TW200833786A - Polyimide film and process for producing the same - Google Patents

Polyimide film and process for producing the same

Info

Publication number
TW200833786A
TW200833786A TW096139587A TW96139587A TW200833786A TW 200833786 A TW200833786 A TW 200833786A TW 096139587 A TW096139587 A TW 096139587A TW 96139587 A TW96139587 A TW 96139587A TW 200833786 A TW200833786 A TW 200833786A
Authority
TW
Taiwan
Prior art keywords
particle diameter
proportion
producing
film
particles
Prior art date
Application number
TW096139587A
Other languages
Chinese (zh)
Inventor
Koichi Sawasaki
Toshihiro Teshiba
Original Assignee
Du Pont Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont Toray Co Ltd filed Critical Du Pont Toray Co Ltd
Publication of TW200833786A publication Critical patent/TW200833786A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A polyimide film characterized in that an inorganic particle having a particle diameter in the range of 0.01 to 1.5 μm, an average particle diameter of 0.05 to 0.7 μm and a particle size distribution that the proportion of the particles having a particle diameter of 0.15 to 0.60 μm to the total particles is 80% by volume or more is dispersed into the film in a proportion of 0.1 to 0.9% by weight per film resin weight. A process for producing the polyimide film characterized in that a tetracarboxylic acid anhydride and a diamine are reacted in a polar organic solvent to produce a polyamic acid, when it is imidized and then formed into a film, an inorganic particle having a particle diameter in the range of 0.01 to 1.5 μm, an average particle diameter of 0.05 to 0.7 &mr;m and a particle size distribution that the proportion of the particles having a particle diameter of 0.15 to 0.60 μm to the total particles being 80% by volume or more is dispersed into a polar organic solvent which is the same as the above polar organic solvent to form a slurry, and the slurry is added to the polyamic acid solution during the process for producing the polyimide, wherein the proportion of the slurry is 0.1 to 0.9% by weight per film resin weight.
TW096139587A 2006-10-25 2007-10-23 Polyimide film and process for producing the same TW200833786A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006290149A JP2008106138A (en) 2006-10-25 2006-10-25 Polyimide film and method for producing the same

Publications (1)

Publication Number Publication Date
TW200833786A true TW200833786A (en) 2008-08-16

Family

ID=39324500

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096139587A TW200833786A (en) 2006-10-25 2007-10-23 Polyimide film and process for producing the same

Country Status (4)

Country Link
JP (1) JP2008106138A (en)
KR (1) KR20090073134A (en)
TW (1) TW200833786A (en)
WO (1) WO2008050703A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI800261B (en) * 2022-02-15 2023-04-21 台虹科技股份有限公司 Method for manufacturing a rolled laminate

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010016244A (en) * 2008-07-04 2010-01-21 Nitto Denko Corp Method of manufacturing wiring circuit board
CN117358066B (en) * 2023-12-07 2024-03-19 湖南沁森高科新材料有限公司 Nanofiltration membrane and preparation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0730247B2 (en) * 1986-10-09 1995-04-05 宇部興産株式会社 Aromatic polyamic acid solution composition
JPH03170548A (en) * 1989-11-30 1991-07-24 Mitsui Toatsu Chem Inc Polyimide film and its production
JP2914338B2 (en) * 1996-02-27 1999-06-28 東レ株式会社 Aromatic polyamide or aromatic polyimide film and magnetic recording medium using the same
JP2001031866A (en) * 1999-07-21 2001-02-06 Mitsubishi Chemicals Corp Polyimide composition and substrate for solar cell produced by using the composition
JP2004217907A (en) * 2002-12-25 2004-08-05 Du Pont Toray Co Ltd Polyimide film and method for producing the same
JP2005314669A (en) * 2004-03-30 2005-11-10 Du Pont Toray Co Ltd Polyimide film and copper-clad laminate using the same as substrate
JP2006124685A (en) * 2004-09-29 2006-05-18 Ube Ind Ltd Polyimide film for cof (chip-on-film), and laminate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI800261B (en) * 2022-02-15 2023-04-21 台虹科技股份有限公司 Method for manufacturing a rolled laminate

Also Published As

Publication number Publication date
WO2008050703A1 (en) 2008-05-02
KR20090073134A (en) 2009-07-02
JP2008106138A (en) 2008-05-08

Similar Documents

Publication Publication Date Title
Jouyandeh et al. Curing epoxy resin with anhydride in the presence of halloysite nanotubes: the contradictory effects of filler concentration
TW200728355A (en) Polycyclic polyimides and compositions and methods relating thereto
Yuen et al. Preparation and morphological, electrical, and mechanical properties of polyimide‐grafted MWCNT/polyimide composite
CN103881091B (en) A kind of preparation method of the polyimide containing carborane structure
NO20082480L (en) Process for the preparation of ultrafine powders based on polyamides, ultrafine polyamide powders and their use
MX2009000761A (en) Particle in the shape of an encapsulated droplet and process for making such a particle.
ATE445671T1 (en) SELF-BONDING COATING COMPOSITION
MY167070A (en) Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device
CN103434236A (en) Polyimide/polytetrafluoroethylene composite membrane for insulation of electric wire and cable and preparation method thereof
WO2009022619A1 (en) Polyimide resin composition, polyimide precursor resin composition for providing the polyimide resin composition, their production methods, polyimide film and method for producing the polyimide film
CN105085956B (en) Antistatic polyimides shields the preparation method of black film
TW200833786A (en) Polyimide film and process for producing the same
TW200833785A (en) Polyimide film and process for producing the same
HK1150169A1 (en) Polyamic acid solution composition having carbon black dispersed therein, process for production of semiconductive polyimide resin belt using the composition, and semiconductive polyimide resin belt
WO2007014635A3 (en) Aqueous dispersion of hybrid particles consisting of organic or inorganic pigment particles and organic nano-particles and process for preparing the same
Mallakpour et al. Grafting of citric acid as a green coupling agent on the surface of CuO nanoparticle and its application for synthesis and characterization of novel nanocomposites based on poly (amide-imide) containing N-trimellitylimido-L-valine linkage
Qiu et al. 1‐naphthylacetic‐acid‐functionalized polyacrylate‐coated urea with dual controlled‐release properties
CN101250326A (en) Method for preparing carbon nano-tube reinforced bismaleimide resin composite material
Nurhamiyah et al. Wholly Biobased Polyamide Thermoplastic Elastomer‐Cellulose Nanocomposites
KR102089408B1 (en) Polyimide Composition
Wang et al. Decomposition and Transformation of Pyrene‐Derivative Micelles at Intracellular Milieu and Their Influence on Cytoviability
JP5331004B2 (en) Ink composition
JP4621852B2 (en) Polyimide porous body and method for producing fine particles
Guan et al. Selective recognition of beta‐cypermethrin by molecularly imprinted polymers based on magnetite yeast composites
Sun et al. Preparation and characterization of magnetic polyimide hybrid thin films