CN101482399B - Method and system for measuring substrate inclination and cornerstone inclination - Google Patents
Method and system for measuring substrate inclination and cornerstone inclination Download PDFInfo
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- CN101482399B CN101482399B CN2009100457459A CN200910045745A CN101482399B CN 101482399 B CN101482399 B CN 101482399B CN 2009100457459 A CN2009100457459 A CN 2009100457459A CN 200910045745 A CN200910045745 A CN 200910045745A CN 101482399 B CN101482399 B CN 101482399B
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- work stage
- tilting value
- foundation stone
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Abstract
The invention provides a substrate inclination and foundation stone inclination measuring method and system used for focusing and leveling in projection photoetching system. The method and system disclosed in the invention need not exposure, comprises: selecting multiple points with same interval on X and Y direction on the substrate; measuring by the substrate inclination and foundation stone inclination measuring system; and performing fitting calculation to the obtained measuring data to obtain the substrate inclination value and the foundation stone inclination value.
Description
Technical field
The invention relates to measuring method and system that a kind of substrate inclination and foundation stone tilt, and particularly relevant for a kind of substrate inclination of projection lithography system focusing and leveling and measuring method and system that foundation stone tilts of being applied to.
Background technology
Flourish along with electronic industry, the application of integrated circuit is extensive all the more, and the thing followed is the high precision of its production.And the equipment of projection mask aligner's to be integrated circuit produce most critical in each link, photoetching technique is the basis that large scale integrated circuit is made, and has become the core driving force that promotes the integrated circuit development.
The purpose of projection mask aligner be with mask graph clearly image in scribble photoresist substrate (for example: silicon chip), reach this purpose and must guarantee that suprabasil exposure area is in projection objective optimal focal plane (optimal focal plane: the plane of correspondence when exposing substrate is best in quality) position.Because processing technology causes the upper and lower surface of substrate that certain pitch angle is arranged.
In projection mask aligner, (work stage: the estrade of bearing basement) (for example: marble) upper surface moves work stage in the exposure process, and foundation stone integral body maintains static all the time along foundation stone by vertical control system control.Because install, the relative projection objective optimal focal plane of foundation stone upper surface has certain pitch angle.
The inclination of the relative projection objective optimal focal plane with the foundation stone upper surface of substrate inclination all can influence the exposure quality, so the inclination of substrate inclination and foundation stone must obtain by certain survey calibration method before exposure, compensating for tilt is to the influence of exposure vertical position when actual exposure, thereby optimizes image quality.
U.S. Pat 6278515 has disclosed method of tilting and the device between a kind of automatic measurement and adjusting upper surface of substrate and the optimal focal plane, but for suprabasil fringe region, the device that this measurement is tilted is just accurate inadequately.The size of substrate at present is increasing, and the depth of focus value is more and more littler, utilizes the focal plane automatic correction device fringe region of substrate can not be transferred to the optimal focal plane place.
U.S. Pat 6562528 has disclosed a kind of method of measuring substrate tilting value and image planes tilting value, along a coordinate axis (X or Y) and in X-Y plane the travelling workpiece platform mark on the mask is exposed to substrate, thereby in substrate, form an exposure sequence, highly differently between the picture that utilizes different exposure positions and the focal plane can obtain the substrate tilting value; Work stage forms another one exposure sequence along Z axle and one of them transverse axis (X or Y) stepping on silicon chip, analysis exposure sequence obtains the tilting value between image planes and the upper surface of substrate.Yet, measure tilting value by the method for exposure, not only cost height and process are also complicated.
Summary of the invention
The invention provides a kind of substrate inclination of projection lithography system focusing and leveling and measuring method and system that foundation stone tilts of being applied to.The method disclosed in the present and system need not expose, equidistantly choose multiple spot by X in substrate, Y direction, utilize substrate inclination and foundation stone inclinometric system to measure, utilize measurement data to carry out The Fitting Calculation then and obtain substrate tilting value and foundation stone tilting value.
The measuring method that substrate inclination of the present invention and foundation stone tilt comprises:
At the X of upper surface of substrate, the Y direction is equidistantly chosen a plurality of measurement points, determines the coordinate figure of described measurement point;
Utilize the work stage level to the tangential movement of control system control work stage;
Utilize the vertical control system control of work stage work stage catenary motion;
Utilize the described substrate of work stage clamping and drive described substrate and move, make described suprabasil a plurality of measurement points move to the optical axis place, wherein said work stage moves along the foundation stone upper surface;
Utilize focusing and leveling sensor that the measurement point that is positioned under the optical axis is measured, obtain the height value and the tilting value of the relative optimal focal plane of described measurement point;
Utilize the height value and the coordinate figure of described a plurality of measurement points, calculate the fit Plane coefficient of described upper surface of substrate;
Utilize the fit Plane coefficient of described upper surface of substrate, calculate the substrate tilting value, wherein said substrate tilting value is the tilting value between described fit Plane and the described substrate lower surface;
Utilize the tilting value of described substrate tilting value and described a plurality of measurement points, calculate the foundation stone tilting value, wherein said foundation stone tilting value is the tilting value between described foundation stone upper surface and the optimal focal plane.
The measuring system that substrate inclination of the present invention and foundation stone tilt comprises:
Luminous source system, lens combination, substrate, work stage, work stage level are to control system, the vertical control system of work stage, foundation stone, focusing and leveling sensor, wherein:
The X of upper surface of substrate, the Y direction equidistantly is set with the measurement point that a plurality of coordinate figures are determined;
The work stage level is to the tangential movement of control system control work stage;
The vertical control system control of work stage work stage catenary motion;
The described substrate of work stage clamping also drives described substrate and moves, and makes described suprabasil a plurality of measurement points move to the optical axis place, and wherein said work stage moves along the foundation stone upper surface;
Focusing and leveling sensor is measured the measurement point that is positioned under the optical axis, obtains the height value and the tilting value of the relative optimal focal plane of described measurement point;
Utilize the height value and the coordinate figure of described a plurality of measurement points, calculate the fit Plane coefficient of described upper surface of substrate;
Utilize the fit Plane coefficient of described upper surface of substrate, calculate the substrate tilting value, wherein said substrate tilting value is the tilting value between described fit Plane and the described substrate lower surface;
Utilize the tilting value of described substrate tilting value and described a plurality of measurement points, calculate the foundation stone tilting value, wherein said foundation stone tilting value is the tilting value between described foundation stone upper surface and the optimal focal plane.
Measuring method of the present invention and system are simple compared to the prior art measuring process, and owing to need not expose, so cost is also lower.
For above-mentioned feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1 shows that substrate inclination of the present invention and foundation stone inclinometric system.
Embodiment
In order to understand technology contents of the present invention better, especially exemplified by specific embodiment and cooperate appended illustrate as follows.
In the present invention, the substrate tilting value is defined as the fit Plane of upper surface of substrate and the tilting value between the substrate lower surface; The foundation stone tilting value is defined as the tilting value between foundation stone upper surface and the optimal focal plane.
Figure 1 shows that substrate inclination of the present invention and foundation stone inclinometric system.Substrate inclination and foundation stone inclinometric system shown in Figure 1 comprise: illuminator 1, optical lens 2, focusing and leveling sensor 3, the work stage 5 of bearing basement 4, the level-regulating system 6 of control work stage 5 tangential movements, the vertical control system 7 of work stage of control work stage 5 catenary motions, foundation stone 8.Wherein, illuminator 1 transmitting illuminant is radiated on the upper surface of substrate through lens 2 and along the optical axis direction of lens 2, height and tilting value that focusing and leveling sensor 3 is measured between upper surface of substrate and the optimal focal plane are got measurement point in the substrate 4, and work stage 5 is for having 6DOF (x, y, z, R
x, R
y, R
z) and clamping drive the wafer-supporting platform of basement movement, the level of level-regulating system 6 control work stage 5 is to (x, y, R
z) motion, vertical (z, the R of vertical control system 7 control work stage
x, R
y) motion, the zero plane of vertical control system 7 is parallel with the foundation stone upper surface, vertical control system 7 along foundation stone 8 upper surfaces and be in work stage 5 lower surfaces and foundation stone 8 upper surfaces between move vertical control system 7 of foundation stone 8 supporting workpiece platforms and work stage 5.
Measuring method of the present invention is, chooses multiple spot to equidistantly by X in substrate, Y, measures with substrate and foundation stone inclinometric system, utilizes measurement data to carry out The Fitting Calculation and obtains substrate tilting value and foundation stone tilting value.
Point sampling method is in substrate, and the radius of establishing substrate is R, and the substrate center is made as true origin, and then the coordinate of measurement point need satisfy (1) and (2) formula, and the measurement point of choosing all can be by focusing and leveling sensor measuring height and the inclination in the measuring system.
More than getting point range only is preferred implementation, can all can be chosen as measurement point by the point of focusing and leveling sensor measuring height in the measuring system and inclination in the substrate.
The present invention utilizes measuring system that the measurement point in the substrate 4 is measured, measuring process is: the light that lighting source 1 sends arrives the upper surface of substrate 4 along the irradiation optical axis of lens 2 through lens 2, work stage level-regulating system 6 according to the level of measurement point position control work stage to motion, (work stage 5 moves and work stage 5 highly is always certain value along the foundation stone upper surface catenary motion of the vertical control system of work stage 7 control work stage all the time, work stage 5 tilts to be always zero), work stage 5 clamping substrates 4 also drive substrate and move and make suprabasil measurement point move to the optical axis place, and 3 pairs of measurement points that are positioned under the optical axis of focusing and leveling sensor measure the height and the tilting value of the relative optimal focal plane of measurement point.
But the measurement point height value and the plane equation of measurement point coordinate match (3) that measure by measuring system, with each measurement point coordinate (x, y) and height value (z) substitution (3) formula of the measurement point that measures of focusing and leveling sensor 3 obtain fitting coefficient a, b, c.Because the inclination of work stage 5 is always zero, substrate lower surface places on the work stage, so the inclination of work stage lower surface also is zero, the tilting value of substrate is the tilting value of the fit Plane of upper surface of substrate with respect to zero plane.Utilize (5) and (6) formula to obtain the tilting value of substrate, utilization (7) and 8 at last) formula obtains the foundation stone tilting value.
Z＝ax+by+c (3)
(3) formula is write as matrix form and is:
If the substrate tilting value is expressed as R
X, substrate, R
Y, substrate, the tilting value of the measurement point that focusing and leveling sensor 3 measures is expressed as R
x,, R
y, the foundation stone nauropemeter is shown R
X, stone, R
Y, stone
Then substrate tilting value expression formula is:
R
x，substrate＝b (5)
R
y，substrate＝-a (6)
Foundation stone tilting value expression formula is:
R
x，stone＝-R
x，substrate-<R
x> (7)
R
y，stone＝-R
y，substrate-<R
y> (8)
(3), the coordinate system of (5), (6), (7), (8) formula all is the right-handed coordinate system that defines among Fig. 1, R
xBe rotation angle, direction the direction in Fig. 1 demarcate of plane around X-axis, R
yBe rotation angle, direction the direction in Fig. 1 demarcate of plane around Y-axis,＜R
x,＜R
yMeasure the mean value of the tilting value that multiple spot obtains for focusing and leveling sensor.
Suppose in substrate, to get n measurement point, and this n measurement point can be measured all by focusing and leveling sensor, if i (i=1,2,3......n) tilting value of individual measurement point is R
Xi, R
Yi, then＜R
x,＜R
yExpression formula be:
<R
x>＝(R
x1+R
x2+R
x3+...R
xn)/n (9)
<R
y>＝(R
y1+R
y2+R
y3+...R
yn)/n (10)
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (14)
1. the measuring method that tilts of substrate inclination and foundation stone is applied to the focusing and leveling of projection lithography system, it is characterized in that, comprising:
At the X of upper surface of substrate, the Y direction is equidistantly chosen a plurality of measurement points, determines the coordinate figure of described measurement point;
Utilize the work stage level to the tangential movement of control system control work stage;
Utilize the vertical control system control of work stage work stage catenary motion;
Utilize the described substrate of work stage clamping and drive described substrate and move, make described suprabasil a plurality of measurement points move to the optical axis place, wherein said work stage moves along the foundation stone upper surface;
Utilize focusing and leveling sensor that the measurement point that is positioned under the optical axis is measured, obtain the height value and the tilting value of the relative optimal focal plane of described measurement point;
Utilize the height value and the coordinate figure of described a plurality of measurement points, calculate the fit Plane coefficient of described upper surface of substrate;
Utilize the fit Plane coefficient of described upper surface of substrate, calculate the substrate tilting value, wherein said substrate tilting value is the tilting value between described fit Plane and the described substrate lower surface;
Utilize the tilting value of described substrate tilting value and described a plurality of measurement points, calculate the foundation stone tilting value, wherein said foundation stone tilting value is the tilting value between described foundation stone upper surface and the optimal focal plane.
2. the measuring method that substrate inclination according to claim 1 and foundation stone tilt is characterized in that, the coordinate of described measurement point satisfies:
Wherein R is described base radius.
3. the measuring method that substrate inclination according to claim 1 and foundation stone tilt is characterized in that the height value that the vertical control system of work stage described in the motion process is controlled described work stage is always certain value, and described work stage tilting value is always zero.
4. the measuring method that substrate inclination according to claim 1 and foundation stone tilt, it is characterized in that, utilize described work stage level to taking described measurement point to optical axis following time with vertical control system, measure the height and the tilting value of the relative optimal focal plane of measurement point under the described optical axis by described focusing and leveling sensor, measure and finish the back and move to next measurement point to controlling work stage with vertical control system by described work stage level.
5. the measuring method that substrate inclination according to claim 1 and foundation stone tilt, it is characterized in that, the described computing method coincidence formula Z=ax+by+c that obtains upper surface of substrate fit Plane coefficient, wherein Z is the height value, (x of described measurement point, y) be the coordinate, (a of described measurement point, b c) is the fitting coefficient of the fit Plane of described upper surface of substrate.
6. the measuring method that substrate inclination according to claim 5 and foundation stone tilt is characterized in that the described computing method coincidence formula (R that obtains the substrate tilting value
X, substrate=b, R
Y, substrate=-a), wherein (R
X, substrate, R
Y, substrate) be the substrate tilting value.
7. the measuring method that substrate inclination according to claim 1 and foundation stone tilt is characterized in that the described computing method coincidence formula R that obtains the foundation stone tilting value
X, stone=-R
X, substrate-＜R
x, R
Y, stone=-R
Y, substrate-＜R
y, (R wherein
X, substrate, R
Y, substrate) be the substrate tilting value, (R
x, R
y) be the measurement point tilting value, (R
X, stone, R
Y, stone) be the foundation stone tilting value,＜R
x,＜R
yBe the mean value of the tilting value of a plurality of measurement points.
8. the measuring system that tilts of substrate inclination and foundation stone, be applied to the focusing and leveling of projection lithography system, comprise: luminous source system, lens combination, substrate, work stage, work stage level is characterized in that to control system, the vertical control system of work stage, foundation stone, focusing and leveling sensor:
The X of upper surface of substrate, the Y direction equidistantly is set with the measurement point that a plurality of coordinate figures are determined;
The work stage level is to the tangential movement of control system control work stage;
The vertical control system control of work stage work stage catenary motion;
The described substrate of work stage clamping also drives described substrate and moves, and makes described suprabasil a plurality of measurement points move to the optical axis place, and wherein said work stage moves along the foundation stone upper surface;
Focusing and leveling sensor is measured the measurement point that is positioned under the optical axis, obtains the height value and the tilting value of the relative optimal focal plane of described measurement point;
Utilize the height value and the coordinate figure of described a plurality of measurement points, calculate the fit Plane coefficient of described upper surface of substrate;
Utilize the fit Plane coefficient of described upper surface of substrate, calculate the substrate tilting value, wherein said substrate tilting value is the tilting value between described fit Plane and the described substrate lower surface;
Utilize the tilting value of described substrate tilting value and described a plurality of measurement points, calculate the foundation stone tilting value, wherein said foundation stone tilting value is the tilting value between described foundation stone upper surface and the optimal focal plane.
9. the measuring system that substrate inclination according to claim 8 and foundation stone tilt is characterized in that, the coordinate of described measurement point satisfies:
Wherein R is described base radius.
10. the measuring system that substrate inclination according to claim 8 and foundation stone tilt is characterized in that the height value that the vertical control system of work stage described in the motion process is controlled described work stage is always certain value, and described work stage tilting value is always zero.
11. the measuring system that substrate inclination according to claim 8 and foundation stone tilt, it is characterized in that, utilize described work stage level to taking described measurement point to optical axis following time with vertical control system, measure the height and the tilting value of the relative optimal focal plane of measurement point under the described optical axis by described focusing and leveling sensor, measure and finish the back and move to next measurement point to controlling work stage with vertical control system by described work stage level.
12. the measuring system that substrate inclination according to claim 8 and foundation stone tilt, it is characterized in that, the described computing method coincidence formula Z=ax+by+c that obtains upper surface of substrate fit Plane coefficient, wherein Z is the height value, (x of described measurement point, y) be the coordinate, (a of described measurement point, b c) is the fitting coefficient of the fit Plane of described upper surface of substrate.
13. the measuring system that substrate inclination according to claim 12 and foundation stone tilt is characterized in that the described computing method coincidence formula (R that obtains the substrate tilting value
X, substrate=b, R
Y, substrate=-a), wherein (R
X, substrate, R
Y, substrate) be the substrate tilting value.
14. the measuring system that substrate inclination according to claim 8 and foundation stone tilt is characterized in that the described computing method coincidence formula R that obtains the foundation stone tilting value
X, stone=-R
X, substrate-＜R
x, R
Y, stone=-R
Y, substrate-＜R
y, (R wherein
X, substrate, R
Y, substrate) be the substrate tilting value, (R
x, R
y) be the measurement point tilting value, (R
X, stone, R
Y, stone) be the foundation stone tilting value.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100457459A CN101482399B (en) | 2009-02-03 | 2009-02-03 | Method and system for measuring substrate inclination and cornerstone inclination |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100457459A CN101482399B (en) | 2009-02-03 | 2009-02-03 | Method and system for measuring substrate inclination and cornerstone inclination |
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| Publication Number | Publication Date |
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| CN101482399B true CN101482399B (en) | 2011-08-10 |
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| CN103246169B (en) * | 2012-02-03 | 2015-04-15 | 上海微电子装备有限公司 | Apparatus and method for focal plane change measurement |
| CN107024185B (en) * | 2016-01-29 | 2020-08-25 | 上海微电子装备（集团）股份有限公司 | Method and device for measuring basal surface |
| CN107045266B (en) * | 2017-03-22 | 2019-01-15 | 国家纳米科学中心 | Successive ignition leveling method for large-area laser straight-writing system |
| CN114734136A (en) * | 2022-04-20 | 2022-07-12 | 上海柏楚电子科技股份有限公司 | Laser processing machine tool and laser processing method |
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Address after: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |
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