JP2011240352A - Lead-free solder composition for vehicle - Google Patents
Lead-free solder composition for vehicle Download PDFInfo
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- JP2011240352A JP2011240352A JP2010112823A JP2010112823A JP2011240352A JP 2011240352 A JP2011240352 A JP 2011240352A JP 2010112823 A JP2010112823 A JP 2010112823A JP 2010112823 A JP2010112823 A JP 2010112823A JP 2011240352 A JP2011240352 A JP 2011240352A
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- lead
- solder
- glass
- free solder
- mass
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
Abstract
Description
本発明は、特に自動車のガラスへのはんだ付けに適するはんだ組成物であって、無鉛であることを特徴とするものである。 The present invention is a solder composition particularly suitable for soldering to glass of an automobile, and is characterized by being lead-free.
車両にはデフォッガやアンテナを受信するため、車体とガラスの接点を取る給電端子が施され、給電端子とガラスは鉛を含むはんだによって接続されている。一般的に、鉛は毒性の強い環境汚染物質であり、鉛の健康・環境への影響への懸念、特に生態系への悪影響や汚染が問題視されている。そのため、給電端子用のはんだを無鉛化する動きが急速に広まっている。 In order to receive a defogger and an antenna, a vehicle is provided with a power supply terminal that takes a contact point between the vehicle body and glass, and the power supply terminal and the glass are connected by solder containing lead. In general, lead is a highly toxic environmental pollutant, and concerns about the health and environmental impacts of lead, especially adverse effects on the ecosystem and pollution, are regarded as problems. Therefore, the movement to lead-free solder for power supply terminals is rapidly spreading.
また、車両を廃棄した場合には、給電端子のはんだに酸性雨などが接触すると、鉛が環境中に溶出し、環境負荷を与えてしまう原因となる。このことから、車両用のはんだの無鉛化は必要不可欠な状況となっている。 In addition, when the vehicle is discarded, if acid rain or the like comes into contact with the solder of the power supply terminal, lead is eluted into the environment and causes an environmental load. For this reason, lead-free soldering for vehicles is indispensable.
家電業界を始め大部分の業界が、種々のはんだ付け用途のために低鉛または無鉛のはんだをすでに使用している。それらの一般的な無鉛のはんだは、Ｓｎの含有量が極めて多いという特徴がある(例えば特許文献１参照)。 Most industries, including the consumer electronics industry, already use low-lead or lead-free solders for various soldering applications. These general lead-free solders are characterized by a very high Sn content (see, for example, Patent Document 1).
しかしながら、自動車のガラスと装置をはんだ付けする用途では、一般的な家電分野とは異なる問題が存在する。すなわち、金属同士をはんだ付けする場合と異なり、高Ｓｎ無鉛はんだは、自動車のガラスに割れを生じさせる可能性がある。 However, there is a problem different from the general home appliance field in the application of soldering the glass and the device of the automobile. That is, unlike the case where metals are soldered together, high Sn lead-free solder may cause cracks in automobile glass.
例えば、上記特表２００９−５０９７６７号公報に記載のものは、Ｓｎを９０％以上程度含んでいるが、電子基板のような柔軟な素材と比較し、ガラスは硬いため、そのまま使用することはできない。これは膨張係数が金属とガラスで大きく異なるのが一因であるが、金属の膨張係数をガラスと同じ程度にすることは困難であるので、弾性係数の小さい(柔らかい)材料が求められる。 For example, although the thing described in the above-mentioned special table 2009-509767 contains about 90% or more of Sn, since glass is hard compared with a flexible material such as an electronic substrate, it cannot be used as it is. . This is partly due to the fact that the coefficient of expansion is greatly different between metal and glass, but it is difficult to make the coefficient of expansion of the metal the same as that of glass, so a material with a small elastic coefficient (soft) is required.
本発明は、質量％で表して、Ｉｎが２６〜５６、Ａｇが０〜１０、Ｓｎが残部である３４〜７４、であることを特徴とする車両用無鉛はんだ組成物である。 The present invention is a lead-free solder composition for vehicles, characterized in that In is 26 to 56, Ag is 0 to 10, and Sn is the remaining 34 to 74 in terms of mass%.
また、ヤング率が５０ＧＰａ以下であることを特徴とする、上記の車両用無鉛はんだ組成物である。 Moreover, the above-mentioned lead-free solder composition for vehicles, wherein Young's modulus is 50 GPa or less.
本発明により、無鉛であることで環境に悪影響を与えず、かつ一般的な高Ｓｎ無鉛はんだと違って熱応力も小さいため、車両用無鉛はんだとして好適な無鉛はんだ組成物を得ることができる。 According to the present invention, since it is lead-free, it does not adversely affect the environment, and unlike general high-Sn lead-free solder, the thermal stress is small, so that a lead-free solder composition suitable as a lead-free solder for vehicles can be obtained.
本発明は車両用無鉛はんだとして好適な、Ｓｎ−Ｉｎ−Ａｇ系無鉛はんだ組成物である。 The present invention is a Sn-In-Ag lead-free solder composition suitable as a lead-free solder for vehicles.
本発明の成分系においてＩｎは質量％で２６〜５６％であることが望ましい。Ｉｎは特に本発明のはんだの弾性率に影響する。Ｉｎが２６％未満では、弾性率が大きくなり、ガラスにクラックを与える可能性がある。逆にＩｎが５６％を超えると、常温付近の温度変化においてもＩｎ３Ｓｎ／Ｉｎ３Ｓｎ+ＩｎＳｎ４の相変化による内部応力の残留や、クラック発生により、はんだの接着強度が低下する。より望ましくは４６〜５６％の範囲である。 In the component system of the present invention, In is preferably 26 to 56% by mass. In particularly affects the elastic modulus of the solder of the present invention. If In is less than 26%, the elastic modulus is increased, and there is a possibility that the glass is cracked. On the other hand, if In exceeds 56%, the adhesive strength of the solder is lowered due to residual internal stress due to phase change of In 3 Sn / In 3 Sn + InSn 4 and generation of cracks even at a temperature change near room temperature. More desirably, it is in the range of 46 to 56%.
Ａｇは必須ではないが、はんだの疲労強度や対衝撃強度を上げる成分である。質量％で０〜５％が望ましい。５％を超えると粗大なＡｇ３Ｓｎが析出し、強度低下や疲労強度を低下させる原因となる。より望ましくは１〜５％である。 Ag is not essential, but is a component that increases the fatigue strength and impact strength of the solder. 0 to 5% by mass% is desirable. If it exceeds 5%, coarse Ag 3 Sn precipitates, causing a decrease in strength and fatigue strength. More desirably, it is 1 to 5%.
以下、実施例に基づき、説明する。 Hereinafter, a description will be given based on examples.
３５０ｍｍ×１５０ｍｍ×３．５ｔのソーダライムガラス基板に、一般的な自動車用ガラスの熱線部と端子を接続させるために設ける銀のバスバー部を加工するのと同様に、銀ペーストをメッシュ：＃200のスクリーンを用いてスクリーン印刷し、銀プリント（サイズ：１２×７０ｍｍ、１５箇所）を施した。スクリーン印刷したガラスは乾燥した後、加熱処理し、強化ガラスを得た。 A silver paste is meshed on a soda-lime glass substrate of 350 mm × 150 mm × 3.5 t in the same manner as processing a silver bus bar portion provided to connect a hot wire portion and a terminal of general automotive glass: # 200 The screen was printed using a screen and silver print (size: 12 × 70 mm, 15 locations) was applied. The screen-printed glass was dried and then heat-treated to obtain tempered glass.
黄銅製給電端子に、実施例及び比較例の組成の無鉛はんだを２ｍｍ厚程度になるように盛り、給電端子を準備した。 A lead-free solder having a composition of the example and the comparative example was placed on a brass power-feed terminal so as to have a thickness of about 2 mm, and a power-feed terminal was prepared.
ガラス上の銀バスバー部にはんだ盛りした給電端子をセットし、３００℃以上の熱風を給電端子に加熱し、はんだを溶融させ、銀のバスバー部にはんだ付けした。その後、一定時間後冷却処理したものを試料とした。 The power supply terminal soldered on the silver bus bar part on the glass was set, hot air of 300 ° C. or higher was heated to the power supply terminal, the solder was melted, and soldered to the silver bus bar part. Thereafter, a sample that had been cooled for a certain time was used as a sample.
このようにして作製した各試料について、接着強度、外観、温度サイクル試験による変化を確認した。接着強度は１５０Ｎ以上であるものを合格とした。外観ははんだ表面のクラックの有無を目視で観察し、クラックのないものを合格とした。温度サイクル試験は９０℃×１５ｈｒ・−４０℃×１５ｈｒ、２０サイクル行い、試験後にガラス面に外観変化(クラック)のないものを合格とした。 For each sample thus produced, changes in adhesive strength, appearance, and temperature cycle test were confirmed. An adhesive strength of 150 N or more was accepted. As for the appearance, the presence or absence of cracks on the solder surface was visually observed, and those having no cracks were accepted. The temperature cycle test was conducted at 90 ° C. × 15 hr · −40 ° C. × 15 hr for 20 cycles.
（結果）
実施例を表１に、比較例を表２に示す。
Examples are shown in Table 1, and Comparative Examples are shown in Table 2.
表から明らかなように、実施例１〜５の各試料は、各組成が適切な範囲であるため、接着強度、外観、温度サイクルによるガラスへの影響がなく全て良好であった。 As is clear from the table, the samples of Examples 1 to 5 were all good because there was no influence on the glass due to the adhesive strength, appearance, and temperature cycle because each composition was in an appropriate range.
これらに対して、比較例１〜５の試料は、組成範囲が適当でないために、強度、外観、ガラスへの影響の何れかに問題があり、車両用無鉛はんだとして適用し得ない結果となった。 On the other hand, the samples of Comparative Examples 1 to 5 have problems in any of the effects on the strength, appearance, and glass because the composition range is not appropriate, and cannot be applied as lead-free solders for vehicles. It was.
Claims (2)
Ｉｎが２６〜５６、
Ａｇが０〜１０、
Ｓｎが残部である３４〜７４、
であることを特徴とする車両用無鉛はんだ組成物。 Expressed in mass%,
In is 26 to 56,
Ag is 0 to 10,
34-74 where Sn is the balance
The lead-free solder composition for vehicles characterized by the above-mentioned.
The lead-free solder composition for vehicles according to claim 1, wherein Young's modulus is 50 GPa or less.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010112823A JP2011240352A (en) | 2010-05-17 | 2010-05-17 | Lead-free solder composition for vehicle |
| PCT/JP2011/061261 WO2011145591A1 (en) | 2010-05-17 | 2011-05-17 | Lead-free solder composition for vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010112823A JP2011240352A (en) | 2010-05-17 | 2010-05-17 | Lead-free solder composition for vehicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2011240352A true JP2011240352A (en) | 2011-12-01 |
Family
ID=44991693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010112823A Pending JP2011240352A (en) | 2010-05-17 | 2010-05-17 | Lead-free solder composition for vehicle |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2011240352A (en) |
| WO (1) | WO2011145591A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112958943A (en) * | 2015-05-15 | 2021-06-15 | 安波福技术有限公司 | Lead-free solder based on indium-tin-silver |
| US11267080B2 (en) | 2019-05-09 | 2022-03-08 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR112015003280B1 (en) | 2012-08-24 | 2020-03-10 | Saint-Gobain Glass France | GLASS WITH CONNECTION ELEMENT AND METHOD TO PRODUCE SUCH GLASS |
| CN117139917B (en) * | 2023-10-31 | 2024-03-08 | 苏州塞一澳电气有限公司 | Lead-free solder for automobile glass and preparation method and application thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61148774A (en) * | 1984-12-21 | 1986-07-07 | 富士通株式会社 | Electric connector |
| JPH02217193A (en) * | 1989-02-17 | 1990-08-29 | Matsushita Electric Works Ltd | Indium series powdery solder |
| US7159756B2 (en) * | 2003-08-29 | 2007-01-09 | Ppg Industries Ohio, Inc. | Method of soldering and solder compositions |
| PL1922175T3 (en) * | 2005-08-12 | 2020-03-31 | Aptiv Technologies Limited | Solder composition |
-
2010
- 2010-05-17 JP JP2010112823A patent/JP2011240352A/en active Pending
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2011
- 2011-05-17 WO PCT/JP2011/061261 patent/WO2011145591A1/en active Application Filing
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112958943A (en) * | 2015-05-15 | 2021-06-15 | 安波福技术有限公司 | Lead-free solder based on indium-tin-silver |
| US11267080B2 (en) | 2019-05-09 | 2022-03-08 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
| US11712762B2 (en) | 2019-05-09 | 2023-08-01 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011145591A1 (en) | 2011-11-24 |
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