200847382 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種雷射打標梦¥ .一衣置之元件承載裝置，特別 積體電路⑽上製作標記_爾 置及其 【先前技術】 應用細了標技術在物體表轉作文字 等 與傳統的機械雕刻或化學蝕刻等方弋★ 木寻知a己， 精準度高、速倾、似敲之記圍$ 點，因此在目前的ms卩標加 纽專優 置的改良實屬重要。w _射打標技術與裝200847382 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a component carrying device for a laser marking dream, a garment, a special integrated circuit (10), and a prior art The use of fine-grained technology in the object table to text and other traditional mechanical engraving or chemical etching, etc. ★ wood to know a self, high precision, fast tilt, like knocking around $ point, so in the current ms It is important to improve the standard of the United States and Canada. w _ shooting marking technology and equipment
早期浦’是整__岭紅後，即於其上作 田射加工^，現在财許多麵將不同麵IW 路板（PCB)上後，再將所需的商椁 、 P电 條碼或序號於1C上進 記，因此必麟雷射打標農置有更佳的系統控制 ==光源強度與方向的選擇或調整，才能達到精準度高 oa^JC 罕。 然而，現有技術的雷射打標裂置在加工Ic元件 =工平面之厚度、大小不—，或每—PCB板上之IC元件厚 f的不同，便會產生失論關位置偏差的問題，目此雷射光 束的聚焦位置需要於每—批不同加从件打標前作調整，才$ 使加工效果的誤差減少，但f知雷射打標裂置蚊位設計，是 6 200847382 由使用者手動測1 ’或是以試打幾次制試方式，來調整雷射 ，源系統與加工元件之間的距離，但這些調整方式過程不易， 奋易造成秩差，且經過調整焦距後的雷射打標裝置，同一批元 件的重現性將會不佳。 士此外’當我們去改變較複雜的雷射光源系統之聚焦位置 日寸’谷易產生絲、移位，造成光驗準不精顧而產品 重現性不佳的問題。 職是之故，發明人鑑於習知技術之設計缺失，乃經悉心 氧驗與研究，並-本鍥而不捨之精神，發明出本案「雷射打標 I置」’以下為本案之簡要說明。 【發明内容】 本發明之目的在於提供一種雷射打標機裝置，能讓每一 批不同尺寸、厚度之產品元件的雷射標記位置精準，以改善習 知技術於不同加X元件打標前，調整光齡統與加工元件間之 距離日请產生的誤差大、光減差、失焦、產品重現性不佳等 缺點。 本發明之另-目的在於提供—種雷射打標機之元件承載 裝置’用以承載-元件’射該雷射打標機包含—導光系統， 而該元件承載裝置包含-水平調整裝置，職調整該元件承載 裝置與該導光水平轉位置，—校正健_校正該元 件之平面座標位置，以及-高度調整裝置，用_整該元件承 載裝置與該導光系統的垂直相對位置。 根據上述的構想，該元件為一積體電路元件，一積體電 7 200847382 路放置盤，或是一印刷電路板(PCB)，該印刷電路板上有複數 積體電路。 根據上述的構想，其中該元件承載裝置為一可動式平 台’該導光系統包含一振鏡系統。 根據上述的構想，該水平調整裝置包含一水平調整螺絲 以及一氣泡水平儀，且該高度調整裝置為一分厘卡。 根據上述的構想，談校正裝置為一座標系統原點校正裝 置’用以校正該元件與一預設原點的座標相對位置。 本發明之另一目的在於提供一種雷射打標裝置，用以在 一元件上打標，其包含用以將一雷射光輸出至該元件的一導光 系統，用以承載該元件的一承載裝置，用以調整該導光系統與 該承载裝置間之水平相對位置的一水平調整裝置，用以校正該 元件之平面座標位置的一校正裝置，以及用以調整該導光系統 與該承载裝置間之垂直相對位置的一高度調整裝置。 根據上述的構想，該元件為一積體電路元件，一積體電 路放置盤，或是-印刷電路板(PCB)，該印刷電路板上有複數 積體電路。 根據上述的構想，其中該元件承載裝置 台’該導光系統包含-振齡統。 根據上述的構想，該水平·裝置包含—水平調整螺絲 以及-聽水平儀，且該高度調錄置為—分厘卡。 詈，用、的構想’雜正裝置為m統原點校正裝 正該轉與—預設原闕座標相對位置。 如前述本發明之雷射打標裝置，得藉由下列實施例及圖 8 200847382 示說明，俾得更深入之了解·· 【實施方式】 本發明之技術手段將詳細說明如下，相信本發明之目 的、特徵與特點，當可由此得—深人且具體之了解，然而下列 實施例與圖示僅提縣考與购用，並_來對本發明加以限 制。 首先明爹考第-圖，其為本發明之雷射打標裝置之一實 施例的結構示意圖，該雷射打標機」包含—雷射錢n… 導光系統13以及-元件承餘置15，—f射光束12由該雷 射光源11產生後，經導光系統13接收並傳送至一元件16作 雷射加工標記’聽元件承餘置丨5侧以承_元件. 請再參考第一圖的元件承餘置15，該元件承載裝置15 包含-水平調絲置17，-校正裝置14，以及1度調整裝 置18，該水平調整裝置17係用以調整該導光系統與該元 件承載裝置15間的水平姆位置，雜正裝置14侧以校正 該το件16之平面座標位置高度調整裝置18侧以調整 該導光系統13與該元件承載裝置15 _垂直相對位置。 在上述實施例中，該元件16可為一積體電路元件（ic)， - 1C放置盤（IC tray)，或是具有複數IC於其上的印刷電路 板（PCB)，由於不同批欲以雷射加工標記的ic尺寸、厚度备 不相同’甚朗-PCB板上的Ic元件尺寸、厚度也可能神 同如果光源焦距的調整獨精確，雕刻位置就可能會有 偏差，造成產品碱’而假若如習知技術僅去雜雷射光源 9 200847382 ^或導麵統13等光㈣統與元件_垂直姆位置，會有 調整誤差大與光軸偏差等缺點。 而本發明之雷射打標機1之元件承載裝置]5，同時具有 水平調整裝置π以及高度調錄置18，_可精確地去調整 兀件承載裝置I5解光祕水平姆位置和垂直相對 位置’同時具植正裝置丨4峨魅精確校準元件I6之平面 座標位置’而使得元件16哺射標記輕精準，每一批產品 元件的重現性高。 此外，在實際操作與設計上，水平傾斜位置經校正後的 載裝置15，可直接以該元件16的厚度直浦入成高度 调广衣置18的-刻度⑤定值’設定快速且精準，因而免除傳 統調整焦距的繁複程序。 在上述實施例中，該元件承餘置15為—可動式平台， 較佳為-XY轴機械平台（X.Y table)，在胃_器、轴控卡與 電腦軟體等的㈣下’元件承錄置b可鶴縣確定位該 元件16。 在上述實施例中，該導光系統13還包含一振鏡系統19， 例如XY轴南速掃4苗振鏡系統，如第二圖所#，該振鏡系統 I9包含X軸振鏡m和γ轴振鏡m，以快速並精確地將雷 射光束12定位後於元件16上打標。 、士明再辦第二圖，其為第_圖中雷射打標機1之元件承 載裝置I5之實施例的細部結構示意圖，在此實施例中，該高 度調整裝置18為-分厘卡，因而可調整和校正該導光系統13 14«亥7〇料餘置b間麵直相對位置丨該水平調整裝置口 200847382 包含水平調整賴171以及氣泡水平儀172，讀確校準該導 光系統13與該元件承載裝置15間的水平相對位置，因而改善 雷射打標機1因為該導光系統13與該元件承絲置15間的垂 直相對位置改賴產生的綠偏差問題；此外，該校正裝置 14為-座標祕雜校正裝置，加校正該元件16與树承 載裝置15中的一預設原點的座標相對位置。 請再參考第四圖’其為本發明之雷射打標裝置的另一實 施例，該雷射打標裝置3係用以在一元件36上打標，其包含 士 ‘光系、統33用以將-雷射光32輸出至該元件％，一承載 I置35/用以承載該元件36，一水平調整裝置37係用以調整 "亥導光系、統33與該承載裝置35關水平相對位置，一校正事 置34係用以校正該元件36之平面座標位置，以及一高度調整 裝置38係用以調整該導光系統33與該承載裝置％間的垂直 相對位置。 在此灵施例中’該元件36為一積體電路元件（IC)，一 ic放μ (IC tray)，或是具有複數IC於其上的印刷電路板 ( = )’且该導光系統33還包含一振鏡系統39，例如—χγ 軸高速掃描振齡統，以快速並精视將#射絲32定位後 於辑36上打標。該承載裝置35為一可動式平台，較佳為一 轴機械平台（X-Ytable)，在驅動器、轴控卡與電腦軟體等 的^制下，承载裝置35可移動並準確粒該元件36。 此外，该向度調整裝置38為一分厘卡，而該水平調整裝 壯37包含水平調整螺絲371以及氣泡水平儀372，且該校正 為座4示糸統原點校正裝置，用以校正該元件％與一 11 200847382 預設原點_標相耻置。值躲意的是，在此實補中，水 •^周整裝置37和⑧度罐裝置38的位置並不祕設置在承载 裝置35，而是可設置於雷射打標裝置3性何適當的位置， 只要能夠分別用以調整和校正該導光系統33和該承載裝置％ 間的水平相對位置與垂直相對位置即可。 此外，於上述各實施例中，高度調整裝置18、％並不限 於-^厘卡，任何具職校正魏而可準確輕元件與光源間 垂直高度的精密元件均能_，且該水平調錄置17、^亦 不限於使财平機_和氣泡水平儀，任·精確調整和校 正儀器水平錄雜能_於本發明之各實施例。 雖然本發明已讀個較佳實施觸露如上，然1並非用 以限定本發明’任何翻此·者，在不脫離本發明之精神和 章=内，=作些软更動與潤飾，因此本發明之保護範圍當 視後附之申睛專利範圍所界定者為準。 【圖式簡單說明】 =圖：本發明之雷射打標裝置之—實施例的結構示意圖； 第一圖·振鏡系統的結構示意圖； ° =圖：本發狀雷射打標裝置之元件承餘置的細部結構示 思圖， 第四圖：本發明之雷射打標裝置之另—實施侧結構示意圖。 【主要元件符號說明】 1 ^ 3 雷射打標裝置 12 200847382 11 光源 12、32 雷射光束 13、33 導光系統 14、34 校正裝置 15 > 35 元件承載裝置 16、36 元件 17、37 水平調整裝置 18、38 高度調整裝置 19、39 振鏡系統 17卜 371 水平調整螺絲 172、372 氣泡水平儀 191 X轴振鏡 192 Y轴振鏡 13The early Pu's is the whole __ ling red, that is, it is used for field processing ^, now many faces will be different on the IW board (PCB), and then the required quotation, P bar code or serial number 1C is on the score, so the Binglin laser marking the farm has better system control == the choice or adjustment of the light source intensity and direction, in order to achieve high precision oa^JC. However, the prior art laser marking cracking is different in the thickness and size of the processing Ic component = the working plane, or the thickness f of the IC component on each PCB board, which may cause a problem of positional deviation. Therefore, the focus position of the laser beam needs to be adjusted before each batch of different stampings, so that the error of the processing effect is reduced, but the design of the laser marking cracking mosquito position is 6 200847382 by the user. Manually measure 1 ' or to test the laser, the distance between the source system and the processing component, but these adjustment methods are not easy, cause the rank difference, and the laser after adjusting the focal length Marking device, the reproducibility of the same batch of components will be poor. In addition, when we change the focus position of the more complex laser light source system, the size of the grain is shifted, causing the light to be inaccurate and the product reproducibility is not good. As a result of the job, the inventor, in view of the lack of design of the prior art, was carefully examined and researched, and the spirit of perseverance was invented to produce the "laser marking I". The following is a brief description of the case. SUMMARY OF THE INVENTION The object of the present invention is to provide a laser marking machine device, which can accurately position the laser markings of each batch of product components of different sizes and thicknesses, so as to improve the prior art before marking different X-components. , adjust the distance between the light age system and the processing components, such as large errors, light loss, out of focus, poor product reproducibility and other shortcomings. Another object of the present invention is to provide a component carrying device for a laser marking machine for carrying a component, the laser marking device comprising a light guiding system, and the component carrying device comprising a horizontal adjusting device. The device adjusts the component carrying device and the light guiding horizontal rotation position, the correction coordinate_corrects the plane coordinate position of the component, and the height adjusting device, and uses the vertical relative position of the component carrying device and the light guiding system. According to the above concept, the component is an integrated circuit component, an integrated circuit, or a printed circuit board (PCB) having a plurality of integrated circuits on the printed circuit board. According to the above concept, wherein the component carrying device is a movable platform, the light guiding system comprises a galvanometer system. According to the above concept, the level adjusting device comprises a horizontal adjusting screw and a bubble level, and the height adjusting device is a centimeter card. According to the above concept, the correction device is a standard system origin correction device 'for correcting the relative position of the element to a predetermined origin. Another object of the present invention is to provide a laser marking device for marking a component, comprising a light guiding system for outputting a laser light to the component for carrying a bearing of the component a level adjusting device for adjusting a horizontal relative position between the light guiding system and the carrying device, a correcting device for correcting a planar coordinate position of the component, and adjusting the light guiding system and the carrying device A height adjustment device with a vertical relative position therebetween. According to the above concept, the component is an integrated circuit component, an integrated circuit placement disk, or a printed circuit board (PCB) having a plurality of integrated circuits on the printed circuit board. According to the above concept, wherein the component carrying device table ' the light guiding system comprises - vibrating system. According to the above concept, the level device includes a horizontal adjustment screw and a listening level, and the height recording is set to a centimeter card.詈, the concept of use, the miscellaneous positive device is the m system origin correction device is to be transferred to - the relative position of the original coordinates. As described above, the laser marking device of the present invention can be further understood by the following embodiments and FIG. 8 200847382. [Embodiment] The technical means of the present invention will be described in detail below, and it is believed that the present invention The objects, features, and characteristics of the present invention can be obtained by the following examples and illustrations. First, a first embodiment of a laser marking apparatus according to the present invention, the laser marking machine includes - laser money n... light guiding system 13 and - component bearing 15. After the laser beam 11 is generated by the laser source 11, it is received by the light guiding system 13 and transmitted to a component 16 for laser processing. The listening component is placed on the side of the 丨5 side to support the component. Please refer to The component of the first figure has a housing 15, the component carrying device 15 comprises a horizontal leveling device 17, a correcting device 14, and a 1 degree adjusting device 18 for adjusting the light guiding system and the The horizontal position between the component carrying devices 15 and the side of the positive device 14 are used to correct the plane coordinate position height adjusting device 18 side of the τ member 16 to adjust the vertical position of the light guiding system 13 and the component carrying device 15_. In the above embodiment, the component 16 can be an integrated circuit component (ic), - 1C IC tray, or a printed circuit board (PCB) having a plurality of ICs thereon. The size and thickness of the laser processing mark are different. 'The size and thickness of the Ic component on the PCB board may also be the same. If the adjustment of the focal length of the light source is accurate, the engraving position may be biased, resulting in the product alkali' If the conventional technique only removes the light source 9 200847382 ^ or the light (4) of the guide system 13 and the component _ vertical m position, there will be disadvantages such as large adjustment error and deviation of the optical axis. The component carrying device 5 of the laser marking machine 1 of the present invention has a horizontal adjusting device π and a height recording device 18, which can accurately adjust the position and vertical relative position of the object carrying device I5. The position 'at the same time, the position of the plane coordinates of the sleek precision calibration component I6' makes the component 16 lightly and accurately, and the reproducibility of each batch of product components is high. In addition, in actual operation and design, the carrier device 15 after the horizontal tilt position is corrected, and the thickness of the component 16 can be directly input into the height-adjusted clothes-set 18-scale 5 setting value quickly and accurately. This eliminates the traditional process of adjusting the focal length. In the above embodiment, the component bearing 15 is a movable platform, preferably an -XY axis mechanical platform (XY table), under the (4) of the stomach _ device, the axis control card and the computer software component Set b Kehe County to determine the component 16. In the above embodiment, the light guiding system 13 further includes a galvanometer system 19, such as an XY axis south speed sweeping 4 galvanometer system, as shown in the second figure, the galvanometer system I9 includes an X-axis galvanometer m and The gamma galvanometer m is used to quickly and accurately position the laser beam 12 and mark it on the component 16. The second figure is a schematic diagram of a detailed structure of the embodiment of the component carrying device I5 of the laser marking machine 1 in the first embodiment. In this embodiment, the height adjusting device 18 is a - centimeter card. Therefore, the light guiding system 13 14 can be adjusted and corrected. The horizontal adjusting device port 200847382 includes a horizontal adjustment 171 and a bubble level 172, and the light guiding system 13 is read and calibrated. a horizontal relative position with the component carrying device 15, thus improving the laser marking machine 1 because the vertical relative position between the light guiding system 13 and the component carrier 15 is dependent on the resulting green deviation; in addition, the correction The device 14 is a coordinate correction device that corrects the relative position of the element 16 to a predetermined origin of the tree carrier 15. Please refer to the fourth figure, which is another embodiment of the laser marking device of the present invention. The laser marking device 3 is used for marking on a component 36, which includes a 'light system, a system 33 For outputting - the laser light 32 to the component %, a carrier I is 35 / for carrying the component 36, a level adjusting device 37 is used to adjust the "Heiling light system, the system 33 and the carrying device 35 The horizontal relative position, a calibration event 34 is used to correct the planar coordinate position of the component 36, and a height adjustment device 38 is used to adjust the vertical relative position between the light guiding system 33 and the carrier device %. In this embodiment, the component 36 is an integrated circuit component (IC), an IC tray, or a printed circuit board (=) having a plurality of ICs thereon and the light guiding system 33 further includes a galvanometer system 39, such as a χ γ-axis high-speed scanning oscillator, to quickly and accurately align the #射线 32 and mark it on the 36. The carrying device 35 is a movable platform, preferably a one-axis mechanical platform (X-Ytable). Under the control of the driver, the axis control card and the computer software, the carrying device 35 can move and accurately granulate the component 36. In addition, the directional adjustment device 38 is a centimeter card, and the horizontal adjustment device 37 includes a horizontal adjustment screw 371 and a bubble level 372, and the correction is a pedestal homing correction device for correcting the component. % with a 11 200847382 preset origin _ standard shame. The value is hidden, in this actual compensation, the position of the water and the whole device 37 and the 8 degree tank device 38 are not secretly disposed on the carrying device 35, but can be set in the laser marking device 3 The position is as long as it can be used to adjust and correct the horizontal relative position and the vertical relative position between the light guiding system 33 and the carrying device %, respectively. In addition, in the above embodiments, the height adjusting device 18, % is not limited to - PCT, any precision component that can correct the vertical height between the light component and the light source can be _, and the horizontal recording The setting of 17, is not limited to the use of the financial machine _ and the bubble level, any precision adjustment and correction of the instrument horizontal recording energy _ in the various embodiments of the present invention. Although the preferred embodiment of the present invention has been described above, the present invention is not intended to limit the invention, and it is not intended to limit the scope of the invention. The scope of protection of the invention is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic structural view of an embodiment of a laser marking device according to the present invention; FIG. 1 is a schematic structural view of a galvanometer system; The detailed structure of the bearing structure is shown in the figure, and the fourth figure is a schematic diagram of the other side of the laser marking device of the present invention. [Main component symbol description] 1 ^ 3 Laser marking device 12 200847382 11 Light source 12, 32 Laser beam 13, 33 Light guiding system 14, 34 Correction device 15 > 35 Component carrying device 16, 36 Component 17, 37 Level Adjustment device 18, 38 Height adjustment device 19, 39 galvanometer system 17 371 Horizontal adjustment screw 172, 372 Bubble level 191 X-axis galvanometer 192 Y-axis galvanometer 13