TW200839962A - Contact sensor - Google Patents
Contact sensor Download PDFInfo
- Publication number
- TW200839962A TW200839962A TW96110444A TW96110444A TW200839962A TW 200839962 A TW200839962 A TW 200839962A TW 96110444 A TW96110444 A TW 96110444A TW 96110444 A TW96110444 A TW 96110444A TW 200839962 A TW200839962 A TW 200839962A
- Authority
- TW
- Taiwan
- Prior art keywords
- carrier
- electrostatic
- sensing
- pad
- contact
- Prior art date
Links
- 235000012431 wafers Nutrition 0.000 claims description 27
- 230000003068 static effect Effects 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005538 encapsulation Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 241000282376 Panthera tigris Species 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96110444A TW200839962A (en) | 2007-03-27 | 2007-03-27 | Contact sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96110444A TW200839962A (en) | 2007-03-27 | 2007-03-27 | Contact sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200839962A true TW200839962A (en) | 2008-10-01 |
| TWI334635B TWI334635B (enrdf_load_stackoverflow) | 2010-12-11 |
Family
ID=44212005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96110444A TW200839962A (en) | 2007-03-27 | 2007-03-27 | Contact sensor |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200839962A (enrdf_load_stackoverflow) |
-
2007
- 2007-03-27 TW TW96110444A patent/TW200839962A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI334635B (enrdf_load_stackoverflow) | 2010-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |