TW200902202A - Target material backing plate with an embedded cooling passage and manufacturing method thereof - Google Patents
Target material backing plate with an embedded cooling passage and manufacturing method thereof Download PDFInfo
- Publication number
- TW200902202A TW200902202A TW96124834A TW96124834A TW200902202A TW 200902202 A TW200902202 A TW 200902202A TW 96124834 A TW96124834 A TW 96124834A TW 96124834 A TW96124834 A TW 96124834A TW 200902202 A TW200902202 A TW 200902202A
- Authority
- TW
- Taiwan
- Prior art keywords
- groove
- cover plate
- cover
- plate
- built
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000013077 target material Substances 0.000 title abstract 2
- 238000003466 welding Methods 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 31
- 238000003756 stirring Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 3
- 241001125620 Dermochelys coriacea Species 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 238000010276 construction Methods 0.000 description 8
- 239000011324 bead Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 241000221035 Santalaceae Species 0.000 description 1
- 235000008632 Santalum album Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96124834A TW200902202A (en) | 2007-07-06 | 2007-07-06 | Target material backing plate with an embedded cooling passage and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96124834A TW200902202A (en) | 2007-07-06 | 2007-07-06 | Target material backing plate with an embedded cooling passage and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200902202A true TW200902202A (en) | 2009-01-16 |
| TWI322735B TWI322735B (enExample) | 2010-04-01 |
Family
ID=44721831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96124834A TW200902202A (en) | 2007-07-06 | 2007-07-06 | Target material backing plate with an embedded cooling passage and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200902202A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8627567B2 (en) | 2009-02-23 | 2014-01-14 | Nippon Light Metal Company, Ltd. | Manufacturing method of liquid-cooled jacket |
| CN103769742A (zh) * | 2012-10-19 | 2014-05-07 | 倍亿淂科技股份有限公司 | 制造水冷式散热器的方法及其所制成的水冷式散热器 |
| CN107225221A (zh) * | 2017-07-21 | 2017-10-03 | 四川省祥业机械铸造有限公司 | 一种曲轴箱体过桥盖板浇注系统 |
| CN111455335A (zh) * | 2020-04-24 | 2020-07-28 | 河北恒博新材料科技股份有限公司 | 一种平面靶材的绑定方法 |
| CN112676782A (zh) * | 2020-12-25 | 2021-04-20 | 宁波江丰电子材料股份有限公司 | 一种钛靶材与铜背板的装配方法 |
| CN112894291A (zh) * | 2021-03-02 | 2021-06-04 | 京浜乐梦金属科技（苏州）有限公司 | 一种工业用冷却铜背板制造方法 |
| CN116140733A (zh) * | 2023-03-20 | 2023-05-23 | 宁波江丰电子材料股份有限公司 | 一种含冷却水道靶材背板的焊接结构和焊接方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061206A (zh) * | 2016-06-29 | 2016-10-26 | 航天华盛源机电（苏州）有限公司 | 一种水冷板及其制作方法 |
| CN110560955B (zh) * | 2019-10-25 | 2021-04-02 | 宝鸡文理学院 | 一种氧化铝陶瓷与金属钼的焊接方法 |
| JP7437011B2 (ja) * | 2019-12-13 | 2024-02-22 | 京浜ラムテック株式会社 | 金属構造体の製造方法、及び金属構造体 |
-
2007
- 2007-07-06 TW TW96124834A patent/TW200902202A/zh unknown
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8627567B2 (en) | 2009-02-23 | 2014-01-14 | Nippon Light Metal Company, Ltd. | Manufacturing method of liquid-cooled jacket |
| US9233439B2 (en) | 2009-02-23 | 2016-01-12 | Nippon Light Metal Company, Ltd. | Manufacturing method of liquid-cooled jacket |
| CN103769742A (zh) * | 2012-10-19 | 2014-05-07 | 倍亿淂科技股份有限公司 | 制造水冷式散热器的方法及其所制成的水冷式散热器 |
| CN107225221A (zh) * | 2017-07-21 | 2017-10-03 | 四川省祥业机械铸造有限公司 | 一种曲轴箱体过桥盖板浇注系统 |
| CN111455335A (zh) * | 2020-04-24 | 2020-07-28 | 河北恒博新材料科技股份有限公司 | 一种平面靶材的绑定方法 |
| CN112676782A (zh) * | 2020-12-25 | 2021-04-20 | 宁波江丰电子材料股份有限公司 | 一种钛靶材与铜背板的装配方法 |
| CN112894291A (zh) * | 2021-03-02 | 2021-06-04 | 京浜乐梦金属科技（苏州）有限公司 | 一种工业用冷却铜背板制造方法 |
| CN112894291B (zh) * | 2021-03-02 | 2022-09-23 | 京浜乐梦金属科技（苏州）有限公司 | 一种工业用冷却铜背板制造方法 |
| CN116140733A (zh) * | 2023-03-20 | 2023-05-23 | 宁波江丰电子材料股份有限公司 | 一种含冷却水道靶材背板的焊接结构和焊接方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI322735B (enExample) | 2010-04-01 |
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