200839492 九、發明說明·· 【發明所屬之技術領域】 制、土本發明係關於一種散熱器、散熱基座及散熱基座之 二方法’特別是詩-種熱傳導效能佳之散熱器、散 …、土座及散熱基座之製造方法。 【先前技術】 Φ 由於科技的進步，各種電子產品（例如中央處理器 及曰曰片組等）趨向功能性提高與尺寸微型化方向發展， 所使用的電子元件集積度密集，而散熱需求也就越來越 大政熱放犯直接影響電子產品的可靠度與使用壽命。 以中央處理n的散熱結構為例，通常將—散熱器黏 口、扣合或焊接^置於中央處理器上，並與中央處理器 接觸’將中央處理器所產生的熱能導出並散熱，習知技 術更在散熱器上加裝一風扇，以加強散熱效能。 • 一請參照^ 1圖所示，-種習知之散熱裝置1係包括 平板式熱管11以及一散熱元件12;散熱元件12係設 • f於平板式熱管11上，通常散熱元件12具有複數個散 .=曰片I21。平板式熱管11係具有一上蓋11T及一下 "\UB’上盍11τ之内表面上具有一第一毛細結構lu， 下盍11B之内表面上具有一第二毛細結構112。當組 平板式熱管11時，上蓋11T與下蓋11B以焊接相 結合:使上蓋11τ及下蓋11β内形成一容置空間⑴， I使第一毛細結構1U與第二毛細結構112連結；再於 200839492 作流體W並抽真空以形成平板 工 容置空間11S填充 式熱管11之結構。 散熱裝置1係設置於一電子裝置（圖未顯示），例 如中央處理器上，使平板式熱管η與電子裳置接觸。 當電子裝置運作產生熱源時，熱源傳導至平板式熱管n ^之^體入’並藉由第一毛細結構⑴及第二毛細結構 112相配合，將数源僂宴$私抽- 、？得¥至政熱兀件12，以逸散埶源。 然而，此種方式由於平板式熱管u之上苔ιιτ盥 下蓋UB需藉由焊接方式加以連結，故焊道路徑較b =可靠度比較不穩定，且構成平板式熱管η的上 盍及下盖11Β需使用不同模具，悍接技術 且 需治具配合，故製程成本相對提高。此外， Π 11之上蓋11Τ及下蓋仙之幾何形狀的限制/而 無法同時燒結’使第一毛細結構lu肖第二毛細結構 112亚不具有連_性，意即第—毛細結構η! 連接處為不連續性，進而造成嶋^ 散熱效能降低。 1 < j因於此，如何提供—種能夠降低製程成本、減少 ::役及能夠一次同時燒結，進而使熱傳導效能佳之 政熱器、散熱基座及其製造方法’實為重要課題=之 【發明内容】 有鑑於上述課題，本發明 易、一娜成剞~I广 之目的為提供一種製程簡 “型繼座以降低製程成本、提升熱傳導效 200839492 能之散熱器、散熱基座及其製造方法。 緣是，為達上述目的 劍、生士、土 依據本盔明之一種散熱基座 之衣k方法包括：据供—^ ^ 八蛉熱主體，導熱主體之二端部 为別具有一開口；加工導埶 你甘曰> * 命熱主體，使其具有不同的直徑 部；扁平化導熱主體之夬古 聪之大直梭部；以及封閉導熱主體之 該荨開口至少其中之一。200839492 IX. INSTRUCTIONS········································································· Method for manufacturing earth seat and heat sink base. [Prior Art] Φ Due to advances in technology, various electronic products (such as central processing units and enamel groups) tend to be functionally improved and miniaturized in size. The electronic components used are densely packed, and the heat dissipation requirements are also More and more political pressures directly affect the reliability and service life of electronic products. Taking the heat dissipation structure of the central processing n as an example, the heat sink is bonded, fastened, or soldered to the central processing unit, and is in contact with the central processing unit to extract and dissipate the heat generated by the central processing unit. Knowing technology adds a fan to the heat sink to enhance heat dissipation. • As shown in Fig. 1, a conventional heat sink 1 includes a flat heat pipe 11 and a heat dissipating component 12; the heat dissipating component 12 is provided on the flat heat pipe 11, and usually the heat dissipating component 12 has a plurality of散.=曰片I21. The flat heat pipe 11 has an upper cover 11T and a lower "\UB' upper 盍11τ having a first capillary structure lu on its inner surface, and a lower surface 11b having a second capillary structure 112 on its inner surface. When the flat heat pipe 11 is assembled, the upper cover 11T and the lower cover 11B are combined by welding: an accommodation space (1) is formed in the upper cover 11τ and the lower cover 11β, and the first capillary structure 1U is coupled with the second capillary structure 112; The fluid W is evacuated at 200839492 to form a structure of the flat-plate accommodating space 11S filled heat pipe 11. The heat sink 1 is disposed on an electronic device (not shown), such as a central processing unit, to bring the flat heat pipe η into contact with the electronic skirt. When the electronic device operates to generate a heat source, the heat source is conducted to the flat heat pipe n ^ and the first capillary structure (1) and the second capillary structure 112 are matched, and the digital source is arbitrarily pumped. Get ¥ to the political enthusiasm 12, to escape the source. However, in this way, since the lower surface of the flat heat pipe u is covered by the welding method, the bead path is unstable compared with b = reliability, and the upper and lower sides of the flat heat pipe η are formed. The cover 11 needs to use different molds, the splicing technology and the need for the fixture to cooperate, so the process cost is relatively improved. In addition, the geometry of the cover 11Τ and the lower cover of the crucible 11 is limited/cannot be sintered at the same time 'the first capillary structure lu is not connected to the second capillary structure 112, that is, the first capillary structure η! The discontinuity is caused by the heat dissipation of the 嶋^. 1 < j Because of this, how to provide a kind of technology that can reduce the cost of the process, reduce: and can simultaneously sinter at the same time, so that the heat transfer performance is good, the heat sink and its manufacturing method are really important issues = SUMMARY OF THE INVENTION In view of the above problems, the present invention is easy to use, and the purpose of the invention is to provide a process-stable "seat" to reduce process cost, improve heat transfer efficiency, heat sink and heat sink base of 200839492 The manufacturing method. The edge is that the method for the purpose of the above-mentioned purpose sword, raw materials, soil according to the helmet of a heat sink base k includes: According to the supply - ^ ^ gossip hot body, the two ends of the heat-conducting body have one Opening; processing guides you are 曰 曰 * * 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命 命
為達上述目的’依據本發明之—種散熱基座包括一 導熱主體。導熱主體係具有-容置”及-開口，開口 位於谷置空間之-端。其中，導熱主體係為單—管狀體 加工而成。 為達上述目的，依據本發明之一種散熱器包括一散 熱基座以及m件。散熱基座係具有—導熱主體， 導熱主體具有-容置空間及一開口，開口位於容置空間 之一端。其中’I熱主體係為單一管狀體加工而成。散 熱元件係設置並連結於散熱基座。 承上所述，因依據本發明之一種散熱器、散熱基座 及其製造方法係將散熱基座之導熱主體藉由單一管狀 體加工而形成具有容置空間及開口的結構。與習知技術 相較，本發明一體成型散熱基座，取代習知以上蓋及下 盍結合再行焊接之結構設置，此種方式不僅能夠免除焊 接燒結，簡化製程及降低生產成本，避免焊接影響可靠 度，更能夠藉由加工導熱主體使散熱基座依據實際需求 成型各種幾何形狀。此外，散熱基座能夠與導熱管搭配 結合構成各式的組合態樣，符合不同的散熱需求，使散 7 200839492 熱器及散熱基座能夠彈性配置，進而提升散熱效能。 【實施方式】 以下將參照相關圖式，說明依據本發明較佳實施例 之一種散熱器、散熱基座及其製造方法，其中相同的元 件將以相同的參照符號加以說明。 請參照第2圖、第3A圖至第3D圖所示，第2圖 係本發明第一實施例之一種散熱基座2A之製造方法係 包括步驟S〇1至步驟別4。第3A圖至第3D圖係為散熱 基庄2 A之製造方法的流程。 巧芩照第2圖與第3A圖所示，步驟s〇丨係提供一 導熱主體21A，導熱主體21A之二端部分別具有一開口 21卜212。於本實施例中，導熱主體21八係為單一管狀 體’其材質具有高導熱特性及高延展特性，以兼顧導熱 及適於加工的需求，例如但不限於金屬或合金，而當導 熱主體21A之材質為金屬時，係可為銅或鋁。 結構 内壁 成， 毛細結構213設置於導熱主體 熱主體21A與毛細結構213為 此0 此外，於本實施例中，導熱主體21A係具有一毛細In order to achieve the above object, a heat dissipating base according to the present invention includes a heat conducting body. The heat conduction main system has a "accommodation" and an opening, and the opening is located at the end of the valley space. The heat conduction main system is processed by a single-tubular body. To achieve the above object, a heat sink according to the present invention includes a heat dissipation. The susceptor and the m-piece. The heat-dissipating base has a heat-conducting body, the heat-conducting body has a accommodating space and an opening, and the opening is located at one end of the accommodating space. The 'I thermal main system is processed by a single tubular body. The heat sink and the heat dissipation base and the manufacturing method thereof are formed by processing a heat conductive body of the heat dissipation base by a single tubular body to have a receiving space. And the structure of the opening. Compared with the prior art, the integrated heat-dissipating base of the present invention replaces the conventional structure of the above cover and the lower jaw combined with the welding, which not only eliminates welding and sintering, simplifies the process and reduces the production. The cost, avoiding the influence of soldering reliability, and the ability to form a heat-conducting body to shape various geometries according to actual needs by processing the heat-conducting body. The seat can be combined with the heat pipe to form various combinations, which meets different heat dissipation requirements, so that the heat dissipation and heat dissipation base can be flexibly configured to improve the heat dissipation performance. [Embodiment] Reference will be made to the related drawings. A heat sink, a heat sink base, and a method of manufacturing the same according to a preferred embodiment of the present invention will be described with the same reference numerals. Referring to FIG. 2, FIG. 3A to FIG. 3D 2 is a manufacturing method of a heat dissipation base 2A according to a first embodiment of the present invention, which includes steps S1 to 4: 3A to 3D are processes of a heat dissipation base 2 A manufacturing method. As shown in Fig. 2 and Fig. 3A, the step s is to provide a heat conducting body 21A, and the two ends of the heat conducting body 21A respectively have an opening 21 212. In this embodiment, the heat conducting body 21 is eight. It is a single tubular body whose material has high thermal conductivity and high ductility to meet the requirements of heat conduction and processing, such as but not limited to metal or alloy, and when the material of the heat conductive body 21A is metal, The structure of an inner wall of copper or aluminum, the capillary structure 213 is provided to heat the thermally conductive body 21A and the capillary structure body 213 is 0 In addition to this, in the present embodiment, the thermally conductive body having a capillary system 21A
^主體21A為一體成型製 成散熱基座2A後，再將 豐21A之内壁。在此係以導 為一體成型為例，但不限於^ The main body 21A is integrally formed to form the heat dissipation base 2A, and then the inner wall of the 21A is further formed. In this case, it is taken as an example, but it is not limited to
請參照第2圖與第3B 200839492 . 熱主體21A使其具有不同的直徑部。將呈單一管狀體的 導熱主體21A經由加工而形成不同的直徑部，意即導熱 主體21A係於加工後而區分為一大直徑部di^_小^ 徑部D2。此外，導熱主體21A之加工方式係可為❹ 擠壓成型或衝壓成型之方式。 請參照帛2圖與第3C圖所示，步，驟S03係扁平化 導熱主體21A之大直徑部D1。此時，導熱主 大直徑部D1於實質上係呈現接近長方體的形狀，且並 未元全扁平，以於後續製程充填工作流體。 請參照第2圖與第3D圖所示，步驟s〇4係封閉導 熱主體21A之該等開口 211、212至少其中之一。於本 貝把例中，V熱主體21A係封閉鄰近大直徑部d 1之開 口 211，而封閉之方式並無限制，係可以焊接、熔接、 壓合或黏合方式達成。此時，導熱主體21A係具有一容 置空間214及開口 212，而容置空間214係設置於已扁 _ 平化之大直徑部D1内，開口 212係位於容置空間214 之一端，即開口 212係鄰設於小直徑部D2，並用以作 . 為工作流體的注入口。於本實施例中，係將適量之工作 - 流體，例如易於蒸發之液體（蒸發溫度與環境溫度相 近）、水或冷卻液，自開口 212注入容置空間214内， 然後，再將開口 212加以密封，完成散熱基座2A的製 作。 、 請參照第4圖所示，本發明第二實施例之一種散熱 基座2B之製造方法係包括步驟s〇i至步驟s〇5。由於 9 200839492 步驟SOI至步驟S04係已於上述第一實施例詳予說明， 故於此不再贅述。 5月苓照第4圖與第5圖所示，步驟S05係連結導熱 體A之小直徑部於一導熱管之一端u卜此 外，本實施例之導熱管22的内壁具有毛細結構213(圖 未示導熱管22與導熱主體21A之連結方式並無限 制，係可為焊接方式，亦可為—體成型製成，在此亦以 導熱主體21A與導熱管22為一體成型為例。故毛細結 構213係自容置空間214及開口 212延伸至導熱管^ 之内壁。當導熱管22之一端221與小直徑部〇2相連結 柃，導熱官22係與開口 212及容置空間214相通，工 作流體係可藉由毛細結構213流動於導熱管22與容置 空間214之間，而導熱管22之另一端222係為密封。 請再參照第4圖所示，本發明第三實施例之一種散 熱基座2C之製造方法係包括步驟s〇1至步驟§〇6。由 於步驟S01至步驟S05係已於上述第一及第二較佳實施 例詳予說明，故於此不再贅述。 請參照第4圖與第6圖所示，步驟s〇6係連結導熱 管22之另一端222於另一導熱主體21B之小直徑部' D2。其中’另一導熱主體21B包括一開口 212、一大直 徑部D1、一小直徑部D2及一容置空間214，其構成與 功能係與開口 212、大直徑部D1、小直徑部D2及容置 空間214相同，故不再贅述。本實施例之導熱主體21a、 導熱管22與另一導熱主體21B之連結方式，係可藉由 10 200839492 焊接以相互連結，當然亦可以一體成型製成。意即藉由 單一導熱主體經由加工後而形成二個大直徑部Di ^一 小直徑部D2,而小直徑部D2係可伸長以形成導熱管； 然後再扁平化該等大直徑部D1，並注入適量工作流 體，再封閉各鄰近該等大直徑部D1之該等開口，即可 完成散熱基座2C。此時，導熱主體21A及21B係具有 -一個容置空間214，而毛細結構（圖未示）係佈滿導熱主 體21A、21B及導熱管22之内壁，液體係藉由毛細結 構213於該等容置空間214及導熱管22之間流動。口 請參照第7圖所示，本發明第一實施例之一種散熱 器3係包括一散熱基座2Α以及一散熱元件31，散熱基 座2Α係與第3D圖所示的散熱基座2Α具有相同的構成 與功此。散熱基座2Α係具有一導熱主體21 a，而導熱 主體21A係具有一開口 212、一毛細結構213及容置空 間214，開口 212係位於容置空間214之一端，毛細結 • 構213係設置於導熱主體21A之容置空間214的内壁， 且更設置至鄰近開口 212之内壁。導熱主體21A係由單 * 一官狀體加工而成。此外，更可自導熱主體21A之開口 -212注入適量之液體，例如易於蒸發液體、水或冷卻液 至容置空間214内。散熱元件31係具有複數個散熱鰭 片311，並設置於散熱基座2A上。散熱元件31係可以 黏合、鎖合、卡固或焊接方式與導熱主體21a連結。 凊參照第8圖所示，本發明第二實施例之一種散熱 器4係包括一散熱基座2B以及一散熱元件31，散熱基 200839492 座2B係與第5圖所示的散熱基座2δ具有相同的構成 與功能。其中，散熱基座2Β包括—導熱主體21Α及一 V熱管22，$熱主體21Α的開口 212更可與一導熱管 22連結，且毛細結構213係自容置空間214及開口 212 延伸設置至導熱管22之内壁。當散熱基座⑼係與散熱 X件31相連結時，散熱元件31係設置於導熱主體2ia 上，再將導熱官22彎折成C字型或u字型，並與散熱 元件31相接觸，而導熱管22與散熱元件31之接觸 式，係可穿設散熱元件31’或與散熱元件31之一端面， 例如但不限散熱元件3丨之頂面相接觸，在此係以導埶 管22係穿設並接觸散熱元件31為例，但不以此為限。 故電子裝置的導熱途徑有二：其一為電子裝置直 至導熱主體21A，再傳導至散熱元件31;== 置經由導熱管22傳導至散熱元件3 1 ;同時以上述二種 V熱迷徑將熱能傳導至散熱元件3丨，能夠加強散執效 能。 ”、、 請參照第9圖所示，本發明第三實施例之一種散熱 器5係包括一散熱基座2C以及一散熱元件22，散熱基 座2C係與第6圖所示的散熱基座2C具有相同的構成 與功能。其中，散熱基座2C之導熱主體21A係與導熱 管22相連結後，更經由導熱管22與另一導熱主體21β 相連結。而本實施例之另一導熱主體21B係具有一開口 212、一毛細結構213及一容置空間214，另一導熱主 脰313係與$熱主體2ia具有相同的構成與功能，故於 12 200839492 &不再I述。毛細結構213亦延伸設置 内壁及另一導熱主體21B之開ϋ212及;^吕22 = 2内壁。當散熱基座2C係與散熱元件31相連：二 ，、、凡件31係設置於導熱主體21Α ^ -以使另-導熱主體·與散熱元件穴=管 •例=不限為頂面相接觸，而另-導熱主體2ΐβ .r:二 ί::，，再傳導至散熱元:=:= 置經由導埶營22值墓石私為-从〇 ~电卞衣 經由導” 22C:;其，子装置 & 22傳v至另一導熱主體21β，再 心兀件31 ’同時以上述三種導熱途徑將孰能導 熱元们卜能夠進一步加強散熱效能。’、'、傳*至月丈 ::照第7圖至第9圖所示’散熱基m 時1 21A、21B之形狀並無限制，係可於加工 日Μ化為各種不同幾何形狀，以於散熱器3、4 二’可依據不同散熱需求，使用上述不同 基 座2A、2B、2C與散熱元件31相連結 散 器3、4、5之外形’以達到最佳的散熱效能。；= ^主體2m1B僅於與導熱管22連結處以焊接方式 ^成’故焊道路徑大A降低，相對地提升焊接之可靠 又’且當導熱主體21A、導熱管22及另一導熱主體⑽ 為一體成型時，甚至不需任何焊接。 一 絲上所述，因依據本發明之一種散熱器、散熱基座 13 200839492 及其製造方法係將散熱基座之導熱主體藉由單一管狀 體加工而形成具有容置空間及開口的結構。與習知技術 相較，本發明—體成型散熱基座，取代習知以上蓋及^ 蓋結合再行焊接之結構設置，此種方式不僅能夠免除焊 接燒結，簡化製程及降低生產成本，避免焊接影響可^ 度，更能夠藉由加工導熱主體使散熱基座依據實際需2 成型各種幾何形狀。此外，散熱基座能夠與導熱管2配 結合構成各式的組合態樣，符合不同的散熱需求，使散 熱器及散熱基座能夠彈性配置，進而提升散熱效能。月 以上所述僅為舉例性，而非為限制性者。任何未脫 離本發明之精神與範疇，而對其進行之等效修改或變 更，均應包含於後附之申請專利範圍中。 又 【圖式簡單說明】 第1圖為一種習知之散熱器的示意圖。 第2圖為依據本發明第—實施例之一種散熱基座之製 造方法的流程圖。 第3A圖至第3D圖為第2圖之散熱基座之製造方法的 示意圖。 第4圖為依據本發明第二及第三實施例之散熱基座之 製造方法的流程圖。 第5圖為依據本备明第二實施例之散熱基座的示意圖。 第6圖為依據柄、第三實_之散熱基座的示意圖。 第7圖為依據本發明第—實施例之一種散熱器的示意 14 200839492 圖。 第8圖為依據本發明第二實施例之一種散熱器的示音 圖。 …、、不思 第9圖為依據本發明第三實施例之一種散熱器的示意Please refer to Fig. 2 and 3B 200839492. The hot body 21A has different diameter portions. The heat-conducting body 21A having a single tubular body is processed to form different diameter portions, that is, the heat-conducting body 21A is divided into a large-diameter portion di^_ small-diameter portion D2 after being processed. Further, the heat-transfer main body 21A can be processed in the form of ❹ extrusion molding or press forming. Referring to Fig. 2 and Fig. 3C, in step S03, the large diameter portion D1 of the heat transfer main body 21A is flattened. At this time, the thermally conductive main large diameter portion D1 substantially assumes a shape close to a rectangular parallelepiped, and is not fully flattened to fill the working fluid in a subsequent process. Referring to Figures 2 and 3D, step s〇4 closes at least one of the openings 211, 212 of the heat-conducting body 21A. In the example of the present invention, the V hot body 21A closes the opening 211 adjacent to the large diameter portion d 1 , and the manner of sealing is not limited, and can be achieved by welding, welding, pressing or bonding. At this time, the heat conducting body 21A has an accommodating space 214 and an opening 212, and the accommodating space 214 is disposed in the flattened large diameter portion D1, and the opening 212 is located at one end of the accommodating space 214, that is, the opening The 212 series is adjacent to the small diameter portion D2 and is used as an injection port for the working fluid. In this embodiment, an appropriate amount of work-fluid, such as a liquid that is easy to evaporate (evaporation temperature is close to the ambient temperature), water or a coolant, is injected into the accommodating space 214 from the opening 212, and then the opening 212 is then applied. Sealed to complete the fabrication of the heat sink base 2A. Referring to Fig. 4, a method of manufacturing the heat dissipation base 2B according to the second embodiment of the present invention includes the steps s〇i to s〇5. Since the steps from the SOI to the step S04 are explained in detail in the above-mentioned first embodiment, the details are not described herein again. Referring to FIG. 4 and FIG. 5 in May, step S05 is to connect the small diameter portion of the heat conductor A to one end of the heat pipe. Further, the inner wall of the heat pipe 22 of the present embodiment has a capillary structure 213 (Fig. The manner in which the heat transfer tube 22 and the heat transfer main body 21A are not connected is not limited, and may be a soldering method or a body molding method. Here, the heat conductive body 21A and the heat transfer tube 22 are integrally formed as an example. The structure 213 extends from the accommodating space 214 and the opening 212 to the inner wall of the heat pipe 2. When one end 221 of the heat pipe 22 is coupled to the small diameter portion 柃2, the heat conductor 22 is connected to the opening 212 and the accommodating space 214. The workflow system can flow between the heat pipe 22 and the accommodating space 214 by the capillary structure 213, and the other end 222 of the heat pipe 22 is sealed. Referring to FIG. 4 again, the third embodiment of the present invention The manufacturing method of the heat dissipation base 2C includes the steps s〇1 to §6. Since the steps S01 to S05 have been described in detail in the first and second preferred embodiments, they are not described herein. Please refer to Figure 4 and Figure 6. Step s〇6 is the link guide. The other end 222 of the tube 22 is in the small diameter portion 'D2 of the other heat conducting body 21B. The other heat conducting body 21B includes an opening 212, a large diameter portion D1, a small diameter portion D2 and an accommodating space 214. The configuration and function are the same as the opening 212, the large diameter portion D1, the small diameter portion D2, and the accommodating space 214, and therefore will not be described again. The heat conducting body 21a of the present embodiment, the heat conducting tube 22 and the other heat conducting body 21B are connected. The system can be welded to each other by 10 200839492, and can of course be integrally formed. That is, two large diameter portions Di ^ a small diameter portion D2 are formed by processing a single heat conduction body, and the small diameter portion D2 is The heat dissipating tube 2C can be completed by forming the heat pipe by flattening the large diameter portion D1 and injecting an appropriate amount of the working fluid, and then closing the openings adjacent to the large diameter portions D1. The heat conducting bodies 21A and 21B have an accommodating space 214, and the capillary structure (not shown) is filled with the inner walls of the heat conducting bodies 21A, 21B and the heat pipe 22, and the liquid system is in the accommodating space by the capillary structure 213. 214 and the heat pipe 22 Referring to FIG. 7 , a heat sink 3 according to a first embodiment of the present invention includes a heat dissipation base 2 Α and a heat dissipating component 31 , and the heat dissipation base 2 is coupled to the heat dissipation base shown in FIG. 3D. The heat sink base 2 has a heat conducting body 21 a, and the heat conducting body 21A has an opening 212 , a capillary structure 213 and an accommodating space 214 . The opening 212 is located in the accommodating space 214 . One end, the capillary structure 213 is disposed on the inner wall of the accommodating space 214 of the heat conductive body 21A, and is further disposed to the inner wall adjacent to the opening 212. The heat conductive body 21A is processed from a single body. Further, an appropriate amount of liquid may be injected from the opening -212 of the thermally conductive body 21A, for example, to easily evaporate liquid, water or coolant into the accommodating space 214. The heat dissipating member 31 has a plurality of heat radiating fins 311 and is disposed on the heat radiating base 2A. The heat dissipating member 31 is bonded to the heat conducting main body 21a by bonding, locking, clamping or welding. Referring to FIG. 8, a heat sink 4 according to a second embodiment of the present invention includes a heat dissipation base 2B and a heat dissipating component 31. The heat dissipation base 200839492 is 2B and the heat dissipation base 2δ shown in FIG. 5 has The same composition and function. The heat-dissipating base 2 includes a heat-conducting body 21 and a V-heat pipe 22, and the opening 212 of the hot body 21 can be connected to a heat pipe 22, and the capillary structure 213 is extended from the accommodating space 214 and the opening 212 to the heat conduction. The inner wall of the tube 22. When the heat dissipation base (9) is coupled to the heat dissipation X member 31, the heat dissipation member 31 is disposed on the heat conduction body 2ia, and then the heat conductor 22 is bent into a C-shape or a U-shape and is in contact with the heat dissipation member 31. The contact between the heat pipe 22 and the heat dissipating component 31 can be disposed through the heat dissipating component 31 ′ or in contact with one end surface of the heat dissipating component 31 , for example, but not limited to the top surface of the heat dissipating component 3 , where the guiding tube 22 is used. The heat dissipation member 31 is worn and contacted as an example, but is not limited thereto. Therefore, the electronic device has two thermal conduction paths: one is an electronic device up to the heat conducting body 21A, and then conducted to the heat dissipating component 31; == is conducted to the heat dissipating component 31 through the heat conducting pipe 22; The conduction of thermal energy to the heat dissipating component 3 can enhance the performance of the dissipating effect. As shown in FIG. 9, a heat sink 5 according to a third embodiment of the present invention includes a heat sink base 2C and a heat dissipating component 22, and the heat sink base 2C and the heat sink base shown in FIG. 2C has the same configuration and function. The heat-conducting body 21A of the heat-dissipating base 2C is connected to the heat-transfer tube 22, and is further connected to the other heat-conducting body 21β via the heat-conducting tube 22. Another heat-conducting body of this embodiment The 21B has an opening 212, a capillary structure 213 and an accommodating space 214, and the other heat-conducting main 313 has the same structure and function as the heat main body 2ia, so it will not be described in 12 200839492 & 213 also extends the inner wall and the opening 212 of the other heat conducting body 21B and the wall 22 = 2 inner wall. When the heat sink base 2C is connected to the heat dissipating component 31: second, the piece 31 is disposed on the heat conducting body 21 Α ^ - So that the other heat-conducting body and the heat-dissipating component hole = tube • example = not limited to the top surface, and the other - heat-conducting body 2 ΐ β .r: two ί::,, then conduction to the heat sink element: =: =埶营22值墓石 private - from 〇 ~ electric 卞 clothing via guide" 22C:; its, sub-device & am p; 22 transmits v to the other heat-conducting body 21β, and then the core member 31' simultaneously enhances the heat-dissipating performance by the above-mentioned three heat-conducting paths. ', ', pass * to Yuezhang: According to Figure 7 to Figure 9 'The shape of the heat dissipation base m 1 21A, 21B is not limited, can be transformed into various geometric shapes during processing, to The heat sinks 3, 4 and 2' can be connected to the heat dissipating elements 31 to form an external shape of the diffusers 3, 4, 5 according to different heat dissipation requirements to achieve optimum heat dissipation performance. ; = ^ The main body 2m1B is only welded to the heat pipe 22 to be welded. Therefore, the bead path is reduced by a large A, and the welding is relatively reliable, and when the heat conducting body 21A, the heat pipe 22 and the other heat conducting body (10) are When you are in one piece, you don't even need any soldering. As described above, a heat sink and heat sink base 13 200839492 and a manufacturing method thereof according to the present invention form a structure having a housing space and an opening by processing a heat conducting body of the heat sink base by a single tubular body. Compared with the prior art, the present invention-body-formed heat-dissipating base replaces the conventional structure of the above cover and the cover combined with the re-welding, which not only eliminates welding and sintering, simplifies the process and reduces the production cost, and avoids welding. The influence can be improved, and the heat-conducting base can be processed to form various geometric shapes according to actual needs. In addition, the heat sink base can be combined with the heat pipe 2 to form various combinations, which meet different heat dissipation requirements, so that the heat sink and the heat sink base can be elastically configured to improve heat dissipation performance. The above descriptions are for illustrative purposes only and are not limiting. Any changes or modifications to the spirit and scope of the present invention are intended to be included in the scope of the appended claims. [Simplified illustration of the drawings] Fig. 1 is a schematic view of a conventional heat sink. Fig. 2 is a flow chart showing a method of manufacturing a heat dissipation base according to a first embodiment of the present invention. 3A to 3D are schematic views showing a method of manufacturing the heat sink base of Fig. 2. Fig. 4 is a flow chart showing a method of manufacturing the heat dissipation base according to the second and third embodiments of the present invention. Figure 5 is a schematic view of a heat sink according to a second embodiment of the present invention. Figure 6 is a schematic view of the heat sink base according to the handle and the third solid. Figure 7 is a schematic view of a heat sink according to a first embodiment of the present invention. Figure 8 is a diagram showing a heat sink according to a second embodiment of the present invention. Fig. 9 is a schematic view of a heat sink according to a third embodiment of the present invention.
元件符號說明： 1 散熱裝置 11 平板式熱管 2A、2B、2C 散熱基座 11B 下蓋 11T 上蓋 111 第一毛細結構 112 第二毛細結構 12、 31 散熱元件 121 、 311 散熱鰭片 11S 、214容置空間 21A、21B 導熱主體 211 、212 開口 213 毛細結構 22 導熱管 3、4、5 散熱器 D1 大直徑部 D2 小直徑部S01〜 S06 製造方法之步驟 15Component symbol: 1 Heat sink 11 Flat heat pipe 2A, 2B, 2C Heat sink base 11B Lower cover 11T Upper cover 111 First capillary structure 112 Second capillary structure 12, 31 Heat dissipating components 121, 311 Heat sink fins 11S, 214 Space 21A, 21B Heat-conducting body 211, 212 Opening 213 Capillary structure 22 Heat pipe 3, 4, 5 Heat sink D1 Large-diameter portion D2 Small-diameter portion S01 to S06 Step 15 of the manufacturing method