wherein the first temperature is the same as 127318.doc
TW96146559A 2006-12-07 2007-12-06 Method of molding barrier ribs with hygroscopic polymeric molds TW200903570A (en)

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US6352763B1 (en) * 1998-12-23 2002-03-05 3M Innovative Properties Company Curable slurry for forming ceramic microstructures on a substrate using a mold
US7176492B2 (en) * 2001-10-09 2007-02-13 3M Innovative Properties Company Method for forming ceramic microstructures on a substrate using a mold and articles formed by the method
JP3986386B2 (en) * 2002-07-17 2007-10-03 スリーエム イノベイティブ プロパティズ カンパニー Manufacturing method of fine structure

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