200850104 九、發明說明： 【發明所屬之技術領域】 本發明是關於一種軟性電路基板’特別是一種具捲繞部的 軟性電路基板與形成該捲繞部的製造方法。 【先前技術】 隨著電子科技的日新月異，人們所擁有的攜帶型電子裝置也愈 來愈多，這些攜帶型電子裝置例如為電子字典或攜帶型數位 , 撥放機。目前於市面上，電子字典-蚊由上、下兩殼體所組成曰， 亡殼體設置有螢幕，而下殼體則設置有鍵盤，幻ι殼體與下殼體 是藉由一旋轉軸而枢接在一起。而且，上殼體與下殼體分別^設 有一電路基板，以對各種電性訊號進行處理。 請參閱圖卜圖1所緣示為一電子字典的内部視圖。此電 典1=具有-上殼體110與-下殼體120，上殼體11〇與下殼體 120藉由一轉轴130而相樞接。上殼體11〇的内部具有一第—電路 基板II2,該第-電路基板m主要用於處理與螢幕輸出相關二 t性訊號。另外，下殼體120的内部具有一第二電路基板122，該第 I二電路基板m主制贼理無缝人相性峨 第-電路絲m與第二魏基板122之間，職由—軟路 基板140以進行電性訊號的傳遞。 由於設計上的關係，軟性電路基板14〇在經過轉車由13〇的 需進灯捲繞，此被捲繞的部分稱為軟性電路基板14〇的捲繞部 目前，在組裝電子字典1〇〇時，一般的做 用手在軟性電路基板14G彎折出_捲繞部142，之後二將二有』 5 200850104 Ϊ 電路基板14G的兩端分別安裝在第—電路基板112 與弟一電路基板122相連接。 合大!生產時’使用上述的方式而形成的捲繞部142， i路美；的形狀尺寸無法統—的情形，而造成某些軟性 ! 142會與轉軸130 殼體相接觸。或者， 142處’軟性電路基板14。彼此會相碰觸。而且，即使 的形狀尺寸控制得當，但是由於捲繞部142在彎折後 =有殘留應力的存在，所以時間—久後，捲繞部142還是會產 线形’而與轉轴13〇的殼體產生碰觸。如此一來，當使 體、UG時’捲繞部142便會和轉軸⑽的殼體相摩擦而 產生，進而造成使用者的困擾。 因口此，如何確保捲繞部142不會與轉車由13〇的殼體產生摩擦， 疋值得本領域具有通常知識者思量地。 【發明内容】 本發明之目的是提供一種具捲繞部的軟性電路基板及 乂 卩的製造方法，該捲繞部不會與轉軸的殼體產生摩擦。 根據上述目的與其他目的，本發_提供_種於軟性電路 土板^形成捲繞部的製造方法。此製造方法包括以下步 驟··首先，將一軟性電路基板欲捲繞的區域捲繞於一定型 ，上’以形成-捲繞部的雛型；接著，將軟性電路基板固 疋’之後，將未定型的捲繞部進行加熱直至捲繞部產生軟 化；再來，將已軟化的捲繞部進行冷卻，以形成一定型的 捲繞部；接著，將定型的捲繞部從定型棒移出。 於上述之於軟性電路基板上形成捲繞部的製造方法 6 200850104 中，定型棒是設置於一治具上，且該治具還包括至少兩個 挾持部，這些挾持部用於挾持軟性電路基板。 於上述之於軟性電路基板上形成捲繞部的製造方法 中，是利用一加熱器對該未定型的捲繞部進行加熱。加熱 器包括一上加熱模與一下加熱模，此上加熱模與下加熱模 分別具有第一溝槽與第二溝槽。其中，第一溝槽與第二溝 槽相對應，而將該未定型的捲繞部進行加熱的步驟包括： 首先，將上加熱模與下加熱模進行加熱至一預定溫度，此 預定溫度例如為180°C ;接著，將捲繞於定型棒的未定型 之捲繞部置放於上加熱模與下加熱模之間；再來，使上加 熱模與下加熱模合模，以使第一溝槽與第二溝槽的壁面對 該未定型的捲繞部進行熱壓；於一預定時間後（例如：30 秒），將上加熱模與下加熱模分模。 於上述之於軟性電路基板上形成捲繞部的製造方法 中，上加熱模與下加熱模分別具有一溫度感應器，此溫度 感應器是分別設置於第一溝槽與第二溝槽的鄰近處。 根據上述目的與其他目的，本發明提供一種具捲繞部的 軟性電路基板，此軟性電路基板的捲繞部是由上所述的製 造方法所製成。 由於捲徺部於加熱後，會將捲繞部的殘留應力去除，所 以相較於習知的捲繞部，本實施例之捲繞部較不會於長久 使用後產生變形。而且，使用定型棒對捲繞部的外形進行 界定，可使所產出的捲繞部之形狀尺寸較精不會有形狀尺寸不 一的情形。 為讓本發明之上述目的、特徵和優點更能明顯易懂，下 7 200850104 文將以實施例並配合所附圖示，作詳細說明如下。 【實施方式】 請參閱圖2,圖2所繪示為用於在軟性電路基板上形成 捲繞部的治具。此治具10的外形呈一 U字形的形狀，治 具10的中間部分具有一開口 12，於此開口 12處設置有一 定型棒14，此定型棒14是穿設於治具10上。此外，在治 具10的兩端則分別設有一挾持部16，用以挾持一軟性電 路基板240 (如圖4A所繪示）。 請參閱圖3，圖3所繪示為一加熱器，此加熱器20是 用於對軟性電路基板上之未定型的捲繞部進行加熱。加熱 器20包括一上加熱模22與一下加熱模24，此上加熱模22 與下加熱模24分別連接有加熱管（未繪示），此加熱管是 用以對上加熱模22與下加熱模24進行加熱。上加熱模22 與下加熱模24分別具有一第一溝槽22a與一第二溝槽 24a，此第一溝槽22a與第二溝槽24a相對應。另外，加熱 器20還包括有一垂直壁面26與兩個溫度感應器28。上加 熱模22是藉由滑接的方式設置在垂直壁面26上，可讓使 用者依需要而調整上加熱模22於垂直方向的位置。此外， 兩個溫度感應器28是分別埋設於上加熱模22與下加熱模 24且位於第一溝槽22a與第二溝槽24a的鄰近處，溫度感 應器28是用於量測第一溝槽22a與第二溝槽24a的溫度。 上述之溫度感應器28分別連接有傳輸線29，此傳輸線29 在於將溫度感應器28所量測的溫度數據傳送至外部的資 訊處理裝置（未繪示）。而且，加熱器20的兩旁分別設有 一置放平台30，圖2所示之治具10可放置在此置放平台 8 200850104 30上。 以下’將介紹如何在軟性電路基板上形成捲繞部的製造 流程，請參閱圖4A〜圖4C。請先參照圖4A，將一軟性電 路基板240中欲捲繞的區域捲繞於定型棒上，以形成一 捲繞部242的雛型。接著，將軟性電路基板24〇向兩旁拉 申，並用挾持部16將軟性電路基板240固定在治具1〇上。 接著，將加熱器20的上加熱模22與下加熱模24進行加熱 至一預定溫度，此預定溫度例如為l8(rc。 再來，請參照圖4B，將治具1〇放置於加熱器2〇的置 放平台30上，並使纏繞於定型棒14的捲繞部242位於第 一溝槽22a與第二溝槽24a (請參閱圖3)之間。 、 之後’請同時參照圖4C與圖5，將上加熱模22下移以 使其與下加熱模24進行合模。此時，第一溝槽22a與第二 溝槽24a的壁面會對捲繞部242進行熱壓（如圖5所示 持績一預定時間（約30秒）後，再將上加熱模22往上移， 並將軟化的捲繞部242從加熱器20移出。 接著，將軟化的捲繞部242進行冷卻。軟化的捲繞部 242可於至溫中進行冷卻，或者將軟化的捲繞部μ】放在 較室溫低的環境下進行冷卻。待冷卻完成後，便可調整挾 持部16以讓軟性電路基板24〇鬆脫，並將捲繞部242從定 型棒14移出’便完成了具有一定型的捲繞部242之軟性電 路基板240的製作（請參照圖6)。之後，電子字典1〇〇 (如圖 1所示）的組裝人員便可將軟性電路基板240組裝在電子字典 100 上。 /、 由於捲繞部242進行加熱後，會將捲繞部242的殘留應 9 200850104 力去除，所以相較於習知的捲繞部142，本實施例之捲繞 部242較不會於長久使用後產生變形。而且，使用定型棒 14對捲繞部242的外形進行界定，可使所產出的捲繞部242 較不會有形狀尺寸不一的情形。另外，藉由第一溝槽22a與第 二溝槽24a的壁面對捲繞部2U進行熱壓，可以使捲繞邙 242的形狀更加符合所需。因此，本實施例之軟性電 板240組裝於電子字典1〇〇後，其捲繞部2犯較不會與= 130的殼體相摩擦而產生噪音。 、 r i. 當然，本領域具有通常知識者可調整定型棒14的形狀 尺寸，而製作出其他形狀尺寸的捲繞部242。而且，在上 述的實施例中’捲繞部242雖只進行單圈的捲繞，但 域具有通常知識讀可對其進行乡_ 。此外，本領、 域^有通常知識者也可❹具有加熱功能蚊型棒Μ ^ 捲、W如直接進行加熱，而無需使用上述之加熱器ι ^發明以實施例說明如上，其並非用以限林發 主張之專利權利範圍。其】 太献雜太査員域疋。凡本領域具有通常知識者，在 本發明所揭示精神下所之更動或潤飾’均屬於 在下述之申請專·^成之4效改變錢計，且應包含 【圖式簡單說明】 圖1所緣示為—電子字典的内部視圖。 具。圖2所缘示為用於在軟性電路基板上形成捲繞部的治 200850104 圖3所繪示為一加熱器，此加熱器是用於對軟性電路 基板上之未定型的捲繞部進行加熱。 圖4A〜圖4C所繪示為在軟性電路基板上形成捲繞部 的製造流程。 圖5所緣示為第一溝槽與第二溝槽的壁面對捲繞部進 行熱壓的示意圖。 圖6所繪示為具有一定型的捲繞部之軟性電路基板。 #· 【主要元件符號說明】 100 :電子字典 110 :上殼體 112 :第一電路基板 12〇 ·:下殼體 122 :第二電路基板 ( 130 :轉軸 140 :軟性電路基板 M2 :捲繞部 10 :治具 12 :開口 14 :定型棒 16 :挾持部 11 200850104 20 :加熱器 22 :上加熱模 22a :第一溝槽 24 :下加熱模 24a :第二溝槽 26 :垂直壁面 28 :溫度感應器 29 :傳輸線 30 :置放平台 240 :軟性電路基板 242 :捲繞部[Technical Field] The present invention relates to a flexible circuit board, in particular, a flexible circuit board having a winding portion and a method of manufacturing the same. [Prior Art] With the rapid development of electronic technology, there are more and more portable electronic devices that are available, such as electronic dictionaries or portable digital and video players. Currently in the market, the electronic dictionary-mosquito is composed of upper and lower casings, the dead casing is provided with a screen, and the lower casing is provided with a keyboard, and the imaginary housing and the lower casing are provided by a rotating shaft. And pivoted together. Moreover, the upper casing and the lower casing are respectively provided with a circuit substrate for processing various electrical signals. Please refer to Figure 1 for an internal view of an electronic dictionary. The code 1 = has an upper casing 110 and a lower casing 120, and the upper casing 11 and the lower casing 120 are pivotally connected by a rotating shaft 130. The inside of the upper casing 11A has a first circuit substrate II2, and the first circuit substrate m is mainly used for processing the t-signal associated with the screen output. In addition, the inside of the lower casing 120 has a second circuit substrate 122, and the first two circuit substrate m is mainly manufactured by the thief, the human phase is separated from the first circuit wire m and the second WE substrate 122, and the position is soft. The circuit substrate 140 is configured to transmit electrical signals. Due to the design relationship, the flexible circuit board 14 is wound by a 13-turn required lamp through the transfer, and the portion to be wound is called the winding portion of the flexible circuit board 14〇. Currently, the electronic dictionary is assembled. In the case of the first circuit board 112 and the circuit board 122, the two ends of the circuit board 14G are respectively mounted on the flexible circuit board 14G by the hand-wrapped portion 142. Connected. At the time of production, the winding portion 142 formed by the above-described method is not in the form of a shape, and some softness 142 is brought into contact with the housing of the rotating shaft 130. Alternatively, there are 142 "flex circuit boards 14". They will touch each other. Moreover, even if the shape size is properly controlled, since the winding portion 142 is bent after the presence of residual stress, the winding portion 142 is still in the shape of a linear shape and the housing of the rotating shaft 13 Produce a touch. As a result, the winding portion 142 of the body and the UG can be rubbed against the casing of the rotating shaft (10), which causes trouble to the user. Because of this, how to ensure that the winding portion 142 does not rub against the casing of the 13 转 turn, is worthy of consideration by those skilled in the art. SUMMARY OF THE INVENTION An object of the present invention is to provide a flexible circuit board having a winding portion and a method of manufacturing the same, which does not cause friction with a housing of the rotating shaft. In accordance with the above and other objects, the present invention provides a method of manufacturing a winding portion formed of a flexible circuit board. The manufacturing method includes the following steps: First, a region to be wound by a flexible circuit substrate is wound into a fixed type, and a 'formation of a winding portion is formed on the upper portion; and then, the flexible circuit substrate is fixed, and then The unformed winding portion is heated until the winding portion is softened; further, the softened winding portion is cooled to form a fixed winding portion; and then the shaped winding portion is removed from the shaping rod. In the above-mentioned manufacturing method 6 200850104 for forming a winding portion on a flexible circuit substrate, the shaping rod is disposed on a jig, and the jig further includes at least two holding portions for holding the flexible circuit substrate . In the above-described manufacturing method for forming a winding portion on a flexible circuit board, the unshaped winding portion is heated by a heater. The heater includes an upper heating die and a lower heating die, the upper heating die and the lower heating die having a first groove and a second groove, respectively. Wherein the first groove corresponds to the second groove, and the step of heating the unshaped winding portion comprises: first, heating the upper heating die and the lower heating die to a predetermined temperature, for example, the predetermined temperature, for example 180 ° C; then, the unformed winding portion wound around the shaping rod is placed between the upper heating mold and the lower heating mold; and then, the upper heating mold and the lower heating mold are combined to make the first A groove and a wall of the second groove are heat-pressed facing the unshaped winding portion; after a predetermined time (for example, 30 seconds), the upper heating die and the lower heating die are divided. In the manufacturing method of forming the winding portion on the flexible circuit substrate, the upper heating mold and the lower heating mold respectively have a temperature sensor, and the temperature sensors are respectively disposed adjacent to the first groove and the second groove. At the office. In accordance with the above and other objects, the present invention provides a flexible circuit board having a winding portion, the winding portion of which is formed by the above-described manufacturing method. Since the residual stress of the winding portion is removed after the winding portion is heated, the winding portion of the present embodiment is less deformed after long-term use than the conventional winding portion. Further, the shape of the winding portion is defined by using a sizing rod, so that the shape of the wound portion to be produced can be made finer and the shape and size are not uniform. The above objects, features and advantages of the present invention will become more apparent from the following description. [Embodiment] Please refer to Fig. 2, which is a jig for forming a winding portion on a flexible circuit board. The jig 10 has a U-shaped shape, and the intermediate portion of the jig 10 has an opening 12 at which a fixing rod 14 is disposed. The shaping rod 14 is disposed on the jig 10. In addition, a holding portion 16 is disposed at each end of the fixture 10 for holding a flexible circuit substrate 240 (as shown in FIG. 4A). Referring to Fig. 3, Fig. 3 shows a heater for heating an unformed winding portion on a flexible circuit substrate. The heater 20 includes an upper heating die 22 and a lower heating die 24, and the upper heating die 22 and the lower heating die 24 are respectively connected with a heating pipe (not shown) for heating the upper heating die 22 and the lower heating die 22 The mold 24 is heated. The upper heating die 22 and the lower heating die 24 respectively have a first groove 22a and a second groove 24a, and the first groove 22a corresponds to the second groove 24a. Additionally, heater 20 includes a vertical wall 26 and two temperature sensors 28. The upper heating die 22 is disposed on the vertical wall surface 26 by sliding, allowing the user to adjust the position of the upper heating die 22 in the vertical direction as needed. In addition, two temperature sensors 28 are respectively embedded in the upper heating die 22 and the lower heating die 24 and located adjacent to the first trench 22a and the second trench 24a, and the temperature sensor 28 is used for measuring the first trench. The temperature of the groove 22a and the second groove 24a. The above temperature sensors 28 are respectively connected with a transmission line 29 for transmitting the temperature data measured by the temperature sensor 28 to an external information processing device (not shown). Moreover, a heater platform 20 is provided with a placement platform 30 on each side thereof, and the fixture 10 shown in Fig. 2 can be placed on the placement platform 8 200850104 30. Hereinafter, a manufacturing flow of how to form a winding portion on a flexible circuit board will be described, referring to Figs. 4A to 4C. Referring first to Fig. 4A, a region to be wound in a flexible circuit substrate 240 is wound around a sizing rod to form a prototype of the winding portion 242. Next, the flexible circuit board 24 is pulled sideways, and the flexible circuit board 240 is fixed to the jig 1 by the holding portion 16. Next, the upper heating mold 22 and the lower heating mold 24 of the heater 20 are heated to a predetermined temperature, for example, 18 (rc. Further, please refer to FIG. 4B, the fixture 1 is placed on the heater 2 The winding platform 242 of the crucible is placed between the first groove 22a and the second groove 24a (see FIG. 3). Then, please refer to FIG. 5, the upper heating mold 22 is moved downward to be clamped with the lower heating mold 24. At this time, the wall surfaces of the first groove 22a and the second groove 24a are hot pressed by the winding portion 242 (as shown in the figure). After the predetermined period of time (about 30 seconds), the upper heating die 22 is moved upward, and the softened winding portion 242 is removed from the heater 20. Next, the softened winding portion 242 is cooled. The softened winding portion 242 can be cooled to a temperature, or the softened winding portion can be cooled in an environment lower than room temperature. After the cooling is completed, the holding portion 16 can be adjusted to make the softness The circuit board 24 is loosened, and the winding portion 242 is removed from the shaping rod 14 to complete the softness of the winding portion 242 having a certain type. The circuit board 240 is fabricated (please refer to Fig. 6). Thereafter, the assembler of the electronic dictionary 1 (shown in Fig. 1) can assemble the flexible circuit board 240 on the electronic dictionary 100. /, due to the winding portion 242 After the heating, the residual portion of the winding portion 242 is removed by the force of 9 200850104, so that the winding portion 242 of the present embodiment is less deformed after a long period of use than the conventional winding portion 142. The outer shape of the winding portion 242 is defined by using the shaping rod 14, so that the produced winding portion 242 is less likely to have a different shape and size. In addition, the first groove 22a and the second groove 24a are provided. The wall is heat-pressed facing the winding portion 2U, so that the shape of the winding 邙 242 can be made more suitable. Therefore, after the flexible electric board 240 of the present embodiment is assembled in the electronic dictionary, the winding portion 2 is smashed. No noise is generated by friction with the housing of = 130. r i. Of course, those skilled in the art can adjust the shape and size of the shaping rod 14 to produce the winding portion 242 of other shape sizes. In the above embodiment, the winding portion 242 is only single. Winding, but the domain has the usual knowledge to read it. In addition, the general knowledge of the domain, the domain can also have a heating function mosquito rod Μ ^, W, such as direct heating, without using the above The heater ι ^ invention is described above by way of example, and is not intended to limit the scope of patent rights claimed by Linfa. It is too much to be used in the field of general knowledge in the field of the present invention. The changes or refinements of the application are all subject to the following four-effect change plan, and should include a simple description of the drawing. Figure 1 shows the internal view of the electronic dictionary. 2 is a view for forming a winding portion on a flexible circuit substrate. 200850104 FIG. 3 is a heater for heating an unshaped winding portion on a flexible circuit substrate. . 4A to 4C are views showing a manufacturing flow for forming a winding portion on a flexible circuit board. Fig. 5 is a schematic view showing the heat of the wall of the first groove and the second groove facing the winding portion. Fig. 6 shows a flexible circuit board having a certain type of winding portion. #· [Description of main component symbols] 100: Electronic dictionary 110: Upper casing 112: First circuit substrate 12A: Lower casing 122: Second circuit substrate (130: Rotary shaft 140: Flexible circuit board M2: Winding section 10: jig 12: opening 14: shaping rod 16: holding portion 11 200850104 20: heater 22: upper heating mold 22a: first groove 24: lower heating mold 24a: second groove 26: vertical wall surface 28: temperature Inductor 29: Transmission line 30: placement platform 240: flexible circuit substrate 242: winding portion