200838370 九、發明說明： 【發明所屬之技術領域】 本發__-種埋人式被動元件結構及其製造方法，尤指有著 高電氣值(例如電容量）的埋人式被動元件結構及其製造方^。者 【先前技術】 f 所謂“埋入式被動元件”（Embedded Passives)，係利用多層板 之内層板製程’採行_或印刷方式，將電容器或電阻器直接製 做在内層板上’再經壓合成多層板後，將可取代掉板面上組裝時 所焊接的零散（Di_te)被動元件，以節省板崎給主動元件 及其佈線者。 埋入式、植入式或藏入式技術，最早是公司利用内層 〔板面原有銅箱的毛面（Matt Side)上，另外處理上薄膜之罐錄合 至層¥成電阻性成份（Resistive Element)而壓合成為Thin core ’然後再利用兩次光阻與三次蝕刻的技術，於特定位置上形 成所需的薄膜“電阻器，，。由於是埋入在内層中，故商名稱之為200838370 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a buried passive component structure and a method of manufacturing the same, and more particularly to a buried passive component structure having a high electrical value (e.g., capacitance) and Manufacturer ^. [Prior Art] f The so-called "Embedded Passives" are used to make capacitors or resistors directly on the inner layer using the inner layer process of the multi-layer board. After being laminated into a multi-layer board, it will replace the scattered (Di_te) passive components soldered on the board surface to save the board and the driver and its router. Buried, implantable or hidden technology, the company first used the inner layer [Matt Side of the original copper box on the board surface, and the processing of the upper film tank was recorded to the layer to form a resistive component ( Resistive Element) and press-compressed into Thin core 'and then use two photoresist and three etching techniques to form the desired film "resistor at a specific position. Because it is buried in the inner layer, the name of the trade for
Buried Resistor(BR)。 在這之後，於1992年美國的PCB製造廠商--Zycon，曾在高階的 夕層板中，在原有Vcc/GND内層之外，另加入極薄（2—4mii)的 w貝層的内層板，利用其廣大面積的平行金屬銅板面，製作成為 200838370 王體f生的電谷态，此商名稱為capacit〇r(Bc)。其優點為 基頻操作下避免雜訊、提供電荷能量、穩壓。Zy_公司也曾為此 申凊了數篇_ BC的專柳卩美國專麵5, _，〇69、 5, 161，086、5,155, 655)。 絲祝’若需魏高電容H的電雜，在固定糕的情況下， 要不是採用高介電值的介電層、大面積的電源極、接地極，就是 讓宅源極、接地極S可能地接近。然而，若採用办⑽公司的埋 =式電容結構時，因為必縣用超薄的基材，使得作業_，同 時良耗偏低。在此種電容結構中，電源極、介電層、接地極是 依序堆疊，並且為了有較高的電容量，電源極、接地極彼此已十 分接近。這因為如此，在後續進行壓合製程時，很容易因為壓迫 到較上面的電源極或接地極，而迫使部分電源極或接地極伸入介 電層，進而導致電源極、接地極彼此被導通，使產品成為不良品。 因此，雖然現在製程技術已大幅提高，但是在-般設計準則中， 其介電層的厚度最低始終停留在·m。至於採用高介電質樹脂方 部分在於油墨填充完畢進行壓合的時候不容易控制 ^的尽度’同咖為必輕使職銳_皮崎免產生社人 力的問題，這樣的作法使得電路板的鋪度麵考驗。、、’°σ 【發明内容】 製造方 本發明之主要目的在提供-種獻式被動元件結構及其 200838370 法’其被動元件的電源極、接地極均在相同層級，可避免在壓合 時造成電_、接地極彼此稱，並隨著·賴分支、該些接 地分支有著越大__触量時，而域提高其電容量。 本㈣之:欠要目的在提供—龜人式_祕結構及其製造方 法其利用在製程中能傳遞電鍍電流的薄銅層，在不依賴钕刻金 屬形成線路的手段下’僅利用圖案化光阻層定義出線路層所在位 置’改以紐手段來逐一完成載板所需的線路或導通孔結構，以 (提高製程細線能力，並在製程中或結束時去除用來傳遞電鑛電流 的薄銅層，以增加可佈線空間，實現高密度載板的目的。 本發明之:欠要目的在提供-麵人式被航件結構及其製造方 法其在充填電材料至電源極、接地極之前，先粗链化電源極、 接iiL極(特別是其侧面），以提高電源極、介電層、接地極之間的 結合力’提南產品可信度。 基於上述目的，本發明埋入式被動元件結構及其製造方法，主要 ( 是將被動元件結構埋入在印刷電路板中。在此結構中，被動元件 的電源極、接地極均在相同層級，而由垂直形成在電路板的介電 層内部且彼此連通的複數個電源分支、接地分支所構成，而避免 在壓合時造成電源極、接地極彼此通路。若為電容結構時，利用 超細線路技術，使該些電源分支、該些接地分支彼此相隔微小間 距，並隨著該些電源分支、該些接地分支有著越大的側面積與數 量時，而大幅提高其電容量。 .200838370 職賴隨 【實施方式】 -立閱第’第1Α〜1β圖為本發明埋人式被動元件結構之 二圖如讀_示，從俯視肢來觀察，本發龍入式被鸯 以結構(可為電容、電阻、電感結構)主要包含電源極a、接地 亟:4、以及充填在電源極12、接地極14彼此之間、周圍的介電 ^從俯面的角度來看，電源㈣、接地極14個別包含有無 且彼此連摘魏個電齡支12a、接地分支14a。 簡單來說，為了構成電容，複數個電源分支⑶、接地分支恤 的耗狀體線路必須如第1A圖所示成對地彼此交錯且面對，或是複 個=原刀支12a、接地分支14遺線路只需成對地相互平行。 :例來說’如第1B圖所示’在本發_人式被航件結構中，被 轉的電源極12、接地極14均在相同層級，亦即均形成在基板 士相同的層面’而非如習知技術的堆疊狀，藉此完全避開敎壓合 ^可能導致的通路問題。在此結射，為了在有限的空間中大幅 提向例如電容量’本發明被動元件中的電源極12、接地極Μ，均 2^垂直形成在電路板的介·_处彼此連通魄數個電 Λ、刀支12a、接地分支所構成。 成上ϋ刀支時，利用超細線路技術，使該些電源分支他、該 200838370 些接地分14a支彼此相隔微小間距(t)，並隨著該些電源分支 12a、該些接地分支14a有著越大的侧面積(A = w χ d)與數量時， 而大幅提高其電容量。除此之外，介電層10可盡量採用高介電係 數的材料，以提高電容量。換句話說，彼此相對形成的電源分支 12a、接地分14a，每增加一對時，其侧面積就增加一倍，電容量 也隨之增加一倍。總之，以目前的線路技術來推估，本發明埋入 式被動元件結構的單位面積電容量大約可以提昇到一般水準的二 倍以上。底下，賴續綱本發日紐人紐動元件結構的製造方 法。 ° 由於本發明結構中，該些電源分支12a、該些接地分14a支彼此相 隔的間距⑴，對於電容量的影_A，因此必須制突破傳統的 細線路製程，藉著大幅縮小舰⑴，幅提昇電容量。為此， 本發明製造方法的祕製程，最好選用電鍍形成祕，而不依賴 钕刻金屬形成線路。當然，不管是電鍍出線路或侧金屬而形成 線路，、要月b形成如第1Α〜1Β圖所示之結構，均被本發明的精神 所涵蓋’底下所描述電鍍線路方式並不限制到本發明結構的形 手段。 請參閱第2A~2G ®，第2Α〜2G圖為本發明埋入式被動元件的製造 方法之示意圖。如第2Α圖所示，首先提供基板5，且基板5上已 =有可傳導電鍍電流的薄銅層7。接著，為了定義出如第ια或ΐβ 圖所不之本翻被祕射㈣雜12、接絲U(#即包含有 200838370 被此連通的複數個電源分支12a、複數個接地分支㈣，在基板5Buried Resistor (BR). After that, in 1992, Zycon, a PCB manufacturer in the United States, added a very thin (2–4 mii) w-layer inner layer to the high-end slab, outside the original Vcc/GND inner layer. Using its large area of parallel metal copper plate surface, it is made into the electric valley state of 200838370. The trade name is capacit〇r(Bc). The advantage is that it avoids noise, provides charge energy, and regulates voltage under fundamental frequency operation. Zy_ has also applied for a number of _ BC's special 卩 卩 US 专 5, _, 〇 69, 5, 161, 086, 5, 155, 655). Silk wishing 'If you need Weigao capacitor H's electric miscellaneous, in the case of fixed cake, if you use high dielectric value dielectric layer, large area power pole, grounding pole, it is to make the source and grounding pole S Probably close. However, if the buried capacitor structure of the company (10) is used, because the ultra-thin substrate is used in the county, the operation is low, and the consumption is low. In this type of capacitor structure, the power source, the dielectric layer, and the ground electrode are sequentially stacked, and in order to have a higher capacitance, the power source and the ground electrode are close to each other. Because of this, in the subsequent pressing process, it is easy to force a part of the power source or the ground electrode into the dielectric layer by pressing to the upper power source or the ground electrode, thereby causing the power source and the ground electrode to be turned on each other. Make the product a defective product. Therefore, although the process technology has been greatly improved, in the general design guidelines, the thickness of the dielectric layer is always at a minimum. As for the use of high dielectric resin, the part is that it is not easy to control the end of the ink when the ink is filled. The same coffee is used to make the job sharp. The test of the pavement. [°σ] [Invention] The main purpose of the present invention is to provide a passive component structure and its 200838370 method. The power supply and grounding poles of the passive components are all at the same level, which can be avoided during pressing. The electric _ and the grounding poles are called each other, and as the landscaping branch has a larger __touch, the domain increases its capacitance. (4): The purpose of the owing is to provide - the turtle type _ secret structure and its manufacturing method, which utilizes a thin copper layer capable of transmitting plating current in the process, and uses only the patterning means without relying on the metal forming circuit The photoresist layer defines the location of the circuit layer to change the line or via structure required to complete the carrier layer one by one to improve the process thin line capability and remove the current used to transmit the ore current during or at the end of the process. A thin copper layer for increasing the routable space and achieving a high-density carrier. The present invention has the object of providing a face-to-face maneuver structure and a manufacturing method thereof, which are filled with an electric material to a power source and a ground electrode. Previously, the power supply pole was first thickened, and the iiL pole (especially its side) was connected to improve the bonding force between the power supply electrode, the dielectric layer and the grounding electrode. The reliability of the product was lifted. Based on the above purpose, the present invention is buried. The passive passive component structure and its manufacturing method are mainly used to embed the passive component structure in a printed circuit board. In this structure, the power source and the grounding pole of the passive component are all at the same level, and are formed vertically. The plurality of power branches and ground branches inside the dielectric layer of the circuit board and connected to each other are formed to avoid the path between the power source and the ground electrode when the voltage is pressed. If the capacitor structure is used, the ultra-fine line technology is used to make the The power branches and the ground branches are separated by a small distance from each other, and the power capacity is greatly increased as the power branches and the ground branches have larger side areas and numbers. 200838370 】 -立阅第第1Α~1β图 is the second diagram of the buried passive component structure of the invention. As shown in the reading _, from the bird's eye view, the hairpin is shackled by structure (can be capacitor, resistor, The inductor structure mainly includes a power source a, a grounding 亟: 4, and a dielectric filled between the power supply pole 12 and the grounding pole 14 and the surrounding area. The power source (4) and the grounding pole 14 are individually included. And each of the electrical age branch 12a and the grounding branch 14a are picked up from each other. Briefly, in order to form a capacitor, the plurality of power branches (3) and the grounding strips of the grounded branch shirts must be interlaced in pairs as shown in FIG. 1A. Face, or multiple = original knife branch 12a, ground branch 14 legacy lines need only be parallel to each other in pairs. : For example, as shown in Figure 1B, in the hair _ human-type voyage structure, The turned-on power supply pole 12 and the grounding pole 14 are all at the same level, that is, they are formed on the same level of the substrate, instead of being stacked in a conventional manner, thereby completely avoiding the path problem caused by the pressing. In this case, in order to greatly increase the amount of power supply poles 12 and grounding poles in the passive component of the present invention in a limited space, both of them are vertically connected to each other at the interface of the circuit board. One electric cymbal, the knives 12a, and the grounding branch are formed. When the boring tool is used, the ultra-fine circuit technology is used to make the power branches, and the 200838370 grounding points 14a are separated by a small distance (t), and When the power supply branches 12a and the grounding branches 14a have a larger side area (A = w χ d) and a quantity, the capacitance is greatly increased. In addition, the dielectric layer 10 can be made of a material having a high dielectric constant as much as possible to increase the capacitance. In other words, the power supply branch 12a and the grounding portion 14a which are formed opposite each other, the side area is doubled and the capacitance is doubled each time a pair is added. In summary, it is estimated by the current line technology that the capacitance per unit area of the buried passive component structure of the present invention can be increased to more than twice the general level. Underneath, Lai Shougang is the method of manufacturing the New Zealand's new component structure. Due to the structure of the present invention, the power supply branches 12a and the grounding points 14a are spaced apart from each other by a distance (1), and for the capacitance _A, it is necessary to break through the conventional fine line process, by substantially reducing the ship (1), Increase the capacity. For this reason, the secret process of the manufacturing method of the present invention preferably uses electroplating to form a secret without relying on engraving of metal to form a wiring. Of course, whether the circuit is formed by plating a line or a side metal, and the structure shown in FIG. 1 to FIG. 1 is formed by the spirit of the present invention, the plating circuit described below is not limited to this. The form of the invention structure. Please refer to the 2A~2G ® , and the 2nd to 2Gth drawings are schematic diagrams showing the manufacturing method of the buried passive component of the present invention. As shown in Fig. 2, the substrate 5 is first provided, and the substrate 5 has a thin copper layer 7 capable of conducting a plating current. Then, in order to define the 翻 被 秘 ( ( ( 四 四 四 四 四 四 四 四 四 四 四 四 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘5
的薄銅層7上，形成圖案化光阻層2〇，如第2β圖所示。如第2C 圖所不，然後，基於圖案化光阻層2〇，透過薄銅層7所傳導的電 鑛電流’在薄銅層7上電鑛形成電源極12、接地極14，並去除圖 案化光阻層20。然後，在去賴案化光阻層2()之後卿下的空隙 處（主要是在複數個電源分支12a、複數個接地分支恤之間的間 隔處），在薄銅層7上填充高介電材料的介電層22。 為了加強電源極12、接地極14、介電層1〇彼此之間的結合力， 在薄銅層7上填充高介電材料的介電層1()之前，先對電源極12、 接地極14(特別是複數個電源分支⑶、複數個接地分支恤的側 面處)作粗化處理。 在電源極12、接地極14完成粗化(或沒有作粗化)之後，如第2e 圖所不，將具有金屬層27的絕緣層25熱壓合至電源極i2、接地 極14、介電層10之上，並如第2F圖所示線路化金屬層1〇，而成 線路24。最後’在製程中或結束時如第％圖所示去除絲傳遞電 鍍電流的_層7 ’以增加可佈線空間，實現高密度载板的目的。 猎由以上較佳具體實施例之詳述，係希望能更加清楚描述本發明 之特^精神’而並非以上述所揭露魄佳碰實施絲對本發 明之範4域_。減地’其目岐希望能涵蓋各種改變及具 相等性的安排於本發明所欲申請之專利範圍的範嘴内。 200838370 【圖式簡單說明】 第1A〜1B圖為本發明埋入式被動元件結構之示意圖。 第2A〜2G圖為本發明埋入式被動元件的製造方法之示意圖。 【主要元件符號說明】 5基板 7、薄銅層 10介電層 12電源極 12a電源分支 14接地極 14a接地分支 20圖案彳匕光阻層 24線路 25絕緣層 27金屬層 11On the thin copper layer 7, a patterned photoresist layer 2 is formed as shown in the second β-graph. As shown in FIG. 2C, then, based on the patterned photoresist layer 2, the electric current I conducted through the thin copper layer 7 is electroformed on the thin copper layer 7 to form the power source 12 and the ground electrode 14, and the pattern is removed. The photoresist layer 20 is formed. Then, after the photoresist layer 2 () is removed from the gap (mainly at the interval between the plurality of power supply branches 12a and the plurality of grounded branch shirts), the thin copper layer 7 is filled with Gao Jie. Dielectric layer 22 of electrical material. In order to strengthen the bonding force between the power supply electrode 12, the grounding electrode 14, and the dielectric layer 1 , before the thin copper layer 7 is filled with the dielectric layer 1 ( high dielectric material), the power supply terminal 12 and the ground electrode are first 14 (especially at the side of a plurality of power branches (3) and a plurality of grounded branch shirts) for roughening. After the power supply electrode 12 and the ground electrode 14 are roughened (or not roughened), as shown in FIG. 2e, the insulating layer 25 having the metal layer 27 is thermocompression-bonded to the power source electrode i2, the ground electrode 14, and the dielectric layer. Above the layer 10, the metal layer 1 is lined as shown in Fig. 2F to form the line 24. Finally, the _ layer 7' of the wire transfer current is removed as shown in the % diagram during the process or at the end to increase the wiring space and achieve the purpose of high-density carrier. The detailed description of the preferred embodiments above is intended to provide a more complete description of the present invention and is not intended to be a limitation of the invention. The purpose of the reduction is to cover a variety of changes and equivalence arrangements within the scope of the patent application to which the present invention is intended. 200838370 [Simple description of the drawings] Figs. 1A to 1B are schematic views showing the structure of a buried passive component of the present invention. 2A to 2G are schematic views showing a method of manufacturing a buried passive component of the present invention. [Main component symbol description] 5 substrate 7, thin copper layer 10 dielectric layer 12 power supply pole 12a power supply branch 14 grounding pole 14a grounding branch 20 pattern 彳匕 photoresist layer 24 line 25 insulating layer 27 metal layer 11