200842452 九、發明說明： 【發明所屬之技術領域】 本發明係關於散熱器，尤指一種應用於液晶顯示器之 背光模組中之散熱器結構設計。 【先前技術】 液晶顯示器（LCD)中之液晶面板本身，因不具有主動 發光之特性，因此，為使液晶面板的螢幕可以清楚地顯示 畫面’於該液晶面板背面一般均會設置一背光模組，用以 對液晶面板提供必要的背光源。 前述之背光模組主要係包括一導光板、至少一組發光 組件没於該導光板側邊、一反射板設於導光板背面、以及 至少一光學膜片設於該導光板前面，藉此，利用發光組件 發光投入於該導光板側邊的入光面，經導光板内部對光的 折射、以及反射板對光之反射，使光由導光板前面射出， 並透過光學膜片’使光均勻散射，用以對液晶面板提供均 勻的背光源。 前述背光模組中之發光組件，除使用冷陰極燈管外， 尚有使用發光二極體（Light Emitting Diode， LED)作為 發光組件。針對使用發光二極體為發光組件之背光模組， 因發光二極體發光時會產生熱，該背光模組中因無任何散 熱機制，是故，為減少熱量的產生，目前已知的背光模組 均係使用低功率的發光二極體，避免使用高功率的發光二 極體。 & — 惟前揭背光模組選用低功率發夬-托辦 ^ 刀千知尤一極體，雖可相較於 4 200842452 高功率發光二極體減少熱量的產生，但為提供液晶面板足 夠的光亮度，於是，該背光模組即需使用較多數量的低功 率發光二極體，如此一來，不僅該背光模組中之發光組件 成本較高，同時，使用多數個低功效率發光二極體後\該 背光模組之操作溫度仍高達12(rc以上，仍有高溫無法有 效散發之問題存在。 為改善前述背光模組散熱問題，目前已知的做法是提 供一鋁質基板彎折成端視呈L形的散熱板，並以散熱板的 一側短邊提供設有數發光二極體之電路板組設其上，'以期 利用該散熱板擴大散熱面積，改善背光模組之散熱問題。 惟前述提供的L形散熱板設計，雖可對發光二極體提 供散熱機制，但因該散熱板對於發光二極體產生的熱所提 供的熱傳速率慢，使得該背光模組之操作溫度仍維持於9〇 c以上，無法使該操作溫度下降至6〇c>c以下之較佳工作溫 又疋故w亥政熱板可長:供散熱效果十分有限，且因該散 熱板可提供之散熱效能不佳，無法使該背光模組進一步將 低功率發光二極體換裝為高功率發光二極體來降低成本。 【發明内容】 本發明之主要目的在於提供一種液晶顯示器之背光模 組散熱器，希藉此設計改善先前既有背光模組之散熱板散 熱效果不佳之缺點。 為達成前揭目的，本發明所設計之液晶顯示器之背光 模組散熱器係包括·· 至少一熱導管，包括一封閉的中空導熱管件以及充填 5 200842452 於該導熱官件内的熱傳介質；以及 至少一散熱片，設於該熱導管上。 本發明藉由前述散熱器設計，相較於先前既有之散熱 板設計’其特點在於： μ 本發明利用該熱導管提供設有發光二極體的電路板組 設其中，可藉由該熱導管中之液態熱傳介質快速熱傳之特 性，使熱傳導至熱導管遠離發光二極體之遠端散熱片處， 再進一步藉該散熱片擴大散熱面積，而達到較佳之散熱效 ι 果，依據前述散熱器試作樣品測試，可使背光模組的操作 溫度下降低至60°C以下之較佳工作溫度。而且，本發明藉 此高效能之背光模組散熱器設計，使該背光模組可以將多 數個低功率發光二極體換裝成少數高功率的發光二極體， 以降低成本。 【實施方式】 如第一至三圖所示，係揭示本發明液晶顯示器之背光 模組散熱器之數種較佳實施例，由圖中可以見及，該散熱 器係包括至少一熱導管（1 〇 )以及至少一散熱片（2 〇 )， 所述之熱導管（10)及散熱片（20)數量可依液晶顯 示器之液晶面板尺寸的大小，或依該背光模組中設於導光 板側邊的發光二極體（2 )的位置及數量而設定，其中： 所述之熱導管（1 0 ) ’其包括一封閉的中空導熱管 件（1 1)以及充填於邊導熱管件（1 1)内部的熱傳介 質（1 2)(如第四圖所示者），所述之導熱管件（丄工） 係熱傳導性能佳之金屬材料（如铭合金、銅合金…等）所製 6 200842452 成，該熱傳介質 之液態熱傳介質；如第態冷媒或其他熱傳效能佳 可為-組接部（13)以及—圖所不，該導熱管件（11) 拉Λ < Ί 1 1 3 )以及二延伸部（1 4 )銜接於該组 3 )兩端平行延伸所構成之〔形體，或者，，導 Γ:(11)可為二組接部（…平行設=及= = (14)銜接於該二組接部（1 所：成之门型體，或如第三圖所示，.導熱管件（1:; ::組接部（"）平行設置以及二延伸部（14)銜 接於該二組接部（1 q 1 1 3 )相對應之兩端間構成之口字形體； 熱管件（11)彳為—組接部（Η)以及一 ==4))銜接於該組接部（"）-端所構成之L Φ 體（圖未不),τ ^ ^ 匚形體或-π形體另一 =熱官件（11)可併合成-、， 另可以一個匚形或门形體導熱管件（1 1 )可併合成一 口形體。 ;所述之散熱片（2 Q)係組設於該熱導管（1〇)上， ::熱片（2 0)係熱傳導性能佳之金屬材料（如鋁合金、 m)所製成，該散熱片（2Q)具有—固接部，以 :一散熱部（2 2 )設於該固接部（2 1 )之側邊，藉以 用。口接邛（2 1 )組設於該熱導管（1 〇 )上，該散 (2 0 ) <固接部（2丄）可如第—至三圖所示之較 “施例’該散熱片（20)之固接冑（21)形成具有 二夾片部（91 Ί、 匕丄1)呈間隔交錯排列狀之形體，藉以利用 =二夾片邛（2 1 1)夾持固定於該熱導管（丄〇)上， 田然’所述之固接部亦可形成其他可固定於該熱導管之形 200842452 體；另該散熱片（20)之散熱部（22)可形成—具有 複數穿孔（2 2 1 )之平板，使其具有較大的散熱面積。 本發明之散熱器（1 )應用於背光模組時，如第二、 三圖以及第五圖所示，可令該背光模組中設有數顆發光二 極體（2)之電路板（3)組設於該熱導管（丄〇)之一 或二組接部（1 3 )内側面上，所述之散熱片（2 〇 )則 可選擇組設於該熱導管（i 〇 )之延伸部（丄4 )任一 全部或是未組設發光二極體（2 )及電路板（3 )之組接 部（1 3 )上，另於導光板（4 )背面裝設一反射板（5 )， 再令該結合有發光二極體（2)及電路板（3)之散熱器 (1 )裝設於反射板（5 )之後，並使該發光二極體（2 ) 朝向該導光板（4 )側邊的入光面，該導光板（4 )前面 另δ又至少一光學膜片（6 )，或進一步於其外側加裝框架 (7 )，組成一可應用於液晶面板背面提供背光源的背光 模組。 本發明散熱器於使用時，可令該具有數發光二極體 (2 )的電路板（3 )工作產生的熱透過内含熱傳介質（1 2)的熱導管（1 〇)快速地熱導至遠離發光二極體（2) 處的散熱片（20)上，藉由該散熱片（20)擴大散熱 面積加速散熱，如此，藉此高效能的散熱機制，使該背光 模組可以有效降低其操作溫度至6〇它以下之較佳工作溫 度’基於本發明提供了強效之散熱器，使該背光模組可以 選用少量高功率發光二極體取代多數低功率發光二極體， 仍可藉由該散熱器提供良好的散熱效能，是故，本發明確 8 200842452 17提供員極具產業利用價值之背光模組散熱器設計。 【圖式簡單說明】 第一圖係本發明背光模組散熱器之第一較佳實施例之 局部立體分解示意圖。 第一圖係第一圖所示背光模組散熱器第一較佳實施例 組裝具有發光二極體之電路板之立體示意圖。 第三圖係本發明背光模組散熱器第二較佳實施例組裝 具有發光二極體之電路板之立體示意圖。 第四圖係本發明背光模組散熱器中之熱導管剖面示意 圖0 第五圖係第一圖所示背光模組散熱器第一較佳實施例 應用於背光模組中之立體分解示意圖。 【主要元件符號說明】 (1)散熱器 （2)發光二極體 (3 )電路板 （4 )導光板 (5 )反射板 (7 )框架 (1 〇 )熱導管 (1 2 )熱傳介質 (13)組接部 (2 0 )散熱片 (211)夾片部 (6 )光學膜片 (1 1 )導熱管件 (1 4 )延伸部 (2 1 )固接部 (2 2 )散熱部 (2 2 1 )穿孔 9200842452 IX. Description of the Invention: [Technical Field] The present invention relates to a heat sink, and more particularly to a heat sink structure design applied to a backlight module of a liquid crystal display. [Prior Art] The liquid crystal panel itself in the liquid crystal display (LCD) does not have the characteristics of active illumination. Therefore, in order to make the screen of the liquid crystal panel clearly display the screen, a backlight module is generally disposed on the back of the liquid crystal panel. Used to provide the necessary backlight for the LCD panel. The backlight module mainly includes a light guide plate, at least one set of light emitting components is not disposed on a side of the light guide plate, a reflective plate is disposed on a back surface of the light guide plate, and at least one optical film is disposed in front of the light guide plate, thereby The light-emitting component is used to illuminate the light-incident surface of the light guide plate, and the light is refracted by the light guide plate and the light is reflected by the reflector, so that the light is emitted from the front surface of the light guide plate, and the light is transmitted through the optical film. Scattering to provide a uniform backlight to the LCD panel. In the light-emitting component of the backlight module, in addition to the use of a cold cathode lamp, a light-emitting diode (LED) is used as a light-emitting component. For a backlight module using a light-emitting diode as a light-emitting component, heat is generated when the light-emitting diode emits light, and the backlight module has no heat-dissipating mechanism, so that the backlight is known to reduce heat generation. The modules use low-power LEDs to avoid the use of high-power LEDs. & - Only the front-end backlight module uses a low-power hairpin-to-handle ^ knife to know one pole, although it can reduce the heat generation compared to the 4 200842452 high-power light-emitting diode, but it is enough to provide a liquid crystal panel The brightness of the backlight module requires a large number of low-power light-emitting diodes, so that not only the cost of the light-emitting component in the backlight module is high, but also a plurality of low-power-emitting lights are used. After the diode, the operating temperature of the backlight module is still as high as 12 (rc or more, there is still a problem that the high temperature cannot be effectively radiated. In order to improve the heat dissipation problem of the backlight module, it is known to provide an aluminum substrate bend. The heat dissipation plate is folded into an L-shaped end, and a circuit board assembly with a plurality of light-emitting diodes is provided on one short side of the heat dissipation plate, in order to use the heat dissipation plate to expand the heat dissipation area, and improve the backlight module. The heat dissipation problem. However, the L-shaped heat sink design provided above can provide a heat dissipation mechanism for the light-emitting diode, but the heat transfer rate provided by the heat sink for the heat generated by the light-emitting diode is slow, so that the backlight mode is The operating temperature is still maintained above 9〇c, and the operating temperature cannot be lowered to 6〇c>c. The preferred working temperature is lower. Therefore, the heat board can be long: the heat dissipation effect is very limited, and the heat dissipation is limited. The heat dissipation performance of the board can be poor, and the backlight module can not be further replaced with a low-power light-emitting diode as a high-power light-emitting diode to reduce the cost. SUMMARY OF THE INVENTION The main object of the present invention is to provide a liquid crystal display. The backlight module heat sink is designed to improve the heat dissipation effect of the heat sink of the prior backlight module. To achieve the foregoing, the backlight module heat sink of the liquid crystal display designed by the present invention includes At least one heat pipe comprising a closed hollow heat pipe member and a heat transfer medium filled in the heat conductive member; and at least one heat sink disposed on the heat pipe. The invention is designed by the heat sink Compared with the prior heat sink design, the present invention is characterized in that: μ the present invention utilizes the heat pipe to provide a circuit board assembly provided with a light emitting diode, by which The rapid heat transfer of the liquid heat transfer medium in the heat pipe allows the heat to be transmitted to the heat pipe away from the remote heat sink of the light emitting diode, and further expands the heat dissipation area by the heat sink to achieve better heat dissipation effect. According to the test sample test of the heat sink, the operating temperature of the backlight module can be lowered to a preferred operating temperature below 60 ° C. Moreover, the backlight module heat sink design of the present invention is utilized to enable the backlight module A plurality of low-power light-emitting diodes can be replaced with a few high-power light-emitting diodes to reduce the cost. [Embodiment] As shown in the first to third figures, the backlight module of the liquid crystal display of the present invention is disclosed. The preferred embodiment of the device, as can be seen from the figure, the heat sink comprises at least one heat pipe (1 〇) and at least one heat sink (2 〇), the heat pipe (10) and the heat sink (20) The number may be set according to the size of the liquid crystal panel of the liquid crystal display, or according to the position and quantity of the light emitting diodes (2) disposed on the side of the light guide plate in the backlight module, wherein: the thermal conductivity The tube (10) 'includes a closed hollow heat transfer tube member (1 1) and a heat transfer medium (12) (as shown in the fourth figure) filled inside the edge heat transfer tube member (11), The heat-conducting pipe fittings (completed) are made of metal materials with good thermal conductivity (such as alloys, copper alloys, etc.). The liquid heat transfer medium of the heat transfer medium; for example, the state of the refrigerant or other heat transfer performance is good. - the joint (13) and the figure are not, the heat pipe member (11) pulls < Ί 1 1 3 ) and the two extensions (14) are connected to the group 3) Shape, or, guide: (11) can be two sets of joints (... parallel set = and = = (14) connected to the two sets of joints (1: into the door shape, or as shown in the third figure As shown, the heat-conducting pipe member (1:; :: assembly portion (") is arranged in parallel and the two extension portions (14) are connected to the opposite ends of the two-group joint portion (1 q 1 1 3 ). The mouthpiece body; the heat pipe member (11) is - the joint (Η) and a == 4)) is connected to the L Φ body formed by the (")-end of the set (not shown), τ ^ ^ 匚 shape or -π shape Another officer = thermal element (11) can be synthesized, and - a channel-like shape may be another ,, OR gate heat transfer tubes shaped body member (11) can be synthesized, and a molded article. The heat sink (2 Q) is assembled on the heat pipe (1〇), and the hot film (20) is made of a metal material (such as aluminum alloy, m) having good heat conduction performance. The sheet (2Q) has a fixing portion such that a heat dissipating portion (2 2 ) is provided on the side of the fixing portion (2 1 ) for use. The port joint (2 1 ) is disposed on the heat pipe (1 〇), and the scatter (2 0 ) < fixed portion (2 丄) can be as shown in the first to third figures. The fixing 胄 (21) of the heat sink (20) is formed into a shape having two clip portions (91 Ί, 匕丄 1) arranged in a staggered manner, thereby being clamped and fixed by the y clip 邛 (2 1 1). The fixing portion of the heat pipe (丄〇), Tian Ran' can also form another shape of the heat sink (2008) which can be fixed to the heat pipe (2008); and the heat dissipating portion (22) of the heat sink (20) can be formed - a plurality of perforated (2 2 1 ) plates having a large heat dissipation area. When the heat sink (1) of the present invention is applied to a backlight module, as shown in the second, third, and fifth figures, a circuit board (3) having a plurality of light-emitting diodes (2) in a backlight module is disposed on one side of the heat pipe (丄〇) or on the inner side of the two-group (1 3), the heat sink (2 〇), you can choose any one of the extensions (丄4) of the heat pipe (i 〇) or the assembly of the LED (2) and the circuit board (3). 1 3) on, and on the light guide a reflector (5) is mounted on the back of the board (4), and the heat sink (1) incorporating the light emitting diode (2) and the circuit board (3) is mounted behind the reflector (5), and The light emitting diode (2) faces the light incident surface of the side of the light guide plate (4), and the light guide plate (4) is further δ and at least one optical film (6), or further has a frame attached thereto ( 7), forming a backlight module that can be applied to the backlight of the liquid crystal panel to provide a backlight. The heat sink of the present invention can use the heat generated by the operation of the circuit board (3) with the light-emitting diodes (2). The heat pipe (1 )) containing the heat transfer medium (1 2) is rapidly thermally conducted to the heat sink (20) away from the light emitting diode (2), and the heat sink (20) is used to expand the heat dissipation area to accelerate heat dissipation. Thus, the high-efficiency heat dissipation mechanism enables the backlight module to effectively lower its operating temperature to a better operating temperature below 6 '. Based on the present invention, a powerful heat sink is provided, so that the backlight module can A small number of high-power light-emitting diodes are used to replace most low-power light-emitting diodes, and the heat sink can still be used. For good heat dissipation performance, the present invention is a backlight module heat sink design with high industrial value. The first picture is the first of the backlight module heat sink of the present invention. A first perspective view of a preferred embodiment of the backlight module heat sink shown in the first embodiment is a perspective view of a circuit board having a light emitting diode. The third figure is the backlight of the present invention. The second preferred embodiment of the module heat sink is assembled with a schematic diagram of a circuit board having a light-emitting diode. The fourth figure is a schematic cross-sectional view of the heat pipe in the backlight module heat sink of the present invention. The first preferred embodiment of the backlight module heat sink is applied to the stereoscopic exploded view of the backlight module. [Main component symbol description] (1) Heat sink (2) Light-emitting diode (3) Circuit board (4) Light guide plate (5) Reflector plate (7) Frame (1 〇) Heat pipe (1 2 ) Heat transfer medium (13) Assembly part (20) Heat sink (211) Clip part (6) Optical film (1 1) Heat pipe member (1 4 ) Extension portion (2 1 ) Fixing portion (2 2 ) Heat sink portion ( 2 2 1) Perforation 9