TW200848194A - Method of making leadless solder - Google Patents

Abstract

This invention relates to a method of making a leadless solder. The leadless solder comprises, in addition to tin (Sn), 0.1 to 1.0 percent of copper (Cu), 10 to 25 percent of bismuth (Bi), and 0.1 to 3.0 percent of silver (Ag). The ingredients mentioned above are then mixed in a mixer used in the high silver content process to produce the leadless solder with low silver content. The method of this invention can be carried out with costs lower than the method for producing solder with high silver content, so the overuse of the rare resource and the environment pollution can be prevented by the low silver content. Moreover, the solder of this invention can provide a soldering effect identical to that with high silver content and can be used under a lower temperature to reduce the heat shock on the components.

Description

200848194 A 3⁄4乍 ring refers to the temperature, I-) is low (-use the source of the source to make the ball can be used to make the ground with the same low tin, welding and lead source with no knots I. Source for tin 1. The final welding has a 1 series lead-drilling field. There is no less heat-reducing technique: the silver of the technique can be a pair of children, and the phase zero is a silver. Low ^0 is low and low, and the use of lowering, hair dyeing, nine t kinds of pollution industry [previous technology] live in the middle of the child ίί?月异' and the use of electronic equipment in the 曰 Changsheng tin is quite large If the purpose of the combination, it can be seen that the welding industry, at the same time, also caused the use of the components of the daily maintenance of the work equipment under high temperature [invention content], the manufacturing method (two), such as the first _ ^(S n)E 1 f 〇ί^ The percentage of content is multiplied by two ΐϊΐ ΐϊΐ 用 with in, which can achieve the same right-hand effect as the ratio of high-content silver, and the lower temperature of the sub-Chen (four) to reduce the number of components 5 200848194 [Embodiment] The embodiment of r, = is to provide a method for manufacturing lead-free solder (2), as shown in the second figure, When the lead-free solder is manufactured, it can be composed of copper (C u ) Β, ratio of 1 〇 to 2 5 percent, and th th thJir'Q0., 1~3. 0% content of silver (Ag) D, and the remaining content of the day - mixed with 'to form - low temperature and low silver touch solder A, Gu Yi Dan Ling according to the percentage of the percentage of the mixing process, can also be used CrUf equipment, in order to save the cost of re-purchase operation, with its copper, 曰B: 1B 1 )C, silver (Ag) D and the remaining content of tin (S Π) Effectively reduces the cost of solders that must be made with high levels of silver, and produces a good ratio of content to reduce the use of rare resources and reduce the use of high-content silver in the same day. The same welding effect. The heat-solder soldering A of (2), (CU) B, secret (B i) C, silver (Ag) D, and tin (Sn) E can be used for electronic substrates, electronic parts, mixed substrates, and the like: Arrangement resistance and other related devices that must be bonded and fixed by welding method, so as to reduce the amount of rare resources and reduce environmental pollution, and at the same time achieve the same welding effect, and can operate at a lower temperature. Modifications or alterations made by those skilled in the art using the techniques and methods described herein are intended to be included in the scope of the invention. The invention further demonstrates its advancement and utility. The advantages are listed as follows: =, the same effect as the solder with high silver content. First, it can effectively reduce costs. Third, it can save the cost of re-purchase operation. Fourth, it can reduce the use of rare resources and reduce environmental pollution. 5. Use lower temperature operation to reduce the thermal shock of components. Sixth, with industrial competitiveness. VII. It has commercial value. VIII. It has novelty. According to the bite ^ soil, the invention is in line with the application requirements of the invention patent, and the law is submitted in accordance with the law, and the member of the examination committee is given the certificate and the patent right is granted. 6 200848194 [Brief Description of the Drawings] The first drawing is one of the system block diagrams of the present invention. The second drawing is a table showing the material content of the present invention. The third drawing is an embodiment of the present invention. [Main component symbol description]

No soldering.......A

Copper (C u ).......B

i).......C

Silver (A g).......D Tin (S η).......Ε

Claims (1)

200848194 X. Patent application scope: ' i (, C - manufacturing method (2), its error-free _ component contains: ^u) content is based on 〇.1~1. ◦ percentage ratio; silver (匕): branch of 1,); ratio of 1 〇 to 2 5 percent; tin (S 罝 is in 〇. 1 to 3. 0 percentage ratio; gc U ) ^, (B i ) A and Add, when welding, 'the above materials can be used according to the percentage of content can be turned without JJ (njgf low temperature low silver non-ship solder, η · and can be used for environmental pollution, to compare to reduce the rare resources The amount of use and the lower temperature of the household can be achieved with the same welding effect with the use of bismuth content of silver, one-'s work, to reduce the thermal shock of the components, to prepare for the industry It is used to make the tin soldering ratio mismatched without the amount of silver. I include the high-income project of the firm 1 to make the cost of the dime when the consumption is the same as when the profit-making special design industry, please apply for the change in the tin ^ ^, Welding saves 2 wrong knots